Monitoring system and monitoring method

Abstract

This monitoring system for monitoring the pressures of a plurality of vacuum pumps provided in a work device comprises: a sensor that detects the pressure in an air flow path communicating with the plurality of vacuum pumps; a pressure acquisition unit that, while sequentially switching the vacuum pumps to be operated, executes an acquisition process for acquiring, as the pressure of the vacuum pump being operated, a detection value of the sensor while one of the plurality of vacuum pumps is operated and the remaining vacuum pumps are stopped; and a determination unit that determines the states of the plurality of vacuum pumps on the basis of the pressure acquired in the acquisition process.

Description

Monitoring system and monitoring method

[0001] This specification discloses a monitoring system and method.

[0002] Conventionally, there have been proposals for monitoring vacuum pressure generated by a vacuum pump, etc. For example, Patent Document 1 describes a method of storing time-series data of vacuum pressure detected by a detection sensor, determining the amount of change in the time-series data, and determining whether or not there is an abnormality in a pipe that supplies the vacuum pressure, and then performing maintenance such as cleaning.

[0003] Japanese Patent Application Publication No. 05-185390

[0004] As described above, monitoring the vacuum pressure to ensure that an appropriate vacuum pressure is supplied is an important issue in stabilizing production operations, etc., and further improvements are required.

[0005] The primary objective of the present disclosure is to provide a more appropriate method for monitoring vacuum pumps.

[0006] The present disclosure has adopted the following means to achieve the above-mentioned main object.

[0007] The monitoring system disclosed herein is a monitoring system that monitors the pressure of multiple vacuum pumps equipped in a work device, and comprises: a sensor that detects the pressure of an air flow path that communicates with the multiple vacuum pumps; a pressure acquisition unit that executes an acquisition process in which one of the multiple vacuum pumps is operated and the rest are stopped, and acquires the detected value of the sensor as the pressure of the operating vacuum pump, while sequentially switching between the operating vacuum pumps; and a determination unit that determines the state of each of the multiple vacuum pumps based on the pressure acquired in the acquisition process.

[0008] In the mounting apparatus of the present disclosure, the pressure of the vacuum pump is acquired to determine the state, so that the vacuum pump can be monitored more appropriately.

[0009] 1 is a configuration diagram showing an outline of the configuration of a mounting system 1 including a mounting device 10. A top view of the mounting device 10. A configuration diagram showing an outline of the configuration of a pressure supply device 70. A flowchart showing an example of pressure-related information transmission processing. A flowchart showing an example of pressure acquisition processing. An explanatory diagram showing an example of a pump status display screen. An explanatory diagram showing an example of a pump status display screen. An explanatory diagram showing an example of a pump status display screen. A flowchart showing an example of pump status confirmation processing. An explanatory diagram showing an example of a pressure-related information database 103a. An explanatory diagram showing an example of how the pump status is determined. A configuration diagram showing an outline of the configuration of a pressure supply device 170 of a modified example.

[0010] An embodiment of the present disclosure will be described with reference to the drawings. FIG. 1 is a configuration diagram illustrating an outline of the configuration of a mounting system 1 including a mounting device 10. FIG. 2 is a top view of the mounting device 10. The mounting system 1 includes the mounting device 10 and a management device 100 that manages the mounting device 10. The mounting system 1 includes a mounting line in which mounting devices 10 that perform a mounting process of picking up components supplied from a feeder and mounting them on a board S are arranged along the transport direction (X-axis direction) of the board S. Note that FIG. 1 shows only one mounting device 10. The mounting system 1 may also include a solder printing device, an inspection device, a reflow oven, and the like on the mounting line. Note that in this embodiment, the left-right direction in FIG. 1 is the X-axis direction, the front-rear direction is the Y-axis direction, and the up-down direction is the Z-axis direction.

[0011] The mounting apparatus 10 includes a substrate transport device (not shown), first and second feeder sections F1 and F2, first and second heads 15a and 15b, first and second slide members 20a and 20b, first and second X-axis movement devices 30a and 30b, first and second Y-axis movement devices 40a and 40b, and first and second part cameras 50a and 50b. These are mounted on a base 12 and housed within a housing 11. The mounting apparatus 10 also includes a display / operation panel 55, a pressure supply device 70 (see FIG. 3), and a control device 90 (see FIG. 3), all of which are provided on the housing 11. Support bases 13 extending forward and backward are provided on both the left and right sides of the upper stage of the base 12. The first head 15a and the second head 15b may sometimes be simply referred to as heads 15. The first part camera 50a and the second part camera 50b may be simply referred to as part cameras 50. The board transport device transports the board S on the conveyor belt from left to right by driving the conveyor belt with a motor.

