Electronic device including structure for dissipating heat

Abstract

An electronic device according to an embodiment may comprise: a first housing including a first supporting portion; a second housing including a second supporting portion opposite to the first supporting portion; and at least one electronic component in the first housing. The electronic device may include a hinge structure which rotatably couples the first housing and the second housing to each other. The first supporting portion and the second supporting portion may be configured to be connected to each other in an unfolded state of the electronic device, thereby forming a heat transfer path from the at least one electronic component to the second housing.

Description

Electronic device including a structure for dissipating heat

[0001] The various embodiments described below relate to electronic devices including structures for dissipating heat.

[0002] Electronic devices including large-screen displays can enhance user usability. As demand for highly portable electronic devices increases, electronic devices may include deformable displays. Deformable displays may be slidable, rollable, or foldable. By including deformable displays, electronic devices can be miniaturized to be worn or carried by a user. Electronic devices may include electronic components within the electronic device to implement various functions. As electronic components within the electronic device perform operations to respond to user requests, heat may be generated within the miniaturized electronic device. To reduce damage to the electronic device, a structure may be required to dissipate the heat generated from the electronic components.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above-described matters constitute prior art related to the present disclosure.

[0004] In one embodiment, an electronic device may include a display, a first housing including a first supporting portion for supporting the display, and a second housing including a second supporting portion for supporting the display. The electronic device may include at least one electronic component within the first housing. The electronic device may include a hinge structure rotatably coupling the first housing and the second housing. The first supporting portion and the second supporting portion may be configured to be connected to each other in an unfolded state of the electronic device to provide a heat transfer path from the at least one electronic component to the second housing.

[0005] In one embodiment, an electronic device may include a first housing including a first support portion, and a second housing including a second support portion facing the first support portion. The electronic device may include a flexible display including a first display area coupled to the first housing, a second display area coupled to the second housing, and a third display area extending from the first display area to the second display area and being deformable. The electronic device may include at least one electronic component within the first housing. The electronic device may include a vapor chamber within the first housing that contacts the at least one electronic component and the first support portion, and extends from the at least one electronic component to the first support portion. The electronic device may include a hinge structure configured to provide a plurality of folded states in which the second housing is folded relative to the first housing about a folding axis by rotatably coupling the first support portion and the second support portion, and an unfolded state. The first support portion may be configured to form a heat transfer path from the at least one electronic component to the second housing through the vapor chamber by being connected to the second support portion in the unfolded state.

[0006] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0007] FIG. 2A illustrates an example of an unfolded state of an exemplary electronic device, according to one embodiment.

[0008] FIG. 2b illustrates an example of a first folding state of an exemplary electronic device according to one embodiment.

[0009] FIG. 2c is an exploded view of an exemplary electronic device according to one embodiment.

[0010] FIG. 3 is a partial cross-sectional view of an exemplary electronic device taken along line A-A' of FIG. 2a.

[0011] Figures 4a and 4b illustrate portions of exemplary electronic devices.

[0012] FIG. 5A illustrates a portion of an exemplary electronic device in a first folded state.

[0013] FIG. 5b illustrates a portion of an exemplary electronic device in a second folded state.

[0014] FIG. 5c illustrates a portion of an exemplary electronic device in an unfolded state.

[0015] FIG. 6 illustrates a portion of an exemplary electronic device in an unfolded state.

[0016] FIG. 7A illustrates a portion of an exemplary electronic device in a first folded state.

[0017] FIG. 7b illustrates a portion of an exemplary electronic device in an unfolded state.

[0018] Figure 7c is a top plan view of a support structure of an exemplary electronic device.

[0019] FIG. 8A illustrates a portion of an exemplary electronic device in a first folded state.

[0020] FIG. 8b illustrates a portion of an exemplary electronic device in an unfolded state.

[0021] Figure 8c is a partially exploded perspective view of an exemplary electronic device.

[0022] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0023] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0024] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0025] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0026] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0027] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0028] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0029] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0030] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0031] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0032] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0033] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0034] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0035] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0036] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0037] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0038] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0039] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0040] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0041] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0042] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0043] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0044] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0045] FIG. 2A illustrates an example of an unfolded state of an electronic device according to one embodiment. FIG. 2B illustrates an example of a first folded state of an electronic device according to one embodiment. FIG. 2C is an exploded view of an electronic device according to one embodiment.

[0046] Referring to FIGS. 2A, 2B, and 2C, the electronic device (101) may include a first housing (210), a second housing (220), a display (230), at least one camera (240) (e.g., the camera module (180) of FIG. 1), a hinge structure (250), and / or at least one electronic component (260).

[0047] The first housing (210) and the second housing (220) may form at least a portion of an outer surface of the electronic device (101) that may be gripped by a user. At least a portion of the outer surface of the electronic device (101) defined by the first housing (210) and the second housing (220) may come into contact with a portion of the user's body when the electronic device (101) is used by the user. According to one embodiment, the first housing (210) may include a first front surface (211), a first back surface (212) facing the first front surface (211) and spaced apart from the first front surface (211), and a first side surface (213) enclosing at least a portion of the first front surface (211) and the first back surface (212). The first side surface (213) may connect a periphery of the first front surface (211) and a periphery of the first back surface (212). The first front (211), the first rear (212), and the first side (213) may define an internal space of the first housing (210). According to one embodiment, the first housing (210) may provide a space formed by the first front (211), the first rear (212), and the first side (213) as a space for arranging components of the electronic device (101).

[0048] According to one embodiment, the second housing (220) may include a second front surface (221), a second rear surface (222) facing the second front surface (221) and spaced apart from the second front surface (221), and a second side surface (223) surrounding at least a portion of the second front surface (221) and the second rear surface (222). The second side surface (223) may connect a periphery of the second front surface (221) and a periphery of the second rear surface (222). The second front surface (221), the second rear surface (222), and the second side surface (223) may define an interior space of the second housing (220). According to one embodiment, the second housing (220) may provide a space formed by a second front surface (221), a second rear surface (222), and a second side surface (223) surrounding at least a portion of the second front surface (221) and the second rear surface (222), as a space for mounting components of the electronic device (101). According to one embodiment, the second housing (220) may be coupled to the first housing (210) so as to be rotatable with respect to the first housing (210).

[0049] According to one embodiment, each of the first housing (210) and the second housing (220) may include a first protective member (214) and a second protective member (224), respectively. The first protective member (214) and the second protective member (224) may be disposed on the first front surface (211) and the second front surface (221) along the periphery of the display (230). According to one embodiment, the first protective member (214) and the second protective member (224) may prevent foreign substances (e.g., dust or moisture) from entering through the gap between the display (230) and the first housing (210) and the second housing (220). For example, the first protective member (214) may surround the edge of the first display area (231) of the display (230), and the second protective member (224) may surround the edge of the second display area (232) of the display (230). The first protective member (214) may be formed by being attached to the first side (213) of the first housing (210), or may be formed integrally with the first side (213). The second protective member (224) may be formed by being attached to the second side (223) of the second housing (220), or may be formed integrally with the second side (223).

[0050] According to one embodiment, the first side (213) and the second side (223) may include a conductive material, a non-conductive material, or a combination thereof. For example, the second side (223) may include at least one conductive portion (225) and at least one non-conductive portion (226). The at least one conductive portion (225) may include a plurality of conductive portions that are each spaced apart from each other. The at least one non-conductive portion (226) may be disposed between the plurality of conductive portions. The plurality of conductive portions may be isolated from each other by the at least one non-conductive portion (226) disposed between the plurality of conductive portions. According to one embodiment, the plurality of conductive portions and the plurality of non-conductive portions may together form an antenna radiator. The electronic device (101) may be capable of communicating with an external electronic device through the antenna radiator formed by the plurality of conductive portions and the plurality of non-conductive portions.

[0051] The display (230) may be configured to display visual information. According to one embodiment, the display (230) may be disposed on a first front surface (211) of the first housing (210) and a second front surface (221) of the second housing (220) across the hinge structure (250). For example, the display (230) may include a first display area (231) disposed on the first front surface (211) of the first housing, a second display area (232) disposed on the second front surface (221) of the second housing, and a third display area (233) disposed between the first display area (231) and the second display area (232). The first display area (231), the second display area (232), and the third display area (233) may form a front surface of the display (230). According to one embodiment, the display (230) may further include a sub-display panel (235) disposed on the second rear surface (222) of the second housing (220). For example, the display (230) may be referred to as a flexible display. According to one embodiment, the display (230) may include a window exposed toward the outside of the electronic device (101). The window may protect the surface of the display (230) and may include a substantially transparent material to transmit visual information provided by the display (230) to the outside of the electronic device (101). For example, the window may include, but is not limited to, glass (e.g., UTG, ultra-thin glass) and / or a polymer (e.g., PI, polyimide).

[0052] At least one camera (240) may be configured to acquire an image based on receiving light from a subject external to the electronic device (101). According to one embodiment, the at least one camera (240) may include first cameras (241), second cameras (242), and / or third cameras (243). The first cameras (241) may be disposed in the first housing (210). For example, the first cameras (241) may be disposed inside the first housing (210) and at least a portion of the first cameras (241) may be visible through the first rear surface (212) of the first housing (210). The first cameras (241) may be supported by a bracket (not shown) within the first housing (210). The first housing (210) may include at least one opening (241a) that overlaps the first cameras (241) when viewed from above on the first rear surface (212). The first cameras (241) may acquire images based on receiving light from the outside of the electronic device (101) through the at least one opening (241a).

[0053] According to one embodiment, the second camera (242) may be disposed in the second housing (220). For example, the second camera (242) may be disposed inside the second housing (220) and may be visible through the sub-display panel (235). The second housing (220) may include at least one opening (242a) that overlaps the second camera (242) when the second rear surface (222) is viewed from above. The second camera (242) may acquire an image based on receiving light from the outside of the electronic device (101) through the at least one opening (242a).

[0054] In one embodiment, the third camera (243) may be disposed in the first housing (210). For example, the third camera (243) may be disposed inside the first housing (210) and at least a portion thereof may be visible through the first front surface (211) of the first housing (210). In another example, the third camera (243) may be disposed inside the first housing (210) and at least a portion thereof may be visible through the first display area (231) of the display (230). The first display area (231) of the display (230) may include at least one opening (not shown) that overlaps the third camera (243) when the display (230) is viewed from above. The third camera (243) may acquire an image based on receiving light from the outside of the display (230) through the at least one opening.

