Chip driving assembly and camera module

Abstract

Disclosed in the present invention are a chip driving assembly and a camera module. The chip driving assembly comprises a circuit board, a movable carrier, a packaging body and an image-stabilization electrically conductive portion, wherein the packaging body is integrally joined to the front face of the circuit board; the movable carrier is attached to an attachment face of the packaging body; and a circuit board through hole of the circuit board, a light window of the packaging body and a carrier through hole of the movable carrier correspond to one another. The image-stabilization electrically conductive portion comprises a fixed circuit board, a movable circuit board and at least one flexible connecting portion, wherein the fixed circuit board surrounds the movable circuit board; the outer end of the flexible connecting portion is connected to the fixed circuit board, and the inner end of the flexible connecting portion is connected to the movable circuit board; the front face of the movable circuit board is attached to the back face of the circuit board; and from a top view perspective, the circuit board and the flexible connecting portion have an overlapping portion, so as to increase the area of the attachment face of the packaging body for the reliable attachment of the movable carrier.

Description

Chip driver components and camera modules Technical Field

[0001] The present invention relates to a camera module, and in particular to a chip driving component and a camera module. Background Art

[0002] With the popularity of mobile electronic devices, the relevant technologies of camera modules used in mobile electronic devices (for example, smart phones) to help users obtain images have been rapidly developed and advanced. At present, in the market, consumers have increasingly higher and more diverse requirements for the functions and performance of camera modules configured in mobile electronic devices. For example, consumers require camera modules to have an anti-shake function. The reason is that when a handheld mobile electronic device is used to take pictures, the human body has a certain frequency of physiological tremors and jitters caused by movement under normal circumstances, which will cause the imaging effect of the camera module to decline. Therefore, mobile electronic devices are usually equipped with an anti-shake motor to drive the optical lens and / or photosensitive chip to achieve the anti-shake function. However, with the development trend of large image surfaces of photosensitive chips, the camera module has higher and higher requirements for the driving force of the anti-shake motor, and current mobile electronic devices need to meet the development trend of lightness and thinness at the same time, which has a greater restriction on the size and volume of the camera module, resulting in the anti-shake motor being unable to increase accordingly with the increase in the size of the photosensitive chip. Therefore, how to provide a camera module that can achieve good optical image stabilization function and has a smaller size to meet the trend of lightweight and thin development of mobile electronic devices is a technical problem that the inventors of the present invention are committed to solving.

[0003] Summary of the Invention

[0004] An object of the present invention is to provide a chip driving component and a camera module, wherein the camera module can achieve a good optical image stabilization effect and has a smaller size to meet the development trend of thinner and lighter mobile electronic devices.

[0005] One object of the present invention is to provide a chip driving component and a camera module, wherein at least one frame of the circuit board of the chip driving component has a wider size, so that at least one frame of the package body integrally combined with the circuit board has a wider size, so that the area of ​​the mounting surface of the package body can be increased, which is conducive to reliable and stable mounting of the movable carrier.

[0006] One object of the present invention is to provide a chip driving component and a camera module, wherein the anti-shake conductive part of the chip driving component provides a movable circuit board, a fixed circuit board surrounding the movable circuit board, and at least one flexible conductive part connecting the movable circuit board and the fixed circuit board. The flexible conductive part enables the movable circuit board and the circuit board connected to the movable circuit board to translate relative to the fixed circuit board, providing basic conditions for realizing the optical image stabilization function, thereby improving imaging quality.

[0007] One object of the present invention is to provide a chip driving component and a camera module, wherein the flexible connection portion is bent multiple times between the movable circuit board and the fixed circuit board to allow the flexible circuit board to deform as the movable circuit board moves horizontally, and in this process, the reaction force generated by the flexible circuit board is small to avoid affecting the anti-shake effect of the camera module.

[0008] One object of the present invention is to provide a chip driving component and a camera module, wherein on at least one side of the chip driving component, the outer edge of the circuit board is located outside the outer edge of the movable circuit board, so that on this side of the chip driving component, the circuit board has a wider dimension to increase the width dimension of the package on this side, thereby increasing the area of ​​the top surface of the package.

[0009] An object of the present invention is to provide a chip driver assembly and a camera module, wherein, when viewed from above, the circuit board and the flexible connection portion of the anti-shake conductive portion have an overlapping portion, thereby facilitating an increase in the top surface area of ​​the package. Preferably, the circuit board and the fixed circuit board of the anti-shake conductive portion have an overlapping portion.

[0010] One object of the present invention is to provide a chip driving component and a camera module, wherein in some embodiments, glue is provided at the bonding positions of the solder pads of the circuit board and the solder pads of the photosensitive chip. This not only protects the solder, but also enhances the connection strength between the circuit board and the photosensitive chip, reducing the force on the bonding position during the falling process.

[0011] One object of the present invention is to provide a chip driving component and a camera module, wherein in some embodiments, glue is provided at the bonding positions of the solder pads of the movable circuit board and the solder pads of the photosensitive chip. This not only protects the solder, but also enhances the connection strength between the movable circuit board and the photosensitive chip, and reduces the force applied to the bonding arrangement during a drop.

[0012] According to one aspect of the present invention, the present invention provides a chip driver component, comprising:

[0013] a circuit board having a circuit board through-hole;

[0014] a movable carrier having a carrier through-hole;

[0015] a driving unit configured to drive the movable carrier to move;

[0016] a package body having a light window and a mounting surface surrounding a top opening of the light window, wherein the package body is integrally combined with a front surface of the circuit board, the movable carrier is mounted on the mounting surface of the package body, and the circuit board through-hole of the circuit board, the light window of the package body, and the carrier through-hole of the movable carrier correspond to each other; and

[0017] The anti-shake conductive portion includes a fixed circuit board, a movable circuit board, and at least one flexible connection portion. The fixed circuit board surrounds the movable circuit board. The outer end of the flexible connection portion is connected to the fixed circuit board, and the inner end of the flexible connection portion is connected to the movable circuit board. The front side of the movable circuit board is mounted on the back side of the circuit board. When viewed from above, the package body and the flexible connection portion have an overlapping portion.

[0018] According to an embodiment of the present invention, the package body and the fixed circuit board have an overlapping portion when viewed from a top view.

[0019] According to one embodiment of the present invention, on at least one side of the chip driving component, the distance between the outer edge of the package body and the central axis of the chip driving component is greater than the distance between the outer edge of the movable circuit board and the central axis of the chip driving component.

[0020] According to one embodiment of the present invention, on at least one side of the chip driving assembly, the distance between the outer edge of the circuit board and the central axis of the chip driving assembly is greater than the distance between the outer edge of the movable circuit board and the central axis of the chip driving assembly.

[0021] According to one embodiment of the present invention, on at least one side of the chip driving assembly, the distance between the outer edge of the circuit board and the central axis of the chip driving assembly is greater than the distance between the inner edge of the fixed circuit board and the central axis of the chip driving assembly.

