Composite laminated structure, flexible display module, and electronic device

Abstract

A composite laminated structure, a flexible display module, and an electronic device. The composite laminated structure is applied to the flexible display module and comprises a first film layer and a second film layer which are stacked; the first film layer comprises a high-modulus material, and the modulus of the high-modulus material is in the range of greater than or equal to 4 GPa and less than or equal to 300 GPa; the second film layer comprises an energy-absorbing and impact-resistant material and / or an explosion-proof material; and the second film layer is chemically bonded to the high-modulus material of the first film layer. By using the composite laminated structure, the reliability of the flexible display module is considered while ensuring that a product is light and thin, so that the flexible display module has the characteristics of impact resistance, press resistance and bending resistance.

Description

Composite laminated structure, flexible display module and electronic device

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on September 22, 2023, with application number 202311242963.8, and priority to the Chinese patent application entitled "Composite laminated structure, flexible display module and electronic device", all contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of display technology, and in particular to a composite laminated structure, a flexible display module and an electronic device. Background Art

[0003] Electronic devices with flexible screens look like ordinary mobile phones when folded, but when unfolded, the flattened flexible screen can provide users with a larger display experience, gradually becoming an important application trend in current terminal devices. However, the cover and protective layer of flexible screens are made of flexible materials. When the front of the flexible screen is subjected to stress scenarios such as squeezing and bumping, it is very easy to develop black spots, broken bright spots and other failures, resulting in poor reliability of the flexible screen. Of course, in order to improve the reliability of flexible screens, flexible screens can be made thicker, but this is contrary to the user's experience and demand for thinness.

[0004] Therefore, for electronic devices with flexible screens, how to make the product light and thin while taking into account the reliability of the flexible screen, so that the flexible screen has the characteristics of impact resistance, extrusion resistance and bending resistance, has become an important direction of R&D design and market demand.

[0005] Summary of the Invention

[0006] The embodiments of the present application provide a composite laminated structure, a flexible display module, and an electronic device. The composite laminated structure enables the flexible display module to have the characteristics of impact resistance, extrusion resistance, and bending resistance.

[0007] In the first aspect, the present application provides a composite laminate structure, which is applied to a flexible display module for protecting the display layer. The composite laminate structure includes a first film layer and a second film layer that are stacked, and the first film layer and the second film layer are at least partially stacked. The first film layer includes a high modulus material, and the modulus range of the high modulus material is greater than or equal to 4Gpa and less than or equal to 300Gpa. The second film layer includes energy-absorbing and impact-resistant material and / or explosion-proof material. The energy-absorbing and impact-resistant material and / or the explosion-proof material of the second film layer are bonded to the high modulus material of the first film layer so that the first film layer and the second film layer are bonded by molecular force.

[0008] The composite laminated structure provided by the present application does not require additional adhesive material between the first film layer and the second film layer, which is conducive to achieving a thin design of the flexible display module and reducing the opening and closing resistance during the bending process. Moreover, chemical bonding is achieved through the bonding between the energy-absorbing and impact-resistant material or explosion-proof material and the high-modulus material, so that the extrusion resistance of the high-modulus material can be combined with the impact resistance of the energy-absorbing and impact-resistant material or explosion-proof material, which can improve the impact resistance, scratch resistance, extrusion resistance and bending resistance of the flexible display module, and can also improve the refinement of creases and large-surface light and shadow, thereby improving the display effect.

[0009] In one possible implementation, the energy-absorbing and impact-resistant material and / or the explosion-proof material has a functional group with a bonding function, and the functional group with a bonding function is bonded to the high-modulus material of the first film layer. This solution defines a specific bonding method, namely, the bonding between the energy-absorbing and impact-resistant material or the explosion-proof material and the high-modulus material is achieved through the functional group with a bonding function and the material of the first film layer.

[0010] In one possible implementation, the silanol groups generated by hydrolysis of the silane in the bonding functional group chemically bond with the silanol groups on the surface of the first film layer to form a silicon-oxygen-silicon bond. This solution defines a specific bonding principle for the bonding functional group, namely, bonding between the first and second film layers is achieved by forming a silicon-oxygen-silicon bond.

[0011] In one possible implementation, the functional group with bonding function in the energy-absorbing and impact-resistant material is any one of silane coupling agent, epoxypropyltriethoxysilane, vinyltriethoxysilane, and aminopropyltrimethoxysilane, or a silane oligomer composed of at least two of them. The second film layer in the composite laminate structure provided by this solution is a material with energy-absorbing and impact-resistant structure, such as a non-Newtonian fluid material, and the silanol group generated by the silane in the functional group with bonding function after hydrolysis is chemically bonded to the silanol group on the surface of the first film layer to form a silicon-oxygen-silicon bond, so that the second film layer and the first film layer are chemically bonded to form an integrated composite laminate structure. The energy-absorbing and impact-resistant material is softer and has a larger deformation, so the energy absorption effect is better. The energy-absorbing and impact-resistant material can achieve the effect that the screen becomes stronger when it encounters strong objects and soft when it encounters soft objects, and can improve the reliability of the folding screen. Energy-absorbing and impact-resistant materials can convert the mechanical energy generated by impact or extrusion into heat energy, thereby absorbing the impact energy or extrusion energy. Energy-absorbing and impact-resistant materials have shear thickening properties. At low stress rates, the material remains soft and has better bending performance. At high stress rates, the elastic modulus of the energy-absorbing and impact-resistant material increases, which can effectively block external impact stress or extrusion stress and protect electronic equipment from damage.

[0012] In one possible implementation, the functional group with a bonding function in the explosion-proof material is any one of: a silane coupling agent, epoxypropyltriethoxysilane, vinyltriethoxysilane, aminopropyltrimethoxysilane, or a silane oligomer composed of at least two of them, or an amide. The second film layer in the composite laminate structure provided by this solution is an explosion-proof material used to protect the first film layer and the display layer. The silanol groups generated after hydrolysis of the silane in the functional group with a bonding function chemically bond with the silanol groups on the surface of the first film layer to form a silicon-oxygen-silicon bond, thereby chemically bonding the second film layer and the first film layer to form an integrated composite laminate structure.

[0013] In one possible implementation, the modulus of the energy-absorbing and impact-resistant material is greater than or equal to 10 kPa and less than or equal to 500 MPa; and / or the modulus of the explosion-proof material is greater than or equal to 10 kPa and less than or equal to 10 GPa. This solution constrains the modulus ranges of the energy-absorbing and impact-resistant materials and the explosion-proof materials, ensuring that their performance meets the requirements for better energy absorption. The energy-absorbing and impact-resistant materials can achieve the effect of making the screen stronger when exposed to strong forces and more flexible when exposed to soft forces.

[0014] In one possible implementation, the energy-absorbing and impact-resistant material is a combination of any one or more of a shear-thickening material, a polyurethane material, a glass-like polyurethane, and an energy-absorbing material containing non-covalent dynamic bonds. This solution provides various specific examples of energy-absorbing and impact-resistant materials, and the composite laminate structure provided in the embodiments of this application can use these different materials as the second film layer.

[0015] In one possible implementation, the high modulus material is any one or more of UTG, FRP, PI, a composite material of high modulus polyurethane and fiber material, or a nanocomposite material. This solution provides various specific examples of high modulus materials, and the first film layer provided in the embodiments of this application can use these different high modulus materials.

[0016] In one possible implementation, the explosion-proof material is a single or multiple resin system or a single or multi-component system selected from epoxy, polyester, acrylic, and urethane resins. This solution provides various specific examples of explosion-proof materials, and the second film layer provided in the embodiments of this application can utilize these different explosion-proof materials.

[0017] In one possible implementation, the number of first film layers is at least two, at least two of which are stacked, and the second film layer is bonded to at least one of the first film layers. Specifically, the first film layer may be UTG. The composite laminate structure defined in this application comprises at least two first film layers, and the stacking of multiple first film layers can increase the modulus of the composite laminate structure.

[0018] In one possible implementation, the composite laminate structure further includes a third film layer, the second film layer is laminated between the third film layer and the first film layer, and the second film layer is bonded to the material of the third film layer. The composite laminate structure provided by this solution sandwiches the second film layer between the first film layer and the third film layer, and the second film layer is chemically bonded to the first film layer and the third film layer through chemical bonding with functional groups having bonding functions to achieve molecular force bonding between the film layers. Both the third film layer and the first film layer can be made of high modulus materials, making the composite laminate structure provided by this solution a hard-soft-hard structure, which can enhance the impact resistance of the composite laminate structure and improve scratch resistance.

[0019] In one possible implementation, the composite laminate structure further includes a fourth film layer stacked with the first film layer, the first film layer being bonded to the fourth film layer via an optical adhesive layer, and the fourth film layer being stacked between the first film layer and the display layer of the flexible display module. This solution provides a specific design for a composite laminate structure, wherein the fourth film layer disposed between the first film layer and the display layer can improve the modulus of the composite laminate structure.

[0020] In one possible implementation, the composite laminate structure further includes a fourth film layer stacked with the first film layer, the first film layer being bonded to the fourth film layer via an optical adhesive layer, the third film layer being stacked between the second film layer and the display layer of the flexible display module, and the fourth film layer being located on the side of the first film layer facing away from the second film layer. This solution provides a specific design for a composite laminate structure, in which the third film layer is disposed between the display layer and the second film layer, and the fourth film layer is located on the side of the first film layer facing away from the display layer. The fourth film layer can protect the first film layer, and the combination of the fourth film layer and the third film layer can improve the modulus of the composite laminate structure.

[0021] In one possible implementation, the composite laminated structure is laminated outside the display layer of the flexible display module, with the first film layer positioned between the second film layer and the display layer, or alternatively, the second film layer positioned between the first film layer and the display layer. This solution provides two different implementations, differing in the positional relationship of the first and second film layers relative to the display layer. Both embodiments ensure that the composite laminated structure maintains the reliability of the flexible screen while ensuring impact resistance, compression resistance, and bending resistance.

[0022] In one possible implementation, the number of second film layers is two, with one second film layer located on the top surface of the first film layer and the other second film layer located on the bottom surface of the first film layer. In the composite laminate structure provided by this solution, the number of second film layers is two. By chemically bonding the two second film layers to the first film layer on the top and bottom surfaces, respectively, the second film layers provide buffering protection for both the top and bottom surfaces of the first film layer. During the assembly of the composite laminate structure into the flexible display module, there is no need to consider the assembly direction.