[0012] The first and second feeder units F1, F2 are provided on both the front and rear sides of the base 12, and feeders that supply components are detachably attached. The first feeder unit F1 supplies components to the first head 15a, and the second feeder unit F2 supplies components to the second head 15b. Note that the feeder units may be provided on only one of the front and rear sides.

[0013] The first and second heads 15a, 15b each have a nozzle 16 (see FIG. 3) that picks up components and a nozzle holder 17 (see FIG. 3) that can move up and down while holding the nozzle 16. The first head 15a is supported by a first slide member 20a so as to be movable left and right (X axis). The second head 15b is supported by a second slide member 20b so as to be movable left and right (X axis).

[0014] The first and second slide members 20a, 20b are elongated members extending left and right (X-axis), arranged parallel to each other, and suspended across a pair of shared iron Y-axis linear guides 41 (guide rails) on the left and right, allowing them to move back and forth (Y-axis) along the pair of Y-axis linear guides 41.

[0015] The first Y-axis moving device 40a moves the first slide member 20a back and forth (Y-axis). The second Y-axis moving device 40b moves the second slide member 20b back and forth (Y-axis). The first and second Y-axis moving devices 40a, 40b each have a pair of left and right Y-axis linear guides 41 and a Y-axis linear motor 42 provided on each of the left and right sides. The Y-axis linear motor 42 is configured as a flat linear motor having a Y-axis stator 43 fixed to the support base 13 so as to extend back and forth, and a Y-axis mover 44 fixed to the first slide member 20a or the second slide member 20b, facing the Y-axis stator 43 at a predetermined vertical distance. The Y-axis stator 43 has multiple permanent magnets arranged flat along the Y-axis linear guide 41 with alternating north and south poles. The Y-axis mover 44 has multiple cores formed by laminating electromagnetic steel sheets and phase coils wound around the corresponding cores. The Y-axis mover 44 moves back and forth (Y-axis) by applying a three-phase AC current to each phase coil.

[0016] Furthermore, although not shown, a pair of upper and lower iron X-axis linear guides (guide rails) extending parallel to each other are attached to the opposing side surfaces (side walls) of the frames of the first and second slide members 20a, 20b. The first and second heads 15a, 15b are supported by the first and second slide members 20a, 20b so as to be movable left and right along the X-axis linear guides. The first X-axis moving device 30a moves the first head 15a left and right (X-axis). The second X-axis moving device 30b moves the second head 15b left and right (X-axis). Although not shown, the first and second X-axis moving devices 30a, 30b, like the first and second Y-axis moving devices 40a, 40b, have X-axis linear guides and X-axis linear motors configured as flat linear motors.

[0017] In this way, the mounting device 10 uses the Y-axis movement devices 40 (40a, 40b) to move the slide members 20 (20a, 20b) back and forth (Y-axis), and uses the X-axis movement devices 30 (30a, 30b) to move the heads 15 (15a, 15b) left and right (X-axis) relative to the slide members 20. This allows the heads 15 (15a, 15b) to move back and forth and left and right (XY-axis directions).

[0018] The first and second part cameras 50a, 50b are provided between the first and second feeder sections F1, F2, respectively, and the board transport device. The first and second part cameras 50a, 50b have an imaging range above them, and capture images of objects such as components sucked onto the nozzles 16 from below to generate captured images. The display / operation panel 55 is configured as a touch panel that displays various information and accepts input operations from the operator.

[0019] As shown in FIG. 3 , the control device 90 includes a CPU 91, a ROM 92, a HDD 93, and a RAM 94. The control device 90 controls the mounting device 10 to perform mounting processing based on a production job for the board S. The production job defines which components are to be mounted on the board S in the mounting device 10, in what order, and how many boards S with components mounted are to be produced. The control device 90 receives inputs such as images captured by the first and second part cameras 50 a and 50 b, detected values ​​from the pressure sensor 72 of the pressure supply device 70, and operation signals based on input operations to the display / operation panel 55. The control device 90 outputs drive signals to the feeders, the board transport device, the first and second heads 15 a and 15 b, the first and second X-axis movement devices 30 a and 30 b, and the first and second Y-axis movement devices 40 a and 40 b, drive signals to the vacuum pumps 71 and solenoid valves (not shown) of the pressure supply device 70, and display signals to the display / operation panel 55.

