Detection device and detection method

Abstract

A detection device and method for detecting a circuit board. The device comprises: a carrier plate which receives the circuit board; a plate rotating unit which rotates the carrier plate along a rotating shaft at a plurality of rotation angles; a radiation light source which emits radiation light having an optical axis parallel to the rotating shaft; a radiation detector which detects the radiation light so as to receive a plurality of radiation images for a detected area of the circuit board; and an image adjustment unit which determines a plurality of pixel values by performing weighted combination on the plurality of radiation images, so as to reconstruct a sample image of the detected area. The radiation light source and the radiation detector are arranged on different sides of the carrier plate, and when the carrier plate is rotated to a specific rotation angle, the radiation detector receives a specific radiation image among the plurality of radiation images.

Description

Detection device and detection method Technical Field

[0001] The present invention relates to the field of detection devices and detection methods, and more particularly, to a detection device and detection method for detecting a circuit board by using a radiation light source. Background Art

[0002] With the continuous advancement of digital information technology, the requirements for digital signal transmission speed and frequency have also increased. However, as the frequency of circuit signals on printed circuit boards (PCBs) continues to increase, the excess film layers (e.g., copper film) in the plated through holes (PTHs) on the PCB can act as extra antennas, causing signal radiation and unnecessary signal interference. Therefore, back drilling (also known as controlled depth drilling) is commonly used in PCB manufacturing to prevent signal distortion caused by reflections, scattering, or delays during high-speed signal transmission.

[0003] However, during the backdrilling process, errors in the drill's position, angle, or depth can result in incomplete removal of the intended film layer. Traditionally, residual conductors in backdrilled holes can be detected using tools like high-magnification magnifiers or probes. However, this method is time-consuming and labor-intensive, significantly increasing PCB production costs and time expenditures. Therefore, both drilling accuracy during the backdrilling process and post-drilling inspection accuracy are crucial issues.

[0004] Summary of the Invention

[0005] The present invention is made in view of the above problems and provides a detection device for detecting a circuit board and a detection method for detecting a circuit board using a detection device.

[0006] To address the aforementioned issues, the detection method includes: receiving the circuit board on a carrier plate, wherein the carrier plate is rotatable along a rotation axis at multiple rotation angles; emitting radiation light toward the circuit board via a radiation light source of the detection device, wherein an optical axis of the radiation light is parallel to the rotation axis; detecting the radiation light via a radiation detector of the detection device to receive multiple radiation images of a detected area of ​​the circuit board, wherein the radiation light source and the radiation detector are disposed on opposite sides of the carrier plate, and when the carrier plate is rotated to a specific rotation angle among the multiple rotation angles, a specific radiation image among the multiple radiation images is received; reconstructing a sample image of the detected area by determining multiple pixel values ​​by weighted combination of the multiple radiation images; and establishing a three-dimensional image of the circuit board based on the sample image.

[0007] In some embodiments, the detection device includes: a carrier plate configured to receive the circuit board; a plate rotation unit coupled to the carrier plate and configured to rotate the carrier plate along a rotation axis at multiple rotation angles; a radiation light source configured to emit radiation light, wherein an optical axis of the radiation light is parallel to the rotation axis; a radiation detector configured to detect the radiation light to receive multiple radiation images of a detected area of ​​the circuit board, wherein: the radiation light source and the radiation detector are respectively disposed on different sides of the carrier plate, and when the plate rotation unit rotates the carrier plate to a specific rotation angle among the multiple rotation angles, the radiation detector receives a specific radiation image among the multiple radiation images; and an image adjustment unit coupled to the radiation detector and configured to determine multiple pixel values ​​by weighted combination of the multiple radiation images to reconstruct a sample image of the detected area, wherein the sample image is used to establish a three-dimensional image of the circuit board.

[0008] In some embodiments, when the carrier plate is rotated at the multiple rotation angles (for example, the plate rotation unit rotates the carrier plate at the multiple rotation angles), a detection point in the detected area of ​​the circuit board is correspondingly moved to multiple target positions; when the detection point is respectively located at the multiple target positions, the detection point is detected to generate multiple point values, each of the multiple point values ​​being included in one of the multiple radiation images; by weightedly combining the multiple point values ​​with multiple detection distances, a specific pixel value among the multiple pixel values ​​in the sample image of the detected area is generated for the detection point; and each of the multiple detection distances is determined based on a corresponding one of the multiple target positions.

[0009] In some embodiments, the radiation light source is set at a light source position; the multiple detection distances are each the length of a corresponding one of a plurality of straight line segments; and the multiple straight line segments are respectively linked from the light source position through the corresponding one of the plurality of target positions to the radiation detector.

[0010] In some embodiments, the radiation light source is capable of moving along a first moving direction, wherein the first moving direction is parallel to the rotation axis; and the radiation detector is capable of moving along a second moving direction and / or a third moving direction, wherein the second moving direction is parallel to the rotation axis and the third moving direction is perpendicular to the rotation axis.

[0011] In some embodiments, the detection device further includes: a light source moving unit, which is coupled to the radiation light source and configured to move the radiation light source along a first moving direction, wherein the first moving direction is parallel to the rotation axis; and a detection moving unit, which is coupled to the radiation detector and configured to move the radiation detector along a second moving direction and / or a third moving direction, wherein the second moving direction is parallel to the rotation axis, and the third moving direction is perpendicular to the rotation axis.

[0012] In some embodiments, the magnification of the multiple radiation images is determined based on a first perpendicular distance between the circuit board and a radiation plane of the radiation light source and a second perpendicular distance between a detection plane of the radiation detector and the radiation plane of the radiation light source.

[0013] In some embodiments, a light source distance between the circuit board and a radiation plane of the radiation light source along the first movement direction is determined by the light source movement unit; a detection distance between a detection plane of the radiation detector and the radiation plane of the radiation light source along the first movement direction is determined by the light source movement unit and the detection movement unit; and a magnification of the multiple radiation images is determined based on the light source distance and the detection distance along the first movement direction.

[0014] In some embodiments, the circuit board includes: multiple circuit layers; a signal layer, which is arranged between two adjacent circuit layers among the multiple circuit layers; a plate through hole, which passes through the circuit board; and a coating layer, which is arranged on the inner side of the plate through hole.

[0015] In some embodiments, before drilling the through-plate hole on the circuit board to generate a back-drilled via, the detection device estimates at least one drilling parameter of the back-drilled via based on the three-dimensional image created by weighted combination of the sample image generated by the plurality of radiation images.

[0016] In some embodiments, the at least one drilling parameter includes a drilling depth of the back-drilled hole, and the detection device measures a redundant length between a plate surface of the circuit board and a signal line of the signal layer based on the three-dimensional image to evaluate the drilling depth as being less than the redundant length.

[0017] In some embodiments, the at least one drilling parameter includes a drilling position and a drilling aperture of the back-drilled hole, and the detection device measures a through-hole position of the plate through-hole based on the three-dimensional image to evaluate the drilling position and the drilling aperture of the back-drilled hole, and the drilling aperture is greater than twice the distance from the drilling position to a longest radius of a through-hole wall of the plate through-hole, so as to avoid a residual film layer of the coating layer on the back-drilled hole after drilling the plate through-hole.

[0018] In some embodiments, after drilling the through hole on the circuit board to generate a back-drilled hole, the detection device confirms a drilling condition of the back-drilled hole based on the three-dimensional image created by weighted combination of the sample image generated by the plurality of radiation images.

[0019] In some embodiments, the confirmed drilling condition includes at least one of the following conditions: (1) confirming whether the back-drilled hole penetrates the signal layer; (2) confirming whether there is a residual film layer of the coating layer on the back-drilled hole; and (3) confirming whether the distance between the bottom of a drill hole of the back-drilled hole and the signal line is less than a preset thickness.

[0020] To address the aforementioned issues, the detection method includes: receiving the circuit board on a carrier plate; emitting radiation light toward the circuit board via a radiation light source of the detection device, wherein the radiation light source is rotatable along a rotation axis at multiple first rotation angles; and an optical axis of the radiation light is parallel to the rotation axis; detecting the radiation light via a radiation detector of the detection device to receive multiple radiation images of a detected area of ​​the circuit board, wherein the radiation light source and the radiation detector are disposed on opposite sides of the carrier plate, and when the radiation light source is rotated to a specific first rotation angle among the multiple first rotation angles, a specific radiation image among the multiple radiation images is received; reconstructing a sample image of the detected area by determining multiple pixel values ​​through weighted combination of the multiple radiation images; and establishing a three-dimensional image of the circuit board based on the sample image.

[0021] In some embodiments, the detection device includes: a carrier plate configured to receive the circuit board; a radiation light source configured to emit radiation light, wherein an optical axis of the radiation light is parallel to the rotation axis; a light source rotation unit coupled to the radiation light source and configured to rotate the radiation light source along the rotation axis at multiple first rotation angles; a radiation detector configured to detect the radiation light to receive multiple radiation images of a detected area of ​​the circuit board, wherein: the radiation light source and the radiation detector are respectively disposed on different sides of the carrier plate, and when the light source rotation unit rotates the radiation light source to a specific first rotation angle among the multiple first rotation angles, the radiation detector receives a specific radiation image among the multiple radiation images; and an image adjustment unit coupled to the radiation detector and configured to determine multiple pixel values ​​by weighted combination of the multiple radiation images to reconstruct a sample image of the detected area, wherein the sample image is used to establish a three-dimensional image of the circuit board.

[0022] In some embodiments, when the radiation light source is rotated at the multiple first rotation angles (for example, the light source rotation unit rotates the carrier plate at the multiple rotation angles), the radiation light source is correspondingly moved to a plurality of light source positions; when the radiation light source is respectively located at the multiple light source positions, a detection point in the detected area of ​​the circuit board is detected to generate a plurality of point values, each of the plurality of point values ​​being included in one of the multiple radiation images; by weightedly combining the multiple point values ​​with a plurality of detection distances, a specific pixel value among the plurality of pixel values ​​in the sample image of the detected area is generated for the detection point; and each of the plurality of detection distances is determined based on a corresponding one of the multiple light source positions.

[0023] In some embodiments, the detection point is located at a target location; the multiple detection distances are each the length of a corresponding one of a plurality of straight line segments; and the multiple straight line segments are respectively linked from the corresponding one of the plurality of light source positions through the target location to the radiation detector.

[0024] In some embodiments, the radiation light source is capable of moving along a first moving direction, wherein the first moving direction is parallel to the rotation axis; and the radiation detector is capable of moving along a second moving direction and / or a third moving direction, wherein the second moving direction is parallel to the rotation axis and the third moving direction is perpendicular to the rotation axis.

[0025] In some embodiments, the detection device further includes: a light source moving unit, which is coupled to the radiation light source and configured to move the radiation light source along a first moving direction, wherein the first moving direction is parallel to the rotation axis; and a detection moving unit, which is coupled to the radiation detector and configured to move the radiation detector along a second moving direction and / or a third moving direction, wherein the second moving direction is parallel to the rotation axis, and the third moving direction is perpendicular to the rotation axis.

[0026] In some embodiments, the magnification of the multiple radiation images is determined based on a first perpendicular distance between the circuit board and a radiation plane of the radiation light source and a second perpendicular distance between a detection plane of the radiation detector and the radiation plane of the radiation light source.

[0027] In some embodiments, a light source distance between the circuit board and a radiation plane of the radiation light source along the first movement direction is determined by the light source movement unit; a detection distance between a detection plane of the radiation detector and the radiation plane of the radiation light source along the first movement direction is determined by the light source movement unit and the detection movement unit; and a magnification of the multiple radiation images is determined based on the light source distance and the detection distance along the first movement direction.