[0023] In one possible implementation, the second film layer, located on the bottom surface of the first film layer, is bonded to the display layer of the flexible display module via an optical adhesive layer. In the composite laminate structure provided by this solution, the second film layer is directly bonded to the display layer via an optical adhesive layer, eliminating the need for any other optical film layer between the second film layer and the display layer, thereby facilitating a thinner design for the flexible display module.

[0024] In one possible implementation, the composite laminate structure further includes a fourth film layer and a fifth film layer stacked together, the fifth film layer including an energy-absorbing and impact-resistant material and / or an explosion-proof material, the fourth film layer and the fifth film layer being bonded together, and the fifth film layer being adhered to the surface of the first film layer facing away from the second film layer via an optical adhesive layer. This solution provides a specific composite laminate structure. In addition to including a composite layer structure formed by bonding the first film layer and the second film layer, the composite laminate structure also includes a composite layer structure formed by bonding the fourth film layer and the fifth film layer. The two composite layer structures are adhered together via optical adhesive. The composite laminate structure provided by this solution has excellent impact resistance, extrusion resistance, and bending resistance.

[0025] In one possible implementation, the first film layer includes a top surface, a bottom surface, and side surfaces connecting the top and bottom surfaces. A portion of the second film layer is bonded to the top surface of the first film layer, and a portion of the second film layer is bonded to the side surfaces of the first film layer. This solution provides a second film layer that is bonded not only to the top surface of the first film layer but also to the side surfaces of the first film layer, thereby improving the bonding strength between the first and second film layers.

[0026] In one possible implementation, there are two second film layers, one disposed on the top and one on the bottom of the first film layer. The composite laminate structure further includes a connecting portion connecting the two second film layers, the connecting portion being bonded to the first film layer. This solution utilizes the connecting portion to connect the two second film layers, which is also bonded to the first film layer. This allows the two second film layers and the connecting portion to bond to the first film layer, thereby providing better protection for the first film layer.

[0027] In a possible implementation manner, the connecting portion and the second film layer are made of the same material.

[0028] In one possible implementation, a groove is provided on the top surface of the first film layer, and the thickness of the film layer at the position where the groove is provided on the first film layer is less than the thickness of the film layer at other positions on the first film layer, and the second film layer is stacked on the top surface of the first film layer; a filling glue is provided in the groove, and / or the groove accommodates part of the second film layer. This solution provides an architecture of first film layers with unequal thicknesses. In one embodiment, the flexible display module is used for a foldable electronic device, and a groove is provided on the first film layer corresponding to the position of the rotating shaft of the electronic device. The filling glue is a low-modulus material, which is conducive to bending at the groove position, ensuring the bendability of the flexible display module, and improving the large-surface light and shadow experience of the electronic device.

[0029] In a second aspect, the present application provides a flexible display module, comprising a substrate, a display layer, and the composite laminated structure provided in any possible implementation of the first aspect, wherein the display layer is stacked between the substrate and the composite laminated structure.

[0030] In a third aspect, the present application provides a flexible display module, comprising a substrate, a display layer, a cover plate and a protective film stacked in sequence, wherein at least one of the cover plate and the protective film is a composite laminated structure as described in any possible embodiment of the first aspect.

[0031] In a fourth aspect, the present application provides an electronic device, comprising a housing and the flexible display module described in the second aspect or the third aspect, wherein the flexible display module is assembled to the housing. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] FIG1A is a schematic diagram of an electronic device in one position during a transition from a flattened state to a folded state, according to one embodiment;

[0033] FIG1B is a schematic diagram of the electronic device shown in FIG1A in a folded state;

[0034] FIG2A is a schematic diagram of an electronic device in one position during a transition from a flattened state to a folded state, according to an embodiment;

[0035] FIG2B is a schematic diagram of the electronic device shown in FIG2A in a folded state;

[0036] FIG3A is a schematic diagram of an electronic device in one position during a transition from a flattened state to a folded state, according to an embodiment;

[0037] FIG3B is a schematic diagram of the electronic device shown in FIG3A in a folded state;

[0038] FIG4 is a perspective schematic diagram of a flexible display module provided in one embodiment of the present application;

[0039] FIG5 is a cross-sectional view of the flexible display module shown in FIG4 along the AA direction;

[0040] 6A, 6B, 6C, and 6D are schematic cross-sectional views of a cover plate provided in accordance with an embodiment of the present application;

[0041] FIG7A is a schematic diagram of the molecular structure of the energy-absorbing and impact-resistant material in the second film layer before the introduction of functional groups with bonding functions, provided in one embodiment of the present application;

[0042] FIG7B is a schematic diagram of a specific structure of a functional group with a bonding function in the second film layer provided in one embodiment of the present application, as well as a schematic diagram illustrating the principle of bonding between the functional group with a bonding function and the energy-absorbing and impact-resistant raw material of the second film layer and the material of the first film layer;

[0043] FIG8 is a cross-sectional schematic diagram of a cover plate provided in one embodiment of the present application;

[0044] FIG9 is a cross-sectional schematic diagram of a cover plate provided in one embodiment of the present application;

[0045] FIG10 is a schematic diagram of a specific structure of the functional group with a bonding function in the second film layer in the embodiment shown in FIG9 , and a schematic diagram of the principle of bonding between the functional group with a bonding function and the explosion-proof raw material of the second film layer and the material of the first film layer;

[0046] FIG11 is a cross-sectional schematic diagram of a cover plate provided in one embodiment of the present application;

[0047] FIG12 is a schematic cross-sectional view of a cover plate provided in one embodiment of the present application;

[0048] FIG13 is a cross-sectional schematic diagram of a cover plate provided in one embodiment of the present application;

[0049] FIG14 is a cross-sectional schematic diagram of a cover plate provided in one embodiment of the present application;

[0050] FIG15A, FIG15B, FIG15C and FIG15D are schematic cross-sectional views of a cover plate provided in one embodiment of the present application;

[0051] FIG16 is a schematic diagram of a flexible display module provided in one embodiment of the present application;

[0052] FIG17 is a schematic diagram of a flexible display module provided in one embodiment of the present application;

[0053] FIG18 is a schematic diagram of a flexible display module provided in one embodiment of the present application;

[0054] 19A, 19B and 19C are schematic diagrams of combining three first film layers of unequal thicknesses and a second film layer according to one embodiment of the present application;

[0055] FIG20 , FIG21 and FIG22 provide a method for manufacturing a composite laminate structure in which the first film layer is UTG and the second film layer is a non-Newtonian fluid material as an example;

[0056] FIG23 , FIG24 , FIG25 , FIG26 and FIG27A provide a method for manufacturing a composite laminate structure in which the first film layer is UTG and the second film layer is a non-Newtonian fluid material as an example;

[0057] FIG27B is a schematic diagram illustrating the principle of chemical bonding between the non-Newtonian fluid material and the UTG layer mentioned in the step shown in FIG27A ;

[0058] FIG28 , FIG29 and FIG30 provide a method for manufacturing a composite laminate structure in which the first film layer is UTG and the second film layer is an explosion-proof material as an example;

[0059] Figures 31, 32, 33, 34, 35, 36, 37 and 38 are schematic diagrams of a manufacturing process for mass production of the composite laminate structure provided in this application;

[0060] FIG39 is a schematic diagram showing a single composite laminate structure in which energy-absorbing and impact-resistant materials are provided on both sides of the UTG layer. DETAILED DESCRIPTION

[0061] The following describes possible implementations of the present application in conjunction with the accompanying drawings in possible implementations of the present application.

[0062] The specific embodiment of the present application provides an electronic device and a flexible display module. The flexible display module is a part of an electronic device. Examples of electronic devices may include, but are not limited to, smartphones, mobile phones, tablet personal computers ("PCs"), personal digital assistants ("PDAs"), portable multimedia players ("PMPs"), televisions, game consoles, watch-type electronic devices, head-mounted displays, personal computer displays, laptops, car navigation systems, car dashboards, digital cameras, camcorders, external billboards, electronic billboards, various medical devices, various inspection equipment, various household appliances (such as refrigerators or washing machines) that display images or videos on a display portion DPA, physical electronic devices, and / or daily necessities (e.g., Internet of Things devices) that have expanded Internet connections. The present application uses a foldable smartphone, tablet PC, or laptop as a representative illustration of an electronic device, but the present application is not limited thereto.

[0063] The term "foldable device" as used herein refers to a device that can be folded and unfolded and a folding device that maintains a folded state (e.g., non-expandable). A foldable electronic device can be folded at an angle between 0 degrees and about 180 degrees, but the present disclosure is not limited thereto. An electronic device that is set to be flat is considered to be set at 0 degrees and can be folded at a folding angle greater than or less than 180 degrees. In an embodiment, for example, the electronic device can be folded at a folding angle equal to or greater than 90 degrees and less than 180 degrees, or equal to or greater than 120 degrees and less than 180 degrees relative to 0 degrees. In addition, the folded state may refer to a state folded out from the unfolded state, even if it is not fully folded.

[0064] In one embodiment, the electronic device is a foldable mobile terminal. When the electronic device is in a folded state, the flexible display module is in a folded state, the overall size is small, and it is easy to carry. When the electronic device is in a flattened state, the flexible display module is in a flattened state, and the flexible display module forms a display interface of a larger size. The electronic device provided in the specific embodiment of the present application can be a folding device (as shown in Figures 1A, 1B, 2A, and 2B), or a three-fold device (as shown in Figures 3A and 3B). For example, when the electronic device is a folding device, the flexible display module can be an inward folding structure (as shown in Figures 1A and 1B) or an outward folding structure (as shown in Figures 2A and 2B).

[0065] FIG1A is a schematic diagram of an electronic device provided in one embodiment, showing a position during the transition from a flattened state to a folded state, and FIG1B is a schematic diagram of the electronic device shown in FIG1A in a folded state. Referring to FIG1A and FIG1B , in one embodiment, the electronic device 100 is a folding device with an inward folding scheme, and the electronic device 100 includes a device body 10 and a flexible display module 20. The flexible display module 20 is assembled on the surface of the device body 10. The device body 10 includes a first body 1, a second body 2, and a hinge assembly 3, which is located between the first body 1 and the second body 2 so that the first body 1 and the second body 2 can be folded or flattened relative to each other. The flexible display module 20 includes a first portion 201, a second portion 203, and a bent portion 202 connecting the first portion 201 and the second portion 203. The first portion 201 is connected to the first body 1, and the second portion 203 is connected to the second body 2. During the folding of the first and second bodies 1, 2, the flexible display module 20 is located inward in the folding direction. During this process, the first and second portions 201, 203 fold relative to each other, causing the bent portion 202 to bend and deform. In the folded state, the flexible display module 20 is stacked between the first and second bodies 1, 2. In the illustration shown in Figure 1B, the flexible display module 20 is obscured by the device body 10 and is not visible.

