Multilayer structure film

Abstract

Provided is a mulltilayer structure film in which a touch sensor and part of a display device are integrated. The multilayer structure film includes: a support; a first electroconductive layer provided on one surface of the support; a second electroconductive layer provided on the other surface of the support, on the side opposite from the one surface; an insulating layer provided on the other surface of the support, the insulating layer covering the second electroconductive layer; a transparent electrode layer provided on the insulating layer; and a structural layer provided on the transparent electrode layer. The first and second electroconductive layers have a mesh pattern. The structural layer is configured from a resin material that is transparent to visible light. The structural layer has a plurality of mutually independent regions partitioned by a partition wall. The insulating layer includes an inorganic layer configured from an oxide, a nitride, an oxynitride, or a carbonized oxide containing an element selected from Si, Al, Ti, and Zr. The thickness of the inorganic layer is 0.02-2 μm.

Description

Laminated structure film

[0001] The present invention relates to a laminated structure film having a support having conductive layers on both sides and a structure layer having a plurality of regions partitioned by partition walls, and in particular to a laminated structure film that partially integrates a touch sensor function and a display function.

[0002] Touch sensors are currently used as input devices. Touch sensors are incorporated into various electronic devices, including tablet computers, smartphones, and other portable information devices. Input operations into electronic devices are performed by touching or bringing a finger or a stylus pen, etc., into close proximity to the touch sensor.

[0003] For example, Patent Document 1 describes a capacitive touch panel. The touch panel in Patent Document 1 includes a light-transmitting substrate, a plurality of mesh-like first electrode patterns provided on a first main surface of the substrate and interconnected along a first direction, a plurality of mesh-like second electrode patterns provided on the first main surface and arranged at intervals from each other along a second direction intersecting the first direction, a jumper insulating layer provided on the first main surface so as to cover intersections between the meshes of the interconnected first electrode patterns, and jumper wiring provided on the jumper insulating layer and electrically connecting adjacent second electrode patterns, and the first electrode patterns interconnected along the first direction are electrically connected at the intersections.

[0004] JP 2014-115694 A

[0005] As described above, touch sensors are incorporated into electronic devices, but they are simply disposed on the surface of the display device, such as an LCD, of the electronic device, and the touch sensor and the display device are separate entities. While there is currently a demand for functional integration of the touch sensor and the display device, there is currently no functionally integrated touch sensor and display device. An object of the present invention is to provide a laminated structure film that integrates a touch sensor and a part of a display device.

[0006] The above-mentioned object can be achieved by the following configuration: Invention [1] is a laminated structure film having a support, a first conductive layer provided on one surface of the support, a second conductive layer provided on the other surface opposite to the one surface of the support, an insulating layer provided on the other surface of the support to cover the second conductive layer, a transparent electrode layer provided on the insulating layer, and a structural layer provided on the transparent electrode layer, the first conductive layer and the second conductive layer have a mesh pattern, the structural layer is made of a resin material that is transparent to visible light, the structural layer has a plurality of independent regions partitioned by partition walls, the insulating layer includes an inorganic layer made of an oxide, nitride, oxynitride, or oxycarbonate containing an element selected from Si, Al, Ti, and Zr, and the inorganic layer has a thickness of 0.02 to 2 μm.

[0007] Invention [2] is the laminated structure film according to Invention [1], wherein the insulating layer is a single layer of an inorganic layer containing polysilazane. Invention [3] is the laminated structure film according to Invention [1] or [2], wherein the inorganic layer contains an oxynitride on the surface. Invention [4] is the laminated structure film according to any one of Inventions [1] to [3], wherein the region of the structure layer is a recess surrounded by a partition wall, and the distance in the thickness direction of the transparent electrode layer from the bottom of the recess to the end of the partition wall opposite the bottom is 20 to 50 μm.

[0008] According to the present invention, it is possible to provide a laminated film in which a touch sensor and a part of a display device are integrated.

[0009] FIG. 1 is a schematic cross-sectional view showing an example of an image display device having a laminated structure film according to an embodiment of the present invention. FIG. 2 is a schematic view showing an example of a touch sensor of the laminated structure film according to an embodiment of the present invention. FIG. 3 is a schematic view showing an example of an electrode configuration of a detection unit of a touch sensor. FIG. 4 is a schematic view showing an example of a mesh pattern shape of a touch sensor. FIG. 5 is a schematic view showing an example of a partition wall pattern of a structure layer of a laminated structure film according to an embodiment of the present invention. FIG. 6 is a schematic cross-sectional view showing one step of a manufacturing method for a laminated structure film according to an embodiment of the present invention. FIG. 7 is a schematic cross-sectional view showing one step of a manufacturing method for a laminated structure film according to an embodiment of the present invention. FIG. 8 is a schematic cross-sectional view showing one step of a manufacturing method for a laminated structure film according to an embodiment of the present invention.

[0010] The laminated structure film of the present invention will be described in detail below based on preferred embodiments shown in the accompanying drawings. Note that the drawings described below are merely illustrative for explaining the present invention, and the present invention is not limited to the drawings shown below. Note that in the following, the range of values ​​indicated by "to" includes the values ​​written on both sides. For example, when ε is a value ε α ~Number ε β That is, the range of ε is the number ε α and the number ε β The range includes ε α ≦ε≦ε β Unless otherwise specified, angles such as "parallel" and "perpendicular" include the error range generally accepted in the relevant technical field. Unless otherwise specified, "transparent" means that the light transmittance is 40% or more, preferably 80% or more, and more preferably 90% or more in the visible light wavelength range of 380 to 780 nm. Furthermore, in the following description, "transparent" means that the material is transparent to visible light, i.e., light in the wavelength range of 380 to 780 nm, unless otherwise specified. The light transmittance is measured using "Plastics - Determination of total luminous transmittance and total luminous reflectance" as specified in JIS (Japanese Industrial Standards) K 7375:2008.

[0011] 1 is a schematic cross-sectional view showing an example of an image display device having a laminated structure film according to an embodiment of the present invention. The image display device 26 has a laminated structure film 10, a sealing layer 22, an adhesive layer 23, and a drive circuit board 24.

[0012] (Laminated Structure Film) The laminated structure film 10 includes a support 12, a first conductive layer 13 provided on one surface 12a of the support 12, a second conductive layer 14 provided on the other surface 12b opposite the one surface 12a of the support 12, an insulating layer 16 provided on the other surface 12b of the support 12 to cover the second conductive layer 14, a transparent electrode layer 17 provided on the insulating layer 16, and a structural layer 18 provided on the transparent electrode layer 17. The first conductive layer 13 and the second conductive layer 14 have a mesh pattern (see FIG. 4 ). The support 12, the first conductive layer 13, and the second conductive layer 14 form a touch sensor 15. The one surface 12a of the support 12 is the side of the touch sensor 15 that comes into contact with a finger, a stylus pen, or the like. The touch sensor 15 has a configuration other than the support 12, the first conductive layer 13, and the second conductive layer 14. The touch sensor 15 will be described in detail later. The transparent electrode layer 17 is provided on the surface 16b of the insulating layer 16. The surface 16b of the insulating layer 16 is the surface of the insulating layer 16 opposite to the support 12.

