Electronic device comprising antenna module

Abstract

The present disclosure relates to an electronic device. The electronic device according to one embodiment of the present disclosure comprises: a housing including a side wall, the side wall including a recess recessed from the outer surface of the housing; a non-conductive cap which is arranged in the recess and which includes a protruding portion passing through the recess; an antenna module which faces the cap with respect to the recess and which includes a plurality of antenna elements arranged to face the recess; and a bracket, which is arranged inside the housing, has the antenna module placed therein, and includes a coupling hole into which the protruding portion is inserted.

Description

Electronic device including an antenna module

[0001] The present disclosure relates to an electronic device, for example, an electronic device including an antenna module.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. In particular, recent electronic devices are being developed to enable portable communication.

[0003] Electronic devices can refer to devices that perform specific functions based on their embedded programs, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and car navigation systems. For example, these electronic devices can output stored information as audio or video.

[0004] As the integration of electronic devices increases and ultra-high-speed, high-capacity wireless communications become more widespread, a single electronic device, such as a mobile terminal, can now incorporate a variety of functions. For example, in addition to communication functions, entertainment functions like gaming, multimedia functions like music and video playback, communication and security functions like mobile banking, and even calendar management and electronic wallet functions are being integrated into a single electronic device. These electronic devices are also becoming smaller and more portable for users.

[0005] An electronic device according to one embodiment of the present disclosure may include a housing including a side wall, the side wall including a recess recessed from an outer surface thereof; a non-conductive cap disposed in the recess and including a protruding portion penetrating the recess; an antenna module facing the cap with respect to the recess, the antenna module including a plurality of antenna elements disposed to face the recess; and a bracket disposed inside the housing, the bracket including a coupling hole into which the protruding portion is inserted, the bracket being configured to restrict movement of the bracket inside the electronic device.

[0006] An electronic device according to one embodiment of the present disclosure may include a housing including a side wall, the side wall including a recess recessed from an outer surface thereof; a non-conductive cap disposed in the recess and including a protruding portion penetrating the recess; an antenna module facing the cap with respect to the recess, the antenna module including a plurality of antenna elements disposed to face the recess; and a mounting bracket disposed inside the housing, the mounting bracket overlapping an end of the protruding portion, on which the antenna module is mounted. In one embodiment, movement of the bracket within the electronic device may be restricted.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0008] FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment of the present disclosure.

[0009] FIG. 3 is an exploded perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.

[0010] FIG. 4 is an exploded perspective view showing an antenna assembly according to one embodiment of the present disclosure.

[0011] FIG. 5 is an exploded perspective view of an antenna assembly and a cap according to one embodiment of the present disclosure.

[0012] FIG. 6 is a perspective view of a cap according to one embodiment of the present disclosure.

[0013] FIG. 7 is a rear view of a portion of an electronic device according to one embodiment of the present disclosure.

[0014] FIG. 8 is a cross-sectional view taken along line AA` of FIG. 7 according to one embodiment of the present disclosure.

[0015] FIG. 9 is a cross-sectional view taken along line BB` of FIG. 7 according to one embodiment of the present disclosure.

[0016] FIG. 10 is a perspective view of a cap according to one embodiment of the present disclosure.

[0017] FIG. 11 is a rear view of a portion of an electronic device according to one embodiment of the present disclosure.

[0018] FIG. 12 is a perspective view of an antenna assembly according to one embodiment of the present disclosure.

[0019] FIG. 13A is a rear view of a portion of an electronic device according to one embodiment of the present disclosure.

[0020] FIG. 13b is a cross-sectional view taken along line CC` of FIG. 13a according to one embodiment of the present disclosure.

[0021] FIG. 14 is a front view of a bracket according to one embodiment of the present disclosure.

[0022] FIG. 15A is a rear view of a portion of an electronic device according to one embodiment of the present disclosure.

[0023] FIG. 15b is a cross-sectional view taken along line DD` of FIG. 15a according to one embodiment of the present disclosure.

[0024] FIG. 16 is a rear view of a cap according to one embodiment of the present disclosure.

[0025] FIG. 17 is an exploded perspective view of an antenna assembly and a cap according to one embodiment of the present disclosure.

[0026] Fig. 18 is an enlarged view of a portion of the side wall with the antenna assembly positioned on the side wall as shown in Fig. 17.

[0027] FIG. 19 is a rear view of a portion of an electronic device according to one embodiment of the present disclosure.

[0028] FIG. 20 is a cross-sectional view taken along line EE` of FIG. 19 according to one embodiment of the present disclosure.

[0029] The following description of the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure, including the claims and their equivalents. While the exemplary embodiments disclosed in the following description include numerous specific details to aid understanding, they are to be considered as one example of various exemplary embodiments. Accordingly, those skilled in the art will appreciate that various modifications and variations of the various implementations described herein may be made without departing from the scope and spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0030] The terms and words used in the following description and claims are not limited to their reference meanings and can be used to clearly and consistently describe one embodiment of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various implementations of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the disclosure and its equivalents.

[0031] Unless the context clearly dictates otherwise, the singular forms of "a," "an," and "the" should be understood to include plural meanings. Thus, for example, "a component surface" could be understood to include one or more of the surfaces of the component.

[0032] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0033] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0034] The processor (120) may include various processing circuits and / or multiple processors. For example, as used in this specification and claims, the term “processor” may include various processing circuits including at least one processor, one or more of which may be configured to individually and / or collectively perform the various functions described below in a distributed manner. As described below, when “processor,” “at least one processor,” and “one or more processors” are described as being configured to perform multiple functions, this includes, for example, instances where one processor performs some functions and another processor performs other functions, and instances where a single processor performs all of the stated functions. Furthermore, as an example, the at least one processor may include a combination of processors that perform the various functions described in a distributed manner. The at least one processor may execute program instructions to achieve or perform the various functions.

[0035] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0036] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0037] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0038] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0039] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0040] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0041] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0042] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0043] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0044] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0045] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0046] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0047] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0048] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0049] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0050] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0051] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0052] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0053] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0054] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0055] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0056] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0057] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0058] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0059] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0060] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0061] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0062] FIG. 2 is a perspective view illustrating a front surface of an electronic device (101) according to one embodiment of the present disclosure. Referring to FIG. 2, the electronic device (101) according to one embodiment (e.g., the electronic device (101) of FIG. 1 ) may include a housing (210) that includes a first surface (or front surface) (210A), a second surface (or back surface), and a side surface (210C) that surrounds a space between the first surface (210A) and the second surface. According to one embodiment, the first surface (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The side surface (210C) may be formed by a side structure (or “side bezel structure”) (218) that is coupled to the front plate (202) and includes metal and / or polymer.

[0063] According to one embodiment, the electronic device (101) may include at least one of a display (220), an audio module (203, 207, 214), a sensor module (204), a camera module (205), a key input device (217), a light emitting element (206), and a connector hole (208, 209). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., the key input device (217) or the light emitting element (206)) or may additionally include other components.

[0064] The display (220) may be visually exposed, for example, through a significant portion of the front plate (202). In one embodiment, at least a portion of the display (220) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment, the edge of the display (220) may be formed to be substantially the same as the adjacent outer shape of the front plate (202). In one embodiment (not shown), the gap between the outer edge of the display (220) and the outer edge of the front plate (202) may be formed to be substantially the same in order to expand the area over which the display (220) is visually exposed.

[0065] In one embodiment (not shown), a recess or opening may be formed in a portion of a screen display area of ​​the display (220), and at least one of an audio module (214), a sensor module (204), a camera module (205), and a light-emitting element (206) may be included that are aligned with the recess or opening. In one embodiment (not shown), at least one of an audio module (214), a sensor module (204), a camera module (205), a fingerprint sensor (not shown), and a light-emitting element (206) may be included on a back surface of the screen display area of ​​the display (220). In one embodiment (not shown), the display (220) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen. The audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (207, 214). The microphone hole (203) may have a microphone disposed therein for acquiring external sound, and in one embodiment, multiple microphones may be disposed so as to detect the direction of the sound. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for calls. In one embodiment, the speaker hole (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

[0066] The key input device (217) may be positioned on a side (210C) of the housing (210). In one embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (220).

