Deposition equipment and deposition system

Abstract

This deposition equipment for manufacturing a plurality of sub-pixels having a side-by-side structure on a substrate may comprise an evaporation source device that is positioned beneath a substrate and emits a deposition material toward the substrate. The evaporation source device may include a point source or a linear source. The point source may be located at least four times further from the substrate than the linear source.

Description

Deposition equipment and deposition systems

[0001] The embodiments relate to deposition equipment and deposition systems.

[0002] Organic light-emitting diode (OLED) displays are increasingly being applied to a variety of lightweight and thin information electronic devices, driven by the growing demand for portable information media. Recently, OLED displays are increasingly being applied to product groups such as mobile PCs and automobiles, rather than TVs or mobile phones. Because OLED displays used in mobile PCs and automobiles operate with still images for extended periods of time, long lifespan is essential. To achieve long lifespan, light extraction from the OLED must be maximized. To produce long-lasting OLEDs, each subpixel must be implemented with a top-emitting, side-by-side structure, with two or more stacks of OLEDs. Furthermore, to reduce costs, it is crucial to expand the technology to a production capacity of 8.5 generations (2200 x 2500 mm) or higher.

[0003] The main technologies emerging to implement the aforementioned structures are as follows:

[0004] First, there is a method of applying a fine metal mask (hereinafter referred to as FMM) on a large screen. Second, there is a method of patterning organic light-emitting elements at subpixel levels using photolithography. This method can be called PhSbS (Side-by-side structure by photolithography). Third, there is a method of depositing different deposition angles for each subpixel or material in a three-dimensional subpixel structure.

[0005] In addition to these three solutions, technologies that freely control and manage the deposition angle, along with the deposition equipment and systems that implement them, could form the basis for producing innovative organic light-emitting diode displays in the future. The key to this technology lies in precisely depositing the deposition material at the design-specific location in the deposition equipment.

[0006] First, when manufacturing an organic light-emitting display device using an FMM, there is a problem that the alignment position accuracy (PPA) of the subpixel unit between the FMM and the substrate is low. In addition, when manufacturing an organic light-emitting display device using an FMM, even if the alignment of the subpixel unit is well performed, there is a problem that a difference in position accuracy occurs due to the shadowing effect caused by the FMM. In addition, for the PhSbS structure, a precise deposition position for each deposition material is essential. Furthermore, in order to implement a new structure that configures an organic light-emitting element on a three-dimensional structure, a technology for accurately implementing the deposition angle of the deposition material is required.

[0007] The invention of this novel deposition technology can ultimately improve the product's light-emitting area ratio (EAR), thereby extending its lifespan. Furthermore, it enables the production of large-area substrates, thereby enhancing productivity and increasing the material utilization efficiency of organic light-emitting devices. Here, the light-emitting area ratio is the value obtained by dividing the light-emitting area of ​​a subpixel by the area of ​​the subpixel.

[0008] The present invention aims to solve the above-mentioned and other problems.

[0009] Another object of the present invention is to provide a deposition equipment and a deposition system capable of patterning an organic light-emitting layer in a side-by-side structure with or without using an FMM in a deposition process and depositing it at different deposition angles to fit a three-dimensional structure, thereby improving productivity.

[0010] Another object of the present invention is to provide a deposition equipment and a deposition system capable of freely changing the deposition angle.

[0011] The technical problems of the embodiment are not limited to those described in this article, but include those that can be understood through the description of the invention.

[0012] According to one aspect of the embodiment to achieve the above or other purposes, a deposition apparatus for manufacturing each of a plurality of subpixels having a side-by-side structure on a substrate includes an evaporation source device positioned below the substrate and discharging a deposition material toward the substrate; wherein the evaporation source device includes a point source or a linear source, and the point source is positioned at least four times further from the substrate than the linear source.

[0013] The range of the deposition angle of the point source in the scan direction and the range of the deposition angle of the point source in the direction orthogonal to the scan direction may be the same.

[0014] The plurality of subpixels may include a blue subpixel, a green subpixel, and a red subpixel, and the blue subpixel, the green subpixel, and the red subpixel may each include a plurality of organic light-emitting layers.

[0015] When at least one organic light-emitting layer among the plurality of organic light-emitting layers is formed on the substrate using a mask positioned between the substrate and the point source, the range of the deposition angle of the point source is 60º to 120º, and the at least one organic light-emitting layer can be individually formed on the blue subpixel, the green subpixel, and the red subpixel by the mask.

[0016] The plurality of subpixels include a blue subpixel, a green subpixel, and a red subpixel, and the blue subpixel, the green subpixel, and the red subpixel each include a hole injection layer on an anode electrode and at least one stack structure on the hole injection layer, and when the hole injection layer is formed on the substrate using a protrusion between the plurality of subpixels as a mask, the range of the deposition angle of the point source may be 60º to 120º.

[0017] The at least one stack structure includes a first stack structure and a second stack structure, and the blue subpixel, the green subpixel, and the red subpixel each further include a charge generation layer between the first stack structure and the second stack structure, and when the charge generation layer is formed on the substrate using the protrusion as a mask, the range of the deposition angle of the point source may be 60º to 120º.

[0018] The plurality of subpixels include a blue subpixel, a green subpixel, and a red subpixel, and the blue subpixel, the green subpixel, and the red subpixel commonly include a blue organic light-emitting layer. When the blue organic light-emitting layer is formed on the substrate using the plurality of three-dimensional structures on the substrate as a mask, the range of the deposition angle of the point source may be 70º to 110º.

[0019] The above evaporation source device may include a first evaporation source device including a first evaporation source device, a first evaporation source device, and a first evaporation source device arranged in a row along a scan direction; and a second evaporation source device spaced apart from the first evaporation source device along a direction orthogonal to the scan direction and including a second evaporation source device, a second evaporation source device, and a second evaporation source device arranged in a row along the scan direction.

[0020] The above 1-2 evaporation source device and the above 2-2 evaporation source device may each include a dopant material as the deposition material, and the above 1-1 evaporation source device, the above 1-3 evaporation source device, the above 2-1 evaporation source device and the above 2-3 evaporation source device may each include a host material as the deposition material.

[0021] The first evaporation source device includes a plurality of first-first point sources arranged in a circle along the upper circumference thereof, the first-second evaporation source device includes a plurality of first-second point sources arranged in a circle along the upper circumference thereof, and the first-third evaporation source device includes a plurality of first-third point sources arranged in a circle along the upper circumference thereof, and one of the plurality of first-first point sources, one of the plurality of first-second point sources, and one of the plurality of first-third point sources can be positioned on a straight line.

[0022] The 2-1 evaporation source device includes a plurality of 2-1 point sources arranged in a circle along the upper circumference thereof, the 2-2 evaporation source device includes a plurality of 2-2 point sources arranged in a circle along the upper circumference thereof, and the 2-3 evaporation source device includes a plurality of 2-3 point sources arranged in a circle along the upper circumference thereof, and one of the plurality of 2-1 point sources, one of the plurality of 2-2 point sources, and one of the plurality of 2-3 point sources can be positioned on a straight line.

[0023] The evaporation source device including the above point source may have a cylindrical structure, and the evaporation source device including the above linear source may have a rectangular parallelepiped structure long in a direction orthogonal to the scan direction.

[0024] According to another aspect of the embodiment to achieve the above or other purposes, the deposition system includes a plurality of deposition equipment configured in a cluster manner or an inline manner; and one of the plurality of deposition equipment may be the deposition equipment described above.

[0025] The effects of the deposition equipment and deposition system according to the embodiment are described as follows.

[0026] According to at least one of the embodiments, the organic light-emitting layer can be patterned side-by-side with or without the use of an FMM in the deposition process and deposited at different deposition angles to fit the three-dimensional structure, thereby improving productivity. Accordingly, the light-emitting area ratio is improved, thereby extending the lifespan of the product, enabling the production of large-area substrates, thereby improving productivity, and increasing the material utilization efficiency of the organic light-emitting device.

[0027] According to at least one of the embodiments, free change of the deposition angle is possible,

[0028] Depending on the structure of the product, it is possible to solve the problem of deterioration of image quality and yield due to short circuit or current leakage between subpixels or between the cathode electrode and anode electrode of the organic light-emitting element within a subpixel.

[0029] Further scope of applicability of the embodiments will become apparent from the detailed description below. However, since various changes and modifications within the spirit and scope of the embodiments will be readily apparent to those skilled in the art, it should be understood that the detailed description and specific embodiments, such as preferred embodiments, are given by way of example only.

[0030] Figure 1 illustrates a substrate according to embodiment 461.

[0031] Figure 2 illustrates a deposition material being deposited on a substrate using FMM.

[0032] Figure 3 is an enlarged view of area A shown in Figure 2.

[0033] FIG. 4 illustrates a red organic light-emitting element, a green organic light-emitting element, and a blue organic light-emitting element deposited on the substrate of FIG. 1.

[0034] Figure 5 is a plan view illustrating a deposition system according to the first embodiment.

[0035] Fig. 6a is a cross-sectional view taken along line A1-A2 in the first deposition equipment of Fig. 5.

[0036] Fig. 6b is a cross-sectional view taken along line B1-B2 in the first deposition equipment of Fig. 5.

[0037] Fig. 7a is a cross-sectional view taken along the line C1-C2 in the sixth deposition equipment of Fig. 5.

[0038] Figure 7b is a cross-sectional view taken along line D1-D2 in the sixth deposition equipment of Figure 5.

[0039] FIG. 8A is a plan view illustrating a red subpixel, a green subpixel, and a blue subpixel constituting one pixel on a substrate having a protrusion according to an embodiment.

[0040] Figure 8b is a cross-sectional view taken along line E1-E2 in the pixel of Figure 8a.

[0041] FIG. 9 illustrates a red organic light-emitting element, a green organic light-emitting element, and a blue organic light-emitting element deposited on the substrate of FIG. 8b.

[0042] Fig. 10 is a cross-sectional view illustrating a deposition system according to the second embodiment.

[0043] FIG. 11 illustrates a red organic light-emitting device, a green organic light-emitting device, and a blue organic light-emitting device each having a two-stack structure deposited on the substrate of FIG. 8b.

[0044] Fig. 12 is a cross-sectional view illustrating a deposition system according to the third embodiment.

[0045] FIG. 13 is a cross-sectional view illustrating a red organic light-emitting layer, a green organic light-emitting layer, and a blue organic light-emitting layer arranged on a substrate having a three-dimensional structure according to an embodiment.

[0046] FIG. 14 illustrates a red organic light-emitting element, a green organic light-emitting element, and a blue organic light-emitting element deposited on a substrate having a three-dimensional structure according to an embodiment.

[0047] Fig. 15 is a cross-sectional view illustrating a deposition system according to the fourth embodiment.

[0048] Figure 16 illustrates a blue organic light-emitting layer being deposited according to an embodiment.

[0049] Figure 17 illustrates a red organic light-emitting layer being deposited according to an embodiment.

[0050] Figure 18 illustrates a green organic light-emitting layer being deposited according to an embodiment.

[0051] Fig. 19 is a plan view illustrating a deposition equipment according to the first embodiment.

[0052] Figure 20a is a plan view illustrating a deposition equipment according to the first embodiment.

[0053] Figure 20b shows a view along the line C1-C2 in the deposition equipment according to the first embodiment.

[0054] FIG. 20c shows a view along line D1-D2 in the deposition equipment according to the first embodiment.

[0055] Fig. 21 is a table showing deposition characteristics in a deposition equipment according to the first embodiment.

[0056] Fig. 22a is a plan view illustrating a deposition equipment according to the second embodiment.

[0057] Figure 22b shows a view along the line C1-C2 in the deposition equipment according to the second embodiment.

[0058] Figure 22c shows a view along line D1-D2 in the deposition equipment according to the second embodiment.

[0059] Fig. 23 is a table showing deposition characteristics in a deposition equipment according to the second embodiment.

[0060] Figure 24a is a plan view illustrating a deposition equipment according to the third embodiment.

[0061] Figure 24b shows a view along the line C1-C2 in the deposition equipment according to the third embodiment.

[0062] Figure 24c shows a view along line D1-D2 in the deposition equipment according to the third embodiment.

[0063] Fig. 25 is a table showing deposition characteristics in a deposition equipment according to the third embodiment.

[0064] Fig. 26a is a plan view illustrating a deposition equipment according to the fourth embodiment.

[0065] Figure 26b shows a view along the line C1-C2 in the deposition equipment according to the fourth embodiment.

[0066] Figure 26c shows a view along line D1-D2 in the deposition equipment according to the fourth embodiment.

[0067] Fig. 27 is a table showing deposition characteristics in a deposition equipment according to the fourth embodiment.

[0068] Fig. 28a is a plan view illustrating a deposition equipment according to the fifth embodiment.

[0069] Figure 28b shows a view along the C1-C2 line in the deposition equipment according to the fifth embodiment.

[0070] Figure 28c shows a view along the line D1-D2 in the deposition equipment according to the fifth embodiment.

[0071] Fig. 29 is a table showing deposition characteristics in a deposition equipment according to the fifth embodiment.

[0072] Figures 30a, 30b and 30c illustrate nozzles provided on the upper side of a point source according to the first embodiment.

[0073] Figures 31a, 31b and 31c illustrate nozzles provided on the upper side of a point source according to the second embodiment.

