Temperature monitoring device

Abstract

This temperature monitoring device (10) comprises switches (91C, 91D) and temperature sensor units (30, 31). The switches (91C, 91D) respectively have first terminals (91J, 91K) connected to first power paths (91E, 91F) and second terminals (91L, 91M) connected to second power paths (91G, 91H). The switches (91C, 91D) switch from an allowable state, in which energization between the first terminals (91J, 91K) and the second terminals (91L, 91M) is allowed, to a cut-off state in which the energization is cut off. The temperature monitoring device (10) further comprises: energization units (30C, 31C) that cause the current to flow between the temperature sensor units (30, 31) and the first terminals (91J, 91K); and heat transfer units (72) provided separately from the energization units (30C, 31C). The heat transfer units (72) are respectively provided between the switches (91C, 91D) and the temperature sensor units (30, 31), and transmit heat on the switches (91C, 91D) side to the temperature sensor units (30, 31) side.

Description

temperature monitoring device

[0001] The present disclosure relates to a temperature monitoring device.

[0002] Patent Document 1 discloses a configuration in which a thermistor is disposed on an insulatingly coated bus bar of a system main relay (switch).

[0003] Japanese Patent Application Laid-Open No. 2017-58257

[0004] If the thermistor is covered with an insulating coating, the insulating coating may make it difficult for heat to be transmitted to the thermistor, making it difficult to monitor the temperature with good responsiveness.

[0005] The present disclosure has been made in light of the above-mentioned circumstances, and has as its object to provide a temperature monitoring device that can monitor the temperature of an electrical component with good responsiveness.

[0006] The temperature monitoring device disclosed herein comprises an electrical component provided between a first power path and a second power path in a power path that supplies power to a power supply target; and a temperature sensor unit that outputs a signal indicating the temperature around the electrical component, wherein the electrical component has a first terminal electrically connected to the first power path and a second terminal electrically connected to the second power path, and is switchable from an allowable state that allows current to flow between the first terminal and the second terminal to a cut-off state that cuts off current, and further comprises a current-carrying unit that passes current between the temperature sensor unit and one of the first terminal and the second terminal, and a heat transfer unit that is provided separately from the current-carrying unit, and the heat transfer unit is provided between the electrical component and the temperature sensor unit and transfers heat from the electrical component side to the temperature sensor unit side.

[0007] According to the present disclosure, the temperature of an electrical component can be monitored with high responsiveness.

[0008] Fig. 1 is a schematic diagram of a temperature monitoring device of embodiment 1 attached to a power supply system. Fig. 2 is a schematic diagram of the temperature monitoring device. Fig. 3 is a plan view of a circuit board. Fig. 4 is a schematic diagram of a temperature monitoring device of another embodiment, showing a state in which a circuit board is attached to the other plate surface of a first bus bar. Fig. 5 is a schematic diagram of a temperature monitoring device of another embodiment, showing a state in which a first bus bar and a second bus bar are formed by stacking multiple metal plates. Fig. 6 is a schematic diagram of a temperature monitoring device of another embodiment, showing a state in which a through-hole is formed in one of the multiple metal plates of the first bus bar.

[0009] The following describes exemplary embodiments of the present disclosure. The following features (1) to (7) may be combined in any manner consistent with each other.

[0010] (1) A temperature monitoring device comprising: an electrical component provided between a first power path and a second power path in an electric power path that supplies power to a power supply target; and a temperature sensor unit that outputs a signal indicating the temperature around the electrical component, wherein the electrical component has a first terminal electrically connected to the first power path and a second terminal electrically connected to the second power path, and is configured to switch from an allowable state that allows current to flow between the first terminal and the second terminal to a cut-off state that cuts off current; a current-carrying unit that causes current to flow between the temperature sensor unit and one of the first terminal and the second terminal; and a heat transfer unit that is provided separately from the current-carrying unit, wherein the heat transfer unit is provided between the electrical component and the temperature sensor unit and transfers heat from the electrical component side to the temperature sensor unit side.

[0011] The temperature monitoring device (1) has a heat transfer section provided separately from the current-carrying section, which makes it easier for the heat of the electrical component to be transferred to the temperature sensor section, thereby enabling the temperature sensor section to detect the temperature of the electrical component with good responsiveness.

[0012] (2) The temperature monitoring device according to (1), comprising: a bus bar that constitutes at least a part of the power path; and a circuit board fixed to the bus bar, wherein the bus bar is electrically connected to the one of the terminals; the current-carrying unit is provided on the circuit board and electrically connected to the one of the terminals via the bus bar; and the heat transfer unit is in contact with the bus bar and the temperature sensor unit and transfers heat from the bus bar to the temperature sensor unit.

