Inner conductor and connector

Abstract

An inner conductor (11) formed from a metal plate comprises: a substrate connection part (11C) that is connected to a circuit board (50); a press-fitting part (11A) that is press-fitted into a dielectric (12) (attachment object); and a coupling part (11D) that couples the press-fitting part (11A) and the substrate connection part (11C) to each other. Among the press-fitting part (11A), the coupling part (11D), and the substrate connection part (11C), a thin-walled thin part (11E) for partially thinning the plate thickness of the inner conductor (11) is disposed in the coupling part (11D) and the substrate connection part (11C).

Description

Inner conductor and connector

[0001] The present disclosure relates to an inner conductor and a connector.

[0002] Patent Document 1 discloses a connector used for high-speed communication.

[0003] Japanese Patent Application Laid-Open No. 2023-018174

[0004] In high-speed communication connectors, it is necessary to match the characteristic impedance to suppress signal reflection. The connector of Patent Document 1 uses an inner conductor with a constant thickness along its length to match the characteristic impedance. However, the inner conductor has a press-fit shoulder that presses the inner conductor into the mounting hole of the dielectric, and a narrow portion is formed behind the press-fit shoulder to increase the width of the press-fit shoulder. Furthermore, the dielectric has a complex shape, including an extended recess for accommodating a connecting portion and a drawn recess into which a tool that presses the press-fit shoulder fits. Furthermore, while a portion of the inner conductor is press-fit into the dielectric, another portion is exposed from the dielectric. For this reason, there is a concern that the connector of Patent Document 1 may not be able to sufficiently match the characteristic impedance.

[0005] The present disclosure was completed in light of the above circumstances, and aims to provide an inner conductor and a connector that can further improve the matching of characteristic impedance.

[0006] The inner conductor of the first disclosure is an inner conductor formed from a metal plate, and comprises a board connection portion connected to a board, a press-fit portion pressed into an attachment object, and a connecting portion connecting the press-fit portion and the board connection portion, and a thin-walled portion that partially reduces the plate thickness of the inner conductor is arranged in at least the connecting portion of the press-fit portion, the connecting portion, and the board connection portion.

[0007] The connector of the second disclosure comprises an inner conductor formed from a metal plate; and a dielectric having a press-fit hole into which the inner conductor is press-fitted, wherein the inner conductor has a board connection portion connected to a board, a press-fit portion press-fitted into the press-fit hole, and a connecting portion connecting the press-fit portion and the board connection portion, the dielectric exposes the connecting portion, and a thin-walled portion is arranged in the connecting portion to partially reduce the plate thickness of the inner conductor.

[0008] According to the first and second disclosures, the matching of characteristic impedance can be improved.

[0009] Fig. 1 is an exploded perspective view of the connector of this embodiment. Fig. 2 is a side view of the inner conductor shown in Fig. 1. Fig. 3 is a front view of the dielectric shown in Fig. 1. Fig. 4 is a cross-sectional view taken along line A-A in Fig. 3. Fig. 5 is a cross-sectional side view showing the connector shown in Fig. 1 attached to a circuit board.

[0010] [Description of Embodiments of the Present Disclosure] First, embodiments of the present disclosure will be listed and described. (1) An inner conductor formed from a metal plate, comprising: a board connection portion connected to a board; a press-fit portion press-fitted into an attachment target; and a linking portion linking the press-fit portion and the board connection portion, wherein a thin-walled portion that partially reduces the plate thickness of the inner conductor is disposed in at least the linking portion among the press-fit portion, the linking portion, and the board connection portion.

[0011] The inner conductor (1) can be easily matched in characteristic impedance at the portion that tends to be exposed from the object to be attached by providing a thin portion at least at the connecting portion. Also, by providing a thin portion on the inner conductor according to the shape of the object to be attached, it is possible to easily improve the matching of the characteristic impedance of the inner conductor.

[0012] (2) A connector comprising: an inner conductor formed from a metal plate; and a dielectric having a press-fit hole into which the inner conductor is press-fitted; the inner conductor having a board connection portion connected to a board, a press-fit portion press-fitted into the press-fit hole, and a connecting portion connecting the press-fit portion and the board connection portion; the dielectric exposing the connecting portion; and a thin-walled portion disposed in the connecting portion that partially reduces the plate thickness of the inner conductor.

[0013] The connector (2) can adjust the characteristic impedance of the exposed connecting portion by arranging a thin portion on the connecting portion exposed from the dielectric. Also, by arranging a thin portion on the inner conductor according to the shape of the attachment object, it is possible to easily improve the matching of the characteristic impedance of the inner conductor.