[0020] The management device 100 manages the production and status of one or more mounting devices 10, and includes a CPU 101, a ROM 102, a HDD 103, and a RAM 104. The HDD 103 stores a production plan database including production jobs, a pressure-related information database 103a (described later), and other information. The management device 100 also includes an input device 107 such as a mouse and keyboard, and a display 108. The management device 100 transmits production jobs to the control device 90 and obtains information related to the production status and the operating status of the mounting devices 10 from the control device 90.

[0021] FIG. 3 is a schematic diagram illustrating the configuration for supplying negative pressure in the pressure supply device 70. The pressure supply device 70 includes three vacuum pumps 71, namely, a first vacuum pump 71a, a second vacuum pump 71b, and a third vacuum pump 71c, as negative pressure sources. As shown in FIG. 3 , the nozzle 16 has a suction port 16a at the tip (lower end) of its cylindrical shaft for suctioning a component, and a flange portion 16b is formed at the upper end of the shaft. The nozzle holder 17 has a central hole 17a penetrating vertically through the center, an annular recess 17b on its lower surface (holding surface), and a communication hole 17c penetrating vertically from the upper surface to the bottom of the recess 17b. The recess 17b of the nozzle holder 17 is covered by the upper surface of the flange portion 16b of the nozzle 16 to form a negative pressure chamber. The nozzle holder 17 is capable of suction-holding the nozzle 16 by supplying negative pressure to its negative pressure chamber (inside the recess 17b) through the communication hole 17c. The nozzle 16 is capable of suction-holding the component by supplying negative pressure to the suction port 16a through the central hole 17a of the nozzle holder 17 and the central hole of the shaft. The mounting device 10 includes two heads 15 (15a, 15b) and is required to supply the necessary negative pressure to each of the nozzles 16 and the nozzle holder 17. Since a relatively large negative pressure must be generated, the mounting device 10 is configured to include multiple (e.g., three) vacuum pumps 71. Although not shown, a permanent magnet is embedded in a portion of the bottom surface of the recess 17b. A metal plate is embedded in the upper surface (the held surface) of the flange portion 16b of the nozzle 16, at a position facing the permanent magnet in the recess 17b. Therefore, the nozzle 16 is held by the nozzle holder 17 by the suction force of the negative pressure and the suction force of the magnet.

[0022] The pressure supply device 70 includes air flow paths capable of supplying negative pressure, including a first flow path 73 connected to the first vacuum pump 71a, a second flow path 74 connected to the second vacuum pump 71b, connecting flow paths 75, 79a, and 79b, a third flow path 76 connected to the third vacuum pump 71c, component suction flow paths 77a and 77b, and nozzle holding flow paths 78a and 78b. The connecting flow path 75 is connected to the first flow path 73 and the second flow path 74, as well as to the component suction flow paths 77a and 77b. The component suction flow path 77a is connected to the central hole 17a of the nozzle holding portion 17 of the head 15a, and supplies negative pressure via the central hole 17a to the suction port 16a of the nozzle 16 of the head 15a for suctioning a component. The component suction flow path 77b is connected to the central hole 17a of the nozzle holder 17 of the head 15b and supplies negative pressure to the suction port 16a of the nozzle 16 of the head 15b via the central hole 17a for suctioning a component. The nozzle holding flow path 78a is connected to the component suction flow path 77a and to the communication hole 17c of the nozzle holder 17 of the head 15a and supplies negative pressure to hold (suction) the nozzle 16 in the recess 17b via the communication hole 17c. The nozzle holding flow path 78b is connected to the component suction flow path 77b and to the communication hole 17c of the nozzle holder 17 of the head 15b and supplies negative pressure to hold (suction) the nozzle 16 in the recess 17b via the communication hole 17c. The connection flow path 79a is connected to the third flow path 76 and the nozzle holding flow path 78a. The connection flow path 79b is connected to the third flow path 76 and the nozzle holding flow path 78b.

[0023] The pressure supply device 70 also includes a pressure sensor 72 that detects pressure (negative pressure). The pressure sensor 72 is attached to, for example, the component suction flow path 77b. Although not shown, the pressure supply device 70 is configured to supply positive pressure to the negative pressure chamber of the nozzle holder 17 and the suction port 16a of the nozzle 16. This allows the nozzle holder 17 to release the nozzle 16 that has been sucked, or to release the component that has been sucked by the nozzle 16 and place it on the board S.

