Spray structure, reaction chamber, coating device and coating method

Abstract

The present application discloses a spray structure, a reaction chamber, a coating device and a coating method, belonging to the technical field of coatings. The spray structure comprises a top plate and spray modules, multiple spray modules being mounted at intervals on the top plate, and a spray module being a cavity-shaped body having an opening; a chemical source tube is provided in the spray module, and multiple chemical source spray holes are provided on the chemical source tube; the top plate is provided with air release holes in communication with the spray modules; in a working state, a barrier gas and each spray module form an enclosed space with a gap, the gap being located at the opening of the spray module facing a substrate, and a chemical source is sprayed toward the substrate through the chemical source spray holes and the gap, to treat the substrate. The spray structure provided in the present application is provided with multiple independent spray modules, and a chemical source tube is disposed in a spray module. In a working state, the chemical source can be isolated in each spray module by combined action of a barrier gas and the spray module, thereby effectively reducing the amount of dust generated during surface treatment of a substrate.

Description

Spray structure, reaction chamber, coating equipment and coating method

Technical field

[0001] The present invention relates to the field of film coating technology, and in particular to a spray structure, a reaction chamber, a film coating device and a film coating method. [Background Technology]

[0002] When coating the surface of a substrate, different chemical sources need to be connected to a spray plate and passed into a reaction chamber. The chemical sources are sprayed toward the substrate through the spray plate, and the chemical sources react on the surface of the substrate, thereby depositing a thin film on the substrate. Due to the certain distance between the spray plate and the substrate, different chemical sources are prone to contact and react with each other before reaching the surface of the substrate, thereby generating dust. The dust easily adheres to the spray plate and blocks the chemical source outlet on the spray plate, or accumulates in the chamber, affecting the coating effect and the normal use of the reaction chamber. This makes the maintenance and cleaning of the coating equipment very frequent, reduces the utilization rate of the coating equipment, and is not conducive to improving the coating production capacity. Therefore, how to prevent the chemical source from reacting and generating dust before contacting the substrate during the surface treatment of the substrate and reduce the amount of dust has become a technical problem that needs to be solved urgently.

[0003] [Summary of the invention]

[0004] The present application provides a spray structure that can solve the technical problem that during the surface treatment process of a substrate, a chemical source reacts before contacting the substrate, thereby generating a large amount of dust.

[0005] In order to solve the above technical problems, the present application provides a spray structure, which includes a top plate and multiple spray modules. The multiple spray modules are installed on the top plate at intervals. The spray module is a cavity-shaped body with an opening; a chemical source conduit is provided in the spray module, and a number of chemical source spray holes are opened on the chemical source conduit; the top plate is provided with an exhaust hole connected to the spray module; when in working state, the barrier gas and each spray module form an enclosed space with a gap, and the gap is located at the opening of the spray module facing the substrate. The chemical source is sprayed toward the substrate through the chemical source spray hole and the gap to treat the substrate.

[0006] The present application provides a reaction chamber, which includes a reaction chamber body and the spray structure as described above, wherein the spray structure is accommodated in the reaction chamber body; the reaction chamber body is provided with an air inlet, a substrate inlet, and a substrate outlet; the spray module is close to the substrate; in a working state, a barrier gas dynamically fills the reaction chamber and forms a plurality of enclosed spaces with gaps with the spray module, and a chemical source is sprayed from the spray module through the gaps and toward the substrate to treat the substrate.

[0007] The present application provides a coating device, which includes a transmission mechanism and the reaction chamber as described above. The transmission mechanism can drive a substrate to move from a substrate inlet to a substrate outlet.

[0008] The present application also provides a coating method, which includes:

[0009] Evacuating the reaction chamber;

[0010] A barrier gas is introduced into the reaction chamber, the barrier gas enters the reaction chamber from the air inlet, and leaves the reaction chamber through the air extraction hole connected to the spray module;

[0011] A chemical source is introduced into the chemical source conduit in the spray module, and the ventilation and extraction rates of the barrier gas and / or the rate of the chemical source are controlled so that the gas pressure in the spray module is lower than the gas pressure in the reaction chamber, and the barrier gas and the spray module form an enclosed space with a gap, where the gap is opposite to the substrate;

[0012] The transmission mechanism drives the substrate to move from the substrate inlet to the substrate outlet, so that when the substrate passes through the spray module, the chemical source is sprayed toward the substrate through the chemical source spray holes and gaps in the spray module to treat the substrate.