[0014] (3) The connector described in (2) includes an outer conductor surrounding the dielectric and the inner conductor, the outer conductor having a cylindrical surrounding portion surrounding the outer periphery of the press-fit portion and a wall portion hanging down from the rear end of the surrounding portion toward the board, a first shortest distance between the connecting portion and the wall portion is smaller than a second shortest distance between the press-fit portion and the surrounding portion, and the thin-walled portion is arranged in a region of the connecting portion that includes at least the position closest to the wall portion.

[0015] In the connector of (3), the first shortest distance between the connecting portion and the wall portion is shorter than the second shortest distance between the press-fit portion and the surrounding portion, so the characteristic impedance at the connecting portion is relatively small. However, by arranging the thin-walled portion in the region of the connecting portion that includes the position closest to the wall portion, the characteristic impedance of the connecting portion can be made relatively large, and the characteristic impedance at the connecting portion can be made closer to the characteristic impedance of the press-fit portion.

[0016] (4) The connector described in (3), wherein the connecting portion is bent obliquely downward and rearward from the rear end of the press-fit portion, and the distance between the center of the connecting portion in the extending direction and the wall portion is the first shortest distance.

[0017] The connector (4) has a configuration in which the connecting portion extends at an angle downward and rearward relative to the press-fit portion, so that the length of the inner conductor can be made as short as possible to suppress the resistance value of the inner conductor, and the characteristic impedance at the connecting portion can be adjusted.

[0018] (5) The connector according to (4), wherein the outer conductor has a pair of bosses extending downward from both widthwise ends of the wall portion and connected to the board.

[0019] In the connector of (5), the pair of bosses are provided at both ends of the wall portion in the width direction, so that the relative positions of the pair of bosses are unlikely to change.

[0020] (6) The connector according to (5), wherein the thin-walled portion is disposed at least from the central portion to the boundary between the press-fit portion and the connecting portion.

[0021] In the connector of (6), the thin-walled portion is disposed up to the boundary between the press-fit portion and the connecting portion, so that when forming the inner conductor, it is easy to bend the connecting portion relative to the press-fit portion.

[0022] [Details of the Embodiments of the Present Disclosure] <Embodiment 1> A connector 10 according to a first embodiment of the present disclosure will be described with reference to FIGS. 1 to 5. The connector 10 is a board connector mounted on a circuit board 50 (see FIG. 5). As shown in FIG. 1, the connector 10 includes an inner conductor 11, a dielectric 12 to which the connector 10 is attached, an outer conductor 13, and a housing 14. The connector 10 is mated with a mating connector (not shown). The mating connector is a shielded connector connected to the end of a cable through which a communication signal is transmitted. In the drawings, in this first embodiment, the "front side," "rear side," "upper side," "lower side," "right side," and "left side" are represented by "F," "B," "U," "D," "R," and "L," respectively. The front-to-rear direction is the direction in which the connector 10 is mated with the mating connector.

[0023] [Configuration of the Inner Conductor] The inner conductor 11 is a male terminal formed from a conductive metal plate. The inner conductor 11 is formed to be elongated as a whole. The inner conductor 11 has a press-fit portion 11A, a mating connection portion 11B (tab), a board connection portion 11C, a connecting portion 11D disposed between the mating connection portion 11B and the board connection portion 11C, and a thin-walled portion 11E.

[0024] 2, the press-fit portion 11A is formed so as to extend in the front-rear direction with its plate thickness oriented in the up-down direction. The vertical dimension (thickness dimension) of the press-fit portion 11A is the same as the plate thickness of the base metal plate. That is, the vertical direction of the press-fit portion 11A corresponds to the plate thickness direction of the base metal plate.

[0025] The mating connection portion 11B is connected to a mating terminal (not shown) of a mating connector. The mating connection portion 11B extends forward from the front end of the press-fit portion 11A. The mating connection portion 11B and the press-fit portion 11A extend together in a front-to-rear direction (one direction) perpendicular to the thickness direction of the metal plate, which is the base material.

[0026] The board connection portion 11C is formed to extend in the front-to-rear direction. The board connection portion 11C is located rearward and downward from the press-fit portion 11A and the mating connection portion 11B. The board connection portion 11C is connected to a conductive portion of the circuit board 50 by soldering (see FIG. 5). The linking portion 11D extends obliquely downward and rearward from the rear end of the press-fit portion 11A. The lower end of the linking portion 11D is connected to the front end of the board connection portion 11C. In other words, the linking portion 11D connects the press-fit portion 11A and the board connection portion 11C.

