Sensor module and electronic device

Abstract

The present application relates to the technical field of sensors. Provided are a sensor module and an electronic device, which can solve the problem of poor universality of sensor modules in related technologies. The sensor module is applied to an electronic device and comprises a light source module, a driving unit, a TOF receiving sensor and a proximity sensor. The light source module comprises a light source, the light source having a first light-emitting portion and a plurality of second light-emitting portions. The driving unit is electrically connected to the first light-emitting portion and is used for driving the first light-emitting portion to emit a first light ray. The TOF receiving sensor is used for receiving a first reflected light ray, the first reflected light ray being a light ray formed after the first light ray is reflected by a target object. The proximity sensor is electrically connected to each second light-emitting portion and is used for driving at least one second light-emitting portion to emit a second light ray. The proximity sensor is further used for receiving a second reflected light ray, the second reflected light ray being a light ray formed after the second light ray is reflected by the target object. The present application can be used for electronic devices such as mobile phones.

Description

Sensor modules and electronic equipment

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on September 18, 2023, with application number 202311209373.5 and application name “Sensor Module and Electronic Equipment”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of sensor technology, and in particular to a sensor module and electronic equipment. Background Art

[0003] With the development of electronic technology, electronic devices such as mobile phones are usually equipped with multiple sensors to meet various needs of consumers. For example, current electronic devices are equipped with TOF (time of flight) sensors and proximity sensors.

[0004] The TOF sensor consists of two modules: a transmitter and a receiver. Its operating principle is as follows: the transmitter continuously emits light toward the target. When the light is reflected by the target and received by the receiver, the TOF sensor calculates the distance between the sensor and the target based on the time difference between the transmitter and the receiver. This information provides depth information for object recognition, enabling functions such as object recognition. The proximity light sensor also consists of two modules: a transmitter and a receiver. Its operating principle is as follows: the transmitter continuously emits light toward the target. When the light reaches the target, it is reflected. The proximity light sensor determines the distance of the target by measuring the intensity of the light reflected by the target at the receiver, enabling functions such as turning off the screen during calls.

[0005] For electronic device designers, internal space is at a premium. If the TOF sensor and proximity light sensor are installed independently, this will occupy a large amount of space inside the electronic device. To address this issue, a related art sensor module is provided that reduces the internal space occupied by the electronic device by sharing a transmitter end with the proximity light sensor and the TOF sensor. However, this shared transmitter end design has limited flexibility and cannot simultaneously meet the varying light intensity requirements of the proximity light sensor's receiver when installed in different locations, thereby reducing the versatility of the sensor module.

[0006] Summary of the Invention

[0007] The embodiments of the present application provide a sensor module and an electronic device, which are used to solve the problem of poor versatility of sensor modules in related technologies.

[0008] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0009] In the first aspect, an embodiment of the present application provides a sensor module, which is applied to an electronic device, including a light source module, a driving unit, a TOF receiving sensor and a proximity sensor; the light source module includes a light source, and the light source has a first light-emitting portion and multiple second light-emitting portions; the driving unit is electrically connected to the first light-emitting portion, and is used to drive the first light-emitting portion to emit a first light; the TOF receiving sensor is used to receive a first reflected light, and the first reflected light is a light formed by the first light being reflected by the target object; the proximity sensor is electrically connected to each second light-emitting portion, and is used to drive at least one second light-emitting portion to emit a second light, and the proximity sensor is also used to receive the second reflected light, and the second reflected light is a light formed after the second light is reflected by the target object.

[0010] The sensor module in the embodiment of the present application has a plurality of second light-emitting parts, and the proximity sensor is electrically connected to each second light-emitting part and is used to drive at least one second light-emitting part to emit a second light. In this way, by driving some or all of the second light-emitting parts to emit light, the light-emitting power can be adjusted to meet the different requirements of the proximity sensor for the light source's light-emitting power when the proximity sensor is installed in different positions. Therefore, there is no need to adjust the design of the light source when the proximity sensor is installed in different positions, thereby improving the versatility of the sensor module and further helping to reduce the design and manufacturing costs of the sensor.

[0011] In some embodiments, the light source includes a chip substrate and an array of light-emitting elements disposed on the chip substrate. A portion of the light-emitting elements in the array constitutes a first light-emitting section, and another portion of the light-emitting elements in the array constitutes a second light-emitting section. The number of light-emitting elements in the first light-emitting section is greater than the sum of the number of light-emitting elements in the second light-emitting section of the light source. This arrangement can balance the different light power requirements of the sensor module for the first and second light-emitting sections of the light source.

[0012] In some embodiments, a light source includes a chip substrate and an array of light-emitting elements disposed on the chip substrate. A portion of the light-emitting elements in the array constitute a first light-emitting section, and another portion of the light-emitting elements in the array constitute a second light-emitting section. An insulating barrier is provided on the chip substrate, separating the first light-emitting section from each of the second light-emitting sections. This arrangement prevents contact and short circuiting between conductive components (such as electrodes of the light-emitting elements) on the first and second light-emitting sections on the chip substrate.

[0013] In some embodiments, the light emitting element array is a polygonal array, and each second light emitting portion is located at the same corner of the light emitting element array.

[0014] In some embodiments, the array of light emitting elements is a rectangular array.

[0015] In some embodiments, the number of light-emitting elements in the first light-emitting section is N1, the sum of the number of light-emitting elements in the second light-emitting section of the light source is N2, and N1 / N2 satisfies: 20 ≤ N1 / N2 ≤ 70. This configuration can better balance the different luminous power requirements of the sensor module for the first and second light-emitting sections of the light source.

[0016] In some embodiments, the light source module includes a housing and an optical element. The housing has an opening, the optical element is disposed at the opening, and the light source is disposed within the housing. The optical element includes a first region and a second region, the first region being configured to allow a first light ray to pass through, and the second region being configured to allow a second light ray to pass through. The first field of view (FOV1) formed by the first light ray passing through the first region is different from the second field of view (FOV2) formed by the second light ray passing through the second region. This configuration can meet the different requirements of electronic devices for the sensing areas of TOF sensors and proximity sensors.

[0017] In some embodiments, the second field of view FOV2 is greater than the first field of view FOV1. This configuration can increase the sensing area of ​​the proximity light sensor and greatly increase the range of the receiving end of the proximity light sensor.

[0018] In some embodiments, the optical element is a diffuser plate, and the first region and the second region are different diffusion areas in the optical element. This configuration makes the structure of the optical element simpler while achieving that the first field of view angle FOV1 is not equal to the second field of view angle FOV2.

[0019] In some embodiments, the light source module includes a housing and an optical element. The housing has an opening, the optical element is disposed at the opening, and the light source is disposed within the housing. The proximity sensor includes a first photoelectric element disposed within the housing and configured to receive the second reflected light. This arrangement allows the first photoelectric element and the light source to share a light-transmitting window, simplifying the structure of the sensor module.

[0020] In some embodiments, the first photoelectric element is further configured to receive a third reflected light ray, which is formed after the first light ray is reflected by the optical element. The driving unit includes a first control unit, a first driving module and a first quantization module, each electrically connected to the first control unit. The first driving module is electrically connected to the first light-emitting portion and configured to drive the first light-emitting portion to emit the first light ray. The first quantization module is electrically connected to a first signal port of the first photoelectric element, which is configured to output a first electrical signal representing the intensity of the third reflected light ray. This configuration can reduce the number of components in the sensor module.

[0021] In some embodiments, the first quantization module includes a first current-voltage converter and a first analog-to-digital converter, the first analog-to-digital converter is electrically connected to the first control unit, and the first current-voltage converter is connected between the first analog-to-digital converter and the first signal port.

[0022] In some embodiments, the drive unit further includes a second drive module electrically connected to the first control unit, the second drive module electrically connected to each second light-emitting portion and configured to drive at least one second light-emitting portion to emit a second light; a first quantization module electrically connected to the second signal port of the first photoelectric element, the second signal port configured to output a second electrical signal representing the intensity of the second reflected light; the first photoelectric element, the first control unit, the second drive module, and the first quantization module constitute the proximity sensor. This configuration can make the sensor module more compact.

[0023] In some embodiments, the second signal port and the first signal port are the same port. This arrangement can make the structure of the sensor module more concise.

[0024] In some embodiments, the proximity sensor includes a data processing module, which includes a second control unit, a second driver module, and a second quantization module, each electrically connected to the second control unit. The second driver module is electrically connected to each second light-emitting portion and is configured to drive at least one second light-emitting portion to emit a second light. The second quantization module is electrically connected to a second signal port of the first photoelectric element, which is configured to output a second electrical signal representing the intensity of the second reflected light. This configuration converts the second electrical signal output by the first photoelectric element into a digital signal, thereby facilitating processing by the processor.

[0025] In some embodiments, the second quantization module includes a second current-voltage converter and a second analog-to-digital converter, the second analog-to-digital converter is electrically connected to the second control unit, and the second current-voltage converter is connected between the second analog-to-digital converter and the second signal port.

[0026] In some embodiments, the data processing module is disposed outside the accommodating cavity. This arrangement can reduce the impact on the light source module when the data processing module is damaged and needs to be replaced.

