Resin molding device and method for producing resin molded article

Abstract

A resin molding device according to the present invention comprises: a first mold that is capable of placing a substrate on which an electronic element is mounted; a second mold for forming a cavity between the first mold and the second mold; a transfer mechanism for supplying a resin material to the cavity by a plunger; and a control unit for controlling the moving speed of the plunger on the basis of a volume value of a space in which the resin material in the cavity can be filled in a state in which the substrate is placed in the cavity.

Description

Resin molding device and method for manufacturing resin molded product

[0001] The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded product.

[0002] Patent Document 1 discloses a method for manufacturing a resin molded product by placing a substrate with a chip mounted in a cavity and filling the cavity with resin by moving a plunger of a transfer mechanism. Specifically, the rate at which the resin fills the cavity is indirectly controlled by adjusting the plunger ascent speed according to the resin fill rate in the cavity based on the relationship between the resin fill rate in the cavity and the ascent position of the plunger.

[0003] Japanese Patent Application Laid-Open No. 2022-148957

[0004] Even if the plunger movement speed is the same, if the number of chips mounted on the board changes, the resin filling speed (filling time) in the cavity can actually change as follows: (1) The amount of resin required varies depending on the number of chips on the board, so if the plunger movement speed is kept the same regardless of the number of chips, the resin filling speed will change. (2) If the plunger movement speed is kept the same regardless of the number of chips, the resin filling time will be shorter for boards with a large number of chips. In other words, the resin filling speed in the cavity will be faster.

[0005] As described above, different resin filling speeds in the cavity result in inconsistent molding quality. For example, if the resin filling speed is too fast, wires may flow or the chip may shift. On the other hand, if the resin filling speed is too slow, some of the resin may harden, resulting in unfilled areas.

[0006] The present invention has been made to solve the above problems, and an object of the present invention is to provide a resin molding apparatus and a method for manufacturing a resin molded product that can improve the molding quality of resin.

[0007] The resin molding device of the present invention comprises a first mold in which a substrate having a semiconductor chip mounted thereon can be placed, a second mold that forms a cavity between the first mold and the second mold, a transfer mechanism that supplies resin material to the cavity using a plunger, and a control unit that controls the moving speed of the plunger based on the volume value of the space in the cavity that can be filled with resin material when the substrate is placed in the cavity.

[0008] The method for manufacturing a resin molded product according to the present invention is a method for manufacturing a resin molded product in a resin molding device that includes a first mold in which a substrate on which a semiconductor chip is mounted can be placed, a second mold that forms a cavity between the first mold and the second mold, and a transfer mechanism that supplies resin material to the cavity by a plunger, and includes the steps of placing the substrate in the first mold, clamping the second mold and the first mold together, and supplying the resin material to the cavity by moving the plunger, and in the step of supplying the resin material to the cavity, the moving speed of the plunger is controlled based on the volume value of the space in the cavity that can be filled with resin material.

[0009] According to the present invention, the molding quality of resin can be improved.

[0010] 1 is a plan view showing a schematic configuration of a resin molding apparatus according to one embodiment of the present invention; FIG. 2 is a cross-sectional view of a resin molding module provided in the resin molding apparatus of FIG. 1; FIG. 3 is a plan view of the lower mold of the resin molding module of FIG. 2 seen from the mold surface side (above); FIG. 4 is a plan view of the upper mold of the resin molding module of FIG. 2 seen from the mold surface side (below); FIG. 5 is a plan view showing a connecting groove that connects cull portions to each other; FIG. 6 is a plan view showing an example in which cull portions are connected to each other via a cavity; FIG. 7 is a partial cross-sectional view of the resin molding module of FIG. 2; FIG. 8 is a model of a cavity used to calculate the moving speed of a plunger; FIG. 9 is an example of a resin filling speed; and FIG. 10 is a flowchart showing a resin molding flow.

[0011] A resin molding apparatus and a method for manufacturing a resin molded product according to one embodiment of the present invention will be described below with reference to the drawings. For convenience of explanation, the following description will be given according to the directions shown in the drawings. However, the present invention is not limited to these directions, and the orientation can be changed depending on the type of the product. The following description will be given assuming that a lower mold is used as the first mold of the present invention and an upper mold is used as the second mold of the present invention.

[0012] 1 is a plan view showing the schematic configuration of a resin molding apparatus according to this embodiment. This resin molding apparatus 1 is an apparatus for resin-encapsulating electronic elements such as semiconductor chips (hereinafter simply referred to as "chips 2a") on a substrate to produce a resin molded product. In particular, this embodiment illustrates a resin molding apparatus 1 that performs resin molding using a transfer molding method.

[0013] 1, the resin molding apparatus 1 includes, as its components, a supply module 10, two resin molding modules 20, and an unloading module 30, which are arranged in this order from left to right. Each component is detachable and replaceable with respect to the other components.

[0014] <1-1. Supply Module> The supply module 10 supplies a lead frame (hereinafter simply referred to as "substrate 2"), which is a type of substrate on which a chip 2a is mounted, and a resin tablet T to the resin molding module 20. Note that in this embodiment, a lead frame is exemplified as the substrate 2, but various other substrates (glass epoxy substrates, ceramic substrates, resin substrates, metal substrates, etc.) can also be used in addition to lead frames. The supply module 10 mainly includes a frame sending unit 11, a frame measuring unit 12, a frame supply unit 13, a resin sending unit 14, a resin measuring unit 15, a resin supply unit 16, a loader 17, and a control unit 18.

[0015] The frame sending unit 11 sends out the non-resin-sealed substrate 2 housed in an in-magazine unit (not shown) to the frame measuring unit 12. The frame measuring unit 12 measures the volume of the chip 2a attached to the substrate 2. Details of the frame measuring unit 12 will be described later. After the measurement of the volume of the chip 2a has been completed in the frame measuring unit 12, the substrate 2 is sent out to the frame supply unit 13. The frame supply unit 13 receives the substrate 2 from the frame measuring unit 12, aligns the received substrate 2 appropriately, and hands it over to the loader 17.

