Mounting device

Abstract

Provided is a mounting device with which it is possible to solve problems such as an increase in weight that occur in relation to a heater for heating a component to be mounted.　The mounting device (21) is provided with: a fixed unit (U1); and a moving unit (U2) that is held by the fixed unit (U1) so as to be movable in a direction in which the moving unit advances and retracts with respect to a substrate (102). The fixed unit (U1) has a heating unit (23). The moving unit (U2) has: a head part (35); and a shaft body (14) at the tip of which the head part (35) is provided. In a state in which the moving unit (U2) is retracted with respect to the fixed unit (U1), the head part (35) and / or the shaft body (14) is in contact with the heating unit (23), and the head part (35) is heated. In a state in which the moving unit (U2) is advanced with respect to the fixed unit (U1) and a component (103) is pressed against the substrate (102), the head part (35) and the shaft body (14) are not in contact with the heating unit (23).

Description

Mounting Equipment

[0001] The present invention relates to a mounting apparatus used when mounting components on a substrate.

[0002] Conventionally, as shown in Patent Document 1, for example, components (e.g., LED chips) have been mounted on a substrate via a bonding material such as an anisotropic conductive film (ACF) or anisotropic conductive paste (ACP) containing conductive particles and a thermosetting resin. A mounting device used for such mounting includes a mounting unit that can move toward and away from the substrate. The component placed on the substrate via the ACF or the like is pressurized and heated by a head provided at the tip of the mounting unit, thereby electrically connecting the substrate and the component via the conductive particles and curing the thermosetting resin to bond them together.

[0003] The head unit of Patent Document 1 is provided with a heater that can be heated by passing electricity. When a mounting unit presses a component onto an ACF or the like provided on a substrate, the component is heated by the heater, thereby fixing the component to the ACF or the like.

[0004] JP 2017-118147 A

[0005] On the other hand, installing a heater in the head increases the weight of the mounting unit, and so when components need to be mounted with low pressure, it becomes necessary to provide a mechanism to cancel the weight of the mounting unit, for example, in order to reduce the pressure applied to the components during mounting, which leads to a more complicated device.

[0006] Furthermore, if the head section is configured to be rotatable around a vertical axis, thereby giving the mounting unit an alignment function that aligns the orientation of the component held by the head section with the orientation of the board before mounting, the range of rotation angles allowed for the head section will be limited by the heater wiring provided in the head section.

[0007] In view of the above, an object of the present invention is to provide a mounting apparatus that can solve the conventional problems that have arisen regarding heaters for heating components to be mounted.

[0008] The present invention is a mounting device comprising a head portion that presses a component against a substrate and a heating unit that heats the head portion, and comprises: a fixed unit that is immobile in the direction of moving back and forth relative to the substrate and has a Z-axis motor; and a moving unit that is held by the fixed unit so as to be movable in the direction of moving back and forth relative to the substrate and that moves back and forth relative to the substrate when the Z-axis motor is driven, wherein the fixed unit has the heating unit, and the moving unit has the head portion and a shaft body with the head portion attached to its tip, and when the moving unit is retracted relative to the fixed unit, the head portion and / or the shaft body come into contact with the heating unit and the head portion is heated, and when the moving unit is advanced relative to the fixed unit to press the component against the substrate, the head portion and the shaft body are not in contact with the heating unit.

[0009] In such a mounting apparatus, it is preferable that the fixed unit and the moving unit do not include an elastic body that biases the head portion in a direction that moves the head portion toward and away from the substrate.

[0010] The moving unit preferably has a θ-axis motor that rotates the shaft about its axis.

[0011] Another aspect of the mounting device of the present invention is characterized in that it comprises a mounting unit having a head portion that presses a component against a substrate, and a heating unit that heats the head portion by contacting or non-contacting the mounting unit.

[0012] In such a mounting device, the mounting unit preferably has a shaft having the head portion at its tip, and a θ-axis motor that rotates the shaft about its axis.

[0013] Furthermore, in such a mounting device, it is preferable that the heating unit has a heat transfer part that contacts the shaft body and / or the head part to heat the head part, but is not in contact with the shaft body and the head part when the head part presses the component.

