Electronic device comprising camera module

Abstract

According to an embodiment of the present disclosure, an electronic device can be provided. The electronic device may comprise at least one camera module and a first printed circuit board. The at least one camera module includes: at least one lens; a lens barrel surrounding the at least one lens; a lens holder for fastening the lens barrel; an image sensor; and a second printed circuit board on which the image sensor is disposed. The lens holder can include a first portion, which is in contact with at least a portion of the lens barrel and includes a non-conductive material, and a second portion, which includes a conductive material. Various other embodiments are possible.

Description

Electronic device including a camera module

[0001] Various embodiments of the present disclosure relate to an electronic device including a shielding structure applied to a camera module holder.

[0002] Advances in information and communication technology (ICT) and semiconductor technology have led to a rapid increase in the proliferation and use of various electronic devices. In particular, recent electronic devices are being developed to be portable and capable of communicating. These devices are being miniaturized for user convenience. Along with this trend of miniaturization, the need for faster and clearer images of subjects captured using cameras embedded in electronic devices has become increasingly important. Accordingly, camera module performance is increasing, and electronic devices are increasingly being developed to incorporate multiple camera modules, rather than just a single one.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0004] According to one embodiment of the present disclosure, an electronic device including a camera module may be provided. The camera module may include at least one lens; a lens barrel configured to support the at least one lens; a lens holder configured to be fastenably engaged with the lens barrel; and an image sensor. The lens holder may include a body formed of a non-conductive material, and the body may include a first portion configured to be fastenably engaged with the lens barrel. The lens holder may further include a second portion covering an outer surface of the body by plating or coating a layer of a conductive material on an outer surface of the body excluding the first portion.

[0005] According to one embodiment of the present disclosure, an electronic device may be provided. The electronic device may include at least one camera module and a first printed circuit board. The at least one camera module may include at least one lens; a lens barrel surrounding the at least one lens; a lens holder for fixing the lens barrel; an image sensor; and a second printed circuit board on which the image sensor is disposed. The lens holder may be configured to contact at least a portion of the lens barrel and may include a first portion comprising a non-conductive material and a second portion comprising a conductive material.

[0006] According to one embodiment of the present disclosure, a camera module may be provided. The camera module may include at least one lens; a lens barrel enclosing the at least one lens; a lens holder fastened to the lens barrel; and an image sensor. The lens holder may include a fastening structure formed of a non-conductive material and a shielding structure formed of a conductive material.

[0007] The above-described aspects or other aspects, configurations and / or advantages of one embodiment of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.

[0008] FIG. 1 is a block diagram of an electronic device within a network environment, according to one embodiment.

[0009] FIG. 2 is a drawing illustrating an unfolded state among folding states of a foldable electronic device according to one embodiment of the present disclosure.

[0010] FIG. 3 is a diagram illustrating a folded state among folding states of a foldable electronic device according to one embodiment of the present disclosure.

[0011] FIG. 4 is a diagram illustrating an electronic device and its internal structure according to one embodiment of the present disclosure.

[0012] FIG. 5 is a perspective view of at least one camera module according to one embodiment of the present disclosure.

[0013] FIG. 6 is a drawing illustrating the back of a camera module according to one embodiment of the present disclosure.

[0014] FIG. 7 is a diagram illustrating signal lines within a camera module according to one embodiment of the present disclosure.

[0015] FIG. 8 is a diagram illustrating signal lines within a first printed circuit board of an electronic device according to one embodiment of the present disclosure.

[0016] FIG. 9A is a cross-sectional view of a camera module according to one embodiment of the present disclosure. FIG. 9B is a view illustrating a lens holder viewed from above according to one embodiment of the present disclosure.

[0017] FIG. 10 is a cross-sectional view of a camera module according to one embodiment of the present disclosure.

[0018] FIG. 11 is a cross-sectional view of a camera module according to one embodiment of the present disclosure.

[0019] FIG. 12 is a drawing showing a second printed circuit board on which an image sensor is arranged, according to one embodiment of the present disclosure.

[0020] FIG. 13 is a drawing showing a lens holder viewed from below according to one embodiment of the present disclosure.

[0021] FIG. 14 is a cross-sectional view of a camera module according to one embodiment of the present disclosure.

[0022] FIG. 15 is a drawing showing a lens holder viewed from below according to one embodiment of the present disclosure.

[0023] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.

[0024] In order for a camera module to quickly acquire a clear subject image, not only must the performance of the lens, auto focus (AF) mechanism, and / or optical image stabilization (OIS) mechanism be good, but the signal acquired from the image sensor and / or the processed signal must not be affected by noise (e.g., electromagnetic interference (EMI)).

[0025] For example, in the case of a typical fixed focus type (FF) camera module, a shielding sheet is usually attached only to the back of the camera module, and if this camera module is placed around an antenna, electromagnetic noise may be induced in the camera module, causing the image sensor as well as the camera module to not operate normally.

[0026] Hereinafter, according to various embodiments of the present disclosure described below, there is provided a lens holder shielding structure of a camera module capable of three-dimensionally blocking and / or reducing electromagnetic noise generated by the camera module.

[0027] The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present disclosure belongs from the description below.

[0028] The following description of the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure, including the claims and their equivalents. While the exemplary embodiments disclosed in the following description include numerous specific details to aid understanding, they are to be considered as one example of various exemplary embodiments. Accordingly, those skilled in the art will appreciate that various modifications and variations of the various implementations described herein may be made without departing from the scope and spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0029] The terms and words used in the following description and claims are not limited to their reference meanings and can be used to clearly and consistently describe one embodiment of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various implementations of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the disclosure and its equivalents.

[0030] Unless the context clearly dictates otherwise, the singular forms of "a," "an," and "the" should be understood to include plural meanings. Thus, for example, "a component surface" could be understood to include one or more of the surfaces of the component.

[0031] FIG. 1 is a block diagram of an electronic device within a network environment, according to one embodiment.

[0032] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0033] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0034] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0035] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0036] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0037] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0038] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0039] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0040] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0041] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0042] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0043] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0044] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0045] The camera module (180) can capture still images and moving images. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0046] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0047] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0048] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0049] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0050] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0051] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0052] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0053] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0054] FIG. 2 is a diagram illustrating an unfolded state among folding states of a foldable electronic device according to an embodiment of the present disclosure. FIG. 3 is a diagram illustrating a folded state among folding states of a foldable electronic device according to an embodiment of the present disclosure.

[0055] FIG. 2 is a diagram illustrating an unfolded state of an electronic device (200) according to one embodiment of the present disclosure. FIG. 3 is a diagram illustrating a folded state of an electronic device (200) according to one embodiment of the present disclosure. The electronic device (200) may be a foldable or bendable electronic device, as an example of the electronic device (101) illustrated in FIG. 1.

[0056] Referring to FIGS. 2 and 3, in one embodiment, the electronic device (200) may include a foldable housing (201), and a flexible or foldable display (250) (hereinafter, simply referred to as “flexible display” 250) (e.g., the display module (160) of FIG. 1) disposed within a space formed by the foldable housing (201). According to one embodiment, a surface on which the flexible display (250) is disposed (or a surface on which the flexible display (250) is visible from the outside of the electronic device (200)) may be defined as a front surface of the electronic device (200). And, a surface opposite to the front surface may be defined as a rear surface of the electronic device (200). In addition, a surface surrounding the space between the front surface and the rear surface may be defined as a side surface of the electronic device (200).

[0057] According to one embodiment, the foldable housing (201) may include a first housing (210) including a sensor area (212), a second housing (220), a first rear cover (215), a second rear cover (225), and a hinge assembly (230). Here, the hinge assembly (230) may include a hinge cover that covers a foldable portion of the foldable housing (201). The foldable housing (201) of the electronic device (200) is not limited to the shape and combination shown in FIGS. 2 and 3, and may be implemented by a combination and / or combination of other shapes or parts. For example, in one embodiment, the first housing (210) and the first rear cover (215) may be formed integrally, and the second housing (220) and the second rear cover (225) may be formed integrally.