[0055] According to one embodiment, the second camera (242) and the third camera (243) may be positioned below the display (230) (e.g., toward the inside of the first housing (210) or the inside of the second housing (220). For example, the second camera (242) and the third camera (243) may be under-display cameras (UDCs). When the second camera (242) and the third camera (243) are under-display cameras, an area of ​​the display (230) corresponding to the respective positions of the second camera (242) and the third camera (243) may not be an inactive area. For example, when the second camera (242) and the third camera (243) are under-display cameras, an area of ​​the display (230) corresponding to the respective positions of the second camera (242) and the third camera (243) may have a lower pixel density than a pixel density of another area of ​​the display (230). The inactive area of ​​the display (230) may refer to an area of ​​the display (230) that does not include pixels or does not emit light outside of the electronic device (101). For another example, the second camera (242) and the third camera (243) may be punch-hole cameras. When the second camera (242) and the third camera (243) are punch-hole cameras, an area of ​​the display (230) corresponding to the respective positions of the second camera (242) and the third camera (243) may be an inactive area. For example, when the second camera (242) and the third camera (243) are punch-hole cameras, an area of ​​the display (230) corresponding to the respective positions of the second camera (242) and the third camera (243) may include an opening that does not include pixels.

[0056] According to one embodiment, the hinge structure (250) can rotatably connect the first housing (210) and the second housing (220). The hinge structure (250) can be disposed between the first housing (210) and the second housing (220) of the electronic device (101) so that the electronic device (101) can be bent, curved, or folded. For example, the hinge structure (250) can be disposed between a portion of the first side (213) and a portion of the second side (223) that face each other. The hinge structure (250) can change the electronic device (101) into an unfolding state in which the first front surface (211) of the first housing (210) and the second front surface (221) of the second housing (220) face each other in substantially the same direction, or into a folding state in which the first front surface (211) and the second front surface (221) face each other. When the electronic device (101) is in the first folding state, the first housing (210) and the second housing (220) can be folded or overlapped by facing each other.

[0057] According to one embodiment, when the electronic device (101) is in the first folded state, the direction in which the first front surface (211) faces and the direction in which the second front surface (221) faces may be different from each other. For example, when the electronic device (101) is in the first folded state, the direction in which the first front surface (211) faces and the direction in which the second front surface (221) faces may be opposite to each other. For another example, when the electronic device (101) is in the first folded state, the direction in which the first front surface (211) faces and the direction in which the second front surface (221) faces may be inclined with respect to each other. When the direction in which the first front surface (211) faces is inclined with respect to the direction in which the second front surface (221) faces, the first housing (210) may be inclined with respect to the second housing (220). However, the present invention is not limited thereto. For example, in the first folding state of the electronic device (101), the first rear surface (212) of the first housing (210) may face the second rear surface (222) of the second housing (220). When the first rear surface (212) and the second rear surface (222) face each other in the first folding state of the electronic device (101), the direction in which the first front surface (211) faces and the direction in which the second front surface (221) faces may be opposite to each other. When the first rear surface (212) and the second rear surface (222) face each other in the first folding state of the electronic device (101), the display (230) may be directly exposed to the outside in the first folding state of the electronic device (101).

[0058] According to one embodiment, the electronic device (101) may be foldable based on a folding axis (f). The folding axis (f) may refer to an imaginary line extending through the hinge cover (251) in a direction substantially parallel to the longitudinal direction of the electronic device (101), but is not limited thereto. For example, the folding axis (f) may be an imaginary line extending in a direction substantially perpendicular to the longitudinal direction of the electronic device (101). When the folding axis (f) extends in a direction substantially perpendicular to the longitudinal direction of the electronic device (101), the hinge structure (250) may extend in a direction parallel to the folding axis (f) to connect the first housing (210) and the second housing (220). The first housing (210) and the second housing (220) may be rotatable by the hinge structure (250) extending in a direction substantially perpendicular to the longitudinal direction of the electronic device (101).

[0059] According to one embodiment, the hinge structure (250) may include a hinge cover (251), a first hinge plate (252), a second hinge plate (253), and a hinge module (254). The hinge cover (251) may surround internal components of the hinge structure (250) and form an outer surface of the hinge structure (250). According to one embodiment, the hinge cover (251) surrounding the hinge structure (250) may be at least partially exposed to the outside of the electronic device (101) through a space between the first housing (210) and the second housing (220) when the electronic device (101) is in a first folded state. According to an embodiment, when the electronic device (101) is in an unfolded state, the hinge cover (251) may be covered by the first housing (210) and the second housing (220) and may not be exposed to the outside of the electronic device (101).

[0060] According to one embodiment, the first hinge plate (252) and the second hinge plate (253) can be coupled with the first housing (210) and the second housing (220), respectively, thereby rotatably connecting the first housing (210) and the second housing (220). For example, the first hinge plate (252) can be coupled with the first front bracket (215) of the first housing (210), and the second hinge plate (253) can be coupled with the second front bracket (227) of the second housing (220). As the first hinge plate (252) and the second hinge plate (253) are coupled to the first front bracket (215) and the second front bracket (227), respectively, the first housing (210) and the second housing (220) can be rotated according to the rotation of the first hinge plate (252) and the second hinge plate (253).

[0061] The hinge module (254) can rotate the first hinge plate (252) and the second hinge plate (253). For example, the hinge module (254) can rotate the first hinge plate (252) and the second hinge plate (253) about the folding axis (f) by including gears that are interlocked with each other and can rotate. According to one embodiment, the hinge module (254) can be a plurality of pieces. For example, the plurality of hinge modules (254) can be arranged spaced apart from each other at both ends of the first hinge plate (252) and the second hinge plate (253), respectively.

[0062] According to one embodiment, the first housing (210) may include a first front bracket (215) and a first rear bracket (216), and the second housing (220) may include a second front bracket (227) and a second rear bracket (228). The first front bracket (215) and the first rear bracket (216) may support components of the electronic device (101). The first front bracket (215) may define the first housing (210) by being coupled with the first rear bracket (216). The first rear bracket (216) may define a portion of an outer surface of the first housing (210). The second front bracket (227) and the second rear bracket (228) may support components of the electronic device (101). The second front bracket (227) can define a second housing (220) by being coupled with the second rear bracket (228). The second rear bracket (228) can define a portion of an outer surface of the second housing (220). For example, the display (230) can be disposed on one side of the first front bracket (215) and one side of the second front bracket (227). The first rear bracket (216) can be disposed on the other side of the first front bracket (215) opposite the one side of the first front bracket (215). The second rear bracket (228) can be disposed on the other side of the second front bracket (227) opposite the one side of the second front bracket (227). The sub display panel (235) can be placed between the second front bracket (227) and the second rear bracket (228).

[0063] In one embodiment, a portion of the first front bracket (215) may be surrounded by the first side (213), and a portion of the second front bracket (227) may be surrounded by the second side (223). For example, the first front bracket (215) may be formed integrally with the first side (213), and the second front bracket (227) may be formed integrally with the second side (223). In another example, the first front bracket (215) may be formed separately from the first side (213), and the second front bracket (227) may be formed separately from the second side (223).

[0064] At least one electronic component (260) may implement various functions to be provided to a user. According to one embodiment, at least one electronic component (260) may include a first printed circuit board (261), a second printed circuit board (262), a flexible printed circuit board (263), a battery (264) (e.g., battery (189) of FIG. 1), and / or an antenna (265) (e.g., antenna module (197) of FIG. 1). The first printed circuit board (261) and the second printed circuit board (262) may each form an electrical connection between components within the electronic device (101). For example, components for implementing the overall function of the electronic device (101) (e.g., the processor (120) of FIG. 1) may be placed on the first printed circuit board (261), and at least one electronic component for implementing a part of the function of the first printed circuit board (261) may be placed on the second printed circuit board (262). As another example, components for the operation of the sub-display panel (235) placed on the second rear surface (222) may be placed on the second printed circuit board (262).

[0065] According to one embodiment, the first printed circuit board (261) may be disposed within the first housing (210). For example, the first printed circuit board (261) may be disposed on one surface of the first front bracket (215). According to one embodiment, the second printed circuit board (262) may be disposed within the second housing (220). For example, the second printed circuit board (262) may be spaced apart from the first printed circuit board (261) and disposed on one surface of the second front bracket (227). A flexible printed circuit board (263) may connect the first printed circuit board (261) and the second printed circuit board (262). For example, the flexible printed circuit board (263) may extend from the first printed circuit board (261) to the second printed circuit board (262).

[0066] The battery (264) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (264) may be arranged substantially on the same plane as the first printed circuit board (261) or the second printed circuit board (262).

[0067] The antenna (265) may be configured to receive power or a signal from outside the electronic device (101). According to one embodiment, the antenna (265) may be positioned between the first rear bracket (216) and the battery (264). The antenna (265) may include, for example, a near field communication (NFC) antenna, an antenna module, and / or a magnetic secure transmission (MST) antenna. The antenna (265) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging.

[0068] FIG. 3 is a partial cross-sectional view of an exemplary electronic device taken along line A-A' of FIG. 2a.

[0069] Referring to FIG. 3, the electronic device (101) may include a first housing (210), a second housing (220), at least one electronic component (301), and a hinge structure (250).

[0070] According to one embodiment, the first housing (210) may include a first supporting portion (310). The second housing (220) may include a second supporting portion (320) facing the first supporting portion (310).

[0071] For example, the first support portion (310) may be a part of the first housing (210) that is coupled with the hinge structure (250). For example, the first support portion (310) may be configured to be rotatably coupled with the hinge structure (250) to rotate the first housing (210) with respect to the hinge structure (250). For example, the first support portion (310) may be, but is not limited to, a bracket (e.g., the first front bracket (215) of FIG. 2C) within the first housing (210) for coupling with the hinge structure (250). For example, the first support portion (310) may be configured to deform at least a portion (e.g., the third display area (233) of FIG. 2A) of a display (e.g., the display (230) of FIG. 2A) on the first housing (210) by rotatably connecting the first housing (210) to the hinge structure (250). For example, the first support portion (310) may receive at least a portion of heat emitted from at least one electronic component (301) within the first housing (210).

[0072] For example, the second support portion (320) may be a part of the second housing (220) that is coupled with the hinge structure (250). For example, the second support portion (320) may be configured to be rotatably coupled with the hinge structure (250) to rotate the second housing (220) with respect to the hinge structure (250). For example, the second support portion (320) may be, but is not limited to, a bracket (e.g., the second front bracket (227) of FIG. 2C) within the second housing (220) for coupling with the hinge structure (250). For example, the second support portion (320) may be configured to deform at least a portion of the display (230) on the second housing (220) (e.g., the third display area (233) of FIG. 2A) by rotatably connecting the second housing (220) to the hinge structure (250).

