Substrate cleaning apparatus and substrate cleaning method using same

Abstract

One embodiment of the present invention provides a substrate cleaning apparatus and a substrate cleaning method using same, the substrate cleaning apparatus comprising: a substrate rotation module which supports and fixes a substrate to be cleaned and rotates the substrate with respect to a virtual central axis line; a chemical liquid supply module having an upper chemical liquid supply unit for supplying a chemical liquid to the upper surface of the substrate and a lower chemical liquid supply unit for supplying a chemical liquid to the lower surface of the substrate; and a bowl module disposed outside the substrate rotation module and discharging the chemical liquid scattered from the substrate due to rotation, wherein a chemical liquid filling space is formed between the upper surface of a spin chuck provided in the substrate rotation module and the lower surface of the substrate fixed to the substrate rotation module, and a cleaning operation of the substrate is performed in a state in which the lower surface of the substrate is immersed in the chemical liquid filled in the chemical liquid filling space.

Description

Substrate cleaning device and substrate cleaning method using the same

[0001] The present invention relates to a substrate cleaning device and a substrate cleaning method using the same, and more particularly, to a substrate cleaning device that performs a uniform cleaning process on the upper and lower surfaces of a substrate, and a substrate cleaning method using the same.

[0002] Typically, during the substrate manufacturing process, a cleaning process is essential to increase substrate yield. This process removes foreign substances from the substrate surface. Specifically, after processes such as the deposition of insulating films and metal materials, etching, and the application of photoresists, various impurities may remain on the substrate surface. These impurities are a critical factor influencing substrate performance and yield, making the substrate cleaning process crucial.

[0003] This type of substrate cleaning process involves spraying a chemical solution from the top and bottom of the substrate while the substrate is rotating, thus cleaning the substrate. In other words, the chemical solution sprayed onto the substrate moves from the center to the edge of the substrate due to the centrifugal force of the rotating substrate, and the upper and lower surfaces of the substrate are completely cleaned.

[0004] However, since the lower liquid supply unit that sprays the chemical solution onto the underside of the substrate usually sprays the chemical solution toward the center of the substrate in a fixed state, there are cases where the underside of the substrate is not properly cleaned depending on the rotation speed of the substrate or the flow rate of the chemical solution. In other words, if the chemical solution sprayed toward the center of the substrate is not continuously supplied to the edge of the substrate but falls in the middle, the substrate is not properly cleaned. Due to this problem, the substrate cleaning work is sometimes performed while it is turned over.

[0005] In addition, substrate cleaning devices often maintain the temperature of the substrate at a predetermined temperature using infrared lamps to effectively clean the substrate with a high-temperature chemical solution, for example, above 120°C. However, conventional substrate cleaning devices have problems in that the infrared lamps are installed on the upper side of the substrate, which can cause obstructions when the upper chemical solution supply unit moves, and the overall device structure also becomes complex.

[0006] Accordingly, various research and developments are being conducted on substrate cleaning devices that perform uniform cleaning on the upper and lower surfaces of the substrate.

[0007] The technical task of the present invention to solve the above problems is to provide a substrate cleaning device that performs uniform cleaning on the upper and lower surfaces of a substrate and a substrate cleaning method using the same.

[0008] In order to achieve the above technical problem, one embodiment of the present invention provides a substrate cleaning device including a substrate rotation module that supports and fixes a substrate for cleaning and rotates the substrate around an imaginary central axis; a chemical supply module having an upper chemical supply unit that supplies a chemical to an upper surface of the substrate and a lower chemical supply unit that supplies a chemical to a lower surface of the substrate; and a bowl module that is disposed outside the substrate rotation module and discharges the chemical that is scattered from the substrate by rotation, wherein a chemical filling space is formed between an upper surface of a spin chuck provided on the substrate rotation module and a lower surface of the substrate fixed to the substrate rotation module, and a cleaning operation of the substrate is performed while the lower surface of the substrate is immersed in the chemical filled in the chemical filling space.

[0009] In one embodiment of the present invention, the liquid discharge wing provided on the edge of the spin chuck is inserted into the wing insertion groove of the first bowl provided in the bowl module, and the upper end of the liquid receiving jaw forming the wing insertion groove in a state where the liquid discharge wing is inserted into the wing insertion groove may be positioned higher than the lower surface of the substrate and lower than the upper surface of the substrate.

[0010] In one embodiment of the present invention, the wing insertion groove forms a second separation space with the liquid discharge wing, and the wing insertion groove may be formed to be inclined so as to become closer to the central axis as it goes from the top to the bottom.

[0011] In one embodiment of the present invention, a plurality of lamps are provided on the lower surface of the spin chuck at predetermined intervals in an outward direction based on a central axis, and thermal energy generated from the lamps is transmitted to the substrate through the chemical solution contained in the chemical solution filling space, so that the substrate is maintained at a predetermined temperature, and the plurality of lamps can be individually controlled.