[0024] The mounting device 10 configured in this manner performs a mounting process in which components are picked up and mounted on the board S as follows. In the mounting process, the CPU 91 moves the head 15 (15a, 15b) above the component supply position of the feeder and lowers the nozzle 16 to pick up the component. Once the component pickup is complete, the CPU 91 moves the head 15 above the part camera 50 (50a, 50b) to capture an image of the component picked up by the nozzle 16. The CPU 91 determines the component pickup deviation relative to the nozzle 16 based on the captured image and corrects the target mounting position to eliminate the deviation. Then, based on the target mounting position, the CPU 91 moves the head 15 above the board S and lowers the nozzle 16 to mount the component on the board S. The CPU 91 repeatedly performs this component pickup and component mounting process for all components to be mounted.

[0025] During the mounting process, the CPU 91 collects various information, stores it in the HDD 93, and transmits it to the management device 100. Examples of the collected information include a pickup success rate and a placement success rate. The pickup success rate is calculated by dividing the number of components successfully picked up by the nozzle 16 without a pickup failure by the total number of components to be mounted. A pickup failure occurs when a component falls off the nozzle 16 or when the amount of pickup deviation determined from an image captured by the parts camera 50 is outside a predetermined tolerance. The placement success rate is calculated by dividing the number of components successfully placed on the board S without a placement failure by the total number of components to be mounted. A placement failure occurs when a component is not properly released from pickup during placement on the board S and is returned to the factory. The pickup success rate and placement success rate may be calculated as the success rate from the start of production to the end of production over a predetermined period (e.g., one day). Poor suction and placement are influenced by misalignment of the supplied components, improper shape of the components, warpage of the substrate S, etc., but are also influenced by poor pressure of each vacuum pump 71 of the pressure supply device 70.

[0026] Furthermore, the mounting system 1 performs various processes to check the state of each vacuum pump 71 and the need for maintenance. Figure 4 is a flowchart showing an example of a pressure-related information transmission process, which is executed by the CPU 91 of the control device 90.

[0027] 5 (S110), and if it is determined that it is not the time to acquire the pressure, the process proceeds to S150. The pressure may be acquired, for example, before the mounting device 10 starts the mounting process, or when an operator issues an instruction to check the pressure via the display operation panel 55 while production is not in progress.

[0028] In the pressure acquisition process of FIG. 5 (S110), the CPU 91 first activates (ON) the first vacuum pump 71a and stops (OFF) the second and third vacuum pumps 71b and 71c (first state) (S200). The CPU 91 then acquires the detected value of the pressure sensor 72 as the pressure of the activated first vacuum pump 71a and displays it on the display / operation panel 55 (S210, FIG. 6). On the pump status display screen, as shown in FIG. 6, the first pump (first vacuum pump 71a) is displayed as ON, with its pressure (-** kPa). Next, the CPU 91 activates the second vacuum pump 71b and stops the first and third vacuum pumps 71a and 71c (second state) (S220). The CPU 91 then acquires the detected value of the pressure sensor 72 as the pressure of the activated second vacuum pump 71b and displays it on the display / operation panel 55 (S230, FIG. 7).

[0029] Next, the CPU 91 activates the third vacuum pump 71c and stops the first vacuum pump 71a and the second vacuum pump 71b (third state) (S240). The CPU 91 then acquires the detection value of the pressure sensor 72 as the pressure of the operating third vacuum pump 71c, displays it on the display / operation panel 55 (S250, FIG. 8), and ends the pressure acquisition process. In this way, in the pressure acquisition process, the detection values ​​of the pressure sensor 72 are sequentially acquired as the pressure of the operating vacuum pumps 71 while sequentially switching between a state in which one of the vacuum pumps 71 is activated (ON) and the other two are stopped (OFF).

[0030] After executing the pressure acquisition process in this manner, the CPU 91 determines whether any of the vacuum pumps 71 has a pressure abnormality (S120). The CPU 91 determines that a pressure abnormality exists if any of the pressures acquired in S210, S230, and S250 of FIG. 5 is more positive (i.e., has a smaller absolute value) than the predetermined pressure threshold P1 for determining an abnormality. If the CPU 91 determines that a pressure abnormality exists, it notifies the user of the pressure abnormality (S130). If the CPU 91 determines that a pressure abnormality does not exist, it skips S130. In S130, the CPU 91 may notify the user of the pressure abnormality by, for example, displaying a warning on the display / operation panel 55, illuminating a warning light (not shown), or outputting a warning sound from a speaker. The notification of the pressure abnormality allows the operator to take prompt action, such as replacing the vacuum pump 71 determined to be abnormal. The CPU 91 also transmits the pressure of each vacuum pump 71 acquired (detected) in the pressure acquisition process to the management device 100 (S140). The CPU 91 may transmit a message indicating a pressure abnormality to the management device 100, and the management device 100 may display the message indicating a pressure abnormality on the display 108.