[0058] According to one embodiment, a light sensor (not shown) and an image sensor (not shown) may be arranged in the sensor area (212). The light sensor may detect the amount of light surrounding the electronic device (200), and the image sensor may convert light incident through a camera lens into a digital signal. The light sensor and the image sensor may be visually exposed to the flexible display (250). According to one embodiment, the light sensor and the image sensor may not be visually exposed. For example, the camera may be configured as an under display camera (UDC). The pixels of an area of ​​the flexible display (250) corresponding to the position of the UDC may be configured differently from the pixels of other areas, so that the image sensor and / or the camera may not be visually exposed.

[0059] According to one embodiment, the first housing (210) is connected to the hinge assembly (230) and may include a first front surface facing in a first direction and a first rear surface facing in a direction opposite to the first direction. The second housing (220) is connected to the hinge assembly (230) and may include a second front surface facing in a second direction and a second rear surface facing in a direction opposite to the second direction. The second housing (220) may rotate relative to the first housing (210) about the hinge assembly (230). The electronic device (200) may be variable between a folded state and an unfolded state.

[0060] According to one embodiment, the first housing (210) may include a first side (211a) spaced apart from and substantially parallel to the folding axis (A) of the hinge assembly (230) between the first front side and the first rear side, and the second housing (220) may include a second side (221a) spaced apart from and substantially parallel to the folding axis (A) of the hinge assembly (230) between the second front side and the second rear side. Additionally, the first housing (210) may include a third side (211b) that is substantially perpendicular to the first side (211a), has one end connected to the first side (211a), and has the other end connected to the hinge assembly (230), and a fourth side (211c) that is substantially perpendicular to the first side (211a), has one end connected to the first side (211a), and has the other end connected to the hinge assembly (230), and is spaced apart in a direction substantially parallel to the third side (211b). The second housing (220) may include a fifth side (221b) that is substantially perpendicular to the second side (221a), has one end connected to the second side (221a), and has the other end connected to the hinge assembly (230), and a sixth side (221c) that is substantially perpendicular to the second side (221a), has one end connected to the second side (221a), and has the other end connected to the hinge assembly (230), and is spaced apart in a direction substantially parallel to the fifth side (221b). When the second housing (220) is folded relative to the first housing (210) about the hinge assembly (230), the first side (211a) can come closer to the second side (221a), and when the second housing (220) is unfolded relative to the first housing (210) about the hinge assembly (230), the first side (211a) and the second side (221a) can move away from each other.

[0061] According to one embodiment, the electronic device (200) may have the first front side and the second front side facing each other in a fully folded state, and the second direction may be substantially the same as the first direction in a fully unfolded state. In a fully unfolded state, the distance between the first side side (211a) and the second side side (221a) may be formed to be the greatest.

[0062] According to one embodiment, the first housing (210) and the second housing (220) may be arranged on both sides with respect to the folding axis (A) as the center, and may have a shape that is overall symmetrical with respect to the folding axis (A). As described below, the angle or distance between the first housing (210) and the second housing (220) may vary depending on whether the electronic device (200) is in an unfolded state, a folded state, or a partially unfolded (or partially folded) intermediate state.

[0063] According to one embodiment, as illustrated in FIG. 2, the first housing (210) and the second housing (220) may together form a recess for accommodating the flexible display (250). According to one embodiment, at least a portion of the first housing (210) and the second housing (220) may be formed of a metallic material or a non-metallic material having a rigidity of a selected size to support the flexible display (250). At least a portion formed of the metallic material may provide a ground plane of the electronic device (200) and may be electrically connected to a ground line formed on a printed circuit board disposed inside the foldable housing (201).

[0064] According to one embodiment, a protective member (not shown) may be arranged on the outer surface of the flexible display (250). The protective member may be formed as an integral part with the side surface of the foldable housing (201) or as a separate structure. The flexible display (250) may not be adhered to the side surface of the foldable housing (201) and / or the protective member. A gap may be formed between the flexible display (250) and the protective member. The protective member may be configured to cover the internal structure of the electronic device (200) from the outside or protect the internal structure of the electronic device (200) from external impact. According to one embodiment, the protective member may be configured to cover the wiring mounted on the flexible display (250) from the outside or protect it from external impact.

[0065] According to one embodiment, the first rear cover (215) is disposed on one side of the folding axis (A) on the rear of the electronic device (200) and may have, for example, a substantially rectangular periphery, the periphery of which may be wrapped by the first housing (210). Similarly, the second rear cover (225) is disposed on the other side of the folding axis (A) on the rear of the electronic device (200) and the periphery of which may be wrapped by the second housing (220).

[0066] According to one embodiment, the first rear cover (215) and the second rear cover (225) may have substantially symmetrical shapes with respect to the folding axis (A). However, the first rear cover (215) and the second rear cover (225) do not necessarily have mutually symmetrical shapes, and in one embodiment, the electronic device (200) may include the first rear cover (215) and the second rear cover (225) of various shapes. In one embodiment, the first rear cover (215) may be formed integrally with the first housing (210), and the second rear cover (225) may be formed integrally with the second housing (220).

[0067] According to one embodiment, the first rear cover (215), the second rear cover (225), the first housing (210), and the second housing (220) may form a space in which various components of the electronic device (200) (e.g., a printed circuit board or a battery) may be placed. According to one embodiment, one or more components may be placed or visually exposed on the rear surface of the electronic device (200). For example, one or more components or sensors may be visually exposed through the first rear area (216) of the first rear cover (215). In various embodiments, the sensors may include a proximity sensor and / or a rear camera. In one embodiment, at least a portion of the sub-display may be visually exposed through the second rear area (226) of the second rear cover (225).

[0068] According to one embodiment, a front camera disposed on a front side (e.g., a second front side) of the electronic device (200) or a rear camera exposed through a first rear area (216) of the first rear cover (215) may include one or more lenses, an image sensor, and / or an image signal processor. A flash may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be disposed on one side of the electronic device (200).

[0069] Referring to FIG. 3, a hinge cover included in a hinge assembly (230) may be configured to be positioned between a first housing (210) and a second housing (220) so as to cover an internal component (e.g., the hinge assembly (230)). According to one embodiment, the hinge assembly (230) may be covered by a portion of the first housing (210) and the second housing (220) or exposed to the outside depending on the state of the electronic device (200) (unfolded state, intermediate state, or folded state).

[0070] According to one embodiment, as illustrated in FIG. 2, when the electronic device (200) is in an unfolded state (e.g., a fully unfolded state), the hinge assembly (230) may be covered by the first housing (210) and the second housing (220) and not exposed. As another example, as illustrated in FIG. 3, when the electronic device (200) is in a folded state (e.g., a fully folded state), the hinge assembly (230) may be exposed to the outside between the first housing (210) and the second housing (220). As another example, when the first housing (210) and the second housing (220) are in an intermediate state where they are folded with a certain angle, the hinge assembly (230) may be partially exposed to the outside between the first housing (210) and the second housing (220). However, in this case, the exposed area may be less than in a fully folded state. In one embodiment, the hinge assembly (230) may include a curved surface.

[0071] According to one embodiment, the flexible display (250) may be placed on a space formed by the foldable housing (201). For example, the flexible display (250) may be placed on a recess formed by the foldable housing (201) and may be viewed from the outside through the front surface (e.g., the first front surface and / or the second front surface) of the electronic device (200). According to one embodiment, the flexible display (250) may constitute a majority of the front surface (e.g., the first front surface and / or the second front surface) of the electronic device (200). Accordingly, the front surface (e.g., the first front surface and / or the second front surface) of the electronic device (200) may include the flexible display (250) and a portion of the first housing (210) adjacent to the flexible display (250) and a portion of the second housing (220). And, the back side (e.g., the first back side and / or the second back side) of the electronic device (200) may include a first back cover (215), a portion of a first housing (210) adjacent to the first back cover (215), a second back cover (225), and a portion of a second housing (220) adjacent to the second back cover (225).

[0072] According to one embodiment, the flexible display (250) may refer to a display in which at least a portion of the display can be transformed into a flat or curved surface. According to one embodiment, the flexible display (250) may include a folding area (253), a first area (251) arranged on one side (e.g., the right side of the folding area (253) illustrated in FIG. 2) with respect to the folding area (253), and a second area (252) arranged on the other side (e.g., the left side of the folding area (253) illustrated in FIG. 2).

[0073] However, the region division of the flexible display (250) illustrated in FIG. 2 is exemplary, and the display (250) may be divided into a plurality of regions (for example, four or more or two) depending on the structure or function. For example, in the embodiment illustrated in FIG. 2, the regions of the flexible display (250) may be divided by a folding region (253) extending parallel to the folding axis (A), but as another example, the regions of the flexible display (250) may be divided based on another folding axis (for example, a folding axis parallel to the width direction of the electronic device).