[0074] Figures 32a, 32b and 32c illustrate nozzles provided on the upper side of a point source according to a third embodiment.

[0075] The sizes, shapes, and dimensions of components depicted in the drawings may differ from the actual components. Furthermore, even if the same components are depicted with different sizes, shapes, and dimensions across drawings, this is merely an example within the drawings, and the same components may have the same sizes, shapes, and dimensions across drawings.

[0076] Hereinafter, embodiments disclosed in the present specification will be described in detail with reference to the attached drawings. Regardless of the drawing numbers, identical or similar components will be given the same reference numbers and redundant descriptions thereof will be omitted. The suffixes 'module' and 'part' used for components in the following description are given or used interchangeably in consideration of the ease of writing the specification, and do not have distinct meanings or roles in themselves. In addition, the attached drawings are intended to make it easier to understand the embodiments disclosed in the present specification, and the technical ideas disclosed in the present specification are not limited by the attached drawings. In addition, when an element such as a layer, region, or substrate is referred to as existing 'on' another element, this includes that it may be directly on the other element or that other intermediate elements may exist therebetween.

[0077] Hereinafter, the range of deposition angles can be determined based on the horizontal direction from left to right or the horizontal line. The values ​​listed in each table below may vary depending on various variables such as the target-source distance of each evaporation source device, the location of each evaporation source device, and the type of deposition material discharged from each evaporation source device. Nevertheless, the target-source distance of a point source can be at least four times or more than the target-source distance of a linear source. In other words, a point source is positioned much further away from the substrate than a linear source, so that the deposition material can be deposited onto the substrate within a smaller range of deposition angles. A point source sprays the deposition material in a dot shape through a single nozzle, whereas a linear source sprays the deposition material in a line shape through multiple nozzles arranged in a row. As will be explained later, a point source is advantageous over a linear source in order to secure a high angle for spraying the deposition material in the vertical direction.

[0078] The structures of organic light-emitting display devices described below are representative examples, and various other structural modifications may be possible.

[0079] [Deposition equipment and deposition system using FMM]

[0080] Figure 1 illustrates a substrate according to an embodiment.

[0081] As illustrated in FIG. 1, a pixel (P) is defined on a substrate (10), and the pixel (P) may include a red subpixel (SPr), a green subpixel (SPg), and a blue subpixel (SPb). Although one pixel (P) is defined in the drawing, a plurality of pixels (P) may be arranged, for example, in a matrix, on the substrate (10). Although three subpixels (SPr, SPg, SPb) are illustrated in the drawing, more subpixels than this may be included in one pixel (P).

[0082] A red organic light-emitting element may be arranged in a red subpixel (SPr), a green organic light-emitting element may be arranged in a green subpixel (SPg), and a blue organic light-emitting element may be arranged in a blue subpixel (SPb). An organic light-emitting display device capable of displaying an image may be implemented through the configuration of a red organic light-emitting element, a green organic light-emitting element, and a blue organic light-emitting element.

[0083] The red organic light-emitting element, the green organic light-emitting element, and the blue organic light-emitting element can be deposited on the substrate (10) using respective deposition equipment. These deposition equipments can be included in a cluster-type deposition system as illustrated in FIG. 5, but are not limited thereto.

[0084] Figure 2 illustrates a deposition of a deposition material on a substrate using an FMM. Figure 3 is an enlarged view of area A shown in Figure 2.

[0085] As illustrated in FIG. 2, anode electrodes (11) may be disposed on the substrate (10) corresponding to each of the red subpixels (SPr), green subpixels (SPg), and blue subpixels (SPb). The anode electrodes (11) disposed on each of the red subpixels (SPr), green subpixels (SPg), and blue subpixels (SPb) may be spaced apart from each other and electrically disconnected. Banks (12-1, 12-2) may be disposed between the red subpixels (SPr), green subpixels (SPg), and blue subpixels (SPb).

[0086] A substrate (10) equipped with an anode electrode (11) and banks (12-1, 12-2) is transferred to a deposition device, and a predetermined organic light-emitting element can be deposited on the substrate (10) in the deposition device.

[0087] An evaporation source device (31) may be provided in the deposition equipment. For example, the evaporation source device (31) may be positioned at the lower side of the chamber and may spray a deposition material toward a substrate (10) positioned at the upper side of the chamber. The substrate (10) may be positioned such that the anode electrode (11) or the banks (12-1, 12-2) face the evaporation source device (31). Accordingly, a deposition material, for example, an organic light-emitting material, ejected from the evaporation source device (31) toward the substrate (10) may be deposited on the substrate (10).

[0088] Meanwhile, the FMM (20) may be positioned between the evaporation source device (31) and the substrate (10). The FMM (20) may be positioned as close to the substrate (10) as possible so that the gap between the FMM (20) and the substrate (10) does not widen, thereby preventing a reduction in the deposition area. The FMM (20) may be a mask in which an opening is formed so that the organic light-emitting material is deposited only on a specific area on the substrate (10).

[0089] As illustrated in FIG. 2, an FMM (20) may be provided with an opening formed corresponding to a red subpixel (SPr) on a substrate (10). The opening may correspond to an area between half of a first bank (12-1) positioned between a blue subpixel (SPb) and a red subpixel (SPr) and half of a second bank (12-2) positioned between a red subpixel (SPr) and a green subpixel (SPg). A red organic light-emitting material may be loaded into the evaporation source device (31).

[0090] The FMM (20) can be precisely aligned with the substrate (10). The degree of alignment can be referred to as alignment position accuracy (PPA). In a deposition process using the FMM (20), the PPA can be determined by the position tolerance of the pattern of the substrate (10), the position tolerance through the manufacturing of the FMM (20), the deposition shadow tolerance of the FMM (20), the alignment position tolerance of the deposition equipment, etc. Each tolerance may include a more detailed tolerance for each factor.

[0091] In order to ensure that the organic light-emitting material is deposited over the largest possible area on the red subpixel (SPr), the alignment margin (Mg) of the FMM (20) must be secured. The alignment margin (Mg) of the FMM (20) may be the gap between the edge (20a) of the FMM (20) and the end of the anode electrode (11) exposed by the bank (12-1, 12-2).

[0092] In order to allow the red organic light-emitting material to be deposited on the largest possible area of ​​the red subpixel (SPr), the FMM (20) may have a geometric shape. For example, the thickness of the FMM (20) may be maximum in the corresponding area between each subpixel (SPr, SPg, SPb) on the substrate (10), and the thickness of the FMM (20) may decrease as it moves toward the adjacent subpixel and as the distance from the substrate (10) decreases, but this is not limited thereto. Since various shapes of the FMM (20) are widely known, a detailed description thereof will be omitted.

[0093] Meanwhile, an edge (20a) may be provided in contact with the opening of the FMM (20). A shadow phenomenon may occur due to the edge (20a). That is, since the edge (20a) of the FMM (20) is provided at the end of the lower surface spaced apart from the upper surface of the FMM (20), a shadow phenomenon may occur in the amount of thickness between the edge (20a) and the upper surface of the FMM (20). Due to this shadow phenomenon, the area of ​​the organic light-emitting material deposited on the red subpixel (SPr) is reduced, which reduces light extraction and shortens the lifespan.

[0094] Meanwhile, depending on the position of the evaporation source device (31), the area where the organic light-emitting material is deposited on the red subpixel (SPr) via the edge (20a) may vary.

[0095] For example, the evaporation source device (31) may be positioned at a first target-source distance (TS1) or a second target-source distance (TS2). The deposition angle (θ2) of the organic light-emitting material discharged via the edge (20a) from the evaporation source device (31) positioned at the second target-source distance (TS2) may be greater than the deposition angle (θ1) of the organic light-emitting material discharged via the edge (20a) from the evaporation source device (31) positioned at the first target-source distance (TS1).

[0096] In this case, as illustrated in FIG. 3, the shadow width (W2) by the organic light-emitting material deposited on the deposition surface (15) at the deposition angle (θ2) may be smaller than the shadow width (W1) by the organic light-emitting material deposited on the deposition surface (15) at the deposition angle (θ1). Therefore, the organic light-emitting material discharged at the deposition angle (θ2) greater than the deposition angle (θ1) may be deposited over a larger area in the red subpixel (SPr). The deposition angle (θ1) and the deposition angle (θ2) may be angles with respect to a horizontal line. That is, the deposition angle (θ1) and the deposition angle (θ2) may be angles with respect to a horizontal line or a horizontal direction from left to right.

[0097] The deposition angle (θ1) and deposition angle (θ2) can also be defined as angles with respect to the normal line.

[0098] For example, by increasing the target-source distance (TS1, TS2), the shadow phenomenon of the FMM (20) can be reduced by more than 50%. Accordingly, the deposition area of ​​the red subpixel (SPr) can be expanded, thereby achieving a long lifespan.

[0099] Meanwhile, theoretically, when the deposition angle is 90 degrees, the largest area of ​​organic light-emitting material can be deposited on the red subpixel (SPr). However, since the organic light-emitting material is discharged from the evaporation source device (31) and disperses as it progresses, the evaporation source device (31) must be positioned very far away from the substrate (10). In this case, there is a problem that the size of the deposition equipment becomes very large.

[0100] In an embodiment, the organic light-emitting material having the largest area can be deposited on the red subpixel (SPr) through modifications of various structures, positions, etc., as well as the distance between the target and the source (TS1, TS2).

[0101] In the above, with reference to FIGS. 2 and 3, the description is limited to the deposition of the organic light-emitting material on the red subpixel (SPr), but the same description can also be applied to the deposition of the organic light-emitting material on each of the green subpixel (SPg) and the blue subpixel (SPb).

[0102] FIG. 4 illustrates a red organic light-emitting element, a green organic light-emitting element, and a blue organic light-emitting element deposited on the substrate (10) of FIG. 1.

[0103] As illustrated in FIG. 4, a red organic light-emitting element, a green organic light-emitting element, and a blue organic light-emitting element may be arranged on the substrate (10). That is, a red organic light-emitting element may be arranged in a red subpixel (SPr), a green organic light-emitting element may be arranged in a green subpixel (SPg), and a blue organic light-emitting element may be arranged in a blue subpixel (SPb).

[0104] Specifically, in the red subpixel (SPr), a hole injection layer (HIL), a red hole transport layer (R-HTL), a red organic light-emitting layer (R-EML), an electron transport layer (ETL), etc. may be deposited on the anode electrode (E1). In the green subpixel (SPg), a hole injection layer (HIL), a green hole transport layer (G-HTL), a green organic light-emitting layer (G-EML), an electron transport layer (ETL), etc. may be deposited on the anode electrode (E1). In the blue subpixel (SPb), a hole injection layer (HIL), a hole transport layer (HTL), a blue organic light-emitting layer (B-EML), a blue electron transport layer (ETL), etc. may be deposited on the anode electrode (E1).

[0105] A hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), a cathode electrode (E2), a capping layer (CPL), etc. may be commonly formed in a red subpixel (SPr), a green subpixel (SPg), and a blue subpixel (SPb). The arrangement order of the hole injection layer (HIL) and the hole transport layer (HTL) may be changed. Although not shown, an electron injection layer may be deposited between the electron transport layer (ETL) and the cathode electrode (E2). As described above, the hole injection layer (HIL) and / or the hole transport layer are included in the hole transport structure, the electron transport layer and the electron injection layer are included in the electron transport structure, and the hole transport structure and the electron transport structure may each include more organic light-emitting layers.

[0106] Meanwhile, a cathode electrode (E2) and a capping layer (CPL) can be deposited on the electron transport layer (ETL) in each of the red subpixel (SPr), green subpixel (SPg), and blue subpixel (SPb).

[0107] Meanwhile, as illustrated in FIG. 4, the red organic light-emitting element, the green organic light-emitting element, and the blue organic light-emitting element may have different thicknesses. The distance between the anode electrode (E1) and the cathode electrode (E2) of the red organic light-emitting element, the distance between the anode electrode (E1) and the cathode electrode (E2) of the green organic light-emitting element, and the distance between the anode electrode (E1) and the cathode electrode (E2) of the blue organic light-emitting element may be different. These thicknesses or distances may be determined in consideration of the wavelength of the corresponding color.

[0108] The distance between the anode electrode (E1) and the cathode electrode (E2) can be designed so that the wavelength of light of each of the red organic light-emitting device, the green organic light-emitting device, and the blue organic light-emitting device satisfies Equation 1 so that constructive interference occurs in each of the red organic light-emitting device, the green organic light-emitting device, and the blue organic light-emitting device. In other words, the distance between the anode electrode (E1) and the cathode electrode (E2) in each of the red organic light-emitting device, the green organic light-emitting device, and the blue organic light-emitting device can be designed to be a multiple of the wavelength (λ) of light. This can be expressed by Equation 1.

[0109] [Mathematical Formula 1]

[0110] 2nd = mλ

[0111] n may represent the effective refractive index of each of the red organic light-emitting device, the green organic light-emitting device, and the blue organic light-emitting device. d may represent the distance between the anode electrode (E1) and the cathode electrode (E2) in each of the red organic light-emitting device, the green organic light-emitting device, and the blue organic light-emitting device. m represents the order, and λ may represent the wavelength of light generated from each of the red organic light-emitting device, the green organic light-emitting device, and the blue organic light-emitting device.