[0073] According to one embodiment, the electronic device (101) may include a display (230) including a first display area (e.g., the first display area (231) of FIG. 2A) coupled to a first housing (210), a second display area (e.g., the second display area (232) of FIG. 2A) coupled to a second housing (220), and a third display area (233) extending from the first display area (231) to the second display area (232) and being deformable. For example, the first display area (231) may be attached to the first housing (210). The second display area (232) may be attached to the second housing (220) and spaced apart from the first display area (231). For example, the third display area (233) may connect the first display area (231) and the second display area (232). The third display area (233) may be arranged on a hinge structure (250). For example, the third display area (233) may be at least partially deformable by the first housing (210) and / or the second housing (220) that are rotated by the hinge structure (250). For example, the third display area (233) may be arranged on the first support portion (310) of the first housing (210) and the second support portion (320) of the second housing (220). The third display area (233) may be at least partially deformable by the first support portion (310) and / or the second support portion (320). The display (230) may provide various user experiences to the user by including the deformable third display area (233).

[0074] According to one embodiment, at least one electronic component (301) may be disposed within the first housing (210). For example, the at least one electronic component (301) may be disposed on a printed circuit board (e.g., the first printed circuit board (261) of FIG. 2C) within the first housing (210). For example, the at least one electronic component (301) may be disposed between the first housing (210) and a display (230) on the first housing (210). For example, as the electronic device (101) operates, the at least one electronic component (301) may emit heat. At least a portion of the heat emitted from the electronic device (101) may be transferred to the first support portion (310) of the first housing (210). For example, at least one electronic component (301) may be referred to as, but is not limited to, a processor (e.g., processor (120) of FIG. 1) and / or a battery (e.g., battery (189) of FIG. 1, battery (264) of FIG. 2c)) of the electronic device (101).

[0075] According to one embodiment, the hinge structure (250) may be configured to provide a plurality of folded states and an unfolded state in which the second housing (220) is folded relative to the first housing (210) about the folding axis (f) by rotatably connecting the first support portion (310) and the second support portion (320).

[0076] The plurality of folding states of the electronic device (101) may refer to states in which the second housing (220) is folded with respect to the first housing (210) by the hinge structure (250). For example, the plurality of folding states may be states in which the second housing (220) is tilted with respect to the first housing (210). For example, the plurality of folding states may be states in which the second front surface (e.g., the second front surface (221) of FIG. 2A) of the second housing (220) is tilted with respect to the first front surface (e.g., the first front surface (211) of FIG. 2A) of the first housing (210). The plurality of folding states may be states in which the first front surface (211) and the second front surface (221) face each other. The plurality of folding states may be states in which the first front surface (211) and the second front surface (221) face substantially different directions. For example, the plurality of folding states may be states in which the first display area (231) on the first housing (210) of the display (230) faces a different direction than the second display area (232) on the second housing (220). For example, the plurality of folding states may be states in which at least a portion of the third display area (233) between the first display area (231) and the second display area is bent. For example, the plurality of folding states may include states in which the angle between the first housing (210) and the second housing (220) is positioned within a range greater than 0 degrees and less than 180 degrees.

[0077] The unfolded state of the electronic device (101) may be referred to as a state in which the first housing (210) and the second housing (220) are unfolded. For example, the unfolded state may be a state that can be changed into a plurality of folding states. For example, the unfolded state may be a state in which the first housing (210) and the second housing (220) are unfolded, so that the first housing (210) and the second housing (220) form a substantially flat surface. For example, the unfolded state may be a state in which the first display area (231) and the second display area (232) of the display (230) are oriented in substantially the same direction. For example, the unfolded state may be a state in which the angle between the first housing (210) and the second housing (220) is 180 degrees. For example, the unfolded state may be a state in which the deformable third display area (233) of the display (230) is unfolded.

[0078] For example, the hinge structure (250) may provide a folding axis (f). The first support portion (310) may be coupled to the hinge structure (250) so as to be rotatable with respect to the second support portion (320) about the folding axis (f). The second support portion (320) may be coupled to the hinge structure (250) so as to be rotatable with respect to the first support portion (310) about the folding axis (f). For example, the first housing (210) may be coupled to the hinge structure (250) so as to be rotatable with respect to the second housing (220) through the first support portion (310). The second housing (220) may be coupled to the hinge structure (250) so as to be rotatable with respect to the first housing (210) through the second support portion (320). For example, the first support portion (310) and the second support portion (320) may face each other with respect to the folding axis (f).

[0079] According to one embodiment, the hinge structure (250) may include a first hinge plate (331) coupled with the first housing (210), and a second hinge plate (332) coupled with the second housing (220) and spaced apart from the first hinge plate (331). The hinge structure (250) may include a hinge cover (340) that rotatably connects the first hinge plate (331) and the second hinge plate (332). For example, the hinge cover (340) may include a first link (250a) for coupling the first hinge plate (331) to the hinge cover (340), and a second link (250b) for coupling the second hinge plate (332) to the hinge cover (340). The first link (250a) can provide a rotation axis so that the first hinge plate (331) can rotate with respect to the hinge cover (340). The second link (250b) can provide a rotation axis so that the second hinge plate (332) can rotate with respect to the hinge cover (340). The hinge cover (340) can rotatably couple the first hinge plate (331) and the second hinge plate (332) by providing the first link (250a) and the second link (250b). For example, the first hinge plate (331) can be coupled with the first support portion (310) of the first housing (210). The second hinge plate (332) can be coupled with the second support portion (320) of the second housing (220). For example, the first hinge plate (331) and the second hinge plate (332) may face each other with respect to the folding axis (f). For example, the hinge cover (340) may be a portion of the hinge structure (250) that provides the folding axis (f). For example, the hinge cover (340) may be at least partially disposed between the first housing (210) and the second housing (220).For example, the hinge cover (340) may be at least partially exposed to the outside within a plurality of folding states of the electronic device (101). For example, the hinge cover (340) may rotatably couple the first hinge plate (331) and the second hinge plate (332) by including a hinge module (e.g., hinge module (254) of FIG. 2C) including at least one gear within the hinge structure (250). The hinge cover (340) may rotatably couple the first housing (210) and the second housing (220) by rotatably coupling the first hinge plate (331) and the second hinge plate (332).

[0080] According to one embodiment, the first support portion (310) can be slidably coupled to the first hinge plate (331). The second support portion (320) can be slidably coupled to the second hinge plate (332). For example, the first support portion (310) can slide toward the folding axis (f) with respect to the first hinge plate (331) while changing from a plurality of folded states to an unfolded state. The second support portion (320) can slide toward the folding axis (f) with respect to the first hinge plate (331) while changing from the plurality of folded states to the unfolded state. For example, the first support portion (310) can slide in the opposite direction toward the folding axis (f) with respect to the first hinge plate (331) within the unfolded state to change from the unfolded state to the plurality of folded states. The second support portion (320) can slide in the opposite direction toward the folding axis (f) with respect to the second hinge plate (332) within the unfolded state. However, this is not limited thereto.

[0081] According to one embodiment, heat emitted from at least one electronic component (301) within the first housing (210) may be emitted into the interior of the first housing (210). The heat may deteriorate the performance of at least one electronic component and / or the electronic device (101) within the first housing (210). At least a portion of the heat may be transferred to the first support portion (310) of the first housing (210). The electronic device (101) may require a structure for dissipating the heat by using the first support portion (310) and the second support portion (320) facing the first support portion (310). The structure for dissipating the heat is described below in FIG. 4A.

[0082] According to the above-described embodiment, the electronic device (101) includes a first housing (210) including a first support portion (310) coupled with a hinge structure (250), and a second housing (220) including a second support portion (320) coupled with the hinge structure (250), thereby providing a variety of user experiences to the user. The electronic device (101) includes a display (230) including a deformable third region (233), thereby providing a variety of user experiences to the user.

[0083] Figures 4a and 4b illustrate portions of exemplary electronic devices.

[0084] Referring to FIGS. 4A and 4B, the electronic device (101) may include a first housing (210) including a first support portion (310), and a second housing (220) including a second support portion (320) facing the first support portion (310). The electronic device (101) may include at least one electronic component (301) within the first housing (210). The electronic device (101) may include a hinge structure (250) configured to provide a plurality of folded states in which the second housing (220) is folded about a folding axis (f) with respect to the first housing (210) and an unfolded state by rotatably coupling the first support portion (310) and the second support portion (320). According to one embodiment, the hinge structure (250) may include a first hinge plate (331) coupled with the first housing (210), a second hinge plate (332) coupled with the second housing (220) and spaced apart from the first hinge plate (331), and a hinge cover (340) rotatably connecting the first hinge plate (331) and the second hinge plate (332).

[0085] According to one embodiment, the first hinge plate (331) can be coupled with the first support portion (310). The second hinge plate (332) can be coupled with the second support portion (320). The hinge cover (340) can include a first protruding structure (341) on the folding axis (f) that separates the first hinge plate (331) and the second hinge plate (332). For example, the first protruding structure (341) can overlap the folding axis (f). The first hinge plate (331) and the second hinge plate (332) can come into contact with the first protruding structure (341) in an unfolded state. For example, the first hinge plate (331) may include a first coupling portion (331a) coupled with the hinge cover (340), and a second coupling portion (331b) extending from the first coupling portion (331a) toward the first housing (210) and coupled with the first support portion (310). The second hinge plate (332) may include a third coupling portion (332a) coupled with the hinge cover (340), and a fourth coupling portion (332b) extending from the third coupling portion (332a) toward the second housing (220) and coupled with the second support portion (320). The first coupling portion (331a) and the third coupling portion (332a) may each be rotatably coupled with respect to the hinge cover (340). The first coupling portion (331a) and the third coupling portion (332a) can be in contact with the first protruding structure (341) in an unfolded state. The second coupling portion (331b) can be slidably coupled with the first support portion (310). The fourth coupling portion (332b) can be slidably coupled with the second support portion (320).

[0086] According to one embodiment, the first support portion (310) may be configured to be connected with the second support portion (320) in an unfolded state to form a heat transfer path (p) from the at least one electronic component (301) to the second housing (220).