[0013] The temperature monitoring device (2) transfers thermal energy from one terminal to the temperature sensor by utilizing electric charges that move from one terminal to the temperature sensor via the current-carrying part. At the same time, a path for transferring heat from the bus bar to the temperature sensor via a heat transfer part is provided separately from the current-carrying part, thereby improving heat transfer.

[0014] (3) The temperature monitoring device according to (2), wherein the temperature sensor unit has an element unit whose resistance value changes depending on the ambient temperature, and the element unit is provided on a mounting surface of the circuit board facing the bus bar.

[0015] In the temperature monitoring device (3), heat from the electrical components is easily transferred to the element portion, and the temperature of the electrical components is easily reflected.

[0016] (4) The temperature monitoring device according to (3), wherein the bus bar has a recess or a hole portion in which a through-hole is formed, and the element portion is housed in the recess or the hole portion.

[0017] The temperature monitoring device (4) can easily reduce the maximum thickness of the bus bar to which the circuit board is attached.

[0018] (5) The temperature monitoring device according to (4), wherein the heat transfer portion is filled in the recess or the hole.

[0019] The temperature monitoring device (5) can easily increase the cross-sectional area of ​​the heat transfer path from the bus bar to the temperature sensor section, thereby improving heat transfer from the bus bar to the element section, supplementing the heat transfer in the current-carrying section, and improving overall heat transfer.

[0020] (6) The temperature monitoring device according to any one of (2) to (5), wherein the current-carrying portion is formed by a circuit pattern on the circuit board.

[0021] (6) The temperature monitoring device can be easily shaped to suit the current-carrying portion.

[0022] (7) A temperature monitoring device according to any one of (1) to (5), comprising a control unit that processes temperature information based on the signal output from the temperature sensor unit, wherein the control unit has an input unit to which the signal is input, an output unit that is a path for outputting output information to other equipment, and an insulating unit provided in the signal path between the input unit and the output unit, wherein the insulating unit transmits a temperature signal based on the temperature information to the transmission path while insulating between the input path from the input unit side and the transmission path to the other equipment side in the signal path.

[0023] (7) In the temperature monitoring device, when the voltage values ​​on the temperature sensor side and the other equipment side in the signal path are different, the insulating section can prevent the temperature sensor side and the other equipment side in the signal path from affecting each other.

[0024] [Details of the embodiment of the present disclosure]

[0025] <First Embodiment> A temperature monitoring device 10 according to the first embodiment will be described with reference to Fig. 1 to Fig. 3. Fig. 1 illustrates a power supply system 100 provided with the temperature monitoring device 10 according to the first embodiment. The power supply system 100 has a power supply unit 91 and is mounted on a vehicle (not shown). The power supply system 100 supplies power from the power supply unit 91 via a power path P to a power supply target S, which is a load mounted on the vehicle, to operate the load.

[0026] The power supply unit 91 may be, for example, a lead battery or a lithium-ion battery. A positive power path 91A is electrically connected to the positive electrode of the power supply unit 91. A negative power path 91B is electrically connected to the negative electrode of the power supply unit 91. The positive electrode of the power supply unit 91 applies a constant DC voltage to the positive power path 91A. The voltage applied by the power supply unit 91 to the positive power path 91A may vary slightly from this constant value. The positive power path 91A and the negative power path 91B form a power path P that supplies power to the power supply target S. The portions of the positive power path 91A and the negative power path 91B that are on the power supply unit 91 side are first power paths 91E and 91F. The portions of the positive power path 91A and the negative power path 91B that are on the power supply target S side are second power paths 91G and 91H.

[0027] 2, the temperature monitoring device 10 includes electrical components such as switches 91C and 91D, bus bars Bu, circuit boards 70 and 71, temperature sensor units 30 and 31, current-carrying units 30C and 31C, a heat transfer unit 72, and a control unit 66. The control unit 66 includes input units such as AD converters 40 and 41, insulating units 50 and 51, an MCU 60, and an output unit 65.

[0028] [Configuration of Switches] The switches 91C, 91D are, for example, relay switches such as semiconductor relays or mechanical relays. The switches 91C, 91D have first terminals 91J, 91K and second terminals 91L, 91M. The switches 91C, 91D have a function of switching from a permissive state that allows current to flow through the switches 91C, 91D between the first terminals 91J, 91K and the second terminals 91L, 91M to a cut-off state that cuts off current flow through the switches 91C, 91D. The switches 91C, 91D also have a function of switching from the cut-off state to the permissive state.

