Inspection system, display device, inspection method, program, method for manufacturing laminate, and control device

Abstract

The purpose of the present invention is to appropriately detect local deformation of a layer. An inspection system (100) comprises: an emitting device (2) capable of emitting radiation; an imaging device (4) that outputs data indicating the internal structure of a laminate as obtained by the emitting device (2) emitting radiation toward the laminate; and a control device (5). The control device (108) outputs information relating to deformation of some of a first layer of the laminate on the basis of the data.

Description

Inspection system, display device, inspection method, program, laminate manufacturing method, and control device

[0001] The present invention relates to an inspection system, a display device, an inspection method, a program, a laminate manufacturing method, and a control device.

[0002] Known devices for non-destructively acquiring information about the interior of an object include an X-ray device having an X-ray source that irradiates an object with X-rays and a detector that detects the transmitted X-rays that have passed through the object, as disclosed in the following patent document, for example.

[0003] JP 2013-174495 A

[0004] According to a first aspect of the present disclosure, an inspection system includes an irradiation device capable of irradiating radiation, an imaging device that irradiates a stack with the radiation using the irradiation device and outputs data indicating the internal structure of the stack, and a control device, and the control device outputs information regarding deformation of a portion of a first layer of the stack based on the data.

[0005] According to a second aspect of the present disclosure, an inspection system includes an irradiation device capable of irradiating radiation and a control device, and the control device irradiates the radiation onto a stack using the irradiation device, acquires data indicating the internal structure of the stack, and outputs the acquired information regarding deformation of a portion of a first layer inside the stack.

[0006] According to a third aspect of the present disclosure, the display device displays information regarding deformation of a portion of a first layer of the laminate, calculated based on data indicating the internal structure of the laminate imaged by irradiation with radiation.

[0007] According to a fourth aspect of the present disclosure, an inspection method includes acquiring data indicating the internal structure of a laminate imaged by irradiating radiation, and calculating information regarding deformation of a portion of a first layer of the laminate based on the data.

[0008] According to a fifth aspect of the present disclosure, the program causes a computer to acquire data indicating the internal structure of a laminate imaged by irradiating radiation, and calculate information regarding deformation of a portion of a first layer of the laminate based on the data.

[0009] According to a sixth aspect of the present disclosure, a method for manufacturing a laminate includes creating design information regarding the shape of a laminate, manufacturing the laminate based on the design information, and determining, using the inspection system, whether any part of a member constituting a layer of the manufactured laminate is deformed.

[0010] According to a seventh aspect of the present disclosure, the control device acquires data indicating the internal structure of the stack, which is imaged by irradiating radiation, and calculates a determination result based on the data as to whether a portion of a component constituting a layer of the stack has deformed.

[0011] FIG. 1 is a schematic configuration diagram showing an example of an inspection device according to a first embodiment; FIG. 2 is a schematic block diagram of an inspection device according to the present embodiment; FIG. 3 is a schematic diagram of a laminate; FIG. 4 is a schematic diagram of a laminate; FIG. 5 is a schematic diagram of a laminate; FIG. 6 is a graph showing an example of gradation values ​​at each position on a line; FIG. 7 is a graph showing an example of a layer position; FIG. 8 is a schematic diagram showing an example of a detection line and a reference line; FIG. 9 is a graph showing an example of a difference between the detection line and the reference line; FIG. 10 is a graph showing an example of a local change amount of a layer; FIG. 11 is a flowchart illustrating a processing flow of a control device; FIG. 12 is a flowchart illustrating a processing flow of a control device; FIG. 13 is a flowchart illustrating a processing flow according to another example of the present embodiment; FIG. 14 is a schematic diagram illustrating another example of information to be output; FIG. 15 is a schematic diagram illustrating another example of information to be output; FIG. 16 is a schematic diagram illustrating another example of information to be output; FIG. 17 is a block configuration diagram of a manufacturing system; FIG. 18 is a flowchart showing a processing flow by the manufacturing system.

[0012] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The components in the following embodiments include those that can be easily imagined by a person skilled in the art, those that are substantially the same, and those that are within the so-called equivalent range. Furthermore, the components disclosed in the following embodiments can be combined as appropriate.

[0013] In the following explanation, an STU Cartesian coordinate system is set, and the positional relationship of each part is explained with reference to this STU Cartesian coordinate system. A predetermined direction in a horizontal plane is defined as the U-axis direction, a direction perpendicular to the U-axis direction in the horizontal plane is defined as the S-axis direction, and a direction perpendicular to both the U-axis direction and the S-axis direction (i.e., the vertical direction) is defined as the T-axis direction. Furthermore, the rotation (tilt) directions around the S-axis, T-axis, and U-axis are defined as the θS, θT, and θU-axis directions, respectively.

[0014] (Overall Configuration of Inspection System) FIG. 1 is a schematic diagram showing an example of an inspection device according to this embodiment. In the inspection system 100 according to this embodiment, an irradiation device 2 irradiates a measurement object Q (in this embodiment, a laminate A, which will be described later) with radiation, and an imaging device 4 detects the radiation that has passed through the measurement object Q. In this embodiment, the radiation irradiated by the irradiation device 2 includes X-rays. X-rays are electromagnetic waves generated from the outer part of atomic nuclei, and have wavelengths of approximately 1 pm to 30 nm. The X-rays include at least one of ultra-soft X-rays of approximately 50 eV, soft X-rays of approximately 0.1 to 2 keV, X-rays of approximately 2 to 20 keV, and hard X-rays of approximately 20 to 1000 ekV. Inspection systems using X-rays are disclosed, for example, in Japanese Patent Application Laid-Open Nos. 60-210087, 7-308313, 2013-113798, 2013-174495, 2017-22054, and 2018-536978.

[0015] In this embodiment, the inspection system 100 includes an X-ray CT inspection device that irradiates a measurement object Q with radiation (X-rays), detects the transmitted X-rays that have passed through the measurement object Q, and non-destructively acquires information about the interior of the measurement object Q. The information about the interior of the measurement object Q is, for example, the internal structure.

[0016] 1, the inspection system 100 includes a measurement system 1 that irradiates a measurement object Q with radiation (X-rays) and detects the transmitted X-rays, and a control system 5 that controls the overall operation of the inspection system 100 including the measurement system 1. The measurement system 1 includes an irradiation device 2 that emits X-rays XL, which are radiation, a stage device 3 that is movable while holding the measurement object Q, and an imaging device 4 that detects the radiation (transmitted X-rays) that is emitted from the irradiation device 2 and has transmitted through the measurement object Q held by the stage device 3.

[0017] In this embodiment, the irradiation device 2 and the imaging device 4 are installed so that the optical axis of the X-rays XL emitted from the irradiation device 2 toward the imaging device 4 is oriented along the U-axis. The detection surface of the imaging device 4 is installed parallel to a plane (ST plane) perpendicular to the optical axis of the X-rays XL.

[0018] In addition, in this embodiment, the inspection system 100 includes a chamber member 6 that forms an internal space SP through which the X-rays XL emitted from the irradiation device 2 travel. In this embodiment, the irradiation device 2, the stage device 3, and the imaging device 4 are disposed in the internal space SP.

[0019] In this embodiment, the chamber member 6 is placed on a support surface FR. The support surface FR includes the floor surface of a factory or the like. The chamber member 6 is supported by a plurality of support members 6S. The chamber member 6 is placed on the support surface FR via the support members 6S. In this embodiment, the support members 6S separate the lower surface of the chamber member 6 from the support surface FR. In other words, a space is formed between the lower surface of the chamber member 6 and the support surface FR. Note that at least a portion of the lower surface of the chamber member 6 may be in contact with the support surface FR.

[0020] In this embodiment, the chamber member 6 contains lead. The chamber member 6 prevents the X-rays XL in the internal space SP from leaking into the external space RP of the chamber member 6.

[0021] In this embodiment, the inspection system 100 includes a member 6D attached to the chamber member 6 and having a thermal conductivity lower than that of the chamber member 6. In this embodiment, the member 6D is disposed on the outer surface of the chamber member 6. The member 6D prevents the temperature of the internal space SP from being affected by the temperature (temperature change) of the external space RP. In other words, the member 6D functions as a heat insulating member that prevents heat from the external space RP from being transferred to the internal space SP. The member 6D includes, for example, plastic. In this embodiment, the member 6D includes, for example, polystyrene foam.

[0022] (Irradiation Device) The irradiation device 2 is a device capable of irradiating radiation (X-rays XL in this embodiment). The irradiation device 2 irradiates the measured object Q with the X-rays XL. The irradiation device 2 has an emission unit 8 that emits the X-rays XL. The irradiation device 2 forms a point X-ray source. In this embodiment, the irradiation device 2 includes a point X-ray source (an X-ray generation point). The irradiation device 2 irradiates the measured object Q with cone-shaped X-rays (a so-called cone beam). The irradiation device 2 may be capable of adjusting the intensity of the emitted X-rays XL. The intensity of the X-rays XL emitted from the irradiation device 2 may be adjusted based on the X-ray absorption characteristics of the measured object Q, etc. The spreading shape of the X-rays emitted from the irradiation device 2 is not limited to a cone shape, and may be, for example, fan-shaped X-rays (a so-called fan beam). Alternatively, for example, linear X-rays (a so-called pencil beam) may be used.

[0023] The emission unit 8 of the irradiation device 2 faces the +U direction. In this embodiment, at least a portion of the X-rays XL emitted from the emission unit 8 travels in the +U direction in the internal space SP.

[0024] (Stage Device) The stage device 3 includes a stage 9 that can move while holding the measurement object Q, and a drive system 10 that moves the stage 9 .

[0025] In this embodiment, the stage 9 has a table 12 having a holding portion 11 that holds the object to be measured Q, a first movable member 13 that movably supports the table 12, a second movable member 14 that movably supports the first movable member 13, and a third movable member 15 that movably supports the second movable member 14.

[0026] The table 12 is rotatable with the object Q held by the holder 11. The table 12 is movable (rotatable) in the θT direction. The first movable member 13 is movable in the S-axis direction. When the first movable member 13 moves in the S-axis direction, the table 12 moves in the S-axis direction together with the first movable member 13. The second movable member 14 is movable in the T-axis direction. When the second movable member 14 moves in the T-axis direction, the first movable member 13 and the table 12 move in the T-axis direction together with the second movable member 14. The third movable member 15 is movable in the U-axis direction. When the third movable member 15 moves in the U-axis direction, the second movable member 14, the first movable member 13, and the table 12 move in the U-axis direction together with the third movable member 15.

[0027] In this embodiment, the drive system 10 includes a rotation drive device 16 that rotates the table 12 around the T-axis on the first movable member 13, a first drive device 17 that moves the first movable member 13 in the S-axis direction on the second movable member 14, a second drive device 18 that moves the second movable member 14 in the T-axis direction, and a third drive device 19 that moves the third movable member 15 in the U-axis direction.

