Peeling method and peeling system for metal foil

Abstract

Provided are a peeling method and peeling system for a metal foil, which relate to the field of materials. The peeling method comprises: obtaining a substrate, the substrate comprising a substrate body and a transition layer, the transition layer covering a part of the surface of the substrate body, and the transition layer being detachably connected to the substrate body or the transition layer being a two-dimensional conductive material formed on the substrate body; growing a metal film on the surface of the substrate, the metal film comprising a first metal film grown on the surface of the transition layer and a second metal film integrally formed with the first metal film and grown on the surface of the substrate body; and starting a peeling treatment using the transition layer as a peeling interface, so that the peeled first metal film drives the second metal film to be peeled from the substrate body to obtain the metal foil. According to the method, a metal foil which is difficult to peel in the related art can be peeled from a substrate, thereby reducing the difficulty of peeling.

Description

Metal foil peeling method and peeling system CROSS-REFERENCE TO RELATED APPLICATIONS This application claims priority to Chinese patent application number 202311200882.1, filed with the State Intellectual Property Office of China on September 15, 2023, and entitled “Method and system for stripping of metal foil”, the entire contents of which are incorporated by reference into this application. Technical Field The present application relates to the field of materials, and in particular, to a metal foil stripping method and a stripping system. Background Art Metals are divided into single crystal and polycrystalline. Compared with polycrystalline metals, single crystal metals can better reflect the intrinsic properties of materials. For example, single crystal metals have higher thermal conductivity, ductility, electrical conductivity, creep resistance, etc. The excellent properties of single crystal metals make them not only of great value in scientific research, but also widely used in industrial production. In the related art, the Czochralski method or the dry pot descent method can be used to prepare ingot single crystal metals, such as single crystal copper, single crystal gold, single crystal silver, single crystal aluminum, etc. The directional solidification method can be used to manufacture single crystals with special contours, such as single crystal blades required for gas turbine engines and aircraft engines with thermal shock resistance, long fatigue life, and high creep resistance. The method of abnormal grain growth can be used to prepare single crystal metal foils, such as single crystal copper foil, single crystal nickel foil, single crystal platinum foil, single crystal palladium foil, etc. The above methods all have a common feature, that is, the metal needs to be treated at high temperature near the melting point before it can be transformed into a single crystal. This leads to complex single crystal metal manufacturing processes and high production costs. Based on this situation, the invention of a technology for preparing single crystal metals at room temperature not only has important scientific significance, but also has important industrial application value. Taking a single crystal metal as a substrate, using the electroplating method, electro-depositing a metal with the same element as the substrate, or electro-depositing a metal element with a small difference in lattice constant from the substrate, an epitaxial single crystal electroplating layer can be prepared, and single crystal metal can be prepared at room temperature. For example, an epitaxial single crystal copper plating layer is electroplated on single crystal copper, and an epitaxial single crystal nickel plating layer is electroplated on single crystal nickel. According to the basic principle of electroplating, it can be known that the electroplating layer is formed on a single crystal metal substrate in the form of atoms. Since the electrodeposited atoms have the same or similar lattice constant as the substrate, the electroplating layer and the single crystal substrate are seamlessly combined at the atomic level, and a metal bond is formed. This results in a very strong bonding force between the electroplating layer and the substrate. At present, there is no effective method to directly peel off the single crystal metal foil from the single crystal substrate. Since the single crystal metal foil cannot be peeled off from the single crystal substrate, when we use the electroplating method to prepare single crystal metal, the single crystal metal substrate can only be used once and cannot be reused, which greatly increases the manufacturing cost of single crystal metal. In addition, when the metal substrate is polycrystalline, when electroplating an element that is the same as the substrate element or has a smaller lattice mismatch, due to the correlation of the crystal structure, a metal bond can also be formed at the interface between the substrate metal and the electrodeposited metal film. Therefore, there is also the problem that the electroplated metal film is difficult to peel off. Summary of the invention The present application provides a metal foil stripping method and a stripping system, which can strip the metal foil that is difficult to strip from a substrate in the related art, is easy to operate, and the substrate can be reused, thereby reducing the manufacturing cost of the metal foil. Some embodiments of the present application provide a method for stripping a metal foil, which may include: A substrate is obtained, wherein the substrate may include a substrate body and a transition layer, wherein the transition layer may cover a portion of the surface of the substrate body, wherein the transition layer is detachably connected to the substrate body or the transition layer is a two-dimensional conductive material formed on the substrate body; a metal film is grown on the surface of the substrate, wherein the metal film may include a first metal film grown on the surface of the transition layer, and a second metal film integrally formed with the first metal film and grown on the surface of the substrate body; a stripping process is started with the transition layer as a stripping interface, so that the stripped first metal film drives the second metal film to be stripped from the substrate body, thereby obtaining a metal foil. The metal foil stripping method provided in the present application can strip the second metal film from the substrate body regardless of whether the lattice constants of the substrate body and the second metal film formed on the substrate body are very different, thereby stripping the difficult-to-strip metal foil from the substrate in the related art, and the operation is easy. In some embodiments, the first metal film and the second metal film may have the same composition. In some embodiments, the metal film growth method may include electroplating, magnetron sputtering, molecular beam epitaxy, or molecular evaporation deposition. Optionally, the transition layer is electrically connected to the substrate body, and the