[0016] The resin sending unit 14 receives the resin tablets T from a stocker (not shown) and sends them out to the resin measuring unit 15. The resin measuring unit 15 measures the weight (volume) of the resin tablets T. Details of the resin measuring unit 15 will be described later. The resin tablets T whose weight has been measured in the resin measuring unit 15 are sent out to the resin supply unit 16. The resin supply unit 16 receives the resin tablets T from the resin measuring unit 15, aligns the received resin tablets T appropriately, and hands them over to the loader 17.

[0017] The loader 17 transports the substrate 2 and resin tablet T received from the frame supply unit 13 and resin supply unit 16 to the resin molding module 20 .

[0018] The control unit 18 controls the operation of each module 10, 20, 30 of the resin molding apparatus 1. In this embodiment, an example is shown in which the control unit 18 is provided in the supply module 10, but the control unit 18 can also be provided in other modules. It is also possible to provide multiple control units 18. For example, it is possible to provide a control unit 18 for each module or device, and to individually control the operation of each module while linking them together.

[0019] <1-2. Resin molding module> The two resin molding modules 20 each resin-seal the chips 2a mounted on the substrate 2. By using the two resin molding modules 20 to resin-seal the substrates 2 in parallel, the manufacturing efficiency of resin-molded products can be improved. As will be described later, the resin molding module 20 has a lower mold 110 and an upper mold 140, and uses molten resin material to resin-seal the chips 2a mounted on the substrate 2. The detailed configuration of the resin molding module 20 will be described later.

[0020] <1-3. Unloading Module> The unloading module 30 receives and unloads the resin-sealed substrate 2 from the resin molding module 20. The unloading module 30 mainly includes an unloader 31 and a substrate accommodating section 32.

[0021] The unloader 31 holds the resin-sealed substrate 2 and carries it out to the substrate accommodation section 32. The substrate accommodation section 32 accommodates the resin-sealed substrate 2.

[0022] 2. Detailed Configuration of Resin Molding Module Next, the configuration of resin molding module 20 will be described in detail with reference to Figures 2 to 4. Figure 2 is a cross-sectional view of the resin molding module, Figure 3 is a schematic plan view showing the configuration of the lower mold as viewed from the mold surface side (above), and Figure 4 is a schematic bottom view showing the configuration of the upper mold as viewed from the mold surface side (below).

[0023] 2, the resin molding module 20 mainly includes a lower mold installation section 100, a lower mold 110, a lower mold cavity adjustment mechanism 120, an upper mold installation section 130, an upper mold 140, a disc spring 150, an upper mold cavity adjustment mechanism 160, an air vent opening / closing mechanism 170, a transfer mechanism 180, and a mold clamping mechanism 190. Each part will be described below.

[0024] <2-1. Lower die installation section> The lower die installation section 100 is a section where the lower die 110 is provided. The lower die installation section 100 mainly comprises a lower die movable base section 101 and a lower die mounting section 102. The lower die movable base section 101 forms the lower section of the lower die installation section 100. The lower die mounting section 102 is a section where the lower die 110 is mounted, and is provided on the upper section of the lower die movable base section 101.

[0025] <2-2. Lower Mold> The lower mold 110 constitutes the lower part of the molding die. The lower mold 110 mainly comprises a lower mold side block 111, a pot block 112, a lower mold cavity block 113, a lower mold pillar 114, and a lower mold elastic member 115. In this embodiment, as shown in Fig. 3, the pot block 112 is disposed in the center of the lower mold 110, and lower mold cavity blocks 113 are disposed on either side of the pot block 112, sandwiching the pot block 112 therebetween. Furthermore, lower mold side blocks 111 are disposed on the outer left and right sides of each lower mold cavity block 113, respectively.

[0026] Each lower die side block 111 forms an outer periphery of the lower die 110 and is provided on the upper surface of the lower die mounting portion 102. The pot block 112 is a portion where the resin tablets T supplied from the supply module 10 are accommodated. The pot block 112 has a plurality of through holes (pots) formed therein for accommodating the resin tablets T. The pot block 112 is also provided on the upper surface of the lower die mounting portion 102.

[0027] The lower die cavity block 113 is a portion on which the substrate 2 is placed. The lower die cavity block 113 is disposed between the lower die side block 111 and the pot block 112. The lower die cavity block 113 is movable in the vertical direction relative to the lower die side block 111 and the pot block 112.

[0028] The lower die pillars 114 are members that extend downward from the lower die cavity block 113. The upper ends of the lower die pillars 114 are fixed to the lower part of the lower die cavity block 113. In this embodiment, a plurality of lower die pillars 114 are provided.

[0029] The lower mold elastic member 115 is a member that applies an upward elastic force to each lower mold cavity block 113. Each lower mold elastic member 115 can be formed, for example, from a compression coil spring. Each lower mold elastic member 115 is disposed between the lower mold cavity block 113 and the lower mold mounting portion 102. The biasing force of the lower mold elastic member 115 always applies an upward force to the lower mold cavity block 113.

[0030] <2-3. Lower die cavity adjustment mechanism> The lower die cavity adjustment mechanism 120 has a function of adjusting the position of the lower die cavity block 113. The lower die cavity adjustment mechanism 120 mainly includes a lower die first wedge member 121, a lower die second wedge member 122, and a lower die wedge member drive unit 123.

[0031] The lower die first wedge member 121 and the lower die second wedge member 122 are a pair of members with tapered portions formed on the surfaces facing each other. The lower die second wedge member 122 is disposed above the lower die first wedge member 121. The lower die second wedge member 122 is also disposed below the lower die pillar 114. The lower end of the lower die pillar 114 comes into contact with the lower die second wedge member 122, thereby restricting downward movement of the lower die cavity block 113. This sets the position of the lower die cavity block 113.

[0032] The lower die wedge member drive unit 123 has the function of moving the lower die first wedge member 121 in the horizontal direction (left and right direction). The lower die wedge member drive unit 123 is formed by, for example, a servo motor or an air cylinder. The lower die wedge member drive unit 123 is connected to the lower die first wedge member 121 via a known power transmission member. When the lower die wedge member drive unit 123 is driven, the lower die first wedge member 121 can be moved arbitrarily in the left and right direction.