[0066] Figure 2A is a schematic diagram of an electronic device in one embodiment, illustrating a position during the transition from a flattened state to a folded state. Figure 2B is a schematic diagram of the electronic device shown in Figure 2A in a folded state. Referring to Figures 2A and 2B, in one embodiment, the electronic device 100 is an outward-folding device. During the relative folding of the first body 1 and the second body 2 of the device body 10, the flexible display module 20 is located on the outside of the folding direction. The first body 1 and the second body 2 are relatively close together, so that in the folded state, they are stacked. In the folded state, the flexible display module 20 wraps around the periphery of the device body 10.

[0067] Figure 3A is a schematic diagram of an electronic device in one embodiment, showing a position during the transition from a flattened state to a folded state. Figure 3B is a schematic diagram of the electronic device shown in Figure 3A in the folded state. Referring to Figures 3A and 3B, in one embodiment, the electronic device 100 is a tri-fold device. The device body 10 includes a first body 1, a second body 2, a hinge assembly 3, a hinge assembly 4, and a third body 5. The hinge assembly 3 is connected between the first body 1 and the second body 2, and the hinge assembly 4 is connected between the third body 5 and the second body 2. The flexible display module 20 includes a first portion 201, a bending portion 202, a second portion 203, a bending portion 204, and a third portion 205. The bending portion 202 is connected between the first portion 201 and the second portion 203, and the bending portion 204 is connected between the third portion 205 and the second portion 203. The first portion 201 is connected to the first body 1, the second portion 203 is connected to the second body 2, and the third portion 205 is connected to the third body 5. During the relative folding of the first body 1 and the second body 2, the first portion 201 and the second portion 203 correspond to an outward folding scheme, i.e., the first portion 201 and the second portion 203 are located on the outside of the folding direction. During the relative folding of the second body 2 and the third body 5, the second portion 203 and the third portion 205 correspond to an inward folding scheme, i.e., the second portion 203 and the third portion 205 are located on the inside of the folding direction. In the folded state, the device body 10 and the flexible display module 20 are both folded into a three-fold structure, with the first body 1, the second body 2, and the third body 5 stacked. In the folded state, the first portion 201 is located on the outer surface of the device body 10 and is used to display the interface. The second portion 203 and the third portion 205 are sandwiched and hidden between the second body 2 and the third body 5.

[0068] The flexible display module provided in this application can be applied to the electronic device provided in any of the aforementioned specific embodiments.

[0069] FIG4 is a three-dimensional schematic diagram of a flexible display module provided in one embodiment of the present application, and FIG5 is a cross-sectional view of the flexible display module shown in FIG4 along the AA direction. Referring to FIG5, in one embodiment, the flexible display module 20 includes a substrate 30, a display layer 40, a cover plate 50, and a protective film 60 stacked in sequence. The cover plate 50 and the display layer 40 can be connected by an optical adhesive layer 71, and the protective film 60 and the cover plate 50 can be connected by an optical adhesive layer 72. The optical adhesive layer 71 and the optical adhesive layer 72 can be made of the same material, for example, OCA (Optically Clear Adhesive). It is understood that the materials of the two can also be different. The thickness of the optical adhesive layer 71 and the optical adhesive layer 72 can be the same or different.

[0070] In one embodiment, substrate 30 comprises a flexible substrate made of a flexible polymer material such as polyimide. In another embodiment, substrate 30 may comprise a bamboo layer or an ultra-thin metal layer. Substrate 30 may also include a buffer layer, such as a PI film or foam adhesive layer. By designing the material of the bamboo layer and the structure of the buffer layer, the bendability and reliability of the flexible display module can be enhanced.

[0071] In one embodiment, the display layer 40 may include (but is not limited to) an array substrate, a light-emitting device layer, and an encapsulation layer stacked in sequence. The array substrate is provided on the substrate 30. The array substrate includes an array layer, which may specifically include a semiconductor layer and a metal layer for forming electronic devices (such as transistors and storage capacitors), as well as a plurality of inorganic insulating layers. The electronic device may further include a driver chip provided on the array substrate, the driver chip being used to drive the light-emitting device layer through the array layer. In one embodiment, the light-emitting device layer may specifically include a stacked anode, a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, an electron injection layer, and a cathode. When the driver chip drives the light-emitting device layer to emit light, the electronic devices in the array layer transmit a driving current to the anode, and the electrons and holes are respectively injected into the light-emitting layer for composite light emission. In one embodiment, the encapsulation layer may specifically include a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer stacked. The encapsulation layer is used to prevent the infiltration of water and oxygen from the outside and protect the light-emitting devices and electronic devices in the electronic device.

[0072] Referring to Figure 5 , a cover plate 50 and a protective film 60 are disposed on the outside of the display layer 40 to protect the display layer 40. In one embodiment, the flexible display module 20 may include only the cover plate 50 without the protective film 60. In one embodiment, the flexible display module 20 requires both the cover plate 50 and the protective film 60 to reliably protect the display layer 40. The cover plate 50 must exhibit excellent impact resistance, scratch resistance, extrusion resistance, and bending resistance to enhance the protection of the electronic device.

[0073] This application provides a composite laminate structure within the cover plate 50 and / or protective film 60 to achieve functional reliability, such as impact resistance, scratch resistance, extrusion resistance, and bending resistance, thereby enabling the flexible display module to achieve both a thin structure and the aforementioned functional reliability. This application utilizes chemical bonding, i.e., chemical bonding between functional groups with bonding functions and high-modulus materials, to achieve molecular bonding between the two film layers to form a composite laminate structure.

[0074] The present application provides a composite laminate structure for use in a flexible display module to protect a display layer. The composite laminate structure includes a first film layer and a second film layer stacked together, wherein the first film layer includes a high-modulus material (e.g., a high-modulus material having a modulus range of greater than or equal to 4 GPa and less than or equal to 300 GPa), and the second film layer includes an energy-absorbing and impact-resistant material or an explosion-proof material, wherein both the energy-absorbing and impact-resistant material and the explosion-proof material include functional groups with bonding functions, and the second film layer is chemically bonded to the high-modulus material of the first film layer through the functional groups with bonding functions, so that the first film layer and the second film layer are bonded by molecular forces. The composite laminated structure provided by the present application does not require additional adhesive material between the first film layer and the second film layer, which is conducive to achieving a thin design of the flexible display module and reducing the opening and closing resistance during the bending process. Moreover, through chemical bonding between the energy-absorbing and impact-resistant material or explosion-proof material and the high-modulus material, the extrusion resistance of the high-modulus material can be combined with the impact resistance of the energy-absorbing and impact-resistant material or explosion-proof material, which can improve the impact resistance, scratch resistance, extrusion resistance and bending resistance of the flexible display module, and can also improve the refinement of creases and large-surface light and shadow, thereby improving the display effect.

[0075] The cover plate 50 in Figure 5 may be a composite laminate structure provided in the present application. Figure 6A is a cross-sectional schematic diagram of a cover plate provided in one embodiment of the present application.

[0076] Referring to Figure 6A, in one embodiment, the cover plate 50 includes a third film layer 53, a second film layer 52, a first film layer 51, and a fourth film layer 54 that are stacked. The second film layer 52 is located between the first film layer 51 and the third film layer 53, and the three constitute a composite laminated structure. The fourth film layer 54 is located on the side of the first film layer 51 away from the second film layer 52, and the fourth film layer 54 and the first film layer 51 are bonded by an optical adhesive layer 571. The fourth film layer 54 is used to be adhered to the display layer of the flexible display module through the optical adhesive layer 572. The fourth film layer 54 is the bottom layer of the cover plate 50 (for bonding with the display layer), and the third film layer 53 can be the surface layer of the cover plate 50 (located on the surface of the cover plate 50 away from the display layer). In one embodiment, the cover plate 50 may not include the fourth film layer 54, and the first film layer 51 can be directly bonded to the display layer of the flexible display module through the optical adhesive layer 571. In one embodiment, a protective film may also be provided on the surface of the third film layer 53. In one embodiment, the third film layer 53 can be used as the surface layer of the flexible display module, that is, no protective film is required on the outer side of the third film layer 53 .

[0077] In the embodiment shown in FIG6A , the first film layer 51 is located between the second film layer 52 and the display layer. It can be understood that the second film layer 52 covers the surface of the first film layer 51 and can protect the first film layer 51 from external impact. When the flexible display module is subjected to a strong external impact or extrusion, the second film layer 52 can convert mechanical energy into heat energy and absorb the impact energy and extrusion energy of the external force. The second film layer 52 also has shear thickening properties. At low stress rates, the second film layer 52 keeps the material soft and has better bending performance. At high stress rates, the elastic modulus of the second film layer 52 increases, effectively blocking external impact stress or extrusion stress, and protecting the flexible display module from damage.

[0078] In the embodiment shown in FIG6A , the first film layer 51 is a hard film layer, and the first film layer 51 includes a high modulus material, and the modulus range of this high modulus material is greater than or equal to 4 GPa and less than or equal to 300 GPa. In one embodiment, the high modulus material is: UTG (Ultra Thin Glass), or FRP (fiber reinforced polymer / plastic), or PI (polyimide) slurry / film, or a composite material of high modulus polyurethane and fiber material, or a nanocomposite material. In one embodiment, the fiber material may include, for example: glass fiber, carbon fiber, UHWPE (Ultra High Molecuar Weight Polyethylene), carbon fiber, etc. The nanocomposite material may be: an oriented or non-oriented nanocomposite material prepared by compounding epoxy resin, high modulus polyurethane resin, etc. with nano-montmorillonite, carbon nanotubes, etc. In one embodiment, the thickness of the first film layer 51 is 10 to 200 μm.

