Battery device, cooling system therefor, cooling plate, cooling assembly, and cooling method

Abstract

A system for cooling a battery device according to the present disclosure comprises a substrate part (2) of a case having a cell body incorporated therein, and a cooling plate attached to the substrate part (2). Also provided are a first refrigerant flow path and a second refrigerant flow path (A2) that is set apart from the first refrigerant flow path (A1). The back surface of the substrate part (2) constitutes a peripheral wall of the first refrigerant flow path (A1) and the second refrigerant flow path (A2). The cooling plate is provided with a first plate that forms the other peripheral wall of the first refrigerant flow path (A1), and a second plate that forms the other peripheral wall of the second refrigerant flow path (A2). The first plate and the second plate are attached to a region where the cell body is disposed on the back surface of the substrate part (2).

Description

Battery device and its cooling system, cooling plate, cooling assembly, and cooling method

[0001] The present disclosure relates to a battery device, a cooling plate, a cooling system and a cooling assembly used therein, and a cooling method thereof.

[0002] There is a need for technological developments for cooling battery devices. An example of a battery device is a power storage device, which is installed as a power source in, for example, electric vehicles or hybrid vehicles and is capable of outputting a large current. The case of this power storage device is generally rectangular box-shaped, and stacked cells are housed and fixed directly or in modules to the flat substrate of the case. Here, a stacked cell is formed by stacking multiple power storage cells in a stacking direction. Since the stacked cells generate heat within the case, a cooler is attached to the case to forcibly cool them. For example, a typical cooler, as disclosed in Patent Document 1, has a volumetric housing attached below the case, which is independent of the case, and coolant water is circulated through the housing.

[0003] However, installing an independent cooler next to the case is not desirable in terms of cost and weight, and having the case and cooler separate from each other inhibits heat transfer between them (high thermal resistance).

[0004] Therefore, Patent Document 2 proposes using the back surface of the base plate (bottom wall) of the case as the peripheral wall of the refrigerant flow path of the cooler. Since the cooling water in the refrigerant flow path comes into direct contact with the back surface of the base plate of the case, the thermal resistance between the cooling water and the stacked cells, which are the heat source, is reduced.

[0005] Prior art document that discloses technology related to the present invention is Patent Document 3. In Patent Document 3, multiple cooling devices that are separate from the case are separately disposed on the base portion of the case. Each cooling device is arranged in series with respect to the flow of cooling water.

[0006] Japanese Patent Application Publication No. 2023-12176 Japanese Patent Registration No. 7167103 Japanese Patent Application Publication No. 2020-510534

[0007] In order to meet the high output and long life required for power sources of modern electric vehicles, stricter temperature control is required for cell bodies of battery devices such as stacked cells. As in the energy storage device described in Patent Document 2, cooling efficiency can be improved by using the back surface of the substrate part of the case as part of the peripheral wall that forms the refrigerant flow path. In other words, heat from the stacked cells inside the case can be efficiently transferred to the cooling water flowing through the refrigerant flow path.

[0008] The stacked cells are not arranged to cover the entire surface of the substrate (the surface opposite the back surface) of the case, and there are gaps between the stacked cells. Heat from the stacked cells is also conducted to the substrate (open substrate) facing this gap. If this open substrate forms the peripheral wall of the refrigerant flow path, heat from this portion will also be transferred to the cooling water. As a result, the cooling capacity of the cooling water is hindered, affecting the cooling capacity of the substrate (actual cooling target substrate) where the stacked cells are installed, which is the intended cooling target of the cooling water.

[0009] In view of the above, an object of the present application is to provide a technique that can contribute to improving the cooling effect of a battery device by a refrigerant.

[0010] The present disclosure has been made to solve such problems, and a cooling system according to a first aspect of the present disclosure is a cooling system for a battery device, comprising a substrate portion of a case incorporating a cell body of a battery device, and a cooling plate attached to the substrate portion, wherein the cooling system comprises a first refrigerant flow path and a second refrigerant flow path spaced apart from the first refrigerant flow path, the rear surface of the substrate portion forms peripheral walls of the first refrigerant flow path and the second refrigerant flow path, the cooling plate comprises a first plate forming another peripheral wall of the first refrigerant flow path and a second plate forming another peripheral wall of the second refrigerant flow path, and the first plate and the second plate are attached to an area on the rear surface of the substrate portion where the cell body is arranged.

[0011] A battery device according to aspect 21 of the present disclosure is a battery device comprising a case incorporating a cell body and a cooling section arranged on the rear surface of a substrate section of the case, wherein the cooling section comprises a first refrigerant flow path and a second refrigerant flow path spaced apart from the first refrigerant flow path, the rear surface of the substrate section forms peripheral walls of the first refrigerant flow path and the second refrigerant flow path, the other peripheral walls of the first refrigerant flow path are formed by a first plate, and the other peripheral walls of the second refrigerant flow path are formed by a second plate, and the first plate and the second plate are attached to the area on the rear surface of the substrate section where the cell body is arranged.

[0012] A cooling method for a battery device according to aspect 22 of the present disclosure is a method for cooling a battery device comprising: a base portion of a case incorporating a cell body; and a cooling plate attached to the base portion, the battery device comprising the first refrigerant flow path and a second refrigerant flow path separated from the first refrigerant flow path; a back surface of the base portion constituting peripheral walls of the first refrigerant flow path and the second refrigerant flow path; the cooling plate comprising a first plate forming another peripheral wall of the first refrigerant flow path and a second plate forming another peripheral wall of the second refrigerant flow path; the first plate and the second plate being attached to an area on the back surface of the base portion where the cell body is arranged; and the method for cooling a battery device wherein refrigerant is supplied independently and in parallel to the first refrigerant flow path and the second refrigerant flow path.

[0013] A cooling plate according to aspect 23 of the present disclosure is a cooling plate attached to a substrate of a case incorporating a cell body of a battery device, and constituting a cooling system for the battery device together with the substrate, wherein the back surface of the substrate comprises a first plate that forms the peripheral walls of a first refrigerant flow path and a second refrigerant flow path spaced from the first refrigerant flow path and has a first refrigerant flow path forming recess that forms another peripheral wall of the first refrigerant flow path, a second plate that has a second refrigerant flow path forming recess that forms another peripheral wall of the second refrigerant flow path, and a refrigerant supply portion forming recess that supplies refrigerant to the first refrigerant flow path and the second refrigerant flow path independently in parallel.

[0014] 9 is a perspective view schematically showing a state in which stacked cells are arranged on an upper surface of a substrate part of an energy storage device according to a first embodiment of the present disclosure. FIG. 10 is a bottom view of an energy storage device according to a first embodiment of the present disclosure. FIG. 11 is a schematic cross section taken along the line III-III in FIG. 2. FIG. 12 is a schematic cross section taken along the line IV-IV in FIG. 2. FIG. 13 is a schematic cross section taken along the line V-V in FIG. 2. FIG. 14 is a schematic cross section taken along the line VI-VI in FIG. 2. FIG. 15 is a schematic cross section taken along the line VII-VII in FIG. 2. FIG. 16 is a schematic cross section taken along the line VIII-VIII in FIG. 2. FIG. 17 is a bottom view of an energy storage device according to a second embodiment of the present disclosure. FIG. 18 is a schematic cross section taken along the line X-X in FIG. 9. FIG. 19 is a perspective view showing an energy storage device according to a third embodiment of the present disclosure. FIG. 20 is a bottom view of an energy storage device according to a fourth embodiment of the present disclosure. FIG. 19 is a schematic cross section taken along the line XIII-XIII in FIG. 12. FIG. 19 is a schematic cross section taken along the line XVI-XIV in FIG. 12. FIG. 19 is a schematic cross section taken along the line XV-XV in FIG. 12. 24 is a schematic cross-section taken along arrows XVI-XV in FIG. 12. It is a bottom view of an electricity storage device according to a fifth embodiment of the present disclosure. It is an enlarged view of a portion of FIG. 17. It is a schematic cross-section taken along arrows XIX-XIX in FIG. 18. It is a schematic cross-section taken along arrows XX-XX in FIG. 18. It is a schematic cross-section taken along arrows XXI-XXI in FIG. 17. FIG. 22 is a bottom view of an electricity storage device according to a sixth embodiment of the present disclosure. It is a bottom view of an electricity storage device according to a seventh embodiment of the present disclosure. It is a bottom view of an electricity storage device according to an eighth embodiment of the present disclosure. It is an enlarged view of a portion of FIG. 24. It is a schematic cross-section taken along arrows XXVI-XXVI in FIG. 25. It is a schematic cross-section taken along arrows XXVII-XXVII in FIG. 25. It is a schematic cross-section taken along arrows XXVII-XXVII in FIG. 25. It is a bottom view of an electricity storage device according to a ninth embodiment of the present disclosure. It is a bottom view of an electricity storage device according to a tenth embodiment of the present disclosure. It is an enlarged view of a portion of FIG. 29. It is a schematic cross-section taken along arrows XXXI-XXXI in FIG. 29. FIG. 29 is a schematic diagram of a cross section taken along the line XXXII-XXXII of FIG. 29. FIG. 29 is a schematic diagram of a cross section taken along the line XXXIII-XXXIII of FIG. 29. FIG. 30 is a schematic diagram of a cross section taken along the line XXXIV-XXXIV of FIG. 30. FIG. 30 is a schematic diagram of a cross section taken along the line XXXV-XXXV of FIG. 30. FIG. 30 is a schematic diagram of a cross section taken along the line XXXVI-XXXVI of FIG. 30.

[0015] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings.

[0016] (First embodiment) FIG. 1 is a perspective view schematically illustrating a state in which stacked cells S are arranged on the upper surface of a substrate portion 2 of an energy storage device (an example of a battery device of the present disclosure) of the first embodiment. The stacked cells S are formed by stacking unit cells. The stacked cells S are an example of a "cell body" of the present disclosure, and a plurality of stacked cells S are arranged adjacent to each other at a predetermined interval on the upper surface of the substrate portion 2. The substrate portion 2 is made of a metal plate such as SUS, and includes a specific region 3 on whose upper surface the stacked cells S are arranged, and a general region 8 in which the stacked cells S are not arranged. A control device or the like can be arranged in this general region 8. Side walls (not shown) are erected from the periphery of the substrate portion 2 to surround the stacked cells S, forming a case portion.

[0017] The specific region 3 is provided with an actual cooling target substrate portion 4 and an open substrate portion 6. The actual cooling target substrate portion 4 is a portion of the substrate portion 2 that is in direct contact with the stacked cells S in the specific region 3. The open substrate portion 6 is a portion of the substrate portion 2 that corresponds to a gap formed between adjacently arranged stacked cells S in the specific region 3.

[0018] 2, first to fourth refrigerant flow paths A1 to A4 are provided as a cooling section on the rear surface (bottom surface) of the substrate unit 2. Hereinafter, the term "refrigerant flow path A" refers to at least one of the first to fourth refrigerant flow paths A1 to A4.

