Inverter and photovoltaic power station

Abstract

The present application relates to the technical field of inverters and provides an inverter and a photovoltaic power station. The inverter comprises a metal shell and a circuit board, wherein the metal shell comprises a plurality of shells that are detachably connected, a mounting cavity is enclosed by the plurality of shells, and the circuit board is mounted in the mounting cavity; the metal shell has a configured plate body located on the configured side of a substrate of the circuit board in a first direction, and at least one outwardly-protruding protrusion structure and / or at least one inwardly-recessed recess structure are formed on the configured plate body, the first direction being consistent with the direction of thickness of the substrate; the protrusion structure is arranged corresponding to a first configured element of the circuit board to accommodate the corresponding first configured element, and the set height of the first configured element is greater than a first preset height; the recess structure is arranged corresponding to a first area of the circuit board, no elements are provided in the first area of the circuit board or a second configured element is provided therein, and the set height of the second configured element is less than a second preset height; and the set height is the height of the portion of the corresponding element located on the configured side.

Description

Inverter and photovoltaic power station

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on September 14, 2023, with application number 202322512287.3 and invention name “Inverter and Photovoltaic Power Station”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of inverters, and in particular to an inverter and a photovoltaic power station. Background Art

[0003] Inverters are widely used in power systems, such as photovoltaic power plants. They all face performance requirements such as waterproofing, salt spray resistance, heat dissipation, EMC (Electro Magnetic Compatibility) shielding, and grounding. Some technologies utilize a plastic housing with a circuit board installed inside. Glue is then applied between the housing and the circuit board to improve the inverter's waterproofing and salt spray resistance. However, this requires a large amount of glue, resulting in insufficient heat dissipation and the need for a separate heat sink bracket. This results in a complex inverter structure with many components and makes it difficult to ensure EMC shielding. Consequently, the inverter's performance needs to be improved.

[0004] Specifically, in microinverter technology, an inverter is connected to one or multiple PV modules, performing maximum power point tracking for each PV module. This converts the generated electrical energy directly into AC power, which is then consumed by AC loads or transmitted to the grid. If a single PV module malfunctions, only that one module is affected, while the remaining modules operate at optimal levels. This results in higher overall efficiency and greater power generation for the PV power plant. Microinverter technology requires a large number of inverters in PV power plants, and the performance of each inverter must be guaranteed. Therefore, improving inverter performance is particularly urgent for the widespread application of microinverter technology.

[0005] Summary of the Invention

[0006] This application aims to solve the problem of how to improve the performance of the inverter in the related art to a certain extent.

[0007] To at least partially address at least one aspect of the above-mentioned problems, in a first aspect, the present application provides an inverter, comprising a metal housing and a circuit board, wherein the metal housing comprises a plurality of detachably connected housings, the plurality of housings collectively forming an installation cavity, and the circuit board is installed in the installation cavity;

[0008] The metal shell has a setting plate body located on a setting side of the substrate of the circuit board along a first direction, the setting plate body being formed with at least one outwardly convex protrusion structure and / or at least one inwardly concave concave structure, wherein the first direction is consistent with the thickness direction of the substrate;

[0009] The raised structure is arranged corresponding to the first setting element of the circuit board to accommodate the corresponding first setting element, and the setting height of the first setting element is greater than the first preset height; the recessed structure is arranged corresponding to the first area of ​​the circuit board, and the circuit board has no elements or a second setting element arranged in the first area, and the setting height of the second setting element is less than the second preset height; wherein, the setting height is the height of the portion of the corresponding element located on the setting side.

[0010] Optionally, the setting plate body has a flat plate structure parallel to the substrate and located at the edge position, and the protruding structure is arranged to protrude outward relative to the flat plate structure; the substrate has a setting side wall adjacent to the flat plate structure, and the height between the setting side wall and the inner surface of the flat plate structure is a third preset height; the first preset height is less than or equal to the third preset height, and when the first preset height is less than the third preset height, the absolute value of the difference between the first preset height and the third preset height is less than or equal to the first preset difference; the second preset height is less than the third preset height.

[0011] Optionally, when the recessed structure is arranged adjacent to the flat plate structure, and the recessed structure is arranged corresponding to the second setting element, the absolute value of the difference between the second preset height and the third preset height is greater than or equal to the second preset difference;

[0012] When the recessed structure is spaced apart from the flat plate structure and the recessed structure is arranged corresponding to the second setting element, the absolute value of the difference between the second preset height and the third preset height is smaller than the second preset difference.

[0013] Optionally, the protruding structure includes a first setting portion arranged corresponding to the first setting element; the first setting portion includes a first plate body arranged opposite to the base plate, or at least a portion of the first setting portion is adapted to the shape of the first setting element;

[0014] The recessed structure includes a second setting portion arranged corresponding to the second setting element; the second setting portion includes a second plate body arranged opposite to the base plate, or at least a part of the second setting portion is adapted to the shape of the second setting element.

[0015] Optionally, when the minimum interval between two adjacent first setting elements on the circuit board is smaller than a first preset interval, the two adjacent first setting elements are accommodated in the same protruding structure;

[0016] And / or, when the set heights of adjacent second setting elements on the circuit board are all less than a fourth preset height, the corresponding recessed structure is formed with a second plate body arranged opposite to the substrate, the projection of the second plate body on the substrate covers the adjacent second setting elements, and the second plate body is arranged parallel to the substrate.

[0017] Optionally, the protruding structure includes a first plate body arranged opposite to the substrate;

[0018] When the absolute value of the difference between the set heights of the two adjacent first setting elements is less than or equal to a third preset difference, the projection of the same first plate on the substrate covers the two adjacent first setting elements;

[0019] When the absolute value of the difference between the set heights of the two adjacent first setting elements is greater than the third preset difference, the first plates are respectively provided corresponding to the two adjacent first setting elements, and the first plates are connected by a transition plate.