[0013] The spray structure provided in the present application is provided with a plurality of independent spray modules, and the chemical source conduit is arranged in the spray module. When in working state, the chemical source can be isolated in each spray module through the combined action of the barrier gas and the spray module, thereby preventing the chemical sources in each spray module from contacting and reacting with each other before reaching the surface of the substrate to generate dust, thereby effectively reducing the amount of dust generated during the surface treatment of the substrate.

Brief Description of the Drawings

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0015] FIG1 is a schematic structural diagram (including a partial cross-section) of an embodiment of a spray structure provided by the present application;

[0016] FIG2 is a schematic diagram of the structure of an embodiment of a spray structure provided by the present application (including a partial cross-section) when viewed from above;

[0017] FIG3 is a structural schematic diagram (including a partial cross-section) of another embodiment of the spray structure provided by the present application;

[0018] FIG4 is a structural schematic diagram (including a partial cross-section) of another embodiment of the spray structure provided by the present application;

[0019] FIG5 is a structural schematic diagram (including a partial cross-section) of an embodiment of the present application in which multiple chemical source conduits are provided in the spray module;

[0020] FIG6 is a schematic structural diagram of an embodiment of a chemical source conduit provided by the present application;

[0021] FIG7 is a schematic structural diagram of another embodiment of a chemical source conduit provided by the present application;

[0022] FIG8 is a schematic structural diagram (including a partial cross-section) of an embodiment of a reaction chamber provided by the present application;

[0023] FIG9 is a schematic structural diagram (including a partial cross-section) of an embodiment of a coating device provided by the present application;

[0024] FIG10 is a flow chart of an embodiment of a coating method provided by the present application. [Specific implementation method]

[0025] The present invention will be described in further detail below with reference to the accompanying drawings and examples. It is particularly noted that the following examples are intended only to illustrate the present invention and are not intended to limit the scope of the present invention. Similarly, the following examples are only some embodiments of the present invention and are not intended to be all embodiments. All other embodiments obtained by those of ordinary skill in the art without creative effort are intended to fall within the scope of protection of the present invention.

[0026] In the description of the present invention, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise specifically defined. The terms "first", "second", and "third" in the embodiments of the present application are only used for descriptive purposes and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", and "third" can explicitly or implicitly include at least one of such features. All directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative positional relationship, movement, etc. between the components under a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly. The terms "including" and "having" in the embodiments of the present application and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or components inherent to these processes, methods, products, or devices.

[0027] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present invention. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute a separate or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0028] The present application provides a spray structure. The following numbers, unless otherwise specified, all represent the marking numbers in the accompanying drawings. Please refer to Figures 1 to 5 at the same time. The spray structure 100 includes a top plate 10 and a plurality of spray modules 20, and the plurality of spray modules 20 are installed at intervals on the top plate 10. The spray module 20 is a cavity-shaped body with an opening. Preferably, the spray module 20 is a cube, a rectangular parallelepiped or a cylinder with an opening. The specific shape of the cavity-shaped body is not limited here. This application takes the rectangular parallelepiped as an example for explanation. A chemical source conduit 22 is provided in the spray module 20, and a plurality of chemical source spray holes 221 are provided on the chemical source conduit 22. The chemical source conduit 22 is used to connect a chemical source. Openings can be provided on the opposite side walls of the spray module 20 to introduce the chemical source conduit 22.

[0029] The type of chemical source introduced can be determined based on actual needs. For example, if an Al2O3 film is to be deposited, water vapor and TMA (Tri-Methyl Aluminum) can be introduced into the spray module 20. The types of chemical sources are not limited to two, and the above is merely an illustrative example. Water vapor and TMA can be introduced alternately into multiple, spaced spray modules 20. For example, water vapor can be introduced into the spray modules 20 in odd-numbered positions (1, 3, 5, etc.), while TMA can be introduced into the spray modules 20 in even-numbered positions (2, 4, 6, etc.). When a substrate moves to the spray module 20 in position 1, water vapor adsorbs on the substrate. When the substrate moves to the adjacent spray module 20 in position 2, the TMA and water vapor react to form a uniform thin film, completing a growth cycle. Similarly, the substrate can be moved through multiple pairs of spray modules 20 to complete multiple growth cycles.