[0027] The thin-walled portion 11E is disposed, for example, in the inner conductor 11 over the entire extension direction of the connecting portion 11D and the entire extension direction of the board connecting portion 11C. The thin-walled portion 11E is a portion of the inner conductor 11 formed to be thinner than the thickness of the base metal plate of the inner conductor 11. The thin-walled portion 11E is disposed, for example, from the rear end of the board connecting portion 11C to the boundary between the connecting portion 11D and the press-fit portion 11A. Specifically, the thin-walled portion 11E is disposed in a region including the center of the connecting portion 11D in the extension direction, both ends in the extension direction, and the entire board connecting portion 11C.

[0028] The thin-walled portion 11E is formed, for example, by pressing the upper surface of the base metal plate downward, so that the connecting portion 11D is bent downward and rearward at the boundary between the connecting portion 11D and the press-fit portion 11A from a position lower than the upper surface of the press-fit portion 11A.

[0029] [Configuration of the Dielectric] The dielectric 12 is made of insulating synthetic resin. As shown in Fig. 1, the dielectric 12 is formed in a block shape as a whole. When viewed from the side, the dielectric 12 is L-shaped. The dielectric 12 has a terminal mounting portion 12A extending in the front-rear direction and a terminal lead-out portion 12B extending in the up-down direction, connected to the rear end of the terminal mounting portion 12A.

[0030] As shown in Fig. 3, the terminal mounting portion 12A is formed with a pair of left and right press-fit holes 12C. An inner conductor 11 is press-fitted into each press-fit hole 12C. As shown in Fig. 4, each press-fit hole 12C penetrates the terminal mounting portion 12A in the front-rear direction. The rear portion of each press-fit hole 12C is larger in the left-right direction than the front portion.

[0031] The vertical dimension H1 (see FIG. 3 ) of each press-fit hole 12C is slightly larger than the vertical dimension of the press-fit portion 11A of the inner conductor 11. In other words, the vertical dimension H1 of the press-fit hole 12C is approximately the same as the maximum tolerance of the plate thickness of the metal plate that is the base material of the inner conductor 11.

[0032] 4, a forward-facing accommodating recess 12D is formed in the rear surface of the terminal lead-out portion 12B. The accommodating recess 12D extends in the left-right direction at the top of the terminal lead-out portion 12B, and the rear ends of the press-fit holes 12C communicate with and open into the rear-facing inner surface of the accommodating recess 12D. The accommodating recess 12D extends downward on both the left and right sides, and its lower ends open into the underside of the terminal lead-out portion 12B.

[0033] [Example of assembling inner conductor to dielectric] The inner conductor 11 is inserted from the rear into each press-fit hole 12C of the dielectric 12. Specifically, the inner conductor 11 is positioned so that the mating connection portion 11B is located in front of the press-fit portion 11A and the board connection portion 11C is located below the mating connection portion 11B and the press-fit portion 11A, and the inner conductor 11 is brought close to the dielectric 12 from the rear. Then, the inner conductor 11 is inserted into each press-fit hole 12C.

[0034] The vertical dimension H1 of the press-fit hole 12C is approximately the same as the maximum tolerance of the plate thickness of the metal plate that is the base material of the inner conductor 11. Therefore, frictional force is generated between the mating connection portion 11B and the press-fit portion 11A and the surfaces that form the press-fit hole 12C, and the mating connection portion 11B and the press-fit portion 11A are press-fitted into the press-fit hole 12C.

[0035] As the inner conductor 11 is further inserted into the press-fit hole 12C, the mating connection portion 11B passes forward through the press-fit hole 12C and protrudes forward of the terminal mounting portion 12A, as shown in FIG. 5 . At the same time, the connecting portion 11D is positioned along the inner surface of the accommodating recess 12D and is accommodated within the accommodating recess 12D. At this time, the accommodating recess 12D exposes the connecting portion 11D, which has the thin-walled portion 11E, toward the rear. The board connection portion 11C is positioned to protrude below the terminal lead-out portion 12B. The thin-walled portion 11E is exposed to the rear of the dielectric 12.

[0036] [Configuration of the Outer Conductor] The outer conductor 13 is made of die-cast zinc or a zinc alloy and functions as a shielding member that suppresses noise from entering the inner conductor 11 from the outside and also suppresses noise leakage from the inner conductor 11 to the outside.

