Electronic device

Abstract

An electronic device according to one embodiment disclosed herein may comprise: a foldable housing; a flexible display accommodated in the foldable housing; and a digitizer disposed below the flexible display. The digitizer may include a flexible circuit board layer, a first conductive layer disposed under the flexible circuit board layer, and a magnetic layer disposed under the flexible circuit board layer. A portion of the magnetic layer may be disposed between the flexible circuit board layer and the first conductive layer. The magnetic layer may include a first magnetic layer having a first magnetic polarity and a second magnetic layer having a second magnetic polarity that is different from the first magnetic polarity. The first magnetic layer and the first conductive layer may be disposed so as to substantially overlap when viewed in the direction perpendicular to the flexible display when the electronic device is in an unfolded state. The second magnetic layer and the first conductive layer may be disposed so as not to overlap when viewed in the direction perpendicular to the flexible display when the electronic device is in an unfolded state. Various other embodiments may be possible.

Description

electronic devices

[0001] Embodiments of the present disclosure relate to an electronic device including a digitizer and a method of operating the same.

[0002] Electronic devices are aiming for thinness, weight reduction, miniaturization, and multifunctionality. To achieve this, displays and various components are being incorporated into electronic devices. As display technology advances, research and development on electronic devices that include displays (or flexible displays) are actively underway. Electronic devices may include displays (or flexible displays), and digitizers may be applied to convert analog coordinates (e.g., position) from electronic pens (e.g., stylus pens) or other input devices into digital data.

[0003] The above is provided only as background information to aid in understanding embodiments of the present invention.

[0004] To improve the bending (e.g., unfolding and folding) of an electronic device, a portion of the conductive layer of the digitizer may be removed. Removing a portion of the conductive layer of the digitizer may degrade the characteristics of the electronic pen in the bending region. This may result in a significant change in characteristics in the bending region when the electronic pen (e.g., a stylus pen) is tilted.

[0005] Various embodiments of the present disclosure may provide a bendable / foldable electronic display device that can improve the electronic pen detection performance of a detachable digitizer in a segmented portion (e.g., a bending region) of the detachable digitizer.

[0006] Various embodiments of the present disclosure can provide a bendable / foldable electronic display device that can prevent (or compensate for, reduce) characteristic degradation in a bending region by reducing the thickness of a magnetic layer corresponding to a segmented portion of a separate digitizer (e.g., a digitizer in which at least one layer does not extend across a bending region and / or a digitizer that is not integrally formed with a display) and disposing a conductive layer thereon.

[0007] Various embodiments of the present disclosure can provide a bendable foldable electronic display device capable of improving folding / unfolding performance by reducing the thickness of a magnetic layer in a portion corresponding to a segmented portion (e.g., a bending region) of a separate digitizer.

[0008] The technical challenges addressed in this document are not limited to the technical challenges mentioned above, and may be expanded upon without departing from the spirit and scope of the present disclosure. Additional technical challenges not mentioned herein will be readily apparent to those skilled in the art, as described below.

[0009] An electronic device according to one embodiment of the present disclosure may include a foldable housing, a flexible display accommodated in the foldable housing, and a digitizer disposed below the flexible display. The digitizer may include a flexible circuit board layer, a first conductive layer disposed below the flexible circuit board layer, and a magnetic layer disposed below the flexible circuit board layer. A portion of the magnetic layer may be disposed between the flexible circuit board layer and the first conductive layer. The magnetic layer may include a first magnetic layer having a first magnetism and a second magnetic layer having a second magnetism different from the first magnetism. When the electronic device is unfolded and viewed in a direction perpendicular to the flexible display, the first magnetic layer and the first conductive layer may be disposed to substantially overlap each other. When the electronic device is unfolded, the second magnetic layer and the first conductive layer may be arranged so as not to overlap when viewed in a vertical direction from the front of the electronic device to the back of the electronic device through the flexible display.

[0010] An electronic device according to an embodiment of the present disclosure may include a second magnetic layer (MMP2) arranged to overlap a portion of a conductive layer (e.g., a conductive plate) of a digitizer from which a portion has been removed. By arranging the second magnetic layer (MMP2) in a portion corresponding to a bending area of ​​the electronic device, a decrease in detection in the bending area due to the removal of the conductive layer (e.g., a conductive plate) can be prevented (or compensated for, reduced).

[0011] An electronic device according to one embodiment of the present disclosure can improve the detection performance and pressure performance of an electronic pen in a banding area.

[0012] An electronic device according to one embodiment of the present disclosure can prevent (reduce) magnetization of a hinge component from affecting a digitizer.

[0013] An electronic device according to one embodiment of the present disclosure can improve folding / unfolding performance of the electronic device by reducing the thickness of a magnetic layer (MMP) in a folding region.

[0014] An electronic device according to one embodiment of the present disclosure can improve the electronic pen detection performance of a digitizer in a segmented portion (e.g., a bending region) of a detachable digitizer.

[0015] The effects that can be obtained through the embodiments of the present disclosure are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains from the description below.

[0016] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0017] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments of the present disclosure.

[0018] FIGS. 2A and 2B are front and rear views of a first state (e.g., unfolded stage) of an electronic device according to an embodiment of the present disclosure.

[0019] FIGS. 2C and 2D are front and rear views of a second state (e.g., folded state) of an electronic device according to an embodiment of the present disclosure.

[0020] FIG. 3A is a perspective view of an electronic device illustrating a first state (e.g., a flat state or unfolding state) according to one embodiment of the present disclosure.

[0021] FIG. 3b is a plan view illustrating the front of an electronic device in a first state (e.g., an unfolded state) according to one embodiment of the present disclosure.

[0022] FIG. 3c is a plan view illustrating the rear surface of an electronic device in a first state (e.g., an unfolded state) according to one embodiment of the present disclosure.

[0023] FIG. 3D is a perspective view of an electronic device illustrating a second state (e.g., a folding state) according to one embodiment of the present disclosure.

[0024] FIG. 3e is a perspective view of an electronic device illustrating a third state (e.g., an intermediate state) according to one embodiment of the present disclosure.

[0025] FIG. 4 is a block diagram illustrating the configuration of an electronic device according to one embodiment.

[0026] Fig. 5a is a drawing showing a first resonance method of an electronic pen (e.g., a stylus pen).

[0027] FIG. 5b is a diagram showing a method of secondary resonance of an electronic device according to primary resonance of an electronic pen (e.g., a stylus pen).

[0028] FIG. 6 is a drawing showing an electronic device according to an embodiment of the present disclosure, showing an unfolded state of the electronic device.

[0029] Fig. 7 is a drawing showing a folded state of the electronic device illustrated in Fig. 6.

[0030] FIG. 8 is a drawing showing an electronic device according to an embodiment of the present disclosure, showing an unfolded state of the electronic device.

[0031] FIG. 9 is a drawing showing a folded state of the electronic device illustrated in FIG. 8.

[0032] FIG. 10 is a drawing showing an electronic device according to an embodiment of the present disclosure, showing an unfolded state of the electronic device.

[0033] Fig. 11 is a drawing showing a folded state of the electronic device illustrated in Fig. 10.

[0034] FIG. 12 is a drawing showing an electronic device according to an embodiment of the present disclosure, showing an unfolded state of the electronic device.

[0035] Fig. 13 is a drawing showing a folded state of the electronic device illustrated in Fig. 12.

[0036] FIG. 14 is a drawing showing an electronic device according to an embodiment of the present disclosure, showing an unfolded state of the electronic device.

[0037] Fig. 15 is a drawing showing a folded state of the electronic device illustrated in Fig. 14.

[0038] FIG. 16 is a drawing showing a multi-foldable electronic device according to an embodiment of the present disclosure, showing an unfolded state of the multi-foldable electronic device.

[0039] FIG. 17 is a drawing showing an electronic device according to an embodiment of the present disclosure, showing an unfolded state of the electronic device.

[0040] FIG. 18 is a drawing showing an electronic device according to an embodiment of the present disclosure, showing an unfolded state of the electronic device.

[0041] Figure 19 is a drawing showing a second conductive layer arranged to overlap the second magnetic layer.

[0042] Figure 20 is a drawing showing the spacing between the first magnetic portion and the second magnetic portion of the first magnetic layer, and the positions where the first magnetic portion and the second magnetic portion of the first magnetic layer are arranged from a reference point.

[0043] FIG. 21 is a diagram showing the change in inductance [μH] inside an electronic pen according to the pattern density (e.g., the ratio of the width (w) [mm] and space (s) [mm] of the conductive pattern) of a conductive layer arranged to overlap with a second magnetic layer.

[0044] Figure 22 is a diagram showing the change in inductance inside an electronic pen depending on the presence or absence of a second conductive layer arranged to overlap the second magnetic layer.

[0045] Figure 23 is a diagram showing a phase change point according to the gap between the first and second parts of the first magnetic layer.

[0046] It should be noted that throughout the drawings, the same reference numbers are used to describe identical or similar elements, features and structures.

[0047] The following description, with reference to the attached drawings, is provided to facilitate a comprehensive understanding of various embodiments of the disclosure as defined by the claims and their equivalents. While it includes numerous specific details to aid understanding, these are to be considered merely exemplary. Accordingly, those skilled in the art will recognize that various modifications can be made to the various embodiments described herein without departing from the scope and spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0048] The terms and words used in the following description and claims are not limited to their literary meanings and are merely used by the applicant to facilitate a clear and consistent understanding of this document. Therefore, it should be apparent to those skilled in the art that the following description of various embodiments of this document is provided for illustrative purposes only, and is not intended to limit this document as defined by the appended claims and their equivalents.

[0049] The singular form should be understood to include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "component surfaces" may include reference to one or more of such surfaces. The features and embodiments described herein may be combined in any form, unless explicitly stated to be incompatible or incombinable.

[0050] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0051] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0052] The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculation, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0053] The auxiliary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0054] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0055] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0056] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0057] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0058] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0059] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0060] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0061] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0062] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0063] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0064] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0065] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0066] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0067] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0068] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0069] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0070] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0071] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0072] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0073] Electronic devices according to embodiments disclosed herein may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments disclosed herein are not limited to the aforementioned devices.

[0074] The embodiments of the present disclosure and the terminology used therein are not intended to limit the technical features described in this document to a specific embodiment, but should be understood to include various modifications, equivalents, or substitutes of the embodiment. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the item, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among the phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0075] The term "module" used in one embodiment of the present disclosure may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0076] An embodiment of the present disclosure may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0077] According to one embodiment, the method according to one embodiment disclosed in the present document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0078] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0079] According to one embodiment, the display module (160) may include a flexible display configured to be foldable or unfoldable.

[0080] According to one embodiment, the display module (160) may include a flexible display that is arranged to be slidable (e.g., slidable in the x-axis direction, slidable in the y-axis direction) to provide a screen (e.g., a display screen).

[0081] According to one embodiment, the display module (160) may be referred to as a stretchable display, an expandable display, or a slide-in / out display.

[0082] According to various embodiments, the sensor module (176) may include a movement distance detection sensor for detecting a distance between the first housing and the second housing of the electronic device.

[0083] According to one embodiment, the electronic device (101) may include a display module (160) and an electronic pen (e.g., an electronic pen (500) of FIGS. 5A and 5B) (e.g., a stylus pen). For example, the display module (160) may include a flexible display configured to be foldable or unfoldable. For example, the display module (160) may include a display (e.g., a display (410) of FIG. 4), a display driver IC (e.g., a display driver IC (430) of FIG. 4), a touch circuit (e.g., a touch circuit (450) of FIG. 4), a digitizer (e.g., a digitizer (460) of FIG. 4), and a digitizer driver (e.g., a digitizer driver (470) of FIG. 4).

[0084] Throughout this disclosure, electronic devices are considered to include some form of flexible display as described above. However, the present disclosure is not limited to electronic devices including flexible displays, and may also include other forms of flexible electronic devices that include a digitizer near the flexible portion and / or hinge.

[0085] FIGS. 2A and 2B are front and rear views of a first state (e.g., unfolded state) of an electronic device according to an embodiment of the present disclosure. FIGS. 2C and 2D are front and rear views of a second state (e.g., folded state) of an electronic device according to an embodiment of the present disclosure.

[0086] The electronic device (200) of FIGS. 2A to 2D may be at least partially similar to the electronic device (101) of FIG. 1, or may further include other embodiments of the electronic device (e.g., other embodiments providing a flexible electronic display device).

[0087] Referring to FIGS. 2A to 2D , an electronic device (200) according to an embodiment of the present disclosure (e.g., the electronic device (101) of FIG. 1 ) may include a pair of housings (210, 220) (e.g., a foldable housing structure) that are rotatably coupled about a folding axis (F) through at least one hinge device (e.g., a hinge module or a hinge structure) so as to be foldable with respect to each other, a first display (230) (e.g., a flexible display, a foldable display, or a main display) disposed through the pair of housings (210, 220), and / or a second display (235) (e.g., a sub-display) disposed through the second housing (220).

[0088] According to one embodiment, at least a portion of at least one hinge device may be arranged so as not to be visible from the outside through the first housing (210) and the second housing (220), and may be arranged so as not to be visible from the outside through the hinge housing (290) (e.g., hinge cover) that covers the foldable portion in a first state (e.g., unfolded state). In this document, the surface on which the first display (230) is arranged may be defined as the front surface of the electronic device (200). In this document, the surface opposite to the front surface may be defined as the back surface of the electronic device (200). In addition, the surface surrounding the space between the front surface and the back surface may be defined as the side surface of the electronic device (200).

[0089] According to one embodiment, a pair of housings (210, 220) may include a first housing (210) and a second housing (220) that are foldably arranged relative to each other via at least one hinge device.

[0090] According to one embodiment, the pair of housings (210, 220) are not limited to the shapes and combinations shown in FIGS. 2a to 2d, and may be implemented by other shapes or combinations and / or combinations of parts.

[0091] According to one embodiment, the first housing (210) and the second housing (220) are arranged on both sides with respect to the folding axis (F), have an overall symmetrical shape with respect to the folding axis (F), and can be folded to match each other.

[0092] According to one embodiment, the first housing (210) and the second housing (220) may be folded asymmetrically with respect to the folding axis (F).

[0093] According to one embodiment, the angle or distance between the first housing (210) and the second housing (220) may be different depending on whether the electronic device (200) is in a first state (e.g., unfolded stage), a second state (e.g., folded state), or a third state (e.g., intermediate state). For example, the electronic device (200) may sense whether it is in the first state (e.g., unfolded stage), the second state (e.g., folded state), or the third state (e.g., intermediate state) using a sensor module (e.g., sensor module (176) of FIG. 1). The electronic device (200) may sense the angle between the first housing (210) and the second housing (220) using a sensor module (e.g., sensor module (176) of FIG. 1).

[0094] According to one embodiment, the first housing (210) may be connected to at least one hinge device in a first state (e.g., an unfolded state) of the electronic device (200). The first housing (210) may include a first side member (213) arranged to face the front of the electronic device (200), a second side member (212) facing in an opposite direction of the first side member (211), and / or a first side member (213) surrounding at least a portion of a first space (2101) between the first side member (211) and the second side member (212).

[0095] According to one embodiment, the second housing (220) may be connected to at least one hinge device in a first state (e.g., an unfolded state) of the electronic device (200). The second housing (220) may include a third face (221) arranged to face the front of the electronic device (200), a fourth face (222) facing in an opposite direction of the third face (221), and / or a second side member (223) surrounding at least a portion of a second space (2201) between the third face (221) and the fourth face (222).

[0096] According to one embodiment, the first side (211) may be at least partially oriented in substantially the same direction as the third side (221) in a first state (e.g., an unfolded state) and may face the third side (221) in a second state (e.g., a folded state).

[0097] According to one embodiment, the electronic device (200) may include a recess (201) formed to accommodate a first display (230) through a structural combination of a first housing (210) and a second housing (220).

[0098] According to one embodiment, the recess (201) may have substantially the same size as the first display (230).

[0099] According to one embodiment, the first housing (210) may be coupled to a first side member (213) when the first display (230) is viewed from above. The first housing (210) may include a first protective frame (213a) (e.g., a first decorative member) that overlaps an edge of the first display (230) to cover the edge of the first display (230) so that it is not visible from the outside.

[0100] According to one embodiment, the first protective frame (213a) may be formed integrally with the first side member (213).

[0101] According to one embodiment, the second housing (220) may be coupled to the second side member (223) when the first display (230) is viewed from above. The second housing (220) may include a second protective frame (223a) that overlaps the edge of the first display (230) to cover the edge of the first display (230) so that it is not visible from the outside.

[0102] According to one embodiment, the second protective frame (223a) may be formed integrally with the second side member (223). According to one embodiment, the first protective frame (213a) and the second protective frame (223a) may be omitted.

[0103] According to one embodiment, a hinge housing (290) (e.g., a hinge cover) may be positioned between the first housing (210) and the second housing (220). The hinge housing (290) may be positioned to cover at least a portion of one hinge device (e.g., at least one hinge module).

[0104] According to one embodiment, the hinge housing (290) may be covered by a portion of the first housing (210) and the second housing (220) or exposed to the outside, depending on the first state (e.g., unfolded state), the second state (e.g., folded state), or the third state (e.g., intermediate state) of the electronic device (200). For example, when the electronic device (200) is in the first state (e.g., unfolded state), at least a portion of the hinge housing (290) may be covered by the first housing (210) and the second housing (220) and may be arranged so as to be substantially invisible from the outside.

[0105] According to one embodiment, when the electronic device (200) is in the second state (folded state), at least a portion of the hinge housing (290) may be positioned between the first housing (210) and the second housing (220) so as to be visible from the outside.

[0106] According to one embodiment, when the first housing (210) and the second housing (220) are in a third state (intermediate state) where they are folded at a certain angle, the hinge housing (290) may be positioned between the first housing (210) and the second housing (220) so as to be at least partially visible from the outside of the electronic device (200). For example, the area where the hinge housing (290) is exposed to the outside may be less than that in the completely folded state. According to one embodiment, the hinge housing (290) may include a curved surface.

[0107] According to one embodiment, when the electronic device (200) is in a first state (e.g., an unfolded state), the first housing (210) and the second housing (220) form an angle of about 180 degrees, and the first region (230a), the second region (230b), and the folding region (230c) of the first display (230) may form substantially the same plane. The first region (230a), the second region (230b), and the folding region (230c) of the first display (230) may be arranged to face substantially the same direction (e.g., the z-axis direction). According to one embodiment, when the electronic device (200) is in a first state (e.g., unfolded state), the first housing (210) may be rotated at an angle of about 360 degrees with respect to the second housing (220) so that the second side (212) and the fourth side (222) may be folded in the opposite direction (e.g., out folding).

[0108] According to one embodiment, when the electronic device (200) is in the second state (folded state), the first side (211) of the first housing (210) and the third side (221) of the second housing (220) may be arranged to face each other. In this case, the first area (230a) and the second area (230b) of the first display (230) may be arranged to face each other while forming a narrow angle (e.g., in the range of 0 degrees to about 10 degrees) with each other through the folding area (230c). According to one embodiment, at least a portion of the folding area (230c) may be deformed into a curved shape having a predetermined curvature.

[0109] According to one embodiment, when the electronic device (200) is in the third state (intermediate state), the first housing (210) and the second housing (220) may be arranged at a certain angle with respect to each other. In this case, the first region (230a) and the second region (230b) of the first display (230) may form an angle that is larger than the second state (e.g., folded state) and smaller than the first state (e.g., unfolded state), and the curvature of the folding region (230c) may be smaller than the second state (folded state) and larger than the first state (e.g., unfolded state). According to one embodiment, the first housing (210) and the second housing (220) may form an angle that can stop at a specified folding angle between the second state (e.g., folded state) and the third state (e.g., intermediate state) through at least one hinge device (e.g., free stop function). According to one embodiment, the first housing (210) and the second housing (220) may be continuously operated while being pressed in an unfolding or folding direction based on a specified inflection angle through at least one hinge device.

[0110] According to one embodiment, the electronic device (200) may include at least one of a display (230, 235), an input device (215), audio output devices (227, 228), sensor modules (217a, 217b, 226), camera modules (216a, 216b, 225), a key input device (219), an indicator (not shown), or a connector port (229) disposed in the first housing (210) and / or the second housing (220). According to one embodiment, the electronic device (200) may omit at least one of the components or may additionally include at least one other component.

[0111] According to one embodiment, at least one display (230, 235) may include a first display (230) (e.g., a flexible display) that is arranged to be supported by a third side (221) of a second housing (220) via at least one hinge device from a first side (211) of a first housing (210), and a second display (235) that is arranged to be at least partially visible from the outside through a fourth side (222) in an interior space of the second housing (220).

[0112] According to one embodiment, the second display (235) may be positioned so as to be visible from the outside through the second surface (212) in the interior space of the first housing (210).

[0113] According to one embodiment, the first display (230) may be primarily used in a first state (e.g., unfolded state) of the electronic device (200). The second display (235) may also be used in the first state (e.g., unfolded state) of the electronic device (200).

[0114] According to one embodiment, the second display (235) may be primarily used in a second state (e.g., folded state) of the electronic device (200). The first display (230) may also be used in the second state (e.g., folded state) of the electronic device (200).

[0115] According to one embodiment, the electronic device (200) can control the first display (230) and / or the second display (235) to be usable based on the folding angles of the first housing (210) and the second housing (220) in the third state (e.g., intermediate state).

[0116] According to one embodiment, the first display (230) may be disposed in a receiving space formed by a pair of housings (210, 220). For example, the first display (230) may be disposed in a recess (201) formed by the pair of housings (210, 220), and may be disposed to occupy substantially most of the front surface of the electronic device (200) in a first state (e.g., an unfolded state). According to one embodiment, the first display (230) may include a flexible display in which at least a portion of the first display (230) may be transformed into a flat or curved surface.

[0117] According to one embodiment, the first display (230) may include a first area (230a) facing the first housing (210) and a second area (230b) facing the second housing (220). According to one embodiment, the first display (230) may include a folding area (230c) including a portion of the first area (230a) and a portion of the second area (230b) with respect to the folding axis (F).

[0118] According to one embodiment, at least a portion of the folding area (230c) may include an area corresponding to at least one hinge device.

[0119] According to one embodiment, the division of the regions of the first display (230) is merely an exemplary physical division by a pair of housings (210, 220) and at least one hinge device, and in reality, the first display (230) can be displayed as a seamless, full screen through the pair of housings (210, 220) and at least one hinge device. Here, the relative positions and sizes of the regions (230a, 230b, 230c) can vary.

[0120] According to one embodiment, the first region (230a) and the second region (230b) may have an overall symmetrical shape with respect to the folding region (230c) or may have a partially asymmetrical shape.

[0121] According to one embodiment, the electronic device (200) may include a first rear cover (240) disposed on a second side (212) of a first housing (210) and a second rear cover (250) disposed on a fourth side (222) of a second housing (220). According to one embodiment, at least a portion of the first rear cover (240) may be formed integrally with the first side member (213). According to one embodiment, at least a portion of the second rear cover (250) may be formed integrally with the second side member (223).

[0122] In one embodiment, at least one of the first rear cover (240) and the second rear cover (250) may be formed of a substantially transparent plate (e.g., a glass plate including various coating layers, or a polymer plate) or an opaque plate. In one embodiment, the first rear cover (240) may be formed of an opaque plate, such as, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

[0123] According to one embodiment, the second rear cover (250) may be formed of a substantially transparent plate, such as glass or polymer. Accordingly, the second display (235) may be positioned so as to be visible from the outside through the second rear cover (250) in the internal space of the second housing (220).

[0124] In one embodiment, the input device (215) may include a microphone. In one embodiment, the input device (215) may include a plurality of microphones arranged to detect the direction of sound.

[0125] In one embodiment, the audio output devices (227, 228) may include speakers. In one embodiment, the audio output devices (227, 228) may include a call receiver (227) disposed through the fourth side (222) of the second housing (220) and an external speaker (228) disposed through at least a portion of the second side member (223) of the second housing (220).

[0126] According to one embodiment, the input device (215), the audio output devices (227, 228), and the connector port (229) may be arranged in spaces of the first housing (210) and / or the second housing (220). The input device (215), the audio output devices (227, 228), and the connector port (229) may be exposed to the external environment through at least one hole formed in the first housing (210) and / or the second housing (220). According to one embodiment, the holes formed in the first housing (210) and / or the second housing (220) may be used in common for the input device (215) and the audio output devices (227, 228). According to one embodiment, the audio output devices (227, 228) may include a speaker (e.g., a piezo speaker) that operates without the holes formed in the first housing (210) and / or the second housing (220).

[0127] According to one embodiment, the camera modules (216a, 216b, 225) may include a first camera module (216a) disposed on a first side (211) of the first housing (210), a second camera module (216b) disposed on a second side (212) of the first housing (210), and / or a third camera module (225) disposed on a fourth side (222) of the second housing (220).

[0128] According to one embodiment, the electronic device (200) may include a flash (218) positioned near the second camera module (216b). According to one embodiment, the flash (218) may include, for example, a light emitting diode or a xenon lamp.

[0129] According to one embodiment, the camera modules (216a, 216b, 225) may include one or more lenses, image sensors, and / or image signal processors. According to one embodiment, at least one camera module of the camera modules (216a, 216b, 225) includes two or more lenses (e.g., wide-angle and telephoto lenses) and image sensors, and may be arranged together on one side of the first housing (210) and / or the second housing (220).

[0130] According to one embodiment, the sensor modules (217a, 217b, 226) (e.g., the sensor module (176) of FIG. 1) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state.

[0131] According to one embodiment, the sensor modules (217a, 217b, 226) (e.g., the sensor module (176) of FIG. 1) may include a first sensor module (217a) disposed on a first surface (211) of the first housing (210), a second sensor module (217b) disposed on a second surface (212) of the first housing (210), and / or a third sensor module (226) disposed on a fourth surface (222) of the second housing (220).

[0132] According to one embodiment, the sensor modules (217a, 217b, 226) (e.g., sensor module (176) of FIG. 1) may include at least one of a gesture sensor, a gyro sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a light sensor, an ultrasonic sensor, a proximity sensor, a biometric sensor (e.g., an iris recognition sensor), a distance detection sensor (e.g., a time of flight (TOF) sensor, a light detection and ranging (LiDAR) sensor), a barometric pressure sensor, a magnetic sensor (e.g., a 6-axis sensor, a geomagnetic sensor), an acceleration sensor, a temperature sensor, a humidity sensor, and / or a fingerprint recognition sensor.

[0133] According to one embodiment, a processor of an electronic device (200) (e.g., processor (120) of FIG. 1) may operate sensor modules (217a, 217b, 226) (e.g., sensor module (176) of FIG. 1) to sense the illumination and / or IR intensity of the surroundings of the electronic device (200). The processor (120) may obtain information about the illumination and IR intensity of the surroundings of the electronic device (200).

[0134] According to one embodiment, the electronic device (200) may include at least one of a gesture sensor, a gyro sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a light sensor, an ultrasonic sensor, a proximity sensor, a biometric sensor (e.g., an iris recognition sensor), a distance detection sensor (e.g., a time of flight (TOF) sensor, a light detection and ranging (LiDAR) sensor), a barometric pressure sensor, a magnetic sensor (e.g., a 6-axis sensor, a geomagnetic sensor), an acceleration sensor, a temperature sensor, a humidity sensor, and / or a fingerprint recognition sensor, which are not shown.

[0135] According to one embodiment, the fingerprint recognition sensor may be disposed through at least one of the first side member (213) of the first housing (210) and / or the second side member (223) of the second housing (220).

[0136] According to one embodiment, the key input device (219) may be arranged to be exposed to the outside through the first side member (213) of the first housing (210). According to one embodiment, the key input device (219) may also be arranged to be exposed to the outside through the second side member (223) of the second housing (220). According to one embodiment, the electronic device (200) may not include some or all of the key input devices (219), and the key input devices (219) that are not included may be implemented in another form, such as a soft key, on at least one display (230, 235). According to one embodiment, the key input device (219) may be implemented using a pressure sensor included in at least one display (230, 235).

[0137] According to one embodiment, the connector port (229) may include a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device. According to one embodiment, the connector port (229) may also perform a function for transmitting and receiving audio signals with an external electronic device, or may further include a separate connector port (e.g., an ear jack hole) for performing a function for transmitting and receiving audio signals.

[0138] According to one embodiment, at least one of the camera modules (216a, 216b, 225), at least one of the sensor modules (217a, 217b, 226), and / or an indicator may be arranged to be visually exposed through at least one display (230, 235). For example, at least one of the camera modules (216a, 225), at least one of the sensor modules (217a, 226), and / or the indicator may be arranged in an internal space of at least one housing (210, 220), below an active area (display area) of at least one display (230, 235). At least one camera module (216a, 225), at least one sensor module (217a, 226) and / or an indicator may be positioned so as to be in contact with the external environment through a perforated opening or transparent area through a cover member (e.g., a window layer (not shown) of the first display (230) and / or a second rear cover (250)).

