Heat dissipation apparatus for electronic device

Abstract

The present invention relates to a heat dissipation apparatus for an electronic device, the heat dissipation apparatus comprising: a heat dissipation housing having an inner space and open at the front; various types of heating elements that are arranged in a plurality of regions in the up-down direction on an inner surface corresponding to the inner space of the heat dissipation housing; and a plurality of heat sink fins that are arranged lengthwise in the up-down vertical direction on the back surface of the heat dissipation housing and detachably coupled so as to be spaced at certain intervals in the left-right horizontal direction. The plurality of heat sink fins are arranged so as to be discontinuous in the up-down direction near the boundaries of the plurality of regions, and thus provide the advantage of significantly improving heat dissipation performance.

Description

Heat dissipation devices for electronic devices

[0001] The present invention relates to a heat dissipation apparatus for an electronic device, and more particularly, to a heat dissipation apparatus for an electronic device capable of improving heat dissipation performance by responding to a plurality of heat generating elements having different heat generating amounts and different heat generating locations.

[0002] In diverse industries such as communications, electronics, and electricity, related technologies are continuously being developed at an advanced level for application in more advanced industries. This advanced technological development requires high-power energy, and devices utilizing this energy inevitably face the problem of high heat generation. Consequently, the development of appropriate heat dissipation systems must accompany this development.

[0003] Heat dissipation systems are used in a variety of industries, including air conditioners, mobile communications, data centers, aerospace mobility, electric vehicles, energy storage devices, and displays. These systems are a major source of power consumption, and power consumption is steadily increasing as industries develop.

[0004] In general, heat dissipation devices are largely divided into Active Cooling Devices and Passive Cooling Devices. Active Cooling Devices mainly utilize Forced Convection by fans, while Passive Cooling Devices can be classified as a technology that utilizes Natural Convection without fans.

[0005] However, conventional heat dissipation systems have limitations in dissipating the high heat generated by continuously evolving advanced technologies. Therefore, related industries urgently need innovative technologies to address these issues. To address this, heat dissipation devices utilizing phase-change materials are being developed.

[0006] In addition, electronic devices are equipped with a number of different types of heat generating elements that operate electrically but have different heat generating amounts. In addition, depending on the purpose and usage of the electronic device, there are cases where the number of different types of heat generating elements must inevitably dissipate heat through only one side.

[0007] At this time, in order to facilitate heat dissipation from the internal space of the electronic device to the outside (outside air), a heat dissipation housing made of a thermally conductive material covering one of the surfaces where heat dissipation occurs is provided, and a number of heat sink fins may be provided integrally or detachably on the outer surface of the heat dissipation housing to increase the heat exchange area with the outside air.

[0008] However, if a number of heat sink fins are arranged vertically and longitudinally on the outer surface of the heat dissipation housing with the same size and at the same intervals to avoid interference with the rising air current without considering the number of types of heat generating elements and the arrangement positions of each heat generating element, there is a problem that when heat inside the electronic device is concentrated toward the upper part due to the rising air current, the heat dissipation requirements in the vertical direction are different, making uniform heat dissipation difficult.

[0009] In addition, even if each single heat sink fin that constitutes a plurality of heat sink fins is long enough to span the entire upper and lower direction of the outer surface of the heat dissipation housing, the heat conducted from the lower side of the interior of the electronic device may affect the heat generating element that is vulnerable to high temperatures because it is mounted on the upper side during the process of moving upward, which may lead to a problem of lowering the performance of a specific heat generating element.

[0010] For example, if the material used as a heat transfer medium is a phase-changeable refrigerant, unlike cases where the heat conductivity of the metal material itself is dependent, its heat dissipation performance is so excellent that the high temperature of the condensation heat generated when the gaseous refrigerant condenses into a liquid refrigerant can lead to a deterioration in the function of a heat-sensitive heating element.

[0011]

[0012] The present invention has been devised to solve the above-mentioned technical problem, and its purpose is to provide a heat dissipation device for an electronic device in which a plurality of heat sink fins provided on the back surface of a heat dissipation housing are installed in specific heat dissipation areas according to the upper and lower positions of the back surface of the heat dissipation housing, thereby allowing the internal heat to be dissipated with uniform heat dissipation performance throughout the entire upper and lower surface.

[0013] In addition, another object of the present invention is to provide a heat dissipation device for an electronic device that can prevent the reverse heat conduction phenomenon inside a heat dissipation housing that occurs when the heat dissipation performance of a plurality of heat sink fins is significantly high.

[0014] In addition, another object of the present invention is to provide a heat dissipation device for an electronic device capable of rapid heat dissipation in the left and right horizontal directions of some high-heat generating elements.

[0015] In addition, another object of the present invention is to provide a heat dissipation device for an electronic device that utilizes not only the heat conduction according to the inherent material of a plurality of heat sink fins depending on the installation location, but also the phase change of a refrigerant.

[0016] In addition, another object of the present invention is to provide a heat dissipation device for an electronic device in which the heat dissipation area range in the vertical direction is divided and designed so as to minimize, as much as possible, the functional degradation of the heat generating element due to condensation heat when a plurality of heat sink fins utilize a phase change of a refrigerant.

[0017] The technical problems of the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the description below.

[0018] One embodiment of a heat dissipation device for an electronic device according to the present invention comprises a heat dissipation housing having an internal space with an open front, a plurality of types of heating elements arranged in a plurality of regions in the vertical direction on an inner surface corresponding to the internal space of the heat dissipation housing, and a plurality of heat sink fins arranged longitudinally in the vertical direction on a rear surface of the heat dissipation housing, but detachably coupled to each other at a predetermined distance apart in the left and right horizontal directions, wherein the plurality of heat sink fins are separated and arranged so as to be discontinuous in the vertical direction near the boundaries of the plurality of regions.

[0019] Here, the plurality of heat sink fins can be arranged separately so that heat transfer in the vertical direction with respect to the rear surface of the heat dissipation housing is cut off.

[0020] In addition, a plurality of heat sink fins may be installed on the rear surface of the heat dissipation housing so as to independently receive heat from heating elements located in each of the regions and then dissipate heat through independent heat transfer paths when the plurality of regions can be divided into an upper region located relatively higher on the rear surface of the heat dissipation housing, a middle region located in the middle, and a lower region located lower.