[0020] Optionally, the multiple shells include a top shell and a bottom shell distributed along the first direction; the bottom shell includes a bottom plate and a side panel, the side panel is connected to the bottom plate and forms a receiving cavity with an open opening, the circuit board is at least partially received in the receiving cavity, the top shell cover is arranged at the open opening and is detachably connected to the bottom shell; the bottom plate and / or the top shell are configured to form the setting plate body.

[0021] Optionally, the side panel is provided with a via hole, the via hole being configured to install an electrical connection line, the electrical connection line being connected to the circuit board;

[0022] And / or, a connection ear is provided on the top shell or the bottom shell, the connection ear is configured to achieve installation of the inverter, and a grounding connection structure configured to be grounded is provided on the connection ear.

[0023] Optionally, the via hole passes through the side panel along the first direction toward the side close to the top shell to form an opening, and the electrical connection wire is placed into the via hole through the opening and is engaged with the edge of the via hole to limit movement of the electrical connection wire along the depth direction of the via hole;

[0024] The grounding connection structure includes a column and a grounding connection hole. The column is arranged on the connection ear, and the grounding connection hole passes through the column and the connection ear.

[0025] Optionally, when the setting plate is formed with the convex structure and the concave structure, the second preset height is less than or equal to the first preset height.

[0026] In a second aspect, the present application provides a photovoltaic power station, comprising the inverter as described in the first aspect above.

[0027] Optionally, the photovoltaic power station further includes one or more photovoltaic components arranged and connected to the inverter. When the inverter is provided with a plurality of photovoltaic components, the inverter is connected to the plurality of corresponding photovoltaic components respectively.

[0028] Compared with the related traditional technology, in the inverter and photovoltaic power station of the present application, the outer shell of the inverter adopts a metal shell, which includes multiple shells that can be detachably connected. The multiple shells are used to form an installation cavity for installing a circuit board. When the circuit board is installed in the installation cavity, the metal shell enables the inverter to achieve relatively good heat conduction and heat dissipation effects, and can also provide EMC shielding for the circuit board. It is also convenient for grounding, realizing ground fault protection of the inverter, and improving the performance of the inverter. At the same time, the setting plate of the metal shell located on the setting side of the substrate along the first direction (i.e., the thickness direction of the substrate) is formed with at least one convex protrusion structure and / or at least one concave recessed structure. The protrusion structure can be used to accommodate the first setting element of the circuit board. The setting height of the first setting element (i.e., the height of the part located on the setting side of the substrate) is greater than the first preset height. The recessed structure is set corresponding to the first area of ​​the circuit board. The circuit board is not provided with an element in the first area or is provided with a second setting element. The setting height of the second setting element (i.e., the height of the part located on the setting side) is less than the second preset height; that is, the protrusion structure of the setting plate is used to form a relatively high setting height. The accommodation of the first setting element can avoid the setting plate body being set as a flat plate parallel to the substrate, which causes the setting plate body to be set as a whole and causes the spacing between the setting plate body and the substrate to be too large. This can also avoid the overall space occupied by the inverter being too large and the glue amount required for glue injection being too large when a metal shell is used. The concave structure of the setting plate body is used to make the inner surface of the setting plate body corresponding to the first area closer to the substrate, thereby further reducing the space occupied by the inverter in the first area and the glue amount required for glue injection, thereby reducing the overall glue amount required for glue injection of the inverter and the distance between the circuit board and the inner surface of the metal shell, saving glue injection costs, and reducing the thickness of the glue layer corresponding to the components on the circuit board to a certain extent, which is beneficial to improving the heat dissipation efficiency of the inverter. The inverter of the present application, by adopting a metal shell and structurally designing the metal shell, can meet the inverter's requirements for less glue injection, improved heat dissipation capacity and EMC shielding, and is also convenient for realizing ground protection functions. The number of components is small, which can improve the performance of the inverter. When the inverter is used in large quantities, such as in micro-inverter technology, its overall cost can be reduced to a certain extent, and it is highly practical. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] FIG1 is a schematic structural diagram of an inverter in accordance with an embodiment of the present application;

[0030] FIG2 is a schematic diagram of an exploded structure of an inverter in Embodiment 1 of the present application;

[0031] FIG3 is a schematic structural diagram of an inverter in a second embodiment of the present application;

[0032] FIG4 is a schematic diagram of the exploded structure of the inverter shown in FIG3 ;

[0033] FIG5 is a schematic structural diagram of the inverter shown in FIG3 with the top shell removed;

[0034] FIG6 is a schematic structural diagram of the bottom shell of the inverter shown in FIG3 ;

[0035] FIG7 is a structural diagram of the inverter in the second embodiment of the present application from another perspective;

[0036] FIG8 is a schematic diagram of the exploded structure of the inverter shown in FIG7 ;

[0037] FIG9 is a schematic structural diagram of a photovoltaic power station in an embodiment of the present application.

[0038] Description of reference numerals:

[0039] 100-shell; 100a-top shell; 100b-bottom shell; 101-bottom plate; 102-side panel; 103-through hole; 104-connection ear; 105-ground connection structure; 106-opening; 107-opening; 108-accommodation cavity; 110-setting plate; 110a-first setting plate; 110b-second setting plate; 111-flat plate structure; 112-convex structure; 112a-first convex structure; 112b-second convex structure; 112c-third convex structure; 112d-fourth convex structure; 112e-fifth convex structure; 112f-sixth convex structure; 1121-first plate; 1121a-first plate portion; 1121b-second Plate portion; 1122-transition plate body; 113-recessed structure; 113a-first recessed structure; 113b-second recessed structure; 1131-second plate body; 200-circuit board; 210-substrate; 211-first side wall; 212-second side wall; 221-first setting element; 222-second setting element; 220a-first element; 220b-second element; 220c-third element; 220d-fourth element; 220e-fifth element; 220f-sixth element; 220g-seventh element; 220h-eighth element; 220i-ninth element; 300-electrical connection line; 400-photovoltaic module; 500-grid; 600-load; A-inverter. DETAILED DESCRIPTION

[0040] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0041] In the description of this application, it should be noted that, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to direct connections or indirect connections through an intermediary. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0042] Throughout this specification, reference to terms such as "an embodiment," "one embodiment," "some embodiments," "exemplarily," and "one embodiment" means that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or embodiment are included in at least one embodiment or embodiment of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or embodiment. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or embodiments.

