Sensor assembly and electronic device comprising same
Patent Information
- Application Number
- PCT/KR2024/013537
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-10-31
- Filing Date
- 2024-09-06
- Publication Date
- 2025-03-13
Smart Images

Figure KR2024013537_13032025_PF_FP_ABST
Abstract
Description
Sensor assembly and electronic device including same
[0001] Examples disclosed in this document relate to sensor assemblies and electronic devices including the same.
[0002] Advances in information and communication technology and semiconductor technology are integrating various functions into a single portable electronic device. For example, electronic devices can implement not only communication functions but also entertainment functions such as gaming, multimedia functions such as music / video playback, communication and security functions for mobile banking, or calendar management and electronic wallet functions. These electronic devices are being miniaturized for convenient portability. Electronic devices (e.g., mobile phones) may include a display and a sensor assembly. The sensor assembly can detect the external environment (e.g., the position of an object or illumination) using optical elements. The sensor assembly may be positioned in an inactive area surrounding the display (e.g., a black matrix area) or beneath the display (e.g., an under-panel).
[0003] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.
[0004] According to one embodiment of the present disclosure, an electronic device may be provided. The electronic device may include a display including a display panel, a sensor assembly disposed facing a rear surface of the display panel, and at least one processor electrically connected to the display and the sensor assembly. The display panel may include a plurality of scan lines including a plurality of pixels arranged in a first direction. The scan lines may be spaced apart from each other in a second direction intersecting the first direction. The sensor assembly may include a first array including a plurality of first optical elements arranged in a first direction, and a second array spaced apart from the first array in the second direction. The second array may include a plurality of second optical elements arranged in a first direction. When the display is viewed from above, the first array and the second array may not overlap with the scan lines or may overlap with a specified number or fewer of the scan lines.
[0005] In one embodiment, the display further includes a support structure disposed on the back surface of the display panel and spaced apart from the sensor assembly, wherein the support structure may include a first through hole at least partially facing the sensor assembly.
[0006] According to one embodiment, the first direction lengths of the first array and the second array are a first designated length, and the first designated length may be greater than the diameter of the first through hole.
[0007] In one embodiment, the specified number may be 2 or less.
[0008] According to one embodiment, the sensor assembly may be configured to measure illumination of an external environment of the electronic device using at least a portion of the first array or the second array.
[0009] According to one embodiment, the sensor assembly may be configured to be switchable between an independent mode in which the first array and the second array are independently driven, or a composite mode in which the first array and the second array are driven in conjunction.
[0010] In one embodiment, the processor may be configured to change the brightness of the display in the standalone mode based on a greater value of a first illuminance value measured by the first array or a second illuminance value measured by the second array.
[0011] In one embodiment, the processor may be configured to change the brightness of the display based on a third illuminance value calculated using the first illuminance value measured by the first array or the second illuminance value measured by the second array, in the composite mode.
[0012] According to one embodiment, in the composite mode, the first array and the second array can be driven with a time difference.
[0013] According to one embodiment, the exposure time (integration time) of the first array and the second array in the composite mode may be at least twice the exposure time of the first array and the second array in the independent mode.
[0014] In one embodiment, the sensor assembly may further include a third array disposed between the first array and the second array, the third array including a plurality of third optical elements arranged in series in the first direction.
[0015] According to one embodiment, the sensor assembly may be configured to perform at least one of measuring illuminance of an external environment of the electronic device or detecting a position of an external object of the electronic device using the third array.
[0016] According to one embodiment, the third array can be aligned with the first through hole in a third direction intersecting the first direction and the second direction.
[0017] According to one embodiment, the first optical elements may include first light-receiving elements, and the second optical elements may include second light-receiving elements sensitive to light of a different wavelength band from the first light-receiving elements. According to one embodiment of the present disclosure, a sensor assembly may be provided. The sensor assembly may include a first array including a plurality of first optical elements arranged in series in the first direction, and a second array spaced apart from the first array in the second direction, the second array including a plurality of second optical elements (372a) arranged in series in the first direction. At least some of the first optical elements or the second optical elements may be configured to detect light incident on the sensor assembly.
[0018] According to one embodiment, the sensor assembly may be configured to measure illuminance of an external environment using at least some of the first optical elements or the second optical elements.
[0019] According to one embodiment, the sensor assembly may be configured to detect a position of an external object using at least some of the first optical elements or the second optical elements.
[0020] According to one embodiment, the sensor assembly may be configured to be switchable between an independent mode in which the first array and the second array are independently driven, or a composite mode in which the first array and the second array are driven in conjunction.
[0021] According to one embodiment, the first optical elements may include first light-receiving elements, and the second optical elements may include second light-receiving elements sensitive to light of a different wavelength band from the first light-receiving elements.
[0022] According to one embodiment, the device further comprises a third array disposed between the first array and the second array, wherein the third array may include a plurality of third optical elements arranged in series in the first direction.
[0023] According to one embodiment, the third optical elements may include light-receiving elements for detecting the illuminance of an external environment of the sensor assembly or the position of an external object of the sensor assembly.
[0024] The above-described aspects or other aspects, configurations and / or advantages of one embodiment of the present disclosure may be further clarified by the following detailed description taken in conjunction with the accompanying drawings.
[0025] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment disclosed in this document.
[0026] FIG. 2 is a front perspective view of an electronic device according to one embodiment disclosed in this document.
[0027] FIG. 3 is a rear perspective view of an electronic device according to one embodiment disclosed in this document.
[0028] FIG. 4 is a front exploded perspective view of an electronic device according to one embodiment of the present disclosure.
[0029] FIG. 5 is a rear exploded perspective view of an electronic device according to one embodiment of the present disclosure.
[0030] FIG. 6A is a plan view illustrating a display and sensor assembly of an electronic device according to one embodiment of the present disclosure.
[0031] Figure 6b is a cross-sectional view taken along line A-A' of Figure 6a.
[0032] Figure 6c is a cross-sectional view taken along line B-B' of Figure 6a.
[0033] FIG. 7a and FIG. 7b are drawings for explaining the driving of a display panel according to one embodiment of the present disclosure.
[0034] FIG. 8A is a drawing for explaining the operation of a sensor assembly according to one embodiment of the present disclosure.
[0035] FIG. 8b is a drawing for explaining light-receiving elements of a sensor assembly according to one embodiment of the present disclosure.
[0036] FIG. 9 is a drawing for explaining the operation of a sensor assembly in short mode according to one embodiment of the present disclosure.
[0037] FIG. 10 is a drawing for explaining brightness control of a display using a sensor assembly according to one embodiment of the present disclosure.
[0038] FIG. 11 is a drawing for explaining a display and sensor assembly according to one embodiment of the present disclosure.
[0039] FIG. 12 is a drawing for explaining operation of a sensor assembly in an independent mode according to one embodiment of the present disclosure.
[0040] FIG. 13 is a drawing for explaining the angle of view of a sensor assembly according to one embodiment of the present disclosure.
[0041] FIGS. 14A and 14B are drawings for explaining operation of a sensor assembly in a composite mode according to one embodiment of the present disclosure.
[0042] FIG. 15 is a drawing for explaining a change in the angle of view of a sensor assembly according to the tilting of an electronic device according to one embodiment of the present disclosure.
[0043] FIG. 16 is a flowchart illustrating a method for controlling the brightness of a display using a sensor assembly according to one embodiment of the present disclosure.
[0044] Throughout the attached drawings, similar reference numbers may be assigned to similar parts, components and / or structures.
[0045] The following description, with reference to the accompanying drawings, is provided to facilitate a comprehensive understanding of various embodiments of the present invention as defined by the claims and their equivalents. While the following description includes numerous specific details to aid understanding, these should be considered merely illustrative. Accordingly, those skilled in the art will recognize that various modifications and variations of the various embodiments described herein may be made without departing from the scope and spirit of the present disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.
[0046] The terms and words used in the following description and claims are not intended to be limited by their bibliographic meanings, but are merely used by the inventors to ensure a clear and consistent understanding of the disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of the present invention is provided solely for illustrative purposes, not for the purpose of limiting the present invention, which is defined by the appended claims and their equivalents.
[0047] The singular forms "a," "an," and "the" should be understood to include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a surface of a part" includes reference to one or more of those surfaces.
[0048] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment disclosed in this document.