[0139] According to one embodiment, an area where at least one display (230, 235) and at least one camera module (216a, 225) face each other may be formed as a transparent area having a certain transmittance as part of an area displaying content.

[0140] In one embodiment, the transparent region may be formed to have a transmittance in the range of about 5% to about 20%. The transparent region may include an area overlapping an effective area (e.g., a field of view area) of at least one camera module (216a, 225) through which light passes to be imaged by the image sensor to create an image. For example, the transparent region of the display (230, 235) may include an area with a lower pixel density than the surrounding area. For example, the transparent region may replace an opening. For example, at least one camera module (216a, 225) may include an under-display camera (UDC) or an under-panel camera (UPC). In one embodiment, some camera modules or sensor modules (217a, 226) may be arranged to perform their functions without being visually exposed through the display. For example, the area facing the camera module (216a, 225) and / or sensor module (217a, 226) positioned under the display (230, 235) (e.g., display panel) may have an under display camera (UDC) structure, so that a perforated opening may not be necessary.

[0141] For example, the electronic device (200) of FIG. 2A may include a touch circuit (e.g., a touch circuit (450) of FIG. 4) including a touch sensor (e.g., a touch sensor (451) of FIG. 4) and a touch sensor IC (e.g., a touch sensor IC (453) of FIG. 4).

[0142] For example, the electronic device (200) of FIG. 2A may include a digitizer (e.g., a digitizer (460) of FIG. 4) and a digitizer driver (e.g., a digitizer driver (470) of FIG. 4).

[0143] FIG. 3A is a perspective view of an electronic device in a first state (e.g., a flat state or unfolding state) according to an embodiment of the present disclosure. FIG. 3B is a plan view illustrating a front side of the electronic device in a first state (e.g., a flat state) according to an embodiment of the present disclosure. FIG. 3C is a plan view illustrating a rear side of the electronic device in a first state (e.g., a unfolding state) according to an embodiment of the present disclosure. FIG. 3D is a perspective view of an electronic device in a second state (e.g., a folding state) according to an embodiment of the present disclosure. FIG. 3E is a perspective view of an electronic device in a third state (e.g., an intermediate state) according to an embodiment of the present disclosure.

[0144] The electronic device (300) of FIGS. 3A to 3E may be at least partially similar to the electronic device (101) of FIG. 1, or may further include other embodiments of the electronic device.

[0145] Referring to FIGS. 3A to 3E, an electronic device (300) according to an embodiment of the present disclosure may include a pair of housings (310, 320) (e.g., foldable housings) that are rotatably coupled to face each other and foldable based on a hinge structure (e.g., hinge structure (340), hinge device, or hinge module of FIG. 3B).

[0146] According to one embodiment, the hinge structure (340) may be arranged in the x-axis direction or in the y-axis direction. According to one embodiment, two or more hinge structures (340) may be arranged so as to be folded in the same direction or in different directions.

[0147] According to one embodiment, the electronic device (300) may include a flexible display (330) (e.g., a foldable display) disposed in an area formed by a pair of housings (310, 320).

[0148] According to one embodiment, the first housing (310) and the second housing (320) are arranged on both sides with respect to the folding axis (axis A) as the center, and may have a shape that is substantially symmetrical with respect to the folding axis (axis A).

[0149] According to one embodiment, the angle or distance between the first housing (310) and the second housing (320) may vary depending on whether the state of the electronic device (300) is a first state (e.g., a flat state or unfolding state), a second state (e.g., a folding state), or a third state (e.g., an intermediate state).

[0150] According to one embodiment, a pair of housings (310, 320) may include a first housing (310) (e.g., first housing structure, first housing portion) coupled with a hinge structure (340) and a second housing (320) (e.g., second housing structure, second housing portion) coupled with the hinge structure (340).

[0151] According to one embodiment, the first housing (310) may include, in a first state (e.g., an unfolded state), a first surface (311) facing a first direction (e.g., a front direction) (z-axis direction) and a second surface (312) facing a second direction (e.g., a rear direction) (-z-axis direction) opposite to the first surface (311).

[0152] According to one embodiment, the second housing (320) may include, in a first state (e.g., an unfolded state), a third face (321) facing a first direction (z-axis direction) and a fourth face (322) facing a second direction (-z-axis direction).

[0153] According to one embodiment, the electronic device (300) may be operated in such a manner that in a first state (e.g., a sleeping state), a first surface (311) of a first housing (310) and a third surface (321) of a second housing (320) are oriented in substantially the same first direction (z-axis direction), and in a second state (e.g., a folded state), the first surface (311) and the third surface (321) face each other.

[0154] According to one embodiment, the electronic device (300) may be operated such that in a first state (e.g., an unfolded state), the second face (312) of the first housing (310) and the fourth face (322) of the second housing (320) face substantially in the same second direction (-z-axis direction), and in a second state (e.g., a folded state), the second face (312) and the fourth face (322) face in opposite directions. For example, in the second state (e.g., a folded state), the second face (312) may face in the first direction (z-axis direction), and the fourth face (322) may face in the second direction (-z-axis direction).

[0155] According to one embodiment, the first housing (310) may include a first side member (313) that at least partially forms an exterior of the electronic device (300) and a first rear cover (314) that is coupled to the first side member (313) and forms at least a portion of a second side (312) of the electronic device (300).

[0156] According to one embodiment, the first side member (313) may include a first side member (313a), a second side member (313b) extending from one end of the first side member (313a), and a third side member (313c) extending from the other end of the first side member (313a). According to one embodiment, the first side member (313) may be formed into a rectangular (e.g., square or rectangular) shape through the first side member (313a), the second side member (313b), and the third side member (313c).

[0157] According to one embodiment, the second housing (320) may include a second side member (323) that at least partially forms an exterior of the electronic device (300) and a second rear cover (324) that is coupled to the second side member (323) and forms at least a portion of a fourth side (322) of the electronic device (300). According to one embodiment, the second side member (323) may include a fourth side member (323a), a fifth side member (323b) that extends from one end of the fourth side member (323a), and a sixth side member (323c) that extends from the other end of the fourth side member (323a). According to one embodiment, the second side member (323) may be formed into a rectangular shape through the fourth side member (323a), the fifth side member (323b), and the sixth side member (323c).

[0158] According to one embodiment, the pair of housings (310, 320) are not limited to the illustrated shapes and combinations, and may be implemented by combinations and / or combinations of other shapes or parts. For example, the first side member (313) may be formed integrally with the first rear cover (314), and the second side member (323) may be formed integrally with the second rear cover (324).

[0159] According to one embodiment, in the electronic device (300), in a first state (e.g., unfolded state), the second side (313b) of the first side member (313) and the fifth side (323b) of the second side member (323) can be connected without any gap. According to one embodiment, in the electronic device (300), in a first state (e.g., unfolded state), the third side (313c) of the first side member (313) and the sixth side (323c) of the second side member (323) can be connected without any gap.

[0160] According to one embodiment, the electronic device (300) may be configured such that, in a first state (e.g., an unfolded state), the combined length of the second side (313b) and the fifth side (323b) is longer than the length of the first side (313a) and / or the fourth side (323a). Additionally, the combined length of the third side (313c) and the sixth side (323c) may be configured such that the combined length of the first side (313a) and / or the fourth side (323a) is longer than the length of the first side (313a) and / or the fourth side (323a).

[0161] According to one embodiment, the first side member (313) and / or the second side member (323) may further include a polymer formed of metal or injected into metal. According to one embodiment, the first side member (313) and / or the second side member (323) may also include at least one conductive portion (316 and / or 326) electrically segmented through at least one segment (3161, 3162, and / or 3261, 3262) formed of polymer. In this case, the at least one conductive portion may be electrically connected to a wireless communication circuit included in the electronic device (300) so as to be used as an antenna operating in at least one designated band (e.g., about 400 MHz to about 6 GHz).

[0162] According to one embodiment, the first rear cover (314) and / or the second rear cover (324) may be formed by, for example, at least one or a combination of two of coated or colored glass, ceramic, polymer, or metal (e.g., aluminum, stainless steel (STS), or magnesium).

[0163] According to one embodiment, the flexible display (330) may be arranged to extend from a first side (311) of the first housing (310) across the hinge structure (340) to at least a portion of a third side (321) of the second housing (320). For example, the flexible display (330) may include a first portion (330a) substantially corresponding to the first side (311), a second portion (330b) substantially corresponding to the third side (321), and a third portion (330c) (e.g., a bendable region) connecting the first portion (330a) and the second portion (330b) and corresponding to the hinge structure (340).

[0164] According to one embodiment, the electronic device (300) may include a first protective cover (315) (e.g., a first protective frame or a first decorative member) coupled along an edge of the first housing (310). According to one embodiment, the electronic device (300) may include a second protective cover (325) (e.g., a second protective frame or a second decorative member) coupled along an edge of the second housing (320).

[0165] According to one embodiment, the first protective cover (315) and / or the second protective cover (325) may be formed of a metal or polymer material. According to one embodiment, the first protective cover (315) and / or the second protective cover (325) may be used as a decoration member.

[0166] According to one embodiment, the flexible display (330) may be positioned such that an edge of the first portion (330a) is interposed between the first housing (310) and the first protective cover (315). According to one embodiment, the flexible display (330) may be positioned such that an edge of the second portion (330b) is interposed between the second housing (320) and the second protective cover (325).

[0167] According to one embodiment, the flexible display (330) may include a protective cap (335) disposed in an area corresponding to the hinge structure (340).

[0168] According to one embodiment, the electronic device (300) may include a hinge housing (341) (e.g., a hinge cover) that supports a hinge structure (340).

[0169] According to one embodiment, the flexible display (330) may be arranged to extend from at least a portion of the second side (312) to at least a portion of the fourth side (322). In this case, the electronic device (300) may be folded so that the flexible display (330) may be exposed to the outside (out-folding method).

[0170] According to one embodiment, the electronic device (300) may include a sub-display (331) (e.g., an external display) that is arranged separately from the flexible display (330). According to one embodiment, the sub-display (331) (e.g., an external display) is arranged to be at least partially exposed to the second side (312) of the first housing (310), so that when in a second state (e.g., a folded state), it may replace the display function of the flexible display (330) to display state information (e.g., first state information, second state information, or third state information) of the electronic device (300).

[0171] According to one embodiment, the sub-display (331) (e.g., external display) may be arranged to be visible from the outside through at least a portion of the first rear cover (314). According to one embodiment, the sub-display (331) (e.g., external display) may also be arranged on the fourth side (322) of the second housing (320). In this case, the sub-display (331) (e.g., external display) may be arranged to be visible from the outside through at least a portion of the second rear cover (324).

[0172] According to one embodiment, the electronic device (300) may include at least one of an input device (303) (e.g., a microphone), an audio output device (301, 302), a sensor module (304), a camera device (305, 308), a key input device (306), or a connector port (307). The electronic device (300) may also include a substantial electronic component (e.g., an input device, an audio output device, a sensor module, or a camera device) that is disposed inside the electronic device and operates through a hole or shape.

[0173] According to one embodiment, the input device (303) may include at least one microphone (303) disposed in the second housing (320).

[0174] According to one embodiment, the audio output device (301, 302) may include speakers (301, 302).

[0175] According to one embodiment, at least one connector port (307) may be used to transmit and receive power and / or data to and from an external electronic device. According to one embodiment, at least one connector port (e.g., an ear jack hole) may also accommodate a connector (e.g., an ear jack) for transmitting and receiving audio signals to and from an external electronic device.

[0176] According to one embodiment, the sensor module (304) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (300) or an external environmental state. The sensor module (304) can detect an external environment, for example, through a first surface (311) of the first housing (310). According to one embodiment, the electronic device (300) may further include at least one sensor module arranged to detect an external environment through a second surface (312) of the first housing (310).

[0177] According to one embodiment, a sensor module (304) (e.g., a proximity sensor, a light sensor) may be positioned under the flexible display (330) to detect the external environment through the flexible display (330).

[0178] According to one embodiment, the sensor module (304) (e.g., the sensor module (176) of FIG. 1) may include at least one of a gesture sensor, a gyro sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a light sensor, an ultrasonic sensor, a proximity sensor, a biometric sensor (e.g., an iris recognition sensor), a distance detection sensor (e.g., a time of flight (TOF) sensor, a light detection and ranging (LiDAR) sensor), a barometric pressure sensor, a magnetic sensor (e.g., a 6-axis sensor, a geomagnetic sensor), an acceleration sensor, a temperature sensor, a humidity sensor, and / or a fingerprint recognition sensor.

[0179] According to one embodiment, the camera devices (305, 308) may include a first camera device (305) (e.g., a front camera device) disposed on a first side (311) of a first housing (310) and a second camera device (308) disposed on a second side (312) of the first housing (310). The electronic device (300) may further include a flash (309) disposed near the second camera device (308).

[0180] According to one embodiment, the camera devices (305, 308) may include lenses and / or image sensors for time of flight (TOF).

[0181] According to one embodiment, the key input device (306) (e.g., a key button) may be disposed on a third side (313c) of the first side member (313) of the first housing (310). According to one embodiment, the key input device (306) may also be disposed on at least one of the other side members (313a, 313b) of the first housing (310) and / or the side members (323a, 323b, 323c) of the second housing (320).

[0182] According to one embodiment, some of the camera devices (305, 308) (e.g., the first camera device (305)) or the sensor module (304) may be positioned to be exposed through the flexible display (330). For example, the first camera device (305) or the sensor module (304) may be positioned so as to be in contact with the external environment through an opening (e.g., a through hole) at least partially formed in the flexible display (330) in the internal space of the electronic device (300).

[0183] According to one embodiment, some sensor modules (304) may be arranged to perform their functions without being visually exposed through the flexible display (330) in the internal space of the electronic device (300). For example, in this case, the area of ​​the flexible display (330) facing the sensor modules (304) may be omitted from the opening.

[0184] According to one embodiment, the electronic device (300) may be operated to maintain a third state (e.g., an intermediate state) through the hinge structure (340). In this case, the electronic device (300) may control the flexible display (330) to display different contents on the display area corresponding to the first side (311) and the display area corresponding to the third side (321).

[0185] According to one embodiment, the electronic device (300) can be operated in a substantially first state (e.g., an unfolded state, the unfolded state of FIG. 3A) and / or a substantially second state (e.g., a folded state, the folded state of FIG. 3D) based on a predetermined inflection angle (e.g., an angle between the first housing (310) and the second housing (320) when in an intermediate state) through the hinge structure (340). For example, the electronic device (300) can be operated to transition to the first state (e.g., an unfolded state, the unfolded state of FIG. 3A) when a pressure is applied in the unfolding direction (direction B) when the electronic device (300) is in an unfolded state at a predetermined inflection angle through the hinge structure (340). For example, the electronic device (300) may be operated to transition to a second state (e.g., a folded state, the folded state of FIG. 3D) when a pressure is applied in the direction of folding (direction C) when the electronic device (300) is in an unfolded state at a certain inflection angle through the hinge structure (340). According to one embodiment, the electronic device (300) may be operated to maintain an unfolded state (not shown) at various angles through the hinge structure (340).

[0186] The electronic device (300) of FIG. 3A may include a touch circuit (e.g., a touch circuit (450) of FIG. 4) including a touch sensor (e.g., a touch sensor (451) of FIG. 4) and a touch sensor IC (e.g., a touch sensor IC (453) of FIG. 4). Although the contact / touch circuit and the sensor IC have been described, the electronic device (300) may also perform a role of detecting a proximity input.

[0187] The electronic device (300) of FIG. 3A may include a digitizer (e.g., a digitizer (460) of FIG. 4) and a digitizer driver (e.g., a digitizer driver (470) of FIG. 4).

[0188] FIG. 4 is a block diagram illustrating the configuration of an electronic device according to one embodiment.

[0189] Referring to FIG. 4, a display module (160) (e.g., display module (160) of FIG. 1) may include a display (410), a display driver IC (DDIC) (430) (e.g., display driver) for driving the display (410), a touch circuit (450), a digitizer (460) (e.g., digitizer (460) of FIGS. 5A and 5B), and a digitizer driver (470).

[0190] According to one embodiment, the DDIC (430) may include an interface module (431), a memory (433) (e.g., a buffer memory), an image processing module (435), or a mapping module (437).

[0191] According to one embodiment, the DDIC (430) can receive image information including image data or an image control signal corresponding to a command for controlling the image data from another component of an electronic device (e.g., the electronic device (101) of FIG. 1, the electronic device (200) of FIGS. 2 and 3) through an interface module (431).

[0192] According to one embodiment, image information may be received from a processor (e.g., processor (120) of FIG. 1) (e.g., main processor (121) of FIG. 1) (e.g., application processor) or an auxiliary processor (e.g., auxiliary processor (123) of FIG. 1) (e.g., graphics processing unit) that operates independently of the functions of the main processor (121).

[0193] According to one embodiment, the DDIC (430) can communicate with the touch circuit (450) or the sensor module (176) through the interface module (431). In addition, the DDIC (430) can store at least some of the received image information in the memory (433). As an example, the DDIC (430) can store at least some of the received image information in the memory (433) on a frame-by-frame basis.

[0194] According to one embodiment, the image processing module (435) may perform preprocessing or postprocessing (e.g., resolution, brightness, or size adjustment) on at least a portion of the image data based at least on characteristics of the image data or characteristics of the display (410).

[0195] According to one embodiment, the mapping module (437) may generate a voltage value or a current value corresponding to the image data pre-processed or post-processed through the image processing module (435). According to one embodiment, the generation of the voltage value or the current value may be performed at least in part based on, for example, the properties of the pixels of the display (410) (e.g., the arrangement of the pixels (RGB stripe or pentile structure), or the size of each sub-pixel).

[0196] According to one embodiment, at least some pixels of the display (410) may be driven based at least in part on, for example, the voltage value or current value, so that visual information (e.g., text, an image, or an icon) corresponding to the image data may be displayed through the display (410).

[0197] According to one embodiment, the touch circuit (450) may include a touch sensor (451) and a touch sensor IC (453) for controlling the touch sensor (451).

[0198] According to one embodiment, the touch sensor IC (453) may control the touch sensor (451) to detect a touch input or hovering input for a specific location of the display (410). For example, the touch sensor IC (453) may detect the touch input or hovering input by measuring a change in a signal (e.g., voltage, light quantity, resistance, or charge quantity) for a specific location of the display (410). The touch sensor IC (453) may provide information (e.g., location, area, pressure, or time) regarding the detected touch input or hovering input to a processor (e.g., processor (120) of FIG. 1).

[0199] According to one embodiment, at least a portion of the touch circuit (450) (e.g., touch sensor IC (453)) may be included as part of the DDIC (430) or the display (410).

[0200] According to one embodiment, at least a portion of the touch circuit (450) (e.g., touch sensor IC (453)) may be included as part of another component (e.g., auxiliary processor (123)) disposed external to the display module (160).

[0201] According to one embodiment, the display module (160) may further include at least one sensor (e.g., a fingerprint sensor, an iris sensor, a pressure sensor, or an illuminance sensor) of the sensor module (176), or a control circuit therefor. In this case, the at least one sensor or the control circuit therefor may be embedded in a part of the display module (160) (e.g., the display (410) or the DDIC (430)) or a part of the touch circuit (450).

[0202] For example, if the sensor module (176) embedded in the display module (160) includes a biometric sensor (e.g., a fingerprint sensor), the biometric sensor can obtain biometric information (e.g., a fingerprint image) associated with a touch input through a portion of the display (410).

[0203] For example, if the sensor module (176) embedded in the display module (160) includes a pressure sensor, the pressure sensor can obtain pressure information associated with a touch input through a part or the entire area of ​​the display (410).

[0204] According to one embodiment, the touch sensor (451) or sensor module (176) may be positioned between pixels of a pixel layer of the display (410), or above or below the pixel layer.

[0205] According to one embodiment, the display module (160) may include a digitizer (460) for detecting an input (e.g., a touch input or a hovering input) of an electronic pen (e.g., an electronic pen (500) of FIGS. 5A and 5B) (e.g., a stylus pen) or another input device (e.g., a user's finger). For example, the digitizer (460) may convert analog coordinates (e.g., a position) of the electronic pen (500) (e.g., a stylus pen) into digital coordinate data. The digitizer (460) may transmit the digital coordinate data to a processor (e.g., the processor (120) of FIG. 1) and / or a DDIC (430).

[0206] According to one embodiment, a processor (e.g., processor (120) of FIG. 1) may obtain digital coordinate data input from a digitizer (460). The processor (120) may detect an input (e.g., a touch input or a hovering input) through an electronic pen (500) (e.g., a stylus pen) based on the digital coordinate data. For example, the digitizer (460) may include a plurality of x-axis channels and a plurality of y-axis channels. The processor (120) may sense the position of the electronic pen (500) (e.g., a stylus pen) using sensing signals (e.g., EMR signals) received from the x-axis channels and y-axis channels arranged in the digitizer (460). For example, a digitizer (460) may have a plurality of x-axis channels and a plurality of y-axis channels sequentially arranged, and a processor (120) may sense the position of an electronic pen (500) (e.g., a stylus pen) using sensing signals (e.g., EMR signals) received from three consecutive channels (e.g., three adjacent channels).

[0207] In one embodiment, the digitizer (460) may be invisible from the outside of the electronic device.

[0208] For example, the digitizer (460) may be disposed integrally with the flat display (410), or may be disposed adjacent to the flat display (410). For example, when the digitizer (460) is applied to the flat display (410), the digitizer (460) may include one EMR (electro magnetic resonance) sheet (or EMR film). A plurality of x-axis channels and a plurality of y-axis channels for detecting the position of the electronic pen (500) may be disposed on one EMR sheet.

[0209] For example, the digitizer (460) may be disposed integrally with a flexible display or a foldable display, or may be disposed adjacent to the flexible display or the foldable display. For example, the digitizer (460) may be disposed at a lower portion (e.g., bottom) of the display (410) (e.g., the first display (230) of FIG. 2A) (e.g., the flexible display (330) of FIG. 3A) in the z-axis direction (e.g., the z-axis direction of FIG. 2A).

[0210] For example, when a digitizer (460) is applied to a flexible display or a foldable display, the digitizer (460) may include one EMR (electro magnetic resonance) sheet (or EMR film). A plurality of x-axis channels and a plurality of y-axis channels for detecting the position of the electronic pen (500) may be arranged on one EMR sheet.

[0211] For example, when a digitizer (460) is applied to a flexible display or a foldable display, the digitizer (460) may include a plurality of EMR (electro magnetic resonance) sheets (or EMR films). A plurality of x-axis channels and a plurality of y-axis channels for detecting the position of the electronic pen (500) may be arranged on the plurality of EMR sheets.

[0212] Fig. 5a is a diagram showing a first resonance method of an electronic pen (e.g., a stylus pen). Fig. 5b is a diagram showing a second resonance method of an electronic device according to the first resonance of the electronic pen (e.g., a stylus pen).

[0213] Referring to FIGS. 5A and 5B , an electronic device according to various embodiments of the present disclosure (e.g., an electronic device (101) of FIG. 1 , an electronic device (200) of FIG. 2A , an electronic device (300) of FIG. 3A ) may include a display (410) (e.g., a first display (230) of FIG. 2A ) (e.g., a flexible display (330) of FIG. 3A ), a digitizer (460) (e.g., a digitizer (460) of FIG. 4 ), a digitizer drive unit (e.g., a digitizer drive unit (470) of FIG. 4 ) configured to interact with an electronic pen (500) (e.g., a stylus pen), and an electronic pen (500) (e.g., a stylus pen).

[0214] According to one embodiment, a digitizer (460) may be placed at the lower portion (e.g., below) of the display (410) in the z-axis direction. The digitizer (460) may be used to detect the input and position of an electronic pen (500) (e.g., a stylus pen).

[0215] According to one embodiment, an electronic pen (500) (e.g., a stylus pen) may include a resonant circuit (510, 520) for generating resonance. The resonant circuit (510, 520) may include a magnetic core (510) (e.g., a ferrite core) and a coil (520) (e.g., a coil or inductor for electromagnetic resonance (induction) operation) arranged to surround the magnetic core (510). In addition, the resonant circuit (510, 520) may further include a capacitor (not shown).

[0216] For example, a processor (e.g., processor (120) of FIG. 1) can control the operation of a digitizer drive unit (470). The digitizer drive unit (470) can supply current to the digitizer (460) based on the control of the processor (120). Current can be supplied from the digitizer drive unit (470) to the digitizer (460) to generate an electromagnetic (EM) field. The electromagnetic field can interact with a resonance circuit of an electronic pen (500) (e.g., a stylus pen) to generate a primary resonance signal.

[0217] For example, when the current supplied to the digitizer (460) is cut off, the first resonance signal induced in the electronic pen (500) (e.g., stylus pen) may be maintained for a certain period of time and then gradually attenuated. A second resonance signal may be generated in the digitizer (460) by the first resonance signal that remains after being induced in the electronic pen (500) (e.g., stylus pen). The digitizer driving unit (470) may measure the current (or voltage) induced by the second resonance signal to detect the coordinates (e.g., position) of the electronic pen (500) (e.g., stylus pen). The digitizer driving unit (470) may provide information about the coordinates (e.g., position) of the electronic pen (500) (e.g., stylus pen) to the processor (120). For example, an electronic pen may have an internal power source (e.g., a battery) and generate its own electromagnetic field to generate a secondary resonant signal for the digitizer from the internal power source.

[0218] For example, since a cover window (411) (e.g., a protective film) is placed on the upper surface of the display (410), the electronic pen (500) (e.g., a stylus pen) may not directly touch the upper surface of the display (410). When the electronic pen (500) (e.g., a stylus pen) approaches the digitizer (460), resonance occurs due to electromagnetic induction, so that the coordinates (e.g., a position) of the electronic pen (500) (e.g., a stylus pen) can be detected.

[0219] For example, an electronic pen (500) (e.g., a stylus pen) can generate a current through interaction with a digitizer (460) (e.g., electromagnetic induction) and form a magnetic field using the generated current. The resonant circuit (510, 520) can be used to change the intensity or frequency of an electromagnetic field according to a user's operating state. For example, the resonant circuit (510, 520) can provide various frequencies for recognizing a hovering input, a drawing input, a button input, or an erasing input. For example, the resonant circuit (510, 520) can provide various resonant frequencies according to a combination of connections of a plurality of capacitors, or can provide various resonant frequencies based on a variable inductor and / or a variable capacitor.

[0220] For example, when an electronic pen (500) (e.g., a stylus pen) approaches a digitizer (460), an electromagnetic induction phenomenon occurs in the channels (461) of the digitizer (460), and the resonant circuit (510, 520) of the electronic pen (500) (e.g., a stylus pen) can generate a current in the channel (461). The resonant circuit (510, 520) of the electronic pen (500) (e.g., a stylus pen) can form a magnetic field that induces a current in the channels by a magnetic field generated by the digitizer or an internal power source.

[0221] For example, the digitizer drive unit (470) can detect the coordinates (e.g., position) of the electronic pen (500) (e.g., stylus pen) by scanning the intensity of the magnetic field (or current induced by the channel) applied from the electronic pen (500) (e.g., stylus pen) to the digitizer (460) over the entire area.

[0222] For example, the digitizer driving unit (470) can provide coordinate (e.g., location) information of the detected electronic pen (500) to a processor (e.g., processor (120) of FIG. 1). The processor (120) can cause the coordinate (e.g., location) of the electronic pen (500) to be displayed on the display (410) based on the coordinate (e.g., location) information of the electronic pen (500). The coordinates can be used to control other information displayed on the display (410) or the internal operation of the electronic device.

[0223] According to one embodiment, when an electronic pen (500) (e.g., a stylus pen) is positioned on top of a digitizer (460), a magnetic field generated from a magnetic core (510) of the electronic pen (500) (e.g., a stylus pen) may be induced to the digitizer (460). When there is no magnetic material outside the digitizer (460), the magnetic layer of the digitizer (460) and the electronic pen (500) (e.g., a stylus pen) may form a closed loop.

[0224] According to one embodiment, the digitizer (460) may include a flexible circuit board layer (e.g., away from the front of the display) having a coil array (e.g., including a channel), a magnetic layer, and a conductive layer (e.g., a conductive plate). For example, the magnetic layer may be disposed under the flexible circuit board layer, and the conductive layer (e.g., a conductive plate) may be disposed under the magnetic layer. To facilitate folding and unfolding of the electronic device (e.g., the electronic device (200) of FIG. 2A and the electronic device (300) of FIG. 3A), the digitizer (460) may include a first digitizer portion and a second digitizer portion spaced apart from each other with respect to a folding axis. A gap may be provided between the first digitizer portion and the second digitizer portion that coincides with the hinge, wherein the gap may be centered around the hinge axis and extend to both sides of the hinge axis.

