Transmission strip line waveguide connector, communication system, communication apparatus, and communication method

Abstract

A communication method, comprising: a microstrip line transmits a first radio frequency signal from an active device to an array element, and couples to a waveguide a second radio frequency signal transmitted via the array element and a third radio frequency signal, wherein the second radio frequency signal is part of the radio frequency signal transmitted to the array element, and the third radio frequency signal is a radio frequency signal which is reflected by a capacitor composed of a plate and a grounding plate. The communication method is used for a transmission strip line waveguide connector, and the transmission strip line waveguide connector comprises a transmission strip line, a dielectric substrate, and a grounding plate; the transmission strip line is located on a first surface of the dielectric substrate, and the grounding plate is located on a second surface of the dielectric substrate; a gap is formed in the grounding plate, and the gap is used for coupling with a waveguide; and the transmission strip line comprises a microstrip line, a plate, and an array element coupled with the gap, wherein one end of the microstrip line is connected to the plate, the other end of the microstrip line is used for being connected to an active device, and the array element is located between the two ends of the microstrip line and connected to the microstrip line; and the plate is connected to a direct-current feed end, and the plate is coupled with the grounding plate.

Description

Transmission strip line waveguide connector, communication system, communication device and communication method Technical Field

[0001] The embodiments of the present application relate to the field of communication technology, and in particular to a transmission strip line waveguide connector, a communication system, a communication device, and a communication method. Background Art

[0002] At present, with the development of communication technology, the frequency of electromagnetic wave signals used to transmit signals is getting higher and higher, and the loss of electromagnetic energy during the transmission process is also getting greater and greater.

[0003] In microwave circuit systems, planar transmission lines are usually used to connect microwave components, while different microwave circuit systems are connected through waveguides. Therefore, a transition structure is required between the waveguide and the microstrip.

[0004] Among them, some active devices in the microwave circuit system, such as diodes, transistors and other RF devices, are single devices with simple structures. Their RF ports also serve as power supply ports. For such devices, it is necessary to design external circuits to isolate the RF signal and DC power supply to prevent DC power from damaging other devices. The structure is relatively complex and the loss is large.

[0005] Summary of the Invention

[0006] Embodiments of the present application provide a transmission strip line waveguide connector, a communication system, a communication device, and a communication method for realizing the transition between a planar microstrip line and a waveguide, and providing a power supply port isolated from a radio frequency signal, thereby simultaneously realizing power supply and signal transmission of the device.

[0007] In a first aspect, a transmission strip line waveguide connector is provided, comprising: a transmission strip line, a dielectric substrate, and a ground plate; the transmission strip line is arranged on a first surface of the dielectric substrate, and the ground plate is arranged on a second surface of the dielectric substrate; a slot is provided on the ground plate, and the slot is used for coupling with the waveguide; the transmission strip line comprises: a microstrip line, a plate, and an array coupled to the slot; wherein a first end of the microstrip line is connected to an active device, a second end of the microstrip line is connected to the plate, and a third end of the microstrip line is connected to the array, and the third end is located between the first and second ends; the plate is connected to a DC feed terminal, and the plate is coupled to the ground plate.

[0008] It can be seen that the transmission strip line waveguide connector can transmit the RF signal transmitted by the waveguide to the active device, transmit the signal through the active device, and can also transmit the signal received by the active device to the waveguide, thereby realizing signal reception and transmission. Among them, a plate is provided at one end of the microstrip line, so that the plate, the ground plate and the dielectric substrate together form a capacitor, so that the RF signal transmitted to the capacitor is reflected, reducing energy leakage. At the same time, a DC feeding terminal is provided on the plate of the capacitor, and a DC signal can be loaded to the plate. The DC signal passes through the plate and the microstrip line in turn to reach the active device, realizing DC power supply to the active device. The capacitor composed of the plate and the ground plate is disconnected for the DC signal and will not affect the DC signal. Therefore, the transmission strip line waveguide connector provided by the embodiment of the present application, through a circuit system, not only realizes the transition function between the waveguide and the transmission strip line, but also provides a power supply port isolated from the RF signal, realizes DC feeding to the active device, thereby realizing power supply and signal transmission of the device at the same time, with a simple structure and reduced loss.

[0009] In an optional implementation, the electrode, the dielectric plate, and the ground plane form a capacitor. Thus, during the transmission and reception stages of the RF signal, the RF signal transmitted to the capacitor can be reflected, reducing energy leakage. For example, during the RF signal transmission stage, the RF signal transmitted by the waveguide is coupled to the dielectric substrate through the gap on the ground plane, and is transmitted from the dielectric substrate to the array. It is then transmitted through the array to the first and second ends of the microstrip line. The RF signal transmitted to the first end of the microstrip line is directed to the active device. The RF signal transmitted to the second end of the microstrip line is directed to the electrode and reflected at the capacitor formed by the electrode and the ground plane. The reflected RF signal is directed to the active device through the microstrip line. This completes the transition between the waveguide and the microstrip line, enabling the transmission of the RF signal. Alternatively, during the RF signal reception stage, the energy of the RF signal from the active device can be transmitted to the array by the microstrip line, and the RF energy transmitted to the array is partially coupled to the waveguide. Another part of the RF energy transmitted to the array goes to the plate and is reflected by the capacitor composed of the plate and the ground plate. The reflected RF energy is coupled into the waveguide through the gap between the radiation array and the ground plate, thus completing the RF signal transition from the transmission strip line to the waveguide.

[0010] In one optional implementation, the width of the plate is greater than the width of the microstrip line. In some embodiments, the plate is fan-shaped, with a gradual width, and the plate width is greater than the width of the microstrip line. The maximum width of the plate can be greater than the width of the microstrip line. In other embodiments, the plate is rectangular, so that the width of each portion of the plate is greater than the width of the microstrip line. Thus, a larger plate width results in a larger plate area, a larger equivalent capacitance, and better reflection performance for RF signals, further reducing energy leakage and lowering transition losses.

[0011] In an optional implementation, the length l of the gap satisfies: Where λ1 is the wavelength of the electromagnetic wave in the waveguide, and A is the error threshold. This allows the electromagnetic wave transmitted by the waveguide to couple to the array through the gap, facilitating signal transmission.

[0012] In an optional implementation, the length L of the array satisfies: |L-λ2|≤B, where λ2 is the wavelength of the electromagnetic wave on the microstrip line, and B is the error threshold.

[0013] In an optional implementation, the array is symmetrical about the microstrip line, thereby facilitating uniform transmission of the radio frequency energy to the microstrip line.

[0014] In an optional implementation, there are multiple arrays, wherein the spacing d between adjacent arrays satisfies: Here, λ2 is the wavelength of the electromagnetic wave on the microstrip line, and N is a positive integer. Therefore, the distance between adjacent arrays differs by an integer multiple of half a wavelength. Thus, when arranging the arrays, placing one array at a point of strong electric field will also position the other arrays at strong electric field points. This facilitates placement of the arrays at strong electric field points on the microstrip line, improving the array's radiation performance and reducing RF energy loss on the microstrip line.

[0015] In an optional implementation, the transmission strip line further includes: a first connecting line, through which the first ends of two adjacent arrays are connected. Thus, the first connecting line can connect adjacent arrays to improve impedance matching.

[0016] In an optional implementation, the width of the first connecting line is smaller than the width of the array, thereby further improving the impedance matching of the array.

[0017] In one optional implementation, the first portion of the microstrip line is connected to the array, and the second portion of the microstrip line is connected to the plate, with the second portion of the microstrip line located between the plate and the array. This facilitates adjusting the length of the microstrip line as needed, so that the RF energy reflected from the capacitor formed by the plate and the ground plane returns to the array. By adjusting the length of the second sub-microstrip line, the electric field of the RF signal reflected from the capacitor can be maximized at the radiating array, reducing transition losses between the waveguide and the microstrip line.

[0018] In an optional implementation, the length D of the second portion of the microstrip line satisfies:

[0019] Where λ2 is the wavelength of the electromagnetic wave on the microstrip line, E is the error threshold, and n is a natural number. One cycle corresponds to one wavelength of the electromagnetic wave on the microstrip line, and the electric field intensity is maximum at one-quarter and three-quarters of the cycle. Therefore, n can take values ​​of 0, 1, 2, 3, etc., and the length of the second portion of the microstrip line can be: That is, the length of the second sub-microstrip line 2031b is an odd multiple of a quarter wavelength. In this way, when the signal reflected at the capacitor passes through After the microstrip line is of a long length, the electric field is strongest at the radiation array, thereby reducing the transition loss.

[0020] In an optional implementation, the shape of the electrode plate includes: a sector shape or a rectangle. Thus, the shape of the electrode plate can be flexibly adjusted, and the scope of application is wider.