[0067] The light-emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210). The light-emitting element (206) may provide, for example, status information of the electronic device (101) in the form of light. In one embodiment, the light-emitting element (206) may provide a light source that is linked to the operation of, for example, the camera module (205). The light-emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0068] The connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0069] According to one embodiment of the present disclosure, the electronic device (101) may include a cap (500). The cap (500) may be at least partially non-conductive. The cap (500) may be disposed on the sidewall structure (310). The cap (500) may have a shape that extends along the longitudinal direction (e.g., Y-axis direction) of the sidewall structure (310). The cap (500) may have an outer surface exposed to the outside of the electronic device (101).

[0070] FIG. 3 is an exploded perspective view illustrating a rear surface of an electronic device according to an embodiment of the present disclosure. Referring to FIG. 3, the electronic device (101) (e.g., the electronic device (101) of FIG. 1 or FIG. 2) may include a side structure (310), a bottom structure (319), a first support member (311) (e.g., a bracket), a front plate (320) (e.g., the front plate (202) of FIG. 2), a display (330) (e.g., the display (220) of FIG. 2), at least one printed circuit board (or board assembly) (340a), a battery (350), a second support member (360) (e.g., a rear case), a camera assembly (307), and a rear plate (380). According to an embodiment, the electronic device (101) may omit at least one of the components (e.g., the first support member (311) or the second support member (360)) or may additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 1 or FIG. 2, and any overlapping description will be omitted below.

[0071] The first support member (311) may be provided in at least one portion in a flat shape. In one embodiment, the first support member (311) may be disposed inside the electronic device (101) and connected to the side structure (310), or may be formed integrally with the side structure (310). The first support member (311) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. When the first support member (311) is at least partially formed of a metallic material, the side structure (310) or a portion of the first support member (311) may function as an antenna. The first support member (311) may have a display (330) coupled to one surface and a printed circuit board (340a) coupled to the other surface. A processor, a memory, and / or an interface may be mounted on the printed circuit board (340a). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0072] The first support member (311) may be referred to as a “support member.” The housing (301) may include the support member (311). The support member (311) may face the front plate (320). The support member (311) may face the rear plate (380). The support member (311) may be coupled to the front plate (320) or the rear plate (380) via an adhesive member. The support member (311) may be made of reinforced plastic or metal.

[0073] The support member (311) may include a support body (3111). The support body (3111) may have a flat shape. The support body (3111) may provide a space in which a battery (350) or a printed circuit board (340a) is placed.

[0074] The support member (311) may include an end portion (3112). The end portion (3112) may be integral with the support body (3111). The end portion (3112) may be formed along the perimeter of the support body (3111). The end portion (3112) may extend along the perimeter of the side structure (310). The end portion (3112) may be integral with the side structure (310).

[0075] The front plate (320) can be joined to the support member (311) via an adhesive member. The front plate (320) can be referred to as a “cover” or “front cover.”

[0076] The rear plate (380) may be referred to as a “cover” or “rear cover.” The cover (380) may face the support member (311). The cover (380) may be made of a film-laminated reinforced plastic or reinforced glass material.

[0077] The cover (380) may include a cover body (381). The cover body (381) may be flat. The cover body (381) may face the support body (3111).

[0078] The cover (380) may include a cover edge (382). The cover edge (382) may be integral with the cover body (381). The cover edge (382) may extend along the direction in which the end (3112) of the support member (311) extends. The cover edge (382) may face the end (3112) of the support member (311).

[0079] In one embodiment, the first support member (311), the side structure (310), and the bottom structure (319) may be combined to form a front case or housing (301). In one embodiment, the housing (301) may be generally understood as a structure for accommodating, protecting, or placing a printed circuit board (340a), or a battery (350).

[0080] In one embodiment, the housing (301) may include a bottom structure (319). A side structure (310) may be connected to the bottom structure (319). The side structure (310) may protrude from an edge of the bottom structure (319). The bottom structure (319) and the side structure (310) may form a space that accommodates electronic components (e.g., a battery (350)) within the electronic device (101).

[0081] In one embodiment, the housing (301) may be understood to include structures that are visually or tactilely perceptible to a user on the exterior of the electronic device (101), such as a side structure (310), a front plate (320), and / or a back plate (380). The housing (301) may include the side structure (310), the first support member (311), the front plate (320), and the back plate (380).

[0082] In one embodiment, the first support member (311) is positioned between the front plate (320) (e.g., the first surface (210A) of FIG. 1) and the rear plate (380) and may function as a structure for positioning electrical / electronic components such as a printed circuit board (340a) or a camera assembly (307).

[0083] The memory may include, for example, volatile memory or non-volatile memory.

[0084] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0085] The second support member (360) may include, for example, an upper support member (360a) and a lower support member (360b). In one embodiment, the upper support member (360a) may be arranged to surround a printed circuit board (e.g., a first circuit board (340a)) together with a portion of the first support member (311). For example, the upper support member (360a) of the second support member (360) may be arranged to face the first support member (311) with the first circuit board (340a) interposed therebetween. A circuit device (e.g., a processor, a communication module, or a memory) implemented in the form of an integrated circuit chip or various electrical / electronic components may be arranged on the printed circuit board (340a), and according to an embodiment, the printed circuit board (340a) may be provided with an electromagnetic shielding environment from the second support member (360). In one embodiment, the lower support member (360b) can be utilized as a structure on which electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) can be placed. In one embodiment, electrical / electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) can be placed on an additional printed circuit board (not shown). For example, the lower support member (360b) can be placed to surround the additional printed circuit board together with another part of the first support member (311). The speaker module or interface placed on the additional printed circuit board (not shown) or the lower support member (360b) can be placed corresponding to the audio module (207) or connector holes (208, 309) of FIG. 1.

[0086] The battery (350) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. The battery (350) may be supported by the bottom structure (319). At least a portion of the battery (350) may be disposed substantially on the same plane as, for example, a printed circuit board (340a). The battery (350) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).

[0087] In one embodiment, the camera assembly (307) may include at least one camera module. Within the electronic device (101), the camera assembly (307) (or at least one camera module) may receive at least a portion of light incident through an optical hole or camera window (391, 392, 393). In one embodiment, the camera assembly (307) may be disposed on the first support member (311) at a position adjacent to the printed circuit board (340a). In one embodiment, the camera module(s) of the camera assembly (307) may be generally aligned with one of the camera windows (391, 392, 393) and may be at least partially wrapped around the second support member (360) (e.g., the upper support member (360a)).

[0088] According to one embodiment of the present disclosure, the electronic device (101) may include an antenna assembly (400). The antenna assembly (400) may be disposed on a side structure (310) of the housing (301). The antenna assembly (400) may include an antenna element (e.g., antenna elements (411, 412, 413) of FIG. 4) that receives or generates radio waves. Radio waves generated from the antenna element may be propagated to the outside of the electronic device (101) through the cap (500). In addition, the antenna element may receive radio waves from the outside of the electronic device (101) through the cap (500).

[0089] FIG. 4 is an exploded perspective view illustrating an antenna assembly (400) according to one embodiment of the present disclosure. Referring to FIG. 4, the antenna assembly (400) according to one embodiment of the present disclosure may include an antenna module (410, e.g., antenna module (197) of FIG. 1).

[0090] According to one embodiment of the present disclosure, the antenna module (410) may include a base substrate (414) connected to a flexible circuit board (430). A plurality of antenna elements (411, 412, 413) may be mounted on one surface of the base substrate (414). At least one chip (415) may be mounted on the other surface of the base substrate (414).