[0021] In addition, when the plurality of heat sink fins can be divided into an upper region located relatively upper on the rear surface of the heat dissipation housing, a middle region located in the middle, and a lower region located lower, the plurality of heat sink fins may include an upper heat sink fin coupled to the upper region to dissipate heat from an upper heating element located in the upper region among the plurality of types of heating elements, a middle heat sink fin coupled to the middle region to dissipate heat from an intermediate heating element located in the middle region among the plurality of types of heating elements, and a lower heat sink fin coupled to the lower region to dissipate heat from a lower heating element located in the lower region among the plurality of types of heating elements.

[0022] Additionally, the upper heat sink fin, the middle heat sink fin, and the lower heat sink fin can be arranged on a vertical line that is in a straight line in the up-down direction.

[0023] In addition, the upper heat sink fin and the middle heat sink fin have a first thermal conductivity, the lower heat sink fin has a second thermal conductivity that is relatively lower than the first thermal conductivity, and the upper heating element and the middle heating element located in the upper region and the middle region can dissipate heat at a higher temperature than the lower heating element located in the lower region.

[0024] In addition, the interior of the upper heat sink fin and the middle heat sink fin is filled with a phase-changeable refrigerant, and the first thermal conductivity can be achieved through flow according to the phase change of the refrigerant.

[0025] Additionally, the lower heat sink fin may have the second thermal conductivity due to the thermal conductivity of the material itself.

[0026] In addition, the upper heat sink fin may be further formed integrally with an extended heat sink portion that extends forward from a portion of the upper portion of the heat dissipation housing and covers at least a portion of the upper surface of the heat dissipation housing.

[0027] In addition, the extended heat sink portion can be formed in a form in which a refrigerant flow space filled with refrigerant inside the upper heat sink fin is expanded.

[0028] In addition, in the intermediate region, in addition to the intermediate heating element, a high heating element having a higher heating value than the intermediate heating element is further positioned, and the intermediate region can be divided into an upper intermediate region including a region where the high heating element is positioned and a lower intermediate region including a region where the high heating element is not positioned.

[0029] Additionally, a plurality of heat pipes may be disposed on the inner surface of the internal space of the heat dissipation housing corresponding to the upper middle region to disperse the heat generated from the high-heat generating body in the horizontal direction to the left and right of the heat dissipation housing.

[0030] In addition, when the back surface of the heat dissipation housing is further provided with a press-fit portion for installing the plurality of heat sink fins, and the press-fit portion includes an upper press-fit portion to which the upper heat sink fin among the plurality of heat sink fins is coupled, a middle press-fit portion to which the middle heat sink fin among the plurality of heat sink fins is coupled, and a lower press-fit portion to which the lower heat sink fin among the plurality of heat sink fins is coupled, the back surface of the heat dissipation housing where the middle press-fit portion is formed can be formed to be divided by a stepped surface.

[0031] Additionally, the front end of the intermediate heat sink fin located in the upper middle region may be formed to be recessed to a rearward position with a step greater than the front end of the intermediate heat sink fin located in the lower middle region.

[0032] In addition, the upper heat sink fin and the middle heat sink fin may include a heat conductive panel body having a refrigerant flow space that provides a space in which a refrigerant is filled inside and the refrigerant circulates in a gas-liquid state to release heat as the refrigerant changes phase within a closed space.

[0033] In addition, the refrigerant flow space may include a first refrigerant flow path as an evaporation region that receives heat from the upper and middle heating elements as heat dissipation targets to the heat-conducting panel body, a condensation region excluding the first refrigerant flow path, and a plurality of second refrigerant flow paths formed within the condensation region, excluding the first refrigerant flow path, and a liquid refrigerant condensed from a gaseous state to a liquid state from the other end of the width direction of the heat-conducting panel body may act as a flow path toward the first refrigerant flow path by surface tension or gravity.

[0034] In addition, the thermally conductive panel body of the upper heat sink fin and the middle heat sink fin may be provided in the form of a plate made of SUS material, and the lower heat sink fin may be provided in the form of a plate made of aluminum material having a higher thermal conductivity than the thermally conductive panel body.

[0035] In addition, the heat-conducting panel body of the upper heat sink fin and the middle heat sink fin may be provided in the form of a plate made of SUS material forming the refrigerant flow space therein, and the lower heat sink fin may be provided in the form of a plate made of SUS material not having the refrigerant flow space.

[0036] According to the heat dissipation device of an electronic device according to the present invention, heat dissipation performance can be significantly improved by preventing heat concentration caused by multiple types of heating elements inside a heat dissipation housing formed vertically and elongatedly, thereby enabling heat dissipation to be achieved with uniform heat dissipation performance overall.

[0037] In addition, according to the heat dissipation device of an electronic device according to the present invention, the reverse heat conduction phenomenon that may occur due to the high heat dissipation performance of a plurality of heat sink fins is prevented, thereby protecting the heating element vulnerable to high temperatures inside, thereby improving product reliability.

[0038] Figure 1 is a front and rear perspective view showing a heat dissipation device of an electronic device according to an embodiment of the present invention.

[0039] Figures 2a and 2b are an exploded perspective view of the front and rear parts of Figure 1, respectively.

[0040] Fig. 3 is an exploded perspective view of a portion of the rear part to explain the coupling relationship of a plurality of heat sink fins in the configuration of Fig. 1.

[0041] Fig. 4 is a perspective view (a, b, c) showing a plurality of heat sink fins in the configuration of Fig. 1 and a cross-sectional view (d, e) taken along lines AA and BB.

[0042] Fig. 5 is a perspective projection showing an upper heat sink fin among the plurality of heat sink fins of Fig. 1.

[0043] Figure 6 is an exploded perspective view of Figure 5.

[0044] Figure 7 is a partial cutaway perspective view (a) of Figure 5, an enlarged view (b) of the portion, and a cross-sectional view (c) thereof.

[0045] Figure 8 is an exploded perspective view for explaining the working relationship of a plurality of heat sink fins according to the type and mounting position of the heating elements in the configuration of Figure 1.

[0046] Figure 9 is a back view (a) and a side view (b) of Figure 8,

[0047] FIG. 10a and FIG. 10b are partially cut-away perspective views illustrating the connection relationship of heat pipes for dispersing heat in the horizontal direction left and right inside the heat dissipation housing of the configuration of FIG. 1.

[0048] <Explanation of symbols>

[0049] 1: Antenna device 10: Heat dissipation housing

[0050] 20: Main board 21: Upper heating element

[0051] 22C: High heat source 22: Medium heat source

[0052] 25: Clamshell 30: PSU board

[0053] 40: RF module 41: MBF element

[0054] 42: Antenna element 50: Radome panel

[0055] 60: Finger guard assembly 60h-1,60h-2: Ventilation hole

[0056] 70: External mounting member 100: Multiple heat sink fins

[0057] 110: Top heatsink fin 120: Middle heatsink fin

[0058] 130: Lower heatsink fins

[0059]

[0060] Hereinafter, a heat dissipation device of an electronic device according to one embodiment of the present invention will be described in detail with reference to the attached drawings.