[0049] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In one embodiment, the electronic device (101) may have at least one of these components (e.g., the connection terminal (178)) omitted, or one or more other components added. In one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).
[0050] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.
[0051] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.
[0052] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).
[0053] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).
[0054] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).
[0055] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.
[0056] The display module (160) can visually provide information to an external device (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a hall area program device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.
[0057] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).
[0058] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
[0059] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
[0060] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).
[0061] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
[0062] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.
[0063] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).
[0064] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.
[0065] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).
[0066] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.
[0067] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).
[0068] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.
[0069] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).
[0070] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.
[0071] In the detailed description below, the longitudinal direction, the width direction, and / or the thickness direction of the electronic device may be mentioned, and the longitudinal direction may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and / or the thickness direction as the 'Z-axis direction'. In one embodiment, with respect to the direction that a component is oriented, 'negative / positive (- / +)' may be mentioned together with the orthogonal coordinate system illustrated in the drawings. For example, the front of the electronic device or the housing may be defined as the 'side facing the +Z direction', and the back side may be defined as the 'side facing the -Z direction'. In one embodiment, the side of the electronic device or the housing may include a region facing the +X direction, a region facing the +Y direction, a region facing the -X direction, and / or a region facing the -Y direction. Also, in one embodiment, the 'X-axis direction' may mean both the '-X direction' and the '+X direction'. It should be noted that this is based on the orthogonal coordinate system illustrated in the drawings for the sake of brevity of description, and that the description of these directions or components does not limit the one embodiment disclosed in this document. For example, the aforementioned front or rear facing direction may vary depending on whether the electronic device is unfolded or folded, and the aforementioned direction may be interpreted differently depending on the user's gripping habits.
[0072] FIG. 2 is a perspective view showing the front side of an electronic device according to one embodiment of the present disclosure. FIG. 3 is a perspective view showing the rear side of the electronic device illustrated in FIG. 2 according to one embodiment of the present disclosure. The configuration of the electronic device (101) of FIGS. 2 and 3 may be all or part of the same as the configuration of the electronic device (101) of FIG. 1.
[0073] Referring to FIGS. 2 and 3 , an electronic device (101) according to one embodiment may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing (210) may refer to a structure that forms a portion of the first side (210A) of FIG. 2 , the second side (210B), and the side surface (210C) of FIG. 3 . According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The rear plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side structure (or “side bezel structure”) (218) that is coupled to the front plate (202) and the rear plate (211) and comprises a metal and / or polymer. In one embodiment, the rear plate (211) and the side structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).
[0074] Although not shown, the front plate (202) may include a seamlessly extending region(s) that curves toward the rear plate (211) at least along a portion of an edge. In one embodiment, the front plate (202) (or the rear plate (211)) may include only one of the curved extending regions toward the rear plate (211) (or the front plate (202)) at one edge of the first surface (210A). In some embodiments, the front plate (202) or the rear plate (211) may be substantially flat, in which case it may not include a curved extending region. When it includes a curved extending region, the thickness of the electronic device (101) in the portion that includes the curved extending region may be less than that of the other portions.
[0075] According to one embodiment, the electronic device (101) may include one or more of a display (201), an audio module (not shown) including at least one sound hole (203, 207, 214) (e.g., audio module (170) of FIG. 1), a sensor module (204) (e.g., sensor module (176) of FIG. 1), a camera module (205, 212, 213) (e.g., camera module (180) of FIG. 1), a key input device (217) (e.g., input module (150) of FIG. 1), or a connector hole (208, 209) (e.g., connection terminal (178) of FIG. 1). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., key input device (217) or light emitting element (206)) or may additionally include other components.
[0076] In one embodiment, the display (201) may be visually exposed, for example, through a substantial portion of the front plate (202). In one embodiment, at least a portion of the display (201) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment, the corners of the display (201) may be formed to be substantially the same as the adjacent outer shape of the front plate (202). In one embodiment (not shown), in order to expand the area over which the display (201) is visually exposed, the gap between the outer edge of the display (201) and the outer edge of the front plate (202) may be formed to be substantially the same.
[0077] In one embodiment (not shown), a recess or opening may be formed in a part of a screen display area of the display (201), and at least one of an acoustic hole (214), a sensor module (204), a camera module (205), and a light-emitting element (206) may be included that are aligned with the recess or opening. In one embodiment (not shown), at least one of an acoustic hole (214), a sensor module (204), a camera module (205), a fingerprint sensor (not shown), and a light-emitting element (206) may be included on a back surface of the screen display area of the display (201). In one embodiment (not shown), the display (201) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen. In one embodiment, at least a portion of the sensor module (204) and / or at least a portion of the key input device (217) may be positioned on the side (210C).
[0078] According to one embodiment, the audio module (not shown) may include a microphone hole (203) and sound holes (207, 214). The microphone hole (203) may have a microphone disposed inside to acquire external sound, and in one embodiment, multiple microphones may be disposed to detect the direction of the sound. According to one embodiment, the sound holes (207, 214) may include an external sound hole (207) and a receiver hole (214) for calls. In one embodiment, the sound holes (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included in the audio module without the sound holes (207, 214) (e.g., a piezo speaker).
[0079] According to one embodiment, the sensor module (204) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. The sensor module (204) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210). According to an embodiment, an additional sensor module may be disposed on a second surface (210B) of the housing (210). The fingerprint sensor (not shown) may be disposed on not only the first surface (210A) (e.g., the display (201)) of the housing (210) but also the second surface (210B) or the side surface (210C). The electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
[0080] In one embodiment, the camera modules (205, 212, 213) may include a first camera module (205) facing the first side (210A) of the electronic device (101), and a second camera module (212) and / or a flash (213) facing the second side (210B). For example, the first camera module (205) and / or the second camera module (212) may include one or more lenses, an image sensor, and / or an image signal processor. In one embodiment, some of the camera modules (205) and / or some of the sensor modules (e.g., the sensor module (204)) among the camera modules (205, 212) may be arranged to be exposed to the outside through at least a portion of the display (201). In one embodiment, the first camera module (205) may include a punch hole camera arranged inside a hole or recess formed on the back surface of the display (201). For example, the first camera module (205) can receive at least a portion of light incident on the first side (210A) (or front) of the electronic device (101) through the display (201) within the electronic device (101).
[0081] In one embodiment, the second camera module (212) may be disposed inside the housing (210) such that the lens is exposed to the second side (210B) (or back) of the electronic device (101). For example, the camera module (212) may be electrically connected to a printed circuit board (e.g., the printed circuit board (240a) of FIG. 4). For example, the flash (213) may include a light-emitting diode or a xenon lamp. In one embodiment, one or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be disposed on one side of the electronic device (101). In one embodiment, the flash (213) may emit infrared light. For example, infrared light emitted from the flash (213) and reflected by a subject may be received through a sensor module (not shown) disposed on the second side (210B) of the housing (210). An electronic device (101) or a processor (e.g., processor (120) of FIG. 1) can detect depth information of a subject based on the point in time when infrared rays are received from the sensor module.
[0082] In one embodiment, the key input device (217) may be disposed on a side surface (210C) of the housing (210). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (201). In one embodiment, the key input device may include a sensor module disposed on a second surface (210B) of the housing (210).
[0083] In one embodiment, the light emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210). The light emitting element (206) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light emitting element (206) may provide a light source that is linked to a process of, for example, the camera module (205). The light emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.
[0084] According to one embodiment, the connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.
[0085] FIG. 4 is a front exploded perspective view of an electronic device according to one embodiment of the present disclosure. FIG. 5 is a rear exploded perspective view of an electronic device according to one embodiment of the present disclosure.
[0086] Referring to FIGS. 4 and 5, an electronic device (101) (e.g., the electronic device (101) of FIG. 1 and / or the electronic device (101) of FIG. 2 or FIG. 3) includes a display (201) (e.g., the display (201) of FIG. 2), a front plate (202) (e.g., the front plate (202) of FIG. 2), a support structure (221) (e.g., a bracket), a side bezel structure (or side bezel structure) (222), a camera module (230) (e.g., the camera module (180) of FIG. 1), at least one printed circuit board (or board assembly) (240a, 240b), a battery (245) (e.g., the battery (189) of FIG. 1), a rear case (250), an antenna (not shown) (e.g., the antenna module (197) of FIG. 1) and / or a rear plate (290) (e.g., the rear of FIG. 3). It may include a plate (211)). According to one embodiment, when including a plurality of printed circuit boards (240a, 240b), the electronic device (101) may include at least one flexible printed circuit board (240c) to electrically connect different printed circuit boards. For example, the printed circuit boards (240a, 240b) may include a first circuit board (240a) positioned above the battery (245) (e.g., in the +Y-axis direction) and a second circuit board (240b) positioned below the battery (245) (e.g., in the -Y-axis direction), and the flexible printed circuit board (240c) may electrically connect the first circuit board (240a) and the second circuit board (240b).
