Electronic device and ultrasonic fingerprint recognition apparatus

Abstract

The present application relates to an electronic device and an ultrasonic fingerprint recognition apparatus. The electronic device comprises: a middle frame assembly arranged in a circumferential direction; and an ultrasonic detection module, mounted in the middle frame assembly and used for detecting fingerprint information. By means of such design, a side fingerprint detection function of the electronic device can be achieved, and the ultrasonic detection module detects a fingerprint by means of an ultrasonic signal. Because the ultrasonic signal has good penetration, the high detection precision is achieved, and the actual use requirements are better met.

Description

Electronic device and ultrasonic fingerprint recognition device

[0001] This application claims priority to Chinese utility model patent application with application date of July 28, 2023, application number "202322025594.9", and patent name "An electronic device", and claims priority to Chinese utility model patent application with application date of May 13, 2024, application number "202421039338.3", and patent name "An ultrasonic fingerprint recognition device and an electronic device for fingerprint recognition", and claims priority to Chinese utility model patent application with application date of May 13, 2024, application number "202421049509.0", and patent name "An ultrasonic fingerprint recognition device and an electronic device for fingerprint recognition", and all the contents are hereby incorporated by reference. Technical Field

[0002] The present application relates to the field of fingerprint recognition technology, and in particular to an electronic device and an ultrasonic fingerprint recognition device. Background Art

[0003] With the development of technology, fingerprint unlocking functions are becoming increasingly common in electronic devices such as mobile phones, tablets, and laptops. Typically, capacitive fingerprint modules are installed on the side of electronic devices. However, capacitive fingerprint modules have weak penetration capabilities. When capacitive fingerprint modules are installed on the inner side of the midframe or midframe cover, the penetration capability is easily reduced, which in turn affects the accuracy of fingerprint recognition.

[0004] Utility Model Content

[0005] A first aspect of an embodiment of the present application provides an electronic device, the electronic device comprising:

[0006] a middle frame assembly, the middle frame assembly being arranged along the circumference of the electronic device;

[0007] Ultrasonic detection module, used to detect fingerprint information;

[0008] Wherein, the ultrasonic detection module is installed on the middle frame assembly.

[0009] In a possible implementation, the middle frame assembly includes a button, and the ultrasonic detection module is disposed on the button.

[0010] In a possible implementation, the button has a receiving cavity, and the ultrasonic detection module is adhered to the inner wall of the receiving cavity.

[0011] In a possible implementation, the middle frame assembly includes a main body and a cover plate, wherein the main body is arranged along the circumference of the electronic device, and the cover plate is located outside the main body;

[0012] The ultrasonic detection module is located between the main body and the cover plate.

[0013] In a possible implementation, the ultrasonic detection module is bonded to the middle frame assembly.

[0014] In a possible implementation, the electronic device includes an adhesive layer, the adhesive layer is located on a side of the ultrasonic detection module facing the cover plate, and the ultrasonic detection module is bonded to the cover plate through the adhesive layer.

[0015] In a possible implementation, the ultrasonic detection module includes an ultrasonic fingerprint module and an acoustic layer, and the acoustic layer is located on a side of the ultrasonic fingerprint module away from the interior of the electronic device.

[0016] In one possible embodiment, the acoustic layer includes a first electrode, a second electrode and a piezoelectric layer, the piezoelectric layer is located between the first electrode and the second electrode, the first electrode is used to be electrically connected to the signal transmitting circuit, the second electrode is used to be electrically connected to the signal receiving circuit, and the piezoelectric layer is used to emit and receive ultrasonic signals.

[0017] In a possible implementation, the second electrode includes a plurality of electrodes, and each of the electrodes is connected to an operational amplifier.

[0018] In a possible implementation, the electronic device includes a pressure sensor, which is disposed in the middle frame and is electrically connected to the ultrasonic detection module.

[0019] In a first aspect, the present application provides an electronic device comprising a circumferentially arranged middle frame assembly, and an ultrasonic detection module mounted on the middle frame assembly for detecting fingerprint information. This design enables side fingerprint detection on the electronic device. The ultrasonic detection module detects fingerprints using ultrasonic signals, which have good penetrating power and therefore high detection accuracy, better meeting practical usage requirements.

[0020] A second aspect of an embodiment of the present application provides an ultrasonic fingerprint recognition device, which is installed in an electronic device. The ultrasonic fingerprint recognition device includes an ultrasonic sensor and a circuit board;

[0021] The circuit board is electrically connected to a processing unit of the electronic device;

[0022] The ultrasonic sensor is used to transmit ultrasonic signals and receive ultrasonic signals that are reflected and pass through the outer frame of the electronic device. It is also used to convert the received ultrasonic signals into electrical signals and send the electrical signals to the processing unit through the circuit board;

[0023] The ultrasonic sensor is attached to the groove formed on the back side of the raised structure;

[0024] At least a portion of the ultrasonic sensor is disposed within the recess, and an outer frame of the electronic device protrudes to form a front face of the raised structure;

[0025] The raised structure is part of the outer frame of the electronic device.

[0026] In addition, in combination with the second aspect, in one implementation of the second aspect, the depth of the groove is equal to or less than the thickness of the ultrasonic sensor; the bottom area of ​​the groove is larger than the area of ​​the ultrasonic sensor; the long side of the raised structure is parallel to the long side of the display screen of the electronic device, and the short side of the raised structure is parallel to the short side of the display screen of the electronic device.

[0027] In addition, in conjunction with the second aspect, in an implementation of the second aspect, the height of the protruding structure is not less than 0.5 mm and not more than 3 mm;

[0028] The height of the raised structure is equal to the height of the volume button or power button of the electronic device;

[0029] The raised structure is a rectangular parallelepiped raised structure.

[0030] In addition, in combination with the second aspect, in an implementation of the second aspect, the ultrasonic sensor includes an acoustic layer and a silicon wafer layer, and the silicon wafer layer is connected to the acoustic layer;

[0031] The groove formed by attaching the ultrasonic sensor to the back of the raised structure includes:

[0032] The acoustic layer is attached to the groove, and the acoustic layer is arranged between the protruding structure and the silicon layer; or

[0033] The silicon wafer layer is attached to the groove and is arranged between the protruding structure and the acoustic layer.

[0034] In addition, in conjunction with the second aspect, in one implementation of the second aspect, the ultrasonic sensor further includes an adhesive layer, the acoustic layer or the silicon wafer layer is attached to the groove formed on the back surface of the protruding structure through the adhesive layer, and the adhesive layer is copper foil adhesive;

[0035] The ultrasonic fingerprint recognition device further includes a reinforcement member, which is used to fix the ultrasonic sensor, and the acoustic layer or the silicon wafer layer is fixed to the reinforcement member through the fixing layer;

[0036] The ultrasonic fingerprint recognition device further includes a first fixing component, through which the circuit board is fixed to the outer frame, and the first fixing component is used to support the circuit board so that the circuit board is electrically connected to the silicon wafer layer;

[0037] One end of the silicon wafer layer is connected to the circuit board via a binding wire, and the first fixing component is used to support the circuit board so that the electrical connection area of ​​the circuit board and the electrical connection area of ​​the silicon wafer layer are at the same height; or

[0038] One end of the silicon layer is connected to the circuit board through ACF glue.

[0039] In addition, in combination with the second aspect, in an implementation of the second aspect, the front surface of the raised structure provides a pressing surface for contacting a user's finger.

[0040] In addition, in combination with the second aspect, in one implementation of the second aspect, the outer frame and the raised structure are made of the same material, the outer frame is plastic or metal, the raised structure and the outer frame to which it is connected are integrally formed, and there is no air gap between the raised structure and the outer frame.

[0041] In addition, in combination with the second aspect, in an implementation of the second aspect, the outer frame and the protruding structure are made of different materials, and the outer frame is plastic or metal.

[0042] In addition, in combination with the second aspect, in an implementation of the second aspect, a silk screen is provided on the top of the front surface of the raised structure, and the silk screen is a fingerprint pattern;

[0043] The raised structure is vertical or has a first chamfer on a side close to the display screen of the electronic device and a side close to the back of the electronic device;

[0044] The raised structure is vertical or has a second chamfer on both sides along the outer frame;

[0045] The top of the front face of the raised structure is flat; or,

[0046] The top of the front surface of the raised structure is an arc surface, the curvature of the arc surface is smaller than the curvature of the first chamfer, the curvature of the arc surface is smaller than the curvature of the second chamfer, and the curvature of the arc surface is equal to the curvature of the outer frame of the electronic device.

[0047] A third aspect of the embodiments of the present application provides an electronic device for fingerprint recognition, comprising the ultrasonic fingerprint recognition device according to any one of the second aspects and an outer frame.

[0048] Compared with the prior art, the beneficial effects of the embodiments of the present application are: the second and third aspects of the embodiments of the present application provide an ultrasonic fingerprint recognition device and an electronic device for fingerprint recognition. On the one hand, since ultrasonic waves have strong penetrating power and can easily penetrate the outer frame of the electronic device, the ultrasonic signal intensity received by the ultrasonic sensor is high and the fingerprint recognition accuracy is high. In addition, by setting the ultrasonic fingerprint recognition device in the groove formed by the raised structure of the outer frame of the electronic device, the space utilization rate can be improved. At the same time, the raised structure can guide the user to find the position of pressing the finger more quickly.

[0049] A fourth aspect of the embodiments of the present application provides an ultrasonic fingerprint recognition device, which is installed in an electronic device. The ultrasonic fingerprint recognition device includes an ultrasonic sensor and a circuit board.