[0014] The mounting device of the present invention employs a configuration in which a heating unit is provided in the fixed unit, and a heating unit is not provided in the movable unit which has a head and is movably held by the fixed unit. In other words, in the present invention, the weight of the movable unit can be reduced compared to conventional devices in which a heater is mounted in the head. Furthermore, if the mounting device of the present invention is provided with an alignment function, the rotation angle range of the head is not limited by the heater wiring as in conventional devices.

[0015] Fig. 4 is a side view schematically showing a mounting unit and a heating unit in a first embodiment of a mounting device according to the present invention. Fig. 5 is a front view of the mounting unit and heating unit shown in Fig. 1. Fig. 6 is a modified example of the heating unit shown in Fig. 2. Fig. 7 is a perspective view schematically showing a second embodiment of a mounting device according to the present invention. Fig. 8 is a perspective view showing a state in which a head portion is heated by a heating unit in the mounting device shown in Fig. 4.

[0016] A first embodiment of a mounting device (mounting device 1) according to the present invention will be described below with reference to Figures 1 and 2. In the following description, the X, Y, and Z directions correspond to the directions of the arrows X, Y, and Z shown in the drawings, with the X direction being the front-to-back direction, the Y direction being the left-to-right direction, and the Z direction being the up-to-down direction, but these directions are merely examples and are not intended to limit the orientation of the mounting device in the present invention.

[0017] 2, the mounting apparatus 1 is an apparatus for mounting components 103, such as LED chips, IC chips, and chip resistors, on a substrate 102 having an ACF 101 provided on its surface. The mounting apparatus 1 includes a mounting unit 2 and a heating unit 3. The mounting apparatus 1 also includes a recognition mechanism (not shown) that can recognize the orientation of the substrate 102 around the Z axis and the orientation of the component 103 around the Z axis. The orientations of the substrate 102 and the component 103 around the Z axis can be recognized, for example, by providing alignment marks on the substrate 102 and the component 103 and providing the recognition mechanism with a function that can grasp the orientation of the alignment marks by image recognition.

[0018] First, we will explain the mounting unit 2. The mounting unit 2 of this embodiment has a base 4 to which various members constituting the mounting unit 2 are attached. The base 4 is attached to X-direction moving means and Y-direction moving means (not shown), and is movable in the front-rear and left-right directions.

[0019] As shown in the figure, a linear motion mechanism 5, a Z-axis motor 6, and a ball screw 7 are attached to a base 4. The linear motion mechanism 5 includes a rail 8 that extends vertically and is fixedly attached to the base 4, and a slider 9 that is supported by the rail 8 and moves vertically. The Z-axis motor 6 is fixedly attached to the upper part of the base 4 with its rotating shaft facing downward. The ball screw 7 includes a screw shaft 10 that extends vertically and is rotatably held relative to the base 4 via a bearing or the like, and a nut 11 that moves along the axial direction of the screw shaft 10 as the screw shaft 10 rotates. The rotating shaft of the Z-axis motor 6 is connected to the upper end of the screw shaft 10 via a coupling or the like, and the screw shaft 10 rotates when the Z-axis motor 6 is driven.

[0020] A housing 12 that holds a nut 11 is attached to the slider 9. That is, a driving force is applied to the housing 12 by the nut 11, and the housing 12 is supported by the slider 9 so as to move up and down. Therefore, when the Z-axis motor 6 is rotated, the housing 12 can be raised or lowered depending on the amount and direction of rotation. Furthermore, the housing 12 in this embodiment has a function of rotatably holding a shaft body 14 (described later) and a coupling function that communicates with a suction passage provided inside the shaft body 14 and is configured to be connectable to a pump or the like (not shown), allowing air to be sucked from the suction passage by the pump or the like.

[0021] A θ-axis motor 13 is attached to the housing 12. The θ-axis motor 13 is attached to the upper part of the housing 12 so as to be immovable relative to the housing 12 with its rotation shaft facing downward.