[0028] In some embodiments, the circuit board includes: multiple circuit layers; a signal layer, which is arranged between two adjacent circuit layers among the multiple circuit layers; a plate through hole, which passes through the circuit board; and a coating layer, which is arranged on the inner side of the plate through hole.

[0029] In some embodiments, before drilling the through-plate hole on the circuit board to generate a back-drilled via, the detection device estimates at least one drilling parameter of the back-drilled via based on the three-dimensional image created by weighted combination of the sample image generated by the plurality of radiation images.

[0030] In some embodiments, the at least one drilling parameter includes a drilling depth of the back-drilled hole, and the detection device measures a redundant length between a plate surface of the circuit board and a signal line of the signal layer based on the three-dimensional image to evaluate the drilling depth as being less than the redundant length.

[0031] In some embodiments, the at least one drilling parameter includes a drilling position and a drilling aperture of the back-drilled hole, and the detection device measures a through-hole position of the plate through-hole based on the three-dimensional image to evaluate the drilling position and the drilling aperture of the back-drilled hole, and the drilling aperture is greater than twice the distance from the drilling position to a longest radius of a through-hole wall of the plate through-hole, so as to avoid a residual film layer of the coating layer on the back-drilled hole after drilling the plate through-hole.

[0032] In some embodiments, after drilling the through hole on the circuit board to generate a back-drilled hole, the detection device confirms a drilling condition of the back-drilled hole based on the three-dimensional image created by weighted combination of the sample image generated by the plurality of radiation images.

[0033] In some embodiments, the confirmed drilling condition includes at least one of the following conditions: (1) confirming whether the back-drilled hole penetrates the signal layer; (2) confirming whether there is a residual film layer of the coating layer on the back-drilled hole; and (3) confirming whether the distance between the bottom of a drill hole of the back-drilled hole and the signal line is less than a preset thickness.

[0034] In some embodiments, the radiation detector is capable of rotating along the rotation axis at multiple second rotation angles; each of the multiple second rotation angles corresponds one-to-one to one of the multiple first rotation angles; and when the light source rotation unit rotates the radiation light source to a specific first rotation angle among the multiple first rotation angles, the detection rotation unit correspondingly rotates the radiation detector to a specific second rotation angle among the multiple second rotation angles.

[0035] In some embodiments, the detection device further includes: a detection rotation unit, which is coupled to the radiation detector and configured to rotate the radiation detector along the rotation axis at multiple second rotation angles, wherein: each of the multiple second rotation angles corresponds one-to-one to one of the multiple first rotation angles, and when the light source rotation unit rotates the radiation light source to the specific first rotation angle among the multiple first rotation angles, the detection rotation unit correspondingly rotates the radiation detector to a specific second rotation angle among the multiple second rotation angles. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The various aspects of the present invention can be best understood from the following detailed disclosure and the corresponding figures. Various features are not drawn to scale. The dimensions of various features may be arbitrarily increased or decreased for clarity of discussion.

[0037] FIG1A shows a block diagram of a detection device according to one or more techniques of this disclosure.

[0038] FIG. 1B shows a block diagram of a backdrilling device and the detection device illustrated in FIG. 1A , according to one or more techniques of the present disclosure.

[0039] 2A and 2B respectively show a front view and a three-dimensional structural diagram of the detection unit illustrated in FIG. 1A and FIG. 1B according to one or more techniques of the present disclosure.

[0040] FIG3 shows a flow chart of a detection method for detecting a circuit board using a detection device according to one or more techniques of the present disclosure.

[0041] 4A and 4B respectively show two schematic diagrams of a circuit board and the carrier plate, radiation detector, and radiation light source illustrated in FIG. 2A , according to one or more techniques of the present disclosure.

[0042] 5A and 5B are two schematic diagrams respectively showing the radiation detector, circuit board, and radiation light source illustrated in FIG. 4A , according to one or more techniques of the present disclosure.

[0043] 5C and 5D respectively show two schematic diagrams of the radiation detector, circuit board, and radiation light source illustrated in FIG. 4A , according to one or more techniques of the present disclosure.

[0044] FIG6 shows a schematic diagram of the circuit board illustrated in FIG4A , according to one or more techniques of this disclosure.

[0045] 7A and 7B respectively show cross-sectional views of a circuit board before and after a backdrilling process according to one or more techniques of the present disclosure.

[0046] FIG8 shows a cross-sectional view of a circuit board according to one or more techniques of this disclosure.

[0047] FIG. 9A shows a perspective view generated from a three-dimensional image of a circuit board, according to one or more techniques of this disclosure.

[0048] 9B to 9D respectively illustrate respective cross-sectional views of different cross-sectional views of the circuit board in the perspective view illustrated in FIG. 9A , according to one or more techniques of the present disclosure.

[0049] FIG. 10 shows a perspective view generated from a three-dimensional image of a circuit board, according to one or more techniques of this disclosure. DETAILED DESCRIPTION

[0050] The following disclosure contains specific information related to exemplary embodiments of the present disclosure. The drawings and the accompanying detailed disclosure in this disclosure are directed only to exemplary embodiments. However, the present disclosure is not limited to these exemplary embodiments. Other variations and embodiments of the present disclosure will occur to those skilled in the art. Unless otherwise indicated, identical or corresponding components in the drawings may be represented by identical or corresponding reference numerals. In addition, the drawings and illustrations in this disclosure are generally not drawn to scale and do not necessarily correspond to actual relative dimensions.

[0051] For the purpose of consistency and ease of understanding, similar features are identified by numbers in the exemplary figures (although not shown in some examples). However, features in different embodiments may differ in other aspects and should not be narrowly limited to those shown in the figures.

[0052] This disclosure uses phrases such as "in one embodiment," "in some embodiments," and the like, which may each refer to one or more of the same or different embodiments. The term "coupled" is defined as directly connected or indirectly connected through intermediate components, and is not necessarily limited to physical connections. The term "comprising" means "including but not necessarily limited to," and specifically indicates open inclusion or membership in the above combinations, groups, series, and equivalents.

[0053] In addition, for purposes of explanation and non-limiting, specific details such as functional entities, technologies, protocols, standards, etc. are set forth to provide an understanding of the described technology. In other instances, detailed disclosure of well-known methods, technologies, systems, architectures, etc. is omitted to avoid obscuring the disclosure with unnecessary detail.

[0054] FIG1A is a block diagram of a detection device 1 according to one or more techniques of the present disclosure. The detection device 1 includes a computing unit 10 and a detection unit 100 .

[0055] The computing unit 10 can be an electronic device, including any device configured to control the detection unit 100, receive multiple detection images, and adjust the multiple detection images. The detection unit 100 can be a detection device for detecting a circuit board, generating multiple detection images, and transmitting the multiple detection images to the computing unit 10. The computing unit 10 can communicate with the detection unit 100 via a communication medium, either wired or wirelessly.

[0056] Computing unit 10 may be a mobile phone, tablet computer, desktop computer, laptop computer, server, network computing system, or other electronic device. Computing unit 10 may include more or fewer components than shown, or have a different configuration of the various shown components.

[0057] The computing unit 10 may be implemented as any of a variety of suitable processing circuits, such as one or more microprocessors, central processing units (CPUs), graphics processing units (GPUs), system-on-a-chip (SoCs), digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), discrete logic, software, hardware, firmware, or any combination thereof. When implemented partially in software, the device may store a program having computer-executable instructions of the software in a suitable non-transitory computer-readable medium and execute the computer-executable instructions in hardware using one or more processors to perform the disclosed methods.

[0058] The computing unit 10 and the detection unit 100 may utilize custom protocols or comply with existing standards or de facto standards, including, but not limited to, Ethernet, IEEE 802.11 or IEEE 802.15 series, Wireless USB, or telecommunications standards, including, but not limited to, Global System for Mobile Communications (GSM), Code-Division Multiple Access 2000 (CDMA2000), Time Division Synchronous Code Division Multiple Access (TD-SCDMA), Worldwide Interoperability for Microwave Access (WiMAX), Third Generation Partnership Project Long-Term Evolution (3GPP-LTE), or Time-Division LTE (TD-LTE). The computing unit 10 and the detection unit 100 may each include a device configured to transmit and / or store the plurality of detection images via a communication medium and to receive the plurality of detection images via a communication medium.

[0059] The computing unit 10 may include a computer system interface that enables the plurality of detected images to be stored on or received from a storage device. For example, the computing unit 10 may include a chipset that supports the Peripheral Component Interconnect (PCI) and Peripheral Component Interconnect Express (PCIe) bus protocols, proprietary bus protocols, Universal Serial Bus (USB) protocols, Inter-Integrated Circuit (I2C) protocols, or any other logical and physical structure that can be used to interconnect peer devices.

[0060] Figure 1B shows a block diagram of a backdrill device 2 and the detection device 1 illustrated in Figure 1A , according to one or more techniques of this disclosure. In some embodiments, the backdrill device 2 is used to drill a hole in a circuit board to create a backdrilled via. In some embodiments, the backdrill device 2 can be coupled to the detection device 1 via a wired or wireless connection, allowing the detection device 1 to provide its detection and / or computational results to the backdrill device 2 for drilling. In other embodiments, the backdrill device 2 can also be incorporated into the detection device 1, acting directly as an operational unit within the detection device 1.

[0061] Figures 2A and 2B illustrate, respectively, a front view and a perspective view of the detection unit 100 illustrated in Figures 1A and 1B , according to one or more techniques of the present disclosure. The detection unit 100 may include a carrier plate 110, a plate moving unit 120, a plate rotating unit 130, a radiation detector 140, a detection moving unit 150, a radiation light source 160, a light source moving unit 170, and a device frame 180.

[0062] The carrier plate 110 can be used to receive a circuit board (not shown). The plate moving unit 120 can be coupled to the carrier plate 110 and used to move the carrier plate 110 on a moving plane that is perpendicular to the normal direction of the moving plane. The plate rotating unit 130 can be coupled to the carrier plate 110 and used to rotate the carrier plate 110 along a rotation axis at multiple rotation angles, so that the carrier plate 110 can be rotated along the rotation axis to the multiple rotation angles. In some embodiments, the normal direction can be parallel to the rotation axis, so that the rotation axis can be perpendicular to the moving plane.

[0063] The radiation light source 160 can be used to emit radiation light for detecting circuit boards. The radiation light can be ultraviolet rays, X-rays, or gamma rays. The radiation light can be a conical beam having an optical axis parallel to the rotation axis. The light source movement unit 170 can be coupled to the radiation light source 160 and used to move the radiation light source 160 along a first movement direction parallel to the rotation axis. The radiation detector 140 can be used to detect the radiation light to receive multiple radiation images of a detected area of ​​the circuit board. The detection movement unit 150 can be coupled to the radiation detector 140 and used to move the radiation detector 140 along a second movement direction parallel to the rotation axis and a third movement direction perpendicular to the rotation axis.

[0064] The tablet moving unit 120, the tablet rotating unit 130, the detection moving unit 150, and the light source moving unit 170 may be disposed on the device frame 180. In some embodiments, the carrier tablet 110 may be disposed on the tablet moving unit 120, and the carrier tablet 110 and the tablet moving unit 120 may be disposed on the tablet rotating unit 130. In some embodiments, the carrier tablet 110 may be disposed on the tablet rotating unit 130, and the carrier tablet 110 and the tablet rotating unit 130 may be disposed on the tablet moving unit 120. In addition, the radiation light source 160 may be disposed on the light source moving unit 170, and the radiation detector 140 may be disposed on the detection moving unit 150.

