Molded product formation method and sealing resin

Abstract

The present invention addresses the problem of providing a molded product formation method which makes it possible to: provide a compression molding device and a compression molding method that make it possible to prevent occurrence of molding failure due to irregular winding, residual gas, and dust generation during molding and that make it possible to form a molded product having a thin resin portion; make handling before resin sealing easier; and prevent occurrence of breakage during handling. As a means for solving this problem, a molded product formation method according to the present invention comprises a carrier placement step for placing a carrier (C) such that the carrier (C) is in contact with the bottom of a cavity (108) of a mold, a resin placement step for placing a resin (Rm) in the cavity (108), a temporary molded product formation step for forming a temporary molded product by sealing the carrier (C) in the resin (Rm), and a molded product formation step for forming a molded product (Wp) by applying heat or pressure while a workpiece (W) including an electronic component is in contact with the temporary molded product.

Description

Method for forming molded product and sealing resin

[0001] The present invention relates to a method for forming a molded product and a sealing resin.

[0002] 2. Description of the Related Art As an example of a resin sealing apparatus and method for sealing a workpiece having electronic components with sealing resin to form a molded product, a method using a compression molding method is known.

[0003] The compression molding method is a technology in which a predetermined amount of encapsulating resin is supplied to an encapsulation area (cavity) provided in an encapsulating mold comprising an upper mold and a lower mold, a workpiece is placed in the encapsulating area, and the upper and lower molds are clamped together to encapsulate the workpiece. For example, when using an encapsulating mold with a cavity in the upper mold, a technology is known in which the encapsulating resin is supplied all at once to the center of the workpiece for molding. On the other hand, when using an encapsulating mold with a cavity in the lower mold, a technology is known in which a release film (hereinafter sometimes simply referred to as a "film") covering the mold surface including the cavity and the encapsulating resin are supplied for molding (see Patent Document 1: JP 2019-145550 A).

[0004] JP 2019-145550 A

[0005] Conventionally, the so-called lower die cavity movable compression molding method, in which the workpiece is held in the upper die, a cavity is provided in the lower die, and sealing resin (granular resin, for example) is supplied into the cavity, has been widely adopted, as it was thought to have advantages in terms of preventing deformation of the workpiece due to contact caused by the flow of the sealing resin or the flow of the wire.

[0006] However, in a configuration in which a workpiece is held in an upper mold and a cavity is provided in a lower mold, there are issues such as difficulty in holding the workpiece in the upper mold when the workpiece is thin or large, making it prone to falling. Furthermore, when granular resin is used as the encapsulating resin, there are issues such as dust generation during molding due to friction between resin particles, difficulty in handling, and difficulty in evenly supplying (spraying) the encapsulating resin over the entire area of ​​the cavity provided in the lower mold, which can easily result in uneven spreading. Furthermore, there is an issue of molding defects easily occurring, such as air trapped in the gaps between the particles during spraying and gas components degassed from the encapsulating resin during melting remaining as voids in the molded product.

[0007] On the other hand, when a solid resin having a fixed shape, rather than a granular resin or a liquid resin, is used as the sealing resin, regardless of the arrangement of the cavities, the following problem has become clear. Specifically, when attempting to form a molded product thin enough that the resin thickness after resin sealing (specifically, the thickness of the resin portion above or below the workpiece after resin sealing) is 0.4 mm or less, the thickness of the sealing resin (solid resin) before resin sealing must also be thin. However, the sealing resin (solid resin) before resin sealing is naturally in a state before full curing, so it has low rigidity (brittleness) and low strength, and this has revealed a problem in that it is extremely susceptible to breakage during handling (especially during transportation).

[0008] The present invention has been made in consideration of the above circumstances, and aims to provide a compression molding device and compression molding method that can prevent molding defects caused by uneven scattering, residual gas, and dust generation during molding, and that can form molded products with thin resin portions, and that can facilitate handling before resin sealing and prevent breakage during handling, as well as a method for forming molded products and sealing resin.

[0009] The present invention solves the above problems by the means for solving the problems described below as embodiments.

[0010] A method for forming a molded product according to one embodiment comprises a carrier placing step in which a carrier, which is a plate-shaped member, is placed so that the carrier is in contact with the bottom surface of a cavity of a mold; a resin placing step in which resin is placed in the cavity after the carrier placing step; a temporary molded product forming step in which a temporary molded product is formed by sealing the carrier placed in the carrier placing step with the resin placed in the resin placing step; and a molded product forming step in which a molded product is formed by heating or pressurizing a workpiece having electronic components in contact with the temporary molded product.

[0011] It is also preferable to include a carrier peeling step of peeling the carrier from the molded product, and a step of forming the temporary molded product by sealing the carrier peeled in the carrier peeling step with the resin.

[0012] Moreover, the sealing resin according to one embodiment is a sealing resin that is made up of a carrier that is a plate-like member and a resin, and is required to have an exposed portion in which the carrier is exposed in a part of the sealing resin.

[0013] Furthermore, it is preferable that the sealing resin has a resin sealing portion on the surface on which the exposed portion is formed, where the carrier is not exposed, outside the exposed portion.

[0014] In addition, a method for forming a sealing resin according to one embodiment is a method for forming a sealing resin to be used in compression molding of a workpiece, and is required to include a forming step for forming the sealing resin, which is a solid resin fixed in a state in which the carrier is exposed on one side of the base resin.

[0015] By performing compression molding using the encapsulating resin formed according to the above embodiment, molding defects due to uneven distribution, residual gas, and dust generation during molding can be prevented. Furthermore, handling of the encapsulating resin can be facilitated, and breakage during handling can be prevented, especially when forming thin molded products with a resin thickness of 0.4 mm or less. Furthermore, by applying this configuration in which a cavity is provided in the upper mold and the workpiece is held in the lower mold, problems such as the workpiece falling can be resolved.