[0012] In one embodiment of the present invention, the substrate rotation module may include: a spin chuck; a plurality of substrate fixing members that form a predetermined interval along the outer circumference of the spin chuck and support and fix the edge of the substrate while spacing the upper surface of the spin chuck and the substrate apart from each other by a predetermined interval; a rotation power member that rotates the spin chuck; a power support member that supports the rotation power member and has a hollow formed into which the rotation power member is inserted and fixed; and a bellows that has one end coupled to the power support member and the other end coupled to a mounting surface formed on the bellow module.

[0013] In one embodiment of the present invention, the substrate fixing part may include a chuck pin that supports an upper edge of the substrate; a chuck pin pressurizing part that is inserted into a chuck fixing groove formed in the spin chuck and supports a lower edge of the substrate together with the chuck pin; a chuck pin shaft that penetrates the chuck pin pressurizing part and has an upper end coupled to the chuck pin; a spring that has one end supported by the chuck pin support part in which the chuck fixing groove is formed and the other end supported by a pressurizing support surface provided at a lower end of the chuck pin shaft; and a height adjusting ring that presses the pressurizing support surface and guides an up and down movement of the chuck pin shaft.

[0014] In one embodiment of the present invention, the extension guide coupled to the chuck pin support member may be arranged on the outside of the bellows, and the lower end of the extension guide may be arranged lower than the upper end of the bellows.

[0015] In one embodiment of the present invention, the lower liquid supply unit may include a lower liquid nozzle that sprays the liquid onto the lower surface of the substrate; and a central drain port that discharges the liquid introduced into the first separation space between the lower liquid nozzle and the spin chuck to the outside.

[0016] In one embodiment of the present invention, the bail module may include a first bail; a second bail spaced apart from the upper portion of the first bail and forming a first discharge space together with the first bail; a third bail spaced apart from the upper portion of the second bail and forming a second discharge space together with the second bail; and a bail casing spaced apart from the upper portion of the third bail and forming a third discharge space together with the third bail, and protecting the first to third bails.

[0017] In one embodiment of the present invention, the first bowl is formed with a mounting surface to which a lower portion of a bellows provided in the substrate rotation module is coupled, and the mounting surface is provided with a bottom drain port for discharging the drug introduced through a second space between a drug discharge wing provided on the edge of the spin chuck and a wing insertion groove, and the drug discharged through the first discharge space can be discharged through a side drain port penetrating the first bowl.

[0018] An embodiment of the present invention provides a substrate cleaning method, comprising: (a) loading a substrate into a substrate rotation module on top of an outermost bowl; (b) positioning the substrate rotation module between a first bowl and a second bowl; (c) spraying a chemical solution through an upper chemical solution supply unit and a lower chemical solution supply unit toward the upper and lower surfaces of the substrate positioned between the first bowl and the second bowl; (d) performing a rinsing and drying process on the substrate in the outermost bowl by the substrate rotation module; (e) stopping the rotation of the substrate by the substrate rotation module, the substrate rotation module being positioned above the outermost bowl; and (f) unloading the substrate by a robot; wherein, in the step (b), the substrate cleaning is performed while the lower surface of the substrate is immersed in a chemical solution contained in a chemical solution filling space.

[0019] In one embodiment of the present invention, in the step (c), a plurality of lamps are provided on the lower surface of the spin chuck provided in the substrate rotation module at predetermined intervals in the outward direction based on the central axis, and the lamps can transmit thermal energy to the substrate through the chemical solution contained in the chemical solution filling space, thereby maintaining the substrate at a predetermined temperature.

[0020] In one embodiment of the present invention, the upper liquid supply unit is configured to be swingable and move from the center of the substrate to the edge to spray the liquid, and the rotation speed of the substrate at the second position between the second and third bowls can be configured to be faster than the rotation speed of the substrate at the lowest position.

[0021] In one embodiment of the present invention, in step (a), the substrate can be loaded onto the substrate rotation module with a distance between the lower surface of the substrate and the upper surface of the spin chuck provided in the substrate rotation module of 0.5 to 20 mm.

[0022] The effects of the substrate cleaning device according to the present invention described above and the substrate cleaning method using the same are as follows.

[0023] According to the present invention, the substrate's lower surface is immersed in a chemical solution filled in a chemical solution-filled space, thereby performing substrate cleaning. This prevents the conventional problem of improper substrate cleaning. Consequently, the substrate cleaning process can be effectively performed.

[0024] According to the present invention, a plurality of lamps provided at the lower portion of the spin chuck transfer heat energy generated from the lamps to the substrate through the chemical solution contained in the chemical solution filling space, thereby enabling linear heat transfer to the substrate. In addition, since the plurality of lamps at predetermined intervals can be individually controlled, the heat generation amount of the lamps can be selectively adjusted depending on the position of the lamps on the substrate. Accordingly, the substrate can maintain a uniform temperature throughout any portion. In addition, since the lamps are provided at the lower portion of the spin chuck, they do not interfere with the upper chemical solution supply section, which is configured to swing, thereby simplifying the structure of the substrate cleaning device.

[0025] The effects of the present invention are not limited to the effects described above, and should be understood to include all effects that can be inferred from the detailed description of the present invention or the composition of the invention described in the claims.

[0026] Figure 1 is a configuration diagram of a substrate cleaning device according to one embodiment of the present invention.