metal film growth method may include: growing the metal film on the surface of the substrate by electroplating. In some embodiments, the surface of the substrate body may be a single crystal metal, the metal film may be a single crystal metal film, and the crystal plane index of the single crystal metal film is consistent with that of the single crystal metal substrate. Optionally, the metal film has the same composition as the single crystal metal; or, the lattice mismatch between the metal film and the single crystal metal is within 10%. Alternatively, the lattice-mismatched metal thin film and the single crystal metal may be copper and nickel, respectively. Optionally, the composition of the metal film may include at least one of copper, aluminum, nickel, gold, silver, platinum, palladium, iron, zinc, cobalt, manganese and alloys. In some embodiments, the surface of the substrate body can be made of single crystal metal in the following manner: the substrate body is made of single crystal metal, or the substrate body can include a conductive core and a surface layer coated on the surface of the conductive core, and the surface layer is made of single crystal metal. In some embodiments, the transition layer is detachably connected to the substrate body, and the stripping process may include: stripping the transition layer from the substrate body to obtain a stripped first metal film. Optionally, the stripping method may include: starting the stripping process when the thickness of the metal film is greater than or equal to 0.1 μm, and optionally 3 μm-5 mm. Some other embodiments of the present application provide a metal foil stripping system for implementing the above-mentioned stripping method, which may include: The invention comprises a substrate, a generating mechanism and a stripping mechanism; the generating mechanism is used to grow a metal film on the surface of the substrate, and the metal film may include a first metal film grown on the surface of a transition layer, and a second metal film integrally formed with the first metal film and grown on the surface of the substrate body; the stripping mechanism can be configured to start the stripping process with the transition layer as a stripping interface, so that the stripped first metal film drives the second metal film to be stripped from the substrate body. The metal foil peeling system provided in the present application can peel the second metal film from the substrate body regardless of whether the lattice constants of the substrate body and the second metal film formed on the substrate body are very different, and can peel the difficult-to-peel metal foil from the substrate in the related art, and the operation is easy. In some embodiments, the generating mechanism may be an electroplating mechanism, which may include a tank body, in which the substrate serving as the cathode of the electroplating mechanism may be disposed, the transition layer is electrically connected to the substrate body, and the tank body is used to store an electrolyte containing dissolved plating metal. Optionally, the base body is cylindrical, and the base body is rotatably disposed in the slot body around its axis. Optionally, the transition layer may be disposed on a side wall of the substrate body and extend along an axis of the substrate body. In some embodiments, the surface of the substrate body may be a single crystal metal. In some embodiments, the two-dimensional conductive material may include graphene or a transition metal chalcogenide. In some embodiments, the transition layer is detachably disposed on the substrate body, and the transition layer may include at least one of a conductive copper tape and a conductive aluminum tape. In some embodiments, the stripping system may further include a polishing mechanism, and the polishing mechanism may be configured to perform a polishing operation on the substrate body from which the metal film is stripped without changing the surface single crystallinity and crystal plane index. In some embodiments, the stripping system may further include a pickling mechanism, which may be configured to pickle the stripped metal foil to remove impurities on the surface of the stripped metal foil. The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Moreover, the same reference numerals are used throughout the drawings to represent the same components. In the drawings: FIG1 is a schematic structural diagram of a metal foil stripping system provided in Example 1 of the present application; FIG2 is a schematic diagram of the structure of a substrate provided in Example 1 of the present application; FIG3 is an XRD diagram of a single crystal substrate provided in Example 2 of the present application; FIG4 is an EBSD image of a single crystal substrate provided in Example 2 of the present application; FIG5 is an XRD diagram of the electroplated single crystal copper foil in contact with the substrate body provided in Example 2 of the present application; FIG6 is an EBSD image of the electroplated single crystal copper foil in contact with the substrate body provided in Example 2 of the present application; FIG7 is an XRD diagram of the electroplated polycrystalline copper foil on the copper tape provided in Example 2 of the present application; FIG8 is an EBSD image of the electroplated polycrystalline copper foil on the copper tape provided in Example 2 of the present application. The accompanying drawings are numeraled as follows: 1000-stripping system; 10-electrolyte feeding mechanism; 11-electroplating mechanism; 111-tank body; 112-anode; 113-substrate; 114-substrate body; 115-transition layer; 12-stripping mechanism; 13-pickling mechanism; 14-washing mechanism; 15-squeezing roller; 16-drying mechanism; 17-winding mechanism; 18-spraying mechanism; 19-polishing mechanism; 20-metal foil. DETAILED DESCRIPTION The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions. In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined. In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces). In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application. In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances. In addition to electroplating, metal films can be prepared on substrates by molecular beam epitaxy, magnetron sputtering, evaporation coating and other methods. Take electroplating as an example, where electroplating refers to the preparation of a coating as a metal film on a substrate by the principle of electrolysis. The metal foil can be obtained by peeling the metal film from the substrate. During the electroplating process, when the electrodeposited atoms (plating metal) have the same or similar lattice constant as the substrate, the metal film and the substrate body are seamlessly combined at the atomic level, forming a metal bond. This results in a very strong bond between the metal film and the substrate body. At present, there is no effective method to directly peel off a metal film with the same lattice constant as the substrate or with a smaller lattice mismatch from the substrate. Therefore, the lattice constants of the substrate and the metal film in the related technology are very different, which makes it easier to peel the two off. Therefore, it is difficult to provide a method with strong