[0050] The circuit board is electrically connected to a processing unit of the electronic device;

[0051] The ultrasonic sensor is used to transmit ultrasonic signals and receive ultrasonic signals that are reflected and pass through the outer frame of the electronic device. It is also used to convert the received ultrasonic signals into electrical signals and send the electrical signals to the processing unit through the circuit board;

[0052] The ultrasonic sensor is attached to the back surface of the first groove structure, and the front surface of the first groove structure is formed by the outer frame of the electronic device being recessed.

[0053] In addition, in combination with the fourth aspect, in an implementation of the fourth aspect, the ultrasonic sensor includes an acoustic layer and a silicon wafer layer, and the silicon wafer layer is connected to the acoustic layer;

[0054] The ultrasonic sensor further includes an adhesive layer, through which the acoustic layer or the silicon wafer layer is attached to the back surface of the first groove structure, and the adhesive layer is copper foil adhesive;

[0055] The front side of the first groove structure provides a pressing surface for contact with a user's finger; there is no air gap between the first groove structure and the outer frame;

[0056] The ultrasonic fingerprint recognition device further includes a first fixing portion, through which the circuit board is fixed to the outer frame, and the first fixing portion is used to support the circuit board so that the circuit board is electrically connected to the silicon wafer layer;

[0057] One end of the silicon wafer layer is connected to the circuit board via a binding wire, and the first fixing portion is used to support the circuit board so that the electrical connection area of ​​the circuit board and the electrical connection area of ​​the silicon wafer layer are at the same height; or,

[0058] One end of the silicon layer is connected to the circuit board through ACF glue.

[0059] In addition, in combination with the fourth aspect, in an implementation of the fourth aspect, a second groove structure is formed on the back side of the first groove structure for accommodating at least a portion of the ultrasonic sensor.

[0060] In addition, in combination with the fourth aspect, in an implementation of the fourth aspect, the depth of the second groove structure is less than or equal to the thickness of the ultrasonic sensor; and the bottom area of ​​the second groove structure is greater than or equal to the area of ​​the ultrasonic sensor.

[0061] In addition, in combination with the fourth aspect, in an implementation of the fourth aspect, the acoustic layer is attached to the inside of the second groove structure, and the acoustic layer is disposed between the silicon wafer layer and the first groove structure; or

[0062] The silicon wafer layer is attached to the inside of the second groove structure, and the silicon wafer layer is arranged between the acoustic layer and the first groove structure.

[0063] In addition, in combination with the fourth aspect, in an implementation of the fourth aspect, the back surface of the first groove structure is flat;

[0064] The ultrasonic sensor is attached to the back of the first groove structure and includes:

[0065] The acoustic layer is attached to the back of the first groove structure, and the acoustic layer is arranged between the silicon wafer layer and the first groove structure; or

[0066] The silicon wafer layer is attached to the back surface of the first groove structure, and is arranged between the acoustic layer and the first groove structure.

[0067] In addition, in conjunction with the fourth aspect, in an implementation of the fourth aspect, the first groove structure is made of the same material as the outer frame, and the outer frame is made of plastic or metal;

[0068] The first groove structure is formed by the outer frame of the electronic device being recessed through integral molding, or

[0069] The first groove structure is a physical key, and the front side of the first groove structure is used to provide a pressing surface for the physical key.

[0070] In addition, in conjunction with the fourth aspect, in an implementation of the fourth aspect, the outer frame and the first groove structure are made of different materials, and the outer frame is made of plastic or metal;

[0071] The first groove structure is a physical key, and the front surface of the first groove structure is used to provide a pressing surface for the physical key.

[0072] In addition, in combination with the fourth aspect, in an implementation of the fourth aspect, a depth of the first groove structure is not less than 0.5 mm and not more than 2 mm.

[0073] In addition, in combination with the fourth aspect, in an implementation of the fourth aspect, the front surface of the first groove structure is a plane, and the front surface of the first groove structure is perpendicular to the display screen of the electronic device;

[0074] The front side of the first groove is provided with a silk screen, which is a fingerprint pattern;

[0075] The first groove structure has two side surfaces, which are two opposite side surfaces along the outer frame;

[0076] Two side surfaces of the first groove structure form chamfered structures; or

[0077] The two side surfaces of the first groove structure are side surfaces perpendicular to the front surface of the first groove structure.

[0078] A fifth aspect of the embodiments of the present application provides an electronic device for fingerprint recognition, comprising the ultrasonic fingerprint recognition device of any one of the fourth aspects and an outer frame.

[0079] Compared with the prior art, the beneficial effects of the embodiments of the present application are: the fourth and fifth aspects of the embodiments of the present application provide an ultrasonic fingerprint recognition device and an electronic device for fingerprint recognition. On the one hand, since ultrasonic waves have strong penetrating power and can easily penetrate the outer frame of the electronic device, the ultrasonic signal intensity is high and the fingerprint recognition accuracy is high. In addition, by arranging the ultrasonic fingerprint recognition device on the back side of the first groove structure formed by the recessed outer frame of the electronic device, the first groove structure can guide the user to find the position of pressing the finger more quickly.

[0080] It should be understood that the foregoing general description and the following detailed description are merely illustrative and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0081] FIG1 is a cross-sectional view of an electronic device provided by the present application;

[0082] FIG2 is a schematic diagram of a key provided in this application;

[0083] FIG3 is a schematic diagram of an electronic device provided in this application;

[0084] FIG4 is a cross-sectional schematic diagram of an ultrasonic fingerprint recognition device according to an embodiment of the present application;

[0085] FIG5 is a cross-sectional schematic diagram of another ultrasonic fingerprint recognition device according to an embodiment of the present application;

[0086] FIG6 is a schematic diagram of a cross-section from any one outer frame to another outer frame of an electronic device installed on an outer frame of an embodiment of the present application;

[0087] FIG7 is a schematic diagram of a cross-section from any one outer frame to another outer frame of an electronic device according to an embodiment of the present application;

[0088] FIG8 is a schematic cross-sectional view showing an ultrasonic fingerprint recognition device according to an embodiment of the present application installed on an outer frame of an electronic device, extending from the display screen of the electronic device to the bottom surface of the electronic device;

[0089] FIG9 is a schematic cross-sectional view showing another ultrasonic fingerprint recognition device according to an embodiment of the present application installed on an outer frame of an electronic device, extending from the display screen of the electronic device to the bottom surface of the electronic device;

[0090] FIG10 is a schematic cross-sectional view showing another ultrasonic fingerprint recognition device according to an embodiment of the present application installed on an outer frame of an electronic device, extending from the display screen of the electronic device to the bottom surface of the electronic device;

[0091] FIG11 is a schematic cross-sectional view showing another ultrasonic fingerprint recognition device according to an embodiment of the present application installed on an outer frame of an electronic device, extending from the display screen of the electronic device to the bottom surface of the electronic device;

[0092] FIG12 is a schematic diagram of a cross-section from any one outer frame to another outer frame of an electronic device installed on an outer frame of another embodiment of the present application;

[0093] FIG13 is a schematic diagram of a cross-section from any one outer frame to another outer frame of an electronic device installed on an outer frame of an embodiment of the present application;

[0094] FIG14 is a cross-sectional schematic diagram of an ultrasonic fingerprint recognition device according to an embodiment of the present application;

[0095] FIG15 is a cross-sectional schematic diagram of an ultrasonic fingerprint recognition device according to an embodiment of the present application;

[0096] FIG16 is a cross-sectional schematic diagram of an outer frame of an electronic device according to an embodiment of the present application;

[0097] FIG17 is a cross-sectional diagram of an ultrasonic fingerprint recognition device according to an embodiment of the present application installed on the outer frame of the electronic device shown in FIG16 ;

[0098] FIG18 is a cross-sectional schematic diagram of another ultrasonic fingerprint recognition device according to an embodiment of the present application installed on the outer frame of the electronic device shown in FIG16 ;

[0099] FIG19 is a cross-sectional schematic diagram of another outer frame of the electronic device according to an embodiment of the present application;

[0100] FIG20 is a cross-sectional diagram of an ultrasonic fingerprint recognition device according to an embodiment of the present application installed on the outer frame of the electronic device shown in FIG19 ;

[0101] FIG21 is a cross-sectional schematic diagram of another ultrasonic fingerprint recognition device according to an embodiment of the present application installed on the outer frame of the electronic device shown in FIG19 ;

[0102] FIG22 is a cross-sectional schematic diagram of another outer frame of an electronic device on which an ultrasonic fingerprint recognition device according to an embodiment of the present application is installed.

[0103] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application. DETAILED DESCRIPTION

[0104] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0105] It should be clear that the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0106] The terms used in the embodiments of the present application are for the purpose of describing specific embodiments only and are not intended to limit the present application. The singular forms "a", "an", "the" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise.

[0107] It should be understood that the term "and / or" as used herein is merely a description of the relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A exists alone, A and B exist simultaneously, or B exists alone. Furthermore, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0108] It should be noted that the directional words such as "upper", "lower", "left", and "right" described in the embodiments of the present application are described based on the angles shown in the accompanying drawings and should not be understood as limiting the embodiments of the present application. In addition, in the context, it should be understood that when it is mentioned that an element is connected to another element "on" or "under", it can not only be directly connected to the other element "on" or "under", but also be indirectly connected to the other element "on" or "under" through an intermediate element.