[0022] According to one embodiment of the present invention, on each side of the chip driving assembly, the distance between the outer edge of the circuit board and the central axis of the chip driving assembly is greater than the distance between the inner edge of the fixed circuit board and the central axis of the chip driving assembly.

[0023] According to one embodiment of the present invention, the outer end and the inner end of the flexible connection portion are connected to non-corresponding sides of the fixed circuit board and the movable circuit board, respectively.

[0024] According to another aspect of the present invention, the present invention further provides a camera module, comprising:

[0025] Photosensitive chip;

[0026] an optical lens, wherein the optical lens is held in the light-sensing path of the light-sensing chip; and

[0027] The chip driver assembly further comprises:

[0028] a circuit board having a circuit board through-hole;

[0029] a movable carrier having a carrier through-hole;

[0030] a package body having a light window and a mounting surface surrounding a top opening of the light window, wherein the package body is integrally combined with a front surface of the circuit board, the movable carrier is mounted on the mounting surface of the package body, and the circuit board through-hole of the circuit board, the light window of the package body, and the carrier through-hole of the movable carrier correspond to each other; and

[0031] The anti-shake conductive part includes a fixed circuit board, a movable circuit board and at least one flexible connection part, wherein the fixed circuit board surrounds the movable circuit board, the outer end of the flexible connection part is connected to the fixed circuit board, and the inner end of the flexible connection part is connected to the movable circuit board. The front side of the movable circuit board is mounted on the back side of the circuit board, wherein the circuit board and the flexible connection part have an overlapping part when viewed from a top view, wherein the photosensitive chip is located on the back side of the circuit board, and the photosensitive chip is constructed to translate along with the translation of the circuit board.

[0032] According to one embodiment of the present invention, the movable circuit board has an active circuit board through-hole, and the active circuit board through-hole of the active circuit board corresponds to the circuit board through-hole of the circuit board, wherein the photosensitive chip is mounted on the back side of the movable circuit board, and the photosensitive area of ​​the photosensitive chip corresponds to the active circuit board through-hole of the active circuit board.

[0033] According to one embodiment of the present invention, the photosensitive chip is mounted on the back side of the circuit board, and the photosensitive area of ​​the photosensitive chip corresponds to the circuit board through-hole of the circuit board.

[0034] According to one embodiment of the present invention, the pads of the active circuit board and the pads of the photosensitive chip are connected by solder through a thermocompression bonding process.

[0035] According to one embodiment of the present invention, the pads of the circuit board and the pads of the photosensitive chip are connected by solder through a thermocompression bonding process.

[0036] According to one embodiment of the present invention, glue is provided at the bonding positions of the pads of the active circuit board and the pads of the photosensitive chip.

[0037] According to one embodiment of the present invention, glue is provided at the bonding positions of the solder pads of the circuit board and the solder pads of the photosensitive chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] FIG1 is a perspective schematic diagram of a camera module according to a preferred embodiment of the present invention.

[0039] FIG2 is a schematic diagram of an exploded view of the camera module according to the preferred embodiment of the present invention.

[0040] FIG3 is a schematic diagram of an exploded view of the camera module according to the preferred embodiment of the present invention from another perspective.

[0041] FIG4 is a schematic cross-sectional view of the camera module in one direction according to the above preferred embodiment of the present invention.

[0042] FIG5 is a schematic cross-sectional view of the camera module in another direction according to the above preferred embodiment of the present invention.

[0043] FIG6 is an enlarged schematic diagram of a local position of FIG5.

[0044] FIG7 is a cross-sectional schematic diagram of a modified example of the camera module according to the above preferred embodiment of the present invention.

[0045] FIG8 is a cross-sectional schematic diagram of another modified example of the camera module according to the above preferred embodiment of the present invention. DETAILED DESCRIPTION

[0046] Before describing in detail any embodiment of the present invention, it should be understood that the present invention is not limited in its application to the construction and arrangement details of the components set forth in the following description or illustrated in the following figures. The present invention is capable of other embodiments and can be practiced or carried out in various ways. In addition, it should be understood that the words and terms used herein are for descriptive purposes and should not be considered restrictive. The use of "comprises," "includes," or "has" and variations thereof herein is intended to cover the items and their equivalents set forth below, as well as additional items. Unless otherwise specified or limited, the terms "mount," "connect," "support," and "couple" and variations thereof are used broadly and cover both direct and indirect mounting, connection, support, and coupling. In addition, "connect" and "couple" are not limited to physical or mechanical connections or couplings.

[0047] Furthermore, on the first hand, in the disclosure of the present invention, the terms "longitudinal", "transverse", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like to indicate orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore the above terms cannot be understood as limitations on the present invention; on the second hand, the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" cannot be understood as a limitation on the quantity.

[0048] With reference to Figures 1 to 6 of the accompanying drawings of the present invention, a camera module according to a preferred embodiment of the present invention will be disclosed and explained in the following description, wherein the camera module includes a chip driving component 10, a photosensitive chip 20, and an optical lens 30. The photosensitive chip 20 is connected to the chip driving component 10, and the optical lens 30 is maintained in the light sensing path of the photosensitive chip 20. After passing through the optical lens 30, the incident light reaches the photosensitive chip 20, and the photosensitive chip 20 performs photoelectric conversion to form an image, wherein the chip driving component 10 is configured to be able to translate the photosensitive chip 20 to achieve the optical image stabilization function of the camera module.

[0049] It is worth mentioning that the phrase "the chip driving assembly 10 is configured to translate the photosensitive chip 20" as used herein means that the photosensitive chip 20 is capable of driving the photosensitive chip 20 to move in a direction perpendicular to the optical axis of the camera module to implement the optical image stabilization function of the camera module. For example, referring to FIG1 , the optical axis of the camera module is the Z-axis direction in the coordinate system, and the chip driving assembly 10 is configured to drive the photosensitive chip 20 to move along the X-axis and Y-axis directions to implement the optical image stabilization function of the camera module.

[0050] Specifically, referring to Figures 2 to 5, the chip driving component 10 includes a circuit board 11, a package body 12, an anti-shake conductive part 13 and a movable carrier 14, wherein the circuit board 11 is mounted on the anti-shake conductive part 13, the package body 12 is integrally combined with the circuit board 11, and the movable carrier 14 is mounted on the package body 12.

[0051] More specifically, the circuit board 11 has a circuit board front side 111, a circuit board back side 112, and a circuit board through-hole 113. The circuit board front side 111 and the circuit board back side 112 correspond to each other to define the thickness dimension of the circuit board 11. The circuit board through-hole 113 extends from the circuit board front side 111 to the circuit board back side 112, that is, the circuit board through-hole 113 passes through the opposite sides of the circuit board 11.

