Camera apparatus and optical device

Abstract

The present embodiment relates to a camera apparatus comprising: a base; a first substrate disposed on the base; an image sensor disposed on the first substrate; a housing disposed on the first substrate; a carrier disposed in the housing; a lens coupled to the carrier; a first driving unit for moving the lens in the optical axis direction; a second driving unit for moving the lens in a first direction, which is perpendicular to the optical axis direction; a third driving unit for moving the lens in a second direction, which is perpendicular to the optical axis direction and the first direction; a fourth driving unit for tilting both the image sensor and the lens with a first axis at the center thereof; and a fifth driving unit for tilting both the image sensor and the lens with a second axis, which is perpendicular to the first axis, at the center thereof.

Description

Camera devices and optical instruments

[0001] The present embodiment relates to a camera device and an optical device.

[0002] A camera device is a device that takes pictures or videos of a subject, and is installed in optical devices such as smartphones, drones, and vehicles.

[0003] Camera devices are equipped with a shake correction function to prevent the focus from shaking due to the user's hand shaking.

[0004] However, in conventional lens driving devices, the shake correction function is performed through two-axis correction, that is, x-axis shift correction and y-axis shift correction.

[0005] However, recently, there has been a demand for improved performance image stabilization.

[0006] (Patent Document 1) KR 10-2015-0118005 A

[0007] The present embodiment seeks to provide a camera device having an improved performance shake correction function through 4-axis correction.

[0008] In more detail, it is an object of the present invention to provide a camera device that performs a shake correction function through x-axis shift correction, y-axis shift correction, yaw-direction tilt correction, and pitch-direction tilt correction.

[0009] A camera device according to the present embodiment may include: a base; a first substrate disposed on the base; an image sensor disposed on the first substrate; a housing disposed on the first substrate; a carrier disposed within the housing; a lens coupled to the carrier; a first driving unit that moves the lens in an optical axis direction; a second driving unit that moves the lens in a first direction perpendicular to the optical axis direction; a third driving unit that moves the lens in a second direction perpendicular to the optical axis direction and the first direction; a fourth driving unit that tilts the image sensor and the lens together about a first axis; and a fifth driving unit that tilts the image sensor and the lens together about a second axis perpendicular to the first axis.

[0010] The camera device may include a second substrate disposed on a first side of the housing, and the first driving unit may include a first magnet disposed on the carrier and a first coil disposed on the second substrate.

[0011] The camera device may include a third substrate disposed on the base, and the second driving unit may include a second magnet disposed on the housing and a second coil disposed on the third substrate.

[0012] The second coil may be arranged in the second direction of the housing.

[0013] The third driving unit includes a third magnet disposed in the housing and a third coil disposed on the second substrate, and the third magnet may be disposed on the opposite side of the second magnet with respect to the lens.

[0014] The third coil may be placed in a third direction opposite to the second direction of the housing.

[0015] The second driving unit includes a second magnet and a second coil, and the third driving unit includes a third magnet and a third coil. When current is applied to the second coil, the second magnet moves in the first direction toward or away from the second coil, and when current is applied to the third coil, the distance between the third magnet and the third coil in the first direction does not change, and the third magnet can move in the second direction.

[0016] The second driving unit includes a second magnet and a second coil, the third driving unit includes a third magnet and a third coil, and the entire area of ​​the first surface of the second magnet facing the second coil may have a single polarity, and the first surface of the third magnet facing the third coil may have an N pole and a S pole.

[0017] The third coil may include a third-1 coil, a portion of which faces the N pole of the first face of the third magnet, and a third-2 coil, a portion of which faces the S pole of the first face of the third magnet.

[0018] The fourth driving unit may include a fourth magnet that moves together with the image sensor and a fourth coil that is arranged on the third substrate, and the fifth driving unit may include a fifth magnet that moves together with the image sensor and a fifth coil that is arranged on the third substrate.

[0019] The camera device may include a sensor base disposed between the first substrate and the base; a frame disposed between the sensor base and the housing; a first ball disposed between the housing and the carrier; a second ball disposed between the frame and the housing; and a third ball disposed between the sensor base and the frame.

[0020] The camera device may include a moving plate disposed between the base and the sensor base; a fourth ball disposed between the base and the moving plate; and a fifth ball disposed between the moving plate and the sensor base, wherein the fourth ball may include a plurality of balls disposed on the first axis, and the fifth ball may include a plurality of balls disposed on the second axis.

[0021] The above fourth ball and the above fifth ball can be formed integrally with the moving plate.

[0022] The above camera device may include a first yoke disposed on the second substrate and having an attractive force with the first magnet.

[0023] The above camera device may include a second yoke disposed on the sensor base and having a second magnet and an attractive force acting thereon.

[0024] The above camera device may include a third yoke disposed on the sensor base and having a third magnet and an attractive force acting thereon.

[0025] The camera device includes a sixth magnet disposed on one of the sensor bases and the bases; and a fourth yoke disposed on the other of the sensor bases and the bases, wherein the sixth magnet can overlap the fourth yoke in the optical axis direction.

[0026] The first substrate may include a bending portion disposed between the base and the housing.

[0027] The above camera device may include a stiffener arranged on a portion of the bending portion of the first substrate.

[0028] The first to fifth driving units each include a driving coil and a driving magnet, and the first driving units overlap each other in the second direction, the second driving units overlap each other in the first direction, the third driving units overlap each other in the first direction, the fourth driving units overlap each other in the optical axis direction, and the fifth driving units can overlap each other in the optical axis direction.

[0029] An optical device according to the present embodiment may include a main body; the camera device disposed in the main body; and a display disposed in the main body and outputting at least one of an image and a video captured by the camera device.

[0030] Through this embodiment, an improved performance shake correction function can be provided through 4-axis correction.

[0031] In more detail, it is possible to provide a shake correction function with improved performance compared to the conventional two-axis correction through x-axis shift correction, y-axis shift correction, yaw-direction tilt correction, and pitch-direction tilt correction.

[0032] Therefore, clearer photos or videos can be obtained despite the hand shake of the optical device user.

[0033] Fig. 1 is a perspective view of a camera device according to the present embodiment.

[0034] Figure 2 is a cross-sectional view taken along line AA of Figure 1.

[0035] Figure 3 is a cross-sectional view taken along line BB of Figure 1.

[0036] Figure 4 is a cross-sectional view taken along CC of Figure 1.

[0037] Figure 5 is a cross-sectional view taken along line DD of Figure 1.

[0038] Fig. 6 is a cross-sectional view of a camera device according to the present embodiment, cut in a direction perpendicular to the optical axis and viewed from above.

[0039] Fig. 7 is an exploded perspective view of a camera device according to the present embodiment.

[0040] Figures 8 and 9 are exploded perspective views viewed from different directions from Figure 7.

[0041] Fig. 10 is a perspective view of a camera device according to the present embodiment with the cover omitted.

[0042] Fig. 11 is a perspective view of Fig. 10 with the base omitted.

[0043] Fig. 12 is a perspective view of Fig. 11 with the substrate omitted.

[0044] Fig. 13 is a perspective view of Fig. 12 with the carrier omitted.

[0045] Fig. 14 is a perspective view of Fig. 13 with the housing omitted.

[0046] Figure 15 is a partial perspective view of Figure 14, omitting the sensor base and showing the frame and moving plate.

[0047] Fig. 16 is a perspective view illustrating an x-axis direction OIS driving support structure of a camera device according to the present embodiment.

[0048] Fig. 17 is a perspective view illustrating a y-axis direction OIS driving support structure of a camera device according to the present embodiment.

[0049] Fig. 18 is a perspective view illustrating a sensor substrate assembly and related configuration of a camera device according to the present embodiment.

[0050] Figure 19 is a bottom perspective view with the cover and fixed substrate omitted.

[0051] Fig. 20 is a bottom perspective view of Fig. 19 with the fixed part and related components omitted.

[0052] Fig. 21 is a bottom perspective view of Fig. 20 with the moving plate and related components omitted.

[0053] Fig. 22 is a perspective view of a camera device according to the present embodiment with the cover omitted.

[0054] Fig. 23 is a bottom perspective view showing the shape and related configuration of a folded portion of a sensor substrate of a camera device according to the present embodiment.

[0055] Fig. 24 (a) is a perspective view showing the shape and related configuration of another folded portion of the sensor substrate of the camera device according to the present embodiment, and Fig. 24 (b) is a perspective view of a stiffener.

[0056] Fig. 25 is a perspective view showing a fixed substrate and related components of a camera device according to the present embodiment.

[0057] Figure 26 is a perspective view of Figure 25 viewed from a different direction.

[0058] Fig. 27 is a drawing for explaining auto focus operation of a camera device according to the present embodiment.

[0059] Fig. 28 is a drawing for explaining the shake correction operation through x-axis shift correction and y-axis shift correction of the camera device according to the present embodiment.

[0060] Fig. 29 is a drawing for explaining the shake correction operation through yaw direction tilting correction of the camera device according to the present embodiment.

[0061] Fig. 30 is a drawing for explaining the shake correction operation through pitch direction tilting correction of the camera device according to the present embodiment.

[0062] Fig. 31 is a perspective view of an optical device according to the present embodiment.

[0063] Figure 32 is a perspective view of an optical device according to a modified example.

[0064] Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the attached drawings.

[0065] However, the technical idea of ​​the present invention is not limited to some of the embodiments described, but can be implemented in various different forms, and within the scope of the technical idea of ​​the present invention, one or more of the components between the embodiments can be selectively combined or substituted for use.

[0066] In addition, terms (including technical and scientific terms) used in the embodiments of the present invention may be interpreted as having a meaning that can be generally understood by a person of ordinary skill in the technical field to which the present invention belongs, unless explicitly and specifically defined and described, and terms that are commonly used, such as terms defined in a dictionary, may be interpreted in consideration of the contextual meaning of the relevant technology.

[0067] Additionally, the terms used in the embodiments of the present invention are intended to describe the embodiments and are not intended to limit the present invention.

[0068] In this specification, the singular may also include the plural unless specifically stated otherwise in the phrase, and when it is described as “A and / or at least one (or more) of B, C”, it may include one or more of all combinations that can be combined with A, B, C.

[0069] Additionally, in describing components of embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only intended to distinguish the components from other components, and are not intended to limit the nature, order, or sequence of the components.

[0070] And, when a component is described as being 'connected', 'coupled', or 'connected' to another component, it may include not only cases where the component is 'connected', 'coupled', or 'connected' directly to the other component, but also cases where the component is 'connected', 'coupled', or 'connected' by another component between the component and the other component.

[0071] Additionally, when described as being formed or arranged "above" or "below" each component, "above" or "below" includes not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or arranged between the two components. Furthermore, when expressed as "above" or "below," the meaning may include not only the upward direction but also the downward direction based on one component.

[0072] The 'optical axis direction' used below is defined as the optical axis direction of the lens and / or image sensor coupled to the lens drive device.

[0073] The 'vertical direction' used below may be a direction parallel to or the same direction as the optical axis direction. The vertical direction may correspond to the 'z-axis direction'. The 'horizontal direction' used below may be a direction perpendicular to the vertical direction. That is, the horizontal direction may be a direction perpendicular to the optical axis. Therefore, the horizontal direction may include the 'x-axis direction' and the 'y-axis direction'.

[0074] Hereinafter, one of the ‘x-axis direction’ and the ‘y-axis direction’ may be referred to as the ‘first direction’ and the other may be referred to as the ‘second direction’.

[0075] The 'auto focus (AF) function' used below is defined as a function that automatically focuses on a subject by adjusting the distance from the image sensor by moving the lens in the optical axis direction according to the distance of the subject so that a clear image of the subject can be obtained on the image sensor. In addition, 'closed-loop auto focus (CLAF) control' is defined as a function that detects the distance between the image sensor and the lens and provides feedback control of the position of the lens in real time to improve the accuracy of focus adjustment.

[0076] The term "optical image stabilization (OIS) function" used herein is defined as a function that moves or tilts at least one of the lens and the image sensor in a direction perpendicular to the optical axis to compensate for hand shake in order to prevent images or videos from shaking due to the user's hand shake. In addition, "closed-loop auto focus (CLAF) control" is defined as real-time feedback control to improve the accuracy of hand shake compensation.