[0030] As shown in Figures 8 and 9, in the working state, the spray module 20 is accommodated in the reaction chamber, and the reaction chamber is filled with a barrier gas that does not react with the chemical source. The barrier gas can be nitrogen or an inert gas, such as argon. The barrier gas can also be used to adjust the gas pressure difference inside and outside the spray module 20 and purge the surface of the substrate. The top plate 10 is provided with an exhaust hole 23 connected to the spray module 20. Preferably, as shown in Figures 1 and 5, the openings of the spray module 20 are provided at the upper and lower ends, and the exhaust hole 23 is directly connected to the spray module 20 through the upper end opening; or as shown in Figures 3 and 4, the opening of the spray module 20 is provided at the lower end, and the upper end of the spray module 20 is provided with an air vent 28, through which the exhaust hole 23 is connected to the spray module 20. The barrier gas introduced into the reaction chamber can pass through the spray module 20 and be extracted from the exhaust hole 23 to maintain the gas pressure difference between the inside and outside of the spray module 20, thereby isolating the chemical source within the spray module 20. The exhaust hole 23 can be set at the center of the projection of the spray module 20 on the top plate 10, and the cross-sectional shape of the exhaust hole 23 can be circular or square. The barrier gas and each spray module 20 form an enclosed space with a gap 29. The gap 29 is located at the opening of the spray module 20 facing the substrate. That is, as shown in Figures 8 and 9, at the lower end opening 24 of the spray module 20, the barrier gas and the spray module 20 form a gap 29, and the chemical source conduit 22 is surrounded in the cavity of the spray module 20, preventing the chemical source from overflowing from the spray module 20 into the reaction chamber. The chemical source is then sprayed toward the substrate through the chemical source spray hole 221 and the gap 29, thereby performing a coating treatment on the surface of the substrate.

[0031] The spray structure 100 provided in the present application is provided with a plurality of independent spray modules 20, and the chemical source conduit 22 is arranged in the spray module 20. When in working state, the chemical source can be isolated in each spray module 20 through the combined action of the barrier gas and the spray module 20, thereby preventing the chemical sources in each spray module 20 from contacting and reacting with each other before reaching the surface of the substrate to generate dust, thereby effectively reducing the amount of dust generated during the substrate surface treatment process.

[0032] The cavity-shaped spray module 20 can be arranged in a variety of ways. In one embodiment, as shown in Figures 1, 2, and 5, the cavity-shaped spray module 20 is formed by connecting the side walls 25 at the head and tail to form an upper end opening and a lower end opening 24. In another embodiment, as shown in Figures 3 and 4, the spray module 20 also includes a top wall 26, and the side walls 25 are connected at the head and tail and connected to the top wall 26 as a whole to form the cavity-shaped spray module 20 at the lower end opening 24. The top wall 26 is provided with a vent 28 to communicate with the exhaust hole 23 on the top plate 10. The cavity-shaped body of the spray module 20 can also be formed in one piece, which is not specifically limited here.

[0033] The spray module 20 and the top plate 10 can be integrally formed, and the spray module 20 can also be detachably mounted on the top plate 10. When the spray module 20 is detachably mounted on the top plate 10, the mounting method can be clamping, bolts, screws, etc., which are not specifically limited here and can be selected according to needs. A positioning member 27 can also be provided on the top plate 10, as shown in FIG3 , and the positioning member 27 is used for the installation and positioning of the spray module 20 to facilitate the accurate alignment of the spray module 20. Since the spray module 20 is detachably mounted on the top plate 10, the installation and disassembly of the spray module 20 are simplified. When one or more of the spray modules 20 are damaged or need to be cleaned and maintained, the damaged spray module 20 can be directly replaced. Since only a part of the spray structure 100 needs to be processed, the maintenance cost can be reduced.