[0033] With the above configuration, the lower die cavity adjustment mechanism 120 can adjust the position of the lower die cavity block 113. That is, when the lower die wedge member drive unit 123 is driven to move the lower die first wedge member 121 in the left-right direction, the lower die second wedge member 122, which is in contact with the lower die first wedge member 121, is displaced up and down along the tapered portion. This displaces the position of the set lower die pillar 114, making it possible to adjust the position of the lower die cavity block 113.

[0034] <2-4. Upper Die Installation Section> The upper die installation section 130 is a section where the upper die 140 is provided. The upper die installation section 130 mainly includes an upper die fixing base section 131, an upper die attachment section 132, and a heater plate 133.

[0035] The upper mold fixing base 131 constitutes the upper part of the upper mold installation part 130. The upper mold mounting part 132 is a part to which the upper mold 140 is attached, and is provided at the lower part of the upper mold fixing base 131. The upper mold mounting part 132 can be formed by combining multiple parts. For example, a support part 132a is attached to the upper mold mounting part 132, which supports the upper mold 140 (upper mold base part 141) described below from below. The heater plate 133 has the function of heating the upper mold 140, and is provided on the bottom surface of the upper mold mounting part 132.

[0036] <2-5. Upper Mold> The upper mold 140 constitutes the upper part of the molding die. The upper mold 140 mainly comprises an upper mold base portion 141, upper mold side blocks 142, an upper mold cavity block 143, an upper mold support 145, and upper mold pillars 146. In this embodiment, as shown in Figure 4, a cull block 144 is disposed in the center of the upper mold 140, and upper mold cavity blocks 143 are disposed on the left and right of it. Then, upper mold side blocks 142 are disposed so as to surround the upper mold cavity block 143 and cull block 144.

[0037] The upper die base portion 141 is a plate-shaped member that supports the upper die side block 142. The outer peripheral portion of the upper die base portion 141 is supported from below by the above-mentioned support portion 132a, which allows the upper die base portion 141 to move in the vertical direction relative to the upper die installation portion 130.

[0038] The upper die side block 142 is provided on the lower surface of the upper die base portion 141 and constitutes the side surface of the cavity C formed by the upper die 140. The upper die side block 142 is formed in a frame shape, which forms an opening at a position corresponding to the resin molded product (cavity C). The upper die side block 142 also has an air vent groove 142a formed therein.

[0039] The air vent groove 142a is provided to exhaust air from within the cavity C to the outside. The air vent groove 142a is formed at an appropriate position on the lower surface of the upper die side block 142.

[0040] The upper mold cavity block 143 constitutes the upper surface of the cavity C formed by the upper mold 140. The upper mold cavity block 143 is disposed inside the upper mold side block 142 (more specifically, inside the opening of the upper mold side block 142) and is movable relative to the upper mold side block 142 in the vertical direction.

[0041] The cull block 144 is disposed opposite the pot block 112 of the lower mold 110 and constitutes the side surface of the cavity C formed by the upper mold 140. As shown in Fig. 4, a groove-like cull portion 144a and a runner portion 144b are formed on the lower surface of the cull block 144 to guide the resin material into the cavity C. To facilitate understanding of the flow of resin, Figs. 2 and 4 schematically show how the through-holes (pots) of the pot block 112 communicate with the cavity C, which will be described later, via the cull portion 144a and runner portion 144b.

[0042] The upper die supports 145 contact the upper die installation portion 130 to restrict upward movement of the upper die 140 and define the position of the upper die 140. The upper die supports 145 are fixed to a plurality of positions on the top surface of the upper die base portion 141.

[0043] The upper die pillar 146 is a member that extends upward from the upper die cavity block 143. The lower end of the upper die pillar 146 is fixed to the top of the upper die cavity block 143, and extends upward through the upper die base portion 141. Note that Fig. 2 shows a state in which a release film F is adsorbed onto the lower surface of the upper die 140 (the surface that forms the cavity C).

[0044] <2-6. Disc Spring> The disc spring 150 is a member that applies a downward force to the upper mold 140. The disc spring 150 is disposed between the lower surface of the upper mold installation portion 130 (heater plate 133) and the upper surface of the upper mold 140 (upper mold base portion 141). The biasing force of the disc spring 150 always applies a force to the upper mold 140 in a direction away from the upper mold installation portion 130 (downward).

[0045] <2-7. Upper die cavity adjustment mechanism> The upper die cavity adjustment mechanism 160 has a function of adjusting the position of the upper die cavity block 143. The upper die cavity adjustment mechanism 160 includes an upper die cavity block holding member 161, an upper die cavity block drive unit 162, a restricting member 163, an upper die elastic member 164, an upper die first wedge-shaped member 165, an upper die second wedge-shaped member 166, and an upper die wedge-shaped member drive unit 167.

[0046] The upper mold cavity block holding member 161 is a member that holds the upper mold cavity block 143 via the upper mold pillars 146. The upper mold cavity block holding member 161 is formed in a hollow frame shape when viewed from the front. The upper mold cavity block holding member 161 can be formed by combining multiple members (such as upper and lower plate-shaped members and multiple cylindrical members connecting the upper and lower plate-shaped members). The upper mold cavity block holding member 161 is arranged to vertically penetrate the upper mold fixing base portion 131. The upper mold cavity block holding member 161 is also arranged to be movable up and down relative to the upper mold fixing base portion 131. The upper ends of the upper mold pillars 146 are fixed to the lower surface of the upper mold cavity block holding member 161. This allows the upper mold cavity block 143 to be held by the upper mold pillars 146.

[0047] The upper mold cavity block driving unit 162 moves the upper mold cavity block holding member 161 in the vertical direction (up and down). The upper mold cavity block driving unit 162 is formed by, for example, a servo motor or an air cylinder. The upper mold cavity block driving unit 162 is provided above the upper mold cavity block holding member 161. By driving the upper mold cavity block driving unit 162, the upper mold cavity block holding member 161 (and therefore the upper mold cavity block 143) can be moved arbitrarily in the vertical direction relative to the upper mold installation unit 130.