[0031] Next, the CPU 91 determines whether it is time to transmit production information including the above-mentioned pickup success rate and mounting success rate (S150). The transmission timing may be the timing when production (mounting processing) for a predetermined period (e.g., one day) ends. If the CPU 91 determines that it is time to transmit, it transmits the production information to the management device 100 (S160) and ends the pressure-related information transmission process. If it determines that it is not time to transmit, it skips S160 and ends the pressure-related information transmission process.

[0032] Next, the processing of the management device 100 will be described. Fig. 9 is a flowchart showing an example of a pump status confirmation process, which is executed by the CPU 101 of the management device 100. The CPU 101 determines whether or not it has received a pressure transmitted from the mounting device 10 (S300) and whether or not it has received production information transmitted from the mounting device 10 (S305). When it determines that it has received a pressure or production information, the CPU 101 stores the received pressure or production information in the pressure-related information database 103a (S310, Fig. 10).

[0033] When a pressure is received, if there is recent production information in the pressure-related information database 103a that is not associated with a pressure, the CPU 101 stores the pressure in association with that production information and updates the storage date and time. Furthermore, if there is no production information in the pressure-related information database 103a that is not associated with a pressure, the CPU 101 stores the pressure without associating it with any production information. When production information is received, if there is a recent pressure in the pressure-related information database 103a that is not associated with any production information, the CPU 101 stores the production information in association with that pressure and updates the storage date and time. Furthermore, if there is no pressure in the pressure-related information database 103a that is not associated with any production information, the CPU 101 stores the production information without associating it with any pressure. Therefore, in the pressure-related information database 103a, pressures and production information that have close reception dates and times (acquisition dates and times) are associated with each other and stored in chronological order.

[0034] Next, the CPU 101 determines whether it is time to check the status of each vacuum pump 71 (S315). The CPU 101 determines in S315 that it is time to check the status if the pressure and production information have been associated and saved in S310. Alternatively, the CPU 101 may determine that it is time to check the status when an operator issues a command to check the status via the input device 107. If the CPU 101 determines that it is time to check the status, it checks the status of each vacuum pump 71 based on the pressure and production information stored in the pressure-related information database 103a (S320) and determines whether there are signs of an abnormality (S325). If the CPU 101 determines that any of the vacuum pumps 71 is in a state where there are signs of an abnormality, it notifies a maintenance notice for that vacuum pump 71 (S330). If it determines that there are no signs of an abnormality, it skips S330.

[0035] FIG. 11 is an explanatory diagram showing an example of how the pump status is determined, with pressure plotted along the vertical axis. As described above, a pressure abnormality is determined when the pressure of the vacuum pump 71 is more positive (smaller absolute value) than the predetermined pressure threshold P1 for determining abnormality and within a predetermined abnormal range. The management device 100 may also compare the pressure to the pressure threshold P1 to determine a pressure abnormality during the pump status confirmation process. Alternatively, the CPU 101 may determine a pressure abnormality when the pressure of the vacuum pump 71 is more negative (larger absolute value) than the pressure threshold P0 and within a predetermined normal range. The CPU 101 determines a possible abnormality when the pressure of the vacuum pump 71 is between the pressure thresholds P0 and P1 and the pickup success rate and placement success rate in the production information are each less than a predetermined rate. The predetermined rate for the pickup success rate and the predetermined rate for the placement success rate may be different values. The CPU 101 may also determine a possible abnormality when either the pickup success rate or the placement success rate is less than a predetermined rate, even if the other rate is equal to or greater than a predetermined rate. In this way, even if the pressure of the vacuum pump 71 is not within the abnormal range, it is possible to grasp the trend of pressure drop based on the suction success rate and the mounting success rate, determine that there is a sign of an abnormality, and issue a maintenance notice. Furthermore, because the pressure-related information database 103a stores pressure and production information in chronological order, the CPU 101 may determine that there is a sign of an abnormality based on the trend of pressure change over time or the trend of change in production information. For example, the CPU 101 may determine that there is a sign of an abnormality when it grasps a trend such as the amount of positive pressure change exceeding a predetermined pressure, or when it grasps a trend such as the amount of change in the suction success rate or the mounting success rate exceeding a predetermined rate.