[0029] [Bus Bar Configuration] The bus bar Bu includes first bus bars 20, 21 electrically connected to the first terminals 91J, 91K, and second bus bars 22, 23 electrically connected to the second terminals 91L, 91M. Each bus bar Bu is formed from a flat metal plate. The first bus bars 20, 21 include recesses 20A, 21A and screw holes 20B, 21B. The recesses 20A, 21A are recessed in the thickness direction on one surface of the first bus bars 20, 21. The screw holes 20B, 21B have internal threads formed thereon and penetrate the first bus bars 20, 21 in the thickness direction. The screw holes 20B, 21B are located on the opposite side of the recesses 20A, 21A from the positions where the first terminals 91J, 91K are connected. The first bus bars 20 and 21 are electrically connected to the ends of the first power paths 91E and 91F opposite the power supply unit 91 (see FIG. 1). The second bus bars 22 and 23 are electrically connected to the ends of the second power paths 91G and 91H opposite the power supply target S (see FIG. 1). The bus bar Bu constitutes at least a part of the power path P.

[0030] Thus, the switches 91C and 91D are provided between the first power paths 91E and 91F and the second power paths 91G and 91H. In other words, the switches 91C and 91D are provided on the positive power path 91A and the negative power path 91B, respectively. Specifically, the first terminals 91J and 91K are electrically connected to the first power paths 91E and 91F via the first bus bars 20 and 21 in a short-circuited configuration. The second terminals 91L and 91M are electrically connected to the second power paths 91G and 91H via the second bus bars 22 and 23 in a short-circuited configuration. In the present disclosure, "short-circuited" refers to a configuration in which, among the forms of "electrically connected," the connected objects are connected in a mutually conductive state (a state in which current can flow) so that the potentials of both connected objects are equal.

[0031] [Circuit Board Configuration] The circuit boards 70, 71 are formed in a flat plate shape using, for example, glass epoxy resin or polyimide resin. The circuit boards 70, 71 have insertion holes 70A, 71A formed through them in the thickness direction. Both surfaces of the circuit boards 70, 71 are formed as mounting surfaces M1, M2 on which electronic components can be mounted. Circuit patterns 70B, 70C, 70D, 71B, 71C, and 71D formed from thin metal films are provided on the mounting surfaces M1, M2, respectively. The circuit patterns 70B, 71B are provided on the mounting surface M2.

[0032] The circuit patterns 70B, 71B have annular portions 70E, 71E formed in an annular shape surrounding the insertion holes 70A, 71A, and branch portions 70F, 71F extending in a branch-like manner from the annular portions 70E, 71E (see FIG. 3). The circuit patterns 70C, 71C are provided on the mounting surface M2. When the circuit boards 70, 71 are viewed from the thickness direction, the circuit patterns 70C, 71C are rectangular and are provided spaced apart from the branch portions 70F, 71F (see FIG. 3). The circuit patterns 70D, 71D are provided on the mounting surface M1. When the circuit boards 70, 71 are viewed from the thickness direction, the circuit patterns 70C, 71C, 70D, 71D are arranged to overlap each other (see FIG. 3). For example, the circuit patterns 70C and 70D are electrically connected via a via 70G, and the circuit patterns 71C and 71D are electrically connected via vias 70G and 71G (see FIG. 2).

[0033] 1, one temperature sensor 30 is provided for each of the positive power path 91A and the negative power path 91B. The temperature sensor 30 provided for the positive power path 91A includes a thermistor 30A and a resistor 30B as element components. The temperature sensor 31 provided for the negative power path 91B includes a thermistor 31A and a resistor 31B.

[0034] The thermistors 30A, 31A have a characteristic that their resistance value changes depending on the ambient temperature. The thermistors 30A, 31A are not covered by an insulating material such as glass, and are configured as elements whose resistance value changes with temperature, with a pair of terminals (one terminal 30D, 31D and the other terminal 30E, 31E) provided thereon. The thermistors 30A, 31A may be, for example, NTC thermistors (Negative Temperature Coefficient Thermistors) or PTC thermistors (Positive Temperature Coefficient Thermistors).

[0035] 2 and 3, the thermistors 30A and 31A are mounted on the mounting surfaces M2 of the circuit boards 70 and 71. Specifically, one terminal 30D and 31D of the thermistors 30A and 31A is soldered to the branch portions 70F and 71F of the circuit patterns 70B and 71B, and the other terminal 30E and 31E is soldered to the circuit patterns 70C and 71C (see FIG. 3).