[0021] In one optional implementation, the first side of the plate is connected to the microstrip line, the second side of the plate is opposite the first side, and at least one of the second side, the third side, or the fourth side is connected to the DC feeder, wherein the third side and the fourth side are connected to the first side and the second side. This allows for arbitrary adjustment of the connection position between the DC feeder and the plate, minimizing transition losses at each location, providing greater flexibility and facilitating production and processing.

[0022] In one optional implementation, the transmission strip line further includes a shielding plate spaced apart from the microstrip line, surrounding the array, and spaced apart from the array. Thus, the shielding plate is used to shield electromagnetic waves emitted by the array. By providing this shielding plate, the electromagnetic waves emitted by the array can be isolated within the shielding plate, further reducing transition losses between the waveguide and the transmission strip line.

[0023] In one optional implementation, the dielectric layer is provided with a conductive connection portion, and the shielding plate is connected to the ground plane via the conductive connection portion. Thus, the shielding plate, the conductive connection portion, and the ground plane together form a semi-enclosed cavity, isolating the electromagnetic waves emitted by the array within the cavity, further reducing the transition loss between the waveguide and the transmission line.

[0024] In an optional implementation, the conductive connection portion includes: a plurality of metal vias. Thus, the metal vias are used as the shielding structure, which is simple in structure and easy to produce.

[0025] In a second aspect, a communication system is provided, comprising: an active device and the aforementioned microstrip waveguide connector, wherein the active device is connected to the second end of the microstrip line. Thus, the communication system employs the aforementioned microstrip waveguide connector, and through a single circuit system, not only achieves a transition function between the waveguide and the microstrip line but also provides a power supply port isolated from RF signals, enabling DC power feeding to the active device. This achieves both device power supply and signal transmission simultaneously, resulting in a simple structure and reduced losses.

[0026] In an optional implementation, the active device includes a diode or a triode. Thus, the active device has a simple structure, and its RF port also serves as a power supply port. The aforementioned transmission stripline waveguide connector can be used, resulting in a higher isolation suit and lower loss.

[0027] In a third aspect, a communication device is provided, comprising: a waveguide, an active device, and the aforementioned microstrip waveguide connector, wherein the waveguide is coupled to the slot, and the active device is connected to the second end of the microstrip line. Thus, the communication device employs the aforementioned microstrip waveguide connector, and through a single circuit system, not only achieves a transition between the waveguide and the microstrip line but also provides a power supply port isolated from RF signals, enabling DC power feeding to the active device. This achieves both device power supply and signal transmission, resulting in a simple structure and reduced losses.

[0028] In an optional implementation, the communication device is a base station. Therefore, the base station adopts the above-mentioned transmission strip line waveguide connector, which has a simple structure.

[0029] In a fourth aspect, a communication method is provided, comprising: a radio frequency signal transmitted by a waveguide is coupled to an array through a gap, and is transmitted to a first end and a second end of a microstrip line through the array, wherein the radio frequency signal transmitted to the first end of the microstrip line is passed to the active device; the radio frequency signal transmitted to the second end of the microstrip line is passed to the plate and is reflected at a capacitor formed by the plate and a ground plate, wherein the reflected radio frequency signal is passed to the active device through the microstrip line; wherein the communication method is used for a transmission strip line waveguide connector, wherein the transmission strip line waveguide connector comprises: a transmission strip line, a dielectric substrate, and a ground plate. The transmission strip line is located on the first surface of the dielectric substrate, and the ground plate is located on the second surface of the dielectric substrate. A slot is provided on the ground plate, and the slot is used to couple with the waveguide. The transmission strip line includes: a microstrip line, the plate, and an array coupled with the slot. The microstrip line includes: a first end and a second end opposite to each other, and a third end located between the first and second ends, the first end connected to the plate, the second end used to connect to the active device, and the third end connected to the array. The plate is connected to a DC feed terminal, and the plate is coupled to the ground plate.

[0030] In an optional implementation, the electrode plate is used to receive a DC signal loaded on the DC feeding end, so that the DC signal is transmitted to the active device through the electrode plate and the microstrip line in sequence.

[0031] In an optional implementation, the first portion of the microstrip line is connected to the array, the second portion of the microstrip line is connected to the electrode plate, and the second portion of the microstrip line is located between the electrode plate and the array.

[0032] In an optional implementation, the length D of the second portion of the microstrip line satisfies:

[0033] Wherein, n is a natural number.

[0034] In a fifth aspect, a communication method is provided, the method comprising: a microstrip line transmits a first radio frequency signal from an active device to an array, and couples a second radio frequency signal and a third radio frequency signal transmitted by the array to a waveguide; the second radio frequency signal is a portion of the radio frequency signal transmitted to the array; the third radio frequency signal is a radio frequency signal reflected by a capacitor composed of a plate and a ground plate; wherein the communication method is used for a transmission strip line waveguide connector, the transmission strip line waveguide connector comprising: a transmission strip line, a dielectric substrate, and the ground plate; the transmission strip line is located in the A dielectric substrate is provided on a first surface, and the ground plate is located on a second surface of the dielectric substrate; a slot is provided on the ground plate, and the slot is used to couple with the waveguide; the transmission strip line includes: the microstrip line, the plate, and an array coupled with the slot; wherein the microstrip line includes: a first end and a second end opposite to each other, and a third end located between the first and second ends, the first end is connected to the plate, the second end is used to connect with an active device, and the third end is connected to the array; the plate is connected to a DC feed terminal, and the plate is coupled to the ground plate.

[0035] In an optional implementation, the electrode plate is used to receive a DC signal loaded on the DC feeding end, so that the DC signal is transmitted to the active device through the electrode plate and the microstrip line in sequence.

[0036] In a sixth aspect, a computer-readable storage medium is provided, in which a computer program or instruction is stored. When the computer program or instruction is executed by a processing device, the method described above is implemented.

[0037] In a seventh aspect, a computer program product is provided, comprising a computer program or instructions, which implement the method described above when the computer program or instructions are executed on a processing device.

[0038] In the eighth aspect, a communication device is provided, which can be a first device, or a module or unit (for example, a chip, or a chip system, or a circuit) in the first device that corresponds one-to-one to the method / operation / step / action described in the fourth / fifth aspect, or a device that can be used in combination with the first device.

[0039] In a ninth aspect, an electronic device is provided, comprising: a transceiver for receiving or sending signals; a memory for storing computer program instructions; and a processor for running the computer program instructions so that the electronic device implements the communication method described above.

[0040] In a tenth aspect, a chip system is provided, which includes a processing circuit and a storage medium, wherein the storage medium stores computer program instructions; when the computer program instructions are executed by the processing circuit, the method described above is implemented. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] FIG1 is a circuit diagram of a communication system;

[0042] FIG2 is a schematic structural diagram of a coaxial line;

[0043] FIG3 is a cross-sectional view of the coaxial line in FIG2 ;

[0044] FIG4 is a schematic diagram of the structure of a waveguide;

[0045] FIG5 is a cross-sectional view of the waveguide in FIG4 ;

[0046] FIG6 is a schematic structural diagram of a planar transmission line;

[0047] FIG7 is a top view of the planar transmission line in FIG6;

[0048] FIG8 is a schematic diagram of the disassembled structure of a transmission strip line waveguide connector provided in an embodiment of the present application;

[0049] FIG9 is a top view of a transmission stripline waveguide connector provided in an embodiment of the present application;

[0050] FIG10 is a schematic diagram of electric field distribution on a microstrip line provided in an embodiment of the present application;

[0051] FIG11 is a top view of another transmission stripline waveguide connector provided in an embodiment of the present application;

[0052] FIG12 is a transmission loss curve diagram of the waveguide-microstrip transition at different DC feed ends in FIG11;

[0053] FIG13 is a top view of another transmission stripline waveguide connector provided in an embodiment of the present application;

[0054] FIG14 is a transmission loss curve diagram of the waveguide-microstrip transition at different DC feeding ends in FIG13 . DETAILED DESCRIPTION

[0055] In order to make the purpose, technical solutions and advantages of this application clearer, this application will be further described in detail below with reference to the accompanying drawings.

[0056] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified with "first," "second," etc., may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0057] In addition, in this application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they can change accordingly according to changes in the orientation of the components in the drawings.

[0058] The following explains the terms that may appear in the embodiments of the present application.

[0059] A transmission line, also called a feeder line, is the connection between an antenna's transceiver and the radiator. Depending on the frequency and form, a transmission line can directly transmit current waves or electromagnetic waves. The connection point on the radiator where the transmission line connects is often called a feed point. Transmission lines include wire transmission lines, coaxial transmission lines, waveguides, or microstrip lines. Depending on the carrier, transmission lines can be implemented using materials such as LCP (Liquid Crystal Polymer), FPC (Flexible Printed Circuit), or PCB (Printed Circuit Board).

[0060] Electrical connection: This can be understood as the physical contact and electrical conduction between components. It can also be understood as the connection between different components in a circuit structure through physical lines such as PCB copper foil or wires that can transmit electrical signals. Here, "connection" refers to the mechanical structure and physical structure of the connection.