[0013] The structure layer 18 is made of a resin material that is transparent to visible light. The structure layer 18 has a base 19a and partition walls 19b provided on the base 19a. The base 19a of the structure layer 18 is provided on a surface 17b of the transparent electrode layer 17. The surface 17b of the transparent electrode layer 17 is the surface of the transparent electrode layer 17 opposite to the support 12. The structure layer 18 has a plurality of independent regions 20 partitioned by the partition walls 19b. The regions 20 are recesses 21 that are surrounded by the partition walls 19b. The recesses 21 function as pixels of the display device, as will be described later. Although not shown in FIG. 1, the partition walls 19b extend. FIG. 1 shows the extension direction D of the partition walls 19b. Ｌ1 shows a cross section in a direction Dw orthogonal to the thickness direction Dt of the transparent electrode layer 17. The cross section of the structure layer 18 shown in FIG. 1 corresponds to the cross section taken along line A-A in FIG. 5. In the cross section shown in FIG. 1, for example, the partition walls 19b have flat ends 19c and are trapezoidal in shape with the ends 19c being narrower than the base 19a. The direction Dw is also a direction orthogonal to the thickness direction Dt of the transparent electrode layer 17. The partition walls 19b are arranged side by side in the direction Dw. The thickness direction Dt of the transparent electrode layer 17 and the extending direction D of the partition walls 19b are Ｌ The direction Dw (see FIG. 5 ) and the direction Dw are perpendicular to each other. In this way, the laminated structure film 10 is configured to include a support 12 having a first conductive layer 13 and a second conductive layer 14 on each side thereof, a transparent electrode layer 17, and a structural layer 18 sandwiched between an insulating layer 16, thereby integrating a touch sensor and a part of a display device.

[0014] A sealing layer 22 is provided on the opposite side of the base 19a of the structural layer 18 so as to close the opening of the recess 21. An adhesive layer 23 is provided on the surface 22b of the sealing layer 22. A drive circuit board 24 is adhered to the sealing layer 22 by the adhesive layer 23. In this manner, an image display device 26 is constructed. Note that the surface 22b of the sealing layer 22 is the surface of the sealing layer 22 opposite the structural layer 18. Furthermore, a control unit (not shown) of the touch sensor 15 is provided. The recess 21 of the structural layer 18 is filled with, for example, an electrophoretic ink composition (not shown). As a result, the recess 21 of the structural layer 18 functions as a pixel of the display device, and a display image is obtained as described below, thereby constructing an image display device 26 that combines the touch sensor 15 and the display device. The drive circuit board 24 has, for example, an electrode (not shown) for applying an electric field to the recess 21 of the structural layer 18 using the transparent electrode layer 17 as a common electrode, and a TFT (thin film transistor) for controlling the voltage applied to the electrode. In addition, a controller (not shown) is provided on the drive circuit board 24. The controller controls the TFTs of the drive circuit board 24, thereby controlling the voltage applied to the electrodes. For example, a voltage is applied to the electrodes to generate an electric field between the transparent electrode layer 17 and the electrodes, thereby applying the electric field to the recesses 21 of the structure layer 18. The electric field applied to each recess 21 is controlled, and the movement of the electrophoretic ink composition filled in each recess 21 is controlled to form a display image.

[0015] In the image display device 26, the laminated film 10 is configured so that a display image (not shown) displayed by the recess 21 can be viewed. For example, a protective layer (not shown) covering the first conductive layer 13 is provided on one surface 12a of the support 12. In this case, the surface of the protective layer serves as the touch surface and operation surface of the image display device 26. The configuration of the protective layer is not particularly limited as long as it is transparent and electrically insulating. For example, an optically transparent resin (OCR, Optical Clear Resin) such as a UV (Ultra Violet) curable resin can be used as the protective layer.

[0016] The control unit of the touch sensor 15 described above is configured with known components used for detection by the touch sensor 15. If the touch sensor 15 is of a capacitance type, the control unit detects the position where the capacitance changes due to contact of a finger or the like with the touch surface. Capacitive touch sensors include mutual capacitance type touch sensors and self-capacitance type touch sensors, but are not particularly limited to these. If the touch sensor 15 is of a resistive film type, the control unit detects the position where the resistance changes due to contact of a finger or the like with the touch surface.

[0017] The image display device 26 may further include a cover layer (not shown) on the surface of the protective layer (not shown). In this case, the surface of the cover layer is the touch surface of the image display device 26, and serves as the operation surface. In this case, the surface of the cover layer serves as the operation surface for input operations. The touch surface is a surface that detects contact with a finger, a stylus pen, or the like. The surface of the cover layer serves as the viewing surface for the displayed image (not shown). If the cover layer is made of glass, it is called a cover glass.

[0018] The cover layer protects the laminated structure film 10. The configuration of the cover layer is not particularly limited. The cover layer is preferably transparent so that the display image (not shown) can be seen. Examples of materials that can be used for the cover layer include a plastic film, a plastic plate, and a glass plate. The thickness of the cover layer is preferably selected appropriately depending on the intended use. Examples of materials that can be used for the plastic film and plastic plate include polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN); polyolefins such as polyethylene (PE), polypropylene (PP), polystyrene, and EVA (polyethylene vinyl acetate copolymer); vinyl resins; and other materials such as polycarbonate (PC), polyamide, polyimide, acrylic resin, triacetyl cellulose (TAC), cycloolefin resin (COP), polyvinylidene fluoride (PVDF), polyarylate (PAR), polyethersulfone (PES), polymeric acrylic resin, fluorene derivatives, and crystalline COP. Furthermore, a polarizing plate, a circular polarizing plate, or the like may be used as the cover layer. The surface of the cover layer serves as the touch surface as described above, and therefore may be provided with a hard coat layer if necessary. The thickness of the cover layer is, for example, 0.1 to 1.3 mm, and preferably 0.1 to 0.7 mm.

[0019] Furthermore, the laminated structure film 10 may have a hard coat layer (not shown) between the insulating layer 16 and the transparent electrode layer 17. This increases the adhesion between the insulating layer 16 and the transparent electrode layer 17. The hard coat layer is made of, for example, an ultraviolet curable resin.

