Curable composition, cured layer produced using composition and display device including cured layer

Abstract

Provided are: a curable composition comprising (A) quantum dots and (B) a polymerizable compound, wherein the polymerizable compound comprises a structural unit represented by a specific chemical formula, does not comprise an aromatic ring, and comprises, at at least one of the terminals thereof, a functional group represented by a different specific chemical formula; a cured layer produced using the composition; and a display device including the cured layer.

Description

Curable composition, cured film manufactured using the composition, display device including the cured film

[0001] The present invention relates to a curable composition, a cured film manufactured using the composition, and a display device including the cured film.

[0002]

[0003] In the case of general quantum dots, the solvents in which they can be dispersed are limited due to their hydrophobic surface characteristics, and as a result, there are many difficulties in introducing them into polar systems such as binders or curable monomers.

[0004] For example, even in the case of quantum dot ink compositions that are being actively researched, in the initial stages, they were relatively low in polarity and could only be dispersed in solvents used in highly hydrophobic curable compositions. For this reason, it was difficult to include quantum dots in an amount exceeding 20 wt% of the total composition, making it impossible to increase the ink's luminous efficiency beyond a certain level. In addition, even if quantum dots were added and dispersed to increase luminous efficiency, the viscosity exceeded the range for ink-jetting, making it impossible to satisfy the processability.

[0005] In addition, in order to implement a viscosity range that allows ink-jetting, a method of lowering the ink solids content by including a solvent of 50 wt% or more relative to the total composition has been used. This method also provides somewhat satisfactory results in terms of viscosity, but it has the disadvantage of being difficult to apply to actual processes due to problems such as nozzle drying due to solvent volatilization during ink-jetting, nozzle clogging, and a decrease in film thickness over time after ink-jetting, as well as a severe thickness deviation after curing.

[0006] Therefore, the solvent-free type of quantum dot ink that does not contain a solvent is the most desirable form for application to actual processes, and the current technology for applying quantum dots themselves to solvent-based compositions is now considered to have reached its limits.

[0007] In the case of solvent-free curable compositions (quantum dot ink compositions), due to the characteristic of containing an excessive amount of polymerizable compounds, problems such as nozzle clogging and poor ejection due to nozzle drying caused by volatility, and a decrease in single-film thickness due to volatilization of the ink composition jetted within the pattern barrier pixels are encountered. Therefore, various efforts are being made to improve the optical properties of solvent-free curable compositions.

[0008]

[0009] One embodiment is to provide a curable composition having excellent heat resistance and light resistance.

[0010] Another embodiment is to provide a cured film manufactured using the curable composition.

[0011] Another embodiment is to provide a display device including the cured film.

[0012]

[0013] One embodiment provides a curable composition comprising (A) a quantum dot; and (B) a polymerizable compound, wherein the polymerizable compound comprises a structural unit represented by the following chemical formula 1, but does not include an aromatic ring, and at least one terminal thereof comprises a functional group represented by the following chemical formula 2.

[0014] [Chemical Formula 1]

[0015]

[0016] [Chemical Formula 2]

[0017]

[0018] In the above chemical formula 1,

[0019] L 0is a single bond or a substituted or unsubstituted C1 to C20 alkylene group,

[0020] In the above chemical formula 2,

[0021] R 1 is a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group.

[0022] The above polymerizable compound can be represented by the following chemical formula 3.

[0023] [Chemical Formula 3]

[0024]

[0025] In the above chemical formula 3,

[0026] R 1 is a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group,

[0027] L 1 Inland L 3 are each independently a single bond, a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group or a fused ring thereof, provided that the L 1 Inland L 3 is not a single bond at the same time.

[0028] Above L 1 and L 3 can be identical to each other.

[0029] Above L 2 is the above L 1 and L 3 It may be different for everyone.

[0030] The polymerizable compound represented by the above chemical formula 3 may include at least one compound selected from the group consisting of the following chemical formulas 3-1 to 3-7.

[0031] [Chemical Formula 3-1]

[0032]

[0033] [Chemical Formula 3-2]

[0034]

[0035] [Chemical Formula 3-3]

[0036]

[0037] [Chemical Formula 3-4]

[0038]

[0039] [Chemical Formula 3-5]

[0040]

[0041] [Chemical Formula 3-6]

[0042]

[0043] [Chemical Formula 3-7]

[0044]

[0045] The above polymerizable compound can be represented by the following chemical formula 4.

[0046] [Chemical Formula 4]

[0047]

[0048] In the above chemical formula 4,

[0049] A is a compound with a non-aromatic cyclic structure,

[0050] R 1 is a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group,

[0051] n is an integer from 3 to 6.

[0052] The polymerizable compound represented by the above chemical formula 4 can be represented by the following chemical formula 4-1.

[0053] [Chemical Formula 4-1]

[0054]

[0055] The above polymerizable compound can be represented by the following chemical formula 5.

[0056] [Chemical Formula 5]

[0057]

[0058] In the above chemical formula 5,

[0059] R 1 is a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group,

[0060] R 2 is a substituted or unsubstituted C1 to C20 alkyl group or a functional group represented by the following chemical formula 6,

[0061] [Chemical Formula 6]

[0062]

[0063] In the above chemical formula 6,

[0064] R 0 is a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group.

[0065] The polymerizable compound represented by the above chemical formula 5 may include at least one compound selected from the group consisting of the following chemical formulas 5-1 and 5-2.

[0066] [Chemical Formula 5-1]

[0067]

[0068] [Chemical Formula 5-2]

[0069] (In the above chemical formula 5-2, n is an integer from 10 to 12)

[0070] The above polymerizable compound is a first polymerizable compound, and the curable composition may further include, in addition to the first polymerizable compound, a second polymerizable compound represented by the following chemical formula 7.

[0071] [Chemical Formula 7]

[0072]

[0073] In the above chemical formula 7,

[0074] L 4is a substituted or unsubstituted C1 to C10 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group or an ether group (*-O-*),

[0075] L 5 and L 6 are each independently a single bond or a substituted or unsubstituted C1 to C10 alkylene group,

[0076] R 3 and R 4 are each independently a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group.

[0077] The first polymerizable compound and the second polymerizable compound may be included in a weight ratio of 50:50 to 90:10.

[0078] The above curable composition may be a solvent-free curable composition.

[0079] The solvent-free curable composition may include 5 to 60 wt% of the quantum dot and 40 to 95 wt% of the polymerizable compound, based on the total amount of the solvent-free curable composition.

[0080] The above curable composition may further include a polymerization initiator, a light diffusing agent, a polymerization inhibitor, or a combination thereof.

[0081] The light diffusing agent may include barium sulfate, calcium carbonate, titanium dioxide, zirconia, or a combination thereof.

[0082] The above curable composition may further comprise a solvent.

[0083] The curable composition may include, based on the total weight of the curable composition, 1 wt% to 40 wt% of the quantum dot; 1 wt% to 20 wt% of the polymerizable compound; and 40 wt% to 80 wt% of the solvent.

[0084] The curable composition may further include malonic acid; 3-amino-1,2-propanediol; a silane coupling agent; a leveling agent; a fluorinated surfactant; or a combination thereof.

[0085] Another embodiment provides a cured film manufactured using the curable composition.

[0086] Another embodiment provides a display device including the cured film.

[0087] Specific details of other aspects of the present invention are included in the detailed description below.

[0088]

[0089] By introducing a polymerizable compound capable of low-temperature curing and having a fast reaction rate and excellent heat and light resistance into a quantum dot-containing curable composition, the stability, such as heat resistance and light resistance, of the quantum dot-containing curable composition can be improved.

[0090]

[0091] Hereinafter, embodiments of the present invention will be described in detail. However, these are presented as examples and are not intended to limit the present invention. The present invention is defined solely by the scope of the claims set forth below.

[0092] Unless otherwise specified herein, "alkyl group" means a C1 to C20 alkyl group, "alkenyl group" means a C2 to C20 alkenyl group, "cycloalkenyl group" means a C3 to C20 cycloalkenyl group, "heterocycloalkenyl group" means a C3 to C20 heterocycloalkenyl group, "aryl group" means a C6 to C20 aryl group, "arylalkyl group" means a C6 to C20 arylalkyl group, "alkylene group" means a C1 to C20 alkylene group, "arylene group" means a C6 to C20 arylene group, "alkylarylene group" means a C6 to C20 alkylarylene group, "heteroarylene group" means a C3 to C20 heteroarylene group, and "alkoxylene group" means a C1 to C20 It refers to an alkoxylene group.

[0093] Unless otherwise specified herein, "substitution" means that at least one hydrogen atom is substituted with a halogen atom (F, Cl, Br, I), a hydroxy group, a C1 to C20 alkoxy group, a nitro group, a cyano group, an amine group, an imino group, an azido group, an amidino group, a hydrazino group, a hydrazono group, a carbonyl group, a carbamyl group, a thiol group, an ester group, an ether group, a carboxyl group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphoric acid or a salt thereof, a C1 to C20 alkyl group, a C2 to C20 alkenyl group, a C2 to C20 alkynyl group, a C6 to C20 aryl group, a C3 to C20 cycloalkyl group, a C3 to C20 cycloalkenyl group, a C3 to C20 cycloalkynyl group, a C2 to C20 heterocycloalkyl group, a C2 to C20 heterocycloalkenyl group, a C2 to C20 It means substituted with a C20 heterocycloalkynyl group, a C3 to C20 heteroaryl group, or a combination thereof.

