Measuring device and mounting machine

Abstract

The present invention shortens the length of a measuring device in the axial direction.　In this measuring device, the electrical characteristics of a measurement object are measured while the measurement object is gripped by a pair of first facing surfaces, and the gripping state of the measurement object gripped by the pair of first facing surfaces is acquired on the basis of the conduction state of current between a pair of second facing surfaces. Furthermore, the pair of first facing surfaces and the pair of second facing surfaces are provided in parallel with each other. Therefore, the length of the measuring device in the axial direction can be shortened more than a case where a probe and the pair of facing surfaces are provided in series in the axial direction.

Description

Measuring equipment, placement machine

[0001] The present disclosure relates to a measuring device that measures electrical characteristics of a measurement object while being gripped by a pair of opposing surfaces, and a mounting machine that includes the measuring device.

[0002] Patent Document 1 describes a measuring device that uses a probe to measure the electrical characteristics of a component mounted on a circuit board. The probe is held axially movably on the main body of the measuring device, and a pair of opposing surfaces is provided between one end of the probe and the main body. The pair of opposing surfaces are brought into contact with and separated from each other by movement of the probe relative to the main body. When the other end of the probe comes into contact with the component, the probe moves relative to the main body, separating the pair of opposing surfaces and switching from a conductive state to a non-conductive state. This makes it possible to determine whether the other end of the probe is in contact with the component.

[0003] Japanese Patent Application Publication No. 7-72210 overview

[0004] Problem to be solved

[0005] An object of the present disclosure is to shorten the axial length of the measuring device. Means for solving the problem, actions and effects

[0006] In the measuring device according to the present disclosure, the electrical characteristics of the measurement object are measured while the measurement object is held by the pair of first opposing surfaces, and the state of holding of the measurement object by the pair of first opposing surfaces is acquired based on the state of current conduction between the pair of second opposing surfaces. Furthermore, the pair of first opposing surfaces and the pair of second opposing surfaces are arranged in parallel with each other. Therefore, the axial length of the measuring device can be shortened compared to when the probe and the pair of opposing surfaces are arranged in series in the axial direction.

[0007] 6A is a perspective view of a placement machine including a measuring device according to a first embodiment of the present disclosure; FIG. 6B is a cross-sectional view of a main part of the measuring device; FIG. 6C is a conceptual diagram of the main part of the measuring device; FIG. 6D is a perspective view of a part that is an object to be measured by the measuring device; FIG. 6E is a conceptual diagram of an operating state of the measuring device; (6A) A state in which the part is gripped; (6B) A state in which the part is not gripped; A diagram showing the periphery of an air cylinder of the measuring device; A diagram showing the periphery of a control device of the placement machine; A flowchart showing an electrical characteristic acquisition program stored in a memory unit of the control device. Embodiment

[0008] A measuring device according to an embodiment of the present disclosure will be described in detail below with reference to the drawings.

[0009] The placement machine shown in FIG. 1 places electronic components s (hereinafter referred to as components) on a circuit board and includes a main body 2, a circuit board transport and holding device 4, a component supply device 6, a head moving device 8, etc. The circuit board transport and holding device 4 transports and holds a circuit board P (hereinafter referred to as board) in a horizontal position. In FIG. 1 , the transport direction of the board P is defined as the x-direction, the width direction of the board P as the y-direction, and the thickness direction of the board P as the z-direction. The y-direction and z-direction are the front-to-back and up-to-down directions of the placement machine, respectively. The x-direction, y-direction, and z-direction are perpendicular to each other. The component supply device 6 supplies components s to be placed on the board P and includes multiple tape feeders 14, etc. The head moving device 8 moves a working head 16 in the x-, y-, and z-directions. The working head 16 holds a suction nozzle 18, which is an example of a component holder that picks up and holds the components s.

[0010] The placement machine also includes a camera 20, a measuring device 22, etc. The camera 20 captures an image of the component s held by the suction nozzle 18. Based on the image captured by the camera 20, it is determined whether the component s is to be placed on the circuit board P. The measuring device 22 measures the electrical characteristics of the component s that has not been placed on the board P. The electrical characteristics of the component s include L (inductance), C (capacitance), R (resistance, resistance value), X (reactance), Z' (impedance), etc., and the measuring device 22 measures one or more of these.