[0061] Coupling: can be understood as direct coupling and / or indirect coupling, and "coupling connection" can be understood as direct coupling connection and / or indirect coupling connection. Direct coupling can also be referred to as "electrical connection", which is understood as the physical contact and electrical conduction between components; it can also be understood as the form in which different components in the circuit structure are connected through physical lines such as printed circuit board (PCB) copper foil or wires that can transmit electrical signals; "indirect coupling" can be understood as two conductors being electrically conductive in an airless / non-contact manner. In one embodiment, indirect coupling can also be referred to as capacitive coupling, for example, signal transmission is achieved by forming an equivalent capacitance through coupling between the gap between two conductive parts.

[0062] Connection: The process of making two or more components conductive or connected to each other to transmit signals or energy through the above-mentioned "electrical connection" or "coupling connection" can be called connection.

[0063] Transmission loss: The ratio of output power to input power, representing the power loss during transmission due to factors such as the transmission medium. The spatial propagation of ultra-high frequency and microwave signals can cause various transmission impairments, including significant attenuation and multipath fading. This can be expressed as S21. A larger S21 value indicates a lower transmission loss. The ideal value is 1, or 0dB. Signal quality is generally guaranteed above -3dB.

[0064] Capacitance: This can be understood as lumped capacitance and / or distributed capacitance. Lumped capacitance refers to capacitive components, such as capacitors. Distributed capacitance (or distributed capacitance) refers to the equivalent capacitance formed by two conductive parts separated by a certain gap. The capacitor in this application is a distributed capacitance, consisting of two plates and an insulating medium disposed between the two plates.

[0065] In order to better understand the signal transmission method disclosed in the embodiment of the present application, a communication system to which the embodiment of the present application is applicable is described.

[0066] The technical solutions / devices of the embodiments of the present application can be applied to various communication systems. For example, global mobile communication systems, long term evolution (LTE) systems, universal mobile communication systems, fourth generation mobile communication technology (4G) systems, next generation radio access networks (NG-RAN), new radio (NR) systems, fifth generation mobile communication technology (5G) systems, and with the continuous development of communication technology, the technical solutions of the embodiments of the present application can also be used for subsequent evolved communication systems, such as sixth generation mobile communication technology (6G) systems, seventh generation mobile communication technology (7G) systems, and the like.

[0067] An embodiment of the present application provides a communication device, which may be a transceiver, a network device, a microwave communication device, a WiFi communication device, etc., or may be various types of terminal devices.

[0068] In the embodiments of the present application, the terminal device may also be referred to as user equipment (UE), terminal, access terminal, subscriber unit, user station, mobile station, mobile station (MS), remote station, remote terminal, mobile device, user terminal, user agent or user device, and may be applied to 4G, 5G or even 6G systems. The terminal device in the embodiments of the present application may be a handheld device, vehicle-mounted device, wearable device, computing device or other processing device connected to a wireless modem with wireless communication capabilities; the terminal device may be a terminal with a function of connecting to a cellular base station; the terminal device may also be a terminal in a wireless fidelity (Wi-Fi) system (i.e., a Wi-Fi terminal), which has a function of connecting to a Wi-Fi wireless access point (AP) (i.e., a Wi-Fi AP). For example, the terminal device may be a cellular phone, a smart phone, a tablet computer, a wireless data card, a personal digital assistant (PDA), a tablet computer, a wireless modem, a handheld device, a laptop computer, a machine type communication (MTC) terminal, etc. The terminal device may also be a virtual reality (VR) terminal device, an augmented reality (AR) terminal device, a wireless terminal in industrial control, a wireless terminal in self-driving, a wireless terminal in remote medical care, a wireless terminal in a smart grid, a wireless terminal in transportation safety, a wireless terminal in a smart city, a wireless terminal in a smart home, etc.

[0069] A network device in this application is a device with wireless transceiver capabilities. For example, a radio access network (RAN) device can provide wireless communication services and connect terminals to a wireless network. A RAN device can be a node in a radio access network, referred to as a RAN node.

[0070] In one possible scenario, a RAN node may be a base station (BS), an evolved NodeB (eNodeB), a transmission reception point (TRP), a home evolved NodeB (HNB), a wireless fidelity (Wi-Fi) access point (AP), a mobile switching center, a next-generation NodeB (gNB) in a 5G mobile communication system, a next-generation NodeB in a 6G mobile communication system, or a base station in a future mobile communication system. A RAN node may also be a device that performs base station functions in device-to-device (D2D) communication systems, vehicle-to-everything (V2X) communication systems, machine-to-machine (M2M) communication systems, and Internet of Things (IoT) communication systems. A RAN node may also be a RAN node in a non-terrestrial network (NTN), meaning that the RAN node may be deployed on a high-altitude platform or satellite. A RAN node can be a macro base station, a micro base station, an indoor base station, a relay node, a donor node, or a radio controller in a cloud radio access network (CRAN) scenario, or a node in an open radio access network (O-RAN or ORAN) scenario. Alternatively, a RAN node can be a server, a wearable device, a vehicle, or an onboard device. For example, a RAN node in V2X technology can be a roadside unit (RSU). Of course, a RAN node can also be a node in the core network.

[0071] In some embodiments, the communication device includes a waveguide and a communication system, wherein the communication system can be used to transmit radio frequency signals.

[0072] In some embodiments, the communication system may be a microwave circuit system. Microwaves refer to electromagnetic waves with frequencies between 30 MHz and 300 GHz. They are easily beamed, highly directional, and propagate in straight lines, making them suitable for transmitting high-frequency signals in free space with unobstructed line of sight. Microwave frequencies are higher than those of typical radio waves and are also known as ultra-high frequency electromagnetic waves.

[0073] In other embodiments, the communication system may be used to transmit radio frequency signals above 40 GHz.

[0074] Figure 1 is a circuit diagram of a communication system. In some embodiments, the communication system includes one or more microwave devices. Microwave devices include active devices and passive devices.

[0075] Active components within microwave devices, such as diodes, transistors, switches, and amplifiers, all require DC power. Integrated chips (ICs) that integrate multiple devices often have independent, designed power ports, typically separate from the RF transmission lines. However, RF components like diodes and transistors are single, compact devices without dedicated power ports. The RF port doubles as a power supply, necessitating external circuitry to isolate the RF signal from the DC power supply to prevent DC damage to other components.

[0076] In some embodiments, a planar transmission line may be used as a transmission line connecting various microwave devices.

[0077] In some embodiments, different communication systems may be connected using waveguides, and therefore, a transition structure between a waveguide and a planar transmission line needs to be provided.

[0078] For example, as shown in FIG1 , the communication system includes: a first transmission line 01 , a DC feeding terminal 02 , an active device 03 and a second transmission line 04 .

[0079] The first transmission line 01 is connected to the active device 03 through the second transmission line 04. The first transmission line 01 is used to input a radio frequency signal to the active device 03. The DC feeding terminal 02 is connected to the active device 03 through the second transmission line 04. The DC feeding terminal 02 is used to feed DC power to the active device 03.

[0080] The embodiments of this application do not limit the types of the first and second transmission lines. Transmission lines are categorized as coaxial, waveguide, and planar transmission lines. The structures of different types of transmission lines are described below with reference to Figures 2, 3, 4, 5, 6, and 7.

[0081] Figure 2 is a schematic diagram of the structure of a coaxial line provided in an embodiment of the present application. Figure 3 is a cross-sectional view of the coaxial line in Figure 2. As shown in Figures 2 and 3, the coaxial line includes: a first conductor 1, a second conductor 2, and a dielectric layer 3. The first conductor 1 and the second conductor 2 are coaxial, and the dielectric layer 3 is located between the first conductor 1 and the second conductor 2.

[0082] Coaxial cables use a closed structure, with electromagnetic waves propagating in the dielectric medium between the inner and outer conductors. At low frequencies, coaxial cable losses are minimal. However, at higher frequencies, such as millimeter waves, dielectric losses in the coaxial cable begin to increase, leading to significant transmission losses. Therefore, coaxial cables are rarely used as primary transmission lines in millimeter wave bands above 40 GHz.

[0083] Figure 4 is a schematic diagram of the structure of a waveguide provided in an embodiment of the present application. Figure 5 is a cross-sectional view of the waveguide in Figure 4. As shown in Figures 4 and 5, the waveguide is a single-conductor transmission line, comprising: a first conductor 1. The first conductor 1 is arranged to form a cavity, and the cavity is filled with air 4.

[0084] The interior of a waveguide is filled with air, allowing electromagnetic waves to propagate within it, resulting in very low losses and high power capacity. However, due to its non-planar structure, waveguides, like coaxial cables, are difficult to use in scenarios with a large number of active devices.

[0085] Planar transmission lines include microstrip lines, striplines, slot lines, coplanar waveguides, etc. Planar transmission lines can be integrated with active devices to form microwave circuits. Among them, microstrip lines have a simple structure and are often used in microwave circuits.