[0225] According to one embodiment, the magnetic layer can be disposed under the flexible circuit board layer to shield the magnetic field. The conductive layer can act as an electromagnetic planarizer, block noise, and dissipate heat generated from a printed circuit board (e.g., a printed board assembly (PBA), a printed circuit board (PCB), a flexible printed circuit board (FPCB)) on which a processor (e.g., an application processor) and electronic components are disposed. When an electronic pen (e.g., an electronic pen (500) of FIGS. 5A and 5B) approaches the electromagnetic field of the digitizer (660), an electromagnetic induction phenomenon occurs, and the magnetic field of the electronic pen (500) can induce a current in a coil array disposed on the flexible circuit board layer. The coordinates (e.g., position) of the electronic pen (500) can be detected by the electromagnetic induction of the electronic pen (500) and the digitizer (660).

[0226] For example, when the electronic device (200, 300) has a dumbbell-shaped folding structure, even if a separate digitizer is applied, forward bending (e.g., in-folding bending) and reverse bending (e.g., out-folding bending) sections may occur in the bending area. The characteristics of the electronic pen (500) may deteriorate in the bending area. When a part of the conductive layer (e.g., conductive plate) corresponding to the bending area of ​​the electronic device (200, 300) is removed, the influence of the magnetic layer may increase, causing the signal of the electronic pen (500) to become non-uniform (e.g., non-uniform signal operation). In addition, the characteristic change may increase when the electronic pen (500) is tilted.

[0227] For example, to improve the folding performance of the digitizer, an additional portion of the conductive layer around the hinge can be removed so that the conductive layer does not extend as far toward the hinge (i.e., area) as the circuit board and magnetic device. However, the thickness of the magnetic layer (MMP1) may be thicker than that of a bar-top phone, and the cover glass may be absent or thin, so that the distance between the stylus and the magnetic layer is closer, which may cause bonding. Since the conductive layer is absent at the bottom of the magnetic layer around the hinge, tilting the stylus in that area may cause significant pressure changes or deterioration of the stylus performance (coordinate accuracy, pressure) even when the stylus tip is not pressed. The rapid change in the signal may cause a decrease in the stylus performance (coordinate accuracy, pressure) even if the detection signal is compensated for through firmware.

[0228] The present invention can alleviate adverse effects in electronic pen detection that may occur when a portion of a digitizer (e.g., a portion of a conductive layer) is removed to improve the bending performance of a flexible display device.

[0229] FIG. 6 is a drawing showing an electronic device according to an embodiment of the present disclosure, showing an unfolded state of the electronic device. FIG. 7 is a drawing showing a folded state of the electronic device illustrated in FIG. 6.

[0230] Referring to FIGS. 6 and 7, an electronic device (600) according to an embodiment of the present disclosure (e.g., the electronic device (101) of FIG. 1, the electronic device (200) of FIG. 2A, and the electronic device (300) of FIG. 3A) may include a display module (601), a bracket (650), a magnetic component (651), a digitizer (660), a hinge plate (680), a hinge structure (690), and a hinge cover (695) (e.g., a hinge housing). For example, the display module (601) may include a display (610) (e.g., a flexible display) (e.g., the first display (230) of FIG. 2A, the flexible display (330) of FIG. 3A, the display (410) of FIG. 4), a flexible plate (620) (e.g., a display support member, a lattice support member, a lattice plate), a flexible circuit board (630, FPCB: flexible printed circuit board), and a printed circuit board (640, PCB: printed circuit board).

[0231] For example, if the hinge structure (690) has magnetism, a shielding member may be further placed between the hinge structure (690) and the digitizer (660). If the hinge structure (690) has a magnetic element, the hinge structure (690) may include stainless steel having magnetism / magnetization.

[0232] For example, the bracket (650) may be bonded (or attached) to at least a portion of the display module (601) via an adhesive member to support the display module (601). The bracket (650) may include a recess capable of accommodating at least a portion of the display module (601) (e.g., a printed circuit board (640)).

[0233] For example, a display (610) (e.g., a flexible display) may be electrically connected to a printed circuit board (640, PCB) via a flexible circuit board (630, FPCB).

[0234] For example, the digitizer (660) can be electrically connected to a digitizer drive unit (e.g., the digitizer drive unit (470) of FIG. 4) through a flexible circuit board.

[0235] For example, the printed circuit board (640, PCB) may include a processor (e.g., processor (120) of FIG. 1), memory (e.g., memory (130) of FIG. 1), display driver IC (e.g., display driver IC (430) of FIG. 4), and digitizer driver (e.g., digitizer driver (470) of FIG. 4).

[0236] According to one embodiment, when the electronic device (600) is folded, magnetic components (651) may be placed on both sides of the bracket (650) to secure the folded (e.g., folded) state. A groove or hole may be formed in at least a portion of both sides of the bracket (650), and the magnetic components (651) may be placed in the groove or hole formed on both sides.

[0237] According to one embodiment, a hinge plate (680) and a hinge structure (690) may be arranged to correspond to the bending area (670). The hinge structure (690) may be covered from the outside by a hinge cover (695). For example, the electronic device (600) may be folded and unfolded in an in-folding manner and / or an out-folding manner by the hinge structure (690).

[0238] According to one embodiment, the hinge plate (680) may include a first hinge plate portion (6801) connected to a first housing portion (e.g., the first housing (210) of FIG. 2A, the first housing (310) of FIG. 3A), and a second hinge plate portion (6802) connected to a second housing portion (e.g., the second housing (220) of FIG. 2A, the second housing (320) of FIG. 3A). For example, when the electronic device (600) is folded, the first hinge plate portion (6801) and the second hinge plate portion (6802) may be arranged to be separated with respect to the folding axis (F).

[0239] According to one embodiment, the hinge cover (695) can be bonded (or attached) to at least a portion of the hinge structure (690) to support the hinge structure (690).

[0240] In one embodiment, the hinge cover (695) may include a hinge plate (680). For example, the hinge plate (680) may be positioned adjacent to or connected to both sides of the bracket (650) so as to be slidable as the electronic device (600) is folded or unfolded.

[0241] According to one embodiment, the hinge structure (690) may be connected to both sides of the bracket (650) through fixed members (not shown) or may be connected through other rotating members (not shown).

[0242] According to one embodiment, the foldable housing of the electronic device (600) may include a first housing portion (e.g., the first housing (210) of FIG. 2A, the first housing (310) of FIG. 3A) connected to a first side of the hinge cover (695) (e.g., the hinge housing), and a second housing portion (e.g., the second housing (220) of FIG. 2A, the second housing (320) of FIG. 3A) connected to a second side of the hinge cover (695) (e.g., the hinge housing).

[0243] According to one embodiment, the hinge structure (690) of the electronic device (600) may be at least partially seated in a hinge cover (695) (e.g., a hinge housing) and disposed at a lower portion (e.g., bottom) of the digitizer (660).

[0244] According to one embodiment, the digitizer (660) may include a flexible circuit board layer (661), a first magnetic layer (662, first magnetic layer MMP1), a conductive layer (663) (e.g., a conductive plate), and a second magnetic layer (664, second magnetic layer MMP2). For example, the first magnetic layer (662) and the second magnetic layer (664) may be disposed under the flexible circuit board layer (661). The conductive layer (663) (e.g., a conductive plate) may be disposed under the first magnetic layer (662).

[0245] For example, the first magnetic layer (662) and the second magnetic layer (664) may be formed of magnetic metal powder (MMP). Without being limited thereto, the first magnetic layer (662) and the second magnetic layer (664) may include silicon, aluminum, cobalt, nickel, ferrite (e.g., MnZn ferrite), iron, silicon steel, permalloy, soft iron, steel, or pure iron having magnetism. The first magnetic layer (662) and the second magnetic layer (664) may be formed of a single material of cobalt, nickel, ferrite (e.g., MnZn ferrite), iron, silicon steel, permalloy, soft iron, steel, or pure iron having magnetism, or a composite material including magnetic materials. For example, cobalt has a permeability of about 250 u', nickel has a permeability of about 600 u', MnZn ferrite has a permeability of about 2,000 u', iron has a permeability of about 5,000 u', silicon steel has a permeability of about 7,000 u', permalloy has a permeability of about 8,000 u', wrought iron has a permeability of about 200 u' to 5,000 u', steel has a permeability of about 5,000 u' to 20,000 u', and pure iron can have a permeability of about 20,000 u'.

[0246] According to one embodiment, the flexible circuit board layer (661) of the digitizer (660) may include a coil array. The flexible circuit board layer (661) of the digitizer (660) may be formed to a thickness of about 50 μm to 300 μm. The conductive layer (663) (e.g., conductive plate) of the digitizer (660) may be formed to a thickness of about 5 μm to 200 μm. For example, the conductive layer (663) (e.g., conductive plate) may be formed of a conductive metal material (e.g., aluminum, stainless steel, copper alloy).

[0247] According to one embodiment, the first magnetic layer (662) and the second magnetic layer (664) are disposed under the flexible circuit board layer (661) to form a path through which a magnetic field can pass and to shield the magnetic field. The conductive layer (663) acts as an electromagnetic planarizer, can block noise, and can dissipate heat generated from the display module (601) and the digitizer (660). When the electronic pen (500) approaches the electromagnetic field of the digitizer (660), an electromagnetic induction phenomenon occurs, and the magnetic field of the electronic pen (500) can be induced in the coil array disposed on the flexible circuit board layer. The coordinates (e.g., position) of the electronic pen (500) can be detected by the electromagnetic induction of the electronic pen (500) and the digitizer (660).

[0248] When the electronic device (600) has a dumbbell-shaped folding structure, forward bending and reverse bending sections may occur in the bending region (670) even when a separate (e.g., non-continuous) digitizer (660) is applied.

[0249] According to one embodiment, a flexible plate (620) (e.g., a lattice plate) may be disposed under a display (610) (e.g., a flexible display). The display (610) (e.g., a flexible display) may be supported by the flexible plate (620) (e.g., a lattice plate) disposed under the display (610) (e.g., a flexible display). When the electronic device (600) is folded (e.g., folded), the display (610) (e.g., a flexible display) may be smoothly folded and unfolded based on the folding axis (F), and the flexible plate (620) (e.g., a lattice plate) may include a lattice portion (622) (e.g., a lattice area) so that the display (610) (e.g., a flexible display) may be supported. For example, the width of the lattice portion (622) may be 8 mm to 12 mm. For example, the width of the lattice portion (622) may be greater than the spacing (w1) (e.g., the spacing distance) of the flexible circuit board layer (661) on which the coil array is arranged. For example, the width of the lattice portion (622) may be smaller than the spacing (w2) (e.g., the spacing distance) of the conductive layer (663) (e.g., the conductive plate). For example, the width of the lattice portion (622) may be substantially the same as the spacing (w2) (e.g., the spacing distance) of the second magnetic layer (664), or may be greater than the spacing (w2) (e.g., the spacing distance) of the second magnetic layer (664).

[0250] According to one embodiment, the folding and unfolding operation of the electronic device (600) can be stably performed by the lattice portion (622) of the flexible plate (620) (e.g., the lattice plate). According to one embodiment, the flexible plate (620) can be composed of carbon fiber reinforced plastic (CFRP), glass fiber reinforced plastics (GFRP), or stainless steel. The flexible plate (620) (e.g., the lattice plate) can more evenly distribute stress and pressure when the electronic device is folded and unfolded, thereby providing a smoother folding and unfolding experience to the user, as well as other advantages such as improved durability and an improved user experience.

[0251] According to one embodiment, the display (610) may be formed to a thickness of about 50 μm to 800 μm, including a protective layer. The flexible plate (620) may be formed to a thickness of about 100 μm to 500 μm.

[0252] According to one embodiment, a digitizer (660) may be placed on the lower portion of a flexible plate (620) (e.g., a lattice plate).

[0253] For example, to enable smooth folding and unfolding of the electronic device (600), the digitizer (660) may include a first digitizer portion (6601) and a second digitizer portion (6602) spaced apart from each other based on the folding axis (F).

[0254] According to one embodiment, when the electronic device (600) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., a flexible display) (e.g., the z-axis direction of FIG. 5A, a direction from the front of the electronic device to the back of the electronic device through the flexible display), a first magnetic layer (662, MMP1) and a second magnetic layer (664, MMP2) may be disposed between the flexible circuit board layer (661) and the conductive layer (663) (e.g., a conductive plate).

[0255] For example, a first magnetic layer (662, MMP1) may be disposed under a flexible circuit board layer (661). The first magnetic layer (662, MMP1) may be disposed to overlap at least a portion of the flexible circuit board layer (661).

[0256] For example, a second magnetic layer (664, MMP2) may be disposed under a flexible circuit board layer (661). The second magnetic layer (664, MMP2) may be disposed to overlap at least a portion of the flexible circuit board layer (661).

[0257] According to one embodiment, the first magnetic layer (662, MMP1) and the second magnetic layer (664, MMP2) may be arranged in parallel on the lower side of the flexible circuit board layer (661).

[0258] According to one embodiment, a conductive layer (663) (e.g., a conductive plate) may be disposed under a first magnetic layer (662, MMP1). The conductive layer (663) (e.g., a conductive plate) may be disposed to overlap the first magnetic layer (662, MMP1). For example, when the electronic device (600) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., a flexible display), the first magnetic layer (662, MMP1) and the conductive layer (663) (e.g., a conductive plate) may be disposed to substantially overlap. According to one embodiment, when the electronic device (600) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., a flexible display), the first magnetic layer (662, MMP1) and the second magnetic layer (664, MMP2) may be disposed to not overlap.

[0259] According to one embodiment, the conductive layer (663) (e.g., conductive plate) may be positioned so as not to overlap the second magnetic layer (664, MMP2).

[0260] According to one embodiment, the flexible circuit board layer (661) may include a first flexible circuit board portion (6611) and a second flexible circuit board portion (6612) spaced apart from each other along the folding axis (F).

[0261] According to one embodiment, the conductive layer (663) (e.g., conductive plate) may include a first conductive layer portion (6631) and a second conductive layer portion (6632) spaced apart from each other along the folding axis (F).

[0262] According to one embodiment, the second magnetic layer (664, MMP2) may include a third magnetic portion (6641) and a fourth magnetic portion (6642) spaced apart from each other along the folding axis (F).

[0263] According to one embodiment, the first magnetic layer (662, MMP1) may include a first magnetic portion (6621) and a second magnetic portion (6622) spaced apart from each other along the folding axis (F). In a direction parallel to the first magnetic layer (662, MMP1), the second magnetic layer (664, MMP2) may be disposed between the first magnetic portion (6621) and the second magnetic portion (6622) of the first magnetic layer (662, MMP1).

[0264] According to one embodiment, at least a portion of the first flexible circuit board portion (6611) of the flexible circuit board layer (661) and the first magnetic portion (6621) of the first magnetic layer (662, MMP1) may be arranged to overlap. The first magnetic portion (6621) of the first magnetic layer (662, MMP1) and the first conductive layer portion (6631) of the conductive layer (663) (e.g., conductive plate) may be arranged to overlap. For example, at least a portion of the second flexible circuit board portion (6612) of the flexible circuit board layer (661) and the second magnetic portion (6622) of the first magnetic layer (662, MMP1) may be arranged to overlap. The second magnetic portion (6622) of the first magnetic layer (662, MMP1) and the second conductive layer portion (6632) of the conductive layer (663) (e.g., conductive plate) may be arranged to overlap. For example, at least a portion of the first flexible circuit board portion (6611) of the flexible circuit board layer (661) and the third magnetic portion (6641) of the second magnetic layer (664, MMP2) may be arranged to overlap. At least a portion of the second flexible circuit board portion (6612) of the flexible circuit board layer (661) and the fourth magnetic portion (6642) of the second magnetic layer (664, MMP2) may be arranged to overlap. For example, a third magnetic portion (6641) of a second magnetic layer (664, MMP2) may be arranged adjacent to a first magnetic portion (6621) of a first magnetic layer (662, MMP1) in a parallel direction. A fourth magnetic portion (6642) of a second magnetic layer (664, MMP2) may be arranged adjacent to a second magnetic portion (6622) of a first magnetic layer (662, MMP1) in a parallel direction.

[0265] According to one embodiment, the flexible circuit board layer (661) of the digitizer (660) may be formed to a thickness of about 50 μm to 300 μm. The first magnetic layer (662, MMP1) of the digitizer (660) may be formed to a thickness of about 10 μm to 100 μm. The second magnetic layer (664, MMP2) of the digitizer (660) may be formed to a thickness of about 10 μm to 100 μm. The conductive layer (663) (e.g., conductive plate) of the digitizer (660) may be formed to a thickness of about 5 μm to 200 μm.

[0266] For example, the conductive layer (663) (e.g., conductive plate) may be formed of a conductive metal material (e.g., aluminum, stainless steel, copper alloy).

[0267] For example, the first magnetic layer (662, MMP1) and the second magnetic layer (664, MMP2) can be formed with substantially the same thickness.

[0268] Not limited thereto, the first magnetic layer (662, MMP1) and the second magnetic layer (664, MMP2) may be formed with different thicknesses. In this case, the first magnetic layer (662, MMP1) may be formed with a first thickness, and the second magnetic layer (664, MMP2) may be formed with a second thickness that is thinner than the first thickness.

[0269] According to one embodiment, the first flexible circuit board portion (6611) and the second flexible circuit board portion (6612) of the flexible circuit board layer (661) may be spaced apart from each other by a first gap (w1) (e.g., a gap distance).

[0270] For example, the first gap (w1) between the first flexible circuit board portion (6611) and the second flexible circuit board portion (6612) may be smaller than the second gap (w2) between the first conductive layer portion (6631) and the second conductive layer portion (6632). For example, the first gap (w1) between the first flexible circuit board portion (6611) and the second flexible circuit board portion (6612) may be substantially equal to the second gap (w2) between the first conductive layer portion (6631) and the second conductive layer portion (6632). Without being limited thereto, the first gap (w1) between the first flexible circuit board portion (6611) and the second flexible circuit board portion (6612) may be greater than the second gap (w2) between the first conductive layer portion (6631) and the second conductive layer portion (6632).

[0271] For example, the first gap (w1) between the first flexible circuit board portion (6611) and the second flexible circuit board portion (6612) may be smaller than the third gap (w3) between the third magnetic layer portion (6641) and the fourth magnetic layer portion (6642). For example, the first gap (w1) between the first flexible circuit board portion (6611) and the second flexible circuit board portion (6612) may be substantially the same as the third gap (w3) between the third magnetic layer portion (6641) and the fourth magnetic layer portion (6642). Without being limited thereto, the first gap (w1) between the first flexible circuit board portion (6611) and the second flexible circuit board portion (6612) may be greater than the third gap (w3) between the third magnetic layer portion (6641) and the fourth magnetic layer portion (6642).

[0272] For example, the first gap (w1) between the first flexible circuit board portion (6611) and the second flexible circuit board portion (6612) may be 0 to 3 mm. For example, when the first flexible circuit board portion (6611) and the second flexible circuit board portion (6612) are arranged to be in contact with each other, the first gap (w1) between the first flexible circuit board portion (6611) and the second flexible circuit board portion (6612) may be substantially '0'. For example, when the first flexible circuit board portion (6611) and the second flexible circuit board portion (6612) are separated, the first gap (w1) between the first flexible circuit board portion (6611) and the second flexible circuit board portion (6612) may be 3 mm or less.

[0273] For example, the first gap (w1) between the first flexible circuit board portion (6611) and the second flexible circuit board portion (6612) may be 8 mm to 12 mm. When the first gap (w1) between the first flexible circuit board portion (6611) and the second flexible circuit board portion (6612) is formed to be 8 mm to 12 mm, it may be smaller than or substantially equal to the second gap (w2) between the first conductive layer portion (6631) and the second conductive layer portion (6632). When the first gap (w1) between the first flexible circuit board portion (6611) and the second flexible circuit board portion (6612) is formed to be 8 mm to 12 mm, it may be smaller than or substantially equal to the third gap (w3) between the third magnetic layer portion (6641) and the fourth magnetic layer portion (6642).

[0274] According to one embodiment, the conductive layer (663) (e.g., conductive plate) may include a first conductive layer portion (6631) and a second conductive layer portion (6632) that are spaced apart from each other. A portion of the conductive layer (663) (e.g., conductive plate) may be removed to improve the bending characteristics of the electronic device (600). For example, a portion of the conductive layer (663) (e.g., conductive plate) corresponding to the bending area (670) may be removed. For example, a portion of the conductive layer (663) (e.g., conductive plate) may be controlled such that the first conductive layer portion (6631) and the second conductive layer portion (6632) are spaced apart from each other by a second gap (w2). For example, the first conductive layer portion (6631) and the second conductive layer portion (6632) may be arranged with a second gap (w2) that is substantially the same as the first gap (w1). For example, the first conductive layer portion (6631) and the second conductive layer portion (6632) may be arranged with a second gap (w2) greater than the first gap (w1). For example, the second gap (w2) between the first conductive layer portion (6631) and the second conductive layer portion (6632) may be 10 mm to 30 mm. According to one embodiment, the first magnetic layer (662, MMP1) may include a first magnetic layer portion (6621) and a second magnetic layer portion (6621) that are spaced apart from each other.

[0275] According to one embodiment, the first magnetic layer portion (6621) and the second magnetic layer portion (6622) of the first magnetic layer (662, MMP1) may be arranged with a second gap (w2) that is substantially the same as the first gap (w1). For example, the first magnetic layer portion (6621) and the second magnetic layer portion (6622) of the first magnetic layer (6622, MMP1) may be arranged with a second gap (w2) that is greater than the first gap (w1). For example, the second gap (w2) between the first magnetic layer portion (6621) and the second magnetic layer portion (6622) of the first magnetic layer (6622, MMP1) may be greater than the first gap (w1). For example, the second gap (w2) between the first magnetic layer portion (6621) and the second magnetic layer portion (6622) of the first magnetic layer (662, MMP1) may be greater than the third gap (w3). However, the second gap (w2) between the first magnetic layer portion (6621) and the second magnetic layer portion (6622) may be smaller than the first gap (w1) or the third gap (w3).

[0276] For example, the first magnetic layer portion (6621) and the second magnetic layer portion (6622) may be spaced apart from each other to fit the hinge structure (690), and the first magnetic layer portion (6621) and the second magnetic layer portion (6622) may be arranged with a gap of 10 mm to 30 mm. According to one embodiment, the conductive layer (663) may be arranged to overlap the entirety of the first magnetic layer (662, MMP1). For example, the first magnetic layer portion (6621) of the first magnetic layer (662, MMP1) and the first conductive layer portion (6631) of the conductive layer (663) may be arranged to overlap. For example, the second magnetic layer portion (6622) of the first magnetic layer (662, MMP1) and the second conductive layer portion (6632) of the conductive layer (663) may be arranged to overlap.

[0277] According to one embodiment, a second magnetic layer (664, MMP2) may be disposed between the first magnetic layer portion (6621) and the second magnetic layer portion (6622).

[0278] According to one embodiment, the second magnetic layer (664, MMP2) may include a third magnetic layer portion (6641) and a fourth magnetic layer portion (6642) that are spaced apart from each other. The third magnetic layer portion (6641) and the fourth magnetic layer portion (6642) of the second magnetic layer (6644, MMP2) may be spaced apart from each other by a third gap (w3). The third gap (w3) between the third magnetic layer portion (6641) and the fourth magnetic layer portion (6642) may be 10 mm to 30 mm.

[0279] For example, the third gap (w3) between the third magnetic layer portion (6641) and the fourth magnetic layer portion (6642) may be substantially the same as the first gap (w1) between the first magnetic layer portion (6621) and the second magnetic layer portion (6622). For example, the third gap (w3) between the third magnetic layer portion (6641) and the fourth magnetic layer portion (6642) may be smaller than the first gap (w1) between the first magnetic layer portion (6621) and the second magnetic layer portion (6622). For example, the third gap (w3) between the third magnetic layer portion (6641) and the fourth magnetic layer portion (6642) may be larger than the first gap (w1) between the first magnetic layer portion (6621) and the second magnetic layer portion (6622).

[0280] For example, the third gap (w3) between the third magnetic layer portion (6641) and the fourth magnetic layer portion (6642) may be substantially the same as the second gap (w2) between the first conductive layer portion (6631) and the second conductive layer portion (6632). For example, the third gap (w3) between the third magnetic layer portion (6641) and the fourth magnetic layer portion (6642) may be smaller than the second gap (w2) between the first conductive layer portion (6631) and the second conductive layer portion (6632). For example, the third gap (w3) between the third magnetic layer portion (6641) and the fourth magnetic layer portion (6642) may be larger than the second gap (w2) between the first conductive layer portion (6631) and the second conductive layer portion (6632).

[0281] According to one embodiment, at least a portion of the first magnetic layer (662, MMP1) and at least a portion of the second magnetic layer (664, MMP2) may be arranged to contact (e.g., abut) each other. For example, a first magnetic layer portion (6621) of the first magnetic layer (662, MMP) and a third magnetic layer portion (6641) of the second magnetic layer (664, MMP2) may be arranged to contact (e.g., abut) each other. For example, a second magnetic layer portion (6622) of the first magnetic layer (662, MMP) and a fourth magnetic layer portion (6642) of the second magnetic layer (664, MMP2) may be arranged to contact (e.g., abut) each other.

[0282] According to one embodiment, the first magnetic layer (662, MMP1) and the second magnetic layer (664, MMP2) may be spaced apart from each other. For example, the first magnetic layer portion (6621) of the first magnetic layer (662, MMP) and the third magnetic layer portion (6641) of the second magnetic layer (664, MMP2) may be spaced apart from each other at a predetermined interval. For example, the second magnetic layer portion (6622) of the first magnetic layer (662, MMP) and the fourth magnetic layer portion (6642) of the second magnetic layer (664, MMP2) may be spaced apart from each other at a predetermined interval.

[0283] According to one embodiment, the hinge plate (680) may be formed with a width of 9 mm to 12 mm so as to substantially cover the second gap (w2). For example, the hinge plate (680) may be arranged to cover all or part of the second gap (w2). Without being limited thereto, the hinge plate (680) may be formed to have a width that is substantially the same as the second gap (w2) or greater than the second gap (w2).

[0284] According to one embodiment, the first magnetic layer (662, MMP1) may be formed to have a first performance coefficient. For example, the first magnetic layer (662, MMP1) may be formed to have a first thickness and a material having a first permeability, thereby having the first performance coefficient. For example, the first magnetic layer (662, MMP1) may be formed to have a thickness of 30 μm to 60 μm. For example, the permeability of the first magnetic layer (662, MMP1) may be approximately 95 u'.

[0285] According to one embodiment, the second magnetic layer (664, MMP2) may be formed to have a second coefficient of performance lower than the first coefficient of performance. For example, the second magnetic layer (664, MMP2) may be formed to have a second thickness that is substantially the same as the first thickness (e.g., 30 μm to 60 μm) or thinner than the first thickness (e.g., 30 μm to 60 μm) and may have the second coefficient of performance. For example, the second magnetic layer (664, MMP2) may be formed to have a thickness of 20 μm to 30 μm. For example, the second magnetic layer (664, MMP2) may have a lower permeability (e.g., about 95 u') than the permeability of the first magnetic layer (662, MMP1). For example, the permeability of the second magnetic layer (664, MMP2) may be about 60 u'.

[0286] For example, the second magnetic layer (664, MMP2) may be formed of a material having a second permeability lower than the first permeability of the first magnetic layer (662, MMP1), and may be formed with a thickness substantially the same as the first thickness of the first magnetic layer (662, MMP1) to have a second performance coefficient.

[0287] For example, the second magnetic layer (664, MMP2) may be formed of a material having a first permeability substantially the same as that of the first magnetic layer (662, MMP1), and may be formed to have a second thickness thinner than the first thickness of the first magnetic layer (662, MMP1), thereby having a second performance coefficient.

[0288] For example, the second magnetic layer (664, MMP2) may be formed of a material having a second permeability lower than the first permeability of the first magnetic layer (662, MMP1) and may be formed to have a second thickness thinner than the first thickness of the first magnetic layer (662, MMP1) to have a second performance coefficient.

[0289] According to one embodiment, a lattice portion (622) (e.g., a lattice portion) may be positioned in a portion corresponding to a banding area (670). For example, the lattice portion (622) (e.g., a lattice portion) may be positioned to overlap the banding area (670).