[0043] The terms "first," "second," etc. are used for descriptive purposes only and should not be understood to indicate or imply relative importance or to implicitly specify the quantity of the technical features indicated. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one of the features.

[0044] In the accompanying drawings, the Z-axis represents the vertical direction, that is, the up and down position, and the positive direction of the Z-axis (that is, the direction of the arrow on the Z-axis) represents the up, and the negative direction of the Z-axis represents the down; in the accompanying drawings, the X-axis represents the horizontal direction and is designated as the left and right position, and the positive direction of the X-axis (that is, the direction of the arrow on the X-axis) represents the right side, and the negative direction of the X-axis represents the left side; in the accompanying drawings, the Y-axis represents the front and back position, and the positive direction of the Y-axis (that is, the direction of the arrow on the Y-axis) represents the front side, and the negative direction of the Y-axis represents the back side; it should be noted that the aforementioned Z-axis, Y-axis and X-axis are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application, and cannot be understood as a limitation on the posture of the microinverter during installation.

[0045] As shown in Figures 1 to 8, in a first aspect, the present application provides an inverter, including a metal shell and a circuit board 200. The metal shell includes a plurality of shells 100 that are detachably connected. The plurality of shells 100 together form an installation cavity, and the circuit board 200 is installed in the installation cavity.

[0046] The metal shell has a setting plate body 110 located on the setting side of the substrate 210 of the circuit board 200 along the first direction, that is, the metal shell has a setting plate body 110, and the setting plate body 110 is located on the setting side of the substrate 210 along the first direction; moreover, the setting plate body 110 is formed with at least one convex protrusion structure 112 and / or at least one concave depression structure 113, that is, the setting plate body 110 can be formed with only the protrusion structure 112, or with only the depression structure 113, or with both structures at the same time, and no matter how many structures are formed, their number is not limited; the first direction is consistent with the thickness direction of the substrate 210.

[0047] The raised structure 112 is arranged corresponding to the first setting element 221 of the circuit board 200 to accommodate the corresponding first setting element 221, and the setting height of the first setting element 221 is greater than the first preset height; the recessed structure 113 is arranged corresponding to the first area of ​​the circuit board 200, and the circuit board 200 has no elements arranged in the first area or is provided with a second setting element 222, and the setting height of the second setting element 222 is less than the second preset height; when the setting plate body 110 is formed with the raised structure 112 and the recessed structure 113, the second preset height is less than or equal to the first preset height; wherein the setting height is the height of the portion of the corresponding element located on the setting side.

[0048] In this specification, the content of this application is explained by taking the inverter as a micro-inverter as an example. The circuit board 200 includes a substrate 210 and multiple components mounted on the substrate 210. The types and quantities of the multiple components are set according to specific needs. The heights of these components may vary. For example, the lowest component in the inverter is about 0.5-3.5 mm, and the highest is as high as 25 mm, resulting in height differences after the components are mounted on the substrate 210.

[0049] It should be noted that the setting side includes the first side and / or the second side of the substrate 210 along the first direction, that is, the setting side can refer to the first side, can also refer to the second side, or can also include the first side and the second side at the same time. In this specification, the content of this application is mainly explained by taking the setting side as the first side, that is, the upper side as an example. At this time, the height of the part of the first setting element 221 located on the setting side is taken as an example to exemplify the height of the part of each element located on the setting side. Specifically, in the Z-axis direction, the first setting element 221 has an end point located on the upper side of the substrate 210 and farthest from the substrate 210. The distance from the end point to the first side wall 211 (that is, the upper side wall, indicated in FIG. 2 ) of the substrate 210 is the height of the part of the first setting element 221 located on the setting side. However, it should be understood that the set side can also be the second side of the substrate 210 along the first direction, and the second side is the lower side of the substrate 210 along the Z-axis direction in the figure. In this case, the first setting element 221 has an end point located on the lower side of the substrate 210 and farthest from the substrate 210. The distance from the end point to the second side wall 212 (i.e., the lower side wall, indicated in FIG8 ) of the substrate 210 is the height of the part of the first setting element 221 located on the set side, which will not be described in detail later.

[0050] When the setting side includes a first side and a second side, the number of setting plates 110 is multiple, including a first setting plate 110a and a second setting plate 110b. The first setting plate 110a and the second setting plate 110b are respectively set corresponding to the first side and the second side. Specifically, the first setting plate 110a corresponds to the first side, and the second setting plate 110b corresponds to the second side. An example explanation will be given later.

[0051] It should be understood that when there is a large difference between the set heights of the components on the substrate 210, if the shell is designed according to the component with the highest set height, and the end face of the shell located on the set side of the substrate 210 is set to be parallel to the substrate 210, a large gap will be left between the component with relatively low height and the end face, the inverter will be larger in size, require a larger amount of glue filling, and the cost will be higher.

[0052] It should be noted that the arrangement of the protruding structures 112 and / or the recessed structures 113 on the plate body 110 is set according to the set height of the components on the substrate 210 .