[0074] According to one embodiment of the present disclosure, the flexible display (250) may be coupled with or disposed adjacent to a touch panel equipped with a touch detection circuit and a pressure sensor capable of measuring the intensity (pressure) of a touch. For example, the flexible display (250) may be coupled with or disposed adjacent to a touch panel that detects an electromagnetic resonance (EMR) stylus pen, as an example of a touch panel.

[0075] According to one embodiment, the first region (251) and the second region (252) may have an overall symmetrical shape centered around the folding region (253).

[0076] Hereinafter, the operation of the first housing (210) and the second housing (220) and each area of ​​the flexible display (250) according to the state of the electronic device (200) (e.g., folded state, unfolded state, or intermediate state) will be described.

[0077] According to one embodiment, when the electronic device (200) is in an unfolded state (e.g., FIG. 2), the first housing (210) and the second housing (220) may be arranged to face the same direction at an angle of approximately 180 degrees. The surface of the first region (251) and the surface of the second region (252) of the flexible display (250) may form an angle of 180 degrees with each other and may face substantially the same direction (e.g., toward the front of the electronic device). At this time, the folding region (253) may form substantially the same plane as the first region (251) and the second region (252).

[0078] According to one embodiment, when the electronic device (200) is in a folded state (e.g., FIG. 3), the first housing (210) and the second housing (220) may be arranged to face each other. The surface of the first region (251) and the surface of the second region (252) of the flexible display (250) may form a narrow angle (e.g., between 0 and 10 degrees) with each other and may face each other. The folding region (253) may be formed as a curved surface having at least a portion of a predetermined curvature.

[0079] According to one embodiment, when the electronic device (200) is in an intermediate state, the first housing (210) and the second housing (220) may be arranged at a certain angle with respect to each other. The surface of the first region (251) and the surface of the second region (252) of the flexible display (250) may form an angle that is larger than an angle in a folded state and smaller than an angle in an unfolded state. The folding region (253) may be formed as a curved surface having at least a portion of a certain curvature, and the curvature at this time may be smaller than that in a folded state.

[0080] According to one embodiment of the present disclosure, an electronic device (200) may include various electronic components arranged in an internal or external space of a first housing (210) and a second housing (220). Various electronic components include, for example, a processor (e.g., a processor (120) of FIG. 1), a memory (e.g., a memory (130) of FIG. 1), an input module (e.g., an input module (150) of FIG. 1), an audio output module (e.g., an audio output module (155) of FIG. 1), a display (250) (e.g., a display module (160) of FIG. 1), an audio module (e.g., an audio module (170) of FIG. 1), a sensor (e.g., a sensor module (176) of FIG. 1), an interface (e.g., an interface (177) of FIG. 1), a connection terminal (e.g., a connection terminal (178) of FIG. 1), a haptic module (e.g., a haptic module (179) of FIG. 1), a camera module (e.g., a camera module (180) of FIG. 1), a power management module (188)), a battery (e.g., a battery (189) of FIG. 1), a communication module (e.g., a communication module (190) of FIG. 1), and a subscriber identification. The electronic device (200) may include a module (e.g., a subscriber identification module (196) of FIG. 1) or an antenna module (e.g., an antenna module (197) of FIG. 1), and the electronic components may be appropriately separated and arranged in the internal or external space of the first housing (210) and the second housing (220). In the electronic device (200), at least one of these components (e.g., a connection terminal (178)) may be omitted, or one or more other components may be added. In addition, some of these components may be integrated into one component.

[0081] The electronic device (200) may include an antenna. Using the antenna, for example, short-range communication with an external device or wirelessly transmitting and receiving power required for charging may be performed. The antenna may be of various types, and may be positioned at multiple locations within the electronic device (200). According to one embodiment, the electronic device (200) may form an antenna using a portion of the housing that includes a conductive material (hereinafter referred to as a "conductive portion"). This will be described in detail below with reference to the embodiment of FIG. 4.

[0082] FIG. 4 is a diagram illustrating an electronic device and its internal structure according to one embodiment of the present disclosure. Referring to FIG. 4, an antenna utilizing side member(s) included in the electronic device is described.

[0083] An electronic device (300) (e.g., the electronic device (101) of FIG. 1, the electronic device (200) of FIGS. 2 and 3) may include a first side member (301) and a second side member (302). In one embodiment, the first side member (301) and the second side member (302) may have a frame shape surrounding an internal space of a housing (e.g., the first housing (210) and the second housing (220) of FIG. 2). In some embodiments, the first side member (301) and the second side member (302) may have substantially the same structure, although there may be some differences in some shapes. According to one embodiment, the first side member (301) and the second side member (302) may at least partially include a conductive material. For example, FIG. 4 substantially illustrates the conductive material portions of the first side member (301) and the second side member (302), and the first side member (301) and the second side member (302) may further include a non-conductive material, for example, an insulating material, in addition to the conductive material portion, thereby having a closed curve shape.

[0084] In one embodiment, the first side surface member (301) may include a first side portion (311), a second side portion (312), a third side portion (313), and / or a fourth side portion (314). In some embodiments, the first to fourth side portions (311, 312, 313, 314) may be referred to as 'first to fourth frames' or 'first to fourth side walls'. In one embodiment, the first side portion (311) may be arranged parallel to or parallel to the folding axis (A-A'). The second side portion (312) may be arranged in a direction intersecting or substantially perpendicular to the folding axis (A-A') from one end (e.g., the top) of the first side portion (311). The third side portion (313) may be arranged in a direction intersecting or substantially perpendicular to the folding axis (A-A') from the other end (e.g., the bottom) of the first side portion (311). The fourth side portion (314) is connected to the ends of the second side portion (312) and the third side portion (313), and may extend substantially parallel to the folding axis (A-A'). In one embodiment, the fourth side portion (314) may be arranged adjacent to a hinge assembly (e.g., the hinge assembly (230) of FIGS. 2 and 3), and may extend along the folding axis (A-A') substantially parallel to the hinge assembly (230).

[0085] According to one embodiment, the first side member (301) may include a plurality of slit(s) (316a, 316b, 316c, 316d, 316e, 316f) that at least partially separate the conductive material portions. In some embodiments, the plurality of slit(s) (316a, 316b, 316c, 316d, 316e, 316f) may be filled with a non-conductive material, which may be referred to as a “non-conductive portion” or a “non-conductive material portion” as needed. A structure made of an insulating material may be formed in at least a portion of the area surrounded by the first to fourth side members (311, 312, 313, 314). In some embodiments, the plurality of slits (316a, 316b, 316c, 316d, 316e, 316f) may be filled with an insulating material.

[0086] According to one embodiment, the first slit (316a) and the second slit (316b) may be formed in the first side (311), the third slit (316c) and the fourth slit (316d) may be formed in the second side (312), and the fifth slit (316e) and the sixth slit (316f) may be formed in the third side (313). According to one embodiment, any one of the slits may be omitted, and further slits not shown may be added.

[0087] The second side member (302) may include a fifth side portion (321), a sixth side portion (322), a seventh side portion (323), and / or an eighth side portion (324). The fifth to eighth side portions (321, 322, 323, 324) may be referred to as 'fifth to eighth frames' or 'fifth to eighth side walls'. In one embodiment, the fifth side portion (321) may be arranged parallel to or in a direction intersecting with the folding axis (A-A'). The sixth side portion (322) may be arranged in a direction substantially perpendicular to or intersecting with the folding axis (A-A') from one end (e.g., the top) of the fifth side portion (321). The seventh side portion (323) may be arranged in a direction intersecting or substantially perpendicular to the folding axis (A-A') from the other end (e.g., the bottom) of the fifth side portion (321). The eighth side portion (324) is connected to the ends of the sixth side portion (322) and the seventh side portion (323), and may extend substantially parallel to the folding axis (A-A'). In one embodiment, the eighth side portion (324) may be arranged adjacent to a hinge assembly (e.g., the hinge assembly (230) of FIGS. 2 and 3), and may extend substantially parallel to the hinge assembly (230) along the folding axis (A-A'). According to one embodiment, the second side member (302) may include a plurality of slit(s) (326a, 326b, 326c, 326d, 326e, 326f) that at least partially separate the conductive material portions. Depending on the design, the second side member (302) may have a shape that is symmetrical with respect to the first side member (301). In the following description, the description of the configuration of the first side member (301) may be applied to the configuration of the second side member (302).