[0037] 1, the outer conductor 13 has a housing portion 13A at its rear, an enclosure portion 13B at its front, and a wall portion 13C at the position where the enclosure portion 13B and the housing portion 13A are connected. The housing portion 13A has a gate-like shape when viewed from the rear. The front end of the housing portion 13A is connected to the rear surface of the wall portion 13C.

[0038] The housing portion 13A and the wall portion 13C have a plurality of cylindrical bosses 13E protruding downward from their lower ends. Specifically, one boss 13E is located at each of the left and right ends of the wall portion 13C, and one boss 13E is located at the rear end of the housing portion 13A. Each boss 13E is inserted into a mounting hole 50A formed in the circuit board 50 to be connected to the circuit board 50 (see FIG. 5).

[0039] The surrounding portion 13B has a rectangular cylindrical shape with rounded corners and extends in the front-rear direction. The rear end of the surrounding portion 13B is continuous with the front surface of the wall portion 13C. The inner peripheral surface of the surrounding portion 13B is formed with a slightly inclined expanding surface 13F that expands forward from the center in the front-rear direction to the front end, and a parallel surface 13G that is parallel to the front-rear direction from the center in the front-rear direction to the rear end (see FIG. 5). When the surrounding portion 13B is mated with a mating connector, the outer conductor of the mating connector comes into conductive contact with the expanding surface 13F (not shown).

[0040] The wall portion 13C is flat and separates the surrounding portion 13B from the storage portion 13A, projecting radially outward from the rear end of the surrounding portion 13B. The wall portion 13C is wider in the left-right direction than the surrounding portion 13B (see FIG. 1). The wall portion 13C has an insertion hole 13D penetrating in the front-rear direction (see FIG. 5). The surrounding portion 13B is connected to the storage portion 13A through the insertion hole 13D (see FIG. 5). The wall portion 13C below the insertion hole 13D hangs down from the rear end of the surrounding portion 13B (see FIG. 5).

[0041] The dielectric 12 with the inner conductor 11 attached thereto is inserted into the outer conductor 13 from the rear. Specifically, the terminal attachment portion 12A is positioned in front of the terminal lead-out portion 12B, and the board connection portion 11C is positioned so as to protrude downward. The dielectric 12 with the inner conductor 11 attached thereto is brought close to the rear of the outer conductor 13. The terminal attachment portion 12A is then inserted into the insertion hole 13D and press-fit into the enclosure portion 13B (see FIG. 5 ). When the front surface of the terminal lead-out portion 12B contacts the rear surface of the wall portion 13C, the insertion of the dielectric 12 into the outer conductor 13 is complete (see FIG. 5 ). At this time, the mating connection portion 11B of the inner conductor 11 is positioned protruding from the front of the enclosure portion 13B (see FIG. 5 ). When the insertion of the dielectric 12 into the outer conductor 13 is complete, the outer conductor 13 surrounds the dielectric 12 and the inner conductor 11 (see FIG. 5 ). The surrounding portion 13B surrounds the outer periphery of the press-fit portion 11A (see FIG. 5).

[0042] When the insertion of the dielectric 12 into the outer conductor 13 is complete, the shortest distance between the connecting portion 11D and the wall portion 13C is defined as a first shortest distance D1. The first shortest distance D1 is the distance between the center of the connecting portion 11D in the extension direction and the wall portion 13C. Specifically, the first shortest distance D1 is the distance between the lower edge of the insertion hole 13D in the wall portion 13C and the front surface of the connecting portion 11D. In other words, the first shortest distance D1 is the distance in the thickness direction of the connecting portion 11D (the direction normal to the connecting portion 11D) between the upper end of the wall portion 13C hanging down from the rear end of the surrounding portion 13B and the front surface of the connecting portion 11D.

[0043] The shortest distance between the surrounding portion 13B and the press-fit portion 11A in the vertical direction after the dielectric 12 has been completely inserted into the outer conductor 13 is defined as a second shortest distance D2. The second shortest distance D2 is the distance between the upper parallel surface 13G of the surrounding portion 13B and the top surface of the press-fit portion 11A, and the distance between the lower parallel surface 13G and the bottom surface of the press-fit portion 11A in the vertical direction. The first shortest distance D1 is smaller than the second shortest distance D2 (see FIG. 5). The thin-walled portion 11E is located in a region of the connecting portion 11D that includes at least the position closest to the wall portion 13C (see FIG. 5). In other words, the thin-walled portion 11E is located in the connecting portion 11D, separated from the wall portion 13C by the first shortest distance D1.

