Array substrate, light-emitting substrate, and display apparatus

Abstract

An array substrate, a light-emitting substrate, and a display apparatus. The array substrate comprises a plurality of light homogenizing units arranged in an array, each light homogenizing unit comprising: a base, which comprises a first surface and a second surface that are arranged opposite each other, wherein the first surface is provided with a recess; a first reflecting layer, which is located on the side of the first surface that is far away from the second surface, wherein the orthographic projection of the first reflecting layer on the second surface of the base does not overlap the orthographic projection of the recess on the second surface of the base; and a second reflecting layer, which is located on the side of the first reflecting layer that is far away from the second surface of the base, wherein the orthographic projection of the second reflecting layer on the second surface of the base partially overlaps the orthographic projection of the first reflecting layer on the second surface of the base, and the second reflecting layer is provided with an opening, the orthographic projection of the opening in the second surface of the base being located in the orthographic projection of the recess on the second surface of the base.

Description

Array substrate, light-emitting substrate, and display device

[0001] Related patent applications

[0002] This application claims priority to PCT application No. PCT / CN2023 / 122603 filed on September 28, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present application relates to the field of display technology, and in particular to an array substrate, a light-emitting substrate, and a display device. Background Art

[0004] With the development of light-emitting diode (LED) technology, light-emitting substrates using submillimeter or even micron-scale light-emitting diodes (LEDs) have become widely used. This allows products such as liquid crystal displays (LCDs) to achieve contrast levels comparable to those of organic light-emitting diode (OLED) displays while retaining the technical advantages of LCDs. This improves display quality and provides users with a superior visual experience.

[0005] Summary of the Invention

[0006] The present application provides an array substrate, a light-emitting substrate, and a display device.

[0007] According to a first aspect of an embodiment of the present application, an array substrate is provided, the array substrate including a plurality of light homogenizing units arranged in an array, each light homogenizing unit including: a substrate including a first surface and a second surface opposite to each other, the first surface being provided with a groove; a first reflective layer located on a side of the first surface away from the second surface, the orthographic projection of the first reflective layer on the second surface of the substrate not overlapping with the orthographic projection of the groove on the second surface of the substrate; a second reflective layer located on a side of the first reflective layer away from the second surface of the substrate, the orthographic projection of the second reflective layer on the second surface of the substrate partially overlapping with the orthographic projection of the first reflective layer on the second surface of the substrate, the second reflective layer being provided with an opening, the orthographic projection of the opening on the second surface of the substrate being located within the orthographic projection of the groove on the second surface of the substrate.

[0008] In some embodiments, each light homogenization unit further includes a first structure, the first structure is located on a side of the first reflective layer away from the substrate, and the first structure is in contact with the second reflective layer.

[0009] In some embodiments, the first structure includes a third reflective layer located on a side of the second reflective layer away from the second surface of the substrate, and an orthographic projection of the third reflective layer on the second surface of the substrate covers a boundary of an orthographic projection of the groove on the second surface of the substrate.

[0010] In some embodiments, the third reflective layer includes a reflective adhesive layer.

[0011] In some embodiments, an orthographic projection of the reflective adhesive layer on the second surface of the substrate coincides with an orthographic projection of the second reflective layer on the second surface of the substrate.

[0012] In some embodiments, the second reflective layer includes a first reflective portion and a second reflective portion, the orthographic projection of the first reflective portion on the second surface of the substrate does not overlap with the orthographic projection of the groove on the second surface of the substrate, the orthographic projection of the second reflective portion on the second surface of the substrate is located within the orthographic projection of the groove on the second surface of the substrate, and the orthographic projection of the reflective adhesive layer on the second surface of the substrate covers the orthographic projections of a portion of the first reflective portion close to the edge of the groove and a portion of the second reflective portion close to the edge of the groove on the second surface of the substrate.

[0013] In some embodiments, the orthographic projection of the second reflective layer on the second surface of the substrate does not overlap with the orthographic projection of the groove on the second surface of the substrate, the orthographic projection of the second reflective layer on the second surface of the substrate is within the orthographic projection of the reflective adhesive layer on the second surface of the substrate, and the orthographic projection of the reflective adhesive layer on the second surface of the substrate overlaps with the orthographic projection of the groove on the second surface of the substrate.

[0014] In some embodiments, the first structure further includes: a fourth reflective layer located on a side of the third reflective layer away from the second surface of the substrate; the ductility of the material of the third reflective layer is greater than the ductility of the material of the second reflective layer, and the material of the fourth reflective layer is the same as the material of the second reflective layer.

[0015] In some embodiments, orthographic projections of the second reflective layer, the third reflective layer, and the fourth reflective layer on the second surface of the substrate at least partially overlap.

[0016] In some embodiments, the first structure includes a first organic layer between the first reflective layer and the second reflective layer, and an orthographic projection of the first organic layer on the second surface of the substrate covers an orthographic projection of the first reflective layer on the second surface of the substrate.

[0017] In some embodiments, the first structure includes a plurality of second through holes uniformly arranged around the opening on the second reflective layer, and the orthographic projections of the plurality of second through holes on the second surface of the substrate are located within the orthographic projection of the groove on the second surface of the substrate.

[0018] In some embodiments, the opening is circular, and the plurality of second through holes are radially distributed with the center of the opening as the center.

[0019] In some embodiments, each second through hole in the plurality of second through holes has a circular cross-section parallel to the second surface, a diameter of each second through hole is ≥5 μm, and a distance between two adjacent second through holes is ≥5 μm.

[0020] In some embodiments, the first structure further includes: a plurality of strip-shaped portions arranged on a side of the second reflective layer facing the substrate and / or a side of the second reflective layer facing away from the substrate, wherein the orthographic projections of the plurality of strip-shaped portions on the second surface of the substrate are located within the orthographic projection of the groove on the second surface of the substrate.

[0021] In some embodiments, the opening is circular, and the plurality of strip-shaped portions are evenly distributed radially with the center of the opening as the center.

[0022] In some embodiments, the projection of each of the plurality of strip portions on the second surface of the substrate is a rectangle, the width of each strip portion is ≥5 μm, and the distance between two adjacent strip portions closest to the opening is ≥5 μm.

[0023] In some embodiments, a material of the plurality of strip portions is the same as a material of the second reflective layer.

[0024] In some embodiments, each light homogenizing unit further includes: a first protrusion, wherein the first protrusion is located in the groove, and in the direction from the first surface of the substrate to the second surface of the substrate, the area of ​​the cross section of the first protrusion parallel to the second surface of the substrate gradually increases, and the distance from the surface of the first protrusion away from the second surface of the substrate to the second surface of the substrate is less than or equal to the distance between the first surface of the substrate and the second surface of the substrate.

[0025] In some embodiments, each light homogenizing unit further includes: a fifth reflective layer, the fifth reflective layer covering at least a side surface of the first protrusion; and a color conversion structure located in the groove, the color conversion structure covering the fifth reflective layer, and the orthographic projection of the color conversion structure on the second surface of the substrate is located within the orthographic projection of the fifth reflective layer on the second surface of the substrate.

[0026] In some embodiments, an orthographic projection of a geometric center of the first protrusion on the second surface of the substrate coincides with an orthographic projection of a geometric center of the groove on the second surface of the substrate.

[0027] In some embodiments, an outer contour of an orthographic projection of the first protrusion on the second surface of the substrate is circular, and an outer contour of an orthographic projection of the groove on the second surface of the substrate is circular.

[0028] In some embodiments, each light homogenizing unit further includes: a second protrusion, the second protrusion is located in the groove, the outer contour of the orthographic projection of the second protrusion on the second surface of the substrate is annular, the orthographic projection of the second protrusion on the second surface of the substrate surrounds the orthographic projection of the first protrusion on the second surface of the substrate, and the distance from the surface of the second protrusion away from the second surface of the substrate to the second surface of the substrate is less than the distance from the surface of the first protrusion away from the second surface of the substrate to the second surface of the substrate.

[0029] In some embodiments, the second reflective layer includes a second reflective portion, the orthographic projection of the second reflective portion on the second surface of the substrate falls within the orthographic projection of the groove on the second surface of the substrate; the width of the second reflective portion is a first dimension; the longitudinal cross-section of the portion of the groove located on the side of the second protrusion away from the first protrusion is an arc, and the length of the radius of the circle in which the longitudinal cross-section of the portion of the groove lies is a second dimension; the first dimension is equal to the second dimension and is greater than the depth of the groove.

[0030] In some embodiments, the first protrusion and the second protrusion are integrally formed with the substrate.

[0031] In some embodiments, the groove is filled with a transparent organic layer, and the refractive index of the transparent organic layer is lower than the refractive index of the substrate.

[0032] In some embodiments, a light uniforming structure is provided on a surface of the first reflective layer facing the substrate.

[0033] In some embodiments, the light uniforming structure includes a plurality of recessed structures arranged in an array, and the array substrate further includes a plurality of supporting portions arranged in an array and located between the first reflective layer and the substrate, and the first reflective layer is in direct contact with the plurality of supporting portions.

[0034] In some embodiments, the light uniforming structure includes a plurality of protrusions arranged in an array and facing the substrate, and a first surface of the substrate is provided with a plurality of recesses arranged in an array, with one protrusion located in a corresponding recess.

[0035] In some embodiments, the light uniforming structure includes a plurality of protruding structures arranged in an array and facing the substrate, a microstructure layer is arranged between the first surface of the substrate and the first reflective layer, and a surface of the microstructure layer facing the first reflective layer is provided with a plurality of recessed portions arranged in an array, and a protruding structure is located in a corresponding recessed portion.

[0036] According to a second aspect of an embodiment of the present application, a light-emitting substrate is provided, comprising a plurality of light-emitting elements and the array substrate described in any of the foregoing embodiments; the light-emitting elements comprise a plurality of pins, each pin being electrically connected to the array substrate via a conductive pad.

[0037] In some embodiments, the light-emitting substrate further includes a sixth reflective layer, the sixth reflective layer covers the light-emitting element, and a light exit hole is provided on a side of the sixth reflective layer facing the array substrate.

[0038] According to a third aspect of the embodiments of the present application, a display device is provided, comprising a display panel and the light-emitting substrate described in any of the aforementioned embodiments; the display panel is located on a side of the substrate away from the light-emitting element. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly describe the technical solutions in the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0040] FIG1A is a partial cross-sectional view of an array substrate provided by an exemplary embodiment of the present application;

[0041] FIG1B is a partial cross-sectional view of an array substrate provided by another exemplary embodiment of the present application;

[0042] FIG2 is a partial cross-sectional view of an array substrate provided by yet another exemplary embodiment of the present application;

[0043] FIG3 is a partial cross-sectional view of an array substrate provided by another exemplary embodiment of the present application;

[0044] FIG4 is a partial cross-sectional view of an array substrate provided by another exemplary embodiment of the present application;

[0045] FIG5 is a top view of an array substrate provided by an exemplary embodiment of the present application;

[0046] FIG6 is a partial enlarged view of the array substrate shown in FIG2 ;

[0047] FIG7 is a partial enlarged view of the array substrate shown in FIG3 ;

[0048] FIG8 is a flow chart of a method for preparing an array substrate provided by an exemplary embodiment of the present application;

[0049] FIG9A is a partial cross-sectional view of a first intermediate structure of an array substrate provided by an exemplary embodiment of the present application;

[0050] FIG9B is a partial top view of a first intermediate structure of an array substrate provided by an exemplary embodiment of the present application;

[0051] FIG10 is a partial cross-sectional view of a second intermediate structure of an array substrate provided by an exemplary embodiment of the present application;

[0052] FIG11 is a partial cross-sectional view of a third intermediate structure of an array substrate provided by an exemplary embodiment of the present application;

[0053] FIG12 is a partial cross-sectional view of a fourth intermediate structure of an array substrate provided by an exemplary embodiment of the present application;

[0054] FIG13 is a partial cross-sectional view of a fifth intermediate structure of an array substrate provided by an exemplary embodiment of the present application;

[0055] FIG14 is a partial cross-sectional view of a sixth intermediate structure of an array substrate provided by an exemplary embodiment of the present application;

[0056] FIG15 is a partial cross-sectional view of a first intermediate structure of an array substrate provided by another exemplary embodiment of the present application;