[0112] As shown in Equation 1, as the wavelength (λ) increases, the distance (d) between the anode electrode (E1) and the cathode electrode (E2) in each of the red organic light-emitting device, the green organic light-emitting device, and the blue organic light-emitting device may increase.

[0113] Meanwhile, in the top emission type structure, the anode electrode (E1) of each of the red organic light emitting element, the green organic light emitting element, and the blue organic light emitting element may be a reflective electrode and the cathode electrode (E2) may be a semi-transmissive electrode so that constructive interference occurs in each of the red organic light emitting element, the green organic light emitting element, and the blue organic light emitting element. The semi-transmissive electrode may be, for example, a single layer of a Mg:Ag alloy, or may include a double layer including a first layer made of a Mg:Ag alloy and a second layer made of a transparent conductive material such as ITO, but is not limited thereto.

[0114] Meanwhile, in order to satisfy Equation 1, different distances between the anode electrode (E1) and the cathode electrode (E2) must be achieved in each of the red organic light-emitting device, the green organic light-emitting device, and the blue organic light-emitting device. To this end, in the embodiment, the thicknesses of the red organic light-emitting layer (R-EML), the green organic light-emitting layer (G-EML), and the blue organic light-emitting layer (B-EML) may be designed differently. In addition to the hole transport layer (HTL) commonly included in the red organic light-emitting device, the green organic light-emitting device, and the blue organic light-emitting device, the thicknesses of the red hole transport layer (R-HTL) included in the red organic light-emitting device and the green hole transport layer (G-HTL) included in the green organic light-emitting device may be designed differently. In this way, by designing the thicknesses of the red hole transport layer (R-HTL) included in the red organic light-emitting device and the green hole transport layer (G-HTL) included in the green organic light-emitting device differently, the distances between the anode electrode (E1) and the cathode electrode (E2) of the red organic light-emitting device, the green organic light-emitting device, and the blue organic light-emitting device, respectively, can be different from each other so as to satisfy Equation 1.

[0115] Therefore, by designing the distances between the anode electrode (E1) and the cathode electrode (E2) of each of the red organic light-emitting device, the green organic light-emitting device, and the blue organic light-emitting device to be different so as to satisfy Equation 1, constructive interference occurs in each of the red organic light-emitting device, the green organic light-emitting device, and the blue organic light-emitting device, so that the light-emitting efficiency can be maximized.

[0116] Figure 5 is a plan view illustrating a deposition system according to the first embodiment.

[0117] As illustrated in FIG. 5, the deposition system (100) according to the first embodiment may be a cluster type deposition system, but is not limited thereto.

[0118] A plurality of transfer modules (TM1 to TM4) may be arranged between the loading equipment (LL) and the unloading equipment (ULL). A plurality of deposition equipments (CH1 to CH8) may be connected to each of the plurality of transfer modules (TM1 to TM4). A plurality of buffer equipments (BUF1 to BUF3) may be arranged between the plurality of transfer modules (TM1 to TM4).

[0119] Referring to FIGS. 2 and 5, a substrate (10) can be loaded into a deposition system (100) according to the first embodiment through a loading device (LL) and can be removed to the outside through an unloading device (ULL). Each of the plurality of transport modules (TM1 to TM4) can transport the substrate (10) to each of the plurality of deposition devices (CH1 to CH8) or return the substrate (10) from each of the deposition devices (CH1 to CH8). To this end, each of the plurality of transport modules (TM1 to TM4) can be equipped with an arm (110).

[0120] For example, the substrate (10) is loaded into the first transfer module (TM1) via the loading device (LL), and the first transfer module (TM1) can transfer and return the substrate (10) in the order of the first deposition device (CH1) and the second deposition device (CH2) via the arm (110). The substrate (10) can be transferred from the first transfer module (TM1) to the second transfer module (TM2) via the first buffer device (BUF1). The substrate (10) can be transferred and returned in the order of the third deposition device (CH3) and the fourth deposition device (CH4) from the second transfer module (TM2).

[0121] The substrate (10) can be transferred from the second transfer module (TM2) to the third transfer module (TM3) via the second buffer equipment (BUF2). The substrate (10) can be transferred and returned in the order of the fifth deposition equipment (CH5) and the sixth deposition equipment (CH6) from the third transfer module (TM3). The substrate (10) can be transferred from the third transfer module (TM3) to the fourth transfer module (TM4) via the third buffer equipment (BUF3). The substrate (10) can be transferred and returned in the order of the seventh deposition equipment (CH7) and the eighth deposition equipment (CH8) from the fourth transfer module (TM4). The substrate (10) can be taken out from the fourth transfer module (TM4) via the unloading equipment (ULL).

[0122] Although not shown, the ninth deposition equipment (CH9) is connected to the fourth transport module (TM4), so that the substrate (10) returned from the eighth deposition equipment (CH8) can be transported and returned to the ninth deposition device (CH9), and then taken out through the unloading equipment (ULL).

[0123] The first deposition equipment (CH1) to the ninth deposition equipment (CH9) are as shown in Table 1.

[0124] Deposition equipmentDeposition materialDeposition angle rangeScan directionOrthogonal directionCH1HIL, HTL60º ~ 120º22º ~ 158ºCH2G-HTL60º ~ 120º60º ~ 120ºCH3R-HTL60º ~ 120º60º ~ 120ºCH4B-EML60º ~ 120º60º ~ 120ºCH5G-EML60º ~ 120º60º ~ 120ºCH6R-EML60º ~ 120º60º ~ 120ºCH7ETL60º ~ 120º22º ~ 158ºCH8EIL, E260º ~ 120º22º ~ 158ºCH9CPL60º ~ 120º22º ~ 158º

[0125] In Table 1, the deposition angle can be an angle with respect to a horizontal line. That is, the deposition angle can be a horizontal direction from left to right or an angle with respect to a horizontal line. The deposition angle can also be defined as an angle with respect to a normal line. The scan direction can be a direction in which the body moves. In a cluster-type deposition system, the deposition material can be deposited on the substrate (10) while the body moves and the linear source or the point source moves with respect to the substrate (10), but this is not limited thereto. The orthogonal direction can be a direction orthogonal to the scan direction. Referring to Table 1 and FIG. 4, the first deposition equipment (CH1) can deposit a hole injection layer (HIL) or a hole transport layer (HTL), and the second deposition equipment (CH2) can deposit a green hole transport layer (G-HTL) on the hole transport layer (HTL). The third deposition equipment (CH3) can deposit a red hole transport layer (R-HTL) on the hole transport layer (HTL), and the fourth deposition equipment (CH4) can deposit a blue organic light-emitting layer (B-EML) on the hole transport layer (HTL).

[0126] The fifth deposition equipment (CH5) can deposit a green organic light-emitting layer (G-EML) on the green hole transport layer (G-HTL), and the sixth deposition equipment (CH6) can deposit a red organic light-emitting layer (R-EML) on the red hole transport layer (R-HTL). The seventh deposition equipment (CH7) can deposit an electron transport layer (ETL) on the blue organic light-emitting layer (B-EML), the green organic light-emitting layer (G-EML), and the red organic light-emitting layer (R-EML). The eighth deposition equipment (CH8) can deposit an electron injection layer or a cathode electrode (E2) on the electron transport layer (ETL), and the ninth deposition equipment (CH9) can deposit a capping layer (CPL) on the cathode electrode (E2).

[0127] Meanwhile, the first deposition equipment (CH1), the seventh deposition equipment (CH7), and the eighth deposition equipment (CH8) can each deposit a deposition material on the substrate (10) using a common metal mask (hereinafter referred to as CMM). The first deposition equipment (CH1), the seventh deposition equipment (CH7), and the eighth deposition equipment (CH8) can each include at least one linear source as an evaporation source device. As shown in Table 1, a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), an electron injection layer, and a cathode electrode (E2) can be deposited on the substrate (10) using the CMM.

[0128] The second deposition equipment (CH2) to the sixth deposition equipment (CH6) can each deposit a deposition material on the substrate (10) using an FMM. The second deposition equipment (CH2) to the sixth deposition equipment (CH6) can each include at least one point source as an evaporation source device. As shown in Table 1, the green hole transport layer (G-HTL), the red hole transport layer (R-HTL), the blue organic light-emitting layer (B-EML), the green organic light-emitting layer (G-EML), and the red organic light-emitting layer (R-EML) can be deposited on the substrate (10) using an FMM.

[0129] For example, an evaporation source device including a point source may have a cylindrical structure, and an evaporation source device including a linear source may have a rectangular parallelepiped structure that is elongated in one direction. An evaporation source device including a point source may include a plurality of point sources arranged in a circular shape along a perimeter of an upper side thereof. An evaporation source device including a linear source may include a plurality of nozzles arranged along one direction on an upper side thereof. For example, an evaporation source device including a linear source may have a rectangular parallelepiped structure that is elongated in an orthogonal direction.

[0130] Fig. 6a is a cross-sectional view taken along line A1-A2 in the first deposition equipment of Fig. 5. Fig. 6b is a cross-sectional view taken along line B1-B2 in the first deposition equipment of Fig. 5.

[0131] As illustrated in FIGS. 6A and 6B, the first deposition equipment (CH1) may include an evaporation source device (30A). The evaporation source device (30A) may be located at the lower side of the chamber. The evaporation source device (30A) may include a body (33), a plurality of linear sources (34) on the body (33), etc. The body (33) may be movable in the X-axis, the Y-axis, and / or the Z-axis. Each of the plurality of linear sources (34) may have a rectangular parallelepiped shape that is elongated in a direction orthogonal to the scan direction. The scan direction may be a transport direction of the body (33), for example, a direction away from the first transport module (TM1). Although the drawing illustrates three linear sources (34) arranged along the scan direction, more linear sources may be provided.

[0132] A plurality of nozzles (35) may be installed in an orthogonal direction on the upper side of each of the plurality of linear sources (34). A deposition material may be sprayed through the plurality of nozzles (35).

[0133] The first deposition equipment (CH1) uses two CMMs (CMM-A, CMM-B) so that different substrates (10) can be sequentially or simultaneously deposited.

[0134] Meanwhile, for excellent film quality of the deposition material deposited on the substrate (10), excellent homogeneity and uniformity are required. Homogeneity refers to the film quality performance of the deposition material deposited along the scan direction with respect to the substrate (10), and uniformity refers to the film quality performance of the deposition material deposited along the direction orthogonal to the substrate (10).

[0135] The target-source distance (TS1) in the linear source (34) may be small. For example, the target-source distance (TS1) in the linear source (34) may be 500 mm. Under these conditions, as shown in Table 1, the range of the deposition angle of the linear source (34) in the scan direction may be 60º to 120º to improve homogeneity (Fig. 6a), and the range of the deposition angle of the linear source (34) in the orthogonal direction may be 22º to 158º to improve uniformity (Fig. 6b). That is, even if the range of the deposition angle of the linear source (34) in the scan direction is 60º to 120º under the condition that the target-source distance (TS1) in the linear source (34) is small, the homogeneity of the deposition material deposited on the substrate (10) is very excellent.

[0136] In contrast, under the condition that the target-source distance (TS1) of the linear source (34) is small, the range of the deposition angle of the linear source (34) in the orthogonal direction is such that when the deposition angle of the deposition material discharged from the nozzle (35) located at the far left is 22º, the deposition material can be deposited even on the far right end region of the substrate (10), as shown in FIG. 6b. When the deposition angle of the deposition material discharged from the nozzle (35) located at the far right is 158º, the deposition material can be deposited even on the far left end region of the substrate (10). Therefore, when the range of the deposition angle of the linear source (34) in the orthogonal direction is 22º to 158º, the uniformity of the deposition material deposited on the substrate (10) in the orthogonal direction can be improved.

[0137] As described above, an evaporation source device having the same structure as the evaporation source device (30A) equipped in the first deposition equipment (CH1) may be equipped in the seventh deposition equipment (CH7) and the eighth deposition equipment (CH8). That is, the first deposition equipment (CH1), the seventh deposition equipment (CH7), and the eighth deposition equipment (CH8) may include a body (33), a plurality of linear sources (34), etc. on the body (33). At this time, the target-source distances (TS1) of the evaporation source devices equipped in the first deposition equipment (CH1), the seventh deposition equipment (CH7), and the eighth deposition equipment (CH8) may be the same, but are not limited thereto.

[0138] Fig. 7a is a cross-sectional view taken along line C1-C2 in the sixth deposition equipment of Fig. 5. Fig. 7b is a cross-sectional view taken along line D1-D2 in the sixth deposition equipment of Fig. 5.

[0139] As illustrated in FIGS. 7A and 7B, the sixth deposition equipment (CH6) may include an evaporation source device (30B). The evaporation source device (30B) may be located at the lower side of the chamber. The evaporation source device (30B) may include a body (36), a plurality of point sources (37) on the body (36), etc. The body (36) may be movable in the X-axis, the Y-axis, and / or the Z-axis. A nozzle may be installed on the upper side of each of the plurality of point sources (37). One nozzle is installed per point source (37), but more nozzles may be installed. The deposition material may be sprayed through the nozzle. Although the drawing illustrates two point sources (37) arranged along the scan direction and five point sources (37) arranged along the orthogonal direction, more point sources may be provided.

[0140] The sixth deposition equipment (CH6) uses two FMMs (FMM-A, FMM-B) so that different substrates (10) can be sequentially or simultaneously deposited.