universality that can peel the difficult-to-peel metal foil from the substrate in the related art. The present application at least solves the above difficulties. The present application provides a method for stripping a metal foil, which may include: A substrate is obtained, and the substrate may include a substrate body and a transition layer, wherein the transition layer covers a portion of the surface of the substrate body, and the transition layer is detachably connected to the substrate body, or the transition layer is a two-dimensional conductive material formed on the substrate body. A metal film is grown on the surface of the substrate, and the metal film may include a first metal film grown on the surface of the transition layer, and a second metal film integrally formed with the first metal film and grown on the surface of the substrate body. The stripping process is started with the transition layer as a stripping interface, so that the stripped first metal film drives the second metal film to be stripped from the substrate body to obtain a metal foil. It can be understood that the first metal film and the second metal film have the same composition. Since the transition layer covers part of the surface of the main body, the first metal film and the second metal film can be integrally formed, and the transition layer is detachably connected to the main body or the transition layer is non-metallic, so the peeling process can be started with the transition layer as a peeling interface, which makes it easy to peel the first metal film from the main body, thereby utilizing the peeled first metal film to drive the second metal film to be peeled from the base body. The metal foil stripping method provided in the present application can strip the second metal film from the substrate body regardless of whether the lattice constants of the substrate body and the second metal film formed on the substrate body are very different, thereby stripping the difficult-to-strip metal foil from the substrate in the related art, and the operation is easy. It should be noted that the peeling process of the metal foil is usually carried out at room temperature, which is beneficial to reducing the manufacturing cost of the metal foil. In some embodiments, the metal film growth method may include electroplating, magnetron sputtering, molecular beam epitaxy, or molecular evaporation deposition. In some embodiments, the transition layer is electrically connected to the substrate body, and the method for preparing the metal film may include: growing the metal film on the surface of the substrate by electroplating. During the electroplating process, the plated metal or other insoluble conductive material is used as the anode, the substrate is used as the cathode, and the solution containing the metal cations of the plated layer (that is, the metal film) is used as the electrolyte. The cations of the plated metal are reduced on the surface of the substrate by electrochemical means to form a uniform and firm electroplated layer (that is, the metal film). In this application, the first metal film and the second metal film are made of the same material. Since the first metal film is formed on the surface of the transition layer, its crystallinity is unlimited. Since the second metal film is in direct contact with the substrate body, when the substrate is a single crystal metal, the second metal film that is consistent with the out-of-plane crystal orientation of the single crystal metal can be obtained by electroplating an element that is the same as the single crystal metal element, or an element with a smaller lattice mismatch, or a metal element that forms an epitaxial relationship with the single crystal metal. Therefore, the outer crystal orientation of the metal foil obtained after peeling off the second metal film is consistent with the out-of-plane crystal orientation of the single crystal metal base, which is conducive to subsequent development and application. The electrolyte is a common industrial electroplating metal electrolyte. Taking the coating of copper as an example, aqueous solutions of sulfuric acid and copper sulfate can be used as the electrolyte; taking the coating of nickel as an example, aqueous solutions of nickel sulfate, nickel chloride, and nickel borate can be used as the electrolyte; other electrolytes that can be electroplated metals can also be used. Among them, there is no strict restriction on the concentration of sulfuric acid, copper sulfate, nickel sulfate, nickel chloride, and nickel borate, and copper and nickel can be electroplated normally. Similarly, there is no strict restriction on the current density during electroplating, and it can be adjusted according to actual production needs. Since the transition layer is electrically connected to the body, a first metal film can be formed on the surface of the transition layer during the electroplating process. The metal foil is prepared by electroplating, which has low production cost and high production efficiency. In some embodiments, the surface of the substrate body may be a single crystal metal, and the metal film may be a single crystal metal film. The surface of the substrate body being single crystal metal may include but is not limited to: the substrate body is made of single crystal metal, or the substrate body may include a conductive core and a surface layer coated on the surface of the conductive core, wherein the surface layer is made of single crystal metal. The above-mentioned stripping method can realize the preparation of single crystal metal foil. Not only the stripped metal foil maintains single crystal properties, but also the single crystal metal substrate can be reused. The process is simple and the production cost is low. Among them, the crystal plane index of the single crystal metal foil can be selected according to actual needs, and may include but is not limited to (100), (110), (111), (112), (113), (122), (124), (133), (223), (233), (236), (255), (256), (335), (345), (346), (355) and other crystal planes. Optionally, the metal film and the single crystal metal have the same element, or the lattice mismatch between the metal film and the single crystal metal is within 10%. Both of the above-mentioned two arrangements can form an epitaxial relationship between the metal film and the single crystal metal, thereby obtaining a single crystal metal film. That is, the above-mentioned stripping method can not only strip the electroplated layer of the same quality from the substrate, but also strip the electroplated layer with similar lattice constants from the substrate, thereby effectively reducing the difficulty of preparation. Optionally, the metal film and the single crystal metal have different compositions, and the lattice mismatch between the metal film and the single crystal metal is within 5%, optionally within 2%, and further optionally within 1%. Optionally, the metal film and the single crystal metal with a small lattice mismatch are copper and nickel respectively. The epitaxy of the single crystal coating is achieved by using the coordination of copper and nickel. Optionally, the composition of the metal film may include but is not limited to at least one of copper, aluminum, nickel, gold, silver, platinum, palladium, iron, zinc, cobalt, manganese