[0057] FIG16 is a partial enlarged view of the first intermediate structure shown in FIG15;

[0058] FIG17 is a partial cross-sectional view of a second intermediate structure of an array substrate provided by another exemplary embodiment of the present application;

[0059] FIG18 is a partial cross-sectional view of a third intermediate structure of an array substrate provided by another exemplary embodiment of the present application;

[0060] FIG19 is a partial cross-sectional view of a seventh intermediate structure of an array substrate provided by an exemplary embodiment of the present application;

[0061] FIG20 is a partial cross-sectional view of a first intermediate structure of an array substrate provided by yet another exemplary embodiment of the present application;

[0062] FIG21 is a partial enlarged view of the first intermediate structure shown in FIG20;

[0063] FIG22 is a partial cross-sectional view of a second intermediate structure of an array substrate provided by yet another exemplary embodiment of the present application;

[0064] FIG23 is a partial cross-sectional view of a third intermediate structure of an array substrate provided by yet another exemplary embodiment of the present application;

[0065] FIG24 is a partial cross-sectional view of a first intermediate structure of an array substrate provided by another exemplary embodiment of the present application;

[0066] FIG25 is a partial cross-sectional view of a second intermediate structure of an array substrate provided by another exemplary embodiment of the present application;

[0067] FIG26 is a partial cross-sectional view of an eighth intermediate structure of an array substrate provided by an exemplary embodiment of the present application;

[0068] FIG27 is a partial cross-sectional view of a ninth intermediate structure of an array substrate provided by an exemplary embodiment of the present application;

[0069] FIG28 is a partial cross-sectional view of a tenth intermediate structure of an array substrate provided by an exemplary embodiment of the present application;

[0070] FIG29 is a partial cross-sectional view of an eleventh intermediate structure of an array substrate provided by an exemplary embodiment of the present application;

[0071] FIG30 is a partial cross-sectional view of a twelfth intermediate structure of an array substrate provided by an exemplary embodiment of the present application;

[0072] FIG31 is a partial cross-sectional view of a thirteenth intermediate structure of an array substrate provided by an exemplary embodiment of the present application;

[0073] FIG32 is a partial cross-sectional view of a light-emitting substrate provided by an exemplary embodiment of the present application;

[0074] FIG33 is a top view of a light-emitting substrate provided by an exemplary embodiment of the present application;

[0075] FIG34 is a partial cross-sectional view of an array substrate provided by yet another exemplary embodiment of the present application;

[0076] FIG35 is a partial cross-sectional view of an array substrate provided by yet another exemplary embodiment of the present application;

[0077] FIG36A shows a photograph of a large-area peeling of a film layer of a light-emitting substrate including the above-mentioned array substrate;

[0078] FIG36B shows a scanning electron microscope image of region A in FIG35 ;

[0079] FIG36C shows a scanning electron microscope image of region B in FIG35 ;

[0080] FIG36D shows a scanning electron microscope image of region B in FIG35 ;

[0081] FIG36E shows an optical test image of a bright ring caused by a crack;

[0082] FIG37 is a partial cross-sectional view of an array substrate provided by yet another exemplary embodiment of the present application;

[0083] FIG38 is a partial SEM image of an array substrate provided according to an embodiment of the present application;

[0084] FIG39 is a partial cross-sectional view of an array substrate provided by yet another exemplary embodiment of the present application;

[0085] FIG40 is a partial cross-sectional view of an array substrate provided by yet another exemplary embodiment of the present application;

[0086] FIG41 is a partial cross-sectional view of an array substrate provided by yet another exemplary embodiment of the present application;

[0087] FIG42 is a partial cross-sectional view of an array substrate provided by yet another exemplary embodiment of the present application;

[0088] FIG43A is a schematic structural diagram of a second reflective layer serving as a mask before etching a substrate according to an embodiment of the present application;

[0089] FIG43B is a schematic diagram of a partial top view of the array substrate after the substrate is etched according to one embodiment of the present application;

[0090] FIG43C is a partial SEM image of the array substrate after substrate etching according to one embodiment of the present application;

[0091] FIG44A is a schematic structural diagram of a second reflective layer and strip portions serving as a mask before etching a substrate according to an embodiment of the present application;

[0092] FIG44B is a schematic diagram of the structure of the second reflective layer and the strip-shaped portion after the substrate is etched according to one embodiment of the present application;

[0093] FIG44C is a scanning electron microscope image of the structure of the second reflective layer and the strip-shaped portion after etching the substrate according to one embodiment of the present application;

[0094] FIG45 is a partial cross-sectional view of an array substrate provided by yet another exemplary embodiment of the present application;

[0095] FIG46A is a schematic diagram of a structure in which the second reflective layer serves as a mask before etching the substrate according to an embodiment of the present application;

[0096] Figure 46B is a schematic diagram of the structure of the second reflective layer serving as a mask before etching the substrate according to one embodiment of the present application.

[0097] It should be understood that the various drawings in the embodiments of the present disclosure are merely schematic illustrations of the connection relationships between the various components. The sizes of the various components in the drawings are not drawn to scale, and their relative positions do not necessarily correspond exactly to their actual positions. In addition, in the drawings, the same or similar reference numerals are used to refer to the same or similar components. DETAILED DESCRIPTION

[0098] The following will be combined with the accompanying drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the embodiments described are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present disclosure.

[0099] The embodiments of the present application provide an array substrate, a light-emitting substrate, and a display device. The array substrate, light-emitting substrate, and display device in the embodiments of the present application are described in detail below with reference to the accompanying drawings. The features of the following embodiments may complement or be combined with each other unless they conflict.

[0100] An embodiment of the present application provides an array substrate. As shown in FIG5 , the array substrate includes a plurality of light homogenizing units 100 arranged in an array. FIG1A through FIG4 illustrate cross-sectional views of a light homogenizing unit of an array substrate according to an embodiment of the present disclosure. Each light homogenizing unit 100 includes a substrate 10, a first protrusion 20, a first reflective layer 31, a second reflective layer 32, a conductive layer 40, and a fifth reflective layer 50.

[0101] The substrate 10 includes a first surface 101 and a second surface 102 facing each other. The first surface 101 is provided with a groove 11. The first protrusion 20 is located within the groove 11 and spaced apart from the side surfaces of the groove 11. The cross-sectional area of ​​the first protrusion 20 parallel to the second surface 102 gradually increases in the direction from the first surface 101 to the second surface 102. The fifth reflective layer 50 covers at least the side surfaces of the first protrusion 20. The second reflective layer 32 is located on the side of the substrate 10 away from the second surface 102. The second reflective layer 32 is provided with openings 303. The orthographic projection of one of the openings 303 on the second surface 102 of the substrate 10 is located within the orthographic projection of one of the grooves 11 on the second surface 102 of the substrate 10. The conductive layer 40 is located on the side of the second reflective layer 32 facing away from the substrate 10 and includes a conductive pad 41.

[0102] In an array substrate provided by an embodiment of the present application, a groove is provided on the first surface of the substrate. In a direction from the first surface of the substrate to the second surface, the cross-section of a first protrusion located within the groove of the substrate gradually increases. Light incident from one side of the first surface of the substrate to a fifth reflective layer covering a side of the first protrusion is reflected by the fifth reflective layer. The light reflected by the fifth reflective layer is then incident on the second reflective layer and reflected again. A portion of the light emitted by the second reflective layer is directly emitted through the surface of the substrate facing away from the second reflective layer, while another portion of the light is reflected multiple times within the substrate and then emitted through the surface of the substrate facing away from the second reflective layer. This improves the uniformity of the emitted light. In this manner, the array substrate can be provided without a light-uniformity film layer or with a reduced number of light-uniformity film layers, which helps reduce the thickness of the array substrate.

[0103] In the embodiment of the present application, the side surface of the groove 11 refers to the continuous part of the inner surface of the groove 11, and the side surface of the groove 11 is opposite to the first protrusion 20; the bottom surface of the groove 11 refers to the continuous part of the inner surface of the groove 11, the bottom surface of the groove 11 is not opposite to the first protrusion 20, and the bottom surface of the groove 11 is continuous with the bottom surface of the first protrusion 20, and the distance from any point on the bottom surface of the groove 11 to the second surface 102 of the substrate 10 is not greater than the distance from any point on the side surface to the second surface 102 of the substrate 10.

[0104] In one embodiment, the refractive index of the substrate 10 is greater than that of air. With this configuration, when light reflected by the second reflective layer 32 strikes the second surface 102 of the substrate 10, some of the light may undergo total internal reflection and re-enter the second reflective layer 32. This further improves the uniformity of the emitted light. In some embodiments, the material of the substrate 10 may be any one of glass, quartz, and polymethyl methacrylate (PMMA).

[0105] In one embodiment, the distance between the surface of the first protrusion 20 away from the second surface 102 and the second surface 102 is less than or equal to the distance between the first surface 101 and the second surface 102. In the embodiment shown in Figures 1A and 1B, the distance between the surface of the first protrusion 20 away from the second surface 102 and the second surface 102 is less than the distance between the first surface 101 and the second surface 102. In the embodiment shown in Figures 2 to 4, the distance between the surface of the first protrusion 20 away from the second surface 102 and the second surface 102 is equal to the distance between the first surface 101 and the second surface 102.

[0106] In one embodiment, the material of the first protrusion 20 is the same as or similar to that of the substrate 10 , which can improve the optical consistency of the structures at corresponding positions.

[0107] Furthermore, as shown in Figure 1A, the first protrusion 20 is an integral structure with the substrate 10. In another embodiment, as shown in Figure 1B, the first protrusion 20 is not an integral structure with the substrate 10.

[0108] In one embodiment, the longitudinal cross-sectional profile of the first protrusion 20 includes an arc-like, straight-line-like, or zigzag-line-like shape. "Arc-like" refers to a shape that is generally arc-like, but is not limited to a standard arc. That is, "arc" here includes not only basic arc shapes but also shapes similar to an arc. For example, some points in the longitudinal cross-section of the first protrusion 20 are not aligned with other points on the same circle. "Straight-line-like" refers to an overall straight line, but is not limited to a standard straight line. That is, "straight line" here includes not only basic straight lines but also shapes similar to a straight line. For example, some points in the longitudinal cross-section of the first protrusion 20 are not aligned with other points on a straight line. "Zigzag-line-like" refers to an overall zigzag shape but is not limited to a standard zigzag shape. That is, "zigzag line" here includes not only basic zigzag shapes but also shapes similar to a zigzag. For example, a certain section in the longitudinal cross-section of the first protrusion 20 is an arc. The longitudinal direction refers to the direction perpendicular to the second surface 102 of the substrate.

[0109] In one embodiment, as shown in Figures 1A to 5, the substrate 10 is provided with a plurality of grooves 11 arranged at intervals, and the second reflective layer 32 is provided with a plurality of openings 303. The openings 303 may correspond one-to-one with the grooves 11, and the orthographic projection of each opening 303 on the second surface 102 of the substrate 10 is located within the orthographic projection of the corresponding groove 11 on the second surface 102 of the substrate 10. It should be noted that Figure 5 is a schematic diagram, and the number of grooves 11 in an actual array substrate is much greater than the number of grooves 11 shown in Figure 5.

[0110] In one embodiment, in a direction from the first surface 101 to the second surface 102 , the cross-sectional area of ​​the groove 11 parallel to the second surface 102 gradually decreases.

[0111] In one embodiment, as shown in FIG. 1A to FIG. 4 , the area surrounding the first protrusion 20 in the bottom surface of the groove 11 is a plane.

[0112] In one embodiment, a line connecting the geometric center of the first protrusion 20 and the geometric center of the groove 11 is perpendicular to the second surface 102 of the substrate 10 .

[0113] Furthermore, the center of the orthographic projection of the first protrusion 20 on the second surface 102 of the substrate 10 coincides with the center of the orthographic projection of the groove 11 on the second surface 102 of the substrate 10 .

[0114] Further, as shown in Figure 5, the outer contour of the orthographic projection of the first protrusion 20 on the second surface 102 of the substrate 10 is circular, and the outer contour of the orthographic projection of the groove 11 on the second surface 102 of the substrate 10 is circular; the center of the outer contour of the orthographic projection of the first protrusion 20 on the second surface 102 of the substrate 10 coincides with the center of the outer contour of the orthographic projection of the groove 11 on the second surface 102 of the substrate 10.