[0019] The first to fourth refrigerant flow paths A1 to A4 are formed by a recess (refrigerant flow path forming recess) 10 in a metal plate 11 made of highly thermally conductive material such as stainless steel and the back surface of the substrate 2. As shown in FIG. 2, the metal plate 11 is a strip with an opening 100 formed in its center, and the central portion of the strip is pressed and bent along its periphery to form the recess 10. The opening 100 is a portion of the metal plate 11 where no plate is present. The unprocessed portion of the metal plate around the periphery of the recess 10 (the flange portion) is welded to the substrate 2 in a liquid-tight manner. The groove of the recess 10 forms at least a portion of the peripheral wall of the refrigerant flow path A (see FIG. 3).

[0020] 2, cooling water as a refrigerant introduced from an inlet 16 passes through a first refrigerant flow path A1 and is discharged from an outlet 19. In this example, the first to fourth refrigerant flow paths are designated by symbols A1 to A4, respectively. As shown in FIG. 1, in each stacked cell S, single cells are stacked in the refrigerant flow direction of the first to fourth refrigerant flow paths A1 to A4.

[0021] The stacked cells S are arranged in parallel in a direction perpendicular to the stacking direction of the unit cells. The stacked cells S facing the first to fourth refrigerant flow paths A1 to A4 correspond to the first to fourth cell bodies. The metal plates 11 that form the peripheral walls of each refrigerant flow path have the same shape, including the recess 10 structure and the locations of the refrigerant inlet 16 and refrigerant outlet 19. By standardizing parts in this way, product costs can be reduced.

[0022] The number of metal plates 11 forming the refrigerant flow paths can be adjusted as desired depending on the area of ​​the substrate portion 2. In addition, by adjusting the shape and area of ​​the metal plates 11, it is possible to accommodate changes in the area and shape of the substrate portion 2. The material and thickness of the metal plates 11 can be adjusted as desired. The openings 100 in the metal plates 11 can also be omitted.

[0023] The metal plate 11 forming the first to fourth refrigerant flow paths A1 to A4 is attached to the rear surface of the substrate 2 in an area where the stacked cells S are arranged. The "area where the stacked cells S are arranged" is an area of ​​the substrate 2 that corresponds to the actual target substrate 4 with which the stacked cells S are in direct contact, and is an area that corresponds to a position facing the stacked cells S across the substrate 2. It is preferable to arrange the metal plate 11 so as to cover the area where the stacked cells S are arranged, i.e., the actual target substrate 4 with which the stacked cells S are in contact.

[0024] In other words, the metal plates 11 that form the first to fourth refrigerant flow paths A1 to A4 are not disposed on the open substrate portion 6. However, this does not exclude disposing the metal plates 11 that form the first to fourth refrigerant flow paths A1 to A4 on the open substrate portion 6, and the metal plates 11 may be disposed on the open substrate portion 6 depending on the size and shape of the substrate portion 2, the number and size of the stacked cells S to be disposed on the substrate portion 2, etc.

[0025] The metal plates 11 are arranged spaced apart from each other, so that the peripheral wall (excluding the substrate portion 2) formed by the grooves of the recesses 10 of the first refrigerant flow path A1 and the peripheral wall (excluding the substrate portion 2) formed by the grooves of the recesses 10 of the second refrigerant flow path A2 are spaced apart from each other.

[0026] The metal plate 11 that forms the peripheral wall of the first refrigerant flow path A1 corresponds to the first plate. The metal plate 11 that forms the peripheral wall of the second refrigerant flow path A2 corresponds to the second plate. The first plate and the second plate may be formed from a continuous member, or they may be formed from separate members. In either case, the member that forms the cooling plate is preferably formed from a material that has excellent thermal conductivity and resistance to refrigerant corrosion (e.g., stainless steel).

[0027] The metal plates that form the peripheral walls of the third refrigerant flow path A3 and the fourth refrigerant flow path A4 constitute the third plate and the fourth plate. Since each plate has the same shape, the number of plates can be increased or decreased as appropriate depending on the area of ​​the substrate portion 2, etc.

[0028] The cooling plate is made up of a plurality of metal plates 11 that form the peripheral walls of the first to fourth refrigerant flow paths A1 to A4. The cooling system for an electricity storage device, which is an example of a battery device, includes a substrate portion 2 of a case that houses stacked cells S as cell bodies of the electricity storage device, and a cooling plate attached to the substrate portion 2.

[0029] In this example, the metal plates 11 that form each of the refrigerant flow paths A1 to A4 are spaced apart from one another. That is, the metal plates 11 that form each of the refrigerant flow paths A1 to A4 are independent from one another, preventing heat transfer between the metal plates 11.

[0030] Each metal plate 11 may be formed as a continuous piece. In this case, it is preferable to reduce the contact area between the metal plates to reduce mutual thermal interference. Also, a heat insulating material may be disposed between the metal plates 11. An adhesive foam resin or the like may be used as the heat insulating material.

[0031] 3 and 4, a portion of the substrate 2 is machined to form a recess 200, and the recess 200 is exposed so as to protrude from the opening 100 in the metal plate 11 in the direction from the front side to the back side of the substrate 2. This increases the area of ​​the substrate 2, improving its heat dissipation efficiency. Note that if no opening is provided in the metal plate 11, there is no need to provide the recess 200. In other words, the recess 200 is not an essential component.

[0032] 2, the cooling system further includes a refrigerant supply unit C and a refrigerant discharge unit D for the first to fourth refrigerant flow paths A1 to A4. The refrigerant supply unit C includes a refrigerant supply flow path C1 and a connecting path C2.

[0033] As shown in Fig. 5, the refrigerant supply flow path C1 is formed between an elongated bottom plate 21 and a top plate 25. The bottom plate 21 is placed over the recesses 10 of each of the refrigerant flow paths A1 to A4 and is disposed at the ends of the first to fourth refrigerant flow paths A1 to A4, perpendicular to the arrangement direction of the refrigerant flow paths A1 to A4. More specifically, as shown in Fig. 2, the refrigerant supply flow path C1 is disposed at the end edges of the first to fourth refrigerant flow paths A1 to A4 in a plan view.

[0034] First to fourth out-ports 16B are formed in bottom plate 21 that defines refrigerant supply flow path C1, and first to fourth out-ports 16B face openings 16A formed in the peripheral walls of recesses 10 of each of refrigerant flow paths A1 to A4, respectively. Out-ports 16B and openings 16A form inlet 16 for cooling water.

[0035] To control the amount of coolant introduced into each of the refrigerant flow paths A1 to A4, it is preferable to adjust the opening area (flow path cross-sectional area) of the first to fourth out-ports 16B. For example, the flow path cross-sectional area is increased sequentially along the flow direction of the coolant. Furthermore, it is preferable that the flow path cross-sectional area of ​​the first to fourth out-ports 16B is smaller than the flow path cross-sectional area of ​​the coolant supply flow path C1. Here, the flow path cross-sectional area refers to the area of ​​a cross section perpendicular to the flow direction of the refrigerant.

[0036] A cooling water inlet 15B is formed at one end of the coolant supply passage C1. This inlet 15B communicates with the connecting passage C2 through an opening 15A of the connecting passage C2. The connecting passage C2 is formed between the substrate 2 and a recess 27 formed by processing a long strip-shaped metal plate 28.

[0037] The flange-shaped unprocessed portion of the metal plate 28 around the recess 27 is welded liquid-tight to the base plate 2. An opening 14 is formed in a predetermined portion of the base plate 2 and communicates with the connecting passage C2. Cooling water is supplied to this opening 14 from the outside.

[0038] 2, the symbol D indicates the refrigerant discharge section, which includes a refrigerant discharge flow path D1 and a connecting path D2. The structure of the refrigerant discharge flow path D1 and the manner in which it is connected to each of the refrigerant flow paths A1 to A4, and the structure of the connecting path D2 and the manner in which it is connected to the refrigerant discharge flow path D1 are the same as those of the refrigerant supply section, so detailed explanations thereof will be omitted.

[0039] 4 and 5 , the cooling water supplied from opening 14 flows through connecting passage C2 and is introduced into cooling medium supply passage C1 from in-port 15B via opening 15A formed downstream in the cooling medium flow direction of recess 27. Thereafter, the cooling water flows into first cooling medium passage A1 via first out-port 16B, and is subsequently supplied to second cooling medium passage A2 via the second out-port, to third cooling medium passage A3 via the third out-port, and to cooling medium passage A4 via the fourth out-port.

[0040] The cooling water supplied to each of the refrigerant flow paths A1 to A4 absorbs heat from the substrate portion 2 (actually cooled target substrate portion 4) that constitutes the peripheral wall of each of the refrigerant flow paths A1 to A4, thereby cooling the stacked cells S. Furthermore, other peripheral walls (other than the substrate portion) that define each of the refrigerant flow paths A1 to A4, i.e., the recesses 10 in the metal plate 11, are separated from the recesses 10 that constitute the other refrigerant flow paths, so that the thermal influence from other stacked cells is suppressed.

[0041] The cooling water in each of the coolant flow paths A1 to A4 flows from the discharge port 19 into the coolant discharge flow path D1, further flows from the opening 18 into the connecting path D2, and is discharged from the opening 17 to the outside.

[0042] As shown in Figures 6 and 7, the coolant discharge flow path D1 is a flow path defined by the bottom plate 31 and the recess 35. As shown in Figure 8, the connecting path D2 is a flow path defined by the recess 37 and the substrate portion 2. The cooling system shown in Figure 2 has a symmetrical structure in the vertical direction (the coolant discharge flow path D1 is on the top, and the coolant supply flow path C1 is on the bottom). Therefore, it is possible to introduce cooling water through the opening 17 and discharge it through the opening 14.

[0043] 2, the peripheral walls of the refrigerant supply flow path C1 and the refrigerant discharge flow path D1 are separated from the substrate 2. That is, recesses 10 that form the peripheral walls of each of the refrigerant flow paths A1 to A4 are interposed between the substrate 2 and bottom plate 21 that forms the peripheral wall of the refrigerant supply flow path C1 and bottom plate 31 that forms the peripheral wall of the refrigerant discharge flow path D1.

[0044] As a result, the cooling water flowing through the coolant supply flow path C1 is less susceptible to the thermal influence from the substrate portion 2, and is introduced into each of the coolant flow paths A1 to A4 under the same temperature conditions. Furthermore, even when the cooling water that has been heated when passing through each of the coolant flow paths A1 to A4 is discharged, the heat of the heated cooling water is prevented from returning to the substrate portion 2 because the coolant discharge flow path D1 is separated from the substrate portion 2.

[0045] In this example, the connecting paths C2 and D2 are arranged in the general area 8 of the substrate portion 2 where the stacked cells S are not arranged. This ensures more reliable heat insulation between the stacked cells S and the cooling water.

[0046] Second Embodiment Fig. 9 shows a cooling section on the bottom surface of a case section of an electricity storage device according to a second embodiment. In Fig. 9, the same elements as those in Fig. 2 are given the same reference numerals, and description thereof will be omitted.