[0034] The spray module 20 can also be mounted on the top plate 10 via a connector 30, as shown in FIG4 . The spray structure 100 is provided with a connector 30, one end of which is mounted on the top plate 10, and the spray module 20 is detachably mounted on the connector 30. The connector 30 is provided with a through hole to connect the spray module 20 and the top plate 10, so that the barrier gas can pass through the spray module 20 and be extracted through the through hole on the connector 30 and the exhaust hole 23. Optionally, the connector 30 can be an I-shaped mounting bracket. The upper and lower flanges of the I-shaped mounting bracket are respectively connected to the top plate 10 and the spray module 20, and the web of the I-shaped mounting bracket is provided with a through hole connecting the spray module 20 and the top plate 10. By providing the connector 30, the top of the spray module 20 can be spaced apart from the top plate 10, that is, a gap is provided between the top of the spray module 20 and the top plate 10. During the startup phase of the coating equipment, the reaction chamber needs to be evacuated and barrier gas is introduced. A gap is set between the top of the spray module 20 and the top plate 10 so that the barrier gas introduced into the reaction chamber can flow through the gap, thereby improving the diffusion speed and uniformity of the barrier gas.

[0035] The multiple chemical source spray holes 221 can be staggered in the length direction of the chemical source conduit 22 so that the chemical source can be sprayed out from the multiple chemical source spray holes 221 simultaneously, thereby improving the coating efficiency.

[0036] Furthermore, to ensure a more uniform spraying of the chemical source onto the substrate, multiple chemical source conduits 22 may be provided within each spray module 20, as shown in FIG5 . The provision of multiple chemical source conduits 22 within the spray module 20 increases the contact area between the chemical source and the substrate surface, thereby improving the uniformity of film deposition on the substrate surface.

[0037] Referring to Figures 6 and 7, in one embodiment, the chemical source spray hole 221 is connected to a diffusion guide port 222, and the cross-sectional area of ​​the diffusion guide port 222 is larger than the cross-sectional area of ​​the chemical source spray hole 221. Specifically, the diffusion guide port 222 can be trumpet-shaped, as shown in Figure 6, or concave-shaped, as shown in Figure 7. Because there is a certain distance between the chemical source conduit 22 and the substrate, if the chemical source sprayed from the chemical source spray hole 221 diffuses too early, the chemical source reaching the substrate surface will be diluted, and the film on the substrate will have breakpoints and cross-sections, resulting in film discontinuity. The provision of the diffusion guide port 222 can guide the chemical source and delay the diffusion time of the chemical source when it is sprayed from the chemical source spray hole 221, thereby preventing the occurrence of breakpoints and cross-sections and improving the continuity and uniformity of the film deposited on the substrate surface.

[0038] In some embodiments, the distance between two adjacent spray modules 20 is 0.1 to 40 mm. If the distance between two adjacent spray modules 20 is too small, such as less than 0.1 mm, it is not conducive to blocking the gas from entering the spray module 20 from the gap between the two adjacent spray modules 20, and an enclosed space cannot be formed, which reduces the barrier effect; if the distance between two adjacent spray modules 20 is too large, such as greater than 40 mm, the efficiency of the coating will be reduced and the effect of the coating will be affected. Specifically, the distance between two adjacent spray modules 20 can be 0.1 mm, 0.269 mm, 3.2 mm, 5 mm, 10 mm, 12 mm, 16.5 mm, 20.8 mm, 31 mm, 37.7 mm, 40 mm, etc., and is not specifically limited here.

[0039] The present application provides a reaction chamber, please refer to Figure 8. The reaction chamber 200 may include a reaction chamber body 210 and the spray structure 100 as described above, and the spray structure 100 is accommodated in the reaction chamber body 210. The reaction chamber body 210 is provided with an air inlet 211, a substrate inlet 212 and a substrate outlet 213. The substrate 50 can move from the substrate inlet 212 to the substrate outlet 213 under the drive of the transmission mechanism. The spray module 20 is close to the substrate 50. In the working state, the reaction chamber 200 is filled with a barrier gas, and the barrier gas does not react with the chemical source. The barrier gas can be nitrogen or an inert gas, such as argon. The barrier gas enters the reaction chamber body 210 through the air inlet 211 and is extracted through the air extraction hole 23, thereby dynamically filling the reaction chamber 200 and forming multiple enclosed spaces with gaps 29 with the spray modules 20. As shown in Figures 8 and 9 in conjunction with Figure 2, the barrier gas and each spray module 20 form an enclosed space with gaps 29. The gaps 29 are located at the opening of the spray module 20 facing the substrate 50, that is, at the lower end opening 24 of the spray module 20. The combined action of the barrier gas and the spray modules 20 isolates the chemical source within each spray module 20, thereby preventing the chemical sources within each spray module 20 from contacting and reacting with each other before reaching the substrate surface, thereby generating dust. The chemical source is then sprayed from the spray module 20 through the gaps 29 and onto the substrate 50, thereby treating the substrate 50.