[0020] (Touch Sensor) Next, a touch sensor 15 having a first conductive layer 13 and a second conductive layer 14 provided on both sides of a support 12 will be described with reference to FIGS. 2 to 4. FIG. 2 is a schematic diagram showing an example of a touch sensor of a laminated structure film according to an embodiment of the present invention, and FIG. 3 is a schematic diagram showing an example of the electrode configuration of the detection unit of the touch sensor. FIG. 4 is a schematic diagram showing an example of the shape of a mesh pattern of a touch sensor. In FIGS. 2 to 4, components that are the same as those in the laminated structure film 10 shown in FIG. 1 are designated by the same reference numerals, and detailed description thereof will be omitted. The touch sensor 15 shown in FIG. 2 is a part of the laminated structure film 10 and is a portion of the laminated structure film 10 that functions as a detection sensor.

[0021] The touch sensor 15 has a detection area E where a user can perform an input operation. １ and detection area E １ The surrounding area E located outside ２ Detection area E １ is placed in a display area of ​​a display device or the like, and a detection area E １ The surrounding area E located outside ２ is placed in a non-display area of ​​a display device or the like.

[0022] The first conductive layer 13 and the second conductive layer 14 are electrically insulated by the support 12. The support 12 functions as an electrical insulating layer. The first conductive layer 13 and the second conductive layer 14 each have a detection unit 40 and a peripheral wiring unit 42. The detection unit 40 includes, for example, a plurality of first detection electrodes 44 and a plurality of first dummy electrodes 45a arranged between adjacent first detection electrodes 44 and insulated from the first detection electrodes 44. The detection unit 40 also includes, for example, a plurality of second detection electrodes 46 and a plurality of second dummy electrodes 45b arranged between adjacent second detection electrodes 46 and insulated from the second detection electrodes 46. The peripheral wiring unit 42 includes first peripheral wiring 42a, which is wiring for transmitting or transmitting touch drive signals and touch detection signals from a control unit (not shown) to the first detection electrodes 44. The peripheral wiring unit 42 also has second peripheral wiring 42 b that is wiring for transmitting or transferring touch drive signals and touch detection signals from a control unit (not shown) to the second detection electrodes 46 .

[0023] The multiple first detection electrodes 44 are strip-shaped electrodes extending parallel to each other in the X direction, and are provided on one surface 12a of the support 12 at intervals in the Y direction perpendicular to the X direction and electrically insulated from each other in the Y direction. Furthermore, the multiple first dummy electrodes 45a are arranged between the first detection electrodes 44 and are provided on one surface 12a of the support 12 and electrically insulated from the first detection electrodes 44. A first electrode terminal 47 is provided on at least one end of each first detection electrode 44 in the X direction.

[0024] The multiple second detection electrodes 46 are strip-shaped electrodes extending parallel to each other in the Y direction, spaced apart from each other in the X direction, and provided on the other surface 12b (see FIG. 1) of the support 12 while being electrically insulated from each other in the X direction. The multiple second dummy electrodes 45b are arranged between the second detection electrodes 46 and provided on the other surface 12b (see FIG. 1) of the support 12 while being electrically insulated from the second detection electrodes 46. A second electrode terminal 48 is provided at one end of each second detection electrode 46 in the Y direction.

[0025] The plurality of first detection electrodes 44 and the plurality of second detection electrodes 46 are arranged orthogonal to each other, but are electrically insulated from each other by the support 12 as described above. The first dummy electrodes 45a and the second dummy electrodes 45b of the first detection electrodes 44 and the second detection electrodes 46 are separated from the first detection electrodes 44 or the second detection electrodes 46 by disconnections and are thus not electrically connected. Therefore, as described above, the plurality of first detection electrodes 44 are electrically insulated from each other in the Y direction, and the plurality of second detection electrodes 46 are electrically insulated from each other in the X direction. As shown in FIG. 2 , the detection unit 40 has six first detection electrodes 44 and five second detection electrodes 46, but the number is not particularly limited as long as there is more than one.

[0026] The first conductive layer 13 and the second conductive layer 14 are formed, for example, by conductive thin wires 50. The first conductive layer 13 and the second conductive layer 14 have a mesh pattern (see FIGS. 3 and 4), and the mesh pattern is formed by the conductive thin wires 50. The first detection electrode 44 and the second detection electrode 46 are mesh electrodes having a mesh pattern made of the conductive thin wires 50. In this case, the first dummy electrode 45a and the second dummy electrode 45b are also mesh dummy electrodes having a mesh pattern made of the conductive thin wires 50. The electrode width of the first detection electrode 44 and the electrode width of the second detection electrode 46 are, for example, 1 to 5 mm, and the inter-electrode pitch is 3 to 6 mm. The electrode width of the first detection electrode 44 is the maximum length in the Y direction, and the electrode width of the second detection electrode 46 is the maximum length in the X direction.

[0027] In the peripheral wiring section 42, one end of the first peripheral wiring 42a is electrically connected to the first detection electrode 44 via the first electrode terminal 47, and the other end is electrically connected to the first external connection terminal 49a. Furthermore, one end of the second peripheral wiring 42b is electrically connected to the second detection electrode 46 via the second electrode terminal 48, and the other end is electrically connected to the second external connection terminal 49b. A flexible circuit board 43 is electrically connected to the first external connection terminal 49a and the second external connection terminal 49b. The flexible circuit board 43 is electrically connected to the above-mentioned control unit (not shown).

[0028] The first peripheral wiring 42a and the second peripheral wiring 42b can also have the same configuration as the first detection electrode 44 and the second detection electrode 46, and are composed of conductive thin wires 50. The first electrode terminal 47 and the second electrode terminal 48 may have a solid film shape or a mesh shape as shown in JP 2013-127658 A. The preferred range of the width of the first electrode terminal 47 and the second electrode terminal 48 is 1 / 3 to 1.2 times the electrode width of the first detection electrode 44 and the second detection electrode 46, respectively.

[0029] In the first conductive layer 13 and the second conductive layer 14, it is preferable that the detection section 40 and the peripheral wiring section 42 are integrally formed from the viewpoints of electrical resistance and the resistance to breakage, and it is even more preferable that they are formed from the same metal material.

[0030] Each part of the laminated structure film will be described below. <Support> The support supports the first conductive layer and the second conductive layer, and electrically insulates the first conductive layer 13 from the second conductive layer 14 as described above. There are no particular limitations on the support as long as it can support the first conductive layer and the second conductive layer and electrically insulate the first conductive layer 13 from the second conductive layer 14. The support may be, for example, a resin substrate or a glass substrate. More specifically, examples of materials constituting the support include glass, reinforced glass, alkali-free glass, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), cycloolefin polymer (COP), cyclic olefin copolymer (COC), polycarbonate (PC), acrylic resin, polyethylene (PE), polypropylene (PP), polystyrene (PS), polyvinyl chloride (PVC), and polyvinylidene chloride (PVDC). For example, cellulose acetate (TAC), triacetyl cellulose (TAC), or the like can be used. The thickness of the support is preferably 20 μm to 1100 μm, and more preferably 20 μm to 500 μm. In particular, in the case of an organic resin substrate such as PET, the thickness is preferably 20 μm to 200 μm, and more preferably 30 μm to 100 μm.