[0065] In some embodiments, the rotation axis can be parallel to the Z axis. Thus, the optical axis, the first movement direction, the second movement direction, and the normal direction can be parallel to the Z axis. Additionally, the movement plane perpendicular to the normal direction can be parallel to the XY plane. In some embodiments, the third movement direction can be parallel to the Y axis, which is perpendicular to the Z axis.

[0066] In some embodiments, a supporting surface of the carrier plate 110 may be a receiving surface for receiving the circuit board. The detection surface of the radiation detector 140 may include a plurality of radiation sensors for receiving radiation light. The radiation surface of the radiation source 160 may include at least one radiation emitter for emitting radiation light. In some embodiments, the supporting surface of the carrier plate 110, the detection surface of the radiation detector 140, and the radiation surface of the radiation source 160 may be parallel to each other. In some embodiments, the supporting surface of the carrier plate 110, the detection surface of the radiation detector 140, and the radiation surface of the radiation source 160 may be parallel to the moving plane. In some embodiments, when the moving plane is parallel to the XY plane, the supporting surface of the carrier plate 110, the detection surface of the radiation detector 140, and the radiation surface of the radiation source 160 may be parallel to the XY plane.

[0067] The radiation detector 140 and the radiation light source 160 may be disposed on two opposite sides of the carrier plate 110. In some embodiments, the radiation detector 140 may be disposed above the carrier plate 110, and the radiation light source 160 may be disposed below the carrier plate 110. In some implementations, the radiation detector 140 may be disposed below the carrier plate 110, and the radiation light source 160 may be disposed above the carrier plate 110.

[0068] The plate moving unit 120 can move the carrier plate 110 along the movement plane perpendicular to the first movement direction, while the plate rotating unit 130 can rotate the carrier plate 110 along the rotation axis perpendicular to the first movement direction at the plurality of rotation angles. Therefore, the plate moving unit 120 and the plate rotating unit 130 do not move the carrier plate 110 along the first movement direction. The light source moving unit 170 can move the radiation light source 160 along the first movement direction, and thus can determine a light source distance along the first movement direction between the circuit board and the radiation plane of the radiation light source 160. This light source distance can be a source-to-object distance (SOD). Furthermore, the detection movement unit 150 can move the radiation detector 140 along the second movement direction parallel to the first movement direction, and the light source movement unit 170 can move the radiation light source 160 along the first movement direction. Therefore, a detection distance along the first movement direction between the detection plane of the radiation detector 140 and the radiation plane of the radiation light source 160 can be determined by the detection movement unit 150 and the light source movement unit 170. The detection distance can be a source-to-detector distance (SDD).

[0069] The magnification (e.g., magnification) of the multiple radiation images can be determined based on the light source distance along the first movement direction and the detection distance along the first movement direction. When the first movement direction is parallel to the Z-axis, the light source distance along the first movement direction can be the perpendicular component of the SOD (SODz), and the detection distance along the first movement direction can be the perpendicular component of the SDD (SDDz). Therefore, the magnification of the multiple radiation images can be equal to the quotient (SDDz / SODz) obtained by dividing SDDz by SODz.

[0070] Referring to Figures 1A, 1B, 2A, and 2B, the computing unit 10 can be an image adjustment unit coupled to the radiation detector 140 and configured to determine multiple pixel values ​​by weighted combination of the multiple radiation images to reconstruct a sample image of the detected area. Furthermore, the computing unit 10 can also be a control unit coupled to at least one of the plate movement unit 120, the plate rotation unit 130, the radiation detector 140, the detection movement unit 150, the radiation light source 160, or the light source movement unit 170. In some embodiments, the control unit can control at least one of the plate movement unit 120 or the plate rotation unit 130 to move and rotate the carrier plate 110. In some embodiments, the control unit can control the radiation detector 140 to detect or stop detecting the radiation light and control the detection movement unit 150 to move the radiation detector 140. In some embodiments, the control unit can control the radiation light source 160 to emit or stop emitting the radiation light and control the light source movement unit 170 to move the radiation light source 160.

[0071] In some embodiments, the detection unit 100 can rotate the circuit board placed on the carrier plate 110 by rotating the plate rotation unit 130 to obtain multiple radiation images incident on the circuit board from different angles. However, in other embodiments, the rotating component can be replaced by the radiation light source 160 and the radiation detector 140 instead of the carrier plate 110. In other words, although the carrier plate 110 of the detection unit 100 does not rotate, the detection unit 100 can change the incident angle of the radiation incident on the circuit board by rotating the radiation light source 160. The rotation of the radiation detector 140 is coordinated with the rotation of the radiation light source 160 to ensure that multiple radiation images of a detected area of ​​the circuit board can be received by the radiation detector 140.

[0072] In some embodiments, using the detection unit 100 shown in Figures 2A and 2B as an example, the plate rotation unit 130 can be separated from the carrier plate 110 that receives the circuit board without rotating the carrier plate 110. Furthermore, the plate rotation unit 130 can be coupled to a radiation source 160 that emits radiation light, rotating the radiation source 160 along a rotation axis at multiple first rotation angles. In other words, the plate rotation unit 130 can function as a light source rotation unit. In some embodiments, the rotation axis is parallel to an optical axis of the radiation light. In some embodiments, the detection movement unit 150 can be coupled to the radiation detector 140 that detects the radiation light, and the detection movement unit 150 is configured to move the radiation detector 140 along the second, third, and / or fourth movement directions. In some embodiments, the second movement direction can be parallel to the rotation axis, while the third and fourth movement directions, which are different from each other, can be perpendicular to the rotation axis. In other words, the detection movement unit 150 can move the radiation detector 140 in two different directions perpendicular to the rotation axis. Therefore, the detection movement unit 150 can rotate the radiation detector 140 by moving in the third and fourth movement directions. Therefore, the detection movement unit 150 can also be configured to rotate the radiation detector 140 along the rotation axis at multiple second rotation angles. In other words, the detection movement unit 150 can also function as a detection rotation unit. In some embodiments, the detection unit 100 can include a movement rotation unit in addition to the detection movement unit 150. In some embodiments, the radiation light source 160 and the radiation detector 140 are disposed on opposite sides of the carrier plate 110.

[0073] In some embodiments, each of the plurality of second rotation angles of the detection rotation unit corresponds one-to-one to one of the plurality of first rotation angles of the light source rotation unit. Furthermore, when the light source rotation unit rotates the radiation source 160 to a specific first rotation angle among the plurality of first rotation angles, the detection rotation unit correspondingly rotates the radiation detector 140 to a specific second rotation angle among the plurality of second rotation angles. Therefore, when the light source rotation unit rotates the radiation source 160 to the specific first rotation angle among the plurality of first rotation angles, the radiation detector 140 receives a specific radiation image among the plurality of radiation images.

[0074] In some embodiments, when the radiation source 160 rotates along with the light source rotating unit, the light source moving unit 120 can still be coupled to the radiation source 160 to move the radiation source 160 along a first moving direction. In some embodiments, the first moving direction is parallel to the rotation axis.

[0075] In some embodiments, when the radiation light source 160 rotates with the light source rotation unit, the light source movement unit 170 can still move the radiation light source 160 along the first movement direction. Therefore, the light source movement unit 170 can still determine a light source distance along the first movement direction between the circuit board and the radiation plane of the radiation light source 160. This light source distance can be the source-to-target distance (SOD). Furthermore, the detection movement unit 150 can also move the radiation detector 140 along a second movement direction parallel to the first movement direction, while the light source movement unit 170 can move the radiation light source 160 along the first movement direction. Therefore, a detection distance along the first movement direction between the detection plane of the radiation detector 140 and the radiation plane of the radiation light source 160 can be determined by the detection movement unit 150 and the light source movement unit 170. This detection distance can be the source-to-detector distance (SDD). The magnification (e.g., magnification) of the multiple radiation images can be determined based on the light source distance along the first movement direction and the detection distance along the first movement direction. In some embodiments, the magnification of the plurality of radiation images may be equal to a quotient obtained by dividing SDDz by SODz (SDDz / SODz).

[0076] In some embodiments, when the radiation source 160 rotates, the computing unit 10 can still be an image adjustment unit coupled to the radiation detector 140 and configured to determine multiple pixel values ​​by weightedly combining the multiple radiation images to reconstruct a sample image of the detected area. Furthermore, the computing unit 10 can also be a control unit coupled to at least one of the plate movement unit 120, the plate rotation unit 130, the radiation detector 140, the detection movement unit 150, the radiation source 160, or the light source movement unit 170. In some embodiments, the control unit can control the plate movement unit 120 to move the carrier plate 110. In some embodiments, the control unit can control the plate rotation unit 130, which functions as a light source rotation unit, to rotate the radiation source 160. In some embodiments, the control unit can control the radiation detector 140 to detect or stop detecting the radiation light, control the detection movement unit 150 to move the radiation detector 140, or control the detection movement unit 150, which functions as a detection rotation unit, to rotate the radiation detector 140. In some embodiments, the control unit can control the radiation light source 160 to emit or stop emitting the radiation light, and control the light source moving unit 170 to move the radiation light source 160 .

[0077] 3 shows a flow chart of a detection method 300 for detecting a circuit board using the detection device 1 according to one or more techniques of the present disclosure. Since there are many ways to detect the circuit board, the detection method 300 is only an example.

[0078] The detection method 300 may be performed using the configurations shown in Figures 1A and 1B and Figures 2A and 2B. The components of these figures may be referenced in the description of the detection method 300. Each block in Figure 3 may represent one or more processes, methods, or subroutines that are performed.

[0079] The order in which the blocks appear in Figure 3 is for illustration only and is not intended to limit the scope of the present disclosure, and is therefore subject to change. Additional blocks may be added or fewer blocks may be used without departing from the present disclosure.

[0080] At block 310 , the detection device 1 receives a circuit board onto the carrier plate 110 of the detection device 1 .

[0081] Figures 4A and 4B respectively illustrate a circuit board 400 and the carrier plate 110, radiation detector 140, and radiation source 160 illustrated in Figure 2A , according to one or more techniques of the present disclosure. Referring to Figures 2A , 4A , and 4B , circuit board 400 may be received on carrier plate 110. Radiation source 160 may be positioned below carrier plate 110, and radiation detector 140 may be positioned above carrier plate 110. In some embodiments, radiation source 160 may be positioned above carrier plate 110, and radiation detector 140 may be positioned below carrier plate 110.

[0082] In some embodiments, the circuit board 400 may be a printed circuit board (PCB). In some embodiments, the circuit board 400 may be a PCB before a backdrilling process is performed to confirm at least one drilling parameter of the backdrilled hole in the backdrilling process. In some embodiments, the at least one drilling parameter may include drilling depth, drilling diameter, and drilling position, etc. In some embodiments, the drilling position may be a drilling center. In some embodiments, the circuit board 400 may be a PCB after a backdrilling process is performed to confirm a drilling condition of the backdrilled hole. The confirmed drilling condition may include at least one of the following conditions: (1) whether the backdrilled hole penetrates the signal layer of the circuit board 400, (2) whether there is a residue of the plating layer on the plated through hole (PTH) on the backdrilled hole, and (3) whether the distance between the bottom of a drill hole of the backdrilled hole and the signal layer of the circuit board 400 is less than a preset thickness.

[0083] The circuit board 400 can be placed on the support surface 111 of the carrier plate 110, allowing the detection device 1 to detect a detection area of ​​the circuit board 400. Furthermore, the carrier plate 110 can move along a movement plane perpendicular to the rotation axis 112 of the carrier plate 110 or the radiation source 116. Therefore, when the circuit board 400 is received on the carrier plate 110, a center point of the detection area of ​​the circuit board 400 can move along the movement plane to align with an intersection between the support surface 111 of the carrier plate 110 and the rotation axis 112.