[0079] The first film layer 51 has a high elastic modulus and a correspondingly high hardness. When the electronic device is impacted or squeezed by an external force, the impact stress or squeeze stress acts on the first film layer 51. The first film layer 51 with a higher hardness can not only improve the scratch resistance and prevent the screen of the electronic device from being scratched, but also effectively reduce the deformation under the impact stress or squeeze stress, thereby effectively reducing the strain of other film layers in the electronic device.

[0080] The second film layer 52 is a soft film layer, and the second film layer 52 includes an energy-absorbing and impact-resistant material. Moreover, the energy-absorbing and impact-resistant material in the second film layer 52 includes a functional group with a bonding function. The second film layer 52 is chemically bonded to the high modulus material of the first film layer 51 through the functional group with a bonding function. In one embodiment, the energy-absorbing and impact-resistant material used to form the second film layer 52 may specifically include modified silicone rubber, TPU (Thermoplastic polyurethanes, thermoplastic polyurethane elastomer), shear thickening material and other energy-absorbing and impact-resistant materials. The energy-absorbing and impact-resistant material is softer and has a larger deformation, so it has a better energy absorption effect. The energy-absorbing and impact-resistant material can achieve the effect that the screen becomes stronger when it encounters strong forces and soft when it encounters soft forces, which can improve the reliability of the folding screen. Energy-absorbing and impact-resistant materials can convert the mechanical energy generated by impact or extrusion into heat energy, thereby absorbing the impact energy or extrusion energy. Energy-absorbing and impact-resistant materials have shear thickening properties. At low stress rates, the material remains soft and has better bending performance. At high stress rates, the elastic modulus of the energy-absorbing and impact-resistant material increases, which can effectively block external impact stress or extrusion stress and protect electronic equipment from damage.

[0081] Specifically, the energy-absorbing and impact-resistant material may be polyborosiloxane-modified silica gel. In one embodiment, the modulus of the second film layer 52 is in the range of 10 kPa to 500 MPa. In one embodiment, the thickness of the second film layer 52 is in the range of 10 to 200 μm.

[0082] The present application optimizes the shear thickening (non-Newtonian fluid) function of the energy-absorbing and impact-resistant material of the second film layer 52 at the microscopic level by introducing functional groups with bonding function into the energy-absorbing and impact-resistant raw materials. Specifically, the molecular structure of the energy-absorbing and impact-resistant raw materials is optimized and adjusted so that the second film layer 52 can be chemically bonded to the high modulus material of the first film layer 51 through the functional groups with bonding function.

[0083] Figure 6B is a cross-sectional schematic diagram of a cover plate provided in one embodiment of the present application. The difference between the embodiment shown in Figure 6B and the embodiment shown in Figure 6A is that the second film layer in the embodiment shown in Figure 6B covers the top surface and two side surfaces of the first film layer, while the second film layer in the embodiment shown in Figure 6A only covers the top surface of the first film layer. Specifically, in the embodiment shown in Figure 6B, the first film layer 51 includes a top surface 511, a bottom surface 512 and side surfaces 513, 514 connected between the top surface 511 and the bottom surface 512, part of the second film layer 52 is bonded to the top surface 511 of the first film layer 51, and part of the second film layer 52 is bonded to the side surfaces 513, 514 of the first film layer 51. This solution makes the bonding force between the first film layer 51 and the second film layer 52 better.

[0084] Figure 6C is a cross-sectional schematic diagram of a cover plate provided in one embodiment of the present application. The difference between the embodiment shown in Figure 6C and the embodiment shown in Figure 6B is that the composite laminate structure provided by the embodiment shown in Figure 6C does not include a fourth film layer, but the composite laminate structure provided by the embodiment shown in Figure 6C includes two layers of first film layers, that is, the embodiment shown in Figure 6C is based on the embodiment shown in Figure 6B, with the fourth film layer replaced by the first film layer. As shown in Figure 6C, the number of first film layers 51 in the composite laminate structure is two. It can be understood that in other embodiments, the number of first film layers 51 can also be a superposition of three or more layers, that is, the composite laminate structure includes at least two layers of first film layers 51, at least two layers of the first film layers 51 are stacked, and the second film layer 52 is bonded to at least one layer of the first film layers 51. The modulus of the composite laminate structure can be increased by stacking multiple layers of first film layers.

[0085] Figure 6D is a cross-sectional schematic diagram of a cover plate provided in one embodiment of the present application. The embodiment shown in Figure 6D differs from the embodiment shown in Figure 6B in that the composite laminate structure provided in the embodiment shown in Figure 6D has an additional first film layer 51 and an optical adhesive layer 572 added to the composite laminate structure shown in Figure 6B. Referring to Figure 6D, the composite laminate structure includes two first film layers 51, with a fourth film layer 54 between the two first film layers 51. The top surface of the fourth film layer 54 is bonded to one of the first film layers 51 via an optical adhesive layer 571, and the bottom surface of the fourth film layer 54 is bonded to the other first film layer 51 via an optical adhesive layer 572. The first film layer 51 located on the bottom side of the fourth film layer 54 is adhered to the display layer of the flexible display module via the optical adhesive layer 572. This solution provides two first film layers 51, which can be UTG, and other film layers can be provided between the two first film layers 51. Such a laminate structure can improve the modulus of the composite laminate structure.

[0086] FIG7A is a schematic diagram of the molecular structure of the energy-absorbing and impact-resistant material in the second film layer 52 provided in one embodiment of the present application before the introduction of functional groups with bonding functions. As shown in FIG7A , the molecular structure of the energy-absorbing and impact-resistant material before the introduction of functional groups with bonding functions includes a bonded polymer molecular backbone 71 and a modified polymer molecular backbone 72, wherein the modified polymer molecular backbone 72 has hydrogen bonds or coordination bonds, and the coordination bonds include boron-oxygen bonds (not limited to single boron-oxygen bonds, including multiple boron-oxygen bond structures), metal-catechol, or metal-histidine, and hydrogen bonds or coordination bonds 73 in FIG7A . In one embodiment, the above-mentioned polymer molecular backbone 71 is a silica gel molecular backbone, and the modified polymer molecular backbone 72 is a modified silica gel molecular backbone; or, the above-mentioned polymer molecular backbone 71 is a TPU molecular backbone, and the modified polymer molecular backbone 72 is a modified TPU molecular backbone; or, the above-mentioned polymer molecular backbone 71 is a PU molecular backbone, and the modified polymer molecular backbone 72 is a modified PU molecular backbone.

[0087] When the electronic device is subjected to a force with a high strain rate, the energy-absorbing and impact-resistant material of the second film layer 52 has a short response time and does not have time to break, maintaining the molecular structure shown in Figure 7A, so that the flexible display film group has impact resistance. When the electronic device is subjected to a force with a low strain rate, the hydrogen bond or coordination bond 73 in Figure 7A breaks, so that the second film layer 52 can maintain the softness of the flexible display module. The hydrogen bond or coordination bond 73 in Figure 7A can be restored after breaking. Specifically, at room temperature and pressure, or at a certain temperature and pressure, as long as the atoms forming the hydrogen bond or coordination bond are close enough, the bond can still be re-occurred or restored, that is, the bond between the hydrogen bond and the coordination bond can be restored.

[0088] FIG7B is a schematic diagram of a specific structure of a functional group with a bonding function in the second film layer 52 provided in one embodiment of the present application, as well as a schematic diagram of the principle of bonding between the functional group with a bonding function and the energy-absorbing and impact-resistant raw material of the second film layer 52 and the material of the first film layer 51. In one embodiment, the energy-absorbing and impact-resistant raw material refers to the energy-absorbing and impact-resistant material shown in FIG7A before the functional group with a bonding function is introduced. Referring to FIG7B , in one embodiment, the functional group with a bonding function can be any one of a silane coupling agent, epoxypropyltriethoxysilane, vinyltriethoxysilane, and aminopropyltrimethoxysilane, or a silane oligomer composed of at least two of them. In one embodiment, the chemical bonding principle of the functional group with bonding function and the first film layer 51 by molecular force is as follows: the silanol generated by the silane in the functional group with bonding function after hydrolysis and the silanol on the surface of the first film layer 51 are chemically bonded to form a silicon-oxygen-silicon bond, so that the second film layer 52 and the first film layer 51 are chemically bonded to form an integrated composite laminate structure.

[0089] In the embodiment of the present application, by introducing functional groups with bonding functions into the molecular structure of the energy-absorbing and impact-resistant material, the second film layer 52 can be integrated with the first film layer 51 through chemical bonding, eliminating the need for additional optical adhesive to bond the first film layer 51 and the second film layer 52. The integrated structure combines the properties of the first film layer 51 and the second film layer 52 in the case of thinning the flexible display module, ensuring the overall impact resistance, extrusion resistance and bending resistance of the flexible display module. Since the first film layer 51 is a high modulus material, such as UTG (ultra-thin glass), the first film layer 51 is at risk of bursting or scratching when the film is torn off for repair or ruptured for use. In the embodiment of the present application, since the first film layer 51 and the second film layer 52 are chemically bonded by introducing functional groups with bonding functions, the molecular forces between the two layers form an integrated film layer structure. When the film is torn off for repair or ruptured for use, the first film layer 51 is protected by the bonding and buffering effect of the second film layer 52, and is less likely to burst or scratch. Therefore, the composite laminated structure provided by the present application can avoid the risk of scratching the first film layer 51 during film tearing for repair or rupture for use, thereby improving safety in use.

[0090] Referring to FIG6A , in the embodiment shown in FIG6A , the second film layer 52 is stacked between the third film layer 53 and the first film layer 51 , and the second film layer 52 is chemically bonded to the material of the third film layer 53 through a functional group having a bonding function, so that the second film layer 52 and the third film layer 53 are bonded by molecular forces. Specifically, the chemical bonding principle of the functional group having a bonding function between the second film layer 52 and the third film layer 53 can be the same as the chemical bonding principle between the second film layer 52 and the first film layer 51 , and will not be repeated here. In one embodiment, the material of the third film layer 53 is a combination of one or more organic materials such as TPU (Thermoplastic polyurethanes) or PU (polyurethanes) or PET (Polyethylene terephthalate) or PI (polyimide) or PC (polycarbonate) or PMMA (polymethyl methacrylate, commonly known as acrylic polymethyl methacrylate). In one embodiment, the modulus of the third film layer 53 is greater than or equal to 50 MPa and less than or equal to 100 GPa. In one embodiment, the thickness of the third film layer 53 is 20 to 200 μm.