[0087] According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., the support structure (221), the rear case (250), or the flexible printed circuit board (240c)) or may additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 2 or FIG. 3, and any redundant description thereof will be omitted below.
[0088] In one embodiment, the support structure (221) may be provided at least in a flat shape. In one embodiment, the support structure (221) may be disposed inside the electronic device (101) and connected to or formed integrally with the side bezel structure (222). For example, the support structure (221) may be formed of a conductive material and / or a non-conductive material (e.g., a polymer). When the support structure (221) at least partially includes a conductive material such as a metal, the side bezel structure (222) or a portion of the support structure (221) may function as an antenna. The support structure (221) may include two sides facing opposite directions. The display (201) may be disposed on one of the two sides of the support structure (221), and the printed circuit board (240a, 240b) may be disposed on the other side.
[0089] In one embodiment, the support structure (221) and the side bezel structure (222) may be combined and referred to as a front case or housing (220). In one embodiment, the housing (220) may be generally understood as a structure for accommodating, protecting, or arranging electrical / electronic components, such as printed circuit boards (240a, 240b) or batteries (245). In one embodiment, the housing (220) may be understood as including structures that can be visually or tactilely perceived by a user in the appearance of the electronic device (101), for example, a side bezel structure (222), a front plate (202), and / or a back plate (290). In one embodiment, the front or back of the housing (220) may refer to the first side (210A) of FIG. 2 or the second side (210B) of FIG. 3. In one embodiment, the support structure (221) is disposed between the front plate (202) (e.g., the first side (210A) of FIG. 2) and the back plate (290) (e.g., the second side (210B) of FIG. 3) and may function as a structure for arranging electrical / electronic components such as a printed circuit board (240a, 240b) or a camera module (230). In the detailed description below, the camera module (230) of the electronic device (101) may be generally illustrated as including a configuration that receives light incident through the second side (210B) of the electronic device (101), but the electronic device (101) may further include a camera module (e.g., the camera module (205) of FIG. 2) and / or a sensor module (e.g., the sensor module (204) of FIG. 2) disposed to be exposed to the outside through at least a portion of the display (201).
[0090] In one embodiment, the camera module (230) may include at least one camera module, for example, at least one of the plurality of camera modules illustrated in FIGS. 4 and 5. In one embodiment, the camera module (230) may be disposed on a portion of the support structure (221) adjacent to the printed circuit board (240a, 240b). In one embodiment, the camera module (230) may be at least partially enclosed by the rear case (250) (e.g., the upper rear case (250a)). In one embodiment, the camera module (230) may receive at least a portion of light incident through an optical hole or a cover window (232, 233) disposed on the rear of the electronic device (101) (e.g., the second side (210B) of FIG. 3) within the electronic device (101). According to one embodiment, the camera module (230) may be aligned with one or more of the cover window(s) (232, 233).
[0091] According to one embodiment, a circuit device (e.g., a processor), a communication module (e.g., a communication module (190) of FIG. 1), a power management module (e.g., a power management module (188)), or a memory (e.g., a memory (130) of FIG. 1), an interface (e.g., an interface (177) of FIG. 1), or various electrical / electronic components implemented in the form of an integrated circuit chip may be disposed on the printed circuit board (240a, 240b). The processor (e.g., the processor (120) of FIG. 1) may include one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, a volatile memory or a non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (101) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. In some embodiments, the printed circuit board (240a, 240b) may be provided with an electromagnetic shielding environment from the rear case (250).
[0092] According to one embodiment, the battery (245) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (245) may be disposed substantially on the same plane as, for example, the printed circuit boards (240a, 240b). The battery (245) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).
[0093] In one embodiment, the rear case (250) may include an upper rear case (250a) and a lower rear case (250b). In one embodiment, the upper rear case (250a) may be arranged to surround a printed circuit board (240a, 240b) (e.g., a first circuit board (240a)) together with a portion of a support structure (221). For example, the upper rear case (250a) may be arranged to face the support structure (221) with the first circuit board (240a) interposed therebetween.
[0094] In one embodiment, the lower rear case (250b) can be utilized as a structure on which various electrical / electronic components, including interfaces (e.g., a USB connector, an SD card / MMC connector, or an audio connector), can be placed. In one embodiment, electrical / electronic components, such as interfaces (e.g., a USB connector, an SD card / MMC connector, or an audio connector), can be placed on an additional printed circuit board (not shown). In this case, the lower rear case (250b) can be placed to surround the additional printed circuit board (not shown) together with another part of the support structure (221). For example, the interfaces placed on the additional printed circuit board (not shown) or the lower rear case (250b) (not shown) can be placed corresponding to the sound hole (207) or the connector holes (208, 209) of FIG. 2.
[0095] In one embodiment, the antenna (not shown) may include a conductive pattern implemented on the surface of the rear case (250), for example, through a laser direct structuring method. In one embodiment, the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the rear plate (290) and the battery (245). The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In one embodiment, another antenna structure may be formed by a part or a combination of the support structure (221) and / or the side bezel structure (222).
[0096] FIG. 6A is a plan view illustrating a display and sensor assembly of an electronic device according to one embodiment of the present disclosure. FIG. 6B is a cross-sectional view taken along line A-A' of FIG. 6A. FIG. 6C is a cross-sectional view taken along line B-B' of FIG. 6A. The configuration of the electronic device of FIG. 6A may be all or part of the same or similar to the configuration of the electronic devices of FIGS. 1 to 5.
[0097] Referring to FIGS. 6A to 6C , in one embodiment, the electronic device (101) may include a display (302), a sensor assembly (370) (e.g., the sensor module (176) of FIG. 1 and / or the sensor module (204) of FIG. 2 ), and / or a printed circuit board (340) on which the sensor assembly (370) is disposed. For example, the printed circuit board (340) may be a main circuit board (e.g., the first printed circuit board (240a) of FIGS. 4 and 5 ) on which a processor (e.g., the processor (120) of FIG. 1 ) is disposed, or an auxiliary circuit board connected to the main circuit board.
[0098] According to one embodiment, the display (302) may include a display panel (310) and a cover window (320) (e.g., the front plate (202) of FIG. 4) disposed on a front surface (e.g., a +Z-direction surface) of the display panel (310). According to one embodiment, the display (302) may include a support structure (330) disposed on a back surface (e.g., a -Z-direction surface) of the display panel (310). According to one embodiment, the display (302) may include an active area (or display area) on which an image is displayed and an inactive area (e.g., a black matrix area) such as a bezel area around the active area.
[0099] According to one embodiment, the sensor assembly (370) may include an ambient light sensor (ALS), a proximity sensor, or a proximity-ambient light sensor in which the ambient light sensor and the proximity sensor are integrated. For example, the electronic device (101) may be configured to adjust the brightness (or screen brightness) of the display (302) based on the illumination of the external environment of the electronic device (101) measured by the illumination sensor of the sensor assembly (370) (or the ambient brightness of the electronic device (101). The electronic device (101) may be configured to optimize the brightness of the display (302) based on the ambient brightness of the electronic device (101) measured by the illumination sensor of the sensor assembly (370), thereby preventing glare to the user and improving the visibility of the screen. For example, the proximity sensor of the sensor assembly (370) can detect the location of an object located outside the electronic device (101) or the distance to the object. For example, the proximity sensor of the sensor assembly (370) can provide a function of turning off the screen of the display (302) during a call to improve power consumption or preventing an incorrect touch of the display (302) due to contact with the user's body (e.g., face) during a call.