[0028] The second driving device 18 includes a screw shaft 20B disposed in a nut of the second movable member 14, and an actuator 20 that rotates the screw shaft 20B. The screw shaft 20B is supported by bearings 21A and 21B so that it can rotate around the T-axis. In this embodiment, the screw shaft 20B is supported by the bearings 21A and 21B so that the axis of the screw shaft 20B and the T-axis are substantially parallel. In this embodiment, a ball is disposed between the nut of the second movable member 14 and the screw shaft 20B. That is, the second driving device 18 includes a so-called ball screw driving mechanism.

[0029] The third drive device 19 includes a screw shaft 23B disposed in a nut of the third movable member 15, and an actuator 23 that rotates the screw shaft 23B. The screw shaft 23B is rotatably supported by bearings 24A and 24B. In this embodiment, the screw shaft 23B is supported by the bearings 24A and 24B so that the axis of the screw shaft 23B and the U-axis are substantially parallel. In this embodiment, a ball is disposed between the nut of the third movable member 15 and the screw shaft 23B. That is, the third drive device 19 includes a so-called ball screw drive mechanism.

[0030] The third movable member 15 has a guide mechanism 25 that guides the second movable member 14 in the Y-axis direction. The guide mechanism 25 includes rail-shaped guide members 25A and 25B that extend in the T-axis direction. At least a portion of the second drive device 18, which includes the actuator 20 and bearings 21A and 21B that support the screw shaft 20B, is supported by the third movable member 15. When the actuator 20 rotates the screw shaft 20B, the second movable member 14 moves in the T-axis direction while being guided by the guide mechanism 25.

[0031] In this embodiment, the inspection system 100 has a base member 26. The base member 26 is supported by the chamber member 6. In this embodiment, the base member 26 is supported by the inner wall (inner surface) of the chamber member 6 via a support mechanism. The position of the base member 26 is fixed at a predetermined position.

[0032] The base member 26 has a guide mechanism 27 that guides the third movable member 15 in the U-axis direction. The guide mechanism 27 includes rail-shaped guide members 27A and 27B that extend in the U-axis direction. At least a portion of the third drive device 19, including the actuator 23 and bearings 24A and 24B that support the screw shaft 23B, is supported by the base member 26. When the actuator 23 rotates the screw shaft 23B, the third movable member 15 moves in the U-axis direction while being guided by the guide mechanism 27.

[0033] Although not shown, in this embodiment, the second movable member 14 has a guide mechanism that guides the first movable member 13 in the S-axis direction. The first drive device 17 includes a ball screw mechanism that can move the first movable member 13 in the S-axis direction. The rotation drive device 16 includes a motor that can move (rotate) the table 12 in the θT direction.

[0034] In this embodiment, a reference object 48 is placed on the table 12, and a measurement object Q is placed on the reference object 48. The reference object 48 and measurement object Q held on the table 12 can be moved by the drive system 10 in four directions, namely, the S-axis, the T-axis, the U-axis, and the θT direction.

[0035] The drive system 10 may move the workpiece Q held on the table 12 in six directions: the S-axis, T-axis, U-axis, θS, θT, and θU directions. In the present embodiment, the drive system 10 includes a ball screw drive mechanism, but it may also include, for example, a voice coil motor. For example, the drive system 10 may include a linear motor or a planar motor.

[0036] In this embodiment, the stage 9 is movable within the internal space SP. The stage 9 is disposed on the +U side of the emission unit 88. The stage 9 is movable within the internal space SP on the +U side of the emission unit 8. At least a portion of the stage 9 is capable of facing the emission unit 8. The stage 9 is capable of positioning the held measurement object Q at a position facing the emission unit 8. The stage 9 is capable of positioning the measurement object Q on the path along which the X-rays XL emitted from the emission unit 8 pass. The stage 9 is capable of being positioned within the irradiation range of the X-rays XL emitted from the emission unit 8.

[0037] In this embodiment, the inspection system 100 includes a measurement system 28 that measures the position of the stage 9. In this embodiment, the measurement system 28 includes an encoder system.

[0038] The measurement system 28 includes a rotary encoder 29 that measures the amount of rotation of the table 12 (position in the θU direction), a linear encoder 30 that measures the position of the first movable member 13 in the S-axis direction, a linear encoder 31 that measures the position of the second movable member 14 in the T-axis direction, and a linear encoder 32 that measures the position of the third movable member 15 in the U-axis direction.

[0039] In this embodiment, the rotary encoder 29 measures the amount of rotation of the table 12 relative to the first movable member 13. The linear encoder 30 measures the position of the first movable member 13 relative to the second movable member 14 (position in the S-axis direction). The linear encoder 31 measures the position of the second movable member 14 relative to the third movable member 15 (position in the T-axis direction). The linear encoder 32 measures the position of the third movable member 15 relative to the base member 26 (position in the U-axis direction).

[0040] The rotary encoder 29 includes, for example, a scale member 29A arranged on the first movable member 13, and an encoder head 29B arranged on the table 12 and detecting the scale of the scale member 29A. The scale member 29A is fixed to the first movable member 13. The encoder head 29B is fixed to the table 12. The encoder head 29B can measure the amount of rotation of the table 12 relative to the scale member 29A (first movable member 13).

[0041] The linear encoder 30 includes, for example, a scale member 30A arranged on the second movable member 14, and an encoder head 30B arranged on the first movable member 13 and detecting the scale of the scale member 30A. The scale member 30A is fixed to the second movable member 14. The encoder head 30B is fixed to the first movable member 13. The encoder head 30B can measure the position of the first movable member 13 relative to the scale member 30A (second movable member 14).

[0042] The linear encoder 31 includes a scale member 31A arranged on the third movable member 15 and an encoder head 31B arranged on the second movable member 14 and detecting the scale of the scale member 31A. The scale member 31A is fixed to the third movable member 15. The encoder head 31B is fixed to the second movable member 14. The encoder head 31B can measure the position of the second movable member 14 relative to the scale member 31A (third movable member 15).

[0043] The linear encoder 32 includes a scale member 32A arranged on the base member 26, and an encoder head 32B arranged on the third movable member 15 and detecting the scale of the scale member 32A. The scale member 32A is fixed to the base member 26. The encoder head 32B is fixed to the third movable member 15. The encoder head 32B can measure the position of the third movable member 15 relative to the scale member 32A (base member 26).

[0044] (Imaging Device) The imaging device 4 acquires a portion of the radiation irradiated onto the measurement object Q (stacked body A) by the irradiation device 2 and outputs the data. In this embodiment, the imaging device 4 acquires transmitted X-rays that have passed through the measurement object Q. As will be described later, the imaging device 4 can acquire multiple transmitted X-rays irradiated onto the measurement object Q by the irradiation device 2 at different angles. By performing reconstruction processing using the multiple transmitted X-rays, it is possible to acquire data that indicates the internal structure of the measurement object Q (stacked body A).

[0045] The imaging device 4 is disposed in the internal space SP on the +U direction side of the irradiation device 2 and the stage 9. The position of the imaging device 4 is fixed at a predetermined position. The imaging device 4 may be movable. The stage 9 is movable in the space between the irradiation device 2 and the imaging device 4 in the internal space SP.

[0046] The imaging device 4 has a scintillator section 34 having an incident surface 33 onto which X-rays XL from the irradiation device 2, including transmitted X-rays that have passed through the measurement object S, are incident, and a light-receiving section 35 that receives light generated in the scintillator section 34. The incident surface 33 of the imaging device 4 can face the measurement object S held on the stage 9.

[0047] The scintillator section 34 contains a scintillation material that generates light of a different wavelength from the X-rays when struck by the X-rays. The light-receiving section 35 includes a photomultiplier tube. The photomultiplier tube includes a phototube that converts light energy into electrical energy through the photoelectric effect. The light-receiving section 35 amplifies the light generated in the scintillator section 34, converts it into an electrical signal, and outputs it. This output electrical signal corresponds to data indicating the internal structure of the laminate of the measured object Q (laminate A).

[0048] A moving mechanism (not shown) movably supports the imaging device 4. The moving mechanism 46 includes a drive device that moves the imaging device 4 at least in the U-axis direction (the direction of moving toward and away from the irradiation device 2 and the stage 9). The moving mechanism 46 may be a mechanism that moves the imaging device 4 in the S-axis direction, the T-axis direction, the U-axis direction, and the θT direction, similar to the stage 9. Similar to the stage 9, the moving mechanism 46 may be a mechanism that moves the imaging device 4 in multiple axial directions. The mechanism that moves the imaging device 4 in multiple axial directions may be, for example, a mechanism that moves the imaging device 4 in the S-axis direction and the T-axis direction.

[0049] Although the structure of the inspection system 100 according to the present embodiment has been described above, the structure of the inspection system 100 is not limited to the above and may be any structure. The inspection system 100 may have any structure including the irradiation device 2, the imaging device 4, and the control system 5.

[0050] (Control System) The control system 5 outputs information about the local deformation of a layer (first layer) of the laminate A based on data indicating the internal structure of the laminate A output by the imaging device 4. Here, the local deformation of the layer does not refer to a large deformation of the entire layer, but rather to a large deformation of only a part of the layer. In other words, the information about the local deformation can also be said to be information about the deformation of a part of the laminate A layer.

[0051] 2 is a schematic block diagram of the inspection apparatus according to the present embodiment. As shown in FIG. 2, the inspection system 100 includes an irradiation device 2, an imaging device 4, and a control system 5. The control system 5 is a computer, and as shown in FIG. 2, includes an input device 101, a display device 102, a communication device 104, a storage device 106, and a control device 108. The control system 5 may be configured as a standalone device, may be configured integrally with other devices, or may be configured as a system combining various devices such as a calculation device and a data server, and is not particularly limited.

[0052] The input device 101 is a mechanism for accepting user input. Examples of the input device 101 include a mouse, a keyboard, and a touch panel. The display device 102 is a display for displaying images. The communication device 104 is a module used in the control device 108 to communicate with an external device and may include, for example, an antenna. In this embodiment, the communication method used by the communication device 104 is wireless communication, but any communication method may be used. The storage device 106 is a memory for storing various information such as data indicating the internal structure of the laminate A output from the imaging device 4, and calculation contents and programs of the control device 108. For example, the storage device 106 includes at least one of a main storage device such as a RAM (Random Access Memory), a ROM (Read Only Memory), and an external storage device such as an HDD (Hard Disk Drive). The program for the control device 108 stored in the storage device 106 may be stored in a recording medium readable by the control system 5.

[0053] The control device 108 is a calculation device and includes a calculation circuit such as a CPU (Central Processing Unit). The control device 108 includes an X-ray control unit 110, a reconstruction calculation unit 111, an acquisition unit 112, a calculation unit 114, a reference line calculation unit 116, a determination unit 118, and an output control unit 120. The control device 108 reads and executes a program (software) from the storage device 106 to realize the X-ray control unit 110, the reconstruction calculation unit 111, the acquisition unit 112, the calculation unit 114, the reference line calculation unit 116, the determination unit 118, and the output control unit 120, and executes the processes of these units. The control device 108 may execute the processes using one CPU, or may be provided with multiple CPUs and execute the processes using the multiple CPUs. At least some of the X-ray control unit 110, the reconstruction calculation unit 111, the acquisition unit 112, the calculation unit 114, the reference line calculation unit 116, the determination unit 118, and the output control unit 120 may be realized by hardware circuits.