[0141] In an embodiment, the target-source distance (TS2) at the point source (37) may be large. For example, the target-source distance (TS2) at the point source (37) may be at least four times the target-source distance (TS1) at the linear source (34 of FIG. 6A). That is, the point source (37) may be located at least four times further from the substrate (10) than the linear source (34). For example, the target-source distance (TS2) at the point source (37) may be 2,500 mm.

[0142] Under these conditions, as shown in Table 1, the range of the deposition angle of the point source (37) in the scan direction to improve homogeneity may be 60º to 120º (Fig. 7a), and the range of the deposition angle of the point source (37) in the orthogonal direction to improve uniformity may be 60º to 120º (Fig. 7b). That is, the range of the deposition angle of the point source (37) in the scan direction and the range of the deposition angle of the point source (37) in the orthogonal direction to the scan direction may be the same.

[0143] As shown in FIGS. 7a and 7b, even if the range of the deposition angle of the point source (37) in the scan direction and the range of the deposition angle of the point source (37) in the direction orthogonal to the scan direction are the same, the homogeneity of the deposition material deposited on the substrate (10) along the scan direction can be very excellent, and the uniformity of the deposition material on the substrate (10) deposited along the orthogonal direction can be excellent. Since the target-source distance (TS2) in the point source (37) is large, even if the range of the deposition angle of the point source (37) in the orthogonal direction is 60º to 120º, which is larger than the range of the deposition angle of the linear source (34), the uniformity of the deposition material on the substrate (10) deposited along the orthogonal direction can be further improved.

[0144] First deposition equipment (CH1) (Figs. 6a and 6b) Sixth deposition equipment (CH6) (Figs. 7a and 7b) Type of source Linear source (34) Point source (37) Target-source distance 500 mm 2,500 m Range of deposition angle Scan direction 60º to 120º 60º to 120º Orthogonal direction 22º to 158º 60º to 120º Stroke of evaporator device ~3,400 mm to 5,900 mm

[0145] In Table 2, the range of the deposition angle in the scan direction and / or the range of the deposition angle in the orthogonal direction may vary as the target-source distance (TS1, TS2) changes, but this is not limited thereto. In the sixth deposition equipment (CH6) using the FMM (FMM-A, FMM-B), the heat influence by the point source (37) is reduced, two types of deposition materials, such as host and dopant, are deposited with excellent homogeneity, and the shadow influence can be optimized compared to the first deposition equipment (CH1) using the CMM (CMM-A, CMM-B). To this end, as shown in Table 2, the target-source distance (TS2) in the point source (37) in the sixth deposition equipment (CH6) is at least four times greater than the target-source distance (TS1) in the linear source (34) in the first deposition equipment (CH1), and the range of the deposition angle in the scan direction and the range of the deposition angle in the orthogonal direction may each be 60˚ to 120˚. Meanwhile, if the target-source distance (TS2) increases, the problem occurs that the utilization efficiency of the organic material decreases and the limitation of the deposition angle adjustment occurs. In order to solve this problem, the point source (37) may be included in the evaporation source device (30B) that discharges the organic deposition material. For example, the nozzle of the point source (37) may be designed to satisfy the deposition angle range of 60˚ to 120˚ at all angles including the scan direction and the orthogonal direction in the sixth deposition equipment (CH6). In addition, the target-source distance (TS2) of the point source (37) can be designed to be at least 2,500 mm or more to satisfy the range of deposition angles of 60˚ to 120˚ at all angles. Through deposition using the point source (37) designed in this way, the utilization efficiency of organic materials can be improved and limitations in adjusting the deposition angle can be eliminated.

[0146] In Table 2, the stroke of the evaporation source device is the reciprocal movement distance of the evaporation source device (30A, 30B). As illustrated in FIG. 5, in the deposition system (100) according to the first embodiment, i.e., the cluster-type deposition system, the evaporation source devices (30A, 30B) of each deposition equipment (CH1 to CH8) can perform a reciprocal scan on the substrate (10) for deposition onto a large-area substrate (10). The stroke may refer to the movement distance that the evaporation source devices (30A, 30B) perform a reciprocal scan on the substrate (10). As shown in Table 2, the evaporation source device (30A) of the first deposition equipment (CH1) may have a stroke of up to 3,400 mm, and the evaporation source device (30B) of the sixth deposition equipment (CH6) may have a stroke of up to 5,900 mm. Although not shown, in an inline type deposition system, the substrate (10) can perform a reciprocating scan with respect to the evaporation source devices (30A, 30B) of each deposition equipment (CH1 to CH8) for deposition onto a large area substrate (10).

[0147] As described above, an evaporation source device having the same structure as the evaporation source device (30B) provided in the sixth deposition equipment (CH6) may be provided in the second deposition equipment (CH2) and the fifth deposition equipment (CH5). That is, the second deposition equipment (CH2) to the sixth deposition equipment (CH6) may include a body (36), a plurality of point sources (37), etc. on the body (36). At this time, the target-source distance (TS2) of the evaporation source devices (30B) provided in each of the second deposition equipment (CH2) to the sixth deposition equipment (CH6) may be the same, but is not limited thereto.

[0148] Meanwhile, the evaporation source devices (30A, 30B) of each of the first deposition equipment (CH1) to the eighth deposition equipment (CH8) can be moved in the X-axis, the Y-axis, and / or the Z-axis. Accordingly, the target-source distance (TS2) or the range of the deposition angle in each of the scan direction and the orthogonal direction can be changed at any time to secure optimal homogeneity and uniformity.

[0149] [Deposition equipment and deposition system using protrusions on a substrate]

[0150] FIG. 8A is a plan view illustrating a red subpixel, a green subpixel, and a blue subpixel constituting one pixel on a substrate having a protrusion according to an embodiment. FIG. 8B is a cross-sectional view taken along line E1-E2 in the pixel of FIG. 8A. FIG. 9 illustrates a red organic light-emitting element, a green organic light-emitting element, and a blue organic light-emitting element deposited on the substrate of FIG. 8B.

[0151] As illustrated in FIGS. 8A and 8B, a pixel (P) may include a red subpixel (SPr), a green subpixel (SPg), and a blue subpixel (SPb). Although three subpixels (SPr, SPg, SPb) are illustrated in the drawing, more subpixels may be included in a pixel (P).

[0152] A red organic light-emitting element (41) may be arranged in a red subpixel (SPr), a green organic light-emitting element may be arranged in a green subpixel (SPg), and a blue organic light-emitting element may be arranged in a blue subpixel (SPb). An organic light-emitting display device capable of displaying an image may be implemented through the configuration of the red organic light-emitting element (41), the green organic light-emitting element, and the blue organic light-emitting element.

[0153] As illustrated in Fig. 8b, the red organic light-emitting device (41) may include an anode electrode (42), a red organic light-emitting layer (43) including a hole injection layer (43a), and a cathode electrode (44). Although not illustrated, the green organic light-emitting device and the blue organic light-emitting device may each have different materials for their organic light-emitting layers, and the other layers may have the same structure as the corresponding layers of the red organic light-emitting device (41).

[0154] A protrusion (45) may be positioned between a red subpixel (SPr), a green subpixel (SPg), and a blue subpixel (SPb). The protrusion (45) may be positioned on a bank (46). The bank (46) and the protrusion (45) may be positioned in a non-emissive area (NEA).

[0155] Since the protrusion (45) serves as a mask to allow the corresponding organic light-emitting element to be deposited on each subpixel (SPr, SPg, SPb), a separate mask such as an FMM is not required, and a light-emitting area having a larger area is secured compared to deposition using an FMM, so that a long lifespan can be realized.

[0156] The protrusion (45) may include a first layer (47), a second layer (48), and a third layer (49). For example, the first layer (47) and the second layer (48) may be metal layers, and the third layer (49) may be an insulating layer, but this is not limited thereto.

[0157] The side of the first layer (47) may extend from the side of the second layer (48) in the direction of the adjacent subpixel (SPr). The first layer (47) may be omitted. The side of the third layer (49) may extend from the side of the second layer (48) in the direction of the adjacent subpixel (SPr). Therefore, an undercut structure may be formed by the extended side of the third layer (49) and the side of each of the first layer (47) and the second layer (48). An edge (49a) may be provided at the lower end of the extended side of the third layer (49). The deposition angle (or range of the deposition angle) of the deposition material deposited on the bank (46) or within the undercut structure may be limited or determined by the edge (49a). In particular, the deposition angle (or range of deposition angle) of the deposition material can be changed by adjusting the distance between the target and the source of each evaporation source device (210 to 270) along with these edges (49a).

[0158] As illustrated in Fig. 8b, by adjusting the distance between the edge (49a) and the target-source of each evaporation source device (210 to 270), various deposition materials can be deposited on the bank (46) or within the undercut structure at different deposition angles.

[0159] For example, the hole injection layer (43a) can be deposited on the bank (46) at a first deposition angle (θa) through the target-source distance and edge (49a) of the first evaporation source device (210 in FIG. 10).

[0160] For example, the hole transport layer, the red organic light-emitting layer, the electron transport layer, and the electron injection layer can be deposited on the bank (46) at the same deposition angle, i.e., the second deposition angle (θb). The second deposition angle (θb) can be smaller than the first deposition angle (θa). To this end, since the edge (49a) is provided at a fixed position, the distance between the target and the source of each of the second evaporation source devices (220 of FIG. 10) to the fifth evaporation source devices (250) can be smaller than the distance between the target and the source of the first evaporation source device (210). The distance between the target and the source of each of the second evaporation source devices (220) to the fifth evaporation source devices (250) can be the same, but is not limited thereto.

[0161] For example, the cathode electrode (44) can be deposited on the first layer (47) and / or the second layer (48) of the protrusion (45) at a third deposition angle (θc) through the edge (49a) and the target-source distance of the sixth evaporation source device (260). The third deposition angle (θc) can be smaller than the second deposition angle (θb). For this purpose, since the edge (49a) is provided at a fixed position, the target-source distance of the sixth evaporation source device (260) can be smaller than the target-source distance of each of the second evaporation source devices (220) to the fifth evaporation source devices (250).

[0162] The first evaporation source device (210) to the sixth evaporation source device (260) may be included in the first deposition equipment (CH1) to the sixth deposition equipment (CH6), respectively.

[0163] In summary, the greater the target-source distance, the greater the deposition angle. As the deposition angle increases, the end of the layer formed with the deposition material can be positioned closer to the side of the bank (46).

[0164] As illustrated in FIG. 8b, the organic light-emitting material discharged at the largest first deposition angle (θa) by the first evaporation source device (210) having the largest target-to-source distance can be deposited closest to the side of the bank (46) as the hole injection layer (43a). The hole injection layer (43a) is a low-resistance organic light-emitting material and must not be electrically connected to the cathode electrode (44) or the first layer (47) and / or the second layer (48) of the protrusion (45). Therefore, the low-resistance organic light-emitting material can be deposited closest to the side of the bank (46) by being discharged at the largest first deposition angle (θa) by the first evaporation source device (210) having the largest target-to-source distance, thereby being physically spaced from and electrically disconnected from the cathode electrode (44) or the first layer (47) and / or the second layer (48) of the protrusion (45).

[0165] Then, the organic light-emitting material discharged at the next largest second deposition angle (θb) by each of the second evaporation source devices (220) to the fifth evaporation source devices (250) having the largest target-source distance can be deposited further away from the side of the bank (46) as the hole transport layer, the red organic light-emitting layer, the electron transport layer (ETL), and the electron injection layer. For example, the hole transport layer, the red organic light-emitting layer (R-EML), the electron transport layer (ETL), and the electron injection layer can be deposited not only on the upper surface of the hole injection layer (43a) but also on the upper surface of the bank (46).

[0166] The metal material discharged at the smallest third deposition angle (θc) by the sixth evaporation source device (260) having the smallest target-source distance can be deposited furthest from the side of the bank (46) as the cathode electrode (44). That is, the cathode electrode (44) can be deposited not only on the upper surface of the bank (46) but also on the first layer (47) and the second layer (48) of the protrusion (45).

[0167] As illustrated in Fig. 9, a red organic light-emitting element, a green organic light-emitting element, and a blue organic light-emitting element may be arranged on the substrate. That is, a red organic light-emitting element may be arranged in a red subpixel (SPr), a green organic light-emitting element may be arranged in a green subpixel (SPg), and a blue organic light-emitting element may be arranged in a blue subpixel (SPb).

[0168] The red organic light-emitting device, the green organic light-emitting device, and the blue organic light-emitting device may each include an anode electrode (E1), a hole injection layer (HIL), a hole transport layer (HTL), an organic light-emitting layer (R-EML, G-EML, B-EML), an electron transport layer (ETL), an electron injection layer (EIL), a cathode electrode (E2), a capping layer (CPL), etc. Since the red organic light-emitting device, the green organic light-emitting device, and the blue organic light-emitting device have been described in FIG. 4, a detailed description thereof will be omitted.

[0169] Fig. 10 is a cross-sectional view illustrating a deposition system according to the second embodiment.