and alloys, and may also be other metals. In some embodiments, the transition layer is detachably connected to the substrate body, and the stripping process may include: stripping the transition layer from the substrate body to obtain a stripped first metal film. That is, when the transition layer is detachably connected to the base body, there is no need to peel off the first metal film from the transition layer. Instead, the transition layer is directly peeled off from the base body to separate the first metal film from the base body, which effectively reduces the peeling difficulty. In some embodiments, when the transition layer is a two-dimensional conductive material formed on the substrate body, the transition layer is used as a peeling interface to peel the first metal film from the two-dimensional conductive material. In some embodiments, the stripping method may include: starting the stripping process when the thickness of the metal film is greater than or equal to 0.1 μm, and optionally 3 μm-5 mm. That is, the thickness of the metal foil obtained by peeling is greater than or equal to 0.1μm, and can be selected as 3μm-5mm. When the thickness of the metal film is greater than or equal to 0.1μm, peeling begins, which is convenient for peeling the metal film from the substrate body and is conducive to ensuring the integrity of the metal foil after peeling. When the thickness of the metal film is 3μm-5mm, it is not only conducive to ensuring the integrity of the metal after peeling, but also conducive to the wide use of the peeled metal in scenarios such as scientific research and engineering applications. In addition, the peeled metal foil can be further processed before cutting according to application requirements, such as cleaning, polishing, etc., which are not limited here. The embodiment of the present application also provides a metal foil stripping system, which can be used to implement the above-mentioned metal foil stripping method. The metal foil stripping system may include a substrate, a generating device, and a stripping mechanism. The generating mechanism is used to grow a metal film on the surface of a substrate, and the metal film may include a first metal film grown on the surface of a transition layer, and a second metal film integrally formed with the first metal film and grown on the surface of a substrate body; the stripping mechanism may be configured to start a stripping process with the transition layer as a stripping interface, so that the stripped first metal film drives the second metal film to be stripped from the substrate body. Among them, the structure of the substrate is shown in the above-mentioned stripping method, and the generating mechanism can be selected according to the specific generating method. For example, when the metal film is generated by electroplating, the generating mechanism is an electroplating mechanism, which can be selected according to actual needs. The metal foil peeling system provided in the present application can peel the second metal film from the substrate body regardless of whether the lattice constants of the substrate body and the second metal film formed on the substrate body are very different, and can peel the difficult-to-peel metal foil from the substrate in the related art, and the operation is easy. In some embodiments, the generating mechanism may be an electroplating mechanism, which may include a tank body, in which the substrate serving as the cathode of the electroplating mechanism may be disposed, the transition layer is electrically connected to the substrate body, and the tank body is used to store an electrolyte containing dissolved plating metal ions. The stripping mechanism may be configured to start the stripping process with the transition layer as a stripping interface, so that the stripped first metal film drives the second metal film to be stripped from the substrate body to obtain a metal foil. The electroplating mechanism may include an anode. After power is applied, a closed current loop is formed between the anode, the cathode and the electrolyte. The anode is made of a plated metal or an insoluble conductive material, wherein the insoluble conductive material may include but is not limited to graphite, Titanium alloy, stainless steel, conductive plastic, conductive ceramic materials, etc., where the anode material can be changed according to different electrolytes. The electrolyte is a common industrial electroplating metal electrolyte. For example, when the coating is copper, aqueous solutions of sulfuric acid and copper sulfate can be used as the electrolyte; when the coating is nickel, aqueous solutions of nickel sulfate, nickel chloride, and nickel borate can be used as the electrolyte; other electrolytes that can be electroplated metals can also be used. There are no strict restrictions on the concentrations of sulfuric acid, copper sulfate, nickel sulfate, nickel chloride, and nickel borate, as long as they can be used for normal electroplating of copper and nickel. The transition layer is electrically connected to the main body, so that a first metal film can be formed on the surface of the transition layer through electroplating, and a second metal film integrally formed with the first metal film can be formed on the surface of the main body, so that the peeled first metal film can drive the second metal film to be peeled off from the substrate body. Among them, there is no strict restriction on the shape of the substrate body, including but not limited to strip, plate, cylindrical and other shapes. It can be understood that in order to facilitate subsequent peeling and ensure that the size of the metal foil is not affected, when the shape of the substrate body is strip or plate, etc., the transition layer can be set at any edge of the substrate body. In some embodiments, the substrate body is cylindrical and is rotatably arranged in the tank body around its axis. Through the above arrangement, it can cooperate with the stripping mechanism, and the body rotates during the stripping process to achieve continuous electroplating and stripping of the metal foil, thereby improving production efficiency. When the substrate body is cylindrical, in some embodiments, the transition layer can be arranged on the side wall of the substrate body and extend along the axis of the substrate body. The above arrangement is conducive to subsequent peeling to obtain a complete metal foil. In some embodiments, the surface of the substrate body may be a single crystal metal. When the above metal foil stripping method is performed using the substrate body surface being a single crystal metal, a single crystal metal film can be prepared by selecting a suitable coating metal. It is understandable that the width of the peeled metal foil is consistent with the axial width of the substrate body, the width of the metal foil is ≥1mm, for example, 1mm-5000mm, optionally 1mm-2000mm, and the length of the metal foil is ≥1mm, optionally 1mm to 100km. Optionally, the stripping system may further include: an electrolyte feeding mechanism, a pickling mechanism, a water washing mechanism, a water squeezing roller, a drying mechanism, a spraying mechanism and a winding mechanism. The