Electronic device

Abstract

The present application provides an electronic device, comprising an antenna. The antenna comprises a radiator and a daughter board. The radiation efficiency and system efficiency of the antenna can be improved by means of electronic elements on the daughter board, so that the electronic device has better communication performance. The antenna comprises a radiator, a daughter board, a first electronic element, a first connecting member, and a second connecting member. The radiator comprises a first connecting point and a second connecting point. A first end of the first connecting member is electrically connected to the first connecting point, and a first end of the second connecting member is electrically connected to the second connecting point. The first electronic element is located on the daughter board, and the first electronic element is electrically connected between a second end of the first connecting member and a second end of the second connecting member. The radiator is provided with a first gap between the first connecting point and the second connecting point.

Description

An electronic device

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on September 27, 2023, with application number 202311272754.8 and application name “An Electronic Device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of wireless communications, and in particular to an electronic device. Background Art

[0003] As demand for high-speed data transmission increases, the industrial design (ID) trend of electronic devices is toward larger screens and multiple cameras. This significantly reduces antenna clearance, limiting layout space.

[0004] Currently, the communication frequency bands of electronic devices will continue to coexist for a long time, encompassing third-generation wireless systems (3G), fourth-generation wireless systems (4G), and fifth-generation wireless systems (5G), with frequency coverage becoming increasingly broad. Given these changes, improving the efficiency of antennas in electronic devices has become a top priority.

[0005] Summary of the Invention

[0006] The present application provides an electronic device including an antenna. The antenna includes a radiator and a sub-board. The system efficiency and radiation efficiency of the antenna can be improved by electronic components disposed on the surface of the sub-board and slots disposed on the radiator.

[0007] In a first aspect, an electronic device is provided, comprising: a ground; an antenna, comprising a radiator, a sub-board, a first electronic component, a first connector, and a second connector; wherein the sub-board and the radiator are opposite to each other and do not contact each other; the radiator comprises a first connection point and a second connection point, the first end of the first connector is electrically connected to the first connection point, and the first end of the second connector is electrically connected to the second connection point; the first electronic component is located on the sub-board, and the first electronic component is electrically connected between the second end of the first connector and the second end of the second connector; the radiator has a first gap between the first connection point and the second connection point.

[0008] According to embodiments of the present application, the first slot provided on the radiator can be considered an equivalent capacitor (e.g., distributed capacitance) provided on the radiator. This equivalent capacitor enables the radiator to form a metamaterial structure. The radiator with this metamaterial structure can increase the radiation aperture. The introduction of the first slot further disperses the electric field, reducing dielectric loss near the conductor, thereby effectively improving the antenna's system efficiency and radiation efficiency.

[0009] In combination with the first aspect, in certain implementations of the first aspect, the antenna further includes a third connector and a second electronic component, the first end of the third connector is electrically connected to the ground, the second electronic component is located on the sub-board, and the second electronic component is electrically connected between the second end of the first connector and the second end of the third connector.

[0010] According to an embodiment of the present application, adding a second electronic component to the daughterboard can cause the current on the radiator to be shunted in the area near the first connection point when the radiator resonates. This shunting in the area near the first connection point can disperse the current density on the radiator. This makes the current distribution on the radiator more dispersed, thereby reducing the conductor loss of the radiator. This more dispersed current distribution on the radiator can increase the radiation aperture of the radiator. Due to the reduced conductor loss of the radiator and the increase in the radiation aperture of the antenna, the system efficiency and radiation efficiency of the antenna can be improved.

[0011] In combination with the first aspect, in some implementations of the first aspect, the electronic device further includes a frame, the frame includes a first position and a second position, the frame is coupled to the ground at the first position, and the frame has a second gap at the second position; the radiator is the conductor part of the frame between the first position and the second position.

[0012] According to an embodiment of the present application, the first end (at the first position) of the radiator is grounded, and the second end (at the second position) is open. The radiator can operate in quarter-wavelength mode. By using the second electronic component and the first gap, the electrical length of the radiator can be increased from a quarter of the first wavelength to more than three-eighths of the first wavelength, while still operating in quarter-wavelength mode. In this case, increasing the radiation aperture can effectively improve the system efficiency and radiation efficiency of the antenna.

[0013] In combination with the first aspect, in certain implementations of the first aspect, the electronic device includes a middle frame and a battery, the middle frame includes a battery compartment and a middle plate, the battery is located in the space surrounded by the battery compartment, the battery compartment is located on the middle plate, and the middle plate serves as the ground; wherein the sub-board is located in a groove surrounded by the first part of the battery compartment, the radiator and the middle plate.

[0014] In combination with the first aspect, in some implementations of the first aspect, the electronic device further includes a first metal part, a second metal part and a third metal part; wherein, the first metal part, the second metal part and the third metal part are located in the groove; the first part of the first metal part is welded to the middle plate, and the second part of the first metal part is located between the first end of the first connector and the first connection point; the first part of the second metal part is welded to the middle plate, and the second part of the second metal part is located between the first end of the second connector and the second connection point; the first part of the third metal part is welded to the middle plate, and the second part of the third metal part is located between the first end of the third connector and the first part of the battery compartment.

[0015] According to an embodiment of the present application, the conductivity of the first metal part, the second metal part or the third metal part can be greater than the conductivity of the conductor part of the frame (for example, the radiator), the battery compartment or the middle plate, so as to enhance the conductive effect between the sub-board and the radiator or the battery compartment and increase the stability of the electrical connection.

[0016] In addition, since the width of the groove formed by the first part of the battery compartment, the radiator and the middle plate is relatively narrow (for example, the distance between the first part of the battery compartment and the radiator is less than or equal to 3 mm), it is impossible to fix the first metal part, the second metal part and the third metal part to the first connection point, the battery compartment and the second connection point by welding (for example, spot welding). Therefore, the first metal part, the second metal part and the third metal part can be welded to the middle plate (for example, spot welding) through the above-mentioned technical solution, which can also achieve the same technical effect and is easier to implement.

[0017] In combination with the first aspect, in certain implementations of the first aspect, the first metal part, the second metal part and the third metal part are spring sheets; the first end of the first connecting part is spring-connected to the second part of the first metal part, the first end of the second connecting part is spring-connected to the second part of the second metal part, and the first end of the third connecting part is spring-connected to the second part of the third metal part.

[0018] According to an embodiment of the present application, the connecting member can fix the second part of the corresponding metal member between the first end of the connecting member and the connection point by means of spring connection.

[0019] In combination with the first aspect, in some implementations of the first aspect, the electronic device further includes a limiting member, and the limiting member, the first portion of the battery compartment, the radiator, and the middle plate form a closed space.

[0020] According to an embodiment of the present application, the limiting member can be used to limit the sub-board to be located in the closed space to prevent the sub-board from sliding in the slot.

[0021] In combination with the first aspect, in certain implementations of the first aspect, the first electronic component is located on the first surface or the second surface of the sub-board, the first surface is the surface of the sub-board facing the radiator, and the second surface is the surface of the sub-board facing the battery compartment; the second electronic component is located on the first surface or the second surface.

[0022] According to the embodiment of the present application, unlike the method in the prior art where the circuit board is perpendicular to the radiator, the embodiment of the present application adopts a method where the sub-board is parallel to the radiator, that is, the sub-board is vertically inserted into the gap between the battery compartment and the radiator, that is, when the gap is small, the sub-board can still complete the electrical connection between the radiator and the circuit board.

[0023] In combination with the first aspect, in some implementations of the first aspect, a distance between the first portion of the battery compartment and the radiator is less than or equal to 3 mm.

[0024] In combination with the first aspect, in certain implementations of the first aspect, a length of the conductor portion between the first position and the first gap is smaller than a length of the conductor portion between the second position and the first gap.

[0025] In combination with the first aspect, in certain implementations of the first aspect, a length of the conductor portion between the first position and the first gap is less than three-fifths of a length of the conductor portion between the second position and the first gap.

[0026] According to an embodiment of the present application, the first slot can be located in a region of the radiator where the current is relatively high. The region of relatively high current should be understood as referring to a region of the radiator where the current is relatively high, relative to an unslotted radiator (e.g., operating in a quarter-wavelength mode). When the first slot is opened, the electric field strength of the radiator is weakened, thereby achieving the effect of dispersing the electric field and thus improving the system efficiency and radiation efficiency of the antenna.

[0027] In combination with the first aspect, in certain implementations of the first aspect, the frame includes a first side and a second side that intersect at an angle, and the length of the first side is greater than the length of the second side; the first gap is located on the first side, and the distance between the first gap and the midpoint of the first side is greater than 0 mm and less than or equal to 30 mm.

[0028] According to an embodiment of the present application, the first gap does not coincide with the midpoint of the first side, which can improve the strength of the electronic device.

