Laser cutting method and laser cutting machine

By real-time detection of cutting quality in the laser cutting machine and dynamically adjusting the cutting parameters, the problem of poor cutting quality when cutting different materials is solved, and an efficient and stable cutting process is achieved.

WO2025060583A1PCT designated stage expired Publication Date: 2025-03-27SHENZHEN CREALITY 3D TECH CO LTD

Patent Information

Application Number
PCT/CN2024/103094
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-09-22
Filing Date
2024-07-02
Publication Date
2025-03-27

AI Technical Summary

Technical Problem

When cutting different materials, existing laser cutting machines are difficult to ensure cutting quality, especially due to poor cutting caused by different material properties and the service life of the laser module.

Method used

By introducing a detection unit and a control unit into the laser cutting machine, the cutting quality is detected in real time and the cutting parameters are dynamically adjusted according to the detection results to ensure the cutting quality.

Benefits of technology

It realizes that good cutting quality is maintained when facing various cutting materials, reduces the cumbersome operation of manual settings by users and improves user experience.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

A laser cutting method and a laser cutting machine (10), wherein the laser cutting method is applied to the laser cutting machine (10). The method comprises: cutting the current cutting region of a cutting material (14) on the basis of a first cutting parameter; detecting whether the current cutting region is cut through; if the current cutting region is not cut through, adjusting the first cutting parameter, so as to obtain a second cutting parameter; and if there is a next cutting region in the cutting material (14), cutting the next cutting region of the cutting material (14) on the basis of the second cutting parameter.
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Description

Laser cutting method and laser cutting machine

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on September 22, 2023, with application number 202311249979.1 and application name “Laser Cutting Method and Laser Cutting Machine”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of laser cutting, and in particular to a laser cutting method and a laser cutting machine. Background Art

[0003] During the laser cutting process, different materials have varying degrees of difficulty in cutting. Therefore, before laser cutting begins, it is generally necessary to adjust the cutting parameters for the material being cut. For example, the user can set the material properties, such as the material and thickness, on the laser cutting machine. The laser cutting machine will then search the pre-stored cutting parameters to match the material properties set by the user and cut the material accordingly.

[0004] However, on the one hand, the pre-stored cutting parameters in the laser cutting machine are difficult to cover all types of cutting materials. On the other hand, in addition to the material and thickness that can be set by the user, other differences in cutting materials, such as differences in the production process of cutting materials, differences in moisture content caused by different storage time and environment, may also affect the cutting quality. Moreover, factors such as the service life of the laser cutting machine will also affect the cutting quality.

[0005] Therefore, selecting cutting parameters by the above method cannot guarantee the cutting quality of the laser cutting machine.

[0006] Summary of the Invention

[0007] In view of the above, the present application proposes a laser cutting method and a laser cutting machine, aiming to ensure the cutting quality of the laser cutting machine.

[0008] The embodiment of the present application is applied to a laser cutting machine, and the laser cutting method includes:

[0009] cutting a current cutting area of ​​the cutting material based on the first cutting parameter;

[0010] Detecting whether the current cutting area is cut through;

[0011] If the current cutting area is not cut through, adjusting the first cutting parameter to obtain a second cutting parameter;

[0012] If a next cutting area exists in the cutting material, the next cutting area of ​​the cutting material is cut based on the second cutting parameter.

[0013] The embodiment of the present application can detect the cutting quality during the process of cutting the cutting material by the laser cutting machine, and dynamically adjust the cutting parameters based on the cutting quality, so as to compensate for the poor cutting caused by various factors, so that the laser cutting machine can achieve good cutting quality when facing various types of cutting materials. On the other hand, it can reduce the tedious operations of manual settings by users and improve the user experience.

[0014] In some embodiments, detecting whether the current cutting area is cut through includes:

[0015] detecting whether there is laser light on a first side of the cutting material, wherein the laser is used to cut a working surface of the cutting material, and the first side is a surface opposite to the working surface;

[0016] If the light is detected, confirming that the current cutting area is cut through;

[0017] If the light is not detected, it is confirmed that the current cutting area is not cut through.

[0018] The embodiment of the present application combines the scattering characteristics of the laser when the cutting material is cut through to detect the cutting quality, and can accurately obtain the cutting quality.

[0019] In some embodiments, the laser cutting method further comprises:

[0020] If there is an uncut area in the cutting material, the uncut area is supplementally cut.

[0021] The embodiment of the present application can perform supplementary cutting on the positions that have not been cut through, thereby improving the cutting effect of the cutting material.

[0022] In some embodiments, if there is an uncut area in the cutting material, performing a supplementary cutting on the uncut area includes:

[0023] If the current cutting area is not cut through, continue cutting the current cutting area until the current cutting area is cut through;

[0024] If a next cutting area exists in the cutting material, cutting the next cutting area of ​​the cutting material based on the second cutting parameter includes:

[0025] In the case that the current cutting area is cut through, if a next cutting area exists in the cutting material, the next cutting area of ​​the cutting material is cut based on the second cutting parameter.

[0026] The embodiment of the present application can perform real-time supplementary cutting of the cut material during the cutting process according to a pre-planned cutting path.