electrolyte feeding mechanism is used to dissolve the plated metal into metal cations and configure it into an electrolyte. The electrolyte feeding mechanism is connected to the tank body through a reflux pipe to form a loop, so that the electrolyte is exchanged between the tank body and the electrolyte feeding mechanism, so that the cation concentration in the tank body is stable and the electroplating process is maintained stable. The pickling mechanism is used to pickle the stripped metal foil to remove impurities on the surface of the stripped metal foil. The water washing mechanism is used to wash the pickled metal foil to remove impurities introduced by pickling. The squeezing roller is used to squeeze the washed metal to remove surface moisture. The drying mechanism is used to dry the metal foil after removing surface moisture. The winding mechanism is used to wind and collect the stripped metal foil. In some embodiments, the two-dimensional conductive material may include graphene or transition metal chalcogenides. Graphene or transition metal chalcogenides have good conductivity and weak bonding force with the coating, which facilitates peeling off the first metal film. In some embodiments, the transition layer is detachably disposed on the substrate body, and the transition layer may include a conductive copper tape, a conductive At least one of aluminum tape. The detachable method may include but is not limited to sticking with conductive tape. In the actual processing process, if the transition layer is detachably disposed on the substrate body, adhesives and the like may remain on the surface of the body after the transition layer is removed. Therefore, in some embodiments, the stripping system may further include a polishing mechanism, and the polishing mechanism may be configured to perform a polishing operation on the substrate body from which the second metal film is stripped without changing the outer crystal orientation of the surface, thereby keeping the surface of the substrate body smooth. Since the polishing operation does not change the outer crystal orientation of the surface of the substrate body from which the second metal film is stripped, the electroplating continues after polishing without affecting the crystal orientation of the second metal film newly deposited on the surface of the substrate body. In some embodiments, the stripping system may further include a spray mechanism, wherein the spray mechanism has a spray head with the liquid outlet direction toward the main body, and the spray head is used to spray the solution onto the substrate to wash away the metal powder and the like adhering to the substrate, thereby ensuring that the surface of the substrate is clean, so as to prevent impurities on the substrate from nucleating during electroplating and avoiding affecting the quality of the metal foil. Example 1 Please refer to Figure 1, the metal foil stripping system 1000 may include: an electrolyte feeding mechanism 10, an electroplating mechanism 11, a stripping mechanism 12, a pickling mechanism 13, a water washing mechanism 14, a squeezing roller 15, a drying mechanism 16, a winding mechanism 17, a spraying mechanism 18 and a polishing mechanism 19. The electroplating mechanism 11 may include a tank body 111 , an anode 112 , and a substrate 113 serving as a cathode. The anode 112 and the substrate 113 can be arranged in the tank body 111, and the tank body 111 is used to store an electrolyte dissolved with a plating metal. The plating metal can include at least one of copper, aluminum, nickel, gold, silver, platinum, palladium, iron, zinc, cobalt, manganese and alloys. The substrate 113 may include a substrate body 114 and a transition layer 115 . The surface of the substrate body 114 can be a single crystal metal, wherein the single crystal metal on the surface of the substrate body 114 is the same as the plated metal; or, the plated metal is lattice mismatched with the single crystal metal on the surface of the substrate body 114 and the plated metal can epitaxially form a single crystal metal foil on the surface of the single crystal metal. The transition layer 115 covers a portion of the surface of the substrate body 114, the transition layer 115 is electrically connected to the substrate body 114, the transition layer 115 is detachably connected to the substrate body 114, or the transition layer 115 is a two-dimensional conductive material, and the two-dimensional conductive material may include graphene or transition metal sulfide formed on the surface of the substrate body 114. When the transition layer 115 is detachably connected to the substrate body 114, the transition layer 115 may include at least one of a conductive tape and a metal foil bonded to the substrate body 114. As shown in FIG. 1 and FIG. 2 , the base body 114 is cylindrical and is rotatably disposed in the groove body 111 around its axis. The transition layer 115 can be disposed on the side wall of the base body 114 and extends along the axis of the base body 114 . During electroplating, the plated metal can form a first metal film on the surface of the transition layer 115 and a second metal film integrally formed with the first metal film on the surface of the base body 114 . 1 , the stripping mechanism 12 can be configured to start the stripping process with the transition layer 115 as the stripping interface, and use the stripped first metal film to drive the second metal film to be stripped from the substrate body 114. The rate at which the stripping mechanism strips the metal foil 20 is not strictly limited, and it only needs to be able to maintain continuous production of the electroplated metal foil 20. The pickling mechanism 13 is used to pickle the stripped metal foil 20 to remove impurities on the surface of the stripped metal foil 20, the water washing mechanism 14 is used to wash the pickled metal foil 20 to remove impurities introduced by pickling, the water squeezing roller 15 is used to squeeze the washed metal roller to remove water, the drying mechanism 16 is used to dry and squeeze the metal foil 20 after removing water, and the winding mechanism 17 is used to wind and collect the stripped metal foil 20. The spray mechanism 18 has a spray head with the liquid outlet facing the body, and the spray head is used to spray the solution to the substrate body 114 to wash away the metal powder and the like adhered to the substrate body 114, so as to ensure that the surface of the substrate body 114 is clean, so as to prevent the impurities on the substrate body 114 from nucleating and plating during electroplating, and avoid affecting the quality of the metal foil 20. The polishing mechanism 19 can be configured to perform a polishing operation on the substrate body 114 from which the metal film is stripped without changing the external crystal orientation of the surface. Example 2 1) Buy a single crystal copper foil with a thickness of 100 μm and a crystal plane index of (111) from the market as a single crystal substrate, and cut it into a size of: length * width = 31.4 * 20 cm. Perform XRD scanning on the single crystal copper foil and the scanning mode is theta scan. The XRD results are shown in Figure 3. The out-of-plane crystal orientation of the single crystal substrate is