[0100] Referring to FIGS. 6A and 6B , in one embodiment, a sensor assembly (370) (e.g., a proximity sensor and / or an illumination sensor) may be disposed under an active area of the display panel (310) (e.g., an under panel). For example, the sensor assembly (370) may be formed as an in-display sensor structure, and may be formed integrally with the display (302) within the display (302). When the sensor assembly (370) is disposed under the display (e.g., an under panel), the sensor assembly (370) may detect light incident through the display (302) to provide information about the external environment of the electronic device (101) (e.g., illumination or the position of an object). In the present disclosure, the arrangement of the sensor assembly (370) may be varied. For example, referring to FIG. 6c, a sensor assembly (370) (e.g., a proximity sensor and / or a light sensor) may be positioned below an inactive area (e.g., a black matrix area) of the display (302).
[0101] Referring to FIG. 6B, according to one embodiment, the display (302) may include a first through hole (331) (e.g., an exposure area, an opening, a punch hole, or a perforation hole) formed at a position facing the sensor assembly (370). For example, the first through hole (331) may be formed in a support structure (330) disposed on a back surface (e.g., a -Z direction surface) of the display (302) or the display panel (310). According to one embodiment, when the sensor assembly (370) is disposed in an active area of the display (302), light incident from outside the electronic device (101) may be received through the first through hole (331) of the display (302). The size or diameter of the through hole (331) may be set in consideration of the size of the sensor assembly (370) or the field of view (FOV) of the sensor assembly (370). In one embodiment, the sensor assembly (370) (e.g., proximity sensor and / or light sensor) may include an array of optical elements (e.g., photodiodes) positioned so as to minimize light interference with the display panel (310) and / or physical interference with the first through-hole (331) (see FIG. 10) while overlapping the display panel (310).
[0102] FIG. 7A and FIG. 7B are diagrams for explaining the operation of a display panel according to an embodiment of the present disclosure. FIG. 8A is a diagram for explaining the operation of a sensor assembly according to an embodiment of the present disclosure. FIG. 8B is a diagram for explaining the light receiving elements of a sensor assembly according to an embodiment of the present disclosure. FIG. 9 is a diagram for explaining the operation of a sensor assembly in short mode according to an embodiment of the present disclosure.
[0103] Referring to FIG. 7a, a display panel (310) (e.g., the display panel (310) of FIG. 6) of a display (e.g., the display (302) of FIG. 6) may include a plurality of pixel modules (310a). According to one embodiment, the display panel (310) may include scan lines (or scanning lines) (311) (or pixel lines or pixel arrays). The scan lines (311) may include pixel modules (310a). The scan lines (311) may be linearly extended in a first direction (e.g., a horizontal direction or an X-axis direction) and may include a plurality of pixels arranged continuously in the first direction. The scan lines (311) may be arranged continuously in a second direction (e.g., a vertical direction or a Y-axis direction) intersecting the first direction.
[0104] According to one embodiment, referring to FIG. 7a, the pixels of each scan line (311) of the display panel (310) are cycled at a certain period (e.g., T in FIG. 7b). D ) can be simultaneously activated (or on) or deactivated (or off). For example, each scan line (311) has a certain cycle (e.g., T in FIG. 7b). D ) may generate an operation signal (e.g., Vsync of FIGS. 7a and 7b) once per scan line. For example, referring to FIG. 7a, when the N-th scan line (311) is activated (or turned on) according to the operation signal (e.g., Vsync of FIGS. 7a and 7b), the N+1-th scan line (311) positioned next to the N-th scan line (311) (e.g., in the -Y direction) may be activated (or turned on) at a certain time difference. For example, the operating frequency of the display panel (310) may vary in a range of about 30 to about 120 Hz. The cycle (e.g., T of FIG. 7b) in which the pixels are activated (or turned on) / deactivated (or turned off) D) may be the reciprocal of the operating frequency of the display panel (310). For example, if the operating frequency of the display panel (310) is about 60 Hz, the operating signal (Vsync) may be generated once for each scan line (311) every about 16.6 ms, which is the above-mentioned regular period. For example, referring to FIG. 7b, the period (e.g., T of FIG. 7b) D ) is about 16.6 ms, the activation (or on) / deactivation (or off) is repeated four times in one cycle, and the time for one activation (or on) and one deactivation (or off) is T in Fig. 7b. D1 ) can be about 4.15 ms. For example, the brightness of the display (302) can be determined by the time at which a pixel is activated (or turned on) (e.g., T in FIG. 7b). Don ) can be brighter the longer it is, and the brighter it can be the greater the luminance when the pixel is activated (or on) (e.g., C in Fig. 7b).
[0105] The horizontal axis of the graph of FIG. 8A may represent wavelength (nm), and the vertical axis may represent responsivity level. In one embodiment, the sensor assembly (e.g., the sensor assembly (370) of FIG. 6) may include photodetectors, which may be photoelectric detectors such as photodiodes. Referring to FIG. 8A, the sensor assembly (370) may include photodetectors configured with channels (CHO, CH1 of FIG. 8A) that are sensitive to light of different wavelength bands. Referring to FIG. 8A, for example, the photodetector of the first channel (CH0) may be sensitive to light of a wavelength in a band of about 400 nm to about 700 nm, and the photodetector of the second channel (CH1) may be sensitive to light of a wavelength in a band of about 700 nm to about 1000 nm. According to one embodiment, the electronic device (101) can calculate the ambient brightness or illuminance value of the electronic device (101) using the ADC (analog to digital) value of the first channel (CH0) and / or the ADC value of the second channel (CH1).
[0106] Referring to FIG. 8b, the photodetectors of the first channel (CH0) and the second channel (CH1) of the sensor assembly (e.g., the sensor assembly (370) of FIG. 6) are pulsed at a specific cycle (e.g., T of FIG. 8b). P ) can be activated (or on) / deactivated (or off) once during a specific cycle (Tp). For example, the photodetectors of the first channel (CH0) and the second channel (CH1) can be activated (or on) / deactivated (or off) once during a specific cycle (Tp) during an integration time (e.g., t in FIG. 8b). IT ) can be activated (or turned on) during a specific period (Tp) and exposure time (t). IT ) can be set by the manufacturer or the user. For example, the larger the size of the light-receiving elements of the sensor assembly (370), the greater the exposure time (t) of the light-receiving elements. IT) can improve the sensitivity of the sensor assembly (370).
[0107] FIG. 9 is a drawing for explaining the driving of a display panel (e.g., the display panel (310) of FIG. 6) and the driving of a sensor assembly (e.g., the sensor assembly (370) of FIG. 6) together. According to one embodiment, the sensor assembly (370) may be disposed under (e.g., under a panel) a display (e.g., the display (302) of FIG. 6). When the sensor assembly (370) is subjected to optical noise due to the display panel (310), the accuracy of the illuminance value measured by the sensor assembly (370) may decrease. According to one embodiment, the sensor assembly (370) may be driven in a short mode to avoid the optical noise of the display panel (310). In the short mode, the measurement value of the sensor assembly (370) when the display panel (310) is off may be used as valid data for measuring the illuminance of the environment around the electronic device (101). For example, the measurement value of the sensor assembly (370) when the display panel (310) is off can be detected based on the ADC value (e.g., 50 or 100) of the sensor assembly (370) that changes when the display panel (310) is activated (or on) or deactivated (or off). For example, the exposure time of the sensor assembly (370) in short mode (e.g., t in FIG. 8) IT ) can be about 400 μm.
[0108] FIG. 10 is a drawing for explaining brightness control of a display using a sensor assembly according to one embodiment of the present disclosure.
[0109] Referring to FIG. 10, in one embodiment, an electronic device (e.g., the electronic device (101) of FIGS. 1 to 5) may include an application processor (10), a sensor hub processor (20), a DDI (or display driver interface) (30), and a sensor module (or sensor integrated circuit (IC)) (40).
[0110] According to one embodiment, the application processor (10) may be configured to control and adjust the properties (e.g., color, brightness) of the display (302) (e.g., the display (302) of FIG. 6). For example, the application processor (10) may include one or more processors (e.g., the processor (120) of FIG. 1). For example, the application processor (10) may include a main processor (e.g., the main processor (121) of FIG. 1) that performs high-performance processing and an auxiliary processor (e.g., the auxiliary processor (123) of FIG. 1) that performs low-power processing.