[0016] It is also preferable that a powder resin is used as the base resin, and the forming step includes a step of tableting the powder resin to form the sealing resin, which is a solid resin of a predetermined shape to which the carrier is fixed.

[0017] The predetermined shape is preferably a shape in which, in a plan view, the carrier is disposed in the center and the base resin is disposed on the periphery so as to cover the outer periphery of the carrier.

[0018] Furthermore, it is preferable that the forming step includes a step of returning the carrier peeled from the compression-molded product to the device that forms the sealing resin and using it again when forming the sealing resin.

[0019] Furthermore, an apparatus for forming sealing resin according to one embodiment is an apparatus for forming sealing resin used in compression molding of a workpiece, and is required to include a tableting mold that holds a base resin and a carrier and tablets the sealing resin, which is a solid resin of a predetermined shape to which the carrier is fixed.

[0020] Furthermore, the sealing resin according to another embodiment is a sealing resin used for compression molding of a workpiece, and is a solid resin that is fixed to one side of the base resin with the carrier exposed.

[0021] According to the present invention, it is possible to form an encapsulating resin that can achieve the following effects. That is, by using the encapsulating resin according to the present invention, it is possible to realize a compression molding apparatus and a compression molding method that can prevent molding defects caused by uneven sprinkling, residual gas, and dust generation during molding, and can form molded products with thin resin portions. In addition, it is possible to facilitate handling before resin encapsulation. In addition, it is possible to prevent breakage during handling.

[0022] FIG. 1 is a plan view showing an example of an apparatus for forming an encapsulating resin according to an embodiment of the present invention. FIG. 2 is a side view showing an example of a first press device of the forming apparatus shown in FIG. 1. FIG. 3 is a front cross-sectional view showing an example of a first mold of the forming apparatus shown in FIG. 1. FIG. 4 is a front cross-sectional view showing another example of the first mold of the forming apparatus shown in FIG. 1. FIG. 5 is an explanatory diagram illustrating an example of a method for forming an encapsulating resin according to an embodiment of the present invention. FIG. 6 is an explanatory diagram continuing from FIG. 5. FIG. 7A is a plan view showing an example of an encapsulating resin according to an embodiment of the present invention. FIG. 7B is a cross-sectional view taken along line A-A in FIG. 7A. FIG. 7C is a cross-sectional view showing another example of an encapsulating resin. FIG. 8 is an explanatory diagram continuing from FIG. 6. FIG. 9 is a plan view showing an example of a compression molding apparatus in which an encapsulating resin according to an embodiment of the present invention is used. FIG. 10 is a side view showing an example of a second press device of the compression molding apparatus shown in FIG. 9. FIG. 11 is a front cross-sectional view showing an example of a second mold of the compression molding apparatus shown in FIG. 9. FIG. 12 is an explanatory diagram illustrating an example of a compression molding method in which an encapsulating resin according to an embodiment of the present invention is used. FIG. 13 is an explanatory diagram continuing from FIG. 12. FIG. 14 is an explanatory diagram continuing from FIG. 13. 15A to 15C are front cross-sectional views showing examples of a molded product formed by a compression molding apparatus and a compression molding method using the sealing resin according to an embodiment of the present invention, where FIG. 15A shows the state before the carrier peeling process, FIG. 15B shows the state after the carrier peeling process, and FIG. 15C shows the state after the cutting process. FIG. 16 is a side view showing an example of a third press device of the compression molding apparatus shown in FIG. 9. FIG. 17 is a front cross-sectional view showing an example of a third mold of the compression molding apparatus shown in FIG. 9. FIG. 18 is an explanatory diagram illustrating another example of a compression molding method using the sealing resin according to an embodiment of the present invention. FIG. 19 is an explanatory diagram continuing from FIG. 18. FIG. 20 is an explanatory diagram continuing from FIG. 19. FIG. 21 is an explanatory diagram illustrating another example of a compression molding method using the sealing resin according to an embodiment of the present invention. FIG. 22 is an explanatory diagram illustrating another example of a compression molding method using the sealing resin according to an embodiment of the present invention.

[0023] (Apparatus for Forming Encapsulating Resin) The encapsulating resin R according to an embodiment of the present invention is a resin used in compression molding of a workpiece (molded product) W. First, an apparatus 1 for forming encapsulating resin R (hereinafter, sometimes simply referred to as a "forming apparatus") will be described. The forming apparatus 1 may be installed either inside or outside a compression molding apparatus 2. FIG. 1 is a plan view (schematic diagram) showing an example of the forming apparatus 1. For ease of explanation, arrows in the figure indicate the left-right direction (X direction), front-back direction (Y direction), and up-down direction (Z direction) of the apparatus. Furthermore, in all the drawings used to explain each embodiment, components having the same function are designated by the same reference numerals, and repeated explanations thereof may be omitted.

[0024] The workpiece W, which is the object to be molded, is configured with electronic components. Examples of electronic components include coil sheets, semiconductor chips, MEMS chips, passive elements, heat sinks, conductive materials, spacers, etc. The workpiece W may be configured to consist solely of electronic components, or may be configured to be mounted on a substrate (by wire bonding, flip-chip mounting, etc.). Examples of substrates include rectangular or circular plate-shaped members such as resin substrates, ceramic substrates, metal substrates, carrier plates, lead frames, and wafers. The number of electronic components constituting the workpiece W is not particularly limited and may be one or more.

[0025] In this embodiment, a base resin Rm to which a carrier C is fixed is used as the sealing resin R (details of the forming apparatus and forming method will be described later). As an example, the carrier C is a plate-like member formed of a metal material (e.g., copper, copper alloy, etc.) with a thickness of approximately 0.1 mm to 0.5 mm, but is not limited to this.

[0026] In this embodiment, a thermosetting resin (such as, but not limited to, a filler-containing epoxy resin) is used as the base resin Rm and the sealing resin R. A powder resin (powder-like resin) having thermosetting properties is preferably used as the base resin Rm (details will be described later). However, the base resin Rm is not limited to this, and granular resin, crushed resin, solid resin, liquid resin, or a resin that combines two or more of these may also be used.

