Anti-shake assembly of image sensor, and camera module

Abstract

Provided in the present application are an anti-shake assembly of an image sensor, a camera module, and an electronic device. An interconnection line for supplying power to an image sensor is laid in a first circuit board of the anti-shake assembly, and the image sensor may be installed on a movable platform of the first circuit board. A connecting arm is connected between the movable platform and a fixed outer frame of the first circuit board, and the connecting arm may be arranged symmetrically about the center. An interaction force between a first magnet and a coil in the anti-shake assembly can drive the movable platform to move or rotate, so as to drive the image sensor mounted on the movable platform to translate or rotate. The anti-shake assembly, the camera module and the electronic device provided in the present application have a strong anti-shake performance, especially in terms of rotational anti-shake performance, and the anti-shake assembly and the camera module have a small size and a high utilization rate of internal spaces.

Description

Image sensor anti-shake components and camera modules

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on July 31, 2023, with application number 202310952631.2 and invention name “Anti-shake component and camera module for image sensor”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of terminal device hardware, and specifically to an anti-shake component of an image sensor and a camera module. Background Art

[0003] Optical image stabilization (OIS) of image sensors is a crucial factor affecting the quality of photos and videos taken by electronic devices. To improve these capabilities, more lenses, sensors, and other components are being integrated into these devices, leaving less space for OIS components.

[0004] How to realize the multi-axis anti-shake function of the image sensor in a limited space is a question worth considering.

[0005] Summary of the Invention

[0006] This application provides an image sensor anti-shake assembly. The image sensor can be mounted on a movable platform of a first circuit board. Interconnecting wires are laid within the first circuit board within the anti-shake assembly to provide power to the image sensor. Connecting arms arranged centrally and symmetrically on the first circuit board can control the displacement or rotation of the movable platform, thereby driving the image sensor to translate or rotate within a limited space, thereby achieving multi-axis anti-shake functionality for the image sensor.

[0007] In a first aspect, an anti-shake assembly for an image sensor is provided, comprising: a shell, a first magnet, a coil and a first circuit board, wherein the first magnet, the coil and the first circuit board are accommodated in the shell, the first circuit board comprises: an outer frame, a connecting arm, a movable platform and an interconnection line, the outer frame comprises a first interface, the first interface is used to connect an external power supply of the anti-shake assembly; a gap is provided between the movable platform and the outer frame, the movable platform is used to load the image sensor; the connecting arm is located in the gap, the connecting arm connects the outer frame and the movable platform, the number of the connecting arms is multiple, and the multiple connecting arms are centrally symmetrical about the rotation center of the first circuit board; the interconnection line is located inside the first circuit board, the interconnection line connects the first interface and the image sensor; the first magnet or coil is fixedly connected to the movable platform, and when current is passed through the coil, the first magnet or coil drives the movable platform to translate or rotate.

[0008] In a possible implementation, a first opening is formed in a middle area of ​​the movable platform, and the first opening is used to mount an image sensor.

[0009] In a possible implementation, the first magnet is fixedly connected to the movable platform, and the coil is fixedly connected to the housing. Alternatively, the coil is fixedly connected to the movable platform, and the first magnet is fixedly connected to the housing.

[0010] It should be understood that the fixed connection herein may include direct connection and indirect connection. For example, the first magnet is fixedly connected to the movable platform, which may refer to the first magnet being fixed to the movable platform, or the first magnet being fixed to the second circuit board, which may refer to the second circuit board being fixedly connected to the movable platform.

[0011] In a possible implementation, the anti-shake component further includes a controller, which is used to control the direction and magnitude of the current in the coil.

[0012] In a possible implementation, the connecting arm or the first circuit board may be made of a material having an elastic modulus greater than a preset threshold value. The connecting arm may also be referred to as an elastic connecting arm, and the first circuit board may also be referred to as an elastic circuit board.

[0013] In this technical solution, interconnects are laid within the first circuit board to power the image sensor, which helps improve the space utilization of the anti-shake assembly and reduces the adverse effects of power supply lines on the anti-shake assembly's rotational anti-shake function. Furthermore, by providing centrally symmetrical connecting arms to control the image sensor's translation or rotation, the image sensor's displacement or rotation angle is more stable, simplifying the anti-shake assembly's structure and improving the reliability and stability of the assembly's rotational anti-shake function. Compared to solutions that use flexible circuit boards to achieve rotational anti-shake, the first circuit board in this technical solution has lower rigidity and better rotational anti-shake performance.

[0014] In combination with the first aspect, in certain implementations of the first aspect, the first end of the connecting arm is connected to the outer frame, the second end of the connecting arm is connected to the movable platform, and the angle formed between the line connecting the first end and the rotation center and the line connecting the second end and the rotation center is greater than or equal to 90°.

[0015] It should be understood that the angle formed by the two connecting lines refers to the angle between the direction of the rotation center pointing to the first end and the direction of the rotation center pointing to the second end.

[0016] In some scenarios, this technical solution can also be understood as using two mutually perpendicular straight lines passing through the rotation center of the first circuit board to divide the plane where the first circuit board is located into four quadrants, and the connecting arm passes through at least two of the four quadrants.

[0017] When subjected to the same force, the connecting arm having the length or shape specified in the present technical solution has a larger total deformation and is more likely to drive the movable platform connected thereto to rotate or translate. In other words, the connecting arm is more efficient in driving the image sensor, which is beneficial to improving the energy utilization of the anti-shake component.

[0018] In combination with the first aspect, in certain implementations of the first aspect, there are multiple connecting arms, and the multiple connecting arms include a first connecting arm and a second connecting arm, and the first connecting arm and the second connecting arm are both used to connect the first connecting portion of the outer frame and the second connecting portion of the movable platform.

[0019] In a possible implementation, the plurality of connecting arms are located in a plane where the first circuit board is located, and a gap is provided between two adjacent connecting arms.

[0020] Using multiple connecting arms to jointly control the movable platform reduces the direction of force applied to the platform's connections, improving stability. Furthermore, if any of the multiple connecting arms is damaged, the remaining arms can still control the platform, further enhancing the reliability of the anti-shake assembly's anti-shake performance.

[0021] In combination with the first aspect, in certain implementations of the first aspect, a connecting rod is connected between the first connecting arm and the second connecting arm.

[0022] In a possible implementation, the first connecting arm and the connecting rod are connected at a position on the first connecting arm where the force direction suddenly changes. The second connecting arm and the connecting rod are also connected at a position on the second connecting arm where the force direction suddenly changes.

[0023] By setting a connecting rod between the two connecting arms, the difference in the deformation amount of the two connecting arms when deformed by force is smaller, the control effect of the two connecting arms on the movable platform is more synchronized, and the anti-shake performance of the anti-shake assembly is more stable.

[0024] In combination with the first aspect, in some implementations of the first aspect, the connecting rod includes a conductive portion, and the conductive portion is used to conduct electricity between the first interconnection line inside the first connecting arm and the second interconnection line inside the second connecting arm.

[0025] In a possible implementation, the connecting rod is a conductor, such as metal. In this case, the connecting rod can also be called a metal flexure.

[0026] By using a connecting rod connecting the first connecting arm and the second connecting arm to connect the interconnection lines inside the two connecting arms, more optional routing methods for the interconnection lines inside the first circuit board are available, which is conducive to reducing the complexity of the routing of the interconnection lines inside the first circuit board.

[0027] In combination with the first aspect, in some implementations of the first aspect, there are multiple interconnection lines, and the multiple interconnection lines are located at different positions in the thickness direction of the first circuit board.

[0028] In a possible implementation, the plurality of interconnection lines are stacked and distributed in a thickness direction of the first circuit board, and the plurality of interconnection lines are insulated from each other.

[0029] In one possible implementation, the multiple interconnect lines are also used to power other electronic components in the anti-shake assembly, such as Hall elements, controllers, etc.

[0030] By providing multiple interconnects in the thickness direction of the first circuit board, the multiple interconnects can be used to power more electronic components. This technical solution further utilizes the space inside the first circuit board, which is conducive to further improving the space utilization of the anti-shake component.

[0031] In combination with the first aspect, in certain implementations of the first aspect, the connecting arm includes a plurality of sub-connecting arms, and an angle formed between two adjacent sub-connecting arms of the plurality of sub-connecting arms is equal to 90°.

[0032] In a possible implementation, the connecting arm includes two mutually perpendicular sub-connecting arms.

[0033] The connecting arm is composed of two mutually perpendicular sub-connecting arms. When a force is applied to the connecting arm, the force is effectively decomposed along the sub-connecting arms, allowing the connecting arm to undergo greater deformation and / or displacement. This improves the efficiency of the anti-shake component in converting electrical energy into mechanical energy, resulting in higher energy utilization efficiency.

[0034] In combination with the first aspect, in certain implementations of the first aspect, the anti-shake assembly further includes a base plate and a support plate, the base plate being located on a side of the first circuit board away from the cover plate of the shell, the support plate being located between the first circuit board and the base plate, and the support plate being in contact with the base plate.

[0035] In a possible implementation manner, the support plate is in rolling friction contact or sliding friction contact with the base plate.

[0036] In a possible implementation, a lubricating material is filled between the support plate and the bottom plate, or a lubricating material is coated on a surface of the support plate that contacts the bottom plate.

[0037] A support plate is provided between the first circuit board and the base plate, and friction between the support plate and the base plate is generated, which helps to avoid direct contact between the image sensor mounted on the first circuit board and the base plate, and helps to reduce wear of the image sensor.