[0111] EBSD was performed on the single crystal copper foil, and the results are shown in FIG4 , where FIG4 is the inverse pole figures IPFZ and IPFY of EBSD, where the IPFZ figure is blue and the IPFY figure is green, that is, from IPFZ and IPFY, it can be seen that the copper foil is a single crystal with a crystal plane index of (111). 2) Prepare an acidic copper plating electrolyte, i.e., an aqueous solution of sulfuric acid and copper sulfate, wherein copper sulfate pentahydrate is 100-150 g / L and concentrated sulfuric acid is 50-100 g / L. 3) The single crystal copper foil was welded to a cathode roller with a diameter of 10 cm as the main body. 4) A transition layer is introduced on the surface of the single crystal copper foil of the main body. Here, the transition layer is made of copper tape. The copper tape is pasted in the following way: in the axial direction of the cathode roller, the copper tape is pasted on the single crystal copper foil, and the width of the copper tape is 2 cm. 5) Electroplating the cathode roller with copper tape. The thickness of the electroplated copper layer is 50 μm. During electroplating, the current density is 3 A / dm 2 . 6) The copper tape is peeled off from the body, thereby driving the electroplated copper foil directly formed on the surface of the body to be peeled off. During the peeling, the cathode roller rotates. There is no strict requirement for the rotation rate of the cathode roller, and it is sufficient to maintain the continuous production of electroplated copper foil with a thickness of 50μm. According to actual needs, the production time is adjusted to obtain electroplated copper foils of different lengths that are peeled off. 7) Perform XRD scanning on the peeled off electroplated single crystal copper foil with theta scan mode, and perform EBSD characterization on the electroplated single crystal copper foil. The XRD results show that the out-of-plane crystal orientation of the electroplated copper foil directly in contact with the body is