[0109] As shown in Figure 1, an embodiment of the present application provides an electronic device, which can be a mobile phone, tablet computer, laptop computer, etc. The electronic device includes a midframe assembly 1 and an ultrasonic detection module 2. The midframe assembly 1 is arranged along the circumference of the electronic device, and the ultrasonic detection module 2 is used to detect fingerprint information. The ultrasonic detection module 2 is arranged in the midframe assembly 1 to enable the electronic device to perform side fingerprint recognition.

[0110] Ultrasonic detection module 2 can be used to identify fingerprints, enabling electronic device unlocking and fingerprint payment, more in line with practical usage needs. Furthermore, compared to capacitive detection modules, ultrasonic detection module 2 has stronger penetration capabilities, resulting in higher detection accuracy, more accurate fingerprint recognition, and greater security.

[0111] As shown in FIG2 , in one possible embodiment, the middle frame assembly 1 includes a button 11, and the ultrasonic detection module 2 is disposed on the button 11. The button 11 may be a side button 11 of an electronic device, including but not limited to a volume adjustment button, a lock screen button, a power button, and the like.

[0112] By integrating the ultrasonic detection module 2 into the button 11, it is convenient for users to perform fingerprint recognition when using it, and the ultrasonic detection module 2 can be directly embedded in the interior of the button 11, which is conducive to reducing the space occupied by the ultrasonic detection module 2, thereby helping to optimize the structure of the electronic device, facilitating the miniaturization and lightweight design of the electronic device, and helping to thin the electronic device, which is more in line with actual needs.

[0113] As shown in FIG. 2 , in a possible implementation, the button 11 has a receiving cavity 111 , and the ultrasonic detection module 2 is adhered to the inner wall of the receiving cavity 111 .

[0114] In this way, the ultrasonic detection module 2 can fit the inner wall of the button 11, which is beneficial to improving the accuracy of the ultrasonic detection module 2 for fingerprint recognition and better meeting actual usage requirements.

[0115] As shown in Figure 1 , in one possible embodiment, the middle frame assembly 1 may include a body 12 and a cover 13. The body 12 is arranged along the circumference of the electronic device, and the cover 13 is located outside the body 12, that is, on the side of the body 12 away from the electronic device. The ultrasonic detection module 2 is located between the body 12 and the cover 13.

[0116] This design allows the cover 13 to protect the ultrasonic detection module 2, thereby reducing the possibility of damage to the ultrasonic detection module 2. It is also beneficial to achieve a design without physical keys. When in use, the ultrasonic detection module 2 can detect the displacement of the finger, thereby achieving functions such as adjusting the volume and calling out the navigation bar. Compared with setting physical keys, the solution provided by the embodiment of the present application can save the cost of setting physical keys and reduce operations such as opening holes in the middle frame assembly 1 of the electronic device. The components are conducive to reducing the difficulty of processing and are also conducive to improving the overall sealing of the electronic device, improving the waterproof and dustproof capabilities of the electronic device, reducing the possibility of accidents such as liquid ingress, and more in line with actual usage needs.

[0117] When an electronic device uses a capacitance detection module, due to the limited penetration of the capacitance detection module, it is necessary to dig a groove in the middle frame assembly 1 or flatten the cover 13 toward the inside of the electronic device during use, thereby reducing the distance that the capacitance detection module needs to penetrate. However, such a design not only affects the overall structural strength of the middle frame assembly 1, but also adds additional processing steps, making the processing very complicated and increasing the cost. Moreover, the outer surface of the middle frame assembly 1 of the electronic device is uneven, affecting the user's feel. The electronic device provided in the embodiment of the present application uses an ultrasonic detection module 2 for fingerprint recognition, which not only has good penetration, but also has higher recognition accuracy for wet fingers, etc., and does not require additional processing of the middle frame assembly 1, so it is more in line with actual usage needs.

[0118] In a possible implementation, the ultrasonic detection module 2 is bonded to the middle frame assembly 1 .

[0119] Bonding has the advantages of simple operation and easy processing. In addition, the bonding method has low requirements on the materials of the objects to be connected. At the same time, it can adapt to different surfaces. The force at the connection position is relatively uniform, and the weight of the adhesive is relatively light, which is more in line with actual usage needs.

[0120] As shown in FIG. 1 , in a possible embodiment, the electronic device includes an adhesive layer 3 , which is located on a side of the ultrasonic detection module 2 facing the cover plate 13 , and the ultrasonic detection module 2 is bonded to the cover plate 13 through the adhesive layer 3 .

[0121] Such a design can help improve the fit between the ultrasonic detection module 2 and the cover 13, thereby facilitating the ultrasonic detection module 2 to identify the fingerprint of the finger in contact with the cover 13, which is conducive to improving the fingerprint recognition accuracy and better meeting actual usage needs.

[0122] As shown in Figure 1, in one possible embodiment, ultrasonic detection module 2 includes an ultrasonic fingerprint module 21 and an acoustic layer 22. Acoustic layer 22 is located on the side of ultrasonic fingerprint module 21 that is away from the interior of the electronic device. Ultrasonic fingerprint module 21 can be a fingerprint recognition chip, and acoustic layer 22 is used to emit and receive ultrasonic waves.

[0123] This design allows the acoustic layer 22 to be located on a side of the ultrasonic detection module 2 that is closer to the finger, thereby facilitating the ultrasonic detection module 2 to identify the fingerprint, thereby improving detection accuracy and better meeting actual usage requirements.

[0124] In one possible embodiment, the acoustic layer 22 includes a first electrode, a second electrode, and a piezoelectric layer. The piezoelectric layer is located between the first electrode and the second electrode. The first electrode is electrically connected to the signal transmitting circuit, and the second electrode is electrically connected to the signal receiving circuit. The piezoelectric layer is used to emit and receive ultrasonic signals.

[0125] The signal transmission circuit is used to generate a mechanical signal and apply it to the first electrode, thereby stimulating the piezoelectric layer to transmit an ultrasonic signal to a finger in contact with the middle frame assembly 1. When the ultrasonic signal returns from the finger, it is applied to the piezoelectric layer, generating an ultrasonic detection signal between the first and second electrodes. The ultrasonic detection signal is used to obtain a fingerprint image of the finger. The fingerprint image can be recognized through the program and algorithm built into the electronic device, thereby realizing the corresponding function.

[0126] In a possible implementation, the second electrode includes a plurality of electrodes, and each electrode is respectively connected to an operational amplifier.

[0127] Each electrode can be connected to a different operational amplifier, or multiple electrodes can be connected to the same operational amplifier. The operational amplifier is used to capture the electrical signal converted from the ultrasonic signal.

[0128] In a possible implementation, the electronic device further includes a pressure sensor, which is electrically connected to the ultrasonic detection module 2 .

[0129] By providing a pressure sensor, the ultrasonic detection module 2 can perform pressure detection while performing fingerprint recognition, so that different functions can be realized according to different pressures applied by the user, such as calling out the navigation bar.

[0130] As shown in Figure 3, in one possible embodiment, the middle frame assembly 1 is located between the screen 4 and the back cover 5 of the electronic device. The solution provided by the embodiment of the present application can realize the ultrasonic sidebar fingerprint (USF) function. The ultrasonic detection module 2 has a fingerprint recognition area 211. The user can slide, click, and perform other operations on the corresponding area cover 13. The ultrasonic detection module 2 can cooperate with the internal program and algorithm of the electronic device to identify the movement trajectory of the finger, process multiple consecutive frames of fingerprint images, and output the displacement change of the finger to realize the corresponding functions. The functions that can be realized include but are not limited to volume adjustment, brightness adjustment, screen off and screen on, fingerprint payment, etc.

[0131] The cover plate 13 can be made of metal, glass, plastic, or other materials that are permeable to ultrasonic signals. The shape of the cover plate 13 can be curved or flat. When the cover plate 13 is curved, the recognized fingerprint image can be processed in conjunction with the program and algorithm of the electronic device, thereby reducing the impact of the curved cover plate 13 on the fingerprint image, which is more in line with actual usage needs.

[0132] In one possible implementation, part of the ultrasonic signal emitted by the ultrasonic detection module 2 to the finger can pass through the skin of the finger and not be absorbed by the blood. The electronic device can be equipped with health detection functions such as heart rate detection. The returned ultrasonic signal is analyzed through corresponding programs and algorithms, and relevant information about the blood is obtained based on the blood's absorption of the ultrasonic signal, thereby obtaining the health status of the human body, which is more in line with actual usage needs.

[0133] An embodiment of the present application provides an electronic device comprising a circumferentially arranged middle frame assembly 1, and an ultrasonic detection module 2 mounted on the middle frame assembly 1 for detecting fingerprint information. This design enables side fingerprint detection on the electronic device. Furthermore, ultrasonic detection module 2 detects fingerprints using ultrasonic signals, which have good penetrating power and therefore offer high detection accuracy, better meeting practical application requirements.

[0134] The basic principle of ultrasonic in-display fingerprint recognition is this: an ultrasonic sensor is installed below the screen. The ultrasonic waves it emits pass through the screen and reach the surface of your finger, where they are then reflected by your fingerprint. Because the valleys and ridges of your fingerprint reflect the ultrasonic waves differently, the reflected echoes pass through the screen and are received by the ultrasonic sensor. The fingerprint image is then generated based on the echo differences.