[0084] The radiation detector 140 can move along a third movement direction perpendicular to the rotation axis 112, but the radiation source 160 does not need to move along this third movement direction. Therefore, when the radiation detector 140 moves along this third movement direction, the horizontal distance between the centerline 142 of the detection plane 141 in the radiation detector 140 and the optical axis 162 of the radiation source 160 can change. Furthermore, when the radiation detector 140 moves along this third movement direction, the tilt angle between a line between a center point of the detection plane 141 and a center point of the radiation plane 161 of the radiation source 160 and the optical axis 162 can change. For example, this tilt angle can change from a first angle θ1 to a second angle θ2.

[0085] The radiation light can penetrate the circuit board 400 and be received by the radiation detector 140. To clearly capture an image showing the internal structure of the detected area of ​​the circuit board 400, the radiation detector 140 can move along the third movement direction to select a detection position. The detection position can be related to at least one of the thickness or internal structure of the circuit board 400. For example, when the circuit board 400 is thick, the detection position can be close to the optical axis 162. When the circuit board 400 contains a small number of sparsely distributed components, the detection position can be farther from the optical axis 162.

[0086] At block 320 , the detection device 1 emits a radiation light toward the circuit board 400 via the radiation light source 160 of the detection device 1 .

[0087] The radiation source 160 may have a radiation plane 161, and the radiation may be emitted from the radiation plane 161 along an optical axis 162. Since the carrier plate 110 does not need to move along the optical axis 162, the circuit board 400 also does not need to move along the optical axis 162. The radiation source 160 may be moved along the first movement direction to a light source position by the light source movement unit 170. Since the optical axis 162 may be parallel to the first movement direction of the radiation source 160, the light source distance between the circuit board 400 and the radiation plane 161 of the radiation source 160 along the first movement direction may be equal to the first perpendicular distance D1. In addition, the first movement direction may be parallel to the rotation axis 112.

[0088] At block 330 , the detection device 1 detects the radiation light via the radiation detector 140 of the detection device 1 to receive a plurality of radiation images of the detected area of ​​the circuit board 400 .

[0089] The radiation detector 140 may have a detection plane 141, and the radiation light may be detected by the detection plane 141 to receive radiation images. The radiation detector 140 may be moved to a detection position along the second, third, and / or fourth movement directions by the detection movement unit 150. Because the second movement direction of the radiation detector 140 may be parallel to the first movement direction, the detection distance along the first movement direction between the detection plane 141 of the radiation detector 140 and the radiation plane 161 of the radiation light source 160 may be equal to a second perpendicular distance D2. Therefore, the magnification of the multiple radiation images received by the radiation detector 140 may be equal to the quotient (D2 / D1) obtained by dividing the second perpendicular distance D2 by the first perpendicular distance D1. Furthermore, the second movement direction may be parallel to the rotation axis 112, and the third and fourth movement directions may be perpendicular to the rotation axis 112.

[0090] In some embodiments, the carrier plate 110 can be rotated along a rotation axis 112 to a plurality of rotation angles by the plate rotation unit 130. The rotation axis 112 can be parallel to the optical axis 162 of the radiation source 160. When the carrier plate 110 is rotated by the plate rotation unit 130 to detect the detected area of ​​the circuit board 400, the radiation detector 140 can receive the plurality of radiation images of the detected area. Therefore, when the carrier plate 110 is rotated to a specific one of the plurality of rotation angles, a specific one of the plurality of radiation images can be received by the radiation detector 140. Each radiation image can correspond to one of the plurality of rotation angles.

[0091] In some other embodiments, the carrier plate 110 may not be rotated by the plate rotation unit 130. Instead, the radiation light source 160 may be rotated along the rotation axis 112 to a plurality of first rotation angles by a light source rotation unit (e.g., the plate rotation unit 130 may function as the light source rotation unit). The rotation axis 112 may be parallel to the optical axis 162 of the radiation light source 160. While the radiation light source 160 is rotating by the light source rotation unit, the radiation detector 140 may be rotated by a detection rotation unit (e.g., the detection movement unit 150 may function as the detection rotation unit) to receive the plurality of radiation images of the detected area of ​​the circuit board 400. Therefore, when the light source rotation unit rotates the radiation light source 160 to a specific first rotation angle among the plurality of first rotation angles, the radiation detector 140 receives a specific radiation image among the plurality of radiation images. Each radiation image may correspond to one of the plurality of first rotation angles.

[0092] At block 340 , the detection device 1 determines a plurality of pixel values ​​by weighted combination of the plurality of radiation images to reconstruct a sample image of the detected area.

[0093] In some embodiments, when the carrier plate 110 is rotated to the multiple rotation angles, a detection point in the detected area of ​​the circuit board 400 can be moved to multiple target positions. When the detection point is located at the multiple target positions, the detection point can be detected to generate multiple point values. The multiple point values ​​are respectively included in one of the multiple radiation images. For example, when the carrier plate 110 is rotated to the specific one of the multiple rotation angles and the radiation detector 140 receives the specific one of the multiple radiation images, the detection point in the detected area can be moved to the specific one of the multiple target positions, and the radiation detector 140 can detect the detection point to determine the specific one of the multiple point values. Therefore, each target position and each point value of the detection point can correspond to one of the multiple rotation angles and one of the multiple radiation images.

[0094] The distance between radiation source 160 and radiation detector 140 can affect the intensity of the multiple radiation images. As the distance between radiation source 160 and radiation detector 140 increases, the intensity of the multiple radiation images decreases. Therefore, when the target position changes due to rotation, the intensity of the multiple point values ​​for the detection point in the multiple radiation images may also change. Therefore, to ensure that the multiple pixel values ​​of the reconstructed sample image are correct, computing unit 10 may perform a weighted combination of the multiple radiation images and multiple distance value sets to reconstruct the sample image of the detected area.

[0095] By weightedly combining the multiple point values ​​of the detection point with the multiple detection distances, a specific pixel value from the multiple pixel values ​​in the sample image can be generated for the detection point. The multiple detection distances can include a specific set of distance values ​​corresponding to the detection point from the multiple sets of distance values. Furthermore, each detection distance can be determined based on a corresponding one of the multiple target positions.

[0096] Multiple straight lines can be connected from the light source position of the radiation source 160 through the multiple target positions to the detection position of the radiation detector 140. Each detection distance can be the same as the length of a corresponding one of the multiple straight lines. A specific one of the multiple straight lines can be connected from the center point of the radiation plane 161 of the radiation source 160 through a specific one of the multiple target positions to the detection plane 141, and the specific one of the multiple detection distances corresponding to the specific one of the multiple detection distances can be the same as the length of the specific one of the straight lines.

[0097] Figures 5A and 5B , according to one or more techniques of the present disclosure, respectively illustrate two schematic diagrams of the radiation detector 140, circuit board 400, and radiation source 160 illustrated in Figure 4A . When the circuit board 400 is detected by a detection device, the circuit board 400 can be viewed as having multiple cross-sectional plates in the XY plane. For example, the circuit board 400 can include a first cross-sectional plate 410 (e.g., in the z1 plane) and a second cross-sectional plate 420 (e.g., in the z2 plane). In some embodiments, both the first cross-sectional plate 410 and the second cross-sectional plate 420 can be in the same XY plane.

[0098] In addition, since the radiation light can penetrate the circuit board 400, the radiation image can be a combination of multiple panel values ​​generated from each cross-sectional panel of the circuit board 400 to generate the multiple point values. Therefore, before the detection begins, one of the multiple cross-sectional panels can be selected as the focal plane to be detected. The radiation light can be focused on the selected cross-sectional panel, and the radiation detector 140 can receive a clear image of the selected cross-sectional panel. In addition, other information generated from other cross-sectional panels in the radiation image may be blurred. When the multiple radiation images are weighted and combined, other information generated from other cross-sectional panels may be diluted.

[0099] In some embodiments, the first cross-sectional plate 410 may be initially selected as the focal plane. When the detection point P1 is located at a first target position (x ) on the first cross-sectional plate 410 in FIG. 5A , 11 ,y 11 , z1)411, the radiation detector 140 can detect the radiation at the detection plane 141 (for example, at z dA first detection position (x′) on the plane 11 ,y′ 11 ,z d )1411, a first point value I is received for the detection point P1 P11 (x′ 11 ,y′ 11 ,z d ). In addition, when the carrier plate 110 rotates from a first rotation angle ω1 to a second rotation angle ω2, the position of the detection point P1 is changed from the first target position (x 11 ,y 11 , z1) 411 is converted to a second target position (x 12 ,y 12 , z1)412, the radiation detector 140 can be at a second detection position (x′) of the detection plane 141. 12 ,y′ 12 ,z d )1412, a second point value I is received for the detection point P1 P12 (x′ 12 ,y′ 12 ,z d ). However, since the center point of the radiation source 160 and the first detection position (x′) 11 ,y′ 11 ,z d ) a first distance between a radial line segment 163 and 1411 It may be shorter than the distance between the center point of the radiation source 160 and the second detection position (x′ 12 ,y′ 12 ,z d ) 1412 a second distance between a radial line segment 164 The first point value I P11 (x′ 11 ,y′ 11 ,z d ) can be greater than the second point value I P12 (x′ 12 ,y′ 12 ,z d ) intensity. Therefore, when the multiple radiation images are weightedly combined to reconstruct the sample image of the first cross-sectional plate 410, each point value I of the detection point P1 P1k (x′ 1k ,y′ 1k ,z d ) can be respectively compared with the distance value Perform weighted combination to generate the plurality of pixel values ​​in the sample image of the first cross-sectional plate 410 The weighted combination equation is shown below:

[0100] In addition, although each point value I of the detection point P1 P1k (x′ 1k ,y′ 1k ,z d ) may include some information generated from other cross-sectional plates (eg, the second cross-sectional plate 420), but when the plurality of point values ​​I of the detection point P1 P1k (x′ 1k ,y′ 1k ,z d ) and the multiple distances When performing weighted combination, information generated from other cross-sectional panels may be diluted. To display the sample image of the first cross-sectional panel 410, the detection device 1 may select a first sample angle from the multiple rotation angles and use the coordinate values ​​generated by rotating the first cross-sectional panel at the first sample angle. For example, the first sample angle may be the first rotation angle ω1.

[0101] In addition, when all pixel values ​​of the sample image of the first cross-sectional plate 410 are generated, the second cross-sectional plate 420 can be selected as the focal plane to reconstruct the sample image of the second cross-sectional plate 420. When the detection point P2 is located at a third target position (x 21 ,y 21 , z2)421, the radiation detector 140 can be at a third detection position (x′) of the detection plane 141. 21 ,y′ 21 ,z d )1421, a third point value I is received for the detection point P2 P21 (x′ 21 ,y′ 21 ,z d ). In addition, when the carrier plate 110 rotates from the first rotation angle ω1 to the second rotation angle ω2, the position of the detection point P2 is changed from the first target position (x 21 ,y 21 , z2) 421 is converted to a fourth target position (x 22 ,y 22 , z2)422, the radiation detector 140 can be at a fourth detection position (x′) on the detection plane 141. 22 ,y′ 22 ,z d )1412, a fourth value I is received for the detection point P2 P22 (x′ 22,y′ 22 ,z d ). When the plurality of radiation images are weightedly combined to reconstruct the sample image of the second cross-sectional plate 420, each point value I of the detection point P2 P2k (x′ 2k ,y′ 2k ,z d ) can be respectively compared with the distance value Perform weighted combination to generate the plurality of pixel values ​​in the sample image of the second cross-sectional plate 420 The weighted combination equation is shown below:

[0102] In addition, although each point value I of the detection point P2 P2k (x′ 2k ,y′ 2k ,z d ) may include some information generated from other cross-sectional plates (eg, the first cross-sectional plate 410), but when the plurality of point values ​​I of the detection point P2 P2k (x′ 2k ,y′ 2k ,z d ) and the multiple distances When performing weighted combination, the information generated from other cross-sectional panels may be diluted. To display the sample image of the second cross-sectional panel 420, the detection device 1 can select a second sample angle from the multiple rotation angles and use the coordinate values ​​generated by rotating the second cross-sectional panel at the second sample angle. The first sample angle can be the same as or different from the second sample angle. For example, the second sample angle can be the second rotation angle ω2.