[0011] The measuring device 22 is provided on the main body of the circuit board conveying and holding device 4 via a storage box 26. A disposal passage 28 is provided between the storage box 26 and the measuring device 22, and the components s whose electrical characteristics have been measured are stored in the storage box 26 via the disposal passage 28.

[0012] The measuring device 22 includes a main body 30, a mounting base 32, a pair of probe groups 34, 36, a mounting base moving device 38, and an approaching / separating device 40. As shown in Fig. 2, the main body 30 is attached to the storage box 26. As shown in Fig. 3, the main body 30 is provided with a through-hole 30a that can communicate with the disposal passage 28.

[0013] The mounting table 32 holds a component s as a measurement target, and includes a component mounting section 42 and a mounting section holder 43 that holds the component mounting section 42. A V-shaped groove 42c is formed in the component mounting section 42, and the component s is placed in the V-shaped groove 42c. The V-shaped groove 42c extends in the y-direction, and the component s is placed in the V-shaped groove 42c. A cover 41 is attached to the mounting table 32.

[0014] In this embodiment, the component s has electrodes sp1 and sp2 at both ends as shown in FIG. 5, and may be, for example, a square chip.

[0015] 3 and 4, each of the probe pairs 34, 36 can move toward or away from each other, and includes a pair of probes, i.e., first probes 46, 48, and a pair of probes, i.e., second probes 50, 52, which are separate from the pair of first probes 46, 48. Insulator portions 53, 54 are provided between the pair of first probes 46, 48 and the pair of second probes 50, 52. This makes the pair of first probes 46, 48 and the pair of second probes 50, 52 electrically independent of each other.

[0016] In this embodiment, the pair of first probes 46, 48 and the pair of second probes 50, 52 are arranged side by side in the up-down direction (z direction) via the insulator portions 53, 54. The pair of first probes 46, 48 are located on the V-groove 42c side. The up-down direction is a direction that intersects with and is perpendicular to the approaching and separating directions of the pair of probe groups 34, 36.

[0017] The pair of first probes 46, 48 each have a first opposing surface 46f, 48f that is an opposing surface that faces each other. The part s is gripped by the pair of first opposing surfaces 46f, 48f at end surfaces fs1, fs2 of the electrodes sp1, sp2.

[0018] The pair of first probes 46, 48 are connected via a coaxial cable to an LCR acquisition unit 56, which serves as an electrical characteristic acquisition unit. The pair of first probes 46, 48 approach each other to grip the component s, and the LCR acquisition unit 56 acquires the electrical characteristics of the component s while it is gripped.

[0019] The pair of second probes 50, 52 each have a second opposing surface 50f, 52f that is an opposing surface that faces each other. The pair of second probes 50, 52 are connected via conductors to a continuity state acquisition unit 58 that serves as a gripping state acquisition unit. The continuity state acquisition unit 58 acquires whether the pair of second probes 50, 52 is in a conductive state or a non-conductive state in which current flows between them.

[0020] The gauge element group 34, which is one of the pair of gauge element groups 34, 36, is held by a stator group holder 60 fixedly provided on the main body 30. The gauge element group 34 can be referred to as a stator group. The gauge element group 36, which is the other of the pair of gauge element groups 34, 36, is held so as to be integrally movable by a mover group holder 62 provided so as to be movable relative to the main body 30. The gauge element group 36 can be referred to as a mover group. In this embodiment, the mover group 36 can move toward and away from the stator group 34 in the y direction.

[0021] In this embodiment, the stator group 34 includes a first probe 46 and a second probe 50, and the mover group 36 includes a first probe 48 and a second probe 52. The first probe 46 and the second probe 50 may be referred to as the fixed-side first probe 46 and the fixed-side second probe 50, respectively, and the first probe 48 and the second probe 52 may be referred to as the movable-side first probe 48 and the movable-side second probe 52, respectively.

[0022] The first opposing surface 48f of the movable-side first probe 48 has a shape that allows it to enter the V-groove 42c formed in the upper surface of the mounting table 32, in other words, a generally triangular shape that corresponds to the V-groove 42c. Therefore, the movable-side first probe 48, together with the fixed-side first probe 46, can grip the part s placed in the V-groove 42c.