[0027] In some embodiments, the light source module further includes a circuit board, which is located in the accommodating cavity, and the data processing module and the light source are both arranged on the circuit board. This arrangement can reduce the space occupied by the sensor module in the electronic device.

[0028] In a second aspect, an embodiment of the present application provides an electronic device comprising the sensor module according to any one of the first aspects.

[0029] The beneficial effects of the electronic device in the embodiment of the present application are the same as the beneficial effects of the sensor module in the first aspect, and will not be repeated here.

[0030] In some embodiments, the electronic device includes a display screen having an aperture area. The TOF receiving sensor and light source are disposed at the aperture area. The proximity sensor is disposed on the back side of the display screen, with the projection of the proximity sensor on the display screen located outside the aperture area. When the sensor module is in a proximity light operating state, the proximity sensor drives each second light emitting unit to emit a second light beam. This configuration avoids a low light intensity of the second reflected light beam received by the proximity sensor due to insufficient light power of the second light emitting unit.

[0031] In some embodiments, an electronic device includes a display screen having an aperture area, and a TOF receiving sensor, a light source, and a proximity sensor are all disposed in the aperture area. When the sensor module is in a proximity light operating state, the proximity sensor drives a plurality of second light-emitting units to emit a second light beam. This configuration prevents saturation of the proximity sensor due to excessive light power from the second light-emitting units.

[0032] In a third aspect, an embodiment of the present application provides an electronic device, comprising a processor and a sensor module according to any one of the first aspects, wherein the TOF receiving sensor and the proximity sensor of the sensor module are electrically connected to the processor respectively, and the TOF receiving sensor is electrically connected to the driving unit.

[0033] The beneficial effects of the electronic device in the embodiment of the present application are the same as the beneficial effects of the sensor module in the first aspect, and will not be repeated here.

[0034] In some embodiments, the processor is further electrically connected to the drive unit. This arrangement is beneficial for reducing the power consumption of the TOF receiving sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] FIG1 is a schematic structural diagram of a sensor module of an electronic device in the related art;

[0036] FIG2 is a front view of an electronic device (mobile phone) in some embodiments of the present application;

[0037] FIG3 is a partial view of the top of the electronic device in FIG2 ;

[0038] FIG4 is a cross-sectional view taken along line AA of the electronic device in FIG2 ;

[0039] FIG5 is a partial view of the top of an electronic device in some embodiments of the present application;

[0040] FIG6 is a longitudinal cross-sectional view of the top of an electronic device in some embodiments of the present application;

[0041] FIG7 is a diagram showing the connection architecture between the sensor module and the processor in the first embodiment of the present application;

[0042] FIG8 is a schematic diagram of the working principle of the sensor module in some embodiments of the present application;

[0043] FIG9 is a front view of a light source module of a sensor module in the first embodiment of the present application;

[0044] FIG10 is a BB cross-sectional view of the light source module in FIG9 ;

[0045] FIG11 is a top view of the light source in FIG10 ;

[0046] FIG12 is a top view of an assembly formed by a light source and a circuit board in the light source module shown in FIG10 ;

[0047] FIG13 is a bottom view of an assembly formed by a light source and a circuit board in the light source module shown in FIG10 ;

[0048] FIG14 is an external connection diagram of the light source module, the driving unit, and the proximity sensor in the sensor module in the first embodiment of the present application;

[0049] FIG15 is a front view of a light source module of a sensor module in a second embodiment of the present application;

[0050] FIG16 a is a CC cross-sectional view of the light source module shown in FIG15 ;

[0051] FIG16 b is a schematic structural diagram of a light source module in some other embodiments of the present application;

[0052] FIG17 is a diagram showing the connection architecture of the sensor module and the processor in the third embodiment of the present application;

[0053] FIG18 is a longitudinal cross-sectional view of a light source module of a sensor module in a third embodiment of the present application;

[0054] FIG19 is a schematic structural diagram of the light source module in FIG18 when an abnormality occurs;

[0055] FIG20 is a top view of an assembly formed by a light source and a circuit board in the light source module shown in FIG18 ;

[0056] FIG21 is a bottom view of an assembly formed by a light source and a circuit board in the light source module shown in FIG18 ;

[0057] FIG22 is an external connection diagram of the light source module, the driving unit, and the proximity sensor in the sensor module in the third embodiment of the present application;

[0058] FIG23 is a first diagram showing the working principle of the first photoelectric element of the sensor module in the fourth embodiment of the present application;

[0059] FIG24 is a second diagram showing the working principle of the first photoelectric element of the sensor module in the fourth embodiment of the present application;

[0060] FIG25 is a diagram illustrating a connection architecture between a sensor module and a processor in a fourth embodiment of the present application;

[0061] FIG26 is a top view of an assembly formed by a light source and a circuit board in the light source module shown in FIG24 ;

[0062] FIG27 is an external connection diagram of the light source module, the driving unit, and the proximity sensor in the sensor module in the fourth embodiment of the present application;

[0063] FIG28 is a diagram illustrating a connection architecture between a sensor module and a processor in a fifth embodiment of the present application;

[0064] FIG29 is a longitudinal sectional view of the light source module of the sensor module in the fifth embodiment;

[0065] FIG30 is a diagram illustrating a connection architecture between a sensor module and a processor in a sixth embodiment of the present application;

[0066] FIG31 is an external connection diagram of the light source module, the driving unit, and the proximity sensor in the sensor module in the sixth embodiment of the present application. DETAILED DESCRIPTION

[0067] The technical solutions in some embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.

[0068] Figure 1 shows a schematic diagram of a sensor module for an electronic device in the related art. The sensor module includes a time-of-flight (TOF) sensor, a driver IC, a proximity sensor (P sensor), a light source (the VSCEL shown in the figure), and a sensor hub (also known as a sensor control center).

[0069] The TOF receiving sensor is connected to the driver chip, the driver chip is connected to the sensor hub, and the sensor hub is also connected to the receiving sensor. The light source is a VCSEL (vertical cavity surface emitting laser). The anode of the light source is connected to the power supply LDVCC, and the cathode of the light source is respectively connected to the first control port LD OUT of the above-mentioned driver chip and the second control port P OUT of the receiving sensor.

[0070] In the above-mentioned sensor module, the TOF receiving sensor, driver chip, and light source constitute the TOF sensor, with the light source being the transmitting end of the TOF sensor and the TOF receiving sensor being the receiving end. The receiving sensor and light source constitute the proximity light sensor, with the light source being the transmitting end of the proximity light sensor and the receiving sensor being the receiving end of the proximity light sensor. It can be seen from this that in this sensor module in the related art, the TOF sensor and the proximity light sensor share a common transmitting end (i.e., light source). This eliminates the need for separate light sources for the TOF sensor and the proximity light sensor, thereby reducing the number of components and the internal space occupied by the sensor module in the electronic device.

[0071] In electronic devices (such as mobile phones), receiving sensors usually have multiple installation locations. In some electronic devices, the receiving sensor is installed on the back of the display screen. Since the display screen has an attenuation effect on light, if the luminous power of the light source is small, the light intensity of the light emitted by the light source is weak. After the light is reflected by the target object and attenuated by the display screen, it cannot be well received by the receiving sensor. Therefore, the light source needs to have a larger luminous power to meet the receiving sensor's requirements for the intensity of the received light. In other electronic devices, the receiving sensor is installed in the opening area of ​​the display screen. At this time, since there is no display screen to attenuate the light, if the light intensity received by the receiving sensor is large, the receiving sensor is more likely to be saturated, making the proximity light sensor unable to accurately sense the position of the target object. Therefore, when the receiving sensor is installed in the opening area of ​​the display screen, the light source needs to have a smaller luminous power.

[0072] However, the luminous power of the light source in the sensor module in the related art cannot be adjusted to a large extent. For example, when the light source is a VCSEL, according to the luminous characteristics of the VCSEL, the VCSEL has a threshold current. When the driving current of the VCSEL is near the threshold current, the luminous power of the VCSEL will be unstable. The threshold current limits the adjustment of the luminous power. Therefore, the light source cannot simultaneously meet the luminous power requirements of the receiving sensor at the above-mentioned two installation positions. The light source needs to be designed separately for the above-mentioned two installation positions. This makes the versatility of the sensor module poor, which is not conducive to reducing the design and manufacturing costs of the sensor module.

[0073] To this end, an embodiment of the present application provides a sensor module and an electronic device, wherein the light source has a first light-emitting part and multiple second light-emitting parts, the first light-emitting part is the transmitting end of the TOF sensor, and the multiple second light-emitting parts are the transmitting ends of the proximity light sensor. By driving some or all of the second light-emitting parts to emit light, the different requirements of the receiving end of the proximity light sensor for the light power of the light source at different installation positions can be met, thereby improving the versatility of the sensor module.

[0074] The electronic devices in the embodiments of the present application can be mobile phones, tablet computers, wearable devices (such as smart watches, smart bracelets, smart glasses, smart jewelry, etc.), vehicle-mounted devices, augmented reality (AR) devices, virtual reality (VR) devices, laptop computers, ultra-mobile personal computers (UMPCs), netbooks, personal digital assistants (PDAs), and other electronic devices with TOF functions and proximity light functions.