[0135] An embodiment of the present application provides an ultrasonic fingerprint recognition device. FIG4 is a cross-sectional schematic diagram of the ultrasonic fingerprint recognition device provided by the embodiment of the present application. The ultrasonic fingerprint recognition device 100 includes an ultrasonic sensor 101 and a circuit board 102. The circuit board 102 is electrically connected to the processing unit of the electronic device. The ultrasonic sensor 101 is used to transmit ultrasonic signals and receive ultrasonic signals that are reflected and pass through the outer frame of the electronic device. It is also used to convert the received ultrasonic signals into electrical signals and send the electrical signals to the processing unit of the electronic device through the circuit board 102. In this embodiment, the ultrasonic sensor 101 and the circuit board 102 are connected by a binding wire 103. In the above embodiment, the circuit board is electrically connected to the processing unit in the electronic device. The circuit board 102 can be a flexible circuit board. The circuit board is used to transmit electrical signals to the processing unit of the electronic device. The processing unit performs fingerprint recognition and fingerprint anti-counterfeiting based on the electrical signals.

[0136] Compared to the ultrasonic sensor shown in FIG4 , in this embodiment, binding wires are not required to connect the circuit board and the ultrasonic sensor. As shown in FIG5 , the ultrasonic fingerprint recognition device 100 includes an ultrasonic sensor 101 and a circuit board 102. The pad portion 14 of the ultrasonic sensor 101 is electrically connected to the flexible circuit board 102. The flexible circuit board 102 is used to connect to an external circuit, such as a processing unit of an electronic device. In this embodiment, the electrical connection area of ​​the flexible circuit board 102 may also include a pad (not shown). The pad portion 14 of the ultrasonic sensor 101 and the electrical connection area of ​​the flexible circuit board 102 may be electrically connected via conductive adhesive 1031. Optionally, the pad portion 14 of the ultrasonic sensor 101 and the electrical connection area of ​​the flexible circuit board 102 may be electrically connected via ACF (Anisotropic Conductive Film) adhesive 1031 using an ACF lamination process. Ultrasonic sensor 101 and flexible circuit board 102 are bonded together using ACF adhesive 1031, ensuring electrical continuity. The inherent adhesive properties of ACF adhesive 1031 also ensure a better bond between ultrasonic sensor 101 and flexible circuit board 102. The bonding wire solution shown in Figure 4 is easy to manufacture and provides good structural stability, while the ACF adhesive solution eliminates the need for bonding wire fixation.

[0137] Figures 6 to 11 are schematic cross-sectional views of an ultrasonic fingerprint recognition device provided in an embodiment of the present application, taken from different angles, installed on the outer frame of an electronic device. The ultrasonic fingerprint recognition device is applied to an electronic device and is installed in an electronic device, such as a mobile phone, an electronic watch, or other electronic device. The embodiments of the present application are described using the ultrasonic fingerprint recognition device installed in a mobile phone as an example. In the following embodiments, Figures 6, 7, 12, and 13 illustrate cross-sectional views from any outer frame of an electronic device to another outer frame, and Figures 8 to 11 illustrate cross-sectional views from the display screen of the electronic device to the outer frame of the bottom surface of the electronic device.

[0138] Figure 6 shows the long frame 300 of the entire electronic device. The ultrasonic fingerprint recognition device includes an ultrasonic sensor 301 and a circuit board 302. The ultrasonic sensor 301 is attached to a groove 306 formed on the back side 3051 of the raised structure 305. When viewed from the side of the phone, the outer frame 300 of the phone protrudes outward to form a raised structure 305. The outer frames 3000 and 3001 of the phone are the two short outer frames of the phone. The outer frame 300 of the phone is one of the long frames of the phone (the other long frame opposite to the long frame 300 is not shown). The long outer frame 300 of the phone can also be provided with a power button and a volume adjustment button. A groove 306 is formed inside the raised structure 305 to accommodate the ultrasonic sensor 301. Specifically, the back side 3051 of the raised structure 305 is concave toward its front side 3052 to form a groove 306 to accommodate the ultrasonic sensor 301. On the one hand, the raised structure 305 helps users quickly find the fingerprint collection area. On the other hand, the groove 306 within the raised structure is used to accommodate at least a portion of the ultrasonic sensor 301, which can improve space utilization. Moreover, because the groove 306 formed on the back of the raised structure 305 is used to accommodate part of the ultrasonic sensor 301, the distance between the ultrasonic sensor and the fingerprint collection surface is reduced, which can significantly enhance the strength of the ultrasonic signal and thus improve the accuracy of fingerprint collection. At least a portion of the ultrasonic sensor 301 is disposed within the raised structure 305. Specifically, at least a portion of the ultrasonic sensor 301 is disposed within the groove 306. The raised structure 305 is part of the outer frame 300 of the electronic device. The outer frame 300 of the electronic device protrudes to form the front face 3052 of the raised structure. The raised structure 305 protrudes from the outer frame 300 of the electronic device. Because the raised structure protrudes from the outer frame of the electronic device, it can remind the user of the location of the finger pressing, allowing the user to find the fingerprint collection location by sense of touch.

[0139] Design and location of the raised structure 305 : Part of the outer frame of the electronic device is designed to be raised. This raised structure is not only a part of the outer frame, but is also specially designed to accommodate the ultrasonic sensor 301 .

[0140] Formation and function of groove 306: A groove 306 is designed on the back side 3051 of the raised structure 305 (i.e., the side facing the interior of the electronic device). Groove 306 is specifically formed for mounting the ultrasonic sensor 301, and its shape and size are suitable for accommodating the ultrasonic sensor. Specifically, the bottom area of ​​groove 306 is larger than the area of ​​ultrasonic sensor 301, and the depth of groove 306 can be equal to the thickness of the ultrasonic sensor to just accommodate the ultrasonic sensor, or the depth of groove 306 can be less than the thickness of the ultrasonic sensor to accommodate part of the ultrasonic sensor. Due to the small depth of the groove, the raised structure 305 has a certain thickness, thereby increasing the strength of the outer frame. In some embodiments, the depth of groove 306 can be greater than the thickness of the ultrasonic sensor so that the ultrasonic sensor can be completely disposed within the groove. In addition, there is still space in the groove to accommodate other related components.

[0141] Installation of ultrasonic sensor: As shown in Figure 6, the ultrasonic sensor may include an adhesive layer 304, and the acoustic layer or silicon wafer layer may be attached to the groove 306 through the adhesive layer 304. The adhesive layer 304 may be glue or other sticky materials. The ultrasonic sensor may be bonded to the groove by a front-mounted or back-mounted method. In this solution, the adhesive layer is not limited to adhesive materials such as copper foil adhesive, double-sided adhesive, and thermosetting adhesive. Since copper foil adhesive can achieve better acoustic impedance matching, the adhesive layer may preferably be copper foil adhesive, which includes a copper foil layer and adhesive layers arranged on the upper and lower surfaces of the copper foil layer. At least part (may be most or all) of the ultrasonic sensor 301 is arranged in the groove 306, which can better fix the ultrasonic sensor and may also provide a certain degree of protection for the ultrasonic sensor.

[0142] The above structure can protect the ultrasonic sensor, not only effectively utilizing the space of the device, but also may help improve the receiving or transmitting efficiency of the ultrasonic sensor. Due to the presence of the groove 306, the propagation path of the ultrasonic wave will be shorter, thereby improving the fingerprint recognition performance of the entire electronic device.

[0143] Based on the disclosure of the above embodiments, in this embodiment, as shown in Figure 6, the front surface 3052 of the raised structure 305 provides a pressing surface for contact with the user's finger, allowing the ultrasonic sensor 301 to collect the user's fingerprint. To improve the device's waterproof rating and prevent moisture from entering the ultrasonic sensor 301 and affecting fingerprint recognition, there is no air gap between the raised structure 305 and the outer frame 300.

[0144] In this embodiment, the circuit board 302 can be attached to the outer frame 300 to facilitate fixing the circuit board 302. Figure 6 adopts a positive attachment method, that is, the acoustic layer 3012 is attached to the groove 306 formed by the raised structure 305 through the adhesive layer 304, and the acoustic layer 3012 is disposed between the silicon wafer layer 3011 and the raised structure 305.

[0145] Based on the disclosure of the above embodiments, this embodiment further provides a schematic diagram of the outer frame of an electronic device as shown in Figure 7. Figure 7 also adopts a front-mounted solution. In this embodiment, Figures 6 and 7 only use the front-mounted solution as an example. It should be noted that Figures 6 and 7 are also applicable to a back-mounted solution. In the back-mounted solution, the silicon wafer layer is attached to the groove formed by the raised structure 305 via an adhesive layer, and the silicon wafer layer 3011 is disposed between the acoustic layer 3012 and the raised structure 305. The back-mounted solution will not be described in detail here.

[0146] In this embodiment, as shown in Figure 7, the ultrasonic fingerprint recognition device may further include a reinforcement member 308, which is used to secure the ultrasonic sensor 301. The ultrasonic sensor 301 is secured to the reinforcement member 308 via a securing layer 309. The securing layer may be adhesive or foam adhesive. In this embodiment, the foam adhesive provides a protective effect. When a back-taping solution is used, the foam adhesive is used to secure the acoustic layer to the reinforcement member, providing a certain degree of protection for the acoustic layer. In this embodiment, one end of the circuit board 302 may also be secured to the reinforcement member 308 via the securing layer 309. The reinforcement member 308 may be a steel plate.