[0094] Additionally, unless otherwise specified herein, “hetero” means that the chemical formula contains at least one heteroatom of at least one of N, O, S, and P.

[0095] Additionally, unless otherwise specified herein, “(meth)acrylate” means both “acrylate” and “methacrylate”, and “(meth)acrylic acid” means both “acrylic acid” and “methacrylic acid”.

[0096] Unless otherwise specified herein, “combination” means mixing or copolymerization.

[0097] Unless otherwise defined in the chemical formulas in this specification, if a chemical bond is not drawn at a position where a chemical bond should be drawn, it means that a hydrogen atom is bonded at that position.

[0098] Additionally, unless otherwise specified herein, “*” means a portion connected to the same or different atoms or chemical formulas.

[0099] The present invention relates to a UV-curable quantum dot resin composition, wherein the composition is used in the manufacture of a cured film employed in a display using quantum dots and μ-LED light sources, and aims to improve the stability of the quantum dot composition by introducing a structure having excellent heat resistance and light resistance.

[0100] Quantum dots have been widely used in display materials recently due to their superior color purity and other properties. However, improving the heat and light resistance of quantum dots is necessary for applying high-power μ-LEDs as light sources. Thermoplastic or thermosetting resins, commonly used as encapsulation materials, can be used, but as LED output increases, the development of materials with superior heat and light resistance is required. Previously, encapsulation using alicyclic epoxy compounds or siloxane compounds was used, but their application is limited due to the deterioration of quantum dot stability at the high temperatures required during manufacturing.

[0101] Below, each component constituting the curable composition according to one embodiment is specifically described.

[0102]

[0103] polymeric compounds

[0104] According to one embodiment, a quantum dot-containing curable composition employs a UV-curable compound that is capable of low-temperature curing and has a fast reaction rate as a polymerizable compound, thereby preventing a decrease in the stability of quantum dots and ultimately providing a quantum dot-containing curable composition with excellent heat resistance and light resistance.

[0105] The above polymerizable compound includes a structural unit represented by the following chemical formula 1, but does not include an aromatic ring, and at the same time includes a functional group represented by the following chemical formula 2 at at least one terminal.

[0106] [Chemical Formula 1]

[0107]

[0108] [Chemical Formula 2]

[0109]

[0110] In the above chemical formula 1,

[0111] L 0 is a single bond or a substituted or unsubstituted C1 to C20 alkylene group,

[0112] In the above chemical formula 2,

[0113] R 1 is a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group.

[0114] Specifically, the polymerizable compound may include a first polymerizable compound or the first polymerizable compound and a second polymerizable compound having a different structure therefrom.

[0115] The viscosity of the curable composition increases as the first polymerizable compound includes more functional groups represented by the above chemical formula 2 at the terminal. However, recently, technologies for performing inkjetting by increasing the temperature have been greatly developed, and a method for spraying ink using an electrohydrodynamic jetting (EHD) method has also been developed. Therefore, the viscosity of the curable composition used in the inkjetting process may not be very important. That is, the curable composition according to one embodiment may have both high viscosity and low viscosity depending on the structure of the first polymerizable composition, and the inkjetting process can be smoothly performed regardless of the viscosity.

[0116] The above first polymerizable compound may include at least one compound selected from the group consisting of the following chemical formulas 3 to 5.

[0117] [Chemical Formula 3]

[0118]

[0119] In the above chemical formula 3,

[0120] R 1 is a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group,

[0121] L 1 Inland L 3 are each independently a single bond, a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group or a fused ring thereof, provided that the L 1 Inland L 3 is not a single bond at the same time,

[0122] [Chemical Formula 4]

[0123]

[0124] In the above chemical formula 4,

[0125] A is a compound with a non-aromatic cyclic structure,

[0126] R 1is a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group,

[0127] n is an integer from 3 to 6,

[0128] [Chemical Formula 5]

[0129]

[0130] In the above chemical formula 5,

[0131] R 1 is a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group,

[0132] R 2 is a substituted or unsubstituted C1 to C20 alkyl group or a functional group represented by the following chemical formula 6,

[0133] [Chemical Formula 6]

[0134]

[0135] In the above chemical formula 6,

[0136] R 0 is a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group.

[0137] When the first polymerizable compound is represented by the chemical formula 3, the L 1 and L 3 may be identical to each other. For example, at this time, the L 2 is the above L 1 and L 3 It may be different for everyone, but it is not necessarily limited to this.

[0138] The polymerizable compound containing the structural unit represented by the above chemical formula 1 and containing a functional group represented by the above chemical formula 2 at at least one terminal does not contain any aromatic ring in the structure. When the structure of the polymerizable compound contains an aromatic ring, there is a problem in that the heat resistance and light resistance of the curable composition are significantly reduced compared to when the structure does not contain an aromatic ring.

[0139] For example, the polymerizable compound represented by the above chemical formula 3 may include at least one compound selected from the group consisting of the following chemical formulas 3-1 to 3-7, but is not necessarily limited thereto.

[0140] [Chemical Formula 3-1]

[0141]

[0142] [Chemical Formula 3-2]

[0143]

[0144] [Chemical Formula 3-3]

[0145]

[0146] [Chemical Formula 3-4]

[0147]

[0148] [Chemical Formula 3-5]

[0149]

[0150] [Chemical Formula 3-6]

[0151]

[0152] [Chemical Formula 3-7]

[0153]

[0154] For example, the polymerizable compound represented by the above chemical formula 4 may be represented by the following chemical formula 4-1, but is not necessarily limited thereto.

[0155] [Chemical Formula 4-1]

[0156]

[0157] For example, the polymerizable compound represented by the above chemical formula 5 may include at least one compound selected from the group consisting of the following chemical formulas 5-1 and 5-2, but is not necessarily limited thereto.

[0158] [Chemical Formula 5-1]

[0159]

[0160] [Chemical Formula 5-2]

[0161] (In the above chemical formula 5-2, n is an integer from 10 to 12)

[0162] For example, the second polymerizable compound may have a different structure from the first polymerizable compound, and specifically, the second polymerizable compound may be represented by the following chemical formula 7.

[0163] [Chemical Formula 7]

[0164]

[0165] In the above chemical formula 7,

[0166] L 4 is a substituted or unsubstituted C1 to C10 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group or an ether group (*-O-*),

[0167] L 5 and L 6 are each independently a single bond or a substituted or unsubstituted C1 to C10 alkylene group,

[0168] R 3 and R 4 are each independently a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group.

[0169] For example, the first polymerizable compound and the second polymerizable compound may be included in a weight ratio of 10:90 to 90:10, for example, a weight ratio of 50:50 to 90:10.

[0170] For example, the first polymerizable compound may be included in a greater amount than the second polymerizable compound.

[0171] For example, the first polymerizable compound and the second polymerizable compound may be included in a weight ratio of 60:40 to 90:10. In this case, the curing rate of the curable composition according to one embodiment is increased, thereby maximizing light resistance.

[0172] For example, the second polymerizable compound represented by the above chemical formula 7 may be represented by the following chemical formula 7-1, chemical formula 7-2, or chemical formula 7-3, but is not necessarily limited thereto.

[0173] [Chemical Formula 7-1]

[0174]

[0175] [Chemical Formula 7-2]

[0176]

[0177] [Chemical Formula 7-3]

[0178]

[0179] For example, compounds having a different structure from the compound represented by the above chemical formula 1 include, in addition to the compounds represented by the above chemical formulas 7-1, 7-2 and 7-3, ethylene glycol diacrylate, triethylene glycol diacrylate, 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, neopentyl glycol diacrylate, pentaerythritol diacrylate, pentaerythritol triacrylate, dipentaerythritol diacrylate, dipentaerythritol triacrylate, dipentaerythritol pentaacrylate, pentaerythritol hexaacrylate, bisphenol A diacrylate, trimethylolpropane triacrylate, novolac epoxy acrylate, ethylene glycol dimethacrylate, triethylene glycol dimethacrylate, propylene glycol dimethacrylate, It may further include 1,4-butanediol dimethacrylate, 1,6-hexanediol dimethacrylate or a combination thereof.

[0180] In addition, in addition to the above polymerizable compound, monomers generally used in conventional thermosetting or photocurable compositions, such as epoxy compounds, oxetane compounds, vinyl ether compounds, etc., can be further used.

[0181] For example, the epoxy compound may include an aliphatic epoxy compound such as a bisphenol A type epoxy compound, a bisphenol F type epoxy compound, a phenol novolak type epoxy compound, trimethylolpropane polyglycidyl ether, neopentyl glycol diglycidyl ether, an alicyclic epoxy compound such as 1,2-epoxy-4-vinyl cyclohexane, and 1-methyl-4-(2-methyloxiranyl)-7-oxabicyclo[4.1.0]heptane.

[0182] It is also possible to use commercially available products as the above epoxy compound. Examples of commercially available epoxy compounds include "Celloxide 2000," "Celloxide 3000," and "Celloxide 4000" manufactured by Daisei Chemical Co., Ltd.