[0038] In combination with the first aspect, in some implementations of the first aspect, the movable platform includes a first opening, the support plate includes a second opening, the first opening is connected to the second opening, and the first opening and the second opening are used to accommodate the image sensor.

[0039] In a possible implementation, the image sensor may be clamped in the first opening and the second opening. When the movable platform drives the image sensor to translate or rotate, the image sensor may drive the support plate to translate or rotate relative to the base plate.

[0040] The side of the image sensor accommodated in the first opening and the second opening facing the base plate can be in a suspended state, that is, not in contact with the base plate, the support plate, etc., which is beneficial to improving the driving effect of the anti-shake component on the image sensor, reducing the wear of the image sensor, and extending the service life of the anti-shake component.

[0041] In combination with the first aspect, in certain implementations of the first aspect, a pad is provided on a side of the support plate facing the bottom plate, and the pad is in contact with the bottom plate.

[0042] In a possible implementation, the pad foot is in rolling friction contact or sliding friction contact with the base plate.

[0043] Providing a foot on the side of the support plate facing the base plate is beneficial for controlling the contact area between the support plate and the base plate during translation or rotation, which is beneficial for reducing the wear of the support plate, and is beneficial for better driving the image sensor to translate or rotate. To a certain extent, it is also beneficial for improving the contact stability between the support plate and the base plate.

[0044] In combination with the first aspect, in some implementations of the first aspect, the anti-shake assembly further includes a second magnet, the bottom plate is composed of a magnetic material, the second magnet is located above the movable platform, and the second magnet and the bottom plate attract each other.

[0045] The mutual attraction between the second magnet and the base plate can effectively press the support plate onto the base plate, which is beneficial to reducing the probability of the support plate shaking in the optical axis direction and improving the reliability and stability of the anti-shake performance of the anti-shake component.

[0046] In combination with the first aspect, in certain implementations of the first aspect, the anti-shake assembly further includes a support frame, the support frame is located between the base plate and the first circuit board, the support frame is located on the outside of the support plate, and the thickness of the support frame is the same as the height of the support plate.

[0047] When the support plate is not provided with feet, the thickness of the support frame is the same as the thickness of the support plate. When the support plate is provided with feet, the thickness of the support frame is the same as the sum of the height of the feet and the thickness of the support plate.

[0048] The peripheral area between the bottom plate and the first circuit board can be filled by the support frame, so that the bottom plate and the first circuit board can fit more closely together, and dust outside the anti-shake component is not easy to enter between the bottom plate and the first circuit board. The friction state between the bottom plate and the support plate is not easily disturbed by dust and other substances. This technical solution is conducive to improving the reliability of the anti-shake component function.

[0049] In combination with the first aspect, in certain implementations of the first aspect, the support frame avoids the connecting arm.

[0050] When the support frame avoids the connecting arm, the deformation or displacement of the connecting arm will not be adversely affected by the friction between the support frame and the connecting arm. In this technical solution, the interaction between the coil and the first magnet drives the movable platform more efficiently, and the energy conversion efficiency of the anti-shake component is higher.

[0051] In combination with the first aspect, in certain implementations of the first aspect, the coil includes a first sub-coil and a second sub-coil, the first sub-coil is used to drive the movable platform to translate along a first direction, and the second sub-coil is used to drive the movable platform to translate along a second direction, and the first direction is perpendicular to the second direction.

[0052] In combination with the first aspect, in some implementations of the first aspect, the coil includes a third sub-coil, and the third sub-coil is used to drive the movable platform to rotate around the rotation center of the first circuit board.

[0053] In a possible implementation, the third sub-coil and the first sub-coil are the same coil, or the third sub-coil and the second sub-coil are the same coil.

[0054] Different coils can be used to provide the force that drives the movable platform to translate or rotate in different directions. This simplifies the control logic of the anti-shake function of the anti-shake component, helps reduce mutual interference between the different coils within the anti-shake component, and helps improve the stability of the anti-shake performance of the anti-shake component.

[0055] In combination with the first aspect, in certain implementations of the first aspect, the first magnet is a Halbach magnet.

[0056] Compared to a single magnet, the Halbach magnet enhances magnetic field strength within a certain range. Using the Halbach magnet can, to a certain extent, enhance the interaction between the first magnet and the coil. In other words, using the Halbach magnet can, to a certain extent, enhance the driving force for the image sensor. In other words, compared to a single magnet, using the Halbach magnet allows for a smaller current or a smaller coil to achieve a comparable driving force. The implementation of this technical solution helps improve the energy conversion efficiency of the anti-shake assembly and improves the space utilization efficiency within the anti-shake assembly.

[0057] In combination with the first aspect, in some implementations of the first aspect, the anti-shake assembly further includes a fixed plate, the fixed plate is fixedly connected to the movable platform, and the first magnet or coil is fixed to the fixed plate.

[0058] In a possible implementation, the fixing plate can also be used to fix other electronic components such as Hall elements and controllers.

[0059] In a possible implementation, the fixing plate is electrically connected to the first circuit board, for example, by soldering.

[0060] By providing a fixed plate to hold the first magnet or coil, multiple electronic components within the anti-shake assembly can be installed and arranged uniformly. Powering the fixed plate also provides power to the electronic components on the fixed plate. This technical solution improves the installation and production efficiency of the anti-shake assembly.

[0061] For the relevant explanations and detailed descriptions of the beneficial effects in the following technical solutions, please refer to the relevant contents in the first aspect, and for the sake of brevity, they are not described in detail below.

[0062] In a second aspect, a circuit board is provided, comprising: an outer frame, a connecting arm, a movable platform and interconnecting lines, wherein the outer frame is provided with a first interface, the first interface being used to connect an external power supply of an anti-shake component; a gap is provided between the movable platform and the outer frame, the movable platform being used to load an image sensor; the connecting arm is located in the gap, the connecting arm connecting the outer frame and the movable platform, the number of the connecting arms is multiple, and the multiple connecting arms are centrally symmetrical about the rotation center of the circuit board; the interconnecting lines are located inside the circuit board, the interconnecting lines connecting the first interface and the image sensor.

[0063] In combination with the second aspect, in certain implementations of the second aspect, the first end of the connecting arm is connected to the outer frame, the second end of the connecting arm is connected to the movable platform, and the angle formed between the line connecting the first end and the rotation center and the line connecting the second end and the rotation center is greater than or equal to 90°.

[0064] In combination with the second aspect, in certain implementations of the second aspect, there are multiple connecting arms, and the multiple connecting arms include a first connecting arm and a second connecting arm, and the first connecting arm and the second connecting arm are both used to connect the first connecting portion of the outer frame and the second connecting portion of the movable platform.

[0065] In combination with the second aspect, in certain implementations of the second aspect, the first connecting arm and the second connecting arm are connected by a connecting rod.

[0066] In combination with the second aspect, in some implementations of the second aspect, the connecting rod includes a conductive portion, and the conductive portion is used to conduct electricity between the first interconnection line inside the first connecting arm and the second interconnection line inside the second connecting arm.

[0067] In combination with the second aspect, in some implementations of the second aspect, there are multiple interconnection lines, and the multiple interconnection lines are located at different positions in the thickness direction of the circuit board.

[0068] In combination with the second aspect, in certain implementations of the second aspect, the connecting arm includes a plurality of sub-connecting arms, and an angle formed between two adjacent sub-connecting arms of the plurality of sub-connecting arms is equal to 90°.

[0069] In a possible implementation, the connecting arm includes two sub-connecting arms.

[0070] In a third aspect, a camera module is provided, comprising a lens, an image sensor, and an anti-shake component for the image sensor in the first aspect and any possible implementation thereof, wherein the image sensor is installed in the middle area of ​​the anti-shake component, the lens and the anti-shake component are relatively fixed, and the imaging light is incident on the image sensor through the lens.

[0071] In a fourth aspect, an electronic device is provided, comprising a mainboard and the camera module according to the third aspect and its possible implementations, wherein the camera module is electrically connected to the mainboard. BRIEF DESCRIPTION OF THE DRAWINGS

[0072] FIG1 is a schematic diagram of an electronic device provided in an embodiment of the present application.

[0073] FIG2 is a schematic diagram of a camera module of an electronic device provided in an embodiment of the present application.

[0074] FIG3 is a three-dimensional view of an anti-shake module of an image sensor provided in an embodiment of the present application.

[0075] FIG4 is an exploded view of the anti-shake module of the image sensor shown in FIG3 provided in an embodiment of the present application.

[0076] FIG5 is a schematic diagram of the arrangement of the first magnet provided in an embodiment of the present application.

[0077] FIG6 is a schematic structural diagram of a first magnet provided in an embodiment of the present application.

[0078] FIG7 is a schematic structural diagram of another first magnet provided in an embodiment of the present application.

[0079] FIG8 is a schematic diagram of a coil configuration according to an embodiment of the present application.

[0080] FIG9 is a schematic diagram of force analysis of the coil shown in FIG8 .

[0081] FIG10 is a three-dimensional view of the first circuit board provided in an embodiment of the present application.

[0082] FIG11 is a schematic diagram of a fixed outer frame of a first circuit board provided in an embodiment of the present application.

[0083] FIG12 is a schematic diagram of a configuration of the connecting arms of the first circuit board according to an embodiment of the present application.