[0029] In combination with the first aspect, in certain implementations of the first aspect, the frame includes a first side and a third side that intersect the second side at an angle, the length of the first side and the third side is greater than the length of the second side, and the first gap or the second gap is located on the first side; the frame has a third gap on the third side, and the distance between the first gap or the second gap and the third gap in the first direction is greater than or equal to 2 mm, and the first direction is the extension direction of the first side.

[0030] According to the embodiment of the present application, the first edges of the first and second slits do not overlap with the third slit in the extending direction, which can improve the strength of the electronic device.

[0031] In combination with the first aspect, in certain implementations of the first aspect, a distance between the third gap and a midpoint of the third side is greater than 0 mm and less than or equal to 30 mm.

[0032] According to an embodiment of the present application, the third gap does not coincide with the midpoint of the third side, which can improve the strength of the electronic device.

[0033] In combination with the first aspect, in some implementations of the first aspect, the length of the radiator between the first connection point and the first gap is less than or equal to 5 mm, and / or the length of the radiator between the second connection point and the first gap is less than or equal to 5 mm.

[0034] According to an embodiment of the present application, the equivalent capacitance value of the first gap can be adjusted by electrically connecting the first electronic component between the first connection point and the second connection point, thereby adjusting the radiation characteristics of the antenna (for example, the resonant point frequency).

[0035] In combination with the first aspect, in certain implementations of the first aspect, the size of the sub-board in the second direction is less than or equal to 1 mm, and the size of the sub-board in the third direction is less than or equal to 5 mm, the second direction is a direction perpendicular to the extension direction of the sub-board, and the third direction is the thickness direction of the electronic device.

[0036] In a second aspect, an electronic device is provided, comprising: a ground; an antenna, comprising a radiator, a sub-board, a first electronic component, a first connector and a second connector; wherein the sub-board and the radiator are opposite to each other and do not contact each other; the radiator comprises a first connection point, the first end of the first connector is electrically connected to the first connection point, and the first end of the second connector is electrically connected to the ground; the first electronic component is electrically connected between the second end of the first connector and the second end of the second connector; the first electronic component is located on the first surface or the second surface of the sub-board, the first surface is the surface of the sub-board facing the radiator, and the second surface is the surface of the sub-board opposite to the first surface.

[0037] According to an embodiment of the present application, a first electronic component is provided on the sub-board, so that when the radiator resonates, the current on the radiator is shunted in the area near the first connection point. Due to the shunting in the area near the first connection point, the current density on the radiator can be dispersed. The current distribution of the radiator is relatively more dispersed, thereby reducing the conductor loss of the radiator. The current distribution of the radiator is relatively more dispersed, which can increase the radiation aperture of the radiator. Since the conductor loss of the radiator is reduced and the radiation aperture of the antenna is increased, the system efficiency and radiation efficiency of the antenna can be improved. Different from the method of the prior art in which the circuit board is perpendicular to the radiator, the embodiment of the present application adopts a method in which the sub-board is parallel to the radiator, that is, the sub-board is vertically inserted into the gap between the battery compartment and the radiator, that is, when the gap is small, the sub-board can still complete the electrical connection between the radiator and the circuit board.

[0038] In combination with the second aspect, in some implementations of the second aspect, the electronic device also includes a frame, the frame includes a first position and a second position, the frame is coupled to the ground at the first position, and the frame has a first gap at the second position; the radiator is the conductor part of the frame between the first position and the second position.

[0039] In combination with the second aspect, in certain implementations of the second aspect, the electronic device further includes a middle frame and a battery, the middle frame includes a battery compartment and a middle plate, the battery is located in the space surrounded by the battery compartment, the battery compartment is located on the middle plate, and the middle plate serves as the ground; wherein the sub-board is located in a groove surrounded by the first part of the battery compartment, the radiator and the middle plate.

[0040] In combination with the second aspect, in some implementations of the second aspect, the electronic device further includes a first metal part and a second metal part; wherein, the first metal part and the second metal part are located in the groove; the first part of the first metal part is welded to the middle plate, and the second part of the first metal part is located between the first end of the first connecting part and the first connection point; the first part of the second metal part is welded to the middle plate, and the second part of the second metal part is located between the first end of the second connecting part and the first part of the battery compartment.

[0041] According to an embodiment of the present application, the conductivity of the first metal part and the second metal part can be greater than the conductivity of the conductor part of the frame (for example, the radiator), the battery compartment or the middle plate, so as to improve the conductive effect between the sub-board and the radiator or the battery compartment and increase the stability of the electrical connection.

[0042] In addition, since the width of the groove formed by the first part of the battery compartment, the radiator and the middle plate is relatively narrow (for example, the distance between the first part of the battery compartment and the radiator is less than or equal to 3 mm), it is impossible to fix the first metal part and the second metal part to the first connection point, the battery compartment and the second connection point by welding (for example, spot welding). Therefore, the above-mentioned technical solution can be used to weld the first metal part, the second metal part to the middle plate (for example, spot welding), which can also achieve the same technical effect and is easier to implement.

[0043] In combination with the second aspect, in certain implementations of the second aspect, the first metal part and the second metal part are spring sheets; the first end of the first connecting part is spring-connected to the second part of the first metal part, and the first end of the second connecting part is spring-connected to the second part of the second metal part.

[0044] According to an embodiment of the present application, the connecting member can fix the second part of the corresponding metal member between the first end of the connecting member and the connection point by means of spring connection.

[0045] In combination with the second aspect, in some implementations of the second aspect, the electronic device further includes a limiting member, and the limiting member, the first part of the battery compartment, the radiator, and the middle plate form a closed space.

[0046] According to an embodiment of the present application, the limiting member can be used to limit the sub-board to be located in the closed space to prevent the sub-board from sliding in the slot.

[0047] In combination with the second aspect, in certain implementations of the second aspect, the size of the sub-board in the second direction is less than or equal to 1 mm, and the size of the sub-board in the third direction is less than or equal to 5 mm, the second direction is a direction perpendicular to the extension direction of the sub-board, and the third direction is the thickness direction of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] FIG1 is a schematic diagram of an electronic device 10 provided in an embodiment of the present application.

[0049] FIG2 is a schematic diagram of an antenna 200 provided in an embodiment of the present application.

[0050] FIG3 is a schematic diagram of an antenna 200 provided in an embodiment of the present application.

[0051] FIG4 is a schematic diagram of an antenna 200 provided in an embodiment of the present application.

[0052] FIG5 is a schematic diagram of an electronic device 10 provided in an embodiment of the present application.

[0053] FIG6 is a schematic diagram of an electronic device 10 provided in an embodiment of the present application.

[0054] FIG7 is a schematic diagram of an electronic device 10 provided in an embodiment of the present application.

[0055] 8A and 8B are schematic diagrams of an electronic device 10 provided in an embodiment of the present application.

[0056] FIG9 is a schematic diagram of an electronic device 10 provided in an embodiment of the present application.

[0057] FIG10 is a schematic diagram of an electronic device 10 provided in an embodiment of the present application. DETAILED DESCRIPTION

[0058] The following explains the terms that may appear in the embodiments of the present application.

[0059] It should be understood that the term "and / or" as used herein is simply a term used to describe the existence of three possible relationships between related objects. For example, "A and / or B" can represent the existence of A alone, the existence of both A and B, and the existence of B alone. Furthermore, the character " / " in this document generally indicates that the related objects are in an "or" relationship.

[0060] As used in this application, “within the range of…” includes both end values ​​of the range by default. For example, within the range of 1 to 5, the two values ​​1 and 5 are included.

[0061] Coupling: can be understood as direct coupling and / or indirect coupling, and "coupling connection" can be understood as direct coupling connection and / or indirect coupling connection. Direct coupling can also be referred to as "electrical connection", which is understood as the physical contact and electrical conduction between components; it can also be understood as the form in which different components in the circuit structure are connected through physical lines such as printed circuit board (PCB) copper foil or wires that can transmit electrical signals; "indirect coupling" can be understood as two conductors being electrically conductive in an airless / non-contact manner. In one embodiment, indirect coupling can also be referred to as capacitive coupling, for example, signal transmission is achieved by forming an equivalent capacitance through coupling between the gap between two conductive parts.

[0062] Capacitance: This can be understood as lumped capacitance and / or distributed capacitance. Lumped capacitance refers to capacitive components, such as capacitors; distributed capacitance (or distributed capacitance) refers to the equivalent capacitance formed by two conductive parts separated by a certain gap.

[0063] Inductance: This can be understood as lumped inductance and / or distributed inductance. Lumped inductance refers to inductive components, such as inductors; distributed inductance (or distributed inductance) refers to the equivalent inductance formed by a certain length of conductive material.