[0048] The restricting member 163 restricts the movement of the upper cavity block holding member 161 by contacting the upper cavity block holding member 161. The restricting member 163 can be formed by combining multiple members (such as plate-shaped members). The restricting member 163 includes an upper portion that straddles the upper cavity block holding member 161 from the left and right, and a central portion that is positioned inside the upper cavity block holding member 161. The central portion of the restricting member 163 is positioned so that it can contact the lower portion (bottom) of the upper cavity block holding member 161 from above. The restricting member 163 restricts the upward movement of the upper cavity block holding member 161 by contacting the lower portion of the upper cavity block holding member 161 from above. This allows the depth of the cavity C to be determined.

[0049] The upper mold elastic member 164 applies an upward force to the regulating member 163. The upper mold elastic member 164 can be formed of, for example, a compression coil spring. The upper mold elastic member 164 is disposed between the regulating member 163 and the upper mold mounting portion 132, and the biasing force of the upper mold elastic member 164 always applies an upward force to the regulating member 163.

[0050] The upper die first wedge member 165 and the upper die second wedge member 166 are a pair of members with tapered portions formed on the surfaces facing each other. The upper die second wedge member 166 is disposed below the upper die first wedge member 165. The upper die first wedge member 165 and the upper die second wedge member 166 are disposed inside the upper die cavity block holding member 161. More specifically, the upper die first wedge member 165 and the upper die second wedge member 166 are disposed between the upper die fixed base portion 131 and the regulating member 163. The upper die second wedge member 166 is fixed to the upper surface of the regulating member 163.

[0051] The upper wedge member drive unit 167 has the function of moving the upper wedge member 165 in the horizontal direction (left and right direction). The upper wedge member drive unit 167 can be formed by, for example, a servo motor or an air cylinder. The upper wedge member drive unit 167 is connected to the upper wedge member 165 via an appropriate power transmission member. By driving the upper wedge member drive unit 167, the upper wedge member drive unit 167 can be moved arbitrarily in the left and right direction.

[0052] With the above configuration, the upper mold cavity adjustment mechanism 160 can adjust the position of the upper mold cavity block 143. Specifically, when the upper mold cavity block drive unit 162 is driven to move the upper mold cavity block holding member 161 downward, a gap is created between the restricting member 163 and the lower part of the upper mold cavity block holding member 161. In other words, this gap can be used to move the restricting member 163 up and down. In this state, when the upper mold wedge member drive unit 167 is driven to move the upper mold first wedge member 165 left and right, the upper mold second wedge member 166, which is in contact with the upper mold first wedge member 165, is displaced up and down along the tapered portion. Furthermore, the restricting member 163 is also displaced up and down together with the upper mold second wedge member 166. After adjusting the restricting member 163 to a predetermined position, the upper mold cavity block driving unit 162 is driven again to move the upper mold cavity block holding member 161 upward until it comes into contact with the restricting member 163. By displacing the restricting member 163 up and down in this manner, the position at which the upward movement of the upper mold cavity block holding member 161 is restricted is displaced, and therefore the position of the upper mold cavity block 143 can be adjusted.

[0053] 2-8. Air Vent Opening / Closing Mechanism The air vent opening / closing mechanism 170 has a function of opening and closing the air vent groove 142a that connects the cavity C with the outside. The air vent opening / closing mechanism 170 mainly includes an air vent pin 171 and an air vent driver 172.

[0054] The air vent groove 142a is closed by the air vent pin 171. More specifically, the air vent pin 171 is provided in a through-hole in the upper side block 142 that is connected to the air vent groove 142a so as to be movable up and down.

[0055] The air vent drive unit 172 moves the air vent pin 171 in the up and down direction. The air vent drive unit 172 can be formed, for example, by a servo motor or an air cylinder. The air vent drive unit 172 is connected to the air vent pin 171 via an appropriate power transmission member. By driving the air vent drive unit 172, the air vent pin 171 can be moved up and down as desired. For example, by moving the air vent pin 171 downward, the air vent groove 142a can be closed.

[0056] 2-9. Transfer Mechanism The transfer mechanism 180 has a function of supplying the resin material to the cavity C. The transfer mechanism 180 mainly includes a transfer drive unit 181, a plunger 182, and a plunger load measurement unit 183.

[0057] The transfer drive unit 181 is a drive source that moves a plunger 182 (described later) in the vertical direction (up and down). The transfer drive unit 181 can be formed, for example, by a servo motor or an air cylinder. The transfer drive unit 181 is provided on the lower mold movable base part 101 below the pot block 112.

[0058] The plunger 182 is a member for supplying the molten resin material to the cavity C. Therefore, the plunger 182 is capable of moving up and down (raising and lowering) within the pot block 112. The resin material is formed by melting the resin tablet T accommodated in the pot block 112.

[0059] The plunger load measuring unit 183 measures the force (plunger load) applied to the plunger 182. Specifically, the force applied to the plunger 182 is the force with which the transfer drive unit 181 presses the plunger 182. The plunger load measuring unit 183 can be formed by, for example, a load cell. The plunger load measuring unit 183 is provided between the transfer drive unit 181 and the plunger 182.

[0060] <2-10. Mold Clamping Mechanism> The mold clamping mechanism 190 has the function of raising the lower mold 110 and clamping (clamping) the lower mold 110 and the upper mold 140. The mold clamping mechanism 190 mainly includes a fixed platen 191, a support 192, a drive mechanism 193, and a clamp load measuring unit 194.

[0061] The fixed platen 191 is a portion that is placed on the ground (installation surface) and supports other components. A lower mold 110 (lower mold installation portion 100) is disposed above the fixed platen 191 via a drive mechanism 193, which will be described later.

[0062] The support pillars 192 are members that support the upper mold 140 (upper mold installation section 130). The support pillars 192 extend upward from the fixed platen 191, and the upper mold fixing base section 131 of the upper mold installation section 130 is fixed to the top of the support pillars 192. As a result, the upper mold 140 (upper mold installation section 130) is positioned above the lower mold 110 (lower mold installation section 100).