[0088] At least a portion of the first side portion (311), the second side portion (312), the third side portion (313), and the fourth side portion (314) may be formed of a conductive material. For example, at least a portion of the first side portion (311), the second side portion (312), the third side portion (313), and / or the fourth side portion (314) may be formed of a radiating conductor. In one embodiment, the first side portion (311), the second side portion (312), the third side portion (313), and / or the fourth side portion (314) may function as a radiator (e.g., a radiating conductor) of an antenna of the electronic device (300). For example, a processor or communication module (e.g., processor (120) or communication module (190) of FIG. 1) of an electronic device (300) may perform wireless communication using at least a portion of the first side (311), the second side (312), the third side (313), and / or the fourth side (314). In one embodiment, a portion of the first side (311) (e.g., the first conductive portion (311-1) of the first side (311)) and a portion of the second side (312) (e.g., the third conductive portion (312-3) of the second side (312)) may be utilized together as a single radiation conductor. Additionally, according to an embodiment, a portion of the second side portion (312) (e.g., the first conductive portion (312-1) of the second side portion (312)) and a portion of the fourth side portion (314) may be utilized together as a single radiation conductor. In addition, there may be various combinations in which multiple portions included in the first side portion (311), the second side portion (312), and the third side portion (313) are utilized as radiation conductors.

[0089] According to one embodiment, the electronic device (300) may include at least one printed circuit board. For example, the electronic device (300) may include a first printed circuit board (330). According to one embodiment, in order to implement various functions and operations of the electronic device (300), a processor (e.g., the processor (120) of FIG. 1) and / or a communication module (e.g., the communication module (190) of FIG. 1) may be transmitted to the electronic component (e.g., a radiation conductor)(s) using various conductive lines (not shown) and / or connectors (not shown) formed on the first printed circuit board (330). For example, a portion of the second side portion (312) may be electrically connected to the first printed circuit board (330) and utilized as a radiation conductor. In this case, the second side portion (312) may include terminals for power supply and / or grounding. For example, a power supply terminal formed on the second side (312) may be electrically connected to the first printed circuit board (330), and a ground terminal formed at another location on the second side (312) may be connected to the first printed circuit board (330). According to one embodiment, the terminal may be electrically connected to the first printed circuit board (330) through a connecting member (e.g., a c-clip) disposed on the first printed circuit board (330).

[0090] According to one embodiment, the second side (312) may include a first conductive portion (312-1) and a second conductive portion (312-2) separated by a first slit (316c), and may include a second conductive portion (312-2) and a third conductive portion (312-3) separated by a second slit (316d). The positions of the feed terminal and the ground terminal formed in the second side (312) may be formed adjacent to the slits. According to one embodiment, when designing the electronic device (300), the lengths of the plurality of conductive portions included in the second side (312) may be set to vary, so that the second side (312) may operate as a radiating conductor operating in a specific frequency range. The description of the first conductive portion (312-1), the second conductive portion (312-2), and the third conductive portion (312-3) of the second side portion (312) above can be applied to the first conductive portion (311-1), the second conductive portion (311-2), and the third conductive portion (311-3) included in the first side portion (311), and the first conductive portion (313-1), the second conductive portion (313-2), and the third conductive portion (313-3) included in the third side portion (313). The description of the first conductive portion (312-1), the second conductive portion (312-2), and the third conductive portion (312-3) of the second side member (312) may further be applied to the first conductive portion (321-1), the second conductive portion (321-2), and the third conductive portion (321-3) included in the fifth side member (321) of the second side member (302), the first conductive portion (322-1), the second conductive portion (322-2), and the third conductive portion (322-3) included in the sixth side member (322), and / or the first conductive portion (323-1), the second conductive portion (323-2), and the third conductive portion (323-3) included in the seventh side member (323).

[0091] For example, the electronic device (300) may include a first antenna that operates using a first conductive portion (312-1) of the second side (312), a second antenna that operates using a second conductive portion (312-2) of the second side (312), and a third antenna that operates using a third conductive portion (312-3) of the second side (312). In addition, the electronic device (300) may include a communication module (e.g., the communication module (190) of FIG. 1) connected to the first antenna, the second antenna, and the third antenna. According to one embodiment, the first antenna may be referred to as a first metal antenna, the second antenna may be referred to as a second metal antenna, and the third antenna may be referred to as a third metal antenna.

[0092] In addition to the above-described antenna(s), the electronic device (300) may further include other antenna(s). For example, the electronic device (300) may further include a fourth antenna (340). The fourth antenna (340) is a patch type antenna and may face in a direction parallel to a surface facing the display of the electronic device (300). According to one embodiment, the fourth antenna (340) may overlap at least a portion with the first printed circuit board (330). In addition, the antenna may further include an LDS antenna manufactured using the LDS (laser direct structure) method. In addition, the antenna may further include an NFC (near field communication) antenna for functionally performing NFC, a wireless charging antenna, and / or an MST (magnetic secure transmission) antenna for performing MST. However, the present invention is not limited thereto, and various other types of antennas may be further included.

[0093] The communication module (350) (e.g., the communication module (190) of FIG. 1) may establish a communication channel of a band to be used for wireless communication with a cellular network, and support legacy network communication and / or 5G network communication through the established communication channel. According to one embodiment, the communication module (350) may support communication corresponding to various bands to be used for wireless communication with a cellular network. According to one embodiment, the communication module (350) may be distinguished and separated according to the designated band into modules for performing communication corresponding to various bands. For example, the communication module may include a low-noise amplifier (LNA) module, which is a communication module for supporting a legacy network (e.g., a second generation (2G), 3G, 4G, or long term evolution (LTE) network), and a module for 5G communication (or RF communication), for example, an e-ultra NR dual connectivity (ENDC) module. For example, a first antenna operating using the first conductive portion (312-1) of the second side (312) may be used as a transmitting antenna (Tx antenna) that is connected to the ENDC module and performs a signal transmission operation (Tx operation). In another example, a third antenna operating using the third conductive portion (312-3) of the second side (312) may be used as a receiving antenna (Rx antenna) that supports a legacy network. In another example, a second antenna operating using the second conductive portion (312-2) of the second side (312) may also be used as a receiving antenna that supports a legacy network, but may be configured to support a different band from the third antenna. For example, the second antenna may be configured to support a low band and the third antenna may be configured to support a mid / high band. The first antenna, the second antenna, and the third antenna may be configured to support a designated band, respectively, while enabling communication in a state where the influence of mutual interference is minimized and / or optimized.However, the above example regarding the designated bands of the first antenna, the second antenna, and the third antenna is only one example, and other examples may be applied. For example, the second antenna may be configured to perform a signal transmission operation (a Tx operation). According to one embodiment, the communication module (e.g., the communication module (190) of FIG. 1) may be configured to perform a function that allows the first antenna, the second antenna, and the third antenna to support a predetermined band, while also supporting other bands as the case may be, that is, a surrounding reference signal (SRS) function. For example, the communication module (350) (e.g., the communication module (190) of FIG. 1) may additionally or alternatively include a switching module, for example, an SRS module, with respect to the LNA module and / or the ENDC module. Using a switching module, for example, a signal transmission operation (Tx) performed by a first antenna can be adjusted to be performed by at least one of the first antenna, the second antenna, and the third antenna.

[0094] In addition, the communication module (350) (e.g., the communication module (190) of FIG. 1) may include a UWB module (or UWB IC) as a communication module for performing a UWB (ultra wide band) function, additionally or alternatively, with respect to the LNA module, the ENDC module, and / or the SRS module. The UWB module may be provided as a separate module from the LNA module, the ENDC module, and / or the SRS module. The UWB module may be connected to, for example, a second antenna. The UWB module may perform the UWB function by using a combination of the second antenna and another antenna included in the electronic device (e.g., the fourth antenna (340) and / or an LDS antenna (not shown)). According to one embodiment, the electronic device (300) may perform a positioning (AoA (angle of arrival)) function and a distance measurement (ranging) function by using the UWB module. Meanwhile, the communication module (350) (e.g., the communication module (190) of FIG. 1) may additionally or alternatively include a WIFI module with respect to the UWB module. For example, when the communication module (350) includes a WIFI module, a combination of the second antenna and another antenna (e.g., an LDS antenna) may operate as an antenna for WIFI communication.