[0075] The following uses a mobile phone as an example to introduce the composition of the sensor module of the electronic device in the embodiment of the present application. Other types of electronic devices can be specifically configured with reference to the composition of the sensor module in the mobile phone embodiment, which will not be described in detail here.

[0076] As shown in Figures 2 to 4, Figure 2 is a front view of an electronic device (mobile phone) in some embodiments of the present application, Figure 3 is a partial view of the top of the electronic device in Figure 2, and Figure 4 is a cross-sectional view taken along line AA of the electronic device in Figure 2. The electronic device includes a housing 200, a display screen 300, and a sensor module 100, with the sensor module 100 mounted on the housing 200.

[0077] In some embodiments, as shown in Figures 2 and 4, the housing 200 includes a middle frame 210 (also referred to as a front shell or front frame) and a back cover 220 (also referred to as a battery cover). The display screen 300 and the back cover 220 are mounted on opposite sides of the middle frame 210. The display screen 300 and the middle frame 210 form a first storage space 230, within which the sensor module 100 is located. The back cover 220 and the middle frame 210 form a second storage space 240, within which the motherboard 250, a battery, and other components are located. The sensor module 100 is electrically connected to the motherboard 250.

[0078] The middle frame 210 and the back cover 220 may be detachably connected or integrally formed, which is not specifically limited herein. The display screen 300 may be a liquid crystal display screen or an OLED (Organic Light-Emitting Diode) display screen, which is not specifically limited herein.

[0079] In some embodiments, as shown in Figures 2 and 3, the sensor module 100 includes a light source module 1, a TOF receiving sensor 2 (TOF sensor), and a proximity sensor 3 (P sensor). The light source module 1 and the TOF receiving sensor 2 constitute a TOF sensor, with the light source module 1 being the transmitting end of the TOF sensor and the TOF receiving sensor 2 being the receiving end of the TOF sensor. The light source module 1 and the proximity sensor 3 constitute a proximity light sensor, with the light source module 1 being the transmitting end of the proximity light sensor and the proximity sensor 3 being the receiving end of the proximity light sensor.

[0080] There are multiple ways to install the sensor module. Figures 3 and 4 illustrate a first arrangement of the sensor module. An opening 310 is provided on the display screen 300. The TOF receiving sensor 2, light source module 1, and proximity sensor 3 are all located within the opening 310. The back side of the display screen 300 refers to the side of the display screen 300 facing away from the display surface, such as the left side of the display screen 300 in Figure 4.

[0081] In some embodiments, as shown in FIG3 , the opening area 310 is in the shape of an elongated strip and extends along the width direction X of the electronic device. The TOF receiving sensor 2, the light source module 1, and the proximity sensor 3 are all opposite to the opening area 310, and the TOF receiving sensor 2, the light source module 1, and the proximity sensor 3 are arranged along the extension direction X of the opening area 310. Of course, the opening area 310 can also be circular, with three opening areas 310 provided, and the three opening areas 310 are respectively arranged opposite to the TOF receiving sensor 2, the light source module 1, and the proximity sensor 3.

[0082] Figures 5 and 6 illustrate a second sensor module configuration. Figure 5 is a partial view of the top of the electronic device in some embodiments of the present application, and Figure 6 is a longitudinal cross-sectional view of the top of the electronic device in some embodiments of the present application. The TOF receiving sensor 2 and light source module 1 are positioned within the aperture 310 , while the proximity sensor 3 is positioned on the back side of the display 300 , with the projection of the proximity sensor 3 on the display 300 positioned outside the aperture 310 .

[0083] In some embodiments, as shown in FIG5 , the opening area 310 is in the shape of an elongated strip and extends along the width direction X of the electronic device. The TOF receiving sensor 2 and the light source module 1 are both opposite to the opening area 310, and the TOF receiving sensor 2 and the light source module 1 are arranged along the extension direction X of the opening area 310. Of course, the opening area 310 can also be circular, with two opening areas 310 provided, and the two opening areas 310 are respectively arranged opposite to the TOF receiving sensor 2 and the light source 11.

[0084] In some embodiments, as shown in FIG5 , along the length direction Y of the electronic device, the projection of the proximity sensor 3 on the display screen 300 is located on one side of the opening area 310, such as the lower side of the opening area 310 as shown in FIG5 . Of course, the present invention is not limited thereto. Along the width direction X of the electronic device, the projection of the proximity sensor 3 on the display screen 300 is located on one side of the opening area 310, such as the left or right side of the opening area 310.

[0085] As shown in Figures 7 and 8, Figure 7 is a connection architecture diagram of the sensor module and the processor 400 in the first embodiment of the present application, and Figure 8 is a schematic diagram of the working principle of the sensor module in some embodiments of the present application.

[0086] The light source module 1 includes a light source 11, which has a first light-emitting portion 111 and multiple second light-emitting portions 112. As shown in FIG7 , the number of second light-emitting portions 112 can be two, but is not limited thereto. The number of second light-emitting portions 112 can also be three or more, depending on the actual situation. The luminous power of the multiple second light-emitting portions 112 can be equal or unequal. For example, when there are two second light-emitting portions 112, the luminous power of one second light-emitting portion 112 can be 1.5 times the luminous power of another second light-emitting portion 112.

[0087] 7 and 8 , the sensor module includes a driving unit 4, which is electrically connected to the first light emitting portion 111 and configured to drive the first light emitting portion 111 to emit the first light 51. The driving unit 4 may be a driver IC.

[0088] The TOF receiving sensor 2 is configured to receive the first reflected light 52, which is the light formed by the first light 51 being reflected by the target. The proximity sensor 3 is electrically connected to each second light emitting unit 112 and is configured to drive at least one second light emitting unit 112 to emit the second light 61. The proximity sensor 3 is also configured to receive the second reflected light 62, which is the light formed by the second light 61 being reflected by the target.

[0089] Among them, the first light 51 and the second light 61 can both be infrared light, and the wavelengths of the first light 51 and the second light 61 can be equal. For example, the wavelengths of the first light 51 and the second light 61 can both be 940 nm. At this time, the proximity light sensor and the TOF sensor need to work in different time periods to ensure that the TOF receiving sensor 2 can accurately receive the first reflected light 52 and the proximity sensor 3 can accurately receive the second reflected light 62.

[0090] Of course, the wavelengths of the first light 51 and the second light 61 may be different, for example, the wavelength of the first light 51 may be 910 nm, and the wavelength of the second light 61 may be 840 nm. In this case, the proximity light sensor and the TOF sensor may operate simultaneously or in different time periods.

[0091] As shown in FIG7 , the electronic device further includes a processor 400 . The TOF receiving sensor 2 and the proximity sensor 3 are electrically connected to the processor 400 , respectively. The TOF receiving sensor 2 is connected to the driving unit 4 .

[0092] The processor 400 may be a system on chip (SOC), an application processor (AP), a sensor hub, etc. of an electronic device, and is not specifically limited here.

[0093] When the sensor module needs to enter the TOF working state, the processor 400 sends a first control signal, which is transmitted to the driving unit 4 via the TOF receiving sensor 2, so that the driving unit 4 drives the first light-emitting part 111 to emit a first light ray 51. As shown in (a) in Figure 8, the first light ray 51 is reflected by the target object (i.e., the first reflected light ray 52) and is received by the TOF receiving sensor 2. The processor 400 calculates the distance between the electronic device and the target object through the time difference between the first light ray 51 emitted by the first light-emitting part 111 and the first reflected light ray 52 received by the TOF receiving sensor 2 to obtain the depth information of the target object, thereby realizing functions such as object recognition.

[0094] When the sensor module needs to enter the proximity light working state, the processor 400 sends a second control signal, and the first control signal is transmitted to the proximity sensor 3, so that the proximity sensor 3 drives at least one second light-emitting portion 112 to emit a second light 61. As shown in (b) in Figure 8, the second light 61 is reflected by the target object (i.e., the second reflected light 62) and is received by the proximity sensor 3. The processor 400 identifies the distance of the target object by the intensity of the second reflected light 62 received by the proximity sensor 3, thereby realizing the function of object proximity recognition.

[0095] In some embodiments, as shown in Figure 7, the driving unit 4 includes a first driving module 41 and a first control unit 42. The first driving module 41 is electrically connected to the first light-emitting portion 111 and is used to drive the first light-emitting portion 111 to emit the first light 51. The first driving module 41 is electrically connected to the first control unit 42.

[0096] The proximity sensor 3 includes a first photoelectric element 31, a second control unit 32 and a second driving module 33. The first photoelectric element 31 and the second driving module 33 are electrically connected to the second control unit 32 respectively. The first photoelectric element 31 is used to receive the second reflected light 62. The second driving module 33 is electrically connected to each second light-emitting portion 112 and is used to drive at least one second light-emitting portion 112 to emit the second light 61.

[0097] The TOF receiving sensor 2 includes a second photoelectric element 21 and a third control unit 22. The second photoelectric element 21 is electrically connected to the third control unit 22, which is also electrically connected to the first control unit 42. The second control unit 32 and the third control unit 22 are electrically connected to the processor 400 respectively.