[0091] In one embodiment, the materials of the first film layer 51 and the third film layer 53 exhibit anisotropic modulus properties, thereby improving the overall modulus of the cover sheet. Anisotropic modulus properties refer to a material having different elastic moduli or shear moduli in different directions. Generally speaking, a modulus difference of more than 30% between two directions is considered modulus anisotropy. Modulus properties include shear modulus and tensile modulus. Generally, a film material with isotropic modulus has similar moduli in the TD and MD directions, while a film material with anisotropic modulus exhibits different moduli in different directions after orientation or composited with different materials. The overall modulus improvement achieved by this solution is relative to the effect produced by isotropic materials. Anisotropic modulus properties result in a material with a higher modulus in a particular direction. By designing the laminate so that the force applied to the cover sheet is parallel to the direction of higher modulus, the overall modulus improvement can be achieved. For example, an isotropic PET material has a modulus of 4 GPa in both the X and Y directions, while an anisotropic PET material may have a modulus of 2 GPa in the X direction and 6 GPa in the Y direction. At this time, when the force is parallel to the Y direction, the modulus is higher than that of isotropic materials. The overall modulus improvement means that the local deformation of the cover is reduced after the force is applied, thus achieving better compression and impact resistance.

[0092] Referring to Figure 6A , in the embodiment shown in Figure 6A , the fourth film layer 54 and the first film layer 51 are stacked and bonded together via an optical adhesive layer 571 (e.g., OCA). The fourth film layer 54 is stacked between the first film layer 51 and the display layer of the flexible display module. Furthermore, the third film layer 53 is directly bonded to the display layer via an optical adhesive layer 572 (e.g., OCA). In one embodiment, the fourth film layer 54 and the third film layer 53 can be made of the same material. The modulus range or thickness of the fourth film layer 54 and the third film layer 53 can also be the same as that of the third film layer 53.

[0093] Referring to FIG. 6A , in one embodiment, the optical adhesive layers 571 and 572 can be made of acrylic or silicone, have a thickness of 10 to 100 μm, and a modulus range of 5 kPa to 50 MPa. The optical adhesive layer 572 in the embodiment shown in FIG. 6A can be the same layer structure as the optical adhesive layer 71 in the flexible display module shown in FIG. 5 .

[0094] FIG8 is a cross-sectional schematic diagram of a cover plate 50 provided in one embodiment of the present application. The embodiment shown in FIG8 differs from the embodiment shown in FIG6A in terms of the positional relationship between the film layers and the order in which they are bonded to the display layer. Referring to FIG8 , in one embodiment, the cover plate 50 includes a third film layer 53, a second film layer 52, a first film layer 51, and a fourth film layer 54 stacked in layers. The second film layer 52 is located between the first film layer 51 and the third film layer 53, and the three constitute a composite laminated structure. The fourth film layer 54 is located on the side of the first film layer 51 away from the second film layer 52, and the fourth film layer 54 and the first film layer 51 are bonded by an optical adhesive layer 571. The third film layer 53 is used to be bonded to the display layer of the flexible display module through the optical adhesive layer 572. The third film layer 53 is the bottom layer of the cover plate 50 (for bonding to the display layer), and the fourth film layer 54 can be the surface layer of the cover plate 50 (located on the surface of the cover plate away from the display layer). A protective film can also be provided on the surface of the fourth film layer 54.

[0095] In the embodiment shown in FIG8 , the chemical bonding between the second film layer 52 and the first film layer 51 and the principle thereof can be the same as the chemical bonding between the second film layer 52 and the first film layer 51 in the embodiment shown in FIG6A . Similarly, the chemical bonding between the second film layer 52 and the third film layer 53 and the principle thereof can also be the same as the chemical bonding between the second film layer 52 and the third film layer 53 in the embodiment shown in FIG6A . The specific physical properties and material characteristics of each film layer provided in the embodiment shown in FIG8 can be the same as the specific physical properties and material characteristics of the corresponding film layer in the embodiment shown in FIG6A .

[0096] Figure 9 is a cross-sectional schematic diagram of a cover plate 50 provided in one embodiment of the present application. Referring to Figure 9, in one embodiment, the cover plate includes a second film layer 52, a first film layer 51, a fifth film layer 55, and a fourth film layer 54 stacked in sequence. The first film layer 51 and the second film layer 52 constitute a composite laminate structure. The fourth film layer 54 and the fifth film layer 55 may also constitute a composite laminate structure. The fifth film layer 55 and the first film layer 51 are bonded together by an optical adhesive layer 572. The fourth film layer 54 is a layer structure of the cover plate 50 away from the display layer, and the second film layer 52 is a layer structure of the cover plate 50 adjacent to the display layer. The second film layer 52 is bonded to the display layer of the flexible display module through the optical adhesive layer 571. The optical adhesive layer 571 at the bottom of the second film layer 52 may be the optical adhesive layer 71 in the flexible display module shown in Figure 5.

[0097] In the embodiment shown in FIG9 , the first film layer 51 comprises a high modulus material, and the modulus of the high modulus material is greater than or equal to 4 GPa and less than or equal to 300 GPa. The structure, material, and other physical properties of the first film layer 51 in the embodiment shown in FIG9 can be the same as the structure, material, and other physical properties of the first film layer 51 in the embodiment shown in FIG6A , and will not be repeated here. The second film layer 52 comprises an explosion-proof material, which includes functional groups with bonding functions. The second film layer 52 is chemically bonded to the high modulus material of the first film layer 51 via the functional groups with bonding functions.

[0098] In one embodiment, the functional group with bonding function in the explosion-proof material is: any one of silane coupling agent, epoxypropyltriethoxysilane, vinyltriethoxysilane, aminopropyltrimethoxysilane, or a silane oligomer composed of at least two of them, or amide.

[0099] In one embodiment, the explosion-proof material is polyurethane, polyamide-polyether copolymer, polyester-polyether copolymer, polysiloxane, epoxy resin, acrylic resin, explosion-proof and energy-absorbing materials including non-Newtonian fluids, glass-like polyurethane (GPU: glassy polyurethane), etc., or a mixed system of the above materials.

[0100] In one embodiment, the modulus range of the explosion-proof material is greater than or equal to 10 KPa and less than or equal to 10 GPa.

[0101] In the embodiment shown in FIG9 , the second film layer 52 is also a soft film layer having functional groups with bonding functions. The second film layer 52 is an explosion-proof material, and the performance of this explosion-proof material is similar to that of the energy-absorbing and impact-resistant material in the second film layer 52 in the embodiment shown in FIG6A . The principle of chemical bonding between the first film layer 51 and the second film layer 52 in this embodiment is the same as that between the first film layer 51 and the second film layer 52 in the embodiment shown in FIG6A . Specifically, this embodiment optimizes the function of the explosion-proof material of the second film layer 52 at the microscopic level by introducing functional groups with bonding functions into the explosion-proof material. Specifically, the molecular structure of the explosion-proof material is optimized and adjusted so that the second film layer 52 can chemically bond to the high-modulus material of the first film layer 51 through the functional groups with bonding functions.

[0102] Figure 10 is a schematic diagram illustrating a specific structure of the functional groups with bonding functions in the second film layer 52 in the embodiment shown in Figure 9, as well as a schematic diagram illustrating the principle of bonding between the functional groups with bonding functions and the explosion-proof raw material of the second film layer 52 and the material of the first film layer 51. The explosion-proof raw material can be understood as the material of the explosion-proof material before the functional groups with bonding functions are introduced. Referring to Figure 10, in one embodiment, the functional groups with bonding functions can be any one of a silane coupling agent, epoxypropyltriethoxysilane, a methacrylate silane coupling agent, vinyltriethoxysilane, and aminopropyltrimethoxysilane, or a silane oligomer composed of at least two of these.

[0103] In the embodiment shown in Figure 9, the material of the fourth film layer 54 can be a combination of one or more organic materials such as TPU or PU or PET or PI or PC or PMMA. In one embodiment, the modulus range of the third film layer 53 is greater than or equal to 50Mpa and less than or equal to 5Gpa. In one embodiment, the thickness of the third film layer 53 is: 20 to 200um. The fifth film layer 55 can be an energy-absorbing and impact-resistant material. The fifth film layer 55 can have the same physical properties such as structure and material as the second film layer 52 in the embodiment shown in Figure 6A. The fifth film layer 55 and the fourth film layer 54 form an integrated composite laminate structure by chemical bonding. Specifically, the energy-absorbing and impact-resistant material in the fifth film layer 55 is chemically bonded to the fourth film layer 54 through the functional groups with bonding functions. The specific principle of chemical bonding is the same as the chemical bonding principle between the first film layer 51 and the third film layer 53 in the embodiment shown in Figure 6A, and will not be repeated.

[0104] Figure 11 is a cross-sectional schematic diagram of a cover plate 50 provided in one embodiment of the present application. The cover plate provided in the embodiment shown in Figure 11 has a similar structure to the cover plate 50 provided in the embodiment shown in Figure 9, with the only difference being that the material of the second film layer 52 is different. Referring to Figure 11, in this embodiment, the second film layer includes an energy-absorbing and impact-resistant material, and the energy-absorbing and impact-resistant material in the second film layer 52 includes a functional group with a bonding function. The second film layer 52 is chemically bonded to the high modulus material of the first film layer 51 through the functional group with a bonding function. The material of the second film layer in this embodiment is the same as that of the second film layer in the embodiment shown in Figure 6A.

[0105] FIG12 is a schematic cross-sectional view of a cover plate 50 provided in one embodiment of the present application. Referring to FIG12 , in one embodiment, the cover plate 50 includes a first film layer 51, a second film layer 52, and a third film layer 53, which are stacked. The second film layer 52 is two layers, one of which is located between the first film layer 51 and the third film layer 53, and the other is located at the bottom of the first film layer 51 (i.e., on the side of the first film layer 51 away from the third film layer 53). In this embodiment, the third film layer 53 is the structure of the display layer of the cover plate 50 away from the flexible display module, and the second film layer 52 located at the bottom of the first film layer 51 is the structure of the display layer of the cover plate 50 adjacent to the flexible display module. The second film layer 52 located at the bottom of the first film layer 51 is bonded to the display layer of the flexible display module via an optical adhesive layer 571. The optical adhesive layer 571 in FIG12 can be the same layer structure as the optical adhesive layer 71 in the flexible display module shown in FIG5 .