[0183] For example, the oxetane compounds are bis[1-ethyl(3-oxetanyl)]methyl ether, 2-ethylhexyloxetane, 3-hydroxymethyl-3-methyloxetane, 3-hydroxymethyl-3-ethyloxetane, 3-hydroxymethyl-3-propyloxetane, 3-hydroxymethyl-3-n-butyloxetane, 3-hydroxymethyl-3-phenyloxetane, 3-hydroxymethyl-3-benzyloxetane, 3-hydroxyethyl-3-methyloxetane, 3-hydroxyethyl-3-ethyloxetane, 3-hydroxyethyl-3-propyloxetane, 3-hydroxyethyl-3-phenyloxetane, 3-hydroxypropyl-3-methyloxetane, 3-hydroxypropyl-3-ethyloxetane, It may include 3-hydroxypropyl-3-propyloxetane, 3-hydroxypropyl-3-phenyloxetane, 3-hydroxybutyl-3-methyloxetane, etc.

[0184] It is also possible to use commercially available products as the above oxetane compound. Commercially available products of the oxetane compound include, for example, the Alon Oxetane series ("OXT-101", "OXT-212", "OXT-121", "OXT-221", etc.) manufactured by Toagosei Co., Ltd.; "Celoxide 2021", "Celoxide 2021A", "Celoxide 2021P", "Celoxide 2080", "Celoxide 2081", "Celoxide 2083", "Celoxide 2085", "Eppolid GT300", "Eppolid GT301", "Eppolid GT302", "Eppolid GT400", "Eppolid GT401", and "Eppolid GT403" manufactured by Daisei Chemical Co., Ltd.; Dow Chemical Japan Co., Ltd.'s "Cyracure UVR-6105", "Cyracure UVR-6107", "Cyracure UVR-6110", "Cyracure UVR-6128", "ERL4289", and "ERL4299" can be used. In addition, a publicly known oxetane compound (e.g., an oxetane compound described in Japanese Patent Application Laid-Open No. 2009-40830, etc.) can also be used.

[0185] For example, as the vinyl ether compound, 2-hydroxyethyl vinyl ether, triethylene glycol vinyl monoether, tetraethylene glycol divinyl ether, trimethylolpropane trivinyl ether, etc. can be used.

[0186] The polymerizable compound may be included in an amount of 40 wt% to 95 wt%, for example, 50 wt% to 90 wt%, based on the total amount of the solvent-free curable composition. When the content of the polymerizable compound is within the above range, it is possible to manufacture a solvent-free curable composition having a viscosity that allows ink jetting, and further, quantum dots in the manufactured solvent-free curable composition can have excellent dispersibility, so that optical properties can also be improved.

[0187] For example, the polymerizable compound may have a molecular weight of 170 g / mol to 1,000 g / mol. When the molecular weight of the polymerizable compound is within the above range, the viscosity of the composition may not be increased without impairing the optical properties of the quantum dots, which may be advantageous for ink-jetting.

[0188] In addition, when the curable composition includes a solvent, the polymerizable compound may be included in an amount of 1 wt% to 20 wt%, 1 wt% to 15 wt%, for example, 5 wt% to 15 wt%, based on the total amount of the curable composition. When the polymerizable compound is included within the above range, the optical properties of the quantum dot may be improved.

[0189]

[0190] quantum dots

[0191] For example, the quantum dot may have a maximum fluorescence emission wavelength between 500 nm and 680 nm.

[0192] For example, when the curable composition according to one embodiment is a solvent-free curable composition, the quantum dots may be included in an amount of 5 wt% to 60 wt%, such as 10 wt% to 60 wt%, such as 20 wt% to 60 wt%, such as 30 wt% to 50 wt%. When the quantum dots are included within the above range, high light retention and light efficiency can be achieved even after curing.

[0193] For example, when the curable composition according to one embodiment is a curable composition including a solvent, the quantum dots may be included in an amount of 1 wt% to 40 wt%, for example, 3 wt% to 30 wt%, based on the total amount of the curable composition. When the quantum dots are included within the above range, the photoconversion rate is excellent and the pattern characteristics and development characteristics are not impaired, so that excellent processability can be achieved.

[0194] For example, the quantum dot may absorb light in a wavelength range of 360 nm to 780 nm, for example, a wavelength range of 400 nm to 780 nm, and emit fluorescence in a wavelength range of 500 nm to 700 nm, for example, 500 nm to 580 nm, or emit fluorescence in a wavelength range of 600 nm to 680 nm. That is, the quantum dot may have a maximum fluorescence emission wavelength (fluorescence λ) in a wavelength range of 500 nm to 680 nm. em ) can have.

[0195] The above quantum dots may each independently have a full width at half maximum (FWHM) of 20 nm to 100 nm, for example, 20 nm to 50 nm. When the quantum dots have a full width at half maximum (FWHM) within the above range, the color purity is high, thereby increasing the color reproducibility when used as a color material in a color filter.

[0196] The above quantum dots may each independently be organic, inorganic, or a hybrid (hybrid) of organic and inorganic materials.

[0197] The above quantum dots can each independently be composed of a core and a shell surrounding the core, and the core and shell can each independently have a structure such as a core, core / shell, core / first shell / second shell, alloy, alloy / shell, etc., made of group II-IV, group III-V, etc., but are not limited thereto.

[0198] For example, the core may include at least one material selected from the group consisting of CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, HgS, HgSe, HgTe, GaN, GaP, GaAs, InP, InAs, and alloys thereof, but is not necessarily limited thereto. The shell surrounding the core may include at least one material selected from the group consisting of CdSe, ZnSe, ZnS, ZnTe, CdTe, PbS, TiO, SrSe, HgSe, and alloys thereof, but is not necessarily limited thereto.

[0199] In one implementation example, since environmental concerns have been increasing significantly worldwide and regulations on toxic substances have been strengthened, environmentally friendly non-cadmium-based luminescent materials (such as InP / ZnS, InP / ZnSe / ZnS) with somewhat lower quantum yields were used instead of luminescent materials having cadmium-based cores, but the present invention is not limited thereto.

[0200] In the case of the quantum dot of the above core / shell structure, the size (average particle diameter) of each entire quantum dot including the shell may be 1 nm to 15 nm, for example, 5 nm to 15 nm.

[0201] For example, the quantum dots may each independently include red quantum dots, green quantum dots, or a combination thereof. The red quantum dots may each independently have an average particle diameter of 10 nm to 15 nm. The green quantum dots may each independently have an average particle diameter of 5 nm to 8 nm.

[0202] Meanwhile, in order to ensure dispersion stability of the quantum dots, the curable composition according to one embodiment may further include a dispersant. The dispersant helps to uniformly disperse the photoconversion material such as quantum dots within the curable composition, and any nonionic, anionic, or cationic dispersant may be used. Specifically, polyalkylene glycol or its esters, polyoxyalkylene, polyhydric alcohol ester alkylene oxide adducts, alcohol alkylene oxide adducts, sulfonic acid esters, sulfonic acid salts, carboxylic acid esters, carboxylic acid salts, alkyl amide alkylene oxide adducts, alkyl amines, etc. may be used, and these may be used alone or in combination of two or more. The dispersant may be used in an amount of 0.1 wt% to 100 wt%, for example, 10 wt% to 20 wt%, relative to the solid content of the photoconversion material such as quantum dots.

[0203] For example, the quantum dot may be a quantum dot surface-modified with a ligand having a polar group, for example, a ligand having a high affinity for the polymerizable compound. In the case of a quantum dot surface-modified as described above, it is very easy to prepare a high-concentration or high-concentration quantum dot dispersion (improving the dispersibility of the quantum dot in the polymerizable compound), which can have a significant effect on improving light efficiency, and in particular, it can be advantageous in implementing a solvent-free curable composition.

[0204] For example, the ligand having the polar group may have a structure having high affinity with the chemical structure of the polymerizable compound.

[0205] For example, the ligand having the polar group may be represented by any one of the compounds represented by the following chemical formulas A to P, but is not necessarily limited thereto.

[0206] [Chemical Formula A]

[0207]

[0208] [Chemical Formula B]

[0209]

[0210] [Chemical Formula C]

[0211]

[0212] [Chemical Formula D]

[0213]

[0214] (In the above chemical formula D, m1 is an integer from 0 to 10.)

[0215] [Chemical Formula E]

[0216]

[0217] [Chemical formula F]

[0218]

[0219] [Chemical formula G]

[0220]

[0221] [Chemical formula H]

[0222]

[0223]

[0224] [Chemical Formula I]

[0225]

[0226] [Chemical formula J]

[0227]

[0228] [Chemical formula K]

[0229]

[0230] [Chemical formula L]

[0231]

[0232] [Chemical formula M]

[0233]

[0234] [Chemical formula N]

[0235]

[0236] [chemical formula O]

[0237]

[0238] [chemical formula P]

[0239]

[0240] When the above ligand is used, surface modification of quantum dots becomes easier, and when quantum dots surface-modified with the above ligand are added to the above-mentioned polymerizable compound and stirred, a very transparent dispersion can be obtained, which serves as a measure of confirming that the surface modification of the quantum dots is very successful.

[0241]

[0242] light diffuser

[0243] The curable composition according to one embodiment may further comprise a light diffusing agent.

[0244] For example, the light diffusing agent may include barium sulfate (BaSO4), calcium carbonate (CaCO3), titanium dioxide (TiO2), zirconia (ZrO2), or a combination thereof.