[0027] In some embodiments, if there is an uncut area in the cutting material, performing a supplementary cutting on the uncut area includes:

[0028] If the current cutting area is not cut through, the position information of the current cutting area is stored in a supplementary cutting area set; the supplementary cutting area set is used to store the position information of each cutting area in the cutting material that is not cut through;

[0029] If the next cutting area does not exist in the cutting material, supplementary cutting is performed based on each position information in the supplementary cutting area set.

[0030] The embodiment of the present application can perform supplementary cutting on the uncut positions after the laser cutting machine completes the pre-planned cutting path, thereby ensuring the cutting effect of the cutting material without affecting the normal cutting progress.

[0031] In some embodiments, the first cutting parameter includes one or more operating parameters of auxiliary gas flow, laser power, cutting focal length, and cutting speed when the laser cutting machine cuts the cutting material;

[0032] If the current cutting area is not cut through, adjusting the first cutting parameter to obtain a second cutting parameter includes:

[0033] increasing the auxiliary gas flow rate to obtain an adjusted auxiliary gas flow rate;

[0034] and / or, increasing the laser power to obtain an adjusted laser power;

[0035] and / or, adjusting the cutting focal length to obtain an adjusted cutting focal length;

[0036] And / or, reducing the cutting speed to obtain an adjusted cutting speed.

[0037] In some embodiments, the first cutting parameters include multiple operating parameters of auxiliary gas flow, laser power, cutting focal length and cutting speed when the laser cutting machine cuts the cutting material, and each of the multiple operating parameters has a corresponding adjustment priority;

[0038] If the current cutting area is not cut through, adjusting the first cutting parameter to obtain a second cutting parameter includes:

[0039] Determining a target operating parameter to be adjusted based on the adjustment priority of each operating parameter;

[0040] The target operating parameters in the first cutting parameters are adjusted to obtain the second cutting parameters.

[0041] In some embodiments, determining the target operating parameter to be adjusted based on the adjustment priority of each operating parameter includes:

[0042] determining, among the plurality of operating parameters, operating parameters having an adjustment margin;

[0043] Among the operating parameters having adjustment margins, the operating parameter having the highest adjustment priority is used as the target operating parameter.

[0044] The present application also provides a laser cutting machine, comprising:

[0045] an execution unit, configured to cut a current cutting area of ​​the cutting material based on the first cutting parameter;

[0046] a detection unit, configured to detect whether the current cutting area is cut through;

[0047] a control unit, configured to adjust the first cutting parameter to obtain a second cutting parameter when the current cutting area is not cut through;

[0048] The execution unit is further configured to cut the next cutting area of ​​the cutting material based on the second cutting parameter if there is a next cutting area in the cutting material.

[0049] In some embodiments, the execution unit includes a laser light source, and the laser is used to cut the working surface of the cutting material;

[0050] The detection unit includes at least one light sensor, which is arranged on the first side of the cutting material, and the first side is opposite to the working surface; the light sensor is used to detect whether there is laser light on the first side of the cutting material. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] FIG1 is a schematic structural diagram of a laser cutting machine according to an embodiment of the present application;

[0052] FIG2 is a flowchart of the steps of a laser cutting method provided according to an embodiment of the present application;

[0053] FIG3 is a flowchart of sub-steps of step 203 according to an embodiment of the present application;

[0054] FIG4 is a flowchart of the steps of a laser cutting method provided according to another embodiment of the present application.

[0055] Main Component Symbols Laser Cutting Machine 10 Actuator 11 Air Pump 111 Motor 112 Laser Module 113 Detection Unit 12 Optical Sensor 121 Signal Processing Circuit 122 Control Unit 13 Cutting Material 14 DETAILED DESCRIPTION

[0056] In order to more clearly understand the above-mentioned objectives, features and advantages of the present application, the present application is described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the present application and the features therein can be combined with each other in the absence of conflict.

[0057] In the following description, many specific details are set forth to facilitate a full understanding of the present application. The described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0058] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0059] It should be further noted that, in this document, the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus comprising a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not preclude the presence of other identical elements in the process, method, article, or apparatus comprising the element.

[0060] In this application, "at least one" means one or more, and "more than one" means two or more than two. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone, where A and B can be singular or plural. The terms "first", "second", "third", "fourth", etc. (if any) in the specification, claims and drawings of this application are used to distinguish similar objects, rather than to describe a specific order or sequence.

[0061] In the embodiments of this application, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be interpreted as being preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.

[0062] Laser cutting technology uses a focused high-power density laser beam to irradiate the cutting material, causing the irradiated cutting material to quickly melt, vaporize, ablate or reach the ignition point, and at the same time uses a high-speed airflow coaxial with the beam to blow away the molten material, thereby achieving the cutting of the workpiece.

[0063] During the laser cutting process, different cutting materials have different cutting difficulties. Therefore, before laser cutting, it is generally necessary to adjust the cutting parameters according to the cutting material, such as cutting speed, cutting power, etc., and cut the cutting material based on the adjusted cutting parameters.