[0061] When assigning reference numerals to components in each drawing, it should be noted that identical components are assigned the same numerals whenever possible, even if they appear on different drawings. Furthermore, when describing embodiments of the present invention, if a detailed description of a related known configuration or function is deemed to hinder understanding of the embodiments of the present invention, the detailed description will be omitted.

[0062] When describing components of embodiments of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are only intended to distinguish the components from other components, and the nature, order, or sequence of the components are not limited by these terms. Furthermore, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning they have in the context of the relevant technology, and shall not be interpreted in an idealized or overly formal sense unless explicitly defined in this application.

[0063]

[0064] FIG. 1 is a front and rear perspective view showing a heat dissipation device of an electronic device according to an embodiment of the present invention, and FIGS. 2a and 2b are an exploded front and rear perspective view of FIG. 1.

[0065] In general, heat generating devices (electronic devices) are manufactured in various forms throughout the industry, but the applicant of the present invention is a company engaged in the manufacturing of other wireless communication equipment. In explaining the heat dissipation device of an electronic device according to one embodiment of the present invention, an antenna device (1), which is a representative heat generating device (electronic device) that is a heat dissipation target of the heat dissipation device, will be described as a specific example.

[0066] However, it should be noted that the electronic device to which the heat dissipation device of one embodiment of the present invention described below is applied should not necessarily be interpreted as being limited to the antenna device (1), and that the specific terms 'antenna device (1)' and 'parts related thereto' used below should all be interpreted as concepts including all similar electronic devices and parts thereof.

[0067] First, let's look at the antenna device (1) used as an example of a representative electronic device.

[0068] An antenna device (1) to which a heat dissipation device according to one embodiment of the present invention is applied includes a heat dissipation housing (10) formed in a rectangular parallelepiped shape having an internal space (10S) opened forward and having a front-to-back width that is approximately long and thin in the vertical direction, as shown in FIGS. 1 to 2B.

[0069] Here, the heat dissipation housing (10) is provided with a sturdy material so as to provide an installation location (internal space (10S)) for various internal components described later, and to protect the internal components against external impact. In particular, it is preferable to be provided with a metal material having excellent thermal conductivity so that heat generated during system operation among the internal components can be dissipated to the outside using the thermal conductivity properties of the material itself.

[0070] Inside the internal space (10S) of the heat dissipation housing (10), an RF module (40) consisting of a combination of a plurality of MBF (Micro Bellows Filter) elements (41) and antenna elements (42) is placed on the front side via a clamshell (25) as a substrate for a DTU (Digital Transceiving Unit), and a main board (20) with a type of heating element mounted on the back side can be stacked.

[0071] Here, components defined as heat generating elements (refer to the drawing reference numerals '21, 22, 22C' of FIG. 8 described later) that generate a large amount of heat during operation, such as RFIC elements, PA elements, and FPGAs, can be mounted on the main board (20).

[0072] However, in the embodiment of the present invention, it should be noted that the description is made by adopting an electronic device as the antenna device (1), and the heating elements (21, 22, 22C) are not limited to the above configuration. For example, the heating elements (21, 22, 22C) may also be adopted as semiconductors, which are representative heating elements.

[0073] In addition, in the lower part of the internal space (10S) of the heat dissipation housing (10), a PSU board (30) on which electrical components related to a PAU (Power Amplifier Unit) are mounted can be stacked so as to have the same layer as the main board (20).

[0074] However, it is not necessary for the PSU board (30) to be arranged in the same layer as the main board (20) on the internal space (10S) of the heat dissipation housing (10), and it may be arranged in different layers in consideration of the external shape or rearward protrusion length of the mounted components mounted on the back surface of the main board (20) and the back surface of the PSU board (30).

[0075] For reference, the above-described main board (20) is stacked and arranged in the upper region (I) and the middle region (II) of the internal space (10S) of the heat dissipation housing (10), as described later (see FIG. 8), and can generate heat with a relatively higher heat generation amount than the heating elements, which are electric components of the PSU board (30) arranged in the lower region (III) corresponding to the lower region.

[0076] Meanwhile, a radome panel (50) is installed on the front of the internal space (10S) of the heat dissipation housing (10), which can protect the radiating elements implemented as antenna elements (42) from the outside and at the same time ensure smooth radiation from the radiating elements.

[0077] Here, the radome panel (50) is formed of a material through which the radiation beam of the radiating elements can easily pass, and can be classified as a component that hinders the heat dissipation of the system operation heat generated in the internal space (10S) of the heat dissipation housing (10) toward the front side. Accordingly, this also becomes a factor in designing the heat dissipation housing (10) itself to be longer in the vertical direction in order to increase the heat dissipation surface area for concentrated heat dissipation toward the rear side of the heat dissipation housing (10).

[0078] A heat dissipation device according to an embodiment of the present invention may be installed on the back surface of such a heat dissipation housing (10). Here, the heat dissipation device according to an embodiment of the present invention may be provided with a plurality of heat sink fins (100) that protrude a predetermined distance rearward from the back surface of the heat dissipation housing (10). A detailed description of the plurality of heat sink fins (100) will be provided later.

[0079] Meanwhile, the heat dissipation device of an electronic device according to one embodiment of the present invention may further include a finger guard assembly (60) that is provided to surround a portion of the rear side and upper side of the heat dissipation housing (10) to block access of external objects (or people) to a plurality of heat sink fins (100), as shown in FIGS. 2A and 2B.

[0080] The finger guard assembly (60) comprises a rear finger guard panel (61) vertically arranged to cover the entire rear end of a plurality of heat sink fins (100), an upper upper finger guard panel (62) having a rear end coupled to the upper end of the rear finger guard panel (61) and a front end horizontally extended forward, a right finger guard panel (63) having a front end coupled to the right rear end of the heat dissipation housing (10) and a rear end coupled to the right end of the rear finger guard panel (61) and arranged to cover the rear right portion of the heat dissipation housing (10), a left finger guard panel (64) having a front end coupled to the left rear end of the heat dissipation housing (10) and a rear end coupled to the left end of the rear finger guard panel (61) and arranged to cover the rear left portion of the heat dissipation housing (10), and a front end of the upper upper finger guard panel (62) and a heat dissipation It may include an upper front finger guard panel (65) arranged to cover the front upper portion of the housing (10).