[0115] Furthermore, the first protrusion 20 includes a vertex, and the orthographic projection of the vertex of the first protrusion 20 on the second surface 102 of the substrate 10 coincides with the center of the orthographic projection of the groove 11 on the second surface 102 of the substrate 10 .

[0116] In one embodiment, a ratio of a radius of an outer contour of an orthographic projection of the first protrusion 20 on the second surface 102 of the substrate 10 to a radius of an outer contour of an orthographic projection of the groove 11 on the second surface 102 of the substrate 10 is less than 0.5.

[0117] In one embodiment, the conductive layer 40 further includes a plurality of signal lines for providing signals to the inorganic light-emitting diodes and / or driver chips. The plurality of signal lines may include a common voltage line, a drive voltage line, a source power line, a source address line, a clock signal line, a data line, etc. In some embodiments, the thickness of the conductive layer 40 may range from 2 μm to 7 μm.

[0118] In one embodiment, as shown in Figures 1A to 4, the array substrate further includes a color conversion structure 70 located within the groove 11. The color conversion structure 70 may cover the fifth reflective layer 50. When the light emitted by the light-emitting elements of the light-emitting substrate on which the array substrate is located is non-white light, the color conversion structure 70, under the stimulation of the non-white light, converts the light into white light, thereby improving the utilization of light energy. Positioning the color conversion structure 70 within the groove 11 does not increase the thickness of the array substrate, thereby contributing to a thinner and lighter array substrate. In some embodiments, the material of the color conversion structure 70 may include at least one of a quantum dot material and a fluorescent material.

[0119] In one embodiment, the color conversion structure 70 of the array substrate includes quantum dot materials of different colors. For example, when the light-emitting element emits blue light, the color conversion structure 70 of the array substrate may include red quantum dot material, green quantum dot material, and a transparent material, with each color conversion structure 70 containing quantum dot materials of a single color. When blue light passes through the red quantum dot material, it is converted to red light; when blue light passes through the green quantum dot material, it is converted to green light. Blue light can also pass directly through the transparent material. When blue, red, and green light are mixed and superimposed in a certain proportion, they appear as white light.

[0120] In one embodiment, the distance between the surface of the color-converting structure 70 distal from the second surface 102 and the second surface 102 is less than or equal to the distance between the first surface 101 and the second surface 102. In the embodiments shown in Figures 1A to 4, the distance between the surface of the color-converting structure 70 distal from the second surface 102 and the second surface 102 is equal to the distance between the first surface 101 and the second surface 102. In other embodiments, the distance between the surface of the color-converting structure 70 distal from the second surface 102 and the second surface 102 may be less than the distance between the first surface 101 and the second surface 102.

[0121] In one embodiment, as shown in Figures 1A to 4, the array substrate further includes an encapsulation layer 60, which is located between the substrate 10 and the conductive layer 40. The encapsulation layer 60 covers the color conversion structure 70. This configuration protects the color conversion structure 70, thereby reducing the risk of failure of the color conversion structure 70 due to water and oxygen corrosion.

[0122] In one embodiment, the encapsulation layer 60 includes an organic film layer and an inorganic film layer, and the film layer farthest from the substrate 10 is the inorganic film layer. The encapsulation layer 60 may include multiple inorganic film layers, and the material of the inorganic film layer may include at least one of silicon carbonitride and silicon oxide.

[0123] In one embodiment, the encapsulation layer 60 is a continuous, integral film layer that covers each color conversion structure 70 and the gaps between adjacent color conversion structures 70. In some embodiments, the orthographic projection of the encapsulation layer 60 on the second surface 102 of the substrate is equal to the area of ​​the second surface 102. Alternatively, as shown in FIG5 , the array substrate includes a central region 110 and an edge region 120 located on at least one side of the central region 110. All grooves 11 are located in the central region 110 of the substrate 10. The encapsulation layer 60 covers the central region 110 of the substrate 10 but does not cover the edge region 120 of the substrate 10. In the embodiment shown in FIG5 , the edge region 120 surrounds the central region 110.

[0124] In one embodiment, the material of the second reflective layer 32 includes a conductive material. The orthographic projection of the organic film layer of the encapsulation layer 60 on the second surface 102 of the substrate 10 covers the orthographic projection of the second reflective layer 32 on the second surface 102 of the substrate 10. The thickness of the organic film layer is relatively large, and the orthographic projection of the organic film layer on the second surface 102 of the substrate 10 covers the orthographic projection of the second reflective layer 32 on the second surface 102 of the substrate 10, which can reduce the signal interference of the second reflective layer 30 on the conductive layer 40. In some embodiments, the thickness of the organic film layer ranges from 2 to 1000 angstroms. In one embodiment, the thickness of the inorganic film layer located on the side of the organic film layer away from the substrate ranges from 1000 angstroms to 5000 angstroms, and the total thickness of each inorganic film layer in the encapsulation layer 60 ranges from 0.5 to the total thickness of the organic film layer. In some embodiments, the thickness of the organic film layer may be, for example, 2 μm, 4 μm, 6 μm, 8 μm, 10 μm, etc.; the thickness range of the inorganic film layer located on the side of the organic film layer away from the substrate may be, for example, 1000 angstroms, 2000 angstroms, 3000 angstroms, 4000 angstroms, 5000 angstroms, etc.; the total thickness of each inorganic film layer in the encapsulation layer 60 may be, for example, 0.5 μm, 0.6 μm, 0.7 μm, 0.8 μm, 0.9 μm, 1.0 μm, etc.

[0125] In one embodiment, the reflectivity of the fifth reflective layer 50 is greater than or equal to 85%. In some embodiments, the material of the fifth reflective layer 50 may include a metal, for example, at least one of aluminum, silver, copper, and platinum. Alternatively, the material of the fifth reflective layer 50 may include white ink and / or silicone white glue.

[0126] In one embodiment, as shown in Figures 1A to 5, the boundary of the orthographic projection of the opening 303 of the second reflective layer 32 on the second surface 102 of the substrate 10 is located inside the boundary of the orthographic projection of the corresponding groove 11 on the second surface 102 of the substrate 10; the orthographic projection of the second reflective layer 32 on the second surface 102 of the substrate 10 does not overlap with the orthographic projection of the first protrusion 20 on the second surface 102 of the substrate 10. With this arrangement, part of the light reflected by the fifth reflective layer 50 is incident on the portion of the second reflective layer 32 opposite the groove 11, and ultimately exits from the surface of the substrate 10 away from the second reflective layer 30. This helps improve light efficiency compared to a solution in which the second reflective layer 32 does not include a portion opposite the groove 11. In addition, when forming the groove 11, the second reflective layer 32 can also serve as a mask, which can save cost and time in the process step of forming the groove 11, thereby reducing the preparation cost of the array substrate. Since the orthographic projection of the second reflective layer 32 on the second surface 102 of the substrate 10 does not overlap with the orthographic projection of the first protrusion 20 on the second surface 102 of the substrate 10, the second reflective layer 32 will not hinder the propagation of light emitted by the light-emitting element to the fifth reflective layer 50.

[0127] In one embodiment, as shown in Figures 1A to 4, the second reflective layer 32 includes a first reflective portion 301 and a second reflective portion 302, the orthographic projection of the first reflective portion 301 on the second surface 102 of the substrate 10 does not overlap with the orthographic projection of the groove 11 on the second surface 102 of the substrate 10, the orthographic projection of the second reflective portion 302 on the second surface 102 of the substrate 10 falls within the orthographic projection of the groove 11 on the second surface 102 of the substrate 10, and the second reflective layer 32 of the first reflective portion 301 is continuous with the second reflective layer 32 of the second reflective portion 302.

[0128] In one embodiment, as shown in FIG. 1A to FIG. 4 , the array substrate further includes a first reflective layer 31 located between the substrate 10 and the second reflective layer 32 , and a third reflective layer 33 located on a side of the second reflective layer 32 away from the substrate 10 .

[0129] In one embodiment, the orthographic projection of the first reflective layer 31 on the second surface 102 of the substrate 10 does not overlap with the orthographic projection of the groove 11 on the second surface 102 of the substrate 10; the reflectivity of the first reflective layer 31 is greater than the reflectivity of the second reflective layer 32. Due to the higher reflectivity of the first reflective layer 31, a larger amount of light reflected by the fifth reflective layer 50 is reflected by the first reflective layer 31 after entering the first reflective layer 31, thereby improving the light emission efficiency and reducing light loss.

[0130] In some embodiments, the reflectivity of the first reflective layer 31 is greater than or equal to 85%. For example, the material of the first reflective layer 31 may include a metal, such as at least one of aluminum, silver, copper, and platinum. For example, the material of the first reflective layer 31 may include white ink and / or silicone white glue.

[0131] In one embodiment, the orthographic projection of the second reflective layer 32 on the second surface 102 of the substrate 10 overlaps with the orthographic projection of the groove 11 on the second surface 102 of the substrate 10. This configuration allows the second reflective layer 32 to serve as a mask when forming the groove. In some embodiments, the material of the second reflective layer 32 may include a metal, such as molybdenum. This provides the second reflective layer 32 with good corrosion resistance. During etching of the substrate using an etching solution, the portion of the second reflective layer 32 that extends beyond the first reflective layer 31 is less likely to collapse. Furthermore, the second reflective layer 32 covers the edge of the first reflective layer 31, protecting the first reflective layer 31 during etching of the substrate using the etching solution.

[0132] In one embodiment, the third reflective layer 33 covers the second reflective layer 32, and the material of the third reflective layer 33 is the same as that of the fifth reflective layer 50. The orthographic projection of the third reflective layer 33 on the second surface 102 of the substrate 10 may overlap with the orthographic projection of the second reflective layer 32 on the second surface 102 of the substrate 10. Because the third reflective layer 33 covers the second reflective layer 32, the thickness and strength of the portion of the second reflective layer 30 facing the groove 11 are increased, helping to prevent the portion of the second reflective layer 30 facing the groove 11 from collapsing before the color conversion structure or transparent organic resin is formed within the groove 11. Because the material of the third reflective layer 33 is the same as that of the fifth reflective layer 50, the third reflective layer 33 and the fifth reflective layer 50 can be formed simultaneously, simplifying the manufacturing process.

[0133] In one embodiment, the orthographic projection of the second reflective layer 32 on the second surface 102 of the substrate 10 overlaps with the orthographic projection of the fifth reflective layer 50 on the second surface 102 of the substrate 10. In the embodiments shown in Figures 1A to 4, the edge of the orthographic projection of the second reflective portion 302 on the second surface 102 of the substrate 10 coincides with the outer edge of the orthographic projection of the fifth reflective layer 50 on the second surface 102 of the substrate 10. In this configuration, the fifth reflective layer 50 does not cover the side surfaces of the groove 11, which can reduce the amount of light reflected by the fifth reflective layer 50 that exits through the opening of the groove 11 and increase the amount of light that exits from the second surface 102 of the substrate 10. In other embodiments, the orthographic projection of the second reflective portion 302 on the second surface 102 of the substrate 10 partially overlaps with the orthographic projection of the fifth reflective layer 50 on the second surface 102 of the substrate 10, meaning that the fifth reflective layer 50 covers part of the side surfaces of the groove 11.

[0134] In one embodiment, as shown in Figures 2 and 3 , the surface of the first reflective layer 31 facing the substrate 10 is provided with a plurality of spaced-apart light-uniform structures 311. The light-uniform structures 311 can disperse light incident on the second reflective layer 30, scattering it in various directions. Specifically, light reflected by the fifth reflective layer 50 is dispersed by the light-uniform structures 311 after entering the first reflective layer 31, changing the propagation direction of the light. After being reflected by the first reflective layer 31, the light is emitted through the surface of the substrate away from the first reflective layer 31, thereby improving the brightness uniformity of the light-emitting substrate.

[0135] In one embodiment, the light homogenizing structures 311 are evenly dispersed throughout the surface of the first reflective layer 31 facing the substrate 10, and the distance between the edge of the first reflective layer 31 near the groove 11 and the groove 11 is less than or equal to 5 μm. This configuration prevents a large distance between the edge of the first reflective layer 31 near the groove 11 and the groove 11. As a result, light reflected by the fifth reflective layer, when incident on the area between the edge of the first reflective layer 31 near the groove 11 and the groove 11, does not contact the light homogenizing structures, resulting in insufficient scattering of this portion of light.