[0053] For example, if the set heights of most components are consistent and relatively low, the housing's end face design can be based on this set height as a reference, and corresponding raised structures 112 can be designed for other components. In this case, the circuit board 200 includes at least one first set element 221. The first set element 221 is at least partially located on the set side of the substrate 210 along the first direction, and the height of the portion located on the set side is greater than the first set height. For example, the first set element 221 is at least partially located on the upper side of the substrate 210, and the height of the portion located on the upper side is greater than the first set height. In this case, the height of the first set element 221 is relatively high. If the first set plate 110a is positioned entirely parallel to the substrate 210, a large gap will remain between the first set plate 110a and the first sidewall 211 (i.e., the upper sidewall) of the substrate 210, resulting in a larger inverter, requiring a larger amount of glue potting, and increasing costs. Therefore, the first set plate 110a can be positioned based on the relatively low height of most components, and the corresponding raised structures 112 can be designed based on the height of the portion of the first set element 221 located on the set side.

[0054] For example, if the set height of most components is consistent and relatively high, this set height of most components can be used as a reference for the end face design of the housing, and corresponding recessed structures 113 can be designed for other components. In this case, the circuit board 200 has at least one first region. The portion of the circuit board 200 within the first region on the set side of the substrate 210, such as the upper side, has a relatively low overall height. If glue is directly poured, a large amount of glue will be required. In this case, by providing the recessed structure 113, the inner surface of the board body 110 in the first region can be set closer to the substrate 210 in the first direction, thereby reducing the glue injection required in the first region.

[0055] Of course, the plate body 110 may be provided with both a protruding structure 112 and a recessed structure 113 as needed, which will be exemplified later.

[0056] It should be understood that the configuration of the protruding structure 112 and / or the recessed structure 113 is described herein for illustrative purposes only, but is not limited thereto.

[0057] It should be understood that the first preset height and the second preset height can be set according to actual needs, for example, they can be determined according to the third preset height described later. Generally speaking, the setting of the first preset height and the second preset height is as convenient as possible for the forming of the shell 100, and for example, the arrangement of the electrical connection line 300 described later.

[0058] It should be understood that a protruding structure 112 can be provided corresponding to one or more first setting elements 221, and a recessed structure 113 can be provided corresponding to one or more second setting elements 222. A first area on the circuit board 200 may not have a corresponding recessed structure 113. The specific configuration depends on actual needs.

[0059] It should be understood that, during actual assembly, the first direction and the thickness direction of the substrate 210 may have a smaller angle, such as an angle of 0-5°, which will not be described in detail here.

[0060] In this way, the inverter casing can be made of a metal shell, which includes multiple shells 100 that are detachably connected. The multiple shells 100 are used to form an installation cavity for installing the circuit board 200. When the circuit board 200 is installed in the installation cavity, the metal shell enables the inverter to achieve relatively good thermal conductivity and heat dissipation effects, and can also perform EMC shielding on the circuit board 200. It is also convenient for grounding, realizing the inverter's ground fault protection, and can improve the performance of the inverter. At the same time, at least one outwardly convex protrusion structure 112 and / or at least one inwardly concave recessed structure 113 are formed on the setting plate body 110 of the metal shell located on the setting side of the substrate 210 along the first direction (i.e., the thickness direction of the substrate 210). The protrusion structure 112 can be used to accommodate the first setting element 221 of the circuit board 200. The setting height of the first setting element 221 (i.e., the height of the portion located on the setting side of the substrate 210) is greater than the first preset height. The recessed structure 113 is set corresponding to the first area of ​​the circuit board 200. The circuit board 200 has no elements set in the first area or is provided with a second setting element 222. The setting height of the second setting element 222 (i.e., the height of the portion located on the setting side) is less than the second preset height. In other words, the protrusion structure 112 of the setting plate body 110 is used to form The accommodation of the first setting element 221 with a relatively high setting height can avoid the setting plate body 110 being set as a flat plate parallel to the substrate 210 as a whole, which causes the distance between the setting plate body 110 and the substrate 210 to be too large, and avoids the overall space occupied by the inverter being too large and the glue amount required for glue potting being too large when a metal shell is used; the recessed structure 113 of the setting plate body 110 is used to make the inner surface of the setting plate body 110 corresponding to the first area closer to the substrate 210, thereby further reducing the space occupied by the inverter in the first area and the glue amount required for glue potting, thereby reducing the overall glue amount required for glue potting of the inverter and the distance between the circuit board 200 and the inner surface of the metal shell, saving glue potting costs, and also reducing the thickness of the glue layer corresponding to the components on the circuit board 200 to a certain extent, which is beneficial to improving the heat dissipation efficiency of the inverter. The inverter of the present application adopts a metal shell and performs a structural design on the metal shell, which can meet the inverter's requirements for less glue filling, improved heat dissipation capacity and EMC shielding, and is also convenient for realizing ground protection function. The number of components is small, which can improve the performance of the inverter. When the inverter is used in large quantities, for example, when it is used in micro-inverter technology, its overall cost can be reduced to a certain extent, and it is highly practical.

[0061] In the above embodiment, optionally, when the plate body 110 is set to be formed with the protruding structure 112 and the recessed structure 113 , the second preset height is less than or equal to the first preset height.

[0062] For example, if the set heights of most components are consistent and relatively centered, the end face of the shell can be designed based on the set heights of most components. For components with higher heights, corresponding raised structures 112 can be designed, and for other components with lower heights, corresponding recessed structures 113 can be designed.

[0063] At this time, the set heights of the elements corresponding to the protruding structure 112 and the recessed structure 113 have a relatively clear dividing line, for example, the dividing line is the third preset height described later, which facilitates the structural design of the protruding structure 112 and the recessed structure 113 .

[0064] Of course, it should be understood that the portion corresponding to the protruding structure 112 can still be provided with a recessed portion as needed, which is not a limitation.