[0023] 3, the movable-side first probe 48 includes a front end 48a including a first opposing surface 48f, and the front end 48a protrudes downward from the intermediate portion 48b. The outer surface of the front end 48a is close to the inner surface of the V-groove 42c, but the intermediate portion 48b is spaced far from the component placement portion 42.

[0024] The pair of first opposing surfaces 46f, 48f and the pair of second opposing surfaces 50f, 52f extend in a direction (x direction) orthogonal to the approaching / separating direction. The first probes 46, 48 and the second probes 50, 52 are movable integrally. The distance between the first opposing surfaces 46f, 48f and the distance between the second opposing surfaces 50f, 52f are the same. Therefore, when the pair of first opposing surfaces 46f, 48f are in contact with each other, the pair of second opposing surfaces 50f, 52f are also in contact with each other, and when the pair of first opposing surfaces 46f, 48f are spaced apart from each other, the pair of second opposing surfaces 50f, 52f are also spaced apart from each other.

[0025] In this embodiment, the first opposing surface 46 f and the second opposing surface 50 f are located at the same position in the approaching / separating direction, the first opposing surface 48 f and the second opposing surface 52 f are located at the same position in the approaching / separating direction, the first opposing surface 46 f and the second opposing surface 50 f are located on the same plane, and the first opposing surface 48 f and the second opposing surface 52 f are located on the same plane. However, such a structure is not essential.

[0026] For example, when measuring the electrical characteristics of a component s, when the pair of first probes 46, 48 are close to each other, as shown in FIG. 6B , if the pair of second probes 50, 52 are in a conductive state (current flows) between them, the pair of second opposing surfaces 50f, 52f are in contact, and the pair of first opposing surfaces 46f, 48f are also in contact. In this state, it can be seen that the component s is not gripped by the pair of first opposing surfaces 46, 48f. As shown in FIG. 6A , if the pair of second probes 50, 52 are in a non-conductive state (current does not flow) between them, the pair of second opposing surfaces 50f, 52f are spaced apart, and the pair of first opposing surfaces 46f, 48f are spaced apart. In this state, it can be seen that the component s is gripped by the pair of first opposing surfaces 46f, 48f.

[0027] As shown in Figure 4, the thicknesses (vertical lengths) d1 and d2 of the insulator portions 53 and 54 are not necessarily the same. If the upper surfaces of the first fixed-side probe 46 and the first movable-side probe 48 are located at approximately the same position (the same height), the thicknesses of the insulator portions 53 and 54 may be the same or different. On the other hand, if the upper surfaces of the first fixed-side probe 46 and the first movable-side probe 48 are located at different heights, it is desirable to make the thickness of the insulating end portion of the lower upper surface of the first fixed-side probe 46 or the first movable-side probe 48 thicker than that of the higher upper surface. This effectively prevents the first opposing surface of the higher upper surface of one of the pair of probe groups 34 and 36 from opposing the second opposing surface of the lower upper surface.

[0028] 4, the heights of the upper surfaces of the insulator portions 53, 53 may be the same or different. The heights of the upper surfaces of the insulator portions 53, 54 may be different as long as the first opposing surface of one and the second opposing surface of the other do not face each other.

[0029] As shown in Figure 3, an air passage 70 is formed in a member on the stator group side (for example, one or more of the stator group 34, the stator group holder 60, and the main body 30), and is connected to air cylinders 72 and 74, which serve as fluid pressure cylinders. An opening (not shown) of the air passage 70 is provided in the member on the stator group side. The opening is formed so that the ejected air is supplied to the opposing surface 48f of the movable-side first measuring element 48. An ionizer 76 is also provided in the air passage 70. The ionizer 76 ionizes the air by generating a corona discharge.

[0030] The mounting table moving device 38 moves the mounting table 32. The approaching / separating device 40 moves the pair of probe groups 34, 36 closer to or farther apart (referred to as approaching / separating) the pair of probe groups 34, 36 as a whole, and moves the mover group 48 as a whole to move the pair of probe groups 34, 36 closer to or farther apart.