[0052] In some embodiments of the present invention, the circuit board 11 is a square plate. For example, the projection pattern of the circuit board 11 on the projection plane perpendicular to the optical axis of the camera module can be a square or a rectangle, so that the circuit board 11 is a square plate. The circuit board through-hole 113 of the circuit board 11 is a square through-hole, and its shape and size match the shape and size of the photosensitive area of ​​the photosensitive chip 20, so that the circuit board 11 has four circuit board frames 114 connected end to end.

[0053] For ease of understanding and description, the four circuit board frames 114 of the circuit board 11 are defined in sequence as a first circuit board frame 1141, a second circuit board frame 1142, a third circuit board frame 1143, and a fourth circuit board frame 1144. The first circuit board frame 1141 and the third circuit board frame 1143 are located on a pair of opposite sides of the circuit board through-hole 113 of the circuit board 11, and the second circuit board frame 1142 and the fourth circuit board frame 1144 are located on another pair of opposite sides of the circuit board through-hole 113 of the circuit board 11, and the The opposite ends of the first frame 1141 of the circuit board are respectively extended to be connected to one end of the second frame 1142 of the circuit board and one end of the fourth frame 1144 of the circuit board, and the opposite ends of the third frame 1143 of the circuit board are respectively extended to be connected to the other end of the second frame 1142 of the circuit board and the other end of the fourth frame 1144 of the circuit board, so that the first frame 1141 of the circuit board, the second frame 1142 of the circuit board, the third frame 1143 of the circuit board and the fourth frame 1144 of the circuit board are surrounded to form the circuit board through hole 113.

[0054] The package body 12 is integrally combined with the front surface 111 of the circuit board 11, and the package body 12 has a light window 121 and a mounting surface 122 surrounding the top opening of the light window 121. The light window 121 of the package body 12 corresponds to the circuit board through-hole 113 of the circuit board 11. The incident light entering the interior of the camera module through the optical lens 30 passes through the light window 121 of the package body 12 and the circuit board through-hole 113 of the circuit board 11 in sequence and then reaches the photosensitive chip 20. The photosensitive chip 20 performs photoelectric conversion to form an image.

[0055] In some embodiments of the camera module of the present invention, the package body 12 can be integrally combined with the circuit board front surface 111 of the circuit board 11 through a molding process. During the molding process, the light window 121 and the mounting surface 122 of the package body 12 are formed at the same time as the package body 12 is formed. Moreover, by virtue of the advantages of the mold, the mounting surface 122 of the package body 12 has good flatness. Moreover, compared with the traditional solution of mounting the lens holder on the circuit board, in the camera module of the present invention, the package body 12 can be integrally combined with the circuit board front surface 111 of the circuit board 11 through a molding process. On the one hand, no glue is required between the package body 12 and the circuit board 11, which is conducive to reducing the height dimension of the camera module. On the other hand, the height dimension of the package body 12 can be smaller than the lens holder, which is conducive to reducing the height dimension of the camera module.

[0056] Specifically, the package body 12 is in the shape of a square frame and has four package body frames 123 connected end to end. The four package body frames 123 are defined in sequence as a first package body frame 1231, a second package body frame 1232, a third package body frame 1233, and a fourth package body frame 1234. The first package body frame 1231 and the third package body frame 1233 are located on a pair of opposite sides of the light window 121 of the package body 12, and the second package body frame 1232 and the fourth package body frame 1234 are located on the other pair of opposite sides of the light window 121 of the package body 12. On the reverse side, the opposite ends of the first frame 1231 of the package body are respectively extended to be connected to one end of the second frame 1232 of the package body and one end of the fourth frame 1234 of the package body, and the opposite ends of the third frame 1233 of the package body are respectively extended to be connected to the other end of the second frame 1232 of the package body and the other end of the fourth frame 1234 of the package body, so that the first frame 1231 of the package body, the second frame 1232 of the package body, the third frame 1233 of the package body and the fourth frame 1234 of the package body are surrounded to form the light window 121.

[0057] The first package frame 1231 of the package body 12 is integrally combined with the first circuit board frame 1141 of the circuit board 11, and the width of the first package frame 1231 is proportional to the width of the first circuit board frame 1141, that is, the larger the width of the first circuit board frame 1141, the larger the width of the first package frame 1231, and the larger the area of ​​the mounting surface 122 of the package body 12 formed on the top of the first package frame 1231, and the easier it is to reliably and stably mount the movable carrier 14, and And the carrier through hole 141 of the movable carrier 14 corresponds to the light window 121 of the package body 12. Therefore, in the camera module of the present invention, the area of ​​the mounting surface 122 of the package body 12 can be increased by increasing the width dimension of the first frame 1141 of the circuit board of the circuit board 11, so that the movable carrier 14 can be reliably and stably mounted on the mounting surface 122 of the package body 12. For example, in some embodiments of the present invention, the movable carrier 14 can be reliably and stably mounted on the mounting surface 122 of the package body 12 by glue. Correspondingly, by increasing the width dimension of the second frame 1142 of the circuit board of the circuit board 11, the area of ​​the mounting surface 122 of the package body 12 can be increased, so that the movable carrier 14 can be reliably and stably mounted on the mounting surface 122 of the package body 12. By increasing the width dimension of the third frame 1143 of the circuit board of the circuit board 11, the area of ​​the mounting surface 122 of the package body 12 can be increased, so that the movable carrier 14 can be reliably and stably mounted on the mounting surface 122 of the package body 12. By increasing the width dimension of the fourth frame 1144 of the circuit board of the circuit board 11, the area of ​​the mounting surface 122 of the package body 12 can be increased, so that the movable carrier 14 can be reliably and stably mounted on the mounting surface 122 of the package body 12.

[0058] 2 to 6 , the anti-shake conductive portion 13 further includes a fixed circuit board 131, a movable circuit board 132, and at least one flexible connection portion 133. The fixed circuit board 131 has a fixed circuit board front face 1311, a fixed circuit board back face 1312, and a fixed circuit board through-hole 1313. The fixed circuit board front face 1311 and the fixed circuit board back face 1312 correspond to each other to define the thickness of the fixed circuit board 131. The fixed circuit board through-hole 1313 extends from the fixed circuit board front face 1311 to the fixed circuit board back face 1312, i.e., the fixed circuit board through-hole 1313 passes through opposite sides of the fixed circuit board 131. Accordingly, the movable circuit board 132 has a movable circuit board front face 1321, a movable circuit board rear face 1322, and a movable circuit board through-hole 1323. The movable circuit board front face 1321 and the movable circuit board rear face 1322 correspond to each other and define the thickness of the movable circuit board 132. The movable circuit board through-hole 1323 extends from the movable circuit board front face 1321 to the movable circuit board rear face 1322, that is, the movable circuit board through-hole 1323 passes through opposite sides of the movable circuit board 132. The movable circuit board 132 and the flexible connecting portion 133 are both located within the fixed circuit board through-hole 1313 of the fixed circuit board 131. The opposite ends of the flexible connecting portion 133 extend to and are connected to the fixed circuit board 131 and the movable circuit board 132, respectively, allowing the flexible connecting portion 133 to suspend the movable circuit board 132 from the fixed circuit board through-hole 1313 of the fixed circuit board 131. That is, the movable circuit board 132 is disposed inside the fixed circuit board 131 , and the movable circuit board 132 is connected to the fixed circuit board 131 through the flexible connection portion 133 .