[0044] [Housing Configuration] The housing 14 is made of an insulating synthetic resin material. As shown in FIG. 1 , the housing 14 has a base wall 14A that is rectangular in rear view and a rectangular mating tubular portion 14B that protrudes forward from the base wall 14A. A mating housing of a mating connector (not shown) is mated into the mating tubular portion 14B. A locking protrusion 14D is formed on the inner surface of the upper wall of the mating tubular portion 14B (see FIG. 5 ). The locking arm of the mating housing engages with the locking protrusion 14D, thereby maintaining the mated state between the connector 10 and the mating connector (not shown). A through-hole 14C is formed in the base wall 14A, penetrating in the front-rear direction. The surrounding portion 13B of the outer conductor 13 is press-fitted into the through-hole 14C (see FIG. 5 ).

[0045] Next, the effects of this configuration are illustrated. The inner conductor 11 is formed from a metal plate and includes a board connection portion 11C connected to the circuit board 50, a press-fit portion 11A press-fitted into the dielectric 12 (the mounting target), and a connecting portion 11D connecting the press-fit portion 11A and the board connection portion 11C. Thin-walled portions 11E that partially reduce the thickness of the inner conductor 11 are disposed in the connecting portion 11D and the board connection portion 11C among the press-fit portion 11A, the connecting portion 11D, and the board connection portion 11C. According to this configuration, by disposing the thin-walled portions 11E in the connecting portion 11D, it is possible to easily match the characteristic impedance of the inner conductor 11 in the portion that tends to be exposed from the dielectric 12. Furthermore, by disposing the thin-walled portions 11E in the inner conductor 11 according to the shape of the dielectric 12, it is possible to easily improve the matching of the characteristic impedance of the inner conductor 11.

[0046] The connector 10 includes an inner conductor 11 formed from a metal plate and a dielectric 12 having a press-fit hole 12C into which the inner conductor 11 is press-fitted. The inner conductor 11 has a board connection portion 11C connected to a circuit board 50, a press-fit portion 11A press-fitted into the press-fit hole 12C, and a connecting portion 11D connecting the press-fit portion 11A and the board connection portion 11C. The dielectric 12 exposes the connecting portion 11D, and a thin-walled portion 11E is disposed in the connecting portion 11D to partially reduce the thickness of the inner conductor 11. With this configuration, the thin-walled portion 11E is disposed in the connecting portion 11D exposed from the dielectric 12, thereby adjusting the characteristic impedance of the connecting portion 11D exposed from the dielectric 12. Furthermore, by disposing the thin-walled portion 11E in the inner conductor 11 according to the shape of the dielectric 12, matching of the characteristic impedance of the inner conductor 11 can be easily improved.

[0047] The connector 10 includes an outer conductor 13 that surrounds the dielectric 12 and the inner conductor 11. The outer conductor 13 has a cylindrical surrounding portion 13B that surrounds the outer periphery of the press-fit portion 11A, and a wall portion 13C that hangs down from the rear end of the surrounding portion 13B toward the circuit board 50. A first shortest distance D1 between the connecting portion 11D and the wall portion 13C is smaller than a second shortest distance D2 between the press-fit portion 11A and the surrounding portion 13B. The thin-walled portion 11E is disposed in a region of the connecting portion 11D that includes at least the position closest to the wall portion 13C.

[0048] With this configuration, the first shortest distance D1 between the bridging portion 11D and the wall portion 13C is shorter than the second shortest distance D2 between the press-fit portion 11A and the surrounding portion 13B, so the characteristic impedance of the bridging portion 11D is relatively small. However, by arranging the thin-walled portion 11E in a region of the bridging portion 11D that includes the position closest to the wall portion 13C, the characteristic impedance of the bridging portion 11D can be made relatively large, and the characteristic impedance of the bridging portion 11D can be made closer to the characteristic impedance of the press-fit portion 11A.

[0049] The connecting portion 11D extends from the rear end of the press-fit portion 11A while bending obliquely downward and rearward, and the distance between the center of the connecting portion 11D in the extending direction and the wall portion 13C is the first shortest distance D1. With this configuration, the connecting portion 11D extends obliquely downward and rearward with respect to the press-fit portion 11A, so that the length of the inner conductor 11 can be shortened as much as possible to suppress the resistance value of the inner conductor 11, and the characteristic impedance of the connecting portion 11D can be adjusted.