[0081] Here, the right finger guard panel (63) and the left finger guard panel (64) may include an upper side guard panel (63-1, 64-1) installed on the upper side with respect to the clamping bracket (5) described later, and a lower side guard panel (63-2, 64-2) installed on the lower side with respect to the clamping bracket (5).

[0082] Therefore, the upper side guard panel (63-1, 64-1) can be divided into a right upper side guard panel (63-1) corresponding to the right finger guard panel (63) installed on the upper side with respect to the clamping bracket (5) and a left upper side guard panel (64-1) corresponding to the left finger guard panel (64) installed on the upper side with respect to the clamping bracket (5), and the lower side guard panel (63-2, 64-2) can be divided into a right lower side guard panel (63-2) corresponding to the right finger guard panel (63) installed on the lower side with respect to the clamping bracket (5) and a left lower side guard panel (64-2) corresponding to the left finger guard panel (64) installed on the lower side with respect to the clamping bracket (5).

[0083] Meanwhile, the finger guard assembly (60) may further include a guard mounting bar (66, 67, 68) that provides a predetermined screw fastening hole (69) for screw connection at each corner portion and reinforces the rigidity of the corner portion.

[0084] Here, the rear finger guard panel or front finger guard panel (61 to 65) described above may be made of plastic material to reduce the weight of the entire antenna device (1), and the guard mounting bars (66, 67, 68) described above may be manufactured and provided in the form of an aluminum extrusion bar to reinforce rigidity.

[0085] The guard mounting bars (66, 67, 68) may further include a front guard mounting bar (66) which is positioned between the upper upper finger guard panel (62) and the upper front finger guard panel (65) and provides a plurality of screw fastening holes (69), a rear guard mounting bar (67) which is positioned between the upper upper finger guard panel (62) and the rear finger guard panel (61) and provides a plurality of screw fastening holes (69), and a lower guard mounting bar (68) which is positioned at the lower end of the rear finger guard panel (61) and has a plurality of screw fastening holes (69) formed therein.

[0086] In addition, the finger guard assembly (60) must be able to allow air (outside air) from the external space to flow in for heat exchange with a plurality of heat sink fins (100) provided inside, so a plurality of net (or grid)-shaped ventilation holes (60h-1, 60h-2) can be formed.

[0087] A finger guard assembly (60) having such a configuration can be arranged to surround all but the lower portions of a plurality of heat sink fins (100) coupled to the rear surface of a heat dissipation housing (10), as shown in FIGS. 1 to 2b.

[0088] Meanwhile, a clamping bracket (5) that mediates mounting to a not-shown support pole can be installed on the left and right ends of the heat dissipation housing (10) to surround the outer surface of the rear finger guard panel (61) of the finger guard assembly (60) described above.

[0089] The clamping bracket (5) not only mediates the mounting to the support pole as described above, but also can function as a handle that allows a worker on site to hold and move the antenna device (1) by hand, and a hole-shaped handle hole (6) can be formed on the left and right ends to facilitate the holding.

[0090] Meanwhile, on the inner surface of the internal space (10S) of the heat dissipation housing (10), a thermal contact portion (11, 12, 13) may be formed that matches the shape of the heating elements (21, 22, 22C) mounted on the back surface of the main board (20) or the back surface of the PSU board (30).

[0091] Here, the thermal contact portion (11, 12, 13) may include a heating element contact portion (11, 12) provided in a protruding or recessed form in a form that makes surface thermal contact with the heating surfaces of heating elements (21, 22, 22C) mounted on the back surface of the main board (20), and a heat pipe contact portion (13) provided in a groove form so that a plurality of heat pipes (140) (see FIG. 8) described later may be inserted and installed.

[0092] Meanwhile, the lower portion of the heat dissipation housing (10) may further be provided with an external mounting member (70) for electrical or signal connection with the main board (20) of the internal space (10S). The external mounting member (70) may be understood as a component that serves as a connection terminal for all connection lines, including power cables or wires, for connecting and supplying electricity or signals in general electronic devices.

[0093] FIG. 3 is an exploded perspective view of a rear portion of the configuration of FIG. 1 for explaining the coupling relationship of a plurality of heat sink fins, FIG. 4 is a perspective view (a, b, c) and a cross-sectional view (d, e) taken along lines AA and BB showing a plurality of heat sink fins of the configuration of FIG. 1, FIG. 5 is a projection perspective view showing an upper heat sink fin of the plurality of heat sink fins of FIG. 1, FIG. 6 is an exploded perspective view of FIG. 5, FIG. 7 is a partially cut-away perspective view (a), an enlarged view (b) of the portion, and a cross-sectional view (c) thereof of FIG. 5, FIG. 8 is an exploded perspective view for explaining the working relationship of a plurality of heat sink fins according to the types and mounting positions of heating elements of the configuration of FIG. 1, FIG. 9 is a rear view (a) and a side view (b) of FIG. 8, and FIGS. 10a and 10b are views of a heat pipe for dispersing heat in the left and right horizontal directions inside a heat dissipation housing of the configuration of FIG. 1. Here are some cutaway perspective views to illustrate the joint relationships.

[0094] A heat dissipation device of an electronic device according to one embodiment of the present invention may include a plurality of heat sink fins (100) installed in press-fit portions (16, 17, 18) formed on the rear surface of a heat dissipation housing (10), as shown in FIG. 3.

[0095] Here, the press-fitting portion (16, 17, 18) may include an upper press-fitting portion (17) to which an upper heat sink fin (110) among a plurality of heat sink fins (100) is coupled, an intermediate press-fitting portion (16) to which an intermediate heat sink fin (120) among a plurality of heat sink fins (100) is coupled, and a lower press-fitting portion (18) to which a lower heat sink fin (130) among a plurality of heat sink fins (100) is coupled.

[0096] Such press-fit portions (16, 17, 18) are integrally formed on the back surface of the heat dissipation housing (10), and may be provided in the form of a long slit groove in the vertical direction so that a portion of the front end of a plurality of heat sink fins (100) can be inserted in a forced fit form.

[0097] However, the press-fit portion (16, 17, 18) may be formed so that the long slot groove described above is sunken forward based on the back surface of the heat dissipation housing (10), and a pair of slot ribs (not indicated in the drawing) may be formed so that they protrude rearward based on the back surface of the heat dissipation housing (10) to form the long slot groove described above.