[0170] Referring to FIG. 10, the deposition system (200) according to the second embodiment may be an inline type deposition system, but is not limited thereto. FIG. 10 may be an inline type deposition system for depositing a red organic light-emitting element (41 in FIGS. 8A, 8B, and 9). Although not shown, an inline type deposition system for depositing the green organic light-emitting element and the blue organic light-emitting element shown in FIG. 9 may also be provided. For example, in the inline type deposition system shown in FIG. 9, a substrate (40) on which a red organic light-emitting element (41) is deposited may be taken out from the seventh deposition equipment (CH7) and transferred to an inline type deposition system for depositing a green organic light-emitting element. Similarly, a substrate (40) on which a red organic light-emitting element (41) and a green organic light-emitting element are deposited may be taken out from the inline type deposition system and transferred to an inline type deposition system for depositing a blue organic light-emitting element.

[0171] The deposition system (200) according to the second embodiment may include, but is not limited to, first deposition equipment (CH1) to seventh deposition equipment (CH7). The first deposition equipment (CH1) to seventh deposition equipment (CH7) may be arranged along a line. A loading device (LL) may be connected to the front end of the first deposition equipment (CH1), and an unloading device may be connected to the rear end of the seventh deposition equipment (CH7).

[0172] The substrate (40) can be sequentially passed through the first deposition equipment (CH1) to the seventh deposition equipment (CH7), so that a red organic light-emitting element can be deposited on the substrate (40).

[0173] The first deposition equipment (CH1) can deposit a hole injection layer (HIL) on a substrate (40), and the second deposition equipment (CH2) can deposit a hole transport layer (HTL) on the hole injection layer (HIL).

[0174] The third deposition equipment (CH3) can deposit a red organic light-emitting layer (R-EML), a green organic light-emitting layer (G-EML), and a blue organic light-emitting layer (B-EML) on the corresponding hole transport layer (HTL).

[0175] The fourth deposition equipment (CH4) can deposit an electron transport layer (ETL) on the corresponding red organic light-emitting layer (R-EML), green organic light-emitting layer (G-EML), and blue organic light-emitting layer (B-EML).

[0176] The fifth deposition equipment (CH5) can deposit an electron injection layer (EIL) on an electron transport layer (ETL), the sixth deposition equipment (CH6) can deposit a cathode electrode (E2) on the electron injection layer (EIL), and the seventh deposition equipment (CH7) can deposit a capping layer (CPL) on the cathode electrode (E2).

[0177] The first deposition equipment (CH1) to the seventh deposition equipment (CH7) may each include a first evaporation source device (210) to a seventh evaporation source device (270). The first evaporation source device (210) to the seventh evaporation source device (270) may each be positioned at the lower side of the chamber. The substrate (40) may be positioned at the upper side of the chamber. Accordingly, the deposition material discharged from each of the first evaporation source devices (210) to the seventh evaporation source devices (270) may be sprayed upward toward the substrate (40).

[0178] As illustrated in FIG. 8b, one end of the hole injection layer (HIL), the hole transport layer (HTL), the organic light-emitting layer (R-EML, G-EML, B-EML), the electron transport layer (ETL), the electron injection layer (EIL), the cathode electrode (E2), and the capping layer (CPL) may be positioned differently from each other. One end of each of the hole transport layer (HTL), the organic light-emitting layer (R-EML, G-EML, B-EML), the electron transport layer (ETL), and the electron injection layer (EIL) may be positioned identically, but this is not limited thereto. As described above, one end of the hole injection layer (HIL) may be positioned at the furthest point from the second layer (48) of the protrusion (45), and one end of each of the hole transport layer (HTL), the organic light emitting layer (R-EML, G-EML, B-EML), the electron transport layer (ETL), and the electron injection layer (EIL) may be positioned at the next furthest point from the second layer (48) of the protrusion (45). One end of the cathode electrode (E2) may be positioned on the first layer (47) and the second layer (48) of the protrusion (45).

[0179] In this way, the distance between the target and the source of each of the first evaporation source devices (210) to the seventh evaporation source devices (270) of the first deposition equipment (CH1) to the seventh deposition equipment (CH7) may be different so that one end of the hole injection layer (HIL), the hole transport layer (HTL), the organic light-emitting layer (R-EML, G-EML, B-EML), the electron transport layer (ETL), the electron injection layer (EIL), the cathode electrode (E2), and the capping layer (CPL) are positioned differently from each other.

[0180] The first evaporation source device (210) to the seventh evaporation source device (270) may include a point source or a linear source. If the distance between the target and the source is large, the evaporation source device may include a point source, and if the distance between the target and the source is small, the evaporation source device may include a linear source.

[0181] The first evaporation source device (210), the fifth evaporation source device (250), and the sixth evaporation source device (260) of the first deposition equipment (CH1), the fifth deposition equipment (CH5), and the sixth deposition equipment (CH6) may each include a plurality of point sources. The fifth evaporation source device (250) and the sixth evaporation source device (260) may each include a plurality of linear sources. The second evaporation source devices (220) to the fourth evaporation source devices (240) of the second deposition equipment (CH2) to the fourth deposition equipment (CH4) and the seventh deposition equipment (CH7) and the seventh evaporation source device (270) may each include a plurality of linear sources.

[0182] Although not shown, a point source or linear source may be attached to a body that can move in the X-axis, Y-axis, and / or Z-axis.

[0183] The range of the deposition angles in each of the first evaporation source device (210) to the seventh evaporation source device (270) in the first deposition device (CH1) to the seventh deposition device (CH7) is as shown in Table 3.

[0184] Deposition equipment Deposition material Deposition angle range CH1HIL60º~ 120ºCH2HTL55º~ 125ºCH3B-EML55º~ 125ºG-EML55º~ 125ºR-EML55º~ 125ºCH4ETL55º~ 125ºCH5EIL55º~ 125ºCH6E220º~ 160ºCH7CPL55º~ 125º

[0185] In Table 3, the range of the deposition angle may be a range of the deposition angle in the scan direction, but is not limited thereto. As shown in Table 3, a hole injection layer (HIL) can be deposited on a substrate (40) at a deposition angle range of 60º to 120º using point sources (211 to 213) of a first evaporation source device (210) in a first deposition equipment (CH1). One end of the hole injection layer (HIL) can be positioned closest to the side of a bank (46 in FIG. 8b). Preferably, the range of the deposition angle of the point sources (211 to 213) may be 70º to 110º. In the second deposition equipment (CH2) to the fifth deposition equipment (CH5) and the seventh deposition equipment (CH7), the second evaporation source devices (220) to the fifth evaporation source devices (250) and the seventh evaporation source devices (270) may use linear sources or point sources to deposit a hole transport layer (HTL), an organic light-emitting layer (R-EML, G-EML, B-EML), an electron transport layer (ETL), an electron injection layer (EIL) and a capping layer (CPL) on the substrate (40) in a range of deposition angles of 55º to 125º. In this case, one end of each of the hole transport layer (HTL), the organic light emitting layer (R-EML, G-EML, B-EML), the electron transport layer (ETL), the electron injection layer (EIL), and the capping layer (CPL) may be positioned further from the side of the bank (46) than one end of the hole injection layer (HIL). In other words, one end of each of the hole transport layer (HTL), the organic light emitting layer (R-EML, G-EML, B-EML), the electron transport layer (ETL), the electron injection layer (EIL), and the capping layer (CPL) may be positioned closer to the second layer (48) of the protrusion (45).

[0186] In the sixth deposition equipment (CH6), the sixth evaporation source device (260) can deposit a cathode electrode (E2) on the substrate (40) at a deposition angle range of 20º to 160º using a point source or a linear source. In this case, one end of the cathode electrode (E2) can be positioned furthest from the side of the bank (46). In other words, one end of the cathode electrode (E2) can be deposited on the first layer (47) and the second layer (48) of the protrusion (45).

[0187] As illustrated in FIG. 10, the distance between the targets and sources of the point sources (211 to 213) of the first evaporation source device (210) may be at least four times greater than the distance between the targets and sources of the linear sources of each of the second evaporation source device (220) to the fourth evaporation source device (240).

[0188] As described above, by using the deposition system (200) according to the second embodiment as illustrated in FIG. 10, mass production can be secured, and price competitiveness can be secured by solving the problems of yield and image quality, material cost, and increased equipment investment cost.

[0189] FIG. 11 illustrates a red organic light-emitting device, a green organic light-emitting device, and a blue organic light-emitting device each having a two-stack structure deposited on the substrate of FIG. 8b.

[0190] As shown in Fig. 11, a red organic light-emitting element (41), a green organic light-emitting element, and a blue organic light-emitting element, each having a two-stack structure, can be arranged on a substrate (40) equipped with a protrusion (45 in Fig. 8b).

[0191] The red organic light-emitting element (41) may include an anode electrode (E1), a first organic light-emitting stack (ST11) on the anode electrode (E1), a charge generation layer (71) on the first organic light-emitting stack (ST11), a second organic light-emitting stack (ST12) on the charge generation layer (71), a cathode electrode (E2) on the second organic light-emitting stack (ST12), and a capping layer (CPL) on the cathode electrode (E2).

[0192] The green organic light-emitting device may include an anode electrode (E1), a first organic light-emitting stack (ST21) on the anode electrode (E1), a charge generation layer (72) on the first organic light-emitting stack (ST21), a second organic light-emitting stack (ST22) on the charge generation layer (72), a cathode electrode (E2) on the second organic light-emitting stack (ST22), and a capping layer (CPL) on the cathode electrode (E2).

[0193] The blue organic light-emitting device may include an anode electrode (E1), a first organic light-emitting stack (ST31) on the anode electrode (E1), a charge generation layer (73) on the first organic light-emitting stack (ST31), a second organic light-emitting stack (ST32) on the charge generation layer (73), a cathode electrode (E2) on the second organic light-emitting stack (ST32), and a capping layer (CPL) on the cathode electrode (E2).

[0194] The charge generation layer (71 to 73) may include an n-type charge generation layer (n-CGL) and a p-type charge generation layer (p-CGL) on the n-type charge generation layer (n-CGL).

[0195] Fig. 12 is a cross-sectional view illustrating a deposition system according to the third embodiment.

[0196] Referring to Fig. 12, the deposition system (200A) according to the third embodiment may be an inline type deposition system. The deposition system (200A) according to the third embodiment may deposit one of the red organic light-emitting element (41), the green organic light-emitting element, and the blue organic light-emitting element having the two-stack structure illustrated in Fig. 11.

[0197] For convenience of explanation, the deposition system (200A) according to the third embodiment may be a deposition system for depositing a red organic light-emitting element (41). In this case, a deposition system for depositing a green organic light-emitting element and a blue organic light-emitting element may be provided separately.

[0198] Compared to the deposition system (200) according to the second embodiment, the deposition system (200A) according to the third embodiment may further include the eighth deposition equipment (CH8) to the twelfth deposition equipment (CH12).

[0199] The first organic light-emitting stack (ST11) can be deposited by the second deposition equipment (CH2) to the fourth deposition equipment (CH4). The charge generation layer (71) can be deposited by the eighth deposition equipment (CH8) and the ninth deposition equipment (CH9). Specifically, the n-type charge generation layer (n-CGL) can be deposited by the eighth deposition equipment (CH8), and the p-type charge generation layer (p-CGL) can be deposited by the ninth deposition equipment (CH9). The second organic light-emitting stack (ST12) can be deposited by the tenth deposition equipment (CH10) to the twelfth deposition equipment (CH12).

[0200] The range of deposition angles in each of the first evaporation source device (210) to the 12th evaporation source device (296) in the first deposition device (CH1) to the 12th deposition device (CH12) is as shown in Table 4.

[0201] 증착 장비증착 재료증착각의 범위CH1HIL60º~ 120ºCH2HTL155º ~ 125ºCH3B-EML55º ~ 125ºG-EML55º ~ 125ºR-EML55º ~ 125ºCH4ETL155º ~ 125ºCH8n-CGL60º~ 120ºCH9p-CGL60º~ 120ºCH10HTL255º ~ 125ºCH11B-EML55º ~ 125ºG-EML55º ~ 125ºR-EML55º ~ 125ºCH12ETL255º ~ 125ºCH5EIL55º ~ 125ºCH6E220º ~ 160ºCH7CPL55º ~ 125º

[0202] In Table 4, the first evaporation source device (210), the eighth evaporation source device (280), and the ninth evaporation source device (290) in the first deposition equipment (CH1), the eighth deposition equipment (CH8), and the ninth deposition equipment (CH9) may each include a plurality of point sources (211 to 213, 281 to 283, 291 to 293). The range of the deposition angles in the point sources (211 to 213, 281 to 283, 291 to 293) may preferably be 70º to 110º. As illustrated in FIGS. 8B and 9, the charge generation layer (71) is also a low-resistance organic light-emitting material, and therefore must be electrically disconnected from the cathode electrode (E2) or the first layer (47) and the second layer (48) of the protrusion (45). To this end, the seventh evaporation source device (270) and the eighth evaporation source device (280) in the eighth deposition equipment (CH8) and the ninth deposition equipment (CH9) for depositing the charge generation layer (71) may include point sources (281 to 283, 291 to 293), respectively. In addition, the target-source distance of (281 to 283, 291 to 293) may be at least four times the target-source distance of the linear source. Here, the linear sources may be included in multiple numbers in the second evaporation source devices (220) to the fourth evaporation source devices (240) of each of the second deposition equipment (CH2) to the fourth deposition equipment (CH4), and in the tenth evaporation source devices (292) to the twelfth evaporation source devices (296) of each of the tenth deposition equipment (CH10) to the twelfth deposition equipment (CH12).