[0147] As shown in Figure 7, the outer frame 300 of the electronic device protrudes toward the outside of the electronic device to form a raised structure 305. The phone frames 3000 and 3001 are the short frames of the phone, while the outer frame 300 of the phone is the long outer frame of the phone. A groove is formed inside the raised structure 305 to accommodate the ultrasonic sensor 301. In this embodiment, the ultrasonic fingerprint recognition device also includes a first fixing component 307, which is attached to the back of the outer frame 300 and is used to fix the circuit board 302 to the outer frame 300. In addition, the first fixing component 307 can also have a certain height. The first fixing component is used to support the circuit board to facilitate electrical connection between the circuit board and the silicon wafer layer. As shown in Figure 7, one end of the silicon wafer layer 3011 is connected to the circuit board 302 via a binding wire 310. The first fixing component 307 is used to support the circuit board 302 so that the second electrical connection area 3061 of the circuit board 302 is at the same height as the first electrical connection area 3062 of the silicon wafer layer 3011, so that the two can be connected via the binding wire 310 and both can be fixed to the reinforcement 308. In Figure 7, a first electrical connection area 3062 is provided at one end of the silicon wafer layer 3011, and a second electrical connection area 3061 is provided at one end of the circuit board 302. A bonding wire 310 is used to connect the first and second electrical connection areas. For a top-mounted mounting solution, if the recess is not deep enough to accommodate the entire acoustic layer 3012, introducing a first fixing member 307 can help ensure that the electrical connection areas of the circuit board 302 and the silicon wafer layer 3011 are at the same height, thereby facilitating connection via bonding wires.

[0148] Based on the disclosures of the above embodiments, in this embodiment, as shown in FIG7 , the height h1 of the raised structure 305 is no less than 0.5 mm and no greater than 3 mm. Setting the height of the raised structure between 0.5 mm and 3 mm prevents the raised structure from being too thin and thus failing to protect the ultrasonic fingerprint recognition device, while also preventing the raised structure from being too thick and thus affecting the strength of the received ultrasonic signal. In this embodiment, when the height of the raised structure is equal to the height of the volume button or power button of the electronic device, the appearance of the electronic device is consistent and easy for the user to use. In this embodiment, the raised structure can be a rectangular parallelepiped raised structure, with the long side of the raised structure parallel to the long side of the electronic device's display screen, and the short side of the raised structure parallel to the short side of the electronic device's display screen. This ensures that the ultrasonic sensor's sensing area is sufficiently long to collect more fingerprint data. The long side of the raised structure can be seen in FIG6 , FIG7 , FIG12 , and FIG13 , and the short side of the raised structure can be seen in FIG8 through FIG11 .

[0149] Based on the contents disclosed in the above embodiments, in this embodiment, as shown in FIG6 , the outer frame 300 and the raised structure 305 are made of the same material, the outer frame can be plastic or metal, and the raised structure 305 and the outer frame 300 to which it is connected are integrally formed. Since the raised structure and the outer frame are integrally formed, process steps are saved and processing is facilitated. In addition, it can further prevent water vapor from entering the ultrasonic sensor, thereby affecting fingerprint recognition, and can also improve the waterproof level of electronic equipment.

[0150] Based on the contents disclosed in the above embodiments, in this embodiment, as shown in Figure 6, the materials of the outer frame 300 and the raised structure 305 can be different. When the outer frame is plastic, the raised structure is metal, or when the raised structure is metal, the outer frame is plastic. Since the material of the raised structure 305 is different from that of the outer frame 300, the user can easily distinguish the position of the raised structure with the naked eye, thereby reminding the user of the pressing position. In this embodiment, the outer frame can be made of plastic, hardware, glass, ceramic, etc., and the surface of the outer frame can be processed using processes such as vacuum plating, vacuum matte, spray painting, and material polishing.

[0151] Based on the contents disclosed in the above embodiments, this embodiment further provides a schematic diagram of the outer frame of an electronic device as shown in FIG8 . FIG8 is a schematic cross-sectional diagram from the display screen of the electronic device to the bottom surface of the electronic device, and the cross-section just allows the laminated structure of the ultrasonic sensor 501 to be seen.

[0152] As shown in Figure 8 , the ultrasonic fingerprint recognition device includes an ultrasonic sensor 501 and a circuit board (not shown). The ultrasonic sensor 501 includes an adhesive layer 504. An acoustic layer 5012 is attached to the interior of a raised structure 505 via the adhesive layer 504. Specifically, the ultrasonic sensor 501 is attached to a groove 506 formed on the back surface 5051 of the raised structure 505. In Figure 8 , an outer frame 500 of the electronic device is disposed perpendicularly to the upper surface 5000 of the display screen and the back surface 5001 of the electronic device. The portion of the outer frame near the upper surface 5000 of the display screen is lower than the height of the front surface of the raised structure 505. Specifically, the middle frame portion near the display screen 5000 is 5003, which is lower than the height of the front surface 5052 of the raised structure. The middle frame portion 5003 near the display screen 5000 and the front surface 5052 of the raised structure form a first step structure, i.e., the raised structure is vertical on the side near the display screen and the side near the back of the electronic device. The height of this first step structure is h2, which in this embodiment can be equal to h1. In Figure 8, the height of the middle frame portion close to the display screen 5000 and close to the back of the electronic device 5001 is lower than the height of the front of the raised structure 505. Specifically, the middle frame portion on the back of the electronic device 5001 and the front of the raised structure 5052 form another step structure, and the raised structure 505 is vertical on the side 5053 close to the display screen of the electronic device and the side 5054 close to the back of the electronic device.

[0153] Based on the contents disclosed in the above embodiments, in this embodiment, the raised structure 505 in FIG8 protrudes a certain height relative to the outer frame 500 close to the display screen, and the top of the front face 5052 of the raised structure 505 is a plane. When the top of the front face 5052 of the raised structure 505 is a plane, it is more conducive to the collection of fingerprint recognition signals.

[0154] Based on the disclosure of the above embodiment, this embodiment differs from FIG8 in that the raised structure forms first chamfers on the side closest to the display screen of the electronic device and on the side closest to the back of the electronic device. As shown in FIG9 , the raised structure 505 forms a first chamfer 5041 on the side closest to the display screen 5000 of the electronic device, and simultaneously forms a first chamfer 5042 on the side closest to the back of the electronic device 5001. In this embodiment, the design of the first chamfers makes the electronic device easier to grip and is more suitable for electronic devices with chamfered outer frames.

[0155] Based on the contents disclosed in the above embodiments, in this embodiment, the top of the front surface of the raised structure can be a curved surface, the curvature of the curved surface is less than the curvature of the first chamfer, and the curvature of the curved surface can be equal to the curvature of the outer frame of the electronic device. As shown in Figure 10, the top of the front surface 5052 of the raised structure 505 can be a curved surface, and the curvature of the curved surface is less than the curvature of the first chamfer 5041, which is more conducive to the collection of fingerprint recognition signals. In addition, when the curvature of the curved surface is equal to the curvature of the outer frame of the electronic device, the appearance of the electronic device has better consistency and is easier to grasp. When the top of the front surface 5052 of the raised structure 505 is a curved surface, it is more suitable for mobile phone models with curved sides. In this embodiment, when the top of the front surface 5052 of the raised structure is curved, the raised structure forms a first chamfer 5041 on the side closest to the display screen 5000 of the electronic device. Simultaneously, the raised structure forms a first chamfer 5042 on the side closest to the back surface 5001 of the electronic device. In this embodiment, the curvature of the curved surface at the top of the front surface 5052 of the raised structure 505 is smaller than the curvature of the first chamfer 5041; the curvatures of the first chamfers 5041 and 5042 are the same. A greater curvature indicates a greater degree of curvature of the curve. A lesser curvature of the curved surface at the top of the front surface of the raised structure facilitates the collection of fingerprint information and improves the consistency of the ultrasonic sensor's propagation path.

[0156] Based on the contents disclosed in the above embodiments, in this embodiment, a silk screen is provided on the top of the protrusion, and the silk screen is a fingerprint pattern. The design of the silk screen facilitates the user to quickly locate the fingerprint collection area, further improving the user experience.

[0157] Based on the contents disclosed in the above embodiments, in this embodiment, as shown in FIG8 , the ultrasonic sensor includes a copper foil adhesive 504, which is adhered to the inside of a groove 506 formed on the back side 5051 of the raised structure 505. The back side 5051 of the raised structure 505 forms a groove 506 for accommodating the ultrasonic sensor 501. Since the groove 506 is provided inside the raised structure to accommodate the ultrasonic sensor, space can be saved and equipment utilization can be improved.

[0158] Based on the contents disclosed in the above embodiments, in this embodiment, as shown in FIG8 , the ultrasonic sensor 501 includes an acoustic layer 5012 and a silicon wafer layer 5011 . The silicon wafer layer 5011 is connected to the acoustic layer 5012 , and one end of the silicon wafer layer is connected to the circuit board via a binding wire.

[0159] The groove formed by attaching the ultrasonic sensor to the back of the raised structure has the following two structures:

[0160] Front-mounted solution: As shown in FIG8 , the acoustic layer 5012 is attached to the inside of the groove 506 formed on the back side of the protruding structure 505 through the adhesive layer 504 . The acoustic layer 5012 is disposed between the protruding structure 505 and the silicon wafer layer 5011 .

[0161] Back-mounted solution: As shown in Figure 11, the ultrasonic sensor 501 is attached to the groove 506 formed on the back side 5051 of the raised structure 505. The silicon wafer layer 5011 is attached to the inside of the groove 506 formed on the back side of the raised structure 505 via an adhesive layer 504. The silicon wafer layer 5011 is electrically connected to the circuit board via bonding wires. The silicon wafer layer 5011 is disposed between the raised structure 505 and the acoustic layer 5012. In this embodiment, compared to the back-mounted solution, the acoustic layer in the front-mounted solution is closer to the object to be measured. Therefore, the ultrasonic fingerprint signal strength collected by the electronic device using the front-mounted solution is higher.