[0098] Here, among the press-fitting portions (16, 17, 18), the middle press-fitting portion (16) can be formed as a middle lower press-fitting portion (16a) into which the lower part of the middle heat sink fin (120) among the plurality of heat sink fins (100) described later is inserted and installed, and a middle upper press-fitting portion (16b) into which the upper part of the middle heat sink fin (120) is inserted and installed.

[0099] The inner surface of the internal space (10S) of the heat dissipation housing (10) in which the middle upper press-in portion (16b) is formed may be formed to protrude slightly further rearward to form a heat pipe contact portion (13) in which a plurality of heat pipes (140) described later are installed.

[0100] Here, the depth of the slot groove forming the middle upper press-in portion (16b) and the middle lower press-in portion (16a) or the protruding length of a pair of slot ribs are all formed to be the same, but the portions of the back surface of the heat dissipation housing (10), which serves as a basis for formation, where the middle upper press-in portion (16b) and the middle lower press-in portion (16a) are formed can be formed to be distinguished by a stepped surface. This will be described in more detail later.

[0101] Meanwhile, in a heat dissipation device of an electronic device according to one embodiment of the present invention, a plurality of heat sink fins (100) may include, as referenced in FIGS. 1 to 3, an upper heat sink fin (110) and a middle heat sink fin (120) that actively dissipate heat generated from heating elements (21, 22, 22C) to the outside using a phase change material, and a lower heat sink fin (130) that dissipates heat generated from heating elements (21, 22, 22C) to the outside using a heat conduction method according to the thermal conductivity of the material itself rather than a phase change material.

[0102] Here, a plurality of heat sink fins (100) are arranged vertically in a vertical direction on the back surface of the heat dissipation housing (10), and can be detachably coupled to each other at predetermined distances in the left and right horizontal directions. In order to individually press-fit the plurality of heat sink fins (100), a plurality of press-fit portions (16, 17, 18) formed on the back surface of the heat dissipation housing (10) can also be arranged vertically in a vertical direction and spaced apart by a predetermined distance in the left and right horizontal directions.

[0103] At this time, a plurality of heat sink fins (100) can be arranged so as to be discontinuous in the vertical direction near the boundary of a plurality of regions (Ⅰ, Ⅱ, Ⅲ).

[0104] The fact that a plurality of heat sink fins (100) are arranged in a discontinuous manner in the vertical direction means that the phase change flow range of the refrigerant filled in the closed refrigerant flow space (111, 112) provided inside each of the plurality of heat sink fins (100) described later is divided into a plurality of regions in the vertical direction at the rear surface of the heat dissipation housing (10), or that the heat transfer areas are physically separated.

[0105] More specifically, as referenced in FIGS. 8 and 9, the above-described multiple regions (Ⅰ, Ⅱ, Ⅲ) can be divided into an upper region (Ⅰ) located relatively higher on the rear surface of the heat dissipation housing (10), a middle region (Ⅱ) located in the middle, and a lower region (Ⅲ) located lower.

[0106] In this case, the plurality of heat sink fins (100) may include an upper heat sink fin (110) coupled to the back surface of the heat dissipation housing (10) corresponding to the upper region (I) to dissipate heat from the upper heating element (21) located in the upper region (I) among the plurality of types of heating elements (21, 22, 22C), an intermediate heat sink fin (120) coupled to the back surface of the heat dissipation housing (10) corresponding to the middle region (II) to dissipate heat from the intermediate heating element (22, 22C) located in the middle region (II) among the plurality of types of heating elements (21, 22, 22C), and a lower heat sink fin (130) coupled to the back surface of the heat dissipation housing (10) corresponding to the lower region (III) to dissipate heat from the lower heating element (not shown, for example, PSU electrical components) located in the lower region (III) among the plurality of types of heating elements (21, 22, 22C).

[0107] In this way, a plurality of heat sink fins (100) installed in different types across three areas in the vertical direction can be arranged in a vertical line that is a straight line in the vertical direction so that the heat generated by heat dissipation in the vertical direction can be easily discharged upward without interference when forming an upward air current.

[0108] A plurality of heat sink fins (100) configured as described above can be press-fitted into press-fit portions (16, 17, 18) formed on the back surface of the heat dissipation housing (10).

[0109] At this time, although not shown in the drawing, it is preferable to treat the press-fit portions (16, 17, 18) with thermal epoxy to improve heat transfer efficiency, and then press-fit a plurality of the heat sink fins (100) described above.

[0110] Among the plurality of heat sink fins (100), the upper heat sink fin (110) and the middle heat sink fin (120) may have a first thermal conductivity, and the lower heat sink fin (130) may have a second thermal conductivity that is relatively lower than the first thermal conductivity.

[0111] As will be described later, the upper heat sink fin (110) and the middle heat sink fin (120) have a heat conductive panel body made of a SUS material (stainless steel) plate, and it is known that the SUS material has lower thermal conductivity than metals such as aluminum (Al). However, the upper heat sink fin (110) and the middle heat sink fin (120) can smoothly release heat through phase change of the refrigerant in the refrigerant flow space (111, 112) filled with the refrigerant therein, and accordingly, the upper heat sink fin (110) and the middle heat sink fin (120) have higher thermal conductivity than the lower heat sink fin (130).

[0112] Accordingly, the upper heat sink fin (110) and the middle heat sink fin (120) are positioned in the upper region (I) and the middle region (II) and are suitable for heat dissipation of relatively high heat generating elements (21, 22, 22C), and the lower heat sink fin (130) is positioned in the lower region (III) and is suitable for heat dissipation of relatively low heat generating elements (e.g., electrical components of a PSU board).

[0113] However, the positional definitions for the upper region and lower region (Ⅰ to Ⅲ) are merely limitations used to help understand the heat dissipation device of an electronic device according to one embodiment of the present invention, and it is not necessary that high-heating elements (21, 22, 22C) be placed in the upper region (Ⅰ) and middle region (Ⅱ) and low-heating elements be placed in the lower region (Ⅲ), and their placement positions may be mixed.

[0114] Here, the upper heat sink fin (110) may be formed integrally with an extended heat sink portion (105) that extends further forward than the press-fit portion (e.g., the upper press-fit portion (17)) for the rear surface of the heat dissipation housing (10) and covers at least a portion of the rear upper portion of the heat dissipation housing (10).

[0115] The fact that the extended heat sink portion (105) is further formed integrally with the upper heat sink fin (110) means that the phase change flow range of the refrigerant filled in the internal refrigerant flow space (111, 112) increases to a wider area.

