Electronic device comprising structures for dispersing heat

Abstract

An electronic device according to one embodiment may comprise a display, an electronic component and a heat diffusion member partially overlapping with the electronic component when viewed from above the display. The heat diffusion member can include: a first plate facing the electronic component; a second plate substantially facing the first plate; a separation structure arranged to have a first flow path and a second flow path; and a wick structure for moving a fluid. The wick structure can include a first wick portion positioned in the first flow path and the second flow path, and a second wick portion positioned on a portion of the first wick portion that corresponds to the second flow path.

Description

Electronic device including a structure for dissipating heat

[0001] The various embodiments described below relate to electronic devices including structures for dissipating heat.

[0002] Electronic devices may include various electronic components. The electronic devices may be miniaturized to be worn or carried by a user. As the electronic components within the electronic devices perform operations in response to user requests, heat may be generated within the miniaturized electronic devices. The electronic devices may require a structure for dissipating heat within the electronic devices. For example, the electronic devices may include a vapor chamber or a heat pipe for dissipating heat within the electronic devices.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] In one embodiment, an electronic device may include a display, an electronic component, and a heat spreader disposed to partially overlap the electronic component when viewed from above the display. The heat spreader may include a first plate facing the electronic component, a second plate substantially opposite the first plate, and a separation structure disposed in an internal space between the first plate and the second plate such that a first flow path and a second flow path are formed along a first side thereof and a second side thereof opposite the first side thereof, respectively. The heat spreader may include a wick structure for moving a fluid along at least one of the first flow path or the second flow path. The wick structure may include a first wick portion positioned in the first flow path and the second flow path, and a second wick portion positioned above a portion of the first wick portion corresponding to the second flow path.

[0005] In one embodiment, an electronic device may include an electronic component and a heat spreader member at least partially disposed on the electronic component. The heat spreader member may include a first region facing the electronic component, a second region spaced from the first region, and a third region connecting the first region and the second region and including a first flow path for a gaseous fluid, a second flow path for the fluid in a liquid state, and the third region including the first flow path and the second flow path. The heat spreader member may include a frame including a separation structure within the third region separating the first flow path and the second flow path, and a wick structure for moving the fluid within the frame. The wick structure may include a first wick portion including a first portion disposed within the first region, a second portion disposed within the second region, and a third portion within the third region connecting the first portion and the second portion, and a second wick portion within the second flow path interposed between the third portion and the frame.

[0006] FIG. 1 is a block diagram of an electronic device within a network environment, according to one embodiment.

[0007] FIG. 2A is a diagram illustrating an electronic device according to one embodiment.

[0008] FIG. 2b is an exploded perspective view of an electronic device according to one embodiment.

[0009] Figure 3a illustrates a portion of an exemplary electronic device.

[0010] Figure 3b is an exploded perspective view of a heat spreading member of an exemplary electronic device.

[0011] FIGS. 4A and 4B are cross-sectional views of a heat spreading member of an exemplary electronic device taken along line A-A' of FIG. 3A.

[0012] FIG. 4c is a cross-sectional view of a heat spreading member of an exemplary electronic device taken along line A-A' of FIG. 3a.

[0013] Figure 4d is a top plan view of the first wick portion of the heat diffusion member of Figure 4c.

[0014] FIG. 4e is a cross-sectional view of a heat spreading member of an exemplary electronic device taken along line A-A' of FIG. 3a.

[0015] Figure 4f is a plan view of the first wick portion of the heat diffusion member of Figure 4d.

[0016] Figure 5a is an exploded perspective view of a heat spreading member of an exemplary electronic device.

[0017] FIG. 5b is a cross-sectional view of a heat spreading member of an exemplary electronic device taken along line A-A' of FIG. 3a.

[0018] Fig. 5c is a plan view of the wick structure of the heat diffusion member of Fig. 5b.

[0019] FIG. 5d is a cross-sectional view of a heat spreading member of an exemplary electronic device taken along line A-A' of FIG. 3a.

[0020] Figure 5e is a plan view of the wick structure of the heat diffusion member of Figure 5d.

[0021] Figures 6a, 6b, 6c, and 6d illustrate a portion of a heat spreading member of an exemplary electronic device.

[0022] Figures 7a, 7b, and 7c illustrate a portion of a heat spreading member of an exemplary electronic device.

[0023] FIGS. 8A, 8B, 8C, 8D, and 8E illustrate portions of exemplary electronic devices.

[0024] Figure 9a illustrates an unfolded state of an exemplary electronic device.

[0025] Figure 9b illustrates a folded state of an exemplary electronic device.

[0026] Figure 9c is an exploded view of an exemplary electronic device.

[0027] FIG. 9d and FIG. 9e illustrate portions of exemplary electronic devices.

[0028] FIG. 1 is a block diagram of an electronic device within a network environment, according to one embodiment.