[0084] FIG13 is a schematic diagram of a connecting arm of a first circuit board provided in an embodiment of the present application.

[0085] FIG14 is a schematic diagram of the shape of the connecting arm of the first circuit board provided in an embodiment of the present application.

[0086] FIG15 is a schematic diagram of a movable platform of a first circuit board provided in an embodiment of the present application.

[0087] FIG16 is a schematic diagram of the AA cross section of the first circuit board provided in an embodiment of the present application.

[0088] FIG17 is a schematic diagram of a support plate of a first circuit board provided in an embodiment of the present application.

[0089] FIG18 is a schematic diagram of a support frame of a first circuit board provided in an embodiment of the present application.

[0090] Figure 19 is a schematic diagram of the second circuit board provided in an embodiment of the present application. DETAILED DESCRIPTION

[0091] The following describes embodiments of the present application in detail, and examples of the embodiments of the present application are shown in the accompanying drawings. In the accompanying drawings, the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present application and are not to be construed as limiting the present application.

[0092] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meanings understood by persons having ordinary skills in the technical field to which this application belongs. In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like, indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operate in a specific direction, and therefore should not be understood as limiting this application.

[0093] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to limit the present application. The terms "first", "second", etc. are only used for descriptive purposes and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. The term "and / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist; for example, A and / or B may mean: A exists alone, A and B exist at the same time, and B exists alone, where A and B can be singular or plural. The character " / " generally indicates that the related objects before and after are in an "or" relationship. The terms "include", "comprise", "have" and their variations all mean "including but not limited to", unless otherwise specifically emphasized.

[0094] Before introducing the embodiments of the present application, some terms that may be used in the following content are first explained.

[0095] Voice coil motor, also known as voice coil motor (VCM), is named because its structure is similar to the voice coil of a speaker. It has the characteristics of high frequency response and high precision.

[0096] Image sensor optical image stabilization (SOIS) improves image stability by driving the image sensor to move and compensate for operator jitter during use.

[0097] Mobile power supply: In image sensor stabilization, it is necessary to solve the power supply problem of the image sensor during movement. Generally, conventional wires, flexible printed circuits (FPCs), printed circuit boards (PCBs), and reed traces are selected to meet the electrical performance requirements of the sensor.

[0098] Optical image stabilization (OIS) refers to the use of optical components in cameras or other similar imaging instruments to avoid or reduce instrument jitter that occurs during the process of capturing light signals, thereby improving image quality.

[0099] A Halbach magnet, or Halbach array, is a special permanent magnet array that enhances the magnetic field on one side of the array while weakening the magnetic field to near zero on the other side of the array.

[0100] FIG1 shows an electronic device 100 provided in an embodiment of the present application. The electronic device 100 may include a front camera module 110 and / or a rear camera module 120 .

[0101] When a user uses the electronic device 100 to perform a shooting operation, the front camera module 110 and / or the rear camera module 120 may undergo one or more of rotation around the optical axis, deflection along the optical axis, and translation in a plane perpendicular to the optical axis.

[0102] FIG2 exemplarily provides a schematic diagram of the composition of a camera module 200 of an electronic device 100 . The camera module 200 may be the aforementioned front camera module 110 or the aforementioned rear camera module 120 .

[0103] The camera module 200 may include a lens 210, an image sensor 220, an image sensor anti-shake component 300, and an image processing chip (not shown). When shooting with the camera module 200, incident light 10 is incident on the lens 210 from the subject being photographed. The incident light 10 is modulated by the lens 210 and can be incident on the image sensor 220. The image sensor 220 can be a complementary metal oxide semiconductor (CMOS) device or a charge coupled device (CCD). The image sensor 220 can convert the incident light signal into an electrical signal. The image signal processor (ISP) within the camera module 200 can convert the electrical signal output by the image sensor 220 into a digital image signal and output it to a digital signal processor (DSP). The DSP can convert the input signal into an image signal in a standard format (e.g., red, green, and blue (RGB) format). The image sensor anti-shake component 300 can be used to mount the image sensor 220, provide power to the image sensor 220, and provide a channel for data transmission.

[0104] In some examples, the camera module 200 may further include one or more other components, such as a voice coil motor (VCM), a filter, and a holder. The voice coil motor can be used to implement the camera module's autofocus function, improving the clarity of images captured by the camera module 200. The filter can improve the quality of images captured by the camera to a certain extent, for example, by filtering out unwanted light to increase the contrast and saturation of the image. The holder can be used to secure the lens 210.

[0105] As mentioned above, it is difficult for the electronic device 100 to remain completely still relative to the subject during the shooting process. When relative movement occurs between the subject and the electronic device, the position of the incident point from the lens 210 to the image sensor 220 may change. This change will, to a certain extent, have an adverse effect on the quality of the image captured by the camera module 200. In order to improve the imaging quality of the camera module 200, it is necessary to improve the anti-shake performance of the image sensor 220.

[0106] In order to improve the anti-shake performance of the image sensor, the present application provides an anti-shake component 300 for an image sensor. The anti-shake component 300 can be used to implement the multi-axis anti-shake function of the image sensor, reduce the adverse effects of the translation, deflection, and rotation of the image sensor on the imaging quality of the camera module of the electronic device 100, and improve the imaging quality of the camera module, which is further explained below.

[0107] Figures 3 and 4 illustrate an image sensor anti-shake assembly 300 provided in an embodiment of the present application. Figure 3 is a perspective view of the anti-shake assembly 300, and Figure 4 is a schematic diagram of the component assembly of the anti-shake assembly 300. The anti-shake assembly 300 may include a housing 310, a first magnet 320, a coil 330, a first circuit board 400, and a bottom plate 340.

[0108] The housing 310 may include a sidewall 311 and a cover plate 312. The sidewall 311 may be formed by extending a distance away from the cover plate 312 from a connection location with the cover plate 312. For example, the sidewall 311 may be formed by extending a distance away from the cover plate 312 along the normal direction (the direction OO' in FIG. 3 ) of the plane where the cover plate 312 is located. That is, the plane where the sidewall 311 is located is perpendicular to the plane where the cover plate 312 is located.

[0109] In some examples, an opening may be provided in the middle area of ​​the cover 312 , and the opening may be used to accommodate devices such as the image sensor 220 and an optical module (eg, the lens 210 ) that cooperates with the anti-shake assembly 300 .

[0110] When the housing 310 is placed on the bottom plate 340, a storage space can be formed between the housing 310 and the bottom plate 340. This storage space can be used to accommodate other devices or components of the anti-shake assembly 300, such as the first magnet 320, coil 330, first circuit board 400, etc. Part or all of the components or devices within the storage space can be exposed at the opening of the cover 312. In some examples, the connection portion 301 of device A can extend from the opening into the storage space, and this connection portion 301 can be used to achieve electrical connection with components outside the anti-shake assembly 300.

[0111] When the housing 310 is covered on the bottom plate 340, the end of the side wall 311 away from the cover plate 312 can contact the bottom plate 340. In some examples, the housing 310 and the bottom plate 340 can be fixedly connected by one or more methods such as gluing, snap fastening, and screws.

[0112] The first magnet 320 and the coil 330 may be disposed opposite to each other, and an interaction force may be generated therebetween.

[0113] In some examples, the first magnet 320 is fixedly connected to the housing 310, and the coil 330 is fixedly connected to the first circuit board 400. When an interaction force is generated between the first magnet 320 and the coil 330, the force can push the coil 330 to cause the first circuit board 400 to deform and / or move.

[0114] For example, when the coil 330 is fixedly connected to the first circuit board 400, taking the coil 330 as the research object, when the first magnet 320 interacts with the coil 330, the coil 330 can be subjected to at least two forces in the same plane that are perpendicular to each other, thereby enabling the image sensor 220 in the anti-shake component 300 to be subjected to driving forces in two directions in the same plane that are perpendicular to each other, and thus to be able to translate or rotate in the plane.

[0115] In some examples, the coil 330 is fixedly connected to the housing 310, and the first magnet 320 is fixedly connected to the first circuit board 400. When an interaction force is generated between the first magnet 320 and the coil 330, the force can push the first magnet 320 to drive the first circuit board 400 to deform and / or move.

[0116] For example, when the first magnet 320 is fixedly connected to the first circuit board 400, taking the first magnet 320 as the research object, when the first magnet 320 interacts with the coil 330, the first magnet 320 can be subjected to at least two forces in the same plane that are perpendicular to each other, thereby enabling the image sensor 220 in the anti-shake component 300 to be driven in two directions in the same plane that are perpendicular to each other, and thus to be able to translate or rotate within the plane.

[0117] When the first magnet 320 is fixedly connected to the housing 310 , one or more fixing members may be provided on the side wall 311 or the cover plate 312 , and the one or more fixing members may be used to fix the first magnet 320 on the housing 310 .

[0118] For example, the one or more fixing members may be a slot-shaped structure, and the shape of the fixing member may match the shape of the first magnet 320. The first magnet 320 may be installed in the slot-shaped structure, and the housing 310 and the first magnet 320 may be fixedly connected by friction between the sidewalls of the slot-shaped structure and the first magnet 320.

[0119] Exemplarily, an adhesive material may be adhered to the surface of the first magnet 320, and the first magnet 320 may be fixedly connected to the side of the cover 312 facing the bottom plate 340 through the adhesive material, or the first magnet 320 may also be fixedly connected to the side of the side wall 311 facing the accommodating space through the adhesive material.