[0064] Radiator: A device in an antenna used to receive / send electromagnetic wave radiation. In some cases, the narrow meaning of "antenna" is the radiator, which converts the guided wave energy from the transmitter into radio waves, or converts radio waves into guided wave energy, used to radiate and receive radio waves. The modulated high-frequency current energy (or guided wave energy) generated by the transmitter is transmitted to the transmitting radiator via the feeder line, where it is converted into a certain polarized electromagnetic wave energy and radiated in the desired direction. The receiving radiator converts the electromagnetic wave energy of a certain polarization from a specific direction in space into modulated high-frequency current energy and transmits it to the receiver input via the feeder line.

[0065] The radiator may include a conductor with a specific shape and size, such as a linear or sheet shape, etc., and the present application does not limit the specific shape. In one embodiment, the linear radiator can be simply referred to as a linear antenna. In one embodiment, the linear radiator can be implemented by a conductive frame, and can also be called a frame antenna. In one embodiment, the linear radiator can be implemented by a bracket conductor, and can also be called a bracket antenna. In one embodiment, the wire diameter (for example, including thickness and width) of the linear radiator, or the radiator of the linear antenna is much smaller than the wavelength (for example, the wavelength of the medium) (for example, less than 1 / 16 of the wavelength), and the length can be comparable to the wavelength (for example, the wavelength of the medium) (for example, the length is about 1 / 8 of the wavelength, or 1 / 8 to 1 / 4, or 1 / 4 to 1 / 2, or longer). The main forms of linear antennas include dipole antennas, half-wave oscillator antennas, monopole antennas, loop antennas, and inverted F antennas (also known as IFA, Inverted F Antenna). For example, for a dipole antenna, each dipole antenna generally includes two radiating branches, and each branch is fed by a feeding portion from the feeding end of the radiating branch. For example, an inverted-F antenna (IFA) can be regarded as a monopole antenna with a ground path added. The IFA antenna has a feeding point and a grounding point, and is called an inverted-F antenna because its side view is an inverted F shape. In one embodiment, the sheet radiator may include a microstrip antenna, or a patch antenna, such as a planar inverted F antenna (also known as a PIFA, Planar Inverted F Antenna). In one embodiment, the sheet radiator may be implemented by a planar conductor (such as a conductive sheet or a conductive coating, etc.). In one embodiment, the sheet radiator may include a conductive sheet, such as a copper sheet, etc. In one embodiment, the sheet radiator may include a conductive coating, such as a silver paste, etc. The shape of the sheet radiator includes circular, rectangular, annular, etc., and the present application does not limit the specific shape. The structure of a microstrip antenna generally consists of a dielectric substrate, a radiator and a ground, wherein the dielectric substrate is arranged between the radiator and the ground.

[0066] The radiator may also include a slot or slot formed in a conductor, for example, a closed or semi-closed slot or slot formed in a grounded conductor surface. In one embodiment, a slotted or slotted radiator may be referred to as a slot antenna or slot antenna. In one embodiment, the radial dimension (e.g., including the width) of the slot or slot of the slot antenna / slot antenna is much smaller than the wavelength (e.g., the dielectric wavelength) (e.g., less than 1 / 16 of the wavelength), and the length dimension may be comparable to the wavelength (e.g., the dielectric wavelength) (e.g., the length is approximately 1 / 8 of the wavelength, or 1 / 8 to 1 / 4, or 1 / 4 to 1 / 2, or longer). In one embodiment, a radiator with a closed slot or slot may be referred to as a closed slot antenna. In one embodiment, a radiator with a semi-closed slot or slot (e.g., a closed slot or slot with an additional opening) may be referred to as an open slot antenna. In some embodiments, the slot is elongated. In some embodiments, the slot is approximately half a wavelength (e.g., the dielectric wavelength). In some embodiments, the slot is approximately an integer multiple of the wavelength (e.g., one wavelength). In some embodiments, the slot can be fed with a transmission line spanning one or both sides, thereby exciting a radio frequency electromagnetic field in the slot and radiating electromagnetic waves into space. In one embodiment, the radiator of a slot antenna or slot antenna can be implemented as a conductive frame with both ends grounded, also known as a frame antenna. In this embodiment, the slot antenna or slot antenna can be considered to include a linear radiator spaced from the ground and grounded at both ends, thereby forming a closed or semi-enclosed slot or slot. In one embodiment, the radiator of a slot antenna or slot antenna can be implemented as a bracket conductor with both ends grounded, also known as a bracket antenna.

[0067] The feed circuit is a combination of all circuits used for receiving and transmitting radio frequency signals. The feed circuit may include a transceiver and an RF front end circuit. In some cases, the "feed circuit" is understood in a narrow sense as a radio frequency chip (RFIC, Radio Frequency Integrated Circuit), and the RFIC can be considered to include an RF front end chip and a transceiver. The feed circuit has the function of converting radio waves (e.g., radio frequency signals) and electrical signals (e.g., digital signals). Generally, it is considered to be part of the radio frequency.

[0068] In some embodiments, the electronic device may also include a test socket (or RF socket or RF test socket). This test socket can be used to insert a coaxial cable and test the characteristics of the RF front-end circuit or antenna radiator through the cable. The RF front-end circuit can be considered as the circuit portion coupled between the test socket and the transceiver.

[0069] In some embodiments, the RF front-end circuit may be integrated into a RF front-end chip in the electronic device, or the RF front-end circuit and the transceiver may be integrated into a RF chip in the electronic device.

[0070] It should be understood that any two of the first / second / ...Nth feeding circuits in the present application can share the same transceiver, for example, transmitting signals through a radio frequency channel in a transceiver (for example, a port (pin) of a radio frequency chip); they can also share a radio frequency front-end circuit, for example, processing signals through a switch or amplifier in a radio frequency front-end.

[0071] It should also be understood that two feeding circuits in the first / second / ...Nth feeding circuit in the present application usually correspond to two radio frequency test sockets in the electronic device.

[0072] A matching circuit is a circuit used to adjust the radiation characteristics of an antenna. In one embodiment, the matching circuit is coupled between the feed circuit and the corresponding radiator. In another embodiment, the matching circuit is coupled between the test socket and the radiator. Typically, the matching circuit is a combination of circuits coupled between the radiator and ground. In one embodiment, the matching circuit may include a switch and / or an electronic component, where the switch may be an electronic component used to switch the coupling connection of the radiator. The matching circuit performs impedance matching and / or frequency tuning functions. Generally, it is considered to be part of the antenna.

[0073] The grounding structure / feeding structure may include a connector, such as a metal spring, through which the radiator is coupled to the ground / the feeding structure is coupled to the feeding circuit. In some embodiments, the feeding structure may include a transmission line / feeding line, and the grounding structure may include a grounding wire.

[0074] End / point: The "end / point" in the first end / second end / feeding end / grounding end / feeding point / grounding point / connection point of an antenna radiator should not be narrowly understood as an end point or end portion that is physically disconnected from other radiators. It can also be considered as a point or a section on a continuous radiator. In one embodiment, an "end / point" may include a connection / coupling area on an antenna radiator that is coupled to other conductive structures. For example, the feeding end / feeding point may be a coupling area on an antenna radiator that is coupled to a feeding structure (for example, an area facing a portion of the feeding structure). For another example, the grounding end / grounding point may be a connection / coupling area on an antenna radiator that is coupled to a grounding structure.

[0075] Open end, closed end: In some embodiments, the open end and the closed end are, for example, relative to whether they are grounded. The closed end is grounded, and the open end is not grounded. In some embodiments, the open end and the closed end are, for example, relative to other conductors. The closed end is electrically connected to other conductors, and the open end is not electrically connected to other conductors. In one embodiment, the open end can also be referred to as a floating end, a free end, an open end, or an open-circuit end. In one embodiment, the closed end can also be referred to as a grounded end or a short-circuit end. It should be understood that in some embodiments, other conductors can be coupled through the open end to transfer coupling energy (which can be understood as transferring current).

[0076] In some embodiments, the "closed end" can also be understood from the perspective of current distribution. The closed end or the grounded end can be understood as a point with larger current on the radiator, or as a point with smaller electric field on the radiator. In one embodiment, the current distribution characteristics of larger current / smaller electric field can be maintained by coupling electronic devices (for example, capacitors, inductors, etc.) through the closed end. In one embodiment, the current distribution characteristics of larger current / smaller electric field can be maintained by opening a gap at or near the closed end (for example, a gap filled with insulating material).

[0077] In some embodiments, the understanding of "open end" can also be viewed from the perspective of current distribution. The open end or floating end can be understood as a point with low current on the radiator, or as a point with high electric field on the radiator. In one embodiment, coupling electronic devices (for example, capacitors, inductors, etc.) through the open end can maintain the current distribution characteristics of the low current point / high electric field point.

[0078] It should be understood that coupling the radiator end at a gap (from the perspective of the radiator structure, it is similar to the radiator at the opening of the open end or the suspended end) with electronic devices (for example, capacitors, inductors, etc.) can make the radiator end a point with larger current / smaller electric field. In this case, it should be understood that the radiator end at the gap is actually a closed end or a grounded end, etc.