[0116] That is, the extended heat sink portion (105) can be formed in a form in which the refrigerant flow space (111, 112) filled with refrigerant inside the upper heat sink fin (110) is expanded.

[0117] Accordingly, it can be said that this is in line with the increase in the heat dissipation area through heat exchange with the outside air through a single upper heat sink fin (110).

[0118] Therefore, the extended heat sink portion (105) formed on the upper side of the upper heat sink fin (110) serves to induce and conduct heat received from the upper heating element (21) of the upper region (I) to the external space side of the upper side of the heat dissipation housing (10) to dissipate heat with higher heat dissipation performance.

[0119] Meanwhile, in the middle region (II), in addition to the middle heating element (22), a high heating element (22C) having a higher heating amount than the middle heating element (22) may be positioned. In one embodiment of the present invention, assuming that the electronic device is employed as an antenna device (1), the upper heating element (21) and the middle heating element (22) may be defined as RFIC elements or PA elements having a somewhat high heating amount during electrical operation, while the high heating element (22C) may be defined as an FPGA element.

[0120] In this case, the intermediate region (II) can be divided into an upper intermediate region (II-U) including a region where the high-heater (22C) is positioned and a lower intermediate region (II-D) including a region where the high-heater (22C) is not positioned and only the intermediate heater (22) is positioned.

[0121] Here, a plurality of heat pipes (140) can be disposed on the inner surface of the internal space (10S) of the heat dissipation housing (10) corresponding to the upper middle region (Ⅱ-U) to disperse the heat generated from the high-heat generating body (22C) in the horizontal direction to the left and right of the heat dissipation housing (10).

[0122] In particular, the front end of the middle heat sink fin (120) located in the upper middle region (II-U) may be formed to be recessed to a rearward degree more than the front end of the middle heat sink fin (120) located in the lower middle region (II-D).

[0123] This is because, as described above, each part of the back surface of the heat dissipation housing (10) where the middle upper press-in portion (16b) and the middle lower press-in portion (16a) are formed is formed to be separated by a stepped surface. This is a shape design change to accommodate a part of the middle upper press-in portion (16b) that protrudes relatively more toward the rear side of the back surface of the heat dissipation housing (10) in order to secure an installation space for a plurality of heat pipes (140) disposed in the upper middle region (II-U).

[0124] Meanwhile, among the plurality of heat sink fins (100), the upper heat sink fin (110) and the middle heat sink fin (120) include a heat conductive panel body (110A, 110B) having a refrigerant flow space (111, 112) that provides a space in which refrigerant is filled inside and circulates in a gas-liquid manner to release heat while undergoing a phase change within a closed space, as referenced in FIGS. 4 to 7.

[0125] However, since the upper heat sink fin (110) and the middle heat sink fin (120) are the same in that they both have a refrigerant flow space (111, 112) in which refrigerant flows inside the heat-conducting panel body (110A, 110B) except for the difference in that the above-described extended heat sink portion (105) is formed, only the drawing of the upper heat sink fin (110) is used for description below, but it can be understood that the detailed functions and configurations are all the same.

[0126] Here, the heat conductive panel body (110A, 110B), although not shown in the drawing, can be formed by forming the heat conductive panel body (110A, 110B) provided as a single metal panel member by bending it in a predetermined manner and joining it along the edge end to seal it, thereby forming the refrigerant flow space (111, 112) described above.

[0127] However, the method of forming the refrigerant flow space (111, 112) is not necessarily limited to applying the single metal panel member type and bending processing method described above, and as referenced in FIGS. 4 to 7, it is also possible to form the refrigerant flow space (111, 112) therein by joining all of the edge ends of two metal panel members (110A, 110B) in a predetermined joining manner.

[0128] Here, the refrigerant flow space (111, 112) corresponds to an evaporation area in which the liquid refrigerant filled therein evaporates by the heat transferred from the heating elements (21, 22, 22C), as shown in FIGS. 4 to 7, and may include a first refrigerant passage (111) formed vertically and elongated in the vertical direction, and a second refrigerant passage (112) formed in a condensation area other than the evaporation area, but having one end communicated with the first refrigerant passage (111) and the other end inclined in a rearward diagonal direction so as to be positioned higher in the direction of gravity than the aforementioned one end, and which is a flow path of the liquid refrigerant that guides the condensed liquid refrigerant from the condensation area to flow toward the first refrigerant passage (111).

[0129] The second refrigerant passage (112) can be defined in shape by a plurality of inclined guides (112a) formed to protrude toward the refrigerant flow space (111, 112) so as to prevent the substantially condensed liquid refrigerant from falling directly in the direction of gravity and to guide the inclined flow toward the first refrigerant passage (111) by the properties of the surface tension of the liquid.

[0130] In the heat-conducting panel body (110A, 110B) corresponding to the condensation area, a plurality of strength reinforcing parts (113) can be formed symmetrically to protrude into the refrigerant flow space (111, 112).

[0131] When the heat-conducting panel bodies (110A, 110B) are joined to each other by bending or joining, the plurality of strength reinforcing parts (113) can serve to reinforce the strength of the heat-conducting panel bodies (110A, 110B) as a whole by joining the facing parts inside the refrigerant flow space (111, 112) through various joining methods such as laser welding.

[0132] In addition, the plurality of strength reinforcing members (113) can also serve to facilitate active condensation by providing a larger interference area for the vaporized refrigerant to collide with for heat dissipation in the condensation region.

[0133] In addition, a plurality of strength reinforcing members (113) can additionally perform the role of enabling active heat exchange by forming a larger contact area with the outside air by being formed to be sunken toward the refrigerant flow space (111, 112) on the outer surface of the heat-conducting panel body (110A, 110B) provided in a flat shape.

[0134] Meanwhile, in the evaporation area corresponding to the first refrigerant passage (111), an absorber (116) may be further installed to actively vaporize the absorbed liquid refrigerant by the heat provided from the heating elements (21, 22, 22C) after absorbing the liquid refrigerant.

[0135] The absorbent (116) may be formed of a fiber material such as a nonwoven fabric having a large number of pores formed therein, and it is preferable that the absorbent (116) be formed of a material capable of dispersing and moving liquid refrigerant by capillary action (or self-absorption) while going against gravity in the vertical direction (i.e., in the direction opposite to gravity) at least at a predetermined height when placed on the first refrigerant passage (111) formed long in the vertical direction.

[0136] However, in the case where an extended heat sink portion (105) is further provided on the upper side, as in the upper heat sink fin (110), an auxiliary absorber (117, 118) may be further provided on any part of the second refrigerant passage (112) forming a boundary with the extended heat sink portion (105).