[0027] Suitable examples of the film F include film materials having excellent heat resistance, ease of peeling, flexibility, and extensibility, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene polymer), PET, FEP, fluorine-impregnated glass cloth, polypropylene, and polyvinylidine chloride. The film F is also used when forming the sealing resin R in the resin forming section 50 described below.

[0028] As shown in Fig. 1, the forming apparatus 1 mainly comprises a base resin supply unit 10D that supplies base resin Rm and carrier C, and a resin forming unit 10E that forms encapsulating resin R using base resin Rm and carrier C. As an example, the base resin supply unit 10D and the resin forming unit 10E are arranged in this order along the X direction in Fig. 1. However, the above configuration is not limited to this, and the equipment configuration within the unit, the number of units, the arrangement order of the units, etc. may be changed. Furthermore, a configuration including units other than those described above (not shown) may also be used.

[0029] Furthermore, the forming apparatus 1 has guide rails 20 provided linearly across the units, and a conveying device (first loader) 21 that conveys the base resin Rm and the carrier C is provided so as to be movable between the units along the guide rails 20. However, the configuration is not limited to the above, and the conveying device may be configured to include a robot hand or the like instead of a loader.

[0030] Furthermore, in the forming apparatus 1, a control unit 80 that controls the operation of each mechanism in each unit is disposed in the base resin supply unit 10D (although it may be disposed in another unit).

[0031] Next, the base resin supply unit 10D provided in the forming apparatus 1 will be described in detail. The base resin supply unit 10D includes a carrier supply section 30 that supplies carriers C and a base resin supply section 40 that supplies base resin Rm. As an example, the carrier supply section 30 is configured with a storage section (e.g., a stocker) that stores multiple carriers C (a pickup, a stage, etc. may also be provided as appropriate). The base resin supply section 40 is configured with a dispenser that supplies base resin Rm, a conveying device, etc. Note that when transporting the carriers C and base resin Rm from the base resin supply unit 10D to the resin forming unit 10E, the conveying device may be a first loader 21 or another conveying device (not shown) (for base resin Rm, direct spraying from a dispenser may also be employed).

[0032] Next, the resin forming unit 10E provided in the forming apparatus 1 will be described in detail. The resin forming unit 10E is provided with a resin forming section 50 as an apparatus for forming the sealing resin R using the base resin Rm and the carrier C. In this embodiment, two resin forming units 10E (or three or more or one) are provided, and one resin forming section 50 (or two or more) is provided per resin forming unit 10E (see FIG. 1). However, the present invention is not limited to this configuration.

[0033] The resin forming section 50 is equipped with a tableting die (first die) 102 having a pair of dies that open and close (for example, a combination of a plurality of die blocks, die plates, die pillars, and other components made of alloy tool steel). It also has a press device (first press device) 150 that drives the first die 102 to open and close. As an example, two first press devices 150 are provided, but a single device or a plurality (three or more) devices (not shown) may also be provided (not shown). A side view (schematic diagram) of the first press device 150 is shown in FIG. 2, and a front cross-sectional view (schematic diagram) of the first die 102 is shown in FIG. 3.

[0034] As shown in FIG. 2 , the first press apparatus 150 includes a pair of platens 154, 156, a plurality of tie bars 152 between which the pair of platens 154, 156 are supported, and a drive device for moving (raising and lowering) the platen 156. Specifically, the drive device includes a drive source (e.g., an electric motor) 160 and a drive transmission mechanism (e.g., a ball screw or a toggle link mechanism) 162 (but is not limited to this). In this embodiment, the upper platen 154 in the vertical direction is configured as a fixed platen (a platen fixed to the tie bars 152), and the lower platen 156 is configured as a movable platen (a platen slidably held by the tie bars 152 and raised and lowered). However, the present invention is not limited to this configuration. The platens may be configured upside down, i.e., the upper platen may be configured as a movable platen and the lower platen as a fixed platen, or both the upper and lower platens may be configured as movable platens (all not shown).

[0035] 3, the first mold 102 includes a first upper mold 104 on the vertical side and a first lower mold 106 on the vertical side as a pair of molds disposed between the pair of platens 154, 156 of the first press device 150. The first upper mold 104 is assembled to the upper platen (in this embodiment, the fixed platen 154), and the first lower mold 106 is assembled to the lower platen (in this embodiment, the movable platen 156). The first upper mold 104 and the first lower mold 106 move toward and away from each other to close and open the mold (the vertical direction (up and down direction) is the mold opening and closing direction). In the first mold 102 according to this embodiment, the first upper mold 104 constitutes a so-called "pestle mold," and the first lower mold 106 constitutes a so-called "mortar mold."

[0036] Next, the first lower mold 106 of the first mold 102 will be described in detail. As shown in Figure 3, the first lower mold 106 includes a lower mold chase (first lower mold chase) 110, a cavity piece (first cavity piece) 126 held therein, a clamper (first clamper) 128, and the like. The first lower mold chase 110 is fixed to the upper surface of a support plate (first support plate) 114 via a support pillar (first support pillar) 112. A cavity (first cavity) 108 is provided on the upper surface of the first lower mold 106 (the surface facing the first upper mold 104). One carrier C and a predetermined amount of base resin Rm are accommodated in this first cavity 108.

[0037] The first clamper 128 is configured in an annular shape to surround the first cavity piece 126, and is assembled to the upper surface of the first support plate 114 via a pushing pin (first pushing pin) 122 and a clamper spring (first clamper spring) 124 (a biasing member such as a coil spring) so as to be spaced apart (floating) and movable up and down (however, this assembly structure is not limited). The first cavity piece 126 forms the innermost portion (bottom) of the first cavity 108, and the first clamper 128 forms the side portion of the first cavity 108. As an example, the upper surface of the first cavity piece 126 (the surface facing the first upper mold 104) is formed flat. The shape and number of first cavities 108 provided in one first lower mold 106 are set appropriately (one or multiple).