[0086] Figure 6 is a schematic diagram of the structure of a planar transmission line provided in an embodiment of the present application. Figure 7 is a top view of the planar transmission line in Figure 6. As shown in Figures 6 and 7, the planar transmission line includes: a first conductor 1, a dielectric layer 3 disposed on the first conductor 1, and a transmission stripline 5 disposed on the dielectric layer. The first conductor 1 serves as a ground plane.

[0087] In one embodiment, the first transmission line 01 is, for example, a coaxial line, which is suitable for circuit systems with relatively low frequencies.

[0088] The communication system provided in this application has a relatively high frequency, and therefore waveguides and planar transmission lines can be used as transmission lines respectively.

[0089] For example, in some embodiments, the first transmission line 01 is a waveguide, and the second transmission line 04 is a planar transmission line. For example, the second transmission line 04 may be a planar transmission line as shown in FIG. 6 .

[0090] Among them, RF devices such as diodes and transistors are single devices with simple structures. Their RF ports also serve as power supply ports. For such devices, it is necessary to design an external circuit to isolate the RF signal and DC power supply to prevent DC power from damaging other devices.

[0091] As shown in Figure 1, a first inductor 002 is connected in parallel to the RF transmission line at the input end of active device 03, and a second inductor 003 is connected in parallel to the RF transmission line at the output end of active device 03 to provide DC power. Thus, two power supply inductors are connected in parallel to the RF transmission line at both ends of active device 03 to provide DC power to the diode.

[0092] Continuing with Figure 1, a first capacitor 001 is connected in series with the RF transmission line at the input end of active device 03, and a second capacitor 004 is connected in series with the RF transmission line at the output end of active device 03 to isolate the DC power supply. Thus, connecting two capacitors in series on the input and output transmission lines of active device 03 prevents the DC power supplying active device 03 from entering the RF transmission line.

[0093] However, the above structure is only applicable to microwave circuits with lower frequencies. In microwave bands with higher frequencies, such as those above 40 GHz, the power supply port suffers from large losses, and it is difficult to achieve good RF isolation using traditional inductors, requiring the additional design of complex power supply isolation circuits.

[0094] To this end, an embodiment of the present application provides an improved communication system, which includes: a transmission strip line waveguide connector, which integrates the connection function between the waveguide and the transmission strip line, as well as the DC power supply function.

[0095] FIG8 is a communication system provided by an embodiment of the present application. As shown in FIG8 , the communication system 100 includes: a waveguide 10 and a transmission strip line waveguide connector 20 stacked along the z direction, wherein the connector 20 is coupled to the waveguide 10 .

[0096] In some embodiments, the transmission stripline waveguide connector 20 uses a planar transmission line. For example, as shown in FIG8 , the planar transmission line can be a microstrip line.

[0097] As shown in FIG8 , the transmission stripline waveguide connector 20 includes a transmission stripline 203 stacked along the z direction, a dielectric substrate 202 , and a ground plate 201 .

[0098] In some embodiments, the transmission stripline 203, dielectric substrate 202, and ground plane 201 can be arranged in different layers along the thickness of the connector. These layers can be parallel to each other. The plane in which each layer lies can be referred to as the xy plane, and the direction perpendicular to the xy plane can be referred to as the z direction. In other words, the transmission stripline 203, dielectric substrate 202, and ground plane 201 can be arranged in layers along the z direction.

[0099] The transmission strip line 203 is disposed on a first surface of the dielectric substrate 202 , and the ground plate 201 is disposed on a second surface of the dielectric substrate 202 .

[0100] In some embodiments, a ground plate 201 is disposed on the second surface of the dielectric substrate 202 .

[0101] The dielectric substrate 202 is used to support the ground plate 201 and the transmission line 203 .

[0102] In some embodiments, the dielectric substrate 202 is made of insulating material, such as resin, ceramic, fiberglass, etc. The ground plate 201 can be a metal structure disposed on the dielectric substrate 202 as shown in FIG8 .

[0103] In other embodiments of the present application, the dielectric substrate 202 is, for example, a printed circuit board (PCB), and the ground plate 201 is made of a conductive material.

[0104] In one embodiment, the conductive material can be any of the following materials: copper, aluminum, stainless steel, brass, and alloys thereof, copper foil on an insulating substrate, aluminum foil on an insulating substrate, gold foil on an insulating substrate, silver-plated copper, silver-plated copper foil on an insulating substrate, silver foil and tin-plated copper on an insulating substrate, cloth impregnated with graphite powder, a graphite-coated substrate, a copper-plated substrate, a brass-plated substrate, and an aluminum-plated substrate. Those skilled in the art will appreciate that the ground plate 201 can also be made of other conductive materials.

[0105] In one embodiment, the material of the ground plate 201 may be metallic copper, that is, the ground plate 201 may specifically be a copper clad layer on the second surface of the dielectric substrate 202 .

[0106] In some embodiments, the ground plate 201 is printed on the first surface of the dielectric substrate 202 .

[0107] In other embodiments, the dielectric substrate 202 may also be other substrates with a load-bearing function, and the material of the ground plate 201 may also be other conductors, which is not specifically limited in this application.

[0108] The waveguide 10 is disposed close to the ground plate 201 .

[0109] In some embodiments, the waveguide 10 is a radio frequency signal input port or output port of an external circuit, and is used to transmit radio frequency signals to an active device, or to receive radio frequency signals sent by an active device.

[0110] In some embodiments, a slot 2011 is defined on the ground plate 201 , and the waveguide 10 is coupled to the slot 2011 .

[0111] In some embodiments, the transmission strip line 203 includes a microstrip line 2031, a plate 2033, and an array 2032, wherein the plate 2033 and the array 2032 are both connected to the microstrip line 2031. The microstrip line 2031 is also used to connect to active devices.

[0112] In some embodiments, the first end of the microstrip line 2031 is used to connect to an active device, the second end of the microstrip line 2031 is connected to the plate 2033, and the third end of the microstrip line 2031 is connected to the array 2032. The third end of the microstrip line 2031 is located between the first end and the second end of the microstrip line 2031, that is, the array 2032 is disposed between the two ends of the microstrip line 2031.

[0113] The array element 2032 is coupled to the slot 2011 on the ground plane 201 .

[0114] During the RF signal transmission phase, the RF signal transmitted by the waveguide 10 is coupled into the dielectric substrate 202 through the slot 2011 on the ground plate 201, and is then transmitted from the dielectric substrate 202 to the array 2032. The RF signal then passes through the array 2032 and is transmitted to the first and second ends of the microstrip line 2031. The RF signal transmitted to the first end of the microstrip line is passed to the active device, completing the transition between the waveguide 10 and the microstrip line 2031 and achieving RF signal transmission.

[0115] Alternatively, during the RF signal reception phase, the energy of the RF signal from the active device can be transferred to the array 2032 via the microstrip line 2031, and then coupled to the slot 2011 on the ground plane 201 through the dielectric substrate 202, and then coupled to the waveguide 10 via the slot 2011, thereby achieving RF signal reception.

[0116] In the above embodiment, after the RF signal is transmitted to the second end of the microstrip line 2031, it reaches the plate. In order to converge the RF signal at the array 2032 to reduce loss, in some embodiments, the transmission strip line waveguide connector 20 further includes: a capacitor.

[0117] In some embodiments, the capacitance is a distributed capacitance, which refers to an equivalent capacitance formed by two conductive members separated by a certain gap.

[0118] The capacitor includes: a plate 2033 , a ground plate 201 , and a dielectric substrate 202 located between the plate 2033 and the ground plate 201 .

[0119] The electrode plate 2033 is opposite to the ground plate 201. Both the electrode plate 2033 and the ground plate 201 are conductors and are separated by a certain gap to form an equivalent capacitor.

[0120] The embodiment of the present application does not limit the shape and material of the plate 2033. In some embodiments, the plate 2033 can be made of the same material as the microstrip line 2031. Its shape may include: fan-shaped, rectangular, circular, etc.

[0121] In some embodiments, the dimension of the plate 2033 in the y direction is greater than the dimension of the microstrip line 2031 in the y direction. For example, as shown in Figures 9 and 13, the width of the microstrip line 2031 in the y direction is N1, and the width of the plate 2033 in the y direction is N2.

[0122] In some embodiments, as shown in Figure 9, the electrode 2033 is fan-shaped, the width N2 of the electrode 2033 in the y direction is gradual, and the size of the electrode 2033 in the y direction is larger than the size of the microstrip line 2031 along the y direction. The maximum size of the electrode 2033 in the y direction (the maximum value of the width N2) can be larger than the size of the microstrip line 2031 along the y direction.

[0123] In some embodiments, as shown in Figure 13, the electrode 2033 is rectangular, the width N2 of the electrode 2033 in the y direction is constant, and the size of the electrode 2033 in the y direction is larger than the size of the microstrip line 2031 along the y direction. The size of the electrode 2033 in the y direction (width N2) can be larger than the size of the microstrip line 2031 along the y direction.