[0031] 7, an air cylinder 72 is a drive source for the mounting table moving device 38, and a piston rod 72p of the air cylinder 72 is connected to the mounting portion holder 43. An electromagnetic valve device 80 is provided between the two air chambers 72a, 72b of the air cylinder 72, the air source 78, the air passage 70, and the atmosphere (silencer). The movement of the mounting portion holder 43 (mounting table 32) and the like are controlled by controlling the electromagnetic valve device 80.

[0032] The air cylinder 74 is a drive source for the approaching / separating device 40, and the mover group holder 62 is connected to a piston rod 74p. An air source 78, an air passage 70, and the atmosphere (silencer) are connected to air chambers 74a and 74b of the air cylinder 74 via an electromagnetic valve device 82. By controlling the electromagnetic valve device 82, the movement of the mover group holder 62 (mover group 36) and the like are controlled, and the approaching / separating of the pair of gauge group 34, 36 is controlled. In this sense, the approaching / separating device 40 can be called a mover group moving device 40.

[0033] The mounting table 32 and the mover group holder 62 are held by a pair of guide rods 86, 87 extending in the y direction so as to be movable relative to each other, and the mover group holder 62 is held by a pair of guide rods 88, 89 (see FIG. 1 ) extending in the y direction so as to be movable relative to the main body 30. As a result, the mounting table 32 and the mover group holder 62 are held by a pair of guide rods 88, 89 (see FIG. 1 ) extending in the y direction so as to be movable relative to each other in the y direction.

[0034] 3, a stopper 92 is provided on the stator group side of the mover group holder 62, and a stopper 90 is provided on the member on the stator group side. The stopper 92 sets the approach limit between the mover group holder 62 and the mounting table 32 (mounting section holder 43), and the stopper 90 sets the approach limit between the stator group 34 (main body 30) and the mounting table 32.

[0035] The mounting table 32 is moved by a mounting table moving device 38 between a position where it abuts against a stopper 90 and a position where it abuts against a stopper 92. When the mounting table 32 is at the position where it abuts against the stopper 92, the mounting table 32 is not between the pair of gauge head groups 34, 36, but is spaced a set distance or more from at least one of the pair of gauge head groups 34, 36 (the movable element group 36).

[0036] The placement machine includes a control device 200. As shown in Fig. 8, the control device 200 includes a controller 202, which is mainly a computer, and a plurality of drive circuits 204. The controller 202 includes an execution unit, a memory unit, an input / output unit, etc. The circuit board transport and holding device 4, the component supply device 6, the head moving device 8, and the work head 16 are each connected to the input / output unit via the drive circuits 204, as well as the mounting table moving device 38 and the solenoid valve devices 80, 82 of the approach / separation device 40. Also connected to the input / output unit are an LCR acquisition unit 56, a conduction state acquisition unit 58, a display 216, a mover group position sensor, a mounting table position sensor, a nozzle height sensor, etc. (not shown).

[0037] The electrical characteristics of the component s are measured by gripping the component s between the first opposing surfaces 46f, 48f of the pair of first probes 46, 48. However, when the component s is small, or when the value of the electrical characteristics of the component s is 0, it may be difficult to determine whether the component s is actually being gripped by the pair of first opposing surfaces 46f, 48f.

[0038] Furthermore, for example, when the electrical characteristics of the component s are measured, the working head 16 can be moved above the pair of first opposing surfaces 46f, 48f, and it can be determined whether the component s is being held by the pair of opposing surfaces 46f, 48f using a camera or the like of the working head 16. However, in this case, the working head 16 cannot perform another task while the electrical characteristics of the component s are being measured, which poses another problem of reduced work efficiency.

[0039] Therefore, in this embodiment, it is possible to easily determine whether or not a component s is gripped between the pair of first opposing surfaces 46f, 48f based on the electrical continuity between the pair of second probes 50, 52.

[0040] The electrical characteristics of the component s as the measurement object are measured by executing the electrical characteristics measurement program shown in the flowchart of Fig. 9. In this embodiment, when a changeover is performed, a command to measure the electrical characteristics of the component s as the measurement object is issued at the start of the mounting machine, etc. The component s is supplied by the component supply device 6 and is an unmounted component that has not been mounted on the board P.