[0027] FIG. 2 is a perspective view of a substrate cleaning device according to an embodiment of the present invention viewed from above.

[0028] FIG. 3 is a perspective view of a substrate cleaning device according to an embodiment of the present invention viewed from below.

[0029] Figure 4 is a cross-sectional view taken along line AA' of Figure 2.

[0030] Figure 5 is a cross-sectional view of a main part of a substrate rotation module according to one embodiment of the present invention.

[0031] Figure 6 is an exemplary diagram showing a state in which a liquid discharge wing according to one embodiment of the present invention is inserted into a wing insertion groove.

[0032] Figure 7 is a flow chart showing a substrate cleaning method according to one embodiment of the present invention.

[0033] FIG. 8 is an exemplary diagram schematically showing a state in which a substrate rotation module or a bowl module is moved during a substrate cleaning process according to one embodiment of the present invention.

[0034] Hereinafter, the present invention will be described with reference to the attached drawings. However, the present invention can be implemented in various different forms and is therefore not limited to the embodiments described herein. In the drawings, irrelevant parts have been omitted for clarity of description, and similar parts have been designated with similar reference numerals throughout the specification.

[0035] Throughout the specification, when a part is said to be "connected" to another part, this includes not only "directly connected" but also "indirectly connected" with other elements intervening. Furthermore, when a part is said to "include" a component, this does not exclude other components, but rather implies that the other components may be included, unless otherwise specifically stated.

[0036] In the present invention, upper and lower parts mean being located above or below the target member, but do not necessarily mean being located above or below with respect to the direction of gravity.

[0037] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings.

[0038] FIG. 1 is a configuration diagram of a substrate cleaning device according to an embodiment of the present invention, FIG. 2 is a perspective view of the substrate cleaning device according to an embodiment of the present invention as viewed from above, FIG. 3 is a perspective view of the substrate cleaning device according to an embodiment of the present invention as viewed from below, FIG. 4 is a cross-sectional view taken along line AA' of FIG. 2, FIG. 5 is a cross-sectional view of a main part of a substrate rotation module according to an embodiment of the present invention, and FIG. 6 is an exemplary view showing a state in which a liquid discharge wing according to an embodiment of the present invention is inserted into a wing insertion groove.

[0039] As shown in FIGS. 1 to 6, the substrate cleaning device (1000) may include a substrate rotation module (100), a chemical solution supply module (200), and a bowl module (300).

[0040] This substrate rotation module (100) supports and fixes the loaded substrate (W), and controls the rotation of the substrate (W) and the up and down movement of the substrate (W). Here, the substrate (W) may be a silicon wafer that serves as a semiconductor substrate.

[0041] Such a substrate rotation module (100) may include a spin chuck (110), a substrate fixing member (120), a rotation power member (130), a power support member (140), and a bellows (150).

[0042] Here, the spin chuck (110) is coupled to a rotation power unit (130). This spin chuck (110) receives rotational force provided from the rotation power unit (130) and rotates the substrate (W).

[0043] And the substrate fixing part (120) is provided at the edge of the spin chuck (110), and may be provided in multiple numbers at predetermined intervals along the circumference of the spin chuck (110).

[0044] These substrate fixing parts (120) are configured to support and fix the edge of the substrate (W) being loaded. In the present invention, a form having six substrate fixing parts (120) is illustrated as an example, but the number of substrate fixing parts (120) is not necessarily limited to six, and may be configured in various numbers other than six.

[0045] This substrate fixing member (120) is configured to support and fix a substrate (W) loaded into the substrate rotation module (100) while being spaced apart from the upper surface of the spin chuck (110) by a predetermined distance.

[0046] Such a substrate fixing member (120) may include a chuck pin (121), a chuck pin pressurizing member (122), a chuck pin shaft (123), a spring (124), and a height adjustment ring (125).

[0047] Here, the chuck pin (121) is configured to support the upper edge of the substrate (W). This chuck pin (121) can be moved in the up and down directions through the operation of the height adjustment ring (125).

[0048] And the chuck pin pressurizing part (122) is configured to support the lower edge of the substrate (W) loaded together with the chuck pin (121). This chuck pin pressurizing part (122) is inserted and fixed into the chuck fixing groove (113) formed in the chuck pin support part (112).

[0049] And the chuck pin shaft (123) is inserted through the shaft through hole (126) formed in the chuck pin pressurizing portion (122). The upper end of the chuck pin shaft (123) is coupled to the chuck pin (121), and the chuck pin shaft (123) and the chuck pin (121) form an integral body.

[0050] And the spring (124) is inserted through the chuck pin shaft (123), and one end is supported by the chuck pin support member (112), and the other end is supported by the pressure support surface (127). Here, the pressure support surface (127) is coupled to the lower end of the chuck pin shaft (123) and is configured to support the spring (124).

[0051] And the height adjustment ring (125) presses the pressure support surface (127) and guides the up and down movement of the chuck pin shaft (123). The height adjustment ring (125) is coupled with an up and down movement control unit (not shown) that controls the up and down movement of the height adjustment ring (125), so that the height adjustment ring (125) can move up and down to a required height.