[0065] As shown in Figures 6 and 8, optionally, the multiple shells 100 include a top shell 100a and a bottom shell 100b distributed along a first direction; the bottom shell 100b includes a bottom plate 101 and a side panel 102, the side panel 102 is connected to the bottom plate 101 and forms a accommodating cavity 108 with an open opening 107, the circuit board 200 is at least partially accommodated in the accommodating cavity 108, and the top shell 100a covers the open opening 107 and is detachably connected to the bottom shell 100b.

[0066] Specifically, when the top shell 100 a covers the opening 107 and is connected to the bottom shell 100 b , the top shell 100 a and the bottom shell 100 b form a mounting cavity for accommodating the circuit board 200 .

[0067] Furthermore, the bottom plate 101 and / or the top shell 100 a are used to form a setting plate body 110 .

[0068] Specifically, Figures 1 to 8 illustrate a case where the top case 100a is provided with a first setting plate 110a (indicated in Figure 8 ), and the bottom case 101 is provided with a second setting plate 110b (indicated in Figure 8 ). In this case, the glue injection amount can be further reduced. The following description will focus on the case where the setting plate 110 is the first setting plate 110a.

[0069] As shown in Figure 1, optionally, the plate body 110 is set to have a flat plate structure 111 parallel to the substrate 210 and located at the edge position, and the protruding structure 112 is arranged to bulge outward relative to the flat plate structure 111; the substrate 210 has a set side wall adjacent to the flat plate structure 111, and the height between the side wall and the inner surface of the flat plate structure 111 is set to be a third preset height; the first preset height is less than or equal to the third preset height, and when the first preset height is less than the third preset height, the absolute value of the difference between the first preset height and the third preset height is less than or equal to the first preset difference; the second preset height is less than the third preset height.

[0070] Specifically, the first preset height and the third preset height satisfy: H1 = H2, or H1 < H2, and H1 ≥ H2 - Δ1, where H1 is the first preset height, H2 is the third preset height, and Δ1 is a first preset difference (H1, H2, and Δ1 are not marked in the figure). The first preset difference is determined according to specific needs. For example, 0 < Δ1 ≤ 0.5 mm.

[0071] The following description is made by taking the setting plate 110 on the top shell 100 a as the first setting plate 110 a and the setting side wall corresponding to the first setting plate 110 a as the first side wall 211 (ie, the upper side wall) as an example.

[0072] For example, when H1>H2, the protruding structure 112 is provided corresponding to the first setting element 221 , thereby accommodating the first setting element 221 .

[0073] When H2≥H1≥H2-Δ1, the uppermost endpoint of the first setting element 221 is lower than the lower surface of the flat plate structure 111 of the first setting plate body 110a, and there is a risk of contact with the lower surface of the flat plate structure 111 of the first setting plate body 110a. At this time, a protruding structure 112 is provided corresponding to the first setting element 221 to accommodate the first setting element 221.

[0074] In this way, the setting plate body 110 is set to have a flat plate structure 111 that is parallel to the substrate 210 and located at the edge position. The design distance between the flat plate structure 111 and the set side wall of the substrate 210 can be used as a reference, thereby facilitating the determination of the first setting element 221 and the corresponding setting of the protruding structure 112; and the relationship between the first preset height and the third preset height can, to a certain extent, avoid the outer end point of the first setting element 221 along the first direction (i.e., the end point away from the corresponding set side wall) being located on the inner side of the flat plate structure 111 and being too close to the inner surface of the flat plate structure 111, which may lead to, for example, the risk of collision or interference between the two (because the shell 100 may have certain processing and assembly errors, etc.).

[0075] Furthermore, when the recessed structure 113 is disposed adjacent to the flat structure 111 and the recessed structure 113 is disposed corresponding to the second setting element 222 , the absolute value of the difference between the second preset height and the third preset height is greater than or equal to the second preset difference.

[0076] When the recessed structure 113 is spaced apart from the flat structure 111 and the recessed structure 113 is disposed corresponding to the second setting element 222 , the absolute value of the difference between the second preset height and the third preset height is smaller than the second preset difference.

[0077] Specifically, the second preset difference is determined based on specific needs, for example, based on the thickness of the plate body 110 and the dimensions of the forming process. For example, the second preset difference is 1.5-3 mm, for example, 1.5 mm. In this case, when the recessed structure 113 is adjacent to the flat plate structure 111, the difference between the second preset height and the third preset height may be, for example, 2 mm. When the recessed structure 113 is spaced apart from the flat plate structure 111, the difference between the second preset height and the third preset height may be 0.5-1.5 mm, for example, 1 mm.

[0078] That is to say, when the component is close to the edge of the substrate 210 and the set height of the component is relatively close to the third preset height, for example, the difference between the two is the second preset difference, such as 1.5 mm, if this component is defined as the second setting component 222 and a corresponding recessed structure 113 is performed on this component, then the height difference between the part of the recessed structure 113 corresponding to this component and the flat plate structure 111 is small, and this component can be directly covered with the flat plate structure 111, thereby avoiding the structure of the setting plate body 110 being too complicated, resulting in difficulty in forming, and having limited effect on reducing the amount of glue injection.

[0079] When the recessed structure 113 is spaced apart from the flat plate structure 111, that is, the protruding structure 112 is provided between the recessed structure 113 and the flat plate structure 111, at this time, the first setting element 221 is provided between the second setting element 222 corresponding to the recessed structure 113 and the edge of the substrate 210. At this time, the recessed structure 113 is not directly connected to the flat plate structure 111 to be formed, and there is no need to worry that the recessed structure 113 is difficult to form due to direct connection with the flat plate structure 111. At this time, under the premise that the second preset height is less than the third preset height, the difference between the two is small and the recessed structure 113 can also be formed accordingly, so the thickness of the glue layer at the second setting element 222 can be reduced as much as possible.