[0103] In some other embodiments, the circuit board 400 may be pre-moved by the plate movement unit 120, so that the detection point in the detected area is moved to a target position. When the light source rotation unit rotates the radiation source 160 to the multiple first rotation angles, the radiation source 160 may be correspondingly moved to multiple light source positions. When the radiation source 160 is located at each of the multiple light source positions, the detection point in the detected area of ​​the circuit board 400 is detected at the target position and generates multiple point values, each of which is included in one of the multiple radiation images. For example, when the radiation source 160 is rotated to a specific one of the multiple first rotation angles and the radiation detector 140 receives the specific one of the multiple radiation images, the radiation source 160 may be moved to the specific one of the multiple light source positions, and the radiation detector 140 may be moved to the specific one of the multiple detection positions to detect the detection point and determine the specific one of the multiple point values. Therefore, each light source position and each point value of the radiation light source 160 can correspond to one first rotation angle of the plurality of first rotation angles and one radiation image of the plurality of radiation images.

[0104] The distance between radiation source 160 and radiation detector 140 can affect the intensity of the multiple radiation images. As the distance between radiation source 160 and radiation detector 140 increases, the intensity of the multiple radiation images decreases. Therefore, when the light source position changes due to rotation, the intensity of the multiple point values ​​for the detection point in the multiple radiation images may also change. Therefore, to ensure that the multiple pixel values ​​of the reconstructed sample image are correct, computing unit 10 may perform a weighted combination of the multiple radiation images and multiple distance value sets to reconstruct the sample image of the detected area.

[0105] By weightedly combining the multiple point values ​​of the detection point with the multiple detection distances, a specific pixel value from the multiple pixel values ​​in the sample image can be generated for the detection point. The multiple detection distances can include a specific set of distance values ​​corresponding to the detection point from the multiple sets of distance values. Furthermore, each detection distance can be determined based on a corresponding one of the multiple light source positions. In other words, each detection distance can also be determined based on a corresponding one of the multiple detection positions.

[0106] A plurality of straight lines can be connected from the multiple light source positions of the radiation source 160, through the target position, and then to a corresponding one of the multiple detection positions of the radiation detector 140. Each detection distance can be the same as the length of a corresponding one of the plurality of straight lines. A specific one of the plurality of straight lines can be connected from the center point of the radiation plane 161 of the radiation source 160 at the specific light source position, through the target position, and then to the detection plane 141 of the radiation detector 140. The specific one of the plurality of detection distances corresponding to the specific light source position can be the same as the length of the specific one of the straight lines.

[0107] Figures 5C and 5D , according to one or more techniques of the present disclosure, respectively illustrate two schematic diagrams of the radiation detector 140, circuit board 400, and radiation source 160 illustrated in Figure 4A . When the circuit board 400 is detected by a detection device, it can be viewed as having multiple cross-sectional plates on the XY plane (e.g., a third cross-sectional plate 430 on the z3 plane and a fourth cross-sectional plate 440 on the z4 plane). In some embodiments, both the third cross-sectional plate 430 and the fourth cross-sectional plate 440 can be a single XY plane.

[0108] In addition, since the radiation light can penetrate the circuit board 400, the radiation image can be a combination of multiple panel values ​​generated from each cross-sectional panel of the circuit board 400 to generate the multiple point values. Therefore, before the detection begins, one of the multiple cross-sectional panels can be selected as the focal plane to be detected. The radiation light can be focused on the selected cross-sectional panel, and the radiation detector 140 can receive a clear image of the selected cross-sectional panel. In addition, other information generated from other cross-sectional panels in the radiation image may be blurred. When the multiple radiation images are weighted and combined, other information generated from other cross-sectional panels may be diluted.

[0109] In some embodiments, the third cross-sectional plate 430 may be initially selected as the focal plane. A detection point P3 in the detected area may be located at a fifth target position (x ) on the third cross-sectional plate 430 in FIG. 5C . 31 ,y 31 , z3) 431. When the radiation source 160 is located at a first light source position (x s1 ,y s1 ,z s )1601, the radiation detector 140 may detect the radiation at the detection plane 141 (e.g., at z d A fifth detection position (x′) on the plane 31 ,y′ 31 ,z d )1431, a fifth point value I is received for the detection point P3 P31 (x′31 ,y′ 31 ,z d ). In addition, when the radiation source 160 rotates from the first rotation angle ω1 to the second rotation angle ω2, so as to move the radiation source from the first light source position (x s1 ,y s2 ,z s )1601 switches to a second light source position (x in FIG5D s2 ,y s2 ,z s )1602, the radiation detector 140 may be at a sixth detection position (x′) on the detection plane 141. 32 ,y′ 32 ,z d )1432, a sixth value I is received for the detection point P3 P32 (x′ 32 ,y′ 32 ,z d However, at the first light source position (x s1 ,y s1 ,z s )1601 and the center point of the radiation source 160 and the fifth detection position (x′ 31 ,y′ 31 ,z d )1431 a third distance of a radial line segment 165 between Possibly related to the second light source position (x s2 ,y s2 ,z s )1602 and the center point of the radiation source 160 and the sixth detection position (x′ 32 ,y′ 32 ,z d )1432 a fourth distance of a radial line segment 166 between is different, so the fifth point value is I P31 (x′ 31 ,y′ 31 ,z d ) may be related to the sixth point value I P32 (x′ 32 ,y′ 32 ,z d ) have different intensities. Therefore, when the multiple radiation images are weightedly combined to reconstruct the sample image of the third cross-sectional plate 430, each point value I of the detection point P3 P3k (x′ 3k ,y′ 3k ,z d ) can be respectively compared with the distance value Perform weighted combination to generate the plurality of pixel values ​​in the sample image of the third cross-sectional plate 430 The weighted combination equation is shown below:

[0110] In addition, although each point value I of the detection point P3 P3k (x′ 3k ,y′ 3k ,z d ) may include some information generated from other cross-sectional plates (eg, the fourth cross-sectional plate 440), but when the plurality of point values ​​I of the detection point P3 P3k (x′ 3k ,y′ 3k ,z d ) and the multiple distances When performing weighted combination, information generated from other cross-sectional panels may be diluted. To display the sample image of the third cross-sectional panel 430, the detection device 1 may select a first sample angle from the multiple rotation angles and use the coordinate values ​​generated by rotating the third cross-sectional panel 430 at the first sample angle. For example, the first sample angle may be the first rotation angle ω1.

[0111] Furthermore, when all pixel values ​​of the sample image of the third cross-sectional plate 430 are generated, the fourth cross-sectional plate 440 can be selected as the focal plane to reconstruct the sample image of the fourth cross-sectional plate 440. A detection point P4 in the detected area can be located at a sixth target position (x 41 ,y 41 , z4) 441. When the radiation light source 160 is located at the first light source position (x s1 ,y s1 ,z s )1601, the radiation detector 140 may detect the radiation at the detection plane 141 (e.g., at z d A seventh detection position (x′) on the plane 41 ,y′ 41 ,z d )1441, a seventh point value I is received for the detection point P4 P41 (x′ 41 ,y′ 41 ,z d ). In addition, when the radiation light source 160 rotates from the first rotation angle ω1 to the second rotation angle ω2, the radiation light source is converted to the second light source position (x s2 ,y s2 ,z s)1602, the radiation detector 140 may be at an eighth detection position (x′) on the detection plane 141. 42 ,y′ 42 ,z d )1442, receives an eighth point value I for the detection point P4 P42 (x′ 42 ,y′ 42 ,z d ). Therefore, when the plurality of radiation images are weightedly combined to reconstruct the sample image of the fourth cross-sectional plate 440, each point value I of the detection point P4 P4k (x′ 4k ,y′ 4k ,z d ) can be respectively compared with the distance value Perform weighted combination to generate the plurality of pixel values ​​in the sample image of the fourth cross-sectional plate 440 The weighted combination equation is shown below:

[0112] In addition, although each point value I of the detection point P4 P4k (x′ 4k ,y′ 4k ,z d ) may include some information generated from other cross-sectional plates (eg, the third cross-sectional plate 430), but when the plurality of point values ​​I of the detection point P4 P4k (x′ 4k ,y′ 4k ,z d ) and the multiple distances When performing weighted combination, the information generated from other cross-sectional panels may be diluted. To display the sample image of the fourth cross-sectional panel 440, the detection device 1 can select a second sample angle from the multiple rotation angles and use the coordinate values ​​generated by rotating the fourth cross-sectional panel 440 at the second sample angle. The first sample angle can be the same as or different from the second sample angle. For example, the second sample angle can be the second rotation angle ω2.

[0113] At block 350 , the detection device 1 creates a three-dimensional (3D) image of the circuit board based on the sample image.

[0114] The detection device 1 can receive a sample image for each cross-sectional panel of the circuit board 400. The detection device 1 can combine all the sample images to reconstruct a three-dimensional image of the detected area of ​​the circuit board 400. When reconstructing the three-dimensional image, coordinate values ​​generated based on the same sample angle can be used to generate the multiple sample images of the multiple cross-sectional panels of the circuit board 400. For example, the multiple sample images of the first cross-sectional panel 410 and the second cross-sectional panel 420 can be generated based on the first rotation angle ω1.

[0115] FIG6 shows a schematic diagram of the circuit board 400 illustrated in FIG4A according to one or more techniques of the present disclosure. The circuit board 400 may include a plurality of through-holes 401. In some embodiments, the circuit board 400 may be a printed circuit board (PCB), and the plurality of through-holes 401 may be a plurality of plated through holes (PTHs). In some embodiments, the detected area 610 may be an area that includes at least one of the plurality of through-holes 401. In some embodiments, the detected area 620 may be an area that does not include any through-holes 401.

[0116] The radiation light can penetrate the circuit board 400 and be received by the radiation detector 140. To clearly capture the internal structure of the detected area 610 (e.g., the plurality of through-holes 401) of the circuit board 400, the radiation detector 140 can be moved along the third movement direction to select a detection position. The detection position can be related to at least one of the thickness or internal structure of the circuit board 400. For example, when the circuit board 400 is a thick workpiece, the detection position can be close to the optical axis 162.

[0117] 2B and 6 , when the detection device 1 completes all steps of the detection method 300 for the detected area 610, the plate moving unit 120 can further move the carrier plate 110 for subsequent detection to set an area adjacent to the detected area 610 as the detected area 620. When the detection device 1 completes all steps of the detection method 300 for each area of ​​the circuit board 400, the circuit board 400 can be removed from the detection device 1.

[0118] Figures 7A and 7B illustrate schematic cross-sectional views of a circuit board before and after a backdrilling process, respectively, according to one or more techniques disclosed herein. In Figure 7A , the circuit board before the backdrilling process may be circuit board 7100. In some embodiments, circuit board 7100 may include a through-hole 7110, a coating layer 7120, multiple circuit layers 7130, and a signal layer 7140. In some embodiments, signal layer 7140 may be disposed between two adjacent circuit layers in the multiple circuit layers 7130. In some embodiments, through-hole 7110 may extend through circuit board 7100. In some embodiments, coating layer 7120 may be disposed inside through-hole 7110. In some embodiments, if circuit board 7100 is a PCB, coating layer 7120 may be a copper coating layer.

