Electronic device comprising metal housing, and method for manufacturing same

Abstract

An electronic device according to one embodiment of the present disclosure may comprise: a display; and a housing in which the display is seated. The housing may include a first metal part at least partially exposed to the outside of the electronic device, a second metal part surrounded by the first metal part, and an injection-molded part. The first metal part includes an opening formed to pass through a part of the first metal part, and the opening can be formed so that the space expands toward a first direction. The second metal part includes a coupling portion for coupling with the opening of the first metal part, and a melted portion may be formed in a portion of the coupling portion. The injection-molded part may cover the opening and at least a portion of the coupling portion.

Description

Electronic device including metal housing and method for manufacturing same

[0001] One embodiment disclosed in this document relates to an electronic device including a metal housing and a method for manufacturing the same.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. In particular, recent electronic devices are being developed to enable portable communication.

[0003] Electronic devices can refer to devices that perform specific functions according to the programs installed on them, including home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and car navigation systems. For example, these electronic devices can output stored information as audio or video. As the integration of electronic devices increases and ultra-high-speed, high-capacity wireless communication becomes more widespread, a single electronic device, such as a mobile communication terminal, can now be equipped with various functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions for mobile banking, and functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are becoming smaller so that users can conveniently carry them.

[0004] Recently, electronic devices are being made of metal for their external housings to meet consumers' demands for aesthetic design.

[0005] An electronic device according to one embodiment of the present disclosure may include a display and a housing in which the display is mounted. The housing may include a first metal part at least partially exposed to the outside of the electronic device, a second metal part surrounded by the first metal part, and an injection part. The first metal part may include an opening formed to penetrate a portion of the first metal part, and the opening may be formed such that a space expands in a first direction. The second metal part may include a coupling part for coupling with the opening of the first metal part, and a portion of the coupling part may be formed as a melted portion. The injection part may cover at least a portion of the opening and the coupling part.

[0006] According to one embodiment of the present disclosure, a housing of an electronic device may include a first metal part at least partially exposed to the outside of the electronic device and a second metal part surrounded by the first metal part. The first metal part may include an opening formed to penetrate a portion of the first metal part and formed to allow a space to expand in a first direction. The second metal part may include a joining portion for joining with the opening of the first metal part, and a portion of the joining portion may be formed as a melted portion.

[0007] In one embodiment of the present disclosure, a method for manufacturing a housing of an electronic device may include a first metal base material processing process including an opening formed to expand a space in a first direction, a second metal base material processing process including a joining portion joined to the opening of the first metal base material, an aligning process for joining the first metal base material and the second metal base material, wherein a supporting portion of the joining portion is arranged to contact an edge of the opening of the first metal base material, and a protruding portion extended from the supporting portion is arranged to be inserted into the opening of the first metal base material, a bonding process for applying heat to a surface of the supporting portion of the second metal base material aligned with the first metal base material facing a second direction opposite to the first direction, and an injection process for forming an injection base material portion in an adjacent region of the first metal base material and the second metal base material.

[0008] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment disclosed in this document.

[0009] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment disclosed in this document.

[0010] FIG. 3 is a perspective view showing the rear side of the electronic device illustrated in FIG. 2 according to one embodiment disclosed in this document.

[0011] FIG. 4A is a front exploded perspective view of the electronic device illustrated in FIG. 2, according to one embodiment disclosed in this document.

[0012] FIG. 4b is an exploded perspective view showing the rear side of the electronic device illustrated in FIG. 2, according to one embodiment disclosed in this document.

[0013] FIG. 5 is a perspective view showing a portion of a housing excluding electrical components of an electronic device according to one embodiment of the present disclosure.

[0014] FIG. 6 is an enlarged cross-sectional view showing a portion of a joint portion of a housing cut along line AA` of FIG. 5 according to one embodiment of the present disclosure.

[0015] FIG. 7 is a flowchart for forming a bonding structure of a housing of an electronic device according to one embodiment of the present disclosure.

[0016] FIG. 8A is a drawing showing a bonding state between a first metal base material and a second metal base material during a process of manufacturing a housing of an electronic device according to one embodiment of the present disclosure.

[0017] FIG. 8b is a drawing showing a state of coupling between a first metal portion, a second metal portion, and an injection portion of a housing of an electronic device according to one embodiment of the present disclosure.

[0018] FIG. 9 is a drawing sequentially showing a bonding process between a first metal base material, a second metal base material, and an injection base material of a housing of an electronic device according to one embodiment of the present disclosure.

[0019] FIG. 10 is a drawing sequentially showing a bonding process between a first metal base material, a second metal base material, and an injection base material of a housing of an electronic device according to one embodiment of the present disclosure.

[0020] FIG. 11 is a drawing sequentially showing a bonding process between a first metal base material, a second metal base material, and an injection base material of a housing of an electronic device according to one embodiment of the present disclosure.

[0021] FIG. 12A is a drawing showing a bonding relationship between a first metal portion and a second metal portion of a housing of an electronic device according to one embodiment of the present disclosure.

[0022] FIG. 12b is a drawing showing an assembly state between a first metal base material and a second metal base material before a bonding process during a housing forming process of an electronic device according to one embodiment of the present disclosure.

[0023] FIG. 12c is a drawing showing a bonding state between a first metal base material and a second metal base material that have undergone a bonding process during a housing forming process of an electronic device according to one embodiment of the present disclosure.

[0024] Electronic devices according to the embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments disclosed in this document are not limited to the aforementioned devices.

[0025] The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0026] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0027] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and arranged in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0028] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment disclosed in this document.

[0029] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In one embodiment, the electronic device (101) may have at least one of these components (e.g., the connection terminal (178)) omitted, or one or more other components added. In one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0030] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0031] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0032] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0033] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0034] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0035] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0036] The display module (160) can visually provide information to an external device (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a hall area program device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0037] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0038] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0039] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0040] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0041] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0042] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0043] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0044] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0045] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0046] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0047] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0048] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0049] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0050] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0051] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment disclosed in this document.

[0052] FIG. 3 is a perspective view showing the rear side of the electronic device illustrated in FIG. 2 according to one embodiment disclosed in this document.

[0053] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1) may include a housing (110) that includes a first side (or front side) (110A), a second side (or back side) (110B), and a side surface (110C) that surrounds a space between the first side (110A) and the second side (110B). In one embodiment (not shown), the housing (110) may also refer to a structure that forms a portion of the first side (110A) of FIG. 2, the second side (110B) of FIG. 3, and the side surface (110C).

[0054] In one embodiment, the first side (110A) may be formed by a front plate (102) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate comprising various coating layers). The second side (110B) may be formed by a substantially opaque back plate (111). The back plate (111) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (110C) may be formed by a side structure (or “side bezel structure”) (118) that is joined to the front plate (102) and the back plate (111) and comprises a metal and / or a polymer. In one embodiment, the back plate (111) and the side structure (118) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0055] In one embodiment, the front plate (102) may include a seamlessly extending region(s) that curves toward the back plate (111) from at least a portion of an edge. For example, the front plate (102) (or the back plate (111)) may include only one of the curved extending regions toward the back plate (111) (or the front plate (102)) at one edge of the first side (110A). In one embodiment, the front plate (102) or the back plate (111) may be substantially flat, in which case it may not include a curved extending region. When the front plate (102) or the back plate (111) includes a curved extending region, the thickness of the electronic device (101) in the portion that includes the curved extending region may be smaller than the thickness of other portions.

[0056] According to one embodiment, the electronic device (101) may include at least one of a display (101), an audio module (e.g., a microphone hole (103), an external speaker hole (107), a call receiver hole (114)), a sensor module (e.g., a first sensor module (104), a second sensor module (not shown), a third sensor module (119)), a camera module (e.g., a first camera device (105), a second camera device (112), a flash (113)), a key input device (117), a light-emitting element (106), and a connector hole (e.g., a first connector hole (108), a second connector hole (109)). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., the key input device (117) or the light-emitting element (106)) or may additionally include another component.

[0057] The display (101) may output a screen or be visually exposed, for example, through a significant portion of the first surface (110A) (e.g., the front plate (102)). In one embodiment, at least a portion of the display (101) may be visually exposed through the front plate (102) forming the first surface (110A) or through a portion of a side surface (110C). In one embodiment, the corners of the display (101) may be formed to be substantially the same as the adjacent outer shape of the front plate (102). In one embodiment (not shown), in order to expand the area where the display (101) is visually exposed, the gap between the outer edge of the display (101) and the outer edge of the front plate (102) may be formed to be substantially the same.

[0058] According to one embodiment, a recess or opening may be formed in a part of a screen display area of ​​the display (101), and at least one of an audio module (e.g., a call receiver hole (114)), a sensor module (e.g., a first sensor module (104)), a camera module (e.g., a first camera device (105)), and a light-emitting element (106) may be included that are aligned with the recess or opening. In one embodiment (not shown), at least one of an audio module (e.g., a call receiver hole (114)), a sensor module (e.g., a first sensor module (104)), a camera module (e.g., a first camera device (105)), a fingerprint sensor (not shown), and a light-emitting element (106) may be included on the back surface of the screen display area of ​​the display (101). In one embodiment (not shown), the display (101) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen.

