Processing system, measurement device, and processing method

Abstract

A processing system according to the present invention is provided with: an object placement device which is capable of supporting a first surface and a second surface of a plate-shaped workpiece respectively on a plurality of support sections; a processing device which uses processing light to process the workpiece placed on the object placement device; a measurement device which measures the workpiece placed on the object placement device; and a control device. The control device performs control so as to measure the first surface of the workpiece while the second surface thereof is supported, and, after measurement of the first surface, performs control so as to measure the second surface of the workpiece while the first surface thereof is supported. Furthermore, after the measurement of the second surface, the control device performs control so as to process the second surface on the basis of the measurement result of the first surface and the measurement result of the second surface.

Description

Processing system, measuring device and processing method

[0001] The present invention relates to the technical fields of a processing system for processing an object, a processing method, and a measuring device for measuring an object.

[0002] Patent Document 1 describes a processing device that processes an object by irradiating the object with laser light, which is processing light. In technical fields related to such object processing, there is a demand for improvement in performance related to object processing.

[0003] US Patent Application Publication No. 2005 / 0045090

[0004] According to a first aspect, there is provided a processing system for processing a plate-shaped object, the processing system comprising: an object mounting device capable of supporting a first surface of the object on a plurality of support parts and a second surface different from the first surface on the plurality of support parts; a processing device that processes the object mounted on the object mounting device with processing light; a measuring device that measures the object mounted on the object mounting device; and a control device, wherein the control device controls the measuring device to measure the first surface of the object, the second surface of which is supported by the plurality of support parts, and, after measuring the first surface of the object, controls the measuring device to measure the second surface of the object, the first surface of which is supported by the plurality of support parts, and, after measuring the second surface of the object, controls the processing device to process the second surface based on the measurement results of the first surface and the measurement results of the second surface.

[0005] According to a second aspect, there is provided a measurement device for measuring a plate-shaped object having a first surface and a second surface, the measurement device comprising a control device, the control device controlling the measurement of the first surface of the object, the second surface of which is supported by a plurality of support parts, and, after measuring the first surface of the object, controlling the measurement of the second surface of the object, the first surface of which is supported by the plurality of support parts.

[0006] According to a third aspect, there is provided a processing system for processing a plate-shaped object, comprising: an object mounting device capable of supporting the object on a plurality of support parts; a processing device that processes the object mounted on the object mounting device with processing light; a measuring device that measures the object mounted on the object mounting device; and a control device, wherein the control device processes the object using the processing device based on measurement results by the measuring device, and the control device changes the measurement accuracy of at least one of the first surface and the second surface by the measuring device depending on the support position of the object relative to the support parts.

[0007] According to a fourth aspect, there is provided a processing system for processing a plate-shaped object, which processes the object based on measurement values ​​obtained by measuring a first surface of the object while the object is supported on a plurality of support parts, and measurement values ​​obtained by measuring a second surface of the object, different from the first surface, of the object whose first surface is supported by the plurality of support parts after measuring the first surface of the object.

[0008] According to a fifth aspect, there is provided a processing system for processing a plate-shaped object, comprising: an object mounting device capable of supporting the object on a plurality of support parts so that the thickness direction of the object and the vertical direction are aligned; a processing device that processes the object mounted on the object mounting device with processing light; a measuring device that measures the object mounted on the object mounting device; and a control device, wherein the control device processes the object based on the results of measuring a first surface of the object supported by the plurality of support parts that faces upward and the results of measuring a second surface of the object that faces downward.

[0009] According to a sixth aspect, there is provided a processing method for processing a thin-plate-shaped object having a first surface and a second surface, the processing method including: placing the object on a plurality of supports of an object mounting device so that the second surface of the object is supported; measuring the first surface of the object while supported by the second surface to obtain a first measurement result; placing the object on a plurality of supports of the object mounting device so that the first surface of the object is supported; measuring the second surface of the object while supported by the first surface to obtain a second measurement result; and processing the object based on the first and second measurement results.

[0010] According to a seventh aspect, there is provided a processing method for processing a plate-shaped object having a first surface and a second surface, the processing method including measuring the first surface of the object, the second surface of which is supported by a plurality of support parts, and, after measuring the first surface of the object, measuring the second surface of the object, the first surface of which is supported by the plurality of support parts.

[0011] According to an eighth aspect, there is provided a processing method for processing a plate-shaped object having a first surface and a second surface, the processing method including: placing the object on a plurality of support parts of an object mounting device so that the second surface of the object is supported; measuring the object placed on the object mounting device; processing the object using a processing device based on the measurement results of the measured object; and changing the measurement accuracy of at least one of the first surface and the second surface depending on the support position of the object relative to the support parts.

[0012] According to a ninth aspect, there is provided a processing method for processing a plate-shaped object, the processing method including processing the object based on measurement values ​​obtained by measuring a first surface of the object while the object is supported on a plurality of supports, and measurement values ​​obtained by measuring a second surface, different from the first surface of the object, whose first surface is supported by the plurality of supports after measuring the first surface of the object.

[0013] According to a tenth aspect, there is provided a processing method for processing a plate-shaped object, the processing method including: supporting the object on a plurality of support parts of an object mounting device so that the thickness direction of the object and the vertical direction are aligned; measuring the object mounted on the object mounting device; and processing the object mounted on the object mounting device with processing light based on the results of measuring a first surface of the object supported by the plurality of support parts that faces upward and the results of measuring a second surface of the object that faces downward.

[0014] The functions and other advantages of the present invention will become apparent from the following detailed description of the preferred embodiments.

[0015] FIG. 1 is an external perspective view schematically showing the appearance of the processing system of the first embodiment. FIG. 2 is a system configuration diagram showing the system configuration of the processing system of the first embodiment. FIGS. 3(a) to 3(c) are cross-sectional views showing the removal processing performed on the workpiece. FIG. 4 is a perspective view schematically showing the structure of the irradiation optical system. FIG. 5 is a cross-sectional view schematically showing the placement operation and the first measurement operation. FIG. 6 is an explanatory diagram schematically showing the first calculation operation. FIG. 7 is a cross-sectional view schematically showing the re-placement operation and the second measurement operation. FIG. 8 is an explanatory diagram schematically showing the second calculation operation. FIGS. 9(a) and 9(b) are explanatory diagrams schematically explaining the method of support point inclination correction performed in the first calculation operation. FIGS. 10(a) to 10(c) are explanatory diagrams schematically explaining the method of positional deviation correction and plate thickness inclination correction performed in the second calculation operation. FIGS. 11(a) and 11(b) are explanatory diagrams schematically illustrating a method of support point tilt correction performed in the second calculation operation. FIG. 12 is a perspective view schematically illustrating a discrete measurement method. FIGS. 13(a) to 13(f) are explanatory diagrams schematically illustrating multiple examples of thinning patterns when performing discrete measurement. FIGS. 14(a) to 14(d) are contour maps showing the entire surface measurement data, quarter-thinned measurement data, curved surface approximation data, and approximation error difference data of an object according to a comparative example. FIGS. 14(e) to 14(h) are contour maps showing the entire surface measurement data, quarter-thinned measurement data, curved surface approximation data, and approximation error difference data of a workpiece according to the first embodiment. FIG. 15 is an explanatory diagram illustrating a method of calculating the surface shape of an object using curved surface approximation according to a comparative example. FIG. 16 is an explanatory diagram illustrating the method of calculating the surface shape of an object using curved surface approximation according to the first embodiment. 17(a) to 17(c) are explanatory diagrams showing a method for calculating the surface shape of an object according to a comparative example and the results thereof. FIGS. 18(a) to 18(c) are explanatory diagrams showing a method for calculating the surface shape of an object according to the first embodiment and the results thereof. FIGS. 19(a) to 19(c) are explanatory diagrams showing a method for calculating the surface shape of an object according to a modified example of the first embodiment and the results thereof.20(a) to 20(c) are explanatory diagrams showing a method for calculating the surface shape of an object according to another modification of the first embodiment and the results thereof. Fig. 21 is a flowchart showing the flow of operations of the processing system.

[0016] Hereinafter, with reference to the drawings, embodiments of a machining system, a measuring device, and a machining method will be described. Hereinafter, embodiments of a machining system, a measuring device, and a machining method using a machining system SYS that uses processing light EL to machine a workpiece W (an object in the claims) will be described. However, the present invention is not limited to the embodiments described below. In the following description, the positional relationships of various components constituting the machining system SYS will be described using an XYZ Cartesian coordinate system defined by mutually orthogonal X, Y, and Z axes. For convenience of explanation, the X-axis and Y-axis directions are each assumed to be horizontal directions (i.e., predetermined directions within a horizontal plane), and the Z-axis direction is assumed to be vertical (i.e., a direction perpendicular to the horizontal plane, essentially an up-down direction). Furthermore, the rotation directions around the X-axis, Y-axis, and Z-axis (in other words, tilt directions) will be referred to as the θX direction, the θY direction, and the θZ direction, respectively. Here, the Z-axis direction may be the direction of gravity. Furthermore, the XY plane may be assumed to be horizontal.

[0017] (1) Structure of the Machining System SYS First, the structure of the machining system SYS of the first embodiment will be described with reference to Fig. 1 and Fig. 2. Fig. 1 is an external perspective view that schematically shows the appearance of the machining system SYS of the first embodiment. Fig. 2 is a system configuration diagram that shows the system configuration of the machining system SYS of the first embodiment.

[0018] 1 and 2, the processing system SYS includes a processing apparatus 1, a measuring apparatus 2, a stage apparatus 3, and a control apparatus 4. The processing apparatus 1, the measuring apparatus 2, and the stage apparatus 3 are housed in a housing 5. However, the processing apparatus 1, the measuring apparatus 2, and the stage apparatus 3 do not have to be housed in the housing 5. In other words, the processing system SYS does not have to include a housing 5 that houses the processing apparatus 1, the measuring apparatus 2, and the stage apparatus 3. Note that, because a workpiece W as an object is placed on the stage apparatus 3, the stage apparatus 3 may also be referred to as an object placement device.

[0019] The processing device 1 is capable of processing a workpiece W under the control of the control device 4. The workpiece W is an object processed by the processing device 1. The workpiece W may be, for example, a metal or alloy (e.g., duralumin, etc.), a semiconductor (e.g., silicon), a resin, CFRP (Carbon Fiber Reinforced Plastic), a composite material thereof, or the like. Alternatively, the workpiece W may be an object made of glass, ceramics, or any other material.

[0020] In this embodiment, the workpiece W is a plate-like object having a first surface SU1 and a second surface SU2 opposite the first surface SU1. In particular, the workpiece W in this embodiment is a thin plate-like object in which the areas of the first surface SU1 and the second surface SU2 are very large relative to the plate thickness. For example, the longitudinal dimension of the first surface SU1 or the second surface SU2 of the workpiece W may be 10 times or more the plate thickness of the workpiece W. The workpiece W may be an object that bends when placed on the support members 38. More specifically, the workpiece W in this embodiment refers to an object that, when placed on four support members 38 spaced apart from each other by a predetermined distance or more, bends to the extent that it contacts all four support members 38. Note that a plate-like or thin plate-like object refers to an object that bends when placed on the support members 38, and is not limited to an object that is generally referred to as a plate or plate-like shape.

[0021] The machining system SYS is a system for performing high-precision three-dimensional measurements of the large-area, thin-plate-like workpiece W described above, and for machining the workpiece W based on the measurement results so that the top and bottom surfaces are highly parallel or the thickness is uniform. For this reason, the machining system SYS is required to measure information including the shape and thickness distribution of the workpiece W with high precision (hereinafter, sometimes simply referred to as the three-dimensional shape of the workpiece W). Furthermore, the machining device 1 machines the workpiece W based on the measurement results, for example, by removing thick portions of the workpiece W, so that the workpiece W has high parallelism.

[0022] The processing device 1 may perform removal processing by irradiating the workpiece W with processing light EL to remove a part of the workpiece W. The removal processing may include at least one of flattening, cylindrical processing, drilling, smoothing, cutting, and engraving (in other words, marking) to form (in other words, carve) any character or any pattern.

[0023] Here, an example of removal processing using the processing light EL will be described with reference to each of FIGS. 3(a) to 3(c). Each of FIGS. 3(a) to 3(c) is a cross-sectional view showing the removal processing performed on the workpiece W. As shown in FIG. 3(a), the processing device 1 irradiates the processing light EL onto a target irradiation area EA set (in other words, formed) on the surface of the workpiece W. When the processing light EL is irradiated onto the target irradiation area EA, the energy of the processing light EL is transmitted to the target irradiation area EA and a portion of the workpiece W adjacent to the target irradiation area EA. When heat resulting from the energy of the processing light EL is transmitted, the heat resulting from the energy of the processing light EL melts the material constituting the target irradiation area EA and a portion of the workpiece W adjacent to the target irradiation area EA. The melted material scatters as droplets. Alternatively, the melted material evaporates due to the heat resulting from the energy of the processing light EL. As a result, the target irradiation area EA and a portion of the workpiece W adjacent to the target irradiation area EA are removed. That is, as shown in FIG. 3B, a recess (in other words, a groove) is formed on the surface of the workpiece W. In this case, it can be said that the processing apparatus 1 processes the workpiece W using the principle of so-called thermal processing. Furthermore, the processing apparatus 1 moves the target irradiation area EA on the surface of the workpiece W using a galvanometer mirror 1212 (see FIG. 4), which will be described later. That is, the processing apparatus 1 scans the surface of the workpiece W with the processing light EL. As a result, as shown in FIG. 3C, at least a portion of the surface of the workpiece W is removed along the scanning trajectory of the processing light EL (i.e., the movement trajectory of the target irradiation area EA). Therefore, the processing apparatus 1 can appropriately remove the portion of the workpiece W that is to be removed by causing the processing light EL to scan the surface of the workpiece W along a desired scanning trajectory corresponding to the area to be removed.

[0024] On the other hand, depending on the characteristics of the processing light EL, the processing apparatus 1 may also process the workpiece W using the principle of non-thermal processing (e.g., ablation processing). That is, the processing apparatus 1 may perform non-thermal processing (e.g., ablation processing) on ​​the workpiece W. For example, when pulsed light having an emission time of picoseconds or less (or, in some cases, nanoseconds or femtoseconds or less) is used as the processing light EL, the material constituting the target irradiation area EA and the portion adjacent to the target irradiation area EA of the workpiece W instantaneously evaporates and scatters. Furthermore, when pulsed light having an emission time of picoseconds or less (or, in some cases, nanoseconds or femtoseconds or less) is used as the processing light EL, the material constituting the target irradiation area EA and the portion adjacent to the target irradiation area EA of the workpiece W may sublimate without passing through a molten state. Therefore, it is possible to form a recess (in other words, a groove) on the surface of the workpiece W while minimizing the effect of heat caused by the energy of the processing light EL on the workpiece W.