[0290] According to one embodiment, at least a portion of the second magnetic layer (664, MMP2) may be positioned to overlap the lattice portion (622) (e.g., the lattice region). For example, the second magnetic layer (664, MMP2) may be positioned to overlap the entire lattice portion (622) (e.g., the lattice region).

[0291] According to one embodiment, the first magnetic layer (662) and the lattice portion (622) (e.g., the lattice region) may be arranged so as not to overlap.

[0292] The digitizer (660) of the present disclosure can be applied not only to foldable electronic devices but also to slideable electronic devices or rollable electronic devices. Although the present disclosure exemplifies a foldable electronic device capable of inward folding, the electronic device (600) according to the present disclosure is not limited to a foldable electronic device capable of inward folding. For example, the electronic device (600) according to the present disclosure may include a foldable electronic device including a display capable of outward folding. The electronic device (600) according to the present disclosure may include a multi-foldable electronic device including a display capable of inward-outward folding multiple times. For example, the electronic device (600) according to the present disclosure may include various electronic devices including a flexible display in which some areas (e.g., a bending area or a folding area) are bendable or rollable, such as an electronic device that is expandable through sliding movement between housings.

[0293] In an electronic device (600) according to one embodiment of the present disclosure, a second magnetic layer (664, MMP2) may be arranged to overlap a portion from which a portion of a conductive layer (663) (e.g., a conductive plate) is removed. In a portion corresponding to a bending region (670), the second magnetic layer (664, MMP2) may be arranged between a first magnetic layer portion (6621) and a second magnetic layer portion (6622) to prevent (or compensate for) a degradation of characteristics in the bending region (670) due to the removal of a portion of the conductive layer (663) (e.g., a conductive plate).

[0294] With respect to FIGS. 6 and 7 in general, a portion of the magnetic layer around the hinge axis (i.e., within the bend region (670)) may be replaced with a portion having different magnetic properties (e.g., MPP2 (6641, 6642)). The portion of MPP2 may have lower magnetic performance (e.g., thinner thickness and / or lower permeability) to reduce the adverse effects of removing the conductive layer around the hinge axis in terms of electronic pen sensing. Additionally, reducing the thickness of the magnetic layer around the hinge axis may improve the hinge mechanism by reducing the possibility of the magnetic layer around the hinge axis folding or protruding during folding, which may damage the display. This effect may be achieved through any combination of the relative thicknesses and overlaps of the flexible printed circuit board layer (661), the conductive layer (663), and the magnetic layers (662, 6641, 6642) described above.

[0295] FIG. 8 is a drawing showing an electronic device according to an embodiment of the present disclosure, showing an unfolded state of the electronic device. FIG. 9 is a drawing showing a folded state of the electronic device illustrated in FIG. 8.

[0296] The electronic device (800) of FIG. 8 may be at least partially similar to the electronic device (600) of FIG. 6, or may further include other embodiments of the electronic device. In describing the electronic device (800) of FIGS. 8 and 9, detailed descriptions of configurations substantially the same as (or similar to) the electronic device (600) of FIGS. 6 and 7 may be omitted.

[0297] Referring to FIGS. 8 and 9, an electronic device (800) according to an embodiment of the present disclosure (e.g., the electronic device (101) of FIG. 1, the electronic device (200) of FIG. 2A, the electronic device (300) of FIG. 3A, and the electronic device (600) of FIGS. 6 and 7) may include a display module (801), a bracket (650), a magnetic component (651), a digitizer (860), a hinge plate (880), a hinge structure (690), and a hinge cover (695) (e.g., a hinge housing). For example, the display module (801) may include a display (610) (e.g., a flexible display) (e.g., the first display (230) of FIG. 2A, the flexible display (330) of FIG. 3A, the display (410) of FIG. 4), a flexible plate (620) (e.g., a display support member, a lattice support member, a lattice plate), a flexible printed circuit board (FPCB: flexible printed circuit board) (630), and a printed circuit board (PCB: printed circuit board) (640). For example, when the hinge structure (690) has magnetism, a shielding member may be further disposed between the hinge structure (690) and the digitizer (860). When the hinge structure (690) has magnetism, the hinge structure (690) may include stainless steel having magnetism.

[0298] For example, a display (610) (e.g., a flexible display) may be electrically connected to a printed circuit board (640, PCB) via a flexible circuit board (630, FPCB).

[0299] For example, the digitizer (860) can be electrically connected to a digitizer drive unit (e.g., the digitizer drive unit (470) of FIG. 4) through a flexible circuit board.

[0300] For example, the printed circuit board (640, PCB) may include a processor (e.g., processor (120) of FIG. 1), memory (e.g., memory (130) of FIG. 1), display driver IC (e.g., display driver IC (430) of FIG. 4), and digitizer driver (e.g., digitizer driver (470) of FIG. 4).

[0301] According to one embodiment, when the electronic device (800) is folded, magnetic components (651) may be placed on both sides of the bracket (650) to secure the folded (e.g., folded) state. A groove or hole may be formed in at least a portion of both sides of the bracket (650), and the magnetic components (651) may be placed in the groove or hole formed on both sides.

[0302] According to one embodiment, a hinge plate (880) and a hinge structure (690) may be arranged to correspond to the bending area (670). The hinge structure (690) may be covered by a hinge cover (695) when viewed from the outside. For example, the electronic device (800) may be folded and unfolded in an in-folding manner and / or an out-folding manner by the hinge structure (690). According to one embodiment, a digitizer (860) may be arranged at the bottom of a flexible plate (620) (e.g., a lattice plate). For example, when the electronic device (800) is folded (e.g., folded), the display (610) (e.g., flexible display) can be smoothly folded and unfolded based on the folding axis (F) and the display (810) (e.g., flexible display) can be supported, so that the flexible plate (620) (e.g., lattice plate) can include a lattice portion (622) (e.g., lattice area). For example, the width of the lattice portion (622) can be 8 mm to 12 mm.

[0303] For example, to enable smooth folding and unfolding of the electronic device (800), the digitizer (860) may include a first digitizer portion (8601) and a second digitizer portion (8602) spaced apart from each other based on the folding axis (F).

[0304] According to one embodiment, the digitizer (860) may include a flexible circuit board layer (861) on which a coil array is arranged, a first magnetic layer (862, first magnetic layer, MMP1), and a conductive layer (863) (e.g., a conductive plate), a second magnetic layer (864, second magnetic layer, MMP2), and a third magnetic layer (865, third magnetic layer).

[0305] For example, a first magnetic layer (862) may be disposed below a flexible circuit board layer (861). A conductive layer (863) (e.g., a conductive plate) may be disposed below the first magnetic layer (862). A second magnetic layer (864) and a third magnetic layer (865) may be positioned below (e.g., below) the conductive layer (863). The second magnetic layer (864) and the third magnetic layer (865) may not be attached to or directly adjacent to the conductive layer (763). For example, the second magnetic layer (864) and the third magnetic layer (865) may be disposed within a bending region (670) below the level of the conductive layer (863), but may not overlap with the conductive layer (863) or the first magnetic layer (862). However, in other examples, there may be some overlap between these elements.

[0306] For example, the first magnetic layer (862), the second magnetic layer (864), and the third magnetic layer (865) may be formed of magnetic metal powder (MMP). Without being limited thereto, the first magnetic layer (862) and the second magnetic layer (864) may include silicon, aluminum, cobalt, nickel, ferrite (e.g., MnZn ferrite), iron, silicon steel, permalloy, soft iron, steel, or pure iron having magnetism. The first magnetic layer (862) and the second magnetic layer (864) may be formed of a single material of cobalt, nickel, ferrite (e.g., MnZn ferrite), iron, silicon steel, permalloy, soft iron, steel, or pure iron having magnetism, or a composite material including materials having magnetism.

[0307] According to one embodiment, the flexible circuit board layer (861) of the digitizer (860) may include a coil array. The flexible circuit board layer (861) of the digitizer (860) may be formed to a thickness of about 50 μm to 300 μm. The conductive layer (863) (e.g., conductive plate) of the digitizer (860) may be formed to a thickness of about 5 μm to 200 μm. For example, the conductive layer (863) (e.g., conductive plate) may be formed of a conductive metal material (e.g., aluminum, stainless steel, copper alloy).

[0308] According to one embodiment, when the electronic device (800) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., a flexible display), a first magnetic layer (862, MMP1) may be disposed between the flexible circuit board layer (861) and the conductive layer (863) (e.g., a conductive plate).

[0309] According to one embodiment, when the electronic device (800) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., a flexible display), the second magnetic layer (864, MMP2) may be positioned lower (e.g., below) than the first magnetic layer (862, MMP1) and the conductive layer (863) (e.g., a conductive plate).

[0310] According to one embodiment, when the electronic device (800) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., a flexible display), the third magnetic layer (865) may be disposed lower (e.g., below) than the first magnetic layer (862, MMP1) and the conductive layer (863) (e.g., a conductive plate). For example, when the electronic device (800) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., a flexible display), the third magnetic layer (865) may be disposed adjacent to the second magnetic layer (864).

[0311] For example, a first magnetic layer (862, MMP1) may be disposed under a flexible circuit board layer (861). The first magnetic layer (862, MMP1) may be disposed to overlap at least a portion of the flexible circuit board layer (861).

[0312] According to one embodiment, when the electronic device (800) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., a flexible display), the first magnetic layer (862, MMP1) and the second magnetic layer (864, MMP2) may be positioned at different positions.

[0313] For example, a second magnetic layer (864, MMP2) and a third magnetic layer (865) may be placed between the flexible circuit board layer (861) and the hinge plate (880).

[0314] For example, the first magnetic layer (862, MMP1) may be arranged so as to be substantially in contact with the flexible circuit board layer (861) at the bottom of the flexible circuit board layer (861).

[0315] For example, the first magnetic layer (862, MMP1) may be positioned on top of the conductive layer (863) (e.g., conductive plate) so as to be substantially in contact with the conductive layer (863) (e.g., conductive plate).

[0316] For example, the second magnetic layer (864, MMP2) may be disposed at the bottom of the flexible circuit board layer (861) and spaced apart from the flexible circuit board layer (861) by a certain distance. For example, the second magnetic layer (864, MMP2) may be disposed at the bottom of the flexible circuit board layer (861) and spaced apart from the first magnetic layer (862, MMP1) by a certain distance. For example, the second magnetic layer (864, MMP2) may be disposed at the bottom of the flexible circuit board layer (861) and spaced apart from the conductive layer (863) (e.g., conductive plate) by a certain distance. For example, the third magnetic layer (865) may be disposed at the bottom of the flexible circuit board layer (861) and spaced apart from the conductive layer (863) (e.g., conductive plate) by a certain distance.

[0317] According to one embodiment, the hinge cover (695) can be bonded (or attached) to at least a portion of the hinge structure (690) to support the hinge structure (690).

[0318] In one embodiment, the hinge structure (690) may include a hinge plate (880). For example, the hinge plate (880) may be positioned adjacent to or connected to both sides of the bracket (650) so as to be slidable as the electronic device (800) is folded or unfolded.

[0319] According to one embodiment, the hinge structure (690) may be connected to both sides of the bracket (650) through fixed members (not shown) or may be connected through other rotating members (not shown).

[0320] According to one embodiment, the foldable housing of the electronic device (800) may include a first housing portion (e.g., the first housing (210) of FIG. 2A, the first housing (310) of FIG. 3A) connected to a first side of the hinge cover (695) (e.g., the hinge housing), and a second housing portion (e.g., the second housing (220) of FIG. 2A, the second housing (320) of FIG. 3A) connected to a second side of the hinge cover (695) (e.g., the hinge housing).

[0321] According to one embodiment, the hinge structure (690) of the electronic device (800) may be at least partially seated in a hinge cover (695) (e.g., a hinge housing) and disposed at a lower portion (e.g., bottom) of the digitizer (860).

[0322] For example, the hinge plate (880) may include a first hinge plate portion (8801) connected to a first housing portion (e.g., the first housing (210) of FIG. 2A, the first housing (310) of FIG. 3A), and a second hinge plate portion (8802) connected to a second housing portion (e.g., the second housing (220) of FIG. 2A, the second housing (320) of FIG. 3A).

[0323] For example, the second magnetic layer (864, MMP2) may be arranged on the upper side of the hinge plate (880) so as to be in contact with the hinge plate (880). For example, the second magnetic layer (864, MMP2) may be arranged on the upper side of the hinge plate (880) so as to overlap with the hinge plate (880). For example, when the electronic device (800) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., a flexible display), the second magnetic layer (864, MMP2) may be arranged below the first magnetic layer (862, MMP1). According to one embodiment, a conductive layer (863) (e.g., a conductive plate) may be arranged below the first magnetic layer (862, MMP1). The conductive layer (863) (e.g., conductive plate) may be arranged to overlap the first magnetic layer (862, MMP1).

[0324] According to one embodiment, when the electronic device (800) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., a flexible display), the first magnetic layer (862, MMP1) and the second magnetic layer (864, MMP2) may be arranged so as not to overlap.

[0325] According to one embodiment, the conductive layer (863) (e.g., conductive plate) may be positioned so as not to overlap with the second magnetic layer (864, MMP2). For example, when the electronic device (800) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., flexible display), the second magnetic layer (864, MMP2) and the conductive layer (863) (e.g., conductive plate) may be positioned so as not to overlap.

[0326] According to one embodiment, the first magnetic layer (862, MMP1) may include a first magnetic portion (8621) and a second magnetic portion (8622) spaced apart from each other along the folding axis (F).

[0327] According to one embodiment, the conductive layer (863) (e.g., conductive plate) may include a first conductive layer portion (8631) and a second conductive layer portion (8632) spaced apart from each other along the folding axis (F).

[0328] According to one embodiment, the second magnetic layer (864) may include a third magnetic layer portion (8641) and a fourth magnetic layer portion (8642) spaced apart from each other along the folding axis (F).

[0329] According to one embodiment, the third magnetic layer portion (8641) of the second magnetic layer (864) may be arranged to overlap on the upper portion of the first hinge plate portion (8801) of the hinge plate (880). The fourth magnetic layer portion (8642) of the second magnetic layer (864) may be arranged to overlap on the upper portion of the second hinge plate portion (8802) of the hinge plate (880). For example, the third magnetic layer portion (8641) may be arranged to be bonded on the upper portion of the first hinge plate portion (8801). For example, the fourth magnetic layer portion (8642) may be arranged to be bonded on the upper portion of the second hinge plate portion (8802).

[0330] According to one embodiment, the hinge structure (690) may include a support member (810) (e.g., a center-bar) disposed between a first hinge plate portion (8801) and a second hinge plate portion (8802) along the folding axis (F). For example, when the electronic device (800) is in an unfolded state, a second magnetic layer (864) may be disposed on top of the support member (810) (e.g., the center-bar). At least a portion of the second magnetic layer (864) may be disposed to be bonded to the support member (810) (e.g., the center-bar).

[0331] For example, the conductive layer (863) (e.g., conductive plate) may be formed of a conductive metal material (e.g., aluminum, stainless steel, copper alloy).

[0332] For example, the first magnetic layer (862, MMP1) and the second magnetic layer (864, MMP2) may be formed with substantially the same thickness. For example, the second magnetic layer (864) and the third magnetic layer (865) may be formed with substantially the same thickness.

[0333] Not limited thereto, the first magnetic layer (862, MMP1) and the second magnetic layer (864, MMP2) may be formed with different thicknesses. In this case, the first magnetic layer (862, MMP1) may be formed with a first thickness, and the second magnetic layer (864, MMP2) may be formed with a second thickness that is thinner than the first thickness.

[0334] According to one embodiment, when an electronic pen (e.g., the electronic pen (500) of FIGS. 5A and 5B) approaches a digitizer (860), an electromagnetic induction phenomenon occurs, and a magnetic field of the electronic pen (500) can be induced in a coil array disposed on a flexible circuit board layer (861). The coordinates (e.g., position) of the electronic pen (500) can be detected by the electromagnetic induction of the electronic pen (500) and the digitizer (860).

[0335] According to one embodiment, the flexible circuit board layer (861) may not be separated and may be formed as a single substrate.

[0336] According to one embodiment, the flexible circuit board layer (861) may include a first flexible circuit board portion (8611) and a second flexible circuit board portion (8612) that are spaced apart from each other along the folding axis (F). For example, when the electronic device (800) is folded, the first flexible circuit board portion (8611) and the second flexible circuit board portion (8612) may be separated. Although the first flexible circuit board portion (8611) and the second flexible circuit board portion (8612) are separated, in the unfolded state of the electronic device (800), the first flexible circuit board portion (8611) and the second flexible circuit board portion (8612) may be arranged to contact each other without a gap therebetween.

[0337] According to one embodiment, the first magnetic portion (8621) and the second magnetic portion (8622) of the first magnetic layer (862, MMP1) may be spaced apart from each other by a first gap (w1) (e.g., a gap distance). For example, the first gap (w1) between the first magnetic portion (8621) and the second magnetic portion (8622) of the first magnetic layer (862, MMP1) may be 8 mm to 30 mm.

[0338] For example, the first gap (w1) between the first magnetic portion (8621) and the second magnetic portion (8622) may be substantially the same as the second gap (w2) between the first conductive layer portion (8631) and the second conductive layer portion (8631). For example, the first gap (w1) between the first magnetic portion (8621) and the second magnetic portion (8622) may be smaller than the second gap (w2) between the first conductive layer portion (8631) and the second conductive layer portion (8631). Without being limited thereto, the first gap (w1) between the first magnetic portion (8621) and the second magnetic portion (8622) may be larger than the second gap (w2) between the first conductive layer portion (8631) and the second conductive layer portion (8631).

[0339] According to one embodiment, the conductive layer (863) (e.g., conductive plate) may include a first conductive layer portion (8631) and a second conductive layer portion (8632) that are spaced apart from each other. A portion of the conductive layer (863) (e.g., conductive plate) may be removed to improve the bending characteristics of the electronic device (800). For example, a portion of the first conductive layer portion (8631) of the conductive layer (8633) (e.g., conductive plate) may be removed, and a portion of the second conductive layer portion (8632) may be removed, thereby spacing the first and second conductive layer portions apart from each other by a second gap (w2).

[0340] For example, the second gap (w2) between the first conductive layer portion (8631) and the second conductive layer portion (8631) may be 10 mm to 30 mm. For example, a portion of the conductive layer (863) (e.g., conductive plate) corresponding to the banding area may be removed.

[0341] For example, the second gap (w2) between the first conductive layer portion (8631) and the second conductive layer portion (8631) may be substantially the same as the first gap (w1) between the first magnetic portion (8621) and the second magnetic portion (8622). For example, the second gap (w2) between the first conductive layer portion (8631) and the second conductive layer portion (8631) may be greater than the first gap (w1) between the first magnetic portion (8621) and the second magnetic portion (8622).

[0342] According to one embodiment, the second magnetic layer (864, MMP2) may include a third magnetic layer portion (8641) and a fourth magnetic layer portion (8642) that are spaced apart from each other. The third magnetic layer portion (8641) and the fourth magnetic layer portion (8642) may be spaced apart from each other, and the third magnetic layer (865) may be placed between the third magnetic layer portion (8641) and the fourth magnetic layer portion (8642) of the second magnetic layer (864, MMP2).

[0343] According to one embodiment, when the electronic device (800) is unfolded (see FIG. 8), a third magnetic layer (865) may be disposed between the third magnetic layer portion (8641) and the fourth magnetic layer portion (8642), which are spaced apart from each other along the folding axis (F). For example, when the electronic device (800) is unfolded, the second magnetic layer (864) and the third magnetic layer (865) may be disposed adjacent to each other (e.g., substantially connected). For example, the third magnetic layer (865) may be formed of the same material and with the same height as the second magnetic layer (864). For example, the third magnetic layer (865) may be disposed to overlap the support member (810) (e.g., the center bar). For example, the third magnetic layer (865) may be bonded (or attached) to the support member (810) (e.g., the center bar) via an adhesive member.

[0344] According to one embodiment, when the electronic device (800) is folded (see FIG. 9), the second magnetic layer (864) and the third magnetic layer (865) may be spaced apart from each other. For example, when the electronic device (800) is folded (see FIG. 9), the hinge plate (880) and the support member (810) (e.g., the center bar) may be spaced apart from each other (e.g., separated), and accordingly, the second magnetic layer (864) and the third magnetic layer (865) may be spaced apart from each other (e.g., separated).

[0345] For example, the hinge plate (880) may be formed to have a width that is substantially the same as the first gap (w1) or greater than the first gap (w1) so as to substantially cover the first gap (w1). For example, the hinge plate (880) may be formed to have a width that is substantially the same as the second gap (w2) or greater than the second gap (w2) so as to substantially cover the second gap (w2).

[0346] According to one embodiment, the first magnetic layer (862, MMP1) may be formed to have a first performance coefficient. For example, the first magnetic layer (862, MMP1) may be formed to have a first thickness and a material having a first permeability, thereby having the first performance coefficient. For example, the first magnetic layer (862, MMP1) may be formed to have a thickness of 30 μm to 60 μm. For example, the permeability of the first magnetic layer (862, MMP1) may be approximately 95 u'.

[0347] According to one embodiment, the second magnetic layer (864, MMP2) may be formed to have a second coefficient of performance lower than the first coefficient of performance. For example, the second magnetic layer (864, MMP2) may be formed to have a second thickness that is substantially the same as the first thickness (e.g., 30 μm to 60 μm) or thinner than the first thickness (e.g., 30 μm to 60 μm) and may have the second coefficient of performance. For example, the second magnetic layer (864, MMP2) may be formed to have a thickness of 20 μm to 30 μm. For example, the second magnetic layer (864, MMP2) may have a lower permeability (e.g., about 95 u') than the permeability of the first magnetic layer (662, MMP1). For example, the permeability of the second magnetic layer (864, MMP2) may be about 60 u'.

[0348] For example, the second magnetic layer (864, MMP2) may be formed of a material having a second permeability lower than the first permeability of the first magnetic layer (862, MMP1), and may be formed with a thickness substantially the same as the first thickness of the first magnetic layer (862, MMP1) to have a second performance coefficient.

[0349] For example, the second magnetic layer (864, MMP2) may be formed of a material having a first permeability substantially the same as that of the first magnetic layer (862, MMP1), and may be formed to have a second thickness thinner than the first thickness of the first magnetic layer (862, MMP1), thereby having a second coefficient of performance.

[0350] For example, the second magnetic layer (864, MMP2) may be formed of a material having a second permeability lower than the first permeability of the first magnetic layer (862, MMP1) and may be formed to have a second thickness thinner than the first thickness of the first magnetic layer (862, MMP1) to have a second performance coefficient.

[0351] According to one embodiment, a lattice portion (622) (e.g., a lattice portion) may be positioned in a portion corresponding to a banding area (670). For example, the lattice portion (622) (e.g., a lattice portion) may be positioned to overlap the banding area (670).

[0352] According to one embodiment, at least a portion of the second magnetic layer (864, MMP2) may be positioned to overlap the lattice portion (622) (e.g., the lattice region). For example, the second magnetic layer (864, MMP2) may be positioned to overlap the entire lattice portion (622) (e.g., the lattice region).

[0353] According to one embodiment, the first magnetic layer (862) and the lattice portion (622) (e.g., the lattice region) may be arranged so as not to overlap.

[0354] The digitizer (860) of the present disclosure can be applied not only to foldable electronic devices but also to slideable electronic devices or rollable electronic devices. Although the present disclosure exemplifies a foldable electronic device capable of being folded inward, the electronic device (800) according to the present disclosure is not limited to a foldable electronic device capable of being folded inward. For example, the electronic device (800) according to the present disclosure may include a foldable electronic device including a display capable of being folded outward. The electronic device (800) according to the present disclosure may include a multi-foldable electronic device including a display capable of being folded inward and outward multiple times. For example, the electronic device (800) according to the present disclosure may include various electronic devices including a flexible display in which some areas (e.g., a bending area or a folding area) are bendable or rollable, such as an electronic device that is expandable through sliding movement between housings.

[0355] An electronic device (800) according to one embodiment of the present disclosure may have a second magnetic layer (864, MMP2) arranged to overlap with a hinge plate (880). The second magnetic layer (864, MMP2) may be arranged in a portion corresponding to a bending region to prevent (or compensate for) a degradation of characteristics in the bending region (670) due to removal of a portion of a conductive layer (863) (e.g., a conductive plate).

[0356] With respect to FIGS. 8 and 9 in general, a portion of the magnetic layer around the hinge axis (i.e., the bending region (670)) may be replaced with a portion having lower magnetic performance (e.g., a thinner or lower permeability portion (MMP2 (8641, 8642)) to reduce the adverse effects of removing the conductive layer around the hinge axis from the perspective of electronic pen detection. Additionally, positioning the MMP2 portion (8641, 8642) away from the display may reduce the possibility of the magnetic layer around the hinge axis folding and protruding during folding, thereby damaging the display. This effect may be achieved through any combination of the relative thicknesses and overlaps of the aforementioned flexible printed circuit board layer (661), the conductive layer (663), and the magnetic layers (862, 8641, 8642, 865).

[0357] FIG. 10 is a drawing showing an electronic device according to an embodiment of the present disclosure, showing an unfolded state of the electronic device. FIG. 11 is a drawing showing a folded state of the electronic device illustrated in FIG. 10.

[0358] The electronic device (1000) of FIG. 10 may be at least partially similar to the electronic device (600) of FIG. 6 and the electronic device (800) of FIG. 8, or may further include other embodiments of the electronic device. In describing the electronic device (1000) of FIGS. 10 and 11, a detailed description of a configuration substantially the same as (or similar to) the electronic device (600) of FIG. 6 or the electronic device (800) of FIG. 8 may be omitted.

[0359] Referring to FIGS. 10 and 11, an electronic device (1000) according to an embodiment of the present disclosure (e.g., the electronic device (101) of FIG. 1, the electronic device (200) of FIG. 2A, and the electronic device (300) of FIG. 3A) may include a display module (1001), a bracket (650), a magnetic component (651), a digitizer (1060), a hinge plate (880), a hinge structure (690), and a hinge cover (695). For example, the display module (1001) may include a display (610) (e.g., a flexible display) (e.g., the first display (230) of FIG. 2A, the flexible display (330) of FIG. 3A, the display (410) of FIG. 4), a flexible plate (620) (e.g., a display support member, a lattice support member, a lattice plate), a flexible circuit board (630, FPCB: flexible printed circuit board), and a printed circuit board (640, PCB: printed circuit board).

[0360] For example, if the hinge structure (690) has magnetism, a shielding member may be further placed between the hinge structure (690) and the digitizer (1060). If the hinge structure (690) has magnetism, the hinge structure (690) may include stainless steel having magnetism.

[0361] For example, the bracket (650) may be adhered (or attached) to at least a portion of the display module (1001) through an adhesive material or the like to support the display module (1001). The bracket (650) may include a recess that may accommodate at least a portion of the display module (1001) (e.g., a printed circuit board (640)).

[0362] For example, a display (610) (e.g., a flexible display) may be electrically connected to a printed circuit board (640, PCB) via a flexible circuit board (630, FPCB). For example, a digitizer (1060) may be electrically connected to a digitizer driver (e.g., the digitizer driver (470) of FIG. 4) via a flexible circuit board.

[0363] For example, the printed circuit board (640, PCB) may include a processor (e.g., processor (120) of FIG. 1), memory (e.g., memory (130) of FIG. 1), display driver IC (e.g., display driver IC (430) of FIG. 4), and digitizer driver (e.g., digitizer driver (470) of FIG. 4).

[0364] According to one embodiment, when the electronic device (1000) is folded, magnetic components (651) may be placed on both sides of the bracket (650) to secure the folded (e.g., folded) state. A groove or hole may be formed in at least a portion of both sides of the bracket (650), and the magnetic components (651) may be placed in the groove or hole formed on both sides.

[0365] According to one embodiment, the hinge plate (880) may include a first hinge plate portion (8801) connected to a first housing portion (e.g., the first housing (210) of FIG. 2A, the first housing (310) of FIG. 3A), and a second hinge plate portion (8802) connected to a second housing portion (e.g., the second housing (220) of FIG. 2A, the second housing (320) of FIG. 3A).

[0366] According to one embodiment, the hinge structure (690) may include a support member (1010) (e.g., a center-bar) disposed between a first hinge plate portion (8801) and a second hinge plate portion (8802) along the folding axis (F). For example, the support member (1010) (e.g., a center-bar) may be disposed between the first hinge plate portion (8801) and the second hinge plate portion (8802).