[0047] 9, the cooling system of the second embodiment differs from the cooling system of the first embodiment in that it includes a refrigerant supply passage E. The cooling system of the second embodiment also differs from the cooling system of the first embodiment in that refrigerant discharge passages D3 and D4 are provided in positions corresponding to the refrigerant supply passages C1 and C2 instead of the refrigerant supply passages C1 and C2. The shapes of the refrigerant discharge passages D3 and D4 are the same as those of the refrigerant supply passages C1 and C2, respectively.

[0048] 9, when the refrigerant discharge flow path D1 is on the upper side and the refrigerant discharge flow path D3 is on the lower side in a plan view of the rear surface (bottom surface) of the substrate portion 2, the refrigerant supply flow path E is arranged to vertically divide each of the refrigerant flow paths A1 to A4. More specifically, the refrigerant supply flow path E is preferably arranged to vertically divide each of the refrigerant flow paths A1 to A4 into two.

[0049] 10, the refrigerant supply flow path E is formed by the bottom plate 121 and the recess 125. The refrigerant supply flow path E is also connected to the substrate unit 2 via an adapter 130, which serves to connect the opening 114A of the substrate unit 2 with the in-port 114B of the bottom plate 121. An out-port 116B is formed in the bottom plate 121, and the out-port 116B and the openings 116A of each of the refrigerant flow paths A1 to A4 form the refrigerant inlet 116.

[0050] 9, cooling water supplied from an opening 114A in the substrate 2 passes through an adapter 130 and is introduced from an in-port 114B into a coolant supply flow path E. Thereafter, the cooling water is supplied to each of the coolant flow paths A1 to A4 via an out-port 116B.

[0051] The cooling water supplied to each refrigerant flow path absorbs heat from the substrate portion 2 (actual cooling target substrate portion 4) that forms the peripheral wall of each refrigerant flow path A1 to A4, thereby cooling the stacked cells S. The cooling water in each refrigerant flow path A1 to A4 flows from outlets 26 and 19 into refrigerant discharge flow paths D1 and D3, and similarly flows further from openings 15 and 18 into connecting paths D2 and D4, and is discharged to the outside from openings 14 and 17.

[0052] In the cooling section configured in this manner, the refrigerant supply passage E is arranged between the refrigerant discharge passages D1 and D3 arranged at both ends of the refrigerant passage, thereby shortening the distance from the refrigerant inlet to the refrigerant outlet in each refrigerant passage, thereby improving the cooling efficiency for the stacked cells S.

[0053] In this example, the refrigerant supply flow path E is disposed at the center of each of the refrigerant flow paths A1 to A4, since the entire surface of the stacked cell S is evenly covered by the refrigerant flow paths A1 to A4. However, from the viewpoint of evenly cooling the stacked cell S, it is preferable to dispose the refrigerant supply flow path E at a position on the back surface of the substrate portion 2 corresponding to the region where the stacked cell S is disposed. Furthermore, it is even more preferable to dispose the refrigerant supply flow path E at a position corresponding to the center of the stacked cell S.

[0054] 11 shows a power storage device 200A according to a third embodiment. As shown in FIG. 11 , the third embodiment differs from the power storage devices according to the above-described embodiments in that the power storage device 200A includes a case portion 201.

[0055] 11 , the case 201 has a generally rectangular shape in a plan view, and a plurality of stacked cells S and a control device T are disposed inside the case 201. For convenience of explanation, in this embodiment, the refrigerant flow direction in the refrigerant supply flow path C1 shown in FIG. 11 is referred to as the left-right direction, the direction perpendicular to the left-right direction is referred to as the front-rear direction (inside-outside direction), and the direction perpendicular to the left-right direction and the front-rear direction is referred to as the up-down direction.

[0056] The case 201 includes a substrate 202, a first side plate 210, and a second side plate 220. The substrate 202 is formed in a generally U-shape in a front-to-rear direction when viewed from the side. The substrate 202 has a generally rectangular bottom plate on which a flow path is disposed, a pair of side plates extending upward from the left-to-right edges of the bottom plate, and flanges extending outward from the upper edges of the pair of side plates. A stacked cell S is placed on the bottom plate of the substrate 202, and a plate member joined to the flange portion of the substrate 202 is disposed on the opposite side (above) of the bottom plate of the substrate 202, sandwiching the stacked cell S therebetween. The plate member and the substrate 202 extend outward in the front-to-rear direction beyond the end positions of the stacked cells S disposed inside the case 201.

[0057] The first side plate 210 is disposed on the front side surface in the front-to-rear direction of the case 201. The first side plate 210 is formed in a box shape that is open on the outer side (front side), and has a U-shaped cross section in a cross section perpendicular to the left-to-right direction. When the first side plate 210 is disposed, the portion where the extended portion of the base plate 202 and the first side plate 210 overlap and are connected is the overhang portion 205.

[0058] The second side plate 220 is disposed on the rear side surface of the case 201 in the front-to-rear direction. The second side plate 220 is formed in a box shape that is open on the outer side (rear side), and has a U-shaped cross section perpendicular to the left-to-right direction. The width of the second side plate 220 in the front-to-rear direction (the direction in which the first side plate 210 and the second side plate 220 face each other) is formed to be shorter than the width of the first side plate 210 in the front-to-rear direction. In other words, when the cross sections of the first side plate 210 and the second side plate 220 are compared, the first side plate 210 has a longer length in the front-to-rear direction than the second side plate 220.

[0059] The overhang portion 205 is provided with a refrigerant inlet port C3 and an outlet port D3. The inlet port C3 and the outlet port D3 protrude upward from the overhang portion 205. A refrigerant supply pipe (refrigerant supply pipe) and an outlet pipe (refrigerant discharge pipe), not shown, are connected to the inlet port C3 and the outlet port D3. In this example, the inlet port C3 and the outlet port D3 are provided in the first side plate portion 210 (overhang portion 205), and the overhang portion 205 is provided by extending the substrate portion 202 in the front-rear direction to accommodate the inlet port C3, the outlet port D3, and the piping connected thereto. On the other hand, the width of the second side plate portion 220 is narrowed in the front-rear direction, thereby ensuring the mechanical rigidity of the case portion 201 and the volume for mounting the stacked cells S.

[0060] The coolant flow paths A1 to A4, coolant supply flow paths C1 and C2, and coolant discharge flow paths D1 and D2 that constitute the cooling section are configured in the same manner as those in FIG. 2, and therefore description thereof will be omitted.

[0061] 12 to 16 show a cooling section on the bottom surface of a case of a power storage device according to a fourth embodiment. The cooling system according to the fourth embodiment includes a substrate 402 and metal plates 411 a to 411 c corresponding to cooling plates, but differs from the power storage devices according to the above-described embodiments in the shapes of the substrate 402 and the metal plates 411 a to 411 c.

[0062] 12, first to fourth refrigerant flow paths A11 to A14 are provided as a cooling section on the back surface (bottom surface) of the substrate section 402. In FIG. 12, the z-axis direction is the thickness direction of the substrate section 402, and the x- and y-axis directions are the planar directions of the substrate section 402.

[0063] The first refrigerant flow path A11 includes a first flow path group and a second flow path group having similar shapes. The first flow path group includes three flow paths A11a to A11c extending in the y-axis direction and junctions 417a, 417b provided at both ends of the flow paths.

[0064] The second flow path group includes three flow paths A11d to A11f extending in the y-axis direction and junctions 417c and 417d provided at both ends thereof. An opening is provided between the first flow path group and the second flow path group, and the first flow path group and the second flow path group are separated from each other by a recess 420 provided in the substrate portion 402.

[0065] The shape protruding toward the negative side of the z-axis is referred to as a recess. The second to fourth refrigerant flow paths A12 to A14 are configured in the same manner as the first refrigerant flow path A11. As in the first embodiment, recesses 410 are formed in the metal plates 411a to 411c so that the first to fourth refrigerant flow paths A11 to A14 are positioned on the back surface of the substrate portion 402, facing the area in which the stacked cells S are arranged.

[0066] The first to fourth refrigerant flow paths A11 to A14 are each arranged to face the corresponding stacked cell S via the substrate portion 402. In each stacked cell S, single cells are stacked in the y-axis direction, which is the refrigerant flow direction of the first to fourth refrigerant flow paths A11 to A14. The stacked cells S are arranged in parallel in the x-axis direction. The stacked cells S facing the first to fourth refrigerant flow paths A11 to A14 correspond to the first to fourth cell bodies.

[0067] The first to fourth refrigerant flow paths A11 to A14 are arranged in this order in the positive direction of the x-axis. The first to fourth refrigerant flow paths A11 to A14 are spaced apart from one another. Refrigerant supply flow paths C11, C12 and refrigerant discharge flow paths D11, D12 are arranged around the peripheries of the first to fourth refrigerant flow paths A11 to A14. The refrigerant supply flow path C11 is provided at the end of the substrate portion 402 in the positive direction of the y-axis, and the refrigerant supply flow path C12 is provided at the end of the substrate portion 402 in the negative direction of the x-axis.

[0068] The negative x-axis end of refrigerant supply flow path C11 is connected to the positive y-axis end of refrigerant supply flow path C12, and refrigerant supply flow paths C11 and C12 have a generally L-shape as a whole. Refrigerant discharge flow path D11 is provided at the negative y-axis end of substrate portion 402, and refrigerant discharge flow path D12 is provided at the negative x-axis end of substrate portion 402. The negative x-axis end of refrigerant discharge flow path D11 is connected to the negative y-axis end of refrigerant discharge flow path D12, and refrigerant discharge flow paths D11 and D12 have a generally L-shape as a whole.

[0069] The first to fourth refrigerant flow paths A11 to A14, the refrigerant supply flow paths C11, C12 and the refrigerant discharge flow paths D11, D12 are arranged on the same plane (xy plane), and the refrigerant supply flow paths C11, C12 and the refrigerant discharge flow paths D11, D12 are arranged to surround the first to fourth refrigerant flow paths A11 to A14.

[0070] The substrate portion 402 is a flat plate, and the refrigerant supply channels C11, C12, first to fourth refrigerant channels A11 to A14, and refrigerant discharge channels D11, D12 are arranged so as not to overlap along the back surface of the substrate portion 402. The regions where the refrigerant supply channels C11, C12 and the refrigerant discharge channels D11, D12 are arranged are regions that do not face the stacked cells S across the substrate portion 402.

[0071] The first to fourth refrigerant flow paths A11 to A14 are shaped to be linearly symmetrical with respect to an axis of symmetry extending in the x-axis direction through the center of the y-direction of the substrate portion 402, and the refrigerant supply flow paths C11, C12 and the refrigerant discharge flow paths D11, D12 are also shaped to be linearly symmetrical with respect to this axis of symmetry.

[0072] The metal plate 411a has recesses 410a to 410f and recesses 425, 426, 428, and 429. The peripheral wall of the first refrigerant flow path A11 is formed by the substrate portion 402 and the recesses 410a to 410f. In this manner, the recesses 410a to 410f and the substrate portion 402 define the first refrigerant flow path A11.

[0073] In other words, the peripheral walls of the refrigerant flow paths are defined by the recesses 410a to 410f and the substrate portion 402. The recesses 410a to 410f can be referred to as refrigerant flow path forming recesses in the cooling plate. The second refrigerant flow paths A12 to A14 are similar to the first refrigerant flow path A11.