[0095] According to one embodiment, the communication module (350) (e.g., the communication module (190) of FIG. 1) may be formed within a single chip or single package with a communication processor (CP). Alternatively, the communication module (e.g., the communication module (190) of FIG. 1) may be formed within a single chip or single package with an application processor (AP).

[0096] Referring to FIG. 4, the electronic device (300) may include at least one camera module (360, 370, 380). According to one embodiment, the at least one camera module (360, 370, 380) may be disposed on the upper portion of the electronic device. For example, the at least one camera module (360, 370, 380) may be disposed at a position relatively closer to the second side (312) (or the sixth side (322)) among the second side (312) (or the sixth side (322)) and the third side (313) (or the seventh side (323)) of the electronic device. However, the position of the at least one camera module (360, 370, 380) may be appropriately changed in consideration of the design diversity of the electronic device (300) and the position at which the user holds the electronic device when photographing a subject. According to one embodiment, the position of at least one camera module (360, 370, 380) may be formed at a position corresponding to the sensor area (212), the first rear area (216), and / or the second rear area (226) of FIGS. 2 and 3.

[0097] At least one camera module (360, 370, 380) may include a camera module assembly (360). The camera module assembly (360) may include a combination of at least two cameras selected from the group consisting of a wide-angle camera, an ultra-wide-angle camera, a macro camera, a depth detection camera, a telephoto camera, and / or an infrared light source. Here, the wide-angle camera may have a field of view (FOV) of approximately 80 to 90 degrees, the ultra-wide-angle camera may have a field of view of approximately 110 degrees or more, and the telephoto camera may have a field of view of approximately 50 degrees or less, but this is only one example, and the size of the field of view may vary depending on the embodiment. Although FIG. 4 illustrates the camera module assembly (360) as including three cameras (triple cameras), it is not necessarily limited thereto. The camera module assembly (360) may be formed of two cameras (dual camera), four cameras (quad camera), or a combination of more cameras. In addition, at least one camera module (360, 370, 380) may include a single camera (370, 380). The single camera (370, 380) is generally a wide-angle camera, but is not limited to a wide-angle camera, an ultra-wide-angle camera, a macro camera, a depth detection camera, a telephoto camera, and / or an infrared light source. In one embodiment, the single camera (370, 380) may be implemented as an under-display camera (UDC). The single camera (370, 380) may be provided, for example, for a user to take a selfie, and may overlap with a display or be aligned with a camera hole formed in the display.According to one embodiment, the at least one camera module (360, 370, 380) may include a camera capable of implementing an auto focus (AF) function and / or an optical image stabilization (OIS) function. According to one embodiment, the at least one camera module (360, 370, 380) may include a fixed focus (FF) camera. For example, at least one of the cameras included in the camera module assembly (360) may be a camera having an auto focus function and / or an optical image stabilization function, and the single camera (370, 380) may be a fixed focus camera. However, the present invention is not necessarily limited thereto, and the camera included in the camera module assembly (360) may also include a fixed focus camera, and the single camera (370, 380) may have an auto focus function and / or an optical image stabilization function.

[0098] FIG. 5 is a perspective view of at least one camera module according to one embodiment of the present disclosure.

[0099] In the embodiment of FIG. 5 or below, the camera module (400) is described as a single camera (370, 380) which is a fixed focus (FF) camera.

[0100] In the detailed descriptions of FIGS. 4 and 5 below, the longitudinal direction of the electronic device (300) and / or the camera module (400) may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the height direction (thickness direction) as the 'Z-axis direction'. In the detailed description below, references to the longitudinal direction, the width direction, and / or the height direction (or thickness direction) may indicate the longitudinal direction, the width direction, and / or the height direction (or thickness direction) of the electronic device (300) and / or the camera module (400). In some embodiments, with respect to the direction in which the components are oriented, 'negative / positive (- / +)' may be mentioned together with the rectangular coordinate system illustrated in the drawings. For example, the front of the camera module (400) may be defined as the 'side facing the +Z-axis direction', and the rear may be defined as the 'side facing the -Z-axis direction'. According to one embodiment, the arrangement relationship in the height direction of a component or another component, i.e., the above / below reference, may be based on the +Z-axis direction / -Z-axis direction. That is, when a component is said to be arranged above another component, it may mean that the component is arranged in the +Z-axis direction with respect to the other component, and when a component is said to be arranged below another component, it may mean that the component is arranged in the -Z-axis direction with respect to the other component. Meanwhile, it should be noted that even if a component is arranged above or below another component, it does not mean that the entire component is located above or below all components of the other component. For example, a part of a component may be arranged above a part of another component, but another part of a component may be arranged below another part of the other component.In the following description, when it is said that a component overlaps (or is stacked) with another component, it should be noted that the description of the arrangement relationship in the height direction described above may be applied. According to one embodiment, in describing the components below, when it is said that a component is viewed from 'above' or from the 'top', it may refer to a view of a component viewed from the +Z-axis direction, and when it is said that a component is viewed from 'below' or from the 'back', it may refer to a view of a component viewed from the -Z-axis direction. In describing the direction, if 'yin / yang (- / +)' is not described, it may be interpreted as facing the + direction unless otherwise defined. For example, 'Z-axis direction' may be interpreted as facing the +Z direction, 'X-axis direction' may be interpreted as facing the +X-axis direction, and 'Y-axis direction' may be interpreted as facing the +Y-axis direction. When describing directions, "facing along any one of the three axes of the orthogonal coordinate system" may include facing in a direction parallel to said axis. For the sake of brevity, this description is based on the orthogonal coordinate system depicted in the drawings, and it should be noted that the description of such directions or components does not limit the various embodiments of the present disclosure.

[0101] The camera module (400) may include at least one lens (401), a lens barrel (402) surrounding the at least one lens (401), a lens holder (410) for fixing the lens barrel (402), an image sensor (420), and a second printed circuit board (430) on which the image sensor (420) is arranged.

[0102] At least one lens (401) may be configured to focus and / or guide light (e.g., image information about a subject) incident on the at least one lens (401). The light may be refracted while passing through the at least one lens (401). According to one embodiment, the at least one lens (401) may comprise a lens assembly including a plurality of lenses for aberration control. According to one embodiment, the at least one lens (401) may be made of a glass material and / or a synthetic resin material.

[0103] The lens barrel (402) may generally have a cylindrical shape, and an opening may be formed on the upper surface through which light enters. The lens accommodated in the lens barrel (402) is exposed through the opening, and can refract light entering from the outside and form an image on the image formation surface (img) of the image sensor (420). The size of the image sensor (420) on which the image is formed may be large compared to the small diameter of the opening through which light enters the lens barrel (402), and accordingly, the outer diameters of the plurality of lenses may have a shape that becomes longer or larger as they go from the object side to the image side. The lens barrel (402) may also have a shape corresponding to the shape of the lens assembly assembled therein.

[0104] The lens holder (410) may be configured to surround the lens barrel (402). The lens holder (410) may include a fastening structure that can be fastened to the lens barrel (402), and the lens barrel (402) may have a corresponding structure so as to be coupled with the fastening structure formed in the lens holder (410). According to one embodiment, the fastening structure included in the lens holder (410) may correspond to a screw thread. According to one embodiment, the lens holder (410) is a structure that is coupled to the lens barrel (402) to form the overall appearance of the camera module, and may have a shape that is approximately hexahedral. However, the present invention is not limited thereto, and may have a structure of a cylinder, a triangular prism, or a pentagonal or larger prism. It should be noted that the lens holder (410) is not limited to a specific shape. During use of the camera module (400), the relative position between the lens holder (410) and the lens barrel (402) may be maintained in a fixed state. According to one embodiment, in a fixed-focus camera, since the lens holder (410) does not use a focus adjustment function and a shake correction function, the structure of the lens holder (410) can be simplified. According to one embodiment, the lens holder (410) can be configured to include a non-metallic material.