[0064] For example, the user can set the material properties such as the material and thickness of the cutting material on the laser cutting machine. The laser cutting machine can find the cutting parameters that match the material properties set by the user in the pre-stored cutting parameters to cut the cutting material.

[0065] However, the above method may have the following problems:

[0066] 1. The pre-stored cutting parameters in the laser cutting machine are difficult to cover the cutting parameters corresponding to all types of cutting materials. Therefore, through the above method, there may be some cutting materials that cannot obtain matching cutting parameters, and the cutting quality cannot be guaranteed.

[0067] 2. It is difficult for a laser cutting machine to cover all material properties. In other words, in addition to the material properties such as material and thickness that can be set by the user, the cutting material may also have other material properties that affect the cutting quality.

[0068] If there are differences in the production process of cutting materials of the same material and thickness, such as the number of layers of plywood, the interlayer material, and the amount of adhesive used, the difficulty of cutting the cutting material will also be inconsistent, thus affecting the cutting quality.

[0069] For example, the moisture content of the cutting material can affect the cutting quality. Moisture in the cutting material can cause the moisture content to change. If cutting materials of the same material and thickness are stored in different environments and for different periods of time, the degree of moisture content change will also vary.

[0070] It is difficult for users to know the degree of change in the moisture content of the cutting material, and therefore it is difficult to set the cutting parameters based on the moisture content to match the appropriate cutting parameters.

[0071] 3. The cutting quality of laser cutting machines of the same model also varies.

[0072] For example, after long-term use, the laser module of a laser cutting machine will lose its light output power, which will lead to a decrease in cutting quality. When using the same model of laser cutting machine with different usage time to cut materials of the same thickness and material, the cutting quality may be different.

[0073] In summary, when the production process of cutting materials of the same material and thickness is different, the moisture content of the cutting material changes, or the power of the laser module decays after long-term use, the above method cannot guarantee the cutting efficiency of the cutting material.

[0074] In view of the above, an embodiment of the present application provides a laser cutting machine 10, which is a device having a laser cutting function. For example, a laser engraving machine has a laser cutting function, and the laser cutting machine 10 can be specifically a laser engraving machine.

[0075] As shown in FIG. 1 , the laser cutting machine 10 may include an execution unit 11 , a detection unit 12 and a control unit 13 . The control unit 13 is communicatively connected to the execution unit 11 and the detection unit 12 , respectively.

[0076] The execution unit 11 is configured to obtain first cutting parameters and cut the current cutting area of ​​the cutting material 14 based on the first cutting parameters. The first cutting parameters include, but are not limited to, one or more operating parameters selected from the group consisting of assist gas flow rate, laser power, cutting focal length, and cutting speed. The operating parameters represent the cutting process of the laser cutting machine 10.

[0077] The execution unit 11 may include an air pump 111 , a motor 112 , and a laser module 113 .

[0078] The laser module 113 can be used to emit laser of a specific frequency and power to irradiate the working surface of the cutting material 14, thereby cutting the cutting material at the working surface of the cutting material 14. For example, the laser module 113 can emit laser according to the laser power indicated by the first cutting parameter.

[0079] The air pump 111 can be used to provide auxiliary gas to the laser module 113. For example, the air pump 111 provides auxiliary gas according to the auxiliary gas flow indicated by the first cutting parameter to blow away the molten material formed by the laser irradiation and cutting of the material 14.

[0080] The motor 112 of the execution unit 11 includes an X-axis motor, a Y-axis motor, and a Z-axis motor.

[0081] The X-axis motor and the Y-axis motor can be used to control the laser module 113 to cut the cutting material 14 according to a preset cutting path, and to control the moving speed of the laser emitted by the laser module 113 on the cutting material.

[0082] For example, the first cutting parameter includes a cutting speed, and the X-axis motor and the Y-axis motor can control the laser module 113 to cut the cutting material 14 based on the cutting speed.

[0083] The Z-axis motor can be used to control the cutting focal length of the laser module 113. For example, if the first cutting parameter includes the cutting focal length, the Z-axis motor can control the cutting focal length of the laser module 113 according to the cutting focal length indicated by the first cutting parameter.

[0084] The detection unit 12 is used to detect whether the current cutting area of ​​the cutting material 14 is cut through.

[0085] That is, when the laser engraving machine uses the first cutting parameter, whether the laser engraving machine cuts through the cutting material 14.

[0086] The detection unit 12 may include at least one optical sensor 121. The optical sensor 121 is disposed on the shadow side (i.e., the first side) of the cutting material 14. The shadow side is the side opposite to the working surface of the cutting material 14. The shadow side can also be understood as the side of the cutting material 14 that is away from the laser light source (i.e., the laser module 113).

[0087] The laser cutting machine 10 can be equipped with different types of optical sensors 121 to detect different types of optical signals. The type of optical sensor 121 can be set according to the laser characteristics to be detected, such as frequency and wavelength. For example, the optical sensor 121 can be a photodiode, a phototransistor, a camera, etc., but is not limited thereto.