[0120] When the first magnet 320 is fixedly connected to the housing 310 , one or more fixing members may be provided on the side wall 311 or the cover plate 312 , and the one or more fixing members may be used to fix the coil 330 on the housing 310 .

[0121] For example, the one or more fixing members may be a slot-shaped structure or an annular structure, and the shape of the fixing member may match the shape of the coil 330. The coil 330 may be installed in the slot-shaped structure or the annular structure, and the coil 330 may be fixedly connected to the housing 310 by friction between the sidewall of the slot-shaped structure or the annular structure and the first magnet 320.

[0122] Exemplarily, an adhesive material may be adhered to the surface of the coil 330, and the coil 330 may be fixedly connected to the side of the cover 312 facing the bottom plate 340 through the adhesive material, or the coil 330 may also be fixedly connected to the side of the side wall 311 facing the accommodating space through the adhesive material.

[0123] The above merely provides some exemplary ways of connecting the first magnet 320 or the coil 330 to the housing 310. It should be understood that the first magnet 320 or the coil 330 can be connected to the housing 310 in more ways, and this application does not impose any restrictions on this.

[0124] One of the first magnet 320 and the coil 330 (for example, referred to as the first component) can be fixedly connected to the housing 310, and the other component (for example, referred to as the second component) can be arranged opposite to the first component, and the first component and the second component can interact with each other through magnetic force, and the interaction caused by the magnetic force can drive the image sensor to displace or rotate.

[0125] The following embodiments are described using an example in which the first magnet 320 is fixedly connected to the housing 310, and the coil 330 is fixedly connected to the first circuit board 400. In some examples, the first magnet 320 may also be fixedly connected to the first circuit board 400, and the coil 330 may also be fixedly connected to the housing 310. In other words, the first magnet 320 and the coil 330 may be relatively fixed, and when current is passed through the coil 330, an interaction force is generated between the first magnet 320 and the coil 330.

[0126] Because the coil 330 requires electrical connection, the anti-shake assembly 300 provided in this application can use the first circuit board 400 as a power supply circuit (this part is explained in detail below). Therefore, the coil 330 can be placed close to the first circuit board 400, or in other words, the coil 330 can be fixedly connected to the first circuit board 400. This helps simplify the wiring within the anti-shake assembly 300 and improve the utilization of the internal space of the anti-shake assembly 300. When the interconnecting wires within the first circuit board 400 do not serve as the power supply line for the coil 330, or when the power supply line for the coil 330 does not pass through the first circuit board 400, the number of interconnecting wires within the first circuit board 400 is reduced, the elastic modulus of the first circuit board 400 can be larger, and under the same applied force, the first circuit board 400 can have a larger deformation, which is more conducive to the anti-shake assembly 300 driving the image sensor.

[0127] As shown in FIG. 5 , the first magnet 320 may include a first sub-magnet 321 , a second sub-magnet 322 , a third sub-magnet 323 and a fourth sub-magnet 324 . These four sub-magnets may be disposed along the outer frame of the cover plate 312 .

[0128] Exemplarily, the cover plate 312 can be rectangular or approximately rectangular. When the first magnet 320 is fixedly connected to the housing 310, the first sub-magnet 321, the second sub-magnet 322, the third sub-magnet 323, and the fourth sub-magnet 324 can be respectively arranged near the four outer frames of the cover plate 312. The first sub-magnet 321 and the third sub-magnet 323 are arranged opposite each other, and the second sub-magnet 322 and the fourth sub-magnet 324 are arranged opposite each other. The shape, size, and magnetic field strength distribution that the four sub-magnets included in the aforementioned first magnet 320 can be substantially consistent, thereby facilitating improved production and assembly efficiency of the anti-shake assembly 300.

[0129] In some examples, the first magnet 320 may include only any three sub-magnets of the first sub-magnet 321 , the second sub-magnet 322 , the third sub-magnet 323 and the fourth sub-magnet 324 , for example: the first sub-magnet 321 , the second sub-magnet 322 and the third sub-magnet 323 .

[0130] In some examples, the first magnet 320 may include two adjacent sub-magnets among the first sub-magnet 321, the second sub-magnet 322, the third sub-magnet 323, and the fourth sub-magnet 324. For example, the first sub-magnet 321 and the second sub-magnet 322, the third sub-magnet 323 and the fourth sub-magnet 324, the second sub-magnet 322 and the third sub-magnet 323, etc.

[0131] The first magnet 320 can be a single magnet. Figure 6 exemplarily provides a schematic diagram of a single magnet. The first magnet 320 includes a side A and a side B disposed opposite each other. Outside the first magnet 320, magnetic flux lines emanate from side A and enter the interior of the magnet through side B. Inside the first magnet 320, magnetic flux lines extend from side B to side A. The direction of the arrows in the figure indicates the direction of the magnetic flux lines within the magnet.

[0132] The density of the magnetic flux lines on the A side of the first magnet 320 is comparable to the density of the magnetic flux lines on the B side. The magnetic field intensities at the corresponding points on the A side and the B side (such as points p1 and p2 in FIG6 ) are substantially equal, and the magnetic field intensity distribution on the A side is similar to the magnetic field intensity distribution on the B side. In this case, the interaction force generated between the first magnet 320 and the coil 330 when the A side of the first magnet 320 faces the coil 330 is substantially the same as when the B side of the first magnet 320 faces the coil 330. In other words, in this case, either the A side of the first magnet 320 can face the coil 330 or the B side of the first magnet 320 can face the coil 330.

[0133] The first magnet 320 may also be a Halbach magnet. FIG7 exemplarily provides a schematic diagram of a Halbach magnet. The first magnet 320 includes an A surface and a B surface disposed opposite each other. The arrows in the figure may be used to indicate the direction of the magnetic flux lines within the first magnet 320.

[0134] The directions of the magnetic flux lines in different areas within the first magnet 320 are different. For the first magnet 320 shown in Figure 7, the magnetic flux line density on the A side is higher and the magnetic field strength is greater, while the magnetic flux line density on the B side is lower and the magnetic field strength is smaller. According to Ampere's law, for wires of the same length and equal current, the greater the magnetic induction intensity, the greater the force on the wire in the coil. In this case, it is possible to consider facing the A side of the first magnet towards the coil 330 to increase the force on the coil.

[0135] As mentioned above, the use of Halbach magnets can, to a certain extent, increase the force generated between first magnet 320 and coil 330. This force can be used to drive the image sensor to shift or rotate. In other words, compared to a single magnet, Halbach magnets can, to a certain extent, increase the driving force of anti-shake assembly 300 on the image sensor. From another perspective, to achieve the same driving force, the use of Halbach magnets requires a lower driving current and a smaller coil length (or volume) than using a single magnet.

[0136] It should be noted that FIG. 7 only exemplifies the structure of a Halbach magnet. The Halbach magnet may also be in other shapes such as annular or circular. These Halbach magnets of different forms may all be used in the anti-shake assembly 300 , and this application does not impose any restrictions on this.

[0137] The coil 330 may be arranged in cooperation with the first magnet 320 , so that when the coil 330 is energized, an interaction force may be generated between the coil 330 and the first magnet 320 .

[0138] As shown in Figure 4, when the first magnet 320 is fixedly connected to the shell 310, the coil 330 can be arranged directly below the first magnet 320, or in other words, the coil 330 and the first magnet 320 can be stacked along the direction of the optical axis OO', and the coil 330 is located on the side close to the first circuit board 400, and the first magnet 320 is located on the side close to the cover 311 of the shell 310.

[0139] In some examples, as shown in conjunction with FIG. 4 and FIG. 8 , the coil 330 may include a first sub-coil 331A, a second sub-coil 332A, a third sub-coil 333A, a fourth sub-coil 331B, a fifth sub-coil 332B, and a sixth sub-coil 333B.

[0140] Among them, the first sub-coil 331A and the fourth sub-coil 331B can be regarded as the first sub-coil group, which can interact with the first magnet 320 arranged opposite thereto, thereby being used to generate a force along the positive direction of the X-axis or along the negative direction of the X-axis in Figure 9. The second sub-coil 332A and the fifth sub-coil 332B can be regarded as the second sub-coil group, which can interact with the first magnet 320 arranged opposite thereto, thereby being used to generate a force along the positive direction of the Y-axis or along the negative direction of the Y-axis in Figure 9. Similarly, the third sub-coil 333A and the sixth sub-coil 333B can be regarded as the third sub-coil group, which can be used to generate a force along the positive direction of the Y-axis or along the negative direction of the Y-axis in Figure 9.

[0141] 8 and 9 , in some examples, the forces F1 and F2 acting on the first sub-coil group both pass through the optical axis OO', that is, the length of the force arms of F1 and F2 acting on the optical axis is zero, and F1 and F2 cannot generate a torque that causes the first sub-coil group to rotate.

[0142] In some examples, neither of the forces F3 and F4 acting on the second sub-coil assembly passes through the optical axis OO', and F3 and F4 can generate a torque that causes the second sub-coil assembly to rotate about the optical axis OO'. For example, by controlling the shapes of the second sub-coil 332A and the fifth sub-coil 332B and the magnitude of the current passing therethrough, such that the torque acting on the second sub-coil 332A and the torque acting on the fifth sub-coil 332B are equal in magnitude and have the same direction, the combined torque of the second sub-coil assembly can drive the first circuit board 400, to which it is fixedly connected, to rotate.