[0050] The outer conductor 13 has a pair of bosses 13E that extend downward from both widthwise ends of the wall portion 13C and are connected to the circuit board 50. With this configuration, the pair of bosses 13E are provided at both widthwise ends of the wall portion 13C, making it difficult for the relative positions of the pair of bosses 13E to change, and therefore making it easy to suppress variations in positional misalignment with the circuit board 50.

[0051] The thin-walled portion 11E is disposed at least from the center in the extending direction of the connecting portion 11D to the boundary between the press-fit portion 11A and the connecting portion 11D. According to this configuration, since the thin-walled portion 11E is disposed up to the boundary between the press-fit portion 11A and the connecting portion 11D, it is easy to bend the connecting portion 11D with respect to the press-fit portion 11A when forming the inner conductor 11.

[0052] <Other Embodiments> The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is not limited to the embodiments disclosed herein, but is defined by the claims, and is intended to include all modifications within the meaning and scope of the claims.

[0053] Unlike the first embodiment, a thin-walled portion may be provided only in the center of the connecting portion in the extending direction. Furthermore, if necessary, a thin-walled portion may be provided in the press-fit portion or the mating connection portion. Furthermore, a configuration may be adopted in which a thin-walled portion is not provided in the board connection portion.

[0054] The number of inner conductors inserted into the dielectric is not limited to that in the first embodiment.

[0055] The outer conductor may be machined from zinc or a zinc alloy.

[0056] Unlike the first embodiment, the thin-walled portion may be formed by pressing upward the lower surface of the base metal plate. In this case, at the boundary between the connecting portion and the press-fit portion, the connecting portion is bent downward and rearward from a position higher than the lower surface of the press-fit portion.

[0057] DESCRIPTION OF SYMBOLS 10 ... Connector 11 ... Inner conductor 11A ... Press-fit portion 11B ... Mating connection portion 11C ... Board connection portion 11D ... Joint portion 11E ... Thin-walled portion 12 ... Dielectric (mounting object) 12A ... Terminal mounting portion 12B ... Terminal pull-out portion 12C ... Press-fit hole 12D ... Accommodating recess 13 ... Outer conductor 13A ... Accommodating portion 13B ... Surrounding portion 13C ... Wall portion 13D ... Insertion hole 13E ... Boss 13F ... Expanded surface 13G ... Parallel surface 14 ... Housing 14A ... Base wall 14B ... Fitting cylindrical portion 14C ... Through hole 14D ... Locking protrusion 50 ... Circuit board (board) 50A ... Mounting hole D1 ... First shortest distance D2 ... Second shortest distance H1 ... Dimension

Claims

1. An inner conductor formed from a metal plate, comprising: a board connection portion connected to a board; a press-fit portion pressed into an object to be attached; and a connecting portion connecting the press-fit portion and the board connection portion, wherein at least the connecting portion among the press-fit portion, the connecting portion, and the board connection portion has a thin-walled portion disposed in at least the connecting portion that partially reduces the plate thickness of the inner conductor.

2. A connector comprising: an inner conductor formed from a metal plate; and a dielectric having a press-fit hole into which the inner conductor is press-fitted, wherein the inner conductor has a board connection portion connected to a board, a press-fit portion press-fitted into the press-fit hole, and a connecting portion connecting the press-fit portion and the board connection portion, the dielectric exposes the connecting portion, and a thin-walled portion that partially reduces the plate thickness of the inner conductor is disposed in the connecting portion.

3. A connector as described in claim 2, comprising an outer conductor surrounding the dielectric and the inner conductor, the outer conductor having a cylindrical surrounding portion surrounding the outer periphery of the press-fit portion and a wall portion hanging down from a rear end of the surrounding portion toward the board, a first shortest distance between the connecting portion and the wall portion being smaller than a second shortest distance between the press-fit portion and the surrounding portion, and the thin-walled portion being disposed in an area of ​​the connecting portion including at least the position closest to the wall portion.

4. A connector as described in claim 3, wherein the connecting portion extends from the rear end of the press-fit portion while bending obliquely downward and rearward, and the distance between the center of the connecting portion in the extending direction and the wall portion is the first shortest distance.

5. The connector according to claim 4, wherein said outer conductor has a pair of bosses extending downward from both ends of said wall portion in the width direction and connected to said board.

6. The connector according to claim 5, wherein the thin-walled portion is disposed at least from the central portion to the boundary between the press-fit portion and the connecting portion.

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