[0203] As described above, by using the deposition system (200A) according to the third embodiment as illustrated in FIG. 12, mass production can be secured, and price competitiveness can be secured by solving the problems of yield and image quality, material cost, and increased equipment investment cost.

[0204] [Deposition equipment and deposition system using three-dimensional structures on a substrate]

[0205] FIG. 13 is a cross-sectional view illustrating a red organic light-emitting layer, a green organic light-emitting layer, and a blue organic light-emitting layer arranged on a substrate having a three-dimensional structure according to an embodiment.

[0206] As illustrated in FIG. 13, a red organic light-emitting element, a green organic light-emitting element, and a blue organic light-emitting element may be arranged on a substrate (80). One pixel (P) may include a red subpixel (SPr), a green subpixel (SPg), and a blue subpixel (SPb). Although three subpixels (SPr, SPg, SPb) are illustrated in the drawing, more subpixels may be included in one pixel (P). The red organic light-emitting element, the green organic light-emitting element, and the blue organic light-emitting element may each include a red organic light-emitting layer (R-EML), a green organic light-emitting layer (G-EML), and a blue organic light-emitting layer (B-EML).

[0207] A red organic light-emitting element may be arranged in a red subpixel (SPr), a green organic light-emitting element may be arranged in a green subpixel (SPg), and a blue organic light-emitting element may be arranged in a blue subpixel (SPb). An organic light-emitting display device capable of displaying an image may be implemented through the configuration of a red organic light-emitting element, a green organic light-emitting element, and a blue organic light-emitting element.

[0208] Meanwhile, a three-dimensional structure (81-1, 81-2) may be placed on a substrate (80). The three-dimensional structure (81-1, 81-2) may have at least two side surfaces (SS1, SS2). The three-dimensional structure (81-1, 81-2) may also have a top surface (TM), but is not limited thereto.

[0209] The three-dimensional structures (81-1, 81-2) may serve to guide the deposition material so that it is deposited only in a specific region by using a self-aligned deposition (SAD) method. For example, a red organic light-emitting layer (R-EML) may be deposited on the first side (SS1) of the three-dimensional structures (81-1, 81-2) by a first organic light-emitting material sprayed in a first diagonal direction toward the substrate (80). For example, a green organic light-emitting layer (G-EML) may be deposited on the second side (SS2) of the three-dimensional structures (81-1, 81-2) by a second organic light-emitting material sprayed in a second diagonal direction toward the substrate (80). The first side (SS1) and the second side (SS2) of the three-dimensional structures (81-1, 81-2) may have the same inclination angle with respect to the normal direction. The first diagonal direction and the second diagonal direction may be orthogonal to each other.

[0210] Meanwhile, the three-dimensional structures (81-1, 81-2) can act as a mask for self-aligned deposition to ensure that the corresponding organic light-emitting material is deposited only on a specific side of the three-dimensional structures (81-1, 81-2). Accordingly, a separate mask such as an FMM is not required, and a light-emitting area having a larger area is secured compared to deposition using an FMM, thereby enabling a long lifespan to be realized.

[0211] For example, the first organic light-emitting material sprayed in the first diagonal direction may be obstructed by the second three-dimensional structure (81-2) and deposited only on the first side (SS1) of the first three-dimensional structure (81-1). However, the first organic light-emitting material may be obstructed by the second three-dimensional structure (81-2) and may not be deposited on the second side (SS2) of the first three-dimensional structure (81-1), the second side (SS2) of the second three-dimensional structure (81-2), or the gap area between the first three-dimensional structure (81-1) and the second three-dimensional structure (81-2). The gap area may be defined on the substrate (80) between the first three-dimensional structure (81-1) and the second three-dimensional structure (81-2).

[0212] Likewise, the second organic light-emitting material sprayed in the second diagonal direction may be obstructed by the first three-dimensional structure (81-1) and deposited only on the second side (SS2) of the second three-dimensional structure (81-2). However, the second organic light-emitting material may not be deposited on the first side (SS1) of the second three-dimensional structure (81-2), the first side (SS1) of the first three-dimensional structure, or the gap area between the first three-dimensional structure (81-1) and the second three-dimensional structure (81-2) because it is obstructed by the first three-dimensional structure (81-1).

[0213] Meanwhile, the third organic light-emitting material sprayed in a vertical direction with respect to the substrate (80) can be deposited on the entire area of ​​the substrate (80) without being transmitted to the first three-dimensional structure (81-1) and the second three-dimensional structure (81-2). That is, the third organic light-emitting material can be deposited not only on the separated area on the substrate (80) but also on the first side (SS1) and the second side (SS2) of each of the first three-dimensional structure (81-1) and the second three-dimensional structure (81-2). In this way, the third organic light-emitting material can be commonly deposited on each subpixel (SPr, SPg, SPb) of the substrate (80) as a blue organic light-emitting layer (B-EML). A structure in which the blue organic light-emitting layer (B-EML) is commonly deposited in this way is called a blue common structure.

[0214] For example, after a first organic light-emitting material is deposited as a blue organic light-emitting layer (B-EML) over the entire area of ​​the substrate (80), a second organic light-emitting material can be deposited as a red organic light-emitting layer (R-EML) on the first side (SS1) of the three-dimensional structure (81-1, 81-2), and a third organic light-emitting material can be deposited as a green organic light-emitting layer (G-EML) on the second side (SS2) of the three-dimensional structure (81-1, 81-2).

[0215] Accordingly, as described above, by depositing a red organic light-emitting layer (R-EML), a green organic light-emitting layer (G-EML), and a blue organic light-emitting layer (B-EML) on a substrate (80) having a three-dimensional structure (81-1, 81-2), more pixels (P) can be included in a small size, so that high ppi can be implemented and image quality can be improved.

[0216] FIG. 14 illustrates a red organic light-emitting element, a green organic light-emitting element, and a blue organic light-emitting element deposited on a substrate having a three-dimensional structure according to an embodiment.

[0217] As shown in FIGS. 13 and 14, a red organic light-emitting element, a green organic light-emitting element, and a blue organic light-emitting element can be deposited on a substrate (80).

[0218] The red organic light-emitting device, the green organic light-emitting device, and the blue organic light-emitting device may include an anode electrode (E1), a plurality of organic light-emitting layers, a cathode electrode (E2), and a capping layer (CPL). The plurality of organic light-emitting layers may include a hole injection layer (HIL), a hole transport layer (HTL), an organic light-emitting layer, an electron transport layer (ETL), an electron injection layer, and the like. The organic light-emitting layer may include a red organic light-emitting layer (R-EML), a green organic light-emitting layer (G-EML), and a blue organic light-emitting layer (B-EML).

[0219] The structure illustrated in Fig. 14 is disclosed in Korean Publication No. 10-2023-0162567 (published on November 28, 2023), so a detailed description thereof is omitted.

[0220] Fig. 15 is a cross-sectional view illustrating a deposition system according to the fourth embodiment.

[0221] Referring to FIG. 15, the deposition system (300) according to the fourth embodiment may be an inline type deposition system. The deposition system (300) according to the fourth embodiment may deposit a red organic light-emitting element, a green organic light-emitting element, and a blue organic light-emitting element on the substrate (80) and the three-dimensional structures (81-1, 81-2) illustrated in FIGS. 13 and 14.

[0222] The deposition system (300) according to the fourth embodiment may include, but is not limited to, first deposition equipment (CH1) to seventh deposition equipment (CH7). The first deposition equipment (CH1) to seventh deposition equipment (CH7) may be arranged along a line. A loading device (LL) may be connected to the front end of the first deposition equipment (CH1), and an unloading device may be connected to the rear end of the seventh deposition equipment (CH7).

[0223] The first deposition equipment (CH1) can deposit a hole injection layer (HIL) and / or a hole transport layer (HTL) on the substrate (80), and the second deposition equipment (CH2) can deposit a blue organic light-emitting layer (B-EML) on the hole transport layer (HTL).

[0224] The third deposition equipment (CH3) can deposit an electron blocking layer (R-EBL) and a red organic light-emitting layer (R-EML) on the blue organic light-emitting layer (B-EML), and the fourth deposition equipment (CH4) can deposit an electron blocking layer (G-EBL) and a green organic light-emitting layer (G-EML) on the blue organic light-emitting layer (B-EML). The electron blocking layer (R-EBL) or the electron blocking layer (G-EBL) may be omitted.

[0225] The fifth deposition device (CH5) can deposit an electron transport layer (ETL) and / or an electron injection layer on the blue organic light-emitting layer (B-EML), the red organic light-emitting layer (R-EML), and the green organic light-emitting layer (G-EML). The electron injection layer may be omitted.

[0226] The sixth deposition equipment (CH6) can deposit a cathode electrode (E2) on the electron injection layer, and the seventh deposition equipment (CH7) can deposit a capping layer (CPL) on the cathode electrode (E2).

[0227] The range of the deposition angles in each of the first evaporation source device (310) to the seventh evaporation source device (370) in the first deposition equipment (CH1) to the seventh deposition equipment (CH7) is as shown in Table 4.

[0228] Deposition equipment Deposition material Deposition angle range CH1HIL22º ~ 158ºHTLCH2B-EML70º ~ 110ºCH3R-EBL20º ~ 30ºR-EMLCH4G-EBL150º ~ 160ºG-EMLCH5ETL22º ~ 158ºEILCH6E222º ~ 158ºCH7CPL22º ~ 158º

[0229] As illustrated in FIG. 15, the first deposition equipment (CH1) to the seventh deposition equipment (CH7) may include a first evaporation source device (310) to a seventh evaporation source device (370), respectively. The first deposition equipment (CH1) to the seventh deposition equipment (CH7) may include a first evaporation source device (310) to a seventh evaporation source device (370), respectively. The first evaporation source device (310) to the seventh evaporation source device (370) may be positioned at the lower side of the chamber, respectively. The substrate (80) may be positioned at the upper side of the chamber. Therefore, the deposition material discharged from each of the first evaporation source devices (310) to the seventh evaporation source devices (370) may be sprayed upward toward the substrate (80). The second evaporation source device (320) may include a plurality of point sources (321 to 323). The third evaporation source device (341), the fourth evaporation source device (342), and the sixth evaporation source device (360) may each include a plurality of point sources. The first evaporation source device (310) and the seventh evaporation source device (370) may include a plurality of linear sources. The fifth evaporation source device of the fifth deposition equipment (CH5) may include a 5-1 evaporation source device (351) including a plurality of linear sources and a 5-2 evaporation source device (352) including a plurality of point sources. An electron transport layer (ETL) may be deposited on a substrate (80) by the 5-1 evaporation source device (351), and an electron injection layer may be deposited on the electron transport layer (ETL) by the 5-2 evaporation source device (352).

[0230] Meanwhile, as illustrated in FIG. 16, since the deposition material, i.e., the blue organic light-emitting material, discharged from the second evaporation source device (320) is sprayed in a vertical direction toward the substrate (80), the second evaporation source device (320) can be spaced far from the substrate (80). To this end, the second evaporation source device (320) can include a plurality of point sources. In addition, the target-source distance of the second evaporation source device (320) can be, for example, at least four times the target-source distance of the seventh evaporation source device (370) including a plurality of linear sources. That is, the second evaporation source device (320) can be positioned at a distance from the substrate (80) that is at least four times the target-source distance of the seventh evaporation source device (370). In this case, as shown in Table 5, the range of the deposition angle of the second evaporation source device (320) can be 70º to 110º.

[0231] As illustrated in FIGS. 17 and 18, the deposition materials, e.g., red organic light-emitting material and green organic light-emitting material, discharged from the third evaporation source devices (331, 332) of the third deposition equipment (CH3) and the fourth evaporation source devices (341, 342) of the fourth deposition equipment (CH4), are sprayed diagonally toward the substrate (80), so that the third evaporation source devices (331, 332) and the fourth evaporation source devices (341, 342) can be positioned diagonally with respect to the substrate (80). For example, the third evaporation source devices (331, 332) can be positioned on the left side from the lower side of the chamber in the first diagonal direction with respect to the substrate (80), and the fourth evaporation source devices (341, 342) can be positioned on the right side from the lower side of the chamber in the second diagonal direction with respect to the substrate (80).

[0232] Since the deposition materials discharged from the third evaporation source devices (331, 332) and the fourth evaporation source devices (341, 342) must be deposited only on the first side (SS1) and the second side (SS2) of the three-dimensional structure (81) of the substrate (80), the range of the deposition angle may be very narrow. As shown in Table 5, the range of the deposition angle of the third evaporation source devices (331, 332) may be 20º to 30º, and the range of the deposition angle of the fourth evaporation source devices (341, 342) may be 150º to 160º. If the range of the deposition angle is determined based on the horizontal direction from right to left or the horizontal line, the range of the deposition angle of the third evaporation source device (331, 332) may be 150º to 160º, and the range of the deposition angle of the fourth evaporation source device (341, 342) may be 20º to 30º.

[0233] As described above, by using the deposition system (300) according to the fourth embodiment as illustrated in FIG. 15, mass production can be secured, and problems of yield and image quality, material cost, and increased equipment investment cost can be solved, thereby securing price competitiveness.

[0234] [High-angle deposition equipment]

[0235] Fig. 19 is a plan view illustrating a deposition equipment according to the first embodiment.