[0162] In Figure 6 , the raised structure 305 is vertical along the sides 3055 and 3056 of the outer frame 300. Based on the disclosure of the above embodiments, this embodiment also provides another schematic diagram of the outer frame of an electronic device. Figure 12 shows a cross-sectional view from one outer frame of the electronic device to another. Unlike Figures 6 and 7 , the raised structure in Figure 12 forms second chamfers 3053 and 3054 along the outer frame. This rounded edge design of the raised structure makes it easier for users to touch and easily wipe away stains. In Figure 12 , the top of the front face 3052 of the raised structure is flat.

[0163] Based on the disclosure of the above embodiments, this embodiment also provides another schematic diagram of the outer frame of an electronic device. FIG13 shows a cross-sectional view from one outer frame of the electronic device to another outer frame. Unlike FIG12, in FIG13, the top of the front face 3052 of the raised structure can be a curved surface, and the curvature of the curved surface is less than the curvature of the second chamfer 3053. The greater the curvature, the greater the degree of curvature of the curve. The curved surface at the top of the front face of the raised structure is less curved, which facilitates the collection of fingerprint information. The propagation path of the ultrasonic sensor is more consistent, which is more conducive to the collection of fingerprint recognition signals. In addition, when the curvature of the curved surface is equal to the curvature of the outer frame of the electronic device, the appearance of the electronic device is more consistent. When the top of the front face 3052 of the raised structure 305 is a curved surface, it is more suitable for mobile phone models with curved sides.

[0164] Based on the contents disclosed in the above embodiments, this embodiment further provides an electronic device for fingerprint recognition, for example, an electronic device as shown in Figures 8 to 11, which includes the ultrasonic fingerprint recognition device and outer frame in the above embodiments, which will not be repeated here.

[0165] An embodiment of the present application also provides an ultrasonic fingerprint recognition device. Figure 14 is a cross-sectional schematic diagram of the ultrasonic fingerprint recognition device provided by the embodiment of the present application. The ultrasonic fingerprint recognition device 700 includes an ultrasonic sensor 701 and a circuit board 702. The circuit board 702 is electrically connected to the processing unit of the electronic device. The ultrasonic sensor 701 is used to transmit ultrasonic signals and receive ultrasonic signals that are reflected and pass through the outer frame of the electronic device. It is also used to convert the received ultrasonic signals into electrical signals and send the electrical signals to the processing unit of the electronic device through the circuit board 702. In this embodiment, the ultrasonic sensor 701 and the circuit board 702 are electrically connected via a binding wire 703.

[0166] Compared to the ultrasonic sensor shown in FIG14 , in this embodiment, binding wires are not required to connect the circuit board and the ultrasonic sensor. As shown in FIG15 , an ultrasonic fingerprint recognition device 700 includes an ultrasonic sensor 701 and a circuit board 702. The pad portion 72 of the ultrasonic sensor 701 is electrically connected to the flexible circuit board 702, which is used to connect to an external circuit. In this embodiment, the electrical connection area of ​​the flexible circuit board 702 also includes a pad. The pad portion 72 of the ultrasonic sensor 701 and the electrical connection area of ​​the flexible circuit board 702 can be electrically connected via conductive adhesive 7031. Optionally, the pad portion 72 of the ultrasonic sensor 701 and the electrical connection area of ​​the flexible circuit board 702 can be electrically connected via ACF (Anisotropic Conductive Film) adhesive 7031 using an ACF lamination process. Ultrasonic sensor 701 and flexible circuit board 702 are bonded together using ACF adhesive 7031, ensuring electrical continuity. The inherent adhesive properties of ACF adhesive 7031 also ensure that ultrasonic sensor 701 and flexible circuit board 702 are bonded together. The bonding wire solution shown in Figure 14 is easy to manufacture and provides good structural stability, while the ACF adhesive solution eliminates the need for bonding wire fixation.

[0167] In the above embodiment, the circuit board is electrically connected to the processing unit in the electronic device. The circuit board includes a flexible circuit board. The circuit board is used to transmit electrical signals to the processing unit of the electronic device. The processing unit performs fingerprint recognition and anti-counterfeiting recognition based on the electrical signals.

[0168] Figure 16 is a cross-sectional schematic diagram of the outer frame of an electronic device provided in an embodiment of the present application. The electronic device has four outer frames, which are composed of two relatively long outer frames and two relatively short outer frames. The outer frame 410 of the electronic device is recessed into the interior of the electronic device to form a first groove structure 315. The mobile phone frames 3100 and 3101 are the short outer frames of the mobile phone, and the outer frame 410 of the mobile phone is one of the long outer frames of the mobile phone (the other long outer frame opposite to the long outer frame 410 is not shown). As shown in Figure 16, the front 3152 of the first groove structure 315 is formed by the outer frame 410 of the electronic device being recessed. As shown in Figure 17, the ultrasonic sensor 311 is attached to the back 3151 of the first groove structure 315. The ultrasonic fingerprint recognition device includes an ultrasonic sensor 311 and a circuit board 312. The ultrasonic sensor 311 includes an adhesive layer 314. The ultrasonic sensor 311 is attached to the back surface 3151 of a first groove structure 315 via the adhesive layer 314. Because the first groove structure 315 is formed by a recessed portion of the outer frame of the electronic device, it can serve as a reminder to the user of the finger's pressing position, allowing the user to locate the fingerprint collection location by tactile sensation. In this embodiment, the first groove structure 315 can be a square groove.

[0169] The ultrasonic sensor shown in Figure 17 is mounted to the middle frame using a back-mounted mounting solution. The silicon wafer layer 3111 is attached to the back surface 3151 of the first groove structure 315 via an adhesive layer 314. The silicon wafer layer 3111 is electrically connected to the circuit board 312 via bonding wires 313. In this embodiment, a first fixing portion 319 can also be used to secure the circuit board 312 to the outer frame 410. The first fixing portion 319 is attached to the back surface of the outer frame 410 to secure the circuit board 312. The front surface 3152 of the first groove structure 315 provides a pressing surface.

[0170] It should be noted that the ultrasonic sensor can also be mounted on the back side of the first groove structure 315 using a top-mounted mounting method as shown in Figure 18. Specifically, the acoustic layer 3112 is attached to the back side 3151 of the first groove structure 315 via the adhesive layer 314, and the acoustic layer 3112 is disposed between the silicon wafer layer 3111 and the first groove structure 315. As shown in Figures 16 to 18, the back side 3151 of the first groove structure 315 is flat, and the front side 3152 of the first groove structure 315 is formed by a recessed portion of the outer frame 410 of the long side of the electronic device. The flat back side 3151 of the first groove structure 315 does not require a groove to accommodate the ultrasonic sensor. This allows the outer frame to maintain a certain thickness, thereby increasing the strength of the outer frame. When the back side of the first groove structure is flat, the ultrasonic sensor can be attached to the back side of the first groove structure using either a top-mounted mounting method or a back-mounted mounting method.

[0171] Front-mounted solution: As shown in Figure 18, the acoustic layer 3112 is attached to the back of the first groove structure 315 via an adhesive layer 314. The ultrasonic fingerprint recognition device also includes a first fixing portion 319, which is attached to the back of the outer frame 410 to secure the circuit board 312. The front 3152 of the first groove structure 315 provides a pressing surface. In this embodiment, the acoustic layer 3112 is disposed between the silicon wafer layer 3111 and the first groove structure 315. The first fixing portion 319 also has a certain height so that the circuit board 312 and the silicon wafer layer 3111 are at the same level. The first fixing portion 319 supports the circuit board 312 to ensure electrical connection between the circuit board 312 and the silicon wafer layer 3111. One end of the silicon wafer layer is connected to the circuit board via a bonding wire. The first fixing portion supports the circuit board so that the electrical connection area of ​​the circuit board and the electrical connection area of ​​the silicon wafer layer are at the same height, facilitating connection via the bonding wire 313.

[0172] In this embodiment, the ultrasonic sensor can be adhered to the back of the first groove structure using an adhesive layer (not limited to copper foil adhesive, double-sided adhesive, or thermosetting adhesive) using a front-mounted or back-mounted solution. In this embodiment, the adhesive layer 314 can be made of adhesive materials such as copper foil adhesive, double-sided adhesive, or thermosetting adhesive. Since copper foil adhesive can achieve good acoustic impedance matching, copper foil adhesive is preferably used as the adhesive layer. The copper foil adhesive includes a copper foil layer and adhesive layers disposed on the upper and lower surfaces of the copper foil layer.

[0173] In this embodiment, compared with the back-sticking solution, the distance between the acoustic layer and the finger in the front-sticking solution is closer, so the fingerprint data collected using the front-sticking solution is more accurate.

[0174] Based on the contents disclosed in the above embodiments, in this embodiment, Figure 19 is a cross-sectional schematic diagram of another outer frame of the electronic device provided in the embodiment of the present application. The back side 3151 of the first groove structure 315 is formed with a second groove structure 317 for accommodating at least a portion of the ultrasonic sensor 311. At least a portion of the ultrasonic sensor 311 is arranged inside the second groove structure 317. On the one hand, it is conducive to improving space utilization. On the other hand, it reduces the distance between the ultrasonic sensor and the pressing surface, which can enable more accurate fingerprint recognition.