[0074] A portion of the peripheral wall of the refrigerant supply flow path C11 is formed by the substrate portion 402 and a recess 426. A portion of the peripheral wall of the refrigerant supply flow path C12 is formed by the substrate portion 402 and a recess 425. A portion of the peripheral wall of the refrigerant discharge flow path D11 is formed by the substrate portion 402 and a recess 429. A portion of the peripheral wall of the refrigerant discharge flow path D12 is formed by the substrate portion 402 and a recess 428.

[0075] The recesses 425 and 426 can be referred to as refrigerant supply passage forming recesses. The recesses 428 and 429 can be referred to as refrigerant discharge passage forming recesses. In this embodiment, the refrigerant supply portion forming recesses correspond to the refrigerant supply passage forming recesses, and the refrigerant discharge portion forming recesses correspond to the refrigerant discharge passage forming recesses.

[0076] Although reference numbers are omitted, similarly, recesses are formed in the metal plate 411b that form the peripheral wall of the second refrigerant flow path A12, the peripheral wall of the first flow path group of the third refrigerant flow path A13, part of the peripheral wall of the refrigerant supply flow path C11, and part of the peripheral wall of the refrigerant discharge flow path D11.

[0077] In addition, the metal plate 411c has recesses formed therein that form the peripheral wall of the fourth refrigerant flow path A14, the peripheral wall of the second flow path group of the third refrigerant flow path A13, part of the peripheral wall of the refrigerant supply flow path C11, and part of the peripheral wall of the refrigerant discharge flow path D11.

[0078] Metal plate 411a and metal plate 411b are connected to each other at connection portions 413a and 413b. Metal plate 411b and metal plate 411c are connected to each other at connection portions 413c and 413d. Each of connection portions 413a to 413d can be connected by, for example, butting the opposing surfaces of the metal plates to be connected together and welding them together.

[0079] If metal plate 411a is the first plate, metal plate 411b is the second plate, and the portion of recess 426 provided in metal plate 411a is the first refrigerant supply flow path-forming recess, and the portion provided in metal plate 411b is the second refrigerant supply flow path-forming recess, then by joining the first plate and the second plate, the first and second refrigerant supply flow path-forming recesses are connected, thereby forming a portion of refrigerant supply flow path C11.

[0080] Furthermore, if the portion of the recess 429 provided on the metal plate 411a is designated as the first refrigerant discharge channel-forming recess and the portion provided on the metal plate 411b is designated as the second refrigerant discharge channel-forming recess, the first and second refrigerant discharge channel-forming recesses are connected by joining the first and second plates. This forms a portion of the refrigerant discharge channel D11. Furthermore, the cooling plate includes a metal plate 411c that, like the first and second plates, has a refrigerant channel-forming recess, a refrigerant supply channel-forming recess, and a refrigerant discharge channel-forming recess. Similarly, joining the metal plates 411b and 411c also connects the refrigerant supply channel-forming recess and the refrigerant discharge channel-forming recess of each other.

[0081] Openings 415 and 418 are provided at the end of the substrate portion 402 in the negative direction of the x-axis and at approximately the center in the y-direction. The opening 415 corresponds to an inlet through which cooling water (refrigerant) is introduced into the cooling water supply flow path C12. The opening 418 corresponds to an outlet through which cooling water is discharged from the cooling water discharge flow path D12.

[0082] The refrigerant supply flow path C11 is connected to the first to fourth refrigerant flow paths A11 to A14 via outlet ports 416a to 416h, respectively. The refrigerant discharge flow path D11 is connected to the first to fourth refrigerant flow paths A11 to A14 via discharge ports 419a to 419h, respectively.

[0083] The cross-sectional area of ​​the outlet ports 416a to 416h is smaller than that of the refrigerant supply flow path C11, and the outlet ports 416a to 416h function as orifices. Similarly, the cross-sectional area of ​​the discharge ports 419a to 419h is smaller than that of the refrigerant discharge flow path D11, and the discharge ports 419a to 419h function as orifices. By functioning as orifices, the flow rates of the cooling water flowing through the first to fourth refrigerant flow paths A11 to A14 can be adjusted.

[0084] The cooling water introduced into the refrigerant supply flow path C12 from the opening 415 flows through the refrigerant supply flow path C12 in the positive direction of the y-axis and is introduced into the refrigerant supply flow path C11. The cooling water further flows through the refrigerant supply flow path C11 in the positive direction of the x-axis and is introduced into the first to fourth refrigerant flow paths A11 to A14 via the out-ports 416a to 416h.

[0085] In the first refrigerant flow path A11, the cooling water is introduced from the refrigerant supply flow path C11 through the outlet port 416a to the junction 417a, flows through the respective flow paths A11a to A11c in the negative y-axis direction, and then merges at the junction 417b.The cooling water is then discharged from the junction 417b to the refrigerant discharge flow path D11 through the discharge port 419a.

[0086] Similarly, the coolant introduced from outlet 416b to junction 417c flows through flow paths A11d to A11f in the negative direction of the y-axis and is discharged into refrigerant discharge flow path D11 via junction 417d and discharge port 419b. The coolant introduced from refrigerant supply flow path C11 into second to fourth refrigerant flow paths A12 to A14 via outlets 416c to 416h is similarly discharged into refrigerant discharge flow path D11 via discharge ports 419c to 419h.

[0087] The cooling water discharged into the coolant discharge flow path D11 flows in the negative direction of the x-axis and is introduced into the coolant discharge flow path D12. The cooling water then flows through the coolant discharge flow path D12 in the positive direction of the y-axis toward the opening 418 and is discharged from the opening 418.

[0088] In this way, the cooling water is supplied independently and in parallel to each refrigerant flow path A11 to A14, and the orifice function of the discharge ports 419a to 419h makes it possible to control the flow rate of the cooling water in each refrigerant flow path A11 to A14 according to the heat generation capacity of the stacked cell S that each refrigerant flow path A11 to A14 is responsible for.

[0089] With the cooling section configured in this manner, the height of the cooling plate (the width in the z-axis direction, which is the thickness direction of the substrate section 402) can be reduced by arranging the refrigerant supply flow paths C11, C12 and the refrigerant discharge flow paths D11, D12 using the back surface of the area on the periphery of the substrate section 402 where the stacked cells S are not arranged.

[0090] Furthermore, by connecting multiple metal plates 411a to 411c together and using them as cooling plates, the peripheral walls of the refrigerant flow paths can be configured, making it easy to increase or decrease the number of refrigerant flow paths A11 to A14. For example, by inserting two metal plates 411b between metal plates 411b and 411c shown in Figure 12, a cooling system with up to five and six refrigerant flow paths can be manufactured. As shown in Figure 12, metal plates 411a to 411c have recesses formed in their centers in the y direction that are symmetrical with respect to the axis of symmetry extending in the x-axis direction, so it is possible to combine some of the metal plates with each other with their orientation reversed in the y-axis direction.

[0091] In the above description, the metal plates 411a to 411c correspond to the first plate, the second plate, and the third plate, and correspond to the cooling plate when welded together at the connection portions 413a to 413d. A plurality of openings are formed in the cooling plate.

[0092] More specifically, openings are formed at the following locations: (1) between the refrigerant supply flow path C12 and the refrigerant discharge flow path D12 and the first flow path group of the first refrigerant flow path A11; (2) between the first flow path group and the second flow path group of the first refrigerant flow path A11; (3) between the second flow path group of the first refrigerant flow path A11 and the first flow path group of the second refrigerant flow path A12; (4) between the first flow path group and the second flow path group of the second refrigerant flow path A12; (5) between the second flow path group of the second refrigerant flow path A12 and the first flow path group of the third refrigerant flow path A13; (6) between the first flow path group and the second flow path group of the third refrigerant flow path A13; (7) between the second flow path group of the third refrigerant flow path A13 and the first flow path group of the fourth refrigerant flow path A14; and (8) between the first flow path group and the second flow path group of the fourth refrigerant flow path A14. The refrigerant flow paths A11 to A14 are separated from one another by the openings (1) to (8) above. Furthermore, the first flow path group and the second flow path group in each of the refrigerant flow paths A11 to A14 are also separated from one another.

[0093] The cooling system according to this embodiment can be manufactured by, for example, the following manufacturing method: preparing a substrate, a first molding step of molding a first plate having a first refrigerant flow path-forming recess and a first refrigerant supply flow path-forming recess, a second molding step of molding a second plate having a second refrigerant flow path-forming recess and a second refrigerant supply flow path-forming recess, a first welding step of welding opposing surfaces of the first and second plates, a second step of welding opposing surfaces of the first and second refrigerant supply flow path-forming recesses, and a step of welding the cooling plate obtained through the first and second welding steps to a rear surface of the substrate.

[0094] In the first forming step, the first plate is formed so that the portion to be welded to the second plate protrudes from other portions, and in the second forming step, the second plate is formed so that the portion to be welded to the first plate protrudes from other portions.

[0095] The outer periphery of the cooling plate and the periphery of the openings formed in (1) to (8) above are welded liquid-tightly to the back surface of the substrate portion 402 (the same applies to the following embodiments). As the welding method, a conventionally known method can be used.

[0096] Fifth Embodiment Figures 17 to 21 show a cooling section on the bottom surface of a case of an electricity storage device according to a fifth embodiment. In Figures 17 to 21, the same elements as those in Figure 12 and the like are designated by the same reference numerals, and their description will be omitted. In addition, the reference numerals for some of the same elements are omitted.

[0097] 17, the connecting portions 513a to 513d that connect the metal plates 511a to 511c to each other are formed in a flat plate shape, and a step portion is provided on the substrate portion 502 that faces the flat plate-shaped portion, which is different from the energy storage device shown in the fourth embodiment. Note that the flat plate shape is not limited to a strictly flat plate, and may include a substantially flat plate shape.

[0098] As shown in FIGS. 17 to 21, at positions facing the connecting portions 513a and 513b, the substrate portion 502 is provided with step portions 530a and 530b displaced in the positive direction of the z-axis.

[0099] Although a cross-sectional view is not shown, similarly, in connection portions 513c and 513d that connect metal plate 511b and metal plate 511c to each other, substrate portion 502 has a step portion at a position opposite connection portions 513c and 513d, and metal plates 511b and 511c are approximately flat.

[0100] 18 to 20 , by providing the step portion 530a in the substrate portion 502, the flow path cross-sectional area of ​​the refrigerant supply flow path C11 can be secured, and therefore the refrigerant supply path C11 can be formed in a substantially flat shape near the connection portion 513a. At the connection portion 513a, the opposing surface of the substantially flat metal plate 511a (the surface opposing the metal plate 511b) and the opposing surface of the substantially flat metal plate 511b (the surface opposing the metal plate 511a) can be connected to each other by welding or the like, thereby realizing an easy and reliable connection.