[0080] Optionally, the protruding structure 112 includes a first setting portion corresponding to the first setting element 221 ; the first setting portion includes a first plate body 1121 opposite to the substrate 210 , or at least part of the first setting portion is adapted to the shape of the first setting element 221 .

[0081] As shown in Figures 3 and 4, the sixth protruding structure 112f includes a first plate body 1121, wherein one of the first plate bodies 1121 is a first plate portion 1121a, the first plate portion 1121a is arranged at least corresponding to the seventh element 220g, and the first plate portion 1121a is parallel to the substrate 210.

[0082] As shown in Figure 2, it shows three third elements 220c (for example, capacitors) distributed in sequence. The capacitors are columnar capacitors, and the axial direction of the columnar capacitors is perpendicular to the first direction. The upper surface of the third element 220c along the Z-axis direction is an arc surface. At this time, the second protruding structure 112b is provided with three first setting parts, and the three first setting parts are respectively provided corresponding to the three third elements 220c, and respectively match the arc surfaces of the third elements 220c.

[0083] Of course, in some cases, the first setting portion may include the first plate 1121 and may also have at least a portion that matches the shape of the first setting element 221, which will not be described in detail here.

[0084] Optionally, the recessed structure 113 includes a second setting portion corresponding to the second setting element 222; the second setting portion includes a second plate 1131 disposed opposite the substrate 210, or at least a portion of the second setting portion is shaped to match the second setting element 222. The configuration of the second setting portion is similar to that of the first setting portion and will not be described in detail herein.

[0085] Optionally, when the minimum interval between two adjacent first setting elements 221 on the circuit board 200 is smaller than the first preset interval, the two adjacent first setting elements 221 are accommodated in the same protruding structure 112 .

[0086] As shown in Figure 2, exemplarily, the components of the circuit board 200 include a first component 220a (for example, the first component 220a is an inductor) and a second component 220b (for example, the second component 220b is a capacitor). The first component 220a and the second component 220b are arranged adjacent to each other, and both are first setting components 221. The minimum interval between the first component 220a and the second component 220b is less than the first preset interval. At this time, one of the protruding structures 112 is the first protruding structure 112a, and the first protruding structure 112a is used to accommodate the first component 220a and the second component 220b.

[0087] It should be noted that the first preset interval can be selected according to actual needs. For example, the first preset interval is less than or equal to 8 mm, for example, the first preset interval is less than or equal to 5 mm, so as to avoid the increase in the forming difficulty and forming cost of the shell 100 due to the setting of the recessed structure 113 corresponding to the gap between the first preset element and the second preset element when the first preset interval is too small.

[0088] Optionally, the protruding structure 112 includes a first plate body 1121 disposed opposite to the substrate 210 .

[0089] When the absolute value of the difference between the setting heights of two adjacent first setting elements 221 is less than or equal to the third preset difference, the projection of the same first plate 1121 on the substrate 210 covers the two adjacent first setting elements 221 .

[0090] When the absolute value of the difference between the setting heights of two adjacent first setting elements 221 is greater than the third preset difference, a first plate 1121 is provided corresponding to each of the two adjacent first setting elements 221 , and the first plates 1121 are connected by a transition plate 1122 .

[0091] By setting the third preset difference, it is possible to avoid setting two first setting elements 221 that are closely spaced in a plane parallel to the substrate 210 and have a small absolute value of the difference in set height to correspond to two first plates 1121, thereby avoiding the increase in forming difficulty caused by the height difference of the inner surfaces of the two first plates 1121 being too small, which is beneficial to reducing the forming difficulty of the shell 100.

[0092] The third preset difference can be set as needed, for example, the third preset difference can be set to 3mm, 2.5mm, or 2mm.

[0093] 4 , in the second embodiment of the present application, the fourth element 220d, the fifth element 220e, the sixth element 220f and the seventh element 220g are all first setting elements 221 and share the sixth protruding structure 112f.

[0094] In FIG4 , when the minimum spacing between the seventh element 220 g and the sixth element 220 f in the projection on the substrate 210 is less than the first predetermined spacing, and the absolute value of the difference in the set heights between the seventh element 220 g and the sixth element 220 f is greater than the third predetermined difference, the sixth protruding structure 112 f includes at least two first plates 1121 , wherein the two first plates 1121 are respectively a first plate portion 1121 a and a second plate portion 1121 b , with the first plate portion 1121 a being provided at least corresponding to the seventh element 220 g , and the second plate portion 1121 b being provided at least corresponding to the sixth element 220 f . The first plate portion 1121 a and the second plate portion 1121 b are connected by a transition plate 1122 , for example, the first plate portion 1121 a and the second plate portion 1121 b are parallel to the substrate 210 , and the transition plate 1122 may extend along the first direction.

[0095] Figure 4 also shows that in the projection within the substrate 210, the minimum spacing between the fourth element 220d and the fifth element 220e is less than the first preset spacing, and the absolute value of the difference between the set heights of the two is less than or equal to the third preset difference. For example, the third preset difference is 2 mm, and the difference between the set heights of the fourth element 220d (for example, a transformer) and the fifth element 220e (for example, a capacitor) is 1.5 mm. At this time, in the projection plane parallel to the substrate 210, the first plate portion 1121a is also used to cover the fourth element 220d (for example, a transformer) and the fifth element 220e (for example, a capacitor).

[0096] Referring to FIG. 2 , unlike the solution in the aforementioned second embodiment, in the first embodiment of the present application, the fourth element 220d, the fifth element 220e, the sixth element 220f, and the seventh element 220g are all first setting elements 221, the third protruding structure 112c is provided corresponding to the fourth element 220d, the fourth protruding structure 112d is provided corresponding to the fifth element 220e and the sixth element 220f, and the fifth protruding structure 112e is provided corresponding to the seventh element 220g. Although this further reduces the amount of glue used in the potting process, the reduction is small, resulting in a more complex metal shell structure and higher molding costs and difficulty.