[0036] Each of the resistors 30B and 31B has a pair of terminals (one terminal 30G, 31G and the other terminal 30H, 31H). The one terminal 30G of the resistor 30B is electrically connected to the other terminal 30E of the thermistor 30A via a connection point C1 (see FIG. 1). The one terminal 31G of the resistor 31B is electrically connected to the other terminal 31E of the thermistor 31A via a connection point C2 (see FIG. 1). The one terminals 30G, 31G of the resistors 30B and 31B are electrically connected to the circuit patterns 70D and 71D (see FIG. 2).

[0037] Resistor 30B is electrically connected to the other terminal 30E of the thermistor 30A via circuit pattern 70D, via 70G, and circuit pattern 70C. Resistor 31B is electrically connected to the other terminal 31E of thermistor 31A via circuit pattern 71D, via 71G, and circuit pattern 71C. In this way, the thermistor 30A and resistor 30B of the temperature sensor unit 30 are connected in series, and the thermistor 31A and resistor 31B of the temperature sensor unit 31 are connected in series. The temperature sensor units 30 and 31 have the function of outputting a signal St indicating the ambient temperature from connection points C1 and C2.

[0038] [Configuration of Conductor] The conductor 30C, 31C is formed by the circuit patterns 70B, 71B of the circuit boards 70, 71. The mounting surface M2 of the circuit boards 70, 71, on which the circuit patterns 70B, 71B are provided, is positioned to face one side of the first bus bar 20, 21 (see FIG. 2). The insertion holes 70A, 71A are positioned to communicate with the screw holes 20B, 21B (see FIG. 2). By inserting bolts B into the insertion holes 70A, 71A and screwing them into the screw holes 20B, 21B, the conductor 30C, 31C (circuit patterns 70B, 71B) are pressed against the one side of the first bus bar 20, 21 while making surface contact with the first bus bar 20, 21, and are electrically connected to the first bus bar 20, 21 (see FIG. 2). The circuit boards 70, 71 are fixed to the first bus bar 20, 21 by the bolts B. The current-carrying portions 30C and 31C are electrically connected to the first terminals 91J and 91K via the first bus bars 20 and 21 (see FIG. 2).

[0039] Thus, the current-carrying portion 30C (circuit pattern 70B) shorts one terminal 30D of thermistor 30A and the first bus bar 20 electrically connected to the first power path 91E. The current-carrying portion 31C (circuit pattern 71B) shorts one terminal 31D of thermistor 31A and the first bus bar 21 electrically connected to the first power path 91F. The current-carrying portions 30C, 31C can pass current between one terminal 30D, 31D of the temperature sensor portion 30, 31 and the first terminals 91J, 91K. As a result, the current-carrying portions 30C, 31C transfer heat generated at the first terminals 91J, 91K to the thermistors 30A, 31A via the first bus bars 20, 21.

[0040] The thermistors 30A, 31A are provided on the mounting surface M2 of the circuit boards 70, 71 facing the first bus bars 20, 21 (see FIG. 2). When the circuit boards 70, 71 are attached to the first bus bars 20, 21, the thermistors 30A, 31A are housed in the recesses 20A, 21A of the first bus bars 20, 21 (see FIG. 2). The circuit boards 70, 71 entirely cover the recesses 20A, 21A (see FIG. 2).

[0041] [Configuration of Heat Transfer Section] The heat transfer section 72 may be made of, for example, thermally conductive grease, heat dissipation grease, gap filler, or a thermally conductive sheet. The heat transfer section 72 is provided separately from the current-carrying sections 30C and 31C. The heat transfer section 72 fills the recesses 20A and 21A of the first bus bars 20 and 21. Specifically, the heat transfer section 72 is disposed in the recesses 20A and 21A of the first bus bars 20 and 21 so as to fill the gap between the thermistors 30A and 31A and the recesses 20A and 21A (see FIG. 2). In other words, the heat transfer section 72 is in contact with the first bus bars 20 and 21 and the thermistors 30A and 31A of the temperature sensor sections 30 and 31. The heat transfer section 72 is provided between the first bus bars 20, 21 connected to the switches 91C, 91D and the thermistors 30A, 31A of the temperature sensor units 30, 31. In other words, the heat transfer section 72 is provided between the first bus bars 20, 21 and the thermistors 30A, 31A of the temperature sensor units 30, 31. The heat transfer section 72 has a function of transferring heat from the first bus bars 20, 21 (i.e., heat on the switches 91C, 91D side) to the thermistors 30A, 31A of the temperature sensor units 30, 31 (i.e., on the temperature sensor unit 30, 31 side).