[0040] The distance l between the substrate 50 and the spray module 20 is 0.01 to 0.5 mm. If the distance l is less than 0.01 mm, the distance between the substrate 50 and the spray module 20 is too small, and vibration of the substrate 50 may cause the substrate 50 to contact the spray module 20, resulting in damage. If the distance l is greater than 0.5 mm, the gap between the substrate 50 and the spray module 20 is large, increasing the risk of the chemical source in the spray module 20 overflowing through the gap. Specifically, the distance l can be 0.01 mm, 0.05 mm, 0.068 mm, 0.072 mm, 0.1 mm, 0.126 mm, 0.2 mm, 0.25 mm, 0.39 mm, 0.43 mm, 0.5 mm, etc., without specific limitation herein.

[0041] Continuing with FIG8 , in one embodiment, a first flowmeter 214 is provided on the gas inlet 211, and a second flowmeter (not shown) is provided on the chemical source conduit 22. The first flowmeter 214 can be used to measure the flow rate of the barrier gas entering the reaction chamber body 210 through the gas inlet 211 per unit time. Specifically, the first flowmeter 214 can measure the inflow rate of the barrier gas from the gas inlet 211 into the reaction chamber body 210. The second flowmeter can be used to measure the flow rate of the chemical source entering the reaction chamber body 210 through the chemical source conduit 22. For example, for a gaseous chemical source, the second flowmeter can measure the inflow rate of the chemical source into the reaction chamber body 210. After obtaining the inflow rate, the pressure difference between the spray module 20 and the reaction chamber body 210 can be maintained by adjusting the inflow rate of the barrier gas from the gas inlet 211 into the reaction chamber body 210, the extraction rate at the gas extraction hole 23, and the rate at which the chemical source enters the spray module 20 through the chemical source conduit 22, thereby preventing the chemical source from overflowing from the spray module 20. Preferably, the barrier gas enters the reaction chamber body 210 from the air inlet 211 at a rate of 1 to 5 meters per second, the air extraction rate at the air extraction holes 23 is 15 to 25 meters per second, and the chemical source enters the spray module 20 through the chemical source conduit 22 at a rate of 3 to 8 meters per second. By controlling the air pressure within the spray module 20 so that it is lower than the air pressure within the reaction chamber body 210, the barrier gas within the reaction chamber body 210 can enter the spray module 20 through the lower opening 24 of the spray module 20 and be extracted through the connected air extraction holes 23, thereby blocking the chemical source within the spray module 20. This prevents the chemical source within the spray module 20 from escaping through the gap 29 formed by the barrier gas and the spray module 20 at the lower opening 24 of the spray module, thereby preventing the chemical source from contacting and reacting with each other before reaching the substrate surface and generating dust.

[0042] To ensure that the gas pressure within the spray module 20 is lower than the gas pressure within the reaction chamber body 210, a first barometer 215 may be provided within the reaction chamber body 210, and a second barometer 216 may be provided within the spray module 20. The first barometer 215 and the second barometer 216 are used to monitor the gas pressure within the reaction chamber body 210 and the spray module 20, respectively. Based on the monitored changes in gas pressure, the barrier gas and / or chemical source rate are promptly adjusted or controlled to maintain a pressure difference between the gas within the spray module 20 and the gas within the reaction chamber body 210. This prevents the chemical source within the spray module 20 from overflowing from the gap 29, thereby preventing the chemical sources from interacting and reacting before reaching the substrate surface, thereby generating dust.