[0025] When performing removal processing, the processing device 1 may form a riblet structure on the workpiece W. The riblet structure may be a structure that can reduce the resistance of the surface of the workpiece W to the fluid (particularly, at least one of frictional resistance and turbulent frictional resistance). The riblet structure may include a structure that can reduce noise generated when the fluid and the surface of the workpiece W move relative to each other. The riblet structure may include, for example, a structure in which grooves extending in a first direction (e.g., the Y-axis direction) along the surface of the workpiece W are arranged in a plurality of rows along a second direction (e.g., the X-axis direction) that is along the surface of the workpiece W and intersects the first direction.

[0026] When performing removal processing, the processing device 1 may form an arbitrary structure having an arbitrary shape on the surface of the workpiece W. One example of the arbitrary structure is a structure that generates vortices in the flow of a fluid on the surface of the workpiece W. Another example of the arbitrary structure is a structure that imparts hydrophobic properties to the surface of the workpiece W. Another example of the arbitrary structure is a regularly or irregularly formed fine texture structure (typically an uneven structure) on the order of micrometers or nanometers. Such a fine texture structure may include at least one of a shark skin structure and a dimple structure that have the function of reducing resistance due to a fluid (gas and / or liquid). The fine texture structure may also include a lotus leaf surface structure that has at least one of a liquid-repellent function and a self-cleaning function (e.g., has the lotus effect). The fine texture structure may include at least one of a micro-protrusion structure having a liquid transport function (see U.S. Patent Publication No. 2017 / 0044002), a concave-convex structure having a lyophilic function, a concave-convex structure having an anti-fouling function, a moth-eye structure having at least one of a reflectance reducing function and a liquid repellent function, a concave-convex structure that exhibits a structural color by intensifying only light of a specific wavelength through interference, a pillar array structure having an adhesive function utilizing van der Waals forces, a concave-convex structure having an aerodynamic noise reducing function, a honeycomb structure having a droplet collecting function, and a concave-convex structure that improves adhesion with a layer formed on the surface.

[0027] As shown in FIGS. 1 and 2, in order to process a workpiece W, the processing device 1 includes a processing light source 11, a processing head 12, a head drive system 13, and a position measurement device 14.

[0028] The processing light source 11 emits, for example, at least one of infrared light, visible light, ultraviolet light, and extreme ultraviolet light as the processing light EL. However, other types of light may be used as the processing light EL. The processing light EL may include pulsed light (i.e., multiple pulse beams). The processing light EL may be laser light. In this case, the processing light source 11 may include a laser light source (e.g., a semiconductor laser such as a laser diode (LD)). The laser light source may include at least one of a fiber laser, a CO2 laser, a YAG laser, an excimer laser, etc. However, the processing light EL does not have to be laser light. The processing light source 11 may include any light source (e.g., at least one of an LED (Light Emitting Diode), a discharge lamp, etc.).

[0029] The machining head 12 irradiates the workpiece W with the machining light EL from the machining light source 11. For this reason, the machining head 12 may also be referred to as an irradiation device. In the example shown in FIG. 1 , a stage 32 on which the workpiece W can be placed is disposed below the machining head 12. For this reason, the machining head 12 irradiates the workpiece W with the machining light EL by emitting the machining light EL downward from the machining head 12. In order to irradiate the workpiece W with the machining light EL, the machining head 12 is equipped with an irradiation optical system 121. The irradiation optical system 121 will be described below with reference to FIG. 4. FIG. 4 is a cross-sectional view schematically showing the structure of the irradiation optical system 121.

[0030] As shown in FIG. 4 , the irradiation optical system 121 includes, for example, a focus-changing optical system 1211, a galvanometer mirror 1212, and an fθ lens 1213. The focus-changing optical system 1211 is an optical element that can change the focus position of the processing light EL (i.e., the convergence position of the processing light EL) along the traveling direction of the processing light EL. For this reason, the focus-changing optical system 1211 may also be referred to as a beam convergence position changing element. The focus-changing optical system 1211 may include, for example, multiple lenses aligned along the traveling direction of the processing light EL. In this case, the focus position of the processing light EL may be changed by moving at least one of the multiple lenses along its optical axis direction.

[0031] The processing light EL that passes through the focus change optical system 1211 is incident on the galvanometer mirror 1212. The galvanometer mirror 1212 deflects and scans the processing light EL (i.e., changes the emission angle of the processing light EL), thereby changing the emission direction of the processing light EL from the galvanometer mirror 1212. For this reason, the galvanometer mirror 1212 may be referred to as an emission direction changing member. When the emission direction of the processing light EL from the galvanometer mirror 1212 is changed, the position from which the processing light EL is emitted from the processing head 12 is changed. When the position from which the processing light EL is emitted from the processing head 12 is changed, the irradiation position of the processing light EL on the surface of the workpiece W is changed. Therefore, the galvanometer mirror 1212 can change (i.e., move) the irradiation position of the processing light EL on the surface of the workpiece W by deflecting and scanning the processing light EL. For this reason, the galvanometer mirror 1212 may be referred to as an irradiation position moving member.

[0032] The galvanometer mirror 1212 includes, for example, an X-scanning mirror 1212X and a Y-scanning mirror 1212Y. The X-scanning mirror 1212X and the Y-scanning mirror 1212Y are movable optical components arranged on the optical path of the processing light EL between the processing light source 11 and the fθ lens 1213. The X-scanning mirror 1212X and the Y-scanning mirror 1212Y are tilt-angle variable mirrors whose angles relative to the optical path of the processing light EL incident on each mirror can be changed. The X-scanning mirror 1212X reflects the processing light EL toward the Y-scanning mirror 1212Y. The X-scanning mirror 1212X can swing or rotate around a rotation axis along the Y-axis. By swinging or rotating the X-scanning mirror 1212X, the processing light EL scans the surface of the workpiece W along the X-axis direction. By swinging or rotating the X-scanning mirror 1212X, the target irradiation area EA moves on the surface of the workpiece W along the X-axis direction. The Y scanning mirror 1212Y reflects the processing light EL toward the fθ lens 1213. The Y scanning mirror 1212Y can swing or rotate around a rotation axis along the X axis. By swinging or rotating the Y scanning mirror 1212Y, the processing light EL scans the surface of the workpiece W along the Y axis direction. By swinging or rotating the Y scanning mirror 1212Y, the target irradiation area EA moves on the surface of the workpiece W along the Y axis direction.

[0033] Such a galvanometer mirror 1212 enables the processing light EL to scan a processing shot area PSA that is determined based on the processing head 12. In other words, the galvanometer mirror 1212 enables the target irradiation area EA to move within the processing shot area PSA that is determined based on the processing head 12. The processing shot area PSA indicates an area (in other words, a range) where processing is performed by the processing apparatus 1 while the positional relationship between the processing head 12 and the workpiece W is fixed (i.e., without change). Typically, the processing shot area PSA is set to coincide with or be narrower than the scanning range of the processing light EL deflected by the galvanometer mirror 1212 while the positional relationship between the processing head 12 and the workpiece W is fixed. If the processing shot area PSA is smaller than the portion of the workpiece W to be processed, the following operations are repeated: processing a portion of the workpiece W by scanning the processing shot area PSA set on that portion with the processing light EL; and changing the position of the processing shot area PSA on the workpiece W by changing the relative positional relationship between the processing head 12 and the workpiece W.

[0034] In addition to or instead of the galvanometer mirror 1212, the irradiation optical system 121 may include any optical element capable of deflecting and scanning the processing light EL (i.e., capable of changing at least one of the emission direction and irradiation position of the processing light EL). An example of such an optical element is a polygon mirror having multiple reflective surfaces with different angles. The polygon mirror is rotatable so as to change the angle of incidence of the processing light EL with respect to one reflective surface while the processing light EL is irradiated onto that reflective surface and to switch the reflective surface onto which the processing light EL is irradiated among the multiple reflective surfaces.

[0035] The fθ lens 1213 is an optical system for emitting the processing light EL from the galvanometer mirror 1212 toward the workpiece W. In particular, the fθ lens 1213 is an optical element that can focus the processing light EL from the galvanometer mirror 1212 on a focusing surface. For this reason, the fθ lens 1213 may be referred to as a focusing optical system. The focusing surface of the fθ lens 1213 may be set on, for example, the surface of the workpiece W. In this case, the fθ lens 1213 can focus the processing light EL from the galvanometer mirror 1212 on the surface of the workpiece W.

[0036] As shown in FIGS. 1 and 2 , the head drive system 13 moves the machining head 12 along at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction, and the θZ direction. FIG. 1 illustrates an example in which the head drive system 13 moves the machining head 12 along the Z-axis direction. In this case, the head drive system 13 may include, for example, a Z slider member 131 extending along the Z-axis direction. The Z slider member 131 is disposed on a support frame 6 that is disposed on a base plate 31 (described later) via a vibration isolation device. The support frame 6 may include, for example, a pair of leg members 61 that are disposed on the base plate 31 via a vibration isolation device and extend along the Z-axis direction, and a beam member 62 that is disposed on the pair of leg members 61 and extends along the X-axis direction to connect the upper ends of the pair of leg members 61. The Z slider member 131 is disposed on the beam member 62 via, for example, a support member 63 that extends along the Z-axis direction. The machining head 12 is connected to the Z slider member 131 so as to be movable along the Z slider member 131 .

[0037] When the machining head 12 moves, the positional relationship between the machining head 12 and the stage 32 (and further the workpiece W placed on the stage 32) changes. Therefore, moving the machining head 12 is equivalent to changing the positional relationship between the machining head 12 and the stage 32 and the workpiece W.

[0038] The position measurement device 14 is capable of measuring (in other words, detecting) the position of the machining head 12. The position measurement device 14 may include, for example, at least one of an encoder and a laser interferometer.

[0039] The measuring device 2 is capable of measuring the workpiece W under the control of the control device 4. In order to measure the workpiece W, the measuring device 2 includes a measuring head 21, a head drive system 22, and a position measuring device 23.

[0040] The measurement head 21 is capable of measuring the workpiece W under the control of the control device 4. For example, the measurement head 21 may be a device capable of measuring the state of the workpiece W. The state of the workpiece W may include the position of the workpiece W. The position of the workpiece W may include the position of the surface of the workpiece W. The position of the surface of the workpiece W may include the position of each surface portion obtained by dividing the surface of the workpiece W in at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction. The state of the workpiece W may include the shape (e.g., a three-dimensional shape) of the workpiece W. The shape of the surface of the workpiece W may include the shape of the surface of the workpiece W. In addition to or instead of the position of the surface of the workpiece W described above, the shape of the surface of the workpiece W may include the orientation of each surface portion obtained by dividing the surface of the workpiece W (e.g., the direction of the normal to each surface portion, which is substantially equivalent to the amount of inclination of each surface portion with respect to at least one of the X-axis, the Y-axis, and the Z-axis). Measurement information regarding the measurement results of the measurement head 21 is output from the measurement head 21 to the control device 4.

[0041] The measurement head 21 measures the workpiece W in units of a predetermined measurement shot area. A measurement shot area indicates an area (in other words, a range) where measurement is performed by the measurement head 21 while the positional relationship between the measurement head 21 and the workpiece W is fixed (i.e., without change). The measurement shot area may also be referred to as the measurable range or measurable field of the measurement head 21.

[0042] The measurement head 21 may measure the workpiece W in a non-contact manner, particularly optically. That is, the measurement head 21 may measure the workpiece W using any measurement beam such as measurement light. For example, the measurement head 21 may measure the workpiece W using a light-section method in which slit light is projected onto the surface of the workpiece W and the shape of the projected slit light is measured. For example, the measurement head 21 may measure the workpiece W using white light interferometry in which the interference pattern between white light that has passed through the workpiece W and white light that has not passed through the workpiece W is measured. For example, the measurement head 21 may measure the workpiece W using at least one of the following methods: a pattern projection method in which a light pattern is projected onto the surface of the workpiece W and the shape of the projected pattern is measured; a time-of-flight method in which light is projected onto the surface of the workpiece W and the distance to the workpiece W is measured from the time it takes for the projected light to return, and this is performed at multiple positions on the workpiece W; a moire topography method (specifically, a grating illumination method or a grating projection method); a holographic interferometry method; an autocollimation method; a stereo method; an astigmatism method; a critical angle method; a knife-edge method; an interferometry method; and a confocal method. For example, the measurement head 21 may measure the workpiece W by capturing an image of the workpiece W illuminated with illumination light. In either case, the measurement head 21 may include a light source that emits measurement light ML (e.g., slit light, white light, or illumination light) and a light receiver that receives light from the workpiece W irradiated with the measurement light ML (e.g., reflected light of the measurement light).

[0043] The head drive system 22 moves the measurement head 21 along at least one of the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction, and the θZ direction. Fig. 1 shows an example in which the head drive system 22 moves the measurement head 21 along the Z-axis direction. In this case, the head drive system 22 may include, for example, a Z slider member 221 extending along the Z-axis direction. The Z slider member 221 may be disposed on the beam member 62 via a support member 64 extending in the Z-axis direction. The measurement head 21 is connected to the Z slider member 221 so as to be movable along the Z slider member 221.

[0044] When the measurement head 21 moves, the positional relationship between the measurement head 21 and the stage 32 (and further the workpiece W placed on the stage 32) changes. Therefore, moving the measurement head 21 is equivalent to changing the positional relationship between the measurement head 21 and the stage 32 and the workpiece W.

[0045] The position measurement device 23 is capable of measuring (in other words, detecting) the position of the measurement head 21. The position measurement device 23 may include, for example, at least one of an encoder and a laser interferometer.

[0046] In this embodiment, the measuring device 2 is capable of measuring both of the following (i) and (ii): (i) at least one of the height H1 and position P1 of the first surface of the workpiece W; and (ii) at least one of the height H2 and position P2 of the second surface of the workpiece W.