[0031] The total light transmittance of the support is preferably 40 to 100%, more preferably 85 to 100%. That is, the support is preferably transparent to visible light. The total light transmittance is measured, for example, using "Plastics - Determination of total light transmittance and total light reflectance" as defined in JIS (Japanese Industrial Standards) K 7375:2008.

[0032] One preferred embodiment of the support is a treated substrate that has been subjected to at least one treatment selected from the group consisting of atmospheric pressure plasma treatment, corona discharge treatment, and ultraviolet irradiation treatment. By performing the above treatment, hydrophilic groups such as OH groups are introduced into the surface of the treated support. This improves the adhesion between the support and the first conductive layer and the adhesion between the support and the second conductive layer. Among the above treatments, atmospheric pressure plasma treatment is preferred because it further improves the adhesion between the support and the first conductive layer and the adhesion between the support and the second conductive layer.

[0033] <Undercoat Layer> To improve the adhesion between the support and the first conductive layer and the adhesion between the support and the second conductive layer, an undercoat layer can be disposed between the support and the first conductive layer and between the support and the second conductive layer. This undercoat layer contains a polymer, which further improves the adhesion between the support and the first conductive layer and the second conductive layer. The method for forming the undercoat layer is not particularly limited, but examples include a method in which a polymer-containing undercoat layer-forming composition is applied to the substrate and, if necessary, subjected to a heat treatment. Furthermore, examples of polymer-containing undercoat layer-forming compositions that can be used include gelatin, acrylic resin, urethane resin, and acrylic-styrene latex containing inorganic or polymeric fine particles.

[0034] If necessary, a refractive index adjusting layer may be provided between the support and the first conductive layer and between the support plate and the second conductive layer, in addition to the undercoat layer described above. As the refractive index adjusting layer, for example, an organic layer to which particles of a metal oxide such as zirconium oxide that adjusts the refractive index are added can be used.

[0035] <Conductive Thin Wires> As described above, the conductive thin wires 50 constitute the first conductive layer 13 (see FIG. 1) and the second conductive layer 14 (see FIG. 1). The conductive thin wires 50 constitute the first detection electrode 44 (see FIG. 2), the first peripheral wiring 42a (see FIG. 2), the second detection electrode 46 (see FIG. 2), and the second peripheral wiring 42b (see FIG. 2). As shown in FIG. 4, a mesh pattern is formed by the linear conductive thin wires 50. The thickness of the conductive thin wires 50 is preferably 350 to 1000 nm, and more preferably 600 to 900 nm. If the thickness of the conductive thin wires 50 is 350 to 1000 nm, the electrical resistance of the conductive thin wires 50 is smaller. If the thickness of the conductive thin wires 50 is 600 to 900 nm, the electrical resistance of the conductive thin wires 50 is further reduced, and this is more preferable. Furthermore, a thick conductive thin wire 50 results in more voids and improved bendability, so it is preferable that the conductive thin wire 50 be thick. The width Wc (see FIG. 4) of the conductive thin wire 50 is preferably 1.5 to 4.0 μm, more preferably 1.5 to 3.0 μm, and even more preferably 1.5 to 2.5 μm. If the width Wc of the conductive thin wire 50 is 1.5 to 4.0 μm, it becomes less visible and the occurrence of moire and the like is suppressed. In other words, visibility is excellent. Furthermore, if the width Wc of the conductive thin wire 50 is narrow, it results in more voids and improved bendability, so it is preferable that the width Wc of the conductive thin wire 50 is narrow.

[0036] The thickness and width Wc of the conductive thin wires 50 are measured by cutting the first conductive layer 13, the support 12, and the second conductive layer 14, and using a cross-sectional image of the cut surface with a scanning electron microscope (SEM). In the cross-sectional image, lengths corresponding to the thickness and width Wc of the conductive thin wires 50 are measured at 10 locations in the image area corresponding to the conductive thin wires 50, and the average values ​​of the measurements at the 10 locations are calculated. The thickness and width Wc of the conductive thin wires 50 are each the average values ​​of the measurements at the 10 locations.

[0037] The conductive thin wires constituting the first conductive layer and the second conductive layer are not particularly limited as long as they are made of a conductive material. The conductive thin wires are, for example, made of a material containing metallic silver and a polymer binder such as gelatin or acrylic-styrene latex. Alternatively, the conductive thin wires may be made of a metal, as described below. The conductive thin wires may also be made of a material containing metal oxide particles, metal pastes such as silver paste and copper paste, and metal nanowire particles such as silver nanowires and copper nanowires. <<Metal Thin Wires>> The conductive thin wires are, for example, made of a metal. In this case, the conductive thin wires are thin metal wires. The metal thin wires are made of metals or alloys such as gold (Au), silver (Ag), copper (Cu), aluminum (Al), molybdenum (Mo), and titanium (Ti). Among these, silver or copper is preferred due to their excellent conductivity, and copper or a copper alloy is more preferred. The metal thin wires are not limited to being made of a single metal, and may have a multilayer structure consisting of only metals without layers such as oxides. Examples include a laminated structure of molybdenum, copper, and molybdenum, or molybdenum, aluminum, and molybdenum. When the thin metal wire is made of copper, examples include simple copper (metallic copper) and a mixture containing copper and a metal other than copper (copper alloy), with simple copper being preferred. Examples of metals other than copper contained in copper alloys include silver, gold, aluminum, nickel, molybdenum, chromium, and palladium.

[0038] <<Blackening Layer>> The blackening layer, for example, reduces the reflectance of the conductive thin wires and is particularly effective when the conductive thin wires are made of metal. The blackening layer can be composed of copper nitride, copper oxide, copper oxynitride, molybdenum oxide, AgO, Pd, carbon, or other nitrides or oxides. The blackening layer is formed on the visible side of the conductive thin wires, i.e., on the surface of the conductive thin wires arranged on one surface 12a of the support 12.

[0039] <<Method for forming first conductive layer and second conductive layer>> Next, a method for forming the first conductive layer and the second conductive layer will be described. The first conductive layer and the second conductive layer can be formed by, for example, a sputtering method, a plating method, a silver halide method, a printing method, or the like.