[0143] In some examples, none of the forces acting on the third sub-coil assembly pass through the optical axis OO', and the forces acting on the third sub-coil assembly can generate a torque that causes the third sub-coil assembly to rotate about the optical axis OO'. For example, the torque acting on the third sub-coil 333A and the torque acting on the sixth sub-coil 333B have the same direction and magnitude, and the third sub-coil assembly can drive the first circuit board 400, to which it is fixed, to rotate.

[0144] In some examples, in order to control the magnitude of the driving force that the anti-shake module 300 can generate to drive the image sensor to translate or rotate, the controller can control the magnitude of the current passing through one or more sub-coils included in the coil 330, or the controller can simultaneously energize one or more sub-coils in the coil 330, that is, use one or more sub-coils in the coil 330 in combination.

[0145] Exemplarily, the coil 330 may include a plurality of sub-coils (such as the aforementioned first sub-coil 331A and fourth sub-coil 331B) for generating the driving force along the X-axis direction in FIG9 . In the case where the image sensor needs to move a small distance along the X-axis direction, this can be achieved by passing current through a smaller number of sub-coils, for example, passing current only through the first sub-coil 331A, or by passing a smaller current through the same coil. Correspondingly, in the case where the image sensor needs to move a large distance along the X-axis direction, this can be achieved by passing current through a larger number of sub-coils, for example, passing current through both the first sub-coil 331A and the fourth sub-coil 331B, or by passing a larger current through the same coil.

[0146] Also exemplarily, the coil 330 may include a plurality of sub-coils (such as the aforementioned second sub-coil 332A, third sub-coil 333A, fifth sub-coil 332B, and sixth sub-coil 333B) for generating a driving force to drive the image sensor to rotate around the optical axis OO'. In the case where the image sensor needs to rotate around the optical axis OO' by a smaller angle, this can be achieved by passing current through a smaller number of sub-coils, for example, passing current only through the second sub-coil 332A, or by passing a smaller current through the same coil. In the case where the image sensor needs to rotate around the optical axis OO' by a larger angle, this can be achieved by passing current through a larger number of sub-coils, for example, passing current through the second sub-coil 332A, the third sub-coil 333A, the fifth sub-coil 332B, and the sixth sub-coil 333B at the same time, or by passing a larger current through the same coil.

[0147] Furthermore, if multiple sub-coils are capable of generating the same type of driving force, different numbers of turns can be configured for different sub-coils (e.g., the second sub-coil 332A and the third sub-coil 333A). Thus, for the same current, coils with different numbers of turns can generate different driving forces. If a smaller driving force is required, current can be passed through the coil with fewer turns, thereby providing the driving force. If a larger driving force is required, current can be passed through the coil with more turns, thereby providing the driving force.

[0148] The above only provides some exemplary ways of controlling the magnitude and direction of the driving force generated by the coil 330 by controlling the properties of the coil, the magnitude of the current inside the coil, and the combination of coils. It should be understood that the above control methods should not be regarded as limitations on the embodiments of the present application.

[0149] In some examples, coil 330 may include some of the aforementioned multiple sub-coils. For example, coil 330 may include only a first sub-coil 331A and a second sub-coil 332A. In this case, first sub-coil 331A is used to generate a force along the positive direction of the X-axis or the negative direction of the X-axis in FIG. 9 , and second sub-coil 332A is used to generate a force along the positive direction of the Y-axis or the negative direction of the Y-axis in FIG. 9 . In addition, second sub-coil 332A may also be used to generate a torque acting on second sub-coil 332A about optical axis OO' as the rotation axis.

[0150] For another example, the coil 330 may include only a first sub-coil 331A, a second sub-coil 332A and a third sub-coil 333A. In this case, the first sub-coil 331A is used to generate a force along the positive direction of the X-axis or the negative direction of the X-axis in Figure 9, and the second sub-coil 332A and / or the third sub-coil 333A is used to generate a force along the positive direction of the Y-axis or the negative direction of the Y-axis in Figure 9, and the second sub-coil 332A and / or the third sub-coil 333A can also be used to generate a torque acting on the second sub-coil 332A or the third sub-coil 333A with the optical axis OO' as the rotation axis.

[0151] The coil 330 may also include other combinations of multiple sub-coils from the first sub-coil 331A to the sixth sub-coil 333B mentioned above, and the multiple sub-coils may satisfy the following requirements: they may generate a force along the X-axis direction or the Y-axis direction in FIG9 , and they may also generate a torque with the optical axis OO' as the rotation axis, acting on the second coil group or the third coil group.

[0152] As previously described, when the coil 330 is energized, the coil 330 can generate a force or torque. In some examples, the coil 330 can be fixedly connected to the connecting arm 420 of the first circuit board 400, so that the force or torque can form a driving force that causes the first circuit board 400 to translate or rotate.

[0153] For example, the force generated by the coil 330 can act on the connecting arm 420 of the first circuit board 400. When subjected to the force, the connecting arm 420 will deform and generate stress. The stress can act on the fixed outer frame 410 and the movable platform 430, which are fixedly connected to the connecting arm 420. Because the fixed outer frame 410 is fixedly connected to the cover 310 or the bottom plate 340, it is difficult to undergo significant deformation or displacement. However, the movable platform 430 can undergo corresponding displacement under the action of the connecting arm 420. Similarly, when a torque acts on the connecting arm 420, the connecting arm 420 can deform, thereby driving the movable platform 430 to rotate accordingly.

[0154] In some examples, the coil 330 may be fixedly connected to the movable platform 430 of the first circuit board 400 , so that the force or torque may form a driving force that causes the movable platform 430 to translate or rotate.

[0155] Exemplarily, the force generated by the coil 330 may act on the movable platform 430 of the first circuit board 400 , causing the connecting arm 420 fixedly connected to the movable platform 430 to deform or displace accordingly, thereby achieving translation or rotation of the movable platform 430 .

[0156] In general, the coil 330 may include at least coil #A and coil #B, wherein coil #A can generate a first force with the first magnet 320 when energized, and coil #B can generate a second force with the first magnet 320 when energized. In other words, when energized, coil #A can be subjected to the first force, and coil #B can be subjected to the second force. Here, the direction of the first force and the direction of the second force can be perpendicular to each other, and at least one of the first force and the second force does not pass through the optical axis OO'. In this way, the coil 330 can drive the image sensor on the anti-shake assembly 300 to displace and / or rotate.

[0157] It should be noted that if the anti-shake assembly 300 does not need to implement an anti-shake function along the X-axis in Figure 9 , the coil 330 may not include a coil for generating a force along the X-axis in Figure 9 . Similarly, if the anti-shake assembly 300 does not need to implement an anti-shake function along the Y-axis in Figure 9 , the coil 330 may not include a coil for generating a force along the Y-axis in Figure 9 . If the anti-shake assembly 300 does not need to implement a rotational anti-shake function about the optical axis OO', the coil 330 may not include a coil for generating a torque about the optical axis OO'.

[0158] Figure 10 exemplarily provides a structure of a first circuit board 400, which may include a fixed outer frame 410, a connecting arm 420 and a movable platform 430, wherein the connecting arm 420 is located between the fixed outer frame 410 and the movable platform 430, and the connecting arm 420 is used to connect the fixed outer frame 410 and the movable platform 430.

[0159] The first circuit board 400 can be fixedly connected to the coil 330. When an interaction force is generated between the coil 330 and the first magnet 320, the coil 330 can drive the first circuit board 400 to displace or rotate, so that the image sensor mounted on the first circuit board 400 can move with the movement of the first circuit board 400.

[0160] The coil 330 can be fixedly connected to the movable platform 430 of the first circuit board 400, and the coil 330 can directly drive the movable platform to move or rotate. The coil 330 can also be fixedly connected to the connecting arm 420 of the first circuit board 400, and the deformation and / or displacement of the connecting arm 420 can drive the movable platform 430 to move or rotate.

[0161] In some examples, referring to Figures 10 and 11 , the fixed outer frame 410 is generally in the shape of a square frame, and the fixed outer frame 410 is used to fix the first circuit board 400 in the accommodation space between the cover 310 and the bottom plate 340. In some examples, the first circuit board 400 can be fixedly connected to the housing 310 through the fixed outer frame 410.

[0162] In some examples, the fixed outer frame 410 may be provided with a connecting portion 411, wherein the first connecting portion 411 is connected to one end of the connecting arm 420. As shown in FIG11 , the fixed outer frame 410 may include four sub-connecting portions (respectively, a first sub-connecting portion 411A, a second sub-connecting portion 411B, a third sub-connecting portion 411C, and a fourth sub-connecting portion 411D). Each of these four sub-connecting portions may be provided with one or more connection points, and each connection point on the sub-connecting portion may be used to connect to one end of the connecting arm 420. The four sub-connecting portions are centrally symmetrical about the rotation center of the first circuit board 400, and the connection points provided on the four sub-connecting portions may also be centrally symmetrical about the rotation center O of the first circuit board 400.

[0163] In other words, the fixed outer frame 410 shown in FIG11 may include eight connection points, with each of the eight connection points forming a group of two, forming four groups of connection points. The positions of the four groups of connection points on the fixed outer frame 410 are centrally symmetrical about the rotation center O of the first circuit board 400. The four groups of connection points are respectively fixedly connected to one end of the four groups of connecting arms.