[0105] The image sensor (420) is a sensor that is arranged on the second printed circuit board (430) in a state aligned with the optical axis of at least one lens (401), and can react to light. The image sensor (420) may include, for example, a sensor such as a complementary metal-oxide semiconductor (CMOS) image sensor or a charge coupled device (CCD). The image sensor (420) is not limited thereto, and may include, for example, various elements that convert an image of a subject into an electrical image signal. The image sensor (420) can acquire an image of a subject by detecting brightness information, gradation information, color information, etc. of the subject from light passing through at least one lens.

[0106] The second printed circuit board (430) may be provided separately from the first printed circuit board (e.g., the first printed circuit board (330) of FIG. 4). The second printed circuit board (430) may have a flat shape as a printed circuit board on which an image sensor (420) is disposed on one surface. The second printed circuit board (430) may include at least one component (435, 436) in addition to the image sensor (420). For example, the second printed circuit board (420) may include an image signal processor (ISP), a memory (435) (e.g., EEPROM), and / or a capacitor (436) (e.g., multilayer ceramic capacitors (MLCC)). According to one embodiment, the second printed circuit board (430) may additionally include a reinforcing member (437) to prevent tilting of the image sensor (420).

[0107] According to one embodiment, the camera module (400) may further include a filter (425). For example, the filter (425) may be an IR Cut filter for blocking infrared (IR), and the filter (425) may overlap the image sensor (420). In addition, according to one embodiment, the camera module (400) may further include a lens cover member (440). For example, the lens cover member (440) may be a lens cover tape. According to one embodiment, the lens cover member (440) may be used to make the appearance of the camera module (400) more attractive, or the lens cover member (440) may be used to prevent the camera module (400) from moving within an electronic device.

[0108] The image sensor (420) and / or the second printed circuit board (430) may be electrically connected to other components (e.g., an image signal processor or the first printed circuit board (330) of FIG. 4). Although not shown in the drawing, at least one component (e.g., an image signal processor, a memory, etc.) may be disposed on the first printed circuit board (330), and the second printed circuit board (430) may be connected to the components disposed on the first printed circuit board (330). For this purpose, the camera module (400) may further include an extension portion (431) and a third printed circuit board (432). For example, a plurality of signal lines may be disposed on the extension portion (431) and the third printed circuit board (432). The extension (431) is a component that connects the second printed circuit board (430) and the third printed circuit board (432). In FIG. 5, it is illustrated as simply extending in a straight line toward the third printed circuit board (432), but is not necessarily limited thereto. The extension (431) may have, for example, a shape such as an "L", a "U", or an "S", and the length and shape of the extension (431) may also vary depending on the embodiment. According to one embodiment, the extension (431) may be formed of a flexible printed circuit board (FPCB). A connector (433) may be provided on one surface of the third printed circuit board (432). The connector (433) may have a type of receptacle shape, but is not necessarily limited thereto, and may have a header shape for connecting with a connector of another component.

[0109] FIG. 6 is a diagram illustrating the back surface of a camera module according to an embodiment of the present disclosure. FIG. 7 is a diagram illustrating signal lines within a camera module according to an embodiment of the present disclosure. FIG. 8 is a diagram illustrating signal lines within a first printed circuit board of an electronic device according to an embodiment of the present disclosure.

[0110] Referring to FIG. 6, an EMI (electro magnetic interference) shielding structure (434) may be arranged on the back surface of the camera module (400). For example, for a camera module (400) such as FIG. 5, an EMI shielding structure (434) may be added to the back surface of a second printed circuit board (430) to shield the camera module (400) from electromagnetic waves. The EMI shielding structure (434) arranged on the back surface of the camera module (400) may cover the back surface of the second printed circuit board (430) and the extension portion (431).

[0111] Referring to FIG. 7, a plurality of signal lines may be arranged on the second printed circuit board (430) of the camera module (400). Referring to FIGS. 6 and 7 together, an EMI shielding structure (434) may cover most of the plurality of signal lines to reduce the influence of EMI on the camera module (400). However, the EMI shielding structure (434) may not be formed on the third printed circuit board (432). The signal line of the portion where the third printed circuit board (432) is arranged may have metal pads, terminals, and / or wires exposed to the outside. The second printed circuit board (430) may be electrically connected to another printed circuit board (e.g., the first printed circuit board (330)) using the extension (431) and the third printed circuit board (432). For example, in the camera module (400), the signal line arranged on the third printed circuit board (432) may be electrically connected to another printed circuit board (e.g., the first printed circuit board (330)) using metal pads, terminals, and / or wires exposed to the outside.

[0112] According to one embodiment, the camera module (400) is disposed adjacent to the first printed circuit board (330), and at least one signal line for electrical connection with the camera module (400) may be disposed on the first printed circuit board (330). Referring to FIG. 8, a plurality of signal lines are disposed on the first printed circuit board (330). The plurality of signal lines may serve to transmit a signal transmitted from a component disposed on the first printed circuit board (330) to another component. At least some of the components may be connected to each other and exchange signals (e.g., commands or data) with peripheral components and / or devices through various communication methods (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)). According to one embodiment, the camera module (400) illustrated in FIGS. 6 and 7 may be connected to the MIPI signal line (390). For example, the third printed circuit board (432) of the camera module (400) may be electrically connected to the first MIPI signal line (391) using externally exposed metal pads, terminals, and / or wires. The location where the first MIPI signal line (391) is arranged may be adjacent to at least one of the various antennas mentioned above. Accordingly, electromagnetic noise induced through the first MIPI signal line (391) may cause abnormal operation of the camera module (400). In addition, the first printed circuit board (330) may also have a second MIPI signal line (392) arranged in addition to the first MIPI signal line (391). According to one embodiment, the second MIPI signal line (392) may be connected to a camera included in another camera module (e.g., the camera module assembly (360) of FIG. 4) arranged spaced apart from the camera module (400).For example, when electromagnetic noise is induced through the first MIPI signal line (391), electromagnetic waves may also be induced in the second MIPI signal line (392) adjacent to the first MIPI signal line (391), which may cause abnormal operation of a camera included in another camera module (e.g., the camera module assembly (360) of FIG. 4).

[0113] Hereinafter, camera modules according to various embodiments will be described in detail with reference to FIGS. 9a to 15.

[0114] FIG. 9A is a cross-sectional view of a camera module according to an embodiment of the present disclosure. FIG. 9B is a top view of a lens holder according to an embodiment of the present disclosure. FIG. 10 is a cross-sectional view of a camera module according to an embodiment of the present disclosure.

[0115] The camera module (400) may include at least one lens (401), a lens barrel (402), a lens holder (410), an image sensor (420), and a second printed circuit board (430). According to one embodiment, the lens holder (410) may include a first portion (411) including a non-conductive material and a second portion (412) including a conductive material. The camera module (400) may three-dimensionally shield the inside of the camera module (400) by using the second portion (412) including the conductive material.

[0116] In one embodiment, the lens holder (410) may include a first surface (410a) that faces substantially the same direction as an imaging plane (img) of an image sensor (420). Here, the first surface (410a) may be parallel to the imaging plane (img) of the image sensor (420), or may be inclined at a slight angle (e.g., approximately 10 degrees) with the imaging plane (img) of the image sensor (420). In addition, the lens holder (410) may include a second surface (410b) that faces the imaging plane (img) of the image sensor. In one embodiment, the second surface (410b) may face in a direction substantially opposite to the first surface (410a). The lens holder (410) may include a third surface (410c) between the first surface (410a) and the second surface (410b). Here, the third surface (410c) may be referred to as an inner surface of the lens holder (410). According to one embodiment, the third surface (410c) may be configured to contact the lens barrel (402). In addition, the lens holder (410) may include a fourth surface (410d) facing outward between the first surface (410a) and the second surface (410b). The fourth surface (410d) may be referred to as an outer surface of the lens holder (410). According to one embodiment, the fourth surface (410d) may be a portion that does not contact the lens barrel (402). According to one embodiment, the third surface (410c) may face in a direction substantially opposite to the fourth surface (410d).