[0043] The present application provides a coating apparatus, as shown in FIG9 . The coating apparatus 300 includes a transmission mechanism 310 and the reaction chamber 200 described above. The transmission mechanism 310 can drive a substrate 50 to move from a substrate inlet 212 to a substrate outlet 213. Specifically, the transmission mechanism 310 can be a roller 311, which is disposed at the substrate inlet 212 and the substrate outlet 213, respectively. The rotation of the roller 311 enables the substrate 50 to move from the substrate inlet 212 to the substrate outlet 213. By adjusting the rotation speed of the roller 311, the movement speed of the substrate 50 between the various spray modules 20 can be controlled. The movement speed of the substrate 50 affects the contact time between the surface of the substrate 50 and the chemical source, thereby affecting the thickness of the deposited film.

[0044] The present application provides a coating method. The coating method 400 may include steps S410 to S440. Please refer to FIG10 , which is a flow chart of an embodiment of the coating method provided by the present application:

[0045] S410 , evacuating the reaction chamber 200 .

[0046] At step S420, a barrier gas is introduced into the reaction chamber 200. The barrier gas enters the reaction chamber 200 through the gas inlet 211 and leaves the reaction chamber 200 through the gas extraction hole 23 connected to the spray module 20. The barrier gas does not react with the chemical source and can be nitrogen or an inert gas such as argon.

[0047] At step S430, a chemical source is introduced into the chemical source conduit 22 within the spray module 20. The ventilation and extraction rates of the barrier gas and / or the rate of the chemical source are controlled to ensure that the gas pressure within the spray module 20 is lower than the gas pressure within the reaction chamber 200. Furthermore, the barrier gas and the spray module 20 form an enclosed space with a gap 29, with the gap 29 facing the substrate 50. The barrier gas and the spray module 20 act together to isolate the chemical source within each spray module 20, preventing the chemical sources within each spray module 20 from contacting and reacting with each other before reaching the substrate surface, thereby generating dust.

[0048] At step S440 , the transmission mechanism 310 drives the substrate 50 to move from the substrate inlet 212 to the substrate outlet 213 , so that when the substrate 50 passes through the spray module 20 , the chemical source is sprayed toward the substrate 50 through the chemical source spray holes 221 and the gap 29 in the spray module 20 , thereby treating the substrate 50 .

[0049] When the substrate 50 moves between multiple spray modules 20, the barrier gas surrounds the outer periphery of the spray module 20 and can enter the spray module 20 from the gap between the substrate 50 and the spray module 20 through exhaust, thereby forming a surrounding gap 29 at the lower end opening 24 of the spray module 20. The barrier gas isolates the chemical source spray hole 221 in the spray module 20. After the chemical source is sprayed out from the chemical source spray hole 221, it is sprayed toward the substrate 50 through the gap 29, thereby preventing the chemical source of the spray module 20 from overflowing and preventing the chemical sources from contacting and reacting with each other before reaching the surface of the substrate to generate dust.

[0050] The chemical source includes at least a first process gas and a second process gas, which are introduced into chemical source conduits 22 within different spray modules 20. The type of chemical source introduced can be determined based on actual needs. For example, if Al2O3 film deposition is required, the chemical sources introduced into the spray module 20 may include water vapor and TMA. Because the different reactive chemical sources are isolated by the barrier gas within different spray modules 20, dust generation due to cross-contamination and reaction between the chemical sources before reaching the substrate surface can be avoided.

[0051] The spray structure, reaction chamber, coating equipment, and coating method provided in this application have at least the following beneficial effects:

[0052] 1. A plurality of independent spray modules 20 are provided, and a chemical source conduit 22 is provided in the spray module 20. In the working state, the chemical source can be isolated in each spray module 20 through the combined action of the barrier gas and the spray module 20, thereby preventing the chemical sources in each spray module 20 from contacting and reacting with each other before reaching the substrate surface to generate dust, thereby effectively reducing the amount of dust generated during the substrate surface treatment process.

[0053] 2. The spray module 20 is detachably mounted on the top plate 10 , which simplifies the installation and removal of the spray module 20 and reduces maintenance costs.

[0054] 3. The multiple chemical source spray holes 221 are staggered in the length direction of the chemical source conduit 22, so that the chemical source can be sprayed out from the multiple chemical source spray holes 221 at the same time, thereby improving the coating efficiency.

[0055] 4. The chemical source spray hole 221 is connected to a diffusion guide port 222, which improves the continuity and uniformity of the film deposition on the substrate surface.