[0054] The specific processing contents of the control device 108 will be described later.

[0055] (Laminate) FIGS. 3 to 5 are schematic diagrams of a laminate. The laminate A to be inspected is a laminate in which multiple layers B are stacked. The laminate A is formed by stacking multiple layers B. In this embodiment, the laminate A is a lithium-ion battery. While a lithium-ion battery is used as an example in this embodiment, this is not limiting. Other batteries, such as sodium batteries, may also be used. Note that the laminate is not limited to a battery; the laminate A may be any object in which multiple layers B are stacked. The arbitrary object may be, for example, a structure in which flat "cells" such as a fuel cell stack are stacked, or a packaging material with a laminated structure. As shown in FIG. 3 , the laminate A, which is a lithium-ion battery, has a housing C and multiple layers B disposed within the housing C. When the laminate A is a lithium-ion battery, the components constituting the layers B include at least one of electrodes and components between the electrodes. In this embodiment, layers B1, which are positive electrodes, and layers B2, which are negative electrodes, are alternately stacked. Furthermore, layer B3, which is an electrolyte layer, is provided between layer B1 and layer B2. That is, in this embodiment, layers B1 and B2 are electrodes, and layer B3 is a member between the electrodes (in this example, the electrolyte layer). In this embodiment, layers are stacked in the following order: layer B1, layer B3, layer B2, layer B3, layer B1, .... In this embodiment, layer B1, which is the positive electrode, and layer B2, which is the negative electrode, are stacked alternately, but this is not limited thereto. For example, a stacked structure may be used in which layer B1, which is the positive electrode, a member between the electrodes, and layer B1, which is the positive electrode, are stacked alternately, and only layer B1, which is the positive electrode, is used without layer B2, which is the negative electrode.

[0056] In the examples of Figures 3 and 4, the laminate A, which is a lithium ion battery, is cylindrical, and each cylindrical layer B is stacked. In this embodiment, the laminate A is made of film sheets, and the film sheets are stacked. Each layer B is stacked so that the inner peripheral surface of the next layer B faces the outer peripheral surface of the cylindrical layer B. However, the laminate A is not limited to having each cylindrical layer B stacked, and each layer B may have any shape. For example, as shown in Figure 5, flat layer B may be stacked.

[0057] Hereinafter, the direction in which each layer B is stacked in the laminate A will be referred to as the stacking direction Y. In a given layer B constituting the laminate A, the direction perpendicular to the perpendicular direction of one surface (e.g., the front surface) of the layer B will be referred to as the stacking direction Y. In a given XY cross section formed by the direction X perpendicular to the stacking direction Y, the direction along the surface of the layer will be referred to as the layer direction X. The layer direction X may be a direction along the surface of the layer, or a direction along a midpoint between the front and back surfaces of the layer. The layer direction X can also be referred to as a direction along the layer in the given cross section, among the in-plane directions of the layer B. The given cross section refers to a two-dimensional cross section of a three-dimensional image of the laminate A that is set to generate information about the local deformation of the layer B. The given cross section will be described later. For example, if the laminate A is cylindrical, as shown in FIG. 4, each layer B is stacked radially from the center of the circle toward the circumference, and therefore the direction radially outward from the central axis of the laminate A will be the stacking direction Y. 4, when a plane along the stacking direction Y is taken as a predetermined cross section, the in-plane direction along the predetermined cross section (a direction along the cross section and perpendicular to the stacking direction Y) is the layer direction X. For example, when flat layers B are stacked, the direction in which the flat layers B are stacked is the stacking direction Y, as shown in FIG. 5. When a plane along the stacking direction Y is taken as a predetermined cross section, the in-plane direction along the predetermined cross section (a direction along the cross section and perpendicular to the stacking direction Y) is the layer direction X.

[0058] (Processing by Control System) Hereinafter, the processing performed by the control system 5 to output information related to the local deformation of the layer B of the stack A will be described.

[0059] (Detection of Image Data) The X-ray control unit 110 of the control system 5 controls the irradiation device 2 to irradiate radiation (X-rays XL) from the irradiation device 2 toward the stack A (measurement object Q). The X-ray control unit 110 also controls the imaging device 4 to receive a portion of the radiation irradiated from the irradiation device 2 to the stack A (in this example, transmitted X-rays that have passed through the stack A), thereby acquiring a transmission X-ray image that has passed through the stack A. Furthermore, the stage 9 is rotated to acquire multiple transmission X-ray images in which the angles of the radiation irradiated from the irradiation device 2 to the stack A are varied. The reconstruction calculation unit 111 performs calculations based on multiple X-ray transmission images obtained by irradiating radiation onto the stack A while rotating the stack A, thereby acquiring three-dimensional data (three-dimensional images) of the internal structure of the stack A. As a result, the internal structure of the stack A is calculated. Examples of methods for reconstructing the stack A include back projection, filtered back projection, and iterative approximation. The backprojection method and the filtered projection method are described, for example, in U.S. Patent Application Publication No. 2002 / 0154728, and the successive approximation method is described, for example, in U.S. Patent Application Publication No. 2010 / 0220908.

[0060] The reconstruction calculation unit 111 outputs three-dimensional data of the internal structure of the laminate A. In this embodiment, the data indicating the internal structure of the laminate A is data indicating gradation values ​​(brightness values) at each position in the three-dimensional coordinates of the laminate A, and can also be called image data indicating the internal structure of the laminate A. Hereinafter, the data indicating the internal structure of the laminate A will be referred to as image data of the laminate A as appropriate. Note that the data indicating the internal structure of the laminate A is not limited to a reconstructed image calculated and created based on multiple X-ray transmission images. If the internal structure of the laminate A can be clarified by a single X-ray transmission image, a single X-ray transmission image may also be used. The method of acquiring the internal structure of the laminate A is not limited to radiation; for example, ultrasound, such as terahertz, may also be used.

[0061] (Acquisition of Image Data) The acquisition unit 112 acquires image data of the stack A (data indicating the internal structure of the stack A) output by the reconstruction calculation unit 111. Any method may be used for acquiring the image data of the stack A by the acquisition unit 112. For example, the image data of the stack A output by the reconstruction calculation unit 111 may be stored in the storage device 106, and the acquisition unit 112 may read the image data of the stack A from the storage device 106.

[0062] The output control unit 120 outputs information about the local deformation of layer B based on the image data of the laminate A acquired by the acquisition unit 112. The output control unit 120 may output information about the local deformation of layer B using any method based on the image data acquired by the acquisition unit 112, but an example in this embodiment will be described below.

[0063] (Calculation of Layer Position) The calculation unit 114 calculates position information of layer B of stack A based on the image data of stack A, and the output control unit 120 outputs information regarding the local deformation of layer B based on the position information of layer B of stack A. The calculation unit 114 calculates position information of layer B in a predetermined cross section of stack A using the image data of stack A. The position information of layer B is information indicating the position of layer B in the coordinate system of stack A. Furthermore, the predetermined cross section is a two-dimensional cross section of the three-dimensional image of stack A that is set to generate information regarding the local deformation of layer B, as described above. The calculation unit 114 may set the predetermined cross section arbitrarily, but it is preferable to set a plane that intersects with the in-plane direction of layer B as the predetermined cross section.

[0064] The calculation unit 114 calculates the position of layer B in the stacking direction Y in the specified cross section as the position information of layer B. The position of layer B in the stacking direction Y may be the position of any part of layer B in the stacking direction Y, for example, the position of the surface of layer B in the stacking direction Y, or the position of a part inside layer B in the stacking direction Y.

[0065] In the present embodiment, it is preferable that the calculation unit 114 calculates the position in the stacking direction Y of each location along the layer direction X of the layer B as the position information of the layer B. Furthermore, the calculation unit 114 may calculate the position information of the layer B (the position in the stacking direction Y of each location along the layer direction X) for one layer B of the stack A, but in the present embodiment, the calculation unit 114 calculates the position information of the layer B for multiple layers B of the stack A.

[0066] Any method may be used to calculate the position information of layer B based on image data, but in this embodiment, the calculation unit 114 calculates the position information of layer B from the gradation value for each position indicated in the image data of the laminate A. This will be specifically described below.

[0067] Here, if a line along the stacking direction Y on a predetermined cross section is designated as line SC, the calculation unit 114 extracts gradation values ​​at each position on line SC from the image data of the laminate A. The calculation unit 114 shifts the position of line SC in the layer direction X and repeatedly extracts gradation values ​​at each position on line SC. This extracts gradation values ​​at each position on each line SC that is located at a different position in the layer direction X. In the examples of FIGS. 4 and 5, lines SCa, SCb, SCc, and SCd are shown as examples of lines SC that are located at different positions in the layer direction X, and the calculation unit 114 extracts gradation values ​​at each position on lines SCa to SCd from the image data of the laminate A. However, FIGS. 4 and 5 are merely examples, and the distance between the lines SC in the layer direction X may be arbitrary, and the number of lines SC from which gradation values ​​are extracted may also be arbitrary.

[0068] FIG. 6 is a graph showing an example of gradation values ​​at each position on a line. FIG. 6 shows gradation values ​​at each position on lines SCa to SCd. The horizontal axis of each graph in FIG. 6 indicates the position in the stacking direction Y (the position of each point on line SC), and the vertical axis indicates the gradation value at that position extracted from the image data. For example, gradation value group L0a in FIG. 6 (the line in the top graph in FIG. 6) indicates the gradation value at each position on line SCa, gradation value group L0b in FIG. 6 indicates the gradation value at each position on line SCb, gradation value group L0c in FIG. 6 indicates the gradation value at each position on line SCc, and gradation value group L0d in FIG. 6 indicates the gradation value at each position on line SCd. Hereinafter, the gradation values ​​at each position on line SC will be referred to as gradation value group L0, as appropriate.

[0069] The calculation unit 114 calculates position information of layer B (the position of layer B in the stacking direction Y) based on the gradation values ​​at each position on each line SC (respective gradation value groups L0). That is, because the gradation values ​​of the image data change depending on the position of layer B and the presence or absence of layer B, the calculation unit 114 uses this to calculate the position of layer B in the stacking direction Y from the gradation values ​​at each position on each line SC (respective gradation value groups L0 that differ in position in the layer direction X).

[0070] Here, the gradation value group L0 has a waveform in which the gradation value increases and decreases cyclically as it progresses in the stacking direction Y. In other words, it has a waveform in which a plurality of unit waveforms W, each with the same tendency for the gradation value to increase and decrease, are lined up in the stacking direction Y. The gradation values ​​of the individual unit waveforms W may not be completely the same, but the tendency for the gradation value to increase and decrease is the same. In the example of Fig. 6, each unit waveform W included in the gradation value group L0 has a waveform in which the gradation value increases and reaches a first maximum value as it progresses in the stacking direction Y, then decreases and reaches a minimum value, then increases again and reaches a second maximum value that is lower than the first maximum value, then decreases and reaches a minimum value again. In this example, for example, the position where the gradation value reaches its first maximum value corresponds to the center position in the stacking direction Y of layer B1 (or layer B2), the position where the gradation value reaches its second maximum value corresponds to the center position in the stacking direction Y of layer B2 (or layer B1), and the position where the gradation value reaches its minimum value corresponds to the center position in the stacking direction Y of layer B3.