[0079] The “suspended radiator” mentioned in the embodiments of the present application means that the radiator is not directly connected to the feed line / feed branch and / or the ground line / ground branch, but is fed and / or grounded through indirect coupling.

[0080] It should be understood that the "suspended" in "suspended end" and "suspended radiator" does not mean that there is no structure around the radiator to support it. In one embodiment, the suspended radiator can be, for example, a radiator disposed on the inner surface of the insulating back cover.

[0081] The current same direction / reverse direction mentioned in the embodiments of the present application should be understood as the direction of the main current on the conductor on the same side is the same direction / reverse direction. For example, when stimulating a unidirectional distributed current on a conductor that is bent or ring-shaped (for example, the current path is also bent or ring-shaped), it should be understood that, for example, the main currents stimulated on the conductors on both sides of the ring conductor (for example, a conductor surrounding a gap, on the conductors on both sides of the gap) are opposite in direction, which still falls within the definition of unidirectional distributed current in this application. In one embodiment, the current same direction on a conductor can refer to the current on the conductor having no reversal point. In one embodiment, the current reverse on a conductor can refer to the current on the conductor having at least one reversal point. In one embodiment, the current same direction on two conductors can refer to the current on both conductors having no reversal point and flowing in the same direction. In one embodiment, the current reverse on two conductors can refer to the current on both conductors having no reversal point and flowing in opposite directions. The current same direction / reversal on multiple conductors can be understood accordingly.

[0082] Resonance / resonance frequency: The resonant frequency is also called the resonance frequency. The resonant frequency can have a frequency range, that is, the frequency range in which resonance occurs. The frequency corresponding to the strongest resonance point is the center frequency point frequency. The return loss characteristic of the center frequency can be less than -20dB. It should be understood that, unless otherwise specified, the antenna / radiator mentioned in this application produces a "first / second... resonance", where the first resonance should be the fundamental mode resonance generated by the antenna / radiator, or in other words, the lowest frequency resonance generated by the antenna / radiator. It should be understood that the antenna / radiator can generate one or more antenna modes according to the specific design, and each antenna mode can generate a corresponding fundamental mode resonance.

[0083] Resonant frequency band: The range of the resonant frequency is the resonant frequency band. The return loss characteristic of any frequency point in the resonant frequency band can be less than -6dB or -5dB.

[0084] Communication frequency band / operating frequency band: Regardless of the type of antenna, it always operates within a certain frequency range (bandwidth). For example, an antenna that supports the B40 frequency band operates between 2300MHz and 2400MHz, or in other words, the antenna's operating frequency band includes the B40 frequency band. The frequency range that meets the required specifications can be considered the antenna's operating frequency band.

[0085] The resonant frequency band and the operating frequency band may be the same, or may partially overlap. In one embodiment, one or more resonant frequency bands of the antenna may overlap one or more operating frequency bands of the antenna.

[0086] Electrical length: It can refer to the ratio of physical length (i.e. mechanical length or geometric length) to the wavelength of the transmitted electromagnetic wave. The electrical length can satisfy the following formula:

[0087] Where L is the physical length and λ is the wavelength of the electromagnetic wave.

[0088] Wavelength: Or operating wavelength, this can be the wavelength corresponding to the center frequency of the resonant frequency or the center frequency of the operating frequency band supported by the antenna. For example, if the center frequency of the B1 uplink frequency band (resonant frequency 1920MHz to 1980MHz) is 1955MHz, the operating wavelength can be the wavelength calculated using 1955MHz. "Operating wavelength" is not limited to the center frequency; it can also refer to the wavelength corresponding to a non-center frequency of the resonant frequency or operating frequency band.

[0089] It should be understood that the wavelength of the radiation signal in air can be calculated as follows: (wavelength in air, or wavelength in vacuum) = speed of light / frequency, where frequency is the frequency of the radiation signal (MHz), and the speed of light can be taken as 3×10 8 m / s. The wavelength of the radiation signal in the medium can be calculated as follows: Wherein, ε is the relative dielectric constant of the medium. The wavelength in the embodiments of the present application generally refers to the dielectric wavelength, which can be the dielectric wavelength corresponding to the center frequency of the resonant frequency, or the dielectric wavelength corresponding to the center frequency of the working frequency band supported by the antenna. For example, assuming that the center frequency of the B1 uplink frequency band (resonant frequency is 1920MHz to 1980MHz) is 1955MHz, the wavelength can be the dielectric wavelength calculated using the frequency of 1955MHz. Not limited to the center frequency, "dielectric wavelength" can also refer to the dielectric wavelength corresponding to the non-center frequency of the resonant frequency or the working frequency band. For ease of understanding, the dielectric wavelength mentioned in the embodiments of the present application can be simply calculated by the relative dielectric constant of the medium filled on one or more sides of the radiator.

[0090] Ground (GND): This generally refers to any grounding layer, grounding layer, or at least a portion of a grounding metal layer within an electronic device (such as a mobile phone), or at least a portion of any combination of any of these. Ground can be used to ground components within the electronic device. In one embodiment, ground can be the grounding layer of the electronic device's circuit board, the grounding layer formed by the electronic device's midframe, or the grounding metal layer formed by the metal film below the screen.

[0091] Any of the above-mentioned grounding layers, grounding layers, or grounding metal layers are made of a conductive material. In one embodiment, the conductive material can be any of the following materials: copper, aluminum, stainless steel, brass, and alloys thereof, copper foil on an insulating substrate, aluminum foil on an insulating substrate, gold foil on an insulating substrate, silver-plated copper, silver-plated copper foil on an insulating substrate, silver foil and tin-plated copper on an insulating substrate, cloth impregnated with graphite powder, a graphite-coated substrate, a copper-plated substrate, a brass-plated substrate, and an aluminum-plated substrate. Those skilled in the art will appreciate that the grounding layer / grounding layer / grounding metal layer can also be made of other conductive materials.

[0092] Grounding refers to coupling with the ground / ground mentioned above through a grounding structure and / or grounding circuit. In one embodiment, grounding can be achieved through physical grounding, such as achieving physical grounding at a specific location on the frame through some structural components of the middle frame (or referred to as a physical ground). In one embodiment, grounding can be achieved through device grounding, such as grounding through a device such as a capacitor / inductor / resistor connected in series or in parallel (or referred to as a device ground).

[0093] The technical solutions of the embodiments of the present application will be described below with reference to the accompanying drawings.

[0094] As shown in FIG1 , electronic device 10 may include a cover 13, a display / module 15, a printed circuit board (PCB) 17, a middle frame 19, and a rear cover 21. It should be understood that in some embodiments, cover 13 may be a glass cover or may be replaced with a cover made of other materials, such as a PET (Polyethylene terephthalate) material.

[0095] The cover plate 13 may be disposed closely against the display module 15 , and may be mainly used to protect the display module 15 and prevent dust.

[0096] In one embodiment, the display module 15 may include a liquid crystal display panel (LCD), a light emitting diode (LED) display panel, or an organic light-emitting diode (OLED) display panel, etc., which is not limited in the embodiment of the present application.

[0097] The middle frame 19 mainly supports the entire device. FIG1 shows that the PCB 17 is arranged between the middle frame 19 and the back cover 21. It should be understood that in one embodiment, the PCB 17 can also be arranged between the middle frame 19 and the display module 15. The embodiment of the present application does not limit this. Among them, the printed circuit board PCB17 can adopt a flame-resistant material (FR-4) dielectric board, a Rogers dielectric board, a mixed dielectric board of Rogers and FR-4, and so on. Here, FR-4 is a code for a grade of flame-resistant material, and the Rogers dielectric board is a high-frequency board. Electronic components, such as radio frequency chips, are carried on the PCB17. In one embodiment, a metal layer can be provided on the printed circuit board PCB17. The metal layer can be used to ground the electronic components carried on the printed circuit board PCB17, and can also be used to ground other components, such as bracket antennas, frame antennas, etc. The metal layer can be called ground, grounding, or grounding layer. In one embodiment, the metal layer can be formed by etching metal on the surface of any layer of dielectric board in the PCB17. In one embodiment, the metal layer used for grounding can be provided on the side of the printed circuit board PCB 17 near the middle frame 19. In one embodiment, the edge of the printed circuit board PCB 17 can be considered the edge of its ground layer. In one embodiment, the metal middle frame 19 can also be used to ground the aforementioned components. The electronic device 10 may also have other grounding methods, as previously described and will not be further described here.

[0098] The electronic device 10 may further include a battery (not shown). The battery may be disposed between the middle frame 19 and the back cover 21, or between the middle frame 19 and the display module 15, and this is not limited in this embodiment of the present application. In some embodiments, the PCB 17 is divided into a main board and a sub-board, and the battery may be disposed between the main board and the sub-board. The main board may be disposed between the middle frame 19 and the upper edge of the battery, and the sub-board may be disposed between the middle frame 19 and the lower edge of the battery.