[0091] According to one embodiment of the present disclosure, the antenna module (410) may include a plurality of antenna elements (411, 412, 413) that form a directional beam. The plurality of antenna elements (411, 412, 413) may be disposed on one surface of the base substrate (414) or within the base substrate (414). As an example, the plurality of antenna elements (411, 412, 413) may be a dipole antenna array and / or a patch antenna array.

[0092] According to one embodiment of the present disclosure, the chip (415) may include a radio frequency integrated circuit (RFIC) and / or a power management integrated circuit (PMIC). The RFIC may be configured to process signals of a selected frequency band transmitted / received through antenna elements (411, 412, 413). The PMIC may receive electricity from a power source and provide power required for various components (e.g., the RFIC, antenna elements (411, 412, 413)) on the antenna module (410).

[0093] According to one embodiment of the present disclosure, the antenna assembly (400) may include a bracket (420) on which the antenna module (410) is mounted. The bracket (420) may be disposed inside the electronic device (101). The bracket (420) may be disposed inside a side wall (310) of the electronic device (101).

[0094] According to one embodiment of the present disclosure, the bracket (420) may include a seating portion (424) that supports the antenna module (410). The seating portion (424) may have a shape that extends long along the side wall (310).

[0095] According to one embodiment of the present disclosure, the antenna module (410) can be adhered to the mounting portion (424) via an adhesive member (421). The adhesive member (421) can be positioned between the antenna module (410) and the mounting portion (424). As an example, the adhesive member (421) can be a double-sided tape.

[0096] According to one embodiment of the present disclosure, the mounting portion (424) may include a connecting hole (425). Through the connecting hole (425), the FPCB (430) and the antenna module (410) may be connected. The connecting hole (425) may be located between the two connecting portions (422, 423).

[0097] According to one embodiment of the present disclosure, the bracket (420) may include at least one (e.g., two) engaging portions (422, 423). The engaging portions (422, 423) may be connected to a lateral side of a mounting portion (424). The engaging portions (422, 423) may extend from the mounting portion (424).

[0098] According to one embodiment of the present disclosure, the coupling portion (422, 423) may include a coupling hole (4221, 4231) to which the cap (500) is coupled. The coupling portion (422, 423) may include a bent portion (4222, 4232).

[0099] According to one embodiment of the present disclosure, the coupling portions (422, 423) may include a first coupling portion (422) connected to one side of the mounting portion (424) and a second coupling portion (423) connected to the other side. The second coupling portion (423) may be positioned closer to the flexible circuit board (430, Flexible Printed Circuit Board (FPCB)) than the first coupling portion (422).

[0100] According to one embodiment of the present disclosure, the first coupling portion (422) may include a first coupling hole (4221) and a first bend portion (4222). The second coupling portion (423) may include a second coupling hole (4231) and a second bend portion (4232). The first bend portion (4222) and the second bend portion (4232) may be bent toward the mounting portion (424).

[0101] According to one embodiment of the present disclosure, the antenna assembly (400) may include an antenna module (410) and an FPCB (430) electrically connecting a printed circuit board (340a, e.g., FIG. 3) disposed inside a housing (301). The FPCB (430) may include a connector (431a) electrically connected to a base substrate (414) and a plate (431) on which the connector (431a) is disposed. The FPCB (430) may include a flexible portion (432) that can be bent or rotated. The FPCB (430) may include a connector (433) electrically connected to the printed circuit board (340a, e.g., FIG. 3) disposed inside the housing (301).

[0102] FIG. 5 is an exploded perspective view of an antenna assembly (400) and a cap (500) according to one embodiment of the present disclosure.

[0103] Referring to FIG. 5, according to one embodiment of the present disclosure, a side wall (310) may include a recess (317) formed by being recessed from a portion of an outer surface (312s). The recess (317) may be recessed inward from the outer surface (312s) of the side wall (310). A first space (S1) may be formed between the recess (317) and the outer surface (312s) of the side wall (310). The recess (317) may partially define the first space (S1).

[0104] According to one embodiment of the present disclosure, the recess (317) may be at least partially non-conductive. For example, the recess (317) may be formed entirely of a non-conductive material. As another example, the recess (317) may be formed of a non-conductive material only in the region corresponding to the antenna elements (411, 412, 413). The recess (317) may be referred to as the non-conductive portion (317) of the sidewall (310).

[0105] According to one embodiment of the present disclosure, the recess (317) may be a part of the side wall (310) of the housing (301). The antenna elements (411, 412, 413) of the antenna module (400) may receive signals from the outside of the electronic device (101) or transmit signals to the outside of the electronic device (101) through the recess (317). According to one embodiment of the present disclosure, the side wall (310) may include a radiation hole connecting the first space (S1) and the second space (S2). A non-conductive portion (317) may be disposed in the radiation hole. As an example, the side wall (310) may be formed of a metal material except for the non-conductive portion (317) in order to reinforce the rigidity of the electronic device, and the radiation hole into which the non-conductive portion (317) is inserted may be formed in the metal material. A plurality of antenna elements (411, 412, 413) can transmit radio waves toward the radiation hole into which the non-conductive portion (317) is inserted.

[0106] According to one embodiment of the present disclosure, the non-conductive portion (317) may include a first through hole (3171) through which the first protruding portion (520) passes and a second through hole (3172) through which the second protruding portion (530) passes. The first through hole (3171) may face the first coupling hole (4221) of the bracket (420). The second through hole (3172) may face the second coupling hole (4231) of the bracket (420).

[0107] According to one embodiment of the present disclosure, the sidewall (310) may include a frame portion (312) surrounding a non-conductive portion (317). The non-conductive portion (317) may be recessed inward from an outer surface (312s) of the frame portion (312). The non-conductive portion (317) may be coupled to the frame portion (312). The non-conductive portion (317) may be bonded to the frame portion (312).

[0108] According to one embodiment of the present disclosure, the frame portion (312) may be exposed to the outside of the electronic device (101). The frame portion (312) may form the exterior of the electronic device (101). The non-conductive portion (317) may not be exposed to the outside of the electronic device (101). As an example, the frame portion (312) may be formed of a metal material to ensure the rigidity of the electronic device (101).

[0109] According to one embodiment of the present disclosure, the side wall (310) may include a second space (S2) in which a bracket (420) is mounted. The second space (S2) may be positioned opposite the first space (S1) with respect to the non-conductive portion (317). The second space (S2) and the first space (S1) may be positioned on both sides of the non-conductive portion (317).

[0110] According to one embodiment of the present disclosure, the second space (S2) may be communicated with the outside of the side wall (310) through the guide hole (314). As an example, the second space (S2) may be communicated with the rear of the side wall (310) through the guide hole (314). The guide hole (314) may be a passage through which a bracket (420) on which an antenna module (410) is mounted enters and exits. The guide hole (314) may have a shape corresponding to the bracket (420) on which the antenna module (410) is mounted. The guide hole (314) may be a slot extending along the side wall (310). The guide hole (314) may be referred to as a slot (314) or a guide slot (314).

[0111] According to one embodiment of the present disclosure, the guide hole (314) may be formed in the adhesive surface (313) of the side wall (310). The front plate (320, e.g., FIGS. 2 and 3) or the rear plate (380, e.g., FIG. 3) may be adhered to the adhesive surface (313). FIG. 5 illustrates, as an example, a case where the adhesive surface (313) is the rear surface of the side wall (310), and the rear plate (or cover, 380, e.g., FIG. 3) is adhered thereto. However, unlike what is illustrated in FIG. 5, the adhesive surface (313) may be the front surface of the side wall (310), and the front plate (320, e.g., FIGS. 2 and 3) may be adhered thereto. The adhesive surface (313) may be referred to as the “rear surface (313)” of the side wall (310).

[0112] Referring to FIG. 5, an electronic device (101) according to one embodiment of the present disclosure may include an adhesive member (318) disposed between a cover (380) and an adhesive surface (313). For example, the adhesive member (318) may be a double-sided tape or an adhesive that is applied to the adhesive surface (313) and then cured through a special process such as irradiating it with ultraviolet rays.