[0236] Referring to FIG. 19, the deposition equipment (400) according to the first embodiment may be a high-angle deposition equipment capable of spraying the deposition material in a nearly vertical direction. Here, the high angle refers to an angle that allows the deposition material to be sprayed in a range of a deposition angle of at least 60º to 120º.

[0237] As described above, among the multiple deposition equipments of the deposition systems (100, 200, 200A, 300) according to the first to fourth embodiments, the high-angle deposition equipments are as shown in Table 6.

[0238] Deposition equipment Deposition material Deposition angle range First embodiment (Fig. 5) CH2 to CH6 R-HTL, G-HTL, B-EML, G-EML, R-EML 60º to 120º Second embodiment (Fig. 10) CH1 HIL 60º to 120º Third embodiment (Fig. 12) CH1, CH5, CH6 HIL, n-CGL, p-CGL 60º to 120º Fourth embodiment (Fig. 15) CH2 B-EML 70º to 110º

[0239] As shown in Table 6, in the deposition system according to the first embodiment (100 of FIG. 5), the second to sixth evaporation source devices of the second to sixth deposition devices (CH2) to CH6 may each include a plurality of point sources. As shown in FIGS. 2, 3, and 5, the second to sixth evaporation source devices may each deposit a deposition material on the substrate (10) at a deposition angle range of 60º to 120º, thereby forming an electron transport layer (ETL), an electron transport layer (ETL), a blue organic light-emitting layer (B-EML), a green organic light-emitting layer (G-EML), and a red organic light-emitting layer (R-EML). In the deposition system according to the second embodiment (200 of FIG. 10), the first evaporation source device (210) of the first deposition device (CH1) may include a plurality of point sources. As illustrated in FIGS. 8A, 8B, 9, and 10, the first evaporation source device (210) can form a hole injection layer (HIL) by depositing a deposition material on the substrate (40) at a deposition angle ranging from 60º to 120º. In the deposition system according to the third embodiment (200A in FIG. 12), the first evaporation source device (210), the fifth evaporation source device (250), and the sixth evaporation source device (260) of the first deposition equipment (CH1), the fifth deposition equipment (CH5), and the sixth deposition equipment (CH6) can each include a plurality of point sources. As shown in FIGS. 8a, 8b, 11 and 12, the first evaporation source device (210), the fifth evaporation source device (250) and the sixth evaporation source device (260) deposit the deposition material on the substrate (40) at a deposition angle range of 60º to 120º, thereby forming a hole injection layer (HIL), an n-type charge generation layer (n-CGL) and a p-type charge generation layer (p-CGL).

[0240] In the deposition system according to the fourth embodiment (300 of FIG. 15), the second evaporation source device (320) of the second deposition equipment (CH2) may include a plurality of point sources. As illustrated in FIGS. 13 to 15, the second evaporation source device (320) deposits a deposition material on a substrate (80) at a deposition angle ranging from 70º to 110º, thereby forming a blue organic light-emitting layer (B-EML).

[0241] Meanwhile, as illustrated in FIG. 19, the deposition equipment (400) according to the first embodiment may include two evaporation source devices (410, 450). That is, the first evaporation source device (410) and the second evaporation source device (450) may be positioned spaced apart from each other. For example, with respect to a virtual line defined along the scan direction, the first evaporation source device (410) may be positioned above the virtual line, and the second evaporation source device (450) may be positioned below the virtual line. In this case, the first evaporation source device (410) may spray the deposition material onto the lower surface of one side of the substrate (500), and the second evaporation source device (450) may spray the deposition material onto the lower surface of the other side of the substrate (500).

[0242] The first evaporation source device (410) may include a first-first evaporation source device (420), a first-second evaporation source device (430), and a first-third evaporation source device (440). For example, the first-first evaporation source device (420), the first-second evaporation source device (430), and the first-third evaporation source device (440) may be installed adjacent to each other along the scan direction. Although three evaporation source devices (420 to 440) are illustrated in the drawing, more evaporation source devices may be provided.

[0243] The 1-2 evaporation source device 430) may include a dopant material as a deposition material, and the 1-1 evaporation source device (420) and the 1-3 evaporation source device (440) may each include a host material as a deposition material.

[0244] The first-first evaporation source device (420) may include a plurality of first-first point sources (421 to 423) arranged in a circle along the upper circumference thereof, the first-second evaporation source device (430) may include a plurality of first-second point sources (431 to 433) arranged in a circle along the upper circumference thereof, and the first-third evaporation source device (440) may include a plurality of first-third point sources (441 to 443) arranged in a circle along the upper circumference thereof. Although the drawing illustrates seven first-first point sources (421 to 423), seven first-second point sources (431 to 433), and seven first-third point sources (441 to 443), more point sources may be provided.

[0245] The first-first point sources (421 to 423), the first-second point sources (431 to 433), and the first-third point sources (441 to 443) can each be inserted into the body. The first-first point sources (421 to 423), the first-second point sources (431 to 433), and the first-third point sources (441 to 443) can each be detached from the body. A point source whose deposition material has been exhausted can be rotated by a certain angle and replaced with a new point source.

[0246] Among the plurality of first-first point sources (421 to 423), one (421) may be currently being used in the evaporation process, another (422) may be preliminarily heated for use in the next evaporation process, and the others (423) may be on standby.

[0247] Among the plurality of first-second point sources (431 to 433), one (431) may be currently being used in the evaporation process, another (432) may be preliminarily heated for use in the next evaporation process, and the others (433) may be on standby.

[0248] Among the plurality of first-third point sources (441 to 443), one (441) may be currently being used in the evaporation process, another (442) may be preliminarily heated for use in the next evaporation process, and the others (443) may be on standby.

[0249] In this case, one (421) of the plurality of first-first point sources (421 to 423), one (431) of the plurality of first-second point sources (431 to 433), and one (441) of the plurality of first-third point sources (441 to 443) may be positioned on a straight line (511) and used in the current evaporation process. Here, the direction of the straight line (511) may be the same as the scan direction. Accordingly, the host material discharged from the first-first evaporation source device (420), the dopant material discharged from the first-second evaporation source device (430), and the host material discharged from the first-third evaporation source device (440) are deposited on the substrate (500) in the order along the scan direction, thereby improving the homogeneity of the deposition film deposited on the substrate (500).

[0250] When the deposition material of one (421) of the plurality of first-first point sources (421 to 423), one (431) of the plurality of first-second point sources (431 to 433), or one (441) of the plurality of first-third point sources (441 to 443) positioned on a straight line (511) is exhausted, the first-first evaporation source device (420), the first-second evaporation source device (430), and / or the first-third evaporation source device (440) are rotated so that another (422) of the plurality of first-first point sources (421 to 423), another (432) of the plurality of first-second point sources (431 to 433), and / or another (442) of the plurality of first-third point sources (441 to 443) are positioned on the straight line (511) and can be used in the evaporation process. At this time, the rotation may be clockwise, but is not limited to this.

[0251] The second evaporation source device (450) may include a second-first evaporation source device (460), a second-second evaporation source device (470), and a second-third evaporation source device (480). For example, the second-first evaporation source device (460), the second-second evaporation source device (470), and the second-third evaporation source device (480) may be installed adjacent to each other along the scan direction. Although three point sources 460 to 480 are illustrated in the drawing, more point sources may be provided.

[0252] The 2-2 evaporation source device (470) may include a dopant material as a deposition material, and the 2-1 evaporation source device (460) and the 2-3 evaporation source device (480) may each include a host material as a deposition material.

[0253] The 2-1 evaporation source device (460) may include a plurality of 2-1 point sources (461 to 463) arranged in a circle along the upper circumference thereof, the 2-2 evaporation source device (470) may include a plurality of 2-2 point sources (471 to 473) arranged in a circle along the upper circumference thereof, and the 2-3 evaporation source device (480) may include a plurality of 2-3 point sources (481 to 483) arranged in a circle along the upper circumference thereof. Although the drawing illustrates seven 2-1 point sources (461 to 463), seven 2-2 point sources (471 to 473), and seven 2-3 point sources (481 to 483), more point sources may be provided.

[0254] The second-first point sources (461 to 463), the second-second point sources (471 to 473), and the second-third point sources (481 to 483) can each be inserted into the body. The second-first point sources (461 to 463), the second-second point sources (471 to 473), and the second-third point sources (481 to 483) can each be detached from the body. A point source whose deposition material has been exhausted can be rotated by a certain angle and replaced with a new point source.

[0255] Among the plurality of second-first point sources (461 to 463), one (461) may be currently being used in the evaporation process, another (462) may be being preliminarily heated for use in the next evaporation process, and the others (463) may be in standby.

[0256] Among the plurality of second-second point sources (471 to 473), one (471) may be currently being used in the evaporation process, another (472) may be being preliminarily heated for use in the next evaporation process, and the others (473) may be on standby.

[0257] Among the plurality of second-third point sources (481 to 483), one (481) may be currently being used in the evaporation process, another (482) may be preliminarily heated for use in the next evaporation process, and the others (483) may be in standby. In this case, one (461) of the plurality of second-first point sources (461 to 463), one (471) of the plurality of second-second point sources (471 to 473), and one (481) of the plurality of second-third point sources (481 to 483) may be positioned on a straight line (512). Here, the direction of the straight line (512) may be the same as the scan direction. Accordingly, the host material discharged from the 2-1 evaporation source device (460), the dopant material discharged from the 2-2 evaporation source device (470), and the host material discharged from the 2-3 evaporation source device (480) are deposited on the substrate (500) in the order along the scan direction, thereby improving the homogeneity of the deposition film deposited on the substrate (500).

[0258] When the deposition material of one (461) of the plurality of 2-1 point sources (461 to 463), one (471) of the plurality of 2-2 point sources (471 to 473), or one (481) of the plurality of 2-3 point sources (481 to 483) positioned on a straight line (512) is exhausted, the 2-1 point source, the 2-2 evaporation source device (470), and / or the 2-3 evaporation source device (480) may be rotated so that another (462) of the plurality of 2-1 point sources (461 to 463), another (472) of the plurality of 2-2 point sources (471 to 473), and / or another (482) of the plurality of 2-3 point sources (481 to 483) may be positioned on the straight line (512). At this time, the rotation may be clockwise, but is not limited thereto.

[0259] Fig. 20a is a plan view illustrating a deposition apparatus according to the first embodiment. Fig. 20b illustrates a view along the line C1-C2 of the deposition apparatus according to the first embodiment. Fig. 20c illustrates a view along the line D1-D2 of the deposition apparatus according to the first embodiment. Fig. 21 is a table illustrating deposition characteristics of the deposition apparatus according to the first embodiment.

[0260] As shown in FIGS. 20a, 20b and 20c, the deposition equipment according to the first embodiment may be equipped with a first evaporation source device (410) and a second evaporation source device (450), each including a plurality of point sources (420 to 440, 460 to 480) having a cylindrical structure.

[0261] As illustrated in FIGS. 20A, 20B, 20C and 21, the target-source distance (TS) of the point sources (420 to 440, 460 to 480) may be at least four times the target-source distance (TS) of the linear source. For example, the target-source distance (TS) of the point sources (420 to 440, 460 to 480) may be 2,500 mm. Here, the point sources may be the first-first evaporation source device (420), the first-second evaporation source device (430), the first-third evaporation source device (440), the second-first evaporation source device (460), the second-second evaporation source device (470) and / or the second-third evaporation source device (480) in FIG. 20A. In this case, the range of the deposition angle of the point sources (420 to 440, 460 to 480) in the scan direction may be 60º to 120º, and the range of the deposition angle of the point sources (420 to 440, 460 to 480) in the direction orthogonal to the scan direction may be 60º to 120º. The homogeneity of the film deposited on the substrate (500) is very excellent at 92.5%, and the uniformity is also very excellent at less than 1%.

[0262] Fig. 22a is a plan view illustrating a deposition apparatus according to the second embodiment. Fig. 22b illustrates a view along the line C1-C2 of the deposition apparatus according to the second embodiment. Fig. 22c illustrates a view along the line D1-D2 of the deposition apparatus according to the second embodiment. Fig. 23 is a table illustrating deposition characteristics of the deposition apparatus according to the second embodiment.

[0263] As illustrated in FIGS. 22a, 22b and 22c, the deposition equipment according to the second embodiment may include an evaporation source device (600) including a plurality of linear sources (610 to 630). Each of the plurality of linear sources (610 to 630) may include a plurality of nozzles (611 to 613) provided on its upper side.

[0264] The deposition equipment according to the second embodiment can be applied to the first deposition equipment (CH1), the fifth deposition equipment (CH5), and the seventh deposition equipment (CH7) in the deposition system (300 in FIG. 15) according to the fourth embodiment. The first evaporation source device (310) of the first deposition equipment (CH1), the fifth-first evaporation source device (351) of the fifth deposition equipment (CH5), and the seventh evaporation source device (370) of the seventh deposition equipment (CH7) can include a plurality of linear sources. For example, the plurality of linear sources can be installed along the scan direction. In this case, each of the plurality of linear sources can have an elongated rectangular parallelepiped structure along a direction orthogonal to the scan direction.