[0367] According to one embodiment, a hinge plate (880), a hinge structure (690), and a support member (1010) (e.g., a center bar) may be arranged to correspond to a bending area (670). The hinge structure (690) and the support member (1010) may be covered from the outside by a hinge cover (695). For example, the electronic device (1000) may be folded and unfolded in an in-folding manner and / or an out-folding manner by the hinge structure (690).

[0368] According to one embodiment, the hinge cover (695) can be bonded (or attached) to at least a portion of the hinge structure (690) to support the hinge structure (690).

[0369] According to one embodiment, the hinge plate (880) may be positioned adjacent to or connected to both sides of the bracket (650) so that it can slide as the electronic device (1000) is folded or unfolded.

[0370] According to one embodiment, the hinge structure (690) may be connected to both sides of the bracket (650) through fixed members (not shown) or may be connected through other rotating members (not shown).

[0371] For example, if the hinge structure (690) has magnetism, a shielding member may be further placed between the hinge structure (690) and the digitizer (1060).

[0372] According to one embodiment, a digitizer (1060) may be placed on the lower portion of a flexible plate (620) (e.g., a lattice plate).

[0373] For example, to enable smooth folding and unfolding of the electronic device (1000), at least some components of the digitizer (1060) may be separated from each other with respect to the folding axis (F). For example, to enable smooth folding and unfolding of the electronic device (1000), the digitizer (1060) may include a first digitizer portion (1067) and a second digitizer portion (1068) that are separated from each other with respect to the folding axis (F).

[0374] According to one embodiment, the digitizer (1060) may include a flexible circuit board layer (1061) including a coil array, a first magnetic layer (1062, MMP1), a conductive layer (1063) (e.g., a conductive plate), and a second magnetic layer (1064, MMP2).

[0375] According to one embodiment, when the electronic device (1000) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., a flexible display), a first magnetic layer (1062, MMP1) may be disposed between the flexible circuit board layer (1061) and the conductive layer (1063) (e.g., a conductive plate).

[0376] For example, a first magnetic layer (1062, MMP1) may be disposed under a flexible circuit board layer (1061). The first magnetic layer (1062, MMP1) may be disposed to overlap at least a portion of the flexible circuit board layer (1061).

[0377] For example, a second magnetic layer (1064, MMP2) may be disposed under a flexible circuit board layer (1061). The second magnetic layer (1064, MMP2) may be disposed to overlap at least a portion of the flexible circuit board layer (1061).

[0378] According to one embodiment, the first magnetic layer (1062, MMP1) and the second magnetic layer (1064, MMP2) may be arranged in parallel on the lower side of the flexible circuit board layer (1061).

[0379] According to one embodiment, a conductive layer (1063) (e.g., a conductive plate) may be disposed under a first magnetic layer (1062, MMP1). The conductive layer (1063) (e.g., a conductive plate) may be disposed to overlap the first magnetic layer (1062, MMP1). For example, when the electronic device (1000) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., a flexible display), the first magnetic layer (1062, MMP1) and the conductive layer (1063) (e.g., a conductive plate) may be disposed to substantially overlap.

[0380] According to one embodiment, when the electronic device (1000) is displayed in an unfolded state in a direction perpendicular to the display (610) (e.g., a flexible display), the first magnetic layer (1062, MMP1) and the second magnetic layer (1064, MMP2) may be arranged so as not to overlap.

[0381] According to one embodiment, the conductive layer (1063) (e.g., conductive plate) may be positioned so as not to overlap with the second magnetic layer (1064, MMP2). For example, the conductive layer (1063) (e.g., conductive plate) may be formed of a conductive metal material (e.g., aluminum, stainless steel, copper alloy).

[0382] For example, the first magnetic layer (1062, MMP1) and the second magnetic layer (1064, MMP2) can be formed with substantially the same thickness.

[0383] Not limited thereto, the first magnetic layer (1062, MMP1) and the second magnetic layer (1064, MMP2) may be formed with different thicknesses. In this case, the first magnetic layer (1062, MMP1) may be formed with a first thickness, and the second magnetic layer (1064, MMP2) may be formed with a second thickness that is thinner than the first thickness.

[0384] According to one embodiment, the flexible circuit board layer (1061) may not be separated and may be formed as a single substrate.

[0385] According to one embodiment, the flexible circuit board layer (1061) may include a first flexible circuit board portion (10611) and a second flexible circuit board portion (10612) that are spaced apart from each other along the folding axis (F). For example, the first flexible circuit board portion (10611) and the second flexible circuit board portion (10612) are separated, but in the unfolded state of the electronic device (1000), the first flexible circuit board portion (10611) and the second flexible circuit board portion (10612) may be arranged to contact each other without a gap therebetween.

[0386] According to one embodiment, the first magnetic layer (1062, MMP1) may include a first magnetic portion (10621) and a second magnetic portion (10622) that are spaced apart from each other along the folding axis (F). For example, the first magnetic portion (10621) and the second magnetic portion (10622) may be spaced apart from each other by a first gap (w1) (e.g., a gap distance). For example, the first gap (w1) between the first magnetic portion (10621) and the second magnetic portion (10622) may be 8 mm to 30 mm.

[0387] For example, the first gap (w1) between the first magnetic portion (10621) and the second magnetic portion (10622) may be substantially the same as the second gap (w2) between the first conductive layer portion (10631) and the second conductive layer portion (10632). For example, the first gap (w1) between the first magnetic portion (10621) and the second magnetic portion (10622) may be smaller than the second gap (w2) between the first conductive layer portion (10631) and the second conductive layer portion (10632). Without being limited thereto, the first gap (w1) between the first magnetic portion (10621) and the second magnetic portion (10622) may be larger than the second gap (w2) between the first conductive layer portion (10631) and the second conductive layer portion (10632).

[0388] According to one embodiment, in a direction parallel to the first magnetic layer (1062, MMP1), the second magnetic layer (1064, MMP2) may be disposed between the first magnetic portion (10621) and the second magnetic portion (16022) of the first magnetic layer (1062, MMP1).

[0389] According to one embodiment, a portion of the conductive layer (1063) (e.g., conductive plate) may be removed to improve the bending characteristics of the electronic device (1000). For example, a portion of a first conductive layer portion (10631) of the conductive layer (1063) (e.g., conductive plate) may be removed, and a portion of a second conductive layer portion (10632) may be removed, such that the first conductive layer portion (10631) and the second conductive layer portion (10632) may be spaced apart from each other by a second gap (w2). For example, the second gap (w2) between the first conductive layer portion (10631) and the second conductive layer portion (10632) may be 10 mm to 30 mm. For example, a portion of the conductive layer (1063) (e.g., conductive plate) corresponding to the bending region (670) may be removed.

[0390] For example, the second gap (w2) between the first conductive layer portion (10631) and the second conductive layer portion (10632) may be substantially the same as the first gap (w1) between the first magnetic portion (10621) and the second magnetic portion (10622). For example, the second gap (w2) between the first conductive layer portion (10631) and the second conductive layer portion (10632) may be greater than the first gap (w1) between the first magnetic portion (10621) and the second magnetic portion (10622). Without being limited thereto, the second gap (w2) between the first conductive layer portion (10631) and the second conductive layer portion (10632) may be smaller than the first gap (w1) between the first magnetic portion (10621) and the second magnetic portion (10622).

[0391] According to one embodiment, the second magnetic layer (1064, MMP2) may be formed to have a width substantially the same as the first gap (w1). For example, the second magnetic layer (1064, MMP2) may include a third magnetic portion (10641) and a fourth magnetic portion (10642) that are spaced apart from each other along the folding axis (F). For example, when the electronic device (1000) is unfolded, the third magnetic portion (10641) and the fourth magnetic portion (10642) may be arranged to contact each other. For example, when the electronic device (1000) is unfolded, the third magnetic portion (10641) and the fourth magnetic portion (10642) may be arranged to contact each other without being separated. For example, when the electronic device (1000) is folded, the third magnetic portion (10641) and the fourth magnetic portion (10642) may be arranged to be in contact with each other without being separated.

[0392] For example, the hinge plate (880) may be formed to have a width that is substantially the same as the first gap (w1) or greater than the first gap (w1) so as to substantially cover the first gap (w1).

[0393] For example, the hinge plate (880) may be formed to have a width that is substantially the same as the second gap (w2) or greater than the second gap (w2) so as to substantially cover the second gap (w2).

[0394] According to one embodiment, the first magnetic layer (1062, MMP1) may be formed to have a first performance coefficient. For example, the first magnetic layer (1062, MMP1) may be formed to have a first thickness and a material having a first permeability, thereby having the first performance coefficient. For example, the first magnetic layer (1062, MMP1) may be formed to have a thickness of 30 μm to 60 μm. For example, the permeability of the first magnetic layer (1062, MMP1) may be approximately 95 u'.

[0395] According to one embodiment, the second magnetic layer (1064, MMP2) may be formed to have a second coefficient of performance lower than the first coefficient of performance. For example, the second magnetic layer (1064, MMP2) may be formed to have a second thickness thinner than the first thickness and made of a material having a second permeability lower than the first permeability, thereby having the second coefficient of performance. For example, the second magnetic layer (1064, MMP2) may be formed to have a first thickness and made of a material having a second permeability lower than the first permeability, thereby having the second coefficient of performance. For example, the second magnetic layer (1064, MMP2) may be formed to have a second thickness thinner than the first thickness and made of a material having a first permeability.

[0396] For example, the second magnetic layer (1064, MMP2) may be formed to a thickness of 20 μm to 30 μm. For example, the second magnetic layer (1064, MMP2) may have a lower permeability (e.g., about 95 u') than the permeability of the first magnetic layer (1062, MMP1). For example, the permeability of the second magnetic layer (1064, MMP2) may be about 60 u'.

[0397] When the electronic device (1000) is folded (e.g., folded), the display (610) (e.g., flexible display) can be smoothly folded and unfolded based on the folding axis (F), and the flexible plate (620) (e.g., lattice plate) can include a lattice portion (622) (e.g., lattice area) so that the display (610) (e.g., flexible display) can be supported.

[0398] According to one embodiment, a lattice portion (622) (e.g., a lattice portion) may be positioned in a portion corresponding to a banding area (670). For example, the lattice portion (622) (e.g., a lattice portion) may be positioned to overlap the banding area (670).

[0399] According to one embodiment, at least a portion of the second magnetic layer (1064, MMP2) may be positioned to overlap the lattice portion (622) (e.g., the lattice region). For example, the second magnetic layer (1064, MMP2) may be positioned to overlap the entire lattice portion (622) (e.g., the lattice region).

[0400] According to one embodiment, the first magnetic layer (1062) and the lattice portion (622) (e.g., the lattice region) may be arranged so as not to overlap.

[0401] The digitizer (1060) of the present disclosure can be applied not only to foldable electronic devices but also to slideable electronic devices or rollable electronic devices. Although the present disclosure exemplifies a foldable electronic device capable of being folded inward, the electronic device (1000) according to the present disclosure is not limited to a foldable electronic device capable of being folded inward. For example, the electronic device (1000) according to the present disclosure may include a foldable electronic device including a display capable of being folded outward. The electronic device (1000) according to the present disclosure may include a multi-foldable electronic device including a display capable of being folded inward and outward multiple times. For example, the electronic device (1000) according to the present disclosure may include various electronic devices including a flexible display in which some areas (e.g., a bending area or a folding area) are bendable or rollable, such as an electronic device that is expandable through sliding movement between housings.

[0402] An electronic device (1000) according to one embodiment of the present disclosure may have a second magnetic layer (1064, MMP2) disposed in a portion corresponding to a bending region (670) to prevent (or compensate for) a degradation of characteristics in the bending region (670) due to removal of a portion of a conductive layer (1063) (e.g., a conductive plate) in a manner similar to the description of FIGS. 6 to 9.

[0403] FIG. 12 is a drawing showing an electronic device according to an embodiment of the present disclosure, showing an unfolded state of the electronic device. FIG. 13 is a drawing showing a folded state of the electronic device illustrated in FIG. 12.

[0404] The electronic device (1200) of FIG. 12 may be at least partially similar to the electronic device (800) of FIG. 8, or may further include other embodiments of the electronic device. In describing the electronic device (1200) of FIGS. 12 and 13, a detailed description of a configuration substantially the same as (or similar to) the electronic device (800) of FIG. 8 or the electronic device (1000) of FIG. 10 may be omitted.

[0405] Referring to FIGS. 12 and 13, an electronic device (1200) according to an embodiment of the present disclosure (e.g., the electronic device (101) of FIG. 1, the electronic device (200) of FIG. 2A, and the electronic device (300) of FIG. 3A) may include a display module (1201), a bracket (650), a magnetic component (651), a digitizer (1260), a hinge plate (880), a hinge structure (690), and a hinge cover (695). For example, the display module (1201) may include a display (610) (e.g., a flexible display) (e.g., the first display (230) of FIG. 2A, the flexible display (330) of FIG. 3A, the display (410) of FIG. 4), a flexible plate (620) (e.g., a display support member, a lattice support member, a lattice plate), a flexible circuit board (630, FPCB: flexible printed circuit board), and a printed circuit board (640, PCB: printed circuit board).

[0406] For example, if the hinge structure (690) has magnetism, a shielding member may be further placed between the hinge structure (690) and the digitizer (1060). If the hinge structure (690) has magnetism, the hinge structure (690) may include stainless steel having magnetism.

[0407] For example, the bracket (650) may be adhered (or attached) to at least a portion of the display module (1201) through an adhesive material or the like to support the display module (1201). The bracket (650) may include a recess that may accommodate at least a portion of the display module (1201) (e.g., a printed circuit board (640)).

[0408] For example, a display (610) (e.g., a flexible display) may be electrically connected to a printed circuit board (640, PCB) via a flexible circuit board (630, FPCB).

[0409] For example, the digitizer (1260) can be electrically connected to a digitizer drive unit (e.g., the digitizer drive unit (470) of FIG. 4) through a flexible circuit board.

[0410] For example, the printed circuit board (640, PCB) may include a processor (e.g., processor (120) of FIG. 1), memory (e.g., memory (130) of FIG. 1), display driver IC (e.g., display driver IC (430) of FIG. 4), and digitizer driver (e.g., digitizer driver (470) of FIG. 4).

[0411] According to one embodiment, when the electronic device (1200) is folded, magnetic components (651) may be placed on both sides of the bracket (650) to secure the folded (e.g., folded) state. A groove or hole may be formed in at least a portion of both sides of the bracket (650), and the magnetic components (651) may be placed in the groove or hole formed on both sides.

[0412] According to one embodiment, the hinge plate (880) may include a first hinge plate portion (8801) connected to a first housing portion (e.g., the first housing (210) of FIG. 2A, the first housing (310) of FIG. 3A), and a second hinge plate portion (8802) connected to a second housing portion (e.g., the second housing (220) of FIG. 2A, the second housing (320) of FIG. 3A).

[0413] According to one embodiment, the hinge structure (690) may include a support member (1210) (e.g., a center-bar) disposed between a first hinge plate portion (8801) and a second hinge plate portion (8802) along the folding axis (F). For example, the support member (1210) (e.g., a center-bar) may be disposed between the first hinge plate portion (8801) and the second hinge plate portion (8802).

[0414] According to one embodiment, a hinge plate (880), a hinge structure (690), and a support member (1210) (e.g., a center bar) may be arranged to correspond to a bending area (670). The hinge structure (690) and the support member (1210) may be covered from the outside by a hinge cover (695). For example, the electronic device (1200) may be folded and unfolded in an in-folding manner and / or an out-folding manner by the hinge structure (690).

[0415] According to one embodiment, the hinge cover (695) can be bonded (or attached) to at least a portion of the hinge structure (690) to support the hinge structure (690).

[0416] According to one embodiment, the hinge plate (880) may be positioned adjacent to or connected to both sides of the bracket (650) so that it can slide as the electronic device (1200) is folded or unfolded.

[0417] According to one embodiment, the hinge structure (690) may be connected to both sides of the bracket (650) through fixed members (not shown) or may be connected through other rotating members (not shown).

[0418] For example, if the hinge structure (690) has magnetism, a shielding member may be further placed between the hinge structure (690) and the digitizer (1260).

[0419] According to one embodiment, a digitizer (1260) may be disposed at the bottom of a flexible plate (620) (e.g., a lattice plate). For example, when the electronic device (1200) is folded (e.g., folded), the flexible plate (620) (e.g., a lattice plate) may include a lattice portion (622) (e.g., a lattice area) so that the display (610) (e.g., a flexible display) can be smoothly folded and unfolded with respect to the folding axis (F) and the display (810) (e.g., a flexible display) can be supported. For example, the width of the lattice portion (622) may be 8 mm to 12 mm.

[0420] For example, to enable smooth folding and unfolding of the electronic device (1200), at least some components of the digitizer (1260) may be separated from each other with respect to the folding axis (F). For example, to enable smooth folding and unfolding of the electronic device (1200), the digitizer (1260) may include a first digitizer portion (1267) and a second digitizer portion (1268) that are separated from each other with respect to the folding axis (F).

[0421] According to one embodiment, the digitizer (1260) may include a flexible circuit board layer (1261) including a coil array, a first magnetic layer (1262, MMP1), a conductive layer (1263) (e.g., a conductive plate), a second magnetic layer (1264, MMP2), and a third magnetic layer (1265).

[0422] According to one embodiment, unlike in FIG. 8, the flexible circuit board layer (1261) may not be separated and may be formed as a single substrate. For example, the first and second portions of the flexible circuit board described in FIG. 6 may form a single flexible circuit board extending through a hinge.

[0423] According to one embodiment, the flexible circuit board layer (1261) of the digitizer (1260) may include a coil array. The flexible circuit board layer (1261) of the digitizer (1260) may be formed to a thickness of about 50 μm to 300 μm. The conductive layer (1263) (e.g., conductive plate) of the digitizer (1260) may be formed to a thickness of about 5 μm to 200 μm. For example, the conductive layer (1263) (e.g., conductive plate) may be formed of a conductive metal material (e.g., aluminum, stainless steel, copper alloy).

[0424] According to one embodiment, a first magnetic layer (1262), a second magnetic layer (1264), and a third magnetic layer (1265) may be disposed under a flexible circuit board layer (1261). A conductive layer (1263) (e.g., a conductive plate) may be disposed under the first magnetic layer (1262). The second magnetic layer (1264) and the third magnetic layer (1265) may be positioned lower (e.g., below) than the conductive layer (1263).

[0425] According to one embodiment, when the electronic device (1200) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., a flexible display), a first magnetic layer (1262, MMP1) may be disposed between the flexible circuit board layer (1261) and the conductive layer (1263) (e.g., a conductive plate).

[0426] According to one embodiment, when the electronic device (1200) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., a flexible display), the second magnetic layer (1264, MMP2) may be positioned lower (e.g., below) than the first magnetic layer (1262, MMP1) and the conductive layer (1263) (e.g., a conductive plate).

[0427] According to one embodiment, when the electronic device (1200) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., a flexible display), the third magnetic layer (1265) may be disposed lower (e.g., below) than the first magnetic layer (1262, MMP1) and the conductive layer (1263) (e.g., a conductive plate). For example, when the electronic device (1200) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., a flexible display), the third magnetic layer (1265) may be disposed adjacent to the second magnetic layer (1264).

[0428] For example, a first magnetic layer (1262, MMP1) may be disposed under a flexible circuit board layer (1261). The first magnetic layer (1262, MMP1) may be disposed to overlap at least a portion of the flexible circuit board layer (1261).

[0429] According to one embodiment, when the electronic device (1200) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., a flexible display), the first magnetic layer (1262, MMP1) and the second magnetic layer (1264, MMP2) may be positioned at different positions.

[0430] For example, a second magnetic layer (1264, MMP2) may be placed between the flexible circuit board layer (1261) and the hinge plate (880).

[0431] For example, the first magnetic layer (1262, MMP1) may be positioned at the bottom of the flexible circuit board layer (1261) so as to be substantially in contact with the flexible circuit board layer (1261).

[0432] For example, the first magnetic layer (1262, MMP1) may be positioned on top of the conductive layer (1263) (e.g., conductive plate) so as to be substantially in contact with the conductive layer (1263) (e.g., conductive plate).

[0433] For example, the second magnetic layer (1264, MMP2) may be placed at a certain distance from the flexible circuit board layer (1261) at the bottom of the flexible circuit board layer (1261).

[0434] For example, the second magnetic layer (1264, MMP2) may be arranged at a certain distance from the first magnetic layer (1262, MMP1) at the bottom of the flexible circuit board layer (1261). For example, the second magnetic layer (1264, MMP2) may be arranged at a certain distance from the conductive layer (1263) (e.g., conductive plate) at the bottom of the flexible circuit board layer (861). For example, the third magnetic layer (1265) may be arranged at a certain distance from the conductive layer (1263) (e.g., conductive plate) at the bottom of the flexible circuit board layer (1261).

[0435] According to one embodiment, the hinge cover (695) can be bonded (or attached) to at least a portion of the hinge structure (690) to support the hinge structure (690).

[0436] In one embodiment, the hinge structure (690) may include a hinge plate (880). For example, the hinge plate (880) may be positioned adjacent to or connected to both sides of the bracket (650) so as to be slidable as the electronic device (1200) is folded or unfolded.

[0437] According to one embodiment, the hinge structure (690) may be connected to both sides of the bracket (650) through fixed members (not shown) or may be connected through other rotating members (not shown).

[0438] According to one embodiment, the foldable housing of the electronic device (1200) may include a first housing portion (e.g., the first housing (210) of FIG. 2A, the first housing (310) of FIG. 3A) connected to a first side of the hinge cover (695) (e.g., the hinge housing), and a second housing portion (e.g., the second housing (220) of FIG. 2A, the second housing (320) of FIG. 3A) connected to a second side of the hinge cover (695) (e.g., the hinge housing).

[0439] According to one embodiment, the hinge structure (1290) of the electronic device (1200) may be at least partially seated in the hinge cover (695) (e.g., hinge housing) and may be positioned at the lower portion (e.g., bottom) of the digitizer (1260).

[0440] For example, the hinge plate (880) may include a first hinge plate portion (8801) connected to a first housing portion (e.g., the first housing (210) of FIG. 2A, the first housing (310) of FIG. 3A), and a second hinge plate portion (8802) connected to a second housing portion (e.g., the second housing (220) of FIG. 2A, the second housing (320) of FIG. 3A).

[0441] For example, the second magnetic layer (1264, MMP2) may be arranged on top of the hinge plate (880) so as to be in contact with the hinge plate (880). For example, the second magnetic layer (1264, MMP2) may be arranged so as to overlap the hinge plate (880). For example, the magnetic layer (1264, MMP2) may be bonded (or attached) to the hinge plate (880) through an adhesive member.

[0442] For example, when the electronic device (1200) is unfolded and displayed in a direction perpendicular to the display (610) (e.g., a flexible display), the second magnetic layer (1264, MMP2) may be positioned below the first magnetic layer (1262, MMP1).

[0443] According to one embodiment, a conductive layer (1263) (e.g., a conductive plate) may be disposed under the first magnetic layer (1262, MMP1). The conductive layer (1263) (e.g., a conductive plate) may be disposed to overlap the first magnetic layer (1262, MMP1).

[0444] According to one embodiment, when the electronic device (1200) is displayed in an unfolded state in a direction perpendicular to the display (610) (e.g., a flexible display), the first magnetic layer (1262, MMP1) and the second magnetic layer (1264, MMP2) may be arranged so as not to overlap.

[0445] According to one embodiment, the conductive layer (1263) (e.g., conductive plate) may be positioned so as not to overlap with the second magnetic layer (1264, MMP2). For example, when the electronic device (1200) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., flexible display), the second magnetic layer (1264, MMP2) and the conductive layer (1263) (e.g., conductive plate) may be positioned so as not to overlap.

[0446] According to one embodiment, the first magnetic layer (1262, MMP1) may include a first magnetic portion (12621) and a second magnetic portion (12622) spaced apart from each other along the folding axis (F).

[0447] According to one embodiment, the conductive layer (1263) (e.g., conductive plate) may include a first conductive layer portion (12631) and a second conductive layer portion (12632) spaced apart from each other along the folding axis (F).

[0448] According to one embodiment, the second magnetic layer (1264) may include a third magnetic layer portion (12641) and a fourth magnetic layer portion (12642) spaced apart from each other along the folding axis (F).

[0449] According to one embodiment, the third magnetic layer portion (12641) of the second magnetic layer (1264) may be arranged to overlap on the upper portion of the first hinge plate portion (8801) of the hinge plate (880). The fourth magnetic layer portion (8642) of the second magnetic layer (1264) may be arranged to overlap on the upper portion of the second hinge plate portion (8802) of the hinge plate (880). For example, the third magnetic layer portion (12641) may be arranged to be bonded on the upper portion of the first hinge plate portion (8801). For example, the fourth magnetic layer portion (12642) may be arranged to be bonded on the upper portion of the second hinge plate portion (8802).

[0450] According to one embodiment, the hinge structure (690) may include a support member (1210) (e.g., a center-bar) disposed between a first hinge plate portion (8801) and a second hinge plate portion (8802) along the folding axis (F). For example, when the electronic device (1200) is in an unfolded state, a third magnetic layer (1265) may be disposed between a third magnetic layer portion (12641) and a fourth magnetic layer portion (12642) which are spaced apart from each other along the folding axis (F). For example, when the electronic device (1200) is unfolded, the second magnetic layer (1264) and the third magnetic layer (1265) may be disposed to be adjacent (e.g., substantially connected). For example, the third magnetic layer (1265) may be formed of the same material and with the same height as the second magnetic layer (1264). For example, the third magnetic layer (1265) may be positioned to overlap the support member (1210) (e.g., the center bar). For example, the third magnetic layer (1265) may be bonded (or attached) to the support member (1210) (e.g., the center bar) via an adhesive member.

[0451] According to one embodiment, when the electronic device (1200) is folded, the second magnetic layer (1264) and the third magnetic layer (1265) may be spaced apart from each other. For example, when the electronic device (1200) is folded (see FIG. 9), the hinge plate (1280) and the support member (1210) (e.g., the center bar) may be spaced apart from each other (e.g., separated), and accordingly, the second magnetic layer (1264) and the third magnetic layer (1265) may be spaced apart from each other (e.g., separated).

[0452] For example, the hinge plate (880) may be formed to have a width that is substantially the same as the first gap (w1) or greater than the first gap (w1) so as to substantially cover the first gap (w1). For example, the hinge plate (880) may be formed to have a width that is substantially the same as the second gap (w2) or greater than the second gap (w2) so as to substantially cover the second gap (w2). For example, the conductive layer (1263) (e.g., conductive plate) may be formed of a conductive metal material (e.g., aluminum, stainless steel, copper alloy).

[0453] For example, the first magnetic layer (1262, MMP1) and the second magnetic layer (1264, MMP2) can be formed with substantially the same thickness.

[0454] Not limited thereto, the first magnetic layer (1262, MMP1) and the second magnetic layer (1264, MMP2) may be formed with different thicknesses. In this case, the first magnetic layer (1262, MMP1) may be formed with a first thickness, and the second magnetic layer (1264, MMP2) may be formed with a second thickness that is thinner than the first thickness.

[0455] According to one embodiment, the first magnetic layer portion (12621) and the second magnetic layer portion (12622) of the first magnetic layer (1262, MMP1) may be spaced apart from each other by a first gap (w1). For example, the first gap (w1) between the first magnetic portion (12621) and the second magnetic portion (12622) may be 8 mm to 30 mm. For example, the first gap (w1) between the first magnetic portion (12621) and the second magnetic portion (12622) may be substantially the same as the second gap (w2) between the first conductive layer portion (12631) and the second conductive layer portion (12631). For example, the first gap (w1) between the first magnetic portion (12621) and the second magnetic portion (12622) may be smaller than the second gap (w2) between the first conductive layer portion (12631) and the second conductive layer portion (12631). Without being limited thereto, the first gap (w1) between the first magnetic portion (12621) and the second magnetic portion (12622) may be larger than the second gap (w2) between the first conductive layer portion (12631) and the second conductive layer portion (12631).

[0456] According to one embodiment, a portion of the conductive layer (1263) (e.g., conductive plate) may be removed to improve the bending characteristics of the electronic device (1200). For example, a portion of a first conductive layer portion (12631) of the conductive layer (12633) (e.g., conductive plate) may be removed, and a portion of a second conductive layer portion (12632) may be removed, such that the first conductive layer portion (12631) and the second conductive layer portion (12632) may be spaced apart from each other by a second gap (w2). For example, a portion of the conductive layer (1263) (e.g., conductive plate) corresponding to a bending region may be removed. For example, the second gap (w2) between the first conductive layer portion (12631) and the second conductive layer portion (12632) may be 10 mm to 30 mm.