[0052] A schematic view of the process of loading a substrate (W) onto the substrate rotation module (100) will first show that the height adjustment ring (125) moves upward. During this process, the spring (124) is compressed, and the chuck pin shaft (123) moves upward. In addition, the chuck pin (121) coupled with the chuck pin shaft (123) also moves upward together with the chuck pin shaft (123).

[0053] In this way, as the chuck pin (121) moves upward relative to the chuck pin pressurizing portion (122), a substrate insertion space is provided between the chuck pin (121) and the chuck pin pressurizing portion (122), and the robot transfers the substrate (W) to the substrate insertion space.

[0054] Next, the height adjustment ring (125) moves downward. In this process, the chuck pin (121) moves downward and supports the upper edge of the substrate (W), and the chuck pin pressurizing portion (122) supports the lower edge of the substrate (W). At this time, the chuck pin (121) stably supports and fixes the substrate (W) by the restoring force of the spring (124).

[0055] Here, the substrate (W) supported and fixed to the substrate fixing member (120) is fixed in a state where a predetermined gap is formed between the upper surface of the spin chuck (110). At this time, the distance between the lower surface of the substrate (W) and the upper surface of the spin chuck (110) may be 0.5 to 20 mm. Here, if the distance between the lower surface of the substrate (W) and the upper surface of the spin chuck (110) is less than 0.5 mm, the substrate (W) may be damaged during the loading process of the substrate (W). In addition, if the distance between the lower surface of the substrate (W) and the upper surface of the spin chuck (110) exceeds 20 mm, the chemical cleaning operation of the lower surface of the substrate (W) may not be performed effectively. Therefore, it is preferable that the distance between the lower surface of the substrate (W) and the upper surface of the spin chuck (110) be 0.5 to 20 mm. More preferably, the distance between the lower surface of the substrate (W) and the upper surface of the spin chuck (110) is preferably 1 to 3 mm.

[0056] In this way, when the substrate (W) is loaded onto the substrate rotation module (100), the substrate rotation module (100) moves downward. Here, the substrate rotation module (100) is provided with a movement control unit (170) that moves the substrate rotation module (100) up and down, so that the substrate rotation module (100) can move up and down to a required position.

[0057] In this way, the substrate (W) moved downward through the movement control unit (170) is cleaned while its lower surface is immersed in the chemical solution filled in the chemical solution filling space (101). Here, a chemical solution receiving step (311) is formed in the first bowl (310), so that the chemical solution can be filled in the chemical solution filling space (101). Accordingly, the lower surface of the substrate (W) moved to the first position (P1) for the initial cleaning operation can be immersed in the chemical solution contained in the chemical solution filling space (101). The first chemical solution supplied from the lower chemical solution supply unit (220) can be filled in this chemical solution filling space (101).

[0058] Specifically, when the liquid discharge wing (111) provided on the edge of the spin chuck (110) is inserted into the wing insertion groove (312) of the first bowl (310), the liquid receiving jaw (311) provides a receiving space in which the first liquid can be received together with the upper surface of the spin chuck (110). That is, the upper surface of the spin chuck (110) forms the bottom surface of the liquid filling space (101), and the liquid receiving jaw (311) forms the side surface of the liquid filling space (101), so that the first liquid can be filled in the liquid filling space (101). Accordingly, the lower surface of the substrate (W) can be immersed in the first liquid contained in the liquid filling space (101).

[0059] In this way, when the liquid discharge wing (111) is inserted into the wing insertion groove (312), the upper end of the liquid receiving jaw (311) is positioned higher than the lower surface of the substrate (W) and lower than the upper surface of the substrate (W). Accordingly, the lower surface of the substrate (W) can be immersed in the first liquid received in the liquid filling space (101). Furthermore, not only the lower surface of the substrate (W) but also a portion of the side surface of the substrate (W) can be immersed in the first liquid.

[0060] Here, in the process of the lower liquid nozzle (221) provided in the lower liquid supply unit (220) spraying the first liquid onto the lower surface of the substrate (W), a portion of the first liquid contained in the liquid filling space (101) is discharged. For example, the upper end of the lower liquid nozzle (221) is inserted through the center of the spin chuck (110). Here, since the lower liquid nozzle (221) has a fixed configuration and the spin chuck (110) has a rotating configuration, a fine first separation space (G1) is formed between the lower liquid nozzle (221) and the spin chuck (110), and the first liquid introduced into the first separation space (G1) can be discharged through the central drain port (222). In addition, the first liquid introduced into the second separation space (G2) between the liquid discharge wing (111) and the wing insertion groove (312) can be discharged through the bottom drain port (341).

[0061] Meanwhile, the wing insertion groove (312) is formed in an inclined groove shape so that it gets closer to the central axis (C) from the top to the bottom. In this way, the inclined wing insertion groove (312) is formed to delay the smooth discharge of the first chemical liquid filled in the chemical liquid filling space (101) when the first chemical liquid is discharged through the second separation space (G2). Through this, the first chemical liquid can be effectively filled in the chemical liquid filling space (101).