[0071] 7 is a graph showing an example of layer positions. In this embodiment, the calculation unit 114 determines the position in the stacking direction Y of the unit waveform W (unit waveform W1 in the example of FIG. 6 ) in the same section of each gradation value group L0 at which a gradation value satisfies a predetermined condition (position Pa in the stacking direction Y at the first maximum value in the example of FIG. 6 ) as the position in the stacking direction Y of the same layer B (layer B1a in the example of FIG. 7 ), and calculates position information of that layer B (the position in the stacking direction Y of each location along the layer direction X). The calculation unit 114 repeats this process for each unit waveform W to calculate the position information of each layer B. Here, the unit waveforms W in the same section refer to unit waveforms W located in the same section in the stacking direction Y. For example, when counting the number of unit waveforms W in the stacking direction Y, they may refer to unit waveforms W that are counted in the same order. The gradation value that satisfies the predetermined condition may be set arbitrarily, and may refer to, for example, the maximum value, minimum value, or median value of the gradation value of the unit waveform W. In the example of FIG. 7, the gradation value that is the first maximum value, which indicates the central position of layer B1, is determined to be the gradation value that satisfies the predetermined condition.

[0072] 6 and 7, positions Pa1 to Pa4 in the stacking direction Y where the gradation value reaches its first maximum value in unit waveform W1 (first unit waveform W) of gradation value groups L0a to L0d are used as position information for layer B1a. That is, for example, position Pa1 is used as the position in the stacking direction Y of layer B1a where gradation value group L0a (line SCa) is extracted in the layer direction X. Similarly, positions Pb1 to Pb4 in the stacking direction Y where the gradation value reaches its first maximum value in unit waveform W2 (second unit waveform W) of gradation value groups L0a to L0d are used as position information for layer B1b, which is located closer to layer B1a in the stacking direction Y. Similarly, positions Pc1 to Pc4 in the stacking direction Y where the gradation value reaches its first maximum value in unit waveform W3 (third unit waveform W) of gradation value group L0a to L0d are used as position information for layer B1c, which is located closer to layer B1b in the stacking direction Y. Similarly, positions Pd1 to Pd4 in the stacking direction Y where the gradation value reaches its first maximum value in unit waveform W4 (fourth unit waveform W) of gradation value group L0a to L0d are used as position information for layer B1d, which is located closer to layer B1c in the stacking direction Y.

[0073] In the examples of FIGS. 6 and 7 , the gradation value corresponding to the first maximum value is set as the gradation value satisfying the predetermined condition. However, as described above, the gradation value satisfying the predetermined condition is not limited to this. For example, the gradation value corresponding to the second maximum value may be set as the gradation value satisfying the predetermined condition. In this case, for example, position information for each layer B2 is calculated. Also, for example, the minimum value corresponding to the position of layer B3 may be set as the gradation value satisfying the predetermined condition. In this case, for example, position information for each layer B3 is calculated. However, the position of layer B3 in the stacking direction Y can be converted to the positions of layers B1 and B2 in the stacking direction Y. Therefore, if the minimum value corresponding to the position of B3 is set as the gradation value satisfying the predetermined condition, the position information for layers B1 and B2 can be calculated based on the calculated position information for layer B3. In other words, in this case, the image data for layer B3 (third layer), which is adjacent to layer B1 or layer B2 (first layer), is considered to be the image data for layer B1 or layer B2 (first layer).

[0074] (Calculation of Detection Line) FIG. 8 is a schematic diagram showing an example of the detection line and the reference line. In this embodiment, the calculation unit 114 calculates the detection line L indicating the position of layer B, and the output control unit 120 outputs information about the local deformation of layer B based on the detection line L. The detection line L is a line indicating position information of layer B (the position of layer B in the stacking direction Y at each position in the layer direction X). In other words, the detection line L is a line extending in the layer direction X, and the position of each point in the layer direction X in a direction intersecting the layer direction X indicates the position of layer B in the stacking direction Y at each position in the layer direction X.

[0075] The calculation unit 114 calculates the detection line L based on the position information of layer B. The calculation unit 114 may calculate the detection line L using any method. For example, the calculation unit 114 may use a line connecting the positions in the stacking direction Y of each location along the layer direction X of layer B as the detection line L, or may calculate the detection line L by curve approximating these positions. Any method of curve approximation may be used, and for example, the least squares method may be used to calculate the detection line L. FIG. 8 shows examples of detection lines La to Ld that indicate the positions in the stacking direction Y of each location along the layer direction X of layers B1a to B1d. The detection line La is calculated based on the gradation value group L0a, the detection line Lb is calculated based on the gradation value group L0b, the detection line Lc is calculated based on the gradation value group L0c, and the detection line Ld is calculated based on the gradation value group L0d.

[0076] (Acquisition of Reference Line) In this embodiment, the reference line calculation unit 116 acquires a reference line M indicating the reference position of layer B, and the output control unit 120 outputs information about the local deformation of layer B based on a comparison between the detection line L and the reference line M. The reference line M is a line that indicates the reference position in the stacking direction Y of layer B at each position in the layer direction X. That is, the reference line M is a line that extends in the layer direction X, and the position of each point in the layer direction X in a direction intersecting the layer direction X indicates the reference position in the stacking direction Y of layer B at each position in the layer direction X. The reference position of layer B in the stacking direction Y refers to the estimated position of layer B in the stacking direction Y when layer B is not undergoing local deformation.

[0077] The reference line calculation unit 116 may acquire a common reference line M for a plurality of layers B, but in this embodiment, acquires a reference line M for each layer B.

[0078] The reference line calculation unit 116 may acquire the reference line M using any method. For example, the reference line calculation unit 116 may acquire the reference line M based on design information. That is, for example, the reference line M may be set in advance as design information, and the reference line calculation unit 116 may acquire the reference line M set as the design information. Alternatively, for example, the reference position of layer B may be set in advance as design information, and the reference line calculation unit 116 may calculate the reference line M based on the reference position of layer B. In this case, the reference line calculation unit 116 may use a line connecting the reference positions at each position in the layer direction X as the reference line M, or may calculate the reference line M by curve approximating the reference positions at each position in the layer direction X. The curve approximation method may be any method, and for example, the reference line M may be calculated using the least squares method.

[0079] If design information is not set, the reference line calculation unit 116 may calculate the reference line M based on the detection line L. However, even if design information is set, the reference line calculation unit 116 may calculate the reference line M based on the detection line L. Any method may be used to calculate the reference line M based on the detection line L. The reference line calculation unit 116 may calculate the reference line M by curve approximating the detection line L. Any method may be used for the curve approximation. For example, the reference line calculation unit 116 may calculate the reference line M using the least squares method. The approximating curve is fitted using a smooth function. For example, the smooth function may be a multi-order power series (e.g., 9th order). For example, the reference line calculation unit 116 may calculate the reference line M by fitting the detection line L with a predetermined function (e.g., a multi-order power series). In this case, for example, the reference line calculation unit 116 may use a 9th order power series as the predetermined function and the least squares method for fitting, thereby calculating the reference line M using Equation (1).

[0080]

[0081] Here, y on the left side of equation (1) ｉ(x) indicates the position (reference position) in the stacking direction Y of the i-th reference line M at the position x in the layer direction X. ｉｎ is the x obtained on the i-th reference line M ｎ is the coefficient of x ｎ is the nth power of x.

[0082] The reference line calculation unit 116 may calculate the reference line M using the entire section of the detection line L. In this case, for example, the reference line calculation unit 116 calculates the reference line M by curve approximating the entire section of the detection line L in the layer direction X.

[0083] The reference line calculation unit 116 may calculate the reference line M using only a portion of the detection line L. In this case, for example, the reference line calculation unit 116 may calculate the reference line M by curve approximating a portion of the detection line L in the layer direction X. Any method may be used to select a portion of the detection line L from among all of its sections, and the reference line calculation unit 116 may select a portion of the detection line L at any position within the entire detection line L as the portion for calculating the reference line M. For example, in this embodiment, the reference line calculation unit 116 preferably selects a portion of the detection line L in which the amount of change in position in the stacking direction Y is within a predetermined range as the portion for calculating the reference line M. The amount of change in position in the stacking direction Y refers to the amount of change in position in the stacking direction Y when moving a unit length in the layer direction X along the reference line M. A portion with a large amount of change in position in the stacking direction Y can be said to be a portion in which the position in the stacking direction Y changes abruptly. In other words, in this embodiment, a portion in which the position in the stacking direction Y does not change abruptly is selected as the portion for calculating the reference line M. For example, in the detection line La in Fig. 8, the amount of change in position in the stacking direction Y is large in the section from position X1 to position X2 in the layer direction X. Therefore, a section of the detection line La other than the section from position X1 to position X2 is selected as the section for calculating the reference line M. Note that if there is no section in which the amount of change in position in the stacking direction Y is within a predetermined range, the reference line M may be calculated using the detection line L of another layer B.

[0084] Note that the selection of whether to use the entire section of the detection line L or a portion thereof may be made arbitrarily. For example, the reference line calculation unit 116 may select to use a portion of the section when it is not possible to calculate the reference line M using the entire section of the detection line L (for example, when the curve approximation calculation does not converge). Furthermore, for example, the reference line calculation unit 116 may calculate a candidate reference line M using the entire section of the detection line L, and if the candidate reference line M is separated from the detection line L by a predetermined distance or more, it may determine that the candidate reference line M is not an appropriate reference line M and select to use a portion of the section.

[0085] FIG. 8 shows examples of reference lines Ma to Md for the layers B1a to B1d, respectively.

[0086] (Determination of Local Deformation) The determination unit 118 generates information about the local deformation of layer B based on the position information of layer B calculated by the calculation unit 114, and the output control unit 120 outputs the information about the local deformation of layer B generated by the determination unit 118. That is, the determination unit 118 determines whether layer B is locally deformed based on the position information of layer B, and if it is determined that layer B is locally deformed, generates information about the local deformation of layer B that includes information that indicates that local deformation has occurred. On the other hand, if it is determined that layer B is not locally deformed, the determination unit 118 generates information about the local deformation of layer B that includes information that indicates that no local deformation has occurred.

[0087] The method for determining whether local deformation has occurred based on the position information of layer B (the method for generating information on local deformation) may be arbitrary, but an example in this embodiment will be described below.

[0088] 9 is a graph showing an example of the difference between the detection line and the reference line. In this embodiment, the determination unit 118 determines whether a layer B is locally deformed based on the detection line L of the layer B and the reference line M of the layer B. Any method for making this determination based on the detection line L and the reference line M may be used. In this embodiment, the determination unit 118 determines whether a layer B is locally deformed based on the difference between the detection line L and the reference line M (the difference between the detection line L and the reference line M in the stacking direction Y). In this case, if the difference between the detection line L and the reference line M satisfies a predetermined condition, the determination unit 118 determines that the layer B is locally deformed. If the difference does not satisfy the predetermined condition, the determination unit 118 determines that the layer B is not locally deformed.