[0042] The connection points C1 and C2, at which the first terminals 30G and 31G of the resistors 30B and 31B are electrically connected to the second terminals 30E and 31E of the thermistors 30A and 31A, are configured to output a signal St capable of identifying the temperature of the switches 91C and 91D to the AD converters 40 and 41, which will be described later. Here, the signal St capable of identifying the temperature may be, for example, a voltage value or a current value.

[0043] [Configuration of the control unit] The control unit 66 is configured to be able to process temperature information Ti based on the signal St output from the connection points C1 and C2 of the temperature sensor units 30 and 31. Here, the temperature information Ti based on the signal St may be, for example, a digital signal obtained by converting the signal St.

[0044] [Configuration of AD Converter] The AD converters 40 and 41 are configured, for example, as semiconductor elements capable of converting analog signals into digital signals. As shown in FIG. 1 , the AD converters 40 and 41 have input terminals 40A and 41A to which analog signals are input and output terminals 40B and 41B to which digital signals obtained by converting the input analog signals are output. The input terminal 40A of the AD converter 40 is electrically connected to a connection point C1. The input terminal 41A of the AD converter 41 is electrically connected to a connection point C2. The AD converters 40 and 41 receive a signal St from the temperature sensor units 30 and 31. The output terminal 40B of the AD converter 40 is electrically connected to an input terminal 50A of the insulating unit 50 (described later). The output terminal 41B of the AD converter 41 is electrically connected to an input terminal 51A of the insulating unit 51 (described later).

[0045] [Configuration of the Insulation Unit] The insulators 50 and 51 are provided in the signal path between the AD converters 40 and 41 and an output unit 65 (described later). The insulators 50 and 51 provide insulation between the signal path connected to the input terminals 50A and 51A (the input path on the AD converters 40 and 41 side) and the signal path connected to the output terminals 50B and 51B (the transmission path to the other device E side). The insulators 50 and 51 are formed as semiconductor elements that transmit a temperature signal based on the temperature information Ti from the input terminals 50A and 51A to the output terminals 50B and 51B via the signal path connected to the output terminals 50B and 51B (the transmission path to the other device E side). The insulators 50 and 51 may be, for example, a digital isolator or a signal transformer. The output terminals 50B and 51B of the insulators 50 and 51 are electrically connected to input terminals 60A and 61A of the MCU 60 (described later).

[0046] [Configuration of MCU and Output Unit] The MCU 60 is configured as, for example, an MCU (Micro Controller Unit). The MCU 60 has a function of processing the temperature information Ti input from the insulating units 50 and 51 and transmitting it to the output unit 65. The output unit 65 is electrically connected to another device E and has a function of outputting the temperature information Ti from the MCU 60 as output information Se to the other device E. The output unit 65 is a so-called output interface.

[0047] [Configuration of Second Power Supply Unit] The temperature monitoring device 10 is supplied with power based on the output voltage of a second power supply unit 92, which is different from the power supply unit 91. The second power supply unit 92 is, for example, a lead battery or a lithium-ion battery. A second positive power path 92A is electrically connected to the positive electrode of the second power supply unit 92. A second negative power path 92B is electrically connected to the negative electrode of the second power supply unit 92. The positive electrode of the second power supply unit 92 applies a constant DC voltage to the second positive power path 92A. The voltage applied by the second power supply unit 92 to the second positive power path 92A may vary slightly from this constant value. The potential difference between the second positive power path 92A and the second negative power path 92B (i.e., the output voltage of the second power supply unit 92) is smaller than the potential difference between the positive power path 91A and the negative power path 91B (i.e., the output voltage of the power supply unit 91).

[0048] [Configuration of Insulated Power Supply Unit and Internal Power Supply Unit] Insulated power supplies 93, 94 and an internal power supply 95 are interposed between the second positive power path 92A and the second negative power path 92B. The insulated power supplies 93, 94 have a function of generating output voltages to be applied to the temperature sensor units 30, 31, the AD converters 40, 41, and the insulators 50, 51 based on the power of the second power supply unit 92. The insulated power supplies 93, 94 may be, for example, isolated DC-DC converters.

[0049] The insulated power supply unit 93 applies an output voltage V1 to a conductive path 93A while insulating the power supply unit 91 from the second power supply unit 92. The output voltage V1 is based on the potential of the positive power path 91A and has a predetermined potential difference with respect to the potential of the positive power path 91A. The other terminal 30H of the resistor 30B of the temperature sensor unit 30 is short-circuited and electrically connected to the conductive path 93A. This applies the output voltage V1 to the other terminal 30H of the temperature sensor unit 30. The output voltage V1 is also applied to the AD converter 40 and the insulating unit 50 via the conductive path 93A. The AD converter 40 and the insulating unit 50 are electrically connected to the positive power path 91A.