[0047] The stage device 3 includes a base 31, a stage 32, a stage drive system 33, a position measurement device 34, and a light receiving device 35. The base 31 is disposed on the bottom surface of the housing 5 (or on a support surface such as the floor on which the housing 5 is placed). The stage 32 is disposed on the base 31. A vibration isolation device (not shown) may be installed between the base 31 and the bottom surface of the housing 5 or a support surface such as the floor on which the housing 5 is placed, in order to reduce transmission of vibration from the base 31 to the stage 32. Furthermore, the support frame 6 described above may be disposed on the base 31.

[0048] The stage 32 is a mounting device on which the workpiece W is placed. The stage 32 may be capable of holding the workpiece W placed on the stage 32. Alternatively, the stage 32 may not be capable of holding the workpiece W placed on the stage 32. In this case, the workpiece W may be placed on the stage 32 in a clampless manner.

[0049] In this embodiment, the stage 32 is provided with multiple support portions 38 (see also FIG. 5 ). The support portions 38 protrude upward from the stage 32 in the Z-axis direction. The support portions 38 may be configured with multiple pins, protrusions, or the like. For example, the support portions 38 may be configured to allow the workpiece W to be placed thereon and to prevent the workpiece W from shifting in position by suction. As another example, the support portions 38 may be pins capable of supporting the workpiece W at a point. Note that supporting the workpiece W at a point may include supporting the workpiece W with a pin having an upper surface that has a small area relative to the surface on which the workpiece W is placed (i.e., a small contact area with the workpiece W). The upper surface of the support portions 38 may be flat or curved. The stage 32 may further include guides (not shown) for preventing the workpiece W placed on the support portions 38 from shifting in position along the X-axis and Y-axis. The multiple support portions 38, guides, etc. may be attached to multiple ports (not shown) provided on the stage 32. The stage 32 may have multiple ports. In this case, the port to be used may be changed depending on the size of the workpiece W. A sealing plug may be attached to an unused port.

[0050] In this embodiment, the workpiece W is placed on the stage 32 via the support parts 38. In other words, the workpiece W is placed on the stage 32 without directly touching the stage 32. Therefore, at least three support parts 38 are provided. The number of support parts 38 may be four or more. The workpiece W is supported on the multiple support parts 38 so that the thickness direction of the workpiece W and the vertical direction are approximately aligned.

[0051] The stage drive system 33 moves the stage 32. For this reason, the stage drive system 33 may be referred to as a moving device. When the stage 32 moves, the workpiece W placed on the stage 32 also moves together with the stage 32. For this reason, it can be said that the workpiece W is movably placed on the stage 32 (specifically, the workpiece W is movably placed together with the stage 32). The stage drive system 33 moves the stage 32, for example, along at least one of the X-axis, Y-axis, Z-axis, θX direction, θY direction, and θZ direction. In the example shown in FIG. 1 , the stage drive system 33 moves the stage 32 along each of the X-axis and Y-axis. In this case, the stage drive system 33 may include, for example, an X-slide member 331 extending along the X-axis direction (two X-slide members 331 in the example shown in FIG. 1 ) and a Y-slide member 332 extending along the Y-axis direction (one Y-slide member 332 in the example shown in FIG. 1 ). The two X slide members 331 are arranged on the base 31 so as to be aligned along the Y-axis direction. The Y slide member 332 is connected to the two X slide members 331 so as to be movable along the two X slide members 331. The stage 32 is connected to the Y slide member 332 so as to be movable along the Y slide member 332. It can also be said that each of the X slide member 331 and the Y slide member 332 can function as a moving member that moves the stage 32 in a linear direction.

[0052] When the stage 32 moves, the positional relationships between the stage 32 and the workpiece W, and between the machining head 12 and the measurement head 21, respectively, change. Therefore, moving the stage 32 is equivalent to changing the positional relationships between the stage 32 and the workpiece W, and between the machining head 12 and the measurement head 21, respectively.

[0053] The position measurement device 34 is capable of measuring (in other words, detecting) the position of the stage 32. The position measurement device 34 may include, for example, at least one of an encoder and a laser interferometer.

[0054] The light receiving device 35 includes a light receiving portion capable of receiving the processing light EL from the processing head 12. Furthermore, the light receiving device 35 includes a measurement member that can be measured by the measurement head 21. The results of receiving the processing light EL by the light receiving device 35 and the results of measurement by the measurement head 21 of the light receiving device 35 are used to control the operation of the processing system SYS.

[0055] The control device 4 controls the operation of the machining system SYS. For example, the control device 4 may set machining conditions for the workpiece W and control the machining device 1 and the stage device 3 so that the workpiece W is machined in accordance with the set machining conditions.

[0056] The control device 4 controls the operation of the machining system SYS. The control device 4 may include, for example, an arithmetic device and a storage device. The arithmetic device may include, for example, at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). The storage device may include, for example, a memory. The control device 4 functions as a device that controls the operation of the machining system SYS by the arithmetic device executing a computer program. This computer program is a computer program for causing the arithmetic device to perform (i.e., execute) the operations to be performed by the control device 4, which will be described later. In other words, this computer program is a computer program for causing the control device 4 to function so as to cause the machining system SYS to perform the operations to be performed by the control device 4. The computer program executed by the arithmetic device may be recorded in a storage device (i.e., a recording medium) included in the control device 4, or may be recorded in any storage medium (e.g., a hard disk or semiconductor memory) built into or externally attachable to the control device 4. Alternatively, the computing device may download the computer program to be executed from a device external to the control device 4 via a network interface.

[0057] The control device 4 does not have to be provided inside the machining system SYS. For example, the control device 4 may be provided outside the machining system SYS as a server or the like. In this case, the control device 4 and the machining system SYS may be connected via a wired and / or wireless network (or a data bus and / or communication line). As the wired network, for example, a network using a serial bus interface represented by at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485, and USB may be used. As the wired network, a network using a parallel bus interface may be used. As the wired network, a network using an interface compliant with Ethernet (registered trademark) represented by at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T may be used. As the wireless network, a network using radio waves may be used. An example of a network using radio waves is a network compliant with IEEE 802.1x (e.g., at least one of a wireless LAN and Bluetooth (registered trademark)). A network using infrared rays may be used as the wireless network. A network using optical communication may be used as the wireless network. In this case, the control device 4 and the machining system SYS may be configured to be able to transmit and receive various information via the network. The control device 4 may also be able to transmit information such as commands and control parameters to the machining system SYS via the network. The machining system SYS may include a receiving device that receives information such as commands and control parameters from the control device 4 via the network. The machining system SYS may also include a transmitting device (i.e., an output device that outputs information to the control device 4) that transmits information such as commands and control parameters to the control device 4 via the network. Alternatively, a first control device that performs part of the processing performed by the control device 4 may be provided inside the machining system SYS, while a second control device that performs another part of the processing performed by the control device 4 may be provided outside the machining system SYS.

[0058] The recording medium for recording the computer program executed by the control device 4 may include at least one of the following: a CD-ROM, CD-R, CD-RW, a flexible disk, an MO, a DVD-ROM, a DVD-RAM, a DVD-R, a DVD+R, a DVD-RW, a DVD+RW, and an optical disk such as Blu-ray (registered trademark), a magnetic medium such as a magnetic tape, a magneto-optical disk, a semiconductor memory such as a USB memory, and any other medium capable of storing a program. The recording medium may also include a device capable of recording a computer program (e.g., a general-purpose device or a dedicated device in which a computer program is implemented in an executable state in at least one of software and firmware forms). Furthermore, each process or function included in the computer program may be realized by a logical processing block realized within the control device 4 when the control device 4 (i.e., a computer) executes the computer program, or by hardware such as a predetermined gate array (FPGA, ASIC) included in the control device 4, or may be realized in a form that combines logical processing blocks and partial hardware modules that realize some elements of the hardware.

[0059] (2) Operation of the Machining System SYS of the Present Embodiment Next, the operation of the machining system SYS will be described. As described above, the machining system SYS performs a measurement operation to measure the three-dimensional shape of, for example, a large-area, thin-plate-shaped workpiece W with high precision, and then performs a processing operation to process the workpiece W with high-precision parallelism by performing removal processing. Specifically, as a measurement operation, the machining system SYS first performs a placement operation to place the workpiece W on the multiple supports 38 of the stage device 3 so that the second surface SU2 of the workpiece W is supported. Note that "performing a placement operation" may include manual placement of the workpiece W by an operator, as described below, or automatic placement of the workpiece W by the machining system SYS or another device. Furthermore, the machining system SYS performs a first measurement operation to measure the first surface SU1 of the workpiece W while supported by the second surface SU2, and obtain a first measurement result 81. Furthermore, the machining system SYS performs a first calculation operation to calculate a three-dimensional shape PV1 of the first surface SU1 in an unloaded state, which will be described in detail later, based on the first measurement result 81 and an analysis result 89 that simulates the deflection amount SD1 of the workpiece W. Furthermore, after the first calculation operation, the machining system SYS performs a re-mounting operation to mount the workpiece W so that the multiple supports 38 of the stage device 3 support the first surface SU1 of the workpiece W. Furthermore, the machining system SYS performs a second measurement operation to measure the second surface SU2 of the workpiece W in a state in which the first surface SU1 is supported, and obtains a second measurement result 82. Furthermore, the machining system SYS performs a second calculation operation to calculate the three-dimensional shapes of the first surface SU1 and the second surface SU2 of the workpiece W in a state in which it is placed on the supports 38, based on the second measurement result 82 and an analysis result 89 that simulates the second deflection amount SD2 of the workpiece W. Furthermore, the machining system SYS performs a machining operation to machine the second surface SU2 of the workpiece W based on the first measurement result 81, the second measurement result 82, and the analysis result 89. Therefore, the placing operation, the first measurement operation, the first calculation operation, the re-placing operation, the second measurement operation, the second calculation operation, and the machining operation will be described in order below. Note that each operation described below may be executed (controlled) by the control device 4 of the machining system SYS, or may be executed (controlled) by a control device external to the machining system SYS that is connected to the machining system SYS.Furthermore, some of the operations described below may be executed (controlled) by the control device 4 of the machining system SYS, and the remaining parts may be executed (controlled) by an external control device.

[0060] (2-1) Placing Operation First, the placing operation for placing the workpiece W on the support members 38 of the stage device 3 will be described. FIG. 5 is a cross-sectional view schematically illustrating the placing operation and the first measurement operation. As shown in FIG. 5, in the placing operation, the workpiece W is placed on multiple (four in this embodiment) support members 38 of the stage device 3. The stage device 3 may be capable of supporting the first surface SU1 of the workpiece W on the multiple support members 38, and may also be capable of supporting the second surface SU2 of the workpiece W opposite the first surface SU1 on the multiple support members 38. In the placing operation, the second surface SU2 of the workpiece W is supported by the multiple support members 38, and the workpiece W is placed in an orientation such that the first surface SU1 of the workpiece W faces upward. When placed on the four support members 38, the workpiece W contacts all four support members 38. Ideally, the support members 38 are preferably considered to be support points 39. In other words, it is preferable that the contact area between the support portion 38 and the workpiece W is negligibly small relative to the area of ​​the workpiece W. The placing operation of placing the workpiece W on the support portion 38 may be performed manually by an operator, or may be performed automatically (mechanically) using a manipulator (not shown) or the like.

[0061] (2-2) First Measurement Operation In the first measurement operation, the measuring device 2 measures the first surface SU1 of the workpiece W, the second surface SU2 of which is supported by multiple supports 38. At this time, the measuring device 2 may also measure the positions of support points 39 of the multiple supports 38. The position of the support point 39 may be, for example, the center of the contact area between one support 38 and the workpiece W. The position of the support point 39 may be the height position in the Z-axis direction. The position of the support point 39 may also include positions in the X-axis direction and the Y-axis direction. In this case, the simulation parameter values ​​described below may be changed depending on the position of the support point 39, thereby enabling more accurate simulation. The measuring device 2 may also measure the shapes of the multiple supports 38. Although the term "support point 39" generally refers to a point, from a macroscopic perspective, the support surface of the support 38 (the surface of the portion in contact with the workpiece W) is a collection of "multiple points." Therefore, "measuring the position of the support point 39" may be synonymous with measuring the shape of the part of the support portion 38 that comes into contact with the workpiece W.

[0062] The control device 4 acquires a first measurement result 81 (first surface actual measurement value AM1), which is the measurement result of the first surface SU1 of the workpiece W measured by the first measurement operation. The first measurement result 81 includes information regarding the height H1 of the first surface SU1 of the workpiece W and the position P1 of the first surface SU1. The height H1 and position P1 of the first surface SU1 of the workpiece W may be the height and position at a single point on the surface of the workpiece W, or the height and position at multiple partial points. The height H1 and position P1 of the first surface SU1 of the workpiece W may be the height and position over almost the entire surface of the first surface SU1 of the workpiece W. The height H1 and position P1 of the first surface SU1 of the workpiece W may include positions in the X-axis direction, Y-axis direction, and Z-axis direction. The first measurement result 81 includes information representing the three-dimensional shape of the first surface SU1 of the workpiece W placed on the support portion 38. The first measurement result 81 may include information regarding the position, height, shape, etc. of the support portion 38. The control device 4 may be capable of outputting the acquired first measurement result 81. When the first measurement operation is completed, the three-dimensional shape of the first surface SU1 of the workpiece W placed on the support portion 38 is known. On the other hand, when the first measurement operation is completed, the three-dimensional shape of the second surface SU2 of the workpiece W is still unknown.

[0063] (2-3) First Calculation Operation FIG. 6 is an explanatory diagram schematically illustrating the first calculation operation. After the measurement of the first surface SU1 is completed by the first measurement operation, the machining system SYS then performs a first calculation operation. In the first calculation operation, the three-dimensional shape PV1 of the first surface SU1 in an unloaded state is calculated based on the first measurement result 81 and an analysis result 89 that simulates the deflection amount SD1 of the workpiece W. The unloaded state refers to a state in which no external forces, including gravity and reaction forces from the support portion 38, are acting on the workpiece W (no external forces are applied to the workpiece W). In the first calculation operation, the control device 4 performs a predetermined calculation process on the above-described first measurement operation to calculate (estimate / predict) the three-dimensional shape PV1 of the first surface SU1 of the workpiece W in an unloaded state.