[0088] When the laser cutting machine 10 cuts the material 14, it generates smoke. Once the laser cuts through the material 14, the assist gas from the air pump 111 entrains some of the smoke and blows it out through the cut. The laser light scatters in the smoke, forming a cluster of light, which then emits scattered light in all directions. The light sensor 121, mounted on the shadow side, detects this laser light, such as the scattered light.

[0089] Therefore, based on the detection results of the laser by the light sensor 121, it can be determined whether the cutting material 14 is currently cut through. If the light sensor 121 detects scattered light, it means that the laser cutting machine 10 has cut through the cutting material 14. If the light sensor 121 does not detect the laser, it means that the laser cutting machine 10 has not cut through the cutting material 14.

[0090] In some embodiments, the light sensor 121 may be positioned along an outer edge of a side of the cut material 14 .

[0091] For example, the detection unit 12 may include multiple light sensors 121, which are installed along the four sides of the cutting material 14. The detection direction of the light sensor 121 corresponding to each side is toward the cutting material 14 to completely cover the shadow side of the cutting material 14.

[0092] This embodiment can prevent waste and debris of the cut material 14 from falling and blocking the light sensor 121 .

[0093] In some embodiments, the detection unit 12 may further include a signal processing circuit 122 , which is electrically connected to the light sensor 121 , so that the cutting quality can be obtained from the light sensor 121 and transmitted to the control unit 13 .

[0094] Among them, the control unit 13 and the detection unit 12 can communicate with each other using serial ports, integrated circuit buses (Inter-Integrated Circuit, IIC) and serial peripheral interfaces (Serial Peripheral Interface, SPI) and the like. The embodiments of the present application do not limit the specific communication methods.

[0095] The control unit 13 is used to adjust the first cutting parameter to obtain the second cutting parameter when the current cutting area of ​​the cutting material 14 is not cut through based on the first cutting parameter, and send the second cutting parameter to the execution unit 11 to control the cutting process.

[0096] The control unit 13 is a device that can automatically perform numerical calculations and / or information processing according to pre-set or stored instructions. Its hardware includes but is not limited to a processor, a microprogrammed control unit (MCU), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a digital signal processor (DSP), an embedded device, etc.

[0097] The execution unit 11 is further configured to continue cutting the cutting material 14 based on the second cutting parameter if a next cutting area exists in the cutting material 14 .

[0098] FIG2 is a flowchart of the steps of an embodiment of the laser cutting method of the present application. The laser cutting method can be used in a laser cutting machine 10. According to different requirements, the order of the steps in the flowchart can be changed, and some steps can be omitted.

[0099] Referring to FIG. 2 , the laser cutting method may include the following steps.

[0100] Step 201: cutting a current cutting area of ​​a cutting material based on a first cutting parameter.

[0101] The first cutting parameters include one or more operating parameters of the auxiliary gas flow, laser power, cutting focal length and cutting speed when the laser cutting machine 10 cuts the cutting material 14 .

[0102] The operating parameters can characterize the cutting process of the laser machine in cutting the cutting material 14. The above operating parameters are only examples and can be set according to needs in actual applications.

[0103] The execution unit 11 in the laser cutting machine 10 can cut the cutting material 14 according to the operating parameters included in the first cutting parameters.

[0104] Step 202: Check whether the current cutting area is cut through.

[0105] In some embodiments, step 202 may include detecting the presence of laser light on a first side (i.e., shadow side) of the cutting material 14, wherein the laser is used to cut on a working surface of the cutting material 14, and the first side is opposite to the working surface.

[0106] For example, the detection unit 12 of the laser cutting machine 10 can detect whether there is scattered light of the smoke light cluster on the shadow side of the cutting material 14.

[0107] If there is laser light on the shadow side of the cutting material 14 , it is determined that the laser cutting machine 10 cuts through the current cutting area of ​​the cutting material 14 based on the first cutting parameter, and step 207 may be continued.

[0108] In some embodiments, if the laser light does not exist on the shadow side of the cutting material 14, it is determined that the laser cutting machine 10 has not cut through the current cutting area of ​​the cutting material 14 based on the first cutting parameter. The first cutting parameter can be adjusted to obtain the second cutting parameter, and then the next cutting area is cut according to the second cutting parameter, that is, steps 203 to 205 are executed.

[0109] In some embodiments, if there is an uncut area in the cutting material, the laser cutting machine 10 may further perform supplementary cutting on the uncut area.

[0110] For example, if the current cutting area is not cut through, the laser module of the laser cutting machine 10 can stay in the current cutting area and continue to cut the current cutting area until the current cutting area is cut through. After the current cutting area is cut through, the next cutting area is cut.

[0111] The cutting parameters used in the above-mentioned supplementary cutting process can be set according to actual use requirements and are not limited to this in the embodiments of the present application. For example, the cutting speed in the cutting parameters used in the supplementary cutting can control the laser module to not move, and other operating parameters except the cutting speed are the same as the second cutting parameters.

[0112] This embodiment combines the characteristics of light changes when the cutting material 14 is cut through, and by detecting the light of the shadow measurement, it can timely and accurately determine whether the laser cutting machine 10 has cut through the cutting material 14.