[0041] In step 1 (hereinafter abbreviated as S1, the same applies to the other steps), it is determined whether a command to measure the electrical characteristics of component s as the measurement target has been issued. If the determination is YES, in S2, the work head 16 picks up the component s supplied by the component supply device 6, moves above the component placement section 42, and releases the component s. This places the component s in the V-groove 42c. In S3, the electromagnetic valve device 82 controls the moving element group 36 to move forward, causing the first opposing surfaces 46f, 48f of the pair of first probes 46, 48 to approach each other, thereby gripping the component s placed in the V-groove 42c. In S4, the electromagnetic valve device 80 controls the placement table 32 to move backward until it abuts against the stopper 92. The placement table 32 is separated from the component s and the moving element group 36 by at least a set distance.

[0042] In S5, the continuity state acquisition unit 58 determines whether or not there is continuity between the pair of second probes 50, 52. If the determination in S5 is NO, it is acquired that the component s is being held by the pair of first probes 46, 48, and the electrical characteristics of the component s are measured in S6 and subsequent steps.

[0043] In S6, the component s is released by the suction nozzle 18 and placed in the V-groove 42c, and a set discharge time is awaited. The discharge time is the time required for the static electricity stored on the component s to be removed. If the determination in S6 is YES, the electrical characteristics of the component s are acquired by the LCR acquisition unit 56 in S7. The acquired results are then displayed on the display 216.

[0044] Thereafter, in S8, the mover group 36 is retracted, and in S9, the mounting table 32 is retracted. The component s held between the first probes 46, 48 is released, and the space between the mover group 36 and the stator group 34 is connected to the disposal path 28. As the mover group 36 retracts, air is supplied from the opening to the first opposing surface 48f of the mover-side first probe 48 from diagonally above. This allows the component s to fall smoothly, even if it is attached to the first opposing surface 48f. The cover 41 also prevents the component s from scattering. Thereafter, in S10, the mounting table 32 is advanced, and the area above the mounting table 32 is opened.

[0045] On the other hand, if the determination in S5 is YES, it is determined that the component s is not being gripped by the pair of first opposing surfaces 46f, 48f. In this embodiment, this fact is notified by displaying it on the display 216. Then, S8 to S10 are executed.

[0046] In this manner, in this embodiment, the pair of first probes 46, 48 and the pair of second probes 50, 52 are integrally provided so as to be able to approach and separate from each other, and the distance between the pair of first opposing surfaces 46f, 48f and the distance between the pair of second opposing surfaces 50f, 52f are always the same. Therefore, the state of gripping of the part s by the pair of first opposing surfaces 46f, 48f can be accurately obtained based on the state of conduction between the pair of second opposing surfaces 50f, 52f.

[0047] In addition, it is possible to prevent the value of the electrical characteristics acquired when the component s is not being held by the pair of first probes 46, 48 from being taken as the electrical characteristic value of the component s, thereby improving the measurement accuracy of the electrical characteristics of the component s.

[0048] Furthermore, since the state of gripping of the component s by the pair of probes 46, 48 is not acquired by the working head 16, the working head 16 can be made to perform another task while the electrical characteristics of the component s are being measured, thereby improving the work efficiency of the placement machine.

[0049] Furthermore, while the measuring device described in Patent Document 1 measures the electrical characteristics of components mounted on a circuit board, the measuring device according to this embodiment measures the electrical characteristics of an unmounted component that is not mounted on a circuit board. As a result, if component s is defective, the measuring device described in Patent Document 1 discards the circuit board, whereas the measuring device according to this embodiment simply discards component s, thereby improving yield.

[0050] Furthermore, in the measuring device described in Patent Document 1, the electrical characteristics of a component mounted on a circuit board are acquired, making it difficult to grasp the end faces of the electrodes located on both sides of the component with a pair of first probes. In contrast, the measuring device according to the present embodiment acquires the electrical characteristics of an unmounted component s that is not mounted on a circuit board. Therefore, the end faces of the electrodes located on both sides of the component s can be properly grasped with a pair of first probes 46, 48. Therefore, while the measuring device described in Patent Document 1 includes a single probe as the first probe, the measuring device according to the present embodiment includes a pair of first probes, and the measuring device described in Patent Document 1 and the measuring device according to the present embodiment are structurally different.

[0051] Furthermore, the measuring device according to this embodiment can simplify the structure around the pair of second probes 50, 52 compared to the measuring device described in Patent Document 1. This can reduce costs.