[0099] The electronic device 10 may further include a frame 11, which may be formed of a conductive material such as metal. The frame 11 may be disposed between the display 15 and the back cover 21 and extend circumferentially around the periphery of the electronic device 10. The frame 11 may have four sides surrounding the display 15 to help secure the display 15.

[0100] In one implementation, the frame 11 made of a conductive material can directly serve as the conductive frame of the electronic device 10, for example, forming a metallic frame appearance, suitable for a metallic industrial design (ID). In another implementation, the outer surface of the frame 11 can be made of a conductive material, such as a metal material, thereby forming a metallic frame appearance. In these implementations, the conductive portion of the frame 11 can serve as an antenna radiator for the electronic device 10.

[0101] In another implementation, the outer surface of the frame 11 can also be a non-conductive material, such as plastic, to form the appearance of a non-metallic frame, which is suitable for non-metallic ID. In one implementation, the inner surface of the frame 11 may include a conductive material, such as a metal material. In this implementation, the conductive portion of the frame 11 can be used as an antenna radiator of the electronic device 10. It should be understood that the radiator provided on the inner surface of the frame 11 (or the conductive material on the inner surface) is arranged in contact with the non-conductive material of the frame 11 to facilitate antenna radiation, and both the conductive material and the non-conductive material should be regarded as part of the frame 11.

[0102] The middle frame 19 may include a border 11, and the middle frame 19 including the border 11 is an integral part that can support the electronic devices in the whole machine. The cover 13 and the back cover 21 are respectively covered along the upper and lower edges of the border to form a shell or housing (housing) of the electronic device. In one embodiment, the cover 13, the back cover 21, the border 11 and / or the middle frame 19 can be collectively referred to as the shell or housing of the electronic device 10. It should be understood that "shell or housing" can be used to refer to part or all of any one of the cover 13, the back cover 21, the border 11 or the middle frame 19, or to part or all of any combination of the cover 13, the back cover 21, the border 11 or the middle frame 19.

[0103] The frame 11 on the middle frame 19 can at least partially serve as an antenna radiator to transmit and receive radio frequency signals. A gap can exist between this portion of the frame serving as the radiator and the rest of the middle frame 19 to ensure a good radiation environment for the antenna radiator. In one embodiment, the middle frame 19 can be provided with an aperture in this portion of the frame serving as the radiator to facilitate antenna radiation.

[0104] Alternatively, the frame 11 may not be considered as part of the middle frame 19. In one embodiment, the frame 11 may be connected to the middle frame 19 and formed as one piece. In another embodiment, the frame 11 may include a protrusion extending inward to be connected to the middle frame 19, for example, by means of a shrapnel, a screw, welding, etc. The protrusion of the frame 11 can also be used to receive a feed signal, so that at least a portion of the frame 11 serves as a radiator of the antenna to receive / transmit radio frequency signals. There may be a gap 42 between this portion of the frame that serves as the radiator and the middle frame 30, thereby ensuring that the antenna radiator has a good radiation environment, so that the antenna has a good signal transmission function.

[0105] The back cover 21 can be made of metal, non-conductive materials such as glass or plastic, or a combination of conductive and non-conductive materials. In one embodiment, the conductive back cover 21 can replace the middle frame 19 and integrate with the frame 11 to support the electronic components within the device.

[0106] In one embodiment, the middle frame 19 and / or the conductive parts in the back cover 21 can serve as a reference ground for the electronic device 10, wherein the frame 11, PCB 17, etc. of the electronic device can be grounded through electrical connection with the middle frame.

[0107] The antenna of the electronic device 10 can also be set in the frame 11. When the frame 11 of the electronic device 10 is a non-conductive material, the antenna radiator can be located in the electronic device 10 and arranged along the frame 11. For example, the antenna radiator is set close to the frame 11 to minimize the volume occupied by the antenna radiator and be closer to the outside of the electronic device 10 to achieve better signal transmission effect. It should be noted that the antenna radiator is set close to the frame 11 means that the antenna radiator can be set close to the frame 11, or it can be set close to the frame 11, for example, there can be a certain small gap between the antenna radiator and the frame 11.

[0108] The antenna of electronic device 10 may also be disposed within the housing, such as a bracket antenna or millimeter-wave antenna (not shown in FIG1 ). The clearance for the antenna disposed within the housing can be provided by slots / openings in any of the middle frame, and / or the frame, and / or the back cover, and / or the display screen, or by non-conductive gaps / apertures formed between any of these. The antenna clearance ensures the antenna's radiation performance. It should be understood that the antenna clearance can be a non-conductive area formed by any conductive component within electronic device 10, through which the antenna radiates signals to the outside world. In one embodiment, antenna 40 may be in the form of an antenna based on a flexible printed circuit (FPC), an antenna based on laser-direct-structuring (LDS), or a microstrip disk antenna (MDA). In one embodiment, the antenna may also be a transparent structure embedded within the screen of electronic device 10, such that the antenna is a transparent antenna unit embedded within the screen of electronic device 10.

[0109] FIG. 1 only schematically illustrates some components of the electronic device 10 , and the actual shapes, sizes, and structures of these components are not limited by FIG. 1 .

[0110] It should be understood that in the embodiments of the present application, the surface where the display screen of the electronic device is located can be considered as the front surface, the surface where the back cover is located can be considered as the back surface, and the surface where the frame is located can be considered as the side surface.

[0111] It should be understood that in the embodiments of the present application, it is considered that when a user holds the electronic device (for example, the user holds the electronic device and unlocks it, or for example, when the user holds the electronic device vertically and faces the screen), the orientation of the electronic device has a top, a bottom, a left side, and a right side.

[0112] For the sake of indirectness in the discussion, the antenna structures provided in the embodiments of the present application are all wire antennas. In actual applications, they can also be applied to other antenna structures, such as patch antennas, etc. The embodiments of the present application do not limit this.

[0113] An embodiment of the present application provides an electronic device including an antenna. The antenna includes a radiator and a daughterboard. Electronic components on the daughterboard are electrically connected between the radiator and ground via a connector, thereby improving the antenna's radiation characteristics and enabling the electronic device to have better communication performance.

[0114] FIG2 is a schematic diagram of an antenna 200 provided in an embodiment of the present application.

[0115] As shown in FIG. 2 , the antenna 200 includes a radiator 210 , a sub-board 220 , a first electronic component 231 , a first connector 241 , and a second connector 242 .

[0116] The sub-board 220 and the radiator 210 are opposite to each other and do not contact each other; or the sub-board 220 and the radiator 210 are spaced apart.

[0117] Radiator 210 includes a first connection point 211. A first end of a first connector 241 is electrically connected to first connection point 211. A first end of a second connector 242 is electrically connected to ground 300. In one embodiment, first connector 241 may be a metal component such as a metal spring, and all connectors in the embodiments of the present application should be understood accordingly.

[0118] The first electronic component 231 is located on the daughter board 230 , and the first electronic component 231 is electrically connected between the second end of the first connecting member 241 and the second end of the second connecting member 242 .

[0119] It should be understood that the radiator 210 is electrically connected to the ground 300 at the first connection point 211 via the first electronic component 231. This allows the current on the radiator 210 to be shunted in the area near the first connection point 211 when the radiator 210 resonates. This shunting in the area near the first connection point 211 disperses the current density on the radiator 210. In one embodiment, the current distribution on the radiator 210 is relatively more dispersed, thereby reducing the conductor loss of the radiator 210. In one embodiment, the relatively more dispersed current distribution on the radiator 210 can increase the radiation aperture of the radiator 210. The reduced conductor loss of the radiator 210 and the increased radiation aperture of the antenna 200 can improve the system efficiency and radiation efficiency of the antenna.

[0120] In one embodiment, the radiator 210 further includes a second connection point 212 , and the radiator 210 defines a first gap between the first connection point 211 and the second connection point 212 .

[0121] Antenna 200 further includes a third connector 243 and a second electronic component 232, as shown in FIG3 . A first end of third connector 243 is electrically connected to second connection point 212 . Second electronic component 232 is electrically connected between a second end of first connector 241 and a second end of third connector 243 .

[0122] It should be understood that the first slot provided on the radiator 210 can be considered as an equivalent capacitor (e.g., distributed capacitor) provided on the radiator 210. This equivalent capacitor can form a metamaterial structure on the radiator 210. The radiator 210 with this metamaterial structure can increase the radiation aperture. The provision of the first slot further disperses the electric field and reduces dielectric loss near the conductor, thereby effectively improving the system efficiency and radiation efficiency of the antenna 200.

[0123] In one embodiment, the distance between the first connection point 211 and / or the second connection point 212 and the first gap is less than or equal to 5 mm.