[0059] According to one embodiment, the audio module (103, 107, 114) may include a microphone hole (103) and a speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)). The microphone hole (103) may have a microphone disposed therein for acquiring external sound, and in one embodiment, multiple microphones may be disposed so as to detect the direction of the sound. The speaker hole may include an external speaker hole (107) and a call receiver hole (114). In one embodiment, the speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)) and the microphone hole (103) may be implemented as a single hole, or a speaker may be included (e.g., a piezo speaker) without a speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)).

[0060] According to one embodiment, the sensor module may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module may include, for example, a first sensor module (104) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (110A) of the housing (110), and / or a third sensor module (119) disposed on a second surface (110B) of the housing (110). The second sensor module (not shown) (e.g., a fingerprint sensor) may be disposed on not only the first surface (110A) (e.g., the display (101)) of the housing (110), but also the second surface (110B) or the side surface (110C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (104).

[0061] According to one embodiment, the camera module may include a first camera device (105) disposed on a first side (110A) of the electronic device (101), a second camera device (112) disposed on a second side (110B), and / or a flash (113). The camera devices (e.g., the first camera device (105), the second camera device (112)) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (113) may include, for example, a light emitting diode or a xenon lamp. In one embodiment, one or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be disposed on one side of the electronic device (101). In one embodiment, the flash (113) may emit infrared light, and the infrared light emitted by the flash (113) and reflected by the subject may be received through the third sensor module (119). The electronic device (101) or a processor of the electronic device (101) (e.g., the processor (120) of FIG. 1) may detect depth information of the subject based on the point in time when the infrared light is received by the third sensor module (119).

[0062] According to one embodiment, the key input device (117) may be disposed on a side surface (110C) of the housing (110). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (117), and the key input devices (117) that are not included may be implemented in other forms, such as soft keys, on the display (101). In one embodiment, the key input device may include a sensor module disposed on a second surface (110B) of the housing (110).

[0063] In one embodiment, the light-emitting element (106) may be disposed, for example, on the first surface (110A) of the housing (110). The light-emitting element (106) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light-emitting element (106) may provide a light source that is linked to the operation of, for example, a camera module (e.g., the first camera device (105)). The light-emitting element (106) may include, for example, an LED, an IR LED, and a xenon lamp.

[0064] According to one embodiment, the connector hole (e.g., the first connector hole (108), the second connector hole (109)) may include a first connector hole (108) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device (e.g., the electronic device (1002) of FIG. 1), and / or a second connector hole (e.g., an earphone jack) (109) that can accommodate a connector for transmitting and receiving audio signals with the external electronic device.

[0065] FIG. 4A is a front exploded perspective view of the electronic device illustrated in FIG. 2, according to one embodiment disclosed in this document.

[0066] FIG. 4b is an exploded perspective view showing the rear side of the electronic device illustrated in FIG. 2, according to one embodiment disclosed in this document.

[0067] Referring to FIGS. 4A and 4B , the electronic device (101) (e.g., the electronic device (101) of FIG. 1 , FIG. 2 , or FIG. 3 ) may include a side structure (210), a first support member (211) (e.g., a bracket), a front plate (220) (e.g., the front plate (102) of FIG. 2 ), a display (230) (e.g., the display (101) of FIGS. 2 and 3 ), a printed circuit board (or board assembly) (240), a battery (250), a second support member (260) (e.g., a rear case), an antenna, a camera assembly (207), and a rear plate (280) (e.g., the rear plate (111) of FIG. 3 ).

[0068] According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., the first support member (211) or the second support member (260)) or may additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 2 or FIG. 3, and any redundant description will be omitted below.

[0069] According to one embodiment, the first support member (211) may be disposed inside the electronic device (101) and connected to the side structure (210) or may be formed integrally with the side structure (210). The first support member (211) may be formed of, for example, a metallic material and / or a non-metallic (e.g., a polymer) material. When formed at least partially of a metallic material, the side structure (210) or a portion of the first support member (211) may function as an antenna. The first support member (211) may have a display (230) coupled to one surface and a printed circuit board (240) coupled to the other surface. The printed circuit board (240) may be equipped with a processor (e.g., the processor (120) of FIG. 1), a memory (e.g., the memory (130) of FIG. 1), and / or an interface (e.g., the interface (177) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0070] In one embodiment, the first support member (211) and the side structure (210) may be combined to form a front case or housing (201). In one embodiment, the housing (201) may be generally understood as a structure for accommodating, protecting, or arranging a printed circuit board (240) or a battery (250). In one embodiment, the housing (201) may be understood as including structures that can be visually or tactilely perceived by a user in the appearance of the electronic device (101), for example, a side structure (210), a front plate (220), and / or a rear plate (280). In one embodiment, the 'front or rear side of the housing (201)' may mean the first side (110A) of FIG. 2 or the second side (110B) of FIG. 3. In one embodiment, the first support member (211) is positioned between the front plate (220) (e.g., the first side (110A) of FIG. 2) and the back plate (280) (e.g., the second side (110B) of FIG. 3) and may function as a structure for positioning electrical / electronic components such as a printed circuit board (240) or a camera assembly (207).

[0071] According to one embodiment, the display (230) may include a display panel (231) and a flexible printed circuit board (233) extending from the display panel (231). The flexible printed circuit board (233) may be understood to be electrically connected to the display panel (231) while being disposed, for example, at least partially on the rear surface of the display panel (231). In one embodiment, reference numeral '231' may be understood to be a protective sheet disposed on the rear surface of the display panel. For example, unless otherwise specified in the following detailed description, the protective sheet may be understood to be a part of the display panel (231). In one embodiment, the protective sheet may function as a buffer structure (e.g., a low-density elastomer such as a sponge) that absorbs external force or an electromagnetic shielding structure (e.g., a copper sheet (CU sheet)). According to one embodiment, the display (230) may be disposed on the inner surface of the front plate (220) and may output a screen through at least a portion of the first surface (110A) or the front plate (220) of FIG. 2 by including a light-emitting layer. As mentioned above, the display (230) may output a screen through substantially the entire area of ​​the first surface (110A) or the front plate (220) of FIG. 2.

[0072] According to one embodiment, the memory may include, for example, volatile memory or non-volatile memory.

[0073] According to one embodiment, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0074] According to one embodiment, the second support member (260) may include, for example, an upper support member (260a) and a lower support member (260b). In one embodiment, the upper support member (260a) may be arranged to surround a printed circuit board (240) together with a portion of the first support member (211). A circuit device implemented in the form of an integrated circuit chip (e.g., a processor, a communication module, or a memory) or various electrical / electronic components may be arranged on the printed circuit board (240), and according to an embodiment, the printed circuit board (240) may be provided with an electromagnetic shielding environment from the upper support member (260a). In one embodiment, the lower support member (260b) may be utilized as a structure on which electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be arranged. In one embodiment, electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be arranged on an additional printed circuit board (not shown). In this case, the lower support member (260b) may be arranged to surround the additional printed circuit board together with another part of the first support member (211). The speaker module or interface arranged on the additional printed circuit board (not shown) or the lower support member (260b) may be arranged corresponding to the audio module (e.g., the microphone hole (103) or the speaker hole (e.g., the external speaker hole (107), the call receiver hole (114))) or the connector hole (e.g., the first connector hole (108), the second connector hole (109)) of FIG. 2.

[0075] According to one embodiment, it can be positioned corresponding to the audio module (207) or connector hole (108, 109).

[0076] According to one embodiment, the battery (250) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be disposed substantially on the same plane as, for example, the printed circuit board (240). The battery (250) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0077] According to one embodiment, the electronic device (101) may further include a separate sub-circuit board (290) spaced apart from the printed circuit board (240) within the first support member (211). The sub-circuit board (290) may be electrically connected to the printed circuit board (240) via a connecting member such as a connecting flexible board or cable. The sub-circuit board (290) may be electrically connected to electrical components disposed in an end region of the electronic device (101), such as a battery (289) or a speaker, a USB connector, an antenna connector, and / or a SIM socket, to transmit signals and power.

[0078] Although not shown, the antenna may include a conductive pattern implemented on the surface of the second support member (260), for example, through a laser direct structuring process. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the back plate (280) and the battery (250). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by the side structure (210) and / or a portion or combination of the first support member (211).

[0079] In one embodiment, the camera assembly (207) may include at least one camera module. Within the electronic device (101), the camera assembly (207) may receive at least a portion of light incident through an optical hole or camera window (212, 213, 219). In one embodiment, the camera assembly (207) may be disposed on the first support member (211) at a location adjacent to the printed circuit board (240). In one embodiment, the camera module(s) of the camera assembly (207) may be generally aligned with one of the camera windows (212, 213, 219) and may be at least partially wrapped around the second support member (260) (e.g., the upper support member (260a)).