[0040] A method for forming a first conductive layer and a second conductive layer by sputtering will be described. First, a layer of conductive material is formed by sputtering, and then the conductive material layer is patterned by photolithography, thereby forming the first conductive layer and the second conductive layer. Note that instead of sputtering, the conductive material layer can also be formed by so-called vapor deposition. In addition to sputtering or vapor deposition, electrolytic metal foil can also be used as the conductive material layer. More specifically, the process for forming copper wiring described in JP 2014-029614 A can be used.

[0041] A method for forming the first conductive layer and the second conductive layer by plating will be described. For example, the first conductive layer and the second conductive layer can be formed using a metal plating film formed on an electroless plating base layer by electroless plating the base layer. In this case, the first conductive layer and the second conductive layer are formed by forming a pattern on the substrate with a catalyst ink containing at least metal fine particles, and then immersing the substrate in an electroless plating bath to form a metal plating film. More specifically, the method for manufacturing a metal-coated substrate described in JP 2014-159620 A can be used.

[0042] The first conductive layer and the second conductive layer are formed by forming a pattern on a substrate of a resin composition having functional groups capable of interacting with at least a metal catalyst precursor, then applying a catalyst or catalyst precursor, and immersing the substrate in an electroless plating bath to form a metal plating film. More specifically, the method for manufacturing a metal-coated substrate described in JP 2012-144761 A can be applied. The first conductive layer and the second conductive layer may also be formed by electroless plating on a wiring pattern formed by a silver salt method. In this case, the first conductive layer and the second conductive layer are formed by forming a metal plating film by applying electroless silver or copper plating to a pattern made of silver particles formed in a process including exposing, developing, and optionally further removing gelatin from a film coated with a photographic material. More specifically, the manufacturing methods described in WO 2020 / 158494, WO 2021 / 059812, and WO 2021 / 065226 can be applied.

[0043] A method for forming the first conductive layer and the second conductive layer by the silver salt method will be described. First, a silver halide-containing silver salt emulsion layer is subjected to an exposure process using an exposure pattern that will become the first conductive layer and the second conductive layer, and then a development process is performed, thereby forming the first conductive layer and the second conductive layer. More specifically, the methods for manufacturing the first conductive layer and the second conductive layer described in JP-A-2012-006377, JP-A-2014-112512, JP-A-2014-209332, JP-A-2015-022397, JP-A-2016-192200, and WO 2016 / 157585 can be used.

[0044] A method for forming a first conductive layer and a second conductive layer by a printing method will be described. First, a conductive paste containing a conductive powder is applied to a substrate in the same pattern as the first conductive layer and the second conductive layer, and then a heat treatment is performed to form the first conductive layer and the second conductive layer. Pattern formation using the conductive paste is performed, for example, by an inkjet method or a screen printing method. More specifically, the conductive paste described in JP 2011-028985 A can be used as the conductive paste. Furthermore, thin metal wires are formed as the thin conductive wires using the above-mentioned method for forming the first conductive layer and the second conductive layer.

[0045] Other methods for forming the first conductive layer and the second conductive layer include a method of obtaining a conductive pattern by treating a conductive material precursor in a film, as described in, for example, JP 2013-012604 A or JP 2020-017381 A. Also available for forming the first conductive layer and the second conductive layer are a method of forming a patterned layer containing conductive fine particles, as described in JP 2013-225489 A, and a method of applying a patterned plating layer on a resin layer, as described in JP 2006-222163 A.

[0046] <Mesh Pattern> As described above, the first detection electrode 44 and the second detection electrode 46 have a mesh pattern (see FIGS. 3 and 4 ) in which a plurality of linear conductive thin wires 50 intersect. From the viewpoint of visible light transmittance, the mesh pattern formed by the conductive thin wires 50 preferably has an aperture ratio of 90% or more, and more preferably 95% or more. The aperture ratio corresponds to the percentage of the transparent portion excluding the conductive thin wires in the region where the conductive layer is provided, i.e., the percentage of the openings in the entire region where the conductive layer is provided. The first peripheral wiring 42 a and the second peripheral wiring 42 b may also have a mesh pattern in which a plurality of conductive thin wires 50 intersect.

[0047] When the first detection electrode 44 and the second detection electrode 46, and the first peripheral wiring 42a and the second peripheral wiring 42b are configured to have a mesh pattern, the mesh pattern is not particularly limited, and is preferably a geometric shape combining a triangle such as an equilateral triangle, an isosceles triangle, or a right-angled triangle; a quadrangle such as a square, a rectangle, a rhombus, a parallelogram, or a trapezoid; a regular n-gon such as a regular hexagon or a regular octagon; a circle, an ellipse, or a star. The "mesh" in the mesh pattern refers to a shape including a plurality of openings 51 formed by intersecting thin conductive wires 50. The openings 51 are open areas surrounded by the thin conductive wires 50. In FIG. 3 , the openings 51 have a rhombus shape, but may have other shapes. For example, they may be polygonal (e.g., triangular, quadrangular, hexagonal, or random polygonal). Furthermore, the shape of one side may be straight, curved, or arc-shaped. When the shape is arc-shaped, for example, two opposing sides may be arc-shaped convex outward, and the other two opposing sides may be arc-shaped convex inward. Furthermore, the shape of each side may be a wavy line in which an outwardly convex arc and an inwardly convex arc are connected. Of course, the shape of each side may be a sine curve. The mesh pattern is not particularly limited, and may be a random pattern or a regular pattern, or may be a regular mesh pattern in which multiple congruent shapes are repeatedly arranged.

[0048] The mesh pattern is preferably a regular mesh pattern having identical diamond lattices. The length of one side of the diamond, i.e., the length W of one side of the opening 51 (see FIGS. 3 and 4), is preferably 50 to 1500 μm, more preferably 150 to 800 μm, and even more preferably 200 to 600 μm from the perspective of visibility. When the length W of one side of the opening 51 is within the above-mentioned range, it is possible to maintain good transparency, and the displayed image can be viewed without any discomfort in the laminate structure film 10 (see FIG. 1). The mesh pattern of the conductive thin wires can be observed and measured using an optical microscope (Keyence Corporation Digital Microscope VHX-7000).