[0164] The connecting arms 420 are used to connect the fixed outer frame 410 and the movable platform 430. There can be multiple connecting arms 420. In some examples, referring to Figures 10 and 12 , the first circuit board 400 can include eight connecting arms 420, with two connecting arms forming a group, forming four groups of connecting arms. These four groups of connecting arms 420 are substantially centrally symmetrical about the rotation center O of the first circuit board 400. Each of the eight connecting arms 420 is connected to the fixed outer frame 410 at one end and to the movable platform 430 at the other end.

[0165] As shown in Figure 10, a certain interval can be set between the connecting arm 420 and the fixed outer frame 410, between the connecting arm 420 and the movable platform, and between two adjacent connecting arms in the same group of connecting arms. Therefore, when the connecting arm 420 is deformed or displaced by force, the aforementioned interval can provide deformation or displacement space for the connecting arm 420, which is conducive to the force between the coil 330 and the first magnet 320 to drive the movable platform 430 to displace or rotate.

[0166] In some examples, the connecting arms 420 may include a first group of connecting arms, a second group of connecting arms, a third group of connecting arms, and a fourth group of connecting arms. The first group of connecting arms includes the first and second connecting arms, the second group of connecting arms includes the third and fourth connecting arms, the third group of connecting arms includes the fifth and sixth connecting arms, and the fourth group of connecting arms includes the seventh and eighth connecting arms.

[0167] For example, as shown in FIG12 , the first group of connecting arms is located in the upper right corner, the second group of connecting arms is located in the lower right corner, the third group of connecting arms is located in the lower left corner, and the fourth group of connecting arms is located in the upper left corner. The first group of connecting arms includes a first connecting arm 421 and a second connecting arm 422. In some examples, a connecting rod 423 may be provided between the first connecting arm 421 and the second connecting arm 422. The connecting rod 423 may be used to achieve relative fixation between the first connecting arm 421 and the second connecting arm 422, or in other words, when the connecting rod 423 is provided, the deformation of the first connecting arm 421 and the deformation of the second connecting arm 422 may be relatively synchronized, or the displacement of the first connecting arm 421 and the displacement of the second connecting arm 422 may be relatively synchronized, thereby making it easier to achieve control of the movable platform 430 by the first group of connecting arms.

[0168] The connecting rod 423 can have the same structure as the first connecting arm 421 and / or the second connecting arm 422. For example, if interconnecting wires are provided inside the first connecting arm 421 and the second connecting arm 422, the connecting rod 423 can also be provided with interconnecting wires. Thus, the interconnecting wires inside the connecting rod 423 can be electrically connected to the interconnecting wires inside the first connecting arm 421 and the second connecting arm 422, thereby providing flexibility in the arrangement of the interconnecting wires inside the first circuit board 400. The interconnecting wires are described in detail below and will not be elaborated on here.

[0169] One or more connecting rods may be provided between the multiple connecting arms within the same group of connecting arms, and the position of the connecting rod may be located at a portion of the connecting arm where the direction of force changes. For example, as shown in FIG12 , the first connecting arm 421 includes a horizontal portion and a vertical portion that are interconnected, and the direction of force on the connecting arm is generally along the axis of the arm. The position where the connecting rod 423 is provided on the first connecting arm 421 may be the connection between the horizontal portion and the vertical portion. The connecting rod may also be provided at other positions of the connecting arm, for example, the connecting rod may also be provided at one end of the connecting arm close to the fixed outer frame 410, or the connecting rod may also be provided at one end of the connecting arm close to the movable platform 430, and this application does not impose any restrictions on this. The connecting rod may be perpendicular to the connecting arm, thereby reducing the length of the connecting rod, and the connecting rod may also be provided at an angle to the connecting arm, which is conducive to improving the flexibility of the setting of the connecting rod.

[0170] The first circuit board 400 may further include more or fewer connecting arms 420. For example, the first circuit board 400 may include two or six connecting arms 420. The multiple connecting arms 420 may be centrally symmetrical about the rotation center O of the first circuit board 400. A smaller number of connecting arms can simplify the structure of the first circuit board 400 and improve the production efficiency of the first circuit board 400. A larger number of connecting arms can help improve the reliability and stability of the force between the coil 330 and the first magnet 320 in driving the image sensor 220.

[0171] In some examples, as shown in FIG. 13 , the connecting arm 420 includes a first connecting end 424A and a second connecting end 424B, the first connecting end 424A is fixedly connected to the fixed outer frame 410 , and the second connecting end 424B is fixedly connected to the movable platform 430 .

[0172] In some examples, the angle between a line connecting the first connection end 424A of the connecting arm 420 and the rotation center O of the first circuit board 400 and a line connecting the second connection end 424B and the rotation center O of the first circuit board 400 is greater than or equal to 90°. In other words, the angle between a line connecting the first connection end 424A of the connecting arm 420 and the rotation center O of the first circuit board 400 and a line connecting the second connection end 424B and the rotation center O of the first circuit board 400 is a non-acute angle. Here, the direction from the rotation center O to the first connection end 424A or the second connection end 424B is considered the positive direction of both sides of the angle.

[0173] The above technical solution can also be understood as follows: with the rotation center O of the multiple connecting arms 420 as the center of symmetry, two mutually perpendicular lines passing through the rotation center can divide the plane formed by the multiple connecting arms 420 into quadrants I, II, III, and IV as shown in Figure 12. The connecting arms 420 should pass through at least two of the four quadrants.

[0174] In some examples, the connecting arm 420 may pass through two of the four quadrants mentioned above, for example, the connecting arm 420 may pass through quadrants I and II, or through quadrants II and III, or through quadrants IV and I.

[0175] In some examples, the connecting arm 420 can pass through three of the four quadrants mentioned above, for example, the connecting arm 420 can pass through quadrant I, quadrant II and quadrant III, or pass through quadrant II, quadrant III and quadrant IV, or pass through quadrant III, quadrant IV and quadrant I, etc.

[0176] In some examples, the connecting arm 420 may pass through the above four quadrants at the same time, that is, the connecting arm 420 may pass through the quadrant I, the quadrant II, the quadrant III, and the quadrant IV as shown in FIG. 12 .

[0177] The connecting arm 420 can be composed of multiple connecting arms, and the multiple connecting arms can be formed into different shapes. In other words, the connecting arm 420 can have a variety of different shapes. For example, as shown in Figure 10 or Figure 13, the connecting arm 420 is roughly "L"-shaped. In some examples, the connecting arm 420 can also be roughly "U"-shaped, "Z"-shaped, and so on. Figure 14 exemplarily provides some possible shapes of the connecting arms 420. In these connecting arms 420, each connecting arm includes a first end connected to the fixed outer frame 410 and a second end connected to the movable platform, and the angle α formed between the line connecting the first end and the rotation center O and the connection between the second end and the rotation center O is greater than or equal to 90°.

[0178] As shown in Figure 14(a), connecting arm 420 can be considered to comprise three sub-connecting arms, with adjacent sub-connecting arms perpendicular to each other, forming a roughly U-shaped connection. The angle formed by the line connecting the two ends of the connecting arm and the rotation center O is obtuse, i.e., angle α in the figure is greater than 90°. Connecting arm 420 shown in Figure 14(a) can also be considered to simultaneously pass through three of the four quadrants shown in Figure 12.

[0179] As shown in (b) of Figure 14 , the connecting arm 420 can be considered to include four sub-connecting arms, and the angle formed between two adjacent sub-connecting arms 420 can be an acute angle, a right angle, or an obtuse angle. For example, in (b) of Figure 14 , β1 < 90°, β2 > 90°, and β3 = 90°. The angle formed by the line connecting the two ends of the connecting arm and the rotation center O is an obtuse angle, that is, the angle α in the figure is > 90°. The connecting arm 420 shown in (b) of Figure 13 can also be considered to pass through four of the four quadrants shown in Figure 12 at the same time.

[0180] As shown in Figure 14(c), connecting arm 420 can be considered to comprise three sub-connecting arms, with adjacent sub-connecting arms 420 perpendicular to each other, forming a roughly "Z" shape. The angle formed by the line connecting the two ends of the connecting arm and the rotation center O is approximately a straight angle, that is, angle α in the figure = 180°. The connecting arm 420 shown in Figure 14(c) can also be considered to simultaneously pass through three of the four quadrants shown in Figure 12.

[0181] As shown in Figure 14(d), connecting arm 420 may be a curved rod, and the angle formed by the line connecting the two ends of the connecting arm and the rotation center O is an obtuse angle, that is, angle α in the figure is greater than 90°. Connecting arm 420 shown in Figure 14(d) can also be considered to simultaneously pass through three of the four quadrants shown in Figure 12.

[0182] FIG15 exemplarily provides a movable platform 430 , which is substantially in the shape of a square frame. An internal opening 432 of the movable platform 430 can be used to accommodate an image sensor.

[0183] The movable platform 430 may be provided with a second connection portion 431, which is connected to the other end of the connecting arm 420 connected to the fixed outer frame 410. For example, in Figure 15, the movable platform 430 may include four sub-connecting portions (respectively, a fifth sub-connecting portion 431A, a sixth sub-connecting portion 431B, a seventh sub-connecting portion 431C, and an eighth sub-connecting portion 431D). Each of these four sub-connecting portions may be provided with one or more connection points, and the connection points on each sub-connecting portion may be used to connect to one end of the connecting arm 420. The four connecting portions are symmetrical about the rotation center of the first circuit board 400, and the connection points provided on the four sub-connecting portions may also be symmetrical about the rotation center of the first circuit board 400.

