Forming method for extremely low thermal conductivity direct current cable and direct current cable for quantum computer

Abstract

Disclosed in the present invention is a forming method for an extremely low thermal conductivity direct current cable. A wire core of a titanium alloy material is used, an insulating paint layer is wrapped on the wire core to form a wire, wires are stranded for multiple times to successively form a small wire pair, a large wire pair, a wire strand, and a cable core, and an external sheath of a non-metallic material is wrapped on the outer side of the cable core to form a direct current cable. Further disclosed is a direct current cable for a quantum computer which is manufactured by using the forming method for the extremely low thermal conductivity direct current cable. The forming method for the extremely low thermal conductivity direct current cable is convenient and rapid to operate. The direct current cable for the quantum computer has low thermal conductivity and smaller size, and can be effectively suitable for working environments having a low temperature and a compact space.

Description

Method for forming a DC wire with extremely low thermal conductivity and DC wire for quantum computers Technical Field

[0001] The present invention relates to the technical field of cables, and more precisely to a method for forming a DC line with extremely low thermal conductivity and a DC line for a quantum computer. Background Art

[0002] DC cables can be used as transmission cables for DC signals, providing communication between the inside and outside of equipment. In low-temperature environments within equipment, DC cables are required to have extremely low thermal conductivity. Existing DC cables are primarily used in normal temperature environments, and DC lines have fewer pathways. To ensure signal transmission and avoid crosstalk, the current mainstream process is left-right twisting (SZ-twisting). This process is relatively mature, with each wire group arranged with different lay lengths for adjacent wire groups in each layer. Arrangements include 1+6, 1+6+12, and other arrangements. After twisting, the cables are wrapped with a metal shield and insulation layer to ensure cable strength and anti-interference capabilities. However, this also increases the cable's bulk and reduces its bendability. Furthermore, existing DC cables generally have a metal center reinforcement and shielding layer, resulting in high thermal conductivity.

[0003] Take the DC cables used in quantum computers, for example. Quantum chips require a vacuum and extremely low temperatures to achieve optimal performance. To maintain this low temperature, it's crucial to prevent the cables running through them from transferring excessive heat. Furthermore, the compact interior of quantum computers requires cables that are small and flexible. DC cables produced using existing processes struggle to meet the low thermal conductivity, small size, and flexibility requirements, making them difficult to use in devices operating in low temperatures and compact spaces.

[0004] In summary, a new DC wire forming method is needed in the art to produce a DC wire with extremely low thermal conductivity, smaller volume and greater flexibility.

[0005] Summary of the Invention

[0006] In view of this, the object of the present invention is to provide a method for forming an extremely low thermal conductivity DC line, which uses low thermal conductivity wires and twists them multiple times without a central reinforcement to form a wire core arranged in a 2*2*2*3 manner, thereby reducing the thermal conductivity and cable bending radius of the DC line.

[0007] Another object of the present invention is to provide a DC line for a quantum computer, which is manufactured using the extremely low thermal conductivity DC line forming method.

[0008] In order to achieve the above object, the present invention provides a method for forming an extremely low thermal conductivity DC wire, comprising the steps of:

[0009] (A) A guide wire made of titanium alloy is selected, an insulating varnish layer is coated on the outside of the guide wire to form a conductive wire, and the conductive wire is wound around a conductive wire shaft;

[0010] (B) Select two wire spools for winding wires, pull the wires out of the spools respectively, and fix the ends of the two wires on a first wire collection spool;

[0011] (C) The two conductor shafts rotate about the midpoint of the line connecting the two conductor shafts, and the two conductors are twisted;

[0012] (D) The first collecting spool rotates, and the two twisted wires are collected and wound on the first collecting spool. After the two wires are twisted and collected, a small wire pair is formed.

[0013] (E) Pull the two small wire pairs out of the first collection spool, fix the ends of the small wire pairs on the second collection spool, rotate the two first collection spools around the midpoint of the line connecting the two first collection spools, and gather and wind the two twisted small wire pairs on the second collection spool. After the two small wire pairs are twisted and gathered, they form a large wire pair.

[0014] (F) Pull the two large wire pairs out from the second wire collection spool, fix the ends of the large wire pairs on the third wire collection spool, rotate the two second wire collection spools around the midpoint of the line connecting the two second wire collection spools, collect and wind the two twisted large wire pairs on the third wire collection spool, and form a wire collection after the two large wire pairs are twisted and collected;

[0015] (G) pulling the three wire bundles out from the third wire bundle spool, fixing the ends of the wire bundles, arranging the three third wire bundle spools in a triangle, and rotating about the center point of the triangle, collecting and twisting the three wire bundles to form a wire core;

[0016] (H) A non-metallic outer sheath is braided outside the wire core to form a DC wire.

[0017] Preferably, in the step (D), the first collection shaft and the spool rotate in the same direction.

[0018] Preferably, in the step (E), the second wire collection shaft rotates in the same direction as the first wire collection shaft.