[0038] Here, the first press device 150 is provided with a lower die film supply unit (first lower die film supply unit) 111 that supplies film F to cover the die surface 106a (predetermined area) including the inner surface of the first cavity 108 in the first lower die 106. Note that, as an example, the film F is in a roll shape, but it may also be in a strip shape.

[0039] Furthermore, the first lower mold 106 is provided with suction paths (holes, grooves, etc.) (not shown) that communicate with a suction device at the boundaries between the first clamper 128 and the first cavity piece 126. This allows the film F supplied from the first lower mold film supply unit 111 to be sucked and held on the mold surface 106a, including the inner surface of the first cavity 108.

[0040] Furthermore, in this embodiment, a first lower die heating mechanism (not shown) is provided that heats the first lower die 106 to a predetermined temperature. This first lower die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control unit 80. As an example, the heater is built into the first lower die chase 110 and is configured to apply heat to the entire first lower die 106 and to the carrier C and base resin Rm contained in the first cavity 108. At this time, the first lower die 106 is heated to a predetermined temperature (e.g., 50°C to 80°C) at which thermal curing (main curing) of the base resin Rm does not proceed easily.

[0041] Next, the first upper die 104 of the first mold 102 will be described in detail. As shown in Figure 3, the first upper die 104 has a tableting plate (first plate) 142 held (fixed) by an upper die chase (first upper die chase) 140. This tableting plate (first plate) 142 presses the carrier C and a predetermined amount of base resin Rm contained in the first cavity 108 of the first lower die 106, thereby forming (tabletting) the sealing resin R having a predetermined shape with the carrier C fixed thereto (the forming method will be described in detail later). As an example, the lower surface of the first plate 142 (the surface facing the first lower die 106) is formed flat.

[0042] Here, the first press device 150 is provided with an upper die film supply unit (first upper die film supply unit) 113 that supplies film F to cover the die surface 104a (predetermined area) of the first upper die 104. Note that, as an example, the film F is in a roll shape, but it may also be in a strip shape.

[0043] Furthermore, the first upper mold 104 has suction paths (holes, grooves, etc.) (not shown) that communicate with a suction device provided in the first plate 142, etc. This allows the film F supplied from the first upper mold film supply unit 113 to be adsorbed and held on the mold surface 104a.

[0044] Furthermore, in this embodiment, a first upper die heating mechanism (not shown) is provided that heats the first upper die 104 to a predetermined temperature. This first upper die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control unit 80. As an example, the heater is built into the first upper die chase 140 and is configured to apply heat to the entire first upper die 104. At this time, the first upper die 104 is heated to a predetermined temperature (e.g., 50°C to 80°C) that makes it difficult for the base resin Rm held (contained) in the first lower die 106 to undergo thermal curing (main curing).

[0045] The first mold 102 described above has a structure including a movable clamper (first clamper 128) as an example, but as another example, it may have a structure without a movable clamper as shown in FIG.

[0046] (Method for forming sealing resin) Next, a method for forming the sealing resin R according to this embodiment (hereinafter, may be simply referred to as the "forming method") will be described. As an example, the forming method can be carried out using the forming apparatus 1. Here, FIGS. 5 to 8 are explanatory views of the main steps.

[0047] First, a first preparation step is carried out. The first preparation step includes the following steps: a heating step (first lower mold heating step) is carried out in which the first lower mold 106 is heated by a first lower mold heating mechanism at a predetermined temperature (a temperature at which the base resin Rm and the sealing resin R do not fully cure, e.g., 50°C to 80°C); a heating step (first upper mold heating step) is carried out in which the first upper mold 104 is heated by a first upper mold heating mechanism at a predetermined temperature (a temperature at which the base resin Rm and the sealing resin R do not fully cure, e.g., 50°C to 80°C); and a lower mold film supply step (first lower mold film supply step) is carried out in which the first lower mold film supply unit 111 is operated to supply new film F and adsorb it so as to cover a predetermined region of the mold surface 106a, including the inner surface of the first cavity 108 in the first lower mold 106. In addition, an upper mold film supply process (first upper mold film supply process) is carried out in which the first upper mold film supply unit 113 is operated to supply new film F and adsorb it so as to cover a predetermined area of ​​the mold surface 104a of the first upper mold 104.

[0048] Before or after the first preparation step, or in parallel with the first preparation step, a forming step is carried out in which a base resin Rm having a carrier C fixed thereto is formed as the sealing resin R.

[0049] In one example of the forming process, a carrier C is supplied in the carrier supply unit 30. A predetermined amount of base resin Rm is supplied in the base resin supply unit 40 using a dispenser (not shown) or the like. Next, in the resin forming unit 50, a tableting process is carried out in which the carrier C and base resin Rm are tableted (an example of "pre-molding") to form a solid encapsulating resin R (a "pre-molded product") formed in a predetermined shape with the carrier C fixed thereto. Note that "solid" includes a state in which the resin has melted to the so-called B stage or a state immediately before melting, since the resin is tableted while heated to a temperature that does not fully cure. As an example, the carrier C was placed in the lower mold 106 before the base resin Rm was supplied, but the carrier C may also be attached to the underside of the film F of the upper mold 104.

[0050] Specifically, in the tableting process, the carrier C supplied from the carrier supply unit 30 is transported by a transport device (e.g., the first loader 21, etc.) and placed at a predetermined position (e.g., a central position) in the first cavity 108 of the first lower mold 106. Next, a predetermined amount of base resin Rm supplied from the base resin supply unit 40 is transported by a transport device (e.g., the first loader 21, etc.) or directly sprayed from a dispenser or the like and placed in the first cavity 108 of the first lower mold 106. As an example, the base resin Rm is placed on the carrier C previously placed in the first cavity 108 (see FIG. 5). Next, the first press device 150 is operated to close the first mold 102, which has been heated to the predetermined temperature (see FIG. 6). At this time, the first cavity piece 126 rises relatively within the first cavity 108, and the carrier C and base resin Rm are compressed (sandwiched and pressed) between the first cavity piece 126 and the first plate 142. As a result, a solid sealing resin R is formed that has a predetermined shape to which the carrier C is fixed and that is not thermally cured (fully cured).