[0113] In addition to determining the cutting quality of the first cutting parameter through the detection unit 12, the image recognition algorithm can also be used to identify whether there is a cutting seam at the current cutting position on the cutting material 14. In actual application, the cutting quality detection method can be set according to needs.

[0114] Step 203: Adjust the first cutting parameter to obtain the second cutting parameter.

[0115] In some embodiments, the first cutting parameters include one or more operating parameters of auxiliary gas flow, laser power, cutting focal length, and cutting speed when the laser cutting machine 10 cuts the cutting material 14 .

[0116] Step 203 may include increasing the auxiliary gas flow rate to obtain an adjusted auxiliary gas flow rate. For example, the laser cutting machine 10 increases the auxiliary gas flow rate at a first adjustment speed, which may be 5% / s.

[0117] And / or, the laser power is increased to obtain an adjusted laser power. For example, the laser cutting machine 10 increases the laser power at a second adjustment speed, and the second adjustment speed may be 5% / s.

[0118] And / or, adjusting the cutting focal length to obtain an adjusted cutting focal length. The laser cutting machine 10 can adjust the cutting focal length according to the material thickness, and adjust the cutting focal length toward half the material thickness. When the cutting focal length is half the material thickness, better cutting quality can be achieved.

[0119] The cutting focal length can be adjusted at a third adjustment speed, for example, the third adjustment speed is 0.5 mm / s.

[0120] And / or, reduce the cutting speed to obtain an adjusted cutting speed. For example, the laser cutting machine 10 adjusts the cutting speed to a fourth adjustment speed, such as 50 mm / min.

[0121] The cutting speed refers to the speed of the motor 112 , which can determine the moving speed of the laser module 113 on the cutting material.

[0122] The values ​​of the first adjustment speed, the second adjustment speed, the third adjustment speed and the fourth adjustment speed are merely examples. In actual application, they can be set according to requirements, and the embodiments of the present application are not limited thereto.

[0123] Furthermore, each of the multiple operating parameters may have a corresponding adjustment priority. When the first cutting parameter includes multiple operating parameters, step 203 may include: determining the target operating parameter to be adjusted based on the adjustment priority of each operating parameter; and adjusting the target operating parameter in the first cutting parameter to obtain the second cutting parameter.

[0124] In some embodiments, the order of adjustment priority is determined based on the complexity of the operating parameter adjustment and the characteristics of the operating parameter. For example, the adjustment priority of each operating parameter may be as follows:

[0125] The adjustment priority of auxiliary gas flow > the adjustment priority of laser power > the adjustment priority of cutting focus > the adjustment priority of cutting speed.

[0126] Increasing the auxiliary gas flow rate can improve the laser cutting ability while making the cutting kerf thinner and preventing the surface of the material on both sides of the cutting kerf from being contaminated by smoke and dust. Therefore, among the four operating parameters listed, the adjustment of the auxiliary gas flow rate has the highest priority.

[0127] Increasing the laser power can significantly improve cutting performance, so its adjustment priority is set as the second priority.

[0128] Setting an appropriate cutting focus can also improve the cutting ability, but the adjustment margin of the cutting focus is small, so the adjustment priority of the cutting focus is set to the third priority.

[0129] Since the software processing for adjusting the cutting speed is highly complex, the adjustment priority of the cutting speed is set to the fourth priority.

[0130] In some embodiments, determining the target operating parameter to be adjusted based on the adjustment priority of each operating parameter may include: selecting multiple operating parameters as target operating parameters in descending order of adjustment priority.

[0131] In other embodiments, based on the adjustment priority of each operating parameter, the target operating parameter to be adjusted is determined, including: among the multiple operating parameters, determining the operating parameter with adjustment margin, the operating parameter with adjustment margin indicates that the operating parameter has adjustment space; among the operating parameters with adjustment margin, the operating parameter with the highest adjustment priority is used as the target operating parameter.

[0132] The embodiment of the present application takes into account the adjustment margin of each operating parameter. Among the operating parameters with adjustment margin, the operating parameter with the highest adjustment priority is selected as the target operating parameter, which not only reduces the complexity of adjusting the cutting parameters, but also ensures the adjustment range of the cutting parameters this time.

[0133] Referring to FIG3 , the steps for adjusting the cutting parameters in combination with the adjustment priority of the operating parameters and the adjustment margin can be as follows:

[0134] Step 301: Check whether the auxiliary gas flow rate has an adjustment margin.

[0135] If the auxiliary gas flow rate has an adjustment margin, execute step 302 ; if the auxiliary gas flow rate has no adjustment margin, execute step 303 .

[0136] Step 302: Increase the auxiliary gas flow rate at a first adjustment speed.

[0137] Step 303: Check whether the laser power has an adjustment margin.

[0138] If the laser power has an adjustment margin, execute step 304 ; if the laser power has no adjustment margin, execute step 305 .

[0139] Step 304: Increase the laser power at a second adjustment speed.

[0140] Step 305: Check whether there is adjustment margin for the cutting focal length.

[0141] If there is an adjustment margin for the cutting focal length, execute step 306 ; if there is no adjustment margin for the cutting focal length, execute step 307 .