[0101] In the above, since the connection portion 513a is generally flat, the recess 526a forming the peripheral wall of the refrigerant supply flow path C11 of the metal plate 511a (first plate) rises in the positive direction of the z-axis toward the connection portion 513a (toward the positive direction of the x-axis) and reaches the flat portion of the metal plate 511a, where it terminates. The end of the recess 526a is integrally connected to the first plate connection portion (511a-1), which is the flat portion of the metal plate 511a. The first plate connection portion (511a-1) corresponds to a protruding element that protrudes in the positive direction of the x-axis from the portion of the metal plate 511a where the recess 526a is formed.

[0102] Similarly, recess 526b, which forms the peripheral wall of refrigerant supply channel C11 of metal plate 511b (second plate), rises in the positive direction of the z-axis toward connection portion 513a (toward the negative direction of the x-axis) and reaches the flat portion of metal plate 511b, where it terminates. The end of recess 526b is integrally connected to the y-axis second plate connection portion (511b-1), which is the flat portion of metal plate 511b. Second plate connection portion (511a-b) corresponds to a protruding element that protrudes in the negative direction of the x-axis from the portion of metal plate 511b where recess 526b is formed.

[0103] As described above, the metal plate 511a (an example of a first plate) has a substantially flat first plate connecting portion 511a-1 that is continuous with the first refrigerant supply flow path forming recess, and the metal plate 511b (an example of a second plate) has a substantially flat second plate connecting portion 511b-1 that is continuous with the second refrigerant supply flow path forming recess. The first plate connecting portion 511a-1 and the second plate connecting portion 511b-1 are joined at their opposing surfaces, thereby connecting the metal plates 511a and 511b.

[0104] The substrate portion 502 includes a step portion 530a that is displaced toward the surface of the substrate portion 502 at a position facing the first plate connecting portion 511a-1 and the second plate connecting portion 511b-1, and therefore the step portion 530a and the first and second plate connecting portions 511a-1, 511b-1 form a refrigerant supply flow path C11 at the connecting portion 513a. At the connecting portion 513a, the refrigerant supply flow path C11 is secured, and the opposing surfaces of the substantially flat first plate connecting portion 511a-1 and the second plate connecting portion 511b-1 can be joined by welding or the like, thereby realizing an easy and reliable connection.

[0105] 21 , even at the connection portion 513b of the refrigerant discharge flow path D11, the step portion 530b of the substrate portion 502 ensures a sufficient flow path cross-sectional area of ​​the refrigerant discharge flow path D11, and therefore the refrigerant discharge flow path D11 can be formed in a substantially flat shape near the connection portion 513b. At the connection portion 513b, the opposing surface of the substantially flat metal plate 511a (the surface opposing the metal plate 511b) and the opposing surface of the substantially flat metal plate 511b (the surface opposing the metal plate 511a) can be connected to each other by welding or the like, thereby achieving an easy and reliable connection.

[0106] In this case, a third plate connection portion (511a-2) is formed as a protruding element that protrudes in the positive direction of the x-axis relative to the portion of the metal plate 511a (first plate) where the recess 529a is formed. Similarly, a fourth plate connection portion (511b-2) is formed as a protruding element that protrudes in the negative direction of the x-axis relative to the portion of the metal plate 511b (second plate) where the recess 529b is formed. Although not shown, the other connection portions 513c and 513d are also similarly configured such that the opposing, substantially flat surfaces of the metal plates 511b and 511c are connected to each other by welding or the like.

[0107] Sixth Embodiment Fig. 22 shows a cooling section on the bottom surface of a case of a power storage device according to a sixth embodiment. In Fig. 22, the same elements as those in Fig. 12 and the like are designated by the same reference numerals, and their description will be omitted. In addition, the reference numerals are omitted for some of the same elements.

[0108] The cooling section of FIG. 22 differs from the electricity storage device shown in the fourth embodiment in that the cooling plate is made up of four metal plates 611a to 611d.

[0109] The metal plates 611a to 611d are provided with first to fourth refrigerant flow paths A11 to A14, respectively. The metal plates 611b and 611c have the same shape. The metal plates 611a to 611d are connected to each other at connection portions 613a to 613f. Because the cooling plate is made up of four metal plates 611a to 611d and the metal plates 611a to 611d correspond to the first to fourth refrigerant flow paths A11 to A14, respectively, which correspond to the four stacked cells S, the number of refrigerant flow paths can be increased or decreased more flexibly and easily.

[0110] 12 may be used in combination with the metal plates 411a to 411c and the metal plates 611a to 611d. The number of metal plates may be the same as or different from the number of stacked cells S and their corresponding refrigerant flow paths. For example, the first to fourth refrigerant flow path forming recesses that form the peripheral walls of the first to fourth refrigerant flow paths A11 to A14 may be provided on four metal plates as in this embodiment, or may be provided on two or three metal plates, or may be provided on five or more metal plates.

[0111] Seventh Embodiment Fig. 23 shows a cooling section on the bottom surface of a case of a power storage device according to a seventh embodiment. In Fig. 23, the same elements as those in Fig. 17 are designated by the same reference numerals, and their description will be omitted. In addition, the reference numerals for some of the same elements are omitted.

[0112] In the cooling unit of Fig. 23, the cooling plate is composed of four metal plates 711a to 711d, similar to Fig. 22. Also, in the cooling unit of Fig. 23, the connection portions 713a to 713f that connect the metal plates 711a to 711d to one another are substantially flat, similar to Fig. 17, and a step portion is provided on the substrate portion 702 that faces this substantially flat portion.

[0113] 24 to 27 show a cooling section on the bottom surface of a case of an electricity storage device according to an eighth embodiment. In Fig. 24, the same elements as those in Fig. 17 are designated by the same reference numerals, and their description will be omitted. In addition, the reference numerals for some of the same elements are omitted.

[0114] In the cooling unit of Fig. 24, the cooling plate includes four metal plates 811a-811d and flat plate-like members 881a-881f. In the example of Fig. 17 (same as in Fig. 22), the metal plates 511a-511c (metal plates 611a-611d in the example of Fig. 22) each include first and second plate connecting portions, which are flat protruding elements. In this example, these plate connecting portions are replaced with plate-like members. These plate-like members are welded to the ends of the refrigerant supply flow path-forming recesses of the opposing metal plates.

[0115] That is, one end of plate-shaped member 881a is welded to the end of the refrigerant supply flow path-forming recess in metal plate 811a, which is located in the positive direction of the y axis, on the positive side of the x axis, and the other end is welded to the end of the refrigerant supply flow path-forming recess in metal plate 811b, which is located in the negative direction of the x axis, on the positive side of the y axis. One end of plate-shaped member 881b is welded to the end of the refrigerant discharge flow path-forming recess in metal plate 811a, which is located in the negative direction of the y axis, on the positive side of the x axis, and the other end is welded to the end of the refrigerant discharge flow path-forming recess in metal plate 811b, which is located in the negative direction of the y axis, on the negative side of the x axis. Plate-shaped members 881c to 881f are similarly welded to the opposing metal plates 811b to 811d.

[0116] A step 830a is formed in the region of the substrate portion 802 facing the connection portion 813 (see FIGS. 26 and 27), ensuring the function of the refrigerant supply flow path C11. Although a cross-sectional view is not shown, the third plate connection portion 511a-2 and the fourth plate connection portion 511b-2, which are the protruding elements shown in FIG. 20, can also be substituted with a plate-like member 881b in the connection portion 813b. A step is also provided in the region of the substrate portion 802 facing the connection portion 813b, ensuring the function of the refrigerant discharge flow path D11. The same is true for the connection portions 813c to 813f.

[0117] By using the plate-like members described above, it is possible to eliminate the protruding elements (first to fourth plate connection portions 511a-1, 511b-1, 511a-2, 511b-2: see FIGS. 18 to 21). This improves the yield when manufacturing the metal plates 811a and 811b, and reduces manufacturing costs. The same applies to the other metal plates 811c and 811d.

[0118] In the first to eighth embodiments, the first to fourth refrigerant flow paths A11 to A14 are each provided with three parallel flow paths in the first and second flow path groups, but this is not limiting. The number of flow paths included in each of the first to fourth refrigerant flow path groups A11 to A14 can be changed as appropriate.

[0119] Ninth embodiment Fig. 28 shows a cooling section on the bottom surface of the case of a power storage device according to a ninth embodiment. In Fig. 28, the same elements as those in Fig. 22 are designated by the same reference numerals, and their description will be omitted. In addition, the reference numerals for some of the same elements are omitted.

[0120] The cooling unit in Fig. 28 differs from the power storage device according to the sixth embodiment in the configuration of the first to fourth refrigerant flow paths A31 to A34. The first to fourth refrigerant flow paths A31 to A34 have the same shape and are composed of two flow paths (e.g., flow paths A31a and A31b) that meander in the y-axis direction. The flow path A31a and the flow path A31b are configured to be line-symmetrical with respect to a symmetry axis P1 that is parallel to the y-axis shown in Fig. 28.

[0121] The other first to fourth refrigerant flow paths described in the above embodiments may be replaced with the first to fourth refrigerant flow paths A31 to A34.

[0122] 29 to 36 show a cooling section on the bottom surface of a case of a power storage device according to a tenth embodiment. In Fig. 29 to 36, the same elements as those in Fig. 12 and the like are designated by the same reference numerals, and their description will be omitted. In addition, the reference numerals for some of the same elements are omitted.

[0123] The energy storage device according to the tenth embodiment differs from the energy storage device according to the sixth embodiment in the shape of the substrate portion 1002 and the shapes of the metal plates 1011a to 1011d corresponding to the cooling plates.

[0124] As shown in Fig. 29, the back surface (bottom surface) of the substrate unit 1002 is provided with first to fourth refrigerant flow paths A41 to A44 as a cooling unit. A refrigerant supply flow path C41 is provided on the peripheral edge portion on the positive side of the y-axis relative to the first to fourth refrigerant flow paths A41 to A44. As shown in Figs. 29 to 31, the peripheral walls of the first to fourth refrigerant flow paths A41 to A44 and the refrigerant supply flow path C41 are formed by recesses (refrigerant flow path forming recess 1010, refrigerant supply flow path forming recess 1026) formed on the back surface side (negative side of the z-axis) of the substrate unit 1002 and in the metal plates 1011a to 1011d.

[0125] 29 and 32, a refrigerant discharge flow path D41 is provided on the front surface side (positive side of the z-axis) of the substrate part 1002, at a position facing the ends of the first to fourth refrigerant flow paths A41 to A44 on the positive side of the y-axis. The peripheral wall of the refrigerant discharge flow path D41 is formed by a convex portion (refrigerant discharge flow path forming convex portion 1029) formed on the front surface side of the substrate part 1002 and on the metal plate 1080. The shape protruding on the positive side of the z-axis is referred to as a convex portion.

[0126] An opening 1015 is provided at the end of the substrate portion 1002 in the positive direction of the y-axis and at approximately the center in the x-axis direction. The opening 1015 corresponds to an inlet through which cooling water is introduced into the coolant supply flow path C41. An opening 1018 is provided at approximately the center in the x-axis direction of the metal plate 1080. The opening 1018 corresponds to an outlet through which cooling water is discharged from the coolant discharge flow path D41.