[0080] Below, the joint structure of the housing is described in detail.

[0081] FIG. 5 is a perspective view showing a portion of a housing excluding electrical components of an electronic device according to one embodiment of the present disclosure.

[0082] FIG. 6 is an enlarged cross-sectional view showing a portion of a joint portion of a housing cut along line AA` of FIG. 5 according to one embodiment of the present disclosure.

[0083] According to one embodiment, the electronic device (101) may include a housing (201) (e.g., the first support member (211) and the side structure (210) of FIGS. 4A and 4B). The housing (201) may include a first metal portion (310) (e.g., an outer metal portion), a second metal portion (320) (e.g., an inner metal portion), and an injection portion (330). According to one embodiment, the housing (201) may be understood as a structure for accommodating, protecting, or placing a printed circuit board (e.g., a printed circuit board (240) of FIGS. 4A and 4B) or a battery (a battery (250) of FIGS. 4A and 4B).

[0084] The configuration of the housing (201) of FIGS. 5 and 6 may be partially or completely identical to the configuration of the housing (201) of FIGS. 4a and 4b. The embodiments of FIGS. 5 and 6 may be partially combined with the embodiments of FIGS. 1 to 4b, or the embodiments of FIGS. 7 to 12c.

[0085] According to one embodiment, the housing (201) may include a first metal part (310) and a second metal part (320) surrounded by the first metal part (310). According to one embodiment, the housing (201) may include a first metal part (310), a second metal part (320) surrounded by the first metal part (310), and an injection part (330).

[0086] According to one embodiment, the first metal portion (310) of the housing (201) may form the exterior of the electronic device (101). The second metal portion (320) of the housing (201) may support a display (e.g., the display (220) of FIGS. 4A and 4B) and provide a space in which internal components are arranged. The injection-molded portion (330) of the housing (201) may be arranged along the boundary surface of the first metal portion (310) and the second metal portion (320).

[0087] According to one embodiment, the first metal portion (310) and the second metal portion (320) may be formed of a single metal material. For example, the first metal portion (310) forming the exterior and the second metal portion (320) disposed on the inside of the first metal portion (310) may be formed of at least one material selected from the group consisting of SUS (steel use stainless), titanium, magnesium, aluminum, ceramic, and glass.

[0088] According to one embodiment, the first metal portion (310) and the second metal portion (320) of the housing (201) may be formed of different metal materials (e.g., dissimilar metal materials). For example, the first metal portion (310) forming the exterior may be formed of a material that provides an attractive exterior, such as SUS (steel use stainless), titanium, or magnesium. The second metal portion (320) arranged on the inside of the first metal portion (310) may be formed of a material that is easy to process, such as aluminum.

[0089] According to one embodiment, after the first metal portion (310) and the second metal portion (320) of the housing (201) are joined, an injection-molded portion (330) may be disposed on the joined portion and at least a portion of the surface of the first metal portion (310) and the second metal portion (320) by an injection molding process. The injection-molded portion (330) may cover the joined portion to prevent corrosion, and may design the overall shape of the housing (201). Thereafter, the final shape of the housing (201) may be designed through a CNC (computer numerical control) process.

[0090] According to one embodiment, the housing (201) may be formed through a joint structure between a first metal portion (310) and a second metal portion (320). The first metal portion (310) may include an opening (315) penetrating an area, at least in part, of the electronic device (101). The second metal portion (320) may include a joint portion (325) for jointing with the opening (315) of the first metal portion (310). The overall shape and the opening (315) formed in a portion of the first metal portion (310) and / or the joint portion (325) with the second metal portion (320) may be formed through a CNC (computer numerical control) process.

[0091] According to one embodiment, the opening (315) of the first metal portion (310) (e.g., the diameter of the opening (315)) may be shaped such that at least a portion of the space expands toward the -P direction. For example, the -P direction may be an upward direction (e.g., a display direction) or a downward direction (e.g., a rear plate direction) of the electronic device (101). For example, the -P direction may be a direction in which a protruding portion (323) protruding from a supporting portion (321) of the second metal portion (320) faces. For example, the -P direction may be an opposite direction to one side (e.g., one side facing the +P direction) of the supporting portion (321) of the second metal portion (320) on which a bonding process (e.g., a welding process, a laser process, or a heating process) is performed.

[0092] According to one embodiment, the opening (315) of the first metal portion (310) may be formed to penetrate a portion of the first metal portion (310). The opening (315) penetrating a portion of the first metal portion (310) may be formed to have a variable internal space along the +P direction or the -P direction. For example, the opening (315) of the first metal portion (310) may have an internal space (e.g., a diameter of the opening (315)) that may be sequentially (or gradually) expanded along the -P direction. For example, the opening (315) of the first metal portion (310) may be expanded to be limited to a portion of the internal space along the -P direction.

[0093] According to one embodiment, the cross-section of the opening (315) of the first metal portion (310) may have a trapezoidal shape. For example, the opening (315) may have a circular, square, or polygonal shape when viewed from above or below the opening (315) in the -P direction or the +P direction. In the case of a circular opening, when viewed from above or below the opening (315) in the -P direction or the +P direction, the diameter of the upper space of the opening (315) and the diameter of the lower space of the opening (315) may be different. For example, the diameter of the lower space of the opening (315) may be larger than the diameter of the upper space of the opening (315).

[0094] According to one embodiment, the opening (315) of the first metal portion (310) may have an undercut shape. For example, the inner surface (311c) of the first metal portion (310) forming the opening (315) may be formed as an inclined surface such that the first metal portion (310) adjacent to the opening (315) has a specified incline with respect to the upper surface (311a) (e.g., the surface facing +P) or the lower surface (311b) (e.g., the surface facing -P).

[0095] According to one embodiment, the height (e.g., length in the -P direction or +P direction) of the opening (315) of the first metal portion (310) may be greater than the height (e.g., length in the -P direction or +P direction) of the protruding portion (323). For example, the protruding portion (323) of the second metal portion (320) inserted into the opening (315) penetrating an area of ​​the first metal portion (310) may be located within the opening (315) and may not be exposed outside the opening (315).

[0096] According to one embodiment, the housing (201) may be formed through a joint structure between a first metal portion (310) and a second metal portion (320). The second metal portion (320) may be formed such that at least a portion thereof is surrounded by the first metal portion, and may include a joint portion (325) for jointing with the opening (315) of the first metal portion (310). The joint portion (325) of the second metal portion (320) may include a support portion (321) adjacent to an edge of the opening (315) of the first metal portion (310) and a protruding portion (323) protruding from the support portion (321).

[0097] According to one embodiment, the support portion (321) of the second metal portion (320) may be arranged to be in contact with the first metal portion (310) and may face an upper space (e.g., a space facing the +P direction) of the opening (315). The protruding portion (323) of the second metal portion (320) may be formed to protrude from the support portion (321) in the -P direction and may be inserted into the opening (315) to be coupled with a portion of the inner surface of the first metal portion (310). The protruding portion (323) of the second metal portion (320) may have a shape such as a pole, a protrusion, or a rib.

[0098] According to one embodiment, a plurality of bonding structures between the first metal portion (310) and the second metal portion (320) may be formed. The bonding structures may be formed in various ways in the area where the first metal portion (310) and the second metal portion (320) are in contact. According to one embodiment, the bonding structure (e.g., bonding structure) between the first metal portion (310) and the second metal portion (320) may include a first bonding portion by chemical bonding (e.g., melting) and a second bonding portion by physical bonding.

[0099] According to one embodiment, the joint structure between the first metal part (310) and the second metal part (320) may be such that the support part (321) of the second metal part (320) is placed in contact with an edge adjacent to the opening (315) of the first metal part (310), and the protruding part (323) of the second metal part (320) is inserted into the opening (315) of the first metal part (310). Hereinafter, before the final product, such as before the joining process (e.g., welding process, laser process), the first metal part (310) may be named the first metal base material, and the second metal part (320) may be named the second metal base material. The joint parts (325) of the first metal part (310) (e.g., the support part (321) and the protruding part (323)) may be named the same. The opening (315) of the second metal part (320) may be named identically.

[0100] Before the joining process (e.g., welding process, laser process, or heating process), the size of the protruding portion (323) of the second metal base material may be smaller than the inner space of the opening (315) of the first metal part (310) and may not be in a fitted state. When heat is applied to the upper surface (e.g., one side facing +P) of the support portion (321) (e.g., welding process, laser process), heat may be transferred from the support portion (321) and the lower surface (e.g., one side facing -P) of the support portion (321) to the protruding portion (323) formed by the protrusion. The protruding portion (323) that is melted by the transfer of heat may be deformed into a shape corresponding to the shape of the opening (315) (e.g., an undercut shape). The shape of the protruding portion (323) corresponding to the opening (315) may be an undercut shape and may be in a fitted state with the opening (315).