[0029] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). According to one embodiment, at least one of these components (e.g., the connection terminal (178)) may be omitted, or one or more other components may be added to the electronic device (101). According to one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0030] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0031] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0032] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0033] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0034] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0035] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0036] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0037] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0038] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0039] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0040] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0041] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0042] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0043] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0044] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0045] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0046] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0047] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0048] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to one surface (e.g., a bottom surface) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to another surface (e.g., a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0049] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0050] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. According to one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0051] FIG. 2A is a diagram illustrating an electronic device according to one embodiment.

[0052] Referring to FIG. 2A, an electronic device (200) according to one embodiment may include a housing (210) forming an exterior of the electronic device (200). For example, the housing (210) may include a front surface (200A), a rear surface (200B), and a side surface (200C) surrounding a space between the front surface (200A) and the rear surface (200B). According to one embodiment, the housing (210) may also refer to a structure forming at least a portion of the front surface (200A), the rear surface (200B), and / or the side surface (200C).

[0053] An electronic device (200) according to one embodiment may include a substantially transparent front plate (202). According to one embodiment, the front plate (202) may form at least a portion of the front surface (200A). According to one embodiment, the front plate (202) may include, but is not limited to, a glass plate or a polymer plate including various coating layers.

[0054] An electronic device (200) according to one embodiment may include a substantially opaque back plate (211). According to one embodiment, the back plate (211) may form at least a portion of the back surface (200B). According to one embodiment, the back plate (211) may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

[0055] An electronic device (200) according to one embodiment may include a side bezel structure (or side member) (218). According to one embodiment, the side bezel structure (218) may be combined with a front plate (202) and / or a rear plate (211) to form at least a portion of a side surface (200C) of the electronic device (200). For example, the side bezel structure (218) may form the entire side surface (200C) of the electronic device (200), or, for another example, the side bezel structure (218) may form the side surface (200C) of the electronic device (200) together with the front plate (202) and / or the rear plate (211).

[0056] Unlike the illustrated embodiment, when the side surface (200C) of the electronic device (200) is partially formed by the front plate (202) and / or the rear plate (211), the front plate (202) and / or the rear plate (211) may include a region that extends seamlessly from its edge toward the rear plate (211) and / or the front plate (202). The extending region of the front plate (202) and / or the rear plate (211) may be located at both ends of a long edge of the electronic device (200), for example, but is not limited to the above-described example.

[0057] In one embodiment, the side bezel structure (218) may include a metal and / or a polymer. In one embodiment, the back plate (211) and the side bezel structure (218) may be formed integrally and may include the same material (e.g., a metal material such as aluminum), but is not limited thereto. For example, the back plate (211) and the side bezel structure (218) may be formed as separate components and / or may include different materials.

[0058] According to one embodiment, the electronic device (200) may include at least one of a display (201), an audio module (203, 204, 207), a sensor module (not shown), a camera module (205, 212, 213), a key input device (217), a light emitting element (not shown), and / or a connector hole (208). According to one embodiment, the electronic device (200) may omit at least one of the above components (e.g., the key input device (217) or the light emitting element (not shown)) or may additionally include other components.

[0059] In one embodiment, the display (201) may be visually exposed through a substantial portion of the front plate (202). For example, at least a portion of the display (201) may be visible through the front plate (202) forming the front surface (200A). In one embodiment, the display (201) may be disposed on the back surface of the front plate (202).

[0060] According to one embodiment, the outer shape of the display (201) may be formed to be substantially the same as the outer shape of the front plate (202) adjacent to the display (201). According to one embodiment, in order to expand the area where the display (201) is visually exposed, the gap between the outer shape of the display (201) and the outer shape of the front plate (202) may be formed to be substantially the same.

[0061] According to one embodiment, the display (201) (or the front surface (200A) of the electronic device (200)) may include a screen display area (201A). According to one embodiment, the display (201) may provide visual information to a user through the screen display area (201A). In the illustrated embodiment, when the front surface (200A) is viewed from the front, the screen display area (201A) is depicted as being positioned on the inside of the front surface (200A) and spaced apart from the outer edge of the front surface (200A), but is not limited thereto. In another embodiment, when the front surface (200A) is viewed from the front, at least a portion of an edge of the screen display area (201A) may substantially coincide with an edge of the front surface (200A) (or the front plate (202)).

[0062] In one embodiment, the screen display area (201A) may include a sensing area (201B) configured to acquire biometric information of the user. Here, the meaning of "the screen display area (201A) includes the sensing area (201B)" may be understood to mean that at least a portion of the sensing area (201B) may overlap the screen display area (201A). For example, the sensing area (201B) may be an area capable of displaying visual information by the display (201) like other areas of the screen display area (201A) and additionally capable of acquiring biometric information of the user (e.g., a fingerprint). In one embodiment, the sensing area (201B) may also be formed in the key input device (217).