[0119] In some embodiments, before drilling a back-drilled hole in the through-hole 7110 of the circuit board 7100, the detection device 1 may generate a sample image by weighted combination of the multiple radiation images, and estimate at least one drilling parameter of the back-drilled hole based on the three-dimensional image created from the sample image. In some embodiments, the at least one drilling parameter may include a drilling position, a drilling diameter, a drilling depth, and / or a drilling angle, etc., related to the back-drilled hole.

[0120] In some embodiments, the at least one drilling parameter may include the drilling depth of the back-drilled hole. The detection device 1 may measure a redundant length Db between a board surface 7101 of the circuit board 7100 and a signal line 7141 of the signal layer 7140 based on the three-dimensional image to evaluate the drilling depth that is less than the redundant length Db. In some embodiments, the signal line 7141 may be located on a surface of the signal layer 7140. The surface of the signal layer 7140 may be a signal layer surface that is closer to the board surface 7101. Therefore, the redundant length Db may also be the distance between the board surface 7101 and the surface of the signal layer 7140. In some embodiments, when measuring the redundant length Db, the board through hole 7110 between the board surface 7101 and the signal layer 7140 is not connected to other signal layers.

[0121] In some embodiments, please refer to Figure 1A and Figure 7A together. Since the detection device 1 can evaluate the drilling depth of the back-drilled hole by weightedly combining the sample image generated by the multiple radiation images and establishing the three-dimensional image based on the sample image, the detection device 1 can accurately evaluate the drilling depth less than the redundant length Db while accurately measuring the redundant length Db. Therefore, the back-drilling device 2 can accurately drill the hole based on the three-dimensional image without damaging the signal layer 7140.

[0122] In some embodiments, the at least one drilling parameter may include a drilling position and a drilling aperture of the back-drilled hole. The detection device 1 measures a through-hole position of the plate through-hole 7110 of the circuit board 7100 based on the three-dimensional image to evaluate the drilling position and the drilling aperture of the back-drilled hole. In some embodiments, the through-hole position may be represented by the through-hole center of the plate through-hole 7110. In some embodiments, the through-hole center may be directly used as a drilling center of the back-drilled hole, and the drilling center may be used to represent the drilling position of the back-drilled hole. In some embodiments, if the plate through-hole 7110 is cylindrical, the through-hole aperture Ab of the plate through-hole 7110 may be a diameter of the plate through-hole 7110. In some embodiments, if the plate through hole 7110 is not cylindrical, the plate through hole 7110 may have a through hole wall 7111 surrounding the through hole center, and the through hole diameter Ab may be the longest distance between the through hole walls 7111 of the plate through hole 7110. In some embodiments, the through hole diameter Ab may be twice the distance from the through hole center to the through hole wall 7111. In some embodiments, since the coating layer 7120 may be disposed inside the plate through hole 7110, the range defined by the through hole diameter Ab based on the through hole center may include the entire coating layer 7120. Therefore, if the drilling center is the through hole center and the drilling diameter is greater than the through hole diameter Ab, the coating layer 7120 within the drilling depth range will be removed, so that no residual film layer of the coating layer 7120 will be left on the back-drilled hole. Therefore, the drilling hole diameter may be greater than twice the distance from the drilling position to the longest radius of the through hole wall 7111 of the plate through hole 7110 .

[0123] In some embodiments, please refer to Figure 1A and Figure 7A in combination. Since the detection device 1 can evaluate the drilling position and drilling diameter of the back-drilled hole by weighted combination of the sample image generated by the multiple radiation images and based on the three-dimensional image established by the sample image, the detection device 1 can accurately evaluate the drilling position of the back-drilled hole and the drilling diameter greater than the through-hole diameter Ab while accurately measuring the through-hole center and through-hole diameter Ab of the plate through-hole 7110. Therefore, the back-drilling device 2 can perform precise drilling based on the three-dimensional image to avoid the residual film layer of the coating layer 7120 on the back-drilled hole after drilling the plate through-hole 7110.

[0124] In some embodiments, the at least one drilling parameter may include the drilling angle of the backdrilled hole. The detection device 1 measures the tilt angle of the through-hole 7110 in the circuit board 7100 based on the three-dimensional image to assess the drilling angle as substantially equal to the tilt angle. In some embodiments, the through-hole 7110 may have a through-hole wall 7111. The detection device 1 measures the tilt of the through-hole wall 7111 in the circuit board 7100 relative to a vertical direction based on the three-dimensional image to determine the tilt angle of the through-hole 7110. In some embodiments, the coating layer 7120 may have a coating surface 7121. The detection device 1 measures the tilt of the coating surface 7121 in the circuit board 7100 relative to the vertical direction based on the three-dimensional image to determine the tilt angle of the through-hole 7110. In some embodiments, if the tilt angle of the through-hole 7110 is zero, the backdrilling device 2 may drill the through-hole 7110 vertically. However, if the inclination angle of the plate through hole 7110 is not zero, and the backdrilling device 2 only drills vertically during drilling of the plate through hole 7110, the deviation of the inclination angle may result in residual film of the coating layer 7120 on the backdrilled hole. Therefore, the backdrilling device 2 can ensure that the coating layer 7120 within the drilling depth range is removed by adjusting the drilling angle relative to the vertical direction, so that no residual film of the coating layer 7120 is left on the backdrilled hole.

[0125] In some embodiments, please refer to Figure 1A and Figure 7A together. Since the detection device 1 can evaluate the drilling angle of the back-drilled hole by weightedly combining the sample image generated by the multiple radiation images and establishing the three-dimensional image based on the sample image, the detection device 1 can accurately evaluate the drilling angle that is substantially equal to the tilt angle while accurately measuring the tilt angle. Therefore, the back-drilling device 2 can accurately drill based on the three-dimensional image to avoid the residual film layer of the coating layer 7120 on the back-drilled hole after drilling at the plate through hole 7110.

[0126] In Figure 7B , the circuit board after the backdrilling process may be circuit board 7200. In some embodiments, circuit board 7200 may include a through-hole 7210, a coating layer 7220, multiple circuit layers 7230, a signal layer 7240, and a backdrilled hole 7250. In some embodiments, circuit board 7200 may be the circuit board formed by drilling a hole in circuit board 7100 using backdrilling device 2. Therefore, the only difference between circuit board 7200 and circuit board 7100 is the backdrilled hole 7250.

[0127] Figure 8 shows a cross-sectional view of a circuit board 800 according to one or more techniques of the present disclosure. In some embodiments, circuit board 800 may include a through-hole 810, a coating layer 820, multiple circuit layers 830, a signal layer 840, a back-drilled via 850, a film layer 860, and a pad 870. In some embodiments, after drilling through-hole 810 in circuit board 800 to create back-drilled via 850, detection device 1 may evaluate at least one material parameter of circuit board 800 by weighted-combining a sample image generated by the multiple radiation images and constructing a three-dimensional image based on the sample image. In some embodiments, the at least one material parameter may include parameters related to circuit board 800, such as a through-hole aperture Ab, a through-hole film thickness Th, a film thickness Tf, a pad aperture Ap, a redundant residual height Hr, and an overall thickness Tb.

[0128] In some embodiments, the through-hole diameter Ab may be the diameter of the plate through-hole 810. In some embodiments, the plate through-hole 810 may have a through-hole wall 811 surrounding a through-hole center of the plate through-hole 810, and the through-hole diameter Ab may be the longest distance between the through-hole walls 7111 of the plate through-hole 7110. In some embodiments, the through-hole film thickness Th may be the film thickness of the plating layer 820. In some embodiments, the plating layer 820 of the printed circuit board PCB may be a copper plating layer, and the through-hole film thickness Th of the printed circuit board PCB may be the hole copper thickness. In some embodiments, the plate film thickness Tf may be the film thickness of the plate film layer 860 on the outside of the circuit board 800. In some embodiments, the plate film layer of the printed circuit board PCB may be a copper plate film layer, and the plate film thickness Tf of the printed circuit board PCB may be the surface copper thickness. In some embodiments, the pad aperture Ap may be the pad size of the pad 870 on the outside of the circuit board 800. In some embodiments, the redundant remaining height Hr can be the height of the remaining plating layer 820 between the bottom of the back-drilled hole 850 and the signal layer 840. In some embodiments, the redundant remaining height Hr can be the stub height of the remaining plating layer between the back-drilled hole 850 and the signal layer 840. In some embodiments, the overall board thickness Tb can be the overall thickness of the circuit board 800.

[0129] In some embodiments, after drilling the through hole 810 on the circuit board 800 to generate the back-drilled hole 850, the detection device 1 can confirm a drilling status of the back-drilled hole 850 by weighted combining the sample image generated by the multiple radiation images and establishing the three-dimensional image based on the sample image. The drilling status may include (1) confirming whether the back-drilled hole 850 penetrates the signal layer 840, (2) whether there is a residual film layer of the coating layer 820 on the back-drilled hole 850, and (3) whether the distance between the bottom of the drill hole of the back-drilled hole 850 and the signal layer 840 is less than a predetermined thickness.

[0130] In some embodiments, the detection device 1 can confirm whether the backdrilled hole 850 has penetrated the signal layer 840 by weightedly combining the sample image generated by the multiple radiation images and constructing a three-dimensional image based on the sample image. FIG9A shows a perspective view generated based on a three-dimensional image of a circuit board according to one or more techniques disclosed herein. The perspective view of FIG9A clearly shows the through hole 910, signal layer 940, and signal line 941 of the circuit board. As shown in FIG9A, the connection between the signal layer 940 and the signal line 941 has not been cut off. In other words, after the circuit board is drilled by the backdrill device 2, the backdrill device 2 does not penetrate the signal layer 940, so that the signal layer 940 and the signal line 941 can remain connected.

[0131] Figures 9B to 9D respectively show respective cross-sectional views of different cross-sectional plates of the circuit board in the perspective view illustrated in Figure 9A, according to one or more techniques of the present disclosure. In the perspective view of the circuit board illustrated in Figure 9A, Figure 9B shows a cross-sectional view of a first cross-sectional plate with a back-drilled hole. The circuit board has a first plate surface and a second plate surface relative to the first plate surface. In some embodiments, the first cross-sectional plate is closer to the first plate surface and farther away from the second plate surface. As shown in Figure 9B, since there is no strong white aperture in the cross-sectional view of the first cross-sectional plate, the back-drilling device 2 has completely drilled out the coating layer of the first cross-sectional plate, making it impossible for the detection device 1 to reflect the radiation light through the metal conductive material in the coating layer.

[0132] According to the perspective view of the circuit board illustrated in FIG9A , FIG9C shows a cross-sectional view of a second section plate where the bottom of the back-drilled hole is located. In some embodiments, the distance between the second section plate and the surface of the first plate is greater than the distance between the first section plate and the surface of the first plate, and the distance between the second section plate and the surface of the second plate is less than the distance between the first section plate and the surface of the second plate. If one gradually observes from the first section plate at the bottom of FIG9A toward the inside of the circuit board, a clear white aperture begins to appear in the cross-sectional view of the second section plate. Since the back-drilling device 2 does not drill out the coating layer 920 of the second section plate, the detection device 1 can reflect the radiated light through the metal conductive material in the coating layer 920. Therefore, the image of the coating layer 920 can be clearly seen on the second section plate where the bottom of the back-drilled hole is located.