[0457] For example, the second gap (w2) between the first conductive layer portion (12631) and the second conductive layer portion (12632) may be substantially the same as the first gap (w1) between the first magnetic portion (12621) and the second magnetic portion (12622). For example, the second gap (w2) between the first conductive layer portion (12631) and the second conductive layer portion (12632) may be greater than the first gap (w1) between the first magnetic portion (12621) and the second magnetic portion (12622). Without being limited thereto, the second gap (w2) between the first conductive layer portion (12631) and the second conductive layer portion (12632) may be smaller than the first gap (w1) between the first magnetic portion (12621) and the second magnetic portion (12622).

[0458] For example, the hinge plate (880) may be formed to have a width that is substantially the same as the first gap (w1) or greater than the first gap (w1) so as to substantially cover the first gap (w1).

[0459] For example, the hinge plate (880) may be formed to have a width that is substantially the same as the second gap (w2) or greater than the second gap (w2) so as to substantially cover the second gap (w2).

[0460] According to one embodiment, the first magnetic layer (1262, MMP1) may be formed to have a first performance coefficient. For example, the first magnetic layer (1262, MMP1) may be formed to have a first thickness and a material having a first permeability, thereby having the first performance coefficient. For example, the first magnetic layer (1262, MMP1) may be formed to have a thickness of 30 μm to 60 μm. For example, the permeability of the first magnetic layer (1262, MMP1) may be approximately 95 u'.

[0461] In one embodiment, the second magnetic layer (1264, MMP2) may be formed to have a second coefficient of performance lower than the first coefficient of performance. For example, the second magnetic layer (1264, MMP2) may be formed to have a second thickness thinner than the first thickness and a second coefficient of performance lower than the first coefficient of performance.

[0462] For example, the second magnetic layer (1264, MMP2) may be formed to a thickness of 20 μm to 30 μm. For example, the second magnetic layer (1264, MMP2) may have a lower permeability (e.g., about 95 u') than the permeability of the first magnetic layer (1262, MMP1). For example, the permeability of the second magnetic layer (1264, MMP2) may be about 60 u'.

[0463] For example, the second magnetic layer (1264, MMP2) may be formed of a material having a second permeability lower than the first permeability and may be formed to have a thickness substantially the same as the first thickness, thereby having a second performance coefficient. For example, the second magnetic layer (1264, MMP2) may be formed of a material having a first permeability and may be formed to have a second thickness thinner than the first thickness, thereby having a second performance coefficient.

[0464] For example, the second magnetic layer (1264, MMP2) may be formed of a material having a second permeability lower than the first permeability of the first magnetic layer (1262, MMP1) and may be formed to have a second thickness thinner than the first thickness of the first magnetic layer (1262, MMP1) to have a second performance coefficient.

[0465] According to one embodiment, a lattice portion (622) (e.g., a lattice portion) may be positioned in a portion corresponding to a banding area (670). For example, the lattice portion (622) (e.g., a lattice portion) may be positioned to overlap the banding area (670).

[0466] According to one embodiment, at least a portion of the second magnetic layer (1264, MMP2) may be positioned to overlap the lattice portion (622) (e.g., the lattice region). For example, the second magnetic layer (1264, MMP2) may be positioned to overlap the entire lattice portion (622) (e.g., the lattice region).

[0467] According to one embodiment, the first magnetic layer (1262) and the lattice portion (622) (e.g., the lattice region) may be arranged so as not to overlap.

[0468] The digitizer (1260) of the present disclosure can be applied not only to foldable electronic devices but also to slideable electronic devices or rollable electronic devices. Although the present disclosure exemplifies a foldable electronic device capable of being folded inward, the electronic device (1200) according to the present disclosure is not limited to a foldable electronic device capable of being folded inward. For example, the electronic device (1200) according to the present disclosure may include a foldable electronic device including a display capable of being folded outward. The electronic device (1200) according to the present disclosure may include a multi-foldable electronic device including a display capable of being folded inward and outward multiple times. For example, the electronic device (1200) according to the present disclosure may include various electronic devices including a flexible display in which some areas (e.g., a bending area or a folding area) are bendable or rollable, such as an electronic device that is expandable through sliding movement between housings.

[0469] An electronic device (1200) according to one embodiment of the present disclosure may have a second magnetic layer (1264) disposed to overlap with a hinge plate (880). The second magnetic layer (1264, MMP2) may be disposed at a portion corresponding to the bending region to prevent (or compensate for) a degradation of characteristics in the bending region (670) due to removal of a portion of the conductive layer (1263) (e.g., conductive plate).

[0470] With respect to FIGS. 12 and 13 , a portion of the magnetic layer around the hinge axis (i.e., within the bend region (670)) may be replaced with a portion (MMP2 (12641, 12642)) having lower magnetic performance (e.g., thinner or lower permeability) to reduce the adverse effects of removing the conductive layer around the hinge axis from the perspective of electronic pen detection. Additionally, positioning the MMP2 portion (12641, 12642) away from the display may reduce the possibility of the magnetic layer around the hinge axis folding and protruding during folding, thereby damaging the display. These beneficial effects may be achieved through any combination of the relative thicknesses and overlaps of the aforementioned flexible printed circuit board layer (1261), conductive layer (1263), and magnetic layers (1262, 12641, 12642, 1265).

[0471] FIG. 14 is a drawing showing an electronic device according to an embodiment of the present disclosure, showing an unfolded state of the electronic device. FIG. 15 is a drawing showing a folded state of the electronic device illustrated in FIG. 14.

[0472] The electronic device (1400) of FIG. 14 may be at least partially similar to the electronic device (1000) of FIG. 10, or may further include other embodiments of the electronic device. In describing the electronic device (1400) of FIGS. 14 and 15, a detailed description of a configuration substantially the same as (or similar to) the electronic device (1000) of FIG. 10 may be omitted.

[0473] Referring to FIGS. 14 and 15, an electronic device (1400) according to an embodiment of the present disclosure (e.g., the electronic device (101) of FIG. 1, the electronic device (200) of FIG. 2A, and the electronic device (300) of FIG. 3A) may include a display module (1401), a bracket (650), a magnetic component (651), a digitizer (1460), a hinge plate (880), a hinge structure (690), and a hinge cover (695). For example, the display module (1401) may include a display (610) (e.g., a flexible display) (e.g., the first display (230) of FIG. 2A, the flexible display (330) of FIG. 3A, the display (410) of FIG. 4), a flexible plate (620) (e.g., a display support member, a lattice support member, a lattice plate), a flexible circuit board (630, FPCB: flexible printed circuit board), and a printed circuit board (640, PCB: printed circuit board).

[0474] For example, if the hinge structure (690) is magnetic, a shielding member may be further placed between the hinge structure (690) and the digitizer (1460). If the hinge structure (690) is magnetic, the hinge structure (690) may include stainless steel having magnetism.

[0475] For example, the bracket (650) may be adhered (or attached) to at least a portion of the display module (1401) through an adhesive material or the like to support the display module (1401). The bracket (650) may include a recess that can accommodate at least a portion of the display module (1401) (e.g., a printed circuit board (640)).

[0476] For example, a display (610) (e.g., a flexible display) may be electrically connected to a printed circuit board (640, PCB) via a flexible circuit board (630, FPCB).

[0477] For example, the digitizer (1460) can be electrically connected to a digitizer drive unit (e.g., the digitizer drive unit (470) of FIG. 4) through a flexible circuit board.

[0478] For example, the printed circuit board (640, PCB) may include a processor (e.g., processor (120) of FIG. 1), memory (e.g., memory (130) of FIG. 1), display driver IC (e.g., display driver IC (430) of FIG. 4), and digitizer driver (e.g., digitizer driver (470) of FIG. 4).

[0479] According to one embodiment, when the electronic device (1400) is folded, magnetic components (651) may be placed on both sides of the bracket (650) to secure the folded (e.g., folded) state. A groove or hole may be formed in at least a portion of both sides of the bracket (650), and the magnetic components (651) may be placed in the groove or hole formed on both sides.

[0480] According to one embodiment, the hinge plate (880) may include a first hinge plate portion (8801) connected to a first housing portion (e.g., the first housing (210) of FIG. 2A, the first housing (310) of FIG. 3A), and a second hinge plate portion (8802) connected to a second housing portion (e.g., the second housing (220) of FIG. 2A, the second housing (320) of FIG. 3A).

[0481] According to one embodiment, the hinge structure (690) may include a support member (1410) (e.g., a center-bar) disposed between a first hinge plate portion (8801) and a second hinge plate portion (8802) along the folding axis (F). For example, the support member (1410) (e.g., a center-bar) may be disposed between the first hinge plate portion (8801) and the second hinge plate portion (8802).

[0482] According to one embodiment, a hinge plate (880), a hinge structure (690), and a support member (1610) (e.g., a setter bar) may be arranged to correspond to a banding area (670). The hinge structure (690) and the support member (1610) may be covered from the outside by a hinge cover (695). For example, the electronic device (1400) may be folded and unfolded in an in-folding manner and / or an out-folding manner by the hinge structure (690).

[0483] According to one embodiment, the hinge cover (695) can be bonded (or attached) to at least a portion of the hinge structure (690) to support the hinge structure (690).

[0484] According to one embodiment, the hinge plate (880) may be positioned adjacent to or connected to both sides of the bracket (650) so that it can slide as the electronic device (1400) is folded or unfolded.

[0485] According to one embodiment, the hinge structure (690) may be connected to both sides of the bracket (650) through fixed members (not shown) or may be connected through other rotating members (not shown).

[0486] For example, if the hinge structure (690) has magnetism, a shielding member may be further placed between the hinge structure (690) and the digitizer (1460).

[0487] According to one embodiment, a digitizer (1460) may be placed on the lower portion of a flexible plate (620) (e.g., a lattice plate).

[0488] For example, to enable smooth folding and unfolding of the electronic device (1400), at least some components of the digitizer (1460) may be separated from each other with respect to the folding axis (F). For example, to enable smooth folding and unfolding of the electronic device (1400), the digitizer (1460) may include a first digitizer portion (1467) and a second digitizer portion (1468) that are separated from each other with respect to the folding axis (F).

[0489] According to one embodiment, the digitizer (1460) may include a flexible circuit board layer (1461) including a coil array, a first magnetic layer (1462, MMP1), a conductive layer (1463) (e.g., a conductive plate), and a second magnetic layer (1464, MMP2).

[0490] According to one embodiment, when the electronic device (1400) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., a flexible display), a first magnetic layer (1462, MMP1) may be disposed between the flexible circuit board layer (1461) and the conductive layer (1463) (e.g., a conductive plate).

[0491] According to one embodiment, when the electronic device (1400) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., a flexible display), a second magnetic layer (1464, MMP2) may be disposed between the flexible circuit board layer (1461) and the hinge plate (880).

[0492] For example, a first magnetic layer (1462, MMP1) may be disposed under a flexible circuit board layer (1461). The first magnetic layer (1462, MMP1) may be disposed to overlap at least a portion of the flexible circuit board layer (1461).

[0493] For example, a second magnetic layer (1464, MMP2) may be disposed under a flexible circuit board layer (1461). The second magnetic layer (1464, MMP2) may be disposed to overlap at least a portion of the flexible circuit board layer (1461).

[0494] According to one embodiment, the first magnetic layer (1462, MMP1) and the second magnetic layer (1464, MMP2) may be arranged in parallel on the lower side of the flexible circuit board layer (1461).

[0495] According to one embodiment, a conductive layer (1463) (e.g., a conductive plate) may be disposed under a first magnetic layer (1462, MMP1). The conductive layer (1463) (e.g., a conductive plate) may be disposed to overlap the first magnetic layer (1462, MMP1). For example, when the electronic device (1400) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., a flexible display), the first magnetic layer (1462, MMP1) and the conductive layer (1463) (e.g., a conductive plate) may be disposed to substantially overlap.

[0496] According to one embodiment, when the electronic device (1400) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., a flexible display), the first magnetic layer (1462, MMP1) and the second magnetic layer (1464, MMP2) may be arranged so as not to overlap.

[0497] According to one embodiment, the conductive layer (1463) (e.g., conductive plate) may be positioned so as not to overlap with the second magnetic layer (1464, MMP2). For example, the conductive layer (1463) (e.g., conductive plate) may be formed of a conductive metal material (e.g., aluminum, stainless steel, copper alloy).

[0498] For example, the first magnetic layer (1462, MMP1) and the second magnetic layer (1464, MMP2) can be formed with substantially the same thickness.

[0499] Not limited thereto, the first magnetic layer (1462, MMP1) and the second magnetic layer (1464, MMP2) may be formed with different thicknesses. In this case, the first magnetic layer (1462, MMP1) may be formed with a first thickness, and the second magnetic layer (1464, MMP2) may be formed with a second thickness that is thinner than the first thickness.

[0500] According to one embodiment, the flexible circuit board layer (1461) may not be separated and may be formed as a single substrate.

[0501] According to one embodiment, the first magnetic layer (1462, MMP1) can be separated.

[0502] In one embodiment, the conductive layer (1463) (e.g., conductive plate) may be separated.

[0503] According to one embodiment, the second magnetic layer (1464, MMP2) may be formed as a single layer (e.g., a single continuous layer) without being separated.

[0504] According to one embodiment, the flexible circuit board layer (1461) can be separated in the banding region (670), and the second magnetic layer (MMP2) (1464) can be formed as a single layer without being separated.

[0505] According to one embodiment, the first magnetic layer (1462, MMP1) may include a first magnetic portion (14621) and a second magnetic portion (14622) spaced apart from each other along the folding axis (F). For example, the first magnetic portion (14621) and the second magnetic portion (14622) may be spaced apart from each other by a first gap (w1) (e.g., a gap distance). For example, the first gap (w1) between the first magnetic portion (14621) and the second magnetic portion (14622) may be 8 mm to 30 mm.

[0506] For example, the first gap (w1) between the first magnetic portion (14621) and the second magnetic portion (14622) may be substantially the same as the second gap (w2) between the first conductive layer portion (14631) and the second conductive layer portion (14631). For example, the first gap (w1) between the first magnetic portion (14621) and the second magnetic portion (14622) may be smaller than the second gap (w2) between the first conductive layer portion (14631) and the second conductive layer portion (14631). Without being limited thereto, the first gap (w1) between the first magnetic portion (14621) and the second magnetic portion (14622) may be larger than the second gap (w2) between the first conductive layer portion (14631) and the second conductive layer portion (14631).

[0507] According to one embodiment, in a direction parallel to the first magnetic layer (1462, MMP1), the second magnetic layer (1464, MMP2) may be disposed between the first magnetic portion (14621) and the second magnetic portion (14622).

[0508] According to one embodiment, a portion of the conductive layer (1463) (e.g., conductive plate) may be removed to improve the bending characteristics of the electronic device (1400). For example, a portion of a first conductive layer portion (14631) of the conductive layer (14633) (e.g., conductive plate) may be removed, and a portion of a second conductive layer portion (14632) may be removed, such that the first conductive layer portion (14631) and the second conductive layer portion (14632) may be spaced apart from each other by a second gap (w2). For example, the second gap (w2) between the first conductive layer portion (14631) and the second conductive layer portion (14631) may be 10 mm to 30 mm. For example, a portion of the conductive layer (1463) (e.g., conductive plate) corresponding to the bending region (670) may be removed.

[0509] For example, the second gap (w2) between the first conductive layer portion (14631) and the second conductive layer portion (14631) may be substantially the same as the first gap (w1) between the first magnetic portion (14621) and the second magnetic portion (14622). For example, the second gap (w2) between the first conductive layer portion (14631) and the second conductive layer portion (14631) may be greater than the first gap (w1) between the first magnetic portion (14621) and the second magnetic portion (14622). Without being limited thereto, the second gap (w2) between the first conductive layer portion (14631) and the second conductive layer portion (14631) may be smaller than the first gap (w1) between the first magnetic portion (14621) and the second magnetic portion (14622).

[0510] According to one embodiment, the second magnetic layer (1464, MMP2) may be formed to have a width substantially equal to the first gap (w1). For example, when the electronic device (1400) is unfolded, the first magnetic layer (1462, MMP1) and the second magnetic layer (1464, MMP2) may be arranged to contact each other.

[0511] For example, when the electronic device (1400) is folded, the first magnetic layer (1462, MMP1) and the second magnetic layer (1464, MMP2) may be spaced apart from each other.

[0512] According to one embodiment, a second magnetic layer (1464, MMP2) formed as a single layer may be placed so as to overlap a portion of the conductive layer (1463) (e.g., conductive plate) from which a portion has been removed.

[0513] For example, the second magnetic layer (1464, MMP2) may be formed as a single layer or may be formed separately.

[0514] For example, the hinge plate (880) may be formed to have a width that is substantially the same as the first gap (w1) or greater than the first gap (w1) so as to substantially cover the first gap (w1).

[0515] For example, the hinge plate (880) may be formed to have a width that is substantially the same as the second gap (w2) or greater than the second gap (w2) so as to substantially cover the second gap (w2).

[0516] According to one embodiment, the first magnetic layer (1462, MMP1) may be formed to have a first performance coefficient. For example, the first magnetic layer (1462, MMP1) may be formed to have a first thickness and a material having a first permeability, thereby having the first performance coefficient. For example, the first magnetic layer (1462, MMP1) may be formed to have a thickness of 30 μm to 60 μm. For example, the permeability of the first magnetic layer (1462, MMP1) may be approximately 95 u'.

[0517] According to one embodiment, the second magnetic layer (1464, MMP2) may be formed to have a second coefficient of performance lower than the first coefficient of performance. For example, the second magnetic layer (1464, MMP2) may be formed to have a second thickness thinner than the first thickness and made of a material having a second permeability lower than the first permeability, thereby having the second coefficient of performance. For example, the second magnetic layer (1464, MMP2) may be formed to have a first thickness and made of a material having a second permeability lower than the first permeability, thereby having the second coefficient of performance. For example, the second magnetic layer (1464, MMP2) may be formed to have a second thickness thinner than the first thickness and made of a material having a first permeability.

[0518] For example, the second magnetic layer (1464, MMP2) may be formed to a thickness of 20 μm to 30 μm. For example, the second magnetic layer (1464, MMP2) may have a lower permeability (e.g., about 95 u') than the permeability of the first magnetic layer (1462, MMP1). For example, the permeability of the second magnetic layer (1464, MMP2) may be about 60 u'.

[0519] When the electronic device (1400) is folded (e.g., folded), the display (610) (e.g., flexible display) can be smoothly folded and unfolded based on the folding axis (F), and the flexible plate (620) (e.g., lattice plate) can include a lattice portion (622) (e.g., lattice area) so that the display (610) (e.g., flexible display) can be supported.

[0520] According to one embodiment, a lattice portion (622) (e.g., a lattice portion) may be positioned in a portion corresponding to a banding area (670). For example, the lattice portion (622) (e.g., a lattice portion) may be positioned to overlap the banding area (670).

[0521] According to one embodiment, at least a portion of the second magnetic layer (1464, MMP2) may be positioned to overlap the lattice portion (622) (e.g., the lattice region). For example, the second magnetic layer (1464, MMP2) may be positioned to overlap the entire lattice portion (622) (e.g., the lattice region).

[0522] According to one embodiment, the first magnetic layer (1462) and the lattice portion (622) (e.g., the lattice region) may be arranged so as not to overlap.

[0523] The digitizer (1460) of the present disclosure can be applied not only to foldable electronic devices but also to slideable electronic devices or rollable electronic devices. Although the present disclosure exemplifies a foldable electronic device capable of being folded inward, the electronic device (1400) according to the present disclosure is not limited to a foldable electronic device capable of being folded inward. For example, the electronic device (1400) according to the present disclosure may include a foldable electronic device including a display capable of being folded outward. The electronic device (1400) according to the present disclosure may include a multi-foldable electronic device including a display capable of being folded inward and outward multiple times. For example, the electronic device (1400) according to the present disclosure may include various electronic devices including a flexible display in which some areas (e.g., a bending area or a folding area) are bendable or rollable, such as an electronic device that is expandable through sliding movement between housings.

[0524] An electronic device (1400) according to one embodiment of the present disclosure may have a second magnetic layer (1464, MMP2) disposed in a portion corresponding to a bending region (670) to prevent (or compensate for) a degradation of characteristics in the bending region (670) due to removal of a portion of a conductive layer (1463) (e.g., a conductive plate).

[0525] FIG. 16 is a drawing showing a multi-foldable electronic device according to an embodiment of the present disclosure, showing an unfolded state of the multi-foldable electronic device.

[0526] The multi-foldable electronic device (1600) of FIG. 16 may be at least partially similar to the electronic device (1000) of FIG. 10, or may further include other embodiments of the electronic device. In describing the electronic device (1600) of FIG. 16, a detailed description of a configuration substantially the same as (or similar to) the electronic device (1000) of FIG. 10 may be omitted.

[0527] Referring to FIG. 16, a multi-foldable electronic device (1600) according to an embodiment of the present disclosure (e.g., the electronic device (101) of FIG. 1, the electronic device (200) of FIG. 2A, and the electronic device (300) of FIG. 3A) may include a display module (1601), a bracket (1650), a digitizer (1660), a first hinge portion (1630), and a second hinge portion (1640).

[0528] For example, the display module (1001) may include a display (610) (e.g., a flexible display) (e.g., the first display (230) of FIG. 2A, the flexible display (330) of FIG. 3A, the display (410) of FIG. 4), a flexible plate (620) (e.g., a display support member, a lattice support member, a lattice plate), a flexible circuit board (630, FPCB: flexible printed circuit board), and a printed circuit board (640, PCB: printed circuit board).

[0529] According to one embodiment, the multi-foldable electronic device (1600) can be folded into a multi-foldable form through a first hinge portion (1630) and a second hinge portion (1640). For example, the first hinge portion (1630) can include a first hinge plate (1631), a first hinge structure (1632), and a first hinge cover (1633). For example, the second hinge portion (1640) can include a second hinge plate (1641), a second hinge structure (1642), and a second hinge cover (1643).

[0530] For example, when the first hinge structure (1632) and the second hinge structure (1642) have magnetism, a shielding member may be further disposed between the first hinge structure (1632) and the second hinge structure (1642) and the digitizer (1660). When the first hinge structure (1632) and the second hinge structure (1642) have magnetism, the first hinge structure (1632) and the second hinge structure (1642) may include stainless steel having magnetism.

[0531] For example, the bracket (1650) may be adhered (or attached) to at least a portion of the display module (1601) via an adhesive material or the like to support the display module (1601). The bracket (1650) may include a recess that may accommodate at least a portion of the display module (1601) (e.g., a printed circuit board (640)).

[0532] For example, a display (610) (e.g., a flexible display) may be electrically connected to a printed circuit board (640, PCB) via a flexible circuit board (630, FPCB).

[0533] For example, the digitizer (1660) may be electrically connected to a digitizer drive unit (e.g., the digitizer drive unit (470) of FIG. 4) via a flexible circuit board.

[0534] For example, the printed circuit board (640, PCB) may include a processor (e.g., processor (120) of FIG. 1), memory (e.g., memory (130) of FIG. 1), display driver IC (e.g., display driver IC (430) of FIG. 4), and digitizer driver (e.g., digitizer driver (470) of FIG. 4).

[0535] According to one embodiment, a digitizer (1660) may be placed on the lower portion of a flexible plate (620) (e.g., a lattice plate).

[0536] For example, to enable smooth folding and unfolding of the multi-foldable electronic device (1600), at least some components of the digitizer (1660) may be separated from each other with respect to the folding axis (F).

[0537] According to one embodiment, the digitizer (1660) may include a flexible circuit board layer (1661) including a coil array, a first magnetic layer (1662, MMP1), a conductive layer (1663) (e.g., a conductive plate), and a second magnetic layer (1664, MMP2).

[0538] According to one embodiment, when the multi-foldable electronic device (1600) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., a flexible display), a first magnetic layer (1662, MMP1) and a second magnetic layer (1664, MMP2) may be disposed between the flexible circuit board layer (1661) and the conductive layer (1463) (e.g., a conductive plate).

[0539] For example, a first magnetic layer (1662, MMP1) may be disposed under a flexible circuit board layer (1661). The first magnetic layer (1662, MMP1) may be disposed to overlap at least a portion of the flexible circuit board layer (1661).

[0540] For example, a second magnetic layer (1664, MMP2) may be disposed under a flexible circuit board layer (1661). The second magnetic layer (1664, MMP2) may be disposed to overlap at least a portion of the flexible circuit board layer (1661).

[0541] According to one embodiment, the first magnetic layer (1662, MMP1) and the second magnetic layer (1664, MMP2) may be arranged in parallel on the lower side of the flexible circuit board layer (1661).

[0542] According to one embodiment, a conductive layer (1663) (e.g., a conductive plate) may be disposed under a first magnetic layer (1662, MMP1). The conductive layer (1663) (e.g., a conductive plate) may be disposed to overlap with the first magnetic layer (1662, MMP1). For example, when the multi-foldable electronic device (1600) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., a flexible display), the first magnetic layer (1662, MMP1) and the conductive layer (1663) (e.g., a conductive plate) may be disposed to substantially overlap.

[0543] According to one embodiment, when the multi-foldable electronic device (1600) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., a flexible display), the first magnetic layer (1662, MMP1) and the second magnetic layer (1664, MMP2) may be arranged so as not to overlap.

[0544] According to one embodiment, the first magnetic layer (1662, MMP1) may include a first magnetic portion (16621), a second magnetic portion (16622), and a third magnetic portion (16623).

[0545] According to one embodiment, the second magnetic layer (1664, MMP2) may include a fourth magnetic portion (16641) and a fifth magnetic portion (16642).

[0546] For example, a fourth magnetic portion (16641) of a second magnetic layer (1664, MMP2) may be placed between a first magnetic portion (16621) and a second magnetic portion (16622) of a first magnetic layer (1662, MMP1).

[0547] For example, a fifth magnetic portion (16642) of a second magnetic layer (1664, MMP2) may be placed between a second magnetic portion (16622) and a third magnetic portion (16623) of a first magnetic layer (1662, MMP1).

[0548] According to one embodiment, the first magnetic portion (16621), the second magnetic portion (16622), and the third magnetic portion (16623) of the first magnetic layer (1662, MMP1) and the conductive layer (1663) (e.g., a conductive plate) may be arranged to overlap each other.

[0549] According to one embodiment, the conductive layer (1663) (e.g., conductive plate) may be positioned so as not to overlap the second magnetic layer (1664, MMP2).

[0550] For example, the first magnetic layer (1662, MMP1) and the second magnetic layer (1664, MMP2) can be formed with substantially the same thickness.

[0551] Not limited thereto, the first magnetic layer (1662, MMP1) and the second magnetic layer (1664, MMP2) may be formed with different thicknesses. In this case, the first magnetic layer (1662, MMP1) may be formed with a first thickness, and the second magnetic layer (1664, MMP2) may be formed with a second thickness that is thinner than the first thickness.

[0552] According to one embodiment, the flexible circuit board layer (1661) may not be separated and may be formed as a single substrate.

[0553] According to one embodiment, the first magnetic layer (1662, MMP1) may be formed to have a first coefficient of performance. For example, the first magnetic layer (1662, MMP1) may be formed to have a first thickness and a material having a first permeability, thereby having a first coefficient of performance.

[0554] According to one embodiment, the second magnetic layer (1664, MMP2) may be formed to have a second coefficient of performance lower than the first coefficient of performance. For example, the second magnetic layer (1664, MMP2) may be formed to have a second thickness thinner than the first thickness and made of a material having a second permeability lower than the first permeability, thereby having the second coefficient of performance. For example, the second magnetic layer (1664, MMP2) may be formed to have a first thickness and made of a material having a second permeability lower than the first permeability, thereby having the second coefficient of performance. For example, the second magnetic layer (1664, MMP2) may be formed to have a second thickness thinner than the first thickness and made of a material having a first permeability.

[0555] For example, the first magnetic layer (1662, MMP1) may be formed to a thickness of 30 μm to 60 μm. For example, the permeability of the first magnetic layer (1662, MMP1) may be approximately 95 u'.

[0556] For example, the second magnetic layer (1664, MMP2) may be formed to a thickness of 20 μm to 30 μm. For example, the second magnetic layer (1664, MMP2) may have a lower permeability (e.g., about 95 u') than the permeability of the first magnetic layer (1662, MMP1). For example, the permeability of the second magnetic layer (1664, MMP2) may be about 60 u'.

[0557] When the multi-foldable electronic device (1600) is folded (e.g., folded), the display (610) (e.g., flexible display) can be folded and unfolded smoothly, and the flexible plate (620) (e.g., lattice plate) can include a plurality of lattice portions (622) (e.g., lattice areas) so that the display (610) (e.g., flexible display) can be supported.