[0036] Next, the CPU 101 determines whether it is time for regular maintenance of any of the vacuum pumps 71 (S335), and if it determines that it is not time for regular maintenance, it ends the pump status confirmation process. The timing for regular maintenance is a timing determined in advance based on the elapsed time since the previous maintenance. On the other hand, if the CPU 101 determines that it is time for regular maintenance of any of the vacuum pumps 71, it checks the necessity of maintenance based on the pressure and production information of that vacuum pump 71 (S340), and determines whether regular maintenance is necessary (S345).

[0037] Here, the CPU 101 may determine that regular maintenance is necessary, for example, when the pressure of the vacuum pump 71 is more positive than the pressure threshold value P0 (see FIG. 11 ). The CPU 101 may also determine that regular maintenance is unnecessary when the pressure of the vacuum pump 71 is more negative than the pressure threshold value P0 and therefore within the normal range. The CPU 101 may also determine that maintenance is unnecessary when the pressure of the vacuum pump 71 is within the normal range and the pickup success rate and the placement success rate in the production information are each equal to or greater than a predetermined rate.

[0038] If the CPU 101 determines in S345 that regular maintenance is required, it issues a maintenance notification (S350) and ends the pump status confirmation process. On the other hand, if the CPU 101 determines that regular maintenance is not required, it postpones the timing of regular maintenance of the vacuum pump 71 (S355) and ends the pump status confirmation process. The CPU 101 may postpone the timing by postponing it for a certain period of time, such as a predetermined number of days.

[0039] Here, the correspondence between the components of this embodiment and the components of the present disclosure will be clarified. The pressure sensor 72 of this embodiment corresponds to the sensor of the present disclosure, the control device 90 that executes S110 (pressure acquisition process) of the pressure-related information transmission process corresponds to the pressure acquisition unit, the control device 90 that executes S120 and S130 of the pressure-related information transmission process and the management device 100 that executes the pump status confirmation process correspond to the determination unit. The control device 90 that executes S160 of the pressure-related information transmission process corresponds to the information acquisition unit, and the management device 100 (HDD 103) that stores the pressure-related information database 103a corresponds to the storage unit. In this embodiment, an example of a monitoring method of the present disclosure is also clarified by explaining the operation of the mounting system 1.

[0040] In the mounting system 1 of the embodiment described above, a pressure acquisition process is performed in which one of the multiple vacuum pumps 71 is operated and the rest are stopped, and the detected value of the pressure sensor 72 is acquired as the pressure of the operating vacuum pump 71, while sequentially switching between the operating vacuum pumps 71. The status of each of the multiple vacuum pumps 71 is determined based on the acquired pressure, allowing for more appropriate monitoring of the vacuum pumps 71. Furthermore, since the status of the multiple vacuum pumps 71 can be determined from the detected value of one pressure sensor 72, there is no need to provide the same number of pressure sensors 72 as the vacuum pumps 71, and therefore the pressure supply device 70 can be made smaller while reducing its cost.

[0041] Furthermore, since the pressure acquisition process is executed before the mounting process (production work) of the mounting device 10 is started, it is possible to prevent a malfunction of the vacuum pump 71 from interfering with the production work.

[0042] Furthermore, production information affected by pressure changes in the vacuum pumps 71 is acquired during the mounting process, and the pressure acquired during the pressure acquisition process is associated with the production information acquired during production work after the pressure acquisition process is executed and stored in the pressure-related information database 103a. Then, the states of the multiple vacuum pumps 71 are determined based on the pressures in the pressure-related information database 103a and the production information associated with the pressures. This allows for more appropriate monitoring of the vacuum pumps 71 based on the pressures and the production information.

[0043] Furthermore, if the pressure is within the abnormal range, it is determined that the vacuum pump 71 is in a pressure abnormality state, and if the pressure is not within the abnormal range, it is determined whether the vacuum pump 71 is in a state requiring maintenance (a warning sign state) based on the production information associated with the pressure. This allows the warning sign of an abnormality in the vacuum pump 71 to be appropriately determined, allowing for early implementation of measures such as maintenance.