[0124] Therefore, the larger the size of the plate 2033 is, the larger the area of ​​the plate 2033 is, the larger the equivalent capacitance generated is, the better the reflection performance of the radio frequency signal is, and the loss can be further reduced.

[0125] The electrode plate 2033, the ground plate 201 and the dielectric substrate 202 together form a capacitor. The radio frequency signal transmitted to the second end of the microstrip line 2031 passes through the electrode plate 2033 connected to the microstrip line 2031. Since the electrode plate 2033 and the ground plate 201 form a capacitor, the capacitor is short-circuited for the above-mentioned high-frequency radio frequency signal, so the electric field at the capacitor position is zero, and the radio frequency signal will be totally reflected back at this position.

[0126] For example, during the RF signal transmission phase, the RF signal transmitted by the waveguide 10 is coupled into the dielectric substrate 202 through the slot 2011 in the ground plane 201. The signal is then transferred from the dielectric substrate 202 to the array 2032. The signal then passes through the array 2032 and, through the array, to the first and second ends of the microstrip line 2031. The RF signal transmitted to the first end of the microstrip line is directed to the active device. The RF signal transmitted to the second end of the microstrip line is directed to the plate and reflected by the capacitor formed by the plate and the ground plane. The reflected RF signal then passes through the microstrip line to the active device. This completes the transition between the waveguide 10 and the transmission strip line, enabling RF signal transmission.

[0127] Alternatively, during the RF signal receiving stage, the energy of the RF signal from the active device may be transferred to the array 2032 via the microstrip line 2031 , and the RF energy transferred to the array 2032 may be partially coupled to the waveguide 10 .

[0128] Another portion of the RF energy transmitted to the array 2032 passes through the plate 2033 and is reflected by the capacitor formed by the plate and the ground plate. The reflected RF energy is coupled into the waveguide 10 through the gap between the radiating array 2032 and the ground plate 201, thereby completing the RF signal transition from the transmission strip line to the waveguide 10.

[0129] In the above example, the energy transfer principle from the waveguide 10 to the microstrip line 2031 is opposite to the signal transmission direction from the microstrip line 2031 to the waveguide 10 .

[0130] In some embodiments, the transmission strip line waveguide connector 20 further includes: a DC feeding end 205, which is connected to the electrode 2033. Since the electrode 2033 is connected to the microstrip line 2031, directly supplying DC power on the electrode 2033 can load a DC bias onto the microstrip line 2031.

[0131] During operation, the DC feeding terminal 205 can load a DC signal to the plate 2033 , and the DC signal sequentially passes through the plate 2033 and the microstrip line 2031 to reach the active device, thereby providing DC power to the active device.

[0132] The transmission strip line waveguide connector 20 provided in the embodiment of the present application can transmit the radio frequency signal transmitted by the waveguide 10 to the active device, transmit the signal through the active device, and can also transmit the signal received by the active device to the waveguide 10, thereby realizing signal reception and transmission.

[0133] A plate 2033 is provided at one end of the microstrip line, so that the plate 2033, the ground plate 201 and the dielectric substrate 202 together form a capacitor, so that the radio frequency signal transmitted to the capacitor is reflected, reducing energy leakage.

[0134] At the same time, a DC feeding terminal 205 is set on the plate 2033 of the capacitor, and a DC signal can be loaded onto the plate 2033. The DC signal passes through the plate 2033 and the microstrip line 2031 in turn to reach the active device, thereby realizing DC power supply to the active device. The capacitor composed of the plate 2033 and the ground plate 201 is disconnected from the DC signal and will not affect the DC signal.

[0135] Therefore, in the connector provided in the embodiment of the present application, the plate is reused in the capacitor and the DC feeding circuit. Through a circuit system, not only the transition function between the waveguide and the transmission strip line is realized, but also a power supply port isolated from the radio frequency signal is provided, thereby realizing DC feeding of the active device, thereby realizing power supply and signal transmission of the device at the same time. The structure is simple and the loss is reduced compared with the circuit shown in Figure 1.

[0136] The structures of the gap 2011 and the array 2032 are described below with reference to FIG. 8 and FIG. 9 .

[0137] As shown in FIG8 , the ground plate 201 is provided with two slots 2011 : a first slot 2011 a and a second slot 2011 b arranged along the y direction as shown in FIG9 .

[0138] The first slit 2011a and the second slit 2011b are arranged in parallel. The lengths of the first slit 2011a and the second slit 2011b are the same, for example, both are l, wherein the lengths l of the first slit 2011a and the second slit 2011b satisfy: Where λ1 is the wavelength of the electromagnetic wave in waveguide 10, and A is the error threshold. In some embodiments, A satisfies the following range: -0.1λ1 ≤ A ≤ 0.1λ1. That is, the gap length satisfies the following range: 0.4λ1 ≤ l ≤ 0.6λ1. For example, in some embodiments, the gap length l is 0.5λ1.

[0139] The array 2032 in FIG8 includes at least a first array 2032a and a second array 2032b arranged along the x-direction as shown in FIG9 . The projection of the first array 2032a on the ground plane 201 overlaps with the first slit 2011a, and the projection of the second array 2032b on the ground plane 201 overlaps with the second slit 2011b. The overlap between the array projection on the ground plane 201 and the slit may have an error, for example, partial overlap. For example, the array projection on the ground plane 201 is parallel to the slit, and the centers of the two overlap.

[0140] The first array 2032a and the second array 2032b have the same length, for example, L. The lengths L of the first array 2032a and the second array 2032b satisfy the following: |L-λ2| ≤ B, where λ2 is the wavelength of the electromagnetic wave on the microstrip line and B is the error threshold. In some embodiments, B satisfies the following range: -0.3λ2 ≤ B ≤ 0.3λ2. That is, the lengths L of the first array 2032a and the second array 2032b satisfy the following range: 0.7λ2 ≤ l ≤ 1.3λ2. For example, in some embodiments, the lengths L of the first array 2032a and the second array 2032b are λ2.

[0141] When the error threshold is within the above range, the radio frequency transmission loss does not exceed 60%, and the radio frequency performance is good.

[0142] The present embodiment does not limit the number of arrays. In some embodiments, the number of arrays 2032 can be two or more. The number of arrays 2032 and the number of slots 2011 are the same, and the two are aligned one to one. The number of arrays 2032 and slots 2011 is related to the diameter of the waveguide 10, and the slots 2011 should be within the opening of the waveguide 10.

[0143] The structure of the planar transmission line is described below with reference to FIG8 and FIG9 .

[0144] In some embodiments, the transmission line further includes a first connecting line 2032c, through which the first end of the first array 2032a and the first end of the second array 2032b are connected.

[0145] In some embodiments, the width of the first connecting line is smaller than the width of the array, thereby improving the impedance matching between the first array 2032a and the second array 2032b.

[0146] In other embodiments, as shown in FIG. 9 , the transmission line further includes a second connecting line 2032 d .

[0147] For example, the first end of the first array 2032a is connected to the first end of the second array 2032b via a first connecting line 2032c, and the second end of the first array 2032a is connected to the second end of the second array 2032b via a second connecting line 2032d. The first connecting line 2032c and the second connecting line 2032d are relatively narrow, for example, the widths of the first connecting line 2032c and the second connecting line 2032d are both smaller than the width of the array.

[0148] The embodiment of the present application does not limit the structures of the first connecting line 2032c and the second connecting line 2032d. The first connecting line 2032c and the second connecting line 2032d may also be other structures for impedance matching.

[0149] The structure of the microstrip line 2031 is described below with reference to FIG8 and FIG9 .

[0150] In some embodiments, a first portion of the microstrip line 2031 is connected to the array 2032 , a second portion of the microstrip line 2031 is connected to the plate 2033 , and the second portion of the microstrip line 2031 is located between the plate 2033 and the array 2032 .

[0151] In some embodiments, the length L a of the first array 2032 a satisfies: |La−λ2|≤B, and the first array 2032 a is symmetrical with respect to the microstrip line 2031 .

[0152] The length Lb of the second array 2032 b satisfies: |Lb−λ2|≤B, and the second array 2032 b is symmetrical with respect to the microstrip line 2031 .

[0153] Therefore, by providing two arrays, more radio frequency energy is transferred to the microstrip line 2031 compared to one array.

[0154] In addition, symmetrically arranging the first array 2032a and the second array 2032b about the microstrip line 2031 is conducive to uniformly transmitting the RF energy to the microstrip line 2031 through the first array 2032a and the second array 2032b, thereby avoiding impedance mismatch caused by uneven RF energy transmission.

[0155] In order to further improve the radio frequency transmission performance of the connector, the microstrip line can be further improved.

[0156] In some embodiments of the present application, the microstrip line includes: a first sub-microstrip line 2031a, a second sub-microstrip line 2031b and a third sub-microstrip line 2031c.

[0157] The first sub-microstrip line 2031 a is located between the second sub-microstrip line 2031 b and the third sub-microstrip line 2031 c , and the first sub-microstrip line 2031 a is connected to the array 2032 .