[0051] As an example, the "predetermined shape" is a shape in which, in plan view, the carrier C is disposed in the center and the base resin Rm (in a solid state after tableting) is disposed around the periphery so as to cover the outer periphery Ca of the carrier C, as shown in FIG. 7A (a plan view with the exposed surface of the carrier C facing upward) and FIG. 7B (a cross-sectional view along line A-A in FIG. 7A ). (Note: Since the workpiece W is sandwiched between the top and bottom, a positioning step (not shown) for the workpiece W may be provided on the resin surface.) This can enhance the adhesion between the carrier C and the base resin Rm, thereby preventing unintended peeling. Note: The base resin Rm does not necessarily need to extend all the way outward at the ends. As shown in FIG. 7C (a cross-sectional view similar to FIG. 7B ), the carrier C and the base resin Rm may be substantially the same. Alternatively, a base resin Rm having a recess formed therein may be prepared, and the carrier C may be attached to the recess. Alternatively, a flat-plate-shaped carrier C may be attached to a simple flat-plate-shaped base resin Rm without a recess. The term "attaching" as used herein includes "sticking."

[0052] It is important that the above-mentioned tableting step be carried out at a temperature at which the thermosetting (main curing) of the base resin Rm does not proceed easily (the first lower mold 106 and the first upper mold 104 are heated to a temperature at which the thermosetting (main curing) does not proceed easily) so that the formed sealing resin R can be thermoset (main cured) in the subsequent resin sealing step. As described above, the "temperature at which the thermosetting (main curing) does not proceed easily" depends on the material of the base resin Rm, but is specifically about 50°C to 80°C (about 70°C in this embodiment).

[0053] It is also preferable to use a powder resin as the base resin Rm, since this allows the amount of resin to be adjusted and supplied with greater precision than when granular or crushed resin is used, although the base resin is not limited to a powder resin.

[0054] After the tableting step, the first mold 102 is opened, and a mold opening step (first mold opening step) is carried out (see FIG. 8 ) in which the sealing resin R (with the carrier C fixed to the lower surface side) is separated from the used film F to enable removal of the sealing resin R. In this embodiment, by providing the lower mold film supplying step and the upper mold film supplying step described above, the film F is disposed on both the mold surface 106 a of the first lower mold 106 and the mold surface 104 a of the first upper mold 104, which makes it easy to release the sealing resin R formed by tableting and prevents damage due to resin adhesion to the mold.

[0055] In addition, after or in parallel with the first mold opening process, a film supply process (first lower mold film supply process, first upper mold film supply process) is carried out in which the first lower mold film supply unit 111 and the first upper mold film supply unit 113 are operated to feed out the used film F from inside the first mold 102 and feed and set a new film F into the first mold 102.

[0056] The above are the main steps of the method for forming the sealing resin R according to this embodiment. However, the above order of steps is only an example, and the order of steps can be changed or steps can be performed in parallel as long as there is no problem.

[0057] As described above, when attempting to form a molded product Wp thin enough that the resin thickness after resin sealing (compression molding) (specifically, the thickness Da of the resin portion at the upper position of the workpiece W or the thickness Db of the resin portion at the lower position after resin sealing as shown in FIG. 15C ) is 0.4 mm or less, the thickness of the sealing resin (solid resin) before resin sealing must also be thin. However, since the sealing resin (solid resin) before resin sealing is in a state before full hardening, it naturally has low rigidity (brittle) and weak strength, which makes it extremely susceptible to breakage during handling (especially during transportation). It has also been confirmed that this is particularly pronounced in the case of sealing resin (solid resin) formed by tableting. In contrast, by performing resin sealing (compression molding) using the sealing resin R according to this embodiment, this problem can be solved, that is, breakage during handling (especially during transportation) of the sealing resin R can be prevented, and a molded product Wp with a thin resin portion can be formed. Incidentally, experiments by the inventors have verified that a shape where Da=Db=0.1 mm can also be realized.

[0058] Furthermore, by performing resin sealing (compression molding) using the sealing resin R of the above configuration, it is possible to solve or reduce the problems that have been encountered in the past, such as uneven distribution caused by granular resin, residual gas, and dust generation during molding, as well as the difficulty of handling.

[0059] (Compression molding apparatus and compression molding method) Next, an outline of a compression molding apparatus 2 and a compression molding method for resin sealing (compression molding) the workpiece W using the sealing resin R according to this embodiment will be described. Here, Fig. 9 is a plan view (schematic diagram) showing an example of the compression molding apparatus 2.

[0060] As shown in FIG. 9 , the compression molding apparatus 2 primarily comprises a supply unit 10A for supplying the workpieces W, a press unit 10B for sealing the workpieces W with resin and processing them into molded products Wp, and a storage unit 10C for storing the molded products Wp. As an example, the supply unit 10A, press unit 10B, and storage unit 10C are arranged in this order along the X direction in FIG. 9 . However, the above configuration is not limited to this, and the equipment configuration within the units, the number of units, and the order of unit arrangement may be changed. For example, the supply unit 10A and the storage unit 10C may be arranged in reverse in the X direction, or may be concentrated in one position (not shown). Furthermore, a configuration including units other than those described above may also be used (not shown).

[0061] Furthermore, the compression molding apparatus 2 has a linear guide rail 22 extending between each unit, and a conveying device (second loader) 23 for conveying the workpiece W and the encapsulating resin R (which may be used for conveying items other than the workpiece W and the encapsulating resin R) and a conveying device (third loader) 24 for conveying the molded product Wp (which may be used for conveying items other than the molded product Wp) are arranged to be movable between predetermined units along the guide rail 22. However, the configuration is not limited to the above, and a configuration may also be adopted in which a common (single) conveying device (loader) is provided for conveying the workpiece W, the encapsulating resin R, the molded product Wp, etc. (not shown). Furthermore, the conveying device may be configured to include a robot hand or the like instead of a loader.