[0136] In one embodiment, as shown in Figures 2 and 6, the light homogenizing structure 311 includes a plurality of recessed structures 312 arranged in an array. The array substrate further includes a plurality of support portions 13 located between the first reflective layer 31 and the substrate 10. The plurality of support portions 13 are arranged in an array. The first reflective layer 31 is in direct contact with the support portions 13. The provision of the support portions 13 facilitates the formation of the recessed structures 312.

[0137] In one embodiment, the material of the support portion 13 can be a transparent resin material. The maximum dimension of the support portion 13 in a cross section parallel to the surface of the substrate 10 ranges from 5 μm to 50 μm. This configuration can provide a better light uniformity effect for the formed light uniforming structure 311, and the support portion 13 is easy to manufacture. In some embodiments, the maximum dimension of the support portion 13 in a cross section parallel to the surface of the substrate 10 ranges from 5 μm, 15 μm, 25 μm, 35 μm, 45 μm, 50 μm, etc.

[0138] In one embodiment, as shown in FIG. 2 and FIG. 6 , the recessed structure 312 is formed on the surface of the first reflective layer 31 facing the substrate 10 , and recessed structures are also formed in the regions of the second reflective layer 32 and the third reflective layer 33 opposite to the recessed structure 312 .

[0139] In one embodiment, the support portion 13 may be roughly in the shape of at least one of a cone, a pyramid, and a spherical segment. "Roughly in the shape of a cone and a pyramid" means that the support portion 13 is generally in the shape of a cone and a pyramid, but is not limited to a standard cone and pyramid. That is, the "cone and pyramid" here include not only basic cone and pyramid shapes, but also shapes similar to cones and pyramids. For example, the top angles of cones and pyramids are curved surfaces. "Roughly in the shape of a spherical segment" means that the support portion 13 is generally in the shape of a spherical segment, but is not limited to a standard spherical segment. That is, the "spherical segment" here includes not only basic spherical segment shapes, but also shapes similar to spherical segments. For example, the upper half of the spherical segment is a standard spherical segment, and the lower half is a cylinder.

[0140] In one embodiment, when the first reflective layer 31 is located between the encapsulation layer 60 and the substrate 10, the support portion 13 is located on the side of the first reflective layer 31 facing the substrate 10. The support portion 13 may be in direct contact with the substrate 10. Alternatively, the first reflective layer 31 is located on the side of the encapsulation layer 60 away from the substrate 10, and the support portion 13 is located between the encapsulation layer 60 and the first reflective layer 31.

[0141] In one embodiment, as shown in Figures 3 and 7, the light homogenization structure 311 includes a plurality of protrusions 313 arranged in an array and facing the substrate 10. The surface of the substrate 10 facing the conductive layer 40 is provided with a plurality of recesses 12 arranged in an array, and the protrusions 313 are located within the recesses 12. The protrusions 313 and the recesses 12 may correspond one to one, with each protrusion 313 located within a corresponding recess 12. Providing the recesses 12 on the surface of the substrate 10 facilitates the formation of the protrusions 313.

[0142] In one embodiment, as shown in FIG3 and FIG7 , the protruding structure 313 is formed on the side of the first reflective layer 31 facing the substrate 10 , and protruding structures are also formed in the areas of the second reflective layer 32 and the third reflective layer 33 opposite to the protruding structure 313 .

[0143] In one embodiment, the protrusion structure may be substantially in the shape of at least one of a cone, a pyramid, and a spherical segment.

[0144] In one embodiment, as shown in FIG35 , the light homogenizing structure 311 includes a plurality of protruding structures 314 arranged in an array and facing the substrate 10. A microstructure layer 42 is disposed between the first surface 101 of the substrate 10 and the first reflective layer 31. The surface of the microstructure layer 42 facing the first reflective layer 31 is provided with a plurality of recessed portions 14 arranged in an array, and the protruding structures 314 are located within the recessed portions 14. The protruding structures 314 may correspond one-to-one with the recessed portions 14, with each protruding structure 314 being located within a corresponding recessed portion 14. The material of the microstructure layer 42 may be a material that is different from the material of the substrate used to form the recessed portions 14, such as a transparent resin material. Forming the recessed portions 14 in the microstructure layer is simpler than forming the recessed portions 12 on the substrate 10. The arrangement of the microstructure layer 42 further facilitates the formation of the protruding structures 314.

[0145] In one embodiment, as shown in FIG4 , the array substrate further includes a transparent organic layer 80 positioned within the groove 11. The orthographic projection of the second reflective layer 32 on the second surface 102 of the substrate 10 overlaps with the orthographic projection of the groove 11 on the second surface 102 of the substrate 10, and the orthographic projection of the transparent organic layer 80 on the second surface 102 of the substrate 10 covers the overlapping region. With this configuration, the transparent organic layer 80 supports the second reflective portion 302 of the second reflective layer 32. Furthermore, forming the transparent organic layer 80 before forming the fifth reflective layer 50 prevents the fifth reflective layer 50 from extending to the sides of the groove 11, thereby reducing the amount of light reflected by the fifth reflective layer 50 that exits through the opening of the groove 11 and increasing the amount of light that exits from the second surface 102 of the substrate 10.

[0146] In one embodiment, as shown in FIG4 , the orthographic projection of the transparent organic layer 80 on the second surface 102 of the substrate 10 coincides with the overlapping region. Thus, the transparent organic layer 80 provides better support for the second reflective portion 302. The transmittance of the transparent organic layer can be greater than or equal to 95%, and the refractive index of the transparent organic layer can be less than that of the substrate 10.

[0147] In one embodiment, as shown in FIG. 4 or FIG. 34 , the color conversion structure 70 is located between the transparent organic layer 80 and the fifth reflective layer 50 .

[0148] In one embodiment, as shown in FIG34 , the orthographic projection of the transparent organic layer 80 on the second surface 102 of the substrate 10 is larger than the overlapping region. The color conversion structure 70 covers the portion of the fifth reflective layer 50 located on the first protrusion 20, and the color conversion structure 70 conforms to the shape of the portion of the fifth reflective layer 50 located on the first protrusion 20. As shown in FIG34 , the color conversion structure 70 has a certain thickness but does not completely fill the portion of the groove 11 exposed by the opening. This arrangement can save color conversion material.

[0149] In the embodiments shown in Figures 1A to 3, the boundary of the orthographic projection of the color conversion structure 70 on the second surface 102 of the substrate 10 exceeds the boundary of the orthographic projection of the fifth reflective layer 50 on the second surface 102 of the substrate 10. That is, the color conversion structure 70 is arranged in an area not blocked by the fifth reflective layer 50. In this case, the light generated by the color conversion structure 70 will directly emit from the substrate through the area not blocked by the fifth reflective layer 50, forming a bright ring, resulting in poor brightness uniformity of the light-emitting substrate.

[0150] In the embodiments shown in Figures 4 and 34 , the orthographic projection of the color conversion structure 70 on the second surface 102 of the substrate 10 lies within the orthographic projection of the fifth reflective layer 50 on the second surface 102 of the substrate 10. Light generated by the color conversion structure 70 is reflected by the fifth reflective layer. The reflected light then enters the second reflective layer and is reflected again. A portion of the light emitted by the second reflective layer is emitted directly through the surface of the substrate facing away from the second reflective layer, while another portion, after multiple reflections within the substrate, is emitted through the surface of the substrate facing away from the second reflective layer. This improves the uniformity of the emitted light. This arrangement eliminates the need for a uniform light-diffusing film layer or reduces the number of uniform light-diffusing layers on the array substrate, thereby reducing the thickness of the array substrate. Using this configuration, the brightness uniformity of the light-emitting substrate exceeded 80% in simulations and actual product testing.

[0151] In other embodiments, when the light emitted by the light-emitting element is white light, the color conversion structure 70 is not required to be filled in the groove 11. In this case, the groove 11 may be filled with a transparent organic material 80, as shown in FIG35 . The surface of the transparent organic material facing away from the second surface of the substrate may be flush with the first surface of the substrate, or the surface of the transparent organic material facing away from the second surface of the substrate may be flush with the surface of the second reflective portion of the second reflective layer facing away from the substrate. The transparent organic material may be, for example, a transparent organic resin. The transmittance of the transparent organic resin may be greater than or equal to 95%, and the refractive index of the transparent organic resin may be less than the refractive index of the substrate 10.

[0152] In one embodiment, as shown in Figure 2, the width of the second reflecting portion 302 is a first dimension d1; the longitudinal cross-section of the groove 11 is an arc, and the length of the radius of the circle in which the longitudinal cross-section of the groove 11 lies is a second dimension d2; the first dimension d1 is equal to the second dimension d2, and is equal to the depth h of the groove 11.

[0153] Furthermore, as shown in FIG2 , the longitudinal section of the first protrusion 20 is an arc, and the length of the radius of the circle where the longitudinal section of the first protrusion 20 lies is a third dimension d3 , and the third dimension d3 is equal to the depth h of the groove 11 .

[0154] Researchers in this disclosure discovered that at the location shown in area A in Figures 1A and 35, due to the poor side morphology of the first reflective layer 31 after etching and the significant step difference between the second reflective layer 32 and the first reflective layer 31, the portion of the second reflective layer 32 located in area A is prone to cracking. During the process of etching the grooves on the substrate, due to the cracks in the second reflective layer, the etching solution will seep into the bottom of the second reflective layer, resulting in large-scale peeling of the second reflective layer. Figure 36A shows a photograph of a large-scale peeling of the film layer of a light-emitting substrate including the above-mentioned array substrate. The transparent area in the figure is the area where the glass of the second reflective layer has fallen off. In some embodiments, the material of the first reflective layer can be silver (Ag) and the material of the second reflective layer can be molybdenum (Mo). Figure 36B shows a scanning electron microscope image of area A in Figure 35. It can be seen that because the Ag film layer of the first reflective layer has poor side morphology after etching and the Mo film layer of the second reflective layer is columnar crystals, cracks appear in the Mo film layer of the second reflective layer where the Mo film layer of the second reflective layer crosses the boundary of the Ag film layer of the first reflective layer, as indicated by area A in Figure 36B.

[0155] Researchers in this disclosure also discovered that at the location indicated by region B in FIG35 , the second reflective layer 32 is susceptible to collapse during the etching process to form the groove 11. During the groove etching process, the second reflective layer acts as a mask. Due to the isotropy principle of wet etching, when etching the substrate (e.g., glass), the length of the second reflective portion 302 of the second reflective layer 32 is consistent with the depth of the groove. When the length of the second reflective portion exceeds a certain limit, the second reflective layer at the location indicated by region B collapses, as indicated by region B in FIG36C .

[0156] The researchers of this disclosure also found that after the transparent organic material 80 was filled in the groove 11, cracks were easily formed at the junction of the first reflective part 301 and the second reflective part 302 of the second reflective layer 32 at the position shown in area B in FIG35. FIG36D shows a scanning electron microscope image of the position in area B in FIG35. After analysis, the reasons for the cracks are as follows: (1) The expansion coefficients of the metal of the second reflective layer and the transparent organic material are inconsistent. The transparent organic material expands more than the metal material of the second reflective layer when heated, resulting in cracks in the metal film layer of the second reflective layer at the junction of the first reflective part and the second reflective part; (2) The expansion space of the transparent organic material is limited. After heating, the expansion direction of the transparent organic material is only from the second surface of the substrate to the first surface in the groove. The other directions are restricted by the substrate, resulting in excessive expansion in the direction from the second surface to the first surface in the groove. The cracks at the junction of the first reflective part and the second reflective part will cause light leakage, thereby resulting in poor light uniformity of the light-emitting substrate. FIG36E shows an optical test image of the bright ring caused by the cracks.

[0157] In view of the above problems, the present disclosure proposes the following embodiments to reinforce the second reflective layer from different aspects to prevent the second reflective layer from cracking or collapsing.