[0059] The active circuit board front side 1321 of the active circuit board 132 is mounted on the circuit board back side 112 of the circuit board 11, and the active circuit board through-hole 1323 of the active circuit board 132 corresponds to the circuit board through-hole 113 of the circuit board 11. For example, the active circuit board front side 1321 of the active circuit board 132 and the circuit board back side 112 of the circuit board 11 can be bonded by glue so that the active circuit board front side 1321 of the active circuit board 132 is mounted on the circuit board back side 112 of the circuit board 11. The photosensitive chip 20 is mounted on the back side 1322 of the movable circuit board 132, and the movable circuit board through-hole 1323 of the movable circuit board 132 corresponds to the photosensitive area of ​​the photosensitive chip 20. In this way, the incident light entering the interior of the camera module through the optical lens 30 passes through the carrier through-hole 141 of the movable carrier 14, the light window 121 of the package body 12 and the circuit board through-hole 113 of the circuit board 11 in sequence and reaches the photosensitive chip 20. The photosensitive chip 20 performs photoelectric conversion to form an image.

[0060] When the movable carrier 14 drives the packaging body 12, the circuit board 11, the movable circuit board 132 and the photosensitive chip 20 to translate to realize the optical image stabilization function of the camera module, the flexible connection part 133 can be deformed and always connect the movable circuit board 132 and the fixed circuit board 131.

[0061] In some specific examples of the present invention, the flexible connection portion 133 is bent multiple times between the fixed circuit board 131 and the movable circuit board 132 to allow the flexible connection portion 133 to deform as the movable circuit board 132 translates, and in this process, the reaction force generated by the flexible connection portion 133 is small to avoid affecting the optical image stabilization effect of the camera module.

[0062] In this specific example of the camera module of the present invention shown in Figures 1 to 6, the fixed circuit board 131 and the movable circuit board 132 of the anti-shake conductive part 13 are both square frames, and the fixed circuit board 131 surrounds the outside of the movable circuit board 132, wherein one end of the flexible connection part 133 is connected to one side of the movable circuit board 132, and the other end of the flexible connection part 133 is connected to the non-corresponding side of the fixed circuit board 131, so as to reduce the reaction force generated by the flexible connection part 133 when the movable circuit board 132 translates. That is, each side of the movable circuit board 132 faces the corresponding side of the fixed circuit board 131, and the flexible connection portion 133 is provided with at least three bending positions, one of the bending positions is close to the end of the flexible connection portion 133 connected to the movable circuit board 132, another of the bending positions is close to the end of the flexible connection portion 133 connected to the fixed circuit board 131, and another of the bending positions spans the corner of the movable circuit board 132, so that one end of the flexible connection portion 133 is connected to one side of the movable circuit board 132, and the other end of the flexible connection portion 133 is connected to the non-corresponding side of the fixed circuit board 131.

[0063] More specifically, with reference to Figures 2, 3, 5, and 6, the fixed circuit board 131 has four fixed circuit board frames 1314 connected end to end, which are sequentially defined as a first fixed circuit board frame 13141, a second fixed circuit board frame 13142, a third fixed circuit board frame 13143, and a fourth fixed circuit board frame 13144. The first fixed circuit board frame 13141 and the third fixed circuit board frame 13143 are located on a pair of opposite sides of the fixed circuit board through-hole 1313 of the fixed circuit board 131, and the second fixed circuit board frame 13142 is located on a pair of opposite sides of the fixed circuit board through-hole 1313 of the fixed circuit board 131. The fourth frame 13144 of the fixed circuit board is located on another pair of opposite sides of the fixed circuit board through-hole 1313 of the fixed circuit board 131, and the opposite ends of the first frame 13141 of the fixed circuit board are respectively extended to be connected to one end of the second frame 13142 of the fixed circuit board and the other end of the fourth frame 13144 of the fixed circuit board, and the opposite ends of the third frame 13143 of the fixed circuit board are respectively extended to be connected to the other end of the second frame 13142 of the fixed circuit board and the other end of the fourth frame 13144 of the fixed circuit board.

[0064] The movable circuit board 132 has four movable circuit board frames 1324 connected end to end, which are defined as a first movable circuit board frame 13241, a second movable circuit board frame 13242, a third movable circuit board frame 13243 and a fourth movable circuit board frame 13244. The first movable circuit board frame 13241 and the third movable circuit board frame 13243 are located on a pair of opposite sides of the movable circuit board through-hole 1323 of the movable circuit board 132. The second movable circuit board frame 13242 and the third movable circuit board frame 13243 are located on a pair of opposite sides of the movable circuit board through-hole 1323 of the movable circuit board 132. The four side frames 13244 are located on the other opposite sides of the active circuit board through-hole 1323 of the active circuit board 132, and the opposite ends of the first side frame 13241 of the active circuit board are respectively extended to be connected to one end of the second side frame 13242 of the active circuit board and one end of the fourth side frame 13244 of the active circuit board, and the opposite ends of the third side frame 13243 of the active circuit board are respectively extended to be connected to the other end of the second side frame 13242 of the active circuit board and the other end of the fourth side frame 13244 of the active circuit board.

[0065] The positions of the fixed circuit board first frame 13141, the fixed circuit board second frame 13142, the fixed circuit board third frame 13143 and the fixed circuit board fourth frame 13144 of the fixed circuit board 131 respectively correspond to the positions of the movable circuit board first frame 13241, the movable circuit board second frame 13242, the movable circuit board third frame 13243 and the movable circuit board fourth frame 13244 of the movable circuit board 132, and the positions of the movable circuit board first frame 13241, the movable circuit board second frame 13242, the movable circuit board third frame 13243 and the movable circuit board fourth frame 13244 of the movable circuit board 132 respectively correspond to the positions of the circuit board first frame 1141, the circuit board second frame 1142, the circuit board third frame 1143 and the circuit board fourth frame 1144 of the circuit board 11. That is to say, the first frame 13241 of the movable circuit board 132 can be attached to the first frame 1141 of the circuit board 11 by glue, the second frame 13242 of the movable circuit board can be attached to the second frame 1142 of the circuit board by glue, the third frame 13243 of the movable circuit board can be attached to the third frame 1143 of the circuit board by glue, and the fourth frame 13244 of the movable circuit board can be attached to the fourth frame 1144 of the circuit board by glue.