[0245] The above-described light diffusing agent reflects light not absorbed by the aforementioned quantum dots and allows the reflected light to be reabsorbed by the quantum dots. In other words, the above-described light diffusing agent can increase the amount of light absorbed by the quantum dots, thereby increasing the photoconversion efficiency of the curable composition.

[0246] The above light diffusing agent has an average particle diameter (D 50 ) may be 150 nm to 250 nm, and specifically, 180 nm to 230 nm. When the average particle diameter of the light diffusing agent is within the above range, it may have a better light diffusing effect and increase the light conversion efficiency.

[0247] The light diffusing agent may be included in an amount of 1 wt% to 20 wt%, for example, 2 wt% to 15 wt%, for example, 3 wt% to 10 wt%, based on the total amount of the curable composition. If the light diffusing agent is included in an amount of less than 1 wt% based on the total amount of the curable composition, it is difficult to expect an effect of improving the light conversion efficiency due to the use of the light diffusing agent, and if it is included in an amount exceeding 20 wt%, there is a concern that quantum dot sedimentation problems may occur.

[0248]

[0249] polymerization initiator

[0250] The curable composition according to one embodiment may further comprise a polymerization initiator, for example, a photopolymerization initiator, a thermal polymerization initiator, or a combination thereof.

[0251] The above photopolymerization initiator is an initiator generally used in a photosensitive resin composition, and examples thereof include, but are not limited to, acetophenone-based compounds, benzophenone-based compounds, thioxanthone-based compounds, benzoin-based compounds, triazine-based compounds, oxime-based compounds, and aminoketone-based compounds.

[0252] Examples of the above acetophenone compounds include 2,2'-diethoxy acetophenone, 2,2'-dibutoxy acetophenone, 2-hydroxy-2-methylpropiophenone, pt-butyltrichloro acetophenone, pt-butyldichloro acetophenone, 4-chloro acetophenone, 2,2'-dichloro-4-phenoxy acetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, etc.

[0253] Examples of the above benzophenone compounds include benzophenone, benzoyl benzoate, methyl benzoyl benzoate, 4-phenyl benzophenone, hydroxybenzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-2-methoxybenzophenone, etc.

[0254] Examples of the above thioxanthone compounds include thioxanthone, 2-methylthioxanthone, isopropyl thioxanthone, 2,4-diethyl thioxanthone, 2,4-diisopropyl thioxanthone, 2-chlorothioxanthone, etc.

[0255] Examples of the above benzoin compounds include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyldimethyl ketal, etc.

[0256] Examples of the above triazine compounds include 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-biphenyl-4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, Examples thereof include 2-(naphtho-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphtho-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-4-bis(trichloromethyl)-6-piperonyl-s-triazine, and 2-4-bis(trichloromethyl)-6-(4-methoxystyryl)-s-triazine.

[0257] Examples of the above oxime compounds include O-acyloxime compounds, 2-(O-benzoyloxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1-(O-acetyloxime)-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone, O-ethoxycarbonyl-α-oxyamino-1-phenylpropan-1-one, etc. Specific examples of the O-acyloxime compounds include 1,2-octanedione, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, 1-(4-phenylsulfanylphenyl)-butane-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1-oneoxime-O-acetate, and 1-(4-phenylsulfanylphenyl)-butan-1-oneoxime-O-acetate.

[0258] Examples of the above aminoketone compounds include 2-Benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1.

[0259] In addition to the above compound, the photopolymerization initiator may also include a carbazole compound, a diketone compound, a sulfonium borate compound, a diazo compound, an imidazole compound, a biimidazole compound, etc.

[0260] The above photopolymerization initiator may also be used together with a photosensitizer that causes a chemical reaction by absorbing light, becoming excited, and then transferring the energy.

[0261] Examples of the above photosensitizer include tetraethylene glycol bis-3-mercapto propionate, pentaerythritol tetrakis-3-mercapto propionate, dipentaerythritol tetrakis-3-mercapto propionate, and the like.

[0262] Examples of the above thermal polymerization initiator include peroxides, specifically benzoyl peroxide, dibenzoyl peroxide, lauryl peroxide, dilauryl peroxide, di-tert-butyl peroxide, cyclohexane peroxide, methyl ethyl ketone peroxide, hydroperoxides (e.g., tert-butyl hydroperoxide, cumene hydroperoxide), dicyclohexyl peroxydicarbonate, 2,2-azo-bis(isobutyronitrile), t-butyl perbenzoate, etc., and 2,2'-azobis-2-methylpropionitrile, etc., but are not necessarily limited thereto, and any one widely known in the art can be used.

[0263] The above polymerization initiator may be included in an amount of 0.1 wt% to 5 wt%, for example, 1 wt% to 4 wt%, based on the total amount of the curable composition. When the polymerization initiator is included within the above range, sufficient curing can occur upon exposure to light or thermal curing, thereby obtaining excellent reliability, and a decrease in transmittance due to unreacted initiator can be prevented, thereby preventing a decrease in the optical properties of the quantum dot.

[0264]

[0265] binder resin

[0266] The curable composition according to one embodiment may further comprise a binder resin.

[0267] The above binder resin may include an acrylic resin, a cardo resin, an epoxy resin, or a combination thereof.

[0268] The above acrylic resin may be a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith, and may be a resin including one or more acrylic repeating units.

[0269] Specific examples of the above acrylic binder resin include, but are not limited to, polybenzyl methacrylate, (meth)acrylic acid / benzyl methacrylate copolymer, (meth)acrylic acid / benzyl methacrylate / styrene copolymer, (meth)acrylic acid / benzyl methacrylate / 2-hydroxyethyl methacrylate copolymer, (meth)acrylic acid / benzyl methacrylate / styrene / 2-hydroxyethyl methacrylate copolymer, and the like. These may be used singly or in combination of two or more.

[0270] The weight average molecular weight of the above acrylic resin may be 5,000 g / mol to 15,000 g / mol. When the weight average molecular weight of the above acrylic resin is within the above range, the acrylic resin has excellent adhesion to the substrate, good physical and chemical properties, and appropriate viscosity.

[0271] The acid value of the above acrylic resin may be 80 mgKOH / g to 130 mgKOH / g. When the acid value of the above acrylic resin is within the above range, the resolution of the pixel pattern is excellent.

[0272] The above-mentioned cardo resin may be one used in a conventional curable resin (or photosensitive resin) composition, and may be, for example, one presented in Korean Patent Publication No. 10-2018-0067243, but is not limited thereto.

[0273] The above cardo resin may be, for example, a fluorene-containing compound such as 9,9-bis(4-oxiranylmethoxyphenyl)fluorene; anhydride compounds such as benzenetetracarboxylic acid dianhydride, naphthalenetetracarboxylic acid dianhydride, biphenyltetracarboxylic acid dianhydride, benzophenonetetracarboxylic acid dianhydride, pyromellitic dianhydride, cyclobutanetetracarboxylic acid dianhydride, perylenetetracarboxylic acid dianhydride, tetrahydrofurantetracarboxylic acid dianhydride, and tetrahydrophthalic acid anhydride; a glycol compound such as ethylene glycol, propylene glycol, and polyethylene glycol; an alcohol compound such as methanol, ethanol, propanol, n-butanol, cyclohexanol, and benzyl alcohol; a solvent compound such as propylene glycol methyl ethyl acetate, and N-methylpyrrolidone; a phosphorus compound such as triphenylphosphine; And it can be prepared by mixing two or more of amine or ammonium salt compounds such as tetramethylammonium chloride, tetraethylammonium bromide, benzyldiethylamine, triethylamine, tributylamine, and benzyltriethylammonium chloride. For example, the cardo resin can be represented by the following chemical formula 10, but is not necessarily limited thereto.

[0274] [Chemical Formula 10]

[0275]

[0276] In the above chemical formula 10,

[0277] m can be an integer from 1 to 100.

[0278] The weight average molecular weight of the above cardo resin may be 500 g / mol to 50,000 g / mol, for example, 1,000 g / mol to 30,000 g / mol. When the weight average molecular weight of the above cardo resin is within the above range, pattern formation is good without residue when producing a cured film, and there is no loss of film thickness when developing the curable composition, and a good pattern can be obtained.

[0279] When the above binder resin is a cardo-based resin, the developability of a curable composition containing the same, particularly a photosensitive resin composition, is excellent, and the sensitivity during photocuring is good, resulting in excellent fine pattern formation ability.

[0280] The above epoxy resin is a monomer or oligomer that can be polymerized by heat, and may include compounds having carbon-carbon unsaturated bonds and carbon-carbon cyclic bonds.

[0281] The above epoxy resin may include, but is not necessarily limited to, bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, cyclic aliphatic epoxy resin, and aliphatic polyglycidyl ether.