[0124] The distance between the first connection point 211 / the second connection point 212 and the first gap can be understood as the minimum distance between the first connection point 211 / the second connection point 212 and the conductors on both sides of the first gap. When the first electronic component 231 is electrically connected to the first connection point 211 and the second connection point 212 via a connector (e.g., a metal spring), the distance between the first electronic component 231 and the first gap can be understood as the minimum distance between the center of the portion of the connector that contacts the connection point and the conductors on both sides of the first gap.

[0125] It should be understood that the equivalent capacitance of the first slot can be adjusted by electrically connecting the second electronic component 232 between the first connection point 211 and the second connection point 212 , thereby adjusting the radiation characteristics (eg, the resonant point frequency) of the antenna 200 .

[0126] In one embodiment, the width of the first slit is greater than or equal to 0.1 mm and less than or equal to 2 mm. It should be understood that the width of the slits provided in the embodiments of the present application can be within the above range.

[0127] In one embodiment, the first end of the radiator 210 is a ground end, and the second end is an open end.

[0128] It should be understood that, for the sake of simplicity, the present embodiment is described using the example of a case where the first end of the radiator 210 is grounded and the second end is open. In actual applications, both the first and second ends of the radiator 210 may be open or grounded. When the first end of the radiator 210 is grounded and the second end is open, the operating mode of the radiator 210 may be a quarter-wavelength mode. When both the first and second ends of the radiator 210 are open or grounded, the operating mode of the radiator 210 may be a half-wavelength mode.

[0129] In one embodiment, the length of the radiator 210 between the first end (ground end) of the radiator 210 and the first slot is smaller than the length of the radiator 210 between the second end (open end) of the radiator 210 and the first slot.

[0130] It should be understood that the length of the radiator between one end of the radiator and the first gap can be understood as the length of the conductor part between the end of the end and the first gap. For the sake of simplicity of discussion, it can be understood accordingly in the embodiments of the present application.

[0131] In one embodiment, the length of the radiator 210 between the first end (ground end) of the radiator 210 and the first slot is less than three-fifths of the length of the radiator 210 between the second end (open end) of the radiator 210 and the first slot.

[0132] In one embodiment, the length of the radiator 210 between the first end (ground end) of the radiator 210 and the first slot is less than one third of the length of the radiator 210 between the second end (open end) of the radiator 210 and the first slot.

[0133] In one embodiment, the length of the radiator 210 between the first end (ground end) of the radiator 210 and the first slot is less than one seventh of the length of the radiator 210 between the second end (open end) of the radiator 210 and the first slot.

[0134] It should be understood that the first slot can be located in a region of the radiator 210 where current is relatively high. The region of relatively high current should be understood as referring to the region of the radiator 210 without the slot (e.g., operating in quarter-wavelength mode). When the first slot is opened, the electric field strength of the radiator 210 is weakened, thereby achieving the effect of dispersing the electric field, thereby improving the system efficiency and radiation efficiency of the antenna 200.

[0135] In one embodiment, the radiator 210 may be configured to generate a first resonance. The electrical length of the radiator 210 may be greater than three-eighths of a first wavelength, and the first wavelength may be a wavelength corresponding to the first resonance.

[0136] It should be understood that the first end of the radiator 210 is grounded, and the second end is open. The first resonance of the radiator 210 can correspond to a quarter-wavelength mode. The second electronic component 232 and the first gap can make the electrical length of the radiator 210 greater than three-eighths of the first wavelength, so that the current on the radiator 210 flows in the same direction (e.g., not in reverse), and the electric field between the radiator 210 and the ground does not reverse. The electrical length of the radiator 210 increases from one-quarter of the first wavelength to more than three-eighths of the first wavelength, while still operating in the quarter-wavelength mode. In this case, the current density on the radiator 210 is dispersed, and the electric field density between the radiator 210 and the ground 300 is weakened, thereby reducing the conductor loss and dielectric loss caused by the radiator 210 and the conductors and dielectrics disposed around the radiator 210, thereby improving the radiation characteristics of the antenna 200.

[0137] In one embodiment, the first electronic component 231 may be a capacitor or an electronic component equivalent to a capacitor.

[0138] In one embodiment, the equivalent capacitance of the first electronic component 231 can be less than or equal to a first threshold. The first threshold can be designed based on the resonant frequency of the first resonance generated by the radiator 210. When the resonant frequency of the first resonance is less than or equal to 1 GHz, the first threshold is 10 pF. When the resonant frequency of the first resonance is greater than 1 GHz, the first threshold is 2 pF.

[0139] It should be understood that by designing the equivalent inductance value of the first electronic element 231 according to the frequency of the resonance point of different first resonances, the current distribution on the radiator 210 can be made more uniform, the conductor loss and dielectric loss can be reduced, and the radiation aperture of the radiator 210 can be increased, thereby improving the radiation characteristics of the antenna (for example, radiation efficiency and system efficiency).

[0140] At the same time, the first electronic component 231 can be a lumped component, or a distributed component. The embodiment of the present application does not limit the specific structure of the first electronic component 231, which can be determined according to actual production or design.

[0141] In one embodiment, the second electronic component 232 may include an inductor, a capacitor, and a 0 ohm resistor. In one embodiment, the second electronic component 232 may be used to adjust the electrical length of the radiator 210 , thereby adjusting the radiation characteristics of the antenna 200 (eg, the resonant point frequency).

[0142] In one embodiment, the second electronic component 232 may be an inductor or an electronic component equivalent to an inductor.

[0143] In one embodiment, the equivalent inductance of the second electronic component 232 may be less than or equal to 10 nH.

[0144] It should be understood that by designing the equivalent inductance value of the second electronic component 232 according to the frequency of the resonance point of the different first resonances, the current distribution on the radiator 210 can be made more dispersed, the conductor loss can be reduced, and the radiation aperture of the radiator 210 can be increased, thereby improving the radiation characteristics of the antenna (for example, radiation efficiency and system efficiency).

[0145] Meanwhile, the second electronic component 232 may be a lumped component or a distributed component. When the second electronic component 232 is a distributed electronic component, the second electronic component 232 may be a metal line (microstrip line) disposed on the surface of the daughterboard. The embodiment of the present application does not limit the specific structure of the second electronic component 232, which may be determined according to actual production or design.

[0146] In one embodiment, the antenna 200 may further include a feeding circuit 250 . The feeding circuit 250 is coupled to a feeding point 251 on the radiator 210 to feed an electrical signal to the radiator 210 .

[0147] In one embodiment, the length of the radiator 210 between the feed point 251 and the first end (ground end) of the radiator 210 is greater than the length of the radiator 210 between the feed point 251 and the second end (open end) of the radiator 210 .

[0148] It should be understood that the radiator 210 can form a structure similar to a left-handed antenna, and the operation in the quarter-wavelength mode of the left-handed antenna is described as an example. The left-handed antenna can, for example, be an antenna conforming to a composite right and left hand (CRLH) transmission line structure.

[0149] In one embodiment, the length of the radiator 210 between the feed point 251 and the end of the second end of the radiator 210 is less than 5 mm, which facilitates miniaturization of the antenna 200 .

[0150] In one embodiment, the radiator 210 may be in the form of a flexible printed circuit (FPC), or in the form of laser-direct-structuring (LDS), or in the form of an antenna such as a microstrip disk antenna (MDA).

[0151] It should be understood that for the sake of simplicity, in the embodiments of this application, only the conductive portion of the frame of an electronic device is used as an example radiator. In one embodiment, when radiator 210 is in the form of an FPC or LDS, radiator 210 is located between the PCB and the back cover of the electronic device, or between the PCB and the display screen, or on a bracket, but this embodiment of the application does not limit this.

[0152] FIG4 is a schematic diagram of an antenna 200 provided in an embodiment of the present application.

[0153] As shown in FIG. 4 , the antenna 200 includes a radiator 210 , a sub-board 220 , a second electronic component 232 , a first connector 241 , and a third connector 243 .

[0154] The sub-board 220 and the radiator 210 are opposite to each other and do not contact each other.

[0155] Radiator 210 includes a first connection point 211 and a second connection point 212. A first end of a first connector 241 is electrically connected to first connection point 211. A first end of a third connector 243 is electrically connected to second connection point 212. A second electronic component 232 is located on sub-board 230 and electrically connected between a second end of first connector 241 and a second end of third connector 243.

[0156] The radiator 210 defines a first gap between the first connection point 211 and the second connection point 212 .

[0157] It should be understood that the first slot provided on the radiator 210 can be considered as an equivalent capacitor (e.g., distributed capacitor) provided on the radiator 210. This equivalent capacitor can form a metamaterial structure on the radiator 210. The radiator 210 with this metamaterial structure can increase the radiation aperture. The provision of the first slot further disperses the electric field and reduces dielectric loss near the conductor, thereby effectively improving the system efficiency and radiation efficiency of the antenna 200.