[0098] When the sensor module needs to enter the TOF operating state, such as when the electronic device requires face unlocking, the processor 400 sends a first control signal that is transmitted to the first control unit 42 via the third control unit 22. Upon receiving the first control signal, the first control unit 42 controls the first driver module 41 to drive the first light-emitting unit 111 to emit a first light 51. When the sensor module needs to enter the proximity light operating state, such as when the electronic device is using the call function, the processor 400 sends a second control signal that is transmitted to the second control unit 32. Upon receiving the second control signal, the second control unit 32 controls the second driver module 33 to drive at least one second light-emitting unit 112 to emit a second light 61.

[0099] As shown in FIG7 , the first photoelectric element 31 may be a photodiode (PD), but is not limited thereto and may also be a phototransistor, a photomultiplier tube, a phototube, etc., which are not specifically limited here.

[0100] As shown in FIG7 , the second photoelectric element 21 may be a photodiode (PD), but is not limited thereto and may also be a phototransistor, a photomultiplier tube, a phototube, etc., which are not specifically limited here.

[0101] In some embodiments, as shown in (b) of Figures 4 and 8, the TOF receiving sensor 2, the light source 11 and the proximity sensor 3 are all arranged at the position of the opening area 310. When the sensor module is in the proximity light working state, the proximity sensor 3 drives a part of the second light-emitting parts 112 to emit the second light 61. For example, as shown in Figure 7, one second light-emitting part 112 is driven to emit the second light 61.

[0102] Since there is no display screen 300 on the optical path of the second reflected light 62 to attenuate it, if the luminous power of the second light-emitting portion 112 is large, then the light intensity value of the second reflected light 62 received by the proximity sensor 3 is large, and the proximity sensor 3 is easily saturated, making it unable to accurately sense the position of the target object. Therefore, the proximity sensor 3 drives a part of the second light-emitting portions 112 to emit the second light 61, which can avoid the saturation of the proximity sensor 3 caused by the excessive luminous power of the second light-emitting portion 112, thereby ensuring that the proximity sensor 3 can accurately sense the position of the target object.

[0103] In some embodiments, as shown in FIG6 and FIG8(a), the TOF receiving sensor 2 and the light source 11 are both located at the position of the opening area 310, and the projection of the proximity sensor 3 on the display screen 300 is located outside the opening area 310. When the sensor module is in the proximity light working state, the proximity sensor 3 drives each second light emitting portion 112 to emit the second light 61.

[0104] Because the display screen 300 is located in the optical path of the second reflected light 62 and has an attenuating effect on the second reflected light 62, if the luminous power of the second light-emitting unit 112 is low, the light intensity of the second reflected light 62 received by the proximity sensor 3 will be low, which may prevent the proximity sensor 3 from accurately sensing the location of the target object. Therefore, the proximity sensor 3 drives each second light-emitting unit 112 to emit the second light 61. This can avoid the low light intensity of the second reflected light 62 received by the proximity sensor 3 caused by the low luminous power of the second light-emitting unit 112, thereby ensuring that the proximity sensor 3 can accurately sense the location of the target object.

[0105] The sensor module in the embodiment of the present application has a plurality of second light-emitting portions 112 in the light source 11, and the proximity sensor 3 is electrically connected to each second light-emitting portion 112 and is used to drive at least one second light-emitting portion 112 to emit a second light 61. In this way, by driving some or all of the second light-emitting portions 112 to emit light, the light-emitting power can be adjusted to meet the different requirements of the proximity sensor 3 for the light-emitting power of the light source 11 when the proximity sensor 3 is installed in different positions. Therefore, there is no need to adjust the design of the light source 11 when the proximity sensor 3 is installed in different positions, thereby improving the versatility of the sensor module and further helping to reduce the design and manufacturing costs of the sensor.

[0106] In some embodiments, as shown in Figures 9 and 10, Figure 9 is a front view of the light source module 1 of the sensor module in the first embodiment of the present application, and Figure 10 is a BB cross-sectional view of the light source module 1 in Figure 9. The light source module 1 includes a housing 12 and an optical element 13. The housing 12 has a cavity opening 121, and the optical element 13 is disposed at the cavity opening 121. The light source 11 is disposed within the housing 12. The optical element 13 can be a diffuser plate or a diffractive optical element 13 (DOE), which is not specifically limited here.

[0107] When the sensor module is in the TOF working state, it needs to obtain depth information of targets at different distances. For example, when an electronic device obtains depth information of a target when taking a photo, when the target is far away from the electronic device, if the luminous power of the first light-emitting portion 111 of the light source 11 is small, then the light intensity value of the first light 51 emitted by it will be small, and the light intensity value of the first reflected light 52 will also be small, which cannot meet the requirements of the TOF receiving sensor 2 for the light intensity value of the received first reflected light 52. Therefore, the first light-emitting portion 111 of the light source 11 requires a larger luminous power.

[0108] When the sensor module is in the proximity light mode, it needs to sense whether a target object is approaching. For example, when the electronic device is making a call, the proximity sensor 3 needs to sense whether a person's face (i.e., the target object) is close to the display screen 300. If the face is close to the display screen 300, the processor 400 will turn off the display screen 300 to prevent the face from touching the display screen 300 and causing malfunction. The distance of the target object sensed by the proximity sensor 3 is relatively small. Therefore, compared with the first light-emitting portion 111, the second light-emitting portion 112 of the light source 11 requires less luminous power to meet the light intensity requirement of the second reflected light 62 received by the proximity sensor 3.

[0109] To balance the sensor module's differing requirements for the luminous power of the first light-emitting section 111 and the second light-emitting section 112 of the light source 11, in some embodiments, as shown in FIG11 , which is a top view of the light source 11 in FIG10 , the light source 11 comprises a chip substrate 113 and a light-emitting element array 114 disposed on the chip substrate 113. A portion of the light-emitting elements 115 in the light-emitting element array 114 constitute the first light-emitting section 111, while another portion of the light-emitting elements 115 in the light-emitting element array 114 constitute the second light-emitting section 112. Furthermore, the number N1 of the light-emitting elements 115 in the first light-emitting section 111 is greater than the sum N2 of the number of the light-emitting elements 115 in the second light-emitting section 112 of the light source 11. This arrangement satisfies the sensor module's requirement for a higher luminous power from the first light-emitting section 111 when in TOF operation, and its requirement for a lower luminous power from the second light-emitting section 112 when in near-light operation.

[0110] The number of light-emitting elements 115 in each second light-emitting section 112 can be equal. For example, as shown in FIG11 , each second light-emitting section 112 has four light-emitting elements 115. However, the present invention is not limited thereto. The number of light-emitting elements 115 in each second light-emitting section 112 can also be unequal. For example, when there are two second light-emitting sections 112, the number of light-emitting elements 115 in one second light-emitting section 112 can be four, and the number of light-emitting elements 115 in the other second light-emitting section 112 can be six. The number of light-emitting elements 115 can be set according to the luminous power of each second light-emitting section 112.

[0111] In some embodiments, N1 / N2 satisfies: 20≤N1 / N2≤70. This configuration can better balance the different requirements of the sensor module for the luminous power of the first light emitting portion 111 and the second light emitting portion 112 of the light source 11.

[0112] Among them, N1 can range from 100 to 360; N2 can range from 4 to 12.

[0113] In some embodiments, as shown in FIG11 , the chip substrate 113 is an integral structure. However, this is not limiting. In other embodiments, the chip substrate 113 may be provided in separate parts. Specifically, the chip substrate 113 includes two adjacent sub-substrates, the first light-emitting portion 111 is provided on one of the sub-substrates, and the second light-emitting portion 112 is provided on the other sub-substrate.

[0114] In some embodiments, as shown in FIG11 , the light-emitting element 115 may be a laser. Specifically, as shown in FIG11 , the laser may be a vertical cavity surface emitting laser (VCSEL). The multiple lasers of the first light-emitting portion 111 and the second light-emitting portion 112 may be connected in a common anode and independent cathode configuration, a common cathode and independent anode configuration, or both independent anode and independent cathode configurations.

[0115] Of course, it is not limited thereto, and the laser may also be an edge emitting laser (EEL) or the like.

[0116] In some embodiments, as shown in Figures 10 and 11 , a plurality of light exit holes are provided on one side of a chip substrate 113. The plurality of light exit holes form an array, and a light emitting element 115 is disposed within each light exit hole. Light emitting element 115 is a vertical cavity surface emitting laser. Light emitting element 115 and chip substrate 113 form a VCSEL chip.

[0117] The light exit hole may be a circular hole, a polygonal hole, such as a square hole, etc., which is not specifically limited here.

[0118] In some embodiments, as shown in FIG11 , the light emitting element array 114 is a polygonal array, and each second light emitting portion 112 is located at the same corner of the light emitting element array 114. This arrangement allows the plurality of second light emitting portions 112 to be clustered together, thereby further concentrating the second light 61 emitted by the second light emitting portions 112, thereby better meeting the luminous power requirements of the second light emitting portions 112 during operation of the proximity light sensor.

[0119] As shown in FIG11 , the polygonal array may be a rectangular array, but is not limited thereto. The polygonal array may also be a triangular array, a pentagonal array, a hexagonal array, etc., depending on the design requirements of the light source 11 .

[0120] In some embodiments, as shown in FIG11 , an insulating barrier 116 is provided on the chip substrate 113 to separate the first light-emitting portion 111 from each second light-emitting portion 112. This arrangement prevents contact and short circuiting of conductive components (such as electrodes of the light-emitting element 115) on the first light-emitting portion 111 and the second light-emitting portion 112 on the chip substrate 113, thereby ensuring normal operation of the first light-emitting portion 111 and the second light-emitting portion 112.