[0087] For example, the first support portion (310) may be in contact with the second support portion (320) in the unfolded state. For example, the first support portion (310) may be positioned closer to the second support portion (320) than in the plurality of folded states in the unfolded state. For example, the first support portion (310) may receive heat from at least one electronic component (301) within the first housing (210). The first support portion (310) may transfer at least a portion of the heat received from the at least one electronic component (301) to the second support portion (320) through conduction heat transfer in the unfolded state. For example, at least a portion of the first support portion (310) may be in contact with at least a portion of the second support portion (320) on the hinge cover (340) in the unfolded state. For example, the first support portion (310) can form a heat transfer path (p) with the second support portion (320) through at least one thermally conductive material disposed between the first support portion (310) and the second support portion (320) in the unfolded state. Since at least a portion of the heat is transferred to the second support portion (320), heat emitted from the at least one electronic component (301) into the first housing (210) can be distributed into the second housing (220) through the heat transfer path (p) formed by the first support portion (310) and the second support portion (320). By forming the heat transfer path (p) with the second support portion (320) in the unfolded state, the first support portion (310) can reduce damage to the electronic device (101) caused by heat emitted from the at least one electronic component (301).

[0088] According to one embodiment, the first support portion (310) can be slidably coupled to the first hinge plate (331). The first support portion (310) can include a first portion (311) that supports the first hinge plate (331) and a second portion (312) that extends from the first portion (311) along the folding axis (f). The second support portion (320) can be slidably coupled to the second hinge plate (332). The second support portion (320) can include a third portion (321) that supports the second hinge plate (332) and a fourth portion (322) that extends from the third portion (321) along the folding axis (f). The second portion (312) may be configured to form a heat transfer path (p) by coming into contact with the fourth portion (322) in an unfolded state.

[0089] For example, the first part (311) may be a part that is coupled with the first hinge plate (331) of the first support part (310). The first part (311) may be slidably coupled with respect to the first hinge plate (331). For example, the first part (311) may be a part that is in contact with the first hinge plate (331) of the first support part (310). The first part (311) may cover at least a portion of the first hinge plate (331). The first part (311) may be separated from the second support part (320) by the hinge cover (340) (or the first protruding structure (341)) by being coupled with the first hinge plate (331). For example, the second part (312) may be connected to the first part (311). The second part (312), in an unfolded state, may extend from the first housing (210) toward the folding axis (f).

[0090] For example, the third part (321) may be a part of the second support part (320) that is coupled with the second hinge plate (332). The third part (321) may be slidably coupled with respect to the second hinge plate (332). For example, the third part (321) may be a part of the second support part (320) that is in contact with the second hinge plate (332). The third part (321) may surround at least a portion of the second hinge plate (332). The third part (321) may be separated from the first support part (310) by the hinge cover (340) (or the first protruding structure (341)) by being coupled with the second hinge plate (332). For example, the fourth part (322) may be connected to the third part (321). The fourth portion (322) can extend from the second housing (220) toward the folding axis (f) in an unfolded state.

[0091] For example, the second portion (312) may be in contact with the fourth portion (322) along the folding axis (f) within the unfolded state. The second portion (312) may be disconnected from the fourth portion (322) by being spaced apart from the fourth portion (322) within the plurality of folding states. For example, the electronic device (101) may be configured to maintain a low power mode of a display (e.g., the display (230) of FIG. 2A) within the plurality of folding states. The electronic device (101) may be configured to emit relatively more heat from at least one electronic component (301) within the unfolded state than within the plurality of folding states in order to display visual information through the display (230). The second portion (312) can form a heat transfer path (p) for heat emitted from the at least one electronic component (301) by coming into contact with the fourth portion (322) in the unfolded state.

[0092] For example, the second portion (312) may include a first region (312a) that is disposed on the hinge cover (340) in the unfolded state. The fourth portion (322) may include a second region (322a) that is disposed on the hinge cover (340) in the unfolded state and contacts the first region (312a). For example, the first region (312a) may be positioned on the hinge cover (340) by moving along the first support portion (310) that slides relative to the first hinge plate (331) while changing from the plurality of folding states to the unfolded state. The second region (322a) may be positioned on the hinge cover (340) by moving along the second support portion (320) that slides relative to the second hinge plate (332) while changing from the plurality of folding states to the unfolded state. The first region (312a) and the second region (322a) can be in contact with the hinge cover (340) in the unfolded state. For example, the second part (312) can include a third region (312b) extending from the first part (311). The first region (312a) can protrude from the third region (312b) toward the folding axis (f) in the unfolded state. For example, the fourth part (322) can include a fourth region (322b) extending from the third part (321). The second region (322a) can protrude from the fourth region (322b) toward the folding axis (f) in the unfolded state. In the unfolded state, the first region (312a) can be in contact with the second region (322a) with respect to the folding axis (f). The electronic device (101) is configured so that the first region (312a) is in contact with the second region (322a) in the unfolded state, thereby dispersing heat emitted from at least one electronic component (301) to the second housing (220) through a heat transfer path (p) formed by the first region (312a) and the second region (322a).

[0093] According to one embodiment, the first region (312a) and the second region (322a) may each include a deformable first heat-conducting member (410). For example, the first heat-conducting member (410) may be disposed on a portion of the second region (322a) that is in contact with the first region (312a) in an unfolded state and on a portion of the first region (312a) that is in contact with the second region (322a). For example, the first heat-conducting member (410) may be disposed along the folding axis (f) in an unfolded state. For example, the first heat-conducting member (410) may form one surface of the second region (322a) that is configured to be in contact with the first region (312a). The first heat-conducting member (410) may form one surface of the first region (312a) configured to be in contact with the one surface of the second region (322a). For example, the first heat-conducting member (410) may have a relatively high thermal conductivity, thereby increasing the heat conduction efficiency of the heat transfer path (p). For example, the first heat-conducting member (410) may be deformable, thereby reducing damage to the second portion (312) and the fourth portion (322) due to contact between the second portion (312) and the fourth portion (322) while changing from a plurality of folded states to an unfolded state.

[0094] According to one embodiment, the first heat-conducting member (410) may include a first heat-conducting part (411) disposed in a first region (312a), and a second heat-conducting part (412) disposed in a second region (322a). The first heat-conducting part (411) may be in contact with the second heat-conducting part (412) in an unfolded state. For example, the first heat-conducting part (411) may be disposed at an end of the first region (312a) facing the second region (322a) in an unfolded state. The second heat-conducting part (412) may be disposed at an end of the second region (322a) facing the first region (312a) in the unfolded state. For example, the first heat-conducting part (411) may receive heat from at least one electronic component (301). Since the first heat-conducting portion (411) is in contact with the second heat-conducting portion (412) in the unfolded state, the heat transferred from the at least one electronic component (301) to the first heat-conducting portion (411) can be transferred to the second housing (220) through the second heat-conducting portion (412).

[0095] According to one embodiment, the first support portion (310) and the second support portion (320) may each include at least one of aluminum, thermal grease, and an SMT gasket. For example, the first thermally conductive member (410) included in the first support portion (310) and the second support portion (320) and forming a heat transfer path (p) may include at least one of thermal grease and an SMT gasket, thereby reducing thermal resistance between the first support portion (310) and the second support portion (320). For example, the first support portion (310) and the second support portion (320) may each include aluminum, thereby increasing thermal conductivity for the heat transfer path (p) from the at least one electronic component (301) to the second housing (220). However, the present invention is not limited thereto.

[0096] According to one embodiment, the thermal conductivity (c1) of the first support portion (310) and the thermal conductivity (c2) of the second support portion (320) may be greater than the thermal conductivity (c3) of the hinge structure (250). Since the thermal conductivity (c1) of the first support portion (310) and the thermal conductivity (c2) of the second support portion (320) are greater than the thermal conductivity (c3) of the hinge structure (250), the electronic device (101) can increase the thermal conduction efficiency of the heat transfer path (p) formed by the first support portion (310) and the second support portion (320) in the unfolded state. For example, the first support portion (310) and the second support portion (320) can form a heat transfer path (p) from at least one electronic component (301) to the second housing (220) by being in contact over the hinge structure (250). The first support portion (310) and the second support portion (320) can increase the heat conduction efficiency of the heat transfer path (p) by being in direct contact without going through the hinge structure (250).

[0097] According to one embodiment, the electronic device (101) can include a vapor chamber (420) within the first housing (210) that contacts at least one electronic component (301) and the first support portion (310) and forms a heat transfer path (p) by extending from the at least one electronic component (301) to the first support portion (310). For example, the vapor chamber (420) can be positioned at least partially over the at least one electronic component (301). For example, the vapor chamber (420) can be attached to the at least one electronic component (301). For example, the vapor chamber (420) can provide a heat transfer path for heat transfer from the at least one electronic component (301) to the first support portion (310) within the first housing (210). For example, the vapor chamber (420) may extend to a portion of the first support portion (310) that is in contact with the second support portion (320) in the unfolded state (e.g., the first region (312a)). For example, the vapor chamber (420) may extend from at least one electronic component (301) to the folding axis (f) in the unfolded state. The electronic device (101) may be configured to provide a heat transfer path for heat transfer from at least one electronic component (301) in the first housing (210) to a portion of the first support portion (310) (e.g., the first region (312a)) by including the vapor chamber (420) in the first housing (210).

[0098] In one embodiment, the second housing (220) may include a heat dissipation member (430) attached to the second support portion (320) and configured to contact the vapor chamber (420) in an unfolded state. For example, the heat dissipation member (430) may cover at least a portion of the second support portion (320). For example, the heat dissipation member (430) may extend from the second support portion (320) into the interior of the second housing (220). For example, the heat dissipation member (430) may extend to the folding axis (f) in the unfolded state. For example, the heat dissipation member (430) may contact the vapor chamber (420) along the folding axis (f) in the unfolded state. The heat dissipation member (430) can disperse heat transferred from the vapor chamber (420), the first support portion (310), the second support portion (320), and / or the first heat-conducting member (410) in an unfolded state into the interior of the second housing (220). The electronic device (101) can form a heat transfer path (p) from at least one electronic component (301) of the first housing (210) to the second housing (220) by including the heat dissipation member (430) disposed within the second housing (220).

[0099] Although the electronic device (101) is described and illustrated as including a vapor chamber (420) within the first housing (210) and a heat dissipation member (430) within the second housing (220), it is not limited thereto. The electronic device (101) may include at least one of a plurality of vapor chambers, a plurality of heat dissipation members, or a combination thereof to provide a heat transfer path (p) for heat emitted from at least one electronic component (301) within the first housing (210). For example, unlike the illustration, the second housing (220) may include another vapor chamber distinct from the vapor chamber (420) disposed within the first housing (210) instead of the heat dissipation member (430). The other vapor chamber may form a heat transfer path (p) from at least one electronic component (301) to the second housing (220) when unfolded together with the vapor chamber (420). For example, unlike the illustrated embodiment, the first housing (220) may include a different heat dissipation member (430) than the heat dissipation member (430) disposed within the second housing (220) instead of the vapor chamber (420). The different heat dissipation member may form a heat transfer path (p) from at least one electronic component (301) to the second housing (220) in an unfolded state together with the heat dissipation member (430).