[0066] There are four flexible connection parts 133 , which are sequentially defined as a first flexible connection part 1331 , a second flexible connection part 1332 , a third flexible connection part 1333 , and a fourth flexible connection part 1334 . The inner end of the first flexible connection part 1331 is connected to the first frame 13241 of the movable circuit board 132, and the outer end of the first flexible connection part 1331 is connected to the second frame 13142 of the fixed circuit board 131, so that the first flexible connection part 1331 is used to connect the non-corresponding sides of the fixed circuit board 131 and the movable circuit board 132; the inner end of the second flexible connection part 1332 is connected to the second frame 13242 of the movable circuit board 132, and the outer end of the second flexible connection part 1332 is connected to the third frame 13143 of the fixed circuit board 131, so that the second flexible connection part 1332 is used to connect the non-corresponding sides of the fixed circuit board 131 and the movable circuit board 132; the inner end of the third flexible connection part 1333 is connected to the third frame 13243 of the movable circuit board 132, and the outer end of the third flexible connection part 1333 is connected to the fixed circuit board 131 The fourth frame 13144 of the fixed circuit board is connected, so that the third flexible connection portion 1333 is used to connect the non-corresponding sides of the fixed circuit board 131 and the movable circuit board 132; the inner end of the fourth flexible connection portion 1334 is connected to the movable circuit board fourth frame 13244 of the movable circuit board 132, and the outer end of the fourth flexible connection portion 1334 is connected to the fixed circuit board first frame 13141 of the fixed circuit board 131, so that the fourth flexible connection portion 1334 is used to connect the fixed circuit board 131 and the non-corresponding sides of the movable circuit board 132; through the above-mentioned structure, when the movable carrier 14 drives the packaging body 12, the circuit board 11, the movable circuit board 132 and the photosensitive chip 20 to translate to realize the optical image stabilization function of the camera module, the first flexible connection part 1331, the second flexible connection part 1332, the third flexible connection part 1333 and the fourth flexible connection part 1334 can generate a smaller reaction force to avoid affecting the optical image stabilization effect of the camera module.

[0067] Optionally, in other examples of the camera module of the present invention, the inner end of the first flexible connection part 1331 is connected to the first frame 13241 of the movable circuit board 132, and the outer end of the first flexible connection part 1331 can be connected to the third frame 13143 of the fixed circuit board or the fourth frame 13144 of the fixed circuit board 131. Correspondingly, the inner end of the second flexible connection portion 1332 is connected to the second frame 13242 of the movable circuit board 132, the outer end of the second flexible connection portion 1332 can be connected to the fourth frame 13144 of the fixed circuit board 131 or the first frame 13141 of the fixed circuit board, the inner end of the third flexible connection portion 1333 is connected to the third frame 13243 of the movable circuit board 132, the outer end of the third flexible connection portion 1333 can be connected to the first frame 13141 of the fixed circuit board 131 or the second frame 13142 of the fixed circuit board, the inner end of the fourth flexible connection portion 1334 is connected to the movable circuit board The fourth frame 13244 of the movable circuit board 132, the outer end of the fourth flexible connection part 1334 can be connected to the second frame 13142 of the fixed circuit board or the third frame 13143 of the fixed circuit board 131. Through the above structure, when the movable carrier 14 drives the packaging body 12, the circuit board 11, the movable circuit board 132 and the photosensitive chip 20 to translate to realize the optical image stabilization function of the camera module, the first flexible connection part 1331, the second flexible connection part 1332, the third flexible connection part 1333 and the fourth flexible connection part 1334 can generate a smaller reaction force to avoid affecting the optical image stabilization effect of the camera module.

[0068] 4 and 5 , viewed from above, the package body 12 and the flexible connection portion 133 of the anti-shake conductive portion 13 have an overlapping portion. In this way, at least one package body frame 123 of the package body 12 can have a wider size to increase the mounting area of ​​the mounting surface 122 of the package body 12, thereby facilitating reliable and stable mounting of the movable carrier 14.

[0069] Continuing to refer to Figures 4 and 5, the package body 12 is integrally combined with the circuit board front face 111 of the circuit board 11, and the width dimension of the package body frame 123 of the package body 12 is limited by the width dimension of the circuit board frame 114 of the circuit board 11, that is, on the same side of the camera module, the width dimension of the package body frame 123 of the package body 12 is less than or equal to the dimension of the circuit board frame 114 of the circuit board 11, and the active circuit board front face 1321 of the active circuit board 132 of the anti-shake conductive part 13 is mounted on the circuit board back face 112 of the circuit board 11. In the camera module of the present invention, the circuit board 11 At least one of the circuit board frames 114 extends outward to above the flexible connection portion 133 of the anti-shake conductive portion 13 and does not contact the flexible connection portion 133. In this way, at least one of the circuit board frames 114 of the circuit board 11 can have a wider size without affecting the deformation of the flexible connection portion 133. In this way, at least one of the package body frames 123 of the package body 12 can also have a wider size, so that the package body 12 and the flexible connection portion 133 have an overlapping portion when viewed from above, so as to increase the mounting area of ​​the mounting surface 122 of the package body 12, so as to facilitate reliable and stable mounting of the movable carrier 14.

[0070] For example, referring to FIG4 , the first frame 1141 of the circuit board 11 extends outward to above the first flexible connection portion 1331 and does not contact the first flexible connection portion 1331, that is, the outer edge of the first frame 1141 of the circuit board 11 is located outside the outer edge of the first frame 13241 of the movable circuit board 132, so that the distance L2 between the outer edge of the first frame 1141 of the circuit board and the central axis of the chip driver component 10 is greater than the distance L1 between the outer edge of the first frame 13241 of the movable circuit board and the central axis of the chip driver component 10. Similarly, the first frame 1141 of the circuit board 11 can have a wider size without affecting the deformation of the first flexible connection part 1331. In this way, the first frame 1231 of the package body 12 can also have a wider size. For example, the distance between the outer edge of the first frame 1231 of the package body 12 and the central axis of the chip driving component 10 is greater than the distance between the outer edge of the first frame 13241 of the movable circuit board and the central axis of the chip driving component 10, thereby increasing the mounting area of ​​the mounting surface 122 of the package body 12, which is conducive to reliable and stable mounting of the movable carrier 14.

[0071] In some specific examples of the camera module of the present invention, referring to Figures 4 and 5, the first frame 1141 of the circuit board of the circuit board 11 extends outward to above the first flexible connection portion 1331 and does not contact the first flexible connection portion 1331, the second frame 1142 of the circuit board of the circuit board 11 extends outward to above the second flexible connection portion 1332 and does not contact the second flexible connection portion 1332, the third frame 1143 of the circuit board of the circuit board 11 extends outward to above the third flexible connection portion 1333 and does not contact the third flexible connection portion 1333, and the fourth frame 1144 of the circuit board of the circuit board 11 extends outward to above the fourth flexible connection portion 1334 and does not contact the fourth flexible connection portion 1334. In this way, the first frame 1231 of the package body, the second frame 1232 of the package body, the third frame 1233 of the package body and the fourth frame 1234 of the package body all have a wider size. For example, from a top view, the first frame 1231 of the package body and the first flexible connection part 1331 have an overlapping part, the second frame 1232 of the package body and the second flexible connection part 1332 have an overlapping part, the third frame 1233 of the package body and the third flexible connection part 1333 have an overlapping part, and the fourth frame 1234 of the package body and the fourth flexible connection part 1334 have an overlapping part, thereby increasing the mounting area of ​​the mounting surface 122 of the package body 12, so as to facilitate reliable and stable mounting of the movable carrier 14.