[0049] <Insulating Layer> The insulating layer 16 electrically insulates the second conductive layer 14 of the support 12 from the transparent electrode layer 17. The insulating layer 16 also prevents moisture from penetrating into the transparent electrode layer and the structural layer. The insulating layer includes an inorganic layer composed of an oxide, nitride, oxynitride, or oxycarbide containing an element selected from Si, Al, Ti, and Zr. Specifically, the insulating layer includes an inorganic layer composed of silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, aluminum nitride, aluminum oxynitride, titanium oxide, titanium nitride, titanium oxynitride, zirconium oxide, zirconium nitride, or zirconium oxynitride. By including the inorganic layer, the insulating layer can achieve the above-mentioned electrical insulation and moisture penetration prevention. The insulating layer can also be composed of an inorganic layer containing, for example, silicon nitride and silicon oxynitride. In this case, the silicon oxynitride is included on the surface of the inorganic layer, i.e., on the surface 16b of the insulating layer 16 (see FIG. 1 ). The thickness H of the inorganic layer (see FIG. 1) is 0.02 (20 nm) to 2 μm. If the thickness of the inorganic layer is 0.02 to 2 μm, the above-mentioned electrical insulation and prevention of moisture penetration can be achieved without increasing the thickness of the laminated structure film. The thickness H of the inorganic layer (see FIG. 1) is measured by cutting the laminated structure film 10 and using a cross-sectional image of the cut surface taken with a scanning electron microscope. In the cross-sectional image, the length corresponding to the thickness H of the insulating layer 16 is measured at 10 points in the image area corresponding to the insulating layer 16, and the average value of the measured values ​​at 10 points is calculated. The thickness H of the insulating layer 16 is the average value of the measured values ​​at the 10 points.

[0050] The method for forming the insulating layer is not particularly limited. Examples of methods for forming the insulating layer include coating a composition containing an insulating material or a precursor thereof, and optionally removing volatiles, or heating, exposing, etc. Other examples of methods for forming the insulating layer include vapor deposition and sputtering. In laminated structure films, when the support or other layers have poor heat resistance, methods such as those described in JP 2008-159824 A may be used. Furthermore, the insulating layer preferably has a single-layer structure of an inorganic layer containing polysilazane, which is a silicon nitride. In this case, the polysilazane is a cured product. The inorganic layer containing polysilazane may have a structure containing, for example, SiON (silicon oxynitride) on the surface. The method for forming the inorganic layer containing polysilazane will be described later.

[0051] Polysilazanes are polymers having two or more repeating units of (-Si-N-), and in this chemical formula, the remaining two bonds of the silicon atom (tetravalent) and the remaining bond of the nitrogen atom (trivalent) may each be bonded to a hydrogen atom or an organic group (such as an alkyl group). Polysilazanes may be polymers having a linear structure consisting only of the repeating units, or may be polymers having a cyclic structure formed by bonding one or both of the remaining two bonds of the silicon atom to the bond of the nitrogen atom. The polymer may be composed of repeating cyclic structures only, or may be a linear polymer having a cyclic structure in part.

[0052] Furthermore, an inorganic layer or resin layer having a different composition from the insulating layer may be provided adjacent to the insulating layer, or, when two or more insulating layers are provided, sandwiched between the two insulating layers. In particular, providing a thin resin layer is preferable in terms of imparting resistance to bending. The properties required of such a resin are preferably a low dielectric constant, a low dielectric loss tangent, and low moisture absorption, and also preferably high transparency to visible light. Known materials for such resins include polyolefins, cycloolefin polymers, polyacrylates, polycarbonates, polyamides, and polyimides. High flexibility is particularly preferable, and polyolefins, cycloolefin polymers, polyacrylates, fluorine-containing polyimides, and the like are preferably used. The thickness of each thin resin layer is preferably in the range of 0.2 to 5 μm, more preferably 0.5 to 2.5 μm, from the viewpoint of improving resistance to bending. When the thickness of each thin resin layer is within the above-mentioned range, not only can it be made thin, but it also has the effect of dispersing bending stress and minimizing the difference in curvature change between layers, thereby imparting high bending resistance.

[0053] <Transparent Electrode Layer> The transparent electrode layer functions as a common electrode for driving the electrophoretic ink composition or liquid crystal composition filled in the recesses of the structure layer. The transparency of the transparent electrode layer is as described above. Examples of materials constituting the transparent electrode layer include ITO (Indium Tin Oxide), n-doped In (nitrogen), and the like. ２ O ３ , crystalline ITO and amorphous ITO, IFO (fluorine (F) doped In ２ O ３ ), tin oxide (SnO ２ ), ATO (antimony (Sb) doped SnO ２ ), FTO (fluorine (F) doped SnO ２ ), aluminum (Al) doped ZnO, boron (B) doped ZnO, gallium (Ga) doped ZnO, IZO (Indium Zinc Oxide), titanium oxide (TiO ２ ), spinel oxide, YbFe ２ O ４An oxide having a structure can be used. Other materials constituting the transparent electrode layer include conductive polymers such as polyaniline, polypyrrole, and polythiophene. Examples of methods for forming the transparent electrode layer include PVD (Physical Vapor Deposition) methods such as vacuum deposition, reactive deposition, sputtering, electron beam deposition, and ion plating. Other methods for forming the transparent electrode layer include CVD (Chemical Vapor Deposition) methods including MOCVD (Metal Organic Chemical Vapor Deposition), pyrosol methods, methods involving thermal decomposition of organometallic compounds, spraying, dipping, electroless plating, and electrolytic plating. Other methods for forming the transparent electrode layer include coating methods and methods involving mixing a conductive agent with a solvent or a synthetic resin binder and coating the mixture.

[0054] <Structure Layer> The structure layer constitutes pixels for obtaining a display image. The structure layer constitutes, for example, a part of electronic paper, which is a display device. As described above, the plurality of recesses are filled with, for example, an electrophoretic ink composition. As the electrophoretic ink composition, ink compositions described in, for example, Japanese Patent Publication No. 2010-210812, Japanese Patent Publication No. 2013-174821, Japanese Patent Publication No. 2014-21176, Japanese Patent Publication No. 2014-77968, Japanese Patent Publication No. 2017-15901, etc., can be used. The structure layer is made of a resin material that is transparent to visible light. Therefore, the display image composed of pixels can be viewed. Specific examples of resin materials that are transparent to visible light include acrylic resin, polycarbonate, polyurethane, epoxy resin, melamine resin, polyamide, polyimide, polysulfonamide, polysulfinate, polyvinyl acetate, phenolic resin, polyolefin, cycloolefin polymer, polybutadiene, etc. As the resin material transparent to visible light, the materials described in Japanese Patent Publication No. 2017-58581, Japanese Patent Application Laid-Open No. 2013-235063, and Japanese Patent Application Laid-Open No. 2003-208107 can also be suitably used. Furthermore, a resin material transparent to visible light does not mean that the structure layer itself is transparent to visible light, but that the resin material used to manufacture the structure layer is transparent to visible light.

[0055] The method for forming the structure layer is not particularly limited, and examples thereof include lithography, 3D (dimensional) printing, self-assembly, and imprinting. Among these, imprinting is preferred because of its excellent productivity. For example, the method for forming a concave-convex shape described in paragraph

[0198] of WO 2018 / 084289 can be preferably used.