[0089] More specifically, the determination unit 118 calculates the difference in the stacking direction Y between the detection line L and the reference line M for each position in the layer direction X. That is, the determination unit 118 calculates the difference between the Y-direction position of the detection line L and the Y-direction position of the reference line M at the same position in the layer direction X, and repeats this for each position in the layer direction X to calculate the difference in the stacking direction Y between the detection line L and the reference line M for each position in the layer direction X. Hereinafter, the difference in the stacking direction Y between the detection line L and the reference line M will be appropriately referred to as a difference value, and the difference value for each position in the layer direction X will be appropriately referred to as a difference group N. The difference group Na in FIG. 9 shows an example of the difference group N between the detection line La and the reference line Ma of the layer B1a.

[0090] The determination unit 118 may determine local deformation using any method based on the difference set N (difference values ​​at each position in the layer direction X). For example, the determination unit 118 may compare the difference value with a predetermined threshold for each position in the layer direction X and determine whether the difference value is less than the threshold for each position in the layer direction X. In this case, if the difference values ​​at all positions in the layer direction X are less than the threshold, the determination unit 118 may determine that the difference between the detection line L and the reference line M does not satisfy a predetermined condition and therefore determine that the layer B is not locally deformed. On the other hand, if the difference values ​​at some positions in the layer direction X are equal to or greater than the threshold, the determination unit 118 may determine that the difference between the detection line L and the reference line M satisfies the predetermined condition and therefore determine that the layer B is locally deformed. If the difference values ​​at all positions in the layer direction X are equal to or greater than the threshold, the determination unit 118 preferably determines that the setting of the reference line M is inappropriate, recalculates the reference line M, and redoes the determination of local deformation. However, the determining unit 118 may also determine that the layer B is locally deformed when the difference value is equal to or greater than the threshold value at all positions in the layer direction X.

[0091] Note that even if the difference value at some positions is equal to or greater than the threshold, if the ratio of the difference value to the threshold is less than a predetermined value, the determination of whether local deformation has occurred may be suspended. For example, if the ratio of the difference value to the threshold is less than a predetermined value, the output control unit 120 may output information for the user to determine whether local deformation has occurred. More specifically, in this case, the output control unit 120 may cause the display device 102 to display information indicating the positions where the difference value is equal to or greater than the threshold and information indicating the difference value at that position. As the information indicating the positions where the difference value is equal to or greater than the threshold, the output control unit 120 may, for example, display an image of a 3D image of the laminate A cut at a predetermined cross section and an image indicating the positions in that image where the difference value is equal to or greater than the threshold (e.g., an image highlighting that position). Furthermore, the output control unit 120 may display the difference value or the ratio of the difference value to the threshold as the information indicating the difference value at that position. For example, the output control unit 120 may assign a score to the ratio of the difference value to the threshold, with the score decreasing as the ratio increases, and display the score. The user visually recognizes such an image, determines whether layer B is locally deformed, and inputs the determination result to the input device 101. The determination unit 118 determines whether layer B is locally deformed based on the user's determination result input to the input device 101. That is, if the user's determination result indicates that layer B is locally deformed, the determination unit 118 determines that layer B is locally deformed, and if the user's determination result indicates that layer B is not locally deformed, the determination unit 118 determines that layer B is not locally deformed. Note that if the ratio of the difference value to the threshold is equal to or greater than a predetermined value, the determination unit 118 may determine that layer B is locally deformed.

[0092] In the above example, the determination unit 118 compares the difference value with the threshold value for each position in the layer direction X. This makes it possible to determine whether or not layer B is deformed for each position in the layer direction X, and therefore makes it possible to appropriately detect locations in layer B that are locally deformed.

[0093] However, the determination unit 118 is not limited to comparing the difference value with a threshold value for each position in the layer direction X. For example, the determination unit 118 may calculate the difference (hereinafter referred to as a displacement value) between a maximum difference value, which is the maximum value among the difference values ​​for each position in the layer direction X, and a minimum difference value, which is the minimum value among the difference values ​​for each position in the layer direction X. In this case, the determination unit 118 determines that layer B is not locally deformed if the displacement value is equal to or greater than a predetermined threshold, and determines that layer B is locally deformed if the displacement value is equal to or greater than the threshold. Even in this case, the determination unit 118 may suspend the determination of whether or not there is local deformation if the ratio of the displacement value to the threshold is less than a predetermined value, even if the displacement value is equal to or greater than the threshold. If the ratio of the displacement value to the threshold is less than a predetermined value, the output control unit 120 may output information for determining whether or not the user has locally deformed. The method of outputting information in this case and the method of determination by the determination unit 118 based on the user's determination result are the same as those described above for the case where the ratio of the difference value to the threshold is less than a predetermined value, and therefore will not be described again. In this case as well, if the ratio of the displacement value to the threshold value is equal to or greater than a predetermined value, the determining unit 118 may determine that layer B is locally deformed.

[0094] For example, the determination unit 118 may calculate the average value of the difference values ​​for each position in the layer direction X. In this case, if this average value is equal to or greater than a predetermined threshold, the determination unit 118 determines that the layer B is not locally deformed. If the average value is equal to or greater than the threshold, the determination unit 118 may also determine that the layer B is locally deformed. Even in this case, if the ratio of the average value to the threshold is less than a predetermined value, the determination unit 118 may suspend the determination of whether the layer B is locally deformed. If the ratio of the average value to the threshold is less than the predetermined value, the output control unit 120 may output information for determining whether the user has locally deformed. The method of outputting information in this case and the method of determination by the determination unit 118 based on the user's determination are the same as those described above for the case where the ratio of the difference value to the threshold is less than a predetermined value, and therefore, further description thereof will be omitted. Even in this case, if the ratio of the average value to the threshold is equal to or greater than a predetermined value, the determination unit 118 may determine that the layer B is locally deformed.

[0095] When determining local deformation using displacement values ​​or average values ​​in this way, it is not necessary to determine whether each position is above a threshold, so it is possible to determine whether layer B is locally deformed while reducing the computational load.

[0096] The determination unit 118 performs the above process for each layer B to determine whether each layer B is locally deformed. FIG. 10 is a graph showing an example of the local change amount of a layer. The horizontal axis of FIG. 10 indicates the number of each layer B included in the laminate A (each layer B arranged in stacking order), and the vertical axis indicates the local deformation amount of that layer B. For example, if local deformation is determined for each position in the layer direction X, the local deformation amount on the vertical axis of FIG. 10 may be the difference value at the location determined to be locally deformed. Furthermore, for example, if local deformation is determined based on displacement values, the local deformation amount on the vertical axis of FIG. 10 may be the displacement value, and if local deformation is determined based on an average value, the local deformation amount on the vertical axis of FIG. 10 may be the average value. FIG. 10 shows the local deformation amount for each layer B of laminates A1 and A2. The laminates A1 and A2 are different laminates. For example, the laminates A1 and A2 are the same type of laminate, but were produced on different days. In the example of FIG. 10, it is shown that the local deformation amount of a part of the layer B of the laminate A1 is large, and that the part of the layer B is locally deformed.

[0097] (Defectiveness Determination of Stack) Furthermore, the determination unit 118 may generate information regarding defects in the stack A including the layer B based on the difference value for each layer B, and the output control unit 120 may output the information regarding the defectiveness of the stack A. The information regarding the defectiveness of the stack A is information indicating whether the stack A is defective or not. That is, in this case, the determination unit 118 determines whether the stack A including the layers B is defective based on the difference value for each layer B. In this case, any determination method may be used. For example, the determination unit 118 may determine that the stack A is defective if the number of layers B determined to be locally deformed is equal to or greater than a predetermined number, and may determine that the stack A is not defective if the number is less than the predetermined number. Furthermore, for example, the determination unit 118 may calculate the average value of the displacement values ​​(the difference between the maximum and minimum difference values ​​for each position) of each layer B, and determine that the stack A is defective if the average value is equal to or greater than a predetermined value, and may determine that the stack A is not defective if the average value is less than the predetermined value. For example, the judgment unit 118 may calculate the average value of each layer B (average value of the difference values ​​for each position), and if the average value is equal to or greater than a predetermined value, judge that the stack A is defective, and if the average value is less than the predetermined value, judge that it is not defective.

[0098] By determining defects in the laminate A in this manner, defects due to local deformation can be detected in a non-destructive manner.

[0099] (Output of Information) The output control unit 120 outputs information about the local deformation of layer B generated by the determination unit 118. That is, the output control unit 120 outputs the determination result by the determination unit 118. The method of outputting the information about the local deformation of layer B by the output control unit 120 may be arbitrary, and the information may be displayed on the display device 102 or transmitted to another device.

[0100] The output control unit 120 may output, as information regarding the local deformation of layer B, information indicating which layer B is locally deformed, in addition to the determination result by the determination unit 118 (information regarding whether layer B is locally deformed). That is, the output control unit 120 may output information indicating which layer B included in the stack A is locally deformed. Furthermore, when the determination unit 118 detects a position of local deformation in layer B, the output control unit 120 may also output information indicating the position of local deformation in layer B. For example, the output control unit 120 may cause the display device 102 to display an image obtained by cutting the three-dimensional image of the stack A at a predetermined cross section and an image indicating the position of local deformation in layer B in the image (e.g., an image highlighting the position).

[0101] (Effects) As described above, the control system 5 according to this embodiment analyzes whether layer B of the laminate A is locally deformed based on image data of the laminate A (data showing the internal structure of the laminate A) obtained by irradiation with radiation, and outputs data related to the local deformation. Therefore, according to this embodiment, data related to the local deformation of layer B can be obtained nondestructively, and local deformation of layer B can be appropriately detected. In particular, even if a lithium-ion battery is determined to be free of defects in an electrical inspection, it may deteriorate after reuse and become unable to be used properly. As a result of extensive research, the present inventors have found that this phenomenon is caused by Li precipitation from the lithium-ion battery, which causes local deformation of the lithium-ion battery. In contrast, according to this embodiment, detecting local deformation using the above method based on image data of the laminate A obtained by irradiation with radiation can effectively prevent the battery from becoming unable to be used properly.

[0102] (Processing Flow) A processing flow showing the processing content of the control system 5 described above will be described below. Figures 11 to 13 are flowcharts illustrating the processing flow of the control device.

[0103] 11 , the control system 5 (control device 108) controls the acquisition unit 112 to acquire image data of the stack A (data indicating the internal structure of the stack A) (step S10). The control system 5 (control device 108) controls the calculation unit 114 to calculate a detection line L of layer B of the stack A based on the image data of the stack A (step S12). The control system 5 (control device 108) also controls the reference line calculation unit 116 to acquire (generate) a reference line M of layer B (step S14). The control system 5 (control device 108) then controls the determination unit 118 to determine whether the difference between the detection line L and the reference line M satisfies a predetermined condition (step S16). If the determination unit 118 determines that the difference between the detection line L and the reference line M satisfies the predetermined condition (step S16; Yes), the determination unit 118 determines that the layer B is locally deformed (step S18), and the output control unit 120 outputs information that the layer B is locally deformed as information related to the local deformation. On the other hand, if the determination unit 118 determines that the difference between the detection line L and the reference line M does not satisfy the predetermined condition (step S16; No), the determination unit 118 determines that the layer B is not locally deformed (step S20), and the output control unit 120 outputs information that the layer B is not locally deformed as information related to the local deformation. After executing step S18 or step S20, the control system 5 (control device 108) proceeds to step S22, where it determines whether to end this process. If the control system 5 (control device 108) determines that this process should be terminated (step S22; Yes), it terminates this process; if it does not determine that this process should be terminated (step S22; No), it returns to step S12 and repeats the same process for the other layers B.