[0064] Specifically, in the first calculation operation, the control device 4 first obtains an analysis result 89 regarding the deflection amount SD1 of the workpiece W by simulating the deflection amount SD1 of the workpiece W when the first surface SU1 of the workpiece W is supported by multiple support portions 38. The control device 4 calculates the analysis result 89 regarding the deflection amount SD1 of the workpiece W based on information about the support portions 38 measured by the measuring device 2. Here, the information about the support portions 38 measured by the measuring device 2 may include a third measurement result that is a result of measuring the positions of the multiple support points 39. The information about the support portions 38 measured by the measuring device 2 may include a fourth measurement result that is a result of measuring the shapes of the multiple support portions 38. The control device 4 may calculate the deflection amount SD1 of the workpiece W based on information regarding the positional relationship between the support portions 38 and the workpiece W and information about the workpiece W. The "information regarding the positional relationship between the support portions 38 and the workpiece W" may mainly be the positional relationship in the X-axis and Y-axis directions. The positional relationship between the support portion 38 and the workpiece W may be, for example, the positional relationship between the outer edge (edge) of the workpiece W and the support portion 38 (support point 39). The positional relationship between the support portion 38 and the workpiece W may also be the positional relationship between the center (or center of gravity) of the workpiece W and the support portion 38 (support point 39). If the workpiece W has a polygonal shape, the positional relationship between the support portion 38 and the workpiece W may also be the positional relationship between multiple corners of the workpiece W and the support portion 38 (support point 39).

[0065] At this time, the control device 4 may also calculate the deflection amount SD1 based on a predetermined ideal shape of the workpiece W. The "predetermined ideal shape of the workpiece W" refers to data of an object that imitates the workpiece W, which is the measurement target, that is pre-recorded in the memory unit of the control device 4. The data of the object that imitates the workpiece W includes information about the material of the workpiece W. The data of the object that imitates the workpiece W may be in a state in which deflection occurs due to the action of its own weight while being supported by the support parts 38. Furthermore, multiple types of deflection amount SD1 in the ideal shape of the workpiece W may be defined in advance, such as when the distance between the multiple support parts 38 is close, medium, or far.

[0066] Here, we will explain why the deflection amount SD1 is calculated based on a predetermined ideal shape of the workpiece W. Because the workpieces W actually measured have individual differences in plate thickness, size, etc. due to manufacturing errors, etc., the rigidity, distributed load due to their own weight, etc. differ depending on the workpiece W, and as a result, the deflection amount SD1 also differs from one workpiece W to another. However, if the shape of each workpiece W is reflected in the analysis, it would require a great deal of time and calculation, and there is a risk of reduced productivity. Therefore, in calculating the deflection amount SD1, it is possible to reduce the calculation time by calculating the deflection amount SD1 based on the ideal shape of the workpiece W rather than the actually measured workpiece W. Note that the difference in the analysis result 89 due to individual differences in the workpiece W may be determined by analyzing several possible patterns in advance and incorporating them into the data as processing error factors, so that a single analysis result 89 can be reused.

[0067] Next, the control device 4 calculates the three-dimensional shape of the first surface SU1 of the workpiece W in an unloaded state by dividing the deflection amount SD1 calculated by the simulation (analysis result 89) from the first measurement result 81, which is the measurement result of the first surface SU1 obtained in the first measurement operation. As a result, the three-dimensional shape PV1 of the first surface SU1 of the workpiece W in an unloaded state is made known. Note that in Figure 6, the parts of the workpiece W whose three-dimensional shape has become known by the first calculation operation are shown by solid lines, and the parts whose three-dimensional shape is not known are shown by dashed lines.

[0068] (2-4) Re-Placement Operation FIG. 7 is a cross-sectional view schematically illustrating the re-placing operation and the second measurement operation. After the first calculation operation is completed, the machining system SYS performs a re-placing operation. In the re-placing operation, the workpiece W is flipped upside down to place the workpiece W so that the multiple supports 38 of the stage device 3 support the first surface SU1 of the workpiece W. In the re-placing operation, similar to the placing operation, the workpiece W is placed on the multiple supports 38 of the stage device 3. The same supports 38 may be used in the placing operation and the re-placing operation. In the re-placing operation, the first surface SU1 of the workpiece W is supported by the multiple supports 38, and the workpiece W is placed in an orientation such that the second surface SU2 of the workpiece W faces upward. When placed on the four supports 38, the workpiece W comes into contact with all four supports 38. The re-placing operation may be performed manually by an operator, or may be performed automatically (mechanically) using a manipulator (not shown) or the like. When flipping the workpiece W, the workpiece W may be re-placing so that it is flipped over to a desired position. The desired position may be, for example, a position corresponding to the support point 39 when the second surface SU2 is supported by the support portion 38 in the placing operation. The position of the support point 39 in the re-placing operation may be a random position. In this case, position correction may be performed using simulation in the second calculation operation described below.

[0069] (2-5) Second Measurement Operation As shown in Fig. 7, the second measurement operation measures the second surface SU2 of the workpiece W in a state in which the first surface SU1 is supported by the multiple supports 38 during the re-placing operation. At this time, the measuring device 2 may measure the positions of the support points 39 of the multiple supports 38. The measuring device 2 may measure the positional relationship between the multiple supports 38 and the workpiece W. The measuring device 2 may measure the position and outer shape of the outer periphery of the workpiece W.

[0070] The control device 4 acquires a second measurement result 82 (second surface actual measurement value AM2), which is the measurement result of the second surface SU2 of the workpiece W measured by the second measurement operation. The second measurement result 82 includes information regarding the height H2 of the second surface SU2 of the workpiece W and the position P2 of the second surface SU2. The height H2 of the second surface SU2 of the workpiece W and the position P2 of the second surface SU2 may be the height and position at a single point on the surface of the workpiece W, or the height and position at multiple partial points. The height H2 of the second surface SU2 of the workpiece W and the position P2 of the second surface SU2 may be the height and position over almost the entire surface of the second surface SU2 of the workpiece W. The height H2 of the second surface SU2 of the workpiece W and the position P2 of the second surface SU2 may include positions in the X-axis direction, Y-axis direction, and Z-axis direction. The second measurement result 82 includes information representing the three-dimensional shape of the second surface SU2 of the workpiece W placed on the support portion 38. The second measurement result 82 may include information regarding the position, height, shape, etc. of the support parts 38. The control device 4 may be capable of outputting the acquired second measurement result 82. Therefore, when the second measurement operation is completed, the three-dimensional shape of the second surface SU2 of the workpiece W in a state in which the first surface SU1 is supported by the multiple support parts 38 is known.

[0071] (2-6) Second Calculation Operation Figure 8 is an explanatory diagram showing a schematic diagram of the second calculation operation. After the measurement of the second surface SU2 is completed by the second measurement operation, the machining system SYS then performs a second calculation operation. In the second calculation operation, the three-dimensional shapes of the first surface SU1 and the second surface SU2 of the workpiece W are calculated when the first surface SU1 is placed on the support part 38, and further the machining target surface SUT is calculated.

[0072] First, in the second calculation operation, the control device 4 simulates the amount of deflection of the workpiece W when the workpiece W is supported upside down by the multiple supports 38 so that the second surface SU2 faces upward, thereby acquiring an analysis result 89 regarding the amount of deflection of the workpiece W. Specifically, the control device 4 calculates the analysis result 89 regarding the second amount of deflection SD2 of the workpiece W based on information regarding the positional relationship between the supports 38 and the workpiece W when the workpiece W is supported upside down by the multiple supports 38 so that the second surface SU2 faces upward, and information regarding the workpiece W. The control device 4 may calculate the second amount of deflection SD2 of the workpiece W based on information regarding the positional relationship between the supports 38 and the workpiece W and information regarding the workpiece W. As in the first calculation operation, the "information regarding the positional relationship between the supports 38 and the workpiece W" may mainly refer to the positional relationship in the X-axis and Y-axis directions. The positional relationship between the supports 38 and the workpiece W may be, for example, the positional relationship between the outer edge (edge) of the workpiece W and the support 38 (support point 39). The positional relationship between the support portion 38 and the workpiece W may be the positional relationship between the center (or center of gravity) of the workpiece W and the support portion 38 (support point 39). If the workpiece W has a polygonal shape, the positional relationship between the support portion 38 and the workpiece W may be the positional relationship between multiple corners of the workpiece W and the support portion 38 (support point 39). Also in this case, the control device 4 may calculate the second deflection amount SD2 based on a preset ideal shape of the workpiece W.

[0073] Next, the control device 4 calculates the three-dimensional shape of the first surface SU1 of the workpiece W in a state where the second surface SU2 is supported facing upward by adding the second deflection amount SD2 calculated by simulation to a surface obtained by inverting the three-dimensional shape PV1 of the first surface SU1 of the workpiece W in an unloaded state obtained in the first calculation operation. As a result, the three-dimensional shape of the first surface SU1, which is the lower surface, is known in a state where the second surface SU2 is supported upside down by the multiple supports 38 so that the second surface SU2 faces upward. Furthermore, by the second measurement operation, the three-dimensional shape of the second surface SU2, which is the upper surface (second surface actual measurement value AM2), is known in a state where the second surface SU2 is supported upside down by the multiple supports 38 so that the second surface SU2 faces upward. As a result, the control device 4 calculates the thickness distribution of the workpiece W when it is supported upside down by multiple support parts 38 so that the second surface SU2 faces upward, based on the known values ​​of the top and bottom surfaces of the workpiece W (i.e., the first surface actual measurement value AM1 and the second surface actual measurement value AM2).

[0074] Furthermore, the control device 4 sets a position offset by a predetermined amount (upward in this embodiment) from the calculated shape of the first surface SU1 as the machining target surface SUT. Note that in Figures 7 and 8, the set machining target surface SUT is indicated by a two-dot chain line. Note that the magnitude of the offset amount may be changeable for each workpiece W, for example.

[0075] (2-7) Machining Operation As shown in Fig. 7, the machining system SYS performs a machining operation after the machining target surface SUT is set by the second calculation operation. In the machining operation, the control device 4 causes the machining device 1 to machine the second surface SU2 so that the second surface actual measurement value AM2 obtained by measuring the second surface SU2 of the workpiece W in a state where the second surface SU2 is supported so that the second surface SU2 faces upward coincides with the machining target surface SUT. In the machining operation, after measuring the second surface SU2, the machining device 1 machines the second surface SU2 based on the first measurement result 81, which is the measurement result of the first surface SU1, the second measurement result 82, which is the measurement result of the second surface SU2, and the analysis result 89. The machining of the second surface SU2 in the machining operation may be performed based on at least one of an analysis result 89 simulating an amount of deflection SD1 of the workpiece W when the first surface SU1 of the workpiece W is supported by the plurality of support portions 38 and an analysis result 89 simulating a second amount of deflection SD2 of the workpiece W when the second surface SU2 of the workpiece W is supported by the plurality of support portions 38. The control device 4 may machine the workpiece W based on a measurement value (first surface actual measurement value AM1) obtained by measuring the first surface SU1 of the workpiece W in a state where the workpiece W is supported on the plurality of support portions 38, and a measurement value (second surface actual measurement value AM2) obtained by measuring the second surface SU2 of the workpiece W whose first surface SU1 is supported by the plurality of support portions 38 after measuring the first surface SU1 of the workpiece W. The control device 4 may process the workpiece W based on the first measurement result 81, the second measurement result 82, the analysis result 89, and a third measurement result in which the positions of the plurality of support portions 38 (support points 39) are measured. The control device 4 may process the workpiece W based on the first measurement result 81, the second measurement result 82, the analysis result 89, and a fourth measurement result in which the shapes of the plurality of support portions 38 are measured.

[0076] In the machining operation, machining of the second surface SU2 may be performed while maintaining the support state of the first surface SU1 by the multiple support portions 38 when measuring the second surface SU2 in the second measurement operation. In other words, the support state of the first surface SU1 by the multiple support portions 38 when machining the second surface SU2 in the machining operation does not have to change from the support state of the first surface SU1 by the multiple support portions 38 when measuring the second surface SU2. Or, this can be rephrased as follows. That is, after measuring the second surface SU2, the machining operation may be performed without separating the first surface SU1 and the multiple support portions 38. Alternatively, the contact positions of the multiple support portions 38 within the first surface SU1 may be the same when measuring the second surface SU2 and when machining the second surface SU2.

[0077] (2-8) Summary of Operation of the Machining System SYS Figure 21 is a flowchart showing the operation of the machining system SYS described above. The operations related to the control device 4 of the machining system SYS of this embodiment, as shown in (2-1) to (2-7) above, are summarized as follows. That is, this flow begins when the user turns on the power of the device. When the flow begins, in the machining system SYS, as shown in step S01, the user inputs to the control device 4 the simulation results (DATA1) of the deflection shape when the workpiece W is supported at four support points so that the first surface SU1 faces upward, which were calculated in advance using another personal computer or the like. That is, the control device 4 receives the simulation results (DATA1) of the deflection shape. Note that the simulation results (DATA1) may be calculated by another personal computer or the like as described above and then input by the user, or may be calculated within the control device 4 in step S01. Next, as shown in step S02, the control device 4 controls the measurement device 2 to measure the three-dimensional shape of the first surface SU1, and the measurement results (DATA2) of the three-dimensional shape of the first surface SU1 are input from the measurement device 2 to the control device 4. That is, the control device 4 receives the measurement results (DATA2). Next, as shown in step S03, the control device 4 performs deflection correction using the input simulation results (DATA1) to generate no-load data (DATA3) of the first surface SU1. Next, as shown in step S04, the control device 4 generates data (DATA4) by inverting the no-load data (DATA3) of the first surface SU1 generated in step S03 about the X-axis. Next, as shown in step S05, the control device 4 generates load data (DATA5) of the first surface SU1 using the simulation results (DATA1) obtained in step S01 and the data (DATA4) inverted in step S04. Next, as shown in step S06, the control device 4 inputs the measurement results (DATA6) of the three-dimensional shape of the second surface SU2 while supporting the workpiece W so that the second surface SU2 faces upward.Next, as shown in step S07, the control device 4 outputs a machining amount (DATA7), which is a target amount for the machining to be performed, based on the load data (DATA5) of the first surface SU1 obtained in step S05 and the measurement results (DATA6) of the second surface SU2 obtained in step S06. At this time, the machining amount (DATA7) is determined so that the thickness of the workpiece W at each XY point is uniform. Next, as shown in step S08, the control device 4 outputs machining control information (DATA8) based on the machining amount (DATA7) obtained in step S07. Thereafter, as shown in step S09, the control device 4 controls the machining device 1 to perform machining of the second surface SU2 based on this machining control information (DATA8). This achieves machining that results in a uniform thickness of the workpiece W. Furthermore, this flow ends when the user turns off the power to the device.