[0558] According to one embodiment, a lattice portion (622) (e.g., a lattice portion) may be positioned in a portion corresponding to the banding area. For example, the lattice portion (622) (e.g., a lattice portion) may be positioned to overlap the banding area.

[0559] According to one embodiment, at least a portion of the second magnetic layer (1664, MMP2) may be positioned to overlap the lattice portion (622) (e.g., the lattice region). For example, the second magnetic layer (1664, MMP2) may be positioned to overlap the entire lattice portion (622) (e.g., the lattice region).

[0560] According to one embodiment, the first magnetic layer (1662) and the lattice portion (622) (e.g., the lattice region) may be arranged so as not to overlap.

[0561] The digitizer (1660) of the present disclosure can be applied not only to foldable electronic devices, but also to slideable electronic devices or rollable electronic devices. The electronic device (1600) according to the present disclosure can include a multi-foldable electronic device including a display capable of multiple in-out folding. For example, the electronic device (1600) according to the present disclosure can include various electronic devices including a flexible display in which some areas (e.g., a bending area or a folding area) are bendable or rollable, such as an electronic device that is expandable through sliding movement between housings.

[0562] An electronic device (1600) according to one embodiment of the present disclosure may have a second magnetic layer (1664, MMP2) disposed in a portion corresponding to a bending region to prevent (or compensate for) a degradation of characteristics in the bending region due to removal of a portion of a conductive layer (1663) (e.g., a conductive plate).

[0563] Although each hinge portion (1630 and 1640) has been described individually, each may be formed according to any hinge of FIGS. 6 to 15, and the advantages of the embodiments may be equally applied.

[0564] FIG. 17 is a drawing showing an electronic device according to an embodiment of the present disclosure, showing an unfolded state of the electronic device.

[0565] The electronic device (1700) of FIG. 17 may be at least partially similar to the electronic device (1000) of FIG. 10, or may further include other embodiments of the electronic device. In describing the electronic device (1700) of FIG. 17, a detailed description of a configuration substantially the same as (or similar to) the electronic device (1000) of FIG. 10 may be omitted.

[0566] Referring to FIG. 17, an electronic device (1700) according to an embodiment of the present disclosure (e.g., the electronic device (101) of FIG. 1, the electronic device (200) of FIG. 2A, and the electronic device (300) of FIG. 3A) may include a display module (1701), a bracket (650), a magnetic component (651), a digitizer (1760), a second conductive layer (1765), a hinge plate (880), a hinge structure (690), and a hinge cover (695). For example, the display module (1701) may include a display (610) (e.g., a flexible display) (e.g., the first display (230) of FIG. 2A, the flexible display (330) of FIG. 3A, the display (410) of FIG. 4), a flexible plate (620) (e.g., a display support member, a lattice support member, a lattice plate), a flexible circuit board (630, FPCB: flexible printed circuit board), and a printed circuit board (640, PCB: printed circuit board).

[0567] For example, the digitizer (1760) and the second conductive layer (1765) can be integrated and arranged.

[0568] For example, the digitizer (1760) and the second conductive layer (1765) can be formed and placed separately.

[0569] For example, if the hinge structure (690) is magnetic, a shielding member may be further placed between the hinge structure (690) and the digitizer (1760). If the hinge structure (690) is magnetic, the hinge structure (690) may include stainless steel having magnetism.

[0570] For example, the bracket (650) may be adhered (or attached) to at least a portion of the display module (1701) through an adhesive material or the like to support the display module (1701). The bracket (650) may include a recess that may accommodate at least a portion of the display module (1701) (e.g., a printed circuit board (640)).

[0571] For example, a display (610) (e.g., a flexible display) may be electrically connected to a printed circuit board (640, PCB) via a flexible circuit board (630, FPCB).

[0572] For example, the digitizer (1760) may be electrically connected to a digitizer drive unit (e.g., the digitizer drive unit (470) of FIG. 4) via a flexible circuit board.

[0573] For example, the printed circuit board (640, PCB) may include a processor (e.g., processor (120) of FIG. 1), memory (e.g., memory (130) of FIG. 1), display driver IC (e.g., display driver IC (430) of FIG. 4), and digitizer driver (e.g., digitizer driver (470) of FIG. 4).

[0574] According to one embodiment, when the electronic device (1700) is folded, magnetic components (651) may be placed on both sides of the bracket (650) to secure the folded (e.g., folded) state. A groove or hole may be formed in at least a portion of both sides of the bracket (650), and the magnetic components (651) may be placed in the groove or hole formed on both sides.

[0575] According to one embodiment, when the electronic device (1700) is folded, the hinge plate (880) may include a first hinge plate portion (e.g., the first hinge plate portion (8801) of FIG. 10) and a second hinge plate portion (e.g., the second hinge plate portion (8802) of FIG. 10) that are separated based on the folding axis (F).

[0576] According to one embodiment, a hinge plate (880) and a hinge structure (690) may be arranged to correspond to the banding area (670). The hinge structure (690) may be covered from the outside by a hinge cover (695). For example, the electronic device (1700) may be folded and unfolded in an in-folding manner and / or an out-folding manner by the hinge structure (690).

[0577] According to one embodiment, a digitizer (1760) and a second conductive layer (1765) may be disposed on the lower portion of a flexible plate (620) (e.g., a lattice plate).

[0578] For example, to facilitate smooth folding and unfolding of the electronic device (1700), at least some components of the digitizer (1760) may be separated from each other with respect to the folding axis (F).

[0579] For example, the second conductive layer (1765) may be arranged separately to enable smooth folding and unfolding of the electronic device (1700).

[0580] According to one embodiment, the digitizer (1760) may include a flexible circuit board layer (1761) including a coil array, a first magnetic layer (1762, MMP1), a first conductive layer (1763) (e.g., a conductive plate), and a second magnetic layer (1764, MMP2).

[0581] According to one embodiment, when the electronic device (1700) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., a flexible display), a first magnetic layer (1762, MMP1) may be disposed between the flexible circuit board layer (1761) and the first conductive layer (1763) (e.g., a conductive plate).

[0582] According to one embodiment, when the electronic device (1700) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., a flexible display), a second conductive layer (1765) may be disposed between the second magnetic layer (1764, MMP2) and the hinge plate (880).

[0583] For example, a first magnetic layer (1762, MMP1) may be disposed under a flexible circuit board layer (1761). The first magnetic layer (1762, MMP1) may be disposed to overlap at least a portion of the flexible circuit board layer (1761) (e.g., coil array layer).

[0584] For example, a second magnetic layer (1764, MMP2) may be disposed under a flexible circuit board layer (1761). The second magnetic layer (1764, MMP2) may be disposed to overlap at least a portion of the flexible circuit board layer (1761).

[0585] According to one embodiment, the first magnetic layer (1762, MMP1) and the second magnetic layer (1764, MMP2) may be arranged in parallel on the lower side of the flexible circuit board layer (1761).

[0586] According to one embodiment, a first conductive layer (1763) (e.g., a conductive plate) may be disposed under a first magnetic layer (1762, MMP1). The first conductive layer (1763) (e.g., a conductive plate) may be disposed to overlap the first magnetic layer (1762, MMP1). For example, when the electronic device (1700) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., a flexible display), the first magnetic layer (1762, MMP1) and the first conductive layer (1763) (e.g., a conductive plate) may be disposed to substantially overlap.

[0587] According to one embodiment, when the electronic device (1700) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., a flexible display), the first magnetic layer (1762, MMP1) and the second magnetic layer (1764, MMP2) may be arranged so as not to overlap.

[0588] According to one embodiment, the first conductive layer (1763) (e.g., conductive plate) may be positioned so as not to overlap the second magnetic layer (1764, MMP2).

[0589] For example, the second conductive layer (1765) and the second magnetic layer (1764, MMP2) may be formed to have substantially the same width. However, the second conductive layer (1765) may be formed to have a width wider than the width of the second magnetic layer (1764, MMP2).

[0590] According to one embodiment, the first magnetic layer (1762, MMP1) may include a first magnetic portion and a second magnetic portion that are spaced apart from each other along the folding axis (F). In a direction parallel to the first magnetic layer (1762, MMP1), the second magnetic layer (1764, MMP2) may be disposed between the first magnetic portion and the second magnetic portion of the first magnetic layer (1762, MMP1).

[0591] For example, the first magnetic layer (1762, MMP1) and the second magnetic layer (1764, MMP2) can be formed with substantially the same thickness.

[0592] Not limited thereto, the first magnetic layer (1762, MMP1) and the second magnetic layer (1764, MMP2) may be formed with different thicknesses. In this case, the first magnetic layer (1762, MMP1) may be formed with a first thickness, and the second magnetic layer (1764, MMP2) may be formed with a second thickness that is thinner than the first thickness.

[0593] According to one embodiment, the flexible circuit board layer (1761) may be arranged separately. For example, the flexible circuit board layer (1761) may include a first flexible circuit board portion (17611) and a second flexible circuit board portion (17612). The first flexible circuit board portion (17611) and the second flexible circuit board portion (17612) may be arranged to be spaced apart from each other by a first gap (w1) (e.g., a gap distance). For example, the first gap (w1) between the first flexible circuit board portion (17611) and the second flexible circuit board portion (17612) may be 0 to 3 mm. For example, when the first flexible circuit board portion (17611) and the second flexible circuit board portion (17612) are arranged to be in contact with each other, the first gap (w1) between the first flexible circuit board portion (17611) and the second flexible circuit board portion (17612) can be substantially '0'. For example, when the first flexible circuit board portion (17611) and the second flexible circuit board portion (17612) are separated, the first gap (w1) between the first flexible circuit board portion (17611) and the second flexible circuit board portion (17612) can be 3 mm or less.

[0594] For example, the first gap (w1) between the first flexible circuit board portion (17611) and the second flexible circuit board portion (17612) may be substantially the same as the gap between the third magnetic layer portion (17641) and the fourth magnetic layer portion (17642). For example, the first gap (w1) between the first flexible circuit board portion (17611) and the second flexible circuit board portion (17612) may be smaller than the gap between the third magnetic layer portion (17641) and the fourth magnetic layer portion (17642). Without being limited thereto, the first gap (w1) between the first flexible circuit board portion (17611) and the second flexible circuit board portion (17612) may be larger than the gap between the third magnetic layer portion (17641) and the fourth magnetic layer portion (17642).

[0595] For example, the first gap (w1) between the first flexible circuit board portion (17611) and the second flexible circuit board portion (17612) may be 8 mm to 12 mm. When the first gap (w1) between the first flexible circuit board portion (17611) and the second flexible circuit board portion (17612) is formed to be 8 mm to 12 mm, the first gap (w1) between the first flexible circuit board portion (17611) and the second flexible circuit board portion (17612) may be substantially the same as the second gap (w2) between the first conductive layer portion (17631) and the second conductive layer portion (17632). For example, the first gap (w1) between the first flexible circuit board portion (17611) and the second flexible circuit board portion (17612) may be smaller than the second gap (w2) between the first conductive layer portion (17631) and the second conductive layer portion (17632). Without being limited thereto, the first gap (w1) between the first flexible circuit board portion (17611) and the second flexible circuit board portion (17612) may be larger than the second gap (w2) between the first conductive layer portion (17631) and the second conductive layer portion (17632).

[0596] Not limited thereto, the flexible circuit board layer (1761) may not be separated and may be formed as a single board.

[0597] According to one embodiment, the first conductive layer (1763) (e.g., conductive plate) may include a first conductive layer portion (17631) and a second conductive layer portion (17632) that are spaced apart from each other. To improve the bending characteristics of the electronic device (1700), a portion of the first conductive layer (1763) (e.g., conductive plate) may be removed. For example, a portion of the first conductive layer portion (17631) of the first conductive layer (17633) (e.g., conductive plate) may be removed, and a portion of the second conductive layer portion (17632) may be removed, such that the first conductive layer portion (17631) and the second conductive layer portion (17632) may be spaced apart from each other by a second gap (w2). For example, a portion of the first conductive layer (1763) (e.g., conductive plate) corresponding to the bending region (670) may be removed.

[0598] According to one embodiment, the first magnetic layer (1762, MMP1) may include a first magnetic layer portion (17621) and a second magnetic layer portion (17622) that are spaced apart from each other. The first magnetic layer portion (17621) and the second magnetic layer portion (17622) of the first magnetic layer (17622, ​​MMP) may be spaced apart from each other by a second gap (w2). For example, the second gap (w2) may be 10 mm to 30 mm.

[0599] For example, the second spacing (w2) between the first magnetic layer portion (17621) and the second magnetic layer portion (17622) may be substantially the same as the second spacing (w2) between the first conductive layer portion (17631) and the second conductive layer portion (17632). However, the second spacing (w2) between the first magnetic layer portion (17621) and the second magnetic layer portion (17622) and the second spacing (w2) between the first conductive layer portion (17631) and the second conductive layer portion (17632) may be different from each other.

[0600] According to one embodiment, a second magnetic layer (1764, MMP2) may be positioned to overlap a portion of the first conductive layer (1763) (e.g., conductive plate) from which a portion has been removed.

[0601] According to one embodiment, a second magnetic layer (1764, MMP2) may be disposed between a first magnetic layer portion (17621) and a second magnetic layer portion (17622) of a first magnetic layer (1762, MMP). For example, the second magnetic layer (1764, MMP2) may include a third magnetic layer portion (17641) and a fourth magnetic layer portion (17642) that are separated based on the folding axis (F). For example, the third magnetic layer portion (17641) may be disposed adjacent to the first magnetic layer portion (17621). For example, the fourth magnetic layer portion (17642) may be disposed adjacent to the second magnetic layer portion (17622). For example, the third magnetic layer portion (17641) and the fourth magnetic layer portion (17642) can be arranged with a first gap (w1).

[0602] According to one embodiment, when the electronic device (1700) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., a flexible display), a second conductive layer (1765) may be disposed below the second magnetic layer (1764, MMP2). For example, the second conductive layer (1765) may be disposed to overlap the second magnetic layer (1764, MMP2).

[0603] According to one embodiment, the first magnetic layer (1762, MMP1) may be formed to have a first coefficient of performance. For example, the first magnetic layer (1762, MMP1) may be formed to have a first thickness and a material having a first permeability, thereby having a first coefficient of performance.

[0604] In one embodiment, the second magnetic layer (1764, MMP2) may be formed to have a second coefficient of performance lower than the first coefficient of performance. For example, the second magnetic layer (1764, MMP2) may be formed to have a second thickness thinner than the first thickness and made of a material having a second permeability lower than the first permeability, thereby having the second coefficient of performance. For example, the second magnetic layer (1764, MMP2) may be formed to have a first thickness and made of a material having a second permeability lower than the first permeability, thereby having the second coefficient of performance. For example, the second magnetic layer (1764, MMP2) may be formed to have a second thickness thinner than the first thickness and made of a material having a first permeability.

[0605] For example, the first magnetic layer (1762, MMP1) may be formed to a thickness of 30 μm to 60 μm. For example, the permeability of the first magnetic layer (1762, MMP1) may be approximately 95 u'.

[0606] For example, the second magnetic layer (1764, MMP2) may be formed to a thickness of 20 μm to 30 μm. For example, the second magnetic layer (1764, MMP2) may have a lower permeability (e.g., about 95 u') than the permeability of the first magnetic layer (1762, MMP1). For example, the permeability of the second magnetic layer (1764, MMP2) may be about 60 u'.

[0607] In order to prevent uneven signal distribution from occurring in the banding region (670), the second permeability of the second magnetic layer (1764, MMP2) may be formed to be lower than the first permeability of the first magnetic layer (1762, MMP1), and the second conductive layer (1765) may be placed under the second magnetic layer (1764, MMP2).

[0608] According to one embodiment, the second conductive layer (1765) is disposed between the second magnetic layer (1764) and the hinge plate (880) and may have a different conductivity than the first conductive layer (1763).

[0609] For example, the second conductive layer (1765) may include a second material having lower conductivity than the first material included in the first conductive layer (1763).

[0610] For example, the second conductive layer (1765) can be formed to have substantially the same thickness as the first conductive layer (1763).

[0611] For example, the second conductive layer (1765) may be formed to a thickness thinner than the thickness of the first conductive layer (1763).

[0612] According to one embodiment, the first conductive layer (1763) and the second conductive layer (1765) may be electrically connected. For example, the second conductive layer (1765) may be formed by patterning an extended portion of the first conductive layer (1763). For example, the second conductive layer (1765) may include a conductive pattern (1765a) formed of a conductive material and a space (1765b) formed of a conductive material and a non-conductive material. For example, since the second magnetic layer (1764, MMP2) has a lower second magnetic permeability than the first magnetic layer (1762, MMP1), the conductivity of the second conductive layer (1765) may be tuned in consideration of the signal strength and resonant frequency of the electronic pen (e.g., the electronic pen (500) of FIGS. 5A and 5B). For example, the conductivity of the second conductive layer (1765) and the conductivity of the digitizer (1760) can be tuned by adjusting the line width (w) of the conductive pattern (1765a) and the width (s) of the space (1765b).

[0613] When the electronic device (1700) is folded (e.g., folded), the display (610) (e.g., flexible display) can be smoothly folded and unfolded based on the folding axis (F), and the flexible plate (620) (e.g., lattice plate) can include a lattice portion (622) (e.g., lattice area) so that the display (610) (e.g., flexible display) can be supported.

[0614] According to one embodiment, a lattice portion (622) (e.g., a lattice portion) may be positioned in a portion corresponding to a banding area (670). For example, the lattice portion (622) (e.g., a lattice portion) may be positioned to overlap the banding area (670).

[0615] According to one embodiment, at least a portion of the second magnetic layer (1764, MMP2) may be positioned to overlap with the lattice portion (622) (e.g., the lattice region).

[0616] According to one embodiment, the first magnetic layer (1762) and the lattice portion (622) (e.g., the lattice region) may be positioned so as not to overlap.

[0617] The digitizer (1760) of the present disclosure can be applied not only to foldable electronic devices but also to slideable electronic devices or rollable electronic devices. Although the present disclosure exemplifies a foldable electronic device capable of being folded inward, the electronic device (1700) according to the present disclosure is not limited to a foldable electronic device capable of being folded inward. For example, the electronic device (1700) according to the present disclosure may include a foldable electronic device including a display capable of being folded outward. The electronic device (1700) according to the present disclosure may include a multi-foldable electronic device including a display capable of being folded inward and outward multiple times. For example, the electronic device (1700) according to the present disclosure may include various electronic devices including a flexible display in which some areas (e.g., a bending area or a folding area) are bendable or rollable, such as an electronic device that is expandable through sliding movement between housings.

[0618] An electronic device (1700) according to one embodiment of the present disclosure may have a second magnetic layer (1764, MMP2) and a second conductive layer (1765) disposed so as to overlap a portion of a first conductive layer (1763) (e.g., a conductive plate) from which a portion has been removed. The second magnetic layer (1764, MMP2) and the second conductive layer (1765) may be disposed in a portion corresponding to a bending region (670) to prevent (or compensate for) a degradation of characteristics in the bending region (670) due to the removal of a portion of the conductive layer (1763) (e.g., a conductive plate).

[0619] Additionally, the adjustable properties of the conductive layer (1765) may allow for more precise compensation of degradation compared to when only the second magnetic layer (MPP2, 1764) is applied. The use of the conductive layer (1765) of FIG. 17 may also be applied to the structures described with reference to FIGS. 6, 10, 14, and 16.

[0620] FIG. 18 is a drawing showing an electronic device according to an embodiment of the present disclosure, showing an unfolded state of the electronic device. FIG. 19 is a drawing showing a second conductive layer arranged to overlap a second magnetic layer.

[0621] The electronic device (1800) of FIG. 18 may be at least partially similar to the electronic device (1000) of FIG. 10, or may further include other embodiments of the electronic device. In describing the electronic device (1800) of FIG. 18, a detailed description of a configuration substantially the same (or similar) as the electronic device (1000) of FIG. 10 and the electronic device (1700) of FIG. 17 may be omitted.

[0622] Referring to FIGS. 18 and 19, an electronic device (1800) according to an embodiment of the present disclosure (e.g., the electronic device (101) of FIG. 1, the electronic device (200) of FIG. 2A, and the electronic device (300) of FIG. 3A) may include a display module (1801), a bracket (650), a magnetic component (651), a digitizer (1860), a second conductive layer (1865), a hinge plate (880), a hinge structure (690), and a hinge cover (695). For example, the display module (1801) may include a display (610) (e.g., a flexible display) (e.g., the first display (230) of FIG. 2A, the flexible display (330) of FIG. 3A, the display (410) of FIG. 4), a flexible plate (620) (e.g., a display support member, a lattice support member, a lattice plate), a flexible circuit board (630, FPCB: flexible printed circuit board), and a printed circuit board (640, PCB: printed circuit board).

[0623] For example, the digitizer (1860) and the second conductive layer (1865) can be formed and placed separately.

[0624] For example, if the hinge structure (690) is magnetic, a shielding member may be further placed between the hinge structure (690) and the digitizer (1860). If the hinge structure (690) is magnetic, the hinge structure (690) may include stainless steel having magnetism.

[0625] For example, the bracket (650) may be adhered (or attached) to at least a portion of the display module (1801) through an adhesive member or the like to support the display module (1801). The bracket (650) may include a recess that may accommodate at least a portion of the display module (1801) (e.g., a printed circuit board (640)).

[0626] For example, a display (610) (e.g., a flexible display) may be electrically connected to a printed circuit board (640, PCB) via a flexible circuit board (630, FPCB).

[0627] For example, the digitizer (1860) may be electrically connected to a digitizer drive unit (e.g., the digitizer drive unit (470) of FIG. 4) via a flexible circuit board.

[0628] For example, the printed circuit board (640, PCB) may include a processor (e.g., processor (120) of FIG. 1), memory (e.g., memory (130) of FIG. 1), display driver IC (e.g., display driver IC (430) of FIG. 4), and digitizer driver (e.g., digitizer driver (470) of FIG. 4).

[0629] According to one embodiment, when the electronic device (1800) is folded, magnetic components (651) may be placed on both sides of the bracket (650) to secure the folded (e.g., folded) state. A groove or hole may be formed in at least a portion of both sides of the bracket (650), and the magnetic components (651) may be placed in the groove or hole formed on both sides.

[0630] According to one embodiment, when the electronic device (1800) is folded, the hinge plate (880) may include a first hinge plate portion (e.g., the first hinge plate portion (8801) of FIG. 10) and a second hinge plate portion (e.g., the second hinge plate portion (8802) of FIG. 10) that are separated based on the folding axis (F).

[0631] According to one embodiment, a hinge plate (880) and a hinge structure (690) may be arranged to correspond to the banding area (670). The hinge structure (690) may be covered from the outside by a hinge cover (695). For example, the electronic device (1800) may be folded and unfolded in an in-folding manner and / or an out-folding manner by the hinge structure (690).

[0632] In one embodiment, a digitizer (1860) and a second conductive layer (1865) may be disposed on the lower portion of a flexible plate (620) (e.g., a lattice plate). The second conductive layer (1865) may be disposed below (i.e., at a lower level) and may be separated from other elements of the digitizer (1860).

[0633] For example, to facilitate smooth folding and unfolding of the electronic device (1800), at least some components of the digitizer (1860) may be separated from each other with respect to the folding axis (F).

[0634] For example, the second conductive layer (1865) may be arranged separately to enable smooth folding and unfolding of the electronic device (1800).

[0635] According to one embodiment, the digitizer (1860) may include a flexible circuit board layer (1861) including a coil array, a first magnetic layer (1862, MMP1), a first conductive layer (1863) (e.g., a conductive plate), and a second magnetic layer (1864, MMP2).

[0636] According to one embodiment, when the electronic device (1800) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., a flexible display), a first magnetic layer (1862, MMP1) and a second magnetic layer (1864, MMP2) may be disposed between the flexible circuit board layer (1861) and the first conductive layer (1863) (e.g., a conductive plate).

[0637] For example, a first magnetic layer (1862, MMP1) may be disposed under a flexible circuit board layer (1861). The first magnetic layer (1862, MMP1) may be disposed to overlap at least a portion of the flexible circuit board layer (1861).

[0638] For example, a second magnetic layer (1864, MMP2) may be disposed under a flexible circuit board layer (1861). The second magnetic layer (1864, MMP2) may be disposed to overlap at least a portion of the flexible circuit board layer (1861).

[0639] According to one embodiment, the first magnetic layer (1862, MMP1) and the second magnetic layer (1864, MMP2) may be arranged in parallel on the lower side of the flexible circuit board layer (1861).

[0640] According to one embodiment, a first conductive layer (1863) (e.g., a conductive plate) may be disposed under a first magnetic layer (1862, MMP1). The first conductive layer (1863) (e.g., a conductive plate) may be disposed to overlap the first magnetic layer (1862, MMP1). For example, when the electronic device (1800) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., a flexible display), the first magnetic layer (1862, MMP1) and the first conductive layer (1863) (e.g., a conductive plate) may be disposed to substantially overlap.

[0641] According to one embodiment, when the electronic device (1800) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., a flexible display), the first magnetic layer (1862, MMP1) and the second magnetic layer (1864, MMP2) may be arranged so as not to overlap.

[0642] According to one embodiment, the first conductive layer (1863) (e.g., conductive plate) may be positioned so as not to overlap the second magnetic layer (1864, MMP2).

[0643] According to one embodiment, when the electronic device (1800) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., a flexible display), the second magnetic layer (1864, MMP2) and the second conductive layer (1865) may be arranged to substantially overlap.

[0644] For example, the second challenge layer (1865) may be placed on the hinge plate (880).

[0645] For example, the second conductive layer (1865) and the second magnetic layer (1864, MMP2) may be formed to have substantially the same width. Without being limited thereto, the second conductive layer (1865) may be formed to have a wider width than the width of the second magnetic layer (1864, MMP2).

[0646] According to one embodiment, the first magnetic layer (1862, MMP1) may include a first magnetic portion and a second magnetic portion that are spaced apart from each other along the folding axis (F). In a direction parallel to the first magnetic layer (1862, MMP1), the second magnetic layer (1864, MMP2) may be disposed between the first magnetic portion and the second magnetic portion of the first magnetic layer (1862, MMP1).

[0647] For example, the first magnetic layer (1862, MMP1) and the second magnetic layer (1864, MMP2) can be formed with substantially the same thickness.

[0648] Not limited thereto, the first magnetic layer (1862, MMP1) and the second magnetic layer (1864, MMP2) may be formed with different thicknesses. In this case, the first magnetic layer (1862, MMP1) may be formed with a first thickness, and the second magnetic layer (1864, MMP2) may be formed with a second thickness that is thinner than the first thickness.

[0649] According to one embodiment, the flexible circuit board layer (1861) may be arranged separately. For example, the flexible circuit board layer (1861) may include a first flexible circuit board portion (18611) and a second flexible circuit board portion (18612). The first flexible circuit board portion (18611) and the second flexible circuit board portion (18612) may be arranged to be spaced apart from each other by a first gap (w1) (e.g., a gap distance).

[0650] For example, the first gap (w1) between the first flexible circuit board portion (18611) and the second flexible circuit board portion (18612) may be 0 to 3 mm. For example, when the first flexible circuit board portion (18611) and the second flexible circuit board portion (18612) are arranged to be in contact with each other, the first gap (w1) between the first flexible circuit board portion (18611) and the second flexible circuit board portion (18612) may be substantially '0'. For example, when the first flexible circuit board portion (18611) and the second flexible circuit board portion (18612) are separated, the first gap (w1) between the first flexible circuit board portion (18611) and the second flexible circuit board portion (18612) may be 3 mm or less.

[0651] For example, the first gap (w1) between the first flexible circuit board portion (18611) and the second flexible circuit board portion (18612) may be substantially the same as the gap between the third magnetic layer portion (18641) and the fourth magnetic layer portion (18642). For example, the first gap (w1) between the first flexible circuit board portion (18611) and the second flexible circuit board portion (18612) may be smaller than the gap between the third magnetic layer portion (18641) and the fourth magnetic layer portion (18642). Without being limited thereto, the first gap (w1) between the first flexible circuit board portion (18611) and the second flexible circuit board portion (18612) may be larger than the gap between the third magnetic layer portion (18641) and the fourth magnetic layer portion (18642).