[0121] When the light-emitting element 115 is a vertical cavity surface emitting laser, and the light-emitting elements 115 in the first light-emitting section 111 and the second light-emitting section 112 are connected in a common anode and independent cathode manner, the insulating barrier 116 separates the cathodes of the light-emitting elements 115 in the first light-emitting section 111 and the second light-emitting section 112. When the light-emitting element 115 is a vertical cavity surface emitting laser, and the light-emitting elements 115 in the first light-emitting section 111 and the second light-emitting section 112 are connected in a common cathode and independent anode manner, the insulating barrier 116 separates the anodes of the light-emitting elements 115 in the first light-emitting section 111 and the second light-emitting section 112.

[0122] In some embodiments, as shown in FIG11 , the insulating barrier 116 is strip-shaped, which can reduce the space occupied by the insulating barrier 116 on the chip substrate 113 , thereby facilitating an optimized layout of devices on the chip substrate 113 .

[0123] The insulating barrier 116 may be an insulating barrier wall or an air gap, as long as it can achieve insulating isolation, and is not specifically limited here.

[0124] In some embodiments, as shown in Figures 10 and 12, Figure 12 is a top view of the assembly formed by the light source 11 and the circuit board 14 in the light source module 1 shown in Figure 10. The light source module 1 also includes a circuit board 14, which is disposed in the accommodating cavity 12. The chip substrate 113 of the light source 11 is disposed on the circuit board 14. The circuit board 14 is provided with a first connection terminal 141 and a second connection terminal 142. The chip substrate 113 is provided with a first pin 1171 and a second pin 1172. The first pin 1171 is electrically connected to the first light-emitting portion 111 and is also electrically connected to the first connection terminal 141; the second pin 1172 is electrically connected to the second light-emitting portion 112 and is also electrically connected to the second connection terminal 142.

[0125] As shown in Figures 13 and 14, Figure 13 is a bottom view of the assembly formed by the light source 11 and the circuit board 14 in the light source module 1 shown in Figure 10, and Figure 14 is an external connection diagram of the light source module 1, the drive unit 4, and the proximity sensor 3 in the sensor module in the first embodiment of the present application. The first connection terminal 141 includes a first positive terminal (such as the V+ terminal in the figure) and a first negative terminal (such as the V- terminal in the figure). The first positive terminal and the first negative terminal are respectively electrically connected to the drive unit 4. Specifically, the first positive terminal and the first negative terminal are respectively electrically connected to the first drive module 41 of the drive unit 4.

[0126] The second connection terminal 142 includes a second positive terminal (such as the Vp+ terminal in the figure) and a second negative terminal (such as the Vp- terminal in the figure). The second positive terminal and the second negative terminal are electrically connected to the proximity sensor 3 respectively. Specifically, the second positive terminal and the second negative terminal are electrically connected to the second driving module 33 of the proximity sensor 3 respectively.

[0127] As shown in Figures 15 and 16a, Figure 15 is a front view of the light source module 1 of the sensor module in the second embodiment of the present application, and Figure 16a is a CC cross-sectional view of the light source module 1 shown in Figure 15. The structure of the light source module 1 in this embodiment differs from that of the light source module 1 in Figures 9 to 13 in that the structure of the optical element 13 is different, as described below:

[0128] The optical element 13 includes a first area 131 and a second area 132. The first area 131 is used for allowing the first light 51 to pass through, and the second area 132 is used for allowing the second light 61 to pass through. The first field of view angle FOV1 formed after the first light 51 passes through the first area 131 is not equal to the second field of view angle FOV2 formed after the second light 61 passes through the second area 132.

[0129] By setting the first field of view angle FOV1 and the second field of view angle FOV2 to be unequal, the TOF sensor and the proximity light sensor have different sensing areas. By reasonably setting the sizes of the first field of view angle FOV1 and the second field of view angle FOV2, the different requirements of electronic devices for the sensing areas of the TOF sensor and the proximity light sensor can be met.

[0130] In some embodiments, as shown in FIG16a , the second field of view FOV2 is greater than the first field of view FOV1. That is, the second field of view FOV2 is set to be larger. This configuration not only increases the illumination area of ​​the second light 61 emitted by the second light-emitting portion 112, thereby increasing the sensing area of ​​the proximity light sensor, but also provides a larger illumination area for the second reflected light 62 after the second light 61 is reflected by the target object. This ensures that the receiving end of the proximity light sensor (i.e., the first photoelectric element 31) can successfully receive the second reflected light 62 even when it is far away from the second light-emitting portion 112, thereby greatly increasing the range of the proximity light sensor's receiving end.

[0131] In some embodiments, as shown in FIG16a , the second field of view angle FOV1 is 66°, and the first field of view angle FOV2 is 20°. Of course, the first field of view angle FOV1 and the second field of view angle FOV2 are not limited to the above angles, and other angles can also be selected according to actual conditions.

[0132] In some embodiments, as shown in FIG16a , the optical element 13 is a diffuser, with the first region 131 and the second region 132 serving as distinct diffusion zones within the optical element 13. Because the first region 131 and the second region 132 serve as distinct diffusion zones within the optical element 13, the first region 131 and the second region 132 have different light diffusion capabilities. Consequently, different fields of view (FOVs) are formed for the first light 51 and the second light 61 after passing through the first region 131 and the second region 132. This arrangement not only achieves unequal first and second field of view angles (FOV1 and FOV2), but also simplifies the structure of the optical element 13, thereby reducing the design and manufacturing costs of the optical element 13.

[0133] Specifically, different diffusion regions refer to optical protrusions (optical protrusions used to diffuse light) within the diffusion regions having at least one of different sizes, structures, shapes, and arrangements. The optical protrusions within the diffusion regions may be located on the inner surface, the outer surface, or both.

[0134] As shown in Figure 16b, Figure 16b is a schematic diagram of the structure of the light source module 11 in other embodiments of the present application. In this embodiment, the first field of view angle FOV1 is greater than the second field of view angle FOV2. In other words, the field of view angle FOV1 is larger. By setting the field of view angle FOV1 larger, the illumination area of ​​the first light 51 emitted by the first light-emitting unit 111 can be increased, thereby enabling the TOF sensor to obtain depth information of target objects within a wider range.

[0135] In some embodiments, as shown in Figures 15 and 16b, the optical element 13 is a plate-like structure, the first region 131 is a diffusion region, and the second region 132 is a flat region. The second region 132 can be made of glass or resin.

[0136] Because the first region 131 is a diffusion area, the first light 51 emitted by the first light-emitting portion 111 diffuses in all directions after passing through the first region 131, thereby forming a larger field of view FOV1. Since the second region 132 is a flat region, which does not have a diffusion function, the second light 61 emitted by the second light-emitting portion 112 maintains the same divergence angle as when it was emitted from the second light-emitting portion 112 after passing through the flat region, thereby forming a smaller field of view FOV2.

[0137] By providing the diffusion region and the flat panel region in the optical element 13 , the structure of the optical element 13 is simplified while achieving a larger field of view angle FOV1 than the field of view angle FOV2 , thereby facilitating reduction in the design and manufacturing costs of the optical element 13 .

[0138] The specific structure of the diffusion zone is as follows: at least one of the inner and outer surfaces of the diffusion zone includes multiple optical microstructures for diffusing light. The specific structure of the flat plate zone is as follows: neither the inner nor the outer surface of the flat plate zone has optical microstructures for diffusing light. The inner and outer surfaces of the flat plate zone can be parallel or nearly parallel (for example, with a deviation within 2°).

[0139] The first area 131 and the second area 132 may be designed as separate bodies or as an integrated structure, which is not specifically limited here.

[0140] In some embodiments, as shown in Figures 15 and 16a, the projection of the first light-emitting portion 111 on the optical element 13 is located within the first region 131, and the projection of each second light-emitting portion 112 on the optical element 13 is located within the second region 132. This arrangement ensures that the first light 51 emitted by the first light-emitting portion 111 passes through the first region 131, and the second light 61 emitted by each second light-emitting portion 112 passes through the second region 132.

[0141] As shown in Figures 17 to 22, Figure 17 is a connection architecture diagram of the sensor module and the processor 400 in the third embodiment of the present application, Figure 18 is a longitudinal cross-sectional view of the light source module 1 of the sensor module in the third embodiment of the present application, Figure 19 is a structural schematic diagram of the light source module 1 in Figure 18 when an abnormality occurs, Figure 20 is a top view of the assembly formed by the light source 11 and the circuit board 14 in the light source module 1 shown in Figure 18, Figure 21 is a bottom view of the assembly formed by the light source 11 and the circuit board 14 in the light source module 1 shown in Figure 18, and Figure 22 is an external connection diagram of the light source module 1 and the drive unit 4 and the proximity sensor 3 in the sensor module in the third embodiment of the present application.