[0019] Preferably, in the step (F), the third wire collection shaft rotates in the same direction as the second wire collection shaft.

[0020] Preferably, in step (C), the two spools rotate clockwise at a constant speed with the midpoint of the line connecting the two spools as the center.

[0021] Preferably, the pitch range of the small line pairs formed in step (D) is 6-10 mm.

[0022] Preferably, the pitch range of the large line pairs formed in step (E) is 8-14 mm.

[0023] Preferably, the pitch range of the wire set formed in step (F) is 16-20 mm

[0024] Preferably, the thickness of the insulating paint layer in step (A) is 0.01-0.03 mm.

[0025] The present invention provides a DC line for use in a quantum computer, which is manufactured by adopting the extremely low thermal conductivity DC line forming method.

[0026] Compared with the prior art, the advantages of the method for forming a DC line with extremely low thermal conductivity and the DC line for a quantum computer disclosed in the present invention are: the twisting direction of each step of the method for forming a DC line with extremely low thermal conductivity is the same, which can effectively avoid the mutual influence of each step and constrain the twisting force, and the operation is convenient and quick; the DC line uses a conductor with extremely low thermal conductivity, and does not use metal reinforcements and shielding layers, but uses a non-metallic outer sheath, which effectively reduces the thermal conductivity; the various conductors of the DC line are twisted compactly and not easy to loosen, and the repeated twisting in multiple steps can reduce signal interference between DC signal loops without using a metal shielding layer; the DC line has no internal reinforcements, is smaller in size, is softer and easier to bend as a whole, has a smaller bending radius, and can be more conveniently arranged in a tight space. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0028] FIG1 is a flow chart of a method for forming a DC wire with extremely low thermal conductivity according to the present invention.

[0029] FIG2 is a schematic diagram of the spool rotation process in step (C) of a method for forming a DC wire with extremely low thermal conductivity according to the present invention.

[0030] FIG3 is a schematic diagram showing the rotation process of the third collecting shaft in step (G) of a method for forming a DC wire with extremely low thermal conductivity according to the present invention.

[0031] FIG4 is a schematic cross-sectional view of a conductor of a DC line for a quantum computer according to the present invention.

[0032] FIG5 is a schematic cross-sectional view of a DC line for a quantum computer according to the present invention. DETAILED DESCRIPTION

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0034] As shown in FIG1 , the present invention provides a method for forming a DC wire with extremely low thermal conductivity, comprising the following steps:

[0035] (A) A guide wire made of titanium alloy is selected, an insulating varnish layer is coated on the outside of the guide wire to form a conductive wire, and the conductive wire is wound around a conductive wire shaft;

[0036] (B) Select two wire reels with wound wires, pull the wires out of the reels, align them, and secure the wire ends to a first collection reel;

[0037] (C) The two wire shafts rotate at a constant speed about the midpoint of the line connecting the two wire shafts, and the wires are gradually released from the wire shafts, and the two wires are twisted;

[0038] (D) The first collecting spool rotates at a constant speed in the same direction as the conductor axis, collecting and winding the two twisted conductors on the first collecting spool. During the collection and winding process, the conductors are kept in a straight state. After the two conductors are twisted and collected, a small wire pair is formed.

[0039] (E) Pull the two small wire pairs out of the first collection spool, fix the ends of the small wire pairs on the second collection spool, rotate the two first collection spools at a constant speed with the midpoint of the line connecting the two first collection spools as the center, and rotate the second collection spool at a constant speed in the same direction as the first collection spool, collect and wind the two twisted small wire pairs on the second collection spool, and keep the small wire pairs in a straight state during the collection and winding process. After the two small wire pairs are twisted and collected, they form a large wire pair;

[0040] (F) Pull out the two large wire pairs from the second wire collection spool, fix the ends of the large wire pairs on the third wire collection spool, and the two second wire collection spools rotate at a constant speed with the midpoint of the line connecting the two second wire collection spools as the center. The third wire collection spool rotates at a constant speed in the same direction as the second wire collection spools, and the two twisted large wire pairs are collected and wound on the third wire collection spool. During the collection and winding process, the large wire pairs are in a straight state. After the two large wire pairs are twisted and collected, a wire bundle is formed. The wire bundle has a 2*2*2 structure.

[0041] (G) Pull out the three wire sets from the third wire spool, fix the ends of the wire sets, arrange the three third wire spools in an isosceles triangle, and rotate at a constant speed in the same direction as the third wire spool with the center point of the isosceles triangle as the center, collect and twist the three wire sets, and the wire sets are in a straight state during the process. After the collection and twisting are completed, a wire core is formed, and the wire core has a 2*2*2*3 structure;

[0042] (H) A non-metallic outer sheath is braided outside the wire core to form a DC wire.