[0282] Commercially available products of these compounds include bisphenyl epoxy resins, YX4000, YX4000H, YL6121H, YL6640, YL6677 from Yukashell Epoxy Co., Ltd.; cresol novolac type epoxy resins, EOCN-102, EOCN-103S, EOCN-104S, EOCN-1020, EOCN-1025, EOCN-1027 from Nippon Kayaku Co., Ltd. and Epicoat 180S75 from Yukashell Epoxy Co., Ltd.; bisphenol A type epoxy resins, Epicoat 1001, 1002, 1003, 1004, 1007, 1009, 1010, and 828 from Yukashell Epoxy Co., Ltd.; Bisphenol F type epoxy resins include Epicoat 807 and 834 from Yukashell Epoxy Co., Ltd.; Phenol novolak type epoxy resins include Epicoat 152, 154, 157H65 from Yukashell Epoxy Co., Ltd. and EPPN 201, 202 from Nippon Kayaku Co., Ltd.; Other cyclic aliphatic epoxy resins include CY175, CY177 and CY179 from CIBA-GEIGY AG, ERL-4234, ERL-4299, ERL-4221 and ERL-4206 from UCC, Shodyne 509 from Showa Denko Co., Ltd., Araldite CY-182, CY-192 and CY-184 from CIBA-GEIGY AG, Epichron 200 and 400 from Dainippon Ink & Kogyo Co., Ltd., Epicoat 871, 872 and EP1032H60 from Yukashell Epoxy Co., Ltd., and ED-5661 and ED-5662 from Celanese Coating Co., Ltd.; Examples of aliphatic polyglycidyl ethers include Epicoat 190P and 191P from Yukashell Epoxy Co., Ltd., Epolite 100MF from Kyoeisha Yushi Chemical Co., Ltd., and Epiol TMP from Nippon Yushi Co., Ltd.

[0283] For example, when the curable composition according to one embodiment is a solvent-free curable composition, the binder resin may be included in an amount of 0.5 wt% to 10 wt%, for example, 1 wt% to 5 wt%, based on the total amount of the curable composition. In this case, the heat resistance and chemical resistance of the solvent-free curable composition can be improved, and the storage stability of the composition can also be improved.

[0284] For example, when the curable composition according to one embodiment is a curable composition including a solvent, the binder resin may be included in an amount of 1 wt% to 30 wt%, for example, 3 wt% to 20 wt%, based on the total amount of the curable composition. In this case, excellent pattern characteristics, heat resistance, and chemical resistance can be improved.

[0285]

[0286] Other additives

[0287] To improve the stability and dispersibility of the quantum dots, the curable composition according to one embodiment may further include a polymerization inhibitor.

[0288] The polymerization inhibitor may include, but is not necessarily limited to, a hydroquinone-based compound, a catechol-based compound, or a combination thereof. According to one embodiment, since the curable composition further includes the hydroquinone-based compound, the catechol-based compound, or a combination thereof, crosslinking at room temperature can be prevented during exposure after printing (coating) the curable composition.

[0289] For example, the hydroquinone-based compound, catechol-based compound, or combinations thereof may include, but are not necessarily limited to, hydroquinone, methyl hydroquinone, methoxyhydroquinone, t-butyl hydroquinone, 2,5-di-t-butyl hydroquinone, 2,5-bis(1,1-dimethylbutyl) hydroquinone, 2,5-bis(1,1,3,3-tetramethylbutyl) hydroquinone, catechol, t-butyl catechol, 4-methoxyphenol, pyrogallol, 2,6-di-t-butyl-4-methylphenol, 2-naphthol, tris(N-hydroxy-N-nitrosophenylaminato-O,O')aluminium, or combinations thereof.

[0290] The above hydroquinone-based compound, catechol-based compound, or a combination thereof may be used in the form of a dispersion, and the polymerization inhibitor in the form of the dispersion may be included in an amount of 0.001 wt% to 3 wt%, for example, 0.01 wt% to 2 wt%, based on the total amount of the curable composition. When the polymerization inhibitor is included within the above range, the problem of aging at room temperature can be solved, while at the same time preventing sensitivity degradation and surface peeling.

[0291] In addition, the curable composition according to one embodiment may further include malonic acid; 3-amino-1,2-propanediol; a silane coupling agent; a leveling agent; a fluorinated surfactant; or a combination thereof to improve heat resistance and reliability.

[0292] For example, a curable composition according to one embodiment may further include a silane coupling agent having a reactive substituent such as a vinyl group, a carboxyl group, a methacryloxy group, an isocyanate group, or an epoxy group to improve adhesion to a substrate, etc.

[0293] Examples of the above silane coupling agent include trimethoxysilyl benzoic acid, γ-methacryloxypropyl trimethoxysilane, vinyl triacetoxysilane, vinyl trimethoxysilane, γ-isocyanate propyl triethoxysilane, γ-glycidoxy propyl trimethoxysilane, β-epoxycyclohexyl)ethyl trimethoxysilane, etc., and these may be used alone or in combination of two or more.

[0294] The above silane coupling agent may be included in an amount of 0.01 to 10 parts by weight based on 100 parts by weight of the curable composition. When the silane coupling agent is included within the above range, adhesion, storability, etc. are excellent.

[0295] In addition, the curable composition may further include a surfactant, such as a fluorinated surfactant, to improve coating properties and prevent defects, i.e., to improve leveling performance, as needed.

[0296] The above fluorinated surfactant may have a low weight average molecular weight of 4,000 g / mol to 10,000 g / mol, specifically, may have a weight average molecular weight of 6,000 g / mol to 10,000 g / mol. In addition, the fluorinated surfactant may have a surface tension of 18 mN / m to 23 mN / m (measured in a 0.1% propylene glycol monomethyl ether acetate (PGMEA) solution). When the weight average molecular weight and surface tension of the fluorinated surfactant are within the above ranges, the leveling performance can be further improved, and the occurrence of spots can be prevented during high-speed coating, and since the occurrence of bubbles is small and the film defects are small, it provides excellent properties to slit coating, which is a high-speed coating method.

[0297] As the above fluorinated surfactant, BM Chemie's BM-1000 ® , BM-1100 ® Mecha Pack F 142D by Dai Nippon Inki Kagaku Kogyo Co., Ltd.® , East F 172 ® , East F 173 ® , East F 183 ® Back; Prorad FC-135 from Sumitomo 3M Co., Ltd. ® , East FC-170C ® , East FC-430 ® , East FC-431 ® Saffron S-112 from Asahi Glass Co., Ltd. ® , East S-113 ® , East S-131 ® , East S-141 ® , East S-145 ® SH-28PA from Toray Silicone Co., Ltd. ® , East-190 ® , East-193 ® , SZ-6032 ® , SF-8428 ® Fluorine-based surfactants sold under the names F-482, F-484, F-478, F-554, etc. by DIC Co., Ltd. can be used.

[0298] Additionally, the curable composition according to one embodiment may use a silicone-based surfactant together with the aforementioned fluorinated surfactant. Specific examples of the silicone-based surfactant include, but are not limited to, TSF400, TSF401, TSF410, and TSF4440 from Toshiba Silicone Co., Ltd.

[0299] The surfactant, including the fluorinated surfactant, may be included in an amount of 0.01 to 5 parts by weight, for example, 0.1 to 2 parts by weight, based on 100 parts by weight of the curable composition. When the surfactant is included within the above range, the phenomenon of foreign substances occurring in the sprayed composition is reduced.

[0300] In addition, the curable composition according to one embodiment may further include a certain amount of other additives, such as an antioxidant, within a range that does not impair physical properties.

[0301]

[0302] menstruum

[0303] Meanwhile, the curable composition according to one embodiment may further include a solvent.

[0304] The solvent may be, for example, alcohols such as methanol and ethanol; glycol ethers such as ethylene glycol methyl ether, ethylene glycol ethyl ether, and propylene glycol methyl ether; cellosolve acetates such as methyl cellosolve acetate, ethyl cellosolve acetate, and diethyl cellosolve acetate; carbitols such as methylethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methylethyl ether, and diethylene glycol diethyl ether; propylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate and propylene glycol propyl ether acetate; Ketones such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-propyl ketone, methyl-n-butyl ketone, methyl-n-amyl ketone, and 2-heptanone; saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, n-butyl acetate, and isobutyl acetate; lactic acid alkyl esters such as methyl lactate and ethyl lactate; hydroxyacetic acid alkyl esters such as methyl hydroxyacetate, ethyl hydroxyacetate, and butyl hydroxyacetate; acetic acid alkoxyalkyl esters such as methoxymethyl acetate, methoxyethyl acetate, methoxybutyl acetate, ethoxymethyl acetate, and ethoxyethyl acetate; 3-Hydroxypropionic acid alkyl esters such as methyl 3-hydroxypropionate and ethyl 3-hydroxypropionate; 3-alkoxypropionic acid alkyl esters such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate and methyl 3-ethoxypropionate; 2-hydroxypropionic acid alkyl esters such as methyl 2-hydroxypropionate, ethyl 2-hydroxypropionate and propyl 2-hydroxypropionate; 2-alkoxypropionic acid alkyl esters such as methyl 2-methoxypropionate, ethyl 2-methoxypropionate, ethyl 2-ethoxypropionate and methyl 2-ethoxypropionate;2-Hydroxy-2-methylpropionic acid alkyl esters such as methyl 2-hydroxy-2-methylpropionate and ethyl 2-hydroxy-2-methylpropionate; 2-alkoxy-2-methylpropionic acid alkyl esters such as methyl 2-methoxy-2-methylpropionate and ethyl 2-ethoxy-2-methylpropionate; esters such as 2-hydroxyethyl propionate, 2-hydroxy-2-methylethyl propionate, hydroxyethyl acetate and methyl 2-hydroxy-3-methylbutanoate; Or there are compounds of ketone esters such as ethyl pyruvate, and also N-methylformamide, N,N-dimethylformamide, N-methylformanilide, N-methylacetamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, caproic acid, caprylic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, phenyl cellosolve acetate, etc., but are not limited thereto.;

[0305] For example, it is preferable to use a solvent such as a glycol ether such as ethylene glycol monoethyl ether or ethylene diglycol methyl ethyl ether; an ethylene glycol alkyl ether acetate such as ethyl cellosolve acetate; an ester such as 2-hydroxypropionate ethyl; a carbitol such as diethylene glycol monomethyl ether; a propylene glycol alkyl ether acetate such as propylene glycol monomethyl ether acetate or propylene glycol propyl ether acetate; an alcohol such as ethanol, or a combination thereof.