[0142] The structure of the light source module 1 in this embodiment is different from that of the light source module 1 in FIG. 9 to FIG. 14 in that a third photoelectric element 7 for human eye safety monitoring is added to the accommodating cavity 12, as described below:

[0143] As shown in FIG. 18 , a third photoelectric element 7 is provided in the accommodating cavity 12 . The third photoelectric element 7 is used to receive a third reflected light 53 . The third reflected light 53 is a light formed after the first light 51 is reflected by the optical element 13 .

[0144] As shown in FIG18 , the third photoelectric element 7 may be a photodiode (PD), but is not limited thereto and may also be a phototransistor, a photomultiplier tube, a phototube, etc., which are not specifically limited here.

[0145] As shown in Figure 17, the driving unit 4 includes a first control unit 42, and a first driving module 41 and a first quantization module 43 electrically connected to the first control unit 42 respectively, and the first quantization module 43 is electrically connected to the third photoelectric element 7; the first control unit 42 is also electrically connected to the third control unit 22 in the TOF receiving sensor 2, and the third control unit 22 is electrically connected to the processor 400.

[0146] Specifically, as shown in FIG17 , the first port L11 of the first control unit 42 is electrically connected to the first driving module 41 , the second port L12 of the first control unit 42 is electrically connected to the first quantization module 43 , and the third port L13 of the first control unit 42 is electrically connected to the third control unit 22 .

[0147] The third photoelectric element 7 and the driving unit 4 constitute a human eye safety monitoring module. The third photoelectric element 7 is the receiving end of the human eye safety monitoring module. When the sensor module is in the TOF working state, the third photoelectric element 7 receives the third reflected light 53 reflected by the optical element 13 and outputs an electrical signal. The electrical signal is quantized by the first quantization module 43 and converted into a digital signal for output. The digital signal is transmitted to the processor 400 via the first control unit 42 and the third control unit 22. The processor 400 is used to determine whether the optical element 13 has an abnormality based on the size of the digital signal. Among them, the "abnormality" of the optical element 13 includes the optical element 13 falling off from the accommodating cavity 12 and the appearance of cracks on the optical element 13. For example, as shown in Figure 19, the optical element 13 falls off from the accommodating cavity 12. Due to the lack of the optical element 13 to block it, the light intensity of the first light 51 will increase, which can easily cause damage to the human eye.

[0148] When an abnormality occurs in the optical element 13, the third reflected light 53 received by the third photoelectric element 7 will decrease, the intensity value of the electrical signal output by the third photoelectric element 7 will become smaller, and the digital signal value output by the first quantization module 43 will be smaller. At this time, the processor 400 sends a shutdown signal to the first control unit 42. After receiving the shutdown signal, the first control unit 42 controls the first driving module 41 to turn off the first light-emitting unit 111 to protect the safety of the human eye.

[0149] The digital signal output by the first quantization module 43 may also be directly transmitted to the first control unit 42 for processing. The first control unit 42 is used to determine whether the optical element 13 is abnormal according to the magnitude of the digital signal.

[0150] In some embodiments, as shown in Figure 17, the first quantization module 43 includes a first current-voltage converter 431 and a first analog-to-digital converter 432, the first analog-to-digital converter 432 is electrically connected to the first control unit 42 (that is, electrically connected to the second port L12 of the first control unit 42), and the first current-voltage converter 431 is connected between the first analog-to-digital converter 432 and the third photoelectric element 7.

[0151] When working, the first current-to-voltage converter 431 converts the electrical signal (the electrical signal is a current signal) output by the third photoelectric element 7 into a voltage signal and sends it to the first analog-to-digital converter 432. The first analog-to-digital converter 432 converts the received voltage signal into a digital signal and sends it to the first control unit 42.

[0152] In some embodiments, as shown in Figures 20, 21 and 22, Figure 20 is a top view of the assembly formed by the light source 11 and the circuit board 14 in the light source module 1 shown in Figure 18, Figure 21 is a bottom view of the assembly formed by the light source 11 and the circuit board 14 in the light source module 1 shown in Figure 18, and Figure 22 is an external connection diagram of the light source module 1 and the drive unit 4 and the proximity sensor 3 in the sensor module in the third embodiment of the present application.

[0153] The third photoelectric element 7 is disposed on the circuit board 14 . The circuit board 14 is provided with a third connection terminal 143 . The third connection terminal 143 is electrically connected to the third photoelectric element 7 and is also electrically connected to the first quantization module 43 of the driving unit 4 .

[0154] The third connection terminal 143 includes a positive connection terminal (P+ terminal shown in the figure) and a negative connection terminal (P− terminal shown in the figure), and both the positive connection terminal and the negative connection terminal are electrically connected to the first quantization module 43 .

[0155] As for the structure and connection relationship of the light source 11, the proximity sensor 3 and the TOF receiving sensor 2 in this embodiment, they can be specifically configured with reference to the structure and connection relationship of the sensor module shown in Figures 9 to 14, and will not be described again here.

[0156] As shown in Figures 23 to 27, Figure 23 is a working principle diagram 1 of the first photoelectric element 31 of the sensor module in the fourth embodiment of the present application, Figure 24 is a working principle diagram 2 of the first photoelectric element 31 of the sensor module in the fourth embodiment of the present application, Figure 25 is a connection architecture diagram of the sensor module and the processor 400 in the fourth embodiment of the present application, Figure 26 is an overhead view of the assembly formed by the light source 11 and the circuit board 14 in the light source module 1 shown in Figure 24, and Figure 27 is an external connection diagram of the light source module 1 and the drive unit 4 and the proximity sensor 3 in the sensor module in the fourth embodiment of the present application.

[0157] The structure of the light source module 1 in this embodiment is different from that of the light source module 1 in FIG. 9 to FIG. 14 in that the first photoelectric element 31 is disposed at a different position, as described below:

[0158] As shown in Figures 23 and 25, the first photoelectric element 31 is disposed within the housing cavity 12 and is configured to receive the second reflected light 62. With this arrangement, the first photoelectric element 31 and the light source 11 share a light-transmitting window (i.e., the window formed by the optical element 13). This eliminates the need for an additional light-transmitting window outside of the housing cavity 12 on the display screen 300 of the electronic device, thereby simplifying the structure of the electronic device and reducing its cost.

[0159] In some embodiments, as shown in FIG. 24 and FIG. 25 , the first photoelectric element 31 is further configured to receive a third reflected light 53 , where the third reflected light 53 is light formed after the first light 51 is reflected by the optical element 13 .

[0160] The driving unit 4 includes a first control unit 42, and a first driving module 41 and a first quantization module 43 electrically connected to the first control unit 42. The first quantization module 43 is electrically connected to the first signal port O1 of the first photoelectric element 31. The first signal port O1 is used to output a first electrical signal representing the light intensity value of the third reflected light 53.

[0161] Specifically, as shown in FIG. 25 , the first port L11 of the first control unit 42 is electrically connected to the first driving module 41 , and the second port L12 of the first control unit 42 is electrically connected to the first quantization module 43 .

[0162] As shown in FIG24 , when the sensor module is in the TOF operating state, the first photoelectric element 31 receives the third reflected light 53 reflected by the optical element 13 and outputs a first electrical signal through the first signal port O1. The first electrical signal is quantized by the first quantization module 43 and converted into a first digital signal for output. The first digital signal is transmitted to the processor 400 via the first control unit 42 and the third control unit 22. The processor 400 is configured to determine whether the optical element 13 has an abnormality based on the magnitude of the first digital signal. If the optical element 13 has an abnormality, the third reflected light 53 received by the first photoelectric element 31 will decrease, and the first digital signal output by the first quantization module 43 will be smaller. At this time, the processor 400 sends a shutdown signal to the first control unit 42. After receiving the shutdown signal, the first control unit 42 controls the first driving module 41 to turn off the first light-emitting portion 111 to protect the safety of the human eye.

[0163] In this embodiment, the first photoelectric element 31 is used to receive both the second reflected light 62 and the third reflected light 53. This means that the proximity sensor 3 and the eye safety monitoring module share a common receiving terminal. This reduces the number of components in the sensor module, thereby simplifying the sensor module structure and reducing the cost of the sensor module. By providing a first quantization module 43, the first electrical signal output by the first photoelectric element 31 can be converted into a first digital signal, thereby facilitating processing by the processor 400.

[0164] Of course, the first digital signal output by the first quantization module 43 can also be sent to the first control unit 42 for processing. The first control unit 42 is configured to determine whether an abnormality has occurred in the optical element 13 based on the magnitude of the first digital signal. In this way, the processor 400 does not need to process the first digital signal, thereby reducing the processing burden of the processor 400 of the electronic device.

[0165] In some embodiments, as shown in Figure 25, the first quantization module 43 includes a first current-voltage converter 431 and a first analog-to-digital converter 432, the first analog-to-digital converter 432 is electrically connected to the first control unit 42 (that is, electrically connected to the second port L2), and the first current-voltage converter 431 is connected between the first analog-to-digital converter 432 and the first signal port O1.

[0166] When in operation, the first current-to-voltage converter 431 amplifies the first electrical signal (the first electrical signal is a current signal) output by the first photoelectric element 31 and converts it into a voltage signal and sends it to the first analog-to-digital converter 432. The first analog-to-digital converter 432 converts the received voltage signal into a first digital signal and sends it to the first control unit 42.