[0101] According to one embodiment, the bonding structure between the first metal part (310) and the second metal part (320) may be such that the support part (321) of the second metal part (320) is placed in contact with an edge adjacent to the opening (315) of the first metal part (310), and the protruding part (323) of the second metal part (320) is inserted into the opening of the first metal part (310). According to one embodiment, the support part (321) of the second metal part (320) may form a chemical bonding part (e.g., the first bonding part) with the first metal part (310) that is in contact with it as a part thereof melts through a bonding process. The bonding process may be performed through a physical force such as stirring or welding without applying heat, or may be performed by at least one of a laser process using light or a heating process using heat. According to one embodiment, the adjacent edge of the opening (315) of the first metal portion (310) may form a chemical bonding portion (e.g., the first bonding portion) with the second metal portion (320) that is in contact with the opening (315) by partially melting through the bonding process. The supporting portion (321) of the second metal portion (320) and / or the adjacent edge (401) of the opening (315) that is melted together with the supporting portion (321) may be referred to as a melted portion.

[0102] According to one embodiment, the melted portion (401) may include, in addition to the support portion (321), a portion of a protruding portion (323) adjacent to the support portion (321) and an inner portion of the melted opening (315) together with a portion of the protruding portion (323).

[0103] According to one embodiment, a protruding portion (323) of a second metal portion (320) inserted into an opening (315) of a first metal portion (310) may form a physical joining portion (e.g., the second joining portion) by being fit-fitted with the opening (315). For example, the protruding portion (323) of the second metal base material may fill a portion of the opening (315) by melting through a joining process (e.g., a welding process, a laser process, or a heating process). Thereafter, the cooled protruding portion (323) may be fit-fitted into the opening (315) of the first metal portion (310). A portion of the protruding portion (323) and / or the opening (315) fit-fitted with the protruding portion (323) (e.g., an inner surface of the first metal portion (310) forming the opening (315)) may be referred to as a non-melted portion (402). The protruding portion (323) of the second metal portion (320) may be in a form in which only a portion of the opening (315) of the first metal portion (310) is inserted.

[0104] According to one embodiment, the bonding structure (e.g., bonding structure) between the first metal portion (310) and the second metal portion (320) may include a first bonding portion by chemical bonding (e.g., melting) and a second bonding portion by physical bonding. Within the expansion structure (e.g., undercut structure) of the opening (315) of the first metal portion (310), a portion that is bonded by melting and a portion that is not melted may be formed as a part of the second metal base material is melted and filled in the bonding process. The bonding structure between the first metal portion (310) and the second metal portion (320) that is bonded by melting may increase the bonding strength by chemical bonding. The increase in the area of ​​the protruding portion (323) of the second metal portion that is not melted and filled in the shape of the expansion structure of the opening (315) increases the area in contact with the first metal portion (310), thereby creating a structure that resists external force in a three-dimensional manner and increasing the bonding strength.

[0105] According to one embodiment, the injection portion (330) may be positioned on the upper and / or lower side of a joint structure (e.g., a joining structure) between the first metal portion (310) and the second metal portion (320). The injection portion (330) may be positioned to cover the joint structure between the first metal portion (310) and the second metal portion (320) to limit or reduce corrosion of the joint structure.

[0106] According to one embodiment, the injection portion (330) may include a first injection portion (330) disposed on the upper side (e.g., in the +P direction) of the coupling structure and a second injection portion (330) disposed on the lower side (e.g., in the -P direction) of the coupling structure. The first injection portion (330) may be disposed to surround an upper surface (e.g., a surface facing the +P direction) of the support portion (321) of the second metal portion (320) and the first metal portion (310) in contact therewith. For example, the first injection portion (330) may be disposed to surround at least a portion of the melted portion (e.g., the support portion (321) of the second metal portion (320) and / or an adjacent edge (401) of the melted opening (315) together with the support portion (321). The second injection portion (330) may be arranged to surround an outer surface (e.g., a surface facing the -P direction) of the protruding portion (323) of the second metal portion (320) and the first metal portion (310) in contact therewith. For example, the second injection portion (330) may be arranged together with the protruding portion (323) of the second metal portion (320) within the opening (315). For example, the second injection portion (330) may be arranged to surround at least a portion of a non-melted portion (402) (e.g., a portion of the protruding portion (323) of the second metal portion (320) and an inner surface of the first metal portion (310) forming the opening (315).

[0107] FIG. 7 is a flowchart for forming a bonding structure of a housing of an electronic device according to one embodiment of the present disclosure.

[0108] FIG. 8A is a drawing showing a bonding state between a first metal base material and a second metal base material during a process of manufacturing a housing of an electronic device according to one embodiment of the present disclosure.

[0109] FIG. 8b is a drawing showing a state of coupling between a first metal portion, a second metal portion, and an injection portion of a housing of an electronic device according to one embodiment of the present disclosure.

[0110] FIG. 9 is a drawing sequentially showing a bonding process between a first metal base material, a second metal base material, and an injection base material of a housing of an electronic device according to one embodiment of the present disclosure.

[0111] According to one embodiment, the electronic device (101) may include a housing (201) (e.g., the first support member (211) and the side structure (210) of FIGS. 4A and 4B). The housing (201) may include a first metal portion (310) (e.g., an outer metal portion), a second metal portion (320) (e.g., an inner metal portion), and an injection portion (330).

[0112] The configuration of the housing (201) of FIGS. 7 to 9 may be partially or completely identical to the configuration of the housing (201) of FIGS. 4a and 4b. The embodiments of FIGS. 7 to 9 may be partially combined with the embodiments of FIGS. 1 to 4b or the embodiments of FIGS. 10 to 12c.

[0113] Hereinafter, before the final product, such as before the joining process (e.g., welding process, laser process, or heating process) or before the CNC (computer numerical control) processing, the first metal portion (310) may be named as the first metal base material (310a), and the second metal portion (320) may be named as the second metal base material (320a). The joining portion (325) of the first metal portion (310) (e.g., the support portion (321) and the protruding portion (323)) may be named identically. The opening (315) of the second metal portion (320) may be named identically. The injection portion (330) before the CNC (computer numerical control) processing may be named as the injection base material (330a).

[0114] According to one embodiment, the process of forming a housing (201) may be performed by aligning the parts for joining two metal base materials, joining a portion of one metal base material to another metal base material through a joining process (e.g., a welding process, a laser process, or a heating process), and then performing an injection molding process on the joined portion. The specific process will be described below.

[0115] First, a process of preparing two metal base materials (e.g., a first metal base material (310a) and a second metal base material (320a)) can be performed. The first metal base material (310a) is a shape before processing of a first metal portion (e.g., the first metal portion (310) of FIG. 5) for forming the exterior of an electronic device, and can be defined as an outer metal base material. The second metal base material (320a) is a shape before processing of a second metal portion (e.g., the second metal portion (320) of FIG. 5) disposed inside the first metal portion (e.g., the first metal portion (310) of FIG. 5) of a housing (201), and can be defined as an inner metal base material.

[0116] According to one embodiment, the first metal base material (310a) and the second metal base material (320a) may be formed of a single material. When formed of the single material, the material may be at least one of SUS (steel use stainless), titanium, magnesium, aluminum, ceramic, or glass.

[0117] According to one embodiment, the first metal base material (310a) and the second metal base material (320a) may be formed of different dissimilar metal materials. When formed of the dissimilar metal materials, the first metal base material (310a) may be at least one of SUS (steel use stainless), titanium, or magnesium, and the second metal base material (320a) may be a material that is easier to process than the first metal base material (310a), such as aluminum.

[0118] The prepared first metal base material (310a) can undergo a machining process (e.g., process 10 of FIG. 7) for bonding with the second metal base material (320a). The first metal base material (310a) can be processed through a CNC (computer numerical control) process. In the CNC process, an opening (315) for bonding with the second metal base material (320a) can be machined into a portion of the first metal base material (310a).

[0119] According to one embodiment, the opening (315) of the first metal base material (310a) may be shaped such that at least a portion of the space extends toward the -P direction. The -P direction may be an upper direction (e.g., a display direction) or a lower direction (e.g., a rear plate direction) of the electronic device (101). For example, the -P direction may be a direction (e.g., a -P direction) in which a protruding portion (323) protruding from a supporting portion (321) of the second metal base material (320a) (or the second metal portion (320)) faces. For example, the -P direction may be an opposite direction to one side (e.g., one side facing the +P direction) of the supporting portion (321) of the second metal base material (320a) (or the second metal portion (320)) on which a bonding process (e.g., a welding process, a laser process) is performed.