[0062] And an extension guide (114) is coupled to a chuck pin support (112) provided on the lower outer periphery of the spin chuck (110). This extension guide (114) is configured to extend from the chuck pin support (112).

[0063] This extension guide (114) is configured to prevent the first chemical liquid that flows into the second separation space (G2) and is discharged through the bottom drain (341) from flowing into the rotation power unit (130) provided on the inside of the extension guide (114). That is, the extension guide (114) prevents the first chemical liquid that flows into the second separation space (G2) together with the bellows (150) from penetrating into various components provided on the inside of the extension guide (114), such as the rotation power unit (130), the height adjustment ring (125), and the spring (124). Therefore, various components, including the rotation power unit (130), can be prevented from corrosion due to the first chemical liquid.

[0064] This extension guide (114) is placed on the outside of the bellows (150). At this time, the lower end of the extension guide (114) is made lower than the upper end of the bellows (150), thereby preventing the first liquid from penetrating between the extension guide (114) and the bellows (150).

[0065] And, a hollow space is formed in the center of the power support member (140) into which a rotation power unit (130) is inserted and fixed, so that the rotation power unit (130) inserted into the hollow space can be supported by the power support member (140). Here, the rotation power unit (130) that rotates the spin chuck (110) can be, for example, a motor.

[0066] And one end of the bellows (150) is coupled to the power support member (140), and the other end of the bellows (150) is coupled to the mounting surface (313) formed on the first bowl (310). This bellows (150) expands and contracts in the process of the movement control member (170) moving the rotation power member (130) up and down, and prevents the liquid from penetrating into the inside of the bellows (150).

[0067] Meanwhile, the substrate rotation module (100) may further include a lamp (160).

[0068] These lamps (160) may be provided on the lower surface of the spin chuck (110). For example, a plurality of lamps (160) may be provided at predetermined intervals in the outward direction based on the central axis (C).

[0069] A lamp (160) like this transfers heat energy generated from the lamp (160) to the substrate (W) through the first chemical liquid contained in the chemical liquid filling space (101), so that the substrate (W) can maintain a required predetermined temperature. Here, a reflector (161) is provided at the bottom of the lamp (160), so that the heat energy generated from the lamp (160) can be effectively transferred to the lower surface of the substrate (W).

[0070] These plurality of lamps (160) can selectively control the heat generation amount of the lamps (160) depending on the position on the substrate (W) where the lamps (160) are placed. That is, the plurality of lamps (160) can be individually controlled. For example, the center of the substrate (W) where the first chemical liquid having a high temperature of 120°C or higher is discharged through the lower chemical liquid nozzle (221) can be close to the temperature of the first chemical liquid, but since the temperature of the substrate (W) can decrease as it goes toward the edge of the substrate (W), the lamps (160) placed on the outside of the substrate (W) can be controlled to have a higher heat generation amount than the lamps (160) placed at the center. In this way, the plurality of lamps (160) can be individually controlled depending on the position so that the substrate (W) can maintain a uniform temperature overall. Such a lamp (160) can be, for example, an infrared lamp, but any lamp other than an infrared lamp can be used as long as it can effectively increase the temperature of the substrate (W).

[0071] Meanwhile, the drug supply module (200) may include an upper drug supply unit (210) and a lower drug supply unit (220).

[0072] Here, the upper liquid nozzle (211) provided in the upper liquid supply unit (210) is configured to spray the liquid onto the upper surface of the substrate (W). Such an upper liquid nozzle (211) is configured to be swingable, so that it can move from the center of the substrate (W) to the edge and spray the liquid.

[0073] This upper liquid nozzle (211) can selectively control the speed at which it moves from the center to the edge and can spray the liquid onto the upper surface of the substrate (W). Alternatively, the upper liquid nozzle (211) can repeatedly move from the center to the edge and spray the liquid, and can stay there for a certain amount of time and spray the liquid onto a portion of the substrate that requires more cleaning. In this way, the upper liquid nozzle (211) performs the cleaning operation on the upper surface of the substrate (W) in various ways.

[0074] These upper liquid nozzles (211) may be provided in multiple numbers. For example, they may be provided as individual nozzles, such as a nozzle for spraying a first liquid, a nozzle for spraying a second liquid, a nozzle for performing a rinsing operation, and a nozzle for performing a drying operation. In the present invention, a single upper liquid nozzle (211) will be described as performing the first liquid, the second liquid, the rinsing, and the drying operations.

[0075] And the lower liquid supply unit (220) is configured to spray the liquid onto the lower surface of the substrate (W).

[0076] This lower liquid supply unit (220) may include a lower liquid nozzle (221) and a central drain port (222).

[0077] Here, the lower liquid nozzle (221) is of a fixed configuration, unlike the upper liquid nozzle (211). The lower liquid nozzle (221) is provided with a flange (223), and the flange (223) is coupled to the lower portion of the rotating power unit (130). The lower liquid nozzle (221) is configured to perform the first liquid, second liquid, rinse, and drying operations, like the upper liquid nozzle (211) described above.

[0078] And the central drain hole (222) is configured to discharge the liquid introduced into the first separation space (G1) between the spin chuck (110) and the lower liquid nozzle (221) to the outside.