[0133] Based on the perspective view of the circuit board illustrated in FIG9A , FIG9D shows a cross-sectional view of a third cross-sectional plate, where signal layer 940 and signal line 941 are located. In some embodiments, the distance between the third cross-sectional plate and the surface of the first plate is greater than the distance between the second cross-sectional plate and the surface of the first plate, and the distance between the third cross-sectional plate and the surface of the second plate is less than the distance between the second cross-sectional plate and the surface of the second plate. From the first cross-sectional plate at the bottom of FIG9A to the second cross-sectional plate, and further into the interior of the circuit board, a distinct white line segment begins to appear in the cross-sectional view of the third cross-sectional plate. Because the backdrilling device 2 only drilled into the second cross-sectional plate, the third cross-sectional plate was not drilled by the backdrilling device 2, and thus the image of the coating layer 920 is still clearly visible in the third cross-sectional plate. Furthermore, since the third cross-sectional plate clearly shows the white line segment caused by the reflection of radiation from the metal conductive material in the signal line 941, the third cross-sectional plate is located in the signal layer 940 containing the signal line 941. 9D , since the connection between the coating layer 920 and the signal line 941 is not broken by the drilling of the backdrill device 2 , the detection device 1 can confirm that the backdrilled hole has not penetrated the signal layer 940 based on the 3D image created by the sample image.

[0134] Please refer to FIG8 . In some embodiments, the detection device 1 can determine whether there is a residual film layer of the coating layer 820 on the back-drilled hole 850 by weightedly combining the sample image generated by the multiple radiation images and establishing the three-dimensional image based on the sample image. FIG10 shows a perspective view generated based on a three-dimensional image of a circuit board according to one or more techniques disclosed herein. The perspective view of FIG10 is shown with the back-drilled holes facing upward. The circuit board includes a plurality of plate through-holes 1010 , wherein a white line (the line segment circled by the white frame line) is located above each of the two plate through-holes 1010 . Both of these white lines come from a residual film layer 1021 of the coating layer remaining on the back-drilled holes.

[0135] In some embodiments, after the backdrilling device 2 drills a through-hole 1010 on a circuit board to create a backdrilled hole, the coating layer surrounding the through-hole 1010 within the drilling depth range may also be removed by the backdrilling device 2. In some drilling situations, portions of the coating layer are not completely removed, resulting in a residual film layer 1021 surrounding the backdrilled hole. In some embodiments, because the residual film layer 1021 is itself a remnant of the coating layer, the metallic conductive material in the residual film layer 1021 can reflect radiation, resulting in an image of the residual film layer 1021 surrounding the backdrilled hole. Therefore, the detection device 1 can determine whether there is any residual coating layer on the backdrilled hole based on the three-dimensional image created from the sample image.

[0136] Referring to FIG. 8 , in some embodiments, the detection device 1 can determine whether the distance between the bottom of a backdrilled via 850 and the signal layer 840 is less than a predetermined thickness based on the three-dimensional image created by weighted combination of the sample images generated by the multiple radiation images. In some embodiments, the distance between the bottom of the backdrilled via 850 and the signal layer 840 is approximately equal to the redundant residual height Hr. In some embodiments, the shorter the distance between the bottom of the backdrilled via 850 and the signal layer 840, the shorter the redundant residual height Hr, resulting in fewer unnecessary film layers in the coating layer 820. Therefore, fewer unnecessary film layers can reduce unnecessary signal interference. However, to prevent the drilling device 2 from drilling through the signal layer, a predetermined thickness between the bottom of the backdrilled via 850 and the signal layer 840 can be pre-set as a drilling reference, allowing the drilling device 2 to estimate the required drilling depth before drilling. In addition, the detection device 1 can also use the preset thickness as an evaluation benchmark to assess whether unnecessary excess film layers have been reduced to a tolerable range.

[0137] In some embodiments, the detection device 1 can create the three-dimensional image by weighted combination of the sample images generated by the multiple radiation images and based on the multiple sample images generated by the multiple different cross-sections of the circuit board. Therefore, the detection method 300 and the detection device 1 of the present disclosure can directly obtain various parameters through the establishment of a three-dimensional image after comprehensive image capture, without the need to adjust the imaging angle multiple times for different measurement purposes in order to select the best imaging result manually determined from different shooting results. In addition, after the three-dimensional image is established, the arrangement and density of the components in the circuit board will not affect the measurement of parameters and the judgment of the component status, but the sampling of general images is easily affected by the arrangement and density of the components, which may obscure the object to be measured. In addition, due to the establishment of the three-dimensional image, the cross-sectional view of any block can also be generated at any time through the three-dimensional image. In some embodiments, since the three-dimensional image is generated by the detection method 300 of the present invention using the sample image generated by weighted combination of the multiple radiation images, the three-dimensional image can accurately present the actual conditions of the components on the circuit board and the relative relationships between the components.

[0138] The embodiments shown and described above are merely examples. Many details are commonly found in the art. Therefore, many of these details are neither shown nor described. Although many features and advantages of the present disclosure have been described in the foregoing description along with details of its structure and function, this disclosure is illustrative only, and changes may be made in the details. It should therefore be understood that the above-described embodiments may be modified within the scope of the claims.

Claims

1. A detection device for detecting a circuit board, the detection device comprising: a carrier plate configured to receive the circuit board; a plate rotating unit coupled to the carrier plate and configured to rotate the carrier plate along a rotation axis at a plurality of rotation angles; a radiation light source configured to emit a radiation light, wherein an optical axis of the radiation light is parallel to the rotation axis; a radiation detector configured to detect the radiation light to receive a plurality of radiation images for a detected area of ​​the circuit board, wherein: The radiation source and the radiation detector are respectively disposed on two different sides of the carrier plate, and When the plate rotating unit rotates the carrier plate to a specific rotation angle among the plurality of rotation angles, the radiation detector receives a specific radiation image among the plurality of radiation images; and An image adjustment unit is coupled to the radiation detector and configured to determine a plurality of pixel values ​​by weighted combination of the plurality of radiation images to reconstruct a sample image of the detected area, wherein the sample image is used to establish a three-dimensional image of the circuit board.

2. The detection device according to claim 1, wherein: When the plate rotating unit rotates the carrier plate at the plurality of rotation angles, a detection point in the detected area of ​​the circuit board is correspondingly moved to a plurality of target positions; When the detection point is located at the plurality of target positions respectively, the detection point is detected to generate a plurality of point values, each of the plurality of point values ​​being included in one of the plurality of radiation images; By combining the plurality of point values ​​with a plurality of detection distances for weighted combination, a specific pixel value among the plurality of pixel values ​​in the sample image of the detected area is generated for the detection point; and The plurality of detection distances are each determined based on a corresponding one of the plurality of target positions.

3. The detection device as claimed in claim 2, wherein: The radiation source is disposed at a light source position; Each of the plurality of detection distances is the length of a corresponding one of the plurality of straight line segments; and The plurality of straight line segments are respectively connected from the light source position through the corresponding one of the plurality of target positions to the radiation detector.

4. The detection device as claimed in claim 1, further comprising: a light source moving unit coupled to the radiation light source and configured to move the radiation light source along a first moving direction, wherein the first moving direction is parallel to the rotation axis; and A detection moving unit is coupled to the radiation detector and configured to move the radiation detector along a second moving direction and / or a third moving direction, wherein the second moving direction is parallel to the rotation axis, and the third moving direction is perpendicular to the rotation axis.

5. The detection device as claimed in claim 4, wherein: A light source distance between the circuit board and a radiation plane of the radiation light source along the first moving direction is determined by the light source moving unit; A detection distance between a detection plane of the radiation detector and the radiation plane of the radiation light source along the first moving direction is determined by the light source moving unit and the detection moving unit; and The magnifications of the plurality of radiation images are determined based on the light source distance and the detection distance along the first moving direction.

6. The detection device as claimed in claim 1, wherein the circuit board comprises: Multiple circuit layers; a signal layer disposed between two adjacent circuit layers among the plurality of circuit layers; A plate through hole, which passes through the circuit board; as well as A coating layer is arranged on the inner side of the through hole of the plate.

7. The detection device of claim 6, wherein before drilling the plate through hole on the circuit board to produce a back-drilled hole, the detection device evaluates at least one drilling parameter of the back-drilled hole based on the three-dimensional image established by weighted combination of the sample image generated by the multiple radiation images.

8. The detection device as claimed in claim 7, wherein: The at least one drilling parameter includes a drilling depth of the back-drilled hole, and The detection device measures a plate surface of the circuit board to the signal layer based on the three-dimensional image. A redundant length between signal lines is determined to estimate the drilling depth that is smaller than the redundant length.

9. The detection device according to claim 7, wherein: The at least one drilling parameter includes a drilling position and a drilling aperture of the back-drilled hole, The detection device measures a through hole position of the plate through hole based on the three-dimensional image to evaluate the drilling position and the drilling hole diameter of the back-drilled hole, and The drilling hole diameter is greater than twice the distance from the drilling position to a longest radius of a through hole wall of the plate through hole, so as to avoid a residual film layer of the coating layer on the back-drilled hole after drilling the plate through hole.

10. The detection device as claimed in claim 6, wherein after drilling the plate through hole on the circuit board to generate a back-drilled hole, the detection device confirms a drilling condition of the back-drilled hole based on the three-dimensional image established by weighted combination of the sample image generated by the multiple radiation images.

11. The detection device of claim 10, wherein the confirmed drilling condition comprises at least one of the following conditions: (1) Confirm whether the back-drilled hole penetrates the signal layer; (2) confirming whether there is a residual film layer of the coating layer on the back-drilled hole; and (3) Confirm whether the distance between the bottom of a drill hole of the back-drilled hole and the signal line is less than a preset thickness.

12. A detection method, which is a detection method for detecting a circuit board by a detection device, the detection method comprising: Receiving the circuit board on a carrier plate, wherein the carrier plate is rotatable along a rotation axis at a plurality of rotation angles; Using a radiation light source of the detection device, emitting a radiation light toward the circuit board, wherein an optical axis of the radiation light is parallel to the rotation axis; The radiation light is detected by a radiation detector of the detection device to receive a plurality of radiation images of a detected area in the circuit board, wherein: The radiation source and the radiation detector are respectively disposed on two different sides of the carrier plate, and When the carrier plate is rotated to a specific rotation angle among the plurality of rotation angles, receiving a specific radiation image among the plurality of radiation images; Determining a plurality of pixel values ​​by weighted combination of the plurality of radiation images to reconstruct a sample image of the detected area; and A three-dimensional image of the circuit board is created based on the sample image.

13. The detection method according to claim 12, wherein: When the carrier plate rotates at the plurality of rotation angles, a detection point in the detected area of ​​the circuit board is correspondingly moved to a plurality of target positions; When the detection point is located at the plurality of target positions respectively, the detection point is detected to generate a plurality of point values, each of the plurality of point values ​​being included in one of the plurality of radiation images; By combining the plurality of point values ​​with a plurality of detection distances for weighted combination, a specific pixel value among the plurality of pixel values ​​in the sample image of the detected area is generated for the detection point; and The plurality of detection distances are each determined based on a corresponding one of the plurality of target positions.

14. The detection method according to claim 13, wherein: The radiation source is disposed at a light source position; Each of the plurality of detection distances is the length of a corresponding one of the plurality of straight line segments; and The plurality of straight line segments are respectively connected from the light source position through the corresponding one of the plurality of target positions to the radiation detector.

15. The detection method according to claim 12, wherein: The radiation source is movable along a first moving direction, wherein the first moving direction is parallel to the rotation axis; and The radiation detector is capable of moving along a second moving direction and / or a third moving direction, wherein the second moving direction is parallel to the rotation axis and the third moving direction is perpendicular to the rotation axis.

16. The detection method according to claim 15, wherein: The magnifications of the plurality of radiation images are determined based on a first vertical distance between the circuit board and a radiation plane of the radiation light source and a second vertical distance between a detection plane of the radiation detector and the radiation plane of the radiation light source.