[0175] In this embodiment, the depth h4 of the second groove structure 317 can be equal to or less than the thickness of the ultrasonic sensor. The second groove structure 317 is specifically formed for mounting the ultrasonic sensor 311, and its shape and size are suitable for accommodating the ultrasonic sensor. The depth of the second groove structure 317 can be equal to the thickness of the ultrasonic sensor to just accommodate the ultrasonic sensor, or the depth of the second groove structure 317 can be less than the thickness of the ultrasonic sensor to accommodate part of the ultrasonic sensor. The smaller depth of the second groove structure 317 allows the frame to have a certain thickness, preventing the frame from being too thin due to the presence of the first and second groove structures. In some embodiments, the depth of the second groove structure 317 can be greater than the thickness of the ultrasonic sensor so that the ultrasonic sensor can be completely disposed within the second groove structure. In addition, there is still space within the second groove structure to accommodate other related components.

[0176] In addition, the depth h3 of the first groove structure is greater than the depth h4 of the second groove structure, allowing users to better find the fingerprint recognition position by touch. In addition, the second groove structure is not too deep to affect the strength of the outer frame. The common portion 318 of the first groove structure 315 and the second groove structure 317 is part of the frame and has a certain thickness to protect the ultrasonic sensor.

[0177] In this embodiment, the bottom area of ​​the second groove structure 317 is greater than or equal to the area of ​​the ultrasonic sensor, so that the ultrasonic sensor can be attached to the bottom surface of the second groove structure.

[0178] The ultrasonic sensor 311 is attached to the back surface 3151 of the first groove structure 315 and includes two structures:

[0179] Front-mounted solution: As shown in Figure 20 , the acoustic layer 3112 is attached to the back surface 3151 of the first groove structure 315 via an adhesive layer 314. Specifically, the acoustic layer 3112 is attached to the front surface 3172 of the second groove structure 317 via the adhesive layer 314. One end of the silicon wafer layer 3111 is electrically connected to the circuit board 312 via a bonding wire 313. The acoustic layer 3112 is disposed between the silicon wafer layer 3111 and the first groove structure 315. In this embodiment, the front surface 3172 of the second groove structure 317 corresponds to the back surface 3151 of the first groove structure 315.

[0180] Back-sticking solution: As shown in Figure 21, the silicon wafer layer 3111 is attached to the back side 3151 of the first groove structure 315 through the adhesive layer 314, one end of the silicon wafer layer 3111 is electrically connected to the circuit board 312 through the binding wire 313, and the silicon wafer layer 3111 is arranged between the acoustic layer 3112 and the first groove structure 315.

[0181] In this embodiment, compared with the back-sticking solution, the distance between the acoustic layer and the finger in the front-sticking solution is closer. Therefore, the fingerprint data collected using the front-sticking solution is more accurate. In addition, since the second groove structure is used to accommodate the ultrasonic fingerprint sensor, the distance between the ultrasonic fingerprint sensor and the fingerprint collection surface is reduced, which can significantly improve the accuracy of fingerprint collection.

[0182] Based on the contents disclosed in the above embodiments, in this embodiment, the front side 3152 of the first groove structure 315 provides a pressing surface for contacting the user's finger. In order to improve the waterproof level of the electronic device, there is no air gap between the first groove structure and the outer frame.

[0183] In order to prevent moisture from entering the ultrasonic sensor and affecting fingerprint recognition, and to save process steps and facilitate processing, the first groove structure is recessed into the outer frame of the electronic device through integral molding. The first groove structure is made of the same material as the outer frame for easy processing, and the outer frame is made of plastic or metal.

[0184] Based on the disclosure of the above embodiments, in this embodiment, the outer frame and the first groove structure can be made of different materials. When the outer frame is made of plastic, the first groove structure can be made of metal, or when the first groove structure is made of metal, the outer frame can be made of plastic. Since the material of the first groove structure is different from that of the outer frame, the user can easily distinguish the location of the first groove structure with the naked eye, thereby reminding the user of the pressing position. In this embodiment, the outer frame can be made of plastic, hardware, glass, ceramic, etc., and the surface of the outer frame can be processed using processes such as vacuum plating, vacuum matte, spray painting, and material polishing.

[0185] Based on the contents disclosed in the above embodiments, in this embodiment, as shown in Figures 16 and 19, the depth h3 of the first groove structure is not less than 0.5 mm and not greater than 2 mm. The depth of the first groove structure is set to between 0.5 mm and 2 mm, which not only avoids the depth of the first groove structure being too deep, thereby reducing the strength of the outer frame, but also avoids the depth of the first groove structure being too shallow, thereby preventing the user from easily noticing the fingerprint collection position.

[0186] Based on the disclosure of the above embodiments, in this embodiment, as shown in FIG17 , the front face 3152 of the first groove structure 315 is a plane, and the front face 3152 is perpendicular to the display screen of the electronic device. The first groove structure has two opposing side faces, which are two opposing sides along the outer frame. The two side faces 3155 and 3156 can be vertical sides, that is, the two side faces 3155 and 3156 are perpendicular to the front face 3152 of the first groove structure, and the first groove structure 315 is a cubic groove.

[0187] Based on the disclosure of the above embodiments, in this embodiment, FIG22 is a cross-sectional schematic diagram of an ultrasonic fingerprint recognition device installed on another outer frame of an electronic device. As shown in FIG22, the first groove structure forms chamfered structures on the frame of the electronic device. In other words, the two opposing side surfaces 3153 and 3154 of the first groove structure form chamfered structures, that is, the two opposing side surfaces 3153 and 3154 of the first groove structure along the outer frame form chamfered structures. When the front surface 3152 of the first groove structure 315 is flat, it is more conducive to the collection of fingerprint recognition signals. When the two opposing side surfaces 3153 and 3154 of the first groove structure 315 along the outer frame form chamfered structures, stains at the chamfers are easier to clean.

[0188] The ultrasonic fingerprint recognition device further includes a reinforcement member, which is used to fix the ultrasonic sensor. The acoustic layer or the silicon wafer layer is fixed to the reinforcement member through a fixing layer. The reinforcement member can be a steel plate.

[0189] Based on the contents disclosed in the above embodiments, in this embodiment, a silk screen is provided on the front side of the first groove structure. The silk screen is a fingerprint pattern to facilitate users to quickly locate the fingerprint collection area, further improving the user experience.

[0190] Based on the disclosure of the above embodiments, in this embodiment, the first groove structure can also be a physical key. The front surface of the first groove structure is used to provide a pressing surface for the physical key. As shown in Figure 17, a key module can be provided below the fingerprint sensor to implement the function of the physical key. As shown in Figure 20, the ultrasonic sensor can be entirely provided in the second groove structure. The depth of the second groove structure is greater than the thickness of the ultrasonic sensor. A key module can also be provided below the ultrasonic sensor and can also be provided in the second groove structure. That is, the depth of the second groove structure is greater than or equal to the thickness of the ultrasonic sensor and the thickness of the key module.

[0191] The above description is merely a preferred embodiment of the present application and is not intended to limit the present application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application.

[0192] It should be understood that in the embodiments of the present application, "B corresponding to A" means that B is associated with A and B can be determined based on A. However, it should also be understood that determining B based on A does not mean determining B based solely on A, but B can also be determined based on A and / or other information.

[0193] In this document, the term "and / or" simply describes a relationship between related objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A exists alone, A and B exist simultaneously, or B exists alone. Furthermore, the character " / " in this document generally indicates that the related objects are in an "or" relationship.

[0194] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0195] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0196] In the several embodiments provided in this application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are merely schematic. For example, the division of the units is merely a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0197] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0198] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0199] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, or the part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0200] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. An electronic device, characterized in that: The electronic device comprises: A middle frame assembly (1), the middle frame assembly (1) being arranged along the circumference of the electronic device; Ultrasonic detection module (2), used for detecting fingerprint information; Wherein, the ultrasonic detection module (2) is installed on the middle frame assembly (1).

2. The electronic device according to claim 1, characterized in that: The middle frame component (1) comprises a button (11), and the ultrasonic detection module (2) is arranged on the button (11).

3. The electronic device according to claim 2, characterized in that: The button (11) has a receiving cavity (111), and the ultrasonic detection module (2) is bonded to the inner wall of the receiving cavity (111).

4. The electronic device according to claim 1, characterized in that: The middle frame assembly (1) comprises a main body (12) and a cover plate (13), wherein the main body (12) is arranged along the circumference of the electronic device, and the cover plate (13) is located outside the main body (12); The ultrasonic detection module (2) is located between the main body (12) and the cover plate (13).

5. The electronic device according to claim 4, characterized in that: The ultrasonic detection module (2) is bonded to the middle frame assembly (1).

6. The electronic device according to claim 5, characterized in that: The electronic device comprises an adhesive layer (3), wherein the adhesive layer (3) is located on a side of the ultrasonic detection module (2) facing the cover plate (13), and the ultrasonic detection module (2) is bonded to the cover plate (13) via the adhesive layer (3).

7. The electronic device according to any one of claims 1 to 6, characterized in that: The ultrasonic detection module (2) comprises an ultrasonic fingerprint module (21) and an acoustic layer (22), wherein the acoustic layer (22) is located on a side of the ultrasonic fingerprint module (21) away from the interior of the electronic device.