[0113] According to one embodiment of the present disclosure, an electronic device (101) may include a cap (500) disposed in a first space (S1). The cap (500) may include a non-conductive material. The cap (500) may cover a recess (317) of a side wall (310). The non-conductive cap (500) may face the recess (317) of the side wall (310).

[0114] According to one embodiment of the present disclosure, the cap (500) can be bonded to the non-conductive portion (317) via an adhesive member (540). The adhesive member (540) can be disposed between the cap (500) and the non-conductive portion (317). The adhesive member (540) can include holes (541, 542) through which the protruding portions (520, 530) pass. The adhesive member (540) can include a first hole (541) through which the first protruding portion (520) passes and a second hole (542) through which the second protruding portion (530) passes.

[0115] According to one embodiment of the present disclosure, the cap (500) may include at least one (e.g., two) protruding portions (520, 530). After the bracket (420) is placed inside the second space (S2), the cap (500) may be inserted into the first space (S1) and fastened to the bracket (420).

[0116] According to one embodiment of the present disclosure, the first protruding portion (520) can penetrate the first hole (541) of the adhesive member (540) and the first through-hole (3171) of the non-conductive portion (317). The first protruding portion (520) can be inserted into the first coupling hole (4221) of the bracket (420). The first protruding portion (520) can penetrate the first coupling hole (4221) of the bracket (420). And, the second protruding portion (530) can penetrate the second hole (542) of the adhesive member (540), the second through-hole (3172) of the non-conductive portion (317), and the second coupling hole (4231) of the bracket (420).

[0117] According to one embodiment of the present disclosure, the holes (541, 542) of the adhesive member (540) can be positioned to correspond to the through holes (3171, 3172) of the non-conductive portion (317). The adhesive member (540) can surround the first through hole (3171) and the second through hole (3172) of the non-conductive portion (317). Accordingly, the adhesive member (540) can prevent foreign substances and / or liquids from the outside of the electronic device (101) from flowing into the inside of the electronic device (101) through the first through hole (3171) and the second through hole (3172).

[0118] According to one embodiment of the present disclosure, the first and second protruding portions (520, 530) are coupled to the first and second coupling holes (4221, 4231) to restrict the bracket (420) on which the antenna module (410) is mounted from moving within the second space (S2).

[0119] According to one embodiment of the present disclosure, the non-conductive portion (317) may be positioned between the cap (500) and the antenna module (410). The non-conductive portion (317) may face the antenna elements (411, 412, 413) of the antenna module (410). The antenna elements (411, 412, 413) may transmit radio waves toward the first space (S1). The antenna elements (411, 412, 413) may receive radio waves from the outside of the electronic device (101) through the cap (500) and the non-conductive portion (317).

[0120] FIG. 6 is a perspective view of a cap (500) according to one embodiment of the present disclosure. Referring to FIG. 6, the cap (500) according to one embodiment of the present disclosure may include a board (510) extending along a side wall (310). The board (510) may have a shape corresponding to a first space (S1) of the side wall (310).

[0121] According to one embodiment of the present disclosure, the outer surface of the board (510) may be exposed to the outside of the electronic device (101). The inner surface (511) of the board (510) may face the non-conductive portion (317) of the side wall (310). The outer surface of the board (510) may form a continuous surface with the outer surface (312s) of the side wall (310).

[0122] According to one embodiment of the present disclosure, the protruding portions (520, 530) may be connected to the inner surface (511) of the board (510) facing the non-conductive portion (317). The portion (512) where the protruding portions (520, 530) are connected to the inner surface (511) of the board (510) may be referred to as a connecting portion (512). The protruding portions (520, 530) may protrude from the inner surface (511) of the board (510).

[0123] According to one embodiment of the present disclosure, the cap (500) may include a sealer (521, 531). The sealer (521, 531) may be disposed on a lateral surface of the protruding portion (520, 530). The sealer (521, 531) may surround the lateral surface of the protruding portion (520, 530). The sealer (521, 531) may protrude from the lateral surface of the protruding portion (520, 530). The sealer (521, 531) may have elasticity. The sealer (521, 531) may seal the hole (3171, 3172) of the non-conductive portion (317).

[0124] According to one embodiment of the present disclosure, the cap (500) may be at least partially non-conductive. As an example, the board (510) and the protruding portions (520, 530) may be integrally formed from a non-conductive material (e.g., a resin-based material). As another example, the board (510) may be formed from a non-conductive material, and the protruding portions (520, 530) may be formed from a material different from the board (510).

[0125] FIG. 7 is a rear view of a portion of an electronic device (101) according to one embodiment of the present disclosure. FIG. 8 is a cross-sectional view taken along line AA` of FIG. 7 according to one embodiment of the present disclosure. FIG. 9 is a cross-sectional view taken along line BB` of FIG. 7 according to one embodiment of the present disclosure.

[0126] Referring to FIG. 7, according to one embodiment of the present disclosure, a side wall (310) may include an inner portion (315) supporting a bracket (420). The inner portion (315) may partially define a second space (S2, see FIG. 5). The bracket (420) on which the antenna module (410) is mounted may be positioned between the non-conductive portion (317) and the inner portion (315). The inner portion (315) may partially define a guide hole (314).

[0127] The inner portion (315) can be connected to the frame portion (312). One surface of the inner portion (315) can form a surface continuous with the adhesive surface (313). An adhesive member (318) can be arranged on the surface of the inner portion (315) that forms a surface continuous with the adhesive surface (313).

[0128] According to one embodiment of the present disclosure, the frame portion (312) and the inner portion (315) may form a guide hole (314). The guide hole (314) may include a plurality of regions (3141, 3142, 3143, 3144). The plurality of regions (3141, 3142, 3143, 3144) may be arranged in the longitudinal direction (e.g., Y-axis direction) of the side wall (310).

[0129] Each of the regions (3141, 3142, 3143, 3144) may be partially defined by the frame portion (312) and / or the inner portion (315). The guide hole (314) may include a first region (3143), a second region (3141), a third region (3142), and a fourth region (3144).

[0130] The multiple regions (3141, 3142, 3143, 3144) of the guide hole (314) can be distinguished from each other by using ordinal numbers. Ordinal numbers such as first, second, etc. are used only for the purpose of distinguishing one component from another and may be used interchangeably depending on the order of description, but do not limit the components.

[0131] According to one embodiment of the present disclosure, the second region (3141) and the third region (3142) may be positioned at both ends of the guide hole (314) in the longitudinal direction (e.g., Y-axis direction) of the side wall (310), and the first region (3143) and the fourth region (3144) may be positioned between the second region (3141) and the third region (3142).

[0132] According to one embodiment of the present disclosure, the second region (3141) may be connected to the first region (3143). The second region (3141) may be located at one end of the guide hole (314). The plate (431) of the FPCB (430) may be inserted into the second space (S2) through the second region (3141) and the third region (3142) of the guide hole (314).

[0133] According to one embodiment of the present disclosure, the second region (3141) may have a width smaller than the width of the first region (3143). For example, the width of the second region (3141) defined in the protruding direction (e.g., -X-axis direction) of the protruding portions (520, 530) of the cap (500) may be smaller than the width of the first region (3143).

[0134] According to one embodiment of the present disclosure, the third region (3142) may be connected to the fourth region (3144). The third region (3142) may be located at the other end of the guide hole (314). The third region (3142) may have a shape corresponding to the first coupling portion (422) of the bracket (420). The first coupling portion (422) of the bracket (420) may be inserted into the second space (S2) through the third region (3142). The first coupling portion (422) of the bracket (420) may be moved to the outside of the second space (S2) through the third region (3142).

[0135] According to one embodiment of the present disclosure, the third region (3142) may have a width smaller than the width of the fourth region (3144). For example, the width of the third region (3142) defined in the protruding direction (e.g., -X-axis direction) of the protruding portions (520, 530) of the cap (500) may be smaller than the width of the fourth region (3144).