[0120] According to one embodiment, the opening (315) of the first metal base material (310a) may be formed to penetrate a region of the first metal portion (310). The opening (315) penetrating a region of the first metal base material (310a) may be formed to have a variable internal space along the +P direction or the -P direction. For example, the opening (315) of the first metal base material (310a) may have an internal space that sequentially (or gradually) expands along the -P direction. For example, the opening (315) of the first metal base material (310a) may have an undercut shape. For example, the inner surface of the first metal base material (310a) forming the opening (315) may be formed as an inclined surface so that the first metal base material (310a) adjacent to the opening (315) has a specified incline with respect to the upper surface (e.g., the surface facing +P) or the lower surface (e.g., the surface facing -P). For example, the sizes of the upper space (e.g., the space facing -P direction) and the lower space (e.g., the space facing +P direction) of the opening (315) of the first metal base material (310a) may be different.

[0121] The prepared second metal base material (320a) can undergo a processing process (e.g., process 20) to be combined with the opening (315) of the first metal base material (310a) and its surrounding area. The second metal base material (320a) can be processed through a casting process. According to one embodiment, in the casting process, the second metal base material (320a) can be processed with a support portion (321) for combining with the first metal base material (310a). According to one embodiment, in the casting process, the second metal base material (320a) can be processed with a support portion (321) for combining with the first metal base material (310a) and a protruding portion (323) protruding from the support portion (321).

[0122] According to one embodiment, the support portion (321) of the second metal base material (320a) may be in contact with the edge of the opening (315) of the first metal base material (310a) and may be a portion where a heating process (e.g., a welding process, a laser process, or a heating process) is performed. The protruding portion (323) of the second metal base material (320a) may be a portion to be inserted into the opening (315) of the first metal base material (310a) and may be processed to be smaller than the size (e.g., diameter) of the opening (315). The protruding portion (323) of the second metal base material (320a) may be in the shape of a pole, and may be formed to be inserted into a portion of the opening (315) and then melted through a bonding process to be in contact with the inner surface of the opening (315).

[0123] Afterwards, an alignment process (e.g., process 30) for bonding the first metal base material (310a) and the second metal base material (320a) can be performed.

[0124] According to one embodiment, a plurality of bonding structures may be formed between the first metal base material (310a) and the second metal base material (320a). The bonding structures may be formed in various ways in the area where the first metal base material (310a) and the second metal base material (320a) come into contact.

[0125] According to one embodiment, when the second metal base material (320a) includes a support portion (321) and a protruding portion (323), the support portion (321) of the second metal base material (320a) may be placed in contact with an edge adjacent to the opening (315) of the first metal base material (310a), and the protruding portion (323) of the second metal part (320) may be inserted into the opening of the first metal part (310).

[0126] According to one embodiment, when the second metal base material (320a) includes only a support portion (321), the support portion (321) of the second metal base material (320a) may be placed in contact with an edge adjacent to the opening (315) of the first metal base material (310a).

[0127] Thereafter, a joining process (e.g., process 40) for combining the first metal base material (310a) and the second metal base material (320a) can be performed. A laser process or a welding process can be performed on a portion of the second metal base material (320a) aligned with the first metal base material (310a).

[0128] According to one embodiment, when the second metal base material (320a) includes a support portion (321) and a protruding portion (323), before the bonding process, the size of the protruding portion (323) of the second metal base material (320a) may be smaller than the inner space of the opening (315) of the first metal base material (310a) and may not be fitted together. When heat is applied to the upper surface (e.g., one surface facing +P) of the support portion (321) of the second metal base material (320a) (e.g., during the bonding process), heat may be transferred from the support portion (321) and the lower surface (e.g., one surface facing -P) of the support portion (321) to the protruding portion (323) formed protrudingly. A portion of the protruding portion (323) that is melted by the transfer of heat may be deformed into a shape corresponding to the shape of the opening (315) (e.g., an undercut shape). After the joining process is completed, the shape of the protruding portion (323) corresponding to the opening (315) may be an undercut shape and may have a state of fitting connection with the opening (315).

[0129] According to one embodiment of the present disclosure, a process of performing a heat treatment (e.g., a welding process, a laser process) in the direction of the upper surface (e.g., a surface facing +P) of the support portion (321) of the second metal base material (320a) can reduce the amount of processing of the outer metal (e.g., the first metal base material) compared to a process of performing a heat treatment at the end of a protruding portion protruding into an opening (e.g., performing a heat treatment in the opposite direction to the present disclosure), thereby reducing the overall processing time. In addition, as the amount of processing of the outer metal (e.g., the first metal base material) is reduced, the rigidity of the entire housing can be increased.

[0130] In one embodiment, the adjacent edge of the opening (315) of the first metal base material (310a) and the supporting portion (321) of the second metal base material (320a) may form a chemical bonding portion as a portion thereof is melted. The supporting portion (321) of the second metal base material (320a) and / or the adjacent edge (401, see FIG. 6) of the opening (315) that is melted together with the supporting portion (321) may be referred to as a melted portion. For example, the melted portion may include the supporting portion (321) and a portion of the protruding portion (323) adjacent to the supporting portion (321). For example, the melted portion may include the supporting portion (321), a portion of the protruding portion (323) adjacent to the supporting portion (321), and an inner portion of the opening (315) that is melted together with a portion of the protruding portion (323).

[0131] According to one embodiment, the protruding portion (323) of the second metal base material (320a) inserted into the opening (315) of the first metal base material (310a) can form a physical bonding portion by being fit-fitted with the opening (315). In a joining process (e.g., a welding process, a laser process, or a heating process), as heat is applied to the protruding portion (323) of the second metal base material (320a), a portion thereof may melt, filling a portion of the opening (315). Thereafter, the cooled protruding portion (323) can be fit-fitted into the opening (315) of the first metal base material (310a). A part of the protruding portion (323) and / or the opening (315) that is fitted into the protruding portion (323) (e.g., the inner surface of the first metal base material (310a) forming the opening (315)) may be referred to as a non-melted portion. The protruding portion (323) of the second metal base material (320a) may be provided in a form in which only a part of the opening (315) of the first metal part (310) is inserted. After the bonding process (e.g., a welding process, a laser process, or a heating process), an increase in the area where the first metal base material (310a) and the second metal base material (320a) are melted and bonded may enhance the chemical bonding strength. The increase in the protruding portion (323) of the second metal base material (320a) that is filled in the expanded structural shape of the opening (315) without melting can increase the physical bonding strength by increasing the area in contact with the first metal base material (310a).

[0132] According to one embodiment, when the second metal base material (320a) includes only the support portion (321), when heat is applied to the upper surface (e.g., one surface facing +P) of the support portion (321) of the second metal base material (320a) (e.g., a bonding process), heat may be transferred to the entire support portion (321). As the heat is transferred and a portion of the melted support portion (321) flows down into the opening (315) and fills a portion of the opening (315), the support portion (321) may be deformed into a shape corresponding to a portion of the shape of the opening (315) (e.g., an undercut shape). After the bonding process (e.g., a welding process, a laser process, or a heating process) is completed, a portion of the shape of the variable support portion (321) protruding into the opening (315) may be an undercut shape and may be in a fitted state with the opening (315).

[0133] [Table 1] below is a table showing the bonding strength with the first metal base material (310a) depending on the presence or absence of a protruding portion of the second metal base material (320a) (or the second metal portion (320)).

[0134] This shows a case where a PUSH TEST was performed on the bonding structure between the first and second metal parts (310, 320) after the bonding process was completed. It was determined based on the standard that if the PUSH TEST was 10 kgf or more, a strong bonding force could be maintained without affecting the injection pressure provided in the injection process.

[0135] PUSH TEST Joint strength (check if it is over 10kgf) Presence of protruding part 123451 No protruding part 38kgf41kgf35kgf38kgf40kgf2 Protruding part 44kgf48kgf43kgf44kgf47kgf

[0136] The specimens were selected in groups of 5 based on the presence or absence of protruding parts of the second metal base material (320a) (or the second metal part (320)), and after the bonding process was performed, the PUSH TEST was performed in the same manner.

[0137] In the case where there is no protruding portion of the second metal base material (320a), the results of the PUSH TEST for the bonding force with the first metal base material (310a) were confirmed to be approximately 38 kgf, 41 kgf, 35 kgf, 38 kgf, and 40 kgf for each specimen.

[0138] In the case where there is a protruding portion of the second metal base material (320a), the results of the PUSH TEST for the bonding force with the first metal base material (310a) were confirmed to be approximately 44 kgf, 48 kgf, 43 kgf, 44 kgf, and 47 kgf for each specimen.

[0139] In the case where the second metal base material (320a) does not have a protruding part and in the case where the protruding part is present, the experimental results of the specimens that went through the bonding process are all 10 kgf or more in the PUSH TEST, and it can be confirmed that a high bonding force with the first metal base material can be maintained to sufficiently withstand the injection pressure. Accordingly, it can be confirmed that the bonding structure of the first and second metal base materials according to the present disclosure does not have a reduced mechanical rigidity due to the injection pressure of a subsequent process (e.g., injection process), and the bonding surface can be maintained at all times.