[0077] Hereinafter, one of the “AF drive unit (400)”, the “OIS-x drive unit (510)”, the “OIS-y drive unit (520)”, the “OIS-yaw drive unit (530)”, and the “OIS-pitch drive unit (540)” may be referred to as the “first drive unit”, another may be referred to as the “second drive unit”, another may be referred to as the “third drive unit”, another may be referred to as the “fourth drive unit”, and another may be referred to as the “fifth drive unit”.

[0078] Hereinafter, one of the “AF magnet (410)”, “OIS-x magnet (511)”, “OIS-y magnet (521)”, “OIS-y magnet (531)”, “OIS-pitch magnet (541)” and “attractive force magnet (750)” may be referred to as the “first magnet”, another may be referred to as the “second magnet”, another may be referred to as the “third magnet”, another may be referred to as the “fourth magnet”, another may be referred to as the “fifth magnet” and another may be referred to as the “sixth magnet”.

[0079] Hereinafter, one of the “AF coil (420)”, “OIS-x coil (512)”, “OIS-y coil (522)”, “OIS-y coil (532)” and “OIS-pitch coil (542)” may be referred to as the “first coil”, another may be referred to as the “second coil”, another may be referred to as the “third coil”, another may be referred to as the “fourth coil” and another may be referred to as the “fifth coil”.

[0080] Hereinafter, one of the “AF guide ball (610)”, “OIS-x guide ball (620)”, “OIS-y guide ball (630)”, “OIS-y guide ball (640)” and “OIS-pitch guide ball (650)” may be referred to as the “first ball”, another may be referred to as the “second ball”, another may be referred to as the “third ball”, another may be referred to as the “fourth ball” and another may be referred to as the “fifth ball”.

[0081] Hereinafter, one of the “fixed substrate (130)”, the “sensor substrate (210)”, and the “side substrate (212)” may be referred to as the “first substrate”, the other may be referred to as the “second substrate”, and the other may be referred to as the “third substrate”.

[0082] Hereinafter, one of the “AF manpower yoke (710)”, “OIS-x manpower yoke (720)”, “OIS-y manpower yoke (730)” and “manpower yoke (740)” may be referred to as the “first yoke”, the other may be referred to as the “second yoke”, the other may be referred to as the “third yoke” and the other may be referred to as the “fourth yoke”.

[0083] Hereinafter, one of the “housing (310)”, the “sensor base (320)”, the “frame (330)” and the “carrier (340)” may be referred to as the “first carrier”, another may be referred to as the “second carrier”, another may be referred to as the “third carrier” and another may be referred to as the “fourth carrier”.

[0084]

[0085] Below, the configuration of the camera device according to the present embodiment is described with reference to the drawings.

[0086] Fig. 1 is a perspective view of a camera device according to the present embodiment. Fig. 2 is a cross-sectional view taken along line AA of Fig. 1. Fig. 3 is a cross-sectional view taken along line BB of Fig. 1. Fig. 4 is a cross-sectional view taken along line CC of Fig. 1. Fig. 5 is a cross-sectional view taken along line DD of Fig. 1. Fig. 6 is a cross-sectional view taken along line DD of Fig. 1 and is a cross-sectional view taken along line PERIPHERAL to the optical axis and viewed from above of the camera device according to the present embodiment. Fig. 7 is an exploded perspective view of the camera device according to the present embodiment. Figs. 8 and 9 are exploded perspective views taken from different directions than Fig. 7. Fig. 10 is a perspective view of the camera device according to the present embodiment with the cover omitted. Fig. 11 is a perspective view of Fig. 10 with the base omitted. Fig. 12 is a perspective view of Fig. 11 with the substrate omitted. Fig. 13 is a perspective view of Fig. 12 with the carrier omitted. Fig. 14 is a perspective view of Fig. 13 with the housing omitted. Fig. 15 is a partial perspective view of Fig. 14, omitting the sensor base and showing the frame and the moving plate. Fig. 16 is a perspective view illustrating an x-axis direction OIS driving support structure of a camera device according to the present embodiment. Fig. 17 is a perspective view illustrating a y-axis direction OIS driving support structure of a camera device according to the present embodiment. Fig. 18 is a perspective view illustrating a sensor substrate assembly and related components of a camera device according to the present embodiment. Fig. 19 is a bottom perspective view with the cover and the fixed substrate omitted. Fig. 20 is a bottom perspective view with the fixed part and related components omitted in Fig. 19. Fig. 21 is a bottom perspective view with the moving plate and related components omitted in Fig. 20. Fig. 22 is a perspective view with the cover omitted in a camera device according to the present embodiment. Fig. 23 is a bottom perspective view illustrating a shape of a folded portion of a sensor substrate of a camera device according to the present embodiment and related components. Fig. 24 (a) is a perspective view showing the shape and related configuration of another folded portion of the sensor substrate of the camera device according to the present embodiment, and Fig. 24 (b) is a perspective view of a stiffener.Fig. 25 is a perspective view illustrating a fixed substrate and related components of a camera device according to the present embodiment. Fig. 26 is a perspective view of Fig. 25 viewed from a different direction.

[0087] The camera device may include a camera module. The camera device may include a lens actuator. The camera device may include a voice coil motor. The camera device may include an AF module. The camera device may include an OIS module.

[0088] The camera device may include a fixed member. The fixed member may be relatively fixed when the movable member moves. The fixed member may support the movable member. The fixed member may accommodate the movable member.

[0089] The camera device may include a base (110). The fixing member may include the base (110). The base (110) may form a lower exterior of the camera device. The base (110) may be coupled with a cover (120). The base (110) may be coupled with a side plate (122) of the cover (120). The base (110) may support a carrier (340). The base (110) may support a housing (310). The base (110) may support a sensor base (320).

[0090] The base (110) may include a groove (111). The groove (111) may be a fixed substrate receiving groove. The groove (111) may be formed on the lower surface of the base (110). The groove (111) may be formed concavely on the lower surface of the base (110). The lower portion (132) of the fixed substrate (130) may be placed in the groove (111). The depth of the groove (111) may correspond to the thickness of the lower portion (132) of the fixed substrate (130).

[0091] The base (110) may include a bottom plate. The base (110) may include a side plate. The base (110) may include a plurality of side plates. The base (110) may include a side plate extending upward from the bottom plate. The base (110) may include four side plates. The base (110) may include a bottom plate, a first side plate and a second side plate positioned opposite each other, and a third side plate and a fourth side plate positioned opposite each other.

[0092] The camera device may include a cover (120). The fixing member may include the cover (120). The cover (120) may be disposed on the base (110). The cover (120) may be disposed on the base (110). The cover (120) may be coupled to the base (110). The cover (120) may be fixed to the base (110). The cover (120) may accommodate a carrier (340) therein. The cover (120) may accommodate a housing (310) therein. The cover (120) may accommodate a frame (330) therein. The cover (120) may accommodate a sensor base (320) therein. The cover (120) may be a shield member. The cover (120) may be a shield can.

[0093] The cover (120) may include a top plate (121). The top plate (121) may include a hole through which light passes. The top plate (121) may function as an upper stopper for the AF moving unit. That is, when the carrier (340) moves upward, the carrier (340) may come into contact with the top plate (121).

[0094] The cover (120) may include a side plate (122). The side plate (122) may extend from the top plate (121). The side plate (122) may be disposed on the base (110). The side plate (122) may be disposed on a step portion that protrudes from the lower portion of the outer surface of the base (110). The side plate (122) may include a plurality of side plates. The side plate (122) may include four side plates. The side plate (122) may include a first side plate and a second side plate that are disposed opposite each other, and a third side plate and a fourth side plate that are disposed opposite each other.

[0095] The camera device may include a fixed substrate (130). The fixed portion may include the fixed substrate (130). The fixed substrate (130) may be disposed on the base (110). The fixed substrate (130) may include a circuit board. The fixed substrate (130) may include a flexible printed circuit board. The fixed substrate (130) may include a flexible printed circuit board (FPCB). The fixed substrate (130) may be electrically connected to the outside. The fixed substrate (130) may supply current to the coil, the sensor, the driver IC, and the gyro sensor.

[0096] The fixed substrate (130) may include a terminal (131). The terminal (131) may be formed on the outer surface of the fixed substrate (130). The terminal (131) may include a plurality of terminals. The terminal (131) may be formed on the outer surface of the first side plate (133). The terminal (131) may be electrically connected to an external component.

[0097] The fixed substrate (130) may include a lower portion (132). An OIS-yaw coil (532) may be placed on the lower portion (132). An OIS-pitch coil (542) may be placed on the lower portion (132). The lower portion (132) may be placed on the base (110).

[0098] The fixed substrate (130) may include a first side plate (133). An OIS-x coil (512) may be arranged on the first side plate (133). The first side plate (133) may be arranged on a side surface of the base (110). The first side plate (133) may be connected to the lower plate (132). The first side plate (133) may be bent and extended from the lower plate (132).

[0099] The fixed substrate (130) may include a second side plate (134). The second side plate (134) may be arranged on the opposite side of the first side plate (133). An OIS-y coil (522) may be arranged on the second side plate (134).

[0100] The fixed substrate (130) may include a third side plate (135). The third side plate (135) may connect the first side plate (133) and the second side plate (134). An AF coil (420) may be arranged on the third side plate (135). The portion where the third side plate (135) and the first side plate (133) are connected and the portion where the third side plate (135) and the second side plate (134) are connected may be formed by bending.

[0101] The camera device may include a gyro sensor (140). The fixed part may include the gyro sensor (140). The gyro sensor (140) may be placed on the fixed substrate (130). The gyro sensor (140) may be placed on the lower part (132) of the fixed substrate (130). The gyro sensor (140) may detect a user's hand tremor, etc. The user's hand tremor, etc. detected by the gyro sensor (140), may be compensated for by the driving part.

[0102] The camera device may include a moving part. The moving part may be movable relative to the fixed part. The moving part may be movably arranged relative to the fixed part. The moving part may be moved by a driving part.

[0103] The camera device may include an OIS moving unit that moves when the OIS is driven. The camera device may include a tilt moving unit. The OIS moving unit may include a tilt moving unit. The camera device may include a shift moving unit. The OIS moving unit may include a shift moving unit. The tilt moving unit may include an image sensor (220) and a lens. That is, when the tilt is driven, the image sensor (220) and the lens may move together. In other words, it may be driven in a module tilt manner. The shift moving unit may include a lens. That is, when the shift is driven, the image sensor (220) is relatively fixed and only the lens may move. In other words, it may be driven in a lens shift manner.

[0104] The camera device may include an AF moving unit that moves during AF operation. The AF moving unit may include a lens. That is, during AF operation, the image sensor is relatively fixed and only the lens can move.

[0105] The camera device may include a sensor substrate assembly (200). The sensor substrate assembly (200) may be movably arranged on a base (110). The sensor substrate assembly (200) may be tilt-driven. The sensor substrate assembly (200) may support a housing (310). The sensor substrate assembly (200) may support a carrier (340).

[0106] The camera device may include a sensor substrate (210). The sensor substrate assembly (200) may include the sensor substrate (210). The sensor substrate (210) may be disposed on a base (110). The sensor substrate (210) may be disposed on a sensor base (320). The sensor substrate (210) may movably support an image sensor (220). The sensor substrate (210) may supply power to the image sensor (220). The sensor substrate (210) may movably support the image sensor (220) relative to the base (110) through a bent portion.

[0107] The sensor substrate (210) may include a body portion (211). An image sensor (220) may be arranged in the body portion (211). The body portion (211) may be arranged perpendicular to the optical axis. The body portion (211) may be arranged in a sensor base (320).

[0108] The camera device may include a side substrate (212). The sensor substrate (210) may include the side substrate (212). The side substrate (212) may be connected to the sensor substrate (210). The side substrate (212) may be formed integrally with the sensor substrate (210). The side substrate (212) may be bent and extended from the sensor substrate (210). The side substrate (212) may be disposed on a side surface of the housing (310). The side substrate (212) may be disposed on a first side surface of the housing (310). An AF coil (420) may be disposed on the side substrate (212). An AF sensor (430) may be disposed on the side substrate (212).

[0109] The sensor substrate (210) may include a bending portion (212a). The bending portion (212a) may be formed between the body portion (211) and the side substrate (212). The bending portion (212a) may have a curvature.