[0167] In some embodiments, as shown in Figure 25, the proximity sensor 3 includes a data processing module 35, the data processing module 35 includes a second control unit 32, and a second driving module 33 and a second quantization module 34 electrically connected to the second control unit 32 respectively; the second quantization module 34 is electrically connected to the second signal port O2 of the first photoelectric element 31, and the second signal port O2 is used to output a second electrical signal representing the light intensity value of the second reflected light 62.

[0168] Specifically, as shown in FIG. 25 , the second driving module 33 is electrically connected to the first connection port L21 of the second control unit 32 , and the second quantization module 34 is electrically connected to the second connection port L22 of the second control unit 32 .

[0169] As shown in Figure 23, when the sensor module is in the proximity light working state, the first photoelectric element 31 receives the second reflected light 62 reflected by the target object, and converts it into a second electrical signal and outputs it from the second signal port O2. The second electrical signal is quantized by the second quantization module 34 and converted into a second digital signal output. The second digital signal is transmitted to the processor 400 via the second control unit 32. The processor 400 is used to determine whether the target object is close to the electronic device based on the size of the second digital signal.

[0170] When the sensor module is in the near-light working state and needs to switch to the TOF working state, the processor 400 sends an interrupt control signal to the second control unit 32. After receiving the interrupt control signal, the second control unit 32 controls the second driving module 33 to turn off the second light-emitting unit 112, and the processor 400 sends a first control signal to the first control unit 42, so that the first control unit 42 controls the first driving module 41 to drive the first light-emitting unit 111 to emit the first light 51.

[0171] By providing the second quantization module 34 , the second electrical signal output by the first photoelectric element 31 can be converted into a second digital signal, thereby facilitating processing by the processor 400 .

[0172] The second digital signal output by the second quantization module 34 can also be directly transmitted to the second control unit 32 for processing. The second control unit 32 is configured to determine whether the target object is close to the electronic device based on the magnitude of the second digital signal. In this way, the processor 400 does not need to process the second digital signal, thereby reducing the processing burden of the processor 400 of the electronic device.

[0173] In some embodiments, as shown in Figure 25, the second quantization module 34 includes a second current-voltage converter 341 and a second analog-to-digital converter 342, the second analog-to-digital converter 342 is electrically connected to the second control unit 32 (that is, electrically connected to the second connection port L22), and the second current-voltage converter 341 is connected between the second analog-to-digital converter 342 and the second signal port O2.

[0174] When working, the second current-to-voltage converter 341 amplifies the second electrical signal (the second electrical signal is a current signal) output by the first photoelectric element 31 and converts it into a voltage signal and sends it to the second analog-to-digital converter 342. The second analog-to-digital converter 342 converts the received voltage signal into a second digital signal and sends it to the second control unit 32.

[0175] In some embodiments, as shown in FIG25 , the data processing module 35 is disposed outside the housing cavity 12. For example, the data processing module 35 can be disposed on the electronic device's motherboard 250. With this arrangement, when the data processing module 35 becomes damaged and needs to be replaced, there is no need to open the housing cavity 12, thereby minimizing the impact on the light source module 1.

[0176] In some embodiments, as shown in Figures 26 and 27, Figure 26 is a top view of the assembly formed by the light source 11 and the circuit board 14 in the light source module 1 shown in Figure 24, and Figure 27 is an external connection diagram of the light source module 1 and the drive unit 4 and the proximity sensor 3 in the sensor module in the fourth embodiment of the present application.

[0177] The first photoelectric element 31 is disposed on the circuit board 14. A fourth connection terminal 144 and a fifth connection terminal 145 are provided on the circuit board 14. The fourth connection terminal 144 is electrically connected to the first signal port O1 of the first photoelectric element 31, and the fourth connection terminal 144 is also electrically connected to the first quantization module 43 of the drive unit 4. The fifth connection terminal 145 is electrically connected to the second signal port O2 of the first photoelectric element 31, and the fifth connection terminal 145 is also electrically connected to the second quantization module 34 of the data processing module 35.

[0178] The fourth connection terminal 144 includes a first positive connection terminal (P1+ terminal shown in the figure) and a first negative connection terminal (P1- terminal shown in the figure), and the first positive connection terminal and the first negative connection terminal are both electrically connected to the first quantization module 43. The fifth connection terminal 145 includes a second positive connection terminal (P2+ terminal shown in the figure) and a second negative connection terminal (P2- terminal shown in the figure), and the second positive connection terminal and the second negative connection terminal are both electrically connected to the second quantization module 34.

[0179] In some embodiments, as shown in Figures 25 and 27, the data processing module 35 is connected to the processor 400 via an I2C (Inter-Integrated Circuit) bus and an INT control line. The INT control line is used to transmit an interrupt control signal sent by the processor 400 to the second control unit 32.

[0180] As shown in Figures 28 and 29, Figure 28 is a diagram of the connection architecture of the sensor module and the processor 400 in the fifth embodiment of the present application, and Figure 29 is a longitudinal cross-sectional view of the light source module 1 of the sensor module in the fifth embodiment. The main difference between this embodiment and the sensor module shown in Figures 23 to 27 is that the data processing module 35 is set in a different position, as described below:

[0181] The data processing module 35 and the light source 11 are both mounted on the circuit board 14. In other words, the data processing module 35 is located within the housing cavity 12 and is integrated with the light source 11. This arrangement eliminates the need for the data processing module 35 to occupy space outside the housing cavity 12, making the sensor module more compact and reducing the space it occupies within the electronic device.

[0182] As shown in Figures 30 and 31, Figure 30 is a diagram of the connection architecture between the sensor module and the processor 400 in the sixth embodiment of the present application, and Figure 31 is a diagram of the external connections between the light source module 1, the drive unit 4, and the proximity sensor 3 in the sensor module in the sixth embodiment of the present application. The main difference between this embodiment and the sensor module shown in Figures 23 to 27 is that the data processing module of the proximity sensor 3 is integrated into the drive unit 4, as described below:

[0183] The driving unit 4 further includes a second driving module 33 electrically connected to the first control unit 42. The first quantization module 43 is electrically connected to the second signal port O2 of the first photoelectric element 31. The second signal port O2 is configured to output a second electrical signal, which is configured to represent the intensity of the second reflected light 62. The first photoelectric element 31, the first control unit 42, the first quantization module 43, and the second driving module 33 constitute the proximity sensor 3.

[0184] Specifically, as shown in FIG. 30 , the second driving module 33 is electrically connected to the fourth port L14 of the first control unit 42 , and the first quantization module 43 is electrically connected to the second port L12 of the first control unit 42 .

[0185] When the sensor module is in the TOF operating state, the first signal port O1 of the first photoelectric element 31 outputs a first electrical signal. The first electrical signal is quantized by the first quantization module 43 and converted into a first digital signal for output. The first digital signal is then transmitted to the processor 400 via the first control unit 42. The processor 400 determines whether the optical element 13 has an abnormality based on the magnitude of the first digital signal. If the optical element 13 has an abnormality, the processor 400 sends a shutdown signal to the first control unit 42. Upon receiving the shutdown signal, the first control unit 42 controls the first driver module 41 to shut down the first light-emitting unit 111 to protect the safety of the human eye.

[0186] When the sensor module is in the proximity light operating state, the second signal port O2 of the first photoelectric element 31 outputs a second electrical signal. The second electrical signal is quantized by the first quantization module 43 and converted into a second digital signal for output. The second digital signal is then transmitted to the processor 400 via the first control unit 42. The processor 400 determines whether the target object is close to the electronic device based on the magnitude of the second digital signal.

[0187] When the sensor module is in the near-light working state and needs to switch to the TOF working state, the processor 400 sends an interrupt control signal to the first control unit 42. After receiving the interrupt control signal, the first control unit 42 controls the second driving module 33 to turn off the second light-emitting unit 112, and controls the first driving module 41 to drive the first light-emitting unit 111 to emit the first light 51.

[0188] In this embodiment, the proximity sensor 3 and the human eye safety monitoring module not only share a receiving end, but also the data processing module of the proximity sensor 3 is integrated into the driving unit 4. This avoids the data processing module of the proximity sensor 3 from occupying additional space outside the driving unit 4, thereby making the structure of the sensor module more compact and further reducing the space occupied by the sensor module in the electronic device.

[0189] Of course, the first digital signal and the second digital signal output by the first quantization module 43 can also be directly transmitted to the first control unit 42 for processing. The first control unit 42 is used to determine whether there is an abnormality in the optical element 13 based on the size of the first digital signal; and to determine whether the target object is close to the electronic device based on the size of the second digital signal.

[0190] In some embodiments, as shown in Figure 30, the first quantization module 43 includes a first current-voltage converter 431 and a first analog-to-digital converter 432. The first analog-to-digital converter 432 is electrically connected to the first control unit 42 (that is, electrically connected to the second port L2), and the first current-voltage converter 431 is electrically connected to the first analog-to-digital converter 432, the first signal port O1, and the second signal port O2, respectively.

[0191] In some embodiments, as shown in Figures 30 and 31 , the first signal port O1 and the second signal port O2 are the same port. This configuration simplifies the structure of the first photoelectric element 31 and makes the connection between the first photoelectric element 31 and other components in the sensor module simpler, thereby reducing the cost of the sensor module.

[0192] Of course, the first signal port O1 and the second signal port O2 can also be two independent ports.