[0044] Furthermore, even if the vacuum pump 71 is due for regular maintenance, the timing of the regular maintenance is postponed if the pressure is within a predetermined normal range. This allows the necessity of regular maintenance to be appropriately determined, and if it is not immediately necessary, the regular maintenance can be postponed and the mounting process can be continued. This prevents frequent regular maintenance, reduces the workload on workers, and allows the mounting process to be carried out efficiently.

[0045] It goes without saying that the present disclosure is not limited to the above-described embodiments, and can be embodied in various forms as long as they fall within the technical scope of the present disclosure.

[0046] For example, in the above-described embodiment, the timing for regular maintenance is postponed if the pressure is within a predetermined normal range even when it is time for the maintenance, but this is not limited to this, and maintenance may be performed regardless of the pressure when it is time for the maintenance. In other words, the processes of S340, S345, and S355 of the pump status confirmation process may be omitted.

[0047] In the embodiment, when the pressure is not within the abnormal range, it is determined whether the vacuum pump 71 requires maintenance based on the production information associated with the pressure, but this is not limiting, and such determination may be omitted. For example, when the pressure is not within the abnormal range but is between the normal range and the abnormal range (between the pressure threshold P0 and pressure threshold P1 in FIG. 11 ), it may be determined that the vacuum pump 71 requires maintenance regardless of the production information.

[0048] In the embodiment, the timing of pressure acquisition is exemplified as the timing before the start of the mounting process, but this is not limited to this and may be the timing after the mounting process is completed, etc. That is, the production information acquired during the production work and the pressure acquired in the pressure acquisition process after the production work are completed may be stored in association with each other. Furthermore, the pressure-related information database 103a is not limited to storing the information in chronological order, but may store the pressure and the production information in association with each other to determine signs of abnormality, etc. Alternatively, the pressure acquired in the pressure acquisition process is not limited to acquiring the production information, and various determinations, such as the state of the vacuum pump 71 and the timing of regular maintenance, may be made based on the pressure acquired in the pressure acquisition process.

[0049] The pressure supply device 70 may also be configured as follows. FIG. 12 is a schematic diagram illustrating the configuration of a pressure supply device 170 of this modification. The pressure supply device 170 of this modification does not include the first flow path 73, the second flow path 74, and the connecting flow path 75 of the embodiment. In this modification, the component suction flow path 177a is connected to the first vacuum pump 71a and the central hole 17a of the nozzle holder 17 of the head 15a, and the component suction flow path 177b is connected to the second vacuum pump 71b and the central hole 17a of the nozzle holder 17 of the head 15b. The remaining components, the third flow path 76, the nozzle holding flow paths 78a and 78b, and the connecting flow paths 79a and 79b, are connected in the same manner as in the embodiment. The pressure sensor 72 of this modification is attached to the connecting flow path 79b, for example.

[0050] That is, the pressure supply device 170 of the modified example differs from the pressure supply device 70 of the embodiment in that it does not have flow paths (first flow path 73, second flow path 74, and connecting flow path 75) for connecting both the first vacuum pump 71 a and the second vacuum pump 71 b to each other and supplying negative pressure directly to the nozzle holding portion 17 of each head 15 a, 15 b. In this modified example, as in the embodiment, the multiple vacuum pumps 71 can be more appropriately monitored by performing a pressure acquisition process in which one of the multiple vacuum pumps 71 is operated and the others are stopped, and the detected value of the pressure sensor 72 is acquired as the pressure of the operating vacuum pump 71.

[0051] In the embodiment, the pressure supply device 70 includes three vacuum pumps 71, but this is not limited thereto and may include two or more vacuum pumps 71. Alternatively, the number of vacuum pumps 71 is not limited to multiple, and only one vacuum pump 71 may be included. Then, while the vacuum pump 71 is operating, the detection value of the pressure sensor 72 is acquired as the pressure of the operating vacuum pump 71, and the state of the vacuum pump 71, etc., may be determined as in the embodiment. Furthermore, although the mounting device 10 includes two heads 15, it may also include a single head 15. In this case, the mounting device 10 may include one or one set of each of the feeder unit, slide member 20, X-axis moving device 30, Y-axis moving device 40, and part camera 55.

[0052] In the embodiment, the mounting device 10 that performs the mounting process as the production work has been exemplified, but the present invention is not limited to this and may be any work device provided with a vacuum pump 71, that is, a work device that performs the production work by utilizing the vacuum pressure generated by the vacuum pump 71. Also, the management device 100 performs the pump status confirmation process, but the present invention is not limited to this and the mounting device 10 may perform the pump status confirmation process.