[0079] Meanwhile, the ball module (300) is placed outside the substrate rotation module (100) and is configured to discharge the liquid sprayed from the substrate (W) by rotation.

[0080] These Paul modules (300) may include a first Paul (310), a second Paul (320), a third Paul (330), and a Paul casing (340).

[0081] Here, the first bowl (310) is provided with a liquid receiving jaw (311), so that the liquid can be filled into the liquid filling space (101).

[0082] And the second bowl (320) is spaced apart from the first bowl (310). This second bowl (320) forms a first discharge space (301) together with the first bowl (310). Here, the drug solution discharged through the first discharge space (301) can be discharged through a side drainage port (342) penetrating the first bowl (310).

[0083] And the third bowl (330) is spaced apart from the second bowl (320). This third bowl (330) forms a second discharge space (302) together with the second bowl (320). The drug discharged through this second discharge space (302) can be discharged through a drug drainage unit (not shown).

[0084] And the ball casing (340) is spaced apart from the upper portion of the third ball (330) and forms a third discharge space (303) together with the third ball (330). Through this third discharge space (303), the rinse liquid for rinsing the substrate (W) and the gas for drying the substrate (W) can be discharged to the external discharge port (343).

[0085] Such a ball casing (340) is configured to protect the first ball (310) to the third ball (330) from the outside. Such a ball module (300) prevents the liquid sprayed from the substrate (W) from spraying outside the ball module (300).

[0086] In one embodiment of the present invention, the pawl module (300) is described as being composed of a first pawl (310), a second pawl (320), a third pawl (330), and a pawl casing (340), but the number of pawls provided in the pawl module (300) is not necessarily limited to the first pawl (310) to the third pawl (330), and for example, a fourth pawl (not shown), a fifth pawl (not shown), etc. may be further provided. In other words, the number of pawls provided in the pawl module (300) may be various.

[0087] FIG. 7 is a flowchart illustrating a substrate cleaning method according to an embodiment of the present invention, and FIG. 8 is an exemplary diagram schematically illustrating a state in which a substrate rotation module or a bowl module is moved during a substrate cleaning process according to an embodiment of the present invention.

[0088] The substrate cleaning method according to the present invention will be described as an example in which the bauble module (300) is composed of a first bauble (310), a second bauble (320), a third bauble (330), and a bauble casing (340). Here, the third bauble (330) may be the outermost bauble among the first bauble (310) to the third bauble (330) provided in multiple numbers.

[0089] And as shown in FIG. 8, in the process of cleaning the substrate (W) loaded on the substrate rotation module (100), the relative position adjustment is made between the substrate rotation module (100) and the bowl module (300). As shown in FIG. 8 (a), the bowl module (300) may be moved up and down while the substrate rotation module (100) is fixed, and as shown in FIG. 8 (b), the bowl module (300) may be moved up and down while the substrate rotation module (100) is fixed. Here, when the bowl module (300) is moved up and down, the bowl module (300) may be moved up and down as a whole, and when the first bowl (310) to the third bowl (330) are each individually separated, the first bowl (310) to the third bowl (330) may each individually move up and down.

[0090] In explaining the substrate cleaning method according to the present invention, the bowl module (300) will be described as an example in which the substrate rotation module (100) moves up and down while being fixed.

[0091] If we look at the operating process of the substrate cleaning device (1000) schematically through Fig. 7, first, the substrate (W) is loaded into the substrate rotation module (100). In other words, the substrate (W) is loaded into the substrate rotation module (100) from the upper part of the outermost bowl, i.e., the third bowl (330). At this time, the substrate (W) transported by the robot can be supported and fixed by the substrate fixing part (120). Here, the distance between the lower surface of the substrate (W) and the upper surface of the spin chuck (110) provided in the substrate rotation module (100) is 0.5 to 20 mm, and the substrate (W) can be loaded into the substrate rotation module (100). (S100)

[0092] Next, the substrate rotation module (100) rotates the substrate (W) and moves downward. Here, the substrate rotation module (100) moves to the first position (P1) between the first bowl (310) and the second bowl (320), which are the lowest positions. At this time, the position of the substrate rotation module (100) may be a position where the lower surface of the substrate (W) can be immersed in the first chemical solution contained in the chemical solution filling space (101). (S200)

[0093] Next, the upper chemical liquid supply unit (210) sprays the first chemical liquid onto the upper surface of the substrate (W), and the lower chemical liquid supply unit (220) sprays the first chemical liquid onto the lower surface of the substrate (W). In this process, the lower surface of the substrate (W) rotates while being immersed in the first chemical liquid filled in the chemical liquid filling space (101). Here, the first chemical liquid sprayed onto the substrate (W) through the upper chemical liquid supply unit (210) and the lower chemical liquid supply unit (220) may be, for example, a phosphoric acid aqueous solution. Such a first chemical liquid is not necessarily limited to a phosphoric acid aqueous solution, and may be other chemical liquids. (S300)

[0094] In this way, the first chemical liquid sprayed from the substrate (W) rotated at the first position (P1) is discharged through the first discharge space (301) formed between the first bowl (310) and the second bowl (320). In this process, a plurality of lamps (160) coupled to the lower surface of the spin chuck (110) and spaced at a predetermined interval outward with respect to the central axis (C) can be operated to maintain the substrate (W) at a predetermined temperature. The lamps (160) are configured to transfer heat energy generated from the lamps (160) to the substrate (W) through the first chemical liquid contained in the chemical liquid filling space (101). In this way, the first chemical liquid contained in the chemical liquid filling space (101) absorbs the heat energy generated from the lamps (160) and is transferred to the substrate (W), so that linear heat transfer can be achieved to the substrate (W).