[0136] According to one embodiment of the present disclosure, the first region (3143) may be connected to the second region (3141) and the fourth region (3144). The first region (3143) may be located between the second region (3141) and the fourth region (3144).

[0137] According to one embodiment of the present disclosure, the first region (3143) may have a shape corresponding to the second coupling portion (423) of the bracket (420). The second coupling portion (423) of the bracket (420) may be inserted into the second space (S2) through the first region (3143). The second coupling portion (423) of the bracket (420) may be moved to the outside of the second space (S2) through the first region (3143).

[0138] According to one embodiment of the present disclosure, the fourth region (3144) may be connected to the third region (3142) and the first region (3143). The fourth region (3144) may be located between the third region (3142) and the first region (3143).

[0139] According to one embodiment of the present disclosure, the fourth region (3144) may have a shape corresponding to the mounting portion (424) of the bracket (420). The mounting portion (424) of the bracket (420) may be inserted into the interior of the second space (S2) through the fourth region (3144). The mounting portion (424) of the bracket (420) may be moved to the exterior of the second space (S2) through the fourth region (3144).

[0140] Referring to FIGS. 7 and 8, according to one embodiment of the present disclosure, a bracket (420, see FIG. 4) and an antenna module (410, see FIG. 4) can be accommodated in a second space (S2). According to one embodiment of the present disclosure, a cap (500, see FIG. 5) can be accommodated in a first space (S1).

[0141] According to one embodiment of the present disclosure, the non-conductive portion (317) of the side wall (310) can be positioned between the board (510) of the cap (500) and a plurality of antenna elements (411, 412, 413). The antenna elements (411, 412, 413) can transmit radio waves to the outside of the electronic device (101) through the non-conductive member (317), or receive radio waves from the outside of the electronic device (101) through the non-conductive member (317).

[0142] According to one embodiment of the present disclosure, a bracket (420) on which an antenna module (410) is mounted can be inserted and removed through the fourth area (3144) of the guide hole (314). A non-conductive portion (317) of the side wall (310) can be positioned between the first space (S1) and the second space (S2).

[0143] Referring to FIGS. 7 and 9, according to one embodiment of the present disclosure, a first protruding portion (520) of a cap (500, see FIG. 5) may penetrate a first through hole (3171) and a first coupling hole (4221). A sealer (521, 531, see FIG. 6) may be disposed on a lateral surface of the protruding portion (520, 530, see FIG. 6, for example).

[0144] Fig. 9 illustrates the first protruding portion (520). The description of the first protruding portion (520) and the sealer (521) illustrated in Fig. 9 can be equally applied to the second protruding portion (530) and the sealer (531) illustrated in Fig. 6.

[0145] A sealer (521) according to one embodiment of the present disclosure may be disposed on a lateral surface of a protruding portion (520). The sealer (521) may be positioned in a through hole (3171) of a non-conductive portion (317). The sealer (521) may contact an inner surface of the non-conductive portion (317) defining the through hole (3171). The sealer (521) may seal a space between a lateral surface of the protruding portion (520) inserted into the through hole (3171) and the inner surface of the non-conductive portion (317) defining the through hole (3171).

[0146] According to one embodiment of the present disclosure, the protruding portion (520) can penetrate the joining hole (4221). The protruding portion (520) can restrict the bracket (420) from moving in the second space (S2). The protruding portion (520) can restrict the bracket (420) from moving out of the second space (S2) through the guide hole (314).

[0147] FIG. 10 is a perspective view of a cap (1500) according to one embodiment of the present disclosure. FIG. 11 is a rear view of a portion of an electronic device (101) according to one embodiment of the present disclosure.

[0148] The description of the components (board (510), inner side (511), connecting parts (512), protruding parts (520, 530)) described with reference to FIG. 6 can be equally applied to the components (board (1510), inner side (1511), connecting parts (1512), protruding parts (1520, 1530)) of the same name shown in FIG. 10 to the extent that they are not arranged with each other.

[0149] Referring to FIG. 10, according to one embodiment of the present disclosure, the protruding portion (1520, 1530) may include a groove (1521, 1531). The groove (1521, 1531) may be formed on a lateral surface of the protruding portion (1520, 1530). The groove (1521, 1531) may extend along the perimeter of the protruding portion (1520, 1530). The groove (1521, 1531) may be positioned closer to the end of the protruding portion (1520, 1530) than the connecting portion (1512) of the protruding portion (1520, 1530).

[0150] According to one embodiment of the present disclosure, a first groove (1521) may be formed on a side surface of the first protruding portion (520), and a second groove (1531) may be formed on a side surface of the second protruding portion (530). The first groove (1521) and the second groove (1531) may face each other in opposite directions. The first groove (1521) and the second groove (1531) may face each other. The shapes of the first groove (1521) and the second groove (1531) may be symmetrical to each other.

[0151] Referring to FIG. 10, according to one embodiment of the present disclosure, the protruding portions (1520, 1530) may include inclined surfaces (1522, 1532). The inclined surfaces (1522, 1532) may be formed at the ends of the protruding portions (1520, 1530). The inclined surfaces (1522, 1532) may be inclined downward toward the inner surface (1511) of the cap (1500). The inclined surfaces (1522, 1532) may be connected to the edges of the grooves (1521, 1531). The inclined surfaces (1522, 1532) may be convex curved surfaces toward the protruding direction of the protruding portions (1520, 1530).

[0152] Referring to FIGS. 10 and 11, according to one embodiment of the present disclosure, a bracket (420) may include a bent portion (4222). The bent portion (4222) may be bent toward a protruding portion (1520). An end (4223) of the bent portion (4222) may be located inside a groove (1521). When the protruding portion (1520) is inserted, the inclined surface (1522) of the protruding portion (1520) and the end (4223) of the bent portion (4222) may come into contact. During the insertion of the protruding portion (1520), the bent portion (4222) may be elastically deformed. The end (4223) of the bent portion (4222) may slide along the inclined surface (1522) of the protruding portion (1520) toward the groove (1521).

[0153] According to one embodiment of the present disclosure, when the protruding portion (1520) is inserted, the end (4223) of the bent portion (4222) can be restored by elastic force and inserted into the groove (1521). The groove (1521) can have a shape corresponding to the end (4223) of the bent portion (4222).

[0154] Although FIG. 11 and the description thereof have been described with a focus on the relationship between the groove (1521) of the first protruding portion (1520) and the end (4223) of the first bent portion (4222), the same can be applied to the coupling relationship between the second protruding portion (1530) and the bracket (420) illustrated in FIG. 11.

[0155] FIG. 12 is a perspective view of an antenna assembly (1400) according to one embodiment of the present disclosure. Referring to FIG. 12, the antenna assembly (1400) according to one embodiment of the present disclosure may include an antenna module (410) and a bracket (1420) on which the antenna module (410) is mounted. The description regarding the mounting portion (424) described with reference to FIG. 4 may be equally applied to the mounting portion (1424) of the same name illustrated in FIG. 12, to the extent that they are not mutually arranged.

[0156] Referring to FIG. 12, a bracket (1420) according to one embodiment of the present disclosure may include a flange portion (1422, 1423) connected to a mounting portion (1424). There may be at least one (e.g., two) flange portion (1422, 1423). The flange portions (1422, 1423) may be connected to both sides of the mounting portion (1424).

[0157] According to one embodiment of the present disclosure, the first flange portion (1422) and the second flange portion (1423) may extend away from each other. For example, the first flange portion (1422) and the second flange portion (1423) may extend opposite to each other.

[0158] FIG. 13A is a rear view of a portion of an electronic device (101) according to an embodiment of the present disclosure. FIG. 13B is a cross-sectional view taken along line CC` of FIG. 13A according to an embodiment of the present disclosure. The description regarding the plurality of regions (3141, 3142, 3143, 3144) of the guide hole (314) described with reference to FIG. 7 can be equally applied to the plurality of regions (3141, 3142, 3143, 3144) of the guide hole (314) of the same name illustrated in FIG. 13A to the extent that they are not mutually arranged.