[0056] As described above, the structure layer 18 has a plurality of recesses 21 surrounded by partition walls 19b. The surface 19d of the base 19a corresponds to the bottom surface 21b of the recesses 21. The surface 19d of the base 19a is flat, and the bottom surface 21b of the recesses 21 is also flat. FIG. 5 is a schematic diagram showing an example of a partition wall pattern in the structure layer of the laminate structure film according to an embodiment of the present invention. FIG. 5 shows the pattern of the partition walls 19b when the structure layer 18 is viewed from one surface 12a of the laminate structure film 10. Note that FIG. 5 does not illustrate the base 19a of the structure layer 18. For example, as shown in FIG. 5, the recesses 21 surrounded by partition walls 19b have a regular hexagonal shape. Although not shown in FIG. 5, the regular hexagonal recesses 21 are arranged in a honeycomb pattern on the surface 17b (see FIG. 1) of the transparent electrode layer 17 (see FIG. 1). That is, the partition walls 19b are provided on the surface 17b (see FIG. 1) of the transparent electrode layer 17 (see FIG. 1) so as to form the sides of a regular hexagon. The shape of the recesses 21 is not limited to a regular hexagon, and may be a triangle, a square, a circle, or an ellipse. From the viewpoint of being able to arrange the recesses 21 without gaps on a plane, the shape of the recesses 21 is preferably an equilateral triangle or a square, other than a regular hexagon.

[0057] Furthermore, in the structure layer, the recess 21 preferably has a distance in the thickness direction Dt of the transparent electrode layer 17 from the bottom surface 21b of the recess 21 to the end 19c of the partition wall 19b opposite the bottom surface 21d of 20 to 50 μm. The distance in the thickness direction Dt of the transparent electrode layer 17 from the bottom surface 21b of the recess 21 to the end 19c of the partition wall 19b opposite the bottom surface 21d represents the depth of the recess 21. If the distance in the thickness direction Dt of the transparent electrode layer 17 from the bottom surface 21b of the recess 21 to the end 19c of the partition wall 19b opposite the bottom surface 21d is 20 to 50 μm, this is preferable in that it can shorten the time required for electrophoresis and speed up response while ensuring contrast. The end 19c of the partition 19b opposite the bottom surface 21d refers to the portion of the partition 19b that is farthest from the bottom surface 21d of the recess 21, i.e., the surface 19d of the base 19a, in a direction perpendicular to the surface 19d of the base 19a. The end 19c of the partition 19b opposite the base 19a is flat, and the flat portion is the end 19c. If the end 19c of the partition 19b opposite the base 19a is pointed, the tip of the pointed portion is the end 19c. The size of the recess 21 is, for example, in the range of 2 to 200 μm, more preferably in the range of 5 to 100 μm, and particularly preferably in the range of 10 to 60 μm. This range can prevent chipping of the partition and unevenness in thickness and size when forming a structure layer, and can provide sufficient resolution for visual recognition.

[0058] The cross-sectional shape of the partition wall 19b shown in FIG. 1 is, for example, a trapezoidal shape in which the end 19c is narrower than the base 19a, but is not limited thereto. The cross-sectional shape of the partition wall 19b shown in FIG. 1 may be, for example, a triangular, rectangular, or square shape. For example, in the cross-sectional shape shown in FIG. 1, the length of the partition wall 19b in the thickness direction Dt of the transparent electrode layer 17 (thickness of the transparent electrode layer) can be appropriately set depending on the sheet resistance value or transparency, but is preferably in the range of approximately 100 to 5000 angstroms. The length of the partition wall 19b in the direction perpendicular to the thickness direction Dt of the transparent electrode layer 17 is preferably in the range of 2 to 200 μm. The direction perpendicular to the thickness direction Dt of the transparent electrode layer 17 is the extension direction D of the partition wall 19b described above. Ｌ (see FIG. 5) is a direction Dw perpendicular to the direction of the arrows.

[0059] Unless otherwise specified, the thickness of each layer constituting the laminated structure film is measured by obtaining a cross-sectional image of the cross section of the laminated structure film using a scanning electron microscope, measuring 10 points at each location corresponding to the thickness of each layer, and the average value of each of the 10 points is taken as the thickness of each layer constituting the laminated structure film.

[0060] (Manufacturing Method of Laminated Structure Film) Next, a manufacturing method of the laminated structure film 10 will be described. FIGS. 6 to 10 are schematic cross-sectional views showing, in order of steps, an example of a manufacturing method of a laminated structure film according to an embodiment of the present invention. In FIGS. 6 to 10, components identical to those in the image display device 26 shown in FIG. 1 are designated by the same reference numerals, and detailed descriptions thereof will be omitted. First, as shown in FIG. 6, a first conductive layer 13 is formed on one surface 12a of a support 12, and a second conductive layer 14 is formed on the other surface 12b of the support 12. The first conductive layer 13 and the second conductive layer 14 have, for example, the configuration shown in FIG. 2. As described above, the first conductive layer 13 and the second conductive layer 14 are formed by, for example, sputtering, vapor deposition, plating, silver halide deposition, printing, or the like. More specifically, a 40 μm-thick elongated PET film is prepared as the support, and both surfaces of the support are subjected to a corona discharge treatment to make the surface hydrophilic. A first conductive layer 13 and a second conductive layer 14 having a mesh pattern are formed on both sides of the support using, for example, the manufacturing method of Example 1 described in JP-A-2020-17381.

[0061] Next, as shown in FIG. 7 , an insulating layer 16 covering the second conductive layer 14 is formed on the other surface 12b of the support 12. The insulating layer 16 is formed, for example, by applying a polysilazane compound dissolved in a solvent to the other surface 12b of the support 12, covering the second conductive layer 14, and then partially removing the solvent from the coating by blowing air. Then, in a heated atmosphere, a dry oxygen and nitrogen mixed gas is irradiated with an ultraviolet lamp to generate ozone, and the ozone-containing gas is sprayed onto the coating. This results in the formation of an inorganic layer having a surface of SiON (silicon oxynitride) and an interior of SiN (silicon nitride). The surface of the inorganic layer is the side of the insulating layer 16 opposite the support 12, i.e., the surface 16b of the insulating layer 16 facing the transparent electrode layer 17 (see FIGS. 1 and 8 ). Next, a 0.1 μm-thick ultraviolet-curable hard coat layer (not shown) is formed on the surface of the inorganic layer, i.e., the surface 16b of the insulating layer 16. The ultraviolet-curable hard coat layer is formed, for example, by applying an ultraviolet-curable resin to the surface 16b of the insulating layer 16 and then curing it by irradiating it with ultraviolet light. Next, as shown in FIG. 8 , an ITO film having a thickness of 25 nm is formed on the surface of the ultraviolet-curable hard coat layer (not shown) by, for example, a sputtering method as the transparent electrode layer 17.