[0306] For example, the solvent may be a polar solvent including propylene glycol monomethyl ether acetate, dipropylene glycol methyl ether acetate, ethanol, ethylene glycol dimethyl ether, ethylene diglycol methyl ethyl ether, diethylene glycol dimethyl ether, 2-butoxyethanol, N-methylpyrrolidine, N-ethylpyrrolidine, propylene carbonate, γ-butyrolactone, or a combination thereof.

[0307] The solvent may be included in an amount of 40 wt% to 80 wt%, for example, 45 wt% to 80 wt%, based on the total amount of the curable composition. When the solvent is included within the above range, the solvent-type curable composition has an appropriate viscosity, thereby providing excellent coating properties during large-area coating using spin coating and slitting.

[0308]

[0309] Another embodiment provides a curable composition, for example, a cured film manufactured using the curable composition, a color filter including the cured film, and a display device including the color filter. In this case, the cured film may have a reflectivity of 50% to 55% as described above.

[0310] One of the methods for manufacturing the above cured film includes a step (S1) of forming a pattern by applying the above curable composition onto a substrate using an inkjet spraying method; and a step (S2) of curing the pattern.

[0311] (S1) Pattern forming step

[0312] The above curable composition is preferably applied to a substrate with a thickness of 0.5 to 20 μm using an inkjet dispersion method. The inkjet spraying can form a pattern by spraying only a single color per nozzle and repeatedly spraying according to the required number of colors. To reduce the process, the pattern can also be formed by spraying the required number of colors simultaneously through each inkjet nozzle.

[0313] (S2) Hardening stage

[0314] The above-obtained pattern can be cured to obtain pixels. At this time, as a curing method, both a thermal curing process and a photocuring process can be applied. The thermal curing process is preferably cured by heating to a temperature of 100°C or higher, more preferably cured by heating to 100°C to 300°C, and even more preferably cured by heating to 160°C to 250°C. The photocuring process irradiates active rays such as UV rays of 190 nm to 450 nm, for example, 200 nm to 500 nm. As a light source used for irradiation, a low-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a metal halide lamp, an argon gas laser, etc. can be used, and in some cases, X-rays, electron beams, etc. can also be used.

[0315] Another method of manufacturing the above-mentioned cured film is to manufacture the cured film using the above-mentioned curable composition using a lithography method, and the manufacturing method is as follows.

[0316] (1) Application and film formation stage

[0317] The above curable composition is applied to a substrate that has undergone a predetermined pretreatment using a spin or slit coating method, a roll coating method, a screen printing method, an applicator method, or the like to a desired thickness, for example, 2 μm to 10 μm, and then heated at a temperature of 70°C to 90°C for 1 to 10 minutes to remove the solvent, thereby forming a coating film.

[0318] (2) Exposure stage

[0319] In order to form a necessary pattern on the obtained film, a mask of a predetermined shape is interposed, and then an active ray such as UV light of 190 nm to 450 nm, for example, 200 nm to 500 nm, is irradiated. Light sources used for irradiation include low-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, metal halide lamps, argon gas lasers, etc., and in some cases, X-rays, electron beams, etc. can also be used.

[0320] The exposure dose varies depending on the type, mixing amount, and dry film thickness of each component of the above-mentioned curable composition, but for example, when using a high-pressure mercury lamp, it is 500 mJ / cm 2 Below (based on 365 nm sensor).

[0321] (3) Phenomenon stage

[0322] Following the above exposure step, an alkaline aqueous solution is used as a developer to dissolve and remove unnecessary portions, thereby leaving only the exposed portions to form an image pattern. That is, when developing with an alkaline developer, the unexposed portions are dissolved, and an image color filter pattern is formed.

[0323] (4) Post-processing stage

[0324] The image pattern obtained by the above phenomenon can be cured by reheating or irradiating with active rays, etc., to obtain a pattern superior in terms of heat resistance, light resistance, adhesion, crack resistance, chemical resistance, high strength, storage stability, etc.

[0325]

[0326] Hereinafter, preferred embodiments of the present invention are described. However, the following examples are only preferred embodiments of the present invention, and the present invention is not limited to the following examples.

[0327]

[0328] Preparation of polymeric compounds

[0329] Manufacturing Example 1

[0330] In a round flask, add 352 g of hydrogenated bisphenol A diglycidyl ether, 148 g of acrylic acid, 3.52 g of tetrabutylammonium bromide, and 0.17 g of polymerization inhibitor (MEHQ) and react at 110°C for 15 hours to synthesize a compound represented by the following chemical formula 3-1.

[0331] [Chemical Formula 3-1]

[0332]

[0333]

[0334] Manufacturing Example 2

[0335] In a round flask, add 324 g of 1,1'-Methylenebis[4-(glycidyloxy)cyclohexane], 148 g of acrylic acid, 3.24 g of Tetrabutylammonium bromide, and 0.16 g of polymerization inhibitor (MEHQ) and react at 110°C for 15 hours to synthesize a compound represented by the following chemical formula 3-2.

[0336] [Chemical Formula 3-2]

[0337]

[0338]

[0339] Manufacturing Example 3

[0340] In a round flask, add 216 g of Neopentyl glycol diglycidyl ether, 148 g of acrylic acid, 2.16 g of Tetrabutylammonium bromide, and 0.11 g of polymerization inhibitor (MEHQ) and react at 110°C for 15 hours to synthesize a compound represented by the following chemical formula 3-3.

[0341] [Chemical Formula 3-3]

[0342]

[0343]

[0344] Manufacturing Example 4

[0345] In a round flask, add 256.3 g of 1,4-Cyclohexanedimethanol diglycidyl ether, 148 g of acrylic acid, 2.16 g of Tetrabutylammonium bromide, and 0.11 g of polymerization inhibitor (MEHQ) and react at 110°C for 15 hours to synthesize a compound represented by the following chemical formula 3-4.

[0346] [Chemical Formula 3-4]

[0347]

[0348]

[0349] Manufacturing Example 5

[0350] In a round flask, add 174.2 g of ethylene glycol diglycidyl ether, 148 g of acrylic acid, 2.16 g of tetrabutylammonium bromide, and 0.11 g of polymerization inhibitor (MEHQ) and react at 110°C for 15 hours to synthesize a compound represented by the following chemical formula 3-5.

[0351] [Chemical Formula 3-5]

[0352]

[0353]

[0354] Manufacturing Example 6

[0355] After dissolving 134.1 g of Trimethylolpropane in 200 g of toluene in a round flask, 148 g of acrylic acid and 13 g of methanesulfonic acid are added, and the resulting moisture is removed using a Dean-stark trap at 120°C for 10 hours. After the reaction is complete, the mixture is neutralized and washed with a 20% NaOH aqueous solution, and the residual solvent is removed to synthesize a compound represented by the following chemical formula 3-6.

[0356] [Chemical Formula 3-6]

[0357]

[0358]

[0359] Manufacturing Example 7

[0360] Add 12.8 g of Glycidyl acrylate, 7.2 g of acrylic acid, 0.216 g of Tetrabutylammonium bromide, and 0.05 g of polymerization inhibitor (MEHQ) to a round flask and react at 100°C for 10 hours to synthesize a compound represented by the following chemical formula 3-7.

[0361] [Chemical Formula 3-7]

[0362]

[0363]

[0364] Manufacturing Example 8

[0365] In a round flask, add 297 g of Triglycidyl Isocyanurate, 219 g of acrylic acid, 2.97 g of Tetrabutylammonium bromide, and 0.15 g of polymerization inhibitor (MEHQ) and react at 110°C for 15 hours to synthesize a compound represented by the following chemical formula 4-1.

[0366] [Chemical Formula 4-1]

[0367]

[0368]

[0369] Manufacturing Example 9

[0370] Add 142 g of Glycidyl methacrylate, 74 g of acrylic acid, 1.42 g of Tetrabutylammonium bromide, and 0.07 g of polymerization inhibitor (MEHQ) to a round flask and react at 110°C for 15 hours to synthesize a compound represented by the following chemical formula 5-1.

[0371] [Chemical Formula 5-1]

[0372]

[0373]

[0374] Manufacturing Example 10

[0375] In a round flask, add 249.2 g of dodecyl diglycidyl ether, 72 g of acrylic acid, 2.16 g of tetrabutylammonium bromide, and 0.11 g of polymerization inhibitor (MEHQ) and react at 110°C for 15 hours to synthesize a compound represented by the following chemical formula 5-2A.