[0159] Referring to FIGS. 12 and 13A, according to one embodiment of the present disclosure, the first region (3143) may have a shape corresponding to the second flange portion (1423) of the bracket (1420). The second flange portion (1423) may be inserted into the second space (S2) through the first region (3143). The second flange portion (1423) of the bracket (420) may be moved from the second space (S2) to the outside of the second space (S2) through the first region (3143).

[0160] According to one embodiment of the present disclosure, the second region (3141) may have a width smaller than the width of the first region (3143). For example, the width of the second region (3141) defined in the protruding direction (e.g., -X-axis direction) of the protruding portions (520, 530) of the cap (500) may be smaller than the width of the first region (3143).

[0161] According to one embodiment of the present disclosure, the third region (3142) may have a shape corresponding to the first flange portion (1422) of the bracket (1420). The first flange portion (1422) of the bracket (1420) may be inserted into the second space (S2) through the third region (3142). The first flange portion (1422) of the bracket (420) may be moved from the second space (S2) to the outside of the second space (S2) through the third region (3142).

[0162] According to one embodiment of the present disclosure, the third region (3142) may have a width smaller than the width of the fourth region (3144). For example, the width of the third region (3142) defined in the protruding direction (e.g., -X-axis direction) of the protruding portions (520, 530) of the cap (500) may be smaller than the width of the fourth region (3144).

[0163] Referring to FIG. 13A, according to one embodiment of the present disclosure, the second flange portion (1423) and the second protruding portion (530) may overlap each other. The second flange portion (1423) and the second protruding portion (530) may overlap each other in the opening direction (e.g., Z-axis direction) of the guide hole (314). The second flange portion (1423) may be caught by the second protruding portion (530). The second protruding portion (530) may restrict the second flange portion (1423) from escaping outside the second space (S2) through the guide hole (314).

[0164] Referring to FIGS. 13A and 13B, according to one embodiment of the present disclosure, a first flange portion (1422) and a first protruding portion (520, e.g., see FIG. 13B) may overlap each other. The first flange portion (1422) and the first protruding portion (520) may overlap each other in the opening direction (e.g., Z-axis direction) of the guide hole (314). The first flange portion (1422) may be caught by the first protruding portion (520). The first protruding portion (520) may restrict the first flange portion (1422) from escaping out of the second space (S2) through the guide hole (314).

[0165] According to one embodiment of the present disclosure, the first protruding portion (520) may be adjacent to a top surface of the first flange portion (1422). For example, when the first protruding portion (520) penetrates the non-conductive portion, the end of the first protruding portion (520) may press the top surface of the first flange portion (1422) downward (e.g., in the Z-axis direction of FIG. 13A). Accordingly, the first protruding portion (520) may restrict the first flange portion (1422) from escaping out of the second space (S2) through the guide hole (314).

[0166] Fig. 14 is a front view of a bracket (2420) according to one embodiment of the present disclosure. The description of the mounting portion (424), the coupling portions (422, 423), the coupling holes (4221, 4231), and the adhesive member (421) described with reference to Fig. 4 can be equally applied to the mounting portion (424), the coupling portions (2422, 2423), the coupling holes (2424, 2425), and the adhesive member (421) of the same names illustrated in Fig. 14, to the extent that they are not mutually arranged.

[0167] Referring to FIG. 14, according to one embodiment of the present disclosure, a bracket (2420) may include slot-shaped coupling holes (2424, 2425). The first coupling hole (2424) may be positioned in the first coupling portion (2422). The second coupling hole (2425) may be positioned in the second coupling portion (2423).

[0168] According to one embodiment of the present disclosure, the width of the coupling hole (2424, 2425) defined in the longitudinal direction of the side wall (310) may be smaller than the width of the coupling hole (2424, 2425) defined in a direction intersecting the longitudinal direction of the side wall (310). As an example, the width of the coupling hole (2424, 2425) defined in the longitudinal direction of the side wall (310) may be smaller than the width of the coupling hole (2424, 2425) defined in a direction perpendicular to the longitudinal direction of the side wall (310).

[0169] FIG. 15A is a portion of a rear view of an electronic device according to an embodiment of the present disclosure. FIG. 15B is a cross-sectional view taken along line DD` of FIG. 15A according to an embodiment of the present disclosure.

[0170] The description of the multiple areas (3141, 3142, 3143, 3144) of the guide hole (314) described with reference to FIG. 7 can be applied equally to the multiple areas (3141, 3142, 3143, 3144) of the guide hole (314) of the same name illustrated in FIG. 15a, to the extent that they are not arranged with each other.

[0171] Referring to FIGS. 15A and 15B , according to one embodiment of the present disclosure, the center of the coupling hole (2425) may be spaced apart from the center axis of the protruding portion (520). The distances from one side and the other side of the boundary of the coupling hole (2425) to the lateral surface of the protruding portion (520) may be different from each other. For example, one side of the boundary of the coupling hole (2425) may be adjacent to the lateral surface of the protruding portion (520) and may support the lateral surface of the protruding portion (520). The other side of the boundary of the coupling hole (2425) may be spaced apart from the lateral surface of the protruding portion (520) and may provide a free space for smooth penetration of the protruding portion (520).

[0172] FIG. 16 is a rear view of a cap (2500) according to one embodiment of the present disclosure.

[0173] Referring to FIG. 16, a cap (2500) according to one embodiment of the present disclosure may include a board (2510) from which at least one protruding portion (520, 530) protrudes. The board (2510) may be elongated.

[0174] The cap (2500) may include a stepped portion (2511) that is stepped from the board (2510) toward a non-conductive portion (317, e.g., FIG. 5) of the side wall (310). The stepped portion (2511) may protrude toward the non-conductive portion (317, e.g., FIG. 5) of the side wall (310). The height at which the protruding portions (520, 530) of the cap (2500) protrude may be higher than the height at which the stepped portion (2511) protrudes.

[0175] According to one embodiment of the present disclosure, a step portion (2511) may be positioned between two protruding portions (520, 530). The step portion (2511) may face a non-conductive portion (317, e.g., FIG. 5) of a side wall (310). The step portion (2511) may be in contact with a non-conductive portion (317, e.g., FIG. 5) of a side wall (310).

[0176] A cap (2500) according to one embodiment of the present disclosure may include an adhesive member (2540). The adhesive member (2540) may include holes (2541, 2542). The protruding portions (520, 530) of the cap (2500) may penetrate the holes (2541, 2542) of the adhesive member (2540).

[0177] According to one embodiment of the present disclosure, an adhesive member (2540) may be disposed between a board (2510) and a non-conductive portion (317, e.g., FIG. 5) of a side wall (310). The adhesive member (2540) may surround a through hole (3171, 3172, e.g., FIG. 5) of the non-conductive portion (317).

[0178] According to one embodiment of the present disclosure, the two lateral edges of the step portion (2511) may have a shape corresponding to the shape of the adhesive member (2540). The two lateral edges of the step portion (2511) may have a concave shape corresponding to the convex shape of the adhesive member (2540).

[0179] According to one embodiment of the present disclosure, the holes (2541, 2542) of the adhesive member (2540) can be positioned to correspond to the through holes (3171, 3172, see FIG. 5) of the non-conductive portion (317). The adhesive member (2540) can surround the first through hole (3171) and the second through hole (3172) of the non-conductive portion (317). Accordingly, the adhesive member (2540) can prevent foreign substances and / or liquids from outside the electronic device (e.g., the electronic device (101) of FIG. 3) from flowing into the interior of the electronic device (101) through the first through hole (3171) and the second through hole (3172).

[0180] Fig. 17 is an exploded perspective view of an antenna assembly (400) and a cap (500) according to one embodiment of the present disclosure. Fig. 18 is an enlarged view of a portion of a side wall (310) illustrated in Fig. 17, with the antenna assembly (400) positioned on the side wall (310).