17. The detection method as claimed in claim 12, wherein the circuit board further comprises: Multiple circuit layers; a signal layer disposed between two adjacent circuit layers among the plurality of circuit layers; A plate through hole, which passes through the circuit board; as well as A coating layer is arranged on the inner side of the through hole of the plate.

18. The detection method of claim 17, wherein before drilling the plate through hole on the circuit board to produce a back-drilled hole, the detection device evaluates at least one drilling parameter of the back-drilled hole based on the three-dimensional image established by weighted combination of the sample image generated by the multiple radiation images.

19. The detection method according to claim 18, wherein: The at least one drilling parameter includes a drilling depth of the back-drilled hole, and The detection device measures a redundant length between a plate surface of the circuit board and a signal line of the signal layer based on the three-dimensional image to evaluate the drilling depth that is less than the redundant length.

20. The detection method of claim 18, wherein: The at least one drilling parameter includes a drilling position and a drilling aperture of the back-drilled hole, The detection device measures a through hole position of the plate through hole based on the three-dimensional image to evaluate the drilling position and the drilling hole diameter of the back-drilled hole, and The drilling hole diameter is greater than twice the distance from the drilling position to a longest radius of a through hole wall of the plate through hole, so as to avoid a residual film layer of the coating layer on the back-drilled hole after drilling the plate through hole.

21. The detection method as claimed in claim 17, wherein after drilling the plate through hole on the circuit board to produce a back-drilled hole, the detection device confirms a drilling condition of the back-drilled hole based on the three-dimensional image established by weighted combination of the sample image generated by the multiple radiation images.

22. The detection method of claim 21, wherein the confirmed drilling condition comprises at least one of the following conditions: (1) Confirm whether the back-drilled hole penetrates the signal layer; (2) confirming whether there is a residual film layer of the coating layer on the back-drilled hole; and (3) Confirm whether the distance between the bottom of a drill hole of the back-drilled hole and the signal line is less than a preset thickness.

23. A detection device for detecting a circuit board, the detection device comprising: a carrier plate configured to receive the circuit board; a radiation source configured to emit a radiation light; a light source rotating unit coupled to the radiation light source and configured to rotate the radiation light source along a rotation axis at a plurality of first rotation angles, wherein the rotation axis is parallel to an optical axis of the radiation light; a radiation detector configured to detect the radiation light to receive a plurality of radiation images for a detected area of ​​the circuit board, wherein: The radiation source and the radiation detector are respectively disposed on two different sides of the carrier plate, and When the light source rotating unit rotates the radiation light source to a specific first rotation angle among the plurality of first rotation angles, the radiation detector receives a specific radiation image among the plurality of radiation images; and An image adjustment unit is coupled to the radiation detector and configured to determine a plurality of pixel values ​​by weighted combination of the plurality of radiation images to reconstruct a sample image of the detected area, wherein the sample image is used to establish a three-dimensional image of the circuit board.

24. The detection device of claim 23, wherein: When the light source rotating unit rotates the radiation light source at the plurality of first rotation angles, the radiation light source is correspondingly moved to a plurality of light source positions; When the radiation light source is located at the plurality of light source positions respectively, a detection point in the detected area of ​​the circuit board is detected to generate a plurality of point values, each of the plurality of point values ​​being included in one of the plurality of radiation images; By combining the plurality of point values ​​with a plurality of detection distances for weighted combination, a specific pixel value among the plurality of pixel values ​​in the sample image of the detected area is generated for the detection point; and The plurality of detection distances are each determined based on a corresponding one of the plurality of light source positions.

25. The detection device of claim 24, wherein: The detection point is located at a target position; Each of the plurality of detection distances is the length of a corresponding one of the plurality of straight line segments; and The plurality of straight line segments respectively start from the corresponding one of the plurality of light source positions, The target location is linked to the radiation detector.

26. The detection device of claim 23, further comprising: a light source moving unit coupled to the radiation light source and configured to move the radiation light source along a first moving direction, wherein the first moving direction is parallel to the rotation axis; and A detection moving unit is coupled to the radiation detector and configured to move the radiation detector along a second moving direction and / or a third moving direction, wherein the second moving direction is parallel to the rotation axis, and the third moving direction is perpendicular to the rotation axis.

27. The detection device of claim 26, wherein: A light source distance between the circuit board and a radiation plane of the radiation light source along the first moving direction is determined by the light source moving unit; A detection distance between a detection plane of the radiation detector and the radiation plane of the radiation light source along the first moving direction is determined by the light source moving unit and the detection moving unit; and The magnifications of the plurality of radiation images are determined based on the light source distance and the detection distance along the first moving direction.

28. The detection device as claimed in claim 23, wherein the circuit board comprises: Multiple circuit layers; a signal layer disposed between two adjacent circuit layers among the plurality of circuit layers; A plate through hole, which passes through the circuit board; as well as A coating layer is arranged on the inner side of the through hole of the plate.

29. The detection device of claim 28, wherein before drilling the plate through hole on the circuit board to produce a back-drilled hole, the detection device evaluates at least one drilling parameter of the back-drilled hole based on the three-dimensional image established by weighted combination of the sample image generated by the multiple radiation images.

30. The detection device of claim 29, wherein: The at least one drilling parameter includes a drilling depth of the back-drilled hole, and The detection device measures a redundant length between a plate surface of the circuit board and a signal line of the signal layer based on the three-dimensional image to evaluate the drilling depth that is less than the redundant length.

31. The detection device of claim 29, wherein: The at least one drilling parameter includes a drilling position and a drilling aperture of the back-drilled hole, The detection device measures a through hole position of the plate through hole based on the three-dimensional image to evaluate the drilling position and the drilling hole diameter of the back-drilled hole, and The drilling hole diameter is greater than twice the distance from the drilling position to a longest radius of a through hole wall of the plate through hole, so as to avoid a residual film layer of the coating layer on the back-drilled hole after drilling the plate through hole.

32. The detection device as claimed in claim 28, wherein after drilling the plate through hole on the circuit board to produce a back-drilled hole, the detection device confirms a drilling condition of the back-drilled hole based on the three-dimensional image established by weighted combination of the sample image generated by the multiple radiation images.

33. The detection device of claim 32, wherein the confirmed drilling condition comprises at least one of the following conditions: (1) Confirm whether the back-drilled hole penetrates the signal layer; (2) confirming whether there is a residual film layer of the coating layer on the back-drilled hole; and (3) Confirm whether the distance between the bottom of a drill hole of the back-drilled hole and the signal line is less than a preset thickness.

34. The detection device of claim 23, further comprising: a detection rotation unit, coupled to the radiation detector and configured to rotate the radiation detector along the rotation axis at a plurality of second rotation angles, wherein: Each of the plurality of second rotation angles corresponds one-to-one to one of the plurality of first rotation angles, and When the light source rotating unit rotates the radiation light source to the specific first rotation angle among the plurality of first rotation angles, the detection rotating unit correspondingly rotates the radiation detector to a specific second rotation angle among the plurality of second rotation angles.

35. A detection method, which is a detection method for detecting a circuit board by a detection device, the detection method comprising: receiving the circuit board on a carrier plate; A radiation light source of the detection device is used to emit a radiation light toward the circuit board, wherein: The radiation source is rotatable along a rotation axis at a plurality of first rotation angles; and An optical axis of the radiation light is parallel to the rotation axis; The radiation light is detected by a radiation detector of the detection device to receive the radiation from the circuit board. A plurality of radiation images of a detected area, wherein: The radiation source and the radiation detector are respectively disposed on two different sides of the carrier plate, and When the radiation light source is rotated to a specific first rotation angle among the plurality of first rotation angles, receiving a specific radiation image among the plurality of radiation images; Determining a plurality of pixel values ​​by weighted combination of the plurality of radiation images to reconstruct a sample image of the detected area; and A three-dimensional image of the circuit board is created based on the sample image.

36. The detection method of claim 35, wherein: When the radiation light source rotates at the plurality of first rotation angles, the radiation light source is correspondingly moved to a plurality of light source positions; When the radiation light source is located at the plurality of light source positions respectively, a detection point in the detected area of ​​the circuit board is detected to generate a plurality of point values, each of the plurality of point values ​​being included in one of the plurality of radiation images; By combining the plurality of point values ​​with a plurality of detection distances for weighted combination, a specific pixel value among the plurality of pixel values ​​in the sample image of the detected area is generated for the detection point; and The plurality of detection distances are each determined based on a corresponding one of the plurality of light source positions.

37. The detection method of claim 36, wherein: The detection point is located at a target position; Each of the plurality of detection distances is the length of a corresponding one of the plurality of straight line segments; and The plurality of straight line segments are respectively connected from the corresponding one of the plurality of light source positions through the target position to the radiation detector.

38. The detection method of claim 35, wherein: The radiation source is movable along a first moving direction, wherein the first moving direction is parallel to the rotation axis; and The radiation detector is capable of moving along a second moving direction and / or a third moving direction, wherein the second moving direction is parallel to the rotation axis and the third moving direction is perpendicular to the rotation axis.

39. The detection method according to claim 38, wherein: The magnifications of the plurality of radiation images are determined based on a first vertical distance between the circuit board and a radiation plane of the radiation light source and a second vertical distance between a detection plane of the radiation detector and the radiation plane of the radiation light source.

40. The detection method of claim 35, wherein the circuit board comprises: Multiple circuit layers; a signal layer disposed between two adjacent circuit layers among the plurality of circuit layers; A plate through hole, which passes through the circuit board; as well as A coating layer is arranged on the inner side of the through hole of the plate.

41. The detection method as described in claim 40, before drilling the plate through hole on the circuit board to produce a back-drilled hole, the detection device evaluates at least one drilling parameter of the back-drilled hole based on the three-dimensional image established by weighted combination of the sample image generated by the multiple radiation images.

42. The detection method of claim 41, wherein: The at least one drilling parameter includes a drilling depth of the back-drilled hole, and The detection device measures a redundant length between a plate surface of the circuit board and a signal line of the signal layer based on the three-dimensional image to evaluate the drilling depth that is less than the redundant length.

43. The detection method of claim 41, wherein: The at least one drilling parameter includes a drilling position and a drilling aperture of the back-drilled hole, The detection device measures a through hole position of the plate through hole based on the three-dimensional image to evaluate the drilling position and the drilling hole diameter of the back-drilled hole, and The drilling hole diameter is greater than twice the distance from the drilling position to a longest radius of a through hole wall of the plate through hole, so as to avoid a residual film layer of the coating layer on the back-drilled hole after drilling the plate through hole.

44. The detection method as described in claim 40, wherein after drilling the plate through hole on the circuit board to produce a back-drilled hole, the detection device confirms a drilling condition of the back-drilled hole based on the three-dimensional image established by weighted combination of the sample image generated by the multiple radiation images.

45. The detection method of claim 44, wherein the confirmed drilling condition comprises at least one of the following conditions: (1) Confirm whether the back-drilled hole penetrates the signal layer; (2) confirming whether there is a residual film layer of the coating layer on the back-drilled hole; and (3) Confirm whether the distance between the bottom of a drill hole of the back-drilled hole and the signal line is less than a preset thickness.

46. ​​The detection method of claim 35, wherein: The radiation detector is capable of rotating along the rotation axis at a plurality of second rotation angles; Each of the plurality of second rotation angles corresponds one-to-one to one of the plurality of first rotation angles; and When the light source rotating unit rotates the radiation light source to a specific first rotation angle among the plurality of first rotation angles, the detection rotating unit correspondingly rotates the radiation detector to a specific second rotation angle among the plurality of second rotation angles.

Images