[0127] The refrigerant supply flow path C41 is connected to each of the first to fourth refrigerant flow paths A41 to A44 via two outlet ports, and the refrigerant discharge flow path D41 is connected to each of the first to fourth refrigerant flow paths A41 to A44 via four outlet ports.

[0128] The refrigerant supply flow path C41 is connected to the first refrigerant flow path A41 via outlets 1016a and 1016b, respectively. The refrigerant discharge flow path D41 is connected to the first refrigerant flow path A41 via discharge ports 1019a to 1019d, respectively. The cross-sectional areas of the outlets 1016a and 1016b are smaller than the cross-sectional area of ​​the refrigerant supply flow path C41, and the out-ports 1016a and 1016b function as orifices.

[0129] The outlet ports 1016a and 1016b are formed in the same manner as the exhaust port 1016e shown in Fig. 34. Similarly, the flow path cross-sectional area of ​​the exhaust ports 1019a to 1019d is smaller than the flow path cross-sectional area of ​​the refrigerant exhaust flow path D41, and the exhaust ports 1019a to 1019d function as orifices. The exhaust ports 1019a to 1019d are formed in the same manner as the exhaust port 1019i shown in Fig. 35.

[0130] The first refrigerant flow path A41 includes a first flow path and a second flow path having similar shapes. The first flow path of the first refrigerant flow path A41 includes an upstream flow path A41a extending from the outlet 1016a toward the negative side of the y axis, and downstream flow paths A41b and A41c connected to the end of the upstream flow path A41a on the negative side of the y axis. The downstream flow paths A41b and A41c make U-turns from the end of the upstream flow path A41a on the negative side of the y axis to both sides in the x axis direction (left and right sides as shown in FIG. 29 ) and extend to the discharge ports 1019a and 1019b on the positive side of the y axis.

[0131] Similarly, the second flow path of the first refrigerant flow path A41 includes an upstream flow path A41d extending from the outlet 1016b to the negative side of the y-axis, and downstream flow paths A41e and A41f connecting to the end of the upstream flow path A41d on the negative side of the y-axis and extending to the exhaust ports 1019c and 1019d. The first and second flow paths are separated by a recess 1020 provided in the substrate portion 1002.

[0132] The cooling water introduced into the cooling medium supply flow path C41 from the opening 1015 is introduced into the first cooling medium flow path A41 via the outlets 1016a and 1016b. In the first cooling medium flow path A41, the cooling water flows from the outlets 1016a and 1016b through the upstream flow paths A41a and A41d in the negative direction of the y-axis and is introduced into the downstream flow paths A41b, A41c, A41e, and A41f.

[0133] The cooling water flows through the downstream flow paths A41b, A41c, A41e, and A41f in the positive direction of the y-axis and is discharged into the refrigerant discharge flow path D41 via the discharge ports 1019a to 1019d. The cooling water discharged into the refrigerant discharge flow path D41 is then discharged from the opening 1018.

[0134] The second to fourth refrigerant flow paths A42 to A44 are configured in the same manner as the first refrigerant flow path A41. As in the sixth embodiment and the like, refrigerant flow path forming recesses 1010 are formed in the metal plates 1011a to 1011d so that the first to fourth refrigerant flow paths A41 to A44 are arranged opposite the stacked cells S on the back surface of the substrate portion 1002. The first to fourth refrigerant flow paths A41 to A44 are each arranged opposite the corresponding stacked cells S across the substrate portion 1002.

[0135] The first to fourth refrigerant flow paths A41 to A44 are arranged in this order in the positive direction of the x-axis. The first to fourth refrigerant flow paths A41 to A44 are spaced apart from one another. The refrigerant supply flow path C41 is arranged on the periphery of the first to fourth refrigerant flow paths A41 to A44. The first to fourth refrigerant flow paths A41 to A44 and the refrigerant supply flow path C41 are arranged on the same plane (xy plane).

[0136] The region where the refrigerant supply flow path C41 is arranged is a region that does not face the stacked cells S across the substrate portion 1002. The refrigerant discharge flow path D41 is arranged near a region that faces the periphery of the first to fourth refrigerant flow paths A41 to A44 across the substrate portion 1002. The region where the refrigerant discharge flow path D41 is arranged is a region that does not face the stacked cells S across the substrate portion 1002.

[0137] As in this embodiment, the first to fourth refrigerant flow paths A41 to A44 may be configured to make a U-turn, and the shape and position of the refrigerant supply flow path C41 and the refrigerant discharge flow path D41 may be changed depending on the shape of the first to fourth refrigerant flow paths A41 to A44.

[0138] According to this embodiment, one of the refrigerant supply flow path C41 and the refrigerant discharge flow path D41 is disposed on the rear surface side of the substrate portion 1002, and the other is disposed on the front surface side of the substrate portion 1002. Therefore, even when the outlet ports and discharge ports of the first to fourth refrigerant flow paths A41 to A44 are located on the same peripheral edge relative to the first to fourth refrigerant flow paths A41 to A44, the height (width in the z-axis direction) of the cooling plate can be reduced.

[0139] In the above embodiments, an electric storage device has been described as an example of a battery device, but the present invention is not limited thereto and may be a primary battery or a fuel cell. Furthermore, a stacked cell S has been described as an example of a cell body, but the present invention is not limited thereto and may be a single cell including a pair of electrodes, or a modularized single cell or stacked cell. Furthermore, the cell body is a single cell capable of discharging electric power, a stacked body of such cells, or a module of these. Examples of cells include secondary batteries, such as lithium batteries, which generate heat during charging and / or discharging, and fuel cells that use hydrogen or the like as a fuel gas.

[0140] In the above embodiments, the configurations functioning as orifices are provided in both the out-port and the exhaust port, but this is not limiting. The configurations functioning as orifices may be provided in only one of the out-port and the exhaust port. Furthermore, the configurations functioning as orifices do not have to be uniform, and the throttling amount may be adjusted appropriately for each port. For example, the throttling amount of the out-port and the exhaust port connected to the same refrigerant flow path may be different.

[0141] In addition, for example, the throttling amount may be different between outlet ports connected to different refrigerant flow paths, and similarly, the throttling amount may be different between outlet ports connected to different refrigerant flow paths. In this way, by appropriately providing a structure that functions as an orifice at the inlet and / or outlet of each refrigerant flow path, the flow rate of each refrigerant flowing in parallel can be individually and optimally set.

[0142] In the above embodiments, the substrate is described as being flat, but this is not limiting. Furthermore, the material forming at least the rear surface of the substrate is also required to have thermal conductivity and resistance to refrigerant corrosion, and stainless steel, for example, is used.

[0143] (Effects) The cooling system according to aspect 1 of the present disclosure is a cooling system for a battery device, comprising a substrate portion of a case incorporating a cell body of a battery device, and a cooling plate attached to the substrate portion, and comprising a first refrigerant flow path and a second refrigerant flow path spaced apart from the first refrigerant flow path, the rear surface of the substrate portion constituting peripheral walls of the first refrigerant flow path and the second refrigerant flow path, the cooling plate comprising a first plate forming another peripheral wall of the first refrigerant flow path and a second plate forming another peripheral wall of the second refrigerant flow path, the first plate and the second plate being attached to the area on the rear surface of the substrate portion where the cell body is arranged.

[0144] According to the above configuration, the first refrigerant flow path and the second refrigerant flow path share the back surface of the substrate portion of the case as a peripheral wall, so that the cell body within the case can be efficiently cooled by the refrigerant, such as cooling water, flowing through each flow path. Furthermore, the first refrigerant flow path and the second refrigerant flow path are spaced apart, and the first plate constituting the other peripheral wall of the first refrigerant flow path (the peripheral wall other than the substrate portion; the same applies hereinafter) and the second plate constituting the other peripheral wall of the second refrigerant flow path are attached to the back surface of the substrate portion in an area where the cell body is located. Thus, in the cooling system for a battery device according to Aspect 1, the refrigerant flow paths (first and second refrigerant flow paths) of the cooling unit share the portion of the substrate portion of the case where the cell body is located (the substrate portion to be actually cooled) as their peripheral wall.

[0145] Therefore, the refrigerant is less susceptible to the thermal influence of regions other than the substrate portion that is the actual target of cooling, and can efficiently remove heat from the substrate portion that is the actual target of cooling, thereby efficiently cooling the cell body, which contributes to improving the cooling effect of the refrigerant on the battery device.

[0146] As power supplies become more powerful and their lifespans increase, the cell body can generate more heat. In this case, if the cooling section has only one refrigerant flow path, the temperature of the refrigerant varies between the upstream and downstream sides (the latter being higher), resulting in a difference in cooling capacity. This difference is particularly pronounced in configurations where the back surface of the case substrate is used as part of the peripheral wall that forms the refrigerant flow path.

[0147] A cooling system according to a second aspect of the present disclosure may be configured in the first aspect described above, further comprising a refrigerant supply unit that independently supplies refrigerant to the first refrigerant flow path and the second refrigerant flow path in parallel.

[0148] According to the above configuration, the refrigerant is supplied to the first refrigerant flow path and the second refrigerant flow path independently in parallel, so that the temperature of the refrigerant flowing through one refrigerant flow path is not affected by the temperature of the other refrigerant flow path, and the temperatures of the refrigerant flowing through the first and second refrigerant flow paths can be controlled independently. As a result, the cell bodies covered by the first refrigerant flow path and the cell bodies covered by the second refrigerant flow path can be cooled under conditions suitable for each (including the same conditions).

[0149] Here, "supplying the refrigerant independently to the first refrigerant flow path and the second refrigerant flow path" refers to a relationship in which the first refrigerant flow path and the second refrigerant flow path are parallel to each other in the refrigerant supply flow path. This includes not only a case where a refrigerant supply flow path independent from a refrigerant supply source is provided to each refrigerant flow path, but also a case where a refrigerant is supplied to each refrigerant flow path by branching from a single refrigerant supply flow path connected to the refrigerant supply source.

[0150] A cooling system according to aspect 3 of the present disclosure may be configured in the above-described aspect 2 such that the refrigerant supply unit includes a refrigerant supply flow path, and the refrigerant supply flow path includes an inlet for taking in the refrigerant, a first outport for sending the refrigerant to the first refrigerant flow path, and a second outport for sending the refrigerant to the second refrigerant flow path.

[0151] According to the above configuration, a refrigerant supply section for independently supplying refrigerant to the first and second refrigerant flow paths employs a refrigerant supply flow path with a simple configuration including one in-port and two out-ports (a first out-port to the first refrigerant flow path and a second out-port to the second refrigerant flow path), which facilitates assembly of the cooling system and reduces manufacturing costs for the cooling system and the cooling assembly and battery device that include the cooling system.

[0152] A cooling system according to a fourth aspect of the present disclosure may be configured in the third aspect described above, wherein the refrigerant supply channel has a reduced channel cross-sectional area at the first out-port and the second out-port.

[0153] According to the above configuration, the flow path cross-sectional area of ​​the first and second out-ports is smaller than the flow path cross-sectional area of ​​the other portion of the refrigerant supply flow path, so that the first and second out-ports function as orifices.