8. The electronic device according to claim 7, characterized in that: The acoustic layer (22) comprises a first electrode, a second electrode and a piezoelectric layer, wherein the piezoelectric layer is located between the first electrode and the second electrode, the first electrode is used to be electrically connected to a signal transmitting circuit, the second electrode is used to be electrically connected to a signal receiving circuit, and the piezoelectric layer is used to emit and receive ultrasonic signals.

9. The electronic device according to claim 8, characterized in that: The second electrode includes a plurality of electrodes, and each of the electrodes is connected to an operational amplifier.

10. The electronic device according to any one of claims 1 to 6, characterized in that: The electronic device comprises a pressure sensor, which is arranged on the middle frame and is electrically connected to the ultrasonic detection module (2).

11. An ultrasonic fingerprint recognition device installed in an electronic device, characterized in that: The ultrasonic fingerprint recognition device includes an ultrasonic sensor and a circuit board; The circuit board is electrically connected to the processing unit of the electronic device; The ultrasonic sensor is used to transmit ultrasonic signals and receive ultrasonic signals that are reflected and then pass through the outer frame of the electronic device, and is also used to convert the received ultrasonic signals into electrical signals and send the electrical signals to the processing unit through the circuit board; The ultrasonic sensor is attached to the groove formed on the back side of the protruding structure; At least a portion of the ultrasonic sensor is disposed inside the groove, and an outer frame of the electronic device protrudes to form a front side of the protruding structure; The protruding structure is a part of the outer frame of the electronic device.

12. The ultrasonic fingerprint recognition device according to claim 11, characterized in that: The depth of the groove is equal to or less than the thickness of the ultrasonic sensor; the bottom area of ​​the groove is larger than the area of ​​the ultrasonic sensor; the long side of the raised structure is parallel to the long side of the display screen of the electronic device, and the short side of the raised structure is parallel to the short side of the display screen of the electronic device.

13. The ultrasonic fingerprint recognition device according to claim 11 or 12, characterized in that: The height of the protruding structure is not less than 0.5 mm and not more than 3 mm; The height of the protruding structure is equal to the height of the volume button or the power button of the electronic device; The protruding structure is a rectangular parallelepiped protruding structure.

14. The ultrasonic fingerprint recognition device according to claim 11 or 12, characterized in that: The ultrasonic sensor comprises an acoustic layer and a silicon wafer layer, wherein the silicon wafer layer is connected to the acoustic layer; The groove formed by the ultrasonic sensor being attached to the back side of the protruding structure includes: The acoustic layer is attached to the groove, and the acoustic layer is arranged between the protruding structure and the silicon wafer layer; or The silicon sheet layer is attached to the groove, and the silicon sheet layer is arranged between the protruding structure and the acoustic layer.

15. The ultrasonic fingerprint recognition device according to claim 14, characterized in that: The ultrasonic sensor further comprises an adhesive layer, the acoustic layer or the silicon wafer layer is attached to the groove formed on the back side of the protruding structure through the adhesive layer, and the adhesive layer is copper foil adhesive; The ultrasonic fingerprint recognition device further includes a reinforcing member, the reinforcing member is used to fix the ultrasonic sensor, and the acoustic layer or the silicon wafer layer is fixed to the reinforcing member through a fixing layer; The ultrasonic fingerprint recognition device further includes a first fixing component, through which the circuit board is fixed to the outer frame, and the first fixing component is used to support the circuit board so that the circuit board is electrically connected to the silicon wafer layer; One end of the silicon wafer layer is connected to the circuit board through a binding wire, and the first fixing component is used to support the circuit board so that the electrical connection area of ​​the circuit board and the electrical connection area of ​​the silicon wafer layer are at the same height; or, One end of the silicon wafer layer is connected to the circuit board through ACF glue.

16. The ultrasonic fingerprint recognition device according to claim 11 or 12, characterized in that: The front side of the raised structure provides a pressing surface for contacting with a user's finger.

17. The ultrasonic fingerprint recognition device according to claim 11 or 12, characterized in that: The outer frame is made of the same material as the protruding structure. The outer frame is made of plastic or metal. The protruding structure and the outer frame connected thereto are formed in one piece. There is no air gap between the protruding structure and the outer frame.

18. The ultrasonic fingerprint recognition device according to claim 11 or 12, characterized in that: The outer frame is made of a different material from that of the protruding structure, and the outer frame is made of plastic or metal.

19. The ultrasonic fingerprint recognition device according to claim 11 or 12, characterized in that: A silk screen is provided on the top of the front side of the raised structure, and the silk screen is a fingerprint pattern; The protruding structure is vertical or has a first chamfer on a side close to the display screen of the electronic device and a side close to the back of the electronic device; The protruding structure is vertical or has a second chamfer on both sides along the outer frame; The top of the front side of the protruding structure is a plane; or, The top of the front side of the raised structure is a curved surface, the curvature of the curved surface is smaller than the curvature of the first chamfer, the curvature of the curved surface is smaller than the curvature of the second chamfer, and the curvature of the curved surface is equal to the curvature of the outer frame of the electronic device.

20. An electronic device for fingerprint recognition, characterized in that: Includes the ultrasonic fingerprint recognition device described in any one of claims 11 to 19 and the outer frame.

21. An ultrasonic fingerprint recognition device installed in an electronic device, characterized in that: The ultrasonic fingerprint recognition device includes an ultrasonic sensor and a circuit board; The circuit board is electrically connected to the processing unit of the electronic device; The ultrasonic sensor is used to transmit ultrasonic signals and receive ultrasonic signals that are reflected and then pass through the outer frame of the electronic device, and is also used to convert the received ultrasonic signals into electrical signals and send the electrical signals to the processing unit through the circuit board; The ultrasonic sensor is attached to the back side of the first groove structure, and the front side of the first groove structure is formed by being recessed into the outer frame of the electronic device.

22. The ultrasonic fingerprint recognition device according to claim 21, characterized in that: The ultrasonic sensor comprises an acoustic layer and a silicon wafer layer, wherein the silicon wafer layer is connected to the acoustic layer; The ultrasonic sensor further includes an adhesive layer, the acoustic layer or the silicon sheet layer is attached to the back side of the first groove structure through the adhesive layer, and the adhesive layer is copper foil adhesive; The front side of the first groove structure provides a pressing surface for contacting a user's finger; there is no air gap between the first groove structure and the outer frame; The ultrasonic fingerprint recognition device further includes a first fixing portion, through which the circuit board is fixed to the outer frame, and the first fixing portion is used to support the circuit board so that the circuit board is electrically connected to the silicon wafer layer; One end of the silicon wafer layer is connected to the circuit board through a binding wire, and the first fixing portion is used to support the circuit board so that The electrical connection area of ​​the circuit board and the electrical connection area of ​​the silicon wafer layer are at the same height; or, One end of the silicon wafer layer is connected to the circuit board through ACF glue.

23. The ultrasonic fingerprint recognition device according to claim 21 or 22, characterized in that: A second groove structure is formed on the back side of the first groove structure for accommodating at least a portion of the ultrasonic sensor.

24. The ultrasonic fingerprint recognition device according to claim 23, characterized in that: The depth of the second groove structure is less than or equal to the thickness of the ultrasonic sensor; and the bottom area of ​​the second groove structure is greater than or equal to the area of ​​the ultrasonic sensor.

25. The ultrasonic fingerprint recognition device according to claim 23, characterized in that: The acoustic layer is attached to the inside of the second groove structure, and the acoustic layer is arranged between the silicon sheet layer and the first groove structure; or The silicon sheet layer is attached to the inside of the second groove structure, and the silicon sheet layer is arranged between the acoustic layer and the first groove structure.

26. The ultrasonic fingerprint recognition device according to claim 21 or 22, characterized in that: The back side of the first groove structure is flat; The ultrasonic sensor attached to the back side of the first groove structure includes: The acoustic layer is attached to the back side of the first groove structure, and the acoustic layer is arranged between the silicon wafer layer and the first groove structure; or The silicon sheet layer is attached to the back side of the first groove structure, and the silicon sheet layer is arranged between the acoustic layer and the first groove structure.

27. The ultrasonic fingerprint recognition device according to claim 21 or 22, characterized in that: The first groove structure is made of the same material as the outer frame, and the outer frame is made of plastic or metal; The first groove structure is formed by the outer frame of the electronic device being recessed through integral molding, or The first groove structure is a physical key, and the front side of the first groove structure is used to provide a pressing surface for the physical key.

28. The ultrasonic fingerprint recognition device according to claim 21 or 22, characterized in that: The outer frame is made of a different material from that of the first groove structure, and the outer frame is made of plastic or metal; The first groove structure is a physical key, and the front side of the first groove structure is used to provide a pressing surface for the physical key.

29. The ultrasonic fingerprint recognition device according to claim 21 or 22, characterized in that: The depth of the first groove structure is not less than 0.5 mm and not more than 2 mm.

30. The ultrasonic fingerprint recognition device according to claim 21 or 22, characterized in that: The front side of the first groove structure is a plane, and the front side of the first groove structure is perpendicular to the display screen of the electronic device; The front side of the first groove is provided with a silk screen, and the silk screen is a fingerprint pattern; The first groove structure has two side surfaces, and the two side surfaces are two opposite side surfaces along the outer frame; The two side surfaces of the first groove structure form chamfered structures; or The two side surfaces of the first groove structure are side surfaces perpendicular to the front surface of the first groove structure.

31. An electronic device for fingerprint recognition, characterized in that: Includes the ultrasonic fingerprint recognition device described in any one of rights 21 to 30 and the outer frame.

Images