[0193] In some embodiments, as shown in Figures 30 and 31, on the basis of the electrical connection between the processor 400 and the TOF receiving sensor 2, the processor 400 is also electrically connected to the driving unit 4. Specifically, the fifth port L15 of the first control unit 42 and the third control unit 22 are electrically connected to the processor 400 respectively.

[0194] By electrically connecting the processor 400 to the drive unit 4, the signals sent by the processor 400 to the drive unit 4, such as the interrupt control signal, can be sent directly to the drive unit 4 without being transferred through the TOF receiving sensor 2. In this way, when the sensor module is in a near-light working state, the TOF receiving sensor 2 can be turned off without being in a standby state, which is beneficial to reducing the power consumption of the TOF receiving sensor 2.

[0195] The types of hatching in the drawings of this application are for the purpose of distinguishing different components and should not be understood as limiting the materials of the components. The drawings of this application are for the purpose of illustrating the structural composition and are not shown to scale with the actual product.

[0196] Although the description of this application will be introduced in conjunction with some embodiments, this does not mean that the features of this application are limited to these embodiments. On the contrary, the purpose of introducing the application in conjunction with the embodiments is to cover other options or modifications that may be extended based on the claims of this application. In order to provide an in-depth understanding of this application, the following description will contain many specific details. This application can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of this application, some specific details will be omitted in the description. It should be noted that the embodiments in this application and the features in the embodiments can be combined with each other unless there is a conflict.

[0197] In the embodiments of this application, the terms "first," "second," "third," "fourth," and "fifth" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature specified as "first," "second," "third," "fourth," or "fifth" may explicitly or implicitly include one or more of the features.

[0198] In the embodiments of this application, "and / or" is simply a description of the association relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three situations: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this document generally indicates that the related objects are in an "or" relationship.

[0199] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. The directional terms mentioned in the embodiments of the present application, such as "up", "down", "left", "right", "inside", "outside", etc., are only reference to the directions of the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of the present application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application. "Multiple" means at least two.

[0200] References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present application. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in yet other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more but not all embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0201] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A sensor module, applied to electronic equipment, characterized in that: include: A light source module (1) comprises a light source (11), wherein the light source (11) has a first light-emitting portion (111) and a plurality of second light-emitting portions (112); A driving unit (4), electrically connected to the first light-emitting portion (111), and used to drive the first light-emitting portion (111) to emit a first light beam (51); A TOF receiving sensor (2) for receiving a first reflected light (52), wherein the first reflected light (52) is light formed by the first light (51) being reflected by a target object; A proximity sensor (3) is electrically connected to each of the second light emitting portions (112) and is used to drive at least one of the second light emitting portions (112) to emit a second light ray (61). The proximity sensor (3) is also used to receive a second reflected light ray (62), wherein the second reflected light ray (62) is light formed after the second light ray (61) is reflected by a target object.

2. The sensor module according to claim 1, characterized in that: The light source (11) comprises a chip substrate (113), and a light emitting element array (114) arranged on the chip substrate (113); a portion of the light emitting elements (115) in the light emitting element array (114) constitute the first light emitting portion (111), and another portion of the light emitting elements (115) in the light emitting element array (114) constitute the second light emitting portion (112); The number of light-emitting elements (115) of the first light-emitting portion (111) is greater than the sum of the numbers of light-emitting elements (115) of the second light-emitting portion (112) in the light source (11); and / or an insulating barrier portion (116) is provided on the chip substrate (113), and the insulating barrier portion (116) separates the first light-emitting portion (111) from each of the second light-emitting portions (112).

3. The sensor module according to claim 2, characterized in that: The light emitting element array (114) is a polygonal array, and each of the second light emitting portions (112) is located at the same corner of the light emitting element array (114).

4. The sensor module according to claim 2 or 3, characterized in that: The number of light-emitting elements (115) of the first light-emitting portion (111) is N1, the sum of the numbers of light-emitting elements (115) of the second light-emitting portion (112) in the light source (11) is N2, and N1 / N2 satisfies: 20≤N1 / N2≤70.

5. The sensor module according to any one of claims 1 to 4, characterized in that: The light source module (1) comprises a accommodating cavity (12) and an optical element (13); the accommodating cavity (12) has a cavity opening (121); the optical element (13) is arranged at the cavity opening (121); and the light source (11) is arranged in the accommodating cavity (12); The optical element (13) comprises a first area (131) and a second area (132); the first area (131) is used for allowing the first light (51) to pass through, and the second area (132) is used for allowing the second light (61) to pass through, and a first field of view angle (FOV1) formed after the first light (51) passes through the first area (131) is not equal to a second field of view angle (FOV2) formed after the second light (61) passes through the second area (132).

6. The sensor module according to claim 5, characterized in that: The second field of view angle (FOV2) is greater than the first field of view angle (FOV1).

7. The sensor module according to claim 5 or 6, characterized in that: The optical element (13) is a diffusion plate, and the first area (131) and the second area (132) are different diffusion areas in the optical element (13).

8. The sensor module according to any one of claims 1 to 7, characterized in that: The light source module (1) comprises a accommodating cavity (12) and an optical element (13), the accommodating cavity (12) having a cavity opening (121), the optical element (13) being arranged at the cavity opening (121), and the light source (11) being arranged in the accommodating cavity (12); the proximity sensor (3) comprises a first photoelectric element (31), the first photoelectric element (31) being arranged in the accommodating cavity (12) and being used for receiving the second reflected light (62).

9. The sensor module according to claim 8, characterized in that: The first photoelectric element (31) is further used to receive a third reflected light (53), wherein the third reflected light (53) is light formed after the first light (51) is reflected by the optical element (13); The driving unit (4) comprises a first control unit (42), and a first driving module (41) and a first quantization module (43) respectively electrically connected to the first control unit (42), the first driving module (41) and the first light-emitting unit (111) The first quantization module (43) is electrically connected to the first signal port (O1) of the first photoelectric element (31), and is used to drive the first light emitting portion (111) to emit a first light (51); the first quantization module (43) is electrically connected to the first signal port (O1) of the first photoelectric element (31), and the first signal port (O1) is used to output a first electrical signal representing the light intensity value of the third reflected light (53).

10. The sensor module according to claim 9, characterized in that: The driving unit (4) further comprises a second driving module (33) electrically connected to the first control unit (42), the second driving module (33) being electrically connected to each of the second light-emitting portions (112) and being used to drive at least one of the second light-emitting portions (112) to emit a second light (61); the first quantization module (43) being electrically connected to a second signal port (O2) of the first photoelectric element (31), the second signal port (O2) being used to output a second electrical signal representing the light intensity value of the second reflected light (62); The first photoelectric element (31), the first control unit (42), the second driver (33) and the first quantization module (43) constitute the proximity sensor (3).

11. The sensor module according to claim 10, characterized in that: The second signal port (O2) and the first signal port (O1) are the same port.

12. The sensor module according to claim 8 or 9, characterized in that: The proximity sensor (3) comprises a data processing module (35), the data processing module (35) comprising a second control unit (32), and a second driving module (33) and a second quantization module (34) electrically connected to the second control unit (32), respectively, the second driving module (33) being electrically connected to each of the second light-emitting portions (112) and being used to drive at least one of the second light-emitting portions (112) to emit a second light (61); the second quantization module (34) being electrically connected to a second signal port (O2) of the first photoelectric element (31), the second signal port (O2) being used to output a second electrical signal representing the light intensity value of the second reflected light (62).

13. The sensor module according to claim 12, characterized in that: The data processing module (35) is arranged outside the accommodating cavity (12).

14. The sensor module according to claim 12, characterized in that: The light source module (1) further comprises a circuit board (14), wherein the circuit board (14) is located in the accommodating cavity (12), and the data processing module (35) and the light source (11) are both arranged on the circuit board (14).

15. An electronic device, characterized in that: A sensor module (100) comprising any one of claims 1 to 14.

16. The electronic device according to claim 15, characterized in that: The electronic device comprises a display screen (300), and an opening area (310) is provided on the display screen (300); the TOF receiving sensor (2) and the light source (11) are arranged at the position of the opening area (310), and the proximity sensor (3) is arranged on the back side of the display screen (300), and the projection of the proximity sensor (3) on the display screen (300) is located outside the opening area (310); when the sensor module (100) is in a proximity light working state, the proximity sensor (3) drives each of the second light-emitting parts (112) to emit a second light (61).

17. The electronic device according to claim 15, characterized in that: The electronic device comprises a display screen (300), an opening area (310) is provided on the display screen (300), the TOF receiving sensor (2), the light source (11) and the proximity sensor (3) are all arranged at the position of the opening area (310); when the sensor module (100) is in a proximity light working state, the proximity sensor (3) drives part of the number of the second light-emitting parts (112) to emit second light (61).

18. An electronic device, characterized in that: It comprises a processor (400) and a sensor module (100) according to any one of claims 1 to 14, wherein a TOF receiving sensor (2) and a proximity sensor (3) of the sensor module (100) are electrically connected to the processor (400) respectively, and the TOF receiving sensor (2) is electrically connected to the driving unit (4).

19. The electronic device according to claim 18, characterized in that: The processor (400) is also electrically connected to the drive unit (4).

Images