[0050] The insulated power supply unit 94 applies an output voltage V2 to a conductive path 94A while insulating the power supply unit 91 from the second power supply unit 92. The output voltage V2 is based on the potential of the negative power path 91B and has a predetermined potential difference with respect to the potential of the negative power path 91B. The other terminal 31H of the resistor 31B of the temperature sensor unit 31 is short-circuited and electrically connected to the conductive path 94A. This applies the output voltage V2 to the other terminal 31H of the temperature sensor unit 31. The output voltage V2 is also applied to the AD converter 41 and the insulating unit 51 via the conductive path 94A. The AD converter 41 and the insulating unit 51 are electrically connected to the negative power path 91B.

[0051] A predetermined voltage based on the output voltage V1 of the conductive path 93A and the voltage of the positive power path 91A is applied between the other terminal 30H of the resistor 30B and one terminal 30D of the thermistor 30A. A predetermined voltage based on the output voltage V2 of the conductive path 94A and the voltage of the negative power path 91B is applied between the other terminal 31H of the resistor 31B and one terminal 31D of the thermistor 31A. The temperature sensor units 30, 31 output a signal St while causing a current to flow between the one terminals 30D, 31D and the other terminals 30H, 31H.

[0052] The internal power supply unit 95 has a function of generating power to be supplied to the insulating units 50 and 51 and the MCU 60 based on the output voltage of the second power supply unit 92. The internal power supply unit 95 is configured as a voltage regulator such as a linear regulator or a switching regulator.

[0053] The output voltage V3 generated in the internal power supply unit 95 is applied via an internal conductive path 95A to the insulating units 50, 51 and the MCU 60. The insulating units 50, 51 and the MCU 60 are electrically connected to a second negative-side power path 92B.

[0054] The voltage of the second positive power path 92A (i.e., the output voltage of the second power supply 92) is applied to the output unit 65. The output unit 65 is electrically connected to the second negative power path 92B.

[0055] Next, the effects of this configuration will be illustrated.

[0056] The temperature monitoring device 10 includes switches 91C, 91D provided between first power paths 91E, 91F and second power paths 91G, 91H in a power path P that supplies power to a power supply target S, and temperature sensor units 30, 31 that output a signal St indicating the ambient temperature of the switches 91C, 91D. The switches 91C, 91D have first terminals 91J, 91K electrically connected to the first power paths 91E, 91F, and second terminals 91L, 91M electrically connected to the second power paths 91G, 91H. The switches 91C, 91D switch from a permissive state that allows current to flow between the first terminals 91J, 91K and the second terminals 91L, 91M to a blocking state that blocks current. The temperature monitoring device 10 further includes an electric current conducting unit 30C, 31C that passes current between one terminal 30D, 31D of the thermistor 30A, 31A and the first terminal 91J, 91K, and a heat transfer unit 72 that is provided separately from the electric current conducting unit 30C, 31C. The heat transfer unit 72 is provided between the switches 91C, 91D and the temperature sensor units 30, 31, and transfers heat from the switches 91C, 91D side to the temperature sensor units 30, 31 side.

[0057] According to this configuration, in addition to the conductive parts 30C, 31C, the heat transfer part 72 provided separately from the conductive parts 30C, 31C makes it easier for the heat of the switches 91C, 91D to be transferred to the temperature sensor parts 30, 31, thereby enabling the temperature sensor parts 30, 31 to detect the temperature of the switches 91C, 91D with good responsiveness.

[0058] The temperature monitoring device 10 includes first bus bars 20, 21 that form at least a portion of the power path P, and circuit boards 70, 71 that are fixed to the first bus bars 20, 21. The first bus bars 20, 21 are electrically connected to first terminals 91J, 91K. Current-carrying units 30C, 31C are provided on the circuit boards 70, 71 and electrically connected to the first terminals 91J, 91K via the first bus bars 20, 21. The heat transfer units 72 are in contact with the first bus bars 20, 21 and the temperature sensor units 30, 31, and transfer heat from the first bus bars 20, 21 to the temperature sensor units 30, 31. With this configuration, thermal energy is transferred from the first terminals 91J, 91K to the temperature sensor units 30, 31 by utilizing electric charges that move from the first terminals 91J, 91K toward the temperature sensor units 30, 31 via the current-carrying units 30C, 31C. In addition, a path for transferring heat from the first bus bars 20, 21 to the temperature sensor units 30, 31 via the heat transfer unit 72 is provided separately from the current-carrying units 30C, 31C, thereby improving heat transfer.