[0072] Continuing to refer to FIG4 , the first frame 1141 of the circuit board 11 extends outward to above the first frame 13141 of the fixed circuit board 131 and does not contact the first flexible connection portion 133, that is, the outer edge of the first frame 1141 of the circuit board 11 is located outside the inner edge of the first frame 13141 of the fixed circuit board 131, so that the distance L2 between the outer edge of the first frame 1141 of the circuit board and the central axis of the chip driver component 10 is greater than the distance L3 between the inner edge of the first frame 13141 of the fixed circuit board and the central axis of the chip driver component 10, so that , the first frame 13141 of the fixed circuit board is retracted inward to facilitate reducing the width of the camera module. At the same time, the first frame 1141 of the circuit board of the circuit board 11 can have a wider size without affecting the deformation of the first flexible connection part 1331. In this way, the first frame 1231 of the package body 12 can also have a wider size. For example, the first frame 1231 of the package body 12 can also extend outward to above the first frame 13141 of the fixed circuit board of the fixed circuit board 131, thereby increasing the mounting area of ​​the mounting surface 122 of the package body 12, which is conducive to reliably and stably mounting the movable carrier 14.

[0073] In some specific examples of the camera module of the present invention, referring to Figures 4 and 5, the first frame 1141 of the circuit board 11 extends outward to above the first frame 13141 of the fixed circuit board 131 and does not contact the first flexible connection portion 1331, the second frame 1142 of the circuit board 11 extends outward to above the second frame 13142 of the fixed circuit board 131 and does not contact the second flexible connection portion 1332, the third frame 1143 of the circuit board 11 extends outward to above the third frame 13143 of the fixed circuit board 131 and does not contact the third flexible connection portion 1333, the fourth frame 1144 of the circuit board 11 extends outward to above the fourth frame 13144 of the fixed circuit board 131 and does not contact the fourth flexible connection portion 1334, so that the first frame 13141 of the fixed circuit board and the fixed circuit board The second frame 13142 of the fixed circuit board, the third frame 13143 of the fixed circuit board and the fourth frame 13144 of the fixed circuit board are all retracted to facilitate reducing the length and width of the camera module. At the same time, the first frame 1231 of the package body, the second frame 1232 of the package body, the third frame 1233 of the package body and the fourth frame 1234 of the package body 12 all have relatively wide dimensions. For example, the first frame 1231 of the package body can extend outward to the second frame 1233 of the fixed circuit board. Above a frame 13141, the second frame 1232 of the package body can extend outward to above the second frame 13142 of the fixed circuit board, the third frame 1233 of the package body can extend outward to above the third frame 13143 of the fixed circuit board, and the fourth frame 1234 of the package body can extend outward to above the fixed circuit board frame 13144, thereby increasing the mounting area of ​​the mounting surface 122 of the package body 12, so as to facilitate reliable and stable mounting of the movable carrier 14.

[0074] Continuing to refer to Figures 4 and 5, the chip driver assembly 10 further includes at least one electronic component 15, which can be a passive electronic component such as a resistor or capacitor, or an active electronic component such as a driver chip or a memory chip. The electronic component 15 is mounted on the front surface 111 of the circuit board 11, and the electronic component 15 is covered by the package 12 so that the electronic component 15 is protected by the package 12 to prevent the electronic component 15 from getting damp or oxidized. In some specific examples of the camera module of the present invention, at least one of the first frame 1141, the second frame 1142, the third frame 1143, and the fourth frame 1144 of the circuit board 11 is provided with the electronic component 15.

[0075] Referring to Figures 4 to 6, the active circuit board 132 has at least one column of circuit board pads 1325, and the circuit board pads 1325 are arranged on the active circuit board back side 1322 of the active circuit board 132 and adjacent to the active circuit board through-hole 1323 of the active circuit board 132. The photosensitive chip 20 has at least one column of chip pads 21, and the chip pads 21 are arranged in the non-photosensitive area of ​​the photosensitive chip 20 and adjacent to the photosensitive area, wherein the solders of these circuit board pads 1325 of the active circuit board 132 and these chip pads 21 of the photosensitive chip 20 are hot-pressed bonded to mount the photosensitive chip 20 on the active circuit board back side 1322 of the active circuit board 132 and conduct electricity between the photosensitive chip 20 and the active circuit board 132.

[0076] That is to say, the camera module of the present invention adopts a flip-chip bonding method to achieve the connection and conduction between the photosensitive chip 20 and the active circuit board 132. The flip-chip bonding method allows the camera module of the present invention to eliminate the lead space, which is conducive to reducing the length and width of the camera module. For example, in a specific example of the camera module of the present invention, the length and width of the camera module can be reduced by 0.7mm-1.075mm on one side. Moreover, compared with the lead connection method, the active circuit board pad 1325 of the active circuit board 132 of the camera module of the present invention and the chip pad 21 of the photosensitive chip 20 are directly connected by hot pressing bonding, and the interconnection line is short and the impedance is small. In addition, the camera module of the present invention uses a flip-chip bonding method to achieve connection and conduction between the photosensitive chip 20 and the active circuit board 132, so that the photosensitive chip 20 moves down to a position lower than the active circuit board 132, which is conducive to reducing the height of the camera module. Moreover, the design of the height of the package body 12 does not need to consider the photosensitive chip 20, so that the height of the package body 12 can be consistent with the height of the electronic component 15 protruding from the circuit board front surface 111 of the circuit board 11. It is understandable that in embodiments of the camera module where the package body 12 is not required to cover the electronic component 15, the height of the package body 12 can be further reduced to reduce the height of the camera module.

[0077] It is worth mentioning that the bonding material between the circuit board pads 1325 of the active circuit board 132 and the chip pads 21 of the photosensitive chip 20 can be selected as needed. For example, in some embodiments of the camera module of the present invention, the bonding material between the circuit board pads 1325 of the active circuit board 132 and the chip pads 21 of the photosensitive chip 20 can be a gold-gold material, that is, the solder of the circuit board pads 1325 of the active circuit board 132 is gold, and the solder of the chip pads 21 of the photosensitive chip 20 is gold, and the two solders are bonded by hot pressing to achieve connection and conduction between the active circuit board 132 and the photosensitive chip 20. In other embodiments of the camera module of the present invention, the bonding material between the circuit board pads 1325 of the active circuit board 132 and the chip pads 21 of the photosensitive chip 20 can be a tin-gold material, that is, the solder of the circuit board pads 1325 of the active circuit board 132 is tin, and the solder of the chip pads 21 of the photosensitive chip 20 is gold. The two solders are bonded by hot pressing to achieve connection and conduction between the active circuit board 132 and the photosensitive chip 20.