[0104] A detailed processing flow of the method for acquiring the reference line M in step S14 of Fig. 11 will be described with reference to Fig. 12. As shown in Fig. 12, if design information for the reference line M is available (step S14A; Yes), the reference line calculation unit 116 of the control system 5 (control device 108) calculates the reference line M based on the design information (step S14B). On the other hand, if the reference line calculation unit 116 determines that design information for the reference line M is not available (step S14A; No), the reference line calculation unit 116 determines whether to calculate the reference line M using the detection line L for all sections of layer B (step S14C). If the reference line calculation unit 116 calculates the reference line M using the detection line L for all sections of layer B (step S14C; Yes), the reference line calculation unit 116 calculates the reference line M based on the detection line L for all sections of layer B (step S14D). If the reference line calculation unit 116 does not calculate the reference line M using the detection lines L for all sections of layer B (step S14C; No), the reference line calculation unit 116 determines whether the detection lines L include a section in which the amount of positional change in the stacking direction Y is within a predetermined range (step S14E). If the reference line calculation unit 116 determines that there is a section in which the amount of positional change is within a predetermined range (step S14E; Yes), the reference line calculation unit 116 calculates the reference line M based on the detection lines L for that section (step S14F). On the other hand, if the reference line calculation unit 116 determines that there is no section in which the amount of positional change is within the predetermined range (step S14E; No), the reference line calculation unit 116 selects a different layer B (step S14G), returns to step S14A, and repeats the same process. In other words, in this case, the reference line calculation unit 116 calculates the reference line M from the design information of the reference line M for another layer B and the detection line L of another layer B, and treats the reference line M of that other layer B as the reference line M of the layer B being targeted this time.

[0105] A detailed processing flow of the method for determining whether the difference between the detection line L and the reference line M satisfies a predetermined condition in step S16 of FIG. 11 will be described with reference to FIG. 13 . As shown in FIG. 13 , the determination unit 118 determines whether there is a difference between the detection line L and the reference line M (step S16A). That is, here, the determination unit 118 calculates a difference value (the difference between the detection line L and the reference line M in the stacking direction Y) for each position in the layer direction X, and determines whether the difference value is zero for each position in the layer direction X. If the determination unit 118 determines that there is no difference between the detection line L and the reference line M (step S16A; No), that is, if the difference value is zero at each position in the layer direction X, the determination unit 118 does not determine whether there is a local deformation, and proceeds to step S22 of FIG. 11 . If the determination unit 118 determines that there is a difference between the detection line L and the reference line M (step S16A; Yes) and that the difference value (the difference between the detection line L and the reference line M in the stacking direction Y) is less than the threshold value (step S16B; Yes), the determination unit 118 determines that the layer B is not locally deformed (step S20). On the other hand, if the determination unit 118 determines that the difference value is equal to or greater than the threshold value (step S16B; No) and that the ratio of the difference value to the threshold value is equal to or greater than a predetermined value (step S16C; Yes), the determination unit 118 determines that the layer B is locally deformed (step S18). If the determination unit 118 determines that the ratio of the difference value to the threshold value is less than the predetermined value (step S16C; No), the output control unit 120 outputs information for determining whether the user has locally deformed (step S18A). The user checks this information, determines whether the layer B is locally deformed, and inputs the determination result into the input device 101. The determination unit 118 determines whether the layer B is locally deformed based on the result of the user's determination input to the input device 101 .

[0106] (Another Example 1 of the Method for Determining Local Deformation) In the above description, the determination unit 118 determines whether a layer B is locally deformed based on the detection line L and reference line M of the layer B. However, the determination unit 118 does not have to use the detection line L and reference line M to determine whether a layer B is locally deformed. For example, the determination unit 118 may determine whether a layer B (first layer) to be determined for local deformation is locally deformed based on a comparison between the layer B (first layer) and another layer B (second layer). That is, in this case, the output control unit 120 may output information regarding the local deformation of the layer B (first layer) based on a comparison between the layer B (first layer) and the other layer B (second layer). Here, the other layer B (second layer) to be compared may be any layer different from the layer B (first layer) to be determined. However, in this embodiment, it is preferably a layer adjacent to the layer B (first layer) to be determined in the stacking direction Y. However, if the layer B to be judged is an electrode, the layer adjacent to the layer B via an inter-electrode member (an electrolyte layer in this example) may be the other layer B to be compared. That is, in this embodiment, layer B3, which is an electrolyte layer, is provided between layers B1 and B2, which are electrodes. Therefore, if the layer to be judged is layer B1, the other layer B to be compared may be layer B2, which is adjacent to layer B1 via layer B3. Furthermore, for example, the other layer B to be compared may be a layer of the same type as the layer B to be judged but adjacent to the layer B to be judged via a different type of layer. That is, in this embodiment, the layers are stacked in the order of layer B1, layer B3, layer B2, layer B3, and layer B1. Therefore, if the layer to be judged is layer B1, the other layer B to be compared may be layer B1, which is adjacent to layer B1 via layer B3, layer B2, and layer B3.

[0107] Any method may be used to determine local deformation based on the layer B to be determined and the layer B to be compared. For example, in this embodiment, the determination unit 118 may calculate the detection line L (first detection line) of the layer B to be determined and the detection line L (second detection line) of the layer B to be compared, and determine whether the layer B to be determined is locally deformed based on the difference between the first detection line and the second detection line (the difference between the first detection line and the second detection line in the stacking direction Y). In this case, the determination unit 118 determines that local deformation has occurred if the difference between the first detection line and the second detection line satisfies a predetermined condition, and determines that local deformation has not occurred if the difference does not satisfy the predetermined condition.

[0108] More specifically, the determination unit 118 may calculate a difference between the first detection line and the second detection line in the stacking direction Y for each position in the layer direction X, and determine whether local deformation has occurred based on the difference for each position in the layer direction X. That is, the determination unit 118 calculates the difference between the Y-direction position of the first detection line and the Y-direction position of the first detection line at the same position in the layer direction X, and repeats this for each position in the layer direction X to calculate the difference between the first detection line and the second detection line in the stacking direction Y for each position in the layer direction X. In other words, the determination unit 118 calculates the distance between the layer B to be determined and the layer B to be compared in the stacking direction Y for multiple sections of the layer B to be determined, and outputs information regarding the local deformation of the layer B to be determined. Hereinafter, the difference between the first detection line and the second detection line in the stacking direction Y will be referred to as an inter-layer difference value, as appropriate.

[0109] The determination unit 118 may determine local deformation using any method based on the inter-layer difference value for each position in the layer direction X. For example, the determination unit 118 may compare the inter-layer difference value with a predetermined threshold for each position in the layer direction X and determine, for each position in the layer direction X, whether the inter-layer difference value is less than the threshold. In this case, if the inter-layer difference values ​​at all positions in the layer direction X are less than the threshold, the determination unit 118 may determine that the difference does not satisfy the predetermined condition and that the layer B being determined is not locally deformed. On the other hand, if the inter-layer difference values ​​at some positions in the layer direction X are equal to or greater than the threshold, the determination unit 118 determines that the difference satisfies the predetermined condition and that the layer B being determined is locally deformed. In other words, the determination unit 118 determines that the layer B being determined is locally deformed if, in some sections (first sections) of the multiple sections of the layer B being determined, the distance from the layer B being compared in the stacking direction Y is equal to or greater than a predetermined value and, in a second section different from the first section, the distance from the layer B being compared in the stacking direction Y is less than a predetermined value.

[0110] Note that even if the interlayer difference value at a certain position (first section) is equal to or greater than the threshold, if the ratio of the difference value to the threshold is less than a predetermined value, the determination of whether local deformation has occurred may be suspended. For example, if the ratio of the interlayer difference value to the threshold is less than a predetermined value, the output control unit 120 may output information for the user to determine whether local deformation has occurred. More specifically, in this case, the output control unit 120 may cause the display device 102 to display information indicating the position where the interlayer difference value is equal to or greater than the threshold and information indicating the interlayer difference value at that position. As the information indicating the position where the interlayer difference value is equal to or greater than the threshold, the output control unit 120 may, for example, display an image of the 3D image of the stack A cut at a predetermined cross section and an image indicating the position in that image where the interlayer difference value is equal to or greater than the threshold (e.g., an image highlighting that position). Furthermore, the output control unit 120 may display the interlayer difference value or the ratio of the interlayer difference value to the threshold as the information indicating the interlayer difference value at that position. Alternatively, for example, a score may be assigned to the ratio of the inter-layer difference value to a threshold value, with the score decreasing as the ratio increases, and the score may be displayed. The user visually recognizes such an image, determines whether layer B is locally deformed, and inputs the determination result to the input device 101. The determination unit 118 determines whether layer B is locally deformed based on the user's determination result input to the input device 101. That is, if the user's determination result indicates that local deformation has occurred, the determination unit 118 determines that layer B is locally deformed, and if the user's determination result indicates that no local deformation has occurred, the determination unit 118 determines that layer B is not locally deformed. Note that if the ratio of the difference value to the threshold value is equal to or greater than a predetermined value, the determination unit 118 may determine that layer B is locally deformed.

[0111] For example, the determination unit 118 may calculate the difference (hereinafter referred to as the inter-layer displacement value) between the maximum difference value, which is the maximum value among the inter-layer difference values ​​for each position in the layer direction X, and the minimum difference value, which is the minimum value among the difference values ​​for each position in the layer direction X. In this case, the determination unit 118 determines that layer B is not locally deformed if the inter-layer displacement value is equal to or greater than a predetermined threshold, and determines that layer B is locally deformed if the inter-layer displacement value is equal to or greater than the threshold. Even in this case, the determination unit 118 may suspend the determination of whether local deformation has occurred if the ratio of the inter-layer displacement value to the threshold is less than a predetermined value, even if the inter-layer displacement value is equal to or greater than the threshold. If the ratio of the inter-layer displacement value to the threshold is less than a predetermined value, the output control unit 120 may output information for the user to determine whether local deformation has occurred. In this case, the method of outputting information and the method of determination by the determination unit 118 based on the user's determination result are the same as those described above for the case where the ratio of the inter-layer difference value to the threshold is less than a predetermined value, and therefore will not be described again.

[0112] Furthermore, for example, the determination unit 118 may calculate the average value of the inter-layer difference values ​​(inter-layer average value) for each position in the layer direction X. In this case, if the inter-layer average value is equal to or greater than a predetermined threshold, the determination unit 118 determines that the layer B is not locally deformed. If the inter-layer average value is equal to or greater than the threshold, the determination unit 118 determines that the layer B is locally deformed. Even in this case, if the ratio of the inter-layer average value to the threshold is less than a predetermined value, the determination unit 118 may suspend the determination of whether the layer B is locally deformed. If the ratio of the inter-layer average value to the threshold is less than the predetermined value, the output control unit 120 may output information for determining whether the user has locally deformed. The method of outputting information in this case and the method of determination by the determination unit 118 based on the user's determination are the same as those described above for the case where the ratio of the inter-layer difference value to the threshold is less than a predetermined value, and therefore, description thereof will be omitted.