[0154] The first and second out-ports each function as an orifice, creating resistance to the flow of refrigerant introduced into the refrigerant supply channel. This prevents the refrigerant from preferentially flowing into one of the refrigerant channels. In other words, it is possible to prevent the refrigerant from being unable to flow into one of the refrigerant channels.

[0155] The cross-sectional area of ​​each refrigerant flow path can be reduced by narrowing the space defined by the peripheral wall or by inserting other members such as pins into each out-port. In the refrigerant supply flow path, the cross-sectional area of ​​each out-port can be increased with increasing distance from the refrigerant inlet, thereby making the amount of refrigerant supplied to each refrigerant flow path uniform. The cross-sectional area of ​​each out-port can also be adjusted depending on the cooling capacity required for each refrigerant flow path.

[0156] A cooling system according to a fifth aspect of the present disclosure may be configured in the third aspect above such that a peripheral wall of the coolant supply channel is spaced apart from a base portion of the case.

[0157] According to the above configuration, the peripheral wall constituting the refrigerant supply flow path is separated from the substrate portion of the case, so that the thermal effect from the substrate portion on the refrigerant flowing through the refrigerant supply flow path can be suppressed, and thus the refrigerant capacity of the refrigerant supplied from each out-port of this refrigerant supply flow path in the first and second refrigerant flow paths is ensured.

[0158] The cooling system according to aspect 6 of the present disclosure may be configured in the above-described aspect 5 such that the peripheral wall of the first refrigerant flow path and the peripheral wall of the second refrigerant flow path are interposed between the peripheral wall of the refrigerant supply flow path and the substrate portion.

[0159] According to the above configuration, the first and second refrigerant flow paths are interposed between the refrigerant supply flow path and the substrate portion. In other words, the refrigerant supply flow path is stacked on the first and second refrigerant flow paths, and the refrigerant supply flow path is separated from the substrate portion, which is a heat source. Therefore, the thermal effect of the substrate portion on the refrigerant in the refrigerant supply flow path can be suppressed.

[0160] A cooling system according to aspect 7 of the present disclosure may be configured in the above-described aspect 5 such that the refrigerant supply flow path is separate from the first and second refrigerant flow paths, and the peripheral wall is a substrate portion that is not thermally affected by the cell body.

[0161] According to the above configuration, the coolant supply channel is formed in the substrate portion that is not affected by heat from the cell body, so that the thermal effect of the substrate portion on the coolant in the coolant supply channel can be suppressed.

[0162] A cooling system according to aspect 8 of the present disclosure may be configured in the above-described aspect 6 such that the case contains a first cell body and a second cell body in parallel, the first refrigerant flow path is arranged opposite the first cell body, and the second refrigerant flow path is arranged opposite the second cell body.

[0163] According to the above configuration, the first refrigerant flow path and the second refrigerant flow path are arranged opposite the first cell body and the second cell body, respectively, so that each cell body can be cooled efficiently.

[0164] A cooling system according to aspect 9 of the present disclosure may be configured in the above-described aspect 8 such that the refrigerant supply flow path overlaps the first refrigerant flow path and the second refrigerant flow path and is arranged perpendicular to the direction in which they are aligned.

[0165] According to the above configuration, the coolant supply channel is disposed over the first and second coolant channels, and a first out-port is provided in the coolant supply channel at a portion facing the first coolant channel, and a second out-port is provided in the coolant supply channel at a portion facing the second coolant channel. In this configuration, by arranging the coolant supply channel perpendicular to the arrangement direction of the first and second coolant channels, the length of the coolant supply channel can be minimized. This reduces the thermal effect of the substrate on the coolant in the coolant supply channel.

[0166] A cooling system according to aspect 10 of the present disclosure may be configured in the above-mentioned aspect 9 such that the refrigerant supply flow path is arranged at the end edges of the first refrigerant flow path and the second refrigerant flow path in a plan view.

[0167] A cooling system according to aspect 11 of the present disclosure may be configured in the above-described aspect 9 such that, when viewed in a plane, the refrigerant supply flow path is arranged to divide the first refrigerant flow path and the second refrigerant flow path, preferably to divide it into two.

[0168] A cooling system according to aspect 12 of the present disclosure may be configured in the above-described aspect 3 such that the refrigerant supply flow path, the first refrigerant flow path, and the second refrigerant flow path are arranged on the same plane parallel to the rear surface of the substrate portion.

[0169] According to the above configuration, for example, when there is an area on the periphery of the substrate portion where no cell body is arranged, by arranging a refrigerant supply flow path in that peripheral area, the refrigerant supply flow path, the first refrigerant flow path and the second refrigerant flow path can be arranged on the same plane, and the height of the cooling plate (width in the thickness direction of the substrate) can be reduced.

[0170] A cooling system according to aspect 13 of the present disclosure may be configured in the above-described aspect 12 such that the refrigerant supply flow path is arranged around the periphery of the first refrigerant flow path and the second refrigerant flow path so as to surround the first refrigerant flow path and the second refrigerant flow path.

[0171] According to the above configuration, the coolant supply passages are arranged so as to surround the respective coolant passages, thereby reducing the distance between the former and latter passages, thereby enabling the cooling plate to be made compact.

[0172] A cooling system according to aspect 14 of the present disclosure may be configured in the above-described aspect 12 such that the first plate has a first refrigerant supply flow path forming recess and the second plate has a second refrigerant supply flow path forming recess, and by joining the first and second plates, the first and second refrigerant supply flow path forming recesses are connected, and the refrigerant supply flow path is formed by the joined first and second refrigerant supply flow path forming recesses and the back surface of the substrate portion.

[0173] According to the above configuration, the independent first and second plates each have an area (first and second coolant supply channel forming recesses) that forms the peripheral wall of the coolant supply channel, which leads to higher performance of the parts and ultimately to a reduction in the number of products. In addition, since the cooling plate with the coolant supply channel is constructed simply by connecting the first and second plates together, manufacturing costs are reduced.

[0174] As described above, the cooling plate is formed by connecting the first and second plates, so the number of first and second refrigerant flow paths can be easily increased or decreased. Of course, by preparing third to n plates with the same or similar structure as the first and second plates, it is possible to arbitrarily increase or decrease the number of refrigerant flow paths depending on the shape of the back surface of the substrate.

[0175] A cooling system according to aspect 15 of the present disclosure may be configured in the above-described aspect 14, wherein the first plate has a flat first plate connecting portion that is continuous with the first refrigerant supply flow path forming recess, the second plate has a flat second plate connecting portion that is continuous with the second refrigerant supply flow path forming recess, the first plate connecting portion and the second plate connecting portion are connected when the first plate and the second plate are joined, and the substrate portion has a step portion that is displaced toward the surface of the substrate portion at a position opposite the first plate connecting portion and the second plate connecting portion, and the step portion and the first and second plate connecting portions form the refrigerant supply flow path.

[0176] According to the above configuration, the first and second plate connection portions are flat, which facilitates welding of the two plates. Here, "flat" refers to a state in which the plate-shaped members constituting the first and second plates are not subjected to any textured processing. Furthermore, "flat" includes a substantially flat shape.

[0177] A cooling system according to aspect 16 of the present disclosure may be configured such that, in aspect 15 above, the first plate connection portion and the second plate connection portion are replaced by flat plate-like members, one end of which is connected to the first refrigerant supply flow path forming recess and the other end of which is connected to the second refrigerant supply flow path forming recess.

[0178] According to the above configuration, the protruding elements from the first and second plates are replaced with inexpensive flat plate-like members, thereby reducing the number of protruding elements, thereby improving the yield when manufacturing each plate and reducing manufacturing costs.

[0179] A cooling assembly according to aspect 17 of the present disclosure may be configured in any of aspects 1 to 16 above, comprising the cooling system and a case including a substrate portion of the cooling system and incorporating a cell body of the battery device.

[0180] The above configuration provides the same effects as the cooling systems according to aspects 1 to 16 of the present disclosure.

[0181] A cooling assembly according to aspect 18 of the present disclosure may be configured as in aspect 17 above, further comprising a refrigerant supply section that supplies refrigerant to the first refrigerant flow path and the second refrigerant flow path independently and in parallel, the case having a first side panel section with a U-shaped cross section, the base section having an extended edge, the first side panel section being connected to the extended edge to form an overhang section, the refrigerant supply section having a refrigerant supply flow path, and an in port that takes in the refrigerant of the refrigerant supply flow path being open at the overhang section.

[0182] According to the above configuration, at least one side plate portion (first side plate portion) of the case has a U-shaped cross section, thereby ensuring the shape retention of the case. The extension portion of the base plate portion is connected to this first side plate portion as an overhang portion. The first side plate portion with a U-shaped cross section has high shape retention, i.e., high mechanical rigidity, and is therefore resistant to deformation even when subjected to external impact. Therefore, piping from a refrigerant pump arranged outside the cooling assembly can be stably arranged in this overhang portion. Furthermore, by opening the inlet of the refrigerant supply flow path in this overhang portion, the connection between the refrigerant supply flow path and the refrigerant piping from the outside is stably established.

[0183] A cooling assembly according to aspect 19 of the present disclosure may be configured in the above-described aspect 18 such that the case has the first side plate portion and a second side plate portion having a U-shaped cross section, the first side plate portion being formed wider than the second side plate portion, and a refrigerant supply pipe for supplying the refrigerant to the in port is disposed on the first side plate portion.

[0184] According to the above-described configuration, since both the first and second side plates have a U-shaped cross section, the mechanical rigidity of the case is ensured. By making the first side plate, where the refrigerant supply pipe is located, wide and the second side plate, where no such component is located, narrow, the mechanical rigidity of the case can be ensured while making the internal volume as large as possible.

[0185] A battery device according to aspect 20 of the present disclosure may be configured in any of aspects 1 to 16 above, including the cooling system, a case including a substrate portion of the cooling system, and a cell body built into the case.

[0186] The above configuration provides the same effects as the cooling systems according to aspects 1 to 16 of the present disclosure.

[0187] A battery device according to aspect 21 of the present disclosure is a battery device comprising a case incorporating a cell body and a cooling section arranged on the rear surface of a substrate section of the case, wherein the cooling section comprises a first refrigerant flow path and a second refrigerant flow path spaced apart from the first refrigerant flow path, the rear surface of the substrate section forms peripheral walls of the first refrigerant flow path and the second refrigerant flow path, the other peripheral walls of the first refrigerant flow path are formed by a first plate, and the other peripheral walls of the second refrigerant flow path are formed by a second plate, and the first plate and the second plate are attached to the area on the rear surface of the substrate section where the cell body is arranged.

[0188] A cooling method for a battery device according to aspect 22 of the present disclosure is a method for cooling a battery device comprising: a base portion of a case incorporating a cell body; and a cooling plate attached to the base portion, the battery device comprising a first refrigerant flow path and a second refrigerant flow path separated from the first refrigerant flow path; a back surface of the base portion constituting peripheral walls of the first refrigerant flow path and the second refrigerant flow path; the cooling plate comprising a first plate forming another peripheral wall of the first refrigerant flow path and a second plate forming another peripheral wall of the second refrigerant flow path; the first plate and the second plate being attached to an area on the back surface of the base portion where the cell body is arranged; and the method for cooling a battery device wherein refrigerant is supplied independently and in parallel to the first refrigerant flow path and the second refrigerant flow path.