[0063] In one embodiment, the display (201) may include an area where a first camera (205) is positioned. In one embodiment, an opening is formed in the area of ​​the display (201), and the first camera (205) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the front (200A). In this case, the screen display area (201A) may surround at least a portion of an edge of the opening. In one embodiment, the first camera (205) (e.g., an under display camera (UDC)) may be positioned below the display (201) so as to overlap the area of ​​the display (201). In this case, the display (201) may provide visual information to the user through the area, and additionally, the first camera (205) may acquire an image corresponding to a direction facing the front (200A) through the area of ​​the display (201).

[0064] According to one embodiment, the display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0065] According to one embodiment, the audio module (203, 204, 207) may include a microphone hole (203, 204) and a speaker hole (207).

[0066] According to one embodiment, the microphone holes (203, 204) may include a first microphone hole (203) formed in a portion of the side (200C) and a second microphone hole (204) formed in a portion of the rear (200B). A microphone (not shown) for acquiring external sound may be placed inside the microphone holes (203, 204). The microphone may include multiple microphones to detect the direction of the sound.

[0067] According to one embodiment, the second microphone hole (204) formed in a portion of the rear surface (200B) may be positioned adjacent to the camera module (205, 212, 213). For example, the second microphone hole (204) may acquire sound according to the operation of the camera module (205, 212, 213). However, the present invention is not limited thereto.

[0068] According to one embodiment, the speaker hole (207) may include an external speaker hole (207) and a call receiver hole (not shown). The external speaker hole (207) may be formed in a part of the side surface (200C) of the electronic device (200). According to one embodiment, the external speaker hole (207) may be implemented as a single hole with the microphone hole (203). Although not shown, the call receiver hole (not shown) may be formed in another part of the side surface (200C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (207) in the side surface (200C). For example, with reference to the illustration in FIG. 2A, the external speaker hole (207) may be formed in the side surface (200C) corresponding to the lower portion of the electronic device (200), and the call receiver hole may be formed in the side surface (200C) corresponding to the upper portion of the electronic device (200). However, this is not limited thereto, and in one embodiment, the call receiver hole may be formed at a location other than the side (200C). For example, the call receiver hole may be formed by a spaced space between the front plate (202) (or display (201)) and the side bezel structure (218).

[0069] According to one embodiment, the electronic device (200) may include at least one speaker (not shown) configured to output sound to the outside of the housing through an external speaker hole (207) and / or a call receiver hole (not shown).

[0070] According to one embodiment, a sensor module (not shown) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0071] According to one embodiment, the camera module (205, 212, 213) may include a first camera (205) positioned to face the front (200A) of the electronic device (200), a second camera (212) positioned to face the rear (200B), and a flash (213).

[0072] In one embodiment, the second camera (212) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera (212) is not necessarily limited to including multiple cameras and may include a single camera.

[0073] According to one embodiment, the first camera (205) and the second camera (212) may include one or more lenses, image sensors, and / or image signal processors.

[0074] In one embodiment, the flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (200).

[0075] According to one embodiment, the key input device (217) may be positioned on a side (200C) of the electronic device (200). According to one embodiment, the electronic device (200) may not include some or all of the key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as soft keys, on the display (201).

[0076] According to one embodiment, a connector hole (208) may be formed on a side surface (200C) of the electronic device (200) so that a connector of an external device can be accommodated. A connection terminal electrically connected to the connector of the external device may be arranged within the connector hole (208). The electronic device (200) according to one embodiment may include an interface module for processing electrical signals transmitted and received through the connection terminal.

[0077] According to one embodiment, the electronic device (200) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on the front surface (200A) of the housing. The light-emitting element (not shown) may provide status information of the electronic device (200) in the form of light. According to one embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera (205). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0078] FIG. 2b is an exploded perspective view of an electronic device according to one embodiment.

[0079] In the following, redundant descriptions of configurations having the same reference numerals as the configurations described above are omitted.

[0080] Referring to FIG. 2b, an electronic device (200) according to one embodiment may include a frame structure (240), a first printed circuit board (250), a second printed circuit board (252), a cover plate (260), and a battery (270).

[0081] According to one embodiment, the frame structure (240) may include a side bezel structure (218) forming an exterior of the electronic device (200) (e.g., side surface (200C) of FIG. 2A) and a support portion (243) extending inwardly from the side bezel structure (218). According to one embodiment, the frame structure (240) may be disposed between the display (201) and the back plate (211). According to one embodiment, the side bezel structure (218) of the frame structure (240) may surround a space between the back plate (211) and the front plate (202) (and / or the display (201)), and the support portion (243) of the frame structure (240) may extend from the side bezel structure (218) within the space.