[0063] The drive mechanism 193 has the function of moving the lower mold 110 (lower mold installation section 100) in the vertical direction (up and down). The drive mechanism 193 can be formed, for example, by a drive source such as a servo motor and an appropriate power transmission mechanism. The drive mechanism 193 is disposed between the fixed platen 191 and the lower mold installation section 100. By driving the drive mechanism 193, the lower mold installation section 100 can be moved (raised and lowered) in the vertical direction as desired. For example, the drive mechanism 193 can raise the lower mold 110 toward the upper mold 140 to close the mold. The drive mechanism 193 can also lower the lower mold 110 away from the upper mold 140 to open the mold.

[0064] The clamp load measuring unit 194 has a function of measuring the force (clamp load) when the lower mold 110 and the upper mold 140 are clamped by the mold clamping mechanism 190, and is provided on the support column 192. The clamp load measuring unit 194 can be formed by, for example, a load cell or a strain gauge, and can measure the clamp load based on the load applied to the support column 192.

[0065] 2 shows a state in which the lower mold 110 and the upper mold 140 are clamped together after the substrate 2 and the resin tablet T have been transported to the molding die.

[0066] 3. Overview of Operation of Resin Molding Apparatus Next, an overview of the operation of the resin molding apparatus configured as above (method of manufacturing a resin molded product) will be described with reference to FIGS. 1 and 2. FIG.

[0067] In the supply module 10, the frame sending section 11 sends out the substrates 2 housed in an in-magazine unit (not shown) to the frame measuring section 12. The frame measuring section 12 measures the volume of the chips 2a on the received substrates 2, and then sends the substrates 2 to the frame supply section 13. The frame supply section 13 aligns the received substrates 2 appropriately and hands them over to the loader 17.

[0068] Furthermore, the resin sending unit 14 sends the resin tablets T received from a stocker (not shown) to the resin measuring unit 15. The resin measuring unit 15 measures the weight of the received resin tablets T and then sends the resin tablets T to the resin supplying unit 16. The resin supplying unit 16 transfers the required number of the received resin tablets T to the loader 17. The loader 17 transports the received substrate 2 and resin tablets T to the molding die of the resin molding module 20.

[0069] In the resin molding module 20, the mold clamping mechanism 190 clamps the molding die. Then, the resin tablet T is heated and melted by a heating section (not shown) of the molding die, and the resulting molten resin is used to resin-seal the substrate 2. After resin sealing is complete, the mold clamping mechanism 190 opens the molding die. Then, the resin-sealed substrate 2 is released from the die. The operation of the resin molding module 20 will be described in detail below.

[0070] Thereafter, the unloader 31 unloads the substrate 2 from the mold and stores it in the substrate storage section 32 of the unloading module 30. At this time, unnecessary portions (unnecessary resin such as culls and runners) of the resin-molded substrate 2 are appropriately removed. In this way, a resin-sealed substrate 2 (resin molded product) is manufactured.

[0071] 4. Operation of Resin Molding Module The operation of the resin molding module 20 will be described in detail below. In this embodiment, when resin molding is performed in the resin molding module 20, control is performed to improve the dimensional accuracy of the product (specifically, the dimensional accuracy of the thickness of the molded resin). This will be described with reference to FIGS. 7 and 8. FIG. 7 is a partial cross-sectional view of the resin molding module, and FIG. 8 is a diagram illustrating modeling of the cavity.

[0072] Prior to resin moldability, the control unit 18 calculates and sets the following items: (1) Volume of resin tablet T The specific gravity of the resin tablet T to be used is input to the control unit 18, and the volume of the resin tablet T is calculated from the weight of the resin tablet T measured based on this. Specifically, the following examples can be given.

[0073] The volume of the resin tablet T is measured in the resin measuring unit 15 of the supply module 10 as described above. In the resin measuring unit 15, the volume of the resin tablet T can be measured using any measuring device. An example of the resin measuring unit 15 is a weighing scale that measures the weight of the resin tablet T. The volume of the resin tablet T is calculated from the weight of the resin tablet T measured by the weighing scale and the specific gravity of the resin tablet T. Note that the method for measuring the volume of the resin tablet T is not particularly limited, and measurement can be performed using various other devices. For example, various types of three-dimensional scanners, laser volume meters using laser light, etc. can be used.

[0074] (2) Volume of Chips 2a The volume of the chips 2a on the substrate 2 is measured in the frame measuring unit 12 of the supply module 10 as described above. The frame measuring unit 12 can measure the volume of the chips 2a on the substrate 2 using any measuring device. An example of the frame measuring unit 12 is a volume meter that measures the volume of the chips 2a on the substrate 2. The volume meter is a laser volume meter that measures the shape (and therefore the volume) of the chips 2a by using laser light to detect the distance to the chips 2a on the substrate 2. Note that the method for measuring the volume of the chips 2a is not particularly limited, and various other devices can be used for measurement. For example, various types of three-dimensional scanners can be used.

[0075] (3) Capacity (volume value) of cavity C, resin filling rate, and plunger position The capacity of cavity C is calculated based on the pre-stored dimensions of each part (upper die side block 142, upper die cavity block 143, pot block 112, cull block 144, etc.) and the vertical position of the upper die cavity block 143. The vertical position of the upper die cavity block 143 can be determined based on the drive amount of the upper die wedge-shaped member drive unit 167, etc. The control unit 18 can calculate what percentage of the capacity of cavity C has been filled with molten resin material (resin filling rate) at the point in time when the plunger 182 has risen, based on the calculated capacity of cavity C and the measured volumes of the resin tablet T and chip 2a.

[0076] 7, the control unit 18 calculates positions of the plunger 182 where the resin filling rate of the cavity C is 0%, 25%, 50%, 75%, and 100% (hereinafter referred to as positions T0, T25, T50, T75, and T100, respectively). The distance represented by T100-T0 corresponds to L in the present invention.

[0077] The position T0 of the plunger 182 is determined based on the volume calculated from the weight of the resin tablet T as described above. That is, if the volume of the resin tablet T is large, the position T0 is set lower, and if the volume is small, the position T0 is set higher. Furthermore, the position T100 of the plunger 182 is the position where the filling of the resin is completed, and is therefore set based on the capacity (volume value) of the cavity C calculated as described above.