[0062] In addition, in the compression molding device 2, a control unit 90 that controls the operation of each mechanism in each unit is disposed in the supply unit 10A (although it may be disposed in another unit).

[0063] The press unit 10B includes a resin sealing section 70 that seals the workpiece W with resin and processes it into a molded product Wp. In this embodiment, two press units 10B (or one or three or more) each equipped with the resin sealing section 70 are provided, with one resin sealing section 70 (or two or more) per press unit 10B (see FIG. 9 ). However, this configuration is not limiting. The resin sealing section 70 includes a pair of sealing dies (for example, a pair of dies assembled with a plurality of die blocks, die plates, die pillars, and other components made of alloy tool steel) that are opened and closed by a press device.

[0064] Here, as an example, the steps of a compression molding method performed using a compression molding apparatus 2 equipped with a second press device 250 (see Figure 10) and a second mold 202 (see Figure 11) will be described with reference to Figures 12 to 14.

[0065] First, a second preparation step is performed. Specifically, a heating step (second upper mold heating step) is performed in which the second upper mold 204 is heated to a predetermined temperature (e.g., 100°C to 300°C) using a second upper mold heating mechanism. A heating step (second lower mold heating step) is also performed in which the second lower mold 206 is heated to a predetermined temperature (e.g., 100°C to 300°C) using a second lower mold heating mechanism. A lower mold film supply step (second lower mold film supply step) is also performed in which the second lower mold film supply unit 211 is operated to supply new film F and adsorb it to cover a predetermined region of the mold surface 206a of the second lower mold 206. A top mold film supply step (second upper mold film supply step) is also performed in which the second upper mold film supply unit 213 is operated to supply new film F and adsorb it to cover a predetermined region of the mold surface 204a, including the inner surface of the second cavity 208 in the second upper mold 204.

[0066] Before, after, or in parallel with the second preparation step, a resin preparation step is carried out to prepare a base resin Rm to which the carrier C is fixed as the sealing resin R. Specifically, the sealing resin R formed by the forming device 1 described above is prepared.

[0067] After the second preparation step, a setting step is performed in which the sealing resin R and the workpiece W are set in a sealing mold (second mold 202). As shown in Fig. 12, the workpiece W is sandwiched between two sealing resins R arranged so that each carrier C faces outward, and is held (including placed) on a holder 205.

[0068] As an example of the setting process, one sealing resin R (for convenience of explanation, referred to as "first sealing resin R") prepared in the resin preparation process is transported by a transport device (e.g., second loader 23, etc.) and placed on the holder 205 with the surface on which the carrier C is exposed facing downward. Next, a work W supplied from the supply magazine 12 is transported by a transport device (e.g., second loader 23, etc.) and placed on the first sealing resin R. Next, another sealing resin R (for convenience of explanation, referred to as "second sealing resin R") prepared in the resin preparation process is transported by a transport device (e.g., second loader 23, etc.) and placed on the work W with the surface on which the carrier C is exposed facing upward.

[0069] Alternatively, as another example of the setting process, the first and second sealing resins R prepared in the resin preparation process and the workpieces W supplied from the supply magazine 12 are stacked so that the workpieces W are sandwiched between the two (first and second) sealing resins R arranged with their respective carriers C facing outward (i.e., the first sealing resin R is prepared with the surface on which the carriers C are exposed facing downward, the workpieces W are placed on the first sealing resin R, and the second sealing resin R is placed on the workpieces W with the surface on which the carriers C are exposed facing upward). Next, the stacked first sealing resin R, workpieces W, and second sealing resin R are transported by a transport device (e.g., the second loader 23, etc.) and placed on the holder 205. This has the advantage of transporting the workpieces W and two sealing resins R to the second mold 202 in one go, rather than separately. Furthermore, since the first sealing resin R and the second sealing resin R can be supplied simultaneously to the heated sealing mold (second mold 202), there is an advantage in that the thermal history does not change.

[0070] After all of the above steps are performed, a resin sealing process is performed in which the workpiece W is sealed with sealing resin R (sandwiched between two sealing resins R in this embodiment) to form a molded product Wp. Specifically, the second mold 202 is closed, and a mold closing process (second mold closing process) is performed in which the sealing resin R is heated and pressurized against the workpiece W (see FIG. 13 ). At this time, the second clamper 228 abuts against the lower plate 242 (mold surface 206 a) via the film F, and the second cavity piece 226 relatively descends within the second cavity 208. This mold closing process thermally hardens the sealing resin R, completing the resin sealing (compression molding), and forming a molded product Wp having the shape shown in FIG. 15A . Note that in this embodiment, the workpiece W is sandwiched between sealing resins R with carriers C from above and below and compression molded from above and below as shown in FIG. 12 . However, as another example, as shown in FIG. 21 , only one of the upper and lower sealing resins R with carriers C may be used, and the other may be sealing resin R without carriers C.

[0071] After the second mold closing step, the second mold 202 is opened, and the molded product Wp is separated from the used film F to enable removal of the molded product Wp (second mold opening step) (see FIG. 14 ). Next, the molded product carrying-out step is performed, in which the molded product Wp (for example, held by the holding portion 205 of the lower plate 242) is carried out of the second mold 202 by a conveying device (for example, the third loader 24, etc.) and transported to the storage unit 10C.

[0072] After or in parallel with the molded product removal process, the second lower mold film supply unit 211 and the second upper mold film supply unit 213 are operated to carry out a film supply process (second lower mold film supply process, second upper mold film supply process) in which the used film F is sent out from the second mold 202 and a new film F is sent into the second mold 202 and set.