[0113] The following describes the processing flow for determining local deformation based on the comparison between layer B and another layer B (second layer) as described above. FIG. 14 is a flowchart illustrating a processing flow according to another example of this embodiment. In this example, the control system 5 (control device 108) causes the acquisition unit 112 to acquire image data of the stack A (data indicating the internal structure of the stack A) (step S30). Then, the control system 5 (control device 108) causes the calculation unit 114 to calculate a first detection line, which is the detection line L of the layer B to be determined, and a second detection line, which is the detection line L of the layer B to be compared, based on the image data of the stack A (step S32). The control system 5 (control device 108) causes the determination unit 118 to determine whether the difference between the first detection line and the second detection line satisfies a predetermined condition (step S34). If the determination unit 118 determines that the difference between the first detection line and the second detection line satisfies the predetermined condition (step S34; Yes), the determination unit 118 determines that layer B is locally deformed (step S36), and the output control unit 120 outputs information that layer B is locally deformed as information related to the local deformation. On the other hand, if the determination unit 118 determines that the difference between the first detection line and the second detection line does not satisfy the predetermined condition (step S34; No), the determination unit 118 determines that layer B is not locally deformed (step S38), and the output control unit 120 outputs information that layer B is not locally deformed as information related to the local deformation. After executing step S36 or step S38, the control system 5 (control device 108) proceeds to step S40 to determine whether to end this process. If the control system 5 (control device 108) determines that this process should be terminated (step S40; Yes), it terminates this process; if it determines that this process should not be terminated (step S40; No), it returns to step S32 and repeats the same process for the other layers B.

[0114] (Another Example 2 of the Method for Determining Local Deformation) In the above description, the control system 5 calculates the position of layer B in a predetermined cross-section from the image data, and determines whether or not local deformation exists based on the position of layer B in the predetermined cross-section. That is, in the above description, image data of a two-dimensional cross-section called a predetermined cross-section is extracted from the image data of the stack A, which is three-dimensional voxel data. From the image data of the predetermined cross-section, gradation values ​​along a one-dimensional line SC are extracted to calculate a one-dimensional detection line L, thereby calculating the position of layer B. However, the determination of whether or not local deformation exists is not limited to using the position of layer B in the predetermined cross-section. For example, the calculation unit 114 of the control system 5 may calculate the position of layer B in the stacking direction Y at each location on a two-dimensional plane intersecting with the layer direction X from the image data of the stack A. In this case, the calculation unit 114 extracts gradation values ​​at each location on the two-dimensional plane. Then, the calculation unit 114 shifts the position of the two-dimensional plane and repeats the same process to obtain gradation values ​​for each two-dimensional plane. The calculation unit 114 extracts the gradation values ​​of the two-dimensional planes at locations corresponding to the same layer B, and calculates a detection plane indicating the Y-direction position at each in-plane position of the layer B based on each extracted gradation value.The calculation unit 114 then determines the presence or absence of local deformation based on the detection plane.That is, in this example, the one-dimensional detection line L in the above-described embodiment is replaced with a two-dimensional detection plane.Other processing methods are the same as those in the above-described embodiment.

[0115] (Another Example 1 of Output Information) Next, another example of information regarding the local deformation of layer B output by the output control unit 120 will be described. FIGS. 15 to 17 are schematic diagrams illustrating another example of output information. In this example, the output control unit 120 causes the display device 102 to display an image Q1 of the stack A and an image Q2 indicating the threshold value used to determine the local deformation. Image Q1 includes an image of the three-dimensional image of the stack A cut at a predetermined cross section and an image indicating the position of the local deformation of layer B in that image (e.g., an image highlighting that position). Image Q2 includes an image indicating the threshold value and an image for accepting changes to the threshold value by the user. In the examples of FIGS. 15 to 17, image Q2 includes an image of a scale indicating the upper and lower limits of the settable threshold value and an image of a bar superimposed on the scale indicating the current threshold value.

[0116] When the user inputs the threshold value into the input device 101, the control system 5 sets the threshold value to the value input by the user. The control system 5 then redoes the determination of whether layer B is locally deformed using the newly set threshold value and updates images Q1 and Q2. That is, the control system 5 superimposes, as image Q1, an image showing the location of locally deformed layer B detected using the newly set threshold value on a 3D image of the laminate A cut at a predetermined cross section. The control system 5 also displays, as image Q2, the newly set threshold value. For example, FIG. 15 shows images Q1 and Q2 when the threshold value is a predetermined value. FIG. 16 shows images Q1 and Q2 when the threshold value is set higher than the predetermined value. FIG. 17 shows images Q1 and Q2 when the threshold value is set lower than the predetermined value. In FIG. 16, the area of ​​layer B considered to be locally deformed is narrower due to the higher threshold value. In FIG. 17, the area of ​​layer B considered to be locally deformed is wider due to the higher threshold value.

[0117] As in this example, by displaying an image showing the location of local deformation in layer B and an image accepting changes to the threshold value, the user can properly recognize whether local deformation has occurred.

[0118] (Another Example 2 of Output Information) FIG. 18 is a schematic diagram illustrating another example of output information. In this example, the output control unit 120 may output, as information regarding the local deformation of layer B, image data of stack A (e.g., image Q3 shown in FIG. 18 ), data indicating the degree of deformation for each position on stack A, and information indicating whether layer B is locally deformed. The data indicating the degree of deformation for each position on stack A refers, for example, to the difference (difference value) between the detection line L and the reference line M in the stacking direction Y for each position on stack A, or the difference (inter-layer difference value) between the first detection line and the second detection line in the stacking direction Y for each position on stack A. By outputting such data as information regarding the local deformation of layer B, the information regarding the local deformation can be appropriately used as training data for machine learning. That is, for example, by having a machine learning model learn the degree of deformation for each position and information (label) indicating whether layer B is locally deformed as training data, the correspondence between the degree of deformation for each position and the local deformation can be appropriately learned.

[0119] (System Example) In the above embodiment, the inspection system 100 performs processing using a single device, but multiple devices may be combined. FIG. 19 is a schematic diagram showing the configuration of a system including an inspection device. Next, a manufacturing system 300 including the inspection system 100 will be described using FIG. 19. The manufacturing system 300 includes multiple inspection systems 100 (three in FIG. 12 ) and a program creation device 302. The inspection systems 100 and the program creation device 302 are connected via a wired or wireless communication line. The program creation device 302 creates various settings and programs to be created by the control device of the inspection system 100. The program creation device 302 outputs the created programs and data to the inspection system 100. The inspection system 100 acquires area and range information and inspection programs from the program creation device 302 and performs processing using the acquired data and programs. The manufacturing system 300 performs inspections using the inspection system 100 using the data and programs created by the program creation device 302, thereby making effective use of the created data and programs.

[0120] Next, a manufacturing system including the above-described inspection apparatus will be described with reference to Fig. 20. Fig. 20 is a block diagram of the manufacturing system. The manufacturing system 200 of this embodiment includes the inspection system 100 described in the above embodiment, a design apparatus 202, a manufacturing apparatus 204, and a repair apparatus 206.

[0121] The design device 202 creates design information relating to the shape and composition of the laminate A, and transmits the created design information to the manufacturing device 204 .

[0122] The manufacturing device 204 creates a laminate A based on the design information input from the design device 202. The inspection system 100 inspects the internal structure of the created laminate A and determines whether layer B of the laminate A is locally deformed. In other words, the inspection system 100 determines whether the created laminate A is a non-defective product. If the laminate A is not a non-defective product, the inspection system 100 determines whether the laminate A is repairable. If the laminate A is repairable, the laminate A calculates the defective portion (the portion where the local deformation has occurred) and the repair details based on the information about the local deformation, and transmits information indicating the defective portion and the repair details to the repair device 206.

[0123] The repair device 206 repairs the defective portion of the laminate A based on the information indicating the defective portion and the information indicating the repair content received from the inspection system 100.

[0124] 21 is a flowchart showing the flow of processing by the manufacturing system. In the manufacturing system 200, first, the design device 202 creates design information for the laminate A (step S101). Next, the manufacturing device 204 creates the laminate A based on the design information (step S102). Next, the inspection system 100 inspects (measures) the created laminate A (step S103). Next, the inspection system 100 determines whether the laminate A is locally deformed (step S104).

[0125] Next, the inspection system 100 determines whether the created stack A is a non-defective product (step S105). If the manufacturing system 200 determines that the created stack A is a non-defective product (Yes in step S105), the processing ends. On the other hand, if the inspection system 100 determines that the created stack A is not a non-defective product (No in step S105), the inspection system 100 determines whether the created stack A can be repaired (step S106).

[0126] If the manufacturing system 200 determines that the created laminate A can be repaired (Yes in step S106), the repair device 206 repairs the laminate A (step S107), and the process returns to step S103. If the manufacturing system 200 determines that the created laminate A cannot be repaired (No in step S106), the process ends and the defective product is collected. With this, the manufacturing system 200 ends the process of the flowchart shown in FIG. 21.

[0127] The manufacturing system 200 of this embodiment can determine whether the manufactured laminate A is a non-defective product because the inspection system 100 of the above embodiment can inspect the internal structure of the laminate A with high accuracy. Furthermore, the manufacturing system 200 can repair the laminate A if it is not a non-defective product.

[0128] The repair process performed by the repair device 206 in this embodiment may be replaced with a process in which the manufacturing device 204 re-executes the manufacturing process. In this case, if the inspection system 100 determines that the product can be repaired, the manufacturing device 204 re-executes the manufacturing process.

[0129] (Effects) As described above, the inspection system 100 according to the present disclosure includes an irradiation device 2 capable of irradiating radiation, an imaging device 4 that irradiates the stack A with radiation using the irradiation device 2 and outputs data indicating the internal structure of the stack A, and a control device 108, and the control device 108 outputs information regarding the deformation of a portion of layer B (first layer) of the stack A (information regarding the local deformation of layer B) based on the data indicating the internal structure of the stack A. According to the present disclosure, data regarding the local deformation of layer B can be obtained non-destructively, and the local deformation of layer B can be appropriately detected.

[0130] Furthermore, the control device 108 uses data indicating the internal structure of the laminate A to calculate the position of layer B of the laminate A in a predetermined cross section of the laminate A, and outputs information regarding the local deformation of layer B based on the position of layer B. According to the present disclosure, data regarding the local deformation of layer B can be obtained non-destructively, and the local deformation of layer B can be appropriately detected.

[0131] Furthermore, the control device 108 outputs information regarding the local deformation of layer B based on the detection line L indicating the position of layer B. According to the present disclosure, since information regarding the local deformation is output using the detection line L, the local deformation of layer B can be detected with high accuracy.