[0137] The auxiliary absorber (117, 118) can be installed and secured in the auxiliary absorber installation part (114, 115) that has been modified to have a wider width than a portion of the second refrigerant passage (112).

[0138] The auxiliary absorber (117, 118) may include a first auxiliary absorber (117) provided in the middle portion of the upper heat sink fin (110) and a second auxiliary absorber (118) provided in the boundary portion of the extended heat sink portion (105).

[0139] In addition, auxiliary absorbent installation parts (114, 115) may be provided in two locations for individual installation of the first auxiliary absorbent (117) and the second auxiliary absorbent (118).

[0140] In particular, the auxiliary absorbers (117, 118) may be provided to be fitted together during mutual bonding molding of the heat-conducting panel body (110A, 110B) so that one side auxiliary absorber (117A, 118A) and the other side auxiliary absorber (117B, 118B) do not move with a plurality of fixed ribs (119) in between.

[0141] Meanwhile, although not shown in the drawing, a spacer protrusion may be further provided to stably fix the absorber (116) arranged inside the first refrigerant passage (111) formed vertically and elongated, and the plurality of fixing ribs (119) described above serve to stably fix the auxiliary absorber (117, 118) in the same way as the spacer protrusion for fixing the absorber (116).

[0142] Such a fixed rib (119) can be formed integrally when a pair of heat-conducting panel bodies (110A, 110B) are formed.

[0143] Here, it is preferable that the lower ends of the auxiliary absorbers (117, 118) are connected to the absorber (116). This is to allow the condensed refrigerant (liquid refrigerant) absorbed in the auxiliary absorbers (117, 118) to naturally permeate to the absorber (116) side (or the first refrigerant passage (111) side) located closest to the heating elements (21, 22, 22C).

[0144] Meanwhile, the thermal conductive panel body (110A, 110B) of the upper heat sink fin (110) and the middle heat sink fin (120) may be provided in the form of a plate made of SUS material (stainless steel), and the lower heat sink fin (130) may be provided in the form of a plate made of aluminum material (Al material) having a higher thermal conductivity than the thermal conductive panel body (110A, 110B) of the upper heat sink fin (110) and the middle heat sink fin (120).

[0145] The heat dissipation effect according to the lower heat sink fin (130) made of aluminum is expected to have much higher heat dissipation performance than the case where the upper heat sink fin (110) and the middle heat sink fin (120) have the heat conductivity of the material itself, but in the case of a heat transfer method using a phase change material, such as the upper heat sink fin (110) and the middle heat sink fin (120), there is a significant increase in heat dissipation performance, and therefore the lower heat sink fin (130) can be adopted as a heat dissipation configuration suitable for a heat generating element (such as an electrical component of a PSU) having a relatively low heat generating amount among the heat generating elements provided in the internal space (10S) of the heat dissipation housing (10).

[0146] However, it is not necessary for the lower heat sink fin (130) to be formed of a different metal material from the upper heat sink fin (110) and the middle heat sink fin (120), and it is also possible for it to be formed in the form of a plate made of the same SUS material as the upper heat sink fin (110) and the middle heat sink fin (120).

[0147] That is, the heat-conducting panel body (110A to 110B) forming the upper heat sink fin (110) and the middle heat sink fin (120) is provided in the form of a plate made of SUS material forming a refrigerant flow space (111, 112) therein, and the lower heat sink fin (130) is also provided in the form of a plate made of SUS material, so that heat can be transferred only through the thermal conductivity of the SUS material itself without providing a refrigerant flow space (111, 112).

[0148] Meanwhile, in the case of a high-heat generating body (22C) located in the upper middle region (Ⅱ-U), there may be a problem of being negatively affected by heat due to the high heat transfer performance of the middle heat sink fin (120) using a phase change material.

[0149] More specifically, as referenced in FIGS. 8 and 9, in the case of a high-heat source (21C) such as an FPGA element located in the upper middle region (Ⅱ-U), there is concern that the high temperature of the front end of the middle heat sink fin (120) may cause thermal damage.

[0150] To solve this problem, a plurality of heat pipes (140) may be disposed on the inner surface of the internal space (10S) of the heat dissipation housing (10) corresponding to the upper middle region (Ⅱ-U) to disperse the heat generated from the high-heat generating body (21C) in the horizontal direction to the left and right of the heat dissipation housing (10).

[0151] Here, the heat pipe (140) is also filled with a phase-changeable refrigerant in a closed interior, and the refrigerant is phase-changed into a gaseous refrigerant by heat provided from a high-heat generating body (21C), and the gaseous refrigerant diffused through an internal wick structure (not shown) in which a number of pores are formed is condensed through heat exchange via the inner surface of the heat dissipation housing (10) (particularly, the heat pipe contact portion (13)) so that the phase-change can be made into a liquid refrigerant.

[0152] In particular, a plurality of heat pipes (140) are arranged so that at least one end is in surface thermal contact with the heating surface of the high-temperature heat generating body (21C), and the other end is arranged so as to extend toward the left or right end of the heat dissipation housing (10), thereby evenly distributing and supplying high-temperature concentrated heat supplied from the high-temperature heat generating body (21C) to a plurality of intermediate heat sink fins (120) spaced apart from each other in the horizontal and vertical directions on the rear surface of the heat dissipation housing (10). In this way, the heat dissipation device of an electronic device according to an embodiment of the present invention provides an advantage of securing higher heat dissipation performance by providing a specific region (e.g., an upper region, a middle region, a lower region, etc.) appropriate for the heat generation amount of each of the heat generating bodies (21, 22, 22C) to be dedicated and vertically divided and dissipated, rather than a case where heat generated from a plurality of types of heat generating bodies (21, 22, 22C) is dissipated using a plurality of heat sink fins uniformly arranged vertically.

[0153] In particular, the heat dissipation device of an electronic device according to one embodiment of the present invention has been described as an example of an 'antenna device (1)' and its auxiliary components, which are very familiar to the applicant of the present invention as a representative electronic device, but it can be said that it has technical features that can be applied to any device of any name as long as it is related to heat dissipation of heating elements having different heat generation amounts in each of a plurality of areas.

[0154]

[0155] Above, an embodiment of a heat dissipation device for an electronic device according to the present invention has been described in detail with reference to the attached drawings. However, the embodiments of the present invention are not necessarily limited to the above-described embodiment, and it will be understood that various modifications and equivalent implementations are possible by those skilled in the art to which the present invention pertains. Therefore, the true scope of the present invention is defined by the claims set forth below.