[0100] According to the above-described embodiment, the electronic device (101) may be configured such that the first support portion (310) of the first housing (210) and the second support portion (320) of the second housing (220) form a heat transfer path (p) in the unfolded state, thereby distributing at least a portion of heat emitted from at least one electronic component (301) within the first housing (210) to the second housing (220) in the unfolded state. The electronic device (101) may be configured such that the heat transfer path (p) is formed in the unfolded state, thereby reducing damage to the electronic device (101) due to heat emitted from the at least one electronic component (301).

[0101] FIG. 5A illustrates a portion of an exemplary electronic device in a first folded state. FIG. 5B illustrates a portion of an exemplary electronic device in a second folded state. FIG. 5C illustrates a portion of an exemplary electronic device in an unfolded state.

[0102] Referring to FIGS. 5A, 5B, and 5C, the electronic device (101) may include a first housing (e.g., the first housing (210) of FIG. 2A) including a first support portion (310), and a second housing (e.g., the second housing (220) of FIG. 2A) including a second support portion (320) facing the first support portion (310). The electronic device (101) may include at least one electronic component (301) within the first housing (210). The electronic device (101) may include a hinge structure (250) configured to provide a plurality of folded states in which the second housing (220) is folded about a folding axis (f) with respect to the first housing (210) and an unfolded state by rotatably coupling the first support portion (310) and the second support portion (320). The first support portion (310) may be configured to form a heat transfer path (p) from the at least one electronic component (301) to the second housing (220) by being connected to the second support portion (320) in the unfolded state. According to one embodiment, the hinge structure (250) may include a first hinge plate (331) coupled to the first housing (210), a second hinge plate (332) coupled to the second housing (220) and spaced apart from the first hinge plate (331), and a hinge cover (340) rotatably connecting the first hinge plate (331) and the second hinge plate (332).

[0103] Hereinafter, redundant descriptions of configurations having the same reference numerals as those described in FIGS. 4a and 4b are omitted.

[0104] According to one embodiment, the second portion (312) can be in contact with the fourth portion (322) along the folding axis (f) within the unfolded state. The second portion (312) can be disconnected from the fourth portion (322) by being spaced apart from the fourth portion (322) within a plurality of folding states.

[0105] Referring to FIGS. 5A and 5B, within a plurality of folding states including a first folding state and a second folding state, a first support portion (310) can be disconnected from a second support portion (320). During the transition from the first folding state to the second folding state, a first hinge plate (331) can rotate relative to a hinge cover (340). The first support portion (310) can slide toward a folding axis (f) relative to the first hinge plate (331) by moving along the first hinge plate (331) that rotates relative to the hinge cover (340). At least one electronic component (301) within the first housing (210) can rotate along the first support portion (310) that moves relative to the hinge structure (250). During the change from the first folding state to the second folding state, the second hinge plate (332) can rotate with respect to the hinge cover (340). The second support portion (320) can slide toward the folding axis (f) with respect to the second hinge plate (332) by moving along the second hinge plate (332) that rotates with respect to the hinge cover (340).

[0106] Referring to FIGS. 5b and 5c, during the change from the second folded state to the unfolded state, the first support portion (310) can be moved toward the second support portion (320) by sliding toward the folding axis (f) with respect to the first hinge plate (331). The second support portion (320) can be moved toward the first support portion (310) by sliding toward the folding axis (f) with respect to the second hinge plate (332). In the unfolded state, the first support portion (310) and the second support portion (320) can form a heat transfer path (p) from at least one electronic component (301) to the second housing (220) by contacting each other on the folding axis (f). The first hinge plate (331) and the second hinge plate (332) can be separated by the first protruding structure (341) of the hinge cover (340).

[0107] According to one embodiment, the first support portion (310) and the second support portion (320) may each include a first heat-conducting member (410). The first heat-conducting member (410) may be disposed on a portion of the first support portion (310) that is in contact with the second support portion (320) and on a portion of the second support portion (320) that is in contact with the first support portion (310). The first heat-conducting member (410) may be deformable, thereby reducing damage to the first support portion (310) and the second support portion (320) due to collision with each other while changing from a second folded state to an unfolded state.

[0108] According to the above-described embodiment, the electronic device (101) includes a first support portion (310) and a second support portion (320) configured to form a heat transfer path (p) from at least one electronic component (301) to a second housing (220) in an unfolded state, thereby reducing damage to the electronic device (101) caused by heat emitted from the at least one electronic component (301). The first support portion (310) and the second support portion (320) each include a first heat-conducting member (410) disposed at a position where the first support portion (310) and the second support portion (320) come into contact, thereby reducing damage to the first support portion (310) and the second support portion (320) and increasing heat conduction efficiency of the heat transfer path (p).

[0109] FIG. 6 illustrates a portion of an exemplary electronic device in an unfolded state.

[0110] Referring to FIG. 6, the electronic device (101) may include a first housing (e.g., the first housing (210) of FIG. 2A) including a first support portion (310), and a second housing (e.g., the second housing (220) of FIG. 2A) including a second support portion (320) facing the first support portion (310). The electronic device (101) may include at least one electronic component (301) within the first housing (210). The electronic device (101) may include a hinge structure (250) configured to provide a plurality of folded states in which the second housing (220) is folded relative to the first housing (210) about a folding axis (f) by rotatably coupling the first support portion (310) and the second support portion (320), and an unfolded state. The first support portion (310) may be configured to form a heat transfer path (p) from the at least one electronic component (301) to the second housing (220) by being connected to the second support portion (320) in the unfolded state. According to one embodiment, the hinge structure (250) may include a first hinge plate (331) coupled to the first housing (210), a second hinge plate (332) coupled to the second housing (220) and spaced apart from the first hinge plate (331), and a hinge cover (340) rotatably connecting the first hinge plate (331) and the second hinge plate (332).

[0111] According to one embodiment, the hinge cover (340) may include a second protruding structure (610) separating a first support portion (310) and a second support portion (320). The first support portion (310) and the second support portion (320) may be configured to contact the second protruding structure (610) in an unfolded state to thereby form a heat transfer path (p) through the second protruding structure (610). For example, the second protruding structure (610) may extend from the first protruding structure (341) separating the first hinge plate (331) and the second hinge plate (332). The second protruding structure (610) may extend along a folding axis (f). The second protruding structure (610) may provide the folding axis (f) together with the first protruding structure (341).

[0112] For example, the first support portion (310) may include a first portion (311) coupled with a first hinge plate (331) and a second portion (312) extending from the first portion (311). The second portion (312) may include a first area (312a) that contacts the second protruding structure (610) in an unfolded state. The second support portion (320) may include a third portion (321) coupled with the second hinge plate (332) and a fourth portion (322) that extends from the third portion (321). The fourth portion (322) may include a second area (322a) that contacts the second protruding structure (610) in the unfolded state. The second protruding structure (610) can separate the first region (312a) and the second region (322a) within the unfolded state. The protruding structure (610) may be required to have a structure for increasing the heat conduction efficiency of the heat transfer path (p) formed by the first region (312a) and the second region (322a) within the unfolded state.

[0113] In one embodiment, the second protruding structure (610) may include a deformable second heat-conducting member (612) that contacts the first support portion (310) and the second support portion (320) in an unfolded state. For example, the second protruding structure (610) may include a partition wall (611) and a second heat-conducting member (612) attached to the partition wall (611). The second heat-conducting member (612) may contact the first support portion (310) and the second support portion (320) in an unfolded state. For example, the second heat-conducting member (612) may be arranged to face the first support portion (310) and the second support portion (320) in an unfolded state and in a plurality of folded states. For example, the hinge cover (340) may include a first seating groove (621) and a second seating groove (622) extending from the bulkhead (611). A first region (312a) of the first supporting portion (310) may be rotated within the first seating groove (621). A second region (322a) of the second supporting portion (320) may be rotated within the second seating groove (622). The second heat-conducting member (612) may be positioned on at least a portion of the inner surface of the first seating groove (621) and the inner surface of the second seating groove (622), thereby coming into contact with the first region (312a) and the second region (322a) in an unfolded state. The second protruding structure (610) can increase the heat conduction efficiency of the heat transfer path (p) formed by the first support portion (310), the second support portion (320), and the second protruding structure (610) by including the second heat conducting member (612). According to one embodiment, the second heat conducting member (612) can be deformable, thereby reducing the damage of the first support portion (310) and / or the second support portion (320) by colliding with the partition wall (611) while changing from a folded state to an unfolded state.

[0114] According to one embodiment, the second heat-conducting member (612) may include a third heat-conducting portion (612a) that contacts the first region (312a) in an unfolded state, and a fourth heat-conducting portion (612b) that contacts the second region (322a) in the unfolded state. For example, the third heat-conducting portion (612a) and the fourth heat-conducting portion (612b) may be attached to a partition wall (611). The third heat-conducting portion (612a) and the fourth heat-conducting portion (612b) may be separated from each other based on the partition wall (611). For example, the third heat-conducting portion (612a) may extend from the first mounting groove (621) for the first region (312a). The fourth heat-conducting portion (612b) may extend from the second mounting groove (622) for the second region (322a). For example, the first region (312a) can receive heat from at least one electronic component (301) in an unfolded state. The heat transferred from the at least one electronic component (301) to the first region (312a) can be transferred to the second housing (220) through the third heat-conducting portion (612a) in contact with the first region (312a), the hinge cover (340) (or the partition wall (611)), the fourth heat-conducting portion (612b), and the second region (322a) in contact with the fourth heat-conducting portion (612b). The first region (312a), the third heat-conducting portion (612a), the partition wall (611), the fourth heat-conducting portion (612b), and the second region (322a) can provide a heat transfer path (p) for the heat.

[0115] Although the second heat-conducting member (612) is described and illustrated as including a third heat-conducting portion (612a) and a fourth heat-conducting portion (612b) separated from each other based on the partition wall (611), it is not limited thereto. Unlike as illustrated, the second heat-conducting member (612) may cover the partition wall (611). For example, the second heat-conducting member (612) may include a third heat-conducting portion (612a) that is in contact with the first region (312a) in an unfolded state, a fourth heat-conducting portion (612b) that is in contact with the second region (322a) in the unfolded state, and another heat-conducting portion that extends from the third heat-conducting portion (612a) to the fourth heat-conducting portion (612b) and is attached on the partition wall (611). The second heat conducting member (612) can increase the heat conduction efficiency of the heat transfer path (p) from at least one electronic component (301) to the second housing (220) by covering the partition wall (611).