[0078] Continuing to refer to FIG5 , the bonding positions of the active circuit board pads 1325 of the active circuit board 132 and the chip pads 21 of the photosensitive chip 20 are provided with glue 16. This not only protects the solder, but also enhances the connection strength between the active circuit board 132 and the photosensitive chip 20, and reduces the force on the bonding position during the falling process.

[0079] Continuing to refer to Figures 2 to 5, the camera module further includes a filter element 40, which is mounted on the mounting surface 122 of the package body 12, and the filter element 40 is held between the optical lens 20 and the photosensitive chip 20, wherein the filter element 40 is used to filter stray light in the incident light entering the camera module through the optical lens 20, so as to improve the imaging quality of the camera module.

[0080] 4 and 5 , the filter element 40 can be mounted on the inner side of the mounting surface 122 of the package body 12 by glue, and the movable carrier 14 can be mounted on the outer side of the mounting surface 122 of the package body 12 by glue, and the filter element 40 is located in the carrier through-hole 14 of the movable carrier 14 so that the movable carrier 14 surrounds the filter element 40. In this way, when assembling the camera module, the movable carrier 14 can protect the filter element 40, and the setting of the filter element 40 will not increase the height dimension of the camera module.

[0081] It is worth mentioning that in the camera module of the present invention, the circuit board 11 can extend outward to above the flexible connection part 133 of the anti-shake conductive part 13 so that the width dimension of at least one circuit board frame 114 of the circuit board 11 can be increased, thereby enabling the width dimension of at least one package frame 123 of the package body 12 to be increased, that is, the width dimension of the part of the mounting surface 122 of the package body 12 formed on this package frame 123 is increased, so that the filter element 40 can be mounted on the inner side of the mounting surface 122 of the package body 12 and the movable carrier 145 can be mounted on the outer side of the mounting surface 122 of the package body 12.

[0082] Continuing to refer to Figures 1 to 5, the camera module includes a base 50 and a housing 60, the optical lens 20 is arranged on the base 50, the base 50 is accommodated in the housing 60, and the housing 60 is mounted on the fixed circuit board 131 of the anti-shake conductive part 13, so that the base 50 can maintain the optical lens 20 in the photosensitive path of the photosensitive chip 20.

[0083] The anti-shake conductive portion 13 further includes a reinforcement frame 134, which is attached to the back surface 1312 of the fixed circuit board 131. For example, the reinforcement frame 134 can be attached to the back surface 1312 of the fixed circuit board 131 using glue. The reinforcement frame 134 is used to strengthen the fixed circuit board 131 and improve the flatness of the reinforcement frame 134. The provision of the reinforcement frame 134 can prevent the base 50 attached to the fixed circuit board 131 from tilting, thereby ensuring the coaxiality of the camera module.

[0084] 4 and 5 , the chip driving assembly 10 includes a driving unit 17, which is configured to drive the movable carrier 14. In this specific example of the camera module of the present invention, the driving unit 17 includes at least one driving coil 171 and at least one driving magnet 172, one of the driving coil 171 and the driving magnet 172 is provided on the movable carrier 14, and the other is provided on the base 50. When the driving coil 171 is energized, based on the electromagnetic principle, the driving coil 171 and the driving magnet 172 interact with each other to drive the movable carrier 14 to drive the package body 12, the circuit board 11, the movable circuit board 132 and the photosensitive chip 20 to translate, thereby realizing the optical image stabilization function of the camera module.

[0085] In this specific example of the camera module of the present invention, the drive unit 17 further includes a drive circuit board 173 and at least one pin 174. The drive circuit board 173 is disposed on the movable carrier 14. The pin 174 extends downward from the drive circuit board 173 to and is connected to the circuit board 11. The drive coil 171 is mounted on the drive circuit board 173 or formed on the drive circuit board 173 to dispose the drive circuit board 173 on the movable carrier 14. The drive magnet 172 is disposed on the base 50. When the circuit board 11 supplies power to the drive coil 171 via the pin 174 and the drive circuit board 173, the drive coil 171 generates a magnetic field that cooperates with the drive magnet 172 to drive the movable carrier 14 to translate the package body 12, the circuit board 11, the movable circuit board 132, and the photosensitive chip 20, thereby achieving the optical image stabilization function of the camera module.

[0086] Furthermore, referring to Figures 4 and 5 , the movable carrier 14 has a carrier recess 142. The drive circuit board 63 and the drive coil 171 are located in the carrier recess 142 of the movable carrier 14 to prevent the drive coil 171 from protruding from the top of the movable carrier 14, thereby facilitating a reduction in the height of the camera module. The base 50 has at least one mounting groove 51. The drive magnet 172 is mounted in the mounting groove 51 of the base 50 to position the drive magnet 172 on the base 50 and prevent it from protruding from the bottom of the base 50. This facilitates a reduction in the height of the camera module.

[0087] 4 and 5 , the drive unit 17 includes at least one magnetic conductive plate 175. The magnetic conductive plate 175 is located on a side of the drive magnet 172 away from the drive coil 171. The magnetic conductive plate 175 is used to focus the magnetic field of the drive magnet 172 toward the drive coil 171 to increase the driving force of the drive unit 17. In some specific examples of the camera module of the present invention, the magnetic conductive plate 175 and the drive magnet 172 are superimposedly mounted in the mounting slot 51 of the base 50.

[0088] Continuing to refer to Figures 1 to 6, the camera module further includes a base 70, and the reinforcement frame 134 of the anti-shake conductive part 13 is mounted on the base 70, so that the base 70 can seal the movable circuit board 132 and the flexible connection part 133 of the anti-shake conductive part 13 and hide the photosensitive chip 20, thereby preventing the movable circuit board 132 and the flexible connection part 133 of the anti-shake conductive part 13 and the photosensitive chip 20 from being visually visible.

[0089] In some specific examples of the camera module of the present invention, the base 70 has a base groove 71, and the photosensitive chip 20 corresponds to the base groove 71 of the base 70 to avoid the photosensitive chip 20 touching the base 70 when being driven to translate, thereby improving the reliability of the camera module.

[0090] FIG7 shows a variation of the camera module of the preferred embodiment of the present invention. Unlike the camera module shown in FIG1 to FIG6 , in this specific example of the camera module of the present invention shown in FIG7 , the photosensitive chip 20 is mounted on the back surface 112 of the circuit board 11 using a flip-chip bonding method. In other words, the photosensitive chip 20 is mounted on the inner side of the back surface 112 of the circuit board 11, and the active circuit board 132 of the anti-shake conductive portion 13 is mounted on the outer side of the back surface 112 of the circuit board 11, and the active circuit board 132 surrounds the photosensitive chip 20.