[0095] And the upper chemical liquid supply unit (210) that sprays the first chemical liquid onto the upper surface of the substrate (W) is configured to be swingable, so that, for example, it can move from the center of the substrate (W) to the edge and spray the first chemical liquid onto the upper surface of the substrate (W).

[0096] In this way, the upper chemical liquid supply unit (210) sprays the first chemical liquid onto the upper surface of the substrate (W), and the lower chemical liquid supply unit (220) simultaneously sprays the first chemical liquid onto the lower surface of the substrate (W). In the process, the first chemical liquid flying from the rotating substrate (W) is discharged into the first discharge space (301), and at the same time, a portion of the first chemical liquid filled in the chemical liquid filling space (101) is discharged into the central drain port (222) and the bottom drain port (341).

[0097] Next, the substrate rotation module (100) moves the substrate (W) to the second position (P2) between the second pole (320) and the third pole (330). In this way, in the process of moving the substrate (W) from the first position (P1) to the second position (P2), the substrate rotation module (100) further increases the rotation speed of the substrate (W).

[0098] Next, with the substrate (W) moved to the second position (P2), the upper chemical supply unit (210) sprays the second chemical onto the upper surface of the substrate (W), and the lower chemical supply unit (220) sprays the second chemical onto the lower surface of the substrate (W). Here, the second chemical sprayed onto the substrate (W) may be a chemical for cleaning the substrate (W) that is different from the first chemical.

[0099] Since the rotation speed of the substrate (W) at the second position (P2) is faster than the rotation speed of the substrate (W) at the first position (P1), the second liquid sprayed toward the substrate (W) can move from the center to the edge of the substrate (W) and then be completely discharged through the second discharge space (302) formed between the second bowl (320) and the third bowl (330).

[0100] Next, the substrate rotation module (100) moves the substrate (W) to the third position (P3), which is the uppermost position between the third bowl (330) and the bowl casing (340), and then performs a rinsing and drying operation on the substrate (W). (S400)

[0101] That is, the upper liquid supply unit (210) and the lower liquid supply unit (220) perform a rinsing and drying operation on the substrate (W) moved to the third position (P3), which is the uppermost position. Here, the rinsing liquid may be, for example, de-ionized water (DI water) in which ions are removed. In this way, the substrate (W) that has completed the rinsing operation may be rotated at a faster speed than the rotation speed of the substrate (W) at the second position (P2) so that the liquid present on the substrate (W) may be dried. Alternatively, the upper liquid supply unit (210) and the lower liquid supply unit (220) may discharge, for example, nitrogen gas toward the substrate (W) to dry the substrate (W). In this way, water or gas discharged through the third discharge space (303) during the rinsing and drying process of the substrate (W) may be discharged to the external discharge port (343).

[0102] Next, the substrate rotation module (100) moves the substrate (W) to the upper part of the third position (P3) where the substrate (W) was loaded while stopping the rotation of the substrate (W). That is, the substrate rotation module (100) positions the substrate (W) on which the cleaning process has been completed on the upper part of the third bowl (330), which is the outermost bowl. (S500)

[0103] Finally, the substrate (W) supported and fixed on the substrate rotation module (100) is released by the substrate fixing part (120), and the robot unloads the substrate (W) from the substrate rotation module (100). (S600)

[0104] However, this is only a preferred embodiment of the present invention, and the scope of the rights of the present invention is not limited by the scope of the description of this embodiment.

[0105] The foregoing description of the present invention is for illustrative purposes only, and those skilled in the art will readily appreciate that the present invention can be readily modified into other specific forms without altering the technical spirit or essential characteristics of the present invention. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. For example, each component described as a single entity may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined manner.

[0106] The scope of the present invention is indicated by the claims described below, and all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts should be interpreted as being included in the scope of the present invention.

Claims

1. A substrate rotation module that supports and fixes a substrate for cleaning and rotates the substrate based on an imaginary central axis; A chemical supply module having an upper chemical supply unit for supplying chemical to the upper surface of the substrate and a lower chemical supply unit for supplying chemical to the lower surface of the substrate; and It includes a bowl module that is placed on the outside of the substrate rotation module and discharges the liquid sprayed from the substrate by rotation, A substrate cleaning device in which a liquid filling space is formed between the upper surface of a spin chuck provided in the substrate rotation module and the lower surface of the substrate fixed to the substrate rotation module, and the cleaning operation of the substrate is performed while the lower surface of the substrate is immersed in the liquid filling space of the liquid filling.