[0078] (3) Other Operations of the Machining System SYS Next, other operations performed by the machining system SYS other than those described above will be described. Between the placement operation and the machining operation, the machining system SYS performs various corrections, approximations, and the like in addition to the deflection correction described above. Specifically, in the first calculation operation and the second calculation operation, the machining system SYS performs support point inclination correction to correct inclination due to variations in height of the multiple supports 38 (support points 39). Furthermore, the machining system SYS performs positional deviation correction to correct positional deviation (including rotational deviation) caused by turning over the workpiece W in the re-placing operation. Furthermore, the machining system SYS performs thickness inclination correction to correct inclination due to uneven thickness of the workpiece W. Furthermore, in the first measurement operation and the second measurement operation, the machining system SYS performs discrete measurement to reduce measurement time by thinning out measurement points. Furthermore, in order to calculate the three-dimensional shape of each face of the workpiece W in the first calculation operation and the second calculation operation, the machining system SYS divides the surface of the workpiece W into a plurality of regions and performs surface approximation for each divided region 55. Furthermore, during surface approximation, the machining system SYS performs weighted synthesis at boundary portions 57 of the divided regions 55. For this reason, support point tilt correction, positional deviation correction, plate thickness tilt correction, discrete measurement, surface approximation, and weighted synthesis will be described below in this order. Note that the machining system SYS may perform any one of support point tilt correction, positional deviation correction, plate thickness tilt correction, discrete measurement, surface approximation, and weighted synthesis, or may not perform any of these.

[0079] (3-1) Support Point Tilt Correction First, support point tilt correction will be described. Support point tilt correction is performed in each of the first and second calculation operations. In support point tilt correction, the tilt of the workpiece W due to variations in the heights of the multiple supports 38 (support points 39) is corrected. FIGS. 9(a) and 9(b) are explanatory diagrams schematically illustrating the method of support point tilt correction performed in the first calculation operation. FIG. 9(b) shows the state after support point tilt correction has been performed from the state shown in FIG. 9(a). As shown in FIGS. 9(a) and 9(b), in support point tilt correction in the first calculation operation, the control device 4 first calculates a plane A that minimizes the distance from the four support points 39 based on the positions of the four support points 39 (position coordinates including the X-axis, Y-axis, and Z-axis). Plane A may be calculated using the least squares method. Plane A may also be calculated so as to minimize the average value of the distances from the four support points 39. Next, the control device 4 moves the calculated plane A to a position where it is parallel to the X-axis and Y-axis and where the height in the Z-axis direction is zero, and corrects the measured position of the first surface SU1 of the workpiece W (including the positions in the X-axis, Y-axis, and Z-axis directions) accordingly.

[0080] (3-2) Position Misalignment Correction and Thickness Inclination Correction Figures 10(a) to 10(c) are explanatory diagrams each schematically illustrating the method of position misalignment correction and thickness inclination correction performed in the second calculation operation. Note that Figure 10(a) shows the state after deflection correction has been performed from the state of Figure 9(b). Figure 10(b) shows the state when the workpiece W is flipped over so that the second surface SU2 faces upward, compared to the state of Figure 10(a) in which the first surface SU1 faces upward. Figure 10(c) shows the state after thickness inclination correction has been performed from the state of Figure 10(b). Position misalignment correction corrects the position misalignment of the workpiece W caused by flipping the workpiece W during the re-mounting operation. "Position misalignment" may include rotational misalignment along the XY plane of the workpiece W in a plan view of the workpiece W. In the second measurement operation, the measuring device 2 measures the position of the workpiece W, for example, by detecting the edge of the workpiece W. The control device 4 corrects the position of the workpiece W so that the position of the edge of the turned over workpiece W coincides with the position of the edge of the workpiece W before turning over.

[0081] As shown in Figures 10(b) and 10(c), thickness inclination correction corrects the inclination due to uneven thickness of the workpiece W. Specifically, in thickness inclination correction, after positional deviation correction, plane B is first calculated based on the thickness of the workpiece W at the positions of the four support points 39 (including the position coordinates of the X-axis and Y-axis). Plane B may be calculated using the least squares method. Next, the control device 4 moves the calculated plane B to a position where it is parallel to the X-axis and Y-axis and where the height in the Z-axis direction is zero, and corrects the measured position of the second surface SU2 of the workpiece W (including the positions in the X-axis, Y-axis, and Z-axis directions) accordingly. As a result, as shown in Figure 10(c), the support height (height along the Z-axis direction) of the first surface SU1 after inversion is set to zero.

[0082] Furthermore, after deflection correction is performed in the second calculation operation, support point inclination correction is performed again. Figures 11(a) and 11(b) are explanatory diagrams schematically illustrating the method of support point inclination correction performed in the second calculation operation. Figure 11(a) shows the state after deflection correction has been performed from the state of Figure 10(c). Figure 11(b) shows the state after support point inclination correction has been performed from the state of Figure 11(a). As shown in Figures 11(a) and 11(b), in the support point inclination correction of the second calculation operation, the control device 4 corrects the first surface SU1 so that it coincides with the position of the support point 39.

[0083] (3-3) Discrete Measurement Next, the discrete measurement performed by the machining system SYS will be described. FIG. 12 is a perspective view that schematically illustrates the discrete measurement method. The shaded areas in FIG. 12 indicate points measured by the discrete measurement. As shown in FIG. 12, in the first measurement operation and the second measurement operation, the control device 4 causes the measurement device 2 to discretely measure the surface (surface to be measured) of the workpiece W. FIG. 12 shows an example of discrete measurement when a quarter-thinning-out measurement is performed. When a quarter-thinning-out measurement is performed, it is possible to reduce the measurement time to 1 / 12 compared to when the entire surface is measured, for example. Note that the thinning rate, i.e., the distance between points measured in the discrete measurement, is not limited to the quarter-thinning-out measurement described above.

[0084] The control device 4 may change the measurement accuracy of at least one of the first surface SU1 and the second surface SU2 measured by the measuring device 2 depending on the support position of the workpiece W relative to the support portion 38. Here, when the workpiece W is supported with the first surface SU1 facing upward, a support position on the surface of the second surface SU2 of the workpiece W that corresponds to the support portion 38 is defined as a first position 41. The position opposite to the first position 41, i.e., the support position on the surface of the first surface SU1 of the workpiece W that corresponds to the support portion 38, is defined as a second position 42. A position on the first surface SU1 of the workpiece W that is different from the second position 42 is defined as a third position 43. In this case, the measurement accuracy of a first region 51 including the second position 42 (first measurement accuracy in the claims) may be higher than the measurement accuracy of a second region 52 including a third position 43 different from the second position 42 (second measurement accuracy in the claims). The distance between the first position 41 and the second position 42 may be shorter than the distance between the first position and the third position 43. In other words, the control device 4 may control the measuring device 2 to discretely measure the surface of the workpiece W, and to measure the second position 42 with higher resolution compared to the third position 43. The control device 4 may control the measuring device 2 to discretely measure the surface of the workpiece W, and to measure the second position 42 with higher density compared to the third position 43. The control device 4 may control the measuring device 2 to discretely measure the surface of the workpiece W, and to measure the support portion corresponding region 40 (first region 51) of the workpiece W that corresponds to the support portion 38 with higher density compared to the region other than the support portion corresponding region 40 (second region 52).

[0085] 13( a ) to 13 ( f ) are explanatory diagrams schematically illustrating multiple examples of thinning patterns when performing discrete measurement. As shown in FIG. 13( a ), the control device 4 may perform grid-patterned ½-thinning measurement as discrete measurement. As shown in FIG. 13( b ), the control device 4 may perform houndstooth-patterned discrete measurement. As shown in FIG. 13( c ), the control device 4 may perform discrete measurement that combines houndstooth-patterned discrete measurement and ½-thinning measurement. As shown in FIG. 13( d ), the control device 4 may perform discrete measurement by performing full-circumference measurement at the outer edge of the workpiece W and grid-patterned ½-thinning measurement at the center of the workpiece W. As shown in FIG. 13( e ), the control device 4 may perform full-circumference measurement at the outer edge of the workpiece W and houndstooth-patterned discrete measurement at the center of the workpiece W. As shown in FIG. 13( f), the control device 4 may perform a full circumference measurement at the outer edge of the workpiece W, and a discrete measurement that combines a houndstooth pattern discrete measurement and a 1 / 2 thinned-out measurement at the center of the workpiece W.

[0086] (3-4) Surface Approximation Next, we will explain the surface approximation performed by the machining system SYS. FIGS. 14(a) to 14(d) are contour maps showing the entire surface measurement data, quarter-thinned measurement data, curved surface approximation data, and approximation error difference data of an object according to a comparative example. FIGS. 14(e) to 14(h) are contour maps showing the entire surface measurement data, quarter-thinned measurement data, curved surface approximation data, and approximation error difference data of a workpiece W according to the first embodiment. FIGS. 14(a) and 14(e) show the results of measuring the entire surface of a workpiece W using a method different from that of this embodiment, i.e., the three-dimensional shape of the workpiece W measured without performing surface approximation. FIGS. 14(b) and 14(f) show the measurement results of the workpiece surface obtained when the quarter-thinned measurement of this embodiment described above was performed on the same workpiece W. 14(c) and 14(g) show the three-dimensional shape of the workpiece W obtained when curved surface approximation is performed based on the images of FIGS. 14(b) and 14(f), i.e., the results of calculating the three-dimensional shape of the workpiece surface using the method of this embodiment. FIGS. 14(d) and 14(h) show the results of calculating the difference between the data of FIGS. 14(a) and 14(e) and the data of FIGS. 14(c) and 14(g). In FIGS. 14(d) and 14(h), the closer the difference is to zero, the closer the curved surface approximation is to the original three-dimensional shape of the workpiece W. The control unit performs curved surface approximation in the first and second calculation operations to calculate the three-dimensional shape of each surface of the workpiece W. In the curved surface approximation of this embodiment, as shown in FIG. 14(f), the surface of the workpiece W is divided into multiple regions, and curved surface approximation is performed for each divided region 55 to calculate the shape (three-dimensional shape) of the entire surface of the workpiece W. Although FIG. 14(f) shows an example in which the entire surface of the workpiece W is divided into 16 parts, the number of divisions is not limited to this.

[0087] As shown in Figures 14(b) to 14(d), in a comparative example in which the entire surface of the workpiece W is simultaneously processed using measurement points measured by a measuring device, a high-order approximation is required due to the large number of measurement points. On the other hand, as shown in Figures 14(f) to 14(h), in this embodiment in which curved surface approximation is performed for each divided region 55 of the surface of the workpiece W, the number of measurement points is relatively small, so curved surface approximation is performed using a low-order approximation, thereby making it possible to calculate the three-dimensional shape of the surface of the workpiece W. Furthermore, comparing Figures 14(d) and 14(h), in this embodiment in which curved surface approximation is performed for each divided region 55, the error (difference) between the three-dimensional shape of the workpiece W obtained by curved surface approximation and the entire surface measurement data is smaller than in the comparative example in which curved surface approximation is performed without division.

[0088] FIG. 15 is an explanatory diagram showing a comparative example of a method for calculating the surface shape of a workpiece W using curved surface approximation. FIG. 16 is an explanatory diagram showing a comparative example of a method for calculating the surface shape of a workpiece W using curved surface approximation. The circles in FIG. 15 indicate measurement results of the workpiece W surface. The curves in FIG. 15 indicate fitting data calculated based on the measurement data. The squares in FIG. 15 indicate the difference between the measurement data and the fitting data. The black circles in FIG. 16 indicate measurement results of the workpiece W surface. The white circles in FIG. 16 indicate measurement data that has been weighted and corrected so that the apparent error is large. The solid line in FIG. 16 indicates fitting data calculated based on the weighted and corrected measurement data. In the comparative example, as shown in the left half of FIG. 15, when the amount of change between adjacent measurement data is small, the difference between the measurement data and the fitting data is small. On the other hand, as shown in the right half of FIG. 15, when the amount of change between adjacent measurement data is large, the difference between the measurement data and the fitting data is likely to be large. As a result, in the comparative example, there was a risk of unevenness in the difference, as shown in Figure 14 (d), which shows the difference between the three-dimensional shape of the workpiece W calculated by high-order approximation and the actual three-dimensional shape of the workpiece W.

[0089] As shown in FIG. 16 , in this embodiment, the control device 4 calculates the three-dimensional shape of the workpiece W surface by performing a curved surface approximation using multiple actual measurement points on the surface of the workpiece W. This curved surface approximation may use the least squares method. In the curved surface approximation, the least squares method is used to weight prominent data with large variations in the measurement data, thereby calculating an approximate equation that minimizes the sum of squares of the errors between each measurement data and the approximate equation (the straight line in FIG. 16 ). As a result, as shown in FIG. 16 from the dashed line to the solid line, the approximate equation is calculated to move closer to the prominent measurement data with large variations. As a result, as shown in FIG. 14( h ), the difference is less likely to be uneven (the difference is smaller) compared to the comparative example, allowing for more accurate determination of the three-dimensional shape of the workpiece W surface. Note that the data in FIG. 14( h ) shows the results of weighting at the boundary portions between the divided regions 55 (described later) in addition to the weighting used in the curved surface approximation.

[0090] (3-5) Weighted Combination Next, we will explain the weighted combination performed by the machining system SYS. The weighted combination is performed during the above-mentioned surface approximation. FIGS. 17(a) to 17(c) are explanatory diagrams showing a method for calculating the surface shape of an object according to a comparative example and the results thereof. FIGS. 18(a) to 18(c) are explanatory diagrams showing a method for calculating the surface shape of an object according to the first embodiment and the results thereof. In the comparative example, as shown in FIG. 17(a), after performing surface approximation on each of the divided regions 55, the data is connected at the boundary 57 between adjacent regions A1 and A2 without any special processing or correction. Then, as shown in FIG. 17(b), the three-dimensional shape of the entire workpiece W is calculated based on this data. As a result, as shown in FIG. 17(c), there was a risk of large errors at the boundary 57 between the multiple divided regions (5 x 5 in the comparative example).