[0097] As shown in Figures 3 and 4, optionally, when the set heights of adjacent second setting elements 222 on the circuit board 200 are all less than the fourth preset height, the corresponding recessed structure 113 is formed with a second plate body 1131 arranged opposite to the substrate 210, and the projection of the second plate body 1131 on the substrate 210 covers the adjacent second setting elements 222, and the second plate body 1131 is arranged parallel to the substrate 210.

[0098] The fourth preset height is determined according to actual needs and is generally relatively low. For example, the fourth preset height is 0.35 mm and the fourth preset height is 0.3 mm. In FIG4 , the set heights of multiple components such as the eighth component 220h and the ninth component 220i are relatively low. At this time, the first recessed structure 113a is provided corresponding to the multiple components such as the eighth component 220h and the ninth component 220i, and its second plate 1131 covers the multiple components such as the eighth component 220h and the ninth component 220i.

[0099] In this way, the inner surface of the recessed structure 113 can be prevented from being too close to the substrate 210 , and the distance between the inner surface of the recessed structure 113 and the substrate 210 can be prevented from being too small, which would affect the flow of glue between the second plate 1131 and the substrate 210 .

[0100] Of course, it should be understood that, similar to the case where the same protruding structure 112 may include multiple first plates 1121 , in some cases, the same recessed structure 113 may include multiple second plates 1131 , which will not be described in detail here.

[0101] As shown in FIG. 3 and FIG. 4 , there is no component disposed in the region corresponding to the second plate body 1131 of the second recessed structure 113 b , which will not be described in detail here.

[0102] As shown in FIG. 6 and FIG. 8 , optionally, a through hole 103 is provided on the side panel 102 , and the through hole 103 is used to install an electrical connection line 300 , and the electrical connection line 300 is connected to the circuit board 200 .

[0103] For example, the electrical connection line 300 is connected to the substrate 210 or a component on the substrate 210 .

[0104] At this time, the third preset height is affected to a certain extent by the installation space requirement of the electrical connection line 300 in the first direction.

[0105] As shown in Figure 8, further, the via hole 103 passes through the side panel 102 along the first direction toward the side close to the top shell 100a and forms an opening 106. The electrical connection line 300 is placed into the via hole 103 through the opening 106 and is clamped with the edge of the via hole 103 to limit the movement of the electrical connection line 300 along the depth direction of the via hole 103.

[0106] For example, a connection with a slot is provided on the electrical connection line 300 , and an edge of the via hole 103 is inserted into the slot along the first direction and is engaged with the slot.

[0107] As shown in FIG6 and FIG8 , optionally, a connection ear 104 is provided on the top shell 100a or the bottom shell 100b. The connection ear 104 is used to install the inverter. A grounding connection structure 105 for grounding is provided on the connection ear 104.

[0108] The figure shows that the connecting ear 104 is located on the side panel 102 of the bottom shell 100b. The connecting ear 104 can be used to connect the bracket of the photovoltaic module to fix the inverter, which will not be described in detail here.

[0109] The specific structure of the ground connection structure 105 is not limited. As shown in FIG8 , it illustratively includes a column and a ground connection hole. The column is disposed on the connection ear 104, and the ground connection hole extends through the column and the connection ear 104. The ground connection hole can be a threaded hole, which can reduce the thickness requirement of the connection plate.

[0110] In addition, it should be noted that in the above embodiments, a gap should be left between the inner surface of the protruding structure 112 or the recessed structure 113 and the corresponding component to prevent the component from directly contacting the metal shell 100, thereby protecting the component to a certain extent.

[0111] The housing 100 may be formed by casting, stamping or other processes. Detailed description will not be given here depending on the different forming processes.

[0112] In a second aspect, the present application provides a photovoltaic power station, which includes the inverter of the above embodiment.

[0113] Optionally, the photovoltaic power station further includes one or more photovoltaic modules 400 correspondingly arranged and connected to the inverter. When the inverter is provided with multiple photovoltaic modules 400, the inverter is connected to the corresponding multiple photovoltaic modules 400 respectively. For example, the DC interface of the inverter can be connected to at least one photovoltaic string, which is composed of multiple photovoltaic modules 400 connected in series. For a microinverter, its DC interface can be connected to one photovoltaic module 400 or to at least two photovoltaic modules 400 connected in series and parallel; this is not specifically limited here and depends on the application environment, and is within the scope of protection of this application.

[0114] As shown in FIG9 , it shows a photovoltaic power station including multiple inverters A. Inverter A is the inverter of the above embodiment. The multiple inverters are respectively provided with multiple photovoltaic modules.

[0115] Inverter A converts the direct current outputted by its corresponding photovoltaic assembly 400 into alternating current, and outputs the alternating current to the grid 500 and / or the load 600 .

[0116] Photovoltaic power stations can be used for home or commercial purposes. Photovoltaic power stations can also be equipped with combiner boxes as needed, which will not be explained in detail here.

[0117] At this time, the inverter A can perform maximum power point tracking on each photovoltaic module 400, and the overall efficiency of the photovoltaic power station is relatively high.

[0118] Although the present application is disclosed as above, the protection scope of the present application is not limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present application, and these changes and modifications will fall within the protection scope of the present application.