[0022] A shaft 14 is attached to the housing 12. The shaft 14 in this embodiment is hollow and has a circular outer diameter, and is provided with a suction passage inside that leads to a pump (not shown) connected to the housing 12. The shaft 14 is rotatably held relative to the housing 12 via a bearing or the like. The rotating shaft of the θ-axis motor 13 is connected to the upper end of the shaft 14 via a coupling or the like, and when the θ-axis motor 13 is driven, the shaft 14 rotates circumferentially around the axis O within an unlimited range of 0° to ±360°.

[0023] A head portion 15 is provided at the tip of the shaft body 14. In this embodiment, the head portion 15 is provided integrally with the shaft body 14 and moves together with the shaft body 14 in the front-to-back, left-to-right, and up-and-down directions, and also rotates around the axis O. The head portion 15 is hollow, and can suck in air through the suction passage described above, thereby suctioning the component 103 that comes into contact with the lower end surface of the head portion 15.

[0024] Next, the heating unit 3 will be described. The heating unit 3 is provided separately from the mounting unit 2 and has the function of transferring heat to the mounting unit 2 to heat the head portion 15. Heat may be transferred from the heating unit 3 to the mounting unit 2 by thermal conduction, convection, thermal radiation, or electromagnetic induction. The heating unit 3 shown in FIGS. 1 and 2 is an example of a unit that uses thermal conduction, transferring heat from the heating unit 3 to the shaft 14 by contacting the shaft 14, thereby heating the head portion 15. Such a heating unit 3 can be realized, for example, by using a heater that heats by passing electricity. The heating unit 3 of this embodiment is generally block-shaped and has a heater (not shown) attached to it. As shown in FIG. 2, a heat transfer portion 16 that contacts the shaft 14 and transfers heat from the heating unit 3 is provided on the side of the heating unit 3.

[0025] The heating unit 3 may be a device that transfers heat to the mounting unit 2 without contact, as shown in Fig. 3, by utilizing the above-mentioned convection, thermal radiation, or electromagnetic induction. Examples of devices that transfer heat to the mounting unit 2 without contact include a hot air heater that generates hot air, an infrared heater that radiates infrared rays, and an IH heater. The head portion 15 can be heated by transferring heat to the shaft 14 without contact using hot air from a hot air heater, infrared rays from an infrared heater, or electromagnetic induction from an IH heater.

[0026] Next, a method for mounting components 103 on a substrate 102 provided with an ACF 101 using the mounting device 1 will be described. Here, it is assumed that the ACF 101 is temporarily fixed to the substrate 102 in advance. It is also assumed that the substrate 102 provided with the ACF 101 is transported at a predetermined timing to a position where the components 103 are to be mounted. It is also assumed that the components 103 are sucked by the head unit 15.

[0027] First, the mounting unit 2 is moved by the X-direction moving means and Y-direction moving means (not shown) described above, and the shaft 14 is brought into contact with the heat transfer section 16 of the heating unit 3, as shown in Fig. 2. Heat from the heating unit 3 is transferred from the heat transfer section 16 to the head section 15 via the shaft 14, so that the head section 15 can be heated.

[0028] Next, the mounting unit 2 is moved to directly above the ACF 101 by the X-direction moving means and the Y-direction moving means. In this state, the shaft 14 is not in contact with the heat transfer portion 16 of the heating unit 3. The orientations of the board 102 and the component 103 around the Z-axis are recognized by the above-mentioned recognition mechanism, and the orientation of the component 103 around the Z-axis is aligned with the orientation of the board 102 around the Z-axis by driving the θ-axis motor 13. The Z-axis motor 6 is then driven to lower the housing 12, thereby pressing the component 103 against the ACF 101. As described above, since the head portion 15 is heated by the heating unit 3, the heat of the head portion 15 is also transferred to the ACF 101 via the component 103. Therefore, the conductive particles contained in the ACF 101 electrically connect the board 102 and the component 103, and the thermosetting resin is cured to bond them together.