[0181] The description of the non-conductive portion (317) of the recess (317) or side wall (310) described with reference to FIG. 5 can be equally applied to the non-conductive portion (1317) of the recess (1317) or side wall (310) of the same name shown in FIGS. 17 and 18, to the extent that they are not mutually arranged.

[0182] Referring to FIG. 17, according to one embodiment of the present disclosure, a side wall (310) of a housing (301, see FIG. 3) may include a recess (1317). The recess (1317) may include at least one through hole (3171, 3172) and at least one opening (1317s). Through the opening (1317s), a first space (S1) and a second space (S2) may be connected to each other.

[0183] According to one embodiment of the present disclosure, the through holes (3171, 3172) and the openings (1317s) may be arranged in the longitudinal direction (e.g., Y-axis direction) of the recess (1317). The openings (1317s) may have the shape of elongated slots. The openings (1317s) may be slots (1317s) extending along the direction (e.g., Y-axis direction) in which the antenna elements (411, 412, 413) are arranged. The slots (1317s) may be slots (1317s) extending along the longitudinal direction (e.g., Y-axis direction) of the side wall (310).

[0184] According to one embodiment of the present disclosure, the opening (1317s) may be positioned between the first through hole (3171) and the second through hole (3172). As an example, when a plurality of openings (1317s) are provided, the openings (1317s) may be arranged along the direction (e.g., Y-axis direction) in which the antenna elements (411, 412, 413) are arranged between the first through hole (3171) and the second through hole (3172).

[0185] According to one embodiment of the present disclosure, the recess (1317) may be at least partially non-conductive. For example, the recess (1317) may be formed entirely of a non-conductive material and may have an opening (1317s) formed therein. As another example, the recess (1317) may be formed of a non-conductive material only in a region corresponding to the antenna elements (411, 412, 413) (e.g., the periphery of the opening (1317s)). The recess (1317) may be referred to as the non-conductive portion (1317) of the sidewall (310).

[0186] FIG. 19 is a rear view of a portion of an electronic device (e.g., the electronic device (101) of FIG. 3) according to one embodiment of the present disclosure. FIG. 20 is a cross-sectional view taken along line EE` of FIG. 19 according to one embodiment of the present disclosure.

[0187] The description of the non-conductive portion (317) of the recess (317) or side wall (310) described with reference to FIGS. 5 to 8 can be equally applied to the non-conductive portion (1317) of the recess (1317) or side wall (310) of the same name illustrated in FIG. 20, to the extent that they are not mutually arranged.

[0188] Referring to FIGS. 19 and 20, the recess (1317) may be located between the board (510) of the cap (500) and the antenna elements (411, 412, 413). The opening (1317s) of the recess (1317) may be located between the antenna elements (411, 412, 413) and the board (510) of the cap (500).

[0189] According to one embodiment of the present disclosure, the antenna elements (411, 412, 413) can receive signals from the outside of the electronic device (101) or transmit signals to the outside of the electronic device (101) through the recess (1317). The antenna elements (411, 412, 413) can receive signals from the outside of the electronic device (101) or transmit signals to the outside of the electronic device (101) through the slot (1317s).

[0190] According to one embodiment of the present disclosure, an adhesive member (540) may be disposed between the recess (1317) and the board (510). The adhesive member (540) may be adhered to the recess (1317) and the board (510). The adhesive member (540) may cover the opening (1317s) of the recess (1317). The adhesive member (540) may prevent foreign substances and / or liquids outside the electronic device (101) from flowing into the interior of the electronic device (101) through the opening (1317s) of the recess (1317).

[0191] Unlike as illustrated in FIGS. 17 and 20, the adhesive member (540) may at least partially surround the opening (1317s) of the recess (1317). As an example, the adhesive member (540) may have a hole (not shown) formed in an area facing the opening (1317) to surround the opening (1317s) of the recess (1317). As another example, the adhesive member (540) may have a hole (not shown) formed in an area facing the opening (1317) and the through-holes (3171, 3172) to surround the opening (1317s) of the recess (1317) and the through-holes (3171, 3172).

[0192] Antenna elements can form directional beams. To ensure communication performance of antenna elements positioned within electronic devices, the beams must be formed to pass through non-conductive areas. In other words, the positions of the non-conductive areas through which the beam passes and the antenna elements must be fixed. Therefore, extensive research is currently underway on methods for stably securing antenna elements within electronic devices.

[0193] A problem to be solved in the present disclosure may be to firmly fix an antenna module within an electronic device.

[0194] A problem to be solved in the present disclosure may be to increase the bonding area between a side wall of an electronic device on which an antenna module is placed and a cover bonded to the side wall.

[0195] The problem to be solved in this disclosure is not limited to the problem mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0196] An electronic device according to various embodiments of the present disclosure can securely fix the antenna module within the electronic device by having a non-conductive cap disposed on the outside of a side wall penetrate the side wall and then be fastened to an antenna module disposed on the inside of the side wall.

[0197] Electronic devices according to various embodiments of the present disclosure can increase the bonding area of ​​a configuration that is bonded to an area other than the lateral surface of the side wall (e.g., the front or back) by fixing the antenna module through the side surface of the side wall of the electronic device.

[0198] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0199] An electronic device according to one embodiment of the present disclosure may include a housing (301) including a side wall (310), wherein the side wall (310) includes a recess (317) sunken from an outer surface (312s).

[0200] An electronic device according to one embodiment of the present disclosure may include a non-conductive cap (500; 1500; 2500) disposed in the recess (317) and including a protruding portion (520, 530; 1520, 1530) penetrating the recess (317).

[0201] An electronic device according to one embodiment of the present disclosure may include an antenna module (410) facing the cap (500; 1500; 2500) with respect to the recess (317), and including a plurality of antenna elements (411, 412, 413) arranged to face the recess (317).

[0202] An electronic device according to one embodiment of the present disclosure may include a bracket (420; 2420) disposed inside (S2) of the housing (301) and on which the antenna module (410) is mounted, and which includes a coupling hole (4221, 4231; 2424, 2425) through which the protruding portion (520, 530; 1520, 1530) passes.

[0203] According to one embodiment of the present disclosure, the bracket (420; 2420) may include a mounting portion (424) that supports the antenna module (410).

[0204] According to one embodiment of the present disclosure, the bracket (420; 2420) may include a coupling portion (422, 423; 2422, 2423) extending outwardly from the mounting portion (424) and including the coupling hole (4221, 4231; 2424, 2425).

[0205] According to one embodiment of the present disclosure, the coupling portion (422, 423) can be bent toward the protruding portion (1520, 1530).

[0206] According to one embodiment of the present disclosure, the cap (1500) may include a groove (1521, 1531) formed on a lateral surface of the protruding portion (1520, 1530) and into which an end (4223) of the coupling portion (422, 423) is inserted.

[0207] According to one embodiment of the present disclosure, the end of the protruding portion (1520, 1530) may include an inclined surface (1522, 1532) that is inclined downward toward the groove (1521, 1531) and connected to the edge of the groove (1521, 1531).

[0208] According to one embodiment of the present disclosure, a guide hole (314) may be formed on the side wall (310) and has a shape corresponding to the bracket (420) through which the antenna module (410) is mounted so as to pass.

[0209] According to one embodiment of the present disclosure, the antenna module (410) may include an FPCB (430) electrically connected to the antenna module (410) and extending from the antenna module (410) to the inside of the housing (301) through the guide hole (314).

[0210] According to one embodiment of the present disclosure, the FPCB (430) may include a plate (431) on which a connector (431a) connected to the antenna module (410) is arranged.

[0211] According to one embodiment of the present disclosure, the FPCB (430) may overlap the plate (431) of the FPCB (430) in the protruding direction of the protruding portion (520, 530; 1520, 1530).

[0212] According to one embodiment of the present disclosure, the guide hole (314) may include a first area (3143) having a shape corresponding to the coupling portion (422, 423; 2422, 2423) so that the coupling portion passes therethrough.