[0106] In the embodiment shown in FIG12 , the cover plate 50 forms an integrated composite laminate structure through chemical bonding between the two second film layers 52 and the first film layer 51 and the third film layer 53. Specifically, both second film layers 52 include functional groups with bonding functions. One of the second film layers 52 chemically bonds with the first film layer 51 and the third film layer 53 on either side thereof through the functional groups with bonding functions, thereby achieving molecular bonding. The other second film layer 52 also chemically bonds with the first film layer 51 through the functional groups with bonding functions, thereby achieving molecular bonding. In this embodiment, the material of one of the second film layers 52 is an energy-absorbing and impact-resistant material. The specific structure, material, and other physical properties of this energy-absorbing and impact-resistant material can be the same as those of the second film layer 52 in the embodiment shown in FIG6A . The other second film layer 52 is an explosion-proof material. The structure, material, and other physical properties of this explosion-proof material can be the same as those of the second film layer 52 in the embodiment shown in FIG9 .

[0107] Figure 13 is a schematic cross-sectional view of a cover plate 50 provided in one embodiment of the present application. The structure of the cover plate 50 provided in the embodiment shown in Figure 13 is similar to that of the cover plate 50 provided in the embodiment shown in Figure 12 , with the only difference being a change in the material of one of the second film layers 52. Referring to Figure 13 , in this embodiment, the two second film layers 52 are made of the same material. For example, both second film layers 52 are made of an energy-absorbing and impact-resistant material. The specific structure, material, and other physical properties of this energy-absorbing and impact-resistant material can be the same as those of the second film layer 52 in the embodiment shown in Figure 6A .

[0108] In the embodiments shown in Figures 12 and 13, the cover plate 50 is an integrated composite laminate structure without an optical adhesive layer inside. It is only necessary to set an optical adhesive layer 571 at the bottom of the cover plate 50 to achieve adhesion between the cover plate 50 and the display layer. Therefore, the cover plate 50 provided by the embodiments shown in Figures 12 and 13 can more significantly achieve the advantage of thinning the cover plate. Through the combination of the second film layer 52 with the first film layer 51 and the third film layer 53, the impact resistance, extrusion resistance and bending resistance of the cover plate can also be guaranteed. In this embodiment, the materials of the first film layer 51 and the third film layer 53 have anisotropic modulus characteristics, which improves the overall modulus of the cover plate.

[0109] FIG14 is a schematic cross-sectional view of a cover plate 50 provided in one embodiment of the present application. Referring to FIG14 , the cover plate 50 includes a first film layer 51, a third film layer 53, two second film layers 52, and a connecting portion 522 connecting the two second film layers 52. One of the second film layers 52 is located between the third film layer 53 and the first film layer 51, and the other second film layer 52 is located on the side of the first film layer 51 away from the third film layer 53. The connecting portion 522 passes through the first film layer 51 and connects between the two second film layers 52. An optical adhesive layer 571 is provided on the surface of one of the second film layers 52 facing away from the first film layer 51. The optical adhesive layer 571 is used to bond to the display layer of the flexible display module.

[0110] In this embodiment, the two second film layers 52 and the connecting portion 522 are made of the same material, for example, both are energy-absorbing and impact-resistant materials. Both the second film layers 52 and the connecting portion 522 are chemically bonded to the first film layer 51 via functional groups having bonding functions. In this embodiment, the first film layer 51 and the third film layer 53 are bonded to the second film layer 52 via the two second film layers 52 and the connecting portion 522, forming a composite laminate structure.

[0111] In this solution, two second film layers 52 are interconnected via a connecting portion 522, which together form a structure that surrounds or semi-encloses the second film layer 52. As shown in FIG14 , there are two connecting portions 522, which are connected between the two second film layers 52 and together surround the first film layer 51. The top surface 511 and bottom surface 512 of the first film layer 51 are chemically bonded to the two second film layers 52, respectively. The two side surfaces 513 and 514 of the first film layer 51 connected between the top surface 511 and the bottom surface 512 are chemically bonded to the two connecting portions 522, respectively. This solution ensures that the first film layer 51 is completely wrapped in the energy-absorbing and impact-resistant material. The side surfaces 513 and 514 of the first film layer 51 are also bonded to the energy-absorbing and impact-resistant material, providing all-round protection for the first film layer 51. The side surfaces 513 and 514 of the first film layer 51 are prone to stress concentration. This solution protects the side surfaces 513 and 514 of the first film layer 51, preventing stress-induced cracking of the side surfaces of the first film layer 51. Compared to the embodiment shown in FIG13 , the embodiment shown in FIG14 increases the bonding area between the first film layer 51 and the two second film layers 52, making the chemical bonding between the first film layer 51 and the second film layer 52 more stable.

[0112] Figures 15A, 15B, 15C, and 15D are all cross-sectional schematic diagrams of a cover plate provided in one embodiment of the present application. Referring to Figures 15A, 15B, 15C, and 15D, the present application provides various configuration schemes for the connection portion 522.

[0113] In one embodiment, as shown in FIG15A , there is one connecting portion 522 , which is disposed on one side of the first film layer 51 and connected between the two second film layers 52 . The two second film layers 52 and the connecting portion 522 form a semi-enclosed structure surrounding the second film layer 52 .

[0114] In one embodiment, as shown in FIG. 15B , there are three connecting portions 522 , two of which are located on both sides of the second film layer 52 , and another connecting portion 522 passes through the second film layer 52 inside the second film layer 52 .

[0115] In one embodiment, as shown in FIG15C , there is one connecting portion 522, which passes through the second film layer 52 within the second film layer 52. In this embodiment, the connecting portion 522 is not provided on the periphery of the side surface of the second film layer 52, but is provided within the second film layer 52.

[0116] In one embodiment, as shown in FIG. 15D , there are two connecting portions 522 , one of which is located on the side of the second film layer 52 , and the other of which passes through the second film layer 52 from the inside.

[0117] It can be understood that in the embodiments shown in Figures 15B, 15C and 15D, the number of connecting parts 522 passing through the second film layer 52 from the inside of the second film layer 52 can be two or more, and the connecting parts 522 can be set at appropriate positions according to the size of the area of ​​the flexible display module.

[0118] Figure 16 is a schematic diagram of a flexible display module 20 provided in one embodiment of the present application. Referring to Figure 16 in conjunction with Figure 5 , the cover plate 50 of the flexible display module 20 in the embodiment shown in Figure 16 has the same structure as the cover plate provided in the embodiment shown in Figure 14 . A protective film 60 is adhered to the third film layer 53 of the cover plate 50 via an optical adhesive layer 71. The second film layer 52 at the bottom of the cover plate 50 is adhered to the display layer 40 via an optical adhesive layer 72. The specific structure of the protective film 60 is not limited in this embodiment.

[0119] Figure 17 is a schematic diagram of a flexible display module 20 provided in one embodiment of the present application. Referring to Figure 17 in conjunction with Figure 5 , the cover plate 50 and protective film 60 of the flexible display module 20 in the embodiment shown in Figure 17 have the same cover plate structure as the embodiment shown in Figure 14 . Specifically, in the embodiment shown in Figure 17 , the flexible display module 20 comprises two stacked composite laminate structures.

[0120] In one embodiment, the cover plate provided herein may include a composite laminate structure comprising two first film layers and a first film layer stacked together, or a composite laminate structure comprising multiple (three or more) first film layers and a first film layer stacked together. For example, the first film layer may be UTG. Therefore, the specific embodiments of the present application can implement a laminate structure comprising dual UTG (which may include UTGs of unequal thickness) and multiple UTGs (which may include UTGs of unequal thickness).

[0121] Figure 18 is a schematic diagram of a flexible display module 20 provided in one embodiment of the present application. Referring to Figure 18 in conjunction with Figure 5 , in the embodiment shown in Figure 18 , the protective film 60 of the flexible display module 20 has the same cover plate structure as that provided in the embodiment shown in Figure 14 . The cover plate 50 in the flexible display module can be of other types; in this embodiment, the cover plate 50 does not employ a composite laminated structure.

[0122] It can be understood that in the embodiments shown in Figures 16, 17 and 18, the specific structure of the cover plate can also adopt the structure of the cover plate provided by any embodiment in Figures 6A, 6B, 6C, 6D, 8, 9, 11, 12, 13, 14, 15A, 15B, 15C and 15D.

[0123] In one embodiment, the first film layer 51 in the cover plate provided by any one of Figures 6A, 6B, 6C, 6D, 8, 9, 11, 12, 13, 14, 15A, 15B, 15C, and 15D is a structure of uniform thickness.

[0124] In one embodiment, the first film layer 51 in the cover plate provided in any one of Figures 6A, 6B, 6C, 6D, 8, 9, 11, 12, 13, 14, 15A, 15B, 15C, and 15D can also be replaced with a structure of unequal thickness.

[0125] Figures 19A, 19B, and 19C are schematic diagrams of the combination of three first film layers of unequal thickness and a second film layer provided in one embodiment of the present application. Referring to Figures 19A, 19B, and 19C, in one embodiment, the first film layer 51 includes a bottom surface 512 and a top surface 511 disposed opposite each other, and the top surface 511 of the first film layer 51 is provided with a groove 5112. The film thickness at the location where the groove 5112 is provided on the first film layer 51 is less than that at the location where the groove is not provided on the first film layer 51. In one embodiment, the flexible display module is used in a foldable electronic device, and the groove 5112 is provided on the first film layer 51 corresponding to the position of the rotating shaft of the electronic device.

[0126] Referring to FIG. 19A , in one embodiment, a filler 5113 is provided in the groove 5112 formed by the first film layer 51. The filler 5113 is a low-modulus material, for example, the modulus of the filler 5113 is 10 MPa. The low-modulus material facilitates bending at the position of the groove 5112, helps ensure the bendability of the flexible display module 20, and helps improve the large-surface light and shadow experience of the electronic device. The filler 5113 is provided in the groove 5112. The outer surface of the filler 5113 is coplanar with the top surface 511 of the first film layer 51, that is, the groove 5112 is filled by the filler 5113, and the flatness of the top surface 511 of the first film layer 51 is restored. The top surface 511 of the first film layer 51 is covered with the second film layer 52. The second film layer 52 is chemically bonded to the high-modulus material of the first film layer 51 through the functional groups with bonding function in the energy-absorbing and impact-resistant material or the explosion-proof material, so that the first film layer 51 and the second film layer 52 are bonded by molecular force.