[0059] The temperature sensor units 30, 31 have thermistors 30A, 31A whose resistance changes depending on the ambient temperature. The thermistors 30A, 31A are provided on the mounting surfaces M2 of the circuit boards 70, 71 facing the first bus bars 20, 21. This configuration allows heat from the switches 91C, 91D to be easily transferred to thermistors 30A, 31A, and the temperatures of the switches 91C, 91D are easily reflected by the thermistors 30A, 31A.

[0060] The first bus bars 20, 21 have recesses 20A, 21A, and thermistors 30A, 31A are housed in the recesses 20A, 21A. This configuration makes it easy to reduce the maximum thickness of the first bus bars 20, 21 to which the circuit boards 70, 71 are attached.

[0061] The heat transfer portion 72 is filled in the recesses 20A, 21A. This configuration makes it easy to increase the cross-sectional area of ​​the heat transfer path from the first bus bars 20, 21 to the temperature sensor portions 30, 31, thereby improving the heat transfer from the first bus bars 20, 21 to thermistors 30A, 31A and supplementing the heat transfer in the current-carrying portions 30C, 31C, thereby improving the overall heat transfer.

[0062] The current-carrying portions 30C, 31C are formed by circuit patterns 70B, 71B on the circuit boards 70, 71. This configuration makes it easy to freely form the shapes of the current-carrying portions 30C, 31C.

[0063] The temperature monitoring device 10 includes a control unit 66 that processes temperature information Ti based on a signal St output from the temperature sensor units 30 and 31. The control unit 66 includes AD converters 40 and 41 to which the signal St is input, an output unit 65 that is a path for outputting output information Se to the other device E, and insulators 50 and 51 that are provided in the signal path between the AD converters 40 and 41 and the output unit 65. The insulators 50 and 51 transmit a temperature signal based on the temperature information Ti to the transmission path while insulating the input path from the AD converters 40 and 41 from the transmission path to the other device E. With this configuration, even if the voltage values ​​on the temperature sensor units 30 and 31 and the other device E are different in the signal path, the insulators 50 and 51 can prevent the temperature sensor units 30 and 31 from affecting each other on the signal path.

[0064] <Other Embodiments> The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is not limited to the embodiments disclosed herein, but is defined by the claims, and is intended to include all modifications within the meaning and scope of the claims.

[0065] Unlike the first embodiment, as shown in Fig. 4, recesses 120A and 121A are formed on the other plate surfaces of first bus bars 120 and 121, which are bus bars Bu (i.e., the plate surfaces to which first terminals 91J and 91K of switches 91C and 91D are connected). Then, thermistors 30A and 31A may be housed in recesses 120A and 121A, and circuit boards 70 and 71 may be attached thereto.

[0066] Unlike the first embodiment, as shown in FIGS. 5 and 6 , multiple metal plates Mp may be stacked in the thickness direction to form first bus bars 220, 221 and second bus bars 222, 223, which are electrically connected to first terminals 91J, 91K of switches 91C, 91D. In this case, recesses 220A, 221A may be formed in one metal plate Mp (see FIG. 5 ), or holes 320A, 321A, which are through-holes that penetrate one metal plate Mp in the thickness direction, may be provided (see FIG. 6 ). Thermistors 30A, 31A are housed in the holes 320A, 321A. The heat transfer portions 72 are filled in the holes 320A, 321A of the metal plates Mp.

[0067] Unlike the first embodiment, the heat transfer portion may be disposed so as to be in contact with at least a part of the inner surface of the recess and at least a part of the outer surface of the thermistor.

[0068] Unlike the first embodiment, a diode or a temperature sensor IC using a diode may be mounted on the circuit board instead of the thermistor.

[0069] Unlike the first embodiment, the temperature sensor unit may be provided on only one of the positive power path and the negative power path.

[0070] Unlike the first embodiment, an insulating section may be interposed between the MCU and the output section.

[0071] Unlike the first embodiment, in the insulating power supply unit, a voltage generated based on the output voltage of the power supply unit may be applied to the temperature sensor unit, the AD converter, the insulating unit, and the control unit.

[0072] Unlike the first embodiment, the current-carrying unit may be configured to switch between a state in which current is always allowed to flow and a state in which current is cut off. It is more preferable that the temperature sensor unit and the first terminal are configured to be always short-circuited.

[0073] Unlike the first embodiment, a configuration may be adopted in which a bus bar is provided on only one of the first power path and the second power path.

[0074] Unlike the first embodiment, the other terminal of the resistor may be short-circuited to the bus bar, and a voltage from an insulated power supply unit may be applied to one terminal of the thermistor.

[0075] Unlike the first embodiment, a recess may be formed in the second bus bar, and a circuit board may be provided on the second bus bar. In this case, the current-carrying portion can pass a current between the temperature sensor portion and the second terminal.