[0158] The antenna 200 shown in FIG4 differs from the antenna 200 shown in FIG3 only in that the first electronic component is not provided. For the sake of brevity, the similarities between the antenna 200 shown in FIG4 and the antenna 200 shown in FIG3 are not described in detail, such as the width of the first slot; the distance between the first connection point 211 and / or the second connection point 212 and the first slot; the length of the radiator 210 between the first end (e.g., the ground end) of the radiator 210 and the first slot; the value range of the second electronic component 232; the electrical length of the radiator 210; and the shape of the radiator 210.

[0159] FIG5 is a schematic diagram of an electronic device 10 provided in an embodiment of the present application.

[0160] As shown in FIG. 5 , the electronic device 10 may include a frame 11 .

[0161] The frame 11 includes a first position 201 and a second position 202. The frame 11 is coupled to the ground 300 at the first position 201 and has a second gap at the second position 202. The conductor portion between the first position 201 and the second position 202 serves as the radiator 210 in the above embodiment.

[0162] It should be understood that the electronic device 10 shown in FIG5 includes the structure of the antenna 200 shown in FIG3 for illustration. In actual applications, the structure of the antenna 200 shown in FIG2 or FIG4 may also be included. For the sake of simplicity, they will not be described one by one.

[0163] Meanwhile, in the electronic device 10 shown in FIG5 , the first end (at the first position 201) of the radiator 210 is grounded, and the second end (at the second position 202) is open. In actual applications, the first and second ends of the radiator 210 can both be open or grounded (the frame 11 has gaps at the first position 201 and the second position 202 or is coupled to the ground 300).

[0164] In one embodiment, the frame 11 includes a first side 131 and a second side 132 that intersect at an angle, and the length of the first side 131 is greater than the length of the second side 132. In one embodiment, the first slit or the second slit is located on the first side 131, and the distance between the first slit or the second slit and the midpoint of the first side 131 is greater than 0 mm and less than or equal to 30 mm. The length of the first side 131 on both sides of the midpoint of the first side 131 is the same.

[0165] It should be understood that the first gap and the second gap do not coincide with the midpoint of the first side 131 , which can improve the strength of the electronic device 10 .

[0166] In one embodiment, the frame 11 includes a third side 133 and a second side 132 intersecting at an angle, and the length of the third side 133 is greater than the length of the second side 132. The frame 11 defines a third slit on the third side 133, and a distance between the first slit or the second slit and the third slit in the extension direction of the first side 131 (e.g., the y-direction) is greater than 2 mm.

[0167] It should be understood that the first and second slits do not overlap with the third slit in the extension direction (e.g., the y-direction) of the first side 131, thereby improving the strength of the electronic device 10. The distance between the first or second slit and the third slit in the extension direction (e.g., the y-direction) of the first side 131 can be understood as the distance (conductor length) between the projection of the third slit on the first side 131 and the first or second slit.

[0168] In one embodiment, the distance between the third gap and the midpoint of the third side 133 is greater than 0 mm and less than or equal to 30 mm. It should be understood that the third gap not coinciding with the midpoint of the third side 133 can improve the strength of the electronic device 10.

[0169] In one embodiment, the third side 133 may include a third position 203 and a fourth position 204. The frame 11 may have a third slit at the third position 203 and be coupled to the ground 300 at the fourth position 204. The conductive portion between the third position 203 and the fourth position 204 may serve as a radiator for another antenna, which is not limited in this embodiment of the present application.

[0170] In one embodiment, the electronic device 10 includes a middle frame 19. The middle frame 19 includes a battery compartment 301 and a middle plate 302. The battery compartment 301 is located on the middle plate 302. The middle plate 302 can serve as the ground 300 in the above embodiment. The battery of the electronic device 10 can be located in the space enclosed by the battery compartment 301. In one embodiment, the frame 11 is connected to the middle plate 302 by a connecting rib structure. The connecting rib structure (not shown in the figure) is connected between the frame and the middle plate, and is integrally formed with the frame and the middle plate. In one embodiment, the battery compartment 301, the middle plate 302 and the frame 11 are integrally formed.

[0171] In one embodiment, the first portion of the battery compartment 301 faces the radiator 210 and does not contact each other. The first portion of the battery compartment 301, the radiator 210 and the middle plate 302 form a groove 303, as shown in FIG5 .

[0172] In one embodiment, the sub-board 220 in the above embodiment may be located in a groove formed by the first portion of the battery compartment 301 , the radiator 210 and the middle board 302 , as shown in FIG6 .

[0173] In one embodiment, the distance D1 between the first portion of the battery compartment 301 and the radiator 210 (eg, the width of the slot 303 ) is less than or equal to 3 mm.

[0174] It should be understood that the distance between the first portion of the battery compartment 301 and the radiator 210 can be understood as the minimum distance between a point on the first portion and a point on the radiator 210. The distance between the first portion of the battery compartment 301 and the radiator 210 can also be understood as the width of the slot 303. In one embodiment, the distance between the first portion of the battery compartment 301 and the radiator 210 can also be understood as the distance between the first portion of the battery compartment 301 and the radiator 210 in a first direction, where the first direction is perpendicular to the extension direction of the sub-board 220, for example, the x-direction.

[0175] In one embodiment, the first electronic component 231 and the second electronic component 232 can be located on the first surface of the daughterboard 220, as shown in Figure 7. The first surface of the daughterboard 220 faces the radiator. In one embodiment, the first electronic component 231 and the second electronic component 232 can be located on the second surface of the daughterboard 220, which faces the battery compartment. In one embodiment, the first electronic component 231 and the second electronic component 232 can be located on the first and second surfaces of the daughterboard 220, respectively.

[0176] It should be understood that for the sake of simplicity of discussion, the antenna 200 shown in Figure 6 is the antenna 200 shown in Figure 3 (the antenna 200 includes a first electronic component 231 and a second electronic component 232). In actual applications, it can also be any antenna 200 in the above embodiments. The embodiments shown in Figures 5 and 6 do not limit this.

[0177] Meanwhile, the first electronic component 231 and the second electronic component 232 may be lumped components or distributed components, which is not limited in the embodiment of the present application. For the sake of simplicity, only lumped components are used as an example for description.

[0178] In one embodiment, the second end of the first connector 241 and the second end of the third connector 243 are connected to the first surface of the daughter board 220 .

[0179] In one embodiment, the second end of the second connector 242 is connected to the second surface of the daughter board 220. The first surface and the second surface of the daughter board 220 are oppositely disposed surfaces on the daughter board 220, wherein the first surface is the surface facing the radiator of the daughter board 220, and the second surface is the surface of the daughter board 220 facing the battery compartment.

[0180] In one embodiment, the dimension D2 of the daughter board 220 in the first direction (eg, x-direction) is less than or equal to 1 mm. In one embodiment, the dimension D2 of the daughter board 220 in the first direction (eg, x-direction) is less than or equal to 0.5 mm.

[0181] In one embodiment, a dimension D3 of the sub-board 220 in the second direction is less than or equal to 5 mm. The second direction is the thickness direction of the electronic device 10, for example, the z direction.

[0182] In one embodiment, the dimension D4 of the sub-board 220 in the third direction is less than or equal to 30 mm. In one embodiment, the dimension D4 of the sub-board 220 in the third direction is less than or equal to 20 mm. The third direction is the extension direction of the first side, for example, the y direction.

[0183] In one embodiment, the electronic device further includes a first metal member 311 , a second metal member 312 and a third metal member 313 , as shown in FIG6 .

[0184] In one embodiment, the first metal member 311 , the second metal member 312 and the third metal member 313 are located in a groove formed by the first portion of the battery compartment 301 , the radiator 210 and the middle plate 302 , as shown in FIG8A and 8B .

[0185] In one embodiment, a first portion of the first metal member 311 is welded (e.g., spot welded) to the middle plate 302, and a first portion of the third metal member 313 is welded (e.g., spot welded) to the middle plate 302, as shown in FIG8A . In one embodiment, a second portion of the first metal member 311 is located between the first end of the first connector 241 and the first connection point 211, and a second portion of the third metal member 313 is located between the first end of the third connector 243 and the second connection point 212, as shown in FIG9 .

[0186] In one embodiment, the first portion of the second metal member 312 is welded (e.g., spot welded) to the mid-plate 302, as shown in FIG8B . In one embodiment, the second portion of the second metal member 312 is located between the first end of the second connector 242 and the first portion of the battery compartment 301, as shown in FIG9 .

[0187] It should be understood that since the width of the groove formed by the first part of the battery compartment 301, the radiator 210 and the middle plate 302 is relatively narrow (for example, the distance D1 between the first part of the battery compartment 301 and the radiator 210 is less than or equal to 3 mm), it is impossible to fix the first metal part 311, the second metal part 312 and the third metal part 313 to the first connection point 211, the battery compartment 301 and the second connection point 212 by welding (for example, spot welding). Therefore, the first metal part 311, the second metal part 312 and the third metal part 313 can be welded to the middle plate 302 (for example, spot welding) through the above-mentioned technical solution, which can also achieve the same technical effect and is easier to implement.