[0029] In the above-described procedure, when the head portion 15 is heated by the heating unit 3, the component 103 is adsorbed onto the head portion 15, but the component 103 may also be adsorbed after the head portion 15 is heated by the heating unit 3.

[0030] The mounting unit 2 does not have a heater that is installed in conventional mounting units, and therefore can be lighter in weight than conventional mounting units. Therefore, when using components 103 that need to be mounted with low pressure (for example, when the size of the components 103 is small (for example, the X-direction length and Y-direction length of the components 103 are approximately 1 mm), or when the components 103 are easily damaged by pressure), the mechanism that was previously provided to cancel the mounting unit's own weight can be omitted in the mounting unit 2 of this embodiment.

[0031] Furthermore, in conventional mounting units equipped with heaters, when an alignment function is provided to align the component orientation with the board orientation before mounting, the rotation angle range of the head unit is limited by the heater wiring. As an example, the rotation angle range of conventional mounting units equipped with heaters was limited to a range of approximately 60° in the circumferential direction around the rotation axis. In contrast, the mounting unit 2 of this embodiment can rotate circumferentially around the axis O within an unlimited range of 0° to ±360°.

[0032] The mounting apparatus according to the present invention can also be realized as a mounting apparatus 21 shown in Figures 4 and 5. The mounting apparatus 21 of this embodiment includes a mounting unit 22 and a heating unit 23.

[0033] The mounting unit 22 includes a base 24 to which various components constituting the mounting unit 22 are attached. In this embodiment, the base 24 includes a first member 24a extending along the Z direction and attached to an X-direction moving means and a Y-direction moving means (not shown), a second member 24b extending along the X direction and attached to the upper end of the first member 24a, a third member 24c having a circular hole penetrating in the Z direction and attached to the middle of the first member 24a, and a fourth member 24d extending along the X direction and attached to the lower end of the first member 24a. In this embodiment, the first member 24a, the second member 24b, and the third member 24c are formed from a metal material such as aluminum, while the fourth member 24d is formed from a thermally insulating material (a material with low thermal conductivity). Examples of thermally insulating materials include laminated sheets containing glass fiber and ceramic. The first member 24a and other components constituting the base 24 are fixed to each other, for example, with bolts or the like.

[0034] The linear motion mechanism 5, Z-axis motor 6, and ball screw 7 described above are attached to the base 24. The configurations of the linear motion mechanism 5, Z-axis motor 6, and ball screw 7 provided in the mounting unit 22, the configurations of the rail 8 and slider 9 included in the linear motion mechanism 5, and the configurations of the screw shaft 10 and nut 11 included in the ball screw 7 are the same as those of the mounting unit 2 described above, so the same reference numerals are used in the drawings and detailed description will be omitted. In the mounting unit 22, the screw shaft 10 is inserted into a hole in the second member 24b and rotatably supported by the second member 24b. The main purpose of providing the second member 24b is to stably rotate the screw shaft 10, and it may be provided as desired depending on the length, thickness, etc. of the screw shaft 10.

[0035] A housing 32 that holds the nut 11 is attached to the slider 9, and when the Z-axis motor 6 is rotated, the housing 32 can be raised or lowered depending on the amount and direction of rotation. Similar to the housing 12 described above, the housing 32 has the function of rotatably holding the shaft body 14, and also has a coupling function that communicates with a suction passage provided inside the shaft body 14 and is configured to be connectable to a pump or the like (not shown), allowing air to be sucked from the suction passage by the pump or the like.

[0036] The above-mentioned θ-axis motor 13 and shaft body 14 are attached to the housing 32. As described above, the rotating shaft of the θ-axis motor 13 is connected to the upper end of the shaft body 14 via a coupling or the like, and in this embodiment as well, the shaft body 14 rotates circumferentially around the axis O within an unlimited range of 0° to ±360°.

[0037] A head portion 35 is provided at the tip of the shaft body 14. In this embodiment, the head portion 35 is composed of a disk-shaped upper head portion 35a that is larger in diameter than the shaft body 14, and a lower head portion 35b that is smaller in diameter than the upper head portion 35a, tapers downward at its lower end, and has suction holes in its lower end surface for suctioning a component (not shown). A passage is provided inside the head portion 35 that leads to a suction passage provided inside the shaft body 14, and by sucking air through this suction passage, a component (not shown) can be sucked through the suction holes provided in the lower end surface of the lower head portion 35b.