[0184] In other words, each sub-connection portion on the movable platform 430 can be connected to the ends of multiple connecting arms at the same time. For example, in conjunction with Figures 10 and 15, a sub-connection portion of the movable platform 430 can be connected to the ends of two connecting arms 420 at the same time. That is, the movable platform 430 shown in Figure 15 can include 8 connection points, each of which is a group of two connection points, forming 4 groups of connection points. The positions of these 4 groups of connection points on the movable platform 430 are centrally symmetrical about the rotation center O of the first circuit board 400. These 4 groups of connection points are respectively fixedly connected to the ends of the 4 groups of connecting arms away from the fixed outer frame 410.

[0185] 10 and 11 , interconnecting wires may be laid inside the first circuit board 400, or in other words, interconnecting wires may be laid inside the fixed outer frame 410, the connecting arm 420 and the movable platform 430 of the first circuit board 400. The interconnecting wires may be used to connect the electronic components inside the anti-shake assembly 300 with an external power supply.

[0186] In some examples, the fixed outer frame 410 can be provided with an extension portion 412, on which a power interface (e.g., a B2B interface) is provided. One end of the power interface can be connected to an external power supply, and the other end of the power interface can be connected to the interconnection line inside the first circuit board 400, thereby achieving electrical conduction between the internal interconnection line of the first circuit board 400 and the external power supply.

[0187] The interconnection line laid within the fixed outer frame 410 can be referred to as a first interconnection line, and the power interface on the extension portion 412 can be connected to the first interconnection line. The interconnection line laid within the connecting arm 420 can be referred to as a second interconnection line, and the interconnection line laid within the movable platform 430 can be referred to as a third interconnection line. One end of the second interconnection line can be connected to (or electrically connected to) the end of the first interconnection line away from the power interface, and the other end of the second interconnection line can be connected to (or electrically connected to) the third interconnection line. The other end of the third interconnection line connected to the second interconnection line can be connected to electronic components such as the image sensor on the anti-shake assembly 300.

[0188] Electrical connection points (e.g., pins or contacts) may be provided on the inner sidewalls of the movable platform 430. These electrical connection points may be used to electrically connect to electronic components such as an image sensor, thereby enabling the image sensor to be powered by an external power source provided via the power interface of the first circuit board 400. In some examples, these electrical connection points may also be used to power the coil 330 and other electronic components (e.g., a control chip, a Hall element, etc.) within the aforementioned anti-shake assembly 300.

[0189] Figure 16 provides an exemplary schematic diagram of a cross-section taken along line AA of the first circuit board 400 in Figure 10 . In cross-section AA, the outer solid portion represents the cross-section of the fixed outer frame 410, the connecting arm 420 represents the cross-section between the fixed outer frame 410, and the movable platform 430 represents the cross-section in the middle of cross-section AA. As shown, the fixed outer frame 410 may be provided with a first interconnect 401, the connecting arm 420 may be provided with a second interconnect 402, and the movable platform 430 may be provided with a third interconnect 403.

[0190] The number of first interconnection line 401, second interconnection line 402, and third interconnection line 403 may be one or more. In the case of multiple interconnection lines, the multiple interconnection lines may be stacked, with a dielectric layer between the multiple interconnection lines. The dielectric layer may be a poor conductor, or the conductivity of the dielectric layer may be less than a preset threshold. For example, the dielectric layer may be made of an organic material with low conductivity, such as epoxy resin.

[0191] When the same connection portion of the fixed outer frame 410 and the same connection portion of the movable platform 430 are connected to each other via multiple connection arms 420, and a connection rod is provided between the multiple connection arms 420, an interconnection line may also be laid inside the connection rod, and the interconnection line inside the connection rod may be used to connect the interconnection lines inside the two connection arms 420. Alternatively, the connection rod may be made of a conductive material (e.g., a metal material), or alternatively, the connection rod may include a conductive portion, and the connection rod or the conductive portion of the connection rod may be used to connect the interconnection lines inside the two connection arms. When the connection rod is made of a metal material, the connection rod may also be referred to as a metal flexure.

[0192] In some examples, the first circuit board 400 can be manufactured by laminating multiple conductive layers and multiple dielectric layers, which are then pressed together to form a plate. Local regions of the plate structure (e.g., the regions between the multiple connecting arms 420, the spacing between the connecting arms 420 and the fixed outer frame 410, the spacing between the connecting arms 420 and the movable platform 430, and the opening in the middle of the movable platform) are then hollowed out. The conductive layer comprises the aforementioned first interconnects 401, second interconnects 402, and third interconnects 403, while the dielectric layer serves as an insulator disposed between the conductive layers.

[0193] In some examples, the conductive layer and the dielectric layer may be pre-processed into the shape of the first circuit board 400 as shown in FIG. 10 , and then multiple conductive layers and multiple dielectric layers may be laminated to form the first circuit board 400 .

[0194] In some examples, the fixed outer frame 410, connecting arm 420 and movable platform 430 of the first circuit board 400 can be prepared separately, and the first circuit board 400 can be obtained by assembling the fixed outer frame 410, connecting arm 420 and movable platform 430 in the shape shown in Figure 10.

[0195] The above merely provides some exemplary methods for preparing the first circuit board 400 , and these methods should not be construed as limiting the first circuit board 400 in this application.

[0196] 4 and 17 , the anti-shake assembly 300 may further include a support plate 360 ​​, which may be disposed between the first circuit board 400 and the base plate 340 . The support plate 360 ​​may reduce direct friction between the image sensor and the base plate 340 , thereby reducing wear on the image sensor.

[0197] In some examples, an opening may be provided in the middle region of the support plate 360, and the position of the opening may correspond to the position of the opening in the middle region of the movable platform 430 on the first circuit board 400. When the image sensor is mounted in the opening position of the movable platform 430, the opening provided in the support plate 360 ​​may be used to accommodate a portion of the image sensor, which may be referred to as a protrusion of the image sensor.

[0198] In some examples, the size and shape of the opening of support plate 360 ​​can be determined by the shape and size of the protrusion of the image sensor. For example, when the image sensor is mounted on movable platform 430, the protrusion of the image sensor can be locked within the opening of support plate 360. When the image sensor is translated or rotated, the image sensor can also drive support plate 360 ​​to translate or rotate.

[0199] One or more feet 361 may be provided on the side of the support plate 360 ​​facing the base plate 340. The height of the feet 361 may be greater than the height of the protrusion of the image sensor extending out of the opening of the support plate 360 ​​when the protrusion is engaged with the support plate 360. This allows the feet of the support plate 360 ​​to contact the base plate 340 when the image sensor moves the support plate 360, thereby preventing direct contact between the image sensor and the base plate 340 and reducing the risk of wear and damage to the image sensor.

[0200] The support plate 360 ​​may be provided with multiple feet. For example, as shown in FIG17 , the support plate 360 ​​may include three feet: a first foot 361A, a second foot 361B, and a third foot 361C. The positions of these three feet may be centrally symmetrical about the rotation center O of the support plate 360. The heights of these three feet may be substantially consistent, thereby ensuring relatively stable contact between the support plate 360 ​​and the base plate 340 and minimizing the likelihood of causing jitter along the optical axis.

[0201] The support plate 360 ​​may also be provided with other numbers or positions of feet, for example, the number of feet may be four, and the feet may be symmetrically distributed about the axis of symmetry of the support plate 360. FIG17 is merely an exemplary illustration and should not be construed as limiting the present application.

[0202] In some examples, a friction medium (or lubricating material), such as grease, may be filled between the support plate 360 ​​and the base plate 340. In some examples, a surface coating may be provided on the side of the support plate 360 ​​facing the base plate 340 to reduce friction between the support plate 360 ​​and the base plate 340.

[0203] To improve the stability of friction between the support plate 360 ​​and the base plate 340 and reduce the likelihood of vibration during friction, in some examples, the base plate 340 can be made of a magnetic material containing one or more of iron, cobalt, or nickel. The anti-shake assembly 300 can also include a second magnet, which can be positioned directly above the first circuit board 400. The second magnet and the base plate 340 can generate an attractive force, thereby pressing the first circuit board 400 and the support plate 360 ​​between the second magnet and the base plate 340 onto the base plate 340. The position of the second magnet can correspond to the position of the foot 261 on the support plate 360. When the second magnet and the base plate 340 generate an attractive force, the foot 361, which is in direct contact with the base plate 340, can be subjected to pressure perpendicular to the base plate 340, thereby strengthening the contact between the foot 361 and the base plate 340 and making the nature and magnitude of the friction between them more stable and reliable.

[0204] In some examples, as shown in FIG4 , the support plate 360 ​​can be located inside the base plate 340 . Because the support plate 360 ​​has a certain thickness and is disposed between the base plate 340 and the first circuit board 400 , a portion of spaced-apart area exists around the periphery of the support plate 360 ​​between the first circuit board 400 and the base plate 340 . In some examples, as shown in FIG4 , a support frame 370 , as shown in FIG18 , can be disposed around the periphery of the support plate 360 ​​. The thickness of the support frame 370 can match the height of the space between the first circuit board 400 and the base plate 340 . Specifically, if the support plate 360 ​​does not have the spacers 361 , the thickness of the support frame 370 can be similar to or the same as the thickness of the support plate 360 ​​. If the support plate 360 ​​has the spacers 361 , the thickness of the support frame 370 can be similar to or the same as the sum of the thickness of the support plate 360 ​​and the height of the spacers 361 .