[0376] [Chemical Formula 5-2A]

[0377]

[0378]

[0379] Manufacturing Example 11

[0380] Dissolve 100g of 1,6-hexanediol in 100ml of toluene, then add 135g of acrylic acid and 8.2g of methanesulfonic acid at 120℃ for 10 hours using a Dean-stark trap to remove the generated moisture.

[0381] When the reaction is complete, neutralize with a 20% NaOH aqueous solution, wash, and remove the residual solvent to synthesize a compound represented by the following chemical formula 2-2.

[0382] [Chemical Formula 2-2]

[0383]

[0384]

[0385] Comparative Manufacturing Example 1

[0386] In a round flask, add 463 g of 9,9-Bis(4-glycidyloxyphenyl)fluorine, 148 g of acrylic acid, 4.63 g of Tetrabutylammonium bromide, and 0.23 g of polymerization inhibitor (MEHQ) and react at 110°C for 15 hours. After the reaction is complete, add 262 g of m-Phenoxybenzyl Acrylate to synthesize a mixture of compounds represented by the following chemical formulas C-1-1 and C-1-2.

[0387] [Chemical formula C-1-1]

[0388]

[0389] [Chemical formula C-1-2]

[0390]

[0391]

[0392] Comparative Manufacturing Example 2

[0393] In a round flask, add 150 g of phenyl glycidyl ether, 75 g of acrylic acid, 1.50 g of tetrabutylammonium bromide, and 0.07 g of polymerization inhibitor (MEHQ) and react at 110°C for 15 hours to synthesize a compound represented by the following chemical formula C-2.

[0394] [Chemical Formula C-2]

[0395]

[0396]

[0397] Comparative manufacturing example 3

[0398] In a round flask, add 340.4 g of Bisphenol A glycidyl ether, 148 g of acrylic acid, 1.50 g of Tetrabutylammonium bromide, and 0.07 g of polymerization inhibitor (MEHQ) and react at 110°C for 15 hours to synthesize a compound represented by the following chemical formula C-3.

[0399] [Chemical Formula C-3]

[0400]

[0401]

[0402] Comparative Manufacturing Example 4

[0403] In a round flask, add 362.4 g of 4,4'-Sulfonylbisphenol diglycidyl ether, 148 g of acrylic acid, 1.50 g of Tetrabutylammonium bromide, and 0.07 g of polymerization inhibitor (MEHQ) and react at 110°C for 15 hours to synthesize a compound represented by the following chemical formula C-4.

[0404] [Chemical Formula C-4]

[0405]

[0406]

[0407] Comparative Manufacturing Example 5

[0408] 20 g of 1,4-benzene dithiol is sufficiently dissolved in 200 mL of methylene chloride. 22.5 g of 2-chloroethyl acrylate is added and stirred for 10 minutes. 17 g of triethylamine is slowly added dropwise at 0°C. After stirring for 12 hours, the reaction is terminated. 300 mL of methylene chloride and 300 mL of water are added and extracted. The organic layer is separated, diluted hydrochloric acid solution is added, and the extraction is repeated three times. The dichloromethane layer is separated, MgSO4 is added, and the mixture is stirred for 5 minutes. After filtering, the filtrate is concentrated. After column purification, concentration, and vacuum drying are performed to obtain a compound represented by the following chemical formula C-5.

[0409] [Chemical Formula C-5]

[0410]

[0411]

[0412] Preparation of surface-modified quantum dot dispersions

[0413] Manufacturing Example 12

[0414] A magnetic bar is placed in a three-necked round-bottomed flask, and a green quantum dot dispersion solution (InP / ZnSe / ZnS, Hansol Chemical; quantum dot solid content 26 wt%) is added to each. A compound (ligand) represented by the following chemical formula A is added thereto, and the mixture is stirred at 80°C in a nitrogen atmosphere. After the reaction is complete, the mixture is cooled to room temperature (23°C), and the quantum dot reaction solution is added to cyclohexane to precipitate. The precipitate and cyclohexane are separated by centrifugation, and the precipitate is sufficiently dried in a vacuum oven for 24 hours to obtain surface-modified quantum dots.

[0415] The surface-modified green quantum dots were stirred in a polymerizable compound for 12 hours to obtain a surface-modified quantum dot dispersion (QD solid content: 70 wt%).

[0416] (*Synthesis of a compound represented by chemical formula A: Add 100 g of Thioglycolic acid (Aldrich), 164 g of Triethylene glycol monomethyl ether (MTG, Hanong Chemical), 20 g of p-toluenesulfonic acid monohydrate (Aldrich), and 500 ml of cyclohexane, and heat in a nitrogen atmosphere so that cyclohexane can reflux, and remove the water produced using a Dean Stark apparatus. When no more water is produced, cool the reaction mixture to room temperature and wash it with ethyl acetate and distilled water. Neutralize the organic layer with a diluted NaOH solution, wash it several times with distilled water, dry it with MgSO4, and then concentrate it under reduced pressure to finally obtain a compound represented by chemical formula A below.)

[0417] [Chemical Formula A]

[0418]

[0419]

[0420] (Preparation of solvent-free curable composition)

[0421] Examples 1 to 11 and Comparative Examples 1 to 6

[0422] Using the components mentioned below, curable compositions according to Examples 1 to 11 and Comparative Examples 1 to 6 were prepared with the compositions shown in Tables 1 and 2 below.

[0423] Specifically, the above quantum dot dispersion is weighed, diluted, mixed with a polymerizable compound, and stirred for 5 minutes. Next, a photoinitiator is added, followed by a light diffusing agent. The resulting solution is then stirred for 1 hour to produce a curable composition.

[0424]

[0425] (A) Quantum dots

[0426] Surface-modified green quantum dot dispersion prepared from Manufacturing Example 12

[0427] (B) polymeric compound

[0428] (B-1) Compound of Manufacturing Example 1

[0429] (B-2) Compound of Manufacturing Example 2

[0430] (B-3) Compound of manufacturing example 3

[0431] (B-4) Compound of Manufacturing Example 4

[0432] (B-5) Compound of Manufacturing Example 5

[0433] (B-6) Compound of Manufacturing Example 6

[0434] (B-7) Compound of Manufacturing Example 7

[0435] (B-8) Compound of Manufacturing Example 8

[0436] (B-9) Compound of Manufacturing Example 9

[0437] (B-10) Compound of Manufacturing Example 10

[0438] (B-11) Compound of Manufacturing Example 11

[0439] (B-12) Compound of comparative manufacturing example 1

[0440] (B-13) Compound of comparative manufacturing example 2

[0441] (B-14) Compound of comparative manufacturing example 3

[0442] (B-15) Compound of comparative manufacturing example 4

[0443] (B-16) Compound of comparative manufacturing example 5

[0444] (C) Photopolymerization initiator

[0445] TPO-L (Polynetron)

[0446] (D) Light diffuser

[0447] Titanium dioxide dispersion (TiO2 solid content 50 wt%, average particle size: 200 nm, Iridos Co., Ltd.)

[0448]

[0449] (Unit: wt%) Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 Example 9 Example 10 Example 11 (A) Quantum dot dispersion 58585858585858585858 (B) Polymerization Compound (B-1)18----------(B-2)-18---------(B-3)--18--------(B-4)---18----------(B-5)----18------(B-6)-----18-----(B-7)------18----(B-8)-------18---(B-9)--------18--(B-10)---------18-(B-11)131313131313131313131313131(C) Photopolymerization initiator3333333333(D) Light diffusion agent888888888888

[0450] (Unit: wt%) Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 Comparative Example 6 (A) Quantum dot dispersion 585858585858 (B) Polymerizable compound (B-11) 1313131313- (B-12) 18----31 (B-13)-18--- (B-14)--18--- (B-15)---18--(B-16)----18- (C) Photopolymerization initiator 333333 (D) Light diffusing agent 888888

[0451]

[0452] (Preparation of solvent-based curable composition)

[0453] Examples 12 to 21 and Comparative Examples 7 to 11

[0454] Using the components mentioned below, curable compositions according to Examples 12 to 21 and Comparative Examples 7 to 11 were prepared with the compositions shown in Tables 3 and 4 below.

[0455]

[0456] (A) Quantum dots

[0457] Green quantum dot dispersion solution (InP / ZnSe / ZnS, Hansol Chemical; quantum dot solid content 25 wt%)

[0458] (B) polymeric compound

[0459] (B-1) Compound of Manufacturing Example 1

[0460] (B-2) Compound of Manufacturing Example 2

[0461] (B-3) Compound of manufacturing example 3

[0462] (B-4) Compound of Manufacturing Example 4

[0463] (B-5) Compound of Manufacturing Example 5

[0464] (B-6) Compound of Manufacturing Example 6

[0465] (B-7) Compound of Manufacturing Example 7

[0466] (B-8) Compound of Manufacturing Example 8

[0467] (B-9) Compound of Manufacturing Example 9

[0468] (B-10) Compound of Manufacturing Example 10

[0469] (B-11) Compound of Manufacturing Example 11

[0470] (B-12) Compound of comparative manufacturing example 1

[0471] (B-13) Compound of comparative manufacturing example 2

[0472] (B-14) Compound of comparative manufacturing example 3

[0473] (B-15) Compound of comparative manufacturing example 4

[0474] (B-16) Compound of comparative manufacturing example 5

[0475] (C) Photopolymerization initiator

[0476] TPO-L (Polynetron)

[0477] (D) Light diffuser

[0478] Titanium dioxide dispersion (TiO2 solid content 50 wt%, average particle size: 200 nm, Iridos Co., Ltd.)