[0038] Although not shown, the mounting device 21 of this embodiment is provided with a load cell for measuring the force applied to the component when the component picked up by the head unit 35 is mounted on the board.

[0039] In this embodiment, the heating unit 23 is shaped like a plate overall and is fixed to the fourth member 24d described above. The heating unit 23 in this embodiment includes a heater that heats when electricity is applied. The heater is connected to a power source by wiring (not shown), and the heating unit 23 can be heated by supplying power from the power source. The fourth member 24d to which the heating unit 23 is fixed is made of a heat-insulating material, so that heat from the heating unit 23 is not easily transferred to the first member 24a.

[0040] The heating unit 23 also has a circular through-hole 23a. As shown in the figure, the shaft 14 is inserted through the through-hole 23a. In this embodiment, the inner diameter of the through-hole 23a is larger than the outer diameter of the shaft 14, so that the shaft 14 does not contact the heating unit 23. The head 35 provided at the tip of the shaft 14 is located below the heating unit 23 as shown in the figure. FIG. 4 shows a state in which the Z-axis motor 6 is rotated to lower the housing 32. At this time, the upper surface of the head upper part 35a is separated from the lower surface of the heating unit 23, and the head 35 is not in contact with the heating unit 23. FIG. 5 shows a state in which the Z-axis motor 6 is rotated in the reverse direction to raise the housing 32. At this time, the upper surface of the head upper part 35a contacts the lower surface of the heating unit 23. As a result, heat from the heating unit 23 is transferred to the head 35, heating the head 35.

[0041] In the mounting device 21 configured in this manner, the heating unit 23 is immovable in the Z direction together with the base 24, Z-axis motor 6, rail 8, and screw shaft 10. Here, a group of members that are immovable in the Z direction, such as the heating unit 23, base 24, and Z-axis motor 6, is referred to as a Z-direction fixed unit U1. On the other hand, the shaft 14 and head 35 are movable in the Z direction together with the housing 32, θ-axis motor 13, slider 9, and nut 11. Here, a group of members that are movable in the Z direction, such as the shaft 14, head 35, and housing 32, is referred to as a Z-direction moving unit U2.

[0042] Note that the Z-direction fixed unit U1 and the Z-direction moving unit U2 are not provided with an elastic body that biases the head unit 35 in the Z direction between the Z-axis motor 6 and the head unit 35. In other words, the head unit 35 moves in the Z direction in accordance with the movement amount when the Z-axis motor 6 rotates to raise or lower the housing 32.

[0043] 1 and 2 using the mounting device 21, the Z-direction movement unit U2 is raised to bring the head 35 into contact with the heating unit 23, as shown in Fig. 5. In this state, heat from the heating unit 23 is transferred to the head 35, causing the head 35 to heat up. Depending on the type of ACF 101 and the component 103, the head 35 may be heated with the component 103 held by suction, or the head 35 may be heated without suctioning the component 103, and the heated head 35 may then pick up the component 103 just before mounting it on the substrate 102.

[0044] The X-direction moving means and the Y-direction moving means move the mounting unit 22 to directly above the ACF 101. The orientations of the board 102 and the component 103 around the Z axis are recognized by the above-described recognition mechanism. The θ-axis motor 13 is then driven to align the orientations of the component 103 and the board 102 around the Z axis. The Z-axis motor 6 is then driven to lower the Z-direction moving unit U2 relative to the Z-direction fixed unit U1. The heating unit 23 is provided on the Z-direction fixed unit U1. The Z-direction moving unit U2 is lighter and has less inertia than a unit with a heater in the head, as in Patent Document 1, and therefore moves in the Z direction with good responsiveness using the Z-axis motor 6. Furthermore, because the Z-direction moving unit U2 is light in weight, the mounting device 21, like the mounting device 1 described above, can suitably mount components 103 that require low pressure on the board 102 without a mechanism to cancel out the weight of the Z-direction moving unit U2. Furthermore, the mounting device 21 does not have an elastic body in the Z-direction fixed unit U1 and the Z-direction moving unit U2 that biases the head unit 35 in the Z direction, and therefore it is possible to move the head unit 35 in the Z direction with high precision. In other words, when mounting the component 103 on the board 102, the head unit 35 can be moved in the Z direction as desired while the force applied to the component 103 picked up by the head unit 35 is monitored by the load cell described above, and therefore it is possible to more suitably mount the component 103 that needs to be mounted with low pressure.