[0117] According to one embodiment, the first portion (411) may be formed on at least a portion of the third surface (410c). For example, the first portion (411) including a non-conductive material may be formed at a position corresponding to a fastening structure (e.g., a screw thread) on the third surface (410c) of the lens holder (410). According to another embodiment, the first portion (411) may be formed on at least a portion of the first surface (410a) and at least a portion of the third surface (410c). For another example, the first portion (411) including a non-conductive material may be formed to extend to a position corresponding to a fastening structure (e.g., a screw thread) on the third surface (410c) of the lens holder (410) as well as a position where the fastening structure is not formed. In Fig. 9a, the first part (411) is shown formed on at least a portion of the first surface (410a) and at least a portion of the third surface (410c). According to the embodiment illustrated in Fig. 9a, the lens holder (410) may include the first part (411) arranged corresponding to all surfaces (at least a portion of the first surface (410a) and at least a portion of the third surface (410c)) that come into contact with the lens barrel (402).

[0118] According to one embodiment, the second portion (412) may be formed on at least a portion of the fourth surface (410d). According to another embodiment, the second portion (412) may be formed on at least a portion of the first surface (410a) and at least a portion of the fourth surface (410d). FIG. 9A illustrates that the second portion (412) is formed on at least a portion of the first surface (410a) and at least a portion of the fourth surface (410d). According to the embodiment illustrated in FIG. 9A, the lens holder (410) may include the second portion (412) disposed on a portion that does not contact the lens barrel (402).

[0119] According to one embodiment, the first portion (411) includes a non-conductive material (e.g., a non-metallic material), and thus may be made of a different material from the second portion (412) including a conductive material (e.g., a metallic material). According to one embodiment, the first portion (411) may be formed of the same material (e.g., a non-metallic material) as the body of the lens holder (410) and may form a substantially integral structure. According to one embodiment, the lens holder (410) includes a body formed of a non-conductive material, and the first portion (411) may refer to a structure that is included in the body and is capable of fixing and coupling a lens barrel. In addition, the second portion (412) may refer to a structure that covers the outer surface of the body by plating or coating a layer of a conductive material on the outer surface of the body excluding the first portion.

[0120] According to one embodiment, the second part (412) may be plated (or coated) on the surface of the lens holder (410) by LDS (laser direct structuring) patterning. However, the method of forming the second part (412) is not necessarily limited thereto, and various other embodiments, such as attaching a metal tape or adding a stainless steel plate to the lens holder (410), may also be applied. By plating the surface of the lens holder (410) during the process of manufacturing and / or assembling the camera module (400), a shielding structure for the camera module (400) can be easily provided. At this time, referring to FIG. 9b, the portion of the lens holder (410) that comes into contact with the lens barrel (402) may not be plated. For example, the third surface (410c) of the lens holder (410) may include a fastening structure (e.g., screw thread). When the lens holder (410) is externally connected to the lens barrel (402) using the above-described fastening structure (e.g., screw threads), friction may occur. For example, if the third surface (410c) of the lens holder (410) is plated with LDS patterning to form the second part (412) (when forming a shielding structure), the frictional heat generated during the fastening process of the lens barrel (402) may cause the screw threads to split and / or foreign substances to form, which may obscure the lens, IR filter, and / or image sensor (420), resulting in a problem in which black spots are visible in the acquired image or the image appears blurry. In addition, if the second part (412) is formed on the third surface (410c) of the lens holder (410) (when forming a shielding structure), the expansion and contraction of the fastening structure (e.g., screw threads) depending on temperature may also cause the camera module (400) to become out of focus.Accordingly, in the third side (410c) of the lens holder (410), a portion where a fastening structure (e.g., screw thread) is formed may include a first portion (411) made of a non-conductive material (e.g., non-metallic material).

[0121] According to one embodiment, the lens holder (410) may further include a third portion (413) between the first portion (411) and the second portion (412). For example, the third portion (413) is a portion positioned between the first portion (411) and the second portion (412), and may be a portion including a conductive material or a portion including a non-conductive material, depending on the embodiment. Accordingly, the third portion (413) may be replaced with a component of one of the first portion (411) and / or the second portion (412), depending on the embodiment. Referring to FIG. 9A, the third portion (413) is illustrated as being formed at a location that does not contact the lens barrel (402), but is not necessarily limited thereto. The third portion (413) may be a portion that contacts at least a portion of the lens barrel (402) and includes a conductive material.

[0122] According to one embodiment, even if it is a part of the lens holder (410) that comes into contact with the lens barrel (402), if it is a part that does not generate a lot of frictional heat during the process of fastening with the lens barrel (402), it may include a conductive material. FIG. 10 may illustrate a form in which the third part (413) is omitted (or a form in which the third part (413) is replaced with the second part (412)). Referring again to FIG. 9A, the lens holder (410) may include a first part (411) that is configured to come into contact with at least a portion of the lens barrel (402) and includes a non-conductive material, and a second part (412) that is configured not to come into contact with the lens barrel (402) but includes a conductive material. Alternatively, referring to FIG. 10, the lens holder (410) may include a first portion (411) configured to contact at least a portion of the lens barrel (402) and comprising a non-conductive material, and a second portion (412) configured to contact at least a portion of the lens barrel (402) but comprising a conductive material.

[0123] According to one embodiment, the shielding structure by the second part (412) of the lens holder (410) is composed of a conductive material, and thus, when placed near the antenna, may affect the radiation performance of the antenna, and thus grounding is required. Two different grounding methods will be described below through the embodiments of FIGS. 11 to 13 and the embodiments of FIGS. 14 and 15.

[0124] FIG. 11 is a cross-sectional view of a camera module according to an embodiment of the present disclosure. FIG. 12 is a diagram showing a second printed circuit board on which an image sensor is arranged according to an embodiment of the present disclosure. FIG. 13 is a diagram showing a lens holder as viewed from below according to an embodiment of the present disclosure. FIG. 11 may represent a cross-section of the camera module cut along an imaginary line passing through the second portion (412) of FIG. 13.

[0125] According to one embodiment, for grounding the camera module (400), the second portion (412) may be formed on at least a portion of the second surface (410b). For example, referring to FIG. 11, the second portion (412) may be formed on at least a portion of the first surface (410a), at least a portion of the second surface (410b), and at least a portion of the fourth surface (410d).

[0126] Referring to FIGS. 11 and 12 together, a reinforcing member (437) may be additionally provided adjacent to the image sensor (420). The reinforcing member (437) may be provided to prevent tilt between the image sensor (420) and the second printed circuit board (330). According to one embodiment, the reinforcing member (437) may include a stainless steel material. According to one embodiment, the reinforcing member (437) may have a shape in which branches extend in an approximately 'X' shape centered on the image sensor (420). In addition, the reinforcing member (437) may be grounded to the second printed circuit board (430). According to the embodiment illustrated in FIG. 11, the second portion (412) may extend from the fourth surface (410d) of the lens holder (410) to the second surface (410b), that is, the back surface of the camera module (400). Referring to FIGS. 12 and 13 together, the second portion (412) formed on at least a portion of the second surface (410b) of the lens holder (410) may be formed at a position corresponding to the end portion (438) of the reinforcing member (437). Accordingly, when assembling the assembly of the lens barrel (402) surrounding at least one lens (401) and the lens holder (410) with the second printed circuit board (430) on which the image sensor (420) is disposed, the second portion (412) formed on at least a portion of the second surface (410b) of the lens holder (410) may be electrically connected to the reinforcing member (437), thereby forming a grounding structure.

[0127] Fig. 14 is a cross-sectional view of a camera module according to one embodiment. Fig. 15 is a drawing showing a lens holder according to one embodiment as viewed from below.

[0128] According to one embodiment, for grounding the camera module (400), the second portion (412) may be formed on at least a portion of the second surface (410b). However, unlike the embodiments of FIGS. 11 to 13 described above in which the grounding structure is formed at multiple locations, the embodiments of FIGS. 14 and 15 may provide a sufficient grounding structure at only one location, but are not necessarily limited thereto. Similar to the embodiments of FIGS. 12 and 13 described above, the second portion (412) extending to the second surface (410b) of the lens holder (410) for grounding the camera module (400) may be included in multiple numbers.

[0129] For example, referring to FIGS. 14 and 15 together, the second portion (412) may be formed on at least a portion of the first surface (410a), at least a portion of the second surface (410b), and at least a portion of the fourth surface (410d). And the second portion (212) may extend from any location around the fourth surface (410d) to the second surface (410b). At this time, the second portion (412) may be configured to contact a connecting member (450) disposed on the second printed circuit board (430). According to one embodiment, the connecting member (450) may be a c-clip.