[0110] The sensor substrate (210) may include a hole (212b). The hole (212b) may be formed in the bending portion (212a).

[0111] Since the AF coil (420) is located in the moving part, a U-shaped folded portion (212a) may be included to minimize the resistance of the sensor substrate (210) when driving the y-axis. The U-shaped folded portion (212a) may have a hole (212b) as a partial cut section to minimize the resistance for driving the y-axis.

[0112] The sensor substrate (210) may include a folded portion (213). The folded portion (213) may be disposed between the base (110) and the housing (310). The folded portion (213) may have a folded shape so that the sensor substrate (210) can movably support the image sensor (220). The folded portion (213) may be formed so that the sensor substrate (210) does not interfere with the base (110) when the image sensor (220) moves. The folded portion (213) of the sensor substrate (210) may be disposed so that the image sensor (220) can move relative to the base (110). The folded portion (213) may extend from the body portion (211). The folded portion (213) may connect the body portion (211) and the connector coupling portion (214). The bending portion (213) can be bent multiple times. A stiffener (230) that maintains a shape can be placed on at least one portion of the bending portion (213). The stiffener (230) can be placed on a portion of the bending portion (213) of the sensor substrate (210).

[0113] In the present embodiment, in order to enable smooth operation in the x-axis direction, yaw direction, and pitch direction, some sections of the sensor substrate (210) may be formed as a U-shaped bending portion (213). In addition, a stiffener (230) may be applied to enable smooth operation in the yaw and pitch directions. In order to fold the sensor substrate (210), some sections of the base (110) may have protruding ribs. That is, the base (110) may include a protrusion positioned below the stiffener (230).

[0114] That is, in the present embodiment, the sensor substrate (210) may include a bending portion (212a) and a hole (212b) for y-axis driving. In addition, the sensor substrate (210) may include a bending portion (213) and a stiffener (230) for x-axis, yaw, and pitch driving.

[0115] The sensor substrate (210) may include a connector coupling portion (214). The connector coupling portion (214) may protrude outward. A connector (215) for coupling with the outside may be arranged in the connector coupling portion (214).

[0116] The camera device may include a lens. The lens may be placed on a carrier (340). The lens may be coupled to the carrier (340). The lens may be fixed to the carrier (340). The lens may be adhesively bonded to the carrier (340). The lens may include multiple lenses. The lens may include five or six lenses. The lens may include seven or more lenses. The lens may be coupled to a lens barrel. In this case, the lens barrel may be coupled to the carrier (340). The lens barrel may be screw-coupled to the carrier (340). Alternatively, the lens barrel may be screw-coupled to the carrier (340) using an adhesive. The lens may move integrally with the carrier (340).

[0117] The camera device may include an image sensor (220). The sensor substrate assembly (200) may include the image sensor (220). Light passing through a lens and a filter (350) may be incident on the image sensor (220) to form an image. The image sensor (220) may be disposed on the sensor substrate (210). The image sensor (220) may be disposed on the sensor substrate (210). The image sensor (220) may be coupled to the sensor substrate (210). The image sensor (220) may be fixed to the sensor substrate (210). The image sensor (220) may be soldered to the sensor substrate (210). The image sensor (220) may be mounted on the sensor substrate (210). The image sensor (220) may be electrically connected to the sensor substrate (210). For example, the image sensor (220) may be coupled to the sensor substrate (210) by surface mounting technology (SMT). Alternatively, the image sensor (220) may be coupled to the sensor substrate (210) by flip chip technology. The image sensor (220) may be arranged so that its optical axis is aligned with that of the lens. That is, the optical axis of the image sensor (220) and the optical axis of the lens may be aligned. The image sensor (220) may convert light irradiated to an effective image area of ​​the image sensor (220) into an electrical signal. The image sensor (220) may include any one of a charge coupled device (CCD), a metal oxide semiconductor (MOS), a CPD, and a CID.

[0118] The camera device may include a stiffener (230). The sensor substrate assembly (200) may include a stiffener (230). The stiffener (230) may be positioned on a bent portion of the sensor substrate (210) to maintain a bent shape. The stiffener (230) may be positioned on the bent portion (213) of the sensor substrate (210).

[0119] The stiffener (230) may include a bend portion (231). The bend portion (231) may be formed in a shape corresponding to the bend portion (213) of the sensor substrate (210). The stiffener (230) may include a shape that is bent at least twice.

[0120] The stiffener (230) may include a hole (232). The hole (232) may be formed to penetrate the stiffener (230). The hole (232) may be formed in the bend (213).

[0121] The camera device may include a housing (310). The housing (310) may be disposed on the sensor substrate (210). The housing (310) may be disposed on the base (110). The housing (310) may be disposed on the moving plate (660). The housing (310) may be disposed on the sensor base (320). The housing (310) may be disposed on the frame (330). The housing (310) may be disposed within the cover (120). The housing (310) may be disposed on the outside of the carrier (340). The housing (310) may be disposed between the carrier (340) and the cover (120).

[0122] The camera device may include a sensor base (320). An image sensor (220) may be fixed to the sensor base (320). A sensor substrate (210) may be disposed on the sensor base (320). The sensor base (320) may be disposed on the base (110). The sensor base (320) may be disposed between the sensor substrate (210) and the base (110). The sensor base (320) may be disposed on the moving plate (660). The sensor base (320) may be disposed between the housing (310) and the base (320). The sensor base (320) may be disposed between the frame (330) and the moving plate (660). The sensor base (320) may be disposed inside the cover (120).

[0123] The camera device may include a frame (330). The frame (330) may be disposed between the sensor base (320) and the housing (310). The frame (330) may be disposed on the sensor base (320). The frame (330) may be disposed on the base (110). The frame (330) may be disposed on the moving plate (660). The frame (330) may be disposed under the housing (310). The frame (330) may be disposed within the cover (120).

[0124] The camera device may include a carrier (340). The carrier (340) may be placed within the housing (310). The carrier (340) may be placed on the sensor substrate (210). The carrier (340) may be placed on the base (110). The carrier (340) may be placed on the moving plate (660). The carrier (340) may be placed on the sensor base (320). The carrier (340) may be placed on the frame (330). The carrier (340) may be placed within the cover (120).

[0125] The camera device may include a filter (350). The filter (350) may block light of a specific frequency band from passing through the lens from entering the image sensor (220). The filter (350) may be arranged perpendicular to the optical axis. The filter (350) may be arranged between the lens and the image sensor (220). The filter (350) may be arranged in the housing (310). The filter (350) may be arranged on the lower surface of the housing (310). The filter (350) may include an infrared filter. The infrared filter may block light in the infrared region from entering the image sensor (220). The filter (350) may include an infrared reflective filter. The filter (350) may include an infrared absorbing filter.

[0126] The camera device may include a driving unit. The driving unit may move the moving unit relative to the fixed unit. The driving unit may move the moving unit through electromagnetic interaction. The driving unit may include a magnet and a coil.

[0127] The camera device may include an AF driving unit (400). The AF driving unit (400) may move the AF moving unit relative to the fixed unit. The AF driving unit (400) may move the carrier (340) relative to the housing (310). The AF driving unit (400) may move the carrier (340) in the optical axis direction. The AF driving unit (400) may move the lens in the optical axis direction. The AF driving unit (400) may move the carrier (340) through electromagnetic interaction. The AF driving unit (400) may include a magnet and a coil. The AF driving unit (400) may include a driving magnet and a driving coil. The AF driving units (400) may overlap each other in the y-axis direction. Alternatively, the AF driving units (400) may overlap each other in the x-axis direction. The y-axis direction may be perpendicular to the x-axis direction. The y-axis direction can intersect the x-axis direction.

[0128] The camera device may include an AF magnet (410). The AF driving unit (400) may include the AF magnet (410). The AF magnet (410) may be an "AF magnet." The AF magnet (410) may be disposed on the carrier (340). The AF magnet (410) may be coupled to the carrier (340). The AF magnet (410) may be fixed to the carrier (340). The AF magnet (410) may be adhesively bonded to the carrier (340). The AF magnet (410) may move integrally with the carrier (340). The AF magnet (410) may be disposed between the carrier (340) and the AF coil (420). The AF magnet (410) may be disposed on the housing (310). The AF magnet (410) can be placed on the base (110). The AF magnet (410) can be placed inside the cover (120).

[0129] The AF magnet (410) may be a permanent magnet. The AF magnet (410) may be a four-pole magnet. The AF magnet (410) may be a four-pole magnetized magnet. The AF magnet (410) may include a first magnet portion including a N pole and a S pole, a second magnet portion including a S pole and a N pole, and a neutral portion between the first magnet portion and the second magnet portion. The AF magnet (410) may include a N pole and a S pole on a surface facing the AF coil (420).

[0130] The AF magnet (410) can face the AF coil (420). The AF magnet (410) can face the AF coil (420). The AF magnet (410) can be arranged to correspond to the AF coil (420). The AF magnet (410) can be arranged at a position corresponding to the AF coil (420). The AF magnet (410) can interact with the AF coil (420). The AF magnet (410) can electromagnetically interact with the AF coil (420). The AF magnet (410) can overlap the AF coil (420) in a direction perpendicular to the optical axis. The AF magnet (410) can overlap the AF coil (420) in the y-axis direction.

[0131] The AF magnet (410) is movable. The AF magnet (410) is movable in the optical axis direction. The AF magnet (410) is movable upward in the optical axis direction. The AF magnet (410) is movable downward in the optical axis direction. When current is applied to the AF coil (420), the AF magnet (410) is movable. The AF magnet (410) is movable through interaction with the AF coil (420). The AF magnet (410) is movable together with the carrier (340). The AF magnet (410) is movable together with the lens. Even when the AF magnet (410) is movable, the distance between the AF magnet (410) and the AF coil (420) in the y-axis direction can be maintained constant.

[0132] The camera device may include an AF coil (420). The AF driving unit (400) may include the AF coil (420). The AF coil (420) may be disposed on the sensor substrate (210). The AF coil (420) may be coupled to the sensor substrate (210). The AF coil (420) may be fixed to the sensor substrate (210). The AF coil (420) may be soldered to the sensor substrate (210). The AF coil (420) may be disposed on the housing (310). The AF coil (420) may be coupled to the housing (310). The AF coil (420) may be fixed to the housing (310). The AF coil (420) may be bonded to the housing (310) with an adhesive. The AF coil (420) may move integrally with the housing (310). The AF coil (420) may be placed between the carrier (340) and the side plate (122) of the cover (120). The AF coil (420) may be placed between the AF magnet (410) and the side plate (122) of the cover (120). The AF coil (420) may be placed on the base (110). The AF coil (420) may be placed inside the cover (120).

[0133] The AF coil (420) may be formed in a ring shape. The AF coil (420) may include a first portion facing the N pole of the AF magnet (410) and a second portion facing the S pole of the AF magnet (410). The first and second portions of the AF coil (420) may overlap in the optical axis direction. The second portion of the AF coil (420) may be positioned above the first portion.

[0134] Current can be applied to the AF coil (420). When current is applied to the AF coil (420), an electromagnetic field can be formed around the AF coil (420). A forward current can be applied to the AF coil (420). A reverse current can be applied to the AF coil (420). The AF coil (420) can move the AF magnet (410). The AF coil (420) can be relatively fixed when the AF magnet (410) moves.

[0135] The camera device may include an AF sensor (430). The AF driving unit (400) may include the AF sensor (430). The AF sensor (430) may be disposed on the sensor substrate (210). The AF sensor (430) may be coupled to the sensor substrate (210). The AF sensor (430) may be fixed to the sensor substrate (210). The AF sensor (430) may be soldered to the sensor substrate (210). The AF sensor (430) may be disposed on the housing (310). The AF sensor (430) may be coupled to the housing (310). The AF sensor (430) may be fixed to the housing (310). The AF sensor (430) may move integrally with the housing (310). The AF sensor (430) may be disposed within the AF coil (420). Alternatively, the AF sensor (430) may be positioned outside the AF coil (420). The AF sensor (430) may be positioned on the base (110). The AF sensor (430) may be positioned within the cover (120).