[0091] In some specific examples of the camera module of the present invention, glue 16 is provided at the bonding positions of the chip pads 21 of the photosensitive chip 20 and the circuit board pads of the circuit board 11. This not only protects the solder, but also enhances the connection strength between the circuit board 11 and the photosensitive chip 20, and reduces the force on the bonding position during the falling process.

[0092] In some specific examples of the camera module of the present invention, the manufacturing process of the chip driver assembly 10 includes the following steps: first, the electronic component 15 is arranged on the front surface 111 of the circuit board 11; second, the package body 12 is integrally combined with the front surface 111 of the circuit board 11, and the package body 12 covers the electronic component 15; third, the portion of the circuit board 11 exposed to the light window 121 of the package body 12 is cut, To form the circuit board through-hole 113 of the circuit board 11, the size and shape of the circuit board through-hole 113 of the circuit board 11 match the size and shape of the photosensitive area of ​​the photosensitive chip 20; fourth, solder is respectively set at the circuit board pad of the circuit board 11 and the chip pad 21 of the photosensitive chip 20, and hot pressing bonding is performed to mount the photosensitive chip 20 on the circuit board 11 and make the photosensitive chip 20 and the circuit board 11 conductive; fifth, the movable carrier 14 is mounted on the mounting surface 122 of the package body 12, and the movable circuit board 132 of the anti-shake conductive part 13 is mounted on the circuit board 11.

[0093] Figure 8 shows a modified example of the camera module of the above-mentioned preferred embodiment of the present invention. Different from the camera module shown in Figures 1 to 6, in this specific example of the camera module of the present invention shown in Figure 8, the filter element 40 is mounted on the front side 111 of the circuit board 11, so that the filter element 40 is maintained between the optical lens 30 and the photosensitive chip 20 by the circuit board 11.

[0094] That is to say, in this specific example of the camera module of the present invention shown in Figure 8, the packaging body 12 is integrally combined with the outer side of the circuit board front side 111 of the circuit board 11, the filter element 40 is mounted on the inner side of the circuit board front side 111 of the circuit board 11, and the filter element 40 is located in the light window 121 of the packaging body 12, so that the packaging body 12 surrounds the filter element 40. In this way, when assembling the camera module, the packaging body 12 can protect the filter element 40, and the setting of the filter element 40 will not increase the height dimension of the camera module.

[0095] It is worth mentioning that in the camera module of the present invention, the circuit board 11 can extend outward to above the flexible connection part 133 of the anti-shake conductive part 13 so that the width dimension of at least one circuit board frame 114 of the circuit board 11 can be increased. In this way, when the package body 12 is integrally combined with the outer side of the circuit board front face 111 of the circuit board 11 and the filter element 40 is mounted on the inner side of the circuit board front face 111 of the circuit board 11, the mounting surface 122 of the package body 12 can have a larger mounting area to reliably and stably mount the movable carrier 14.

[0096] Those skilled in the art will appreciate that the embodiments of the present invention described above and shown in the accompanying drawings are intended to be illustrative only and are not intended to limit the present invention. The objectives of the present invention have been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and illustrated in the embodiments. Any variations or modifications may be made to the embodiments of the present invention without departing from the principles described.

Claims

1. A chip driving component, characterized in that: include: a circuit board having a circuit board through hole; a movable carrier having carrier perforations; a driving unit configured to drive the movable carrier to move; a package having a light window and a mounting surface surrounding a top opening of the light window, wherein the package is integrally combined with a front surface of the circuit board, the movable carrier is mounted on the mounting surface of the package, and the circuit board through-hole of the circuit board, the light window of the package, and the carrier through-hole of the movable carrier correspond to each other; and The anti-shake conductive part includes a fixed circuit board, a movable circuit board and at least one flexible connection part, wherein the fixed circuit board surrounds the movable circuit board, the outer end of the flexible connection part is connected to the fixed circuit board, the inner end of the flexible connection part is connected to the movable circuit board, the front side of the movable circuit board is mounted on the back side of the circuit board, wherein the package body and the flexible connection part have an overlapping portion when viewed from a top view. 2 . The chip driving assembly according to claim 1 , wherein the package body and the fixed circuit board have an overlapping portion when viewed from a top view.

3. The chip driving component according to claim 1, wherein on at least one side of the chip driving component, the distance between the outer edge of the package body and the central axis of the chip driving component is greater than the distance between the outer edge of the active circuit board and the central axis of the chip driving component.

4. The chip driving component according to claim 3, wherein on at least one side of the chip driving component, the distance between the outer edge of the circuit board and the central axis of the chip driving component is greater than the distance between the outer edge of the active circuit board and the central axis of the chip driving component.

5. The chip driving component according to claim 4, wherein on at least one side of the chip driving component, the distance between the outer edge of the circuit board and the central axis of the chip driving component is greater than the distance between the inner edge of the fixed circuit board and the central axis of the chip driving component.

6. A chip driving component according to claim 5, wherein on each side of the chip driving component, the distance between the outer edge of the circuit board and the central axis of the chip driving component is greater than the distance between the inner edge of the fixed circuit board and the central axis of the chip driving component. 7 . The chip driving assembly according to claim 1 , wherein an outer end and an inner end of the flexible connection portion are connected to non-corresponding sides of the fixed circuit board and the movable circuit board, respectively.

8. A camera module, characterized in that: include: Photosensitive chip; An optical lens, wherein the optical lens is held in the light-sensing path of the light-sensing chip; as well as According to any one of claims 1 to 7, the photosensitive chip is located on the back side of the circuit board, and the photosensitive chip is constructed to translate along with the translation of the circuit board.

9. The camera module according to claim 8, wherein the active circuit board has an active circuit board through-hole, the active circuit board through-hole of the active circuit board corresponds to the circuit board through-hole of the circuit board, wherein the photosensitive chip is mounted on the back side of the active circuit board, and the photosensitive area of ​​the photosensitive chip corresponds to the active circuit board through-hole of the active circuit board.

10. The camera module according to claim 8, wherein the photosensitive chip is mounted on the back side of the circuit board, and the photosensitive area of ​​the photosensitive chip corresponds to the circuit board through-hole of the circuit board.

11. The camera module according to claim 9, wherein the pads of the active circuit board and the pads of the photosensitive chip are connected by solder through a thermal compression bonding process.

12. The camera module according to claim 10, wherein the solder pads of the circuit board and the solder pads of the photosensitive chip are connected by solder through a thermal compression bonding process.

13. The camera module according to claim 11, wherein glue is provided at the bonding positions of the pads of the active circuit board and the pads of the photosensitive chip.

14. The camera module according to claim 12, wherein glue is provided at the bonding positions of the solder pads of the circuit board and the solder pads of the photosensitive chip.

Images