[0189] A cooling plate according to aspect 23 of the present disclosure is a cooling plate attached to a substrate of a case incorporating a cell body of a battery device, and constituting a cooling system for the battery device together with the substrate, wherein the back surface of the substrate comprises a first plate that forms the peripheral walls of a first refrigerant flow path and a second refrigerant flow path spaced from the first refrigerant flow path and has a first refrigerant flow path forming recess that forms another peripheral wall of the first refrigerant flow path, a second plate that has a second refrigerant flow path forming recess that forms another peripheral wall of the second refrigerant flow path, and a refrigerant supply portion forming recess that supplies refrigerant to the first refrigerant flow path and the second refrigerant flow path independently in parallel.

[0190] The cooling plate according to aspect 24 of the present disclosure may be configured such that, in the above-mentioned aspect 23, the refrigerant flow path forming recess, the first refrigerant flow path forming recess, and the second refrigerant flow path forming recess are arranged on the same plane parallel to the rear surface of the substrate portion.

[0191] A cooling plate according to aspect 25 of the present disclosure may be configured such that, in aspect 24 above, the first plate and the second plate are independent members, the first plate further comprises a first refrigerant supply flow path forming recess, and the second plate further comprises a second refrigerant supply flow path forming recess, and by joining the first plate and the second plate, the first refrigerant supply flow path forming recess and the second refrigerant supply flow path forming recess are connected to form part of the refrigerant supply flow path forming recess.

[0192] A cooling system according to Aspect 26 of the present disclosure may be configured in accordance with Aspect 2 above, further comprising a coolant discharge section, the coolant discharge section being formed on the front surface side of the substrate section.

[0193] According to the above configuration, the coolant discharge section is provided on the opposite surface (front surface) of the substrate section on which the coolant supply section and the coolant flow path are formed, thereby ensuring freedom in designing the coolant discharge section, the coolant supply section, and the coolant flow path.

[0194] The cooling system according to aspect 27 of the present disclosure may be configured in the above-mentioned aspect 26 such that the coolant discharge portion is formed on the surface of the substrate portion opposite to the back surface on which the coolant supply portion is formed.

[0195] According to the above configuration, the coolant supply section and the coolant discharge section can be concentrated in an area on one end side of the substrate section, thereby ensuring a larger area in the substrate section for arranging the coolant flow paths.

[0196] For the purpose of explaining the present disclosure, an embodiment having a specific configuration has been described above with reference to the accompanying drawings. However, the scope of the present disclosure should not be construed as being limited to this embodiment, and it goes without saying that appropriate modifications can be made within the scope of the claims and the matters described in the specification.

[0197] 2, 202, 402, 502, 702, 802, 1002: Substrate portion; A1, A11, A31, A41: First refrigerant flow path; A2, A12, A32, A42: Second refrigerant flow path; 411a, 511a, 611a, 711a, 811a, 1011a: First plate (metal plate); 411b, 511b, 611b, 711b, 811b, 1011b: Second plate (metal plate); C1, C2, C11, C12, C41: Refrigerant supply flow path; D1, D2, D3, D4, D11, D12, D41: Refrigerant discharge flow path; S: Stacked cell

Claims

1. A cooling system for a battery device comprising: a base portion of a case incorporating a cell body of a battery device; and a cooling plate attached to the base portion, wherein the case has a first refrigerant flow path and a second refrigerant flow path separated from the first refrigerant flow path, the rear surface of the base portion constitutes peripheral walls of the first refrigerant flow path and the second refrigerant flow path, the cooling plate comprises a first plate forming the other peripheral wall of the first refrigerant flow path and a second plate forming the other peripheral wall of the second refrigerant flow path, the first plate and the second plate are attached to an area on the rear surface of the base portion where the cell body is arranged.

2. The cooling system according to claim 1, further comprising a refrigerant supply unit that supplies refrigerant to said first refrigerant flow path and said second refrigerant flow path independently in parallel.

3. The cooling system of claim 2, wherein the refrigerant supply section has a refrigerant supply flow path, the refrigerant supply flow path having an inlet for taking in the refrigerant, a first outport for sending the refrigerant to the first refrigerant flow path, and a second outport for sending the refrigerant to the second refrigerant flow path.

4. The cooling system according to claim 3, wherein the refrigerant supply passage has a reduced flow passage cross-sectional area at the first outport and the second outport.

5. The cooling system according to claim 3, wherein the peripheral wall of the coolant supply passage is spaced apart from the base portion of the case.

6. The cooling system according to claim 5, wherein the peripheral wall of the first coolant flow path and the peripheral wall of the second coolant flow path are interposed between the peripheral wall of the coolant supply flow path and the substrate portion.

7. A cooling system according to claim 5, wherein said coolant supply passage is separate from said first and second coolant passages, and the peripheral wall of said passage is made of a substrate portion which is not affected by heat of said cell body.

8. The cooling system according to claim 6, wherein a first cell body and a second cell body are built in parallel in the case, the first refrigerant flow path is arranged opposite the first cell body, and the second refrigerant flow path is arranged opposite the second cell body.

9. The cooling system according to claim 8, wherein the coolant supply passage overlaps the first coolant passage and the second coolant passage and is disposed perpendicular to the direction in which the first and second coolant passages are aligned.

10. The cooling system according to claim 9, wherein the refrigerant supply passage is disposed at an end edge of the first refrigerant passage and the second refrigerant passage in a plan view.

11. The cooling system according to claim 9, wherein the refrigerant supply passage is arranged, in a plan view, so as to divide the first refrigerant passage and the second refrigerant passage, preferably into two.

12. The cooling system according to claim 3, wherein the coolant supply flow path, the first coolant flow path and the second coolant flow path are arranged on the same plane parallel to the rear surface of the substrate portion.

13. The cooling system according to claim 12, wherein the refrigerant supply passage is disposed on peripheral edges of the first refrigerant passage and the second refrigerant passage so as to surround the first refrigerant passage and the second refrigerant passage.

14. The cooling system described in claim 12, wherein the first plate is provided with a first refrigerant supply flow path forming recess, and the second plate is provided with a second refrigerant supply flow path forming recess, and by joining the first and second plates, the first and second refrigerant supply flow path forming recesses are connected, and the refrigerant supply flow path is formed by the joined first and second refrigerant supply flow path forming recesses and the rear surface of the substrate portion.

15. The cooling system described in claim 14, wherein the first plate has a flat first plate connection portion contiguous with the first refrigerant supply flow path forming recess, and the second plate has a flat second plate connection portion contiguous with the second refrigerant supply flow path forming recess, and when the first plate and the second plate are joined, the first plate connection portion and the second plate connection portion are connected, and the base portion has a step portion displaced toward the surface side of the base portion at a position facing the first plate connection portion and the second plate connection portion, and the refrigerant supply flow path is formed by the step portion and the first and second plate connection portions.

16. A cooling system as described in claim 15, wherein the first plate connection portion and the second plate connection portion are replaced by flat plate-like members, one end of which is connected to the first refrigerant supply flow path forming recess and the other end of which is connected to the second refrigerant supply flow path forming recess.

17. A cooling assembly comprising the cooling system according to any one of claims 1 to 16, and a case including a substrate portion of the cooling system and housing a cell body of the battery device.

18. The cooling assembly of claim 17, further comprising a coolant supply section for independently supplying coolant in parallel to the first coolant flow path and the second coolant flow path, the case having a first side plate section with a U-shaped cross section, the base section having an extended edge, the first side plate section being connected to the extended edge to form an overhang section, the coolant supply section having a coolant supply flow path, and an in port for taking in the coolant of the coolant supply flow path being opened at the overhang section.

19. The cooling assembly according to claim 18, wherein the case comprises the first side plate portion and a second side plate portion having a U-shaped cross section, the first side plate portion being wider than the second side plate portion, and a refrigerant supply pipe for supplying the refrigerant to the in port is disposed on the first side plate portion.

20. A battery device comprising the cooling system according to any one of claims 1 to 16, a case including a substrate portion of the cooling system, and a cell body housed in the case.

21. A battery device comprising a case incorporating a cell body and a cooling section arranged on the back surface of a substrate section of the case, wherein the cooling section has a first refrigerant flow path and a second refrigerant flow path spaced from the first refrigerant flow path, the back surface of the substrate section forms peripheral walls of the first refrigerant flow path and the second refrigerant flow path, the other peripheral wall of the first refrigerant flow path is formed by a first plate, and the other peripheral wall of the second refrigerant flow path is formed by a second plate, and the first plate and the second plate are attached to an area on the back surface of the substrate section where the cell body is arranged.

22. A method for cooling a battery device comprising a base portion of a case incorporating a cell body and a cooling plate attached to the base portion, the case comprising a first refrigerant flow path and a second refrigerant flow path separated from the first refrigerant flow path, a back surface of the base portion constituting peripheral walls of the first refrigerant flow path and the second refrigerant flow path, the cooling plate comprising a first plate forming another peripheral wall of the first refrigerant flow path and a second plate forming another peripheral wall of the second refrigerant flow path, the first plate and the second plate being attached to an area on the back surface of the base portion where the cell body is arranged, the method for cooling a battery device, wherein refrigerant is supplied independently and in parallel to the first refrigerant flow path and the second refrigerant flow path.

23. A cooling plate attached to a base plate of a case incorporating a cell body of a battery device and constituting a cooling system for the battery device together with the base plate, the rear surface of the base plate constituting a peripheral wall of a first refrigerant flow path and a second refrigerant flow path separated from the first refrigerant flow path, the cooling plate comprising: a first plate having a first refrigerant flow path forming recess forming the other peripheral wall of the first refrigerant flow path; a second plate having a second refrigerant flow path forming recess forming the other peripheral wall of the second refrigerant flow path; and a refrigerant supply portion forming recess supplying refrigerant independently in parallel to the first refrigerant flow path and the second refrigerant flow path.

24. A cooling plate as described in claim 23, wherein the refrigerant flow path forming recess, the first refrigerant flow path forming recess and the second refrigerant flow path forming recess are arranged on the same plane parallel to the rear surface of the substrate portion.

25. A cooling plate as described in claim 24, wherein the first plate and the second plate are independent members, the first plate further comprises a first refrigerant supply flow path forming recess, and the second plate further comprises a second refrigerant supply flow path forming recess, and by joining the first plate and the second plate, the first refrigerant supply flow path forming recess and the second refrigerant supply flow path forming recess are connected to form a part of the refrigerant supply flow path forming recess.

26. The cooling system according to claim 2, further comprising a coolant discharge portion, the coolant discharge portion being formed on the front surface side of the substrate portion.

27. The cooling system according to claim 26, wherein the coolant discharge portion is formed on the surface of the substrate portion opposite to the back surface on which the coolant supply portion is formed.

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