[0116] According to the above-described embodiment, the hinge structure (250) includes a second protruding structure (610) that forms a heat transfer path (p) from at least one electronic component (301) to the second housing (220) together with the first support portion (310) and the second support portion (320), thereby reducing damage to the electronic device (101) caused by heat emitted from the at least one electronic component (301). The second protruding structure (610) includes a second heat-conducting member (612) that comes into contact with the first support portion (310) and the second support portion (320) in an unfolded state, thereby increasing heat conduction efficiency of the heat transfer path (p).

[0117] FIG. 7A illustrates a portion of an exemplary electronic device in a first folded state. FIG. 7B illustrates a portion of an exemplary electronic device in an unfolded state. FIG. 7C is a top plan view of a support structure of the exemplary electronic device.

[0118] Referring to FIGS. 7A and 7B , the electronic device (101) may include a first housing (e.g., the first housing (210) of FIG. 2A ) including a first support portion (310), and a second housing (e.g., the second housing (220) of FIG. 2A ) including a second support portion (320) facing the first support portion (310). The electronic device (101) may include at least one electronic component (301) within the first housing (210). The electronic device (101) may include a hinge structure (250) configured to provide a plurality of folded states in which the second housing (220) is folded relative to the first housing (210) about a folding axis (f) by rotatably coupling the first support portion (310) and the second support portion (320), and an unfolded state. The first support portion (310) may be configured to form a heat transfer path (p) from the at least one electronic component (301) to the second housing (220) by being connected to the second support portion (320) in the unfolded state. According to one embodiment, the hinge structure (250) may include a first hinge plate (331) coupled to the first housing (210), a second hinge plate (332) coupled to the second housing (220) and spaced apart from the first hinge plate (331), and a hinge cover (340) rotatably connecting the first hinge plate (331) and the second hinge plate (332).

[0119] According to one embodiment, the electronic device (101) may include a support structure (710) including a protrusion (710a) that contacts a first support portion (310) and a second support portion (320) and separates the first support portion (310) and the second support portion (320) in an unfolded state. The protrusion (710a) may be configured to be pressed in a first direction (701) perpendicular to a folding axis (f) by the first support portion (310) in the unfolded state, and to be pressed in a second direction (702) perpendicular to the folding axis (f) and opposite to the first direction (701) by the second support portion (320).

[0120] For example, the support structure (710) may be disposed on the hinge cover (340). For example, the thermal conductivity of the support structure (710) may be greater than the thermal conductivity of the first support portion (310) and the thermal conductivity of the second support portion (320). For example, the support structure (710) may be deformable. For example, the support structure (710) may be in contact with the first support portion (310) and the second support portion (320) in an unfolded state and in a plurality of folded states. For example, the support structure (710) may be positioned on the folding axis (f). For example, the support structure (710) may be configured to provide a heat transfer path (p) from at least one electronic component (301) to the second housing (220) by contacting the first support portion (310) and the second support portion (320) in an unfolded state.

[0121] For example, the protrusion (710a) may be disposed between the first support portion (310) and the second support portion (320). For example, the protrusion (710a) may be pressed in a first direction (701) by the first support portion (310) moving along the first hinge plate (331) while changing from a plurality of folded states to an unfolded state. The protrusion (710a) may be pressed in a second direction (702) opposite to the first direction (701) by the second support portion (320) moving along the second hinge plate (332) while changing from the plurality of folded states to the unfolded state. For example, the protrusion (710a) may be pressed in the first direction (701) by the first area (312a) of the first support portion (310) that contacts the support structure (710). The protrusion (710a) may be pressed in a second direction (702) opposite to the first direction (701) by the second region (322a) of the second support portion (320) in contact with the support structure (710). As the protrusion (710a) is pressed, a gap may be formed between the support structure (710) and the first support portion (310), or a gap may be formed between the support structure (710) and the second support portion (320). As a gap is formed between the support portions (310, 320) and the support portion (320), the heat conduction efficiency of the heat transfer path (p) may be reduced. The support structure (710) may be required to have a structure for reducing the gap in order to increase the heat conduction efficiency of the heat transfer path (p).

[0122] According to one embodiment, the support structure (710) may include a first support member (711), a second support member (712), and an elastic structure (713). The first support member (711) may include a first fastening portion (711a) having a zigzag shape. The second fastening portion (712a) may include a second fastening portion (712a) having a zigzag shape corresponding to the shape of the first fastening portion (711a) so as to be fastened to the first fastening portion (711a). The elastic structure (713) may include a first elastic member (713a) that presses the first support member (711) in a third direction (703) parallel to the folding axis (f), and a second elastic member (713b) that presses the second support member (712) in a fourth direction (704) parallel to the folding axis (f) and opposite to the third direction (703). The protrusion (710a) may be configured to press the first support portion (310) and the second support portion (320) in a direction inclined with respect to the first direction (701) and the third direction (703) and / or in a direction inclined with respect to the second direction (702) and the fourth direction (704) by the elastic structure (713) in the unfolded state.

[0123] For example, the first support member (711) may be disposed at least partially between the hinge cover (340) and the first support portion (310). For example, the first support member (711) may be in contact with the first region (312a) of the first support portion (310). For example, the thermal conductivity of the first support member (711) may be higher than the thermal conductivity of the first support portion (310). For example, the first support member (711) may be elastic by being deformable. For example, the first fastening portion (711a) may form at least a portion of the protrusion (710a). For example, the first fastening portion (711a) may be a portion of the first support member (711) that is in contact with the second support member (712).

[0124] For example, the second support member (712) may be disposed at least partially between the hinge cover (340) and the second support portion (320). For example, the second support member (712) may be in contact with the second region (322a) of the second support portion (320). For example, the thermal conductivity of the second support member (712) may be higher than the thermal conductivity of the second support portion (320). For example, the second support member (712) may be elastic by being deformable. For example, the second fastening portion (712a) may form a protrusion (710a) together with the first fastening portion (711a). For example, the second fastening portion (712a) may be fastened to the first fastening portion (712a) to fasten the second support member (712) to the first support member (711).

[0125] For example, the elastic structure (713) can press the first support member (711) and the second support member (712) in a direction parallel to the folding axis (f) to maintain the fastening of the first support member (711) and the second support member (712). For example, the first elastic member (713a) can be disposed on one side of the support structure (710). The first elastic member (713a) can press the protrusion (710a) in a third direction (703) parallel to the folding axis (f). The second elastic member (713b) can be disposed on the other side of the support structure (710) opposite to the one side. The second elastic member (713b) can press the protrusion (710a) in a fourth direction (704) that is parallel to the folding axis (f) and opposite to the third direction (703).

[0126] For example, while changing from a plurality of folded states to an unfolded state, the first support member (711) can be pressed in a first direction (701) by the first support portion (310). The second support member (712) can be pressed in a second direction (702) opposite to the first direction (701) by the second support portion (320). The elastic structure (713) can press the first support member (711) and the second support member (712) in a direction perpendicular to the first direction (701) and the second direction (702), for example, in a third direction (703) and a fourth direction (704). Due to the zigzag shape of the first fastening portion (711a) and the second fastening portion (712a), the protrusion (710a) pressed by the elastic structure (713) can press the support portions (310, 320) in a direction inclined with respect to the first direction (701) and the third direction (703). For example, the first support member (711) and the second support member (712) of the support structure (710) can each have elasticity. The support structure (710) can cause displacement toward the first support portion (310) by the first support member (711) pressed by the elastic structure (713). The above support structure (710) can generate displacement toward the second support portion (320) by the second support member (712) that is pressed by the elastic structure (713). The support structure (710) can reduce the formation of a gap between the support structure (710) and the support portions (310, 320) by generating displacement in a direction inclined with respect to the first direction (701) and the third direction (703) toward the support portions (310, 320). By reducing the formation of the gap, the support structure (710) can increase the heat conduction efficiency of the heat transfer path (p) formed by the support structure (710) and the support portions (310, 320).

[0127] According to the above-described embodiment, the electronic device (101) includes a support structure (710) that forms a heat transfer path (p) from at least one electronic component (301) to a second housing (220) together with support portions (310, 320), thereby reducing damage to the electronic device (101) caused by heat generated from the at least one electronic component (301). The support structure (710) is configured to press the support portions (310, 320) in a first direction (701) perpendicular to the folding axis (f) and in a direction inclined with respect to a third direction (703) parallel to the folding axis (f) in an unfolded state, thereby increasing the heat conduction efficiency of the heat transfer path (p).

[0128] Figure 8a illustrates a portion of an exemplary electronic device in a first folded state. Figure 8b illustrates a portion of an exemplary electronic device in an unfolded state. Figure 8c is a partially exploded perspective view of the exemplary electronic device.

[0129] Referring to FIGS. 8A and 8B, the electronic device (101) may include a first housing (e.g., the first housing (210) of FIG. 2A) including a first support portion (310), and a second housing (e.g., the second housing (220) of FIG. 2A) including a second support portion (320) facing the first support portion (310). The electronic device (101) may include at least one electronic component (301) within the first housing (210). The electronic device (101) may include a hinge structure (250) configured to provide a plurality of folded states in which the second housing (220) is folded relative to the first housing (210) about a folding axis (f) by rotatably coupling the first support portion (310) and the second support portion (320), and an unfolded state. The first support portion (310) may be configured to form a heat transfer path (p) from the at least one electronic component (301) to the second housing (220) by being connected to the second support portion (320) in the unfolded state. According to one embodiment, the hinge structure (250) may include a first hinge plate (331) coupled to the first housing (210), a second hinge plate (332) coupled to the second housing (220) and spaced apart from the first hinge plate (331), and a hinge cover (340) rotatably connecting the first hinge plate (331) and the second hinge plate (332).