[0158] One end of the second sub-microstrip line 2031 b is connected to the first sub-microstrip line 2031 a , and the other end is connected to the electrode 2033 .

[0159] One end of the third sub-microstrip line 2031 c is connected to the first sub-microstrip line 2031 a , and the other end is connected to the active device.

[0160] The array 2032 includes a first array 2032a and a second array 2032b.

[0161] In some embodiments, a first end of the first sub-microstrip line 2031 a is connected to the first array 2032 a , and a second end of the first sub-microstrip line 2031 a is connected to the second array 2032 b .

[0162] Figure 10 is a schematic diagram of the electric field distribution on a transmission strip line provided by an embodiment of the present application. As shown in Figure 10, the electric field intensity is greatest at points a and b, with point a being at one-quarter of the period and point b being at three-quarters of the period. One period corresponds to the wavelength of an electromagnetic wave on a microstrip line, with one-quarter of the period corresponding to one-quarter of the wavelength, and three-quarters of the period corresponding to three-quarters of the wavelength.

[0163] To further reduce RF energy loss on the microstrip line, in some embodiments, the array 2032 can be placed at a location on the microstrip line where the electric field intensity is the highest. Simultaneously, the length of the second sub-microstrip line 2031b can be adjusted so that the RF energy reflected back from the capacitor 2030 formed by the plate 2033 and the ground plane 201 returns to the location of the array 2032.

[0164] In some embodiments, the spacing d between adjacent arrays 2032 satisfies: Where λ2 is the wavelength of the electromagnetic wave on the microstrip line, and N is a positive integer. For example, N is 1, 2, 3, 4, 5, etc. C is the error threshold. In some embodiments, C satisfies the following range: -0.1Nλ2 ≤ C ≤ 0.1Nλ2. In other words, the spacing d between adjacent arrays 2032 satisfies the following range: 0.4Nλ2 ≤ 1 ≤ 0.6Nλ2. For example, in some embodiments, the spacing d between adjacent arrays 2032 is 0.5Nλ2.

[0165] In some embodiments, the spacing between the first array 2032a and the second array 2032b is For example, the spacing can be: λ2, 2λ2、 That is to say, the distance between the first array and the second array differs by an integer multiple of half a wavelength. Thus, when setting the first array 2032a and the second array 2032b, if one of the arrays is set at a point of strong electric field, the other array will also be located at a point of strong electric field.

[0166] Therefore, the first array 2032a and the second array 2032b can be arranged at the electric field intensity point on the microstrip line, thereby improving the radiation performance of the first array 2032a and the second array 2032b.

[0167] In some embodiments, the second sub-microstrip line 2031b is located between the first end of the first sub-microstrip line 2031a and the electrode plate, so that the length D of the second sub-microstrip line 2031b satisfies:

[0168] Where λ2 is the wavelength of the electromagnetic wave on the microstrip line, and n is a natural number. For example, n is 0, 1, 2, 3, 4, etc. E is the error threshold. In some embodiments, the range of E satisfies: -0.05(2n-1)λ2 ≤ C ≤ 0.05(2n-1)λ2. In other words, the range of the length D of the second sub-microstrip line 2031b satisfies: 0.2(2n-1)Nλ2 ≤ D ≤ 0.3(2n-1)Nλ2. For example, in some embodiments, the length D of the second sub-microstrip line 2031b is 0.25(2n-1)Nλ2.

[0169] In some embodiments, the length of the second sub-microstrip line 2031b is Wherein, n is a natural number. For example, n is 0, 1, 2, 3, 4, etc. For example, the length of the second sub-microstrip line 2031b can be: That is, the length of the second sub-microstrip line 2031b is an odd multiple of a quarter wavelength. Thus, when the signal reflected at the capacitor 2030 passes through After the microstrip line 2031 of a long length, the electric field is strongest at the radiation array 2032, thereby reducing the transition loss.

[0170] For example, the radio frequency signal is transmitted through the array 2032 to the two ends of the microstrip line 2031. After the microstrip line 2031 of a certain length, it reaches the plate 2033. Since the capacitor 2030 composed of the plate 2033 and the ground plane is a short circuit for the RF signal, the electric field at the position of the capacitor 2030 is zero, and the RF signal will be totally reflected back at this point. After the microstrip line 2031 of a long length, the electric field is strongest at the radiation array 2032, thereby reducing the transition loss.

[0171] Therefore, by adjusting the length of the second sub-microstrip line 2031b, the electric field of the radio frequency signal reflected at the capacitor 2030 can be made strongest at the radiation array 2032, thereby reducing the transition loss between the waveguide 10 and the microstrip line.

[0172] The embodiment of the present application does not limit the shape of the electrode plate 2033. In some embodiments of the present application, the shape of the electrode plate 2033 includes: fan-shaped, rectangular, and circular.

[0173] In some embodiments, as shown in Figures 9 and 11, the plate 2033 is fan-shaped. The fan-shaped plate 2033 includes a first side and a second side opposite to each other along the X direction, and a third side and a fourth side connecting the first side and the second side.

[0174] Among them, the first side, the third side and the fourth side are straight sides, and the second side is an arc side.

[0175] In some embodiments, the first side includes opposite first and second ends, the second side includes opposite third and fourth ends, the third side is used to connect the first end of the straight side and the first end of the arcuate side, and the fourth side is used to connect the second end of the first side and the second end of the second side.

[0176] In some embodiments, the first side of the electrode plate is connected to the microstrip line, and at least one of the second side, the third side, or the fourth side is used to be connected to the DC feed end.

[0177] In some embodiments, the second side is connected to the DC feeding terminal 205 .

[0178] The embodiment of the present application does not limit the structure of the sector plate 2033. For example, the radius of the sector plate 2033 is approximately 0.125λ2 to 0.25λ2, where λ2 is the wavelength of the electromagnetic wave on the microstrip line.

[0179] In some embodiments, the arc of the sector plate 2033 is 120°.

[0180] The embodiment of the present application does not limit the position of the DC feeder terminal 205 . The DC feeder terminal 205 can be connected to the second side of the fan-shaped plate 2033 , and the position or angle is not limited.

[0181] FIG11 is a schematic diagram illustrating the positions and angles of the DC feeder terminals 205. FIG11 shows seven DC feeder terminals: a first DC feeder terminal 205A, a second DC feeder terminal 205B, a third DC feeder terminal 205C, a fourth DC feeder terminal 205D, a fifth DC feeder terminal 205E, a sixth DC feeder terminal 205F, and a seventh DC feeder terminal 205G. These DC feeder terminals can be connected to the second side of the sector plate 2033 and are located at different locations.

[0182] Among them, the angle between the first DC feeding terminal 205A and the first side of the fan-shaped plate 2033 is 40°, the angle between the second DC feeding terminal 205B and the first side of the fan-shaped plate 2033 is 50°, the angle between the third DC feeding terminal 205C and the first side of the fan-shaped plate 2033 is 60°, the angle between the fourth DC feeding terminal 205D and the first side of the fan-shaped plate 2033 is 70°, the angle between the fifth DC feeding terminal 205E and the first side of the fan-shaped plate 2033 is 80°, the angle between the sixth DC feeding terminal 205F and the first side of the fan-shaped plate 2033 is 90°, and the angle between the seventh DC feeding terminal 205G and the first side of the fan-shaped plate 2033 is 120°.

[0183] Figure 12 is a graph showing the transmission loss of the waveguide-microstrip transition at different DC feeder terminals in Figure 11. As shown in Figure 12, in the 66 GHz to 76 GHz frequency band, the RF transmission losses corresponding to the first DC feeder terminal 205A, the second DC feeder terminal 205B, the third DC feeder terminal 205C, the fourth DC feeder terminal 205D, the fifth DC feeder terminal 205E, the sixth DC feeder terminal 205F, and the seventh DC feeder terminal 205G are similar, approximately -1 dB. This minimizes transmission loss, improving signal quality.

[0184] In other embodiments, as shown in FIG13 , the electrode plate 2033 is rectangular in shape. The rectangular electrode plate 2033 includes a first side and a second side opposite to each other along the X direction, and a third side and a fourth side connecting the first side and the second side.

[0185] The first side, the second side / the third side and the fourth side are all straight sides.

[0186] In some embodiments, the first side includes opposite first and second ends, the second side includes opposite third and fourth ends, the third side is used to connect the first end of the straight side and the first end of the arcuate side, and the fourth side is used to connect the second end of the first side and the second end of the second side.

[0187] In some embodiments, the first side of the electrode plate is connected to the microstrip line, and at least one of the second side, the third side, or the fourth side is used to be connected to the DC feed end.

[0188] In some embodiments, as shown in FIG13 , the second side is connected to the eighth DC feeding terminal 205M.

[0189] In other embodiments, as shown in FIG13 , the fourth side is connected to the ninth DC feeding terminal 205N.