[0078] The control unit 18 has previously inputted information about the positions. In this embodiment, five positions (T0, T25, T50, T75, and T100) are set, but the coordinates of these positions and the number of positions can be set appropriately depending on the molded product to be manufactured. This also applies to Fn and Vn, which will be described later.

[0079] (4) Determination of Resin Filling Speed ​​In this embodiment, the moving speed of the plunger 182 is adjusted according to the resin filling rate, thereby making it possible to prevent occurrence of insufficient filling of the resin material.

[0080] In this embodiment, as shown in FIG. 7 , there are four sections A1 to A4 between T0 and T100, and the resin filling speed (F1 to F4: collectively referred to as Fn) within the cavity C is determined for these four sections A1 to A4. Such resin filling speed Fn can be determined in advance through experiments, numerical analysis, or the like. For example, such resin filling speed Fn can be determined by using a test chip-mounted substrate to determine the presence or absence of wire sweep and chip shift due to the resin flow speed based on experiments or numerical analysis, or it can be determined empirically. Furthermore, the resin filling speed can be determined in terms of the curing characteristics of the resin used.

[0081] (5) Calculation of Plunger Movement Speed ​​In this embodiment, the movement speed of the plunger 182 is calculated as follows. This will be described with reference to FIG.

[0082] In this embodiment, the cavity is represented by a simple rectangular parallelepiped model as shown in Figure 8. That is, this model assumes that the resin is uniformly filled into cavity C as shown in Figure 8(b) from the initial state shown in Figure 8(a). In this cavity C, the length from the end on the pod side (the side closer to the plunger 182) to the end on the air vent side (the side farther from the plunger 182) is defined as W (the length in the direction in which the resin material flows within cavity C). Therefore, it can be assumed that the time it takes for the plunger 182 to move is the same as the time it takes for the resin to flow within cavity C. Therefore, once the resin filling speed F is determined, the moving speed V of the plunger 182 can be calculated using the following formula (1): V = F × (T100 - T0) / W (1)

[0083] In this embodiment, since the resin filling speed is set in the four sections A1 to A4 as described above, the movement speed Vn (n=4) in each of the sections A1 to A4 can be calculated using the following equations (2) to (5). V1=F1×(T100-T0) / W (2) V2=F2×(T100-T0) / W (3) V3=F3×(T100-T0) / W (4) V4=F4×(T100-T0) / W (5) In other words, in this embodiment, the movement speed of the plunger 182 is different in the four sections A1 to A4. Furthermore, equations (1) to (5) can be combined and expressed as the following equation (6): Vn=Fn×(T100-T0) / W (6) Equations (2) to (5) can also be rewritten as the following equations (7) to (10), respectively. V1 = F1 × (T25 - T0) / (W25 - W0) (7) V2 = F2 × (T50 - T25) / (W50 - W25) (8) V3 = F3 × (T75 - T50) / (W75 - W50) (9) V4 = F4 × (T100 - T75) / (W100 - W75) (10) Here, W0 is the position of the end of cavity C on the pod side, W100 is the position of the end of cavity C on the air vent side, and W25, W50, and W75 are the positions where the resin filling speed in the cavity switches to F2, F3, and F4, respectively.

[0084] FIG. 9 shows an example of the plunger movement speed Vn. In the example of FIG. 9, the movement speed Vn decreases as the plunger 182 ascends. Furthermore, the rate of change of the movement speed Vn decreases as the plunger 182 ascends. That is, in this example, the plunger movement speeds V1 to V4 are decreased as the resin filling into the cavity C progresses. Because the viscosity of the resin decreases over time, increasing the resin filling speed under such circumstances may cause the resin to break down, resulting in gaps, i.e., unfilled portions or voids. Therefore, in the example of FIG. 9, the movement speed of the plunger 182 is decreased over time. However, this is just an example and can be modified as appropriate. Furthermore, the values ​​on the vertical axis of FIG. 9 are used to illustrate an example of the rate of change of the movement speed and do not represent a specific speed.

[0085] (6) Resin Molding Flow Next, the resin molding flow will be described with reference to the flowchart shown in Fig. 10. First, as described above, the resin filling speed Fn corresponding to a predetermined resin filling rate of the cavity C is determined (step S1). Subsequently, as described above, the plunger moving speed Vn is calculated (step S2).

[0086] Next, the volumes of the resin tablet T and the chip 2a are obtained (step S3).

[0087] Next, the substrate 2 and the resin tablet T are each transported to the molding die of the resin molding module 20. Specifically, the substrate 2 is placed on the lower die 110, and the resin tablet T is placed in the pot of the pot block 112. Subsequently, the clamping mechanism 190 clamps the lower die 110 and the upper die 140 together (step S4). Specifically, the clamping mechanism 190 raises the lower die 110 so that the lower die 110 contacts the upper die 140 from below. This closes the cavity C. At this time, as shown in FIG. 11 , the upper die 140 rises to a position where the upper die support 145 contacts the upper die installation section 130 (heater plate 133).

[0088] Next, the plunger 182 is raised (step S5). First, the plunger 182 is raised from position T0 to position T25 at the aforementioned speed V1. Then, when the plunger 182 reaches position T25 (a position where the resin filling rate is 25%) (YES in step S6), the movement speed of the plunger 182 is adjusted (step S7). That is, the movement speed of the plunger 182 is changed to movement speed V2 for the next movement section (positions T25 to T50). In this way, the movement speed of the plunger 182 is changed each time the movement section is changed (step S7). When the plunger 182 reaches position T100 (a position where the resin filling rate is 100%) (YES in step S8), the plunger 182 is stopped.

[0089] Following this, the plunger 182 is lowered (step S10). Then, the mold clamping mechanism 190 opens the lower mold 110 and the upper mold 140 (step S11). After that, the substrate 2, for which resin molding (resin sealing) has been completed, is unloaded from the molding mold. The unloaded substrate 2 is transported to the unloading module 30.