[0091] Therefore, in this embodiment, as shown in FIG. 18( a), the control device 4 forms an overlapping region 58 by overlapping adjacent regions at a boundary 57 between the divided regions 55, and performs specific weighting synthesis in the overlapping region 58. Specifically, in the example shown in FIG. 18( a), the weighting coefficients of the heights of the approximated curved surfaces calculated for two adjacent regions A1 and A2 in the overlapping region 58 are set to 0.5 and added together. Then, as shown in FIG. 18( b), this process is performed for all divided regions 55 on the surface of the workpiece W to calculate the three-dimensional shape of the entire workpiece W. As a result, as shown in FIG. 18( c), the error at the boundary 57 between the multiple (9 × 9 in this embodiment) divided regions 55 can be reduced compared to the comparative example (see FIG. 17).

[0092] 19(a) to 19(c) are explanatory diagrams showing a method for calculating the surface shape of the workpiece W according to a modified example of the first embodiment and the results thereof. In the modified example of this embodiment shown in FIG. 19(a), the control device 4 may weight the overlapping region 58 so that the components of the two adjacent divided regions A1 and A2 increase as one moves from the other region A1 toward the other region A2. The control device 4 may also weight the overlapping region 58 so that the components of the other region A1 increase as one moves from the other region A2 toward the other region A1. Then, as shown in FIG. 19(b), this process is performed for all divided regions 55 on the surface of the workpiece W to calculate the 3D shape of the entire workpiece W. As a result, as shown in FIG. 19(c), the error at the boundary 57 of the multiple divided regions 55 (9 × 9 in this embodiment) can be further reduced compared to the comparative example.

[0093] 20(a) to 20(c) are explanatory diagrams showing a method for calculating the surface shape of the workpiece W according to another modification of the first embodiment and the results thereof. In the modification of this embodiment shown in FIG. 20(a), the control device 4 may weight the overlap region 58 so that the component of one of the two adjacent divided regions A1 and A2 increases as one moves from the other region A1 toward the other region A2. The control device 4 may also weight the overlap region 58 so that the component of one of the two adjacent divided regions A1 and A2 increases as one moves from the other region A2 toward the other region A1. Furthermore, the control device 4 may apply, at the end of the overlap region 58, the numerical value of the end of the overlap region 58 of the region A1 or the other region A2 that is closer. Then, as shown in FIG. 20(b), this process is performed for all divided regions 55 on the surface of the workpiece W to calculate the three-dimensional shape of the entire workpiece W. 20C, the error at the boundary portions 57 of the multiple (9×9 in this embodiment) divided regions 55 can be further reduced compared to the comparative example. Note that the number of divisions of the surface of the workpiece W is not limited to the above-mentioned 5×5 or 9×9.

[0094] (4) Technical Effects of the Machining System SYS of the Present Embodiment As described above, the machining system SYS and machining method of the present embodiment are a machining system SYS and machining method for machining a plate-shaped workpiece W, and include an object mounting device (stage device 3 of the embodiment) capable of supporting a first surface SU1 of the workpiece W on a plurality of supports 38 and a second surface SU2 different from the first surface SU1 on the plurality of supports 38, a machining device 1 that processes the workpiece W mounted on the object mounting device with processing light EL, a measuring device 2 that measures the workpiece W mounted on the object mounting device, and a control device 4. The control device 4 controls the measuring device 2 to measure the first surface SU1 of the workpiece W, the second surface SU2 of which is supported by the plurality of supports 38. After measuring the first surface SU1 of the workpiece W, the control device 4 controls the measuring device 2 to measure the second surface SU2 of the workpiece W, the first surface SU1 of which is supported by the plurality of supports 38. Furthermore, after measuring the second surface SU2 of the workpiece W, the control device 4 controls the processing device 1 to process the second surface SU2 based on the measurement results of the first surface SU1 and the measurement results of the second surface SU2. In this way, by measuring the first surface SU1 and the second surface SU2 of the workpiece W and processing (removal processing) the workpiece W based on the measurement results, the workpiece W can be machined into a desired shape. Conventionally, when removing a plate-shaped workpiece W, the workpiece W may be fixed to a jig with high-precision flatness using vacuum or magnetic force, for example, to force the workpiece W to warp before measurement and processing. In this case, the thickness distribution of the workpiece W is indirectly measured by measuring the jig alone and measuring the workpiece W after it is mounted. However, if particles such as dust or dirt are trapped between the workpiece W and the jig, the measurement results of the workpiece W may be partially offset, potentially preventing accurate thickness measurement. That is, the prior art had a problem in that it was not possible to accurately measure the three-dimensional shape of the workpiece W, including the plate thickness, particularly for a plate-shaped workpiece W that is prone to warping and distortion. According to the machining system SYS and machining method of the present embodiment, the workpiece W is measured in a state in which it is supported at points by placing the workpiece W on a plurality of supports 38, which makes it possible to reduce the influence of particles getting caught between the workpiece W and the jig.This suppresses a decrease in measurement accuracy due to particle entrapment, enabling the thickness and three-dimensional shape of the workpiece W to be measured with high precision. Furthermore, the machining system SYS measures the first surface SU1 and the second surface SU2 of the workpiece W, respectively, and machines the workpiece W based on the measurement results of the first surface SU1 and the second surface SU2. The three-dimensional shape of the workpiece W can be calculated by taking into account the measurement results of both surfaces of the workpiece W, such as deflection of the workpiece W due to supporting the workpiece W on the support portion 38. This makes it possible to accurately grasp the three-dimensional shape of the workpiece W, including the original warpage and thickness of the workpiece W, and to perform machining based on the calculated three-dimensional shape of the workpiece W. Therefore, the workpiece W can be machined with high precision.

[0095] The machining of the workpiece W is performed based on at least one of an analysis result 89 that simulates the amount of deflection SD1 of the workpiece W when the first surface SU1 of the workpiece W is supported by the plurality of support portions 38, and an analysis result 89 that simulates the amount of deflection SD1 of the workpiece W when the second surface SU2 of the workpiece W is supported by the plurality of support portions 38. By using the analysis result 89 that simulates the amount of deflection SD1 in this way, the three-dimensional shape of the workpiece W can be calculated with high precision, even when the workpiece W is supported at points (i.e., by the plurality of support portions 38) without being pressed against a planar jig as in the prior art.

[0096] The deflection amount SD1 of the workpiece W is calculated based on a predetermined ideal shape of the workpiece W. This can suppress a decrease in productivity compared to when measurement and machining are performed by updating analysis data for each of multiple workpieces W, each of which has individual differences in thickness, length, etc. Furthermore, multiple types of patterns may be analyzed in advance as differences (nominal standards) in simulation results for the deflection amount SD1 caused by variations in thickness, length, etc. of the workpiece W before machining, and variations in position when placed on the support portion 38, and the like, and the results may be incorporated as factors in the machining error of the workpiece W. In this case, a single analysis result 89 can be used when measuring and machining multiple workpieces W, thereby improving productivity.

[0097] The processing system SYS acquires measurement results of the first surface SU1 when the first surface SU1 is supported by multiple support parts 38 so that it faces upward, calculates the amount of deflection SD1 of the workpiece W based on information regarding the positional relationship between the support parts 38 and the workpiece W and information about the workpiece W, and calculates the shape of the first surface SU1 of the workpiece W in an unloaded state by dividing the calculated amount of deflection SD1 from the measurement results of the first surface SU1. Furthermore, the machining system SYS calculates a second deflection amount SD2 of the workpiece W based on information regarding the positional relationship between the support parts 38 and the workpiece W when the workpiece W is supported upside down by the multiple support parts 38 so that the second surface SU2 faces upward, and information regarding the workpiece W, and calculates the shape of the first surface SU1 when the workpiece W is supported so that the second surface SU2 faces upward by adding the shape of the first surface SU1 of the workpiece W in the unloaded state to the second deflection amount SD2, and sets a position offset by a predetermined amount from the calculated shape of the first surface SU1 as the machining target surface SUT. In this way, the shape of the first surface SU1 in the unloaded state is first calculated using the measurement results of the first surface SU1, and then the shape of the first surface SU1 in the supported state is calculated using the measurement results of the second surface SU2, so that the machining target surface SUT can be determined when the measurement of the second surface SU2 is completed. Therefore, by machining the second surface SU2 up to the machining target surface SUT while maintaining the posture of the workpiece W at the time the second surface SU2 was measured (a state in which the second surface SU2 is supported by the support portion 38 so that it faces upward), a workpiece W having a highly accurate and uniform plate thickness can be formed.

[0098] The measurement device 2 of this embodiment measures a plate-shaped workpiece W having a first surface SU1 and a second surface SU2, and includes a control device 4. The control device 4 controls the measurement of the first surface SU1 of the workpiece W, whose second surface SU2 is supported by a plurality of supports 38, and then controls the measurement of the second surface SU2 of the workpiece W, whose first surface SU1 is supported by a plurality of supports 38, after measuring the first surface SU1 of the workpiece W. By measuring the first surface SU1 and the second surface SU2 of the workpiece W in this manner, the three-dimensional shape of the workpiece W, including the thickness distribution, can be measured. Furthermore, since the workpiece W is measured while being supported at points by placing the workpiece W on the plurality of supports 38, the measurement is less susceptible to the influence of particles being trapped between the workpiece W and the jig. This suppresses degradation of measurement accuracy due to particle trapping, allowing the thickness and three-dimensional shape of the workpiece W to be measured with high accuracy. Furthermore, the measuring device 2 can calculate the three-dimensional shape of the workpiece W by taking into account the measurement results of both sides of the workpiece W, such as the deflection of the workpiece W caused by supporting the workpiece W on the support portion 38. This makes it possible to accurately grasp the three-dimensional shape of the workpiece W, including the original warpage and thickness of the workpiece W. Therefore, the three-dimensional shape of the workpiece W can be measured with high precision.

[0099] The machining system SYS and machining method of this embodiment are for machining a plate-shaped workpiece W, and include an object mounting device (stage device 3 in this embodiment) capable of supporting the workpiece W on a plurality of supports 38, a machining device 1 that processes the workpiece W mounted on the object mounting device with processing light EL, a measuring device 2 that measures the workpiece W mounted on the object mounting device, and a control device 4. The control device 4 causes the machining device 1 to machine the workpiece W based on the measurement results of the measuring device 2. The control device 4 changes the measurement accuracy of at least one of the first surface SU1 and the second surface SU2 measured by the measuring device 2 depending on the support position of the workpiece W relative to the support parts 38. In this way, by changing the measurement level depending on the support position of the workpiece W relative to the support parts 38, measurement by the machining system SYS can be performed efficiently. For example, when measuring a large-area workpiece W, the time required for measurement can be reduced by discretely measuring the surface of the workpiece W.

[0100] Furthermore, by measuring the area of ​​the workpiece W corresponding to the support portion 38 (support portion corresponding area 40) at a higher density than areas other than the support portion corresponding area 40, it is possible to obtain more data on the portion of the workpiece W where the amount of displacement in the height direction is large. This makes it possible to perform calculations that take into account the deflection of the workpiece W with high precision. Therefore, it is possible to measure the shape of the surface of the workpiece W with high precision.

[0101] Furthermore, by dividing the measured surface of the workpiece W into multiple regions and performing surface approximation for each divided region 55, it is possible to perform approximation using a lower-order polynomial compared to performing surface approximation on the entire surface. Therefore, the calculation time can be reduced compared to performing surface approximation on the entire surface of the workpiece W. Furthermore, at the boundary 57 between the multiple divided regions 55, an overlapping region 58 is formed by overlapping adjacent regions, and specific weighted synthesis is performed on the overlapping region 58. This makes it possible to minimize the influence of errors due to cancellation in the calculation program. Therefore, the approximation accuracy can be improved, and the measurement accuracy of the workpiece W can be improved.

[0102] The machining system SYS and machining method of this embodiment are for machining a plate-shaped workpiece W, and include an object mounting device (stage device 3 in this embodiment) capable of supporting the workpiece W on a plurality of supports 38 so that the thickness direction of the workpiece W is aligned with the vertical direction; a machining device 1 that processes the workpiece W mounted on the object mounting device with processing light EL; a measurement device 2 that measures the workpiece W mounted on the object mounting device; and a control device 4. The control device 4 machines the workpiece W based on the results of measuring the first surface SU1 of the workpiece W supported by the plurality of supports 38, which faces upward, and the results of measuring the second surface SU2 of the workpiece W, which faces downward. In this way, the workpiece W can be positioned so that the thickness direction of the workpiece W is aligned with the vertical direction during measurement. This reduces the effect of elongation of the workpiece W compared to when the workpiece W is positioned vertically to reduce the effect of deflection due to its own weight. Furthermore, measurement of the workpiece W can be easily performed. Therefore, the workability of measuring the workpiece W is improved, and the workpiece W can be measured with high accuracy.

[0103] The above-described machining system SYS, measuring device 2, and machining method can be included in the machining system SYS or can be executed in the machining system SYS. That is, the configuration of the machining system SYS of this embodiment can be rephrased as follows: The machining system SYS is a machining system SYS that machines a plate-shaped object (workpiece W in the embodiment), and includes an object mounting device (stage device 3 in the embodiment) that can support a first surface SU1 of the object on a plurality of supports 38 and can support a second surface SU2 different from the first surface SU1 on the plurality of supports 38, a machining device 1 that processes the object mounted on the object mounting device with processing light EL, a measuring device 2 that measures the object mounted on the object mounting device, and a control device. The control device 4 controls the measuring device 2 to measure a first surface SU1 of the object whose second surface SU2 is supported by a plurality of support parts 38, and after measuring the first surface SU1 of the object, controls the measuring device 2 to measure a second surface SU2 of the object whose first surface SU1 is supported by the plurality of support parts 38, and after measuring the second surface SU2 of the object, controls the processing device 1 to process the second surface SU2 based on the measurement results of the first surface SU1 and the measurement results of the second surface SU2.

[0104] Or, it can be rephrased as follows: The measurement device 2 is a measurement device 2 that measures a plate-shaped object having a first surface SU1 and a second surface SU2, and includes a control device 4, which controls the measurement of the first surface SU1 of the object, the second surface SU2 of which is supported by a plurality of supports 38, and controls the measurement of the second surface SU2 of the object, the first surface SU1 of which is supported by the plurality of supports 38, after measuring the first surface SU1 of the object.