[0136] The AF sensor (430) may include a Hall sensor. The AF sensor (430) may detect the AF magnet (410). The AF sensor (430) may detect the magnetic force of the AF magnet (410). The AF sensor (430) may detect the movement or position of the carrier (340). The AF sensor (430) may detect the movement or position of the lens. The AF sensor (430) may be positioned at a position corresponding to the AF magnet (410). The AF sensor (430) may overlap the AF magnet (410) in a direction perpendicular to the optical axis. The AF sensor (430) may overlap the AF magnet (410) in the y-axis direction. The AF sensor (430) may overlap the neutral portion of the AF magnet (410) in the y-axis direction.

[0137] The camera device may include an AF driver IC (440). The AF driving unit (400) may include the AF driver IC (440). The AF driver IC (440) may be disposed on a sensor substrate (210). The AF driver IC (440) may be coupled to the sensor substrate (210). The AF driver IC (440) may be fixed to the sensor substrate (210). The AF driver IC (440) may be soldered to the sensor substrate (210). The AF driver IC (440) may be disposed on a housing (310). The AF driver IC (440) may be coupled to the housing (310). The AF driver IC (440) may be fixed to the housing (310). The AF driver IC (440) may be movable integrally with the housing (310). The AF driver IC (440) may be placed on the base (110). The AF driver IC (440) may be placed inside the cover (120).

[0138] The AF driver IC (440) can supply current to the AF coil (420). The AF driver IC (440) can be electrically connected to the AF coil (420). The AF driver IC (440) can be electrically connected to the AF sensor (430).

[0139] The camera device may include an optical image stabilization (OIS) actuator. The OIS actuator may move the OIS moving unit relative to the fixed unit. The OIS actuator may move the OIS moving unit in a direction perpendicular to the optical axis. The OIS actuator may tilt the OIS moving unit. The OIS actuator may move the OIS moving unit through electromagnetic interaction. The OIS actuator may include a magnet and a coil.

[0140] The camera device may include an OIS-x driving unit (510). The OIS-x driving unit (510) may move the OIS-x moving unit relative to the fixed unit. The OIS-x driving unit (510) may move the housing (310) in the x-axis direction. The OIS-x driving unit (510) may move the carrier (340) in the x-axis direction. The OIS-x driving unit (510) may move the lens in the x-axis direction. The OIS-x driving unit (510) may move the housing (310) through electromagnetic interaction. The OIS-x driving unit (510) may include a magnet and a coil. The OIS-x driving unit (510) may include a driving magnet and a driving coil. The OIS-x driving units (510) may overlap each other in the x-axis direction. Alternatively, the OIS-x driving units (510) may overlap each other in the y-axis direction.

[0141] The camera device may include an OIS-x magnet (511). The OIS-x driving unit (510) may include the OIS-x magnet (511). The OIS-x magnet (511) may be an “OIS-x magnet.” The OIS-x magnet (511) may be disposed in a housing (310). The OIS-x magnet (511) may be coupled to the housing (310). The OIS-x magnet (511) may be fixed to the housing (310). The OIS-x magnet (511) may be adhesively bonded to the housing (310). The OIS-x magnet (511) may be movable as one piece with the housing (310). The OIS-x magnet (511) may be disposed between the housing (310) and the OIS-x coil (512). The OIS-x magnet (511) may be placed between the carrier (340) and the OIS-x coil (512). The OIS-x magnet (511) may be placed on the housing (310). The OIS-x magnet (511) may be placed on the base (110). The OIS-x magnet (511) may be placed inside the cover (120).

[0142] The OIS-x magnet (511) may be a permanent magnet. The OIS-x magnet (511) may be a two-pole magnet. The OIS-x magnet (511) may be formed with only two polarities. The OIS-x magnet (511) may include a north pole and a south pole. The side of the OIS-x magnet (511) facing the OIS-x coil (512) may be the north pole. Alternatively, the side of the OIS-x magnet (511) facing the OIS-x coil (512) may be the south pole. That is, the side of the OIS-x magnet (511) facing the OIS-x coil (512) may be formed with a single polarity. The entire area of ​​the first side of the OIS-x magnet (511) facing the OIS-x coil (512) may have a single polarity.

[0143] The OIS-x magnet (511) can face the OIS-x coil (512). The OIS-x magnet (511) can face the OIS-x coil (512). The OIS-x magnet (511) can be arranged to correspond to the OIS-x coil (512). The OIS-x magnet (511) can be arranged at a position corresponding to the OIS-x coil (512). The OIS-x magnet (511) can interact with the OIS-x coil (512). The OIS-x magnet (511) can electromagnetically interact with the OIS-x coil (512). The OIS-x magnet (511) can overlap the OIS-x coil (512) in a direction perpendicular to the optical axis. The OIS-x magnet (511) can be overlapped with the OIS-x coil (512) in the x-axis direction.

[0144] The OIS-x magnet (511) is movable. The OIS-x magnet (511) is movable in the x-axis direction. The OIS-x magnet (511) is movable to one side in the x-axis direction. The OIS-x magnet (511) is movable to the other side in the x-axis direction. When current is applied to the OIS-x coil (512), the OIS-x magnet (511) is movable. The OIS-x magnet (511) is movable through interaction with the OIS-x coil (512). The OIS-x magnet (511) is movable together with the housing (310). The OIS-x magnet (511) is movable together with the carrier (340). The OIS-x magnet (511) is movable together with the lens. When the OIS-x magnet (511) moves, the distance between the OIS-x magnet (511) and the OIS-x coil (512) in the x-axis direction may change.

[0145] When current is applied to the OIS-x coil (512), the OIS-x magnet (511) can move in the x-axis direction toward or away from the OIS-x coil (512).

[0146] The camera device may include an OIS-x coil (512). The OIS-x driving unit (510) may include the OIS-x coil (512). The OIS-x coil (512) may be disposed on a fixed substrate (130). The OIS-x coil (512) may be coupled to the fixed substrate (130). The OIS-x coil (512) may be fixed to the fixed substrate (130). The OIS-x coil (512) may be soldered to the fixed substrate (130). The OIS-x coil (512) may be disposed on a base (110). The OIS-x coil (512) may be coupled to the base (110). The OIS-x coil (512) may be fixed to the base (110). The OIS-x coil (512) can be adhesively bonded to the base (110). The OIS-x coil (512) can be disposed between the carrier (340) and the side plate (122) of the cover (120). The OIS-x coil (512) can be disposed between the housing (310) and the side plate (122) of the cover (120). The OIS-x coil (512) can be disposed between the OIS-x magnet (511) and the side plate (122) of the cover (120). The OIS-x coil (512) can be disposed on the base (110). The OIS-x coil (512) can be disposed inside the cover (120). The OIS-x coil (512) can be disposed in the second direction of the housing (310).

[0147] The OIS-x coil (512) may be formed in a ring shape. The OIS-x coil (512) may face the N pole of the OIS-x magnet (511). Alternatively, the OIS-x coil (512) may face the S pole of the OIS-x magnet (511).

[0148] A current can be applied to the OIS-x coil (512). When a current is applied to the OIS-x coil (512), an electromagnetic field can be formed around the OIS-x coil (512). A forward current can be applied to the OIS-x coil (512). A reverse current can be applied to the OIS-x coil (512). The OIS-x coil (512) can move the OIS-x magnet (511). The OIS-x coil (512) can be relatively fixed when the OIS-x magnet (511) moves.

[0149] The camera device may include an OIS-x sensor (513). The OIS-x driver (510) may include the OIS-x sensor (513). The OIS-x sensor (513) may be disposed on a fixed substrate (130). The OIS-x sensor (513) may be coupled to the fixed substrate (130). The OIS-x sensor (513) may be fixed to the fixed substrate (130). The OIS-x sensor (513) may be soldered to the fixed substrate (130). The OIS-x sensor (513) may be disposed on a base (110). The OIS-x sensor (513) may be coupled to the base (110). The OIS-x sensor (513) may be fixed to the base (110). The OIS-x sensor (513) may be disposed within the OIS-x coil (512). Alternatively, the OIS-x sensor (513) may be placed on the outside of the OIS-x coil (512). The OIS-x sensor (513) may be placed on the base (110). The OIS-x sensor (513) may be placed within the cover (120).

[0150] The OIS-x sensor (513) may include a Hall sensor. The OIS-x sensor (513) may detect the OIS-x magnet (511). The OIS-x sensor (513) may detect the magnetic force of the OIS-x magnet (511). The OIS-x sensor (513) may detect movement or position of the housing (310). The OIS-x sensor (513) may detect movement or position of the carrier (340). The OIS-x sensor (513) may detect movement or position of the lens. The OIS-x sensor (513) may be positioned corresponding to the OIS-x magnet (511). The OIS-x sensor (513) may overlap the OIS-x magnet (511) in a direction perpendicular to the optical axis. The OIS-x sensor (513) can be overlapped with the OIS-x magnet (511) in the x-axis direction.

[0151] The camera device may include an OIS-y actuator (520). The OIS-y actuator (520) may move the OIS-y moving unit relative to the fixed unit. The OIS-y actuator (520) may move the housing (310) in the y-axis direction. The OIS-y actuator (520) may move the frame (330) in the y-axis direction. The OIS-y actuator (520) may move the carrier (340) in the y-axis direction. The OIS-y actuator (520) may move the lens in the y-axis direction. The OIS-y actuator (520) may move the housing (310) through electromagnetic interaction. The OIS-y actuator (520) may include a magnet and a coil. The OIS-y actuator (520) may include a driving magnet and a driving coil. The OIS-y driving units (520) may overlap each other in the x-axis direction. Alternatively, the OIS-y driving units (520) may overlap each other in the y-axis direction.

[0152] The camera device may include an OIS-y magnet (521). The OIS-y driving unit (520) may include the OIS-y magnet (521). The OIS-y magnet (521) may be an “OIS-y magnet.” The OIS-y magnet (521) may be disposed in the housing (310). The OIS-y magnet (521) may be coupled to the housing (310). The OIS-y magnet (521) may be fixed to the housing (310). The OIS-y magnet (521) may be adhesively bonded to the housing (310). The OIS-y magnet (521) may move integrally with the housing (310). The OIS-y magnet (521) may be disposed between the housing (310) and the OIS-y coil (522). The OIS-y magnet (521) may be placed between the carrier (340) and the OIS-y coil (522). The OIS-y magnet (521) may be placed on the housing (310). The OIS-y magnet (521) may be placed on the base (110). The OIS-y magnet (521) may be placed inside the cover (120).

[0153] The OIS-y magnet (521) may be a permanent magnet. The OIS-y magnet (521) may be a four-pole magnet. The OIS-y magnet (521) may be a four-pole magnetized magnet. The OIS-y magnet (521) may include a first magnet portion including a N pole and a S pole, a second magnet portion including a S pole and a N pole, and a neutral portion between the first magnet portion and the second magnet portion. The OIS-y magnet (521) may include a N pole and a S pole on a surface facing the OIS-y coil (522). The OIS-y magnet (521) may include a N pole and a S pole on a first surface facing the OIS-y coil (522).

[0154] The OIS-y magnet (521) can face the OIS-y coil (522). The OIS-y magnet (521) can face the OIS-y coil (522). The OIS-y magnet (521) can be arranged to correspond to the OIS-y coil (522). The OIS-y magnet (521) can be arranged at a position corresponding to the OIS-y coil (522). The OIS-y magnet (521) can interact with the OIS-y coil (522). The OIS-y magnet (521) can electromagnetically interact with the OIS-y coil (522). The OIS-y magnet (521) can overlap the OIS-y coil (522) in a direction perpendicular to the optical axis. The OIS-y magnet (521) can be overlapped with the OIS-y coil (522) in the x-axis direction. The OIS-y coil (522) can be placed in the third-side direction of the housing (310). At this time, the third-side direction of the housing (310) can be opposite to the second-side direction of the housing (310).

[0155] The OIS-x coil (512), the OIS-x magnet (511), the OIS-y magnet (521), and the OIS-y coil (522) can be overlapped in the x-axis direction.