[0052] Furthermore, in the measuring device described in Patent Document 1, the pair of second probes is provided inside the measuring device main body. In contrast, in the measuring device according to this embodiment, the pair of probe groups 34, 36 is not provided inside the main body 30. Therefore, in the measuring device according to this embodiment, maintenance of the pair of second probes 50, 52 can be performed more easily than in the measuring device described in Patent Document 1.

[0053] In addition, the present disclosure can be implemented in various forms with various modifications and improvements based on the knowledge of those skilled in the art.

[0054] 6: Component supply device 16: Work head 22: Measuring device 34: Stator group 36: Movable group 40: Approaching / separating device 46, 48: Pair of first measuring probes 46f, 48f: Pair of first opposing surfaces 50, 52: Pair of second measuring probes 50f, 52f: Pair of second opposing surfaces 53, 54: Insulating portion 56: LCR acquisition portion 58: Continuity state acquisition portion 200: Control device Claimable circumstances

[0055] The following paragraphs describe aspects that can be claimed.

[0056] (1) A measuring device for measuring electrical characteristics of a measurement object, comprising: a pair of first opposing surfaces that are a pair of opposing surfaces that can approach and move away from each other; an electrical characteristic acquisition unit that acquires the electrical characteristics of the measurement object when the measurement object is gripped by the pair of first opposing surfaces; a pair of second opposing surfaces that are a pair of opposing surfaces that are arranged side by side in a direction intersecting the direction of approach and movement of the pair of first opposing surfaces; and a gripping state acquisition unit that acquires a current conduction state between the pair of second opposing surfaces when the electrical characteristics of the measurement object are acquired, and acquires a gripping state of the measurement object by the pair of first opposing surfaces.

[0057] The case where the electrical characteristics of the object to be measured are acquired may be a case where the electrical characteristics are actually acquired, or a case where a pair of first opposing surfaces come close to each other in order to acquire the electrical characteristics of the object to be measured.

[0058] The conduction state of current between the pair of second opposing surfaces includes a state in which current flows and a state in which current does not flow. The gripping state of the measurement object by the pair of first opposing surfaces includes a state in which the measurement object is gripped and a state in which the measurement object is not gripped.

[0059] (2) A measuring device according to (1), in which the pair of first opposing surfaces and the pair of second opposing surfaces are arranged side by side in a direction perpendicular to the direction of approach and separation.

[0060] (3) The measuring device according to (1) or (2), wherein the distance between the pair of first opposing surfaces and the distance between the pair of second opposing surfaces are always the same.

[0061] The distance between a pair of first opposing surfaces and the distance between a pair of second opposing surfaces are always the same means that the distance between them is the same whether the pair of first opposing surfaces is approaching or moving away and the pair of second opposing surfaces is approaching or moving away, or whether the pair of first opposing surfaces and the pair of second opposing surfaces are stationary.

[0062] Each of the pair of first opposing surfaces and each of the pair of second opposing surfaces may or may not be located on the same plane.

[0063] (4) A measuring device according to any one of (1) to (3), in which a first measuring element including the pair of first opposing surfaces and a second measuring element including the pair of second opposing surfaces are integrally provided so as to be movable toward and away from each other.

[0064] (5) A measuring device according to any one of (1) to (4), in which an insulator portion is provided between each of the first measuring probes including the pair of first opposing surfaces and each of the second measuring probes including the pair of second opposing surfaces.

[0065] (6) A measuring device described in any one of (1) to (5), in which the gripping state acquisition unit acquires that the object to be measured is not gripped by the pair of first opposing surfaces when the electrical characteristics of the object to be measured are acquired and a current is flowing between the pair of second opposing surfaces.

[0066] (7) A measuring device described in any one of (1) to (6), in which the gripping state acquisition unit acquires that the object to be measured is gripped by the pair of first opposing surfaces when the electrical characteristics of the object to be measured are acquired and no current is flowing between the pair of second opposing surfaces.

[0067] (8) A measuring device described in any one of items (1) to (7), wherein the measuring device includes an alarm unit that notifies the gripping state of the object to be measured by the pair of first opposing surfaces acquired by the gripping state acquisition unit.