[0105] Or, it can be rephrased as follows: That is, the processing system SYS is a processing system SYS that processes a plate-shaped object, and includes an object mounting device that can support an object on a plurality of supports 38, a processing device 1 that processes the object mounted on the object mounting device with processing light EL, a measuring device 2 that measures the object mounted on the object mounting device, and a control device 4, the control device 4 causes the processing device 1 to process the object based on the measurement results of the measuring device 2, and the control device 4 changes the measurement accuracy of at least one of the first surface SU1 and the second surface SU2 by the measuring device 2 according to the support position of the object relative to the supports 38.

[0106] Or, it can be rephrased as follows: That is, the machining system SYS is a machining system SYS that machines a plate-shaped object, and processes the object based on measurement values ​​obtained by measuring a first surface SU1 of the object in a state in which the object is supported on a plurality of supports 38, and measurement values ​​obtained by measuring a second surface SU2, different from the first surface SU1 of the object, whose first surface SU1 is supported by the plurality of supports 38 after measuring the first surface SU1 of the object.

[0107] Or, it can be rephrased as follows: That is, the processing system SYS is a processing system SYS that processes a plate-shaped object, and includes an object mounting device that can support the object on a plurality of supports 38 so that the thickness direction of the object and the vertical up-down direction are aligned, a processing device 1 that processes the object mounted on the object mounting device with processing light EL, a measuring device 2 that measures the object mounted on the object mounting device, and a control device 4, and the control device 4 processes the object based on a result of measuring a first surface SU1 facing upward of the object supported by the plurality of supports 38 and a result of measuring a second surface SU2 facing downward of the object.

[0108] Or, it can be rephrased as follows: That is, the processing method is a processing method for processing a thin-plate-like object having a first surface SU1 and a second surface SU2, and includes: placing the object on a plurality of supports 38 of an object mounting device so that the second surface SU2 of the object is supported by the plurality of supports 38 of the object mounting device, measuring the first surface SU1 of the object while supported by the second surface SU2 to obtain a first measurement result 81, placing the object so that the plurality of supports 38 of the object mounting device support the first surface SU1 of the object, measuring the second surface SU2 of the object while supported by the first surface SU1 to obtain a second measurement result 82, and processing the object based on the first and second measurement results 81, 82.

[0109] Alternatively, this can be rephrased as follows: The processing method is a processing method for processing a plate-shaped object having a first surface SU1 and a second surface SU2, and includes measuring the first surface SU1 of the object, the second surface SU2 of which is supported by a plurality of support parts 38, and, after measuring the first surface SU1 of the object, measuring the second surface SU2 of the object, the first surface SU1 of which is supported by the plurality of support parts 38.

[0110] Or, it can be rephrased as follows: That is, the processing method is a processing method for processing a plate-shaped object having a first surface SU1 and a second surface SU2, and includes: placing the object on a plurality of supports 38 of an object mounting device so that the second surface SU2 of the object is supported; measuring the object mounted on the object mounting device; processing the object with the processing device 1 based on the measurement results of the measured object; and changing the measurement accuracy of at least one of the first surface SU1 and the second surface SU2 according to the support position of the object with respect to the supports 38.

[0111] Or, it can be rephrased as follows: That is, the processing method is a processing method for processing a plate-shaped object, and includes processing the object based on measurement values ​​obtained by measuring a first surface SU1 of the object in a state where the object is supported on a plurality of supports 38, and measurement values ​​obtained by measuring a second surface SU2, different from the first surface SU1 of the object, whose first surface SU1 is supported by the plurality of supports 38 after measuring the first surface SU1 of the object.

[0112] Or, it can be rephrased as follows: That is, the processing method is a processing method for processing a plate-shaped object, and includes supporting the object on a plurality of supports 38 of an object placement device so that the thickness direction of the object and the vertical up-down direction are aligned, measuring the object placed on the object placement device, and processing the object placed on the object placement device with processing light EL based on the results of measuring a first surface SU1 facing upward of the object supported by the plurality of supports 38 and the results of measuring a second surface SU2 facing downward of the object.

[0113] (5) Modifications Next, modifications of the machining system SYS, the measuring device 2, and the machining method will be described. Note that, although modifications of the machining system SYS will be described below, these configurations can also be applied to the above-described machining system SYS, the measuring device 2, and the machining method.

[0114] In the above-described embodiment, the processing system SYS includes the head drive system 13. That is, the processing head 12 is movable. However, the processing system SYS does not necessarily have to include the head drive system 13. That is, the processing head 12 does not necessarily have to be movable. Also, in the above description, the processing system SYS includes the stage drive system 33. That is, the stage 32 is movable. However, the processing system SYS does not necessarily have to include the stage drive system 33. That is, the stage 32 does not necessarily have to be movable.

[0115] The machining system SYS may include a display unit (not shown) such as a display. The display unit may function as a display device capable of displaying a desired image under the control of the control device 4. The display unit may include a display included in the machining system SYS (i.e., a display built into the machining system SYS). The display unit may include a display that can be externally attached to the machining system SYS. Alternatively, a display included in a device different from the machining system SYS may display a desired image under the control of the control device 4. For example, a display included in at least one of a laptop computer and a tablet terminal may display a desired image under the control of the control device 4. In this case, the machining system SYS does not need to include a display as a display unit.

[0116] In addition to removal processing, the processing system SYS may perform marking processing, which is capable of forming a mark (e.g., a letter, a number, or a figure) on at least a part of an object such as a workpiece W by irradiating the object with processing light EL (or any energy beam). The above-described processing device 1 (particularly, the processing head 12) may be attached to a robot (typically, an articulated robot). For example, the processing device 1 (particularly, the processing head 12) may be attached to a welding robot for welding. For example, the processing device 1 (particularly, the processing head 12) may be attached to a self-propelled mobile robot.

[0117] The tip of the support portion 38 supporting the workpiece W, i.e., the portion of the support portion 38 that comes into contact with the workpiece W when the workpiece W is placed on it, may be subjected to a surface treatment to reduce friction. For example, a surface treatment to reduce friction may be performed by forming a friction-reducing film, such as a diamond-like carbon (DLC) film or a plating film such as Caniflon, on at least the tip of the support portion 38. In addition to or instead of this surface treatment, spherical machining may be performed to make the tip of the support portion 38 spherical. When spherical machining is performed on the tip of the support portion 38, the tip may be made substantially flat and the periphery of the flat portion may be machined to have a convex curvature. By performing such a surface treatment to reduce friction on the portion that comes into contact with the workpiece W when the workpiece W is placed on it (the tip of the support portion 38), measurement errors caused by scratches on the surface of the workpiece W can be reduced. This improves measurement reproducibility when the workpiece W is repositioned, thereby achieving high-precision workpiece machining.

[0118] Alternatively, instead of reducing friction on the support portion 38 side, friction reduction treatment may be applied to the workpiece W. For example, a treatment to increase the surface hardness of the workpiece W, such as NiP plating (electroless nickel plating), may be applied to the surface of the workpiece W. The friction reduction treatment may be applied to both the support portion 38 side and the workpiece W side. In order to reduce measurement errors caused by scratches on the surface of the workpiece W, grease may be interposed between the support portion 38 and the workpiece W. In this case, the tip of the support portion 38 may be spherically machined, or one or more recesses capable of holding grease may be provided at the tip of the support portion 38.

[0119] Furthermore, in order to reduce friction, at least the portion of the support portion 38 that comes into contact with the workpiece W may be formed of a carbon-based material. Examples of such carbon-based materials include diamond-like carbon, graphene, graphite, tetrahedral amorphous carbon (ta-C), amorphous carbon (a-C), amorphous carbon with fused tungsten (a-C:W), tetrahedral amorphous carbon with fused tungsten (ta-C:W), hydrogenated amorphous carbon (a-C:H), tetrahedral hydrogenated amorphous carbon (ta-C:H), hydrogenated amorphous carbon with fused tungsten (a-C:H:W), tetrahedral hydrogenated amorphous carbon with fused tungsten (ta-C:H:W), hydrogenated amorphous carbon with silicon doping (a-C). :H:Si), tetrahedral hydrogenated amorphous carbon with silicon doping (ta-C:H:Si), hydrogenated amorphous carbon with fluorine doping (a-C:H:F), tetrahedral hydrogenated amorphous carbon with fluorine doping (ta-C:H:F), ultrananocrystalline diamond (UNCD), diamond, tungsten carbide, chromium carbide, titanium carbide, CrC / a-C:H, graphite / TiC / Ti alloy, multi-walled carbon nanotubes (MWCNT) embedded in alumina, etc., or a combination of materials selected from this group may be used.

[0120] One or more supports 38 may be measured using the measurement device 2. At this time, the positions of the one or more supports 38 in the measurement coordinate system may be measured. Here, the one or more supports 38 may be provided upright on a support that can be placed on the stage 32. When measuring both the support and the one or more supports 38 with the measurement device 2, if the reflectance differs between the surface of the support and the supports 38, measurements may be taken multiple times with different exposure times, and the multiple measurement results may be synthesized using HDR (High Dynamic Range). This makes it possible to reduce measurement noise in the measurement results.

[0121] In the above-described embodiment, the measuring device 2 is housed in the same housing 5 as the processing device 1, but this is not limited to this. The measuring device 2 may be provided in a location separate from the processing device 1. In this case, the above-described control device 4 having the processing device 1 and a control unit (not shown) of the measuring device 2 provided in a separate location may be communicatively connected to each other. In this case, measurement of the workpiece W by the measuring device 2 and processing of the workpiece W by the processing device 1 may be performed in parallel. Furthermore, the processing system SYS may have multiple measuring devices 2. For example, the processing system SYS may have a measuring device 2 provided in the same housing 5 as the processing device 1 and a second measuring device provided in a location separate from the processing device 1. In this case, measurement of the first surface may be performed by the second measuring device provided in a separate location, and measurement and processing of the second surface may be performed by the measuring device 2 provided in the same housing 5 as the processing device 1. In this case, in order to maintain the support state (position of the support point) by the support part between the measurement of the second surface and the machining of the second surface, the workpiece W may be moved together with the stage 32 from the second measuring device to the machining device 1 and the measuring device 2 provided in the same housing 5 as the machining device 1. Instead of moving the workpiece W (or the stage 32 on which the workpiece W is placed), the machining device 1 and the measuring device 2 may move while the stage 32, with the support state of the workpiece W maintained, remains fixed. In the above-described embodiment, the machining system SYS may perform a measurement operation of the light receiving device 35 using the measuring head 21 during the measurement of the workpiece W by the measuring head 21. Furthermore, in the above-described embodiment, machining marks may be formed at multiple locations on a test workpiece (not shown) different from the workpiece W to be actually machined, using machining light from the machining head 12 while moving the stage 32, and these multiple machining marks may be measured by the measuring head 21 while moving the stage 32. From this measurement result, the deviation between the machining position and the measurement position in the coordinate system of the stage 32 can be determined. The machining system SYS may use this measurement result to control the stage 32 during machining. This allows the machining grid to be aligned with the measurement grid, enabling high-precision machining. Note that multiple machining marks may be formed on the workpiece W to be actually machined, and the measurement results of these multiple machining marks may be used to control the stage during machining.

[0122] At least some of the components of each of the above-described embodiments can be appropriately combined with at least some of the other components of the above-described embodiments. Some of the components of the above-described embodiments may not be used.

[0123] The present invention is not limited to the above-described embodiments, but can be modified as appropriate within the scope of the claims and the gist or idea of ​​the invention as can be read from the entire specification, and the machining system SYS, measuring device 2, and machining method that involve such modifications are also included in the technical scope of the present invention.