[0111] According to one embodiment, the application processor (10) may include a brightness control module (11). For example, the brightness control module (11) may determine the brightness of the display (302) based on the illuminance (or ambient brightness) value of the external environment of the electronic device (101) measured by the illuminance sensor of the sensor assembly (e.g., the sensor assembly (370) of FIGS. 6A to 6C and FIG. 11). For example, the brightness control module (11) may determine the brightness of the display (302) using an algorithm and / or a pre-stored brightness table. For example, the application processor (10) or the brightness control module (11) may increase the brightness of the display (302) to secure visibility in a high-illuminance environment (e.g., outdoors under strong sunlight), and may lower the brightness of the display (302) to prevent glare in a low-illuminance environment (e.g., a dark room).
[0112] According to one embodiment, the sensor hub processor (20) may be configured to control and adjust the operation of a sensor module, such as an illuminance sensor, an illuminance sensor, and / or a proximity sensor, of a sensor assembly (e.g., the sensor assembly (370) of FIGS. 6A to 6C and FIG. 11). For example, the application processor (10) may determine and adjust the brightness of the display (302) based on an illuminance value (Lux value) calculated using an algorithm of the sensor hub processor (20). For example, the sensor hub processor (20) may include an illuminance sensor processor module (21). For example, the illuminance sensor processor module (21) may be configured to calculate an illuminance (or ambient brightness) value of the surrounding environment of the electronic device (101) using a pre-stored calculation formula, and to set a gain of the illuminance sensor of the sensor assembly (370) according to the calculated illuminance value.
[0113] According to one embodiment, the DDI (or display driver interface) (30) is a semiconductor that controls the display (302) and can control driving signals and data for displaying a video signal (or image, video) on the screen of the display panel (310). For example, the DDI (30) can be electrically connected to the application processor (10), and the DDI (30) can cause the video signal provided from the application processor (10) to be displayed on the display (302). For example, the DDI (30) can be electrically connected to the display panel (310), and can also be configured as a component that is mechanically independent from the display (302). For example, the DDI (30) can include a brightness module (31) for controlling properties such as brightness of the display (302). For example, the DDI (30) can control the timing at which the display (302) is driven, and as an example, can include a synchronization pin (sync pin ((32)) for synchronizing the driving timing with a light sensor.
[0114] According to one embodiment, a pixel module (310a) of a display panel (310) (pixel module (310a) of FIGS. 7A and 11) may include a plurality of scan lines (311). For example, the scan lines (311) of the display panel (310) may be driven one line at a time, and the screen of the display (302) or the display panel (310) may be updated.
[0115] According to one embodiment, the sensor module (40) may include a light sensor module (41) and a sync pin (42). For example, the sync pin (42) may synchronize the driving timing of the light sensor module (41) with the DDI (30). For example, the sensor module (40) may include a light sensor ASIC (application specific integrated circuit) (43) electrically connected to the sync pin (42) and optical elements (371a, 372a, 373a) of a sensor assembly (e.g., the sensor assembly (370) of FIG. 10). According to one embodiment, the light sensor (41) may receive light from an external light source of the electronic device (101) and measure the intensity or illuminance of the light. According to one embodiment, the light sensor module (41) of the sensor module (40) may refer to a first array (371) (e.g., the first array (371) of FIG. 11), a second array (372) (e.g., the second array (372) of FIG. 11), and / or a third array (373) (e.g., the third array (373) of FIG. 11) of a sensor assembly (e.g., the sensor assembly (370) of FIGS. 6A to 6C and FIG. 11). The light sensor may include a light-receiving element (e.g., a photodiode) capable of receiving light. In the present disclosure, the light sensor has been mainly described as a sensor constituting the sensor module (40), but the type of the sensor is not limited. For example, the sensor module (40) may include various types of optical sensors such as a proximity sensor and an ultraviolet sensor.
[0116] FIG. 11 is a diagram for explaining a display and sensor assembly according to an embodiment of the present disclosure. FIG. 12 is a diagram for explaining operation of a sensor assembly in an independent mode according to an embodiment of the present disclosure. FIG. 13 is a diagram for explaining a field of view of a sensor assembly according to an embodiment of the present disclosure. FIG. 14a and FIG. 14b are diagrams for explaining operation of a sensor assembly in a composite mode according to an embodiment of the present disclosure. FIG. 15 is a diagram for explaining a change in a field of view of a sensor assembly according to an inclination of an electronic device according to an embodiment of the present disclosure. FIG. 16 is a flowchart for explaining a method for controlling brightness of a display using a sensor assembly according to an embodiment of the present disclosure.
[0117] FIG. 11 can show the arrangement of light-receiving elements (371a, 372a, 373a) of a sensor assembly (370) (e.g., the sensor assembly (370) of FIG. 6) and the arrangement of a display (302) (e.g., the display (302) of FIGS. 6a to 6c) overlapping the sensor assembly (370).
[0118] In one embodiment, the sensor assembly (370) may include arrays (371, 372, 373) extending in a first direction (e.g., X-axis direction). The arrays (371, 372, 373) may include a plurality of optical elements (371a, 372a, 373a) arranged in series in the first direction (e.g., X-axis direction). According to one embodiment, the sensor assembly (370) may include a first array (371) and a second array (372). According to one embodiment, the first array (371) and the second array (372) may be spaced apart from each other in a second direction (e.g., Y-axis direction) intersecting the first direction (e.g., X-axis direction).
[0119] In one embodiment, as the number of scan lines (311) overlapping the first array (371) and the second array (372) increases, the influence of the optical noise of the display (302) on the sensor assembly (370) may increase. To avoid the optical noise of the display (302), the exposure time of the sensor assembly (370) (e.g., t in FIG. 9) IT ) may reduce the light sensitivity of the sensor assembly (370), which may result in a decrease in the resolution of the sensor assembly (370) in a low-light environment. According to one embodiment of the present disclosure, when the light-receiving elements (e.g., optical elements (371a, 372a, 373a)) of the sensor assembly (370) are continuously arranged in a first direction (e.g., X-axis direction) that is an extension direction of the scan line (311) of the display panel (310) (e.g., scan line (311) of FIG. 7A), the number of scan lines (311) overlapping with the light-receiving elements may be reduced when the display (302) is viewed from above (e.g., when the display (302) is viewed in the -Z direction) compared to when the light-receiving elements are continuously arranged in a second direction (e.g., Y direction) intersecting the first direction. When the number of scanning lines (311) of the display panel (310) overlapping the light-receiving elements of the sensor assembly (370) is reduced, the influence of the optical noise of the display panel (310) on the sensor assembly (370) can be reduced.
[0120] In one embodiment, when viewing the display (302) from above (e.g., when viewing the display (302) in the -Z direction), the first array (371) and the second array (372) of the sensor assembly (370) may not overlap with the scan lines (311) of the display panel (310) or may overlap with a specified number or fewer of the scan lines (311). In one embodiment, the specified number of scan lines (311) overlapping the first array (371) and the second array (372) may be 2 or less. For example, referring to FIG. 11, when viewing the display (302) from above (e.g., when viewing the display (302) in the -Z direction), the first array (371) may overlap with the Nth scan line (311), and / or the second array (371) may overlap with the N+5th scan line (311).
[0121] According to one embodiment, the first array (371) and the second array (372) of the sensor assembly (370) may constitute an illuminance sensor (e.g., an illuminance sensor module (41) of FIG. 10) for measuring illuminance of the surrounding environment of an electronic device (e.g., an electronic device (101) of FIGS. 1 to 5).
[0122] According to one embodiment, the first array (371) may include a plurality of first optical elements (371a) spaced apart in a first direction (e.g., a horizontal direction or an X-axis direction). The first optical elements (371a) may include at least one light-receiving element (e.g., a photodiode) configured with channels (e.g., CHO and CH1 of FIG. 8A) that are sensitive to light of different wavelength bands. According to one embodiment, the second array (372) may include a plurality of second optical elements (372a) spaced apart in a first direction (e.g., a horizontal direction or an X-axis direction). The second optical elements (372a) may include at least one light-receiving element (e.g., a photodiode) configured with channels (e.g., CHO and CH1 of FIG. 8A) that are sensitive to light of different wavelength bands. Referring to FIG. 13, for example, at least a part of the first optical element (371a) arranged in the first array (371) may correspond to CH0 or CH1 of FIG. 8a, and at least a part of the second optical element (372a) arranged in the second array (372) may correspond to CH0 or CH1 of FIG. 8a.