[0073] After the molded product carrying-out step, a carrier peeling step is carried out in which the carrier C is peeled off from the molded product Wp using a carrier peeling device 16. This results in the formation of a molded product Wp having the shape shown in Fig. 15B. In this step, the molded product Wp may be inverted midway and the carriers C on the upper and lower surfaces may be peeled off in order using a single peeling mechanism, or the molded product Wp may not be inverted and the carriers C on the upper and lower surfaces may be peeled off separately using two peeling mechanisms.

[0074] After the carrier peeling step, a step is carried out in which the carrier C peeled from the molded product Wp is transported from the storage unit 10C to the resin forming unit 10E (or the base resin supply unit 10D) by a transport device (for example, the third loader 24, etc.) (the carrier C can be finally returned to the resin forming section 50). Note that if the carrier C is used as a heat sink or the like in the final product, it is not necessarily necessary to peel the carrier C.

[0075] According to the above configuration, the carrier C can be peeled from the molded product Wp and reused in the forming process in which the sealing resin R (i.e., the base resin Rm to which the carrier C is fixed) is formed in the forming device 1. Therefore, it is possible to reduce the number of parts (total number of required carriers C) and thereby reduce manufacturing costs. Furthermore, since it is not necessary to prepare a large number of carriers C in advance, it is possible to reduce the size of the device, particularly the size of the storage section for the carriers C (e.g., a stocker, etc.) and the installation space.

[0076] After the carrier peeling step, a cutting step is performed to cut the molded product Wp at a predetermined position (the position indicated by the dashed line in FIG. 15B ). Specifically, a cutting device 18 is used to cut the molded product Wp in the thickness direction within the region where the carrier C has been peeled off, and remove the outer edge. This allows the formation of a molded product Wp (final target shape) having the shape shown in FIG. 15C , i.e., a thin resin thickness (resin thickness at the upper or lower portion of the workpiece W).

[0077] After the cutting step, a storing step is carried out in which the molded product Wp (in this embodiment, the carrier C has been peeled off and the product has been cut at a predetermined position) is stored in the storage magazine 14. The carrier peeling device 16 and the cutting device 18 may be provided separately from the compression molding device 2, in which case the molded product Wp may be stored in a state in which it has not been peeled off or cut.

[0078] The above are the main steps of the compression molding method performed using the compression molding apparatus 2 (when the second mold 202 is provided). However, the above order of steps is only an example, and the order of steps can be changed or steps can be performed in parallel as long as there is no problem.

[0079] Next, as another example, the steps of a compression molding method performed using a compression molding apparatus 2 equipped with a third press device 350 (see Figure 16) and a third mold 302 (see Figure 17) will be described with reference to Figures 18 to 20.

[0080] First, a third preparation step is performed. Specifically, a heating step (third upper mold heating step) is performed in which the third upper mold 304 is heated to a predetermined temperature (e.g., 100°C to 300°C) using a third upper mold heating mechanism. A heating step (third lower mold heating step) is also performed in which the third lower mold 306 is heated to a predetermined temperature (e.g., 100°C to 300°C) using a third lower mold heating mechanism. A lower mold film supply step (third lower mold film supply step) is also performed in which the third lower mold film supply unit 311 is operated to supply new film F and adsorb it to cover a predetermined region of the mold surface 306a of the third lower mold 306, including the inner surface of the third cavity 308. A top mold film supply step (third upper mold film supply step) is also performed in which the third upper mold film supply unit 313 is operated to supply new film F and adsorb it to cover a predetermined region of the mold surface 304a of the third upper mold 304.

[0081] Before, after, or in parallel with the third preparation step, a resin preparation step is carried out to prepare a base resin Rm to which the carrier C is fixed as the sealing resin R. Specifically, the sealing resin R formed by the forming device 1 described above is prepared.

[0082] After the third preparation step, a setting step is performed in which the sealing resin R and the workpiece W are set in the sealing mold (third mold 302). As shown in Fig. 18 , the workpiece W is sandwiched between two sealing resins R arranged so that each carrier C faces outward, and is then held (including placed) in the third cavity 308 (on the third cavity piece 326).

[0083] As an example of the setting process, one sealing resin R (for convenience of explanation, referred to as the "first sealing resin R") prepared in the resin preparation process is transported by a transport device (e.g., the second loader 23, etc.) and placed in the third cavity 308 (on the third cavity piece 326) with the surface on which the carrier C is exposed facing downward. Next, a workpiece W supplied from the supply magazine 12 is transported by a transport device (e.g., the second loader 23, etc.) and placed on the first sealing resin R. Next, another sealing resin R (for convenience of explanation, referred to as the "second sealing resin R") prepared in the resin preparation process is transported by a transport device (e.g., the second loader 23, etc.) and placed on the workpiece W with the surface on which the carrier C is exposed facing upward.

[0084] Alternatively, as another example of the setting process, the first and second sealing resins R prepared in the resin preparation process and the workpiece W supplied from the supply magazine 12 are stacked so that the workpiece W is sandwiched between the two (first and second) sealing resins R arranged with their respective carriers C facing outward (i.e., the first sealing resin R is prepared with the surface on which the carrier C is exposed facing downward, the workpiece W is placed on the first sealing resin R, and the second sealing resin R is placed on the workpiece W with the surface on which the carrier C is exposed facing upward). Next, the stacked first sealing resin R, workpiece W, and second sealing resin R are transported by a transport device (e.g., the second loader 23, etc.) and placed in the third cavity 308 (on the third cavity piece 326). This has the advantage that the workpiece W and the two sealing resins R are transported to the third mold 302 at one time, rather than separately. Furthermore, since the first sealing resin R and the second sealing resin R can be supplied simultaneously to the heated sealing mold (third mold 302), there is an advantage in that the thermal history does not change.