[0188] In one embodiment, the first metal member 311, the second metal member 312, and the third metal member 313 may be springs. The first end of the first connecting member 241 is elastically connected to the second portion of the first metal member 311. The first end of the second connecting member 242 is elastically connected to the second portion of the second metal member 312. The first end of the third connecting member 243 is elastically connected to the second portion of the third metal member 313.

[0189] It should be understood that the connecting member can fix the second portion of the corresponding metal member between the first end of the connecting member and the connection point by means of spring connection.

[0190] In one embodiment, the conductivity of the first metal part 311, the second metal part 312 or the third metal part 313 can be greater than the conductivity of the conductor part of the frame (for example, the radiator 210), the battery compartment 301 or the middle plate 302, so as to enhance the conductive effect between the sub-board 220 and the radiator 210 or the battery compartment 301 and increase the stability of the electrical connection.

[0191] In one embodiment, the conductive portion of the frame of the electronic device 10 (e.g., radiator 210), battery compartment 301, or middle plate 302 may be made of aluminum alloy. In one embodiment, the first metal member 311, the second metal member 312, or the third metal member 313 may be made of copper or copper plated with gold.

[0192] It should be understood that compared to copper or copper-plated gold, aluminum alloy has poor corrosion resistance, and long-term use may cause the electrical connection of the first end of the connector to be unstable. The first metal member 311, the second metal member 312, or the third metal member 313 can improve the stability of the electrical connection and avoid radiation spurious emission (RSE) caused by the unstable electrical connection.

[0193] Meanwhile, when the antenna 200 is the antenna 200 shown in FIG. 2 , the electronic device 10 may only include the first metal member 311 and the second metal member 312 , which will not be described in detail for the sake of brevity.

[0194] In one embodiment, the electronic device 10 may further include a limiting member 320, as shown in Figure 10. The limiting member 320, the first portion of the battery compartment 301, the radiator 210, and the middle plate may enclose a closed space.

[0195] It should be understood that in the electronic device 10 shown in FIG. 10 , the limiting member 320 can be used to limit the daughter board 220 to be located in the closed space, thereby preventing the daughter board 220 from sliding in the slot 303 (eg, sliding in the y direction).

[0196] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. An electronic device, characterized in that: include: land; An antenna, comprising a radiator, a sub-board, a first electronic component, a first connector and a second connector; Wherein, the sub-board and the radiator are opposite to each other and do not contact each other; The radiator comprises a first connection point and a second connection point, the first end of the first connection member is electrically connected to the first connection point, and the first end of the second connection member is electrically connected to the second connection point; The first electronic component is located on the sub-board, and the first electronic component is electrically connected between the second end of the first connector and the second end of the second connector; The radiator defines a first gap between the first connection point and the second connection point.

2. The electronic device according to claim 1, characterized in that: The antenna also includes a third connector and a second electronic component, wherein a first end of the third connector is electrically connected to the ground, and the second electronic component is located on the sub-board and electrically connected between a second end of the first connector and a second end of the third connector.

3. The electronic device according to claim 1 or 2, characterized in that: The electronic device further comprises a frame, the frame comprises a first position and a second position, the frame is coupled to the ground at the first position, and the frame has a second gap at the second position; The radiator is a conductor portion of the frame between the first position and the second position.

4. The electronic device according to claim 3, characterized in that: The electronic device further comprises a middle frame and a battery, the middle frame comprises a battery compartment and a middle plate, the battery is located in a space surrounded by the battery compartment, the battery compartment is located on the middle plate, and the middle plate serves as the ground; Wherein, the sub-board is located in a groove surrounded by the first part of the battery compartment, the radiator and the middle board.

5. The electronic device according to claim 4, characterized in that: The electronic device further comprises a first metal member, a second metal member and a third metal member; wherein the first metal member, the second metal member and the third metal member are located in the slot; The first part of the first metal member is welded to the middle plate, and the second part of the first metal member is located between the first end of the first connecting member and the first connecting point; A first portion of the second metal member is welded to the middle plate, and a second portion of the second metal member is located between the first end of the second connecting member and the second connecting point; The first part of the third metal member is welded to the middle plate, and the second part of the third metal member is located between the first end of the third connecting member and the first part of the battery compartment.

6. The electronic device according to claim 5, characterized in that: The first metal piece, the second metal piece and the third metal piece are spring pieces; The first end of the first connecting member is elastically connected to the second part of the first metal member, the first end of the second connecting member is elastically connected to the second part of the second metal member, and the first end of the third connecting member is elastically connected to the second part of the third metal member.

7. The electronic device according to any one of claims 4 to 6, characterized in that: The electronic device further includes a limiting member, and the limiting member, the first part of the battery compartment, the radiator and the middle plate form a closed space.

8. The electronic device according to any one of claims 1 to 7, characterized in that: The first electronic component is located on a first surface or a second surface of the sub-board, the first surface is a surface of the sub-board facing the radiator, and the second surface is a surface of the sub-board facing the battery compartment; The second electronic component is located on the first surface or the second surface.

9. The electronic device according to any one of claims 4 to 8, characterized in that: The distance between the first part of the battery compartment and the radiator is less than or equal to 3 mm.

10. The electronic device according to any one of claims 3 to 9, characterized in that: The length of the conductor portion between the first position and the first slit is shorter than the length of the conductor portion between the second position and the first slit. The length of the minute.

11. The electronic device according to any one of claims 3 to 10, characterized in that: The length of the conductor portion between the first position and the first gap is less than three fifths of the length of the conductor portion between the second position and the first gap.

12. The electronic device according to any one of claims 3 to 11, characterized in that: The frame includes a first side and a second side that intersect at an angle, and the length of the first side is greater than the length of the second side; The first gap is located at the first side, and the distance between the first gap and the midpoint of the first side is greater than 0 mm and less than or equal to 30 mm.

13. The electronic device according to any one of claims 3 to 12, characterized in that: The frame includes a first side and a third side that intersect the second side at an angle, the length of the first side and the third side is greater than the length of the second side, and the first gap or the second gap is located on the first side; The frame has a third slit on the third side, and a distance between the first slit or the second slit and the third slit in a first direction is greater than or equal to 2 mm, and the first direction is an extension direction of the first side.

14. The electronic device according to claim 13, characterized in that: The distance between the third gap and the midpoint of the third side is greater than 0 mm and less than or equal to 30 mm.

15. The electronic device according to any one of claims 2 to 14, characterized in that: The length of the radiator between the first connection point and the first gap is less than or equal to 5 mm, and / or, The length of the radiator between the second connection point and the first gap is less than or equal to 5 mm.

16. The electronic device according to any one of claims 1 to 15, characterized in that: The size of the sub-board in the second direction is less than or equal to 1 mm, and the size of the sub-board in the third direction is less than or equal to 5 mm. The second direction is a direction perpendicular to the extension direction of the sub-board, and the third direction is a thickness direction of the electronic device.

17. An electronic device, characterized in that: include: land; An antenna, comprising a radiator, a sub-board, a first electronic component, a first connector and a second connector; Wherein, the sub-board and the radiator are opposite to each other and do not contact each other; The radiator comprises a first connection point, a first end of the first connection member is electrically connected to the first connection point, and a first end of the second connection member is electrically connected to the ground; The first electronic component is electrically connected between the second end of the first connector and the second end of the second connector; The first electronic component is located on a first surface or a second surface of the sub-board, the first surface is a surface of the sub-board facing the radiator, and the second surface is a surface of the sub-board opposite to the first surface.

18. The electronic device according to claim 17, characterized in that: The electronic device further comprises a frame, the frame comprises a first position and a second position, the frame is coupled to the ground at the first position, and the frame has a first gap at the second position; The radiator is a conductor portion of the frame between the first position and the second position.

19. The electronic device according to claim 18, characterized in that: The electronic device further comprises a middle frame and a battery, the middle frame comprises a battery compartment and a middle plate, the battery is located in a space surrounded by the battery compartment, the battery compartment is located on the middle plate, and the middle plate serves as the ground; Wherein, the sub-board is located in a groove surrounded by the first part of the battery compartment, the radiator and the middle board.

20. The electronic device according to claim 19, characterized in that: The electronic device further comprises a first metal member and a second metal member; wherein the first metal member and the second metal member are located in the groove; The first part of the first metal member is welded to the middle plate, and the second part of the first metal member is located between the first end of the first connecting member and the first connecting point; The first portion of the second metal member is welded to the middle plate, and the second portion of the second metal member is located between the first end of the second connecting member and the first portion of the battery compartment.

Images