Claims

1. An inverter, characterized in that: It comprises a metal shell and a circuit board (200), the metal shell comprising a plurality of shells (100) that are detachably connected, the plurality of shells (100) together enclose a mounting cavity, and the circuit board (200) is mounted in the mounting cavity; The metal shell comprises a setting plate body (110) located on a setting side of a substrate (210) of the circuit board (200) along a first direction, the setting plate body (110) being formed with at least one convex protrusion structure (112) and / or at least one concave depression structure (113), the first direction being consistent with a thickness direction of the substrate (210); The protruding structure (112) is arranged corresponding to a first setting element (221) of the circuit board (200) to accommodate the corresponding first setting element (221), and the setting height of the first setting element (221) is greater than a first preset height; the recessed structure (113) is arranged corresponding to a first area of ​​the circuit board (200), and the circuit board (200) has no element or a second setting element (222) arranged in the first area, and the setting height of the second setting element (222) is less than the second preset height; wherein the setting height is the height of the portion of the corresponding element located on the setting side.

2. The inverter according to claim 1, characterized in that: The set plate body (110) has a flat plate structure (111) which is parallel to the base plate (210) and located at the edge position, and the protruding structure (112) is arranged to protrude outward relative to the flat plate structure (111); the base plate (210) has a set side wall adjacent to the flat plate structure (111), and the height between the set side wall and the inner surface of the flat plate structure (111) is a third preset height; the first preset height is less than or equal to the third preset height, and when the first preset height is less than the third preset height, the absolute value of the difference between the first preset height and the third preset height is less than or equal to the first preset difference; the second preset height is less than the third preset height.

3. The inverter according to claim 2, characterized in that: When the recessed structure (113) is disposed adjacent to the flat plate structure (111), and the recessed structure (113) is disposed corresponding to the second setting element (222), the absolute value of the difference between the second preset height and the third preset height is greater than or equal to the second preset difference; When the recessed structure (113) and the flat plate structure (111) are arranged at a distance from each other, and the recessed structure (113) is arranged corresponding to the second setting element (222), the absolute value of the difference between the second preset height and the third preset height is smaller than the second preset difference.

4. The inverter according to any one of claims 1 to 3, characterized in that: The protruding structure (112) comprises a first setting portion arranged corresponding to the first setting element (221); the first setting portion comprises a first plate body (1121) arranged opposite to the substrate (210), or at least a part of the first setting portion is adapted to the shape of the first setting element (221); The recessed structure (113) includes a second setting portion arranged corresponding to the second setting element (222); the second setting portion includes a second plate body (1131) arranged opposite to the substrate (210), or at least a part of the second setting portion is adapted to the shape of the second setting element (222).

5. The inverter according to any one of claims 1 to 3, characterized in that: When the minimum interval between two adjacent first setting elements (221) on the circuit board (200) is smaller than a first preset interval, the two adjacent first setting elements (221) are accommodated in the same protruding structure (112); And / or, when the set heights of adjacent second setting elements (222) on the circuit board (200) are all less than a fourth preset height, the corresponding recessed structure (113) is formed with a second plate body (1131) arranged opposite to the substrate (210), and the projection of the second plate body (1131) on the substrate (210) covers the adjacent second setting elements (222), and the second plate body (1131) is arranged parallel to the substrate (210).

6. The inverter according to claim 5, characterized in that: The protruding structure (112) comprises a first plate body (1121) arranged opposite to the substrate (210); When the absolute value of the difference between the set heights of the two adjacent first setting elements (221) is less than or equal to a third preset difference, the projection of the same first plate body (1121) on the substrate (210) covers the two adjacent first setting elements (221); When the absolute value of the difference between the set heights of the two adjacent first setting elements (221) is greater than the third preset difference, the first plates (1121) are respectively provided corresponding to the two adjacent first setting elements (221), and the first plates (1121) are connected via a transition plate (1122).

7. The inverter according to any one of claims 1 to 3, characterized in that: The multiple shells (100) include top shells (100a) and bottom shells (100b) distributed along the first direction; the bottom shell (100b) includes a bottom plate (101) and a side panel (102), the side panel (102) is connected to the bottom plate (101) and encloses a receiving cavity (108) having an open opening (107), the circuit board (200) is at least partially received in the receiving cavity (108), the top shell (100a) is covered at the open opening (107) and is detachably connected to the bottom shell (100b); the bottom plate (101) and / or the top shell (100a) are configured to form the setting plate body (110).

8. The inverter according to claim 7, characterized in that: The side panel (102) is provided with a via hole (103), the via hole (103) is configured to install an electrical connection line (300), and the electrical connection line (300) is connected to the circuit board (200); And / or, a connection ear (104) is provided on the top shell (100a) or the bottom shell (100b), the connection ear (104) is configured to achieve installation of the inverter, and a grounding connection structure (105) configured to be grounded is provided on the connection ear (104).

9. The inverter according to claim 8, characterized in that: The through hole (103) passes through the side panel (102) along the first direction toward the side close to the top shell (100a) to form an opening (106); the electrical connection line (300) is inserted into the through hole (103) through the opening (106) and is engaged with the edge of the through hole (103) to limit the movement of the electrical connection line (300) along the depth direction of the through hole (103); The grounding connection structure (105) comprises a column and a grounding connection hole, the column is arranged on the connection ear (104), and the grounding connection hole passes through the column and the connection ear (104).

10. The inverter according to any one of claims 1 to 9, characterized in that: When the setting plate (110) is formed with the protruding structure (112) and the recessed structure (113), the second preset height is less than or equal to the first preset height.

11. A photovoltaic power station, characterized in that: Comprising the inverter according to any one of claims 1 to 10.

12. The photovoltaic power station according to claim 11, characterized in that: The photovoltaic power station further comprises: one or more photovoltaic modules (400) arranged and connected to the inverter in correspondence with the inverter; when the inverter is arranged with a plurality of the photovoltaic modules (400) in correspondence with the inverter, the inverter is respectively connected to the plurality of the photovoltaic modules (400) arranged in correspondence with the inverter.

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