[0142] Step 306: Adjust the cutting focal length at a third adjustment speed.

[0143] Step 307: Check whether there is an adjustment margin for the cutting speed.

[0144] If the cutting speed has an adjustment margin, execute step 308 ; if the cutting speed has no adjustment margin, execute step 309 .

[0145] Step 308: Reduce the cutting speed at a fourth adjustment speed.

[0146] Step 309: Report an error and exit the process adjustment mode.

[0147] Exiting the process adjustment mode means that the cutting parameters are no longer adjusted.

[0148] Step 204 , detecting whether there is a next cutting area in the cutting material.

[0149] For example, the laser cutting machine 10 can obtain the data required for cutting from a computer device or a storage device, such as a TF card (Trans-Flash Card), and the laser cutting machine 10 can parse the data to form a pre-planned cutting path. The cutting path can be in the form of G-code (G-code), which is not limited in this embodiment of the application.

[0150] If there is no next cutting area of ​​the current cutting area in the cutting path, step 402 is executed, that is, the laser machine can confirm that the pre-planned cutting path has been completed.

[0151] If there is a next cutting area of ​​the current cutting area in the cutting path, step 205 is executed.

[0152] Step 205 : cutting the next cutting area of ​​the cutting material based on the second cutting parameter.

[0153] In some embodiments, the execution unit 11 may continue cutting the next cutting area of ​​the cutting material 14 based on the second cutting parameter.

[0154] It can be understood that after cutting the next cutting area of ​​the cutting material 14 based on the second cutting parameters, the laser cutting machine 10 can detect whether the next cutting area is cut through. If the next cutting area is not cut through, the cutting parameters can be further optimized, that is, the second cutting parameters can be adjusted.

[0155] That is, step 205 can be understood as: the laser cutting machine 10 can use the next cutting area as the current cutting area and the second cutting parameter as the first cutting parameter, and then enter step 201 again until the laser cutting machine 10 confirms that there is no next cutting area in the cutting material 14, and then enters step 206.

[0156] Step 206: confirm that the pre-planned cutting path has been completed.

[0157] Steps 203 to 205 are executed by the laser cutting machine 10 when it detects that the current cutting area has not been cut through. However, if the laser cutting machine 10 detects that the current cutting area has been cut through in step 202, it may not update the first cutting parameters and continue cutting the next cutting area of ​​the material based on the first cutting parameters. In other words, step 207 is executed.

[0158] Step 207: If there is a next cutting area, the next cutting area is used as the current cutting area. Then, the process goes back to step 201.

[0159] It is understandable that if there is no next cutting area, it means that the laser cutting machine 10 has completed executing the pre-planned cutting path.

[0160] The embodiment of the present application can detect the laser cutting quality by using the light signal transmitted by the cutting material 14 during the process of the laser cutting machine 10 cutting the cutting material 14, and dynamically adjust the cutting parameters based on the cutting quality, thereby compensating for the poor cutting caused by various factors. When faced with various types of cutting materials 14 and various types of laser cutting machines 10, good cutting quality can be achieved. On the other hand, it can reduce the tedious manual setting operations of the user and improve the user experience.

[0161] The present application also provides a laser cutting method, which is applied to a laser cutting machine 10. In this embodiment, after the laser cutting machine 10 completes the pre-planned cutting path, it performs a supplementary cut on the uncut locations on the pre-planned cutting path. The laser cutting method of this embodiment can be shown in FIG. 4 and includes:

[0162] Step 401: cutting a current cutting area of ​​a cutting material based on a first cutting parameter.

[0163] Step 402: Check whether the current cutting area is cut through.

[0164] If the laser cutting machine 10 cuts through the current cutting area of ​​the cutting material 14, step 403 may be executed, that is, if there is a next cutting area, the next cutting area is used as the current cutting area, and then step 401 is entered again. If there is no next cutting area, step 408 is entered.

[0165] If the laser cutting machine 10 does not cut through the current cutting area of ​​the cutting material 14 , step 404 and step 405 may be executed.

[0166] Among them, the above steps 401 to 403 are substantially the same as the above steps 201, 202 and 207, and are not repeated here.

[0167] Step 404: Store the location information of the current cutting area in the set of complementary cutting areas.

[0168] The complementary cutting area set is used to store the position information of each uncut cutting area in the cutting material 14 .

[0169] For example, if the current cutting position of the cutting material 14 is not cut through based on the first cutting parameters, the current cutting area position information, such as the starting point and end point of the current cutting area, can be stored in the supplementary cutting area set, and the first cutting parameters used to cut the current cutting area can also be stored in the supplementary cutting area set.

[0170] Step 405: Adjust the first cutting parameter to obtain the second cutting parameter.

[0171] Step 405 is substantially the same as step 203 and will not be described again here.

[0172] Step 406 , detecting whether there is a next cutting area in the cutting material.

[0173] If the next cutting area exists, step 407 is executed. If the next cutting area does not exist, it means that the laser cutting machine 10 has completed the pre-planned cutting path, and step 408 can be executed.

[0174] Step 407: cutting the next cutting area of ​​the cutting material based on the second cutting parameter.