[0127] Referring to FIG. 19B , in one embodiment, a second film layer 52 is formed on top of a first film layer 51, and the energy-absorbing, impact-resistant, or explosion-proof material of the second film layer 52 fills the groove 5112 formed on the top of the first film layer 51. This solution facilitates a tighter bond between the first film layer 51 and the second film layer 52.

[0128] In the embodiments shown in Figures 19A and 19B , the second film layer 52 only covers the top surface 511 of the first film layer 51, and the two side surfaces of the first film layer 51 are not covered by the second film layer 52. Referring to Figure 19C , the embodiment shown in Figure 19C differs from the embodiment shown in Figure 19B in that the second film layer 52 covers the top surface 511 and side surfaces 513 and 514 of the first film layer 51. The bonding area between the second film layer 52 and the first film layer 51 in the embodiment shown in Figure 19C is larger than the bonding area between the second film layer 52 and the first film layer 51 in the embodiment shown in Figure 19B . Therefore, in the embodiment shown in Figure 19C , the bonding force between the second film layer 52 and the first film layer 51 is more stable.

[0129] The embodiment of the present application also provides a method for manufacturing a composite laminate structure.

[0130] Figures 20, 21, and 22 provide a method for manufacturing a composite laminate structure in which the first film layer is UTG and the second film layer is a non-Newtonian fluid material. This method uses a liquid composite heating and co-curing method to achieve the side wrapping of the UTG with a non-Newtonian fluid material. The specific steps are as follows:

[0131] Step 1, referring to Figure 20, provides a UTG raw material 90, the UTG raw material 90 includes a UTG release film 91 and a UTG layer 92 formed on the surface of the UTG release film 91, the UTG layer 92 covers part of the surface of the UTG release film 91, and on the periphery of the two sides of the UTG layer 92, part of the surface of the UTG release film 91 is not covered by the UTG layer 92.

[0132] The surface of the UTG layer 92 is subjected to a surface treatment process such as plasma or corona treatment, and after the treatment, the water drop angle is ≤15°.

[0133] A Newtonian fluid material 93 is provided. To increase the interfacial adhesion between the Newtonian fluid material 93 and the UTG layer 92 , a silane coupling agent (or epoxypropyltriethoxysilane, vinyltriethoxysilane, or oligomers thereof) is added to the non-Newtonian fluid material 93 .

[0134] A non-Newtonian fluid material 93 is applied to the surface of the UTG layer 92 and the portion of the UTG release film 91 not covered by the UTG layer 92. The non-Newtonian fluid material 93 is applied using a solvent-based liquid coating method. The top and side surfaces of the UTG layer 92 are both soaked and coated with the non-Newtonian fluid material 93.

[0135] Step 2, referring to FIG21, the non-Newtonian fluid material 93 is subjected to a solvent removal treatment. The non-Newtonian fluid material after solvent removal is in a semi-solid state; or the non-Newtonian fluid material 93 is made into a semi-solid state by partial UV irradiation. The thickness of the non-Newtonian fluid material 93 is in the range of 10-200um (this range includes the end points). An optical film layer 94 (such as an optical film such as PET / PI / TPU) is attached to the surface of the non-Newtonian fluid material 93 to form an intermediate structure. Then, the aforementioned intermediate structure is subjected to a heat curing treatment (or UV curing treatment) to cure the non-Newtonian fluid material 93 and achieve chemical bonding between the non-Newtonian fluid material 93 and the UTG layer 92, as well as chemical bonding between the non-Newtonian fluid material 93 and the optical film layer 94.

[0136] Step 3, referring to FIG. 22 , is to cut the desired shape (e.g., using laser cutting) to form a composite laminate structure, which can serve as a cover or protective film for a flexible display module. Specifically, the cut shape is larger than the outer contour of the UTG layer 92, for example, by at least 50 μm. This ensures the safety of the UTG layer 92 during the cutting process and prevents it from being cut or affected by the cutting force.

[0137] In other implementations, other optical film layers may be laminated onto the intermediate structure and then cut as a whole.

[0138] Figures 23, 24, 25, 26, and 27A provide a method for manufacturing a composite laminate structure in which the first film layer is UTG and the second film layer is a non-Newtonian fluid material. This method uses a solid-state heating and pressurizing composite manufacturing process. The specific steps are as follows:

[0139] Step 1, referring to Figure 23, provides an optical film layer 94 (e.g., PET / PI / TPU). The surface of optical film layer 94 can be treated with plasma or corona treatment to achieve a water drop angle of ≤30°. A Newtonian fluid material 93 is provided. To enhance the interfacial adhesion between Newtonian fluid material 93 and optical film layer 94, a silane coupling agent (e.g., glycidyltriethoxysilane, vinyltriethoxysilane, or oligomers thereof) is added to non-Newtonian fluid material 93.

[0140] The non-Newtonian fluid material 93 is coated on the optical film layer 94 and subjected to a solvent removal process. The non-Newtonian fluid material 93 after solvent removal is in a semi-solid state.

[0141] In step 2, referring to FIG. 24 , the non-Newtonian fluid material 93 is cured (e.g., by forming a solid film layer through partial UV irradiation, heating, moisture curing, or other processes). The thickness of the non-Newtonian fluid material 93 is between 10 and 200 μm. During the curing process, chemical bonding is achieved between the non-Newtonian fluid material 93 and the optical film layer 94. A release film 95 is formed on the side of the non-Newtonian fluid material 93 facing away from the optical film layer 94, forming an intermediate structure.

[0142] Step 3, referring to Figure 25, cut the intermediate structure formed in step 2 according to the shape of the UTG layer. For example, by laser cutting, the shape of the cut intermediate structure is larger than the outer contour of the UTG layer, for example, at least 50um larger.

[0143] Step 4, referring to FIG. 26 , remove the release film 95 on the side of the non-Newtonian fluid material 93 facing away from the optical film layer 94. Provide a UTG raw material 90 comprising a UTG release film and a UTG layer 92 formed on the surface of the UTG release film 91, with the UTG layer 92 covering the entire surface of the UTG release film 91. Plasma treatment is performed on the surfaces of the non-Newtonian fluid material 93 and the UTG layer 92. The plasma treatment process includes, but is not limited to, the following process conditions:

[0144] Vacuum degree 50mBar, plasma time 180s, power 350W, gas atmosphere air; or,

[0145] Vacuum degree 50mBar, plasma time 360s, power 350W, gas atmosphere air; or,

[0146] Vacuum degree 50mBar, plasma time 360s, power 350W, gas atmosphere oxygen.

[0147] Step 5, referring to Figure 27A , is to achieve compounding between the non-Newtonian fluid material 93 and the UTG layer 92 under heating and pressurizing conditions, thereby achieving chemical bonding between the non-Newtonian fluid material 93 and the UTG layer 92. Specifically, compounding between the UTG layer 92 and the non-Newtonian fluid material 93 is achieved under pressure, with the pressure on the membrane surface between the UTG layer 92 and the non-Newtonian fluid material 93 being recommended to be greater than 1 kPa. To accelerate compounding, the material may be heated (<120°C) for varying periods of time.

[0148] Figure 27B is a schematic diagram illustrating the principle of chemical bonding between the non-Newtonian fluid material 93 and the UTG layer 92, as described in the steps of Figure 27A. Referring to Figure 27B , the unoccupied orbitals of the boron atoms (B atoms) in the non-Newtonian fluid material 93 form coordination bonds with the surplus electron pairs on the hydroxyl oxygen groups on the surface of the UTG layer. Specifically, this intrinsic bond formation requires that the distance between the two membrane surfaces is sufficiently short and that groups capable of forming coordination bonds (e.g., B and O in Figure 27B ) are present on both membrane surfaces.

[0149] FIG28, FIG29 and FIG30 provide a method for manufacturing a composite laminate structure in which the first film layer is UTG and the second film layer is an explosion-proof material. This method realizes the manufacturing of the composite laminate structure by liquid composite heating or UV co-curing composite. The specific steps are as follows:

[0150] Step 1, referring to FIG. 28 , provides a UTG raw material 90. The UTG raw material 90 includes a UTG release film 91 and a UTG layer 92 formed on the surface of the UTG release film 91. The UTG layer 92 covers the entire surface of the UTG release film 91. The surface of the UTG layer 92 is treated with a plasma or corona treatment process to achieve a water drop angle of ≤15°.

[0151] The explosion-proof coating 96 is applied by liquid coating with a solvent. Specifically, the explosion-proof coating 96 is evenly coated on the surface of the UTG layer 92 using processes such as scraping, spraying, inkjet printing, and silk-screen printing. The material of the explosion-proof coating 96 can be a single or multiple resin systems such as epoxy, polyester, acrylic, and urethane resins, and can also be a single-component or multi-component method. A curing agent (i.e., a functional group with a bonding function) is introduced into the material of the explosion-proof coating 96. The curing agent is preferably a silane coupling agent, amide, or other system. The coating thickness is 5-100 μm.

[0152] Step 2, referring to FIG29 , is to cure the explosion-proof coating 96 , which may be cured by heating, UV irradiation, particle beam, etc. A release film 97 is applied to the surface of the cured explosion-proof coating 96 to form an intermediate structure.

[0153] Step 3, referring to FIG. 30 , the intermediate structure is cut according to the required shape, for example, by laser cutting. The cut shape needs to be larger than the outer contour of the UTG layer 92 , for example, at least 50 μm larger.

[0154] The explosion-proof coating 96 and the UTG layer 92 shown in Figures 28, 29 and 30 form a composite laminated structure. The explosion-proof coating 96 can be applied on the side of the UTG layer 92 close to the display layer of the flexible display module, and the explosion-proof coating 96 can also be applied on the UTG layer 92 away from the display layer (i.e., the side close to the user). The specific production steps are the same.

[0155] The aforementioned various manufacturing methods are applicable to both UTG layers 92 of equal thickness and UTG layers 92 of unequal thickness. That is, the schemes of first film layers 51 of unequal thickness shown in FIG. 19A , FIG. 19B and FIG. 19C can also be implemented using the aforementioned manufacturing methods.

[0156] Figures 31, 32, 33, 34, 35, 36, 37, and 38 are schematic diagrams of a mass production process for the composite laminated structure provided herein. The composite laminated structure provided in specific embodiments of this application has a mass production process suitable for mass production. For example, referring to Figures 31-38 , a mass production process provided in one embodiment is described below.