[0043] 4 , the thickness of the insulating varnish layer 12 in step (A) is 0.01-0.03 mm, the thermal conductivity of the guide wire 11 made of titanium alloy is very low, and the diameter of the conductor 1 formed after being wrapped with the insulating varnish layer 12 is very small, which can ensure the low thermal conductivity and small volume of the DC line.

[0044] Referring to Figure 2, in step (C), when the two spools A and B rotate one circle and return to their initial positions, the two wires are twisted to form small wire pairs. The distance between the twisted structures on the small wire pairs is one pitch, and the pitch range of the small wire pairs is 6-10mm; preferably, the pitch sizes of the small wire pairs are different.

[0045] The pitch of the large wire pairs in step (E) ranges from 8 to 14 mm, and preferably the pitches of the large wire pairs are different.

[0046] The pitch of the wire assemblies in step (F) ranges from 16 to 20 mm, and preferably the pitch of each wire assembly is different.

[0047] Preferably, in step (C), the two spools rotate clockwise at a constant speed with the midpoint of the line connecting the two spools as the center, and the subsequent first, second and third collective spools all rotate clockwise at a constant speed, which can avoid mutual influence between the steps and constrain the twisting force.

[0048] Referring to Figure 3, in step (G), the three third-party spools C, D, and E are arranged in an isosceles triangle and rotate clockwise at a constant speed. The cores have no pitch requirements and are held together by friction between the spools, preventing them from loosening.

[0049] Referring to Figure 5, the DC line for a quantum computer, produced in step (H), comprises a 2x2x2x3 core 1, encased in a non-metallic outer sheath 2. The DC line for a quantum computer has 24 communication channels, and the non-metallic outer sheath 2 encases the core 1, isolating it from heat transfer and further reducing thermal conductivity.

[0050] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for forming a DC wire with extremely low thermal conductivity, characterized in that: Includes steps: (A) A guide wire made of titanium alloy is selected, an insulating paint layer is wrapped around the outside of the guide wire to form a conductor, and the conductor is wound around a conductor shaft; (B) selecting two wire reels for winding wires, pulling the wires out of the wire reels respectively, and fixing the ends of the two wires on a first wire collection reel; (C) The two conductor axes rotate around the midpoint of the line connecting the two conductor axes, and the two conductors are twisted; (D) The first wire collecting shaft rotates, and the two twisted wires are collected and wound on the first wire collecting shaft. After the two wires are twisted and collected, a small wire pair is formed; (E) Pull out two small wire pairs from the first wire collection shaft, fix the ends of the small wire pairs on the second wire collection shaft, rotate the two first wire collection shafts around the midpoint of the line connecting the two first wire collection shafts, collect and wind the two twisted small wire pairs on the second wire collection shaft, and after the two small wire pairs are twisted and collected, form a large wire pair; (F) Pull out the two large wire pairs from the second wire collection shaft, fix the ends of the large wire pairs on the third wire collection shaft, rotate the two second wire collection shafts around the midpoint of the line connecting the two second wire collection shafts, collect and wind the two twisted large wire pairs on the third wire collection shaft, and form a wire collection after the two large wire pairs are twisted and collected; (G) pulling out the three wire sets from the third wire set spool, fixing the wire ends of the wire sets, arranging the three third wire set spools in a triangle, and rotating around the center point of the triangle, collecting and twisting the three wire sets, and collecting and twisting to form a wire core; (H) A layer of non-metallic outer sheath is woven outside the wire core to form a DC wire.

2. The method for forming a DC wire with extremely low thermal conductivity according to claim 1, characterized in that: In the step (D), the first collecting shaft rotates in the same direction as the wire shaft.

3. The method for forming a DC wire with extremely low thermal conductivity according to claim 2, characterized in that: In the step (E), the second wire collecting shaft rotates in the same direction as the first wire collecting shaft.

4. The method for forming a DC wire with extremely low thermal conductivity according to claim 3, characterized in that: In the step (F), the third wire collecting shaft rotates in the same direction as the second wire collecting shaft.

5. The method for forming a DC wire with extremely low thermal conductivity according to claim 4, characterized in that: In the step (C), the two spools rotate at a constant speed clockwise with the midpoint of the line connecting the two spools as the center.

6. The method for forming a DC wire with extremely low thermal conductivity according to claim 1, characterized in that: The pitch range of the small line pairs formed in the step (D) is 6-10 mm.

7. The method for forming a DC wire with extremely low thermal conductivity according to claim 1, characterized in that: The pitch range of the large line pairs formed in the step (E) is 8-14 mm.

8. The method for forming a DC wire with extremely low thermal conductivity according to claim 1, characterized in that: The pitch range of the wire set formed in step (F) is 16-20 mm 9. The method for forming a DC wire with extremely low thermal conductivity according to claim 1, characterized in that: The thickness of the insulating paint layer in step (A) is 0.01-0.03 mm.

10. A DC line for a quantum computer, characterized in that: The method for forming a DC wire with extremely low thermal conductivity is adopted as claimed in any one of claims 1 to 9.

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