[0053] This specification also discloses the technical idea of ​​changing "a monitoring system according to claim 1 or 2" in claim 5 of the original application to "a monitoring system according to any one of claims 1 to 4."

[0054] The present disclosure can be used for monitoring a vacuum pump provided in a working device, for example.

[0055] 1 Mounting system, 10 Mounting device, 11 Housing, 12 Base, 13 Support stand, 15 Head, 15a First head, 15b Second head, 20 Slide member, 20a First slide member, 20b Second slide member, 30 X-axis moving device, 30a First X-axis moving device, 30b Second X-axis moving device, 40 Y-axis moving device, 40a First Y-axis moving device, 40b Second Y-axis moving device, 41 Y-axis linear guide, 42 Y-axis linear motor, 43 Y-axis stator, 44 Y-axis mover, 50a, 50b Part camera, 55 Display operation panel, 70, 170 Pressure supply device, 71 Vacuum pump, 71a First vacuum pump, 71b Second vacuum pump, 71c Third vacuum pump, 72 Pressure sensor, 73 First flow path, 74 Second flow path, 75, 79a, 79b Connection flow path, 76: Third flow path, 77a, 77b, 177a, 177b: Component suction flow path, 78a, 78b: Nozzle holding flow path, 90: Control device, 91, 101: CPU, 92, 102: ROM, 93, 103: HDD, 94, 104: RAM, 100: Management device, 103a: Pressure-related information database, 107: Input device, 108: Display, F1: First feeder section, F2: Second feeder section, S: Board.

Claims

1. A monitoring system for monitoring the pressure of multiple vacuum pumps equipped in a working device, comprising: a sensor for detecting the pressure of an air flow path communicating with the multiple vacuum pumps; a pressure acquisition unit that executes an acquisition process in which one of the multiple vacuum pumps is operated and the rest are stopped, and acquires the detection value of the sensor as the pressure of the operating vacuum pump, while sequentially switching between the operating vacuum pumps; and a determination unit that determines the state of each of the multiple vacuum pumps based on the pressure acquired in the acquisition process.

2. The monitoring system according to claim 1, wherein the pressure acquisition unit executes the acquisition process at a timing before a production operation by the work device is started.

3. A monitoring system as described in claim 1 or 2, comprising: an information acquisition unit that acquires, as production information, information affected by pressure changes in the vacuum pump during production work of the work equipment; and a memory unit that stores the pressure acquired in the acquisition process in association with the production information acquired during the production work before or after execution of the acquisition process, wherein the judgment unit judges the state of each of the multiple vacuum pumps based on the pressure acquired in the acquisition process and the production information associated with the pressure.

4. The monitoring system of claim 3, wherein the determination unit determines that the vacuum pump is in a pressure abnormality state when the pressure acquired in the acquisition process is within a predetermined abnormality range, and determines whether or not the vacuum pump is in a state requiring maintenance based on the production information associated with the pressure acquired in the acquisition process when the pressure acquired in the acquisition process is not within the abnormality range.

5. The monitoring system of claim 1 or 2, wherein the plurality of vacuum pumps have set timings for regular maintenance, and the judgment unit postpones the timing of regular maintenance of a vacuum pump when the pressure acquired in the acquisition process is within a predetermined normal range, even if the vacuum pump is due for regular maintenance.

6. A monitoring system for monitoring the pressure of a vacuum pump equipped in a working device, comprising: a sensor for detecting the pressure of an air flow path connected to the vacuum pump; a pressure acquisition unit for executing an acquisition process to acquire the detection value of the sensor while the vacuum pump is operating as the pressure of the operating vacuum pump; an information acquisition unit for acquiring information affected by pressure changes of the vacuum pump during production work of the working device as production information; a memory unit for storing the pressure acquired in the acquisition process in association with the production information acquired in the production work before or after execution of the acquisition process; and a judgment unit for judging the state of the vacuum pump based on the pressure acquired in the acquisition process and the production information associated with the pressure.

7. A monitoring method for monitoring the pressure of multiple vacuum pumps equipped in a working device, comprising: (a) a step of executing an acquisition process in which, with one of the multiple vacuum pumps in operation and the rest stopped, a detection value of a sensor that detects the pressure of an air flow path communicating with the multiple vacuum pumps is acquired as the pressure of the operating vacuum pump, while sequentially switching between the operating vacuum pumps; and (b) a step of determining the state of each of the multiple vacuum pumps based on the pressure acquired in the acquisition process.

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