[0090] 5. Features According to this embodiment, the following effects can be obtained. (1) If the movement speed of the plunger 182 is kept constant regardless of the number of chips 2 a on the substrate 2, the filling speed of the resin material in the cavity C changes. For example, for a substrate 2 with a large number of chips 2 a, the filling time of the resin material is shorter. In other words, the filling speed of the resin in the cavity C becomes faster. As such, if the filling speed of the resin in the cavity C varies, there is a problem in that the quality of the molded product will not be consistent. For example, if the filling speed of the resin is too fast, the wire may flow or the chip may shift. On the other hand, if the filling speed of the resin is too slow, some of the resin may harden, resulting in unfilled parts.

[0091] Therefore, in this embodiment, the volume of the space in cavity C that can be filled with resin material is calculated based on the volume of chip 2a, etc., and an appropriate filling speed of the resin material flowing through cavity C is preset based on this volume value. In other words, a resin filling speed appropriate for the calculated volume of cavity C is preset. Then, the movement speed of plunger 182 is set so that the resin material flows through cavity C at the set filling speed. This makes it possible to improve the quality of resin molding. In particular, quality can be maintained or improved when there are constraints on the resin filling time from the perspective of the resin curing characteristics.

[0092] (2) In this embodiment, the resin filling rate (the position of the plunger 182 corresponding to the resin filling rate) is calculated based on the actual measured values ​​of the volume of the resin tablet T and the chip 2a of the substrate 2. Therefore, the resin filling rate of the cavity C can be accurately grasped regardless of variations in the volume of each resin tablet T.

[0093] (3) By adjusting the movement speed of the plunger 182 to V1 to V4 depending on the resin filling rate, it is possible to prevent the resin material from being left unfilled. Specifically, the resin material flowing within the cavity C flows through relatively easy-to-flow areas (e.g., areas of the substrate 2 where the chip 2a is not provided) and relatively difficult-to-flow areas (e.g., areas of the substrate 2 where the chip 2a is provided), so it may be desirable to adjust the flow speed to improve the circulation of the resin. Therefore, by adjusting the movement speed of the plunger 182 depending on the resin filling rate as described above, it is possible to improve the circulation of the resin.

[0094] 6. Modifications Although one embodiment of the present invention has been described above, the present invention is not limited to the above-described embodiments, and various modifications are possible without departing from the spirit of the present invention. For example, the following modifications are possible. Furthermore, the gist of the following modifications can be combined as appropriate.

[0095] <6-1> In the above embodiment, the model shown in FIG. 8 is used to calculate the plunger movement speed using equations (1) to (5) (or equations (7) to (10)), but this is not limiting. For example, assume that the cavity has a shape as shown in FIG. 12. This cavity C has three regions. That is, it has a region where the chip 2a is located (chip region B), a region on the pod side where resin is injected and reaches the chip region B (resin injection region A), and a region on the air vent side where excess resin is flowed to prevent chip region B from being left unfilled with resin (flow cavity region C).

[0096] In the cavity model shown in Fig. 12, the chip region B is formed in a rectangular parallelepiped shape, and the resin injection region A and the flow cavity region C are formed in a triangular prism shape (the longitudinal section is a right-angled triangle). The lengths of the resin injection region A, chip region B, and flow cavity region C in the direction in which the resin is filled are respectively defined as X A , X B , X C (These are sometimes written as WA, WB, and WC.)

[0097] In this model, the position and speed of the plunger in each region can be set as follows: (1) Position of the plunger corresponding to the resin injection region A: T0 to T0 + (T100 - T0) * X A / (2X B +X A +X C ) Since no tip 2a is disposed in this region, the moving speed of the plunger 182 may be any speed.

[0098] (2) Plunger position corresponding to tip area B: T0 + (T100 - T0) * X A / (2X B +X A +X C )~T0+(T100-T0)*(X A +2X B ) / (2X B +X A +X CThe plunger movement speed (constant speed) VB in this region is as follows: VB = 2FB * (T100 - T0) / (2X B +X A +X C ) where FB is the resin filling speed in chip area B

[0099] (3) The plunger position corresponding to the flow cavity region C is T0 + (T100 - T0) * (X A +2X B ) / (2X B +X A +X C ) to T100 The plunger movement speed may be any speed that becomes 0 when the plunger reaches position T100.

[0100] Immediately after the plunger 182 starts to rise, it is necessary to first push out the resin that fills the runner portion, so the initial position of the plunger 182 is lower than position T0 (the position where the resin filling rate in the cavity is 0%). Also, the moving speed of the plunger 182 from the initial position to position T0 can be any value because the resin is not flowing through the tip region B.

[0101] The above model can be used when the resin injection area A and the flow cavity area C where no chips are placed cannot be ignored in filling the resin.

[0102] The above setting of the plunger movement speed is one example, and various modifications are possible. That is, the optimal resin filling speed in the cavity is set based on the volume value of the space in the cavity that can be filled with the resin material, and the movement speed of the plunger 182 is set based on this.

[0103] 1, when there is one plunger 182 and multiple cavities C (two in FIG. 1), the volume value of the space that can be filled with resin material in each cavity C is calculated, and these values ​​are averaged to set an average volume value. Then, the resin filling speed and plunger movement speed can be set based on this average volume value.

[0104] <6-3> In the above embodiment, the movement speed of the plunger 182 is adjusted according to the resin filling rate, but it is not necessary to set multiple movement speeds for the plunger, and a constant speed can be set between positions T0 and T100. In other words, the resin filling speed can also be constant.

[0105] <6-4> In the above embodiment, the resin filling rate (the position of the plunger 182 corresponding to the resin filling rate) is calculated based on the actual measured values ​​of the volume of the resin tablet T and the chip 2a of the substrate 2, but a calculated value can also be used instead of the actual measured value.

[0106] <6-5> The resin molding device shown in the above embodiment is just one example, and various modifications are possible as long as the resin molding device is capable of filling the cavity with resin using plunger 182 and appropriately changing the moving speed of plunger 182. Also, in the above embodiment, substrate 2 on which chip 2a is mounted is placed in lower mold 110 as the first mold, but resin molding may also be performed by placing substrate 2 in upper mold 140. That is, the first mold of the present invention may be upper mold 140, and the second mold may be lower mold 110.