[0130] According to one embodiment, the first hinge plate (331) may be coupled with the first support portion (310). The second hinge plate (332) may be coupled with the second support portion (320). The hinge cover (340) may include a first protruding structure (341) on the folding axis (f) that separates the first hinge plate (331) and the second hinge plate (332). The electronic device (101) may include a third heat-conducting member (810) attached on the first hinge plate (331) and the second hinge plate (332) and in contact with the first protruding structure (341). For example, the third heat-conducting member (810) may cover at least a portion of the first hinge plate (331) and at least a portion of the second hinge plate (332). For example, the thermal conductivity of the third heat-conducting member (810) may be greater than the thermal conductivity of the first hinge plate (331) and the thermal conductivity of the second hinge plate (332). For example, the third heat-conducting member (810) may be attached on one side (330a) of the first hinge plate (331) facing the display (e.g., the display (230) of FIG. 2A) and on one side (330b) of the second hinge plate (332) facing the display (230). For example, the third heat-conducting member (810), together with the first hinge plate (331), the second hinge plate (332), and the first protruding structure (341) of the hinge cover (340), may form a heat transfer path (p) from at least one electronic component (301) in the first housing (210) to the second housing (220). For example, at least a portion of the heat emitted from at least one electronic component (301) may be transferred to the third heat conducting member (810) through the first support portion (310) and the first hinge plate (331) coupled with the first support portion (310).The heat transferred to the third heat conducting member (810) can be transferred to the inside of the second housing (220) through the hinge cover (340) and the second hinge plate (332).

[0131] According to one embodiment, the third heat-conducting member (810) may include a fifth heat-conducting portion (811) attached on the first hinge plate (331), and a sixth heat-conducting portion (812) attached on the second hinge plate (332). The fifth heat-conducting portion (811) and the sixth heat-conducting portion (812) may be in contact with the first protruding structure (341) of the hinge cover (340) in an unfolded state. For example, the fifth heat-conducting portion (811) and the sixth heat-conducting portion (812) may be separated from each other based on the first protruding structure (341). For example, the fifth heat-conducting portion (811) may receive heat from at least one electronic component (301). The heat transferred from the at least one electronic component (301) to the fifth heat-conducting portion (811) can be transferred to the second housing (220) through the hinge cover (340) (or the first protruding structure (341)) in contact with the fifth heat-conducting portion (811) and the sixth heat-conducting portion (812) in contact with the hinge cover (340) in the unfolded state. The fifth heat-conducting portion (811), the hinge cover (340), and the sixth heat-conducting portion (812) can provide a heat transfer path (p) for the heat.

[0132] According to one embodiment, the electronic device (101) may include a fourth heat-conducting member (820) spaced apart from the first hinge plate (331) and the second hinge plate (332) and attached to the hinge cover (340) along the folding axis (f). For example, the hinge cover (340) may include a groove (340a) for accommodating the fourth heat-conducting member (820). The groove (340a) may be formed in a direction opposite to a direction toward the display (230). The fourth heat-conducting member (820) may be attached within the groove (340a). For example, the thermal conductivity of the fourth heat-conducting member (820) may be greater than the thermal conductivity of the hinge cover (340). The electronic device (101) can increase the heat conduction efficiency of the heat transfer path (p) formed by the first hinge plate (331), the second hinge plate (332), and the hinge cover (340) by including the fourth heat conducting member (820).

[0133] According to the above-described embodiment, the electronic device (101) can increase the heat conduction efficiency of the heat transfer path (p) from at least one electronic component (301) formed by the hinge structure (250) to the second housing (220) by including a third heat conducting member (810) and a fourth heat conducting member (820) attached to the hinge structure (250).

[0134] According to the above-described embodiment, an electronic device (e.g., electronic device (101) of FIG. 1) may include a first housing (e.g., first housing (210) of FIG. 2A) including a display (e.g., display (230) of FIG. 2A), a first supporting portion (e.g., first supporting portion (310) of FIG. 3) for supporting the display, and a second housing (e.g., second housing (220) of FIG. 2A) including a second supporting portion (e.g., second supporting portion (320) of FIG. 3) for supporting the display. The electronic device may include at least one electronic component (e.g., at least one electronic component (301) of FIG. 3) within the first housing. The electronic device may include a hinge structure (e.g., hinge structure (250) of FIG. 2B) for rotatably connecting the first housing and the second housing. The first support portion and the second support portion may be configured to be connected to each other in an unfolded state of the electronic device to provide a heat transfer path (e.g., heat transfer path (p) in FIG. 4A) from the at least one electronic component to the second housing. According to the above-mentioned embodiment, the electronic device may reduce damage to the electronic device by the at least one electronic component by including the first support portion forming the heat transfer path together with the second support portion in the unfolded state. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0135] According to one embodiment, the hinge structure may include a first hinge plate coupled with the first housing (e.g., the first hinge plate (331) of FIG. 3), and a second hinge plate coupled with the second housing and spaced apart from the first hinge plate (e.g., the second hinge plate (332) of FIG. 3). The first support portion may include a second portion (e.g., the second portion (312) of FIG. 4b) that is slidably coupled to the first hinge plate at a first portion of the first support portion (e.g., the first portion (311) of FIG. 4b) and extends from the first portion along the folding axis. The second support portion may include a third portion of the second support portion (e.g., the third portion (321) of FIG. 4B) that is slidably coupled to the second hinge plate and a fourth portion (e.g., the fourth portion (322) of FIG. 4B) that extends from the third portion along the folding axis. The heat transfer path may be formed by contact between the second portion and the fourth portion in the unfolded state. According to the above-mentioned embodiment, the electronic device may reduce damage to the electronic device by the at least one electronic component by including the fourth portion that is in contact with the second portion in the unfolded state. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0136] According to one embodiment, the hinge structure may further include a hinge cover (e.g., hinge cover (340) of FIG. 4a). The second portion may include a first region (e.g., first region (312a) of FIG. 4b) disposed between the hinge cover and the display in the unfolded state. The fourth portion may include a second region (e.g., second region (322a) of FIG. 4b) disposed between the hinge cover and the display in the unfolded state and in contact with the first region through at least one deformable thermally conductive member (e.g., first thermally conductive member (410) of FIG. 4a, second thermally conductive member (612) of FIG. 6). For example, the first region and the second region may each include a deformable first thermally conductive member (e.g., first thermally conductive member (410) of FIG. 4a). According to the above-mentioned embodiment, the electronic device can increase the heat conduction efficiency of the heat transfer path in the unfolded state and reduce damage to the first support portion and the second support portion by including the first heat conducting member. The above-mentioned embodiment can have various effects including the above-mentioned effects.

[0137] According to one embodiment, the second portion can be brought into contact along at least a portion of the hinge cover within the unfolded state. The second portion can be separated from the fourth portion by being spaced apart from the fourth portion within a plurality of folding states. According to the above-mentioned embodiment, the electronic device can reduce damage to the electronic device by the at least one electronic component by including the fourth portion that is brought into contact with the second portion within the unfolded state. The above-mentioned embodiment can have various effects including the above-mentioned effects.

[0138] According to one embodiment, the at least one heat conducting member may be disposed in at least one of the first region or the second region.

[0139] According to one embodiment, the at least one heat conducting member may be disposed on a portion of the hinge cover.

[0140] According to one embodiment, the hinge structure may include a hinge cover including a protruding structure (e.g., the second protruding structure (610) of FIG. 6) that separates the first support portion and the second support portion. The first support portion and the second support portion may be configured to form the heat transfer path through the protruding structure by contacting the protruding structure in the unfolded state. According to the above-mentioned embodiment, the first support portion and the second support portion may reduce damage to the electronic device by the at least one electronic component by contacting the protruding structure in the unfolded state. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0141] According to one embodiment, the protruding structure may further include a deformable second heat-conducting member (e.g., the second heat-conducting member (612) of FIG. 6) that contacts the first support portion and the second support portion in the unfolded state. According to the above-mentioned embodiment, the electronic device may increase the heat conduction efficiency of the heat transfer path by including the second heat-conducting member. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0142] An electronic device according to one embodiment may further include a support structure (e.g., a support structure (710) of FIG. 7A) that is in contact with the first support portion and the second support portion and includes a protrusion (e.g., a protrusion (710a) of FIG. 7A) that separates the first support portion and the second support portion in the unfolded state. The protrusion may be configured to be pressed in a first direction (e.g., a first direction (701) of FIG. 7B) perpendicular to the folding axis by the first support portion in the unfolded state, and to be pressed in a second direction (e.g., a second direction (702) of FIG. 7B) perpendicular to the folding axis and opposite to the first direction by the second support portion. According to the above-mentioned embodiment, the electronic device may increase the heat conduction efficiency of the heat transfer path by including the support structure. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0143] According to one embodiment, the support structure may include a first support member (e.g., the first support member (711) of FIG. 7B) including a first fastening portion (e.g., the first fastening portion (711a) of FIG. 7B) having a zigzag shape. The support structure may include a second support member (e.g., the second support member (712) of FIG. 7B) including a second fastening portion (e.g., the second fastening portion (712a) of FIG. 7B) having a zigzag shape corresponding to the shape of the first fastening portion, such that the second fastening portion is fastened to the first fastening portion. The support structure may include an elastic structure (e.g., an elastic structure (713) of FIG. 7B) including a first elastic member (e.g., a first elastic member (713a) of FIG. 7B) that presses the first support member in a third direction parallel to the folding axis (e.g., a third direction (703) of FIG. 7B), and a second elastic member (e.g., a second elastic member (713b) of FIG. 7B) that presses the second support member in a fourth direction parallel to the folding axis and opposite to the third direction (e.g., a fourth direction (704) of FIG. 7B). The protrusion may be configured to press the first support portion and the second support portion in a direction inclined with respect to the first direction and the third direction by the elastic structure in the unfolded state. According to the above-mentioned embodiment, the electronic device may increase the heat conduction efficiency of the heat transfer path by including the support structure. The above-mentioned embodiments may have various effects including the above-mentioned effects.