[0213] According to one embodiment of the present disclosure, the guide hole (314) may include a second region (3141) connected to an edge of the first region (3143), penetrating at least a portion of the FPCB (430), and having a smaller width than the first region (3143).

[0214] According to one embodiment of the present disclosure, the housing (301) may include a cover (380) that is attached to the rear surface (313) of the side wall (310) where the guide hole (314) is defined and covers the guide hole (314).

[0215] According to one embodiment of the present disclosure, an adhesive member (318) having a loop shape with one side open may be included, which is disposed between the rear surface (313) of the side wall (310) and the cover (380).

[0216] According to one embodiment of the present disclosure, the coupling hole (2424, 2425) may be an elongated slot.

[0217] According to one embodiment of the present disclosure, the central axis of the protruding portion (520, 530) may be spaced apart from the center of the coupling hole (2424, 2425).

[0218] According to one embodiment of the present disclosure, an adhesive member (540; 2540) may be disposed between the cap (500; 2500) and the recess (317) and surrounding the protruding portion (520, 530).

[0219] According to one embodiment of the present disclosure, the cap (2500) may include a stepped portion (2511) that steps toward the recess (317) and contacts the recess (317).

[0220] According to one embodiment of the present disclosure, a sealer (521, 531) may be formed around the protruding portion (520, 530) and seals a space between the protruding portion (520, 530) and the recess (317).

[0221] According to one embodiment of the present disclosure, the antenna module (410) may include a base substrate (414) supported by the mounting portion (424).

[0222] According to one embodiment of the present disclosure, the antenna module (410) may include a plurality of antenna elements (411, 412, 413) arranged on one surface or inside the base substrate (414).

[0223] According to one embodiment of the present disclosure, a bracket (1420) is disposed inside (S2) of the housing (301) and on which the antenna module (410) is mounted, and may include a bracket (1420) that overlaps the end of the protruding portion (520, 530).

[0224] According to one embodiment of the present disclosure, the mounting portion (1424) may include a flange portion (1422, 1423) extending from the mounting portion (1424) to surround the protruding portion (520, 530) and being hooked onto the protruding portion (520, 530).

[0225] According to one embodiment of the present disclosure, in the entry / exit direction of the bracket (1420), the end of the protruding portion (520, 530) may be located between the guide hole (314) and the flange portion (1422, 1423).

[0226] According to one embodiment of the present disclosure, the flange portion (1422, 1423) may overlap with the plate (431) of the FPCB (430) in the protruding direction of the protruding portion (520, 530).

[0227] According to one embodiment of the present disclosure, the guide hole (314) may include a first region (3143) having a shape corresponding to the flange portion (1423) so that the flange portion (1423) passes therethrough.

[0228] According to one embodiment of the present disclosure, the guide hole (314) may include a second region (3141) connected to an edge of the first region (3143), penetrating at least a portion of the FPCB (430), and having a smaller width than the first region (3143).

[0229] Ordinal numbers such as first, second, etc. are used only to distinguish one component from another, and do not limit said components.

[0230] The drawings of the present disclosure include x, y, and z coordinate axes having the same directionality. The coordinate axes included in each drawing are for convenience of explanation, and the direction in which each axis (x-axis, y-axis, and z-axis) points does not have a directionality such as front-back, up-down, left-right, etc., and the direction in which each axis points can be understood as the +x, +y, and +z direction, and the opposite direction thereto can be understood as the -x, -y, and -z direction. Hereinafter, the embodiment(s) of the present disclosure will be described with reference to the x, y, and z coordinate axes.

[0231] Although the detailed description of this document has described specific embodiments, it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of this document.

Claims

1. In electronic devices, A housing (301) including a side wall (310), wherein the side wall (310) includes a recess (317) sunken from an outer surface (312s); A non-conductive cap (500; 1500; 2500) disposed in the recess (317) and including a protruding portion (520, 530; 1520, 1530) penetrating the recess (317); An antenna module (410) facing the cap (500; 1500; 2500) with respect to the recess (317), comprising at least one antenna element (411, 412, 413) arranged to face the recess (317); and An electronic device comprising a bracket (420; 2420) disposed inside (S2) of the housing (301) and on which the antenna module (410) is mounted, the bracket including a joining hole (4221, 4231; 2424, 2425) into which the protruding portion (520, 530; 1520, 1530) is inserted.

2. In paragraph 1, The above bracket (420; 2420) is: A mounting portion (424, 1424) supporting the above antenna module (410); and An electronic device comprising a coupling portion (422, 423; 2422, 2423) extending outwardly from the above-described settling portion (424, 1424) and including the coupling hole (4221, 4231; 2424, 2425).

3. In paragraph 1 or 2, The above-mentioned joining portion (422, 423) is bent toward the above-mentioned protruding portion (1520, 1530), The above cap (1500) is, An electronic device comprising a groove (1521, 1531) formed on a lateral surface of the protruding portion (1520, 1530) and into which an end (4223) of the joining portion (422, 423) is inserted.

4. In any one of paragraphs 1 to 3, The end of the above protruding portion (1520, 1530) is An electronic device comprising a sloped surface (1522, 1532) that slopes downward toward the groove (1521, 1531) and is connected to an edge of the groove (1521, 1531).

5. In any one of paragraphs 1 to 4, An electronic device further comprising a guide hole (314) formed on the side wall (310) and having a shape corresponding to the bracket (420) through which the antenna module (410) is mounted.

6. In any one of paragraphs 1 to 5, An electronic device further comprising an FPCB (430) electrically connected to the antenna module (410) and extending from the antenna module (410) to the inside of the housing (301) through the guide hole (314).

7. In any one of paragraphs 1 to 6, The above FPCB (430) includes a plate (431) on which a connector (431a) connected to the antenna module (410) is arranged, The above-mentioned joining portion (422, 423; 2422, 2423) is an electronic device that overlaps with the plate (431) of the FPCB (430) in the protruding direction of the above-mentioned protruding portion (520, 530; 1520, 1530).

8. In any one of paragraphs 1 to 7, The above guide hole (314) is A first region (3143) having a shape corresponding to the above-mentioned joining portion (422, 423; 2422, 2423) so that the above-mentioned joining portion passes through; and An electronic device comprising a second region (3141) connected to an edge of the first region (3143), penetrating at least a portion of the FPCB (430), and having a smaller width than the first region (3143).

9. In any one of paragraphs 1 to 8, The above housing (301) is An electronic device comprising a cover (380) that is adhered to the rear surface (313) of the side wall (310) in which the guide hole (314) is defined and covers the guide hole (314).

10. In any one of paragraphs 1 to 9, An electronic device further comprising an adhesive member (318) having an open loop shape with one side, the adhesive member (318) being positioned between the rear surface (313) of the side wall (310) and the cover (380), and containing an adhesive material.

11. In any one of paragraphs 1 to 10, The above-mentioned joining hole (2424, 2425) is a long, extended slot, An electronic device in which the central axis of the above protruding portion (520, 530) is spaced apart from the center of the above coupling hole (2424, 2425).

12. In any one of paragraphs 1 to 11, An electronic device further comprising an adhesive member (540; 2540) comprising an adhesive material and arranged between the cap (500; 2500) and the recess (317) of the side wall (310), and surrounding the protruding portion (520, 530).

13. In any one of paragraphs 1 to 12, The above cap (2500) is, An electronic device including a stepped portion (2511) that is stepped toward the recess (317) and comes into contact with the recess (317).

14. In any one of paragraphs 1 to 13, An electronic device further comprising a sealer (521, 531) formed around the protruding portion (520, 530) and sealing the space between the protruding portion (520, 530) and the recess (317).

15. In any one of paragraphs 1 to 14, The above antenna module (410) is A base substrate (414) supported by the above-mentioned fixing portion (424); An electronic device comprising at least one antenna element (411, 412, 413) arranged on one surface or inside the base substrate (414).

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