[0107] Some embodiments of the present invention have been described above by way of example. That is, the detailed description and the accompanying drawings have been disclosed for the purpose of illustrative explanation. Therefore, some components described in the detailed description and the accompanying drawings may be non-essential components for solving the problems. Therefore, just because these non-essential components are described in the detailed description and the accompanying drawings, it should not be immediately recognized that these non-essential components are essential.

[0108] (Additional Notes) The following additional notes are disclosed regarding the above-described embodiment. Addition 1. A resin molding device comprising: a first mold in which a substrate having an electronic element mounted thereon can be placed; a second mold that forms a cavity between the first mold and the second mold; a transfer mechanism that supplies resin material to the cavity by a plunger; and a control unit that controls the moving speed of the plunger based on the volume value of a space in the cavity that can be filled with resin material when the substrate is placed in the cavity.

[0109] Supplementary Note 2. The resin molding apparatus according to Supplementary Note 1, wherein the resin material is formed by melting a solid resin material placed in the resin molding apparatus, and the control unit sets an initial position T0 of the plunger based on a weight value of the solid resin material, sets an end position T100 of the plunger based on the volume value, sets a filling speed of the resin material flowing through the cavity based on a volume value of the cavity, and controls a moving speed of the plunger based on the filling speed.

[0110] Supplementary Note 3: The resin molding apparatus according to Supplementary Note 2, wherein W is the length of the cavity in the direction in which the resin material is injected, F is the filling speed of the resin material in the cavity calculated based on the volume value, and L is the moving distance of the plunger from the initial position T0 to the terminal position T100. The moving speed V of the plunger is calculated by the following formula (1): V=F×L / W (1)

[0111] Supplementary Note 4. The resin molding apparatus according to Supplementary Note 1, wherein the resin material is formed by melting a solid resin material placed in the resin molding apparatus, and the control unit: sets an initial position T0 of the plunger based on a weight value of the solid resin material, sets an end position T100 of the plunger based on the volume value, sets a movement section of the plunger between position T0 and position T100 corresponding to filling the resin material into an element region in the cavity where the electronic element is placed, sets a filling speed of the resin material flowing through the element region of the cavity based on a volume value of the element region of the cavity, and controls the moving speed of the plunger based on the filling speed in the element region.

[0112] Supplementary Note 5. The resin molding apparatus according to Supplementary Note 4, wherein WB is the length of the element region of the cavity in the direction in which the resin material is injected, WA and WC are the lengths of the cavity on the upstream side and downstream side of the element region in the direction in which the resin is injected, FB is the filling speed of the resin material in the element region of the cavity calculated based on the movement time, and LB is the movement distance of the plunger in the movement section, then a movement speed VB of the plunger in the movement section is calculated by the following formula (2): VB=2FB×LB / (2WB+WA+WC) (2)

[0113] Supplementary Note 6. The resin molding apparatus according to any one of Supplementary Notes 1 to 5, wherein the control unit adjusts the moving speed of the plunger when the plunger reaches a position corresponding to a predetermined resin filling rate for the cavity.

[0114] Supplementary Note 7. A method for manufacturing a resin molded product in a resin molding apparatus including: a first mold on which a substrate having a semiconductor chip mounted thereon can be placed; a second mold that forms a cavity between the first mold and the second mold; and a transfer mechanism that supplies resin material to the cavity by a plunger, the method comprising: placing the substrate in the first mold; clamping the second mold and the first mold together; and supplying the resin material to the cavity by moving the plunger, wherein in the step of supplying the resin material to the cavity, the moving speed of the plunger is controlled based on a volume value of a space in the cavity that can be filled with resin material.

[0115] C cavity 182 plunger 2 package substrate 2a chip

Claims

1. A resin molding device comprising: a first mold on which a substrate having an electronic element mounted thereon can be placed; a second mold which forms a cavity between the first mold and the second mold; a transfer mechanism which supplies resin material to the cavity by a plunger; and a control unit which controls the moving speed of the plunger based on the volume value of the space in the cavity which can be filled with resin material when the substrate is placed in the cavity.

2. The resin molding apparatus of claim 1, wherein the resin material is formed by melting a solid resin material placed in the resin molding apparatus, and the control unit sets an initial position T0 of the plunger based on a weight value of the solid resin material, sets a terminal position T100 of the plunger based on the volume value, sets a filling speed of the resin material flowing through the cavity based on a volume value of the cavity, and controls the moving speed of the plunger based on the filling speed.

3. The resin molding device according to claim 2, wherein, when W is the length of the cavity in the direction in which the resin material is injected, F is the filling speed of the resin material in the cavity calculated based on the volume value, and L is the moving distance of the plunger from the initial position T0 to the terminal position T100, the moving speed V of the plunger is calculated by the following formula (1): V=F×L / W (1) 4. The resin molding apparatus of claim 1, wherein the resin material is formed by melting a solid resin material placed in the resin molding apparatus, and the control unit: sets an initial position T0 of the plunger based on a weight value of the solid resin material; sets a terminal position T100 of the plunger based on the volume value; sets a movement section of the plunger between position T0 and position T100 corresponding to filling the resin material into an element region in the cavity in which the electronic element is placed; sets a filling speed of the resin material flowing through the element region of the cavity based on a volume value of the element region of the cavity; and controls the moving speed of the plunger based on the filling speed in the element region.

5. The resin molding device according to claim 1, wherein the control unit adjusts the moving speed of the plunger when the plunger reaches a position corresponding to a predetermined resin filling rate for the cavity.

6. A method for manufacturing a resin molded product in a resin molding apparatus including a first mold on which a substrate having a semiconductor chip mounted thereon can be placed, a second mold that forms a cavity between the first mold and the second mold, and a transfer mechanism that supplies resin material to the cavity by a plunger, the method comprising the steps of: placing the substrate in the first mold; clamping the second mold and the first mold together; and supplying the resin material to the cavity by moving the plunger, wherein in the step of supplying the resin material to the cavity, the moving speed of the plunger is controlled based on the volume value of the space in the cavity that can be filled with resin material.

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