[0157] In step 1, as shown in FIG31 , a UTG monomer material 80 is provided. The UTG monomer material 80 includes a UTG layer 81 . The UTG layer 81 is stacked between two release films 82 and 83 .

[0158] In step 2, as shown in FIG32, a yellow light process is used to arrange and attach multiple UTG monomer incoming materials 80 to the UV viscosity-reducing film 100. FIG32 schematically shows four UTG monomer incoming materials 80 arranged on the UV viscosity-reducing film 100. In fact, more UTG monomer incoming materials 80 can be arranged as needed. The bonding force between the UV viscosity-reducing film 100 and the release film 83 is greater than the peeling force between the release film 83 and the UTG layer 81. In one embodiment, the wavelength for viscosity reduction is different from the wavelength for curing the glue or film (for example, the wavelength for curing the glue / film is 285 nm, and the wavelength for curing the UV viscosity-reducing film can be 365 nm).

[0159] Step 3, as shown in Figure 33, remove the release film 82 on the side of the UTG monomer material 80 away from the UV viscosity-reducing film 100. Specifically, the release film 82 can be removed from the UTG layer 81 manually or automatically by tearing the film off, exposing the UTG layer 81. The surface of the UTG layer 81 is treated with a plasma or corona treatment process, and the water drop angle after treatment is ≤15°.

[0160] Step 4, as shown in Figure 34, is to apply energy-absorbing and impact-resistant material 84 to form a semi-finished product. The energy-absorbing and impact-resistant material 84 covers the surface of the UTG layer 81 of all UTG monomer incoming materials 80 and the surface of the UV viscosity-reducing film 100. Specifically, in one embodiment, the explosion-proof coating or non-Newtonian fluid material and other impact-resistant materials are uniformly coated on the surface of the UTG layer by scraping, spraying, inkjet printing, silk-screen printing and other processes. In one embodiment, the uncured explosion-proof film or non-Newtonian fluid material is applied to the surface of the UTG layer by a bonding process (rolling, vacuum bonding, etc.). The explosion-proof glue or film resin system can be a single or multiple resin systems such as epoxy, polyester, acrylic, and urethane resin. The impact-resistant materials such as non-Newtonian fluids use the materials described above and can be single-component or multi-component. The curing agent is preferably a silane coupling agent, amide and other systems. The coating thickness of the energy-absorbing and impact-resistant material is 5-100um. The semi-finished product is cured to form an intermediate structure, and the curing method can be thermosetting, UV, particle beam, etc.

[0161] In step 5, as shown in FIG. 35 , the intermediate structure formed in step 4 is covered with a release film 85 , and the peeling force of the release film 85 is greater than the peeling force of the release film of the UTG monomer material 80 .

[0162] In step 6, as shown in FIG36 , the carrier film is debonded using the wavelength of the UV debonding film 100 , and the UV debonding film 100 is removed.

[0163] In step 7, as shown in Figure 37 , laser cutting or other methods are used to cut the monomers according to product requirements. The cut monomer film shape must be at least 50 μm larger than the shape of the UTG monomer incoming material 80. Figure 38 shows the resulting monomer composite laminate structure 800A after cutting. Monomer composite laminate structure 800A includes a release film 83, a UTG layer 81, an energy-absorbing and impact-resistant material 84, and a release film 85, which are stacked in this order.

[0164] By repeating the steps shown in Figures 31-38, i.e., the manufacturing process described in steps 1 to 7 above, a film layer composed of energy-absorbing and impact-resistant material can be formed on both sides of the UTG layer, as shown in Figure 39. Figure 39 shows a schematic diagram of a single composite laminate structure 800B in which energy-absorbing and impact-resistant material is provided on both sides of the UTG layer. Single composite laminate structure 800B includes a release film 83, energy-absorbing and impact-resistant material 84, UTG layer 81, energy-absorbing and impact-resistant material 84, and release film 85, which are stacked in sequence. For example, one layer of energy-absorbing and impact-resistant material 84 can be an explosion-proof material, and the other layer of energy-absorbing and impact-resistant material 84 can be a non-Newtonian fluid material.

[0165] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A composite laminated structure, applied to a flexible display module, characterized in that: The composite laminate structure includes a first film layer and a second film layer, wherein the first film layer and the second film layer are at least partially stacked, wherein the first film layer includes a high modulus material, wherein the modulus range of the high modulus material is greater than or equal to 4 GPa and less than or equal to 300 GPa, and wherein the second film layer includes an energy-absorbing and impact-resistant material and / or an explosion-proof material, wherein the energy-absorbing and impact-resistant material and / or the explosion-proof material of the second film layer are bonded to the high modulus material of the first film layer.

2. The composite double-layer structure according to claim 1, characterized in that: The energy-absorbing and impact-resistant material and / or the explosion-proof material has a functional group with a bonding function, and the functional group with a bonding function is bonded to the high modulus material of the first film layer.

3. The composite double-layer structure according to claim 2, characterized in that: The silanol groups generated after hydrolysis of the silane in the functional group having a bonding function are chemically bonded with the silanol groups on the surface of the first film layer to form silicon-oxygen-silicon bonds.

4. The composite laminate structure according to any one of claims 1 to 3, characterized in that: The modulus range of the energy-absorbing and impact-resistant material is greater than or equal to 10 Kpa and less than or equal to 500 Mpa; and / or the modulus range of the explosion-proof material is greater than or equal to 10 Kpa and less than or equal to 10 Gpa.

5. The composite laminate structure according to any one of claims 1 to 4, characterized in that: The functional group with bonding function in the energy-absorbing and impact-resistant material is: any one of silane coupling agent, epoxypropyltriethoxysilane, vinyltriethoxysilane, aminopropyltrimethoxysilane, or a silane oligomer composed of at least two of them; and / or, The functional group with bonding function in the explosion-proof material is: any one of silane coupling agent, epoxypropyl triethoxysilane, vinyl triethoxysilane, aminopropyl trimethoxysilane, or a silane oligomer composed of at least two of them, or amide.

6. The composite laminate structure according to any one of claims 1 to 5, characterized in that: The energy-absorbing and impact-resistant material is any one or more combinations of a shear thickening material, a polyurethane material, a glass-like polyurethane, and an energy-absorbing material containing non-covalent dynamic bonds.

7. The composite laminate structure according to any one of claims 1 to 6, characterized in that: The high modulus material is any one or more combinations of UTG, FRP, PI, a composite material of high modulus polyurethane and fiber material, and a nanocomposite material.

8. The composite laminate structure according to any one of claims 1 to 7, characterized in that: The explosion-proof material is a single or multiple resin system or a single component or multi-component form of epoxy, polyester, acrylic, and urethane resins.

9. The composite laminate structure according to any one of claims 1 to 8, characterized in that: The number of the first film layers is at least two, at least two of the first film layers are stacked, and the second film layer is bonded to at least one of the first film layers.

10. The composite laminate structure according to any one of claims 1 to 9, characterized in that: The composite laminate structure further includes a third film layer, the second film layer is stacked between the third film layer and the first film layer, and the second film layer is bonded to the material of the third film layer.

11. The composite laminate structure according to claim 10, characterized in that: The composite laminate structure further includes a fourth film layer stacked with the first film layer, the first film layer is bonded to the fourth film layer via an optical adhesive layer, and the fourth film layer is stacked between the first film layer and the display layer of the flexible display module.

12. The composite laminate structure according to claim 10, characterized in that: The composite laminate structure also includes a fourth film layer stacked with the first film layer, the first film layer is bonded to the fourth film layer through an optical adhesive layer, the third film layer is stacked between the second film layer and the display layer of the flexible display module, and the fourth film layer is located on the side of the first film layer away from the second film layer.

13. The composite laminate structure according to any one of claims 1 to 9, characterized in that: The number of the second film layers is two, one of which is located on the top surface of the first film layer, and the other is located on the bottom surface of the first film layer.

14. The composite laminate structure according to claim 13, characterized in that: The composite laminate structure further includes a third film layer, and the second film layer located on the top surface of the first film layer is bonded to the material of the third film layer.

15. The composite laminate structure according to claim 13 or 14, characterized in that: The second film layer located on the bottom surface of the first film layer is bonded to the display layer of the flexible display module through an optical adhesive layer.

16. The composite laminate structure according to any one of claims 1 to 9, characterized in that: The composite laminate structure also includes a fourth film layer and a fifth film layer that are stacked, the fifth film layer includes energy-absorbing and impact-resistant materials and / or explosion-proof materials, the fourth film layer and the fifth film layer are bonded, and the fifth film layer is adhered to the surface of the first film layer that is away from the second film layer through an optical adhesive layer.

17. The composite laminate structure according to any one of claims 1 to 16, characterized in that: The first film layer includes a top surface, a bottom surface, and a side surface connected between the top surface and the bottom surface, a portion of the second film layer is bonded to the top surface of the first film layer, and a portion of the second film layer is bonded to the side surface of the first film layer.

18. The composite laminate structure according to any one of claims 1 to 16, characterized in that: The number of the second film layers is two, and they are respectively arranged on the top surface and the bottom surface of the first film layer. The composite laminate structure also includes a connecting portion connected between two layers of the second film layers, and the connecting portion is bonded to the first film layer.

19. The composite laminate structure according to claim 18, characterized in that: The connecting portion and the second film layer are made of the same material.

20. The composite laminate structure according to any one of claims 1 to 19, characterized in that: A groove is provided on the top surface of the first film layer, and the film layer thickness at the position where the groove is provided on the first film layer is smaller than the film layer thickness at other positions on the first film layer, and the second film layer is stacked on the top surface of the first film layer; a filling glue is provided in the groove, and / or the groove accommodates part of the second film layer.

21. A flexible display module, characterized in that: The composite laminate structure comprises a substrate, a display layer and the composite laminate structure according to any one of claims 1 to 20, wherein the display layer is stacked between the substrate and the composite laminate structure.

22. A flexible display module, characterized in that: It comprises a substrate, a display layer, a cover plate and a protective film which are stacked in sequence, and at least one of the cover plate and the protective film is a composite laminated structure as claimed in any one of claims 1 to 20.

23. An electronic device, characterized in that: It comprises a shell and the flexible display module according to claim 21 or 22, wherein the flexible display module is assembled to the shell.

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