[0156] The OIS-y magnet (521) is movable. The OIS-y magnet (521) is movable in the y-axis direction. The OIS-y magnet (521) is movable in one direction in the y-axis direction. The OIS-y magnet (521) is movable in the other direction in the y-axis direction. When current is applied to the OIS-y coil (522), the OIS-y magnet (521) is movable. The OIS-y magnet (521) is movable through interaction with the OIS-y coil (522). The OIS-y magnet (521) is movable together with the housing (310). The OIS-y magnet (521) is movable together with the frame (330). The OIS-y magnet (521) is movable together with the carrier (340). The OIS-y magnet (521) can move together with the lens. Even when the OIS-y magnet (521) moves, the distance between the OIS-y magnet (521) and the OIS-y coil (522) in the x-axis direction can be maintained constant.

[0157] When current is applied to the OIS-y coil (522), the distance in the x-axis direction between the OIS-y magnet (521) and the OIS-y coil (522) does not change, and the OIS-y magnet (521) can move in the y-axis direction.

[0158] The OIS-y magnet (521) may be placed on the opposite side of the OIS-x magnet (511) with respect to the lens. The OIS-y magnet (521) may be placed on the opposite side of the OIS-x magnet (511) with respect to the optical axis.

[0159] The camera device may include an OIS-y coil (522). The OIS-y driving unit (520) may include the OIS-y coil (522). The OIS-y coil (522) may be disposed on a fixed substrate (130). The OIS-y coil (522) may be coupled to the fixed substrate (130). The OIS-y coil (522) may be fixed to the fixed substrate (130). The OIS-y coil (522) may be soldered to the fixed substrate (130). The OIS-y coil (522) may be disposed on a base (110). The OIS-y coil (522) may be coupled to the base (110). The OIS-y coil (522) may be fixed to the base (110). The OIS-y coil (522) may be adhesively bonded to the base (110). The OIS-y coil (522) may be disposed between the carrier (340) and the side plate (122) of the cover (120). The OIS-y coil (522) may be disposed between the housing (310) and the side plate (122) of the cover (120). The OIS-y coil (522) may be disposed between the OIS-y magnet (521) and the side plate (122) of the cover (120). The OIS-y coil (522) may be disposed on the base (110). The OIS-y coil (522) may be disposed inside the cover (120).

[0160] The OIS-y coil (522) may be formed in a ring shape. The OIS-y coil (522) may include a plurality of coils. The OIS-y coil (522) may include two coils. The OIS-y coil (522) may include a third-first coil, a portion of which faces the N pole of the first surface of the OIS-y magnet (521). The OIS-y coil (522) may include a third-second coil, a portion of which faces the S pole of the first surface of the OIS-y magnet (521). Alternatively, the OIS-y coil (522) may be formed as a single coil.

[0161] A current may be applied to the OIS-y coil (522). When a current is applied to the OIS-y coil (522), an electromagnetic field may be formed around the OIS-y coil (522). A forward current may be applied to the OIS-y coil (522). A reverse current may be applied to the OIS-y coil (522). The OIS-y coil (522) may move the OIS-y magnet (521). The OIS-y coil (522) may be relatively fixed when the OIS-y magnet (521) moves.

[0162] The camera device may include an OIS-y sensor (523). The OIS-y driving unit (520) may include the OIS-y sensor (523). The OIS-y sensor (523) may be disposed on a fixed substrate (130). The OIS-y sensor (523) may be coupled to the fixed substrate (130). The OIS-y sensor (523) may be fixed to the fixed substrate (130). The OIS-y sensor (523) may be soldered to the fixed substrate (130). The OIS-y sensor (523) may be disposed on a base (110). The OIS-y sensor (523) may be coupled to the base (110). The OIS-y sensor (523) may be fixed to the base (110). The OIS-y sensor (523) may be positioned on the outside of the OIS-y coil (522). The OIS-y sensor (523) may be positioned between two OIS-y coils (522). Alternatively, the OIS-y sensor (523) may be positioned within the OIS-y coil (522). The OIS-y sensor (523) may be positioned on the base (110). The OIS-y sensor (523) may be positioned within the cover (120).

[0163] The OIS-y sensor (523) may include a Hall sensor. The OIS-y sensor (523) may detect the OIS-y magnet (521). The OIS-y sensor (523) may detect the magnetic force of the OIS-y magnet (521). The OIS-y sensor (523) may detect movement or position of the housing (310). The OIS-y sensor (523) may detect movement or position of the carrier (340). The OIS-y sensor (523) may detect movement or position of the lens. The OIS-y sensor (523) may be positioned corresponding to the OIS-y magnet (521). The OIS-y sensor (523) may overlap the OIS-y magnet (521) in a direction perpendicular to the optical axis. The OIS-y sensor (523) can be overlapped with the OIS-y magnet (521) in the x-axis direction.

[0164] The camera device may include an OIS-yaw drive unit (530). The OIS-yaw drive unit (530) can move the OIS-yaw moving unit relative to the fixed unit. The OIS-yaw drive unit (530) can move the sensor base (320) in the yaw direction. The OIS-yaw drive unit (530) can move the housing (310) in the yaw direction. The OIS-yaw drive unit (530) can move the carrier (340) in the yaw direction. The OIS-yaw drive unit (530) can move the image sensor (220) and the lens in the yaw direction. The OIS-yaw drive unit (530) can tilt the image sensor (220) and the lens together about a first axis. The OIS-yaw drive unit (530) can move the sensor base (320) through an electromagnetic interaction force. The OIS-yaw drive unit (530) may include a magnet and a coil. The OIS-yaw drive unit (530) may include a drive magnet and a drive coil. The OIS-yaw drive units (530) may overlap each other in the optical axis direction.

[0165] The camera device may include an OIS-yaw magnet (531). The OIS-yaw drive unit (530) may include the OIS-yaw magnet (531). The OIS-yaw magnet (531) may be an “OIS-yaw magnet.” The OIS-yaw magnet (531) may be disposed on the sensor base (320). The OIS-yaw magnet (531) may be coupled to the sensor base (320). The OIS-yaw magnet (531) may be fixed to the sensor base (320). The OIS-yaw magnet (531) may be adhesively bonded to the sensor base (320). The OIS-yaw magnet (531) may be movable integrally with the sensor base (320). The OIS-yaw magnet (531) may be movable integrally with the image sensor (220). The OIS-yaw magnet (531) can move integrally with the lens. The OIS-yaw magnet (531) can be placed between the sensor base (320) and the OIS-yaw coil (532). The OIS-yaw magnet (531) can be placed between the housing (310) and the OIS-yaw coil (532). The OIS-yaw magnet (531) can be placed on the base (110). The OIS-yaw magnet (531) can be placed inside the cover (120).

[0166] The OIS-yaw magnet (531) may be a permanent magnet. The OIS-yaw magnet (531) may be a four-pole magnet. The OIS-yaw magnet (531) may be a four-pole magnetized magnet. The OIS-yaw magnet (531) may include a first magnet portion including a N pole and a S pole, a second magnet portion including a S pole and a N pole, and a neutral portion between the first magnet portion and the second magnet portion. The OIS-yaw magnet (531) may include a N pole and a S pole on a side facing the OIS-yaw coil (532).

[0167] The OIS-yaw magnet (531) can face the OIS-yaw coil (532). The OIS-yaw magnet (531) can face the OIS-yaw coil (532). The OIS-yaw magnet (531) can be arranged to correspond to the OIS-yaw coil (532). The OIS-yaw magnet (531) can be arranged at a position corresponding to the OIS-yaw coil (532). The OIS-yaw magnet (531) can interact with the OIS-yaw coil (532). The OIS-yaw magnet (531) can electromagnetically interact with the OIS-yaw coil (532). The OIS-yaw magnet (531) can overlap the OIS-yaw coil (532) in the optical axis direction.

[0168] The OIS-yaw magnet (531) is movable. The OIS-yaw magnet (531) is movable in the yaw direction. The OIS-yaw magnet (531) is movable to one side in the yaw direction. The OIS-yaw magnet (531) is movable to the other side in the yaw direction. When current is applied to the OIS-yaw coil (532), the OIS-yaw magnet (531) is movable. The OIS-yaw magnet (531) is movable through interaction with the OIS-yaw coil (532). The OIS-yaw magnet (531) is movable together with the sensor base (320). The OIS-yaw magnet (531) is movable together with the housing (310). The OIS-yaw magnet (531) is movable together with the carrier (340). The OIS-Yo magnet (531) can move together with the image sensor (220). The OIS-Yo magnet (531) can move together with the lens.

[0169] The camera device may include an OIS-yaw coil (532). The OIS-yaw drive unit (530) may include the OIS-yaw coil (532). The OIS-yaw coil (532) may be disposed on a fixed substrate (130). The OIS-yaw coil (532) may be coupled to the fixed substrate (130). The OIS-yaw coil (532) may be fixed to the fixed substrate (130). The OIS-yaw coil (532) may be soldered to the fixed substrate (130). The OIS-yaw coil (532) may be disposed on a base (110). The OIS-yaw coil (532) may be coupled to the base (110). The OIS-yaw coil (532) may be fixed to the base (110). The OIS-yaw coil (532) may be adhesively bonded to the base (110). The OIS-Yo coil (532) can be placed on the base (110). The OIS-Yo coil (532) can be placed inside the cover (120).

[0170] The OIS-yaw coil (532) may be formed in a ring shape. The OIS-yaw coil (532) may include a first portion facing the N pole of the OIS-yaw magnet (531) and a second portion facing the S pole of the OIS-yaw magnet (531). The first and second portions of the OIS-yaw coil (532) may overlap in a direction perpendicular to the optical axis.

[0171] A current can be applied to the OIS-yaw coil (532). When a current is applied to the OIS-yaw coil (532), an electromagnetic field can be formed around the OIS-yaw coil (532). A forward current can be applied to the OIS-yaw coil (532). A reverse current can be applied to the OIS-yaw coil (532). The OIS-yaw coil (532) can move the OIS-yaw magnet (531). The OIS-yaw coil (532) can be relatively fixed when the OIS-yaw magnet (531) moves.

[0172] The camera device may include an OIS-yaw sensor (533). The OIS-yaw drive unit (530) may include the OIS-yaw sensor (533). The OIS-yaw sensor (533) may be disposed on a fixed substrate (130). The OIS-yaw sensor (533) may be coupled to the fixed substrate (130). The OIS-yaw sensor (533) may be fixed to the fixed substrate (130). The OIS-yaw sensor (533) may be soldered to the fixed substrate (130). The OIS-yaw sensor (533) may be disposed on a base (110). The OIS-yaw sensor (533) may be coupled to the base (110). The OIS-yaw sensor (533) may be fixed to the base (110). The OIS-yaw sensor (533) may be disposed within the OIS-yaw coil (532). Alternatively, the OIS-yaw sensor (533) may be placed outside the OIS-yaw coil (532). The OIS-yaw sensor (533) may be placed on the base (110). The OIS-yaw sensor (533) may be placed inside the cover (120).

[0173] The OIS-yaw sensor (533) may include a Hall sensor. The OIS-yaw sensor (533) may detect the OIS-yaw magnet (531). The OIS-yaw sensor (533) may detect the magnetic force of the OIS-yaw magnet (531). The OIS-yaw sensor (533) may detect the movement or position of the sensor base (320). The OIS-yaw sensor (533) may detect the movement or position of the housing (310). The OIS-yaw sensor (533) may detect the movement or position of the carrier (340). The OIS-yaw sensor (533) may detect the movement or position of the image sensor (220). The OIS-yaw sensor (533) may detect the movement or position of the lens. The OIS-yaw sensor (533) may be positioned at a position corresponding to the OIS-yaw magnet (531). The OIS-Yo sensor (533) can be overlapped with the OIS-Yo magnet (531) in the optical axis direction.

[0174] The camera device may include an OIS pitch driving unit (540). The OIS pitch driving unit (540) can move the OIS pitch moving unit relative to the fixed unit. The OIS pitch driving unit (540) can move the sensor base (320) in the pitch direction. The OIS pitch driving unit (540) can move the housing (310) in the pitch direction. The OIS pitch driving unit (540) can move the carrier (340) in the pitch direction. The OIS pitch driving unit (540) can move the image sensor (220) and the lens in the pitch direction. The pitch driving unit (540) can tilt the image sensor (220) and the lens together about a second axis perpendicular to the first axis. The OIS pitch driving unit (540) can move the sensor base (320) through electromagnetic interaction. The OIS pitch driving unit (540) may include a magnet and a coil. The OIS pitch driving unit (540) may include a driving magnet and a driving coil. The OIS pitch driving units (540) may overlap each other in the optical axis direction.