[0190] The embodiment of the present application does not limit the position of the DC feed terminal 205. In some embodiments, the DC feed terminal 205 can be connected to the second side or the fourth side of the rectangular plate 2033, and the position or angle is not limited.

[0191] Next, refer to Figure 13, which shows two DC feeding terminals: an eighth DC feeding terminal 205M and a ninth DC feeding terminal 205N. The eighth DC feeding terminal 205M can be connected to the second side of the rectangular plate 2033, and the ninth DC feeding terminal 205N can be connected to the fourth side of the rectangular plate 2033, and their positions are different.

[0192] The included angle between the eighth DC feeding terminal 205M and the first side of the rectangular plate 2033 is 110°, and the included angle between the ninth DC feeding terminal 205N and the first side of the rectangular plate 2033 is 140°.

[0193] Figure 14 is a graph showing the transmission loss of the waveguide-microstrip transition at different DC feeder terminals in Figure 13. As shown in Figure 14, in the 66 GHz to 76 GHz frequency band, the RF transmission losses corresponding to the eighth DC feeder terminal 205M and the ninth DC feeder terminal 205N are similar, approximately -1 dB, indicating low transmission losses and improved signal quality.

[0194] In some embodiments, as shown in FIG8 , the transmission strip line 203 further includes: a shielding plate 204 , the shielding plate 204 is spaced apart from the microstrip line 2031 , and the shielding plate 204 is disposed around the array 2032 , and the shielding plate 204 is spaced apart from the array 2032 .

[0195] 9 , the width of the microstrip line 2031 is N1, the gap width between the shielding plate 204 and the array 2032 is M1, and the gap width between the shielding plate 204 and the microstrip line 2031 is M2. M1 should satisfy: N1≤M1≤3N1. M2 should satisfy: N1≤M2≤3N1.

[0196] Thus, the array 2032 is surrounded by a circle of shielding plates 204 to prevent RF energy leakage. Furthermore, the gap widths between the array 2032 and the shielding plates 204, as well as the gap widths between the shielding plates 204 and the microstrip line 2031, both fall within a predetermined range. When the gap widths are within this predetermined range, the shielding plates 204 have minimal impact on the microstrip line 2031 and the array 2032, while maintaining the shielding effectiveness of the shielding plates 204.

[0197] In some embodiments, as shown in FIG. 9 , the shielding plate 204 includes a first shielding plate 2041 and a second shielding plate 2042 .

[0198] The first shielding plate 2041 and the second shielding plate 2042 are arranged on both sides of the microstrip line 2031 along the y direction and are spaced apart from the microstrip line 2031 .

[0199] In some embodiments, the first array 2032a and the second array 2032b are respectively connected to the second connecting line 2032d and are located on one side of the microstrip line 2031 to form a first ring structure. The first shielding plate 2041 is arranged around the first ring structure and is spaced apart from the first ring structure.

[0200] In addition, the first array 2032a and the second array 2032b are respectively connected to the first connecting line 2032c and are located on the other side of the microstrip line 2031 to form a second ring structure. The second shielding plate 2042 is arranged around the second ring structure and is spaced apart from the second ring structure.

[0201] In some embodiments, as shown in FIG8 , a conductive connection portion 2021 is provided in the dielectric substrate 202 , and the shielding plate 204 is connected to the ground plate 201 via the conductive connection portion 2021 .

[0202] In some embodiments, the conductive connection portion 2021 includes: a plurality of metal vias.

[0203] Thus, the shielding plate is connected to the grounding plate 201 via the conductive connecting portion. The shielding plate 204, the conductive connecting portion 2021 and the grounding plate 201 are arranged to form a metal cavity with a single-side opening, thereby further preventing leakage of radio frequency energy.

[0204] In some embodiments, the projection of the conductive connection portion 2021 on the ground plate 201 is within the projection range of the shielding plate 204 on the ground plate 201 , so that the shielding plate 204 can be better connected to the ground plate 201 through the conductive connection portion 2021 .

[0205] The embodiment of the present application does not limit the number of the conductive connection parts, and the appropriate number of the conductive connection parts can be determined based on the projection range of the shielding plate 204 on the ground plate 201 .

[0206] The present invention provides a transmission stripline waveguide connector comprising a transmission stripline, a dielectric substrate, and a ground plate. The transmission stripline is located on a first surface of the dielectric substrate, and the ground plate is located on a second surface of the dielectric substrate. The ground plate has a slot configured to couple with the waveguide. The transmission stripline includes a microstrip line, a plate, and an array coupled to the slot.

[0207] The microstrip line includes a first end and a second end opposite to each other, and a third end located between the first and second ends. The first end is connected to the plate, the second end is used to connect to the active device, and the third end is connected to the array. The plate is connected to the DC feed terminal and is coupled to the ground plane.

[0208] The present application also provides a communication method for a transmission stripline waveguide connector, comprising: a transmission stripline, a dielectric substrate, and a ground plane; the transmission stripline is located on a first surface of the dielectric substrate, and the ground plane is located on a second surface of the dielectric substrate; the ground plane is provided with a slot for coupling with the waveguide; the transmission stripline comprises: a microstrip line, a plate, and an array coupled to the slot; the microstrip line comprises: a first end and a second end opposite each other, and a third end located between the first and second ends, the first end connected to the plate, the second end for connecting to an active device, and the third end connected to the array; the plate is connected to a DC feed terminal, and the plate is coupled to the ground plane.

[0209] The method is used in the stage where the waveguide 10 transmits a radio frequency signal through an active device, and the method includes:

[0210] The radio frequency signal transmitted by the waveguide is coupled to the array through the gap and is transmitted to the first end and the second end of the microstrip line through the array. The radio frequency signal transmitted to the first end of the microstrip line leads to the active device.

[0211] The radio frequency signal transmitted to the second end of the microstrip line passes through the plate and is reflected at the capacitor formed by the plate and the ground plane. The reflected radio frequency signal passes through the microstrip line and passes through the active device.

[0212] The present application also provides a communication method, which is also used for a transmission strip line waveguide connector. The structure of the transmission strip line waveguide connector is as described above and will not be described again here.

[0213] The method is used in the stage where the waveguide 10 receives a radio frequency signal through an active device, and the method includes:

[0214] The microstrip line transmits the first radio frequency signal from the active device to the array, and couples the second radio frequency signal and the third radio frequency signal transmitted by the array to the waveguide.

[0215] The second radio frequency signal is a portion of the radio frequency signal transmitted to the array, and the third radio frequency signal is a radio frequency signal reflected by the capacitor formed by the electrode plate and the ground plate.

[0216] While transmitting and receiving RF signals, a DC feeding terminal 205 is provided on the plate 2033 of the capacitor to load a DC signal to the plate 2033 . The DC signal passes through the plate 2033 and the microstrip line 2031 in sequence to reach the active device.

[0217] Therefore, the transmission stripline waveguide connector provided in the embodiment of the present application not only realizes the transition function between the waveguide 10 and the transmission stripline through a circuit system, but also has a simple structure and low loss. It can also realize DC power supply for active devices.

[0218] An embodiment of the present application further provides a controller, which may be a controller of a communication device and may be used to execute the communication method described above to achieve transmission and reception of radio frequency signals.

[0219] It is understandable that, in order to implement the functions of any of the above-mentioned embodiments, the communication system includes hardware structures and / or software modules corresponding to the execution of each function. It should be readily apparent to those skilled in the art that, in combination with the units and algorithm steps of the various examples described in the embodiments disclosed herein, the present application can be implemented in the form of hardware or a combination of hardware and computer software. Whether a function is executed in the form of hardware or computer software driving hardware depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0220] The embodiments of the present application can divide the communication system into functional modules. For example, each functional module can be divided according to each function, or two or more functions can be integrated into one processing module. The above-mentioned integrated modules can be implemented in the form of hardware or in the form of software functional modules. It should be noted that the division of modules in the embodiments of the present application is schematic and is only a logical functional division. In actual implementation, other division methods may be used.

[0221] It should also be understood that each module in the communication system can be implemented in software and / or hardware, without specific limitation. In other words, the electronic device is presented in the form of functional modules. The "module" here can refer to an application specific integrated circuit (ASIC), a circuit, a processor and memory that executes one or more software or firmware programs, an integrated logic circuit, and / or other devices that can provide the above functions.

[0222] In an optional manner, when data transmission is implemented using software, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the process or function of the embodiment of the present application is implemented in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via a wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) method. The computer-readable storage medium can be any available medium that can be accessed by a computer or a data storage device such as a server or data center that includes one or more available media. The available medium can be a magnetic medium (e.g., a floppy disk, a hard disk, a tape), an optical medium (e.g., a digital video disk (DVD)), or a semiconductor medium (e.g., a solid state disk (SSD)).