[0205] In some embodiments, the support frame 370 can be placed between the fixed outer frame 410 of the first circuit board 400 and the bottom plate 340. In other words, the support frame 370 can avoid the connection arm 420 of the first circuit board 400. Therefore, when the connection arm 420 is deformed or displaced by the driving force, the friction caused by the connection arm 420 contacting other components will not adversely affect the deformation or displacement of the connection arm 420.

[0206] In some examples, referring to FIG. 4 and FIG. 19 , the anti-shake assembly 300 may further include a second circuit board 350, which may be disposed directly above the first circuit board 400. The second circuit board 350 may also be referred to as a fixing plate 350. The second circuit board 350 may be used to fix components included in the anti-shake assembly 300. For example, the second circuit board 350 may be used to fix the coil 330 or the first magnet 320. In this case, the second circuit board 350 may be fixedly connected to the first circuit board 400.

[0207] In some examples, the second circuit board 350 can be fixedly connected to the movable platform 430 of the first circuit board 400. When magnetic force is generated between the coil 330 and the first magnet 320, the second circuit board 350 can directly drive the movable platform 430 to displace or rotate under the drive of the coil 330 or the first magnet 320.

[0208] The interaction force between the coil 330 and the first magnet can directly push the movable platform 430 , so the conversion efficiency of mechanical energy into kinetic energy is higher, and the energy utilization efficiency of the anti-shake component 300 is higher.

[0209] In some examples, the second circuit board 350 may also be fixedly connected to the connecting arm 420 of the first circuit board 400. When a magnetic force is generated between the coil 330 and the first magnet 320, the second circuit board 350 may drive the connecting arm 420 to displace or deform under the drive of the coil 330 or the first magnet 320, thereby causing the image sensor mounted on the first circuit board 400 to translate or rotate.

[0210] The solution of fixedly connecting the second circuit board 350 and the connecting arm 420 can be regarded as an alternative solution. When the area of ​​the movable platform 430 is limited, or when it is difficult to fixedly connect the second circuit board 350 and the movable platform 430, it can be considered to use the connecting arm 420 to fix the second circuit board 350. This is beneficial to improving the space utilization efficiency inside the anti-shake assembly 300 to a certain extent.

[0211] The second circuit board 350 and the first circuit board 400 can be fixedly connected by one or more methods such as welding and riveting, which is not limited in this application. The second circuit board 350 and the first circuit board 400 can be electrically connected, so that the second circuit board 350 can obtain external power supply through the power interface of the first circuit board 400.

[0212] The second circuit board 350 may also be used to fix the aforementioned second magnet. The second circuit board 350 may also be used to install one or more electronic components such as a Hall sensor and a controller.

[0213] The anti-shake assembly 300 provided in the embodiment of the present application can achieve electrical connection between electronic components (for example, the image sensor 220) inside the anti-shake assembly 300 and an external power supply by laying interconnection lines inside the first circuit board 400.

[0214] The interaction force between the first magnet 320 and the coil 330 within the anti-shake assembly 300 can be used to drive the movable platform 430 on the first circuit board 400 to displace or rotate. Simultaneously with the displacement or rotation of the movable platform 430, the image sensor 220 mounted on the movable platform 430 can also displace or rotate accordingly. Sensors such as the Hall effect sensor within the anti-shake assembly 300 can determine the target displacement and / or target deflection angle of the image sensor 220. The controller within the anti-shake assembly 300 can control the interaction force between the coil 330 and the first magnet 320 by controlling the magnitude and direction of the current within the coil 330, thereby causing the image sensor 220 to translate by the target displacement and / or rotate by the target deflection angle, thereby achieving anti-shake for the image sensor 220.

[0215] Furthermore, because the interconnects used for power supply are laid inside the connecting arm 420, rotation of the connecting arm 420 can drive the interconnects inside it to rotate as well. The first circuit board 400 within the anti-shake assembly 300 ensures good rotational anti-shake performance while providing power.

[0216] References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present application. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in yet other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more but not all embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0217] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. An anti-shake component for an image sensor, characterized in that: include: a housing, a first magnet, a coil and a first circuit board, The first magnet, the coil and the first circuit board are accommodated in the housing. The first circuit board includes: an outer frame, a connecting arm, a movable platform and interconnection lines, The outer frame includes a first interface, and the first interface is used to connect an external power supply of the anti-shake component; A gap is provided between the movable platform and the outer frame, and the movable platform is used for loading the image sensor; The connecting arm is located in the gap, the connecting arm connects the outer frame and the movable platform, there are multiple connecting arms, and the multiple connecting arms are centrally symmetrical about the rotation center of the first circuit board; The interconnection line is located inside the first circuit board, and the interconnection line connects the first interface and the image sensor; The first magnet or the coil is fixedly connected to the movable platform, and when current is passed through the coil, the first magnet or the coil drives the movable platform to translate or rotate.

2. The anti-shake assembly according to claim 1, characterized in that: The first end of the connecting arm is connected to the outer frame, the second end of the connecting arm is connected to the movable platform, and the angle formed by the line connecting the first end and the rotation center and the line connecting the second end and the rotation center is greater than or equal to 90°.

3. The anti-shake assembly according to claim 1 or 2, characterized in that: There are multiple connecting arms, and the multiple connecting arms include a first connecting arm and a second connecting arm. The first connecting arm and the second connecting arm are both used to connect the first connecting portion of the outer frame and the second connecting portion of the movable platform.

4. The anti-shake assembly according to claim 3, characterized in that: A connecting rod is connected between the first connecting arm and the second connecting arm.

5. The anti-shake assembly according to claim 4, characterized in that: The connecting rod includes a conductive portion, and the conductive portion is used to conduct a first interconnection line located inside the first connecting arm and a second interconnection line located inside the second connecting arm.

6. The anti-shake assembly according to any one of claims 1 to 5, characterized in that: There are multiple interconnection lines, and the multiple interconnection lines are located at different positions in the thickness direction of the first circuit board.

7. The anti-shake assembly according to any one of claims 1 to 6, characterized in that: The connecting arm includes a plurality of sub-connecting arms, and an angle formed between two adjacent sub-connecting arms among the plurality of sub-connecting arms is equal to 90°.

8. The anti-shake assembly according to any one of claims 1 to 7, characterized in that: The anti-shake assembly also includes a bottom plate and a support plate. The bottom plate is located at a side of the first circuit board away from the cover plate of the housing, the support plate is located between the first circuit board and the bottom plate, and the support plate is in contact with the bottom plate.

9. The anti-shake assembly according to claim 8, characterized in that: The movable platform includes a first opening, the supporting plate includes a second opening, the first opening is communicated with the second opening, and the first opening and the second opening are used to accommodate the image sensor.

10. The anti-shake assembly according to claim 8 or 9, characterized in that: A pad is provided on one side of the support plate facing the bottom plate, and the pad is in contact with the bottom plate.

11. The anti-shake assembly according to any one of claims 8 to 10, characterized in that: The anti-shake component also includes a second magnet. The bottom plate is made of magnetic material. The second magnet is located above the movable platform. The second magnet and the bottom plate attract each other.

12. The anti-shake assembly according to any one of claims 9 to 11, characterized in that: The anti-shake component also includes a support frame, which is located between the bottom plate and the first circuit board, and the support frame is located on the outside of the support plate. The thickness of the support frame is the same as the height of the support plate.

13. The anti-shake assembly according to claim 12, characterized in that: The support frame avoids the connecting arm.

14. The anti-shake assembly according to any one of claims 1 to 13, characterized in that: The coil includes a first sub-coil and a second sub-coil, the first sub-coil is used to drive the movable platform to translate along a first direction, and the second sub-coil is used to drive the movable platform to translate along a second direction, and the first direction is perpendicular to the second direction.

15. The anti-shake assembly according to any one of claims 1 to 14, characterized in that: The coil includes a third sub-coil, and the third sub-coil is used to drive the movable platform to rotate around the rotation center of the first circuit board.

16. The anti-shake assembly according to any one of claims 1 to 15, characterized in that: The first magnet is a Halbach magnet.

17. The anti-shake assembly according to any one of claims 1 to 16, characterized in that: The anti-shake component also includes a fixing plate, the fixing plate is fixedly connected to the movable platform, and the first magnet or the coil is fixed on the fixing plate.

18. A circuit board, characterized in that: include: Outer frame, connecting arm, movable platform and interconnecting wires, The outer frame is provided with a first interface, and the first interface is used to connect the external power supply of the anti-shake component; A gap is provided between the movable platform and the outer frame, and the movable platform is used for loading the image sensor; The connecting arm is located in the gap, the connecting arm connects the outer frame and the movable platform, there are multiple connecting arms, and the multiple connecting arms are centrally symmetrical about the rotation center of the circuit board; The interconnection line is located inside the circuit board, and the interconnection line connects the first interface and the image sensor.

19. A camera module, characterized in that: It comprises a lens, an image sensor and an anti-shake component according to any one of claims 1 to 17, wherein the image sensor is installed in the middle area of ​​the anti-shake component, the lens is relatively fixed to the anti-shake component, and imaging light is incident on the image sensor through the lens.

20. An electronic device, characterized in that: It comprises a main board and the camera module as claimed in claim 19, wherein the camera module is electrically connected to the main board.

Images