[0158] As shown in Figure 5, the array substrate includes a plurality of light homogenizing units 100 arranged in an array. Figures 35, 37, 39 to 42 show cross-sectional views of a light homogenizing unit of the array substrate according to an embodiment of the present disclosure. Each light homogenizing unit includes: a substrate 10, including a first surface 101 and a second surface 102 opposite to each other, the first surface 101 being provided with a groove 11; a first reflective layer 31, located on a side of the first surface 101 away from the second surface 102, the orthographic projection of the first reflective layer 31 on the second surface 102 of the substrate 10 not overlapping with the orthographic projection of the groove 11 on the second surface 102 of the substrate 10; a second reflective layer 32, located on a side of the first reflective layer 31 away from the second surface 102 of the substrate 10, the orthographic projection of the second reflective layer 32 on the second surface 102 of the substrate 10 partially overlapping with the orthographic projection of the first reflective layer 31 on the second surface 102 of the substrate 10, and the second reflective layer 32 being provided with an opening 303, the orthographic projection of the opening 303 on the second surface 102 of the substrate 10 being located within the orthographic projection of the groove 11 on the second surface 102 of the substrate 10.

[0159] In some embodiments, each light homogenization unit further includes a first structure, the first structure being located on a side of the first reflective layer away from the substrate and in contact with the second reflective layer. The first structure can reinforce the second reflective layer to prevent cracks or collapse.

[0160] In some embodiments, as shown in FIG1A-4 , the first structure may include a third reflective layer 33 located on a side of the second reflective layer 32 away from the second surface of the substrate. The orthographic projection of the third reflective layer 33 on the second surface 102 of the substrate 10 overlaps the boundary of the orthographic projection of the groove 11 on the second surface 102 of the substrate 10. Specifically, the orthographic projection of the third reflective layer 33 on the second surface 102 of the substrate 10 may overlap the orthographic projection of the second reflective layer 32 on the second surface 102 of the substrate 10. Because the third reflective layer 33 overlaps the second reflective layer 32, the thickness and strength of the portion of the second reflective layer 30 facing the groove 11 are increased, thereby helping to prevent the portion of the second reflective layer 30 facing the groove 11 from collapsing before a color conversion structure or transparent organic resin is formed within the groove 11.

[0161] In some embodiments of the present disclosure, as shown in Figures 39-41, the third reflective layer can be a reflective adhesive layer 304. The reflective adhesive layer 304 is located on a side of the second reflective layer 32 away from the second surface 102 of the substrate 10. The orthographic projection of the reflective adhesive layer 304 on the second surface 102 of the substrate 10 covers the boundary of the orthographic projection of the groove 11 on the second surface 102 of the substrate 10. In the present disclosure, the reflectivity of the reflective adhesive layer can match the reflectivity of metal, for example, a reflectivity of approximately 40%. The arrangement of the reflective adhesive layer on the second reflective layer not only serves as a reflector, but also serves to bond and protect the metal film layer of the second reflective layer, preventing damage to the second reflective layer caused by thermal expansion of the transparent organic layer. The material of the reflective adhesive layer can include silicone white glue.

[0162] In one embodiment of the present disclosure, as shown in FIG39 , the orthographic projection of the reflective adhesive layer 304 on the second surface 102 of the substrate 10 can overlap with the orthographic projection of the second reflective layer 32 on the second surface 302 of the substrate 10. Covering the second reflective layer 32 with a full layer of reflective adhesive effectively protects the metal film layer of the second reflective layer 32, preventing the second reflective layer 32 from warping due to cracks. If the second reflective layer 32 develops minor cracks, the overlying reflective adhesive layer can serve as a reflective layer, compensating for the damage caused by the second reflective layer cracking.

[0163] In one embodiment of the present disclosure, as shown in FIG40 , the second reflective layer 32 includes a first reflective portion 301 and a second reflective portion 302. The orthographic projection of the first reflective portion 301 on the second surface 102 of the substrate 10 does not overlap with the orthographic projection of the groove 11 on the second surface 102 of the substrate 10. The orthographic projection of the second reflective portion 302 on the second surface 102 of the substrate 10 is located within the orthographic projection of the groove 11 on the second surface 102 of the substrate 10. The orthographic projection of the reflective adhesive layer 304 on the second surface 102 of the substrate 10 only covers the orthographic projections of the first reflective portion 301 and the second reflective portion 301 near the edge of the groove 11 on the second surface 102 of the substrate 10. In this embodiment, the reflective adhesive layer is disposed only in areas prone to cracking, namely, an annular reflective adhesive layer is disposed near the edge of the groove. This configuration reduces the amount of reflective adhesive material used, thereby lowering costs. Specifically, the shape of the reflective adhesive layer can be a circular ring concentric with the groove, the width of the circular ring is ≥5um, for example, 6um, 7um, 8um, 9um, 10um, etc., the groove radius minus the inner radius of the circular ring is ≥2.5um, for example, 3um, 3.5um, 4um, 4.5um, 5um, etc., and the outer diameter of the circular ring minus the groove radius is ≥2.5um, for example, 3um, 3.5um, 4um, 4.5um, 5um, etc.

[0164] In one embodiment of the present disclosure, as shown in FIG41 , the orthographic projection of the second reflective layer 32 on the second surface 102 of the substrate 10 does not overlap with the orthographic projection of the groove 11 on the second surface 102 of the substrate 10. The orthographic projection of the second reflective layer 32 on the second surface 102 of the substrate 10 is within the orthographic projection of the reflective adhesive layer 304 on the second surface 102 of the substrate 10, and the orthographic projection of the reflective adhesive layer 304 on the second surface 102 of the substrate 10 overlaps with the orthographic projection of the groove 11 on the second surface 102 of the substrate 10. In this embodiment, a portion of the second reflective layer is replaced by a reflective adhesive layer. Specifically, the second reflective layer is arranged outside the groove and can be at least 0.6 μm away from the edge of the groove. For example, the second reflective portion 302 in FIG40 is replaced by a reflective adhesive layer. A light entrance opening can be provided in the center of the reflective adhesive layer, and the size of the opening can be flexibly set according to design requirements.

[0165] In one embodiment of the present disclosure, as shown in FIG42 , the first structure may include a third reflective layer 33 located on a side of the second reflective layer 32 away from the second surface 102 of the substrate 10, and a fourth reflective layer 34 located on a side of the third reflective layer 33 away from the second surface 102 of the substrate 10. The ductility of the material of the third reflective layer 33 is greater than the ductility of the material of the second reflective layer 32, and the material of the fourth reflective layer 34 may be the same as the material of the second reflective layer 32. The orthographic projections of the second reflective layer 32, the third reflective layer 33, and the fourth reflective layer 34 on the second surface 102 of the substrate 10 at least partially overlap. For example, as shown in FIG42 , the orthographic projections of the second reflective layer 32, the third reflective layer 33, and the fourth reflective layer 34 on the second surface 102 of the substrate 10 may coincide. Exemplarily, the material of the second reflective layer 32 may be Mo, the material of the third reflective layer may be Ag or Al with good ductility, and the material of the fourth reflective layer 34 may be Mo, that is, the structure of the second reflective layer 32, the third reflective layer 33 and the fourth reflective layer 34 is a Mo / Al / Mo stack or a Mo / Ag / Mo stack. This structure does not require changing the mask design. By sandwiching an Ag or Al film layer with good ductility and high toughness between the two Mo film layers, it can be ensured that the second reflective layer is free of cracks.

[0166] In one embodiment of the present disclosure, as shown in FIG37 , the first structure may include a first organic layer 315 positioned between the first reflective layer 31 and the second reflective layer 32. The orthographic projection of the first organic layer 315 on the second surface 102 of the substrate 10 overlaps the orthographic projection of the first reflective layer 31 on the second surface 102 of the substrate 10. By coating the boundary of the first reflective layer with an organic material having leveling properties, such as resin, the angle of the second reflective layer across the step difference can be optimized, ensuring that the second reflective layer is free of cracks and effectively improving the peeling and shedding phenomenon of the second reflective layer. As shown in FIG38 , the resin material covers the boundary of the first reflective layer, and the second reflective layer (Mo) is free of cracks at the boundary across the first reflective layer (Ag).

[0167] For a structure similar to an eave where the membrane material is suspended above the groove, the material deformation follows the following formula: Deflection (material deformation degree) = m*x 2 / 2EI, where m is the mass of the protruding part, x is the protruding length, and EI is the stiffness of the material itself. The second reflective portion of the second reflective layer in the present disclosure belongs to such an eaves structure.

[0168] In one embodiment of the present disclosure, before etching the substrate, the second reflective layer, as a mask, may have the structure shown in FIG43A . A plurality of second through holes 305 are arranged on the second reflective layer 32. After etching the substrate, a partial top view of the array substrate is shown in FIG43B . The first structure may include a plurality of second through holes 305 evenly arranged around the opening 303 on the second reflective layer 32, with the orthographic projections of the plurality of second through holes 305 on the second surface of the substrate located within the orthographic projections of the groove 11 on the second surface of the substrate, i.e., the plurality of second through holes are arranged on the second reflective portion of the second reflective layer. FIG43C shows a partial SEM image of the array substrate after substrate etching. In one embodiment, as shown in FIG43B , the opening 303 can be circular, and multiple second through-holes 305 are radially distributed about the center of the opening. Each of the multiple second through-holes 305 has a circular cross-section parallel to the second surface. The diameter of each second through-hole is ≥5 μm, such as 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, etc., and the spacing between two adjacent second through-holes is ≥5 μm, such as 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, etc. By adding multiple second through-holes to the second reflective portion of the second reflective layer, the mass (m) of the second reflective portion is reduced, and the length of the second reflective portion can be increased from the original 60 μm to 80 μm. Furthermore, due to the presence of the second through-holes, after etching the substrate, uniform stripes are left on the sidewalls of the groove, as shown in the electron micrograph of the groove cross-section on the right side of FIG43C .

[0169] In one embodiment of the present disclosure, as shown in Figures 44A-44C, the first structure may include multiple strips 306 arranged on the side of the second reflective layer 32 facing the substrate and / or on the side of the second reflective layer 32 facing away from the substrate. The orthographic projections of the multiple strips 306 on the second surface of the substrate are located within the orthographic projections of the grooves 11 on the second surface of the substrate. Figure 44A is a schematic diagram of the structure of the second reflective layer and strips, which serve as a mask before etching the substrate. Figure 44B is a schematic diagram of the structure of the second reflective layer and strips, which serve as a mask after etching the substrate. Figure 44C is a scanning electron microscope image of the structure of the second reflective layer and strips, which serve as a mask. If the multiple strips are arranged on the side of the second reflective layer facing the substrate, the multiple strips are prepared before forming the second reflective layer, which serves as a mask. If the multiple strips are arranged on the side of the second reflective layer facing the substrate, the multiple strips can be formed before or after etching the substrate. In one embodiment, as shown in FIG44B , the opening 303 may be circular, and the plurality of strips 306 are evenly distributed radially about the center of the opening 303. Each of the strips 306 projects a rectangular shape onto the second surface of the substrate. The width of each strip is ≥5 μm, for example, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, etc., and the spacing between two adjacent strips closest to the opening is ≥5 μm, for example, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, etc. The material of the plurality of strips can be the same as that of the second reflective layer, for example, both the plurality of strips and the second reflective layer can be Mo. Arranging the strips above or below the second reflective portion of the second reflective layer increases the stiffness EI of the second reflective portion (i.e., the eaves). With this arrangement, after the substrate groove is etched, the maximum length of the second reflective portion can be increased from 60 μm to 100 μm.