[0223] The steps of the method or algorithm described in conjunction with the embodiments of the present application can be implemented in hardware or by executing software instructions by a processor. The software instructions can be composed of corresponding software modules, which can be stored in random access memory (RAM), flash memory, read-only memory (ROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), registers, hard disks, mobile hard disks, compact disc read-only memory (CD-ROM) or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor so that the processor can read information from the storage medium and write information to the storage medium. Of course, the storage medium can also be an integral part of the processor. The processor and storage medium can be located in an ASIC. In addition, the ASIC can be located in an electronic device. Of course, the processor and storage medium can also exist in a communication system as discrete components.

[0224] Through the description of the above implementation methods, technical personnel in the relevant field can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional modules is used as an example. In actual applications, the above-mentioned functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above.

[0225] The above is only a specific embodiment of the present application, but the scope of protection of this application is not limited to this. Any changes or substitutions within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A transmission strip line waveguide connector, characterized in that: include: Transmission strip lines, dielectric substrates, and ground planes; The transmission strip line is arranged on the first surface of the dielectric substrate, and the ground plate is arranged on the second surface of the dielectric substrate; The ground plate is provided with a slot, and the slot is used for coupling with the waveguide; The transmission strip line includes: a microstrip line, a plate, and an array coupled with the gap; Wherein, the first end of the microstrip line is connected to the active device, the second end of the microstrip line is connected to the plate, the third end of the microstrip line is connected to the array, and the third end is located between the first end and the second end; The polar plate is connected to a DC feeding terminal, and the polar plate is coupled to the ground plate.

2. The transmission strip line waveguide connector according to claim 1, characterized in that: The electrode plate, the dielectric substrate and the ground plate form a capacitor.

3. The transmission strip line waveguide connector according to claim 1 or 2, characterized in that: The width of the electrode plate is greater than the width of the microstrip line.

4. The transmission strip line waveguide connector according to any one of claims 1 to 3, characterized in that: The length l of the gap satisfies: Among them, λ1 is the wavelength of the electromagnetic wave in the waveguide, and A is the error threshold.

5. The transmission strip line waveguide connector according to any one of claims 1 to 4, characterized in that: The length L of the array satisfies: |L-λ2|≤B, where λ2 is the wavelength of the electromagnetic wave on the microstrip line, and B is the error threshold.

6. The transmission strip line waveguide connector according to any one of claims 1 to 5, characterized in that: The array is symmetrical about the microstrip line.

7. The transmission strip line waveguide connector according to any one of claims 1 to 6, characterized in that: There are multiple arrays, wherein the spacing d between adjacent arrays satisfies: Wherein, C is the error threshold and N is a positive integer.

8. The transmission strip line waveguide connector according to claim 7, characterized in that: The transmission line further includes a first connecting line, and the first ends of two adjacent arrays are connected by the first connecting line.

9. The transmission strip line waveguide connector according to claim 8, characterized in that: The width of the first connecting line is smaller than the width of the array.

10. The transmission strip line waveguide connector according to any one of claims 1 to 9, characterized in that: The first part of the microstrip line is connected to the array, the second part of the microstrip line is connected to the polar plate, and the second part of the microstrip line is located between the polar plate and the array.

11. The transmission stripline waveguide connector according to claim 10, characterized in that: The length D of the second portion of the microstrip line satisfies: Wherein, E is the error threshold and n is a natural number.

12. The transmission strip line waveguide connector according to any one of claims 1 to 11, characterized in that: The shape of the electrode plate includes: fan-shaped or rectangular.

13. The transmission strip line waveguide connector according to any one of claims 1 to 12, characterized in that: The first side of the electrode plate is connected to the microstrip line, the second side of the electrode plate is opposite to the first side, and at least one of the second side, the third side of the electrode plate or the fourth side of the electrode plate is connected to the DC feeding end, wherein the third side and the fourth side are connected to the first side and the second side.

14. The transmission strip line waveguide connector according to any one of claims 1 to 13, characterized in that: The transmission strip line further includes: a shielding plate, the shielding plate and the microstrip line are spaced apart, the shielding plate is disposed around the array, and the shielding plate and the array are spaced apart.

15. The transmission stripline waveguide connector according to claim 14, characterized in that: The shielding plate is used for shielding the electromagnetic waves emitted by the array.

16. The transmission stripline waveguide connector according to claim 14 or 15, characterized in that: The dielectric substrate is provided with a conductive connecting portion, and the shielding plate is connected to the grounding plate via the conductive connecting portion.

17. The transmission stripline waveguide connector according to claim 16, characterized in that: The conductive connection portion includes: a plurality of metal vias.

18. A communication device, characterized in that: It comprises: an active device, and the transmission strip line waveguide connector according to any one of claims 1 to 17, wherein the active device is connected to the second end of the microstrip line.

19. The communication device according to claim 18, characterized in that: The active device includes a diode or a triode.

20. A communication system, characterized in that: include: A waveguide and a communication device as claimed in claim 18 or 19, wherein the waveguide is coupled to the slot of the transmission stripline waveguide connector.

21. A communication method, the communication method being used for a transmission stripline waveguide connector, the transmission stripline waveguide connector comprising: Transmission strip lines, dielectric substrates, and ground planes; The transmission strip line is located on the first surface of the dielectric substrate, and the ground plate is located on the second surface of the dielectric substrate; The ground plate is provided with a slot, and the slot is used for coupling with the waveguide; The transmission strip line comprises: a microstrip line, a plate, and an array coupled to the gap; wherein the microstrip line comprises: a first end and a second end opposite to each other, and a third end located between the first end and the second end, the first end is connected to the plate, the second end is used to connect to an active device, and the third end is connected to the array; the plate is connected to a DC feed end, and the plate is coupled to the ground plate; the method comprises: The radio frequency signal transmitted by the waveguide is coupled to the array through the gap, and is transmitted to the first end and the second end of the microstrip line through the array, and the radio frequency signal transmitted to the first end of the microstrip line leads to the active device; The radio frequency signal transmitted to the second end of the microstrip line passes to the plate and is reflected at the capacitor formed by the plate and the ground plane. The reflected radio frequency signal passes to the active device through the microstrip line.

22. The communication method according to claim 21, characterized in that: The electrode plate is used to receive the DC signal loaded on the DC feeding end, so that the DC signal is transmitted to the active device through the electrode plate and the microstrip line in sequence.

23. The communication method according to claim 21 or 22, characterized in that: The first part of the microstrip line is connected to the array, the second part of the microstrip line is connected to the polar plate, and the second part of the microstrip line is located between the polar plate and the array.

24. The communication method according to claim 23, characterized in that: The length D of the second portion of the microstrip line satisfies: Wherein, E is the error threshold and n is a natural number.

25. A communication method, the communication method being used for a transmission stripline waveguide connector, the transmission stripline waveguide connector comprising: Transmission strip lines, dielectric substrates, and ground planes; The transmission strip line is located on the first surface of the dielectric substrate, and the ground plate is located on the second surface of the dielectric substrate; The ground plate is provided with a slot, and the slot is used for coupling with the waveguide; The transmission strip line comprises: a microstrip line, a plate, and an array coupled to the gap; wherein the microstrip line comprises: a first end and a second end opposite to each other, and a third end located between the first end and the second end, the first end is connected to the plate, the second end is used to connect to an active device, and the third end is connected to the array; the plate is connected to a DC feed end, and the plate is coupled to the ground plate; the method comprises: The microstrip line transmits the first radio frequency signal from the active device to the array, and couples the second radio frequency signal and the third radio frequency signal transmitted by the array to the waveguide; The second radio frequency signal is a portion of the radio frequency signal transmitted to the array; The third radio frequency signal is a radio frequency signal reflected by the capacitor formed by the electrode plate and the ground plate.

26. The communication method according to claim 25, characterized in that: The electrode plate is used to receive the DC signal loaded on the DC feeding end, so that the DC signal is transmitted to the active device through the electrode plate and the microstrip line in sequence.

27. The communication method according to claim 25 or 26, characterized in that: The first part of the microstrip line is connected to the array, the second part of the microstrip line is connected to the polar plate, and the second part of the microstrip line is located between the polar plate and the array.

28. The communication method according to claim 27, characterized in that: The length D of the second portion of the microstrip line satisfies: Wherein, E is the error threshold and n is a natural number.

29. A computer-readable storage medium, characterized in that: The storage medium stores a computer program or instruction, and when the computer program or instruction is executed by a processing device, the method described in any one of claims 21 to 28 is implemented.

30. A computer program product comprising a computer program or instructions, characterized in that When the computer program or instruction is executed on a processing device, the method according to any one of claims 21 to 28 is implemented.

31. An electronic device, characterized in that: The electronic device comprises: transceiver, used to receive or send signals; a memory for storing computer program instructions; A processor is used to run the computer program instructions so that the electronic device implements the communication method as described in any one of claims 21-28.

32. A chip system, characterized in that: The chip system includes a processing circuit and a storage medium, wherein the storage medium stores computer program instructions; when the computer program instructions are executed by the processing circuit, the method as described in any one of claims 21-28 is implemented.

Images