[0111] , as shown in Figure 5. As shown in Figure 6, the EBSD inverse pole figures IPFZ and IPFY, where the IPFZ figure is blue and the IPFY figure is green, the EBSD results show that the crystal plane index of the electroplated copper foil directly in contact with the body is (111), and the whole is a single crystal. The same characterization is performed on the electroplated copper foil plated on the copper tape. The XRD results show that the electroplated copper foil on the copper tape has an arbitrary crystal orientation. It is polycrystalline, as shown in Figure 7; EBSD results show that the crystal surface of the electroplated copper foil on the copper tape is messy and is polycrystalline, as shown in Figure 8. It can be seen that the use of the above-mentioned stripping system and method realizes the continuous production of electroplated single crystal copper foil. Example 3 1) Buy a single crystal nickel foil with a thickness of 100 μm and a crystal plane index of (122) from the market, and cut it into a size of: length*width=20*20 cm. 2) Prepare an electrolyte for nickel electroplating. Here, an aqueous solution of nickel sulfate, nickel chloride, and nickel borate is used as the electrolyte for nickel electroplating. The concentrations of nickel sulfate, nickel chloride, and nickel borate are not strictly limited, and they can be used for normal nickel electroplating. 3) The above single crystal nickel is used as a cathode to electroplate on one side thereof until the total thickness is 1 mm to form a nickel plate, and the electroplating rate is 10 μm / min. 4) The nickel plate has a first surface and a second surface opposite to each other, and the surface of the nickel plate that is not electroplated is used as the first surface, and a transition layer is introduced in the circumference of the first surface. The transition layer here is an aluminum tape, that is, a circle of aluminum tape is attached to the edge of the first surface of the nickel plate, and the width of the aluminum tape is 2 cm. 5) Single-sided electroplating is performed on the first side of the nickel plate, and no electroplating is performed on the second side. The thickness of the single-sided electroplating is 0.5 mm, and the electroplating rate is 1 μm / min. That is, the total thickness of the nickel plate after electroplating is 1.5 mm. 6) The aluminum tape is peeled off from the nickel plate, thereby driving the electroplated nickel layer formed on the first surface to be peeled off from the body. After the peeling is completed, an electroplated nickel layer with a length*width=20*20 cm is obtained. 7) The stripped electroplated nickel layer was characterized by XRD and EBSD. The results showed that the electroplated nickel layer directly in contact with the substrate was a single crystal with a crystal plane index of (122), and the electroplated nickel layer on the aluminum tape was polycrystalline. Thus, the stripped electroplated single crystal nickel layer was obtained, with a thickness of 500 μm and a size of: length * width = 16 * 16 cm. Example 4 1) Buy a 2 mm thick single crystal silver plate from the market, with the dimensions of length*width=1.5*1.5 cm and a crystal plane index of (110). 2) Prepare cyanide-free silver plating electrolyte. There is no strict limit on the electrolyte concentration, as long as it can be used for normal silver plating. 3) The single crystal silver plate has a first surface and a second surface opposite to each other, and a transition layer is introduced at the edge of the first surface. A conductive thin cloth tape is used as the transition layer, that is, a circle of conductive cloth tape is attached to the circumference of the first surface of the silver plate, and the width of the conductive cloth tape is 0.5 cm. 4) The first side of the single crystal silver plate is electroplated on one side, and the second side is not electroplated. The thickness of the single-sided electroplating is 1 mm, and the electroplating rate is 1 μm / min. That is, the total thickness of the silver plate after electroplating is 3 mm. 5) The conductive cloth tape is peeled off from the main body, thereby driving the electroplated silver layer formed on the first surface to be peeled off from the main body. After the peeling is completed, an electroplated silver layer with a length*width=1.5*1.5 cm is obtained. 6) XRD and EBSD characterization were performed on the peeled off electroplated silver layer. The results showed that the electroplated silver layer directly in contact with the body was a single crystal with a crystal plane index of (110), and the electroplated silver layer on the conductive cloth tape was polycrystalline. Electroplated single crystal silver foil, thickness 1mm, size: length * width = 0.5 * 0.5cm. In summary, the metal foil stripping method and stripping system provided in the present application can strip the difficult-to-strip metal foil from the substrate in the related art, is easy to operate, and the substrate can be reused, thereby improving the recycling rate of the substrate. Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims. Industrial Applicability The present application provides a stripping method and a stripping system for metal foil, which relate to the field of materials. The stripping method comprises: obtaining a substrate, the substrate comprising a substrate body and a transition layer, the transition layer covering a part of the surface of the substrate body, the transition layer being detachably connected to the substrate body or the transition layer being a two-dimensional conductive material formed on the substrate body; growing a metal film on the surface of the substrate, the metal film comprising a first metal film grown on the surface of the transition layer, and a second metal film integrally formed with the first metal film and grown on the surface of the substrate body; starting the stripping process with the transition layer as a stripping interface, so that the first metal film that has been stripped drives the second metal film to be stripped from the substrate body, and obtaining the metal foil. It can realize the stripping of the metal foil that is difficult to strip from the substrate in the related art, and reduce the stripping difficulty. In addition, it is understood that the metal foil stripping method and stripping system of the present application are reproducible and can be used in a variety of industrial applications. For example, the metal foil stripping method and stripping system of the present application can be used in the field of materials.