[0156]

[0157] The present invention provides a heat dissipation device for an electronic device that allows heat inside to be dissipated with uniform heat dissipation performance throughout the entire upper and lower portions by dividing a plurality of heat sink fins provided on the rear surface of a heat dissipation housing into specific heat dissipation areas according to the upper and lower positions of the rear surface of the heat dissipation housing.

Claims

1. A heat dissipating housing having an internal space with an open front; A plurality of types of heating elements arranged in a plurality of vertical areas on the inner surface corresponding to the internal space of the heat dissipation housing; and A plurality of heat sink fins are arranged vertically and elongated on the back surface of the heat dissipation housing, but are detachably coupled to each other at a predetermined distance in the left and right horizontal directions; A heat dissipation device for an electronic device, wherein the above-mentioned plurality of heat sink fins are arranged in a discontinuous vertical direction near the boundary of a plurality of areas.

2. In claim 1, A heat dissipation device for an electronic device, wherein the plurality of heat sink fins are arranged separately so that heat transfer of conductive heat is cut off in the vertical direction with respect to the rear surface of the heat dissipation housing.

3. In claim 1, A heat dissipation device for an electronic device, wherein the plurality of heat sink fins are installed on the rear surface of the heat dissipation housing so as to independently receive heat from heating elements located in each of the regions and then dissipate heat through an independent heat transfer path when the plurality of regions can be divided into an upper region located relatively higher on the rear surface of the heat dissipation housing, a middle region located in the middle, and a lower region located lower.

4. In claim 1, The above multiple heat sink fins, When the above multiple areas can be divided into an upper area located relatively higher on the back surface of the heat dissipation housing, a middle area located in the middle, and a lower area located lower, An upper heat sink fin coupled to the upper region to dissipate heat from the upper heating element located in the upper region among the above-mentioned multiple types of heating elements; An intermediate heat sink fin coupled to the intermediate region to dissipate heat from an intermediate heating element located in the intermediate region among the above-described multiple types of heating elements; and A heat dissipation device for an electronic device, comprising: a lower heat sink fin coupled to the lower region to dissipate heat from a lower heat generating element located in the lower region among the above-mentioned multiple types of heat generating elements; 5. In claim 4, A heat dissipation device for an electronic device, wherein the upper heat sink fin, the middle heat sink fin, and the lower heat sink fin are arranged in a vertical line that is in a straight vertical direction.

6. In claim 4, The upper heat sink fin and the middle heat sink fin have a first thermal conductivity, The above lower heat sink fin has a second thermal conductivity that is relatively lower than the first thermal conductivity, A heat dissipation device for an electronic device, wherein the upper heating element and the middle heating element located in the upper region and the middle region radiate heat at a higher temperature than the lower heating element located in the lower region.

7. In claim 6, A heat dissipation device for an electronic device, wherein the interior of the upper heat sink fin and the middle heat sink fin is filled with a phase-changeable refrigerant, and has the first thermal conductivity through flow according to the phase change of the refrigerant.

8. In claim 6, The above lower heat sink fin is a heat dissipation device for an electronic device having the second thermal conductivity due to the thermal conductivity of the material itself.

9. In claim 6, The upper heat sink fin is a heat dissipation device for an electronic device, wherein an extended heat sink portion is formed integrally so that a portion of the upper portion extends further forward than the back surface of the heat dissipation housing and covers at least a portion of the upper surface of the heat dissipation housing.

10. In claim 9, The above-mentioned extended heat sink portion is a heat sink device for an electronic device, formed in a form in which a refrigerant flow space filled with refrigerant inside the upper heat sink fin is expanded.

11. In claim 6, In the above intermediate region, in addition to the intermediate heating element, a high heating element having a higher heating value than the intermediate heating element is further positioned, A heat dissipation device for an electronic device, wherein the above-mentioned middle region is divided into an upper middle region including a region where the high-heating body is located and a lower middle region including a region where the high-heating body is not located.

12. In claim 11, A heat dissipation device for an electronic device, wherein a plurality of heat pipes are disposed on the inner surface of the internal space of the heat dissipation housing corresponding to the upper middle region to disperse heat generated from the high-heat generating body in the horizontal direction to the left and right of the heat dissipation housing.

13. In claim 12, On the back surface of the above heat dissipation housing, a press-fit portion for installing the plurality of heat sink fins is further provided. When the press-fitting portion includes an upper press-fitting portion to which the upper heat sink fin among the plurality of heat sink fins is coupled, an intermediate press-fitting portion to which the middle heat sink fin among the plurality of heat sink fins is coupled, and a lower press-fitting portion to which the lower heat sink fin among the plurality of heat sink fins is coupled, A heat dissipation device for an electronic device, wherein the back surface on which the intermediate press-fit portion is formed among the above heat dissipation housings is formed to be divided by a stepped surface.

14. In claim 12, A heat dissipation device for an electronic device, wherein the front end of the intermediate heat sink fin located in the upper middle region is recessed to be a step further rearward than the front end of the intermediate heat sink fin located in the lower middle region.

15. In claim 4, A heat dissipation device for an electronic device, comprising: a heat-conducting panel body having a refrigerant flow space in which the upper heat sink fin and the middle heat sink fin are filled with refrigerant and provide a space in which the refrigerant circulates in a gas-liquid manner to release heat as the refrigerant changes phase within a closed space; 16. In claim 15, The above refrigerant flow space is, A first refrigerant passage as an evaporation area, which is a widthwise end portion that receives heat from the upper and middle heating elements as heat dissipation targets through the above heat-conducting panel body; and A heat dissipation device for an electronic device, comprising: a second refrigerant passage formed in a plurality of condensation areas excluding the first refrigerant passage, and in which liquid refrigerant condensed from a gaseous state to a liquid state from the other end in the width direction of the heat-conducting panel body acts as a flow path toward the first refrigerant passage by surface tension or gravity; 17. In claim 15, The thermally conductive panel body of the upper heat sink fin and the middle heat sink fin is provided in the form of a plate made of SUS material, The above lower heat sink fin is a heat dissipation device for an electronic device, which is provided in the form of a plate made of aluminum material having a higher thermal conductivity than the above thermal conductive panel body.

18. In claim 15, The heat-conducting panel body of the upper heat sink fin and the middle heat sink fin is provided in the form of a SUS material plate that forms the refrigerant flow space, The above lower heat sink fin is a heat dissipation device for an electronic device, which is provided in the form of a plate made of SUS material without the above refrigerant flow space.

Images