[0056] 5. The spray module 20 is mounted on the top plate 10 through the connector 30 , which separates the top of the spray module 20 from the top plate 10 , thereby improving the diffusion speed and uniformity of the barrier gas.

[0057] 6. The distance between the substrate 50 and the spray module 20 is 0.01 to 0.5 mm, which can prevent the chemical source in the spray module 20 from overflowing and effectively avoid the substrate 50 from shaking and causing damage to the substrate 50 and contact with the spray module 20.

[0058] The above descriptions are only some embodiments of the present invention and do not limit the scope of protection of the present invention. Any equivalent device or equivalent process transformation made by using the contents of the description and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A spray structure, comprising a top plate, characterized in that: Also includes: A plurality of spray modules, wherein the plurality of spray modules are installed at intervals on the top plate, and the spray modules are cavity-shaped bodies with openings; A chemical source conduit is provided in the spray module, and a plurality of chemical source spray holes are provided on the chemical source conduit; The top plate is provided with an air extraction hole communicating with the spray module; In working state, the barrier gas and each of the spray modules respectively form an enclosed space with a gap, wherein the gap is located at the opening of the spray module facing the substrate, and the chemical source is sprayed toward the substrate through the chemical source spray hole and the gap to process the substrate.

2. The spray structure according to claim 1, characterized in that: The chemical source spray hole is connected with a diffusion guide port, and the cross-sectional area of ​​the diffusion guide port is larger than the cross-sectional area of ​​the chemical source spray hole.

3. The spray structure according to claim 1, characterized in that: The plurality of chemical source spray holes are arranged in a staggered manner along the length direction of the chemical source conduit.

4. The spray structure according to claim 1, characterized in that: The spray module is detachably mounted on the top plate.

5. The spray structure according to claim 1, characterized in that: The barrier gas is nitrogen or an inert gas.

6. A reaction chamber, characterized in that: include: A reaction chamber body and a spray structure as claimed in any one of claims 1 to 5, wherein the spray structure is accommodated in the reaction chamber body; The reaction chamber body is provided with an air inlet, a substrate inlet and a substrate outlet; The spray module is close to the substrate; In the working state, the barrier gas dynamically fills the reaction chamber and forms a plurality of enclosed spaces with gaps with the spray module. The chemical source is sprayed from the spray module through the gaps and sprayed toward the substrate to process the substrate.

7. The reaction chamber according to claim 6, characterized in that: The distance between the substrate and the spray module is 0.01 to 0.5 mm.

8. The reaction chamber according to claim 6, characterized in that: The air inlet is provided with a first flow meter, and the chemical source conduit is provided with a second flow meter.

9. The reaction chamber according to claim 6, characterized in that: A first barometer is disposed in the reaction chamber body, and a second barometer is disposed in the spray module.

10. A coating device, characterized in that: include: A transmission mechanism and a reaction chamber as described in any one of claims 6 to 9, wherein the transmission mechanism can drive the substrate to move from the substrate inlet to the substrate outlet.

11. The coating device according to claim 10, characterized in that: The transmission mechanism is a roller shaft, and the roller shaft is respectively arranged at the substrate inlet and the substrate outlet.

12. A film coating method, characterized in that: include: Evacuating the reaction chamber; Introducing a barrier gas into the reaction chamber, wherein the barrier gas enters the reaction chamber from the air inlet and leaves the reaction chamber through the air extraction hole connected to the spray module; Introducing a chemical source into a chemical source conduit in the spray module, controlling the ventilation and exhaust rates of the barrier gas and / or controlling the rate of the chemical source, so that the gas pressure in the spray module is lower than the gas pressure in the reaction chamber, and the barrier gas and the spray module form an enclosed space with a gap, wherein the gap is opposite to the substrate; The transmission mechanism drives the substrate to move from the substrate inlet to the substrate outlet, so that when the substrate passes through the spray module, the chemical source is sprayed toward the substrate through the chemical source spray hole and the notch in the spray module to process the substrate.

13. The coating method according to claim 12, characterized in that: The chemical source at least includes a first processing gas and a second processing gas, and the first processing gas and the second processing gas are respectively introduced into the chemical source conduits in different spray modules.

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