[0170] In one embodiment of the present disclosure, as shown in FIG45 , each light homogenizing unit of the array substrate includes a first protrusion 20. The first protrusion 20 is located within the groove 11. In the direction from the first surface 10 of the substrate 10 toward the second surface 102 of the substrate 10, the cross-sectional area of ​​the first protrusion 20 parallel to the second surface 102 of the substrate 10 gradually increases. The distance from the surface of the first protrusion 20 away from the second surface 102 of the substrate 10 to the second surface 102 of the substrate 10 is less than or equal to the distance between the first surface 101 of the substrate 10 and the second surface 102 of the substrate 10. The orthographic projection of the geometric center of the first protrusion 20 on the second surface 102 of the substrate 10 coincides with the orthographic projection of the geometric center of the groove 11 on the second surface 102 of the substrate 10. The orthographic projection of the first protrusion 20 on the second surface 102 of the substrate 10 can be circular, and the orthographic projection of the groove 11 on the second surface 102 of the substrate 10 can also be circular. The array substrate may further include: a second protrusion 21, one second protrusion 21 being located in a corresponding groove 11, the outer contour of the orthographic projection of the second protrusion 21 on the second surface 102 of the substrate 10 may be annular, the orthographic projection of the second protrusion 21 on the second surface 102 of the substrate 10 surrounds the orthographic projection of the first protrusion 20 on the second surface 102 of the substrate 10, and the distance from the surface of the second protrusion 21 away from the second surface 102 of the substrate 10 to the second surface 102 of the substrate 10 is less than the distance from the surface of the first protrusion 20 away from the second surface 102 of the substrate 10 to the second surface 102 of the substrate 10. The second reflective layer 32 includes a second reflective portion 302, the orthographic projection of which on the second surface 102 of the substrate 10 falls within the orthographic projection of the groove 11 on the second surface 102 of the substrate 10. The width of the second reflective portion 302 is a first dimension d1. The longitudinal cross-section of the portion of the groove 11 located on the side of the second protrusion 21 away from the first protrusion 20 is an arc, and the radius of the circle within which the longitudinal cross-section of the portion of the groove 11 lies is a second dimension d2. The first dimension d1 is equal to the second dimension d1 and is greater than the depth h of the groove 11. The first protrusion 20 and the second protrusion 21 may be integrally formed with the substrate 10.

[0171] By reducing the depth of the groove below the second reflective portion of the second reflective layer, the amount of transparent organic material filling near the groove edge can be effectively reduced, thereby reducing the possibility of cracks in the second reflective layer around the groove. Specifically, the depth of the groove below the second reflective portion, i.e., d2 in FIG. 45 , is ≤ 10 μm. For example, d2 can be 9 μm, 8 μm, 7 μm, 6 μm, 5 μm, etc.

[0172] To create the structure of groove 11 shown in Figure 45 , the second reflective layer, serving as the mask, can be designed as shown in Figure 46A . The first protrusion forms at the substrate location corresponding to the central circular portion 3201, while the second protrusion forms at the substrate location corresponding to the surrounding annular portion 3202. After substrate etching is complete, the circular portion 3201 and the annular portion 3202 of the second reflective layer will fall off. To facilitate the removal of the annular portion into the etching solution, the annular portion can be cut into several sections, for example, four sections, as shown in Figure 46B .

[0173] The present embodiment further provides a method for preparing an array substrate. As shown in FIG8 , the method includes the following steps 110 and 120 .

[0174] In step 110, a groove is formed on the surface of the substrate, a first protrusion is formed in the groove, and a fifth reflective layer and a second reflective layer are formed. The fifth reflective layer at least covers the side surface of the first protrusion, and the second reflective layer covers the area of ​​the substrate surrounding the groove.

[0175] In one embodiment, step 110 includes the following process:

[0176] First, a mask is placed on a base substrate.

[0177] This step yields the first intermediate structure shown in Figures 9A and 9B . As shown in Figures 9A and 9B , a mask plate 81 is disposed on the first surface of a base substrate 82 . The mask plate 81 includes a first mask portion 811 and a second mask portion 812 . The first mask portion 811 is provided with a first through-hole. The second mask portion 812 is located within the first through-hole of the first mask portion 811, with a gap between the second mask portion 812 and the first mask portion 811. The surface of the second mask portion 812 can be circular, and the first through-hole of the first mask portion 811 can be circular. The center of the surface of the second mask portion 812 can coincide with the center of the first through-hole of the first mask portion 811. The diameter of the surface of the second mask portion 812 is D1, and the diameter of the first through-hole of the first mask portion 811 can be D2. The distance between the edge of the first through-hole of the first mask portion 811 and the edge of the second mask portion 812 is a, where D2 = D1 + 2a.

[0178] In some embodiments, D1 is ≥ 5 μm. The value of D1 is related to the height of the subsequently formed first protrusion; the larger D1 is, the taller the first protrusion will be. Setting D1 ≥ 5 μm prevents the first protrusion from being too small, which in turn prevents the fifth reflective layer covering the side surfaces of the first protrusion from being too small. This would result in a smaller amount of light reflected by the fifth reflective layer from the light-emitting element, and would fail to effectively improve light uniformity.

[0179] In one embodiment, a≥2 μm. This configuration can prevent the distance between the edge of the first through hole of the first mask portion 811 and the edge of the second mask portion 812 from being too small, thereby affecting the contact between the etching solution and the substrate.

[0180] In one embodiment, as shown in Figure 9, the first mask portion 811 includes a first reflective layer 31 and a second reflective layer 32 located on the side of the first reflective layer 31 away from the base substrate 82. The distance between the inner edge of the second reflective layer 32 and the second mask portion 812 is smaller than the distance between the inner edge of the first reflective layer 31 and the second mask portion 812. The second reflective layer 32 covers the edge of the first reflective layer toward the second mask portion 812.

[0181] Subsequently, the substrate is etched using a wet etching process to form a groove, thereby obtaining a substrate including the groove and a first protrusion located in the groove.

[0182] In this step, the etching solution contacts the substrate 82 through the gap between the first mask portion 811 and the second mask portion 812, and etches the substrate 82. Due to the presence of the second mask portion 812, the area of ​​the substrate 82 covered by it is not completely etched away, and the remaining area is the first protrusion. This step results in the second intermediate structure shown in Figure 10. As shown in Figure 10, the substrate 10 and the first protrusion 20 are both part of the substrate 82, that is, the substrate 10 and the first protrusion 20 are integrally formed. A gap exists between the first protrusion 20 and the side of the groove 11. The orthographic projection of the second reflective layer 32 of the first mask portion 811 on the surface of the substrate 10 away from the second reflective layer 32 overlaps with the orthographic projection of the groove 11 on the surface of the substrate 10 away from the second reflective layer 32, that is, a portion of the second reflective layer 32 faces the groove 11.

[0183] In this step, the etching solution etches the second mask portion 812 while etching the base substrate 82 . After the etching of the base substrate 82 is completed, the second mask portion 812 can be removed.

[0184] Due to the isotropic nature of the wet etching process, the area on the bottom surface of the groove 11 corresponding to the gap between the first mask portion 811 and the second mask portion 812 is roughly planar, that is, the area on the bottom surface of the groove 11 surrounding the first protrusion 20 is roughly planar, and the width of the planar area on the bottom surface of the groove 11 is roughly equal to a; the longitudinal cross-section of the groove 11 is roughly an arc, and the radius of the circle on which the arc lies is roughly equal to the maximum depth of the groove 11; the longitudinal cross-section of the first protrusion 20 is roughly an arc, and the radius of the circle on which the arc lies is roughly equal to the maximum depth of the groove 11; the radius of the circle on which the longitudinal cross-section of the groove 11 lies is roughly the same as the width of the portion of the second reflective layer 32 opposite the groove 11.

[0185] In one embodiment, the depth of the groove 11 is greater than or equal to D1 / 2. When the depth of the groove 11 is equal to D1 / 2, the top surface of the first protrusion 20 is substantially flush with the surface of the substrate 10 facing the first reflective layer 31.

[0186] Subsequently, the fifth reflective layer is formed.

[0187] This step can produce the third intermediate structure shown in Figure 11. As shown in Figure 11, the third reflective layer 33 covering the second reflective layer 32 is formed simultaneously with the formation of the fifth reflective layer 50, resulting in the second reflective layer 30 including the first reflective layer 31, the second reflective layer 32, and the third reflective layer 33.

[0188] In one embodiment, after step 110 , the method for preparing the array substrate further includes the following step: forming a color conversion structure in the groove.

[0189] This step can produce a fourth intermediate structure as shown in Figure 12 . As shown in Figure 12 , the surface of the color conversion structure 70 facing the second reflective layer 32 can be flush with the surface of the substrate 10 facing the second reflective layer 32. In other embodiments, the surface of the color conversion structure 70 facing the second reflective layer 32 can be lower than the surface of the substrate 10 facing the second reflective layer 32.

[0190] In another embodiment, if the light emitted by the light emitting element is white, after step 110 , the method for preparing the array substrate further includes the following process: forming a transparent organic layer in the groove.

[0191] In one embodiment, after the step of forming the color conversion structure in the groove, the method for preparing the array substrate further comprises the following step: forming an encapsulation layer covering the color conversion structure.

[0192] Through this step, a fifth intermediate structure as shown in FIG13 can be obtained. As shown in FIG13 , the encapsulation layer 60 covers the color conversion structure 70 and the second reflective layer 30 .

[0193] In step 120 , a conductive layer is formed on a side of the second reflective layer away from the substrate, wherein the conductive layer includes a conductive pad.

[0194] Through this step, the array substrate shown in FIG. 1A can be obtained.

[0195] In one embodiment, before step 110 , the method for preparing the array substrate further includes the following step: forming a plurality of supporting portions on the surface of the base substrate.

[0196] This step results in a sixth intermediate structure as shown in Figure 14 . As shown in Figure 14 , multiple support portions 13 are formed on the surface of the base substrate 82. The continuous area on the surface of the base substrate 82 without support portions 13 can be substantially circular. In some embodiments, a resin material can be first coated on the surface of the base substrate 82, and then the resin material can be patterned to form the multiple support portions 13.

[0197] In this embodiment, after forming the mask on the substrate, a first intermediate structure can be obtained as shown in Figures 15 and 16. As shown in Figures 15 and 16, the first reflective layer 31 has a light homogenizing structure 311 formed in the area of ​​the surface facing the substrate 10 that contacts the support portion 13. The light homogenizing structure 311 is a recessed structure 312. The second reflective layer also has a recessed structure in the area corresponding to the recessed structure 312.

[0198] In this embodiment, after the step of etching the substrate using a wet etching process to form grooves, a second intermediate structure as shown in FIG17 is obtained.

[0199] In this embodiment, after the step of forming the fifth reflective layer, a third intermediate structure as shown in FIG18 can be obtained. As shown in FIG18 , a third reflective layer 33 covering the second reflective layer 32 is formed simultaneously with the formation of the fifth reflective layer 50. A recessed structure is formed in the area of ​​the third reflective layer 33 corresponding to the recessed structure 312 of the first reflective layer 31.

[0200] In this embodiment, the array substrate finally obtained is shown in FIG2 .

[0201] In one embodiment, before step 110 , the method for preparing the array substrate further includes the following step: forming a plurality of recessed portions on the surface of the base substrate.

[0202] This step produces the seventh intermediate structure shown in Figure 19 . As shown in Figure 19 , the surface of the base substrate 82 is formed with a plurality of spaced-apart recesses 12. The continuous areas of the base substrate 82 that are not provided with recesses 12 can be roughly circular. In this step, a mask can be first formed on the surface of the base substrate 82, and then the base substrate can be etched with an etchant to form the recesses. If the base substrate is made of glass, the etchant can include hydrofluoric acid, and the mask can be made of molybdenum. After the recesses are formed, the mask is removed.

[0203] In this embodiment, after forming the mask on the substrate, a first intermediate structure can be obtained as shown in Figures 20 and 21. As shown in Figures 20 and 21, a plurality of light-homogenizing structures 311 are formed on the surface of the first reflective layer 31 facing the substrate 10. The light-homogenizing structures 311 are protruding structures 313 located within the recessed portion 12. The second reflective layer 32 also forms protruding structures in the areas corresponding to the protruding structures 313.

[0204] In this embodiment, after the step of etching the substrate using a wet etching process to form grooves, a second intermediate structure as shown in FIG. 22 is obtained.

[0205] In this embodiment, after the step of forming the fifth reflective layer, a third intermediate structure as shown in FIG23 can be obtained. As shown in FIG23 , a third reflective layer 33 covering the second reflective layer 32 is formed simultaneously with the formation of the fifth reflective layer 50. A protrusion structure is formed in the area of ​​the third reflective layer 33 corresponding to the protrusion structure 313 of the first reflective layer 31.

[0206] In this embodiment, the array substrate finally obtained is shown in FIG3 .

[0207] In one embodiment, step 110 of forming a groove on the surface of the substrate, forming a first protrusion in the groove, and forming a fifth reflective layer and a second reflective layer, wherein the fifth reflective layer at least covers the side surfaces of the first protrusion, and the second reflective layer covers the area of ​​the substrate surrounding the groove, includes the following process:

[0208] First, a mask is formed on the array substrate.