[0068] (9) A measuring device for measuring electrical characteristics of a measurement object, comprising: first opposing surfaces that are a pair of opposing surfaces; an electrical characteristic acquisition unit that acquires the electrical characteristics of the measurement object while the measurement object is held by the pair of first opposing surfaces; second opposing surfaces that are a pair of opposing surfaces arranged in parallel with the pair of first opposing surfaces; and a gripping state acquisition unit that acquires a current conduction state between the pair of second opposing surfaces when the electrical characteristics of the measurement object are acquired, and acquires a gripping state of the measurement object by the pair of first opposing surfaces.

[0069] The measuring device described in Patent Document 1 does not have a pair of first opposing surfaces, but the measuring device described in this section does have a pair of first opposing surfaces. Furthermore, in the measuring device described in Patent Document 1, a probe as a single first measuring element and a pair of second measuring elements are arranged in series, whereas in the measuring device described in this section, a pair of first measuring elements and a pair of second measuring elements are arranged in parallel. The measuring device described in this section can employ any of the technical features described in paragraphs (1) to (8).

[0070] (10) A placement machine that places electronic components supplied by a component supply device onto a circuit board, the placement machine including a measuring device that measures electrical characteristics of electronic components that are supplied by the component supply device but are not mounted on the circuit board, the measuring device including: first opposing surfaces that are a pair of opposing surfaces; an electrical characteristic acquisition unit that acquires the electrical characteristics of the electronic component in a state where the electronic component is gripped by the pair of first opposing surfaces; second opposing surfaces that are a pair of opposing surfaces arranged in parallel with the pair of first opposing surfaces; and a gripping state acquisition unit that acquires a current conduction state between the pair of second opposing surfaces and acquires a gripping state of the electronic component by the pair of first opposing surfaces when the electrical characteristics of the electronic component are acquired.

[0071] The placement machine described in this section can employ any of the technical features described in sections (1) to (9).

Claims

1. A measuring device comprising: a pair of first opposing surfaces which are a pair of opposing surfaces that can approach and separate from each other; an electrical characteristic acquisition unit that acquires electrical characteristics of the object to be measured when the object to be measured is held by the pair of first opposing surfaces; a pair of second opposing surfaces that are a pair of opposing surfaces arranged side by side with the pair of first opposing surfaces in a direction intersecting the direction of approaching and separating the first opposing surfaces; and a gripping state acquisition unit that acquires a state of current conduction between the pair of second opposing surfaces and acquires a gripping state of the object to be measured by the pair of first opposing surfaces when the electrical characteristics of the object to be measured are acquired.

2. The measuring device according to claim 1, wherein the distance between said pair of first opposing surfaces and the distance between said pair of second opposing surfaces are always the same.

3. A measuring device according to claim 1 or 2, wherein a first probe including the pair of first opposing surfaces and a second probe including the pair of second opposing surfaces are integrally provided so as to be movable toward and away from each other.

4. A measuring device as described in claim 1 or 2, wherein an insulating portion is provided between each of the first measuring probes including the pair of first opposing surfaces and each of the second measuring probes including the pair of second opposing surfaces.

5. A measuring device as described in claim 1 or 2, wherein the gripping state acquisition unit acquires that the object to be measured is not gripped by the pair of first opposing surfaces when the electrical characteristics of the object to be measured are acquired and a current is flowing between the pair of second opposing surfaces.

6. A measuring device as described in claim 1 or 2, wherein the gripping state acquisition unit acquires that the object to be measured is in a state where it is gripped by the pair of first opposing surfaces when the electrical characteristics of the object to be measured are acquired and no current is flowing between the pair of second opposing surfaces.

7. A mounting machine which mounts electronic components supplied by a component supplying device onto a circuit board, comprising a measuring device which measures electrical characteristics of electronic components supplied by the component supplying device and not mounted on the circuit board, the measuring device including: a first opposing surface which is a pair of opposing surfaces; an electrical characteristic acquisition unit which acquires the electrical characteristics of the electronic component in a state in which the electronic component is gripped by the pair of first opposing surfaces; a second opposing surface which is a pair of opposing surfaces arranged in parallel with the pair of first opposing surfaces; and a gripping state acquisition unit which acquires the current conduction state between the pair of second opposing surfaces and acquires the gripping state of the electronic component by the pair of first opposing surfaces when the electrical characteristics of the electronic component are acquired.

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