[0123] According to one embodiment, an electronic device (e.g., the electronic device (101) of FIGS. 1 to 5) can measure the illuminance of the surrounding environment of the electronic device (101) using the illuminance value measured by the first array (371) and the illuminance value measured by the second array (372). As described below with reference to FIGS. 12 to 14B, the first array (371) and the second array (372) can be driven independently or in combination (or synchronized) depending on the illuminance of the surrounding environment of the electronic device (101).
[0124] According to one embodiment, the first direction length (e.g., horizontal length or X-axis direction length) of the first array (371) and the second array (372) of the sensor assembly (370) may be a first designated length (e.g., X1 of FIG. 11). For example, the first designated length (X1) of the first array (371) and the second array (372) may be set in consideration of the sensitivity and / or field of view (FOV) of the sensor assembly (370). For example, the first designated length (X1) may be set in consideration of the size of the first through hole (331) of the display (302) (e.g., the first through hole (331) of FIG. 6b and FIG. 13). According to one embodiment, the first designated length (X1) of the first array (371) and the second array (372) may be set to be larger than the diameter of the first through hole (331) (e.g., D1 of FIG. 11) to secure the field of view (FOV) of the sensor assembly (370).
[0125] According to one embodiment, the second direction length (e.g., horizontal length or Y-axis direction length) of the first array (371) and the second array (372) may be a second specified length (e.g., Y1 of FIG. 11). According to one embodiment, the second specified length (Y1) may be set to minimize the number of scan lines (311) of the display panel (310) that overlap with the first array (371) and the second array (372). For example, the second specified length (Y1) may be about 100 μm to about 130 μm, and as an example, may be about 120 μm. For example, the first array (371) and the second array (372) may be spaced apart from each other by a first specified interval (e.g., d1 of FIG. 11). For example, the first designated interval (d1) may be set in consideration of the number of scanning lines (311) of the display panel (310) overlapping the first array (371) and the second array (372) and / or the field of view (FOV).
[0126] According to one embodiment, a first direction length (e.g., horizontal length or X-axis direction length) of the first array (371) may be longer than a second direction length (e.g., vertical length or Y-axis direction length). According to one embodiment, a first direction length (e.g., horizontal length or X-axis direction length) of the second array (372) may be longer than a second direction length (e.g., vertical length or Y-axis direction length). According to one embodiment, a first direction length (e.g., horizontal length or X-axis direction length) of the first optical elements (371a) constituting the first array (371) may be longer than a second direction length (e.g., vertical length or Y-axis direction length) of the first optical elements (371a). According to one embodiment, the first direction length (e.g., horizontal length or X-axis direction length) of at least one second optical element (372a) constituting the second array (372) may be longer than the second direction length (e.g., vertical length or Y-axis direction length) of the second optical elements (372a). However, the number, arrangement, and shape of the first optical elements (371a) and the second optical elements (372a) are not limited. For example, as long as the first direction length (e.g., horizontal length or X-axis direction length) of the first array (371) and the second array (372) is formed to be longer than the second direction length (e.g., vertical length or Y-axis direction length), the number, arrangement, and shape of the first optical elements (371a) and the second optical elements (372a) may be changed.
[0127] Referring to FIG. 11, in one embodiment, the sensor assembly (370) may further include a third array (373) disposed between the first array (371) and the second array (372). According to one embodiment, the third array (373) may be spaced apart from the first array (371) and the second array (372). According to one embodiment, the third array (373) may be disposed at a central portion of the first through hole (331) of the display (302). For example, the third array (373) and the first through hole (331) may be aligned with each other in a third direction (e.g., a Z-axis direction) that intersects a first direction (e.g., an X-axis direction) and a second direction (e.g., a Y-axis direction). According to one embodiment, a first direction length (e.g., horizontal length or X-axis direction length) of the third array (373) may be longer than a second direction length (e.g., vertical length or Y-axis direction length). For example, the first direction length (e.g., horizontal length or X-axis direction length) of the third array (373) may be a first designated length (e.g., X1 of FIG. 11). For example, the second direction length (e.g., vertical length or Y-axis direction length) of the third array (373) may be a second designated length (e.g., Y1 of FIG. 11).
[0128] According to one embodiment, the third array (373) may include a plurality of third optical elements (373a) spaced apart from each other in a first direction (e.g., horizontal direction or X-axis direction). According to one embodiment, the third optical elements (373a) may include light-receiving elements (e.g., photodiodes) for functioning as an illuminance sensor or a proximity sensor. For example, when the third array (373) functions as a proximity sensor, it may include light-receiving elements sensitive to light of different wavelength bands (e.g., light-receiving elements of the first channel (CH0) and the second channel (CH1) of FIGS. 8A and 8B). According to one embodiment, the third array (373) may include light-receiving elements (e.g., photodiodes) for functioning as a proximity sensor or a proximity sensor, and may be sensitive to light of an infrared wavelength (e.g., about 940 nm).
[0129] According to one embodiment, the first direction length (e.g., horizontal length or X-axis direction length) of the third optical elements (373a) of the third array (373) may be longer than the second direction length (e.g., vertical length or Y-axis direction length) of the third optical elements (373a). However, the number, arrangement, and shape of the third optical elements (373a) are not limited. For example, as long as the first direction length (e.g., horizontal length or X-axis direction length) of the third array (373) is formed to be longer than the second direction length (e.g., vertical length or Y-axis direction length), the number, arrangement, and shape of the third optical elements (373a) may be changed.
[0130] FIG. 12 is a drawing for explaining the operation of a sensor assembly (e.g., the sensor assembly (370) of FIGS. 6A to 6C and FIG. 11) in an independent mode. In the present disclosure, the “independent mode” of the sensor assembly (370) may mean a mode in which the first array (371) and the second array (372) are independently driven in a high-illuminance environment. According to one embodiment, the sensor assembly (370) may operate in an independent mode in a high-illuminance or high-brightness environment (e.g., outdoors under strong sunlight), and in the independent mode, a larger value between the illuminance value of the first array (371) and the illuminance value of the second array (372) may be calculated as the illuminance value.
[0131] According to one embodiment, the light sensor (e.g., the light sensor module (41) of FIG. 10) of the first array (371) and the second array (372) of the sensor assembly (370) can be configured. According to one embodiment, in the independent mode, the first array (371) (e.g., the first array (371) of FIG. 11) and the second array (372) (e.g., the second array (372) of FIG. 11) of the sensor assembly (370) can be driven independently of each other.
[0132] Referring to FIGS. 12 and 13 , according to one embodiment, the electronic device (101) can measure the illuminance of the surrounding environment using a first illuminance value (e.g., Lux0 of FIG. 12 ) measured by the first array (371) of the sensor assembly (370) or a second illuminance value (e.g., Lux1 of FIG. 12 ) measured by the second array (372). According to one embodiment, the application processor (e.g., the application processor (10) of FIG. 10 ) or the sensor hub processor (e.g., the sensor hub (20) of FIG. 10 ) can determine or adjust the luminance or brightness of the display (302) based on a larger value between the first illuminance value (Lux0) and the second illuminance value (Lux1). Referring to FIG. 13, for example, in the independent mode, a larger value among the first illuminance value (Lux0) measured by the first light-receiving element (371a) of the first array (371) of the sensor assembly (370) (e.g., CH0 of FIG. 8A) and the second illuminance value (Lux1) measured by the second optical element (372a) of the second array (372) (e.g., CH1 of FIG. 8A) can be used for illuminance measurement, thereby securing the field of view (FOV) of the sensor assembly (370). According to one embodiment, in the independent mode of the sensor assembly (370), since the illuminance value is calculated using the first array (371) or the second array (372), the area of the illuminance sensor can be relatively smaller than in the composite mode in which the illuminance value is calculated using the first array (371) and the second array (372), and thus, the sensor assembly (370) may be more suitable for a high-illuminance or high-brightness environment (e.g., outdoors with strong sunlight) than in the composite mode. According to one experimental example, in the independent mode (e.g., see FIG. 12), the influence of the optical noise of the scan line (311) of the display (302) on the first array (371) and the second array (372) can be reduced by about 74% or more compared to the existing structure.