[0209] This step can produce the first intermediate structure shown in FIG24 . The difference between the first intermediate structure shown in FIG24 and the first intermediate structure shown in FIG9 is that the first mask portion 811 and the second mask portion 812 each include only one film layer, and the material of the first mask portion 811 and the second mask portion 812 can be molybdenum.

[0210] Subsequently, the substrate is etched using a wet etching process to form a groove, thereby obtaining a substrate including the groove and a first protrusion located in the groove.

[0211] This step can yield the second intermediate structure shown in Figure 25. The difference between the second intermediate structure shown in Figure 25 and the second intermediate structure shown in Figure 10 is that the first mask portion 811 includes only one film layer.

[0212] Subsequently, the first mask portion 811 is removed.

[0213] Through this step, an eighth intermediate structure as shown in Figure 26 can be obtained. In this step, the first mask portion 811 can be removed by using a wet etching process.

[0214] Subsequently, a transparent organic layer is filled in the groove.

[0215] This step can produce the ninth intermediate structure shown in Figure 27. As shown in Figure 27, the transparent organic layer 80 completely fills the groove 11, and the surface of the transparent organic layer 80 is flush with the surface of the substrate 10 on the same side. The material of the transparent organic layer 80 can be an organic resin.

[0216] Subsequently, a mask layer is formed on a surface of the substrate on the same side as the opening of the groove.

[0217] This step yields the tenth intermediate structure shown in Figure 28 . As shown in Figure 28 , the mask layer 83 is provided with a first through hole. The first through hole can be circular, with the center of the circle containing the opening of the groove 11 coinciding with the center of the first through hole. The diameter of the first through hole in the mask layer 83 is D3, which can be approximately equal to D2.

[0218] In one embodiment, as shown in FIG28 , the mask layer 83 includes a first reflective layer 31 and a second reflective layer 32 located on a side of the first reflective layer 31 away from the substrate 10. The distance between the edge of the second reflective layer 32 and the groove 11 is smaller than the distance between the inner edge of the first reflective layer 31 and the groove 11. The second reflective layer 32 covers a portion of the transparent organic layer 80, and a gap exists between the first reflective layer 31 and the outer edge of the transparent organic layer 80.

[0219] Subsequently, the transparent organic layer is etched using a wet etching process to remove the area of ​​the transparent organic layer not covered by the mask layer.

[0220] In this step, when the transparent organic layer 80 is made of a transparent organic resin, a dry etching process can be used to etch the transparent organic layer 80. This step results in the eleventh intermediate structure shown in Figure 29. As shown in Figure 29, the area of ​​the transparent organic layer 80 covered by the second reflective layer 32 is retained. The retained transparent organic layer 80 supports the second reflective layer 32 and prevents it from collapsing.

[0221] Subsequently, the fifth reflective layer is formed.

[0222] This step yields the twelfth intermediate structure shown in FIG30 . As shown in FIG30 , the third reflective layer 33 covering the second reflective layer 32 is formed simultaneously with the formation of the fifth reflective layer 50, resulting in the second reflective layer 30 comprising the first reflective layer 31, the second reflective layer 32, and the third reflective layer 33. In this step, since the transparent organic layer 80 covering the side surfaces of the groove 11 is formed within the groove 11, the formed fifth reflective layer 50 is prevented from covering the side surfaces of the groove 11.

[0223] Subsequently, a color conversion structure is formed within the groove.

[0224] Through this step, a thirteenth intermediate structure as shown in FIG31 can be obtained. As shown in FIG31 , the color conversion structure 70 is located between the transparent organic layer 80 and the first protrusion 20 .

[0225] Subsequently, an encapsulation layer covering color conversion structure 70 is formed.

[0226] In this embodiment, the array substrate finally obtained is shown in FIG4 .

[0227] Referring to the above-mentioned preparation method, those skilled in the art can adjust the specific process and steps of the preparation method according to actual conditions to obtain array substrates with structures shown in other embodiments, which will not be described again.

[0228] The embodiment of the method for preparing the array substrate provided in the embodiment of the present application and the embodiment of the array substrate belong to the same inventive concept, and the description of relevant details and beneficial effects can be referred to each other, and will not be repeated here.

[0229] The present application also provides a light-emitting substrate. The light-emitting substrate includes a plurality of light-emitting elements and the array substrate described in any of the above embodiments. The array substrate in the light-emitting substrate shown in FIG32 is the array substrate shown in FIG1A , but is not limited thereto. As shown in FIG32 , the light-emitting element 91 includes a plurality of pins 911 , each of which is bonded to a conductive pad 41 .

[0230] In one embodiment, as shown in FIG32 , the light-emitting element 91 includes a light emitting area 912 . The orthographic projection of one light emitting area 912 on the second surface 102 of the substrate 10 falls within the orthographic projection of one color conversion structure 70 on the second surface 102 of the substrate 10. It should be noted that the light emitting area 912 refers to the area from which the light emitted by the light-emitting element 91 can be emitted during operation. The pins 911 of the light-emitting element 91 are typically made of a metal or alloy material with good conductivity. Light emitted by the light-emitting element 91 can be emitted from all areas except the area where the pins 911 are located. In FIG32 , the light emitting area 912 is located between the pins 911. In practice, the light emitting area 912 is not necessarily a regular area.

[0231] In one embodiment, the edge of the orthographic projection of the light-emitting area of ​​each light-emitting element 91 on the second surface 102 of the substrate 10 is located inside the edge of the orthographic projection of an opening 303 in the second reflective layer 30 on the second surface 102 of the substrate 10. This arrangement prevents light emitted by the light-emitting element 91 from being reflected by the surface of the second reflective layer 30 away from the substrate 10, thereby helping to reduce light loss.

[0232] In one embodiment, as shown in FIG32 , the light-emitting substrate further includes a sixth reflective layer 93, which covers the light-emitting element 91, and a light-emitting hole 931 is provided on the side of the sixth reflective layer 93 facing the array substrate. The orthographic projection of the light-emitting area 912 of the light-emitting element 91 on the second surface 102 of the substrate 10 falls within the orthographic projection of a light-emitting hole 931 on the second surface 102 of the substrate 10. The sixth reflective layer 93 can reflect light emitted from the non-light-emitting area of ​​the light-emitting element 91, thereby improving the utilization efficiency of the light. The sixth reflective layer 93 can cover the surface of the light-emitting element 91 away from the array substrate, the side surface of the light-emitting element 91, and a portion of the surface of the light-emitting element 91 facing the array substrate.

[0233] In one embodiment, the material of the sixth reflective layer 93 includes at least one of white ink and silicone white glue. For example, the material of the sixth reflective layer 93 can be white ink or silicone white glue.

[0234] In one embodiment, as shown in FIG32 , the light-emitting substrate further includes an insulating protective layer 92. The insulating protective layer 92 covers the pins 911 of the light-emitting element 91 and the conductive pad 41 to protect the pins 911 and the conductive pad 41 of the light-emitting element 91. The insulating protective layer 92 can be made of a transparent resin material, and the light transmittance of the transparent resin material can be greater than 95%.

[0235] In one embodiment, the light emitting element 91 may include a Micro LED and / or a Mini LED. The size (e.g., length) of the Micro LED is less than 50 microns, for example, 10 to 50 microns. The size (e.g., length) of the Mini LED is 50 to 150 microns, for example, 80 to 120 microns.

[0236] In one embodiment, as shown in FIG33 , the light-emitting substrate includes a light-emitting region 130 and a peripheral region 140 . The boundary of the light-emitting region 130 may coincide with the boundary of the central region of the substrate, and the boundary of the peripheral region 140 may coincide with the boundary of the edge region of the substrate. The light-emitting element 91 is disposed in the light-emitting region 130 .

[0237] In one embodiment, the conductive layer 40 includes a plurality of conductive pads 41, which are divided into a plurality of conductive pad groups. Each light-emitting element is bonded to a conductive pad 41 in a conductive pad group. The number of pins 911 included in the light-emitting element 91 is the same as the number of conductive pads 41 included in its corresponding conductive pad group, and each pin 911 is bonded to a conductive pad 41.

[0238] In one embodiment, as shown in FIG33 , the light-emitting substrate further includes a non-luminescent element 94, such as a driver chip or a sensor chip. The orthographic projection of the non-luminescent element 94 on the second surface 102 of the substrate 10 does not overlap with the orthographic projection of the groove 11 on the second surface 102 of the substrate 10. The non-luminescent element 94 includes pins, and each pin of the non-luminescent element 94 is bound and connected to a conductive pad in a conductive pad group. The number of pins included in the non-luminescent element 94 is the same as the number of conductive pads included in its corresponding conductive pad group. The non-luminescent element 94 may be located in the peripheral area 140.

[0239] It should be noted that FIG33 is a schematic diagram, and in practice the number of light-emitting elements 91 included in the light-emitting substrate is much greater than the number of light-emitting elements 91 in FIG33 .

[0240] An embodiment of the present application further provides a display device, comprising a display panel and the above-mentioned light-emitting substrate; the display panel is located on a side of the substrate away from the light-emitting element.

[0241] The display panel may be a liquid crystal display device, and the array substrate serves as a backlight module.

[0242] This application does not impose any specific restrictions on the applicability of display devices. It can be any product or component with flexible display function, such as televisions, laptops, tablets, wearable display devices, mobile phones, car displays, navigation, e-books, digital photo frames, advertising light boxes, etc.

[0243] In this disclosure, unless otherwise specified or limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meanings of the above terms in this disclosure can be understood according to the specific circumstances.

[0244] In this disclosure, "electrically connected" includes components connected together via an element having some electrical function. There are no particular limitations on the "element having some electrical function" as long as it enables the transfer of electrical signals between the connected components. Examples of "element having some electrical function" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other components with various functions.

[0245] In this disclosure, the terms "film" and "layer" may be interchanged. For example, "conductive layer" may be replaced with "conductive film." Similarly, "insulating film" may be replaced with "insulating layer."

[0246] The "patterning process" mentioned in the present disclosure includes processes such as depositing a film layer, coating a photoresist, mask exposure, development, etching and stripping the photoresist. Deposition can be performed by any one or more selected from sputtering, evaporation and chemical vapor deposition, coating can be performed by any one or more selected from spray coating and spin coating, and etching can be performed by any one or more selected from dry etching and wet etching. "Thin film" refers to a thin film made by depositing or coating a certain material on a substrate. If the "thin film" does not require a patterning process during the entire production process, the "thin film" can also be called a "layer". When the "thin film" still requires a patterning process during the entire production process, it is called a "thin film" before the patterning process and a "layer" after the patterning process. The "layer" after the patterning process contains at least one "pattern".

[0247] "Same layer" refers to a layer structure formed by using the same film-forming process to form a specific pattern, and then using the same mask through a single patterning process. Depending on the specific pattern, a single patterning process may include multiple exposure, development, or etching steps, and the specific pattern in the resulting layer structure may be continuous or discontinuous, and these specific patterns may also be at different heights or have different thicknesses.

[0248] In the present disclosure, “the orthographic projection of A covers the orthographic projection of B” means that the boundary of the orthographic projection of B falls within the boundary of the orthographic projection of A, or the boundary of the orthographic projection of A overlaps with the boundary of the orthographic projection of B. Similarly, “the orthographic projection of B is within the orthographic projection of A” means that the boundary of the orthographic projection of A falls within the boundary of the orthographic projection of A, or the boundary of the orthographic projection of A overlaps with the boundary of the orthographic projection of B.

[0249] As used herein, "about" or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value, where the acceptable range of deviation is determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0250] In the accompanying drawings, the thickness of certain areas and layers may be exaggerated for clarity. The same reference numerals in the figures represent the same or similar structures, and their detailed descriptions will be omitted. The described features, structures or characteristics may be combined in one or more embodiments in any suitable manner. In the description of the present disclosure, many specific details are provided so as to provide a full understanding of the embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure can be practiced without one or more of the specific details, or other methods, components, materials, etc. can be adopted. In other cases, well-known structures, materials or operations are not shown or described in detail to avoid obscuring the main technical ideas of the present disclosure.

[0251] It will be understood that although the terms first, second, third, etc. may be used to describe various elements, components, areas, layers and / or parts in this article, these elements, components, areas, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer or part from another element, component, area, layer or part. Therefore, the first element, component, area, layer or part discussed above can be referred to as the second element, component, area, layer or part without departing from the teachings of the present disclosure.