[0175] The camera device may include an OIS-pitch magnet (541). The OIS-pitch driving unit (540) may include the OIS-pitch magnet (541). The OIS-pitch magnet (541) may be an "OIS-pitch magnet." The OIS-pitch magnet (541) may be disposed on the sensor base (320). The OIS-pitch magnet (541) may be coupled to the sensor base (320). The OIS-pitch magnet (541) may be fixed to the sensor base (320). The OIS-pitch magnet (541) may be adhesively bonded to the sensor base (320). The OIS-pitch magnet (541) may move integrally with the sensor base (320). The OIS pitch magnet (541) can be moved integrally with the image sensor (220). The OIS pitch magnet (541) can be moved integrally with the lens. The OIS pitch magnet (541) can be placed between the sensor base (320) and the OIS pitch coil (542). The OIS pitch magnet (541) can be placed between the housing (310) and the OIS pitch coil (542). The OIS pitch magnet (541) can be placed on the base (110). The OIS pitch magnet (541) can be placed inside the cover (120).

[0176] The OIS-pitch magnet (541) may be a permanent magnet. The OIS-pitch magnet (541) may be a four-pole magnet. The OIS-pitch magnet (541) may be a four-pole magnetized magnet. The OIS-pitch magnet (541) may include a first magnet portion including a north pole and a south pole, a second magnet portion including a south pole and a north pole, and a neutral portion between the first magnet portion and the second magnet portion. The OIS-pitch magnet (541) may include a north pole and a south pole on a surface facing the OIS-pitch coil (542).

[0177] The OIS-pitch magnet (541) can face the OIS-pitch coil (542). The OIS-pitch magnet (541) can face the OIS-pitch coil (542). The OIS-pitch magnet (541) can be arranged to correspond to the OIS-pitch coil (542). The OIS-pitch magnet (541) can be arranged at a position corresponding to the OIS-pitch coil (542). The OIS-pitch magnet (541) can interact with the OIS-pitch coil (542). The OIS-pitch magnet (541) can electromagnetically interact with the OIS-pitch coil (542). The OIS-pitch magnet (541) can overlap with the OIS-pitch coil (542) in the optical axis direction.

[0178] The OIS-pitch magnet (541) is movable. The OIS-pitch magnet (541) is movable in the pitch direction. The OIS-pitch magnet (541) is movable in one direction in the pitch direction. The OIS-pitch magnet (541) is movable in the other direction in the pitch direction. When current is applied to the OIS-pitch coil (542), the OIS-pitch magnet (541) is movable. The OIS-pitch magnet (541) is movable through interaction with the OIS-pitch coil (542). The OIS-pitch magnet (541) is movable together with the sensor base (320). The OIS-pitch magnet (541) is movable together with the housing (310). The OIS-pitch magnet (541) is movable together with the carrier (340). The OIS-pitch magnet (541) can move together with the image sensor (220). The OIS-pitch magnet (541) can move together with the lens.

[0179] The camera device may include an OIS-pitch coil (542). The OIS-pitch driver (540) may include the OIS-pitch coil (542). The OIS-pitch coil (542) may be disposed on a fixed substrate (130). The OIS-pitch coil (542) may be coupled to the fixed substrate (130). The OIS-pitch coil (542) may be fixed to the fixed substrate (130). The OIS-pitch coil (542) may be soldered to the fixed substrate (130). The OIS-pitch coil (542) may be disposed on a base (110). The OIS-pitch coil (542) may be coupled to the base (110). The OIS-pitch coil (542) may be fixed to the base (110). The OIS-pitch coil (542) can be adhesively bonded to the base (110). The OIS-pitch coil (542) can be placed on the base (110). The OIS-pitch coil (542) can be placed inside the cover (120).

[0180] The OIS-pitch coil (542) may be formed in a ring shape. The OIS-pitch coil (542) may include a first portion facing the N pole of the OIS-pitch magnet (541) and a second portion facing the S pole of the OIS-pitch magnet (541). The first and second portions of the OIS-pitch coil (542) may overlap in a direction perpendicular to the optical axis.

[0181] A current may be applied to the OIS-pitch coil (542). When a current is applied to the OIS-pitch coil (542), an electromagnetic field may be formed around the OIS-pitch coil (542). A forward current may be applied to the OIS-pitch coil (542). A reverse current may be applied to the OIS-pitch coil (542). The OIS-pitch coil (542) may move the OIS-pitch magnet (541). The OIS-pitch coil (542) may be relatively fixed when the OIS-pitch magnet (541) moves.

[0182] The camera device may include an OIS-pitch sensor (543). The OIS-pitch driver (540) may include the OIS-pitch sensor (543). The OIS-pitch sensor (543) may be disposed on a fixed substrate (130). The OIS-pitch sensor (543) may be coupled to the fixed substrate (130). The OIS-pitch sensor (543) may be fixed to the fixed substrate (130). The OIS-pitch sensor (543) may be soldered to the fixed substrate (130). The OIS-pitch sensor (543) may be disposed on a base (110). The OIS-pitch sensor (543) may be coupled to the base (110). The OIS-pitch sensor (543) may be fixed to the base (110). The OIS pitch sensor (543) may be positioned within the OIS pitch coil (542). Alternatively, the OIS pitch sensor (543) may be positioned on the outside of the OIS pitch coil (542). The OIS pitch sensor (543) may be positioned on the base (110). The OIS pitch sensor (543) may be positioned within the cover (120).

[0183] The OIS pitch sensor (543) may include a Hall sensor. The OIS pitch sensor (543) may detect the OIS pitch magnet (541). The OIS pitch sensor (543) may detect the magnetic force of the OIS pitch magnet (541). The OIS pitch sensor (543) may detect the movement or position of the sensor base (320). The OIS pitch sensor (543) may detect the movement or position of the housing (310). The OIS pitch sensor (543) may detect the movement or position of the carrier (340). The OIS pitch sensor (543) may detect the movement or position of the image sensor (220). The OIS pitch sensor (543) may detect the movement or position of the lens. The OIS pitch sensor (543) can be positioned corresponding to the OIS pitch magnet (541). The OIS pitch sensor (543) can overlap the OIS pitch magnet (541) in the optical axis direction.

[0184] The camera device may include an OIS driver IC (550). The OIS driver IC (550) may apply current to the OIS coil. The OIS driver IC (550) may apply current to the OIS-x coil (512), the OIS-y coil (522), the OIS-yaw coil (532), and the OIS-pitch coil (542). The OIS driver IC (550) may be electrically connected to the OIS-x coil (512), the OIS-y coil (522), the OIS-yaw coil (532), and the OIS-pitch coil (542).

[0185] The OIS driver IC (550) may include multiple driver ICs. The OIS driver IC (550) may include two driver ICs. The OIS driver IC (550) may include first and second driver ICs. One driver IC may operate up to three channels. In the present embodiment, the first and second driver ICs may each use two channels. More specifically, the first driver IC may be electrically connected to the OIS-x coil (512) and the OIS-y coil (522). The second driver IC may be electrically connected to the OIS-yaw coil (532) and the OIS-pitch coil (542).

[0186] Alternatively, the camera device may include an optical image stabilization (OIS) roll drive. The OIS roll drive may rotate the lens around the optical axis. The OIS roll drive may include a magnet and a coil.

[0187] The camera device may include a guide member. The guide member may guide the movement of the movable part. The guide member may guide the movement of the movable part in a specific direction relative to the fixed part. The guide member may include a ball.

[0188] The camera device may include an AF guide ball (610). The AF guide ball (610) may be disposed in the carrier (340). The AF guide ball (610) may be disposed in a groove of the carrier (340). The AF guide ball (610) may be disposed in the housing (310). The AF guide ball (610) may be disposed in a groove of the housing (310). The AF guide ball (610) may be disposed between the carrier (340) and the housing (310). The AF guide ball (610) may be disposed between the groove of the carrier (340) and the groove of the housing (310). The AF guide ball (610) may be in contact with the carrier (340) and the housing (310). The AF guide ball (610) may be in direct contact with the carrier (340) and the housing (310). The AF guide ball (610) can connect the carrier (340) and the housing (310). The AF guide ball (610) can directly connect the carrier (340) and the housing (310).

[0189] The AF guide ball (610) can move in the optical axis direction. The AF guide ball (610) can move in the optical axis direction within the groove of the carrier (340). The AF guide ball (610) can move in the optical axis direction within the groove of the housing (310). The AF guide ball (610) can guide the movement of the carrier (340) in the optical axis direction. The AF guide ball (610) can guide the carrier (340) to move in the optical axis direction with respect to the housing (310).

[0190] The AF guide ball (610) may be formed in a spherical shape. Alternatively, the AF guide ball (610) may be formed in a cylindrical shape. The AF guide ball (610) may include a curved surface. The AF guide ball (610) may include a plurality of balls. The AF guide ball (610) may include four balls. The AF guide ball (610) may include first to fourth balls. The AF guide ball (610) may include two balls arranged on one side of the AF magnet (410) and two balls arranged on the other side of the AF magnet (410).

[0191] The camera device may include an OIS-x guide ball (620). The OIS-x guide ball (620) may be disposed in a housing (310). The OIS-x guide ball (620) may be disposed in a groove of the housing (310). The OIS-x guide ball (620) may be disposed in a frame (330). The OIS-x guide ball (620) may be disposed in a groove of the frame (330). The OIS-x guide ball (620) may be disposed between the housing (310) and the frame (330). The OIS-x guide ball (620) may be disposed between the groove of the housing (310) and the groove of the frame (330). The OIS-x guide ball (620) may be in contact with the housing (310) and the frame (330). The OIS-x guide ball (620) can be in direct contact with the housing (310) and the frame (330). The OIS-x guide ball (620) can connect the housing (310) and the frame (330). The OIS-x guide ball (620) can directly connect the housing (310) and the frame (330).

[0192] The OIS-x guide ball (620) can move in the x-axis direction. The OIS-x guide ball (620) can move in the x-axis direction within the groove of the housing (310). The OIS-x guide ball (620) can move in the x-axis direction within the groove of the frame (330). The OIS-x guide ball (620) can guide the movement of the housing (310) in the x-axis direction. The OIS-x guide ball (620) can guide the housing (310) to move in the x-axis direction with respect to the frame (330). The OIS-x guide ball (620) can guide the movement of the carrier (340) in the x-axis direction. The OIS-x guide ball (620) can guide the movement of the lens in the x-axis direction.

[0193] The OIS-x guide ball (620) may be formed in a spherical shape. Alternatively, the OIS-x guide ball (620) may be formed in a cylindrical shape. The OIS-x guide ball (620) may include a curved surface. The OIS-x guide ball (620) may include a plurality of balls. The OIS-x guide ball (620) may include four balls. The OIS-x guide ball (620) may include first to fourth balls.

[0194] The camera device may include an OIS-y guide ball (630). The OIS-y guide ball (630) may be placed in the frame (330). The OIS-y guide ball (630) may be placed in a groove of the frame (330). The OIS-y guide ball (630) may be placed in the sensor base (320). The OIS-y guide ball (630) may be placed in a groove of the sensor base (320). The OIS-y guide ball (630) may be placed between the frame (330) and the sensor base (320). The OIS-y guide ball (630) may be placed between the groove of the frame (330) and the groove of the sensor base (320). The OIS-y guide ball (630) may be in contact with the frame (330) and the sensor base (320). The OIS-y guide ball (630) can be in direct contact with the frame (330) and the sensor base (320). The OIS-y guide ball (630) can connect the frame (330) and the sensor base (320). The OIS-y guide ball (630) can directly connect the frame (330) and the sensor base (320).

[0195] The OIS-y guide ball (630) can move in the y-axis direction. The OIS-y guide ball (630) can move in the y-axis direction within the groove of the frame (330). The OIS-y guide ball (630) can move in the y-axis direction within the groove of the sensor base (320). The OIS-y guide ball (630) can guide the movement of the frame (330) in the y-axis direction. The OIS-y guide ball (630) can guide the frame (330) to move in the y-axis direction with respect to the sensor base (320). The OIS-y guide ball (630) can guide the movement of the housing (310) in the y-axis direction. The OIS-y guide ball (630) can guide the movement of the carrier (340) in the y-axis direction. The OIS-y guide ball (630) can guide the movement of the lens in the y-axis direction.