[0076] Instead of the switch, a circuit breaker such as a thermal fuse may be used. Also, a switch may be further provided on the positive power path and the negative power path, and the present disclosure may be applied to both the switch and the circuit breaker.

[0077] The circuit board may be attached to the first terminal (second terminal) of the switch without passing through the bus bar. In this case, the heat transfer unit is provided between the switch and the thermistor of the temperature sensor unit.

[0078] Unlike the first embodiment, the circuit board may be fixed to the bus bar using a separate member such as a pressing member, instead of using bolts.

[0079] DESCRIPTION OF SYMBOLS 10...Temperature monitoring device 20, 21, 120, 121, 220, 221...First bus bar 20A, 21A, 120A, 121A, 220A, 221A...Recess 20B, 21B...Screw hole 22, 23, 222, 223...Second bus bar 30, 31...Temperature sensor section 30A, 31A...Thermistor (element section) 30B, 31B...Resistor 30C, 31C...Conducting section 30D, 31D...One terminal 30E, 31E...Other terminal 30G, 31G...One terminal 30H, 31H...Other terminal 40, 41...AD converter (input section) 40A, 41A...Input side terminal 40B, 41B...Output side terminal 50, 51...Insulating section 50A, 51A...Input side terminal 50B, 51B...output side terminal 60...MCU 60A, 61A...input side terminal 65...output section 66...control section 70, 71...circuit board 70A, 71A...insertion hole 70B, 70C, 70D, 71B, 71C, 71D...circuit pattern 70E, 71E...annular section 70F, 71F...branch section 70G, 71G...via 72...heat transfer section 91...power supply section 91A...positive side power path 91B...negative side power path 91C, 91D...switch (electrical component) 91E, 91F...first power path 91G, 91H...second power path 91J, 91K...first terminal 91L, 91M...second terminal 92...second power supply section 92A...second positive side power path 92B ...Second negative side power path 93, 94...Insulated power supply section 93A, 94A...Conductive path 95...Internal power supply section 95A...Internal conductive path 100...Power supply system 320A, 321A...Hole B...Bolt Bu...Bus bar C1, C2...Connection point E...Other device M1, M2...Mounting surface Mp...Metal plate P...Power path S...Power supply target Se...Output information St...Signal Ti...Temperature information V1, V2, V3...Output voltage

Claims

1. A temperature monitoring device comprising: an electrical component provided between a first power path and a second power path in a power path that supplies power to a power supply target; and a temperature sensor unit that outputs a signal indicating the temperature around the electrical component, wherein the electrical component has a first terminal electrically connected to the first power path and a second terminal electrically connected to the second power path, and is switched from a permissive state that allows current to flow between the first terminal and the second terminal to a cut-off state that cuts off the current, and further comprising: a current-carrying unit that passes current between the temperature sensor unit and either the first terminal or the second terminal; and a heat transfer unit provided separately from the current-carrying unit, wherein the heat transfer unit is provided between the electrical component and the temperature sensor unit and transfers heat from the electrical component side to the temperature sensor unit side.

2. A temperature monitoring device as described in claim 1, comprising: a bus bar constituting at least a part of the power path; and a circuit board fixed to the bus bar, wherein the bus bar is electrically connected to the one of the terminals, the current-carrying portion is provided on the circuit board and electrically connected to the one of the terminals via the bus bar, and the heat transfer portion is in contact with the bus bar and the temperature sensor portion and transfers heat from the bus bar to the temperature sensor portion.

3. The temperature monitoring device according to claim 2, wherein the temperature sensor unit has an element unit whose resistance value changes depending on the temperature around it, and the element unit is provided on a mounting surface of the circuit board facing the bus bar.

4. A temperature monitoring device as described in claim 3, wherein the bus bar has a recess or a hole with a through hole formed therein, and the element portion is housed within the recess or the hole.

5. The temperature monitoring device according to claim 4, wherein the heat transfer portion is filled in the recess or the hole.

6. A temperature monitoring device as claimed in any one of claims 2 to 5, wherein the current-carrying portion is constituted by a circuit pattern on the circuit board.

7. A temperature monitoring device as described in any one of claims 1 to 5, comprising a control unit that processes temperature information based on the signal output from the temperature sensor unit, the control unit having an input unit to which the signal is input, an output unit that is a path for outputting output information to another device, and an insulating unit provided in the signal path between the input unit and the output unit, the insulating unit transmitting a temperature signal based on the temperature information to the transmission path while insulating between the input path from the input unit side and the transmission path to the other device side in the signal path.

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