[0252] Spatially relative terms such as "row," "column," "under," "above," "left," "right," and the like may be used herein to describe the relationship of one element or feature to another element or feature as illustrated in the figures for ease of description. It will be understood that these spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figure is flipped, the element described as "under other elements or features" will be oriented as "above other elements or features." Thus, the exemplary term "under" can encompass both orientations of above and below. The device can be oriented otherwise (rotated 90 degrees or in other orientations) and the spatially relative descriptors used herein are interpreted accordingly. In addition, it will also be understood that when a layer is referred to as "between two layers," it can be the only layer between the two layers, or one or more intermediate layers may also be present.

[0253] The terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. As used herein, the singular forms "one", "an" and "the" are intended to also include the plural forms, unless the context clearly indicates otherwise. It will be further understood that the terms "include" and / or "comprise" when used in this specification specify the presence of the features, wholes, steps, operations, elements and / or parts, but do not exclude the presence of one or more other features, wholes, steps, operations, elements, parts and / or their groups or add one or more other features, wholes, steps, operations, elements, parts and / or their groups. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. In the description of this specification, the description of the reference terms "one embodiment", "another embodiment" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment are included in at least one embodiment of the present disclosure. In this specification, the schematic representation of the above terms does not necessarily need to be directed to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. Furthermore, those skilled in the art may combine different embodiments or examples and features of different embodiments or examples described in this specification without mutual contradiction.

[0254] It will be understood that when an element or layer is referred to as being “on,” “connected to,” “coupled to,” or “adjacent to” another element or layer, it can be directly on, directly connected to, directly coupled to, or directly adjacent to another element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being “directly on,” “directly connected to,” “directly coupled to,” or “directly adjacent to” another element or layer, no intervening elements or layers are present. However, in no case should “on” or “directly on” be interpreted as requiring that one layer completely cover the underlying layer.

[0255] Embodiments of the present disclosure are described herein with reference to schematic illustrations (and intermediate structures) of idealized embodiments of the present disclosure. Because of this, variations in the illustrated shapes, for example as a result of manufacturing techniques and / or tolerances, should be expected. Therefore, embodiments of the present disclosure should not be interpreted as being limited to the specific shapes of the regions illustrated herein, but should include shape deviations, for example, due to manufacturing. Therefore, the regions illustrated in the figures are schematic in nature, and their shapes are not intended to illustrate the actual shape of the regions of the device and are not intended to limit the scope of the present disclosure.

[0256] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which the present disclosure belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the relevant art and / or the context of this specification, and will not be interpreted in an idealized or overly formal sense unless explicitly defined as such herein.

[0257] As will be appreciated by those skilled in the art, although the various steps of the method of the present disclosure are described in a particular order in the accompanying drawings, this does not require or imply that the steps must be performed in that particular order unless the context clearly indicates otherwise. Additionally or alternatively, multiple steps may be combined into a single step and / or a single step may be broken down into multiple steps and performed. In addition, other method steps may be inserted between steps. An inserted step may represent an improvement to a method such as that described herein, or may be unrelated to the method. In addition, a given step may not be fully completed before the next step begins.

[0258] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this disclosure should be included in the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. An array substrate, comprising a plurality of light-dodging units arranged in an array, each light-dodging unit comprising: A substrate comprising a first surface and a second surface opposite to each other, wherein the first surface is provided with a groove; A first reflective layer is located on a side of the first surface away from the second surface, wherein an orthographic projection of the first reflective layer on the second surface of the substrate does not overlap with an orthographic projection of the groove on the second surface of the substrate; The second reflective layer is located on a side of the first reflective layer away from the second surface of the substrate, the orthographic projection of the second reflective layer on the second surface of the substrate partially overlaps with the orthographic projection of the first reflective layer on the second surface of the substrate, and the second reflective layer is provided with an opening, and the orthographic projection of the opening on the second surface of the substrate is located within the orthographic projection of the groove on the second surface of the substrate. 2 . The array substrate according to claim 1 , each light homogenizing unit further comprises a first structure, wherein the first structure is located on a side of the first reflective layer away from the base substrate, and the first structure contacts the second reflective layer.

3. The array substrate according to claim 2, wherein: The first structure includes a third reflective layer located on a side of the second reflective layer away from the second surface of the substrate, and an orthographic projection of the third reflective layer on the second surface of the substrate covers a boundary of an orthographic projection of the groove on the second surface of the substrate.

4. The array substrate according to claim 3, wherein: The third reflective layer includes a reflective adhesive layer.

5. The array substrate according to claim 4, wherein: The orthographic projection of the reflective adhesive layer on the second surface of the substrate coincides with the orthographic projection of the second reflective layer on the second surface of the substrate.

6. The array substrate according to claim 4, wherein: The second reflective layer includes a first reflective portion and a second reflective portion, the orthographic projection of the first reflective portion on the second surface of the substrate does not overlap with the orthographic projection of the groove on the second surface of the substrate, the orthographic projection of the second reflective portion on the second surface of the substrate is located within the orthographic projection of the groove on the second surface of the substrate, and the orthographic projection of the reflective adhesive layer on the second surface of the substrate covers the orthographic projections of a portion of the first reflective portion close to an edge of the groove and a portion of the second reflective portion close to an edge of the groove on the second surface of the substrate.

7. The array substrate according to claim 4, wherein: The orthographic projection of the second reflective layer on the second surface of the substrate does not overlap with the orthographic projection of the groove on the second surface of the substrate, the orthographic projection of the second reflective layer on the second surface of the substrate is within the orthographic projection of the reflective adhesive layer on the second surface of the substrate, and the orthographic projection of the reflective adhesive layer on the second surface of the substrate overlaps with the orthographic projection of the groove on the second surface of the substrate.

8. The array substrate according to claim 3, further comprising: A fourth reflection layer is located on a side of the third reflection layer away from the second surface of the substrate; the ductility of the material of the third reflection layer is greater than the ductility of the material of the second reflection layer, and the material of the fourth reflection layer is the same as that of the second reflection layer.

9. The array substrate according to claim 8, wherein: Orthographic projections of the second reflective layer, the third reflective layer, and the fourth reflective layer on the second surface of the substrate at least partially overlap.

10. The array substrate according to claim 2, wherein: The first structure includes a first organic layer located between the first reflective layer and the second reflective layer, and an orthographic projection of the first organic layer on the second surface of the substrate covers an orthographic projection of the first reflective layer on the second surface of the substrate.

11. The array substrate according to claim 2, wherein: The first structure includes a plurality of second through holes uniformly arranged around the opening on the second reflective layer, and the orthographic projections of the plurality of second through holes on the second surface of the substrate are located within the orthographic projection of the groove on the second surface of the substrate.

12. The array substrate according to claim 11, wherein: The opening is circular, and the plurality of second through holes are radially distributed with the center of the opening as the center.

13. The array substrate according to claim 11, wherein: The cross section of each second through hole in the plurality of second through holes parallel to the second surface is circular, the diameter of each second through hole is ≥5 μm, and the distance between two adjacent second through holes is ≥5 μm.

14. The array substrate according to claim 2, wherein: The first structure includes a plurality of strip-shaped portions arranged on a side of the second reflective layer facing the substrate and / or a side of the second reflective layer facing away from the substrate, wherein the orthographic projections of the plurality of strip-shaped portions on the second surface of the substrate are located within the orthographic projections of the grooves on the second surface of the substrate.

15. The array substrate according to claim 14, wherein: The opening is circular, and the plurality of strip-shaped portions are evenly distributed radially with the center of the opening as the center.

16. The array substrate according to claim 15, wherein: The projection of each of the plurality of strip-shaped portions on the second surface of the substrate is a rectangle, the width of each strip-shaped portion is ≥5 μm, and the distance between the positions of two adjacent strip-shaped portions closest to the opening is ≥5 μm.

17. The array substrate according to any one of claims 14 to 16, wherein: The material of the plurality of strip-shaped portions is the same as that of the second reflective layer.

18. The array substrate according to claim 1, wherein each light homogenization unit further comprises: A first protrusion, wherein the first protrusion is located in the groove, and in a direction from the first surface of the substrate to the second surface of the substrate, an area of ​​a cross section of the first protrusion parallel to the second surface of the substrate gradually increases, and a distance from a surface of the first protrusion away from the second surface of the substrate to the second surface of the substrate is less than or equal to a distance between the first surface of the substrate and the second surface of the substrate.

19. The array substrate according to claim 18, wherein each light homogenization unit further comprises: a fifth reflective layer, the fifth reflective layer at least covering a side surface of the first protrusion; and a color conversion structure located in the groove, the color conversion structure covering the fifth reflective layer, and an orthographic projection of the color conversion structure on the second surface of the substrate is located within the orthographic projection of the fifth reflective layer on the second surface of the substrate.

20. The array substrate according to claim 18, wherein: An orthographic projection of a geometric center of the first protrusion on the second surface of the substrate coincides with an orthographic projection of a geometric center of the groove on the second surface of the substrate.

21. The array substrate according to claim 20, wherein: The outer contour of the orthographic projection of the first protrusion on the second surface of the substrate is circular, and the outer contour of the orthographic projection of the groove on the second surface of the substrate is circular.

22. The array substrate according to claim 21, wherein each light homogenization unit further comprises: a second protrusion, wherein the second protrusion is located in the groove, the outer contour of the orthographic projection of the second protrusion on the second surface of the substrate is annular, the orthographic projection of the second protrusion on the second surface of the substrate surrounds the orthographic projection of the first protrusion on the second surface of the substrate, and the distance from the surface of the second protrusion away from the second surface of the substrate to the second surface of the substrate is smaller than the distance from the surface of the first protrusion away from the second surface of the substrate to the second surface of the substrate.

23. The array substrate according to claim 22, wherein: The second reflecting layer includes a second reflecting portion, the orthographic projection of the second reflecting portion on the second surface of the substrate falls within the orthographic projection of the groove on the second surface of the substrate; the width of the second reflecting portion is a first dimension; the longitudinal cross-section of a portion of the groove located on the side of the second protrusion away from the first protrusion is an arc, and the length of the radius of the circle where the longitudinal cross-section of the portion of the groove lies is a second dimension; the first dimension is equal to the second dimension and is greater than the depth of the groove.

24. The array substrate according to claim 22 or 23, wherein: The first protrusion and the second protrusion are an integral structure with the substrate.

25. The array substrate according to any one of claims 1 to 24, wherein: The groove is filled with a transparent organic layer, and the refractive index of the transparent organic layer is lower than the refractive index of the substrate.

26. The array substrate according to claim 1, wherein: A light homogenizing structure is provided on a surface of the first reflective layer facing the substrate.

27. The array substrate according to claim 26, wherein: The light homogenizing structure includes a plurality of recessed structures arranged in an array, and the array substrate further includes a plurality of supporting portions arranged in an array and located between the first reflective layer and the substrate, and the first reflective layer is in direct contact with the plurality of supporting portions.

28. The array substrate according to claim 26, wherein: The light homogenizing structure includes a plurality of protruding structures arranged in an array and facing the substrate. A plurality of recessed portions arranged in an array are provided on the first surface of the substrate, and one protruding structure is located in a corresponding recessed portion.

29. The array substrate according to claim 26, wherein: The light homogenizing structure includes a plurality of protruding structures arranged in an array and facing the substrate, a microstructure layer is arranged between the first surface of the substrate and the first reflective layer, and a surface of the microstructure layer facing the first reflective layer is provided with a plurality of recessed portions arranged in an array, and a protruding structure is located in a corresponding recessed portion.

30. A light-emitting substrate, comprising a plurality of light-emitting elements and the array substrate according to any one of claims 1 to 29; the light-emitting elements comprising a plurality of pins, each pin being electrically connected to the array substrate via a conductive pad.

31. The light-emitting substrate according to claim 30, wherein: The light-emitting substrate further includes a sixth reflective layer, the sixth reflective layer covers the light-emitting element, and a light exit hole is provided on a side of the sixth reflective layer facing the array substrate.

32. A display device, comprising a display panel and the light-emitting substrate according to claim 28 or 29; the display panel is located on a side of the substrate away from the light-emitting element.

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