[0196] The OIS-y guide ball (630) may be formed in a spherical shape. Alternatively, the OIS-y guide ball (630) may be formed in a cylindrical shape. The OIS-y guide ball (630) may include a curved surface. The OIS-y guide ball (630) may include a plurality of balls. The OIS-y guide ball (630) may include four balls. The OIS-y guide ball (630) may include first to fourth balls.

[0197] As a variation, the OIS-x guide ball (620) and the OIS-y guide ball (630) are not distinguished, and the OIS guide ball can guide in both the x-axis direction and the y-axis direction.

[0198] The camera device may include an OIS-yaw guide ball (640). The OIS-yaw guide ball (640) may be disposed on a moving plate (660). The OIS-yaw guide ball (640) may be disposed in a groove of the moving plate (660). The OIS-yaw guide ball (640) may be disposed on a base (110). The OIS-yaw guide ball (640) may be disposed in a groove of the base (110). The OIS-yaw guide ball (640) may be disposed between the moving plate (660) and the base (110). The OIS-yaw guide ball (640) may be disposed between the groove of the moving plate (660) and the groove of the base (110). The OIS-yaw guide ball (640) may be in contact with the moving plate (660) and the base (110). The OIS-yaw guide ball (640) can be in direct contact with the moving plate (660) and the base (110). The OIS-yaw guide ball (640) can connect the moving plate (660) and the base (110). The OIS-yaw guide ball (640) can directly connect the moving plate (660) and the base (110). The OIS-yaw guide ball (640) can be formed integrally with the moving plate (660). The OIS-yaw guide ball (640) can be formed in a hemispherical shape on the moving plate (660). The OIS-yaw guide ball (640) can be formed as a convex portion on the moving plate (660).

[0199] The OIS-yaw guide ball (640) can guide the movement of the moving plate (660) in the yaw direction. The OIS-yaw guide ball (640) can guide the moving plate (660) to move in the yaw direction with respect to the base (110). The OIS-yaw guide ball (640) can guide the movement of the sensor base (320) in the yaw direction. The OIS-yaw guide ball (640) can guide the movement of the image sensor (220) in the yaw direction. The OIS-yaw guide ball (640) can guide the movement of the housing (310) in the yaw direction. The OIS-yaw guide ball (640) can guide the movement of the carrier (340) in the yaw direction. The OIS-yaw guide ball (640) can guide the movement of the lens in the yaw direction.

[0200] The OIS-yaw guide ball (640) may be formed in a spherical shape. Alternatively, the OIS-yaw guide ball (640) may be formed in a cylindrical shape. The OIS-yaw guide ball (640) may include a curved surface. The OIS-yaw guide ball (640) may include a plurality of balls. The OIS-yaw guide ball (640) may include two balls. The OIS-yaw guide ball (640) may include first and second balls. The OIS-yaw guide ball (640) may include a plurality of balls arranged on a first axis. In this case, the first axis may be a central axis in the yaw direction.

[0201] The camera device may include an OIS pitch guide ball (650). The OIS pitch guide ball (650) may be disposed on the sensor base (320). The OIS pitch guide ball (650) may be disposed in a groove of the sensor base (320). The OIS pitch guide ball (650) may be disposed on the moving plate (660). The OIS pitch guide ball (650) may be disposed in a groove of the moving plate (660). The OIS pitch guide ball (650) may be disposed between the sensor base (320) and the moving plate (660). The OIS pitch guide ball (650) may be disposed between the groove of the sensor base (320) and the groove of the moving plate (660). The OIS pitch guide ball (650) may be in contact with the sensor base (320) and the moving plate (660). The OIS pitch guide ball (650) can be in direct contact with the sensor base (320) and the moving plate (660). The OIS pitch guide ball (650) can connect the sensor base (320) and the moving plate (660). The OIS pitch guide ball (650) can directly connect the sensor base (320) and the moving plate (660). The OIS pitch guide ball (650) can be formed integrally with the moving plate (660). The OIS pitch guide ball (650) can be formed in a hemispherical shape on the moving plate (660). The OIS pitch guide ball (650) can be formed as a convex portion on the moving plate (660).

[0202] Both the OIS-yaw guide ball (640) and the OIS-pitch guide ball (650) may be formed integrally with the moving plate (660). Alternatively, only one of the OIS-yaw guide ball (640) and the OIS-pitch guide ball (650) may be formed integrally with the moving plate (660).

[0203] The OIS pitch guide ball (650) can guide the movement of the sensor base (320) in the pitch direction. The OIS pitch guide ball (650) can guide the sensor base (320) to move in the pitch direction with respect to the moving plate (660). The OIS pitch guide ball (650) can guide the movement of the sensor base (320) in the pitch direction. The OIS pitch guide ball (650) can guide the movement of the image sensor (220) in the pitch direction. The OIS pitch guide ball (650) can guide the movement of the housing (310) in the pitch direction. The OIS pitch guide ball (650) can guide the movement of the carrier (340) in the pitch direction. The OIS pitch guide ball (650) can guide the movement of the lens in the pitch direction.

[0204] The OIS pitch guide ball (650) may be formed in a spherical shape. Alternatively, the OIS pitch guide ball (650) may be formed in a cylindrical shape. The OIS pitch guide ball (650) may include a curved surface. The OIS pitch guide ball (650) may include a plurality of balls. The OIS pitch guide ball (650) may include two balls. The OIS pitch guide ball (650) may include first and second balls. The OIS pitch guide ball (650) may include a plurality of balls arranged on a second axis. In this case, the second axis may be a central axis in the pitch direction.

[0205] The camera device may include a moving plate (660). The moving plate (660) may be positioned between the base (110) and the sensor base (320). The moving plate (660) may be positioned on the base (110). The moving plate (660) may be positioned under the sensor base (320). The moving plate (660) may be positioned under the housing (310). The moving plate (660) may be positioned under the carrier (340).

[0206] The camera device may include a ball pressurizing member. The ball pressurizing member may pressurize a guide ball so that it is in close contact with adjacent members. Since the ball is maintained in close contact with the adjacent members by the ball pressurizing member, the guide ball may guide the movement of the adjacent members in a preset direction. In addition, the guide ball may be prevented from being lost by the ball pressurizing member. The ball pressurizing member may include an AF guide ball pressurizing member. The ball pressurizing member may include an OIS-x guide ball pressurizing member. The ball pressurizing member may include an OIS-y guide ball pressurizing member. The ball pressurizing member may include an OIS-yaw guide ball pressurizing member. The ball pressurizing member may include an OIS-pitch guide ball pressurizing member.

[0207] The camera device may include an AF manpower yoke (710). The AF guide ball pressurizing member may include the AF manpower yoke (710). The AF manpower yoke (710) may be disposed on a sensor substrate (210). The AF manpower yoke (710) may be coupled to the sensor substrate (210). The AF manpower yoke (710) may be fixed to the sensor substrate (210). The AF manpower yoke (710) may be adhesively bonded to the sensor substrate (210). The AF manpower yoke (710) may be disposed on a side substrate (212). An AF coil (420) may be disposed between the AF manpower yoke (710) and the AF magnet (410). The AF manpower yoke (710) may overlap the AF magnet (410) in a direction perpendicular to the optical axis. The AF manpower yoke (710) can overlap with the AF magnet (410) in the y-axis direction.

[0208] The AF manpower yoke (710) may be formed of metal. The AF manpower yoke (710) may be magnetic. The AF manpower yoke (710) may be a magnetic member. The AF manpower yoke (710) may be arranged to correspond to the AF magnet (410). The AF manpower yoke (710) may be arranged at a position corresponding to the AF magnet (410). The AF manpower yoke (710) may be attracted to the AF magnet (410). The AF manpower yoke (710) may be arranged to be attracted to the AF magnet (410).

[0209] The camera device may include an OIS-x manpower yoke (720). The OIS-x guide ball pressurizing member may include the OIS-x manpower yoke (720). The OIS-x manpower yoke (720) may be placed on the sensor base (320). The OIS-x manpower yoke (720) may be coupled to the sensor base (320). The OIS-x manpower yoke (720) may be fixed to the sensor base (320). The OIS-x manpower yoke (720) may be adhesively bonded to the sensor base (320). The OIS-x manpower yoke (720) may overlap with the OIS-x magnet (511) in the optical axis direction.

[0210] The OIS-x manpower yoke (720) may be formed of metal. The OIS-x manpower yoke (720) may have magnetism. The OIS-x manpower yoke (720) may be a magnetic member. The OIS-x manpower yoke (720) may be arranged to correspond to the OIS-x magnet (511). The OIS-x manpower yoke (720) may be arranged at a position corresponding to the OIS-x magnet (511). The OIS-x manpower yoke (720) may exert an attractive force on the OIS-x magnet (511). The OIS-x manpower yoke (720) may be arranged to exert an attractive force on the OIS-x magnet (511).

[0211] The camera device may include an OIS-y manpower yoke (730). The OIS-y guide ball pressurizing member may include the OIS-y manpower yoke (730). The OIS-y manpower yoke (730) may be placed on the sensor base (320). The OIS-y manpower yoke (730) may be coupled to the sensor base (320). The OIS-y manpower yoke (730) may be fixed to the sensor base (320). The OIS-y manpower yoke (730) may be adhesively bonded to the sensor base (320). The OIS-y manpower yoke (730) may overlap with the OIS-y magnet (521) in the optical axis direction.

[0212] The OIS-y manpower yoke (730) may be formed of metal. The OIS-y manpower yoke (730) may have magnetism. The OIS-y manpower yoke (730) may be a magnetic member. The OIS-y manpower yoke (730) may be arranged to correspond to the OIS-y magnet (521). The OIS-y manpower yoke (730) may be arranged at a position corresponding to the OIS-y magnet (521). The OIS-y manpower yoke (730) may exert an attractive force on the OIS-y magnet (521). The OIS-y manpower yoke (730) may be arranged to exert an attractive force on the OIS-y magnet (521).

[0213] The camera device may include a manpower yoke (740). The manpower yoke (740) may be disposed on the base (110). The manpower yoke (740) may be coupled to the base (110). The manpower yoke (740) may be fixed to the base (110). The manpower yoke (740) may be adhesively bonded to the base (110). Alternatively, the manpower yoke (740) may be disposed on the sensor base (320). The manpower yoke (740) may be coupled to the sensor base (320). The manpower yoke (740) may be fixed to the sensor base (320). The manpower yoke (740) may be adhesively bonded to the sensor base (320).

[0214] The manpower yoke (740) may be formed of metal. The manpower yoke (740) may be magnetic. The manpower yoke (740) may be a magnetic member. The manpower yoke (740) may be arranged to correspond to the manpower magnet (750). The manpower yoke (740) may be arranged at a position corresponding to the manpower magnet (750). The manpower yoke (740) may interact with the manpower magnet (750). The manpower yoke (740) may be arranged to interact with the manpower magnet (750).

[0215] The camera device may include a magnetic field magnet (750). The magnetic field magnet (750) may be placed on the sensor base (320). The magnetic field magnet (750) may be coupled to the sensor base (320). The magnetic field magnet (750) may be fixed to the sensor base (320). The magnetic field magnet (750) may be adhesively bonded to the sensor base (320). Alternatively, the magnetic field magnet (750) may be placed on the base (110). The magnetic field magnet (750) may be coupled to the base (110). The magnetic field magnet (750) may be fixed to the base (110). The magnetic field magnet (750) may be adhesively bonded to the base (110).

[0216] That is, the manpower magnet (750) can be placed on one of the sensor base (320) and the base (110), and the manpower yoke (740) can be placed on the other of the sensor base (320) and the base (110). The manpower magnet (750) can overlap with the manpower yoke (740) in the optical axis direction. The manpower magnet (750) can exert manpower with the manpower yoke (740).

[0217]

[0218] Below, the auto focus (AF) operation of the lens driving device according to the present embodiment is described.

[0219] Fig. 27 is a drawing for explaining auto focus operation of a camera device according to the present embodiment.