[0652] For example, the first gap (w1) between the first flexible circuit board portion (18611) and the second flexible circuit board portion (18612) may be 8 mm to 12 mm. When the first gap (w1) between the first flexible circuit board portion (18611) and the second flexible circuit board portion (18612) is formed to be 8 mm to 12 mm, the first gap (w1) between the first flexible circuit board portion (18611) and the second flexible circuit board portion (18612) may be substantially the same as the second gap (w2) between the first conductive layer portion (18631) and the second conductive layer portion (18632). For example, the first gap (w1) between the first flexible circuit board portion (18611) and the second flexible circuit board portion (18612) may be smaller than the second gap (w2) between the first conductive layer portion (18631) and the second conductive layer portion (18632). Without being limited thereto, the first gap (w1) between the first flexible circuit board portion (18611) and the second flexible circuit board portion (18612) may be larger than the second gap (w2) between the first conductive layer portion (18631) and the second conductive layer portion (18632).

[0653] Not limited thereto, the flexible circuit board layer (1861) may not be separated and may be formed as a single board.

[0654] According to one embodiment, the first conductive layer (1863) (e.g., conductive plate) may include a first conductive layer portion (18631) and a second conductive layer portion (18632) that are spaced apart from each other. To improve the bending characteristics of the electronic device (1800), a portion of the first conductive layer (1863) (e.g., conductive plate) may be removed. For example, a portion of the first conductive layer portion (18631) of the first conductive layer (18633) (e.g., conductive plate) may be removed, and a portion of the second conductive layer portion (18632) may be removed, such that the first conductive layer portion (18631) and the second conductive layer portion (18632) may be spaced apart from each other by a second gap (w2). For example, a portion of the first conductive layer (1863) (e.g., conductive plate) corresponding to the bending region (670) may be removed.

[0655] According to one embodiment, the first magnetic layer (1862, MMP1) may include a first magnetic layer portion (18621) and a second magnetic layer portion (18622) that are spaced apart from each other. The first magnetic layer portion (18621) and the second magnetic layer portion (18622) of the first magnetic layer (18622, MMP1) may be spaced apart from each other by a second gap (w2). For example, the second gap (w2) may be 10 mm to 30 mm.

[0656] For example, the second spacing (w2) between the first magnetic layer portion (18621) and the second magnetic layer portion (18622) may be substantially the same as the second spacing (w2) between the first conductive layer portion (18631) and the second conductive layer portion (18632). However, the second spacing (w2) between the first magnetic layer portion (18621) and the second magnetic layer portion (18622) and the second spacing (w2) between the first conductive layer portion (18631) and the second conductive layer portion (18632) may be different from each other.

[0657] According to one embodiment, a second magnetic layer (1864, MMP2) may be positioned to overlap a portion of the first conductive layer (1863) (e.g., conductive plate) from which a portion has been removed.

[0658] According to one embodiment, a second magnetic layer (1864, MMP2) may be disposed between the first magnetic layer portion (18622) and the second magnetic layer portion (18622) of the first magnetic layer (1862, MMP1).

[0659] For example, the second magnetic layer (1864, MMP2) may include a third magnetic layer portion (18641) and a fourth magnetic layer portion (18642) separated based on the folding axis (F).

[0660] For example, the third magnetic layer portion (18641) may be arranged adjacent to the first magnetic layer portion (18621). For example, the fourth magnetic layer portion (18642) may be arranged adjacent to the second magnetic layer portion (18622). For example, the third magnetic layer portion (18641) and the fourth magnetic layer portion (18642) may be arranged with a first gap (w1) between them.

[0661] According to one embodiment, when the electronic device (1800) is unfolded and viewed in a direction perpendicular to the display (610) (e.g., a flexible display), a second conductive layer (1865) may be disposed below the second magnetic layer (1864, MMP2). For example, the second conductive layer (1865) may be disposed to overlap the second magnetic layer (1864, MMP2). For example, the second conductive layer (1865) may be disposed to overlap the hinge plate (880). For example, the second conductive layer (1865) may be bonded (or attached) to the hinge plate (880) via an adhesive member.

[0662] For example, the second conductive layer (1865) and the first magnetic layer (1862, MMP1) can be electrically separated.

[0663] For example, the second conductive layer (1865) and the first conductive layer (1863) can be electrically isolated and / or physically isolated.

[0664] For example, the second conductive layer (1865) and the second magnetic layer (1864, MMP2) can be electrically separated.

[0665] According to one embodiment, the first magnetic layer (1862, MMP1) may be formed to have a first coefficient of performance. For example, the first magnetic layer (1862, MMP1) may be formed to have a first thickness and a material having a first permeability, thereby having a first coefficient of performance.

[0666] In one embodiment, the second magnetic layer (1864, MMP2) may be formed to have a second coefficient of performance lower than the first coefficient of performance. For example, the second magnetic layer (1864, MMP2) may be formed to have a second thickness thinner than the first thickness and made of a material having a second permeability lower than the first permeability, thereby having the second coefficient of performance. For example, the second magnetic layer (1864, MMP2) may be formed to have a first thickness and made of a material having a second permeability lower than the first permeability, thereby having the second coefficient of performance. For example, the second magnetic layer (1864, MMP2) may be formed to have a second thickness thinner than the first thickness and made of a material having a first permeability.

[0667] For example, the first magnetic layer (1862, MMP1) may be formed to a thickness of 30 μm to 60 μm. For example, the permeability of the first magnetic layer (1862, MMP1) may be approximately 95 u'.

[0668] For example, the second magnetic layer (1864, MMP2) may be formed to a thickness of 20 μm to 30 μm. For example, the second magnetic layer (1864, MMP2) may have a lower permeability (e.g., about 95 u') than the permeability of the first magnetic layer (1862, MMP1). For example, the permeability of the second magnetic layer (1864, MMP2) may be about 60 u'.

[0669] In order to prevent uneven signal distribution from occurring in the banding region (670), the second permeability of the second magnetic layer (1864, MMP2) may be formed to be lower than the first permeability of the first magnetic layer (1862, MMP1), and the second conductive layer (1865) may be placed under the second magnetic layer (1864, MMP2).

[0670] According to one embodiment, the second conductive layer (1865) is disposed between the second magnetic layer (1864) and the hinge plate (880) and may have a different conductivity than the first conductive layer (1863).

[0671] For example, the second conductive layer (1865) may include a second material having a lower conductivity than the first material included in the first conductive layer (1863).

[0672] For example, the second conductive layer (1865) can be formed to have substantially the same thickness as the first conductive layer (1863).

[0673] For example, the second conductive layer (1865) may be formed to a thickness thinner than the thickness of the first conductive layer (1863).

[0674] According to one embodiment, the second conductive layer (1865) may include a conductive pattern (e.g., the conductive pattern (1765a) of FIG. 17) and a space (e.g., the space (1765b) of FIG. 17). By adjusting the line width (w) of the conductive pattern (1765a) of the second conductive layer (1865) and the width (s) of the space (1765b), the conductivity of the second conductive layer (1865) and the conductivity of the digitizer (1860) can be tuned (e.g., see FIG. 17).

[0675] For example, among the entire area of ​​the second conductive layer (1865), the first pattern portion (1910) overlapping with the second magnetic layer (1864, MMP2) may be formed as a wide pattern. For example, among the entire area of ​​the second conductive layer (1865), the first pattern portion (1910) overlapping with the second magnetic layer (1864, MMP2) may be formed such that the conductive pattern (e.g., the conductive pattern (1765a) of FIG. 17) has a first line width (w1).

[0676] For example, among the entire area of ​​the second conductive layer (1865), the second pattern portion (1920) that does not overlap with the second magnetic layer (1864, MMP2) may be formed as a narrow pattern. For example, among the entire area of ​​the second conductive layer (1865), the second pattern portion (1920) that does not overlap with the second magnetic layer (1864, MMP2) may be formed such that the conductive pattern (e.g., the conductive pattern (1765a) of FIG. 17) has a second line width that is narrower than the first line width.

[0677] For example, since the second permeability of the second magnetic layer (1864, MMP2) is lower than the first permeability of the first magnetic layer (1862, MMP1), the conductivity of the second conductive layer (1865) can be tuned in consideration of the signal strength and resonant frequency of the electronic pen (e.g., the electronic pen (500) of FIGS. 5A and 5B). For example, the conductivity of the second conductive layer (1865) and the conductivity of the digitizer (1860) can be tuned by adjusting the line width (w) of the conductive pattern (1765a) and the width (s) of the space (e.g., the space (1765b) of FIG. 17).

[0678] If a material with high permeability (e.g., a ferrite-based material, a martensite-based material, an iron (Fe)-based material) or a magnetic material is positioned under the conductive layer (1863) (e.g., a conductive plate) of the digitizer (1860), it may affect the signal distribution of the electronic pen (500) detected by the digitizer (1860). Since the higher the conductivity of the conductive layer (1863) (e.g., a conductive plate), the higher the resonance frequency of the electronic pen (500) can be shifted, so that the signal distribution of the electronic pen (500) can be made uniform by arranging the second conductive layer (1865). Tuning similar to that described with reference to FIG. 19 can also be applied to the structure of FIG. 17.

[0679] When the electronic device (1700) is folded (e.g., folded), the display (610) (e.g., flexible display) can be smoothly folded and unfolded based on the folding axis (F), and the flexible plate (620) (e.g., lattice plate) can include a lattice portion (622) (e.g., lattice area) so that the display (610) (e.g., flexible display) can be supported.

[0680] According to one embodiment, a lattice portion (622) (e.g., a lattice portion) may be positioned in a portion corresponding to a banding area (670). For example, the lattice portion (622) (e.g., a lattice portion) may be positioned to overlap the banding area (670).

[0681] According to one embodiment, at least a portion of the second magnetic layer (1864, MMP2) may be positioned to overlap with the lattice portion (622) (e.g., the lattice region).

[0682] According to one embodiment, the first magnetic layer (1862) and the lattice portion (622) (e.g., the lattice region) may be positioned so as not to overlap.

[0683] The digitizer (1860) of the present disclosure can be applied not only to foldable electronic devices but also to slideable electronic devices or rollable electronic devices. Although the present disclosure exemplifies a foldable electronic device capable of being folded inward, the electronic device (1800) according to the present disclosure is not limited to a foldable electronic device capable of being folded inward. For example, the electronic device (1800) according to the present disclosure may include a foldable electronic device including a display capable of being folded outward. The electronic device (1800) according to the present disclosure may include a multi-foldable electronic device including a display capable of being folded inward and outward multiple times. For example, the electronic device (1800) according to the present disclosure may include various electronic devices including a flexible display in which some areas (e.g., a bending area or a folding area) are bendable or rollable, such as an electronic device that is expandable through sliding movement between housings.

[0684] An electronic device (1800) according to one embodiment of the present disclosure may have a second magnetic layer (1864, MMP2) and a second conductive layer (1865) disposed so as to overlap a portion of a first conductive layer (1863) (e.g., a conductive plate) from which a portion has been removed. The second magnetic layer (1864, MMP2) and the second conductive layer (1865) may be disposed at a portion corresponding to a bending region (670) to prevent (or compensate for) a degradation of characteristics in the bending region (670) due to the removal of a portion of the conductive layer (1863) (e.g., a conductive plate).

[0685] Figure 20 is a drawing showing the spacing between the first magnetic portion and the second magnetic portion of the first magnetic layer, and the positions where the first magnetic portion and the second magnetic portion of the first magnetic layer are arranged from a reference point.

[0686] Referring to FIG. 20, a digitizer (2000) (e.g., a separate digitizer) may include a first digitizer portion (2010) and a second digitizer portion (2020).

[0687] According to one embodiment, a reference line (e.g., a portion where wires of a flexible circuit board layer (1861) are arranged) may be set as the origin, and the positions where the first digitizer portion (2010) and the second digitizer portion (2020) are arranged may be adjusted.

[0688] For example, the first digitizer portion (2010) and the second digitizer portion (2020) may be positioned closer to the folding axis (F) than the reference line (2001) (e.g., the portion where the wires of the flexible circuit board layer (1861) are positioned).

[0689] For example, the first digitizer portion (2010) and the second digitizer portion (2020) can be positioned close to the folding axis (F) by about -0.5 mm from the reference line (2001) (e.g., the portion where the wires of the flexible circuit board layer (1861) are positioned).

[0690] For example, the first digitizer portion (2010) and the second digitizer portion (2020) may be positioned further away from the folding axis (F) than the reference line (2002) (e.g., the portion where the wires of the flexible circuit board layer (1861) are positioned).

[0691] For example, the first digitizer portion (2010) and the second digitizer portion (2020) may be positioned about 2.0 mm away from the folding axis (F) from the reference line (2002) (e.g., the portion where the wires of the flexible circuit board layer (1861) are positioned).

[0692] According to one embodiment, in a digitizer (2000) (e.g., a split digitizer), a first digitizer portion (2010) and a second digitizer portion (2020) may form a closed loop. An area between the first digitizer portion (2010) and the second digitizer portion (2020) becomes an exterior of the closed loop. When the digitizer (2000) operates as a receiver (Rx), a phase of a magnetic field emanating from an area between the first digitizer portion (2010) and the second digitizer portion (2020) may be opposite to a phase of a magnetic field inside the first digitizer portion (2010) and the second digitizer portion (2020). Due to the occurrence of such an opposite phase, the intensity of the received signal of the digitizer (2000) (e.g., a separate digitizer) may decrease, or the intensity of the signal may become '0' in the part where the phase changes. The same phenomenon may also occur when the digitizer (2000) (e.g., a separate digitizer) operates as a transmitter (Tx). In order to reduce the induced electromotive force due to the magnetic field generated between the first digitizer part (2010) and the second digitizer part (2020), a part of the magnetic layer (e.g., the first magnetic layer (1862, MMP2), the second magnetic layer (1864, MMP2)) may be removed, or the second magnetic layer (1864, MMP2) may be formed of a material having a low magnetic permeability.

[0693] The digitizer (2000) of the present disclosure can be applied not only to foldable electronic devices but also to slideable electronic devices or rollable electronic devices. Although the present disclosure exemplifies a foldable electronic device capable of inward folding, the electronic device according to the present disclosure is not limited to a foldable electronic device capable of inward folding. For example, the electronic device according to the present disclosure may include a foldable electronic device including a display capable of outward folding. The electronic device according to the present disclosure may include a multi-foldable electronic device including a display capable of inward-outward folding multiple times. For example, the electronic device according to the present disclosure may include various electronic devices including a flexible display in which some areas (e.g., a bending area or a folding area) are bendable or rollable, such as an electronic device that is expandable through sliding movement between housings.

[0694] FIG. 21 is a drawing (2100) showing the change in inductance [μH] inside an electronic pen according to the pattern density of a conductive layer arranged to overlap with a second magnetic layer (e.g., the ratio of the width (w) and space (s) of the conductive pattern, see FIG. 17).

[0695] Referring to FIG. 21, depending on the ratio (e.g., pattern ratio) of the line width (w) [mm] of the pattern (1765a) of the second conductive layer (e.g., the second conductive layer (1765) of FIG. 17, the second conductive layer (1865) of FIG. 18) and the width (s) [mm] of the space (1765b), the change in inductance inside the electronic pen (e.g., the electronic pen (500) of FIGS. 5A and 5B) may vary. For example, as the pattern ratio of the second conductive layer (1765, 1865) increases, the amount of inductance reduction inside the electronic pen (500) increases, and the amount of inductance reduction inside the electronic pen (500) may be saturated above a certain level. The resonant frequency of the electronic pen (500) can be changed depending on the inductance of the inductor placed inside the electronic pen (500), and the signal distribution of the electronic pen (500) can be controlled by adjusting the pattern ratio of the second conductive layer (1765, 1865).

[0696] Figure 22 is a drawing (2200) showing the change in inductance inside an electronic pen depending on the presence or absence of a second conductive layer arranged to overlap the second magnetic layer.

[0697] Referring to FIG. 22, when a second conductive layer (e.g., the second conductive layer (1765) of FIG. 17, the second conductive layer (1865) of FIG. 18) is disposed under a second magnetic layer (e.g., the second magnetic layer (1764, MMP2) of FIG. 17, the second magnetic layer (1864, MMP2) of FIG. 18)), and when it is not disposed, a change in inductance inside the electronic pen (e.g., the electronic pen (500) of FIGS. 5A and 5B) may occur.

[0698] For example, when the second conductive layer (1765, 1865) is not disposed under the second magnetic layer (1764, 1864), the inductance (2210) inside the electronic pen (500) may be unevenly distributed. On the other hand, when the second conductive layer (1765, 1865) is disposed under the second magnetic layer (1764, 1864), the inductance (2220) inside the electronic pen (500) may be uniformly distributed. By precisely applying the pattern ratio of the second conductive layer (1765, 1865), the distribution of the inductance inside the electronic pen (500) may be tuned to be uniform.

[0699] Figure 23 is a drawing (2300) showing a phase change point according to the gap between the first and second parts of the first magnetic layer.

[0700] Referring to FIG. 23, the phase change of the magnetic field (2301, 2302) generated at the center (e.g., folding axis) of the segmented portion (e.g., bending region) of the separable digitizer may vary depending on the width by which the magnetic layer (MMP) is removed.

[0701] For example, the trend of the phase shift point (2310) is shown when the magnetic layer (MMP) is arranged with a first gap (e.g., 3.5 μm) apart from the center (e.g., folding axis) of the segmented portion (e.g., bending area) of the separable digitizer. For example, the trend of the phase shift point (2320) is shown when the magnetic layer (MMP) is arranged with a second gap (e.g., 3.0 μm) apart from the center (e.g., folding axis) of the segmented portion (e.g., bending area) of the separable digitizer. For example, the trend of the phase shift point (2330) is shown when the magnetic layer (MMP) is arranged with a third gap (e.g., 2.5 μm) apart from the center (e.g., folding axis) of the segmented portion (e.g., bending area) of the separable digitizer. When a portion of the magnetic layer (MMP) is removed from the center (e.g., the folding axis) of a segmented portion (e.g., the bending region) of a separable digitizer, the phase shift point can be lowered. Lowering the phase shift point can reduce the decrease in signal strength of the electronic pen (500) at the segmented portion (e.g., the bending region) of the separable digitizer, and can improve (reduce) the phase inversion phenomenon.

[0702] An electronic device according to an embodiment of the present disclosure (e.g., an electronic device (600) of FIG. 6, an electronic device (800) of FIG. 8) may include a foldable housing, a flexible display accommodated in the foldable housing (e.g., a flexible display (610) of FIGS. 6 and 8), and a digitizer disposed below the flexible display (610) (e.g., a digitizer (660) of FIG. 6, a digitizer (880) of FIG. 8). The digitizer (660, 860) may include a flexible circuit board layer (e.g., the flexible circuit board layer (661) of FIG. 6, the flexible circuit board layer (861) of FIG. 8), a first conductive layer (e.g., the first conductive layer (663) of FIG. 6, the first conductive layer (863) of FIG. 8) disposed under the flexible circuit board layer (661, 861), and a magnetic layer (e.g., the magnetic layer (662, 664) of FIG. 6, the magnetic layer (862, 864) of FIG. 8) disposed under the flexible circuit board layer (661). A portion of the magnetic layer (662, 664, 862, 864) may be disposed between the flexible circuit board layer (661, 861) and the first conductive layer (663). The magnetic layers (662, 664, 862, 864) may include a first magnetic layer having a first magnetism (e.g., the first magnetic layer (662) of FIG. 6, the first magnetic layer (862) of FIG. 8) and a second magnetic layer having a second magnetism different from the first magnetism (e.g., the second magnetic layer (664) of FIG. 6, the second magnetic layer (864) of FIG. 8). When the electronic device (600, 800) is unfolded and viewed in a vertical direction from the front of the electronic device to the rear of the electronic device through the flexible display (610), the first magnetic layer (662, 862) and the first conductive layer (663, 863) may be arranged to substantially overlap each other.When the electronic device (600, 800) is unfolded and viewed in a vertical direction from the front of the electronic device to the rear of the electronic device through the flexible display (610), the second magnetic layer (664, 964) and the first conductive layer (663, 863) may be arranged so as not to overlap.

[0703] According to one embodiment, the first magnetic layer (662, 862) and the second magnetic layer (664, 864) may be arranged so as not to overlap in the vertical direction.

[0704] According to one embodiment, the first magnetic layer (662) may include a first magnetic portion (6621) and a second magnetic portion (6622) spaced apart from each other along the folding axis of the flexible display (610). When viewed in a direction parallel to the first magnetic layer (662), the second magnetic layer (664) may be disposed between the first magnetic portion (6621) and the second magnetic portion (6622).

[0705] According to one embodiment, the first magnetic layer (862) may include a first magnetic portion (8621) and a second magnetic portion (8622) spaced apart from each other along the folding axis of the flexible display (610). When viewed in a direction parallel to the first magnetic layer (862), the second magnetic layer (64) may be positioned lower than the first magnetic layer (862).

[0706] According to one embodiment, the flexible circuit board layer (661, 861) may include a first flexible circuit board portion (6611, 8611) and a second flexible circuit board portion (6612, 8612) arranged on both sides of the folding axis of the flexible display (610).

[0707] According to one embodiment, the first conductive layer (663, 863) may include a first conductive layer portion (6631, 8631) and a second conductive layer portion (6632, 8632) spaced apart from each other along the folding axis of the flexible display (610).

[0708] According to one embodiment, the first conductive layer portion (6631, 8631) may be arranged to overlap under the first flexible circuit board portion (6611, 8611). The second conductive layer portion (6632, 8632) may be arranged to overlap under the second flexible circuit board portion (6612, 8612).

[0709] According to one embodiment, when viewed in a direction perpendicular to the flexible display (610), the first magnetic portion (6621, 8621) of the first magnetic layer (662, 862) may be disposed between the first flexible circuit board portion (6611, 8611) and the first conductive layer portion (6631, 8631). When viewed in a direction perpendicular to the flexible display (610), the second magnetic portion (6622, 8622) of the first magnetic layer (662, 862) may be disposed between the second flexible circuit board portion (6612) and the second conductive layer portion (6632, 8632).

[0710] According to one embodiment, the second magnetic layer (664, 864) may include a third magnetic portion (6641, 8641) and a fourth magnetic portion (6642, 8642) arranged on both sides of the folding axis of the flexible display (610).

[0711] According to one embodiment, when viewed in a direction perpendicular to the flexible display (610), the third magnetic portion (8641) of the second magnetic layer (864) may be spaced apart from the first magnetic portion (8621) of the first magnetic layer (862) and positioned below the first conductive layer portion (8631) of the first conductive layer (863). When viewed in a direction perpendicular to the flexible display (610), the fourth magnetic portion (8642) of the second magnetic layer (864) may be spaced apart from the second magnetic porti...

Claims

1. In electronic devices (600, 800), foldable housing; A flexible display (610) accommodated in the above foldable housing; and It includes a digitizer (660, 860) positioned below the flexible display (610); The above digitizer (660, 860) Flexible circuit board layer (661, 861), A first conductive layer (663, 863) arranged below the above flexible circuit board layer (661, 861), and It includes a magnetic layer (662, 664, 862, 864) arranged below the above flexible circuit board layer (661, 861), A part of the above magnetic layer (662, 664, 862, 864) is placed between the flexible circuit board layer (661, 861) and the first conductive layer (663), The above magnetic layer (662, 664, 862, 864) includes a first magnetic layer (662, 862) having a first magnetism and a second magnetic layer (664, 864) having a second magnetism different from the first magnetism. When the electronic device (600, 800) is unfolded and viewed in a vertical direction from the front of the electronic device to the rear of the electronic device through the flexible display (610), the first magnetic layer (662, 862) and the first conductive layer (663, 863) are arranged to substantially overlap, and the second magnetic layer (664, 964) and the first conductive layer (663, 863) are arranged to not overlap. Electronic devices.

2. In paragraph 1, The first magnetic layer (662, 862) and the second magnetic layer (664, 864) are arranged so as not to overlap in the vertical direction. Electronic devices.

3. In paragraph 1 or 2, The first magnetic layer (662) includes a first magnetic portion (6621) and a second magnetic portion (6622) spaced apart from each other along the folding axis of the flexible display (610). When viewed in a direction parallel to the first magnetic layer (662), the second magnetic layer (664) is positioned between the first magnetic portion (6621) and the second magnetic portion (6622). Electronic devices.

4. In paragraph 1 or 2, The first magnetic layer (862) includes a first magnetic portion (8621) and a second magnetic portion (8622) spaced apart from each other along the folding axis of the flexible display (610). When viewed in a direction parallel to the first magnetic layer (862), the second magnetic layer (64) is located below the first magnetic layer (862). Electronic devices.

5. In clause 3 or 4, The above flexible circuit board layer (661, 861) includes a first flexible circuit board portion (6611, 8611) and a second flexible circuit board portion (6612, 8612) arranged on both sides of the folding axis of the flexible display (610). Electronic devices.

6. In paragraph 4, The first conductive layer (663, 863) includes a first conductive layer portion (6631, 8631) and a second conductive layer portion (6632, 8632) spaced apart from each other along the folding axis of the flexible display (610). Electronic devices.

7. In paragraph 6, The first conductive layer portion (6631, 8631) is positioned so as to overlap under the first flexible circuit board portion (6611, 8611). The second conductive layer portion (6632, 8632) is positioned so as to overlap under the second flexible circuit board portion (6612, 8612). Electronic devices.

8. In paragraph 6, When viewed in a direction perpendicular to the above flexible display (610), The first magnetic portion (6621, 8621) of the first magnetic layer (662, 862) is arranged between the first flexible circuit board portion (6611, 8611) and the first conductive layer portion (6631, 8631). The second magnetic portion (6622, 8622) of the first magnetic layer (662, 862) is arranged between the second flexible circuit board portion (6612) and the second conductive layer portion (6632, 8632). Electronic devices.

9. In any one of paragraphs 1 to 8, The second magnetic layer (664, 864) includes a third magnetic portion (6641, 8641) and a fourth magnetic portion (6642, 8642) arranged on both sides of the folding axis of the flexible display (610). Electronic devices.

10. In paragraph 9, When viewed in a direction perpendicular to the above flexible display (610), The third magnetic portion (8641) of the second magnetic layer (864) is spaced apart from the first magnetic portion (8621) of the first magnetic layer (862) and is positioned below the first conductive layer portion (8631) of the first conductive layer (863). The fourth magnetic portion (8642) of the second magnetic layer (864) is spaced apart from the second magnetic portion (8622) of the first magnetic layer (862) and is positioned below the second conductive layer portion (8632) of the first conductive layer (863). Electronic devices.

11. In clause 9 or 10, When the above electronic device (600, 800) is in an unfolded state, The first flexible circuit board portion (6611) and the second flexible circuit board portion (6612) are spaced apart from each other by a first gap (w1). The first conductive layer portion (6631) and the second conductive layer portion (6632) are spaced apart from each other by a second distance (w2) that is the same as or farther from the first distance (w1). The third magnetic portion (6641) and the fourth magnetic portion (6642) are spaced apart from each other by a third distance (w3) that is the same as or far from the first distance (w1). Electronic devices.

12. In paragraph 11, The above foldable housing includes a hinge housing, a first housing portion (310) positioned on a first side of the hinge housing, and a second housing portion (310) positioned on a second side of the hinge housing. The electronic device (600, 800) further includes a hinge structure (690) at least partially mounted in the hinge housing and positioned below the digitizer (660, 860). The above hinge structure (690) includes a hinge plate (680, 880), The above hinge plates (680, 880) include a first hinge plate (6801, 8801) positioned adjacent to the first housing portion (310), and a second hinge plate (6802, 8802) positioned adjacent to the second housing portion (310). When the above electronic device (600) is in an unfolded state, The above first gap (w1) is smaller than the sum of the first width of the first hinge plate (6801) and the second width of the second hinge plate. Electronic devices.

13. In paragraph 11, When the above electronic device (800) is in an unfolded state, The first magnetic portion (8621) is extended closer to the folding axis than the first conductive layer portion (8631), The second magnetic portion (8622) extends closer to the folding axis than the second conductive layer portion (8632). Electronic devices.

14. In paragraph 11, The above foldable housing includes a hinge housing, a first housing portion (310) positioned on a first side of the hinge housing, and a second housing portion (320) positioned on a second side of the hinge housing. The electronic device (600, 800) further includes a hinge structure (690) at least partially mounted in the hinge housing and positioned below the digitizer (660, 860). The above hinge structure (690) includes a first hinge plate (6801, 8801) positioned adjacent to the first housing portion (310), and a second hinge plate (6802, 8802) positioned adjacent to the second housing portion. When the above electronic device (600, 800) is in an unfolded state, The second gap (w2) between the first conductive layer portion (6631) and the second conductive layer portion (6632) is greater than the sum of the first width of the first hinge plate (6801) and the second width of the second hinge plate. Electronic devices.

15. In any one of paragraphs 1 to 14, The above first magnetic layer (662, 862) has a first magnetic characteristic of a first investment rate, The second magnetic layer (664, 864) has a second magnetic characteristic of a second investment rate lower than the first investment rate. Electronic devices.

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