[0479] (E) Binder resin

[0480] TA-01 (Tagoma, solid content 50 wt%)

[0481] (F) solvent

[0482] Propylene glycol monomethyl ether acetate (Sigma-Aldrich)

[0483] (G) Other additives

[0484] Leveling agent (F-554, DIC)

[0485]

[0486] (Unit: wt%) Example 12 Example 13 Example 14 Example 15 Example 16 Example 17 Example 18 Example 19 Example 20 Example 21 (A) Quantum dot dispersion 54.6754.6754.6754.6754.6754.6754.6754.6754.6754.6754.6754.67 (B) Polymerizable compound (B-1) 7.97- -- -- - - - (B-2)- 7.97- -- - - - - - (B-3)- -7.97- - - - - - - (B-4)- - - 7.97- - - - - - (B-5)- - - - 7.97- - - - - (B-6)- - - - - 7.97- - - - (B-7)- - - - - - 7.97- - - (B-8)- - - - - - - 7.97- - (B-9)-- - - - - - - 7.97- (B-10)-- -- -- -- -- - 7.97(C) Photopolymerization initiator0.330.330.330.330.330.330.330.330.330.330.33(D) Light diffusion agent2.672.672.672.672.672.672.672.672.672.672.67(E) Binder resin20202020202020202020(F) Solvent 14.3314.3314.3314.3314.3314.3314.3314.3314.3314.33(G) Other additives 0.030.030.030.030.030.030.030.030.030.030.03 Total 100100100100100100100100100

[0487] (Unit: wt%) Comparative Example 7 Comparative Example 8 Comparative Example 9 Comparative Example 10 Comparative Example 11 (A) Quantum dot dispersion 54.67 54.67 54.67 54.67 54.67 54.67 (B) Polymerizable compound (B-12) 7.97 ---- (B-13) - 7.97 --- (B-14) - 7.97 - (B-15) - 7.97 - (B-16) ---- 7.97 (C) Photopolymerization initiator 0.33 0.33 0.33 0.33 0.33 0.33 (D) Light diffusing agent 2.67 2.67 2.67 2.67 2.67 (E) Binder resin 20 20 20 20 20 (F) Solvent 14.33 14.33 14.33 14.33 14.33 14.33 (G) Others Additive0.030.030.030.030.030.03Total100100100100100

[0488] Evaluation: Evaluation of optical properties and diffuse reflectance of curable compositions

[0489] For each of the curable compositions according to Examples 1 to 21 and Comparative Examples 1 to 11, a single film having a thickness of 10 μm was produced after exposure, and the quantum efficiency (EQE) was measured using an integrating sphere device (QE-2100, otsuka electronics). The results are shown in Table 5 below.

[0490] In addition, for each of the curable compositions according to Examples 1 to 21 and Comparative Examples 1 to 11, the change in luminance over time was measured using an inline luminance measuring device (M7000, Mcscience) under the condition of 105,000 nit for the blue LED chip luminance.

[0491] The light reliability was evaluated by comparing the time to reach T90 based on the initial measurement value of 100%, and the results are shown in Table 5 below.

[0492]

[0493] Quantum efficiency after exposure (%) Light resistance reliability (hours) Example 1 35.8 > 2000 Example 2 36.5 > 2000 Example 3 35.9 10 50 Example 4 35.6 > 2000 Example 5 35.5 12 10 Example 6 35.4 7 50 Example 7 35.5 12 40 Example 8 35.5 > 2000 Example 9 35.4 10 16 Example 10 35.9 9 80 Example 11 35.2 6 50 Example 12 33.1 4 50 Example 13 33.8 4 36 Example 14 33.7 3 25 Example 15 33.5 4 80 Example 16 33.6 4 00 Example 17 32.9 3 90 Example 1832.9350 Example 1933.0414 Example 2033.3330 Example 2133.2316 Comparative Example 130.456 Comparative Example 230.934 Comparative Example 330.5124 Comparative Example 430.440 Comparative Example 530.824 Comparative Example 630.124 Comparative Example 729.726 Comparative Example 829.326 Comparative Example 929.825 Comparative Example 1029.925 Comparative Example 1130.026

[0494]

[0495] From the above Table 5, it can be confirmed that the curable compositions according to Examples 1 to 21 have higher quantum efficiency after exposure, thereby improving optical properties, and at the same time, have excellent light resistance reliability, compared to the curable compositions according to Comparative Examples 1 to 11.

[0496]

[0497] The present invention is not limited to the above-described embodiments, but can be manufactured in a variety of different forms. Those skilled in the art will appreciate that the present invention can be implemented in other specific forms without altering the technical spirit or essential characteristics of the present invention. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive.

Claims

1. (A) Quantum dots; and (B) containing a polymeric compound, A curable composition in which the polymerizable compound comprises a structural unit represented by the following chemical formula 1, but does not include an aromatic ring, and at the same time comprises a functional group represented by the following chemical formula 2 at at least one terminal. [Chemical Formula 1] [Chemical Formula 2] In the above chemical formula 1, L 0 is a single bond or a substituted or unsubstituted C1 to C20 alkylene group, In the above chemical formula 2, R 1 is a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group.

2. In paragraph 1, The above polymerizable compound is a curable composition represented by the following chemical formula 3: [Chemical Formula 3] In the above chemical formula 3, R 1 is a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group, L 1 Inland L 3 are each independently a single bond, a substituted or unsubstituted C1 to C20 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group or a fused ring thereof, provided that the L 1 Inland L 3 is not a single bond at the same time.

3. In paragraph 2, Above L 1 and L 3 are identical curable compositions.

4. In paragraph 3, Above L 2 is the above L 1 and L 3 A curable composition that is different from all others.

5. In paragraph 2, The above polymerizable compound is a curable composition comprising at least one compound selected from the group consisting of the following chemical formulas 3-1 to 3-7. [Chemical Formula 3-1] [Chemical Formula 3-2] [Chemical Formula 3-3] [Chemical Formula 3-4] [Chemical Formula 3-5] [Chemical Formula 3-6] [Chemical Formula 3-7] 6. In paragraph 2, The above polymerizable compound is a curable composition represented by the following chemical formula 4: [Chemical Formula 4] In the above chemical formula 4, A is a compound with a non-aromatic cyclic structure, R 1 is a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group, n is an integer from 3 to 6.

7. In paragraph 6, The above polymerizable compound is a curable composition represented by the following chemical formula 4-1. [Chemical Formula 4-1] 8. In paragraph 2, The above polymerizable compound is a curable composition represented by the following chemical formula 5: [Chemical Formula 5] In the above chemical formula 5, R 1 is a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group, R 2 is a substituted or unsubstituted C1 to C20 alkyl group or a functional group represented by the following chemical formula 6, [Chemical Formula 6] In the above chemical formula 6, R 0 is a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group.

9. In paragraph 8, A curable composition comprising at least one compound selected from the group consisting of the following chemical formulas 5-1 and 5-2. [Chemical Formula 5-1] [Chemical Formula 5-2] (In the above chemical formula 5-2, n is an integer from 10 to 12) 10. In paragraph 1, The above polymerizable compound is a first polymerizable compound, The curable composition further comprises, in addition to the first polymerizable compound, a second polymerizable compound represented by the following chemical formula 7: [Chemical Formula 7] In the above chemical formula 7, L 4 is a substituted or unsubstituted C1 to C10 alkylene group, a substituted or unsubstituted C3 to C20 cycloalkylene group or an ether group (*-O-*), L 5 and L 6 are each independently a single bond or a substituted or unsubstituted C1 to C10 alkylene group, R 3 and R 4 are each independently a hydrogen atom or a substituted or unsubstituted C1 to C20 alkyl group.

11. In paragraph 10, A curable composition comprising the first polymerizable compound and the second polymerizable compound in a weight ratio of 50:50 to 90:

10.

12. In paragraph 1, The above curable composition is a curable composition that is a solvent-free curable composition.

13. In paragraph 12, The above solvent-free curable composition, with respect to the total amount of the above solvent-free curable composition, 5 to 60 wt% of the above quantum dots; and 40 wt% to 95 wt% of the above polymerizable compound A solvent-free curable composition comprising:

14. In paragraph 1, The above curable composition further comprises a polymerization initiator, a light diffusing agent, a polymerization inhibitor or a combination thereof.

15. In paragraph 14, The above light diffusing agent is a curable composition comprising barium sulfate, calcium carbonate, titanium dioxide, zirconia or a combination thereof.

16. In paragraph 1, The above curable composition further comprises a solvent.

17. In paragraph 16, The curable composition comprises, based on the total weight of the curable composition, 1 wt% to 40 wt% of the quantum dot; 1 wt% to 20 wt% of the polymerizable compound; and 40 wt% to 80 wt% of the solvent.

18. In paragraph 1, The curable composition further comprises malonic acid; 3-amino-1,2-propanediol; a silane coupling agent; a leveling agent; a fluorinated surfactant; or a combination thereof.

19. A cured film manufactured using a curable composition according to any one of claims 1 to 18.

20. A display device including the cured film of Article 19.

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