[0175] That is, if there is an uncut path on the pre-planned cutting path, the cutting material 14 is continuously cut along the uncut path based on the second cutting parameters.

[0176] Step 407 is substantially the same as step 205 and will not be described again here.

[0177] After the laser cutting machine 10 has completed executing the pre-planned cutting path, it can perform additional cutting on the cutting material 14 , ie, execute step 408 .

[0178] Step 408: Perform complementary cutting based on the position information in the complementary cutting area set.

[0179] In some embodiments, cutting parameters used for supplementary cutting may be pre-stored in the laser cutting machine 10 , and supplementary cutting may be performed on the cut material 14 based on the pre-stored cutting parameters.

[0180] In other embodiments, the laser cutting machine 10 may store target cutting parameters, which are the cutting parameters determined in steps 401 to 407 and adopted by the laser cutting machine 10 when the laser cutting machine 10 cuts through the cutting material 14. The laser cutting machine 10 may perform supplementary cutting on the uncut positions of the cutting material 14 based on the target cutting parameters.

[0181] In other embodiments, the laser cutting machine 10 may perform a supplementary cut on the position that has not been cut through based on the cutting parameters used when cutting the position that has not been cut through.

[0182] The cutting parameters used in the above-mentioned supplementary cutting are only examples and can be set according to actual needs in actual applications.

[0183] The laser cutting machine 10 of the embodiment of the present application can dynamically monitor the cutting quality in real time, thereby dynamically adjusting the cutting parameters, and then compensating for poor cutting quality caused by various reasons, such as the cutting material 14 process, moisture content, and attenuation of the optical power output of the laser cutting machine 10, thereby achieving good cutting effects, reducing unnecessary material loss, and reducing the tedious operations caused by the user repeatedly modifying the cutting parameters, thereby lowering the user's usage threshold.

[0184] Moreover, the embodiment of the present application can not only perform supplementary cutting on the positions that have not been cut through, further ensuring the cutting quality, but also reduce the frequency of changing the cutting parameters of the laser cutting machine when executing the pre-planned cutting path, thereby reducing the complexity of supplementary cutting.

[0185] 1 , an embodiment of the present application further provides a laser cutting machine 10 , which includes an execution unit 11 , a detection unit 12 , and a control unit 13 .

[0186] The execution unit 11 is configured to cut a current cutting area of ​​the cutting material based on a first cutting parameter.

[0187] In some embodiments, the execution unit 11 is further configured to perform supplementary cutting based on each position information in the supplementary cutting area set, or, if the current cutting area is not cut through, continue cutting the current cutting area until the current cutting area is cut through.

[0188] The execution unit 11 includes an air pump 111 , a motor 112 , a laser module 113 , and the like.

[0189] The detection unit 12 is used to detect whether the current cutting area is cut through.

[0190] In some embodiments, the execution unit 11 includes a laser light source (such as a laser module 113 ), and the laser is used to cut the cutting material 14 ;

[0191] The detection unit 12 includes at least one light sensor 121, which is arranged on a first side surface of the cutting material 14, where the first side surface is opposite to the working surface; the light sensor 121 is used to detect whether there is laser light on the first side surface of the cutting material 14.

[0192] In some embodiments, the optical sensor 121 is disposed along an outer edge of a side of the cutting material 14 .

[0193] The detection unit 12 may further include a signal processing circuit 122 connected to the optical sensor 121 to obtain cutting quality from the optical sensor 121 and transmit the cutting quality to the control unit 13. The cutting quality indicates whether the laser cutting machine 10 cuts through the current cutting area.

[0194] The control unit 13 is configured to adjust the first cutting parameter to obtain a second cutting parameter when the current cutting area is not cut through.

[0195] In some embodiments, the first cutting parameter includes one or more operating parameters of auxiliary gas flow, laser power, cutting focal length, and cutting speed when the laser cutting machine cuts the cutting material 14;

[0196] The control unit 13 is used to increase the auxiliary gas flow rate to obtain an adjusted auxiliary gas flow rate;

[0197] and / or, increasing the laser power to obtain an adjusted laser power;

[0198] and / or, adjusting the cutting focal length to obtain an adjusted cutting focal length;

[0199] And / or, reducing the cutting speed to obtain an adjusted cutting speed.

[0200] In some embodiments, the control unit 13 is configured to determine an operating parameter with an adjustment margin among the multiple operating parameters; and use an operating parameter with the highest adjustment priority among the operating parameters with an adjustment margin as the target operating parameter.

[0201] In some embodiments, the control unit 13 is also used to store the position information of the current cutting area in a supplementary cutting area set if the current cutting area is not cut through, and the supplementary cutting area set is used to store the position information of each cutting area that is not cut through in the cutting material 14, and when there is no next cutting area in the cutting material 14, send a supplementary cutting instruction to the execution unit 11, and the execution unit 11 is used to respond to the supplementary cutting instruction and perform supplementary cutting based on each position information in the supplementary cutting area set.

[0202] The control unit 13 may further include a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor 30 executes the computer program, the following steps are implemented: if the current cutting area is not cut through, the first cutting parameter is adjusted to obtain a second cutting parameter.