[0085] After all of the above steps are performed, a resin sealing step is performed in which the workpiece W is sealed with sealing resin R (sandwiched between two sealing resins R in this embodiment) and processed into a molded product Wp. Specifically, the third mold 302 is closed, and a mold closing step (third mold closing step) is performed in which the sealing resin R is heated and pressurized against the workpiece W (see FIG. 19 ). At this time, the third clamper 328 abuts against the upper plate 342 (mold surface 304 a) via the film F, and the third cavity piece 326 rises relatively within the third cavity 308. This mold closing step thermally hardens the sealing resin R, completing resin sealing (compression molding), and a molded product Wp having the shape shown in FIG. 15A (i.e., the same shape as when the second mold 202 is used) is formed. In this embodiment, as shown in Figure 18, the workpiece W is sandwiched from above and below with sealing resin R with a carrier C and compressed and molded from above and below, but as another example, as shown in Figure 22, sealing resin R with a carrier C may be provided on only one side, top and bottom, and the other side may be sealing resin R without a carrier C.

[0086] After the third mold closing step, the third mold 302 is opened, and the molded product Wp is separated from the used film F to enable removal of the molded product Wp (third mold opening step) (see FIG. 20 ). Next, a molded product carrying-out step is performed in which the molded product Wp (for example, held by the holding portion 305 of the upper plate 342) is carried out of the third mold 302 by a conveying device (for example, the third loader 24, etc.) and transported to the storage unit 10C.

[0087] After or in parallel with the molded product removal process, the third lower mold film supply unit 311 and the third upper mold film supply unit 313 are operated to carry out a film supply process (third lower mold film supply process, third upper mold film supply process) in which the used film F is sent out from the third mold 302 and a new film F is sent into the third mold 302 and set.

[0088] After the molded product carrying-out step, a carrier peeling step is carried out in which the carrier C is peeled off from the molded product Wp using a carrier peeling device 16. This results in the formation of a molded product Wp having the shape shown in Fig. 15B. In this step, the molded product Wp may be inverted midway and the carriers C on the upper and lower surfaces may be peeled off in order using a single peeling mechanism, or the molded product Wp may not be inverted and the carriers C on the upper and lower surfaces may be peeled off separately using two peeling mechanisms.

[0089] After the carrier peeling step, a step is carried out in which the carrier C peeled from the molded product Wp is transported from the storage unit 10C to the resin forming unit 10E (or the base resin supply unit 10D) by a transport device (for example, the third loader 24, etc.) (the carrier C can be finally returned to the resin forming section 50). Note that if the carrier C is used as a heat sink or the like in the final product, it is not necessarily necessary to peel the carrier C.

[0090] According to the above configuration, the carrier C can be peeled from the molded product Wp and reused in the forming process in which the sealing resin R (i.e., the base resin Rm to which the carrier C is fixed) is formed in the forming device 1. Therefore, it is possible to reduce the number of parts (total number of required carriers C) and thereby reduce manufacturing costs. Furthermore, since it is not necessary to prepare a large number of carriers C in advance, it is possible to reduce the size of the device, particularly the size of the storage section for the carriers C (e.g., a stocker, etc.) and the installation space.

[0091] After the carrier peeling step, a cutting step is performed to cut the molded product Wp at a predetermined position (the position indicated by the dashed line in FIG. 15B ). Specifically, a cutting device 18 is used to cut the molded product Wp in the thickness direction within the region where the carrier C has been peeled off, and remove the outer edge. This allows the formation of a molded product Wp (final target shape) having the shape shown in FIG. 15C , i.e., a thin resin thickness (resin thickness at the upper or lower portion of the workpiece W).

[0092] After the cutting step, a storage step is carried out in which the molded product Wp (in this embodiment, the carrier C has been peeled off and the product has been cut at predetermined locations) is stored in the storage magazine 14. It is also possible to store the molded product Wp without performing the carrier peeling step or the cutting step (i.e., in a state in which the product has not been peeled or cut). The carrier peeling device 16 and the cutting device 18 may be provided separately from the compression molding device 2, in which case the molded product Wp may be stored in a state in which the product has not been peeled or cut.

[0093] The above are the main steps of the compression molding method performed using the compression molding apparatus 2 (when equipped with the third mold 302). However, the above order of steps is one example, and the order of steps can be changed or steps can be performed in parallel as long as there is no problem.

[0094] As explained above, according to the present invention, it is possible to form an encapsulating resin that can achieve the following effects. That is, by using the encapsulating resin according to the present invention, it is possible to prevent molding defects caused by uneven sprinkling, residual gas, and dust generation during molding, and it is possible to realize a compression molding device and compression molding method that can form molded products with thin resin portions. In addition, it is possible to facilitate handling before resin encapsulation. In addition, it is possible to prevent breakage during handling.

[0095] Furthermore, according to the forming method of the present invention, the carrier can be peeled off from the molded product and reused in the forming process of forming the sealing resin, which reduces manufacturing costs by reducing the number of parts and makes it possible to miniaturize the device, which mainly consists of the carrier storage section.

[0096] The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention.

Claims

1. A method for forming a molded product comprising: a carrier placing step of placing a carrier, which is a plate-like member, so as to be in contact with a bottom surface of a cavity of a mold; a resin placing step of placing resin in the cavity after the carrier placing step; a temporary molded product forming step of forming a temporary molded product by sealing the carrier placed in the carrier placing step with the resin placed in the resin placing step; and a molded product forming step of forming a molded product by heating or pressurizing a workpiece having electronic components in contact with the temporary molded product.

2. A method for forming a molded product according to claim 1, comprising: a carrier peeling step of peeling the carrier from the molded product; and a step of forming the temporary molded product by sealing the carrier peeled off in the carrier peeling step with the resin.

3. A sealing resin comprising a carrier, which is a plate-like member, and a resin, the sealing resin having an exposed portion where the carrier is exposed.

4. The sealing resin according to claim 3, characterized in that the sealing resin has a resin sealing portion on the surface on which the exposed portion is formed, where the carrier is not exposed outside the exposed portion.

Images