[0140] When the second metal base material (320a) has a protruding portion, a higher PUSH TEST result can be confirmed than when the second metal base material (320a) does not have a protruding portion. The protruding portion (323) of the second metal base material (320a) serves as a guide for alignment when directly inserted into the opening (315) of the first metal base material (310a) before the bonding process, and can provide a stronger bonding structure with the first metal base material (310a) after the bonding process.

[0141] After the bonding process, an injection process (e.g., process 50) can be performed. The injection process is an insert injection process, and can form a strong bond between the first metal base material (310a) and the second metal base material (320a), and can limit or reduce corrosion of the bonding structure formed between the first metal base material (310a) and the second metal base material (320a).

[0142] According to one embodiment, the injection molding base material (330a) formed by the injection molding process may include a first injection molding base material portion (331a) disposed on the upper side (e.g., in the +P direction) of the bonding structure and a second injection molding base material portion (332a) disposed on the lower side (e.g., in the -P direction) of the bonding structure. The first injection molding portion (330) may be disposed to surround the upper surface (e.g., one surface facing the +P direction) of the support portion (321) of the second metal base material (320a) and the first metal base material (310a) in contact therewith. For example, the first injection molding material (330a) portion may be arranged to surround at least a portion of the melted portion (e.g., the support portion (321) of the second metal base material (320a) and / or the adjacent edge (401, see FIG. 6) of the melted opening (315) together with the support portion (321)). The second injection molding material portion (332a) may be arranged to surround an outer surface (e.g., one surface facing the -P direction) of the protruding portion (323) of the second metal base material (320a) and the first metal base material (310a) in contact therewith. For example, the second injection molding material portion (332a) may be arranged together with the protruding portion (323) of the second metal base material (320a) within the opening (315). For example, the second injection molding base material portion (332a) may be arranged to surround at least a portion of a non-melted portion (e.g., a portion of the protruding portion (323) of the second metal base material (320a) and an inner surface of the first metal base material (310a) forming the opening (315).

[0143] After the injection process, the housing (201) can be designed into its final shape by a CNC (computer numerical control) process (e.g., process 60).

[0144] FIG. 10 is a drawing sequentially showing a bonding process between a first metal base material, a second metal base material, and an injection base material of a housing of an electronic device according to one embodiment of the present disclosure.

[0145] FIG. 11 is a drawing sequentially showing a bonding process between a first metal base material, a second metal base material, and an injection base material of a housing of an electronic device according to one embodiment of the present disclosure.

[0146] According to one embodiment, the electronic device (101) may include a housing (201) (e.g., the first support member (211) and the side structure (210) of FIGS. 4A and 4B). The housing (201) may include a first metal portion (e.g., an outer metal portion), a second metal portion (e.g., an inner metal portion), and an injection portion.

[0147] The configuration of the housing (201) of FIGS. 10 and 11 may be partially or completely identical to the configuration of the housing (201) of FIGS. 4A and 4B. The embodiments of FIGS. 10 and 11 may be partially combined with the embodiments of FIGS. 1 to 9, or the embodiments of FIGS. 12A to 12C.

[0148] Hereinafter, before the final product, such as before a joining process (e.g., a welding process, a laser process, or a heating process) or before CNC (computer numerical control) processing, the first metal portion may be named a first metal base material (310a), and the second metal portion may be named a second metal base material (320a). The joining portion (325) of the first metal portion (e.g., the support portion (321) and the protruding portion (323)) may be named the same. The opening (315) of the second metal portion may be named the same. The injection portion before CNC (computer numerical control) processing may be named an injection base material (330a).

[0149] According to one embodiment, the process of forming a housing (201) may be performed by aligning the parts for joining two metal base materials, joining a portion of one metal base material to another metal base material through a joining process (e.g., a welding process or a melting process), and then performing an injection molding process on the joined portion. The specific process will be described below.

[0150] First, a process of preparing two metal base materials (e.g., a first metal base material (310a) and a second metal base material (320a)) can be performed. According to one embodiment, the first metal base material (310a) and the second metal base material (320a) can be formed of a single material or different materials.

[0151] The prepared first metal base material (310a) can undergo a machining process (e.g., process 10 of FIG. 7) for bonding with the second metal base material (320a). The first metal base material (310a) can be processed through a CNC (computer numerical control) process. In the CNC process, an opening (315) for bonding with the second metal base material (320a) can be formed in a portion of the first metal base material (310a).

[0152] According to one embodiment, the opening (315) of the first metal substrate (310a) may be shaped such that at least a portion of the space extends toward the -P direction. The -P direction may be an upper direction (e.g., a display direction) or a lower direction (e.g., a rear plate direction) of the electronic device (101).

[0153] Referring to Fig. 10, the opening (315) of the first metal base material (310a) forms a passage having a substantially constant diameter, and a groove or spiral groove may be formed at a specified interval (e.g., a constant interval) on the inner surface of the first metal base material (310a) forming the opening (315). For example, screw tapping may be performed on the inner surface of the first metal base material (310a) forming the opening (315).

[0154] Referring to Fig. 11, the opening (315) of the first metal base material (310a) may be processed in a form in which only one side is open and the other side is closed. For example, the opening (315) of the first metal base material (310a) may be processed in a form in which the upper space (e.g., the space facing the +P direction) is open and the lower space (e.g., the space facing the -P direction) is closed. For example, the opening (315) of the first metal base material (310a) may have a recess or groove shape.

[0155] The depth (e.g., length in the -P direction or +P direction) of the opening (315) of Fig. 11 may be smaller than the depth (e.g., length in the -P direction or +P direction) of the opening (315) of Fig. 10. The inner surface of the first metal base material (310a) forming the opening (315) may have grooves or spiral grooves formed at a specified interval (e.g., a constant interval). For example, the inner surface of the first metal base material (310a) forming the opening (315) may have grooves or spiral grooves formed at a specified interval (e.g., a constant interval).

[0156] The prepared second metal base material (320a) can undergo a machining process (e.g., process 20 of FIG. 7) to be combined with the opening (e.g., opening (315) of FIG. 10 or FIG. 11) of the first metal base material (310a) and its surrounding area. The second metal base material (320a) can be processed through a casting process.

[0157] The following processes (e.g., processes 30, 40, 50, and 60 of FIG. 7) may be applied to the housing forming processes disclosed in FIGS. 7 to 9.

[0158] FIG. 12A is a drawing showing a bonding relationship between a first metal portion and a second metal portion of a housing of an electronic device according to one embodiment of the present disclosure.

[0159] FIG. 12b is a drawing showing an assembly state between a first metal base material and a second metal base material before a bonding process during a housing forming process of an electronic device according to one embodiment of the present disclosure.

[0160] FIG. 12c is a drawing showing a bonding state between a first metal base material and a second metal base material that have undergone a bonding process during a housing forming process of an electronic device according to one embodiment of the present disclosure.

[0161] Figures 12b and 12c are cross-sectional views taken in the direction of BB` in Figure 12a.

[0162] According to one embodiment, the electronic device (101) may include a housing (201) (e.g., the first support member (211) and the side structure (210) of FIGS. 4A and 4B). The housing (201) may include a first metal portion (e.g., an outer metal portion) and a second metal portion (e.g., an inner metal portion).

[0163] The configuration of the housing (201) of FIGS. 12a to 12c may be partially or completely identical to the configuration of the housing (201) of FIGS. 4a and 4b. The embodiments of FIGS. 12a to 12c may be partially combined with the embodiments of FIGS. 1 to 10.

[0164] According to one embodiment, the process of forming the housing (201) may be performed by aligning the parts for joining two metal base materials, joining a part of one metal base material to another metal base material through a joining process (e.g., a welding process or a melting process), and then performing an injection process on the joined part.

[0165] Hereinafter, before the final product, such as before a joining process (e.g., a welding process, a laser process, or a heating process) or before CNC (computer numerical control) machining, the first metal portion may be named a first metal base material (310a), and the second metal portion may be named a second metal base material (320a). The joining portions (325) of the first metal portion (e.g., the support portion (321) and the protruding portion (323)) may be named identically. The openings (315) of the second metal portion may be named identically.

[0166] First, a process of preparing two metal base materials (e.g., a first metal base material (310a) and a second metal base material (320a)) can be performed. According to one embodiment, the first metal base material (310a) and the second metal base material (320a) can be formed of a single material or different materials.

[0167] The prepared first metal base material (310a) can undergo a machining process (e.g., process 10 of FIG. 7) for bonding with the second metal base material (320a). The first metal base material (310a) can be processed through a CNC (computer numerical control) process. In the CNC process, an opening (315) for bonding with the second metal base material (320a) can be formed in a portion of the first metal base material (310a).