[0132] Furthermore, the detection line L is calculated by curve approximating the position of the layer B. According to the present disclosure, information regarding the local deformation is output using such a detection line L, so that the local deformation of the layer B can be detected with high accuracy.

[0133] Furthermore, a smooth curve is approximated when calculating the detection line L. According to the present disclosure, such smooth curve approximation allows the local deformation of the layer B to be detected with high accuracy.

[0134] The control device 108 also acquires a reference line M indicating the reference position of layer B, and outputs information regarding the local deformation of layer B based on a comparison between the reference line M and the detection line L. According to the present disclosure, the information regarding the local deformation is output using the detection line L and the reference line M, so that the local deformation of layer B can be detected with high accuracy.

[0135] Furthermore, the control device 108 acquires the reference line M from the design information. According to the present disclosure, by using such a reference line M, the local deformation of the layer B can be detected with high accuracy.

[0136] Furthermore, the control device 108 calculates the reference line M using the positions of layer B in all sections of layer B. According to the present disclosure, by calculating the reference line M in this manner, local deformation of layer B can be detected with high accuracy.

[0137] Furthermore, the control device 108 calculates the reference line M using the position of layer B in a partial section of layer B. According to the present disclosure, by calculating the reference line M in this manner, local deformation of layer B can be detected with high accuracy.

[0138] Furthermore, the control device 108 uses a section in which the amount of change in the position of the layer B in the stacking direction Y of the stacked body A is within a predetermined range as the partial section. By calculating the reference line M using such a section, the local deformation of the layer B can be detected with high accuracy.

[0139] Furthermore, the control device 108 outputs information regarding the local deformation of layer B based on a comparison between data of layer B (first layer) of the stack A and data of the layer (second layer) adjacent to layer B. According to the present disclosure, the information regarding the local deformation is output based on a comparison between layers B, so that the local deformation of layer B can be detected with high accuracy.

[0140] Furthermore, the control device 108 calculates the distance between each of the multiple sections of the layer B (first layer) and another layer B (second layer) in the stacking direction Y, and outputs information related to the local deformation of the layer B (first layer). According to the present disclosure, the information related to the local deformation is output based on a comparison of each section of the layer B, and therefore the local deformation of the layer B can be detected with high accuracy.

[0141] Furthermore, the control device 108 outputs information that the layer B (first layer) is deformed if the distance between the layer B (first layer) and another layer B (second layer) in the stacking direction Y in a first section of the multiple sections of the layer B (first layer) is equal to or greater than a predetermined value, and the distance between the layer B (second layer) and another layer B (second layer) in the stacking direction Y in a second section different from the first section is less than a predetermined value. According to the present disclosure, determining whether the layer B (first layer) is deformed in this manner enables local deformation to be detected with high accuracy.

[0142] Furthermore, the control device 108 regards the data of the layer B (third layer) adjacent to the layer B (first layer) of the laminate A as the data of the layer B (first layer). By handling the data in this manner, local deformation of the layer B (first layer) can be appropriately detected.

[0143] Furthermore, the members constituting layer B (first layer) include at least one of an electrode and a member between the electrodes. According to the present disclosure, local deformation of the electrode or the member between the electrodes can be appropriately detected.

[0144] Furthermore, the laminate A is a lithium ion battery. According to the present disclosure, local deformation of the lithium ion battery can be appropriately detected.

[0145] Moreover, the data showing the internal structure of the laminate A is an image showing the internal structure of the laminate A. According to the present disclosure, by using such image data, local deformation of the layer B can be appropriately detected.

[0146] Furthermore, the radiation includes X-rays. According to the present disclosure, by using data indicating the internal structure of the laminate A obtained by irradiating with X-rays, the local deformation of the layer B can be appropriately detected.

[0147] The control device 108 also acquires image data showing the internal structure of the stack A, which is generated by reconstructing images of the stack A from multiple images obtained by irradiating the stack A with radiation incident from different directions. According to the present disclosure, the image data showing the internal structure of the stack A can be used to appropriately detect local deformation of layer B.

[0148] The inspection system 100 of the present disclosure also includes an irradiation device 2 capable of irradiating radiation, and a control device 108. The control device 108 irradiates the stack A with radiation using the irradiation device 2, acquires data indicating the internal structure of the stack A, and outputs information regarding partial deformation of the acquired layer B inside the stack A (information regarding local deformation of layer B). According to the present disclosure, local deformation of layer B can be appropriately detected.

[0149] Furthermore, the display device (such as the display device 102) of the present disclosure displays information (information about the local deformation of layer B) about the deformation of a portion of layer B (first layer) of the laminate A, which is calculated based on data showing the internal structure of the laminate A, imaged by irradiation with radiation. According to the present disclosure, displaying the information about the local deformation of layer B calculated in this manner allows the user to appropriately recognize the local deformation.

[0150] The inspection method of the present disclosure also includes acquiring data showing the internal structure of the laminate A, which is imaged by irradiating the laminate A with radiation, and calculating, based on the data, information relating to deformation of a portion of the first layer of the laminate A. According to the present disclosure, local deformation of layer B can be appropriately detected.

[0151] The program of the present disclosure also causes a computer to acquire data showing the internal structure of the laminate A, which is imaged by irradiating the laminate A with radiation, and calculate, based on the data, information relating to deformation of a portion of the first layer of the laminate A. According to the present disclosure, local deformation of layer B can be appropriately detected.

[0152] The method for manufacturing the laminate A of the present disclosure includes creating design information regarding the shape of the laminate A, manufacturing the laminate A based on the design information, and determining whether a portion of a member constituting layer B of the manufactured laminate A is deformed using the inspection system 100. According to the present disclosure, it is possible to provide a laminate A that is not locally deformed.

[0153] Furthermore, the control device 108 of the present disclosure acquires data showing the internal structure of the stack A, which is imaged by irradiating it with radiation, and calculates, based on the data, a determination result as to whether or not a part of the members constituting the layers of the stack A has deformed. According to the present disclosure, local deformation of layer B can be appropriately detected.

[0154] Although preferred embodiments of the present invention have been described above with reference to the accompanying drawings, it goes without saying that the present invention is not limited to these examples. The shapes and combinations of the components shown in the above examples are merely examples, and various modifications can be made based on design requirements, etc., without departing from the spirit of the present invention. The components of the above-described embodiments can be combined as appropriate. In addition, some components may not be used. Furthermore, to the extent permitted by law, the disclosures of all published patent applications relating to the inspection apparatus, etc. cited in the above-described embodiments are incorporated by reference into this description. Other embodiments and operational techniques, etc., made by those skilled in the art based on the above-described embodiments are all included within the scope of the present embodiments.

[0155] REFERENCE SIGNS LIST 1 Measurement system 2 Irradiation device 4 Imaging device 5 Control system 100 Inspection system 108 Control device 110 X-ray control unit 112 Acquisition unit 114 Calculation unit 116 Reference line calculation unit 118 Determination unit 120 Output control unit A Stacked body B Layer L Detection line M Reference line

Claims

1. An inspection system comprising: an irradiation device capable of irradiating radiation; an imaging device that irradiates a stack with the radiation using the irradiation device and outputs data indicating the internal structure of the stack; and a control device that outputs information regarding deformation of a portion of a first layer of the stack based on the data.

2. The inspection system according to claim 1, wherein the control device uses the data to calculate the position of a first layer of the laminate in a specified cross section of the laminate, and outputs information relating to deformation of a portion of the first layer based on the position of the first layer.

3. The inspection system according to claim 2, wherein the control device outputs information regarding deformation of a portion of the first layer based on a detection line indicating a position of the first layer.

4. The inspection system of claim 3, wherein the detection line is calculated by curve approximating the position of the first layer.

5. The inspection system of claim 4, wherein the curve that is approximated is smooth.

6. An inspection system according to any one of claims 3 to 5, wherein the control device obtains a reference line indicating a reference position of the first layer, and outputs information regarding deformation of a portion of the first layer based on a comparison between the reference line and the detection line.

7. The inspection system according to claim 6, wherein the control device obtains the reference line from design information.

8. The inspection system according to claim 6, wherein the control device calculates the reference line using the position of the first layer throughout the entire section of the first layer.

9. The inspection system according to claim 6, wherein the control device calculates the reference line using a position of the first layer in a partial section of the first layer.

10. The inspection system according to claim 9, wherein the control device uses a section in which the amount of change in the position of the first layer in the stacking direction of the stack is within a predetermined range as the partial section.

11. An inspection system according to any one of claims 1 to 10, wherein the control device outputs information relating to deformation of a portion of the first layer based on a comparison between data of the first layer of the laminate and data of a second layer adjacent to the first layer.

12. The inspection system according to claim 11, wherein the control device calculates the distance between the second layer and a plurality of sections of the first layer in a stacking direction of the laminate, and outputs information relating to deformation of a portion of the first layer.

13. The inspection system described in claim 12, wherein the control device outputs information that the first layer is deformed when the distance between the first layer and the second layer in the stacking direction in a first section of the multiple sections of the first layer is equal to or greater than a predetermined value, and when the distance between the first layer and the second layer in the stacking direction in a second section different from the first section is less than a predetermined value.

14. An inspection system according to any one of claims 1 to 13, wherein the control device regards data of a third layer adjacent to the first layer of the laminate as data of the first layer.

15. The inspection system according to any one of claims 1 to 14, wherein the first layer of material includes at least one of an electrode and a material between electrodes.

16. The inspection system of any one of claims 1 to 15, wherein the stack is a lithium ion battery.

17. An inspection system according to any one of claims 1 to 16, wherein the data indicating the internal structure of the laminate is an image indicating the internal structure of the laminate.

18. The inspection system of any one of claims 1 to 17, wherein the radiation includes X-rays.

19. An inspection system according to any one of claims 1 to 18, wherein the control device acquires image data showing the internal structure of the laminate, the image data being generated by reconstructing an image of the laminate from a plurality of images obtained by irradiating the laminate with the radiation so as to be incident on the laminate from different directions.

20. An inspection system comprising: an irradiation device capable of irradiating radiation; and a control device, wherein the control device irradiates a stack with the radiation using the irradiation device, obtains data indicating an internal structure of the stack, and outputs information relating to deformation of a portion of a first layer inside the stack.

21. A display device that displays information about deformation of a portion of a first layer of the laminate, the information being calculated based on data showing an internal structure of the laminate imaged by irradiation with radiation.

22. An inspection method comprising: acquiring data showing an internal structure of a laminate imaged by irradiating with radiation; and calculating information relating to deformation of a portion of a first layer of the laminate based on the data.

23. A program causing a computer to execute the steps of: acquiring data showing the internal structure of a laminate imaged by irradiating the laminate with radiation; and calculating information relating to deformation of a portion of a first layer of the laminate based on the data.

24. A method for manufacturing a laminate, comprising: creating design information relating to the shape of a laminate; manufacturing the laminate based on the design information; and determining whether or not a portion of a member constituting a layer of the manufactured laminate is deformed using an inspection system described in any one of claims 1 to 20.

25. A control device which acquires data showing the internal structure of a laminate imaged by irradiating the laminate with radiation, and calculates a determination result as to whether or not a part of a member constituting a layer of the laminate is deformed based on the data.

Images