[0220] The moving part may be positioned at a position spaced apart from both the upper plate (121) of the cover (120) and the base (110) in the initial position where no current is applied to the AF coil (420). At this time, the moving part may include a carrier (340). Furthermore, the moving part may include a carrier (340), a lens, and an AF magnet (410).

[0221] When current is applied to the AF coil (420), the moving part (see A in FIG. 27) can move upward or downward along the optical axis (see B in FIG. 27).

[0222] When a positive current is applied to the AF coil (420), the AF magnet (410) can move upward in the optical axis direction due to the electromagnetic interaction between the AF coil (420) and the AF magnet (410). At this time, the carrier (340) can move upward in the optical axis direction together with the AF magnet (410). Furthermore, the lens can move upward in the optical axis direction together with the carrier (340). Accordingly, the distance between the lens and the image sensor (220) can be changed, so that the focus of the image formed on the image sensor (220) through the lens can be adjusted.

[0223] When a reverse current is applied to the AF coil (420), the AF magnet (410) can move downward in the optical axis direction due to the electromagnetic interaction between the AF coil (420) and the AF magnet (410). At this time, the carrier (340) can move downward in the optical axis direction together with the AF magnet (410). Furthermore, the lens can move downward in the optical axis direction together with the carrier (340). Accordingly, the distance between the lens and the image sensor (220) can be changed, so that the focus of the image formed on the image sensor (220) through the lens can be adjusted.

[0224] Meanwhile, during the movement of the AF magnet (410), the AF sensor (430) can detect the strength of the magnetic field of the AF magnet (410) to detect the amount of movement or position of the lens in the optical axis direction. The amount of movement or position of the lens in the optical axis direction detected by the AF sensor (430) can be used for auto focus feedback control.

[0225]

[0226] Below, the optical image stabilization (OIS) operation of the lens driving device according to the present embodiment is described.

[0227] Fig. 28 is a drawing for explaining the shake correction operation through x-axis shift correction and y-axis shift correction of the camera device according to the present embodiment.

[0228] The moving part can be placed in the initial position without current being applied to the OIS-x coil (512) and the OIS-y coil (522). At this time, the moving part can include a housing (310). Furthermore, the moving part can include a housing (310), a carrier (340), a lens, an OIS-x magnet (511), and an OIS-y magnet (521). The moving part can include a housing (310), a carrier (340), an AF magnet (410), an AF coil (420), a lens, a filter (350), an OIS-x magnet (511), and an OIS-y magnet (521).

[0229] When current is applied to the OIS-x coil (512), the moving part (see A in Fig. 28) can move in the x-axis direction (see B in Fig. 28).

[0230] When current is applied to the OIS-x coil (512), the OIS-x magnet (511) can move in the x-axis direction perpendicular to the optical axis due to the electromagnetic interaction between the OIS-x coil (512) and the OIS-x magnet (511). At this time, the housing (310) can move in the x-axis direction together with the OIS-x magnet (511). Furthermore, the carrier (340) and the lens can move in the x-axis direction together with the housing (310). More specifically, when a positive current is applied to the OIS-x coil (512), the OIS-x magnet (511), the housing (310), the carrier (340), and the lens can move in one direction on the x-axis. Additionally, when reverse current is applied to the OIS-x coil (512), the OIS-x magnet (511), housing (310), carrier (340), and lens can move in the other direction along the x-axis.

[0231] When current is applied to the OIS-y coil (522), the moving part (see A in Fig. 28) can move in the y-axis direction (see C in Fig. 28).

[0232] When current is applied to the OIS-y coil (522), the OIS-y magnet (521) can move in the y-axis direction perpendicular to the optical axis due to the electromagnetic interaction between the OIS-y coil (522) and the OIS-y magnet (521). At this time, the housing (310) and the frame (330) can move in the y-axis direction together with the OIS-y magnet (521). Furthermore, the carrier (340) and the lens can move in the y-axis direction together with the housing (310). More specifically, when a positive current is applied to the OIS-y coil (522), the OIS-y magnet (521), the frame (330), the housing (310), the carrier (340), and the lens can move in one direction on the y-axis. Additionally, when a reverse current is applied to the OIS-y coil (522), the OIS-y magnet (521), frame (330), housing (310), carrier (340), and lens can move in the other direction along the y-axis.

[0233] Meanwhile, the OIS-x sensor (513) can detect the strength of the magnetic field of the OIS-x magnet (511) to detect the amount of movement or position of the OIS-x magnet (511). The amount of movement or position detected by the OIS-x sensor (513) can be used for x-axis direction shake correction feedback control. The OIS-y sensor (523) can detect the strength of the magnetic field of the OIS-y magnet (521) to detect the amount of movement or position of the OIS-y magnet (521). The amount of movement or position detected by the OIS-y sensor (523) can be used for y-axis direction shake correction feedback control.

[0234] Fig. 29 is a drawing for explaining the shake correction operation through yaw direction tilting correction of the camera device according to the present embodiment.

[0235] The moving part can be placed in the initial position without current being applied to the OIS-Yo coil (532). At this time, the moving part can include an image sensor (220). Furthermore, the moving part can include a moving plate (660), a sensor base (320), a frame (330), a housing (310), a carrier (340), an image sensor (220), and a lens.

[0236] When current is applied to the OIS-Yo coil (532), the moving part can be tilted in the yaw direction (see B in Fig. 29).

[0237] When current is applied to the OIS-yaw coil (532), the OIS-yaw magnet (531) can be tilted in the yaw direction due to the electromagnetic interaction between the OIS-yaw coil (532) and the OIS-yaw magnet (531). That is, it can be tilted around the first axis. In other words, it can be rotated within a limited range around the first axis (see A of FIG. 29). At this time, the image sensor (220) and the lens together with the OIS-yaw magnet (531) can be tilted in the yaw direction. More specifically, when a positive current is applied to the OIS-yaw coil (532), the OIS-yaw magnet (531), the image sensor (220), and the lens can move in one direction on the yaw. Additionally, when a reverse current is applied to the OIS-Yo coil (532), the OIS-Yo magnet (531), the image sensor (220), and the lens can move in the opposite direction of the yoke.

[0238] Meanwhile, the OIS-yaw sensor (533) can detect the strength of the magnetic field of the OIS-yaw magnet (531) to detect the amount of movement or position of the OIS-yaw magnet (531). The amount of movement or position detected by the OIS-yaw sensor (533) can be used for yaw direction shake compensation feedback control.

[0239] Fig. 30 is a drawing for explaining the shake correction operation through pitch direction tilting correction of the camera device according to the present embodiment.

[0240] The moving part can be placed in the initial position without current being applied to the OIS-pitch coil (542). At this time, the moving part can include an image sensor (220). Furthermore, the moving part can include a sensor base (320), a frame (330), a housing (310), a carrier (340), an image sensor (220), and a lens.

[0241] When current is applied to the OIS-pitch coil (542), the moving part can be tilted in the pitch direction (see D in Fig. 30).

[0242] When current is applied to the OIS-pitch coil (542), the OIS-pitch magnet (541) can be tilted in the pitch direction by the electromagnetic interaction between the OIS-pitch coil (542) and the OIS-pitch magnet (541). That is, it can be tilted around the second axis (see C of FIG. 30). In other words, it can be rotated within a limited range around the second axis. At this time, the image sensor (220) and the lens together with the OIS-pitch magnet (541) can be tilted in the pitch direction. More specifically, when a positive current is applied to the OIS-pitch coil (542), the OIS-pitch magnet (541), the image sensor (220), and the lens can move in one direction on the pitch. Additionally, when reverse current is applied to the OIS-pitch coil (542), the OIS-pitch magnet (541), the image sensor (220), and the lens can move in the other direction on the pitch.

[0243] Meanwhile, the OIS-pitch sensor (543) can detect the strength of the magnetic field of the OIS-pitch magnet (541) to detect the amount of movement or position of the OIS-pitch magnet (541). The amount of movement or position detected by the OIS-pitch sensor (543) can be used for pitch direction shake correction feedback control.

[0244] In this embodiment, the x-axis shift drive (see A in FIG. 10) and the y-axis shift drive (see B in FIG. 10) are such that the image sensor (220) is fixed and only the lens can move. However, the yaw tilting (see C in FIG. 10) and the pitch tilting (see D in FIG. 10) may be a module tilt method in which the lens and the image sensor (220) move together.

[0245]

[0246] Below, an optical device according to the present embodiment is described with reference to the drawings.

[0247] Fig. 31 is a perspective view of an optical device according to the present embodiment. Fig. 32 is a perspective view of an optical device according to a modified example.

[0248] The optical device (1) may include one or more of a mobile phone, a cell phone, a portable terminal, a mobile terminal, a smart phone, a smart pad, a portable smart device, a digital camera, a laptop computer, a digital broadcasting terminal, a PDA (Personal Digital Assistant), a PMP (Portable Multimedia Player), and a navigation device. The optical device (1) may include any device for taking images or photographs.

[0249] An optical device (1) may include a main body (20). The optical device (1) may include a camera device (10A). The camera device (10A) may be placed on the main body (20). The camera device (10A) may capture a subject. The optical device (1) may include a display. The display may be placed on the main body (20). The display may output one or more of images and videos captured by the camera device (10A). The display may be placed on a first surface of the main body (20). The camera device (10A) may be placed on one or more of the first surface of the main body (20) and a second surface opposite the first surface. As illustrated in FIG. 31, the camera device (10A) may have a triple camera positioned vertically. As illustrated in FIG. 32, the camera device (10A-1) may have a triple camera positioned horizontally.

[0250]

[0251] Although the embodiments of the present invention have been described with reference to the attached drawings, those skilled in the art will appreciate that the present invention can be implemented in other specific forms without altering the technical concept or essential features thereof. Therefore, the embodiments described above should be understood to be illustrative in all respects and not restrictive.

Claims

1. Base; A first substrate placed on the above base; An image sensor disposed on the first substrate; A housing disposed on the first substrate; A carrier disposed within the housing; A lens coupled to the carrier; A first driving unit that moves the lens in the optical axis direction; A second driving unit that moves the lens in a first direction perpendicular to the optical axis; A third driving unit that moves the lens in a second direction perpendicular to the optical axis direction and the first direction; A fourth driving unit that tilts the image sensor and the lens together around the first axis; and A camera device including a fifth driving unit that tilts the image sensor and the lens together around a second axis perpendicular to the first axis.

2. In paragraph 1, Including a second substrate arranged on the first side of the housing, A camera device including a first magnet disposed on the carrier and a first coil disposed on the second substrate, wherein the first driving unit is a first magnet disposed on the carrier.

3. In paragraph 2, Including a third substrate placed on the above base, A camera device including a second magnet disposed in the housing and a second coil disposed on the third substrate, wherein the second driving unit is a second magnet disposed in the housing and a second coil disposed on the third substrate.

4. In paragraph 3, A camera device in which the second coil is arranged in the second direction of the housing.

5. In paragraph 4, The third driving unit includes a third magnet disposed in the housing and a third coil disposed on the third substrate, A camera device in which the third magnet is positioned opposite the second magnet with respect to the lens.

6. In paragraph 5, A camera device in which the third coil is arranged in a third direction opposite to the second direction of the housing.

7. In paragraph 1, The above second driving unit includes a second magnet and a second coil, The above third driving unit includes a third magnet and a third coil, When current is applied to the second coil, the second magnet moves in the first direction toward or away from the second coil, A camera device in which, when current is applied to the third coil, the distance between the third magnet and the third coil in the first direction does not change and the third magnet moves in the second direction.

8. In paragraph 1, The above second driving unit includes a second magnet and a second coil, The above third driving unit includes a third magnet and a third coil, The above second magnet has a single polarity in the entire area of ​​the first surface facing the second coil, A camera device in which the third magnet has a first surface facing the third coil and has an N pole and an S pole.

9. In paragraph 8, A camera device in which the third coil includes a third-1 coil, a portion of which faces the N pole of the first surface of the third magnet, and a third-2 coil, a portion of which faces the S pole of the first surface of the third magnet.

10. In paragraph 5, The fourth driving unit includes a fourth magnet that moves together with the image sensor and a fourth coil arranged on the third substrate, A camera device including a fifth magnet that moves together with the image sensor and a fifth coil arranged on the third substrate.

Images