[0265] As illustrated in FIGS. 22A, 22B, 22C, and 23, the target-source distance (TS) of the linear source may be 190 mm. Here, the linear source may include at least one of the plurality of linear sources (610 to 630) in FIG. 22A. In this case, the range of the deposition angle of the linear sources (610 to 630) in the scan direction may be 30º to 150º, and the range of the deposition angle of the linear sources (610 to 630) in the direction orthogonal to the scan direction may be 8º to 172º. The homogeneity of the film deposited on the substrate (650) may be 76.8%, and the uniformity may be less than 3%.

[0266] The deposition equipment according to the second embodiment can be useful for depositing a common layer that has high material utilization efficiency and does not affect homogeneity by not applying mixed materials (host and dopant). The common layer can be a layer that is simultaneously formed in common across the entire area of ​​the substrate, i.e., red subpixels (SPr), green subpixels (SPg), and blue subpixels (SPb).

[0267] Fig. 24a is a plan view illustrating a deposition apparatus according to a third embodiment. Fig. 24b illustrates a view along the line C1-C2 of the deposition apparatus according to the third embodiment. Fig. 24c illustrates a view along the line D1-D2 of the deposition apparatus according to the third embodiment. Fig. 25 is a table illustrating deposition characteristics of the deposition apparatus according to the third embodiment.

[0268] As illustrated in FIGS. 24a, 24b, and 24c, the deposition apparatus according to the third embodiment may include an evaporation source device (700) including a plurality of linear sources (710 to 730). For example, the plurality of linear sources (710 to 730) may be installed along a scan direction. In this case, the plurality of linear sources (710 to 730) may each have a rectangular parallelepiped structure that is elongated along a direction orthogonal to the scan direction. The plurality of linear sources (710 to 730) may each include a plurality of nozzles (711 to 713) provided on an upper side thereof.

[0269] As illustrated in FIGS. 24a, 24b, 24c, and 25, the target-source distance (TS) of the linear sources (710 to 730) may be 500 mm, which may be greater than the target-source distance (TS) of the linear sources (610 to 630) illustrated in FIG. 22. In this case, the range of the deposition angle of the linear sources (710 to 730) in the scan direction may be 62º to 118º, and the range of the deposition angle of the linear sources (710 to 730) in the direction orthogonal to the scan direction may be 21º to 159º. The homogeneity of the film deposited on the substrate (750) is very excellent at 91.0%, and the uniformity is excellent at less than 2%.

[0270] The deposition equipment according to the third embodiment may be useful for depositing a common layer or an organic light-emitting layer that affects homogeneity by applying mixed materials (host and dopant). Preferably, the deposition equipment according to the third embodiment has relatively low heat transfer, and thus can be usefully applied to deposition equipment utilizing FMM (CH2 to CH6 in FIG. 5).

[0271] Fig. 26a is a plan view illustrating a deposition apparatus according to the fourth embodiment. Fig. 26b illustrates a view along the line C1-C2 of the deposition apparatus according to the fourth embodiment. Fig. 26c illustrates a view along the line D1-D2 of the deposition apparatus according to the fourth embodiment. Fig. 27 is a table illustrating deposition characteristics of the deposition apparatus according to the fourth embodiment.

[0272] As illustrated in FIGS. 26a, 26b, and 26c, the deposition apparatus according to the fourth embodiment may include an evaporation source device (800) including two point source rows (810, 820), each having a cylindrical structure. Each of the two point source rows (810, 820) may include a plurality of point sources.

[0273] The first point source column (810) may be arranged along an orthogonal direction, and the second point source column (820) may be arranged along an orthogonal direction spaced apart from the first point source column (810).

[0274] The first point source column (810) may be installed adjacent to a starting point in a scan direction, and the second point source column may be installed adjacent to an end point in the scan direction. A plurality of point sources included in the first point source column (810) may be installed to be inclined in a first diagonal direction with respect to the substrate (850). A plurality of point sources included in the second point source column (820) may be installed to be inclined in a second diagonal direction with respect to the substrate (850). The first diagonal direction and the second diagonal direction may be orthogonal to each other.

[0275] The deposition equipment according to the fourth embodiment having the structure described above can be applied to the sixth deposition equipment (CH6) of the deposition system (200 of FIG. 10) according to the second embodiment, the sixth deposition equipment (CH6) of the deposition system (200A of FIG. 12) according to the third embodiment, and the sixth deposition equipment (CH6) of the deposition system (300 of FIG. 15) according to the fourth embodiment.

[0276] As illustrated in FIGS. 26a, 26b, 26c, and 27, the target-source distance (TS) of the point source may be 400 mm. The point source may include at least one of the plurality of point sources in FIG. 26a. In this case, the deposition angle of the point source in the scan direction may range from 20º to 160º, and the deposition angle of the point source in the orthogonal direction to the scan direction may range from 15º to 165º. The homogeneity of the film deposited on the substrate (850) is perfect at 100%, and the uniformity is excellent at less than 2%.

[0277] The deposition equipment according to the fourth embodiment can be applied to a deposition equipment that reduces the target-source distance (TS) of the point source to satisfy the product by reducing the deposition angle, thereby reducing the heat transfer relatively.

[0278] Fig. 28a is a plan view illustrating a deposition apparatus according to the fifth embodiment. Fig. 28b illustrates a view along the line C1-C2 of the deposition apparatus according to the fifth embodiment. Fig. 28c illustrates a view along the line D1-D2 of the deposition apparatus according to the fifth embodiment. Fig. 29 is a table illustrating deposition characteristics of the deposition apparatus according to the fifth embodiment.

[0279] As illustrated in FIGS. 28a, 28b, and 28c, the deposition equipment according to the fifth embodiment can be applied to a deposition equipment for depositing a deposition material using a self-aligned deposition method on a substrate (80) provided with a three-dimensional structure (81-1, 81-2 of FIG. 13). For example, the deposition equipment according to the fifth embodiment can be applied to the third deposition equipment (CH3) and the fourth deposition equipment (CH4) of the deposition system (300 of FIG. 15) according to the fourth embodiment.

[0280] The evaporation source device (900) of the deposition equipment according to the fifth embodiment may include a plurality of point sources (910). The plurality of point sources (910) may be installed in a row along an orthogonal direction. The plurality of point sources (910) may be installed diagonally with respect to the substrate.

[0281] As illustrated in FIGS. 28a, 28b, 28c, and 29, the target-source distance (TS) of the point source (910) may be 320 mm. In this case, the range of the deposition angle of the point source (910) in the scan direction may be 17º to 163º, and the range of the deposition angle of the point source (910) in the direction orthogonal to the scan direction may be 12º to 168º. The homogeneity of the film deposited on the substrate is perfect at 100%, and the uniformity is excellent at less than 2%.

[0282] The nozzle provided on the upper side of the point source may have various shapes. The nozzle provided on the upper side of the point source can control the deposition angle (or range of deposition angles) and / or discharge direction of the deposition material according to changes in the shape of the discharge port. The nozzle will be described with reference to FIGS. 30A to 32C.

[0283] Figures 30a, 30b and 30c illustrate nozzles provided on the upper side of a point source according to the first embodiment.

[0284] As illustrated in FIGS. 30a, 30b and 30c, the nozzle (1010) provided on the upper side of the point source according to the first embodiment may include a discharge port (1012) capable of controlling the deposition angle (or range of deposition angles) and / or discharge direction of the deposition material (1100).

[0285] The discharge port (1012) has a circular shape and its end can be positioned on a horizontal plane. Accordingly, the deposition material (1100) can be discharged vertically from the discharge port (1012) to the ground.

[0286] Figures 31a, 31b and 31c illustrate nozzles provided on the upper side of a point source according to the second embodiment.

[0287] As illustrated in FIGS. 31a, 31b and 31c, the nozzle (1020) provided on the upper side of the point source according to the second embodiment may include a discharge port (1022) capable of controlling the deposition angle (or range of deposition angle) and / or discharge direction of the deposition material (1200).

[0288] The discharge port (1022) has a circular shape and its end can be positioned on a sloped surface. Accordingly, the deposition material (1200) can be discharged from the discharge port (1022) in a diagonal direction with respect to the ground.

[0289] Figures 32a, 32b and 32c illustrate nozzles provided on the upper side of a point source according to a third embodiment.

[0290] As illustrated in FIGS. 32a, 32b and 32c, the nozzle (1030) provided on the upper side of the point source according to the third embodiment may include a discharge port (1032) capable of controlling the deposition angle (or range of deposition angles) and / or discharge direction of the deposition material (1300).

[0291] The discharge port (1032) has a triangular shape, and its end can be positioned on a slope. Accordingly, the deposition material (1300) can be discharged from the discharge port (1032) in a diagonal direction with respect to the ground.

[0292] As shown in FIGS. 31b and 32b, even if the ends of the discharge ports (1022, 1032) are positioned on the same slope, the discharge shapes of the deposition materials (1200, 1300) discharged from the circular discharge port (1022) and the triangular discharge port (1032) may be different.

[0293] The above detailed description should not be construed as limiting in any respect and should be considered illustrative only. The scope of the embodiments should be determined by a reasonable interpretation of the appended claims, and all modifications within the equivalency range of the embodiments are intended to be included within the scope of the embodiments.

Claims

1. In a deposition equipment for manufacturing each of a plurality of subpixels having a side-by-side structure on a substrate, It includes an evaporation source device positioned below the substrate and discharging a deposition material toward the substrate; The above evaporation source device includes a point source or a linear source, The point source is located at least four times further from the substrate than the linear source. Deposition equipment.

2. In paragraph 1, The range of the deposition angle of the point source in the scan direction and the range of the deposition angle of the point source in the direction orthogonal to the scan direction are the same. Deposition equipment.

3. In paragraph 1, The above plurality of subpixels include a blue subpixel, a green subpixel, and a red subpixel, The blue subpixel, the green subpixel, and the red subpixel each include a plurality of organic light-emitting layers, Deposition equipment.

4. In paragraph 3, When at least one organic light-emitting layer among the plurality of organic light-emitting layers is formed on the substrate using a mask positioned between the substrate and the point source, the range of the deposition angle of the point source is 60º to 120º, The at least one organic light-emitting layer is individually formed in the blue subpixel, the green subpixel, and the red subpixel by the mask. Deposition equipment.

5. In paragraph 1, The above plurality of subpixels include a blue subpixel, a green subpixel, and a red subpixel, The blue subpixel, the green subpixel, and the red subpixel each include a hole injection layer on the anode electrode and at least one stack structure on the hole injection layer, When the hole injection layer is formed on the substrate using the protrusions between the plurality of subpixels as a mask, the range of the deposition angle of the point source is 60º to 120º. Deposition equipment.

6. In paragraph 5, wherein said at least one stack structure comprises a first stack structure and a second stack structure, The blue subpixel, the green subpixel and the red subpixel are each, Further comprising a charge generation layer between the first stack structure and the second stack structure, When the charge generation layer is formed on the substrate using the above protrusion as a mask, the range of the deposition angle of the point source is 60º to 120º. Deposition equipment.

7. In paragraph 1, The above plurality of subpixels include a blue subpixel, a green subpixel, and a red subpixel, The blue subpixel, the green subpixel, and the red subpixel commonly include a blue organic light-emitting layer, When a blue organic light-emitting layer is formed on the substrate using a plurality of three-dimensional structures on the substrate as a mask, the range of the deposition angle of the point source is 70º to 110º. Deposition equipment.

8. In paragraph 1, The above evaporation source device is, A first evaporation source device including a first evaporation source device, a first evaporation source device, and a first evaporation source device arranged in a row along the scan direction; and A second evaporation source device including a second-first evaporation source device, a second-second evaporation source device, and a second-third evaporation source device, which are spaced apart from the first evaporation source device along a direction orthogonal to the scan direction and arranged in a row along the scan direction; Deposition equipment.

9. In paragraph 8, The above 1-2 evaporation source device and the above 2-2 evaporation source device each include a dopant material as the deposition material, The above 1-1 evaporation source device, the 1-3 evaporation source device, the 2-1 evaporation source device and the 2-3 evaporation source device each include a host material as the deposition material. Deposition equipment.

10. In paragraph 8, The above 1-1 evaporation source device includes a plurality of 1-1 point sources arranged in a circular shape along the upper perimeter thereof, The above 1-2 evaporation source device includes a plurality of 1-2 point sources arranged in a circle along the upper periphery thereof, The above 1-3 evaporation source device includes a plurality of 1-3 point sources arranged in a circular shape along the upper perimeter thereof, One of the plurality of first-1 point sources, one of the plurality of first-2 point sources and one of the plurality of first-3 point sources are located on a straight line. Deposition equipment.

11. In paragraph 8, The above 2-1 evaporation source device includes a plurality of 2-1 point sources arranged in a circular shape along the upper perimeter thereof, The above 2-2 evaporation source device includes a plurality of 2-2 point sources arranged in a circular shape along the upper perimeter thereof, The above 2-3 evaporation source device includes a plurality of 2-3 point sources arranged in a circle along the upper perimeter thereof, One of the plurality of second-1 point sources, one of the plurality of second-2 point sources and one of the plurality of second-3 point sources are located on a straight line. Deposition equipment.

12. In paragraph 1, The evaporation source device including the above point source has a cylindrical structure, The evaporation source device including the linear source has a rectangular parallelepiped structure long in a direction orthogonal to the scan direction. Deposition equipment.

13. Includes a plurality of deposition equipment configured in a cluster manner or in-line manner; One of the above plurality of deposition equipment is a deposition equipment according to one of claims 1 to 9. Deposition system.

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