[0045] Although one embodiment of the present invention has been described above, the present invention is not limited to this specific embodiment, and unless otherwise specifically limited in the above description, various modifications and variations are possible within the spirit and scope of the present invention as defined in the claims. For example, the configurations of the above-described embodiment can be added or deleted as appropriate, and the configurations of one embodiment can be incorporated into other embodiments. Furthermore, the effects of the above-described embodiment are merely examples of the effects resulting from the present invention, and do not mean that the effects of the present invention are limited to the above-described effects.

[0046] For example, while the heads 15, 35 in this embodiment have the function of suctioning the component 103, the present invention also includes a configuration without a suction function. The portion of the mounting unit 2 heated by the heating unit 3 may be a portion other than the shaft 14 described above. The heating unit 3 may directly heat the head 15, or may heat both the shaft 14 and the head 15. The heat transfer unit 16 may be, for example, a planar member that makes linear contact with the shaft 14, which has a circular outer shape, or a semicircular recess that makes surface contact with the shaft 14. The heating unit 3 may contact the shaft 14 on one side in the left-right direction, as shown in the figure, or may be configured to sandwich the shaft 14 between a pair of members that can open and close in the left-right direction, and contact the shaft 14 on both sides in the left-right direction.

[0047] Furthermore, when heating the head portion 35 with the heating unit 23, it is not limited to the case where the head portion 35 is in contact with the heating unit 23. Alternatively, a structure may be adopted in which the shaft 14 is in contact with the heating unit 23 to heat the head portion 35 via the shaft 14, while the shaft 14 is not in contact with the heating unit 23 when mounting the component 103 with the head portion 35 (for example, as in the modified example of the heating unit 3 described above, the heating unit 23 is configured to open and close in the left-right direction relative to the shaft 14, and the shaft 14 is sandwiched between the heating unit 23 when heating the head portion 35, and the head portion 35 opens left and right so that the shaft 14 and the heating unit 23 are not in contact when mounting the component 103 with the head portion 35). Furthermore, when heating the head portion 35, both the head portion 35 and the shaft 14 may be in contact with the heating unit 23.

[0048] 1, 21: Mounting device 2, 22: Mounting unit 3, 23: Heating unit 13: θ-axis motor 14: Shaft body 15, 35: Head section 16: Heat transfer section 102: Board 103: Component O: Axis U1: Z-direction fixed unit (fixed unit) U2: Z-direction moving unit (moving unit)

Claims

1. A mounting device comprising a head section which presses a component against a board, and a heating unit which heats the head section, comprising: a fixed unit which is immobile in a direction in which it moves toward and away from the board and has a Z-axis motor; and a moving unit which is held by the fixed unit so as to be movable in a direction in which it moves toward and away from the board, and which moves toward and away from the board when the Z-axis motor is driven, wherein the fixed unit has the heating unit, and the moving unit has the head section and a shaft body with the head section attached at its tip, wherein when the moving unit is retracted relative to the fixed unit, the head section and / or the shaft body come into contact with the heating unit and the head section is heated, and when the moving unit is advanced relative to the fixed unit to press the component against the board, the head section and the shaft body are not in contact with the heating unit.

2. The mounting device according to claim 1, wherein the fixed unit and the moving unit are not provided with an elastic body for biasing the head portion in a direction for moving toward and away from the board.

3. The mounting device according to claim 1, wherein the moving unit has a θ-axis motor that rotates the shaft about its axis.

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