[0168] According to one embodiment, the opening (315) of the first metal base material (310a) may have a shape in which at least a portion of the space extends toward the -P direction. For example, the -P direction may be an upper direction (e.g., a display direction) or a lower direction (e.g., a rear plate direction) of the electronic device (101). For example, the -P direction may be a direction (e.g., a -P direction) in which a protruding portion (323) protruding from the support portion (321) of the second metal base material (320a) faces. For example, the -P direction may be an opposite direction to a surface (e.g., a +P direction) on which a heat-applying process (e.g., a welding process) of the support portion (321) of the second metal portion (320) is performed. According to one embodiment, the opening (315) of the first metal base material (310a) (or the first metal portion (310)) may have a passage shape forming the same diameter (or area).

[0169] The prepared second metal base material (320a) can undergo a processing process (e.g., process 20 of FIG. 7) to combine with the opening (e.g., opening (315) of FIG. 10 or FIG. 11) of the first metal base material (310a) and its surrounding area.

[0170] According to one embodiment, the second metal base material (320a) may be at least partially surrounded by the first metal base material (310a) and may include a coupling portion (325) for coupling with the opening (315) of the first metal base material (310a). The coupling portion (325) of the second metal base material (320a) may include a support portion (321) adjacent to an edge of an upper space of the opening (315) of the first metal base material (310a), a protruding portion (323) protruding from the support portion (321), and a hook portion (327) extending from the protruding portion (323) and adjacent to an edge of a lower space of the opening (315).

[0171] Thereafter, an alignment process (e.g., process 30) for joining the first metal base material (310a) and the second metal base material (320a) and a bonding process (e.g., process 40) for joining the first metal base material (310a) and the second metal base material (320a) can be performed.

[0172] According to one embodiment, the support portion (321) of the second metal base material (320a) is arranged to be in contact with the upper surface (e.g., the surface facing the +P direction) of the first metal base material (310a) and may face the upper space (e.g., the space facing the +P direction) of the opening (315). The protruding portion (323) of the second metal base material (320a) is formed to protrude from the support portion (321) in the -P direction and may be inserted into the opening (315) to be combined with a portion of the inner surface of the first metal base material (310a). The protruding portion (323) of the second metal base material (320a) may be in the shape of a pole, and may be formed to be in contact with the inner surface of the opening (315) through a joining process (e.g., a welding process, a laser process, or a heating process) while being inserted into a portion of the opening (315).

[0173] According to one embodiment, the protruding portion (323) of the second metal base material (320a) may be formed in a pole shape so as to penetrate the opening (315), and through a bonding process (e.g., a melting process), the upper portion of the protruding portion (323) may be formed to contact the inner surface of the opening (315). At least a portion of the hook portion (327) of the second metal portion (320) may be arranged to contact the lower surface (e.g., the surface facing the -P direction) of the first metal portion (310) and may face the upper space (e.g., the space facing the +P direction) of the opening (315). The hook portion (327) of the second metal portion (320) may partially protrude in a direction perpendicular to the +P direction together with the protruding portion (323), thereby preventing the second metal portion (320) from being separated from the opening (315).

[0174] Referring to FIG. 12b, in the alignment process for joining the first metal base material (310a) and the second metal base material (320a) (e.g., process 30 of FIG. 7), the protruding portion (323) and the hook portion (327) of the second metal base material (320a) can be inserted through the opening (315) of the first metal base material (310a). Accordingly, in a state where the first metal base material (310a) and the second metal base material (320a) are aligned, the protruding portion (323) of the second metal base material (320a) can be arranged to form a spaced space inside the opening (315) of the first metal base material (310a), and the support portion (321) of the second metal base material (320a) can be arranged around the upper space of the opening (315) of the first metal base material (310a). A hook portion (327) of a second metal base material (320a) can be placed around the lower space of the opening (315) of the first metal base material (310a).

[0175] Referring to Fig. 12c, in a bonding process (e.g., process 40 of Fig. 7) for bonding the first metal base material (310a) and the second metal base material (320a), a bonding process (e.g., laser process or welding process) may be performed on a portion of the second metal base material (320a) aligned with the first metal base material (310a). Before the bonding process, the size of the protruding portion (323) of the second metal base material (320a) may be smaller than the inner space of the opening (315) of the first metal base material (310a), and thus may not be in a fitted state. When heat is applied to the upper surface (e.g., one surface facing the +P direction) of the support portion (321) of the second metal base material (320a) (e.g., during a bonding process), the heat may be transferred to the support portion (321) and a portion of the protruding portion (323) that is formed protruding on the lower surface (e.g., one surface facing the -P direction) of the support portion (321). A portion of the protruding portion (323) that is melted by the transfer of heat may be deformed into a shape corresponding to the shape of the opening (315). For example, the upper portion of the protruding portion (323) may expand to be fitted into the opening (315), and the lower portion of the unmelted protruding portion (323) may be smaller than the inner space of the opening (315) and may not be fitted into the opening. After the bonding process (e.g., a laser process, a welding process, or a heating process) is completed, the shape of the protruding portion (323) corresponding to the opening (315) may be an undercut shape.

[0176] According to one embodiment, the bonding process can be performed while the second metal base material (320a) is moved a certain distance in a direction perpendicular to the +P / -P direction. Accordingly, when viewed from the lower side of the first metal base material (310a) (e.g., when viewed in the +P direction), the hook portion (327) of the second metal base material (320a) forms a portion that overlaps with the first metal base material (310a), thereby limiting or reducing the detachment of the joining portion (325) of the second metal base material (320a) from the first metal base material (310a).

[0177] According to one embodiment, the opening (315) of the first metal base material (310a) and its surroundings and the joining portion (325) of the second metal base material (320a) by the joining process may include the melted portion (401, see FIG. 6) and the non-melted portion (402, see FIG. 6). The non-melted portion may be identified as a portion where the base material is melted and fitted. The melted portion may provide a chemical bond between the first metal base material (310a) and the second metal base material (320a), and the non-melted portion may provide a physical bond between the first metal base material (310a) and the second metal base material (320a).

[0178] In order to form a housing of an electronic device, a structure for joining two metal parts can be formed by inserting a protruding portion of one metal part (e.g., an inner metal part) through an opening of another metal part (e.g., an outer metal part), and then welding the protruding portion from the opening to join them. The heated end of the protruding portion is deformed into a dome shape, but since heat is not transferred to a portion of the inner metal part inserted inside the opening, a space may be created inside the joined structure of the outer and inner metal parts. If the contact area between the outer and inner metal parts is not sufficient, the injection pressure generated during the subsequent injection molding process may cause lifting and poor bonding between the outer and inner metal parts.

[0179] In addition, in the housing forming process, if the contact area between the outer metal part and the inner metal part is not sufficient, voltage is not sufficiently transmitted from the inner metal part to the outer metal part during the surface treatment process, and thus discoloration may occur during surface treatment (e.g., anodizing).

[0180] Additionally, in the housing forming process, the metal portion of the housing where the lifting occurs may have a detrimental effect on antenna performance (e.g., VSWR performance).

[0181] According to various embodiments disclosed in this document, in forming a housing of an electronic device, the shape of an opening of an outer metal portion can be varied, and the bonding direction of an inner metal portion inserted into the opening and / or the direction in which a bonding process proceeds can be controlled, thereby providing stable bonding between the outer metal portion and the inner metal portion.

[0182] Electronic devices according to various embodiments may include chemical bonding through a melted portion and physical bonding through a non-melted portion in the bonding of an outer metal portion and an inner metal portion of a housing. Through stable bonding of the outer metal portion and the inner metal portion, color fading due to surface treatment can be reduced, and a structure advantageous for antenna performance can be provided.

[0183] A housing of an electronic device according to various embodiments may provide a strong bond between an outer metal portion and an inner metal portion. For example, an outer metal structure having an opening that expands space (e.g., an opening having an undercut shape) and an inner metal structure adjacent to or inserted into the opening of the outer metal structure may be assembled. After the assembly, the inner metal portion may undergo a bonding process (e.g., a welding process, a laser process, or a heating process), whereby some of the inner metal portions are melted and others are strongly bonded to the opening and surrounding area of ​​the outer metal portion.

[0184] In a housing forming process of an electronic device according to various embodiments, after a protruding portion of an inner metal portion is assembled to be inserted into an opening of an outer metal portion, a bonding process (e.g., a welding process or a laser process) may be performed. During the bonding process, as heat is applied to a portion opposite to an end of the protruding portion, the inserted protruding portion may be entirely fitted into the opening, thereby providing a strong bond with the outer metal portion. Later, in a processing process, as the processing area of ​​the outer metal portion decreases, the area of ​​the outer metal portion within the housing may increase, thereby increasing the rigidity of the housing.

[0185] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0186] An electronic device according to one embodiment of the present disclosure (e.g., the electronic device (101) of FIGS. 1 to 4) may include a display (230) and a housing (201) in which the display is mounted. The housing (201) may include a first metal part (310) at least a portion of which is exposed to the outside of the electronic device, a second metal part (320) surrounded by the first metal part, and an injection part (330). The first metal part may include an opening (315) formed to penetrate a portion of the first metal part, and the opening may be formed such that a space expands toward a first direction. The second metal part (320) may include a coupling part (321, 323) for coupling with the opening of the first metal part, and a portion of the coupling part may be formed as a melted portion. The injection part (330) may cover at least a portion of the opening and the coupling part.