[0203] The execution unit 11 is further configured to cut the next cutting region of the cutting material 14 based on the second cutting parameter if there is a next cutting region in the cutting material 14 .

[0204] It is obvious to those skilled in the art that the present application is not limited to the details of the above-mentioned exemplary embodiments, and that the present application can be implemented in other specific forms without departing from the spirit or basic characteristics of the present application. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. In addition, it is obvious that the word "comprising" does not exclude other units or steps, and the singular does not exclude the plural. The multiple units or electronic devices stated in the electronic device claim can also be implemented by the same unit or electronic device through software or hardware. Words such as first and second are used to indicate names and do not indicate any particular order.

[0205] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present application and are not limiting. Although the present application has been described in detail with reference to the above embodiments, ordinary technicians in this field should understand that the technical solution of the present application can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present application.

Claims

1. A laser cutting method, characterized in that: Applied to a laser cutting machine, the laser cutting method comprises: cutting a current cutting area of ​​the cutting material based on the first cutting parameter; Detecting whether the current cutting area is cut through; If the current cutting area is not cut through, adjusting the first cutting parameter to obtain a second cutting parameter; If there is a next cutting area in the cutting material, the next cutting area of ​​the cutting material is cut based on the second cutting parameter.

2. The laser cutting method according to claim 1, characterized in that: The detecting whether the current cutting area is cut through includes: Detecting whether there is laser light on a first side of the cutting material, wherein the laser is used to cut on a working surface of the cutting material, and the first side is an opposite side of the working surface; If the light is detected, confirming that the current cutting area is cut through; If the light is not detected, it is confirmed that the current cutting area is not cut through.

3. The laser cutting method according to claim 1, characterized in that: The laser cutting method further comprises: If there is an uncut cutting area in the cutting material, the uncut cutting area is supplemented by cutting.

4. The laser cutting method according to claim 3, characterized in that: If there is an uncut cutting area in the cutting material, supplementary cutting is performed on the uncut cutting area, including: If the current cutting area is not cut through, continue cutting the current cutting area until the current cutting area is cut through; If there is a next cutting area in the cutting material, based on the second cutting The parameters for cutting the next cutting area of ​​the cutting material include: When the current cutting area is cut through, if there is a next cutting area in the cutting material, the next cutting area of ​​the cutting material is cut based on the second cutting parameter.

5. The laser cutting method according to claim 3, characterized in that: If there is an uncut cutting area in the cutting material, supplementary cutting is performed on the uncut cutting area, including: If the current cutting area is not cut through, the position information of the current cutting area is stored in a supplementary cutting area set; the supplementary cutting area set is used to store the position information of each cutting area in the cutting material that is not cut through; If the next cutting area does not exist in the cutting material, supplementary cutting is performed based on each position information in the supplementary cutting area set.

6. The laser cutting method according to any one of claims 1 to 5, characterized in that: The first cutting parameter includes one or more operating parameters of auxiliary gas flow, laser power, cutting focal length and cutting speed when the laser cutting machine cuts the cutting material; If the current cutting area is not cut through, adjusting the first cutting parameter to obtain a second cutting parameter includes: Increasing the auxiliary gas flow rate to obtain an adjusted auxiliary gas flow rate; and / or, increasing the laser power to obtain an adjusted laser power; and / or, adjusting the cutting focal length to obtain an adjusted cutting focal length; And / or, reducing the cutting speed to obtain an adjusted cutting speed.

7. The laser cutting method according to claim 6, characterized in that: The first cutting parameters include multiple operating parameters of auxiliary gas flow, laser power, cutting focal length and cutting speed when the laser cutting machine cuts the cutting material, and each of the multiple operating parameters has a corresponding adjustment priority; If the current cutting area is not cut through, adjusting the first cutting parameter to obtain a second cutting parameter includes: Determining a target operating parameter to be adjusted based on the adjustment priority of each operating parameter; The target operating parameters in the first cutting parameters are adjusted to obtain the second cutting parameters.

8. The laser cutting method according to claim 7, characterized in that: The determining the target operating parameter to be adjusted based on the adjustment priority of each operating parameter includes: Determining, among the plurality of operating parameters, operating parameters having an adjustment margin; Among the operating parameters having adjustment margins, an operating parameter having the highest adjustment priority is used as the target operating parameter.

9. A laser cutting machine, characterized in that: include: an execution unit, configured to cut a current cutting area of ​​the cutting material based on a first cutting parameter; A detection unit, used for detecting whether the current cutting area is cut through; A control unit, configured to adjust the first cutting parameter to obtain a second cutting parameter when the current cutting area is not cut through; The execution unit is further configured to cut the next cutting area of ​​the cutting material based on the second cutting parameter if there is a next cutting area in the cutting material.

10. The laser cutting machine according to claim 9, characterized in that: The execution unit includes a laser light source, and the laser is used to cut the working surface of the cutting material; The detection unit includes at least one light sensor, which is arranged on a first side of the cutting material, and the first side is an opposite side of the working surface; the light sensor is used to detect whether there is laser light on the first side of the cutting material.

Citation Information

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