[0062] Next, for example, the following composition is applied to the surface 17b of the transparent electrode layer 17 to form a coating film 30 as shown in FIG. 9 . When the coating film 30 hardens, it becomes the base 19a. A shaping roll 32 is prepared, having recesses 33 on its surface 32a, each having a shape and pattern based on the partition walls 19b and the arrangement pattern of the partition walls 19b to be formed. Next, the recesses 33 of the shaping roll 32 are filled with the following composition 34. Next, while the shaping roll 32 is wrapped around the surface 32a so that the surface 32a is in contact with the coating film 30, exposure is performed from the support 12 side using an air-cooled metal halide lamp (manufactured by Eye Graphics Co., Ltd.) with an input power of 200 W / cm at an irradiation dose of 500 mJ / cm. At this time, the composition 34 in the recesses 33 of the shaping roll 32 is transferred to the coating film 30 in a shape corresponding to the recesses 33 and exposed. The coating film 30 is also exposed. 10, the coating film 30 is cured to form the base 19a, and the transferred composition 34 is cured to form the partition walls 19b, thereby forming the structure layer 18. In this manner, the laminated structure film 10 can be formed.

[0063] The recesses 21 in the structure layer 18 are regular hexagons with sides measuring 25 μm. When the structure layer 18 is viewed from one surface 12 a of the laminate structure film 10, the regular hexagonal recesses 21 are arranged in a honeycomb pattern as shown in FIG. 5 . The distance in the thickness direction of the transparent electrode layer from the bottom surface 21 b of the recess 21 to the end 19 c of the partition wall 19 b on the opposite side from the bottom surface 21 d is 25 μm. That is, the depth of the recess 21 is 25 μm, and the thickness of the partition wall 19 b separating the recesses 21 is 5 μm at the midpoint of each side of the regular hexagon.

[0064] (Composition) Urethane (meth)acrylate (U-4HA, manufactured by Shin-Nakamura Chemical Co., Ltd.) 49 parts by mass Tricyclodecane dimethanol diacrylate A-DCP (manufactured by Shin-Nakamura Chemical Co., Ltd.) 49 parts by mass Photopolymerization initiator (Irgacure TPO, manufactured by BASF) 2 parts by mass

[0065] (Uses of Laminated Structure Film) The laminated structure film 10 described above can be used, for example, in the image display device 26 shown in FIG. 1 . Alternatively, the laminated structure film 10 can be used, for example, in an active color modulation element having a colorable liquid crystal composition (not shown) filled in the recesses 21 of the structure layer 18, a sealing layer 22 sealing the openings of the recesses 21 shown in FIG. 1 , a drive circuit board 24 provided on the sealing layer 22 side, and a control unit (not shown) connected to the first conductive layer 13 and the second conductive layer 14. The colorable liquid crystal composition may be a liquid crystal composition containing a liquid crystal compound that absorbs light in the visible light range and exhibits dichroism. The colorable liquid crystal composition may also be a liquid crystal composition (so-called host-guest composition) that contains a liquid crystal compound that does not absorb light in the visible light range and a non-liquid crystal compound that absorbs light in the visible light range and exhibits dichroism, in which the non-liquid crystal compound is oriented depending on the orientation state of the liquid crystal compound. Known compositions can be used for such compositions. The above-mentioned laminated structure film 10 can be used, for example, in an active scattering modulation element including a liquid crystal composition (not shown) filled in the recess 21 of the structure layer 18, a sealing layer 22 that seals the opening of the recess 21 shown in Figure 1, a drive circuit board 24 provided on the sealing layer 22 side, and a control unit (not shown) connected to the first conductive layer 13 and the second conductive layer 14. The above-mentioned laminated structure film 10 can be used, for example, in an active microlens array element including a liquid crystal composition (not shown) filled in the recess 21 of the structure layer 18, a sealing layer 22 that seals the opening of the recess 21 shown in Figure 1, a drive circuit board 24 provided on the sealing layer 22 side, and a control unit (not shown) connected to the first conductive layer 13 and the second conductive layer 14, and in which the recess 21 is hemispherical or dome-shaped.

[0066] The present invention is basically configured as described above. Although the laminated structure film of the present invention has been described in detail above, the present invention is not limited to the above-described embodiment, and various improvements and modifications may be made without departing from the spirit and scope of the present invention.

[0067] REFERENCE SIGNS LIST 10 Laminated structure film 12 Support 12a One surface 12b Other surface 13 First conductive layer 14 Second conductive layer 15 Touch sensor 16 Insulating layer 16b, 17b Surface 17 Transparent electrode layer 18 Structure layer 19a Base 19b Partition wall 19c End 19d Surface 20 Region 21 Recess 21b Bottom surface 22 Sealing layer 22b Surface 23 Adhesive layer 24 Drive circuit board 26 Image display device 30 Coating film 32 Shaping roll 32a Surface 33 Recess 34 Composition 40 Detection unit 42 Peripheral wiring unit 42a First peripheral wiring 42b Second peripheral wiring 43 Flexible circuit board 44 First detection electrode 45a First dummy electrode 45b Second dummy electrode 46 Second detection electrode 47 First electrode terminal 48 Second electrode terminal 49a First external connection terminal 49b Second external connection terminal 50 Conductive thin wire 51 Opening Dt Thickness direction E １ Detection area E ２ Surrounding area H thickness

Claims

1. A laminated structure film comprising: a support; a first conductive layer provided on one surface of the support; a second conductive layer provided on the other surface opposite to the one surface of the support; an insulating layer provided on the other surface of the support to cover the second conductive layer; a transparent electrode layer provided on the insulating layer; and a structural layer provided on the transparent electrode layer, wherein the first conductive layer and the second conductive layer have a mesh pattern, the structural layer is made of a resin material that is transparent to visible light, the structural layer has a plurality of independent regions separated from each other by partitions, the insulating layer includes an inorganic layer composed of an oxide, nitride, oxynitride, or oxycarbide containing an element selected from Si, Al, Ti, and Zr, and the inorganic layer has a thickness of 0.02 to 2 μm.

2. The laminated film according to claim 1, wherein the insulating layer is a single layer of the inorganic layer containing polysilazane.

3. The laminated film according to claim 1 or 2, wherein the inorganic layer contains the oxynitride on the surface.

4. A laminated structure film as described in claim 1 or 2, wherein the region of the structure layer is a recess surrounded by the partition wall, and the distance in the thickness direction of the transparent electrode layer from the bottom surface of the recess to the end of the partition wall opposite the bottom surface is 20 to 50 μm.

Images