[0187] According to one embodiment, a portion of the second metal portion (320) adjacent to the opening of the first metal portion (310) among the joining portions may form a melted portion.

[0188] According to one embodiment, a portion of the second metal portion (320) inserted into the opening of the first metal portion (310) among the joining portions may form a non-melted portion.

[0189] According to one embodiment, the first metal portion (310) forming the upper space periphery of the opening facing in a second direction opposite to the first direction can form the melted portion.

[0190] According to one embodiment, a portion of the inner surface of the first metal portion (310) forming the opening may form a non-melted portion.

[0191] According to one embodiment, the joining portion of the second metal portion (320) may include a support portion (321) positioned adjacent to the opening edge of the first metal portion (310) and a protruding portion (323) extending from the support portion and inserted into the opening.

[0192] According to one embodiment, a portion of the support portion of the second metal portion placed in contact with the first metal portion and a portion of the protruding portion adjacent to the support portion may form a melted portion.

[0193] According to one embodiment, the first direction in which the diameter of the opening expands may be the same as the direction in which the protruding portion protruding from the supporting portion of the second metal portion faces.

[0194] According to one embodiment, the diameter of the opening of the first metal portion can be gradually expanded in the first direction.

[0195] According to one embodiment, the protruding portion of the second metal portion is formed to correspond to the shape of the opening and can be combined with the opening.

[0196] According to one embodiment, the height of the opening of the first metal portion may be greater than the height of the protruding portion of the second metal portion.

[0197] According to one embodiment, the diameter of the opening of the first metal portion may be larger than the diameter of the upper space facing the support portion of the second metal portion, and the diameter of the lower space facing the opposite direction of the support portion of the second metal portion.

[0198] According to one embodiment, the inner surface of the first metal portion forming the opening may have a specified slope formed with respect to one surface of the first metal portion facing the support portion.

[0199] In one embodiment, the supporting portion of the two metal portions and the adjacent edge of the opening of the first metal portion fused together with the supporting portion can provide a chemical bond.

[0200] According to one embodiment, the protruding portion of the second metal portion inserted into the opening of the first metal portion can provide a physical connection by being fitted into the opening.

[0201] According to one embodiment, the injection part (330) may include a first injection part (331) arranged to surround an upper surface of the support part of the second metal part facing opposite to the first direction and the first metal part adjacent thereto, and a second injection part (332) arranged to surround an end of the protruding part of the second metal part facing the first direction and the first metal part adjacent thereto.

[0202] According to one embodiment, the inner surface of the first metal portion forming the opening may include grooves or spiral grooves formed at specified intervals.

[0203] According to one embodiment, the opening of the first metal portion may be opened at an upper portion and closed at a lower portion so that a portion of the second metal portion may be inserted.

[0204] According to one embodiment, the coupling portion of the second metal portion may further include a hook portion (327) extending from the protruding portion and adjacent to an edge of the lower space of the opening of the first metal portion.

[0205] According to one embodiment, when viewed from the lower side of the first metal portion, a portion of the hook portion of the second metal base material may overlap with the first metal portion.

[0206] A housing of an electronic device (e.g., the electronic device (101) of FIGS. 1 to 4) according to one embodiment of the present disclosure may include a first metal part (310) at least partially exposed to the outside of the electronic device and a second metal part (320) surrounded by the first metal part. The first metal part may include an opening (315) formed to penetrate a portion of the first metal part and formed to allow a space to expand in a first direction. The second metal part may include a joining portion (325) for joining with the opening of the first metal part, and a portion of the joining portion may be formed as a melted portion.

[0207] According to one embodiment, the joining portion (325) of the second metal portion may include a support portion (321) adjacent to the opening edge of the first metal portion (310) and a protruding portion (323) extending from the support portion and inserted into the opening.

[0208] According to one embodiment, a portion of the second metal portion adjacent to the opening of the first metal portion (310) among the joining portions (325) of the second metal portion may form a melted portion, and a portion of the second metal portion inserted into the opening of the first metal portion (310) among the joining portions (325) of the second metal portion may form a non-melted portion.

[0209] In one embodiment of the present disclosure, a method for manufacturing a housing of an electronic device may include a first metal base material processing process including an opening formed to expand a space in a first direction, a second metal base material processing process including a joining portion joined to the opening of the first metal base material, an aligning process for joining the first metal base material and the second metal base material, wherein a supporting portion of the joining portion is arranged to contact an edge of the opening of the first metal base material, and a protruding portion extended from the supporting portion is arranged to be inserted into the opening of the first metal base material, a bonding process for applying heat to a surface of the supporting portion of the second metal base material aligned with the first metal base material facing a second direction opposite to the first direction, and an injection process for forming an injection base material portion in an adjacent region of the first metal base material and the second metal base material.

[0210] According to one embodiment, after the bonding process, the first metal base material forming the upper space surrounding the opening facing in a second direction opposite to the first direction may form a melted portion, and a portion of the inner surface of the first metal base material forming the opening may form a non-melted portion.

Claims

1. In an electronic device (101) including a housing (201), The above housing (201) is, A first metal part (310) at least partially exposed to the outside of the electronic device, comprising an opening (315) formed to penetrate a part of the first metal part, the opening being formed such that a space expands in a first direction; An electronic device comprising a second metal portion (320) surrounded by the first metal portion, the second metal portion including a joining portion (321, 323) for joining with the opening of the first metal portion, and a part of the joining portion having a melted portion formed therein.

2. In paragraph 1, Among the above-mentioned joining portions of the above-mentioned second metal portion (320), a portion adjacent to the above-mentioned opening of the above-mentioned first metal portion (310) forms a melted portion, An electronic device in which a portion of the second metal portion (320) inserted into the opening of the first metal portion (310) forms a non-melted portion.

3. In paragraph 1 or 2, The first metal portion (310) forming the upper space surrounding the opening facing the second direction opposite to the first direction forms the melted portion, An electronic device in which a portion of the inner surface of the first metal portion (310) forming the opening forms a non-melted portion.

4. In any one of paragraphs 1 to 3, An electronic device in which the joining portion of the second metal portion (320) includes a support portion (321) positioned adjacent to the opening edge of the first metal portion (310) and a protruding portion (323) extending from the support portion and inserted into the opening.

5. In paragraph 4, An electronic device in which a portion of the support portion of the second metal portion placed in contact with the first metal portion and a portion of the protruding portion adjacent to the support portion form a melted portion.

6. In either paragraph 4 or paragraph 5, An electronic device in which the first direction in which the diameter of the opening expands is the same as the direction in which the protruding portion protruding from the supporting portion of the second metal portion faces.

7. In any one of paragraphs 4 to 5, The diameter of the opening of the first metal portion is gradually expanded along the first direction, An electronic device in which the protruding portion of the second metal portion is formed to correspond to the shape of the opening and is coupled with the opening.

8. In any one of paragraphs 4 to 6, An electronic device wherein the height of the opening of the first metal portion is greater than the height of the protruding portion of the second metal portion.

9. In any one of paragraphs 4 to 6, An electronic device in which the diameter of the lower space facing in the opposite direction of the support portion of the second metal portion is larger than the diameter of the upper space of the opening of the first metal portion facing the support portion of the second metal portion.

10. In any one of paragraphs 4 to 6, An electronic device in which the inner surface of the first metal portion forming the opening has a specified slope formed with respect to one surface of the first metal portion facing the support portion.

11. In any one of clauses 4 to 10, The supporting portion of the above two metal parts and the adjacent edge of the opening of the above first metal part fused with the supporting portion provide a chemical bond, An electronic device in which a protruding portion of a second metal portion inserted into the opening of the first metal portion provides a physical connection by being fit-fitted with the opening.

12. In any one of paragraphs 4 to 10, Further comprising an injection part (330) covering at least a portion of the above opening and the above joining part, The above injection part (330) is A first injection part (331) arranged to surround the upper surface of the support part of the second metal part facing opposite to the first direction and the first metal part adjacent thereto, and An electronic device including a second injection part (332) arranged to surround the end of the protruding part of the second metal part facing the first direction and the first metal part adjacent thereto.

13. In any one of paragraphs 4 to 10, An electronic device in which the inner surface of the first metal portion forming the opening includes grooves or spiral grooves formed at specified intervals.

14. In paragraph 13, An electronic device in which the opening of the first metal portion is open at the upper portion and closed at the lower portion so that a part of the second metal portion can be inserted.

15. In any one of paragraphs 4 to 10, The above-mentioned joining portion of the second metal portion further includes a hook portion (327) extending from the protruding portion and adjacent to the edge of the lower space of the opening of the first metal portion, An electronic device in which a portion of the hook portion of the second metal substrate overlaps the first metal portion when viewed from the lower side of the first metal portion.

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