[0144] According to one embodiment, the hinge structure may include a first hinge plate coupled to the first support portion, and a second hinge plate coupled to the second support portion. The hinge structure may include a hinge cover including a protruding structure (e.g., a first protruding structure (341) of FIG. 4B) on the folding axis that rotatably connects the first hinge plate and the second hinge plate and separates the first hinge plate and the second hinge plate. The electronic device may further include a third heat-conducting member (e.g., a third heat-conducting member (810) of FIG. 8A) attached on the first hinge plate and the second hinge plate and in contact with the protruding structure. According to the above-mentioned embodiment, the electronic device may increase heat conduction efficiency of the heat transfer path by including the third heat-conducting member. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0145] An electronic device according to one embodiment may further include a fourth heat-conducting member (e.g., the fourth heat-conducting member (820) of FIG. 8A) spaced apart from the first hinge plate and the second hinge plate and attached to the hinge cover along the folding axis. According to the above-mentioned embodiment, the electronic device may increase the heat conduction efficiency of the heat transfer path by including the fourth heat-conducting member. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0146] According to one embodiment, the display may include a first display area coupled on the first housing (e.g., the first display area (231) of FIG. 2A), a second display area coupled on the second housing (e.g., the second display area (232) of FIG. 2A), and a third display area extending from the first display area to the second display area and being deformable (e.g., the third display area (233) of FIG. 2A). According to the above-mentioned embodiment, the electronic device may provide a variety of user experiences to the user by including the display including the deformable third area. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0147] An electronic device according to one embodiment may further include a vapor chamber (e.g., vapor chamber 420 of FIG. 4A) within the first housing, which is in contact with the at least one electronic component and the first support portion, and forms the heat transfer path by extending from the at least one electronic component to the first support portion. According to the above-mentioned embodiment, the electronic device may form the heat transfer path within the first housing by including the vapor chamber. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0148] According to one embodiment, the second housing may further include a heat dissipation member (e.g., heat dissipation member (430) of FIG. 4A) attached to the second support portion and configured to contact the vapor chamber in the unfolded state. According to the above-mentioned embodiment, the electronic device may form the heat transfer path within the second housing by including the heat dissipation member. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0149] According to one embodiment, the first support portion and the second support portion may each include at least one of aluminum, thermal grease, and an SMT gasket. According to the above-mentioned embodiment, the first support portion and the second support portion may include members having relatively high thermal conductivity, thereby increasing the heat conduction efficiency of the heat transfer path. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0150] According to one embodiment, the thermal conductivity of the first support portion (e.g., c1 in FIG. 4B) and the thermal conductivity of the second support portion (e.g., c2 in FIG. 4B) may be greater than the thermal conductivity of the hinge structure (e.g., c3 in FIG. 4B). According to the above-mentioned embodiment, the thermal conductivity of the first support portion and the thermal conductivity of the second support portion may be greater than the thermal conductivity of the hinge structure, thereby increasing the thermal conduction efficiency of the heat transfer path. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0151] In one embodiment, an electronic device may include a first housing including a first support portion, and a second housing including a second support portion facing the first support portion. The electronic device may include a flexible display including a first display area coupled to the first housing, a second display area coupled to the second housing, and a third display area extending from the first display area to the second display area and being deformable. The electronic device may include at least one electronic component within the first housing. The electronic device may include a vapor chamber within the first housing that contacts the at least one electronic component and the first support portion, and extends from the at least one electronic component to the first support portion. The electronic device may include a hinge structure configured to provide a plurality of folded states in which the second housing is folded relative to the first housing about a folding axis by rotatably coupling the first support portion and the second support portion, and an unfolded state. The first support portion may be configured to form a heat transfer path from the at least one electronic component to the second housing through the vapor chamber by being connected to the second support portion in the unfolded state. According to the above-mentioned embodiment, the electronic device may reduce damage to the electronic device by including the first support portion that forms the heat transfer path together with the second support portion in the unfolded state. The electronic device may provide a variety of user experiences to the user by including the display including the deformable third region. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0152] According to one embodiment, the hinge structure may include a first hinge plate coupled to the first housing, and a second hinge plate coupled to the second housing and spaced apart from the first hinge plate. The first support portion may include a first portion slidably coupled to the first hinge plate and supporting the first hinge plate, and a second portion extending from the first portion along the folding axis. The second support portion may include a third portion slidably coupled to the second hinge plate and supporting the second hinge plate, and a fourth portion extending from the third portion along the folding axis. The second portion may be configured to form the heat transfer path by contacting the fourth portion in the unfolded state. According to the above-mentioned embodiment, the electronic device may reduce damage to the electronic device by the at least one electronic component by including the fourth portion in contact with the second portion in the unfolded state. The above-mentioned embodiments may have various effects including the above-mentioned effects.

[0153] According to one embodiment, the hinge structure may include a hinge cover including a protruding structure separating the first support portion and the second support portion. The first support portion and the second support portion may be configured to form the heat transfer path through the protruding structure by contacting the protruding structure in the unfolded state. According to the above-mentioned embodiment, the first support portion and the second support portion may reduce damage to the electronic device by the at least one electronic component by contacting the protruding structure in the unfolded state. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0154] An electronic device according to one embodiment may further include a support structure including a protrusion that contacts a first support portion and a second support portion and separates the first support portion and the second support portion in the unfolded state. The protrusion may be configured to be pressed in a first direction perpendicular to the folding axis by the first support portion in the unfolded state, and to be pressed in a second direction perpendicular to the folding axis and opposite to the first direction by the second support portion. According to the above-mentioned embodiment, the electronic device may increase the heat conduction efficiency of the heat transfer path by including the support structure. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0155] According to one embodiment, the support structure may include a first support member including a first fastening portion having a zigzag shape. The support structure may include a second support member including a second fastening portion having a zigzag shape corresponding to a shape of the first fastening portion so as to be fastened to the first fastening portion. The support structure may include an elastic structure including a first elastic member that presses the first support member in a third direction parallel to the folding axis, and a second elastic member that presses the second support member in a fourth direction parallel to the folding axis and opposite to the third direction. The protrusion may be configured to press the first support portion and the second support portion in a direction inclined with respect to the first direction and the third direction by the elastic structure in the unfolded state. According to the above-mentioned embodiment, the electronic device may increase the heat conduction efficiency of the heat transfer path by including the support structure. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0156] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0157] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0158] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0159] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0160] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0161] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device (101), Display (230); A first housing (210) including a first supporting portion (310) for supporting the display; A second housing (220) including a second support part (320) for supporting the display; At least one electronic component (301) placed within the first housing (210); and It includes a hinge structure (250) that rotatably connects the first housing (210) and the second housing (220); The above first support part (310) and the above second support part (320) are, configured to provide a heat transfer path (p) from said at least one electronic component (301) to said second housing (220) by being connected each other within the folded state of said electronic device. Electronic device (101).

2. In paragraph 1, The above hinge structure (250) is A first hinge plate (252; 331) coupled with the first housing (210); and A second hinge plate (253; 332) coupled with the second housing (220) and spaced apart from the first hinge plate (252; 331); The above first support part (310) is, A first part (311) of the first support part (310) is slidably coupled to the first hinge plate (252; 331) and includes a second part (312) extending from the first part (311) along the folding axis (f). The above second support part (320) is A fourth part (322) is slidably coupled to the second hinge plate (253; 332) in the third part (321) of the second support part (320) and extends along the folding axis (f) from the third part (321). The above heat transfer path (p) is, In the above unfolded state, the second part (312) and the fourth part (322) are formed by contacting each other. Electronic device (101).

3. In paragraph 1 or 2, The above hinge structure (250) is Further comprising a hinge cover (251; 340); The above second part (312) is, Including a first region (312a) arranged between the hinge cover (251; 340) and the display in the unfolded state; The above fourth part (322) is, A second region (322a) disposed between the hinge cover (251; 340) and the display in the unfolded state and in contact with the first region (312a) through at least one deformable heat conducting member; Electronic device (101).

4. In any one of paragraphs 1 to 3, The above second part (312) is, In the above unfolded state, the fourth part (322) and at least a part of the hinge cover (251; 340) are in contact, disconnected from the fourth portion (322) within multiple folding states; Electronic device (101).

5. In any one of paragraphs 1 to 4, At least one of the above heat conducting members, At least one end of the first region (312a) or the second region (322a) is disposed, Electronic device (101).

6. In any one of paragraphs 1 to 5, At least one of the above heat conducting members, Positioned on a part of the above hinge cover (251; 340), Electronic device (101).

7. In any one of paragraphs 1 to 6, A support structure (710) including a protrusion (710a) that is in contact with the first support portion (310) and the second support portion (320) and separates the first support portion (310) and the second support portion (320) in the unfolded state; further comprising, The above protrusion (710a) is It is configured to be pressed in a first direction (701) perpendicular to the folding axis (f) by the first support portion (310) within the above-described unfolded state, and to be pressed in a second direction (702) perpendicular to the folding axis (f) and opposite to the first direction (701) by the second support portion (320). Electronic device (101).

8. In any one of paragraphs 1 to 7, The above support structure (710) is A first support member (711) including a first fastening portion (711a) having a zigzag shape; A second support member (712) including a second fastening member (712a) having a zigzag shape corresponding to the shape of the first fastening member (711a) so as to be fastened to the first fastening member (711a); and An elastic structure (713) including a first elastic member (713a) that presses the first support member (711) in a third direction (703) parallel to the folding axis (f), and a second elastic member (713b) that presses the second support member (712) in a fourth direction (704) parallel to the folding axis (f) and opposite to the third direction (703); The above protrusion (710a) is In the above unfolded state, the first support portion (310) and the second support portion (320) are configured to be pressed in a direction inclined with respect to the first direction (701) and the third direction (703) by the elastic structure (713). Electronic device (101).

9. In any one of paragraphs 1 to 8, The above hinge structure (250) is A first hinge plate (252; 331) coupled with the first support portion (310); A second hinge plate (253; 332) coupled with the second support portion (320); and A hinge cover (251; 340) including a protruding structure (341) on a folding axis (f) that rotatably connects the first hinge plate (252; 331) and the second hinge plate (253; 332) and separates the first hinge plate (252; 331) and the second hinge plate (253; 332); Further comprising a third heat conducting member (810) attached on the first hinge plate (252; 331) and the second hinge plate (253; 332) and in contact with the protruding structure (341); Electronic device (101).

10. In any one of paragraphs 1 to 9, Further comprising a fourth heat conducting member (820) spaced apart from the first hinge plate (252; 331) and the second hinge plate (253; 332) and attached to the hinge cover (251; 340) along the folding axis (f); Electronic device (101).

11. In any one of paragraphs 1 to 10, The above display (230) is A first display area (231) coupled on the first housing (210); A second display area (232) coupled to the second housing (220); and A third display area (233) extending from the first display area (231) to the second display area (232) and being deformable; Electronic device (101).

12. In any one of paragraphs 1 to 11, Further comprising a vapor chamber (420) within the first housing (210) that is in contact with the at least one electronic component (301) and the first support portion (310) and forms the heat transfer path (p) by extending from the at least one electronic component (301) to the first support portion (310); Electronic device (101).

13. In any one of paragraphs 1 to 12, The above second housing (220) is, Further comprising a heat dissipation member (430) attached to the second support portion (320) and configured to be in contact with the vapor chamber (420) in the unfolded state; Electronic device (101).

14. In any one of paragraphs 1 to 13, The above first support part (310) and the above second support part (320) are, Each comprising at least one of aluminum, thermal grease, and SMT gasket; Electronic device (101).

15. In any one of paragraphs 1 to 14, The thermal conductivity (c1) of the first support portion (310) and the thermal conductivity (c2) of the second support portion (320) are Greater than the thermal conductivity (c3) of the above hinge structure (250), Electronic device (101).

Images