Adhesive composition, as well as adhesive sheet, laminate, and printed wiring board containing same

The adhesive composition for flexible printed wiring boards, combining acid-modified resin, oxazoline group-containing polystyrene, and epoxy resin, addresses the limitations of existing adhesives by forming a high-density crosslinked structure, resulting in superior solder heat resistance and dielectric properties for high-frequency applications.

WO2025018339A1PCT designated stage expired Publication Date: 2025-01-23TOYOBO MC CORP
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Patent Information

Application Number
PCT/JP2024/025494
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-07-20
Filing Date
2024-07-16
Publication Date
2025-01-23

AI Technical Summary

Technical Problem

Existing adhesive compositions for flexible printed wiring boards (FPCs) fail to provide excellent soldering heat resistance, adhesive strength, and dielectric properties, particularly in high-frequency applications, due to high polarity and insufficient heat resistance.

Method used

An adhesive composition comprising acid-modified resin, oxazoline group-containing polystyrene, and epoxy resin, where the oxazoline group-containing polystyrene is copolymerized with styrene and an oxazoline group-containing monomer, forming a high-density crosslinked structure that suppresses hydroxyl group generation, enhancing solder heat resistance and dielectric properties.

Benefits of technology

The adhesive composition achieves excellent solder heat resistance, adhesive strength, and dielectric properties, making it suitable for high-frequency FPC applications by balancing the reaction between acid-modified resin, oxazoline group-containing polystyrene, and epoxy resin.

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Abstract

The present invention provides: an adhesive composition that has excellent solder heat resistance and adhesive strength, and also has dielectric characteristics with low relative permittivity and low loss tangent; and an adhesive sheet, a laminate, and a printed wiring board containing the same.　An adhesive composition according to the present invention contains an acid-modified resin, an oxazoline-group-containing polystyrene (A), and an epoxy resin (B). The oxazoline-group-containing polystyrene (A) content is 12-1000 parts by mass per 100 parts by mass of the acid-modified resin.
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Citation Information

Patent Citations

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