[0130] In the present disclosure, through the embodiments illustrated in FIGS. 11 to 15, a shielding structure for EMI shielding can be provided while also providing a stable grounding structure.

[0131] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains from the description of the above-described embodiment(s).

[0132] According to one embodiment of the present disclosure, an electronic device (101; 200; 300) including a camera module (180; 360; 370; 380; 400;) may be provided. The camera module (180; 360; 370; 380; 400;) may include at least one lens (401); a lens barrel (402) configured to support the at least one lens; a lens holder (410) configured to be fastenably engaged with the lens barrel; and an image sensor (420). The lens holder (410) may include a body formed of a non-conductive material. The body may include a first part (411) configured to be fastenably engaged with the lens barrel. The lens holder (410) may further include a second portion (412) that covers the outer surface of the main body by plating or coating a layer of a conductive material on the outer surface of the main body excluding the first portion.

[0133] According to one embodiment, the electronic device may further include a first printed circuit board (330); and at least one side member (310; 320;). The at least one side member (310; 320;) includes a plurality of side portions, and the first printed circuit board (330) may be electrically connected to the plurality of side portions using power supply and / or ground terminals.

[0134] According to one embodiment, the camera module (180; 360; 370; 380; 400;) is positioned adjacent to the first printed circuit board (330), and at least one signal line connected to the at least one camera module (180; 360; 370; 380; 400;) may be positioned on the first printed circuit board (330).

[0135] According to one embodiment, the at least one signal line may include a mobile industry processor interface (MIPI) signal line.

[0136] According to one embodiment, the lens holder may include a first surface (410a) facing substantially the same direction as the imaging surface (img) of the image sensor; a second surface (410b) facing the imaging surface of the image sensor; a third surface (410c) facing the lens holder between the first surface and the second surface; and a fourth surface (410d) facing outward between the first surface and the second surface.

[0137] According to one embodiment, the first portion (411) may be formed on at least a portion of the third surface.

[0138] According to one embodiment, the first portion (411) may be formed on at least a portion of the first surface and at least a portion of the third surface.

[0139] According to one embodiment, the second portion (412) may be formed on at least a portion of the fourth surface.

[0140] According to one embodiment, the second portion (412) may be formed on at least a portion of the first surface and at least a portion of the fourth surface.

[0141] According to one embodiment, the second portion (412) may be formed on at least a portion of the second surface.

[0142] According to one embodiment, the second portion (412) may be configured to contact a ground portion disposed on a second printed circuit board on which the image sensor is disposed.

[0143] According to one embodiment, the second portion (412) may be configured to contact a connecting member disposed on a second printed circuit board on which the image sensor is disposed.

[0144] According to one embodiment, the lens barrel may be assembled into a lens holder having threads formed on the third surface.

[0145] In one embodiment, the first portion is integral with the lens holder, and the second portion can be plated on the surface of the lens holder by laser direct structuring (LDS) patterning.

[0146] According to one embodiment, the at least one camera module (180; 360; 370; 380; 400) may be a fixed focus type (FF) camera module.

[0147] According to one embodiment of the present disclosure, a camera module (180; 360; 370; 380; 400;) may include at least one lens (401); a lens barrel (402) surrounding the at least one lens; a lens holder (410) fastened to the lens barrel; and an image sensor (420). The lens holder (410) may include a fastening structure formed of a non-conductive material and a shielding structure formed of a conductive material.

[0148] According to one embodiment, the lens holder may include a first surface (410a) facing substantially the same direction as an imaging surface (img) of the image sensor; a second surface (410b) facing the imaging surface of the image sensor; a third surface (410c) contacting the lens barrel between the first surface and the second surface; and a fourth surface (410d) facing outward and not contacting the lens barrel between the first surface and the second surface.

[0149] According to one embodiment, the second portion (412) may be formed on at least a portion of the second surface.

[0150] According to one embodiment of the present disclosure, an electronic device (101; 200; 300) may include a camera module (180; 360; 370; 380; 400;) and a first printed circuit board (330), wherein the camera module (180; 360; 370; 380; 400;) may include at least one lens (401); a lens barrel (402) surrounding the at least one lens; a lens holder (410) for fixing the lens barrel; an image sensor (420); and a second printed circuit board (430) on which the image sensor is disposed. The lens holder (410) may include a first portion (411) configured to be in contact with at least a portion of the lens barrel and including a non-conductive material, and a second portion (412) including a conductive material.

[0151] According to one embodiment, the camera module (180; 360; 370; 380; 400) may be a fixed focus type (FF) camera module.

[0152] Electronic devices according to various embodiments of the present disclosure may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of the present disclosure are not limited to the aforementioned devices.

[0153] The various embodiments of the present disclosure and the terminology used therein are not intended to limit the technical features described in the present disclosure to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In the present disclosure, each of the phrases "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among the phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0154] The term "module" used in various embodiments of the present disclosure may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integrally formed component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0155] Various embodiments of the present disclosure may be implemented as software (e.g., a program) including one or more instructions stored in a storage medium (e.g., built-in memory or external memory) readable by a machine (e.g., an electronic device). For example, a processor (e.g., a processor) of the machine (e.g., an electronic device) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, "non-transitory" only means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and this term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily in the storage medium.

[0156] According to one embodiment, the method according to various embodiments of the present disclosure may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smartphones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0157] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0158] While this disclosure has been described by way of example and example, it should be understood that the example is intended to be illustrative and not limiting. It will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the overall scope of this disclosure, including the appended claims and their equivalents.

Claims

1. In an electronic device (101; 200; 300) including a camera module (180; 360; 370; 380; 400;), The above camera module (180; 360; 370; 380; 400;) At least one lens (401); A lens barrel (402) configured to support at least one lens; A lens holder (410) configured to be fastenably engaged with the lens barrel; and including an image sensor (420); An electronic device in which the lens holder (410) includes a body formed of a non-conductive material, the body includes a first part (411) configured to be capable of fixing the lens barrel, and the lens holder (410) further includes a second part (412) that covers an outer surface of the body by plating or coating a layer of a conductive material on an outer surface of the body excluding the first part.

2. In paragraph 1, The above electronic device comprises: a first printed circuit board (330); and further comprising at least one side member (310; 320;), An electronic device wherein at least one of the side members (310; 320;) includes a plurality of side portions, and the first printed circuit board (330) is electrically connected to the plurality of side portions using power supply and / or ground terminals.

3. In paragraph 2, An electronic device in which the camera module (180; 360; 370; 380; 400;) is positioned adjacent to the first printed circuit board (330), and at least one signal line connected to the camera module (180; 360; 370; 380; 400;) is positioned on the first printed circuit board (330).

4. In paragraph 3, An electronic device wherein at least one of said signal lines comprises a mobile industry processor interface (MIPI) signal line.

5. In any one of paragraphs 1 to 4, The above lens holder has a first surface (410a) facing substantially the same direction as the direction in which the imaging plane (img) of the image sensor faces; A second surface (410b) facing the imaging surface of the image sensor; a third surface (410c) facing the lens holder between the first surface and the second surface; and An electronic device comprising a fourth surface (410d) facing outward between the first surface and the second surface.

6. In paragraph 5, The above first part (411) is an electronic device formed on at least a part of the third surface.

7. In paragraph 5, The above first part (411) is an electronic device formed on at least a part of the first surface and at least a part of the third surface.

8. In paragraph 5, The second part (412) is an electronic device formed on at least a portion of the fourth surface.

9. In paragraph 5, The second part (412) is an electronic device formed on at least a portion of the first surface and at least a portion of the fourth surface.

10. In clause 8 or 9, The second part (412) is an electronic device formed on at least a portion of the second surface.

11. In Article 10, The second part (412) is an electronic device configured to contact a ground portion arranged on a second printed circuit board on which the image sensor is arranged.

12. In paragraph 10, An electronic device in which the second portion (412) is configured to contact a connecting member disposed on a second printed circuit board on which the image sensor is disposed.

13. In paragraph 5, An electronic device in which the lens barrel is assembled into a lens holder having screw threads formed on the third surface.

14. In any one of paragraphs 1 to 13, The above first part is integral with the lens holder, The second part is an electronic device plated on the surface of the lens holder by LDS (laser direct structuring) patterning.

15. In any one of paragraphs 1 to 14, The above camera module (180; 360; 370; 380; 400) An electronic device that is a fixed focus type (FF) camera module.

Images