2. In paragraph 1, The liquid discharge wing provided on the edge of the above spin chuck is inserted into the wing insertion groove of the first bowl provided in the above bowl module. A substrate cleaning device characterized in that the upper end of the liquid receiving jaw forming the wing insertion groove is positioned higher than the lower surface of the substrate and lower than the upper surface of the substrate while the liquid discharge wing is inserted into the wing insertion groove.

3. In paragraph 2, The above wing insertion groove forms a second separation space with the liquid discharge wing, A substrate cleaning device characterized in that the above wing insertion groove is formed to be inclined so as to get closer to the central axis line from the top to the bottom.

4. In paragraph 1, On the lower surface of the above spin chuck, a plurality of lamps are provided at predetermined intervals in the outward direction based on the central axis. A substrate cleaning device characterized in that the thermal energy generated from the lamp is transferred to the substrate through the chemical solution contained in the chemical solution filling space so that the substrate is maintained at a predetermined temperature, and a plurality of the lamps are individually controllable.

5. In paragraph 1, The above substrate rotation module, Spin chuck; A plurality of substrate fixing members that support and fix the edge of the substrate while forming a predetermined interval along the outer circumference of the spin chuck and spacing the upper surface of the spin chuck and the substrate apart from each other by a predetermined interval; A rotating power unit that rotates the above spin chuck; A hollow space is formed in which the above-mentioned rotating power unit is inserted and fixed, and a power support unit that supports the above-mentioned rotating power unit; and A substrate cleaning device characterized by including a bellows, one end of which is coupled to the power support member and the other end of which is coupled to a mounting surface formed on the ball module.

6. In paragraph 5, The above substrate fixing part, A chuck pin supporting the upper edge of the above substrate; A chuck pin pressurizing portion inserted into a chuck fixing groove formed in the above spin chuck and supporting the lower edge of the substrate together with the chuck pin; A chuck pin pressurized portion is inserted through the chuck pin, and the upper end is a chuck pin shaft connected to the chuck pin; A spring whose first end is supported by a chuck pin support formed with the chuck fixing groove, and whose other end is supported by a pressure support surface provided at the lower end of the chuck pin shaft; and A substrate cleaning device characterized by including a height adjustment ring that pressurizes the above-mentioned pressurized support surface and guides the up and down movement of the chuck pin shaft.

7. In paragraph 6, A substrate cleaning device characterized in that the extension guide coupled to the chuck pin support is arranged on the outside of the bellows, and the lower end of the extension guide is arranged lower than the upper end of the bellows.

8. In paragraph 1, The above lower liquid supply unit, A lower liquid nozzle for spraying liquid onto the lower surface of the substrate; and A substrate cleaning device characterized by including a central drain port for discharging the liquid introduced into the first separation space between the lower liquid nozzle and the spin chuck to the outside.

9. In paragraph 1, The above Paul module, 1st Paul; A second pole spaced apart from the first pole and forming a first discharge space together with the first pole; A third pole is spaced apart from the upper portion of the second pole and forms a second discharge space together with the second pole; and A substrate cleaning device characterized by including a bowl casing that is spaced apart from the upper portion of the third bowl and forms a third discharge space together with the third bowl, and protects the first to third bowls.

10. In paragraph 9, The first bowl is provided with a mounting surface to which the lower portion of the bellows provided in the substrate rotation module is coupled, and the mounting surface is provided with a bottom drain port for discharging the introduced liquid through a second separation space between the liquid discharge wing provided on the rim of the spin chuck and the wing insertion groove. A substrate cleaning device characterized in that the liquid discharged through the first discharge space is discharged through a side drain port penetrating the first bowl. 11.(a) A step of loading the substrate into the substrate rotation module from the upper part of the outermost bowl; (b) the substrate rotation module is positioned between the first and second poles; (c) a step of spraying the chemical liquid by the upper and lower chemical liquid supply units toward the upper and lower surfaces of the substrate located between the first and second poles; (d) the substrate rotation module is a step in which the substrate is rinsed and dried in the outermost bowl; (e) the substrate rotation module stops the rotation of the substrate, and the substrate rotation module is positioned above the outermost bowl; and (f) the robot comprises a step of unloading the substrate; A substrate cleaning method in which the substrate is cleaned while the lower surface of the substrate is immersed in a chemical solution contained in a chemical solution filling space in the step (b).

12. In paragraph 11, In step (c) above, A substrate cleaning method characterized in that a plurality of lamps are provided at predetermined intervals in an outward direction based on a central axis on the lower surface of a spin chuck provided in the substrate rotation module, and the lamps transmit thermal energy to the substrate through the chemical solution contained in the chemical solution filling space to maintain the substrate at a predetermined temperature.

13. In paragraph 11, The upper liquid supply unit is configured to swing and move from the center of the substrate to the edge to spray the liquid. A substrate cleaning method, characterized in that the rotation speed of the substrate at the second position between the second and third poles is made faster than the rotation speed of the substrate at the lowest position.

14. In paragraph 11, A substrate cleaning method characterized in that, in the step (a), the substrate is loaded onto the substrate rotation module with a distance between the lower surface of the substrate and the upper surface of the spin chuck provided in the substrate rotation module of 0.5 to 20 mm.

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