[0133] FIGS. 14A and 14B are diagrams for explaining the operation of a sensor assembly (e.g., the sensor assembly (370) of FIGS. 6A to 6C and FIG. 11) in a composite mode. Referring to FIGS. 14A and 14B , according to one embodiment, the electronic device (101) can calculate the illuminance of the surrounding environment using the first array (371) (e.g., the first array (371) of FIG. 11 ) and the second array (372) (e.g., the second array (372) of FIG. 11 ) of the sensor assembly (370), and the calculated value can be referred to as a third illuminance value (e.g., Lux2 of FIGS. 14A and 14B ).
[0134] In the present disclosure, the "composite mode" of the sensor assembly (370) may refer to a mode in which the first array (371) and the second array (372) are operated in conjunction with each other in a high-illuminance environment. According to one embodiment, the sensor assembly (370) may operate in the composite mode in a relatively low-illuminance or low-brightness environment (e.g., a dark room), and in the composite mode, the illuminance value of the first array (371) and the illuminance value of the second array (372) may be calculated or derived.
[0135] According to one embodiment, in the composite mode, the first array (371) and the second array (372) of the sensor assembly (370) are time-differentially AD ) can be driven. For example, the first array (371) and the second array (372) can receive optical noise by the scan line (311) of different displays (302). For example, the first array (371) and the second array (372) can be driven by a time difference (t AD ) are driven, the driving timing of the first array (371) and the second array (372) can be adjusted so that the first array (371) and the second array (372) are not driven simultaneously with the different scanning lines (311) that are affected by each other. Accordingly, the first array (371) and the second array (372) have a time difference (t AD) is driven, the influence of optical noise caused by the scan line (311) of the display (302) on the first array (371) and the second array (372) can be reduced compared to the case where they are driven simultaneously. According to an experimental example, in the composite mode (e.g., see FIG. 14a), the influence of optical noise of the scan line (311) of the display (302) on the first array (371) and the second array (372) can be reduced by about 28% or more compared to the existing structure.
[0136] According to one embodiment, in the composite mode of the sensor assembly (370), since the illuminance value is calculated using the first array (371) and the second array (372), the area of the illuminance sensor is relatively larger than in the above-described independent mode in which the illuminance value is calculated using the first array (371) or the second array (372), and thus, the sensor assembly (370) may be more suitable for low-illuminance or low-brightness environments (e.g., dark rooms) than in the independent mode. Referring to FIG. 14B, in a low-illuminance environment, the display (302) darkens, and thus the deactivation (or off) period of the display (302) may increase. In this case, in the composite mode, the exposure time (t) of the light-receiving elements of the first array (371) and the second array (372) IT ) can be increased to improve or secure the sensitivity of the light sensor. Referring to FIG. 14b, according to one embodiment, in the composite mode, the exposure time (t in FIG. 12) of the light-receiving elements of the first array (371) and the second array (372) is IT ) is the exposure time of the independent mode (t in Fig. 12 ITT ) is twice as much as (2*t in Fig. 14b) IT ) can be increased.
[0137] FIG. 15 may illustrate an electronic device (101) according to one embodiment of the present disclosure (e.g., the electronic device (101) of FIGS. 1 to 5) tilted vertically by about -45 degrees or about +45 degrees, or tilted left and right by about -45 degrees or about +45 degrees. Here, tilting the electronic device (101) vertically may refer to a state in which the electronic device (101) is rotated with the X-axis of FIGS. 2 to 5 as the rotation axis, and tilting left and right may refer to a state in which the electronic device (101) is rotated with the Y-axis of FIGS. 2 to 5 as the rotation axis. Table 1 below can show changes in the amount of light received by the first array (371) and the second array (372) of the sensor assembly (370) when the electronic device (101) of FIG. 15 is tilted up and down or left and right by about -45 degrees or about +45 degrees, compared to a state in which the electronic device (101) is not tilted (0 degrees), which is a comparative example.
[0138] Layout of the light receiving elementDirect lightVertical tiltLeft and right tilt0 degrees+45 degrees tilt-45 degrees tilt+45 degrees tilt-45 degrees tiltConventionalSingle100%34%36%38%36%Independent mode1st array100%95%0%38%41%2nd array100%0%84%40%38%Composite mode(1*IT)1st array+2nd array100%46%43%39%40%
[0139] In Table 1, when the electronic device (101) is not tilted (direct light in Table 1), the light received by the 'conventional' light-receiving element or the light-receiving elements of the independent first array (371) and / or second array (372) according to the embodiment of the present disclosure (e.g., light-receiving elements 371a, 372a, 373a in FIG. 10) may be 100%. In Table 1, the 'conventional' sensor assembly may include a single light-receiving element (e.g., a photodiode), and when tilted up and down or left and right by about -45 degrees or about +45 degrees, the light received by the light-receiving element may be reduced by about 34% to about 38% compared to when the electronic device is not tilted (e.g., direct light). According to one embodiment of the present disclosure, when the electronic device (101) is tilted up and down or left and right by about -45 degrees or about +45 degrees in the independent mode, the light received by the light receiving elements of the first array (371) and / or the second array (372) (e.g., the light receiving elements (371a, 372a, 373a) of FIG. 10) can be improved by up to about 95%, which is more than twice the field of view performance compared to a 'conventional' sensor assembly. According to one embodiment of the present disclosure, when the electronic device (101) is tilted up and down or left and right by about -45 degrees or about +45 degrees in the composite mode, the light received by the light-receiving elements (371a, 372a, 373a) of the first array (371) and / or the second array (372) may increase compared to the 'existing' sensor assembly, and the field of view performance may be improved. FIG. 16 is a flowchart for explaining a method of driving the sensor assembly (370) in the independent mode of FIG. 12 or the composite mode of FIGS. 14a and 14b using the application processor (10), the sensor hub processor (20), the DDI (30), and the sensor module (40) according to the embodiment of FIG. 10.
[0140] Referring to FIG. 16, when a light sensor (e.g., the first array (371), the second array (372) and / or the third array (373) of FIG. 10 and the light sensor module (41) of FIG. 11) is operated (51), it can enter a short mode (52). A sensor hub processor (e.g., the sensor hub processor (20) of FIG. 11) detects the brightness of the display (53), and the current brightness is stored in advance as a threshold brightness (THD). BR ) can be compared with (54). The current luminance is the threshold luminance (THD BR ) is greater than the threshold brightness (THD), the sensor hub processor (20) may determine or command the display (302) to enter the independent mode (55) by determining that the display (302) has insufficient time for being inactive (or off). The current brightness is greater than the threshold brightness (THD BR ) is lower than, the sensor hub processor (20) may determine or command to enter the composite mode (57) by determining that the display (302) has been inactive (or off) for a sufficient period. After entering the independent mode or composite mode, the sensor hub processor (20) may store the pre-stored setting value (t IT , t P , t AD) can be set by commanding the light sensor (e.g., the first array (371), the second array (372) and / or the third array (373) of FIG. 10 and the light sensor module (41) of FIG. 11) to set the setting (56 or 58), and the light sensor can sense the light and output the measurement value as a digital signal (or ADC) (59). The sensor hub processor (20) determines whether the current mode is a composite mode (60), and if not, calculates the first illuminance value (Lux0) and the second illuminance value (Lux1) of the first array (371) (61), compares the first illuminance value (Lux0) and the second illuminance value (Lux1) with each other (62), and if the first illuminance value (Lux0) is greater than the second illuminance value (Lux1), determines the first illuminance value (Lux0) as the final illuminance value (63), and if the first illuminance value (Lux0) is not greater than the second illuminance value (Lux1), determines the second illuminance value (Lux1) as the final illuminance value (64). The sensor hub processor (20) can determine whether the current mode is a composite mode (60), and if so (61), calculate the third illuminance value (Lux2) measured using the first array (371) and the second array (372) (62). The application processor (10) or the DDI (30) can adjust the luminance or brightness of the display (302) based on the final illuminance value (e.g., the first illuminance value (Lux0), the second illuminance value (Lux1), or the third illuminance value (Lux2)).
[0141] The problem to be solved in this disclosure may be determined in various ways without departing from the spirit and scope of this disclosure. The effects that can be obtained from this disclosure are not limited to the effects mentioned above, and various effects that can be directly or indirectly understood through this document may be provided. The sensor assembly of this disclosure described above and the electronic device including the same are not limited to the above-described embodiments and drawings, and it will be apparent to those skilled in the art that various substitutions, modifications, and changes are possible within the technical scope of this disclosure.