[0124] The following supplementary notes are further disclosed with respect to the above-described embodiments. [Supplementary Note 1] A processing method for processing a plate-shaped object having a first surface and a second surface, comprising: measuring the first surface of the object, the second surface of which is supported by a plurality of support units of an object mounting device; measuring the second surface of the object, the first surface of which is supported by the plurality of support units, after measuring the first surface; and processing the second surface of the object with processing light based on the measurement results of the first surface and the measurement results of the second surface. [Supplementary Note 2] The processing method according to Supplementary Note 1, wherein processing the second surface includes processing based on at least one of an analysis result simulating the amount of deflection of the object when the first surface of the object is supported by the plurality of support units and an analysis result simulating the amount of deflection of the object when the second surface of the object is supported by the plurality of support units. [Supplementary Note 3] The processing method according to Supplementary Note 2, wherein the amount of deflection of the object is calculated based on a predetermined ideal shape of the object. [Supplementary Note 4] The machining method according to Supplementary Note 2 or Supplementary Note 3, in which the second surface is machined based on a first measurement result that is a measurement result of the first surface, a second measurement result that is a measurement result of the second surface, and the analysis result. [Supplementary Note 5] The machining method according to Supplementary Note 4, further comprising measuring the positions of the plurality of support parts, and machining the object based on the first measurement result, the second measurement result, the analysis result, and a third measurement result measuring the positions of the plurality of support parts. [Supplementary Note 6] The machining method according to Supplementary Note 4 or Supplementary Note 5, further comprising measuring the shapes of the plurality of support parts, and machining the object based on the first measurement result, the second measurement result, the analysis result, and a fourth measurement result measuring the shapes of the plurality of support parts. [Supplementary Note 7] The machining method according to any one of Supplements 1 to 6, in which machining of the second surface is performed while maintaining the support state of the first surface by the plurality of support parts when measuring the second surface. [Appendix 8] The processing method described in any one of Appendices 1 to 7, wherein the support state of the first surface by the plurality of support parts when the second surface is processed is the same as the support state of the first surface by the plurality of support parts when the second surface is measured.[Supplementary Note 9] The processing method according to any one of Supplements 1 to 8, wherein measuring the object includes measuring (i) and (ii) of: (i) at least one of the height and position of the first surface of the object, and (ii) at least one of the height and position of the second surface of the object. [Supplementary Note 10] The processing method according to any one of Supplements 1 to 9, further including: acquiring a measurement result of the first surface in a state where the first surface is supported by the plurality of support parts so that the first surface faces upward; calculating an amount of deflection of the object based on information relating to a positional relationship between the support parts and the object and information about the object; and calculating a shape of the first surface of the object in an unloaded state by subtracting the amount of deflection from the measurement result of the first surface. [Supplementary Note 11] The machining method according to Supplementary Note 10, further comprising: calculating a second amount of deflection of the object based on information regarding a positional relationship between the supporting units and the object when the object is supported upside down by the multiple supporting units so that the second surface faces upward, calculating a shape of the first surface of the object when supported so that the second surface faces upward by adding the shape of the first surface of the object in the unloaded state and the second amount of deflection, setting a position offset by a predetermined amount from the calculated shape of the first surface as a machining target surface, and machining the second surface so that a second surface actual measurement value obtained by measuring the second surface of the object when supported so that the second surface faces upward coincides with the machining target surface. [Supplementary Note 12] The machining method according to any one of Supplements 1 to 11, wherein the multiple supporting units include at least three supporting units. [Supplementary Note 13] A method for measuring a plate-shaped object having a first surface and a second surface, comprising: measuring the first surface of the object, the second surface of which is supported by a plurality of support parts; and, after measuring the first surface of the object, measuring the second surface of the object, the first surface of which is supported by the plurality of support parts.[Supplementary Note 14] The measurement method according to Supplementary Note 13, comprising: obtaining a first surface actual measurement value by measuring the first surface of the object in a state where the object is supported by the plurality of support parts with the first surface facing upward; calculating an amount of deflection of the object based on information relating to a positional relationship between the support parts and the object and information about the object; and calculating a shape of the first surface of the object in an unloaded state by subtracting the amount of deflection from the first surface actual measurement value. [Supplementary Note 15] The measurement method according to Supplementary Note 14, further comprising: calculating a second amount of deflection of the object based on information relating to a positional relationship between the support parts and the object in a state in which the object is supported upside down by the multiple support parts so that the second surface faces upward, and information about the object, calculating a shape of the first surface in a state in which the object is supported so that the second surface faces upward by adding the shape of the first surface of the object in the unloaded state and the second amount of deflection, obtaining second-surface actual measurement values ​​by measuring the second surface of the object in a state in which the object is supported so that the second surface faces upward, and measuring a plate thickness distribution of the object based on the first-surface actual measurement values ​​and the second-surface actual measurement values. [Supplementary Note 16] The measurement method according to any one of Supplementary Notes 13 to 15, wherein the amount of deflection of the object is calculated based on a predetermined ideal shape of the object. [Supplementary Note 17] A method for processing a plate-shaped object, comprising: supporting the object on a plurality of support units of an object placement device; measuring the object placed on the object placement device; changing the measurement accuracy of at least one of a first surface and a second surface of the object according to the support position of the object relative to the support units; and processing the object placed on the object placement device with processing light based on the measurement result of the object. [Supplementary Note 18] The measurement method according to Supplementary Note 17, in which a first measurement accuracy of a first region including a second position on the object opposite to the first position supported on the support units is made higher than a second measurement accuracy of a second region including a third position different from the second position. [Supplementary Note 19] The processing method according to Supplementary Note 18, in which measuring the object comprises discretely measuring a surface of the object, and measuring the second position with higher resolution compared to the third position.[Supplementary Note 20] The processing method according to Supplementary Note 18, wherein measuring the object includes discretely measuring the surface of the object and measuring the second position at a higher density than the third position. [Supplementary Note 21] The processing method according to any one of Supplements 17 to 20, wherein measuring the object includes discretely measuring the surface of the object and measuring a support part corresponding region of the object corresponding to the support part at a higher density than a region other than the support part corresponding region. [Supplementary Note 22] The processing method according to any one of Supplements 17 to 21, further including dividing the surface of the object into a plurality of regions and calculating the shape of the entire surface of the object by performing curved surface approximation for each of the divided regions. [Supplementary Note 23] The processing method according to Supplementary Note 22, wherein calculating the shape of the surface of the object includes forming an overlapping region by overlapping adjacent regions at a boundary between the divided regions, and performing specific weighted synthesis in the overlapping region. [Supplementary Note 24] The processing method according to Supplementary Note 23, wherein calculating the shape of the surface of the object includes: weighting the overlapping region so that the components of one of the two adjacent divided regions increase as one moves from the other region to the other region; and applying, at an end of the overlapping region, a numerical value of an end of the one region or the other region that is closer to the overlapping region. [Supplementary Note 25] The processing method according to any one of Supplements 17 to 24, wherein calculating the shape of the surface of the object includes calculating the shape of the surface of the object by performing surface approximation using a plurality of actual measurement points on the surface of the object, and wherein the surface approximation uses a least squares method.

[0125] REFERENCE SIGNS LIST 1 Processing device 2 Measurement device 3 Stage device (object placement device) 4 Control device 38 Support part 39 Support point 40 Support part corresponding area 41 First position 42 Second position 43 Third position 51 First area 52 Second area 55 Divided area 57 Boundary area 58 Overlapping area 81 First measurement result 82 Second measurement result 89 Analysis result A1 One area A2 Other area AM1 First surface actual measurement value AM2 Second surface actual measurement value EL Processing light H1 (First surface) height H2 (Second surface) height P1 (First surface) position P2 (Second surface) position SD1 Deflection amount SD2 Second deflection amount SU1 First surface SU2 Second surface SUT Processing target surface SYS Processing system W Workpiece (object)

Claims

1. A processing system for processing a plate-shaped object, comprising: an object mounting device capable of supporting a first surface of the object on a plurality of support parts and capable of supporting a second surface different from the first surface on the plurality of support parts; a processing device that processes the object mounted on the object mounting device with processing light; a measuring device that measures the object mounted on the object mounting device; and a control device, wherein the control device controls the measuring device to measure the first surface of the object whose second surface is supported by the plurality of support parts, controls the measuring device to measure the second surface of the object whose first surface is supported by the plurality of support parts after measuring the first surface of the object, and controls the processing device to process the second surface based on the measurement results of the first surface and the measurement results of the second surface after measuring the second surface of the object.

2. The processing system of claim 1, wherein the processing of the second surface is further performed based on at least one of an analysis result simulating the amount of deflection of the object when the first surface of the object is supported by the multiple supporting parts and an analysis result simulating the amount of deflection of the object when the second surface of the object is supported by the multiple supporting parts.

3. The processing system according to claim 2, wherein the amount of deflection of the object is calculated based on a preset ideal shape of the object.

4. The machining system according to claim 2 or 3, wherein the control device is capable of outputting a first measurement result which is a measurement result of the first surface, and a second measurement result which is a measurement result of the second surface.

5. The machining system according to claim 4, wherein the second surface is machined based on the first measurement result, the second measurement result, and the analysis result.

6. The processing system described in claim 4 or 5, wherein the support portion is a support point, the measuring device measures the positions of the multiple support points, and the control device processes the object based on the first measurement result, the second measurement result, the analysis result, and a third measurement result that measures the positions of the multiple support points.

7. A processing system according to any one of claims 4 to 6, wherein the measuring device measures the shapes of the multiple support parts, and the control device processes the object based on the first measurement result, the second measurement result, the analysis result, and a fourth measurement result measuring the shapes of the multiple support parts.

8. A processing system according to any one of claims 1 to 7, wherein processing of the second surface is performed while maintaining the support state of the first surface by the multiple support parts when measuring the second surface.

9. A processing system described in any one of claims 1 to 8, wherein a support state of the first surface by the multiple support parts when the second surface is machined does not change from a support state of the first surface by the multiple support parts when the second surface is measured.

10. A processing system according to any one of claims 1 to 9, wherein the measuring device is capable of measuring (i) and (ii) of: (i) at least one of the height and position of the first surface of the object; and (ii) at least one of the height and position of the second surface of the object.

11. The processing system described in any one of claims 1 to 10, wherein the control device acquires measurement results of the first surface when the first surface is supported by the multiple supporting parts so that the first surface faces upward, calculates an amount of deflection of the object based on information regarding the positional relationship between the supporting parts and the object and information about the object, and calculates a shape of the first surface of the object in an unloaded state by subtracting the amount of deflection from the measurement results of the first surface.

12. The machining system described in claim 11, wherein the control device calculates a second amount of deflection of the object based on information regarding the positional relationship between the supporting parts and the object when the object is supported upside down by the multiple supporting parts so that the second surface faces upward, and information about the object; calculates a shape of the first surface of the object when supported so that the second surface faces upward by adding the shape of the first surface of the object in the unloaded state and the second amount of deflection; sets a position offset by a predetermined amount from the calculated shape of the first surface as a machining target surface; and machines the second surface so that an actual measurement value of the second surface obtained by measuring the second surface of the object when supported so that the second surface faces upward coincides with the machining target surface.

13. The processing system according to any one of claims 1 to 12, wherein the plurality of supports includes at least three supports.

14. A measuring device for measuring a plate-shaped object having a first surface and a second surface, comprising a control device, which controls the measurement of the first surface of the object, the second surface of which is supported by a plurality of supporting parts, and controls the measurement of the second surface of the object, the first surface of which is supported by the plurality of supporting parts, after the measurement of the first surface of the object.

15. The measuring device described in claim 14, which obtains a first surface actual measurement value by measuring the first surface of the object in a state where the first surface is supported by the multiple supports with the first surface facing upward, calculates an amount of deflection of the object based on information regarding the positional relationship between the supports and the object and information about the object, and calculates a shape of the first surface of the object in an unloaded state by subtracting the amount of deflection from the first surface actual measurement value.

16. The measuring device described in claim 15, further comprising: calculating a second amount of deflection of the object based on information regarding the positional relationship between the supporting parts and the object in a state in which the object is supported upside down by the multiple supporting parts so that the second surface faces upward, and information about the object; calculating a shape of the first surface in a state in which the object is supported so that the second surface faces upward by adding the shape of the first surface of the object in the unloaded state and the second amount of deflection; obtaining second surface actual measurement values ​​by measuring the second surface of the object in a state in which the object is supported so that the second surface faces upward; and measuring a plate thickness distribution of the object based on the first surface actual measurement values ​​and the second surface actual measurement values.

17. The measuring device according to claim 15 or 16, wherein the amount of deflection of the object is calculated based on a preset ideal shape of the object.

18. A processing system for processing a plate-shaped object, comprising: an object mounting device capable of supporting the object on a plurality of support parts; a processing device that processes the object mounted on the object mounting device with processing light; a measuring device that measures the object mounted on the object mounting device; and a control device, wherein the control device processes the object using the processing device based on measurement results by the measuring device, and the control device changes the measurement accuracy of at least one of a first surface and a second surface of the object measured by the measuring device depending on the support position of the object relative to the support parts.

19. The processing system described in claim 18, wherein a first measurement accuracy of a first region including a second position on the object opposite a first position supported on the support portion is higher than a second measurement accuracy of a second region including a third position different from the second position.

20. The processing system according to claim 19, wherein the distance between the first position and the second position is less than the distance between the first position and the third position.

21. The processing system according to claim 19, wherein the control device controls the measurement device to discretely measure the surface of the object and to measure the second position with a higher resolution than the third position.

22. The processing system according to claim 21, wherein the control device controls the control device to perform discrete measurements of the surface of the object and to measure the second location at a higher density than the third location.

23. The processing system according to any one of claims 18 to 22, wherein the control device controls the control device to discretely measure the surface of the object, and to measure support part corresponding regions of the object corresponding to the support parts at a higher density than regions other than the support part corresponding regions.

24. The processing system according to any one of claims 21 to 23, wherein the control device divides the surface of the object into a plurality of regions and calculates the shape of the entire surface of the object by performing curved surface approximation for each of the divided regions.

25. The processing system according to claim 24, wherein the control device forms an overlapping area by overlapping adjacent areas at the boundaries between the divided areas, and performs specific weighted synthesis in the overlapping area.

26. The processing system described in claim 25, wherein the control device weights the overlapping area so that the components of one of the two adjacent divided areas increase as one moves from the other area to the other area, and applies, at the ends of the overlapping area, the numerical value of the end of the area closer to the other area.

27. The processing system according to any one of claims 21 to 26, wherein the control device calculates the shape of the surface of the object by performing surface approximation using a plurality of actual measurement points on the surface of the object, and the surface approximation uses a least squares method.

28. The processing system according to any one of claims 18 to 27, wherein the plate-like object is a thin plate-like object having the first surface and the second surface.

29. A processing system for machining a plate-shaped object, the processing system processing the object based on measurement values ​​obtained by measuring a first surface of the object while the object is supported on a plurality of supports, and measurement values ​​obtained by measuring a second surface, different from the first surface, of the object with the first surface supported by the plurality of supports after measuring the first surface of the object.

30. A processing system for processing a plate-shaped object, comprising: an object mounting device capable of supporting the object on a plurality of support parts so that the thickness direction and vertical up-down direction of the object are aligned; a processing device that processes the object placed on the object mounting device with processing light; a measuring device that measures the object placed on the object mounting device; and a control device, wherein the control device processes the object based on a result of measuring a first surface of the object supported by the plurality of supports that faces upward and a result of measuring a second surface of the object that faces downward.

31. A processing method for machining a thin-plate-like object having a first surface and a second surface, comprising: mounting the object so that the second surface of the object is supported on a plurality of supports of an object mounting device; measuring the first surface of the object while supported by the second surface to obtain a first measurement result; mounting the object so that the plurality of supports of the object mounting device support the first surface of the object; measuring the second surface of the object while supported by the first surface to obtain a second measurement result; and machining the object based on the first and second measurement results.

32. A processing method for machining a plate-shaped object having a first surface and a second surface, comprising: measuring the first surface of the object, the second surface of which is supported by a plurality of supporting parts; and after measuring the first surface of the object, measuring the second surface of the object, the first surface of which is supported by the plurality of supporting parts.

33. A processing method for machining a plate-shaped object having a first surface and a second surface, comprising: placing the object so that the second surface of the object is supported on a plurality of support parts of an object mounting device; measuring the object placed on the object mounting device; processing the object with a processing device based on the measurement results of the object; and changing the measurement accuracy of at least one of the first surface and the second surface depending on the support position of the object relative to the support parts.

34. A processing method for machining a plate-shaped object, comprising: machining the object based on measurement values ​​obtained by measuring a first surface of the object while the object is supported on a plurality of supports; and measurement values ​​obtained by measuring a second surface, different from the first surface, of the object, the first surface of which is supported by the plurality of supports after the measurement of the first surface of the object.

35. A processing method for processing a plate-shaped object, comprising: supporting the object on a plurality of supports of an object mounting device so that the thickness direction and the vertical up-down direction of the object are aligned; measuring the object mounted on the object mounting device; and processing the object mounted on the object mounting device with processing light based on the results of measuring a first surface of the object supported by the plurality of supports facing upward and the results of measuring a second surface of the object facing downward.

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