Claims

1. A method for stripping a metal foil, wherein: include: Obtaining a substrate, wherein the substrate comprises a substrate body and a transition layer, wherein the transition layer covers a portion of the surface of the substrate body, the transition layer is detachably connected to the substrate body, or the transition layer is a two-dimensional conductive material formed on the substrate body; Growing a metal film on the surface of the substrate, wherein the metal film includes a first metal film grown on the surface of the transition layer, and a second metal film integrally formed with the first metal film and grown on the surface of the substrate body; The stripping process is started with the transition layer as a stripping interface, so that the stripped first metal film drives the second metal film to be stripped from the base body to obtain a metal foil.

2. The stripping method according to claim 1, wherein: The first metal film and the second metal film have the same composition.

3. The stripping method according to claim 1 or 2, wherein: The metal film growth method includes electroplating, magnetron sputtering, molecular beam epitaxy or molecular evaporation deposition; Optionally, the transition layer is electrically connected to the substrate body, and the metal film growth method includes: growing the metal film on the surface of the substrate by electroplating.

4. The stripping method according to any one of claims 1 to 3, wherein: The surface of the substrate body is single crystal metal, and the second metal film is single crystal metal film; Optionally, the metal film has the same composition as the single crystal metal; or, the lattice mismatch between the metal film and the single crystal metal is within 10%; Optionally, the lattice-mismatched metal film and the single crystal metal are copper and nickel respectively; Optionally, the metal film comprises at least one of copper, aluminum, nickel, gold, silver, platinum, palladium, iron, zinc, cobalt, manganese and alloys.

5. The stripping method according to claim 4, wherein: The surface of the substrate body is made of single crystal metal in the following manner: the substrate body is made of single crystal metal, or the substrate body includes a conductive core and a surface layer covering the surface of the conductive core, and the surface layer is made of single crystal metal.

6. The stripping method according to any one of claims 1 to 5, wherein: The transition layer is detachably connected to the base body, and the stripping process includes: stripping the transition layer from the base body to obtain the stripped first metal film; Optionally, the stripping method comprises: when the thickness of the metal film is greater than or equal to 0.1 μm, and optionally 3 μm-5 mm, starting the stripping process.

7. A metal foil stripping system for implementing the stripping method according to any one of claims 1 to 6, comprising: the substrate; A generating mechanism, configured to grow a metal film on the surface of the substrate, wherein the metal film includes a first metal film grown on the surface of the transition layer, and a second metal film integrally formed with the first metal film and grown on the surface of the substrate body; as well as The peeling mechanism is configured to start a peeling process using the transition layer as a peeling interface, so that the peeled first metal film drives the second metal film to be peeled off from the substrate body.

8. The stripping system according to claim 7, wherein: The generating mechanism is an electroplating mechanism, the electroplating mechanism comprises a tank body, the substrate is arranged in the tank body as a cathode of the electroplating mechanism, the transition layer is electrically connected to the substrate body, and the tank body is used to store the electrolyte for electroplating the metal film; Optionally, the base body is cylindrical, and the base body is rotatably disposed in the slot body around its axis; Optionally, the transition layer is disposed on a side wall of the base body and extends along an axis of the base body.

9. The stripping system according to claim 7 or 8, wherein: The surface of the substrate body is single crystal metal.

10. The stripping system according to any one of claims 7 to 9, wherein: The two-dimensional conductive material includes graphene or transition metal chalcogenide.

11. The stripping system according to any one of claims 7 to 10, wherein: The transition layer is detachably arranged on the base body, and the transition layer includes at least one of a conductive copper tape and a conductive aluminum tape.

12. The stripping system according to any one of claims 7 to 11, wherein: The stripping system further comprises a polishing mechanism, which is configured to perform a polishing operation on the substrate body from which the metal film is stripped without changing the surface single crystallinity and crystal plane index.

13. The stripping system according to any one of claims 7 to 12, wherein: The stripping system further includes a pickling mechanism, which is configured to pickle the stripped metal foil to remove impurities on the surface of the stripped metal foil.

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