[0142] While this disclosure has been described by way of example and example, it should be understood that the specific embodiment is intended to be illustrative and not limiting. It will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the overall scope of this disclosure, including the appended claims and their equivalents.
[0143] According to one embodiment of the present disclosure, an electronic device (101) may be provided. The electronic device may include a display (302) including a display panel (310), a sensor assembly (370) disposed facing a back surface of the display panel, and at least one processor (120; 10; 20) electrically connected to the display and the sensor assembly. The display panel may include a plurality of scan lines (311a) including a plurality of pixels arranged in a first direction. The scan lines may be spaced apart from each other in a second direction intersecting the first direction. The sensor assembly may include a first array (371) including a plurality of first optical elements (371a) arranged in a first direction, and a second array (372) spaced apart from the first array in the second direction. The second array may include a plurality of second optical elements (372a) arranged in a first direction. When the display is viewed from above, the first array and the second array may not overlap with the scan lines or may overlap with a specified number or less of the scan lines.
[0144] According to one embodiment, the display further includes a support structure (330) disposed on the back surface of the display panel and spaced apart from the sensor assembly, wherein the support structure may include a first through hole (331) that at least partially faces the sensor assembly.
[0145] According to one embodiment, the first direction lengths of the first array and the second array are a first designated length, and the first designated length may be greater than the diameter of the first through hole.
[0146] In one embodiment, the specified number may be 2 or less.
[0147] According to one embodiment, the sensor assembly may be configured to measure illumination of an external environment of the electronic device using at least a portion of the first array or the second array.
[0148] According to one embodiment, the sensor assembly may be configured to be switchable between an independent mode in which the first array and the second array are independently driven, or a composite mode in which the first array and the second array are driven in conjunction.
[0149] In one embodiment, the at least one processor may be configured to change the brightness of the display, in the standalone mode, based on a greater value of a first illuminance value measured by the first array or a second illuminance value measured by the second array.
[0150] In one embodiment, the at least one processor may be configured to change the brightness of the display based on a third illuminance value calculated using the first illuminance value measured by the first array or the second illuminance value measured by the second array, in the composite mode.
[0151] According to one embodiment, in the composite mode, the first array and the second array can be driven with a time difference.
[0152] According to one embodiment, the exposure time (integration time) of the first array and the second array in the composite mode may be at least twice the exposure time of the first array and the second array in the independent mode.
[0153] In one embodiment, the sensor assembly may further include a third array disposed between the first array and the second array, the third array including a plurality of third optical elements arranged in series in the first direction.
[0154] According to one embodiment, the sensor assembly may be configured to perform at least one of measuring illumination of an external environment of the electronic device or detecting a position of an external object of the electronic device using the third array.
[0155] According to one embodiment, the third array can be aligned with the first through hole in a third direction intersecting the first direction and the second direction.
[0156] According to one embodiment, the first optical elements may include first light-receiving elements, and the second optical elements may include second light-receiving elements sensitive to light of a different wavelength band from the first light-receiving elements.
[0157] According to one embodiment of the present disclosure, a sensor assembly (370) may be provided. The sensor assembly may include a first array (371) including a plurality of first optical elements (371a) arranged in series in the first direction, and a second array (372) spaced apart from the first array in the second direction, the second array including a plurality of second optical elements (372a) arranged in series in the first direction. At least some of the first optical elements or the second optical elements may be configured to detect light incident on the sensor assembly.
[0158] According to one embodiment, the sensor assembly may be configured to measure illumination of an external environment using at least some of the first optical elements or the second optical elements.
[0159] According to one embodiment, the sensor assembly may be configured to detect a position of an external object using at least some of the first optical elements or the second optical elements.
[0160] According to one embodiment, the sensor assembly may be configured to be switchable between an independent mode in which the first array and the second array are independently driven, or a composite mode in which the first array and the second array are driven in conjunction.
[0161] According to one embodiment, the first optical elements may include first light-receiving elements, and the second optical elements may include second light-receiving elements sensitive to light of a different wavelength band from the first light-receiving elements.
[0162] According to one embodiment, the device further comprises a third array disposed between the first array and the second array, wherein the third array may include a plurality of third optical elements arranged in series in the first direction.
[0163] According to one embodiment, the third optical elements may include light-receiving elements for detecting the illuminance of an external environment of the sensor assembly or the position of an external object of the sensor assembly.
[0164] An electronic device according to an embodiment disclosed in this document may take various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device according to an embodiment of this document is not limited to the aforementioned devices.
[0165] It should be understood that the embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to a specific embodiment, but include various modifications, equivalents, or substitutes of the embodiment. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the item, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.
[0166] The term "module" used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).
[0167] An embodiment of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.
[0168] According to one embodiment, the method according to one embodiment disclosed in the present document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.
[0169] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to one embodiment, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.
Claims
1. In an electronic device (101), A display (302) including a display panel (310); A sensor assembly (370) positioned facing the back surface of the above display panel; and At least one processor (120; 10; 20) electrically connected to the display and the sensor assembly, The display panel includes a plurality of scan lines (311a) including a plurality of pixels arranged in a first direction, the scan lines being spaced apart from each other in a second direction intersecting the first direction, The above sensor assembly, A first array (371) including a plurality of first optical elements (371a) arranged in series in the first direction; A second array (372) spaced apart from the first array in the second direction, comprising a second array including a plurality of second optical elements (372a) continuously arranged in the first direction, An electronic device, wherein when the display is viewed from above, the first array and the second array do not overlap with the scan lines or overlap with a specified number or less of the scan lines.
2. In paragraph 1, An electronic device, wherein the display further includes a support structure (330) disposed on the back surface of the display panel and spaced apart from the sensor assembly, the support structure including a first through hole (331) at least partially facing the sensor assembly.
3. In paragraph 2, An electronic device, wherein the first direction lengths of the first array and the second array are first designated lengths, and the first designated length is larger than the diameter of the first through hole.
4. In any one of paragraphs 1 to 3, An electronic device, the above specified number of which is 2 or less.
5. In any one of paragraphs 1 to 4, An electronic device, wherein the sensor assembly is configured to measure illumination of an external environment of the electronic device using at least some of the first optical elements or the second optical elements.
6. In any one of paragraphs 1 to 5, An electronic device wherein the sensor assembly is configured to be switchable between an independent mode in which the first array and the second array are independently driven or a composite mode in which the first array and the second array are coupled and driven.
7. In paragraph 6, An electronic device wherein said at least one processor is configured to change the brightness of the display based on a greater value of a first illuminance value measured by the first array or a second illuminance value measured by the second array, in said standalone mode.
8. In paragraph 6 or 7, An electronic device wherein said at least one processor is configured to change the brightness of the display based on a third illuminance value calculated using the first illuminance value measured by the first array or the second illuminance value measured by the second array, in the composite mode.
9. In any one of paragraphs 6 to 8, An electronic device in which the first array and the second array are driven with a time difference in the above composite mode.
10. In any one of paragraphs 6 to 9, The light exposure time (t) of the first array and the second array in the above composite mode IT ) is an electronic device having a light exposure time of at least twice that of the first array and the second array when in the independent mode.
11. In any one of paragraphs 1 to 10, An electronic device wherein the sensor assembly further comprises a third array disposed between the first array and the second array, the third array comprising a plurality of third optical elements arranged sequentially in the first direction.
12. In paragraph 11, An electronic device, wherein the sensor assembly is configured to perform at least one of measuring illumination of an external environment of the electronic device or detecting a position of an external object of the electronic device using at least some of the third optical elements.
13. In clause 11 or 12, An electronic device wherein the third array is aligned in a third direction intersecting the first through hole and the first direction and the second direction.
14. In any one of paragraphs 1 to 13, An electronic device, wherein the first optical elements include first photodetectors, and the second optical elements include second photodetectors sensitive to light of a wavelength in a different band than the first photodetectors.
15. In the sensor assembly (370), A first array (371) including a plurality of first optical elements (371a) arranged in a continuous manner in the first direction; and A second array (372) spaced apart from the first array in the second direction, comprising a second array including a plurality of second optical elements (372a) continuously arranged in the first direction, A sensor assembly, wherein at least some of the first optical elements or the second optical elements are configured to detect light incident on the sensor assembly.
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