[0082] In one embodiment, the frame structure (240) may support or accommodate other components included in the electronic device (200). For example, a display (201) may be disposed on one side of the frame structure (240) facing one direction (e.g., +z direction), and the display (201) may be supported by a support portion (243) of the frame structure (240). For example, a first printed circuit board (250), a second printed circuit board (252), a battery (270), and a second camera (212) may be disposed on the other side of the frame structure (240) facing the opposite direction (e.g., -z direction). The first printed circuit board (250), the second printed circuit board (252), the battery (270), and the second camera (212) may each be mounted in a recess defined by the side bezel structure (218) and / or the support portion (243) of the frame structure (240).

[0083] According to one embodiment, the first printed circuit board (250), the second printed circuit board (252), and the battery (270) may be respectively coupled to the frame structure (240). For example, the first printed circuit board (250) and the second printed circuit board (252) may be fixedly disposed to the frame structure (240) through a coupling member such as a screw. For example, the battery (270) may be fixedly disposed to the frame structure (240) through an adhesive member (e.g., double-sided tape). However, the present invention is not limited to the above-described examples.

[0084] According to one embodiment, the cover plate (260) may be disposed between the first printed circuit board (250) and the back plate (211). According to one embodiment, the cover plate (260) may be disposed on the first printed circuit board (250). For example, the cover plate (260) may be disposed on a surface of the first printed circuit board (250) facing the -z direction.

[0085] According to one embodiment, the cover plate (260) may at least partially overlap the first printed circuit board (250) with respect to the z-axis. According to one embodiment, the cover plate (260) may cover at least a portion of the first printed circuit board (250). Through this, the cover plate (260) may protect the first printed circuit board (250) from physical impact or prevent detachment of a connector coupled to the first printed circuit board (250).

[0086] According to one embodiment, the cover plate (260) may be fixedly positioned on the first printed circuit board (250) via a joining member (e.g., a screw), or may be joined to the frame structure (240) together with the first printed circuit board (250) via the joining member.

[0087] In one embodiment, the display (201) may be disposed between a frame structure (240) and a front plate (202). For example, the front plate (202) may be disposed on one side (e.g., in the +z direction) of the display (201), and the frame structure (240) may be disposed on the other side (e.g., in the -z direction).

[0088] According to one embodiment, the front plate (202) can be coupled with the display (201). For example, the front plate (202) and the display (201) can be adhered to each other through an optical adhesive member (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

[0089] According to one embodiment, the front plate (202) may be coupled with the frame structure (240). For example, the front plate (202) may include an outer portion extending outside the display (201) when viewed in the z-axis direction, and may be adhered to the frame structure (240) through an adhesive member (e.g., double-sided tape) disposed between the outer portion of the front plate (202) and the frame structure (240) (e.g., side bezel structure (218)). However, the present invention is not limited to the above-described example.

[0090] According to one embodiment, the first printed circuit board (250) and / or the second printed circuit board (252) may be equipped with a processor, a memory, and / or an interface. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (200) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. According to one embodiment, the first printed circuit board (250) and the second printed circuit board (252) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0091] In one embodiment, the battery (270) may power at least one component of the electronic device (200). For example, the battery (270) may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery (270) may be disposed substantially coplanar with the first printed circuit board (250) and / or the second printed circuit board (252).

[0092] An electronic device (200) according to one embodiment may include an antenna module (not shown). According to one embodiment, the antenna module may be disposed between the rear plate (211) and the battery (270). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit and receive power with the external device.

[0093] According to one embodiment, a first camera (205) (e.g., a front camera) may be positioned on at least a portion of a frame structure (240) (e.g., a support portion (243)) such that the lens can receive external light through a portion of the front plate (202) (e.g., the camera area (237)) (e.g., the front (200A) of FIG. 1).

[0094] In one embodiment, the second camera (212) (e.g., a rear camera) may be disposed between the frame structure (240) and the rear plate (211). In one embodiment, the second camera (212) may be electrically connected to the first printed circuit board (250) via a connecting member (e.g., a connector). In one embodiment, the second camera (212) may be disposed such that the lens can receive external light through the camera area (284) of the rear plate (211) of the electronic device (200).

[0095] According to one embodiment, the camera area (284) may be formed on a surface of the rear plate (211) (e.g., the rear surface (200B) of FIG. 1). According to one embodiment, the camera area (284) may be formed to be at least partially transparent so that external light may be incident on the lens of the second camera (212). According to one embodiment, at least a portion of the camera area (284) may protrude from the surface of the rear plate (211) by a predetermined height. However, the present invention is not limited thereto, and in another embodiment, the camera area (284) may form a plane substantially coextensive with the surface of the rear plate (211).

[0096] According to one embodiment, the housing of the electronic device (200) (e.g., the housing (210) of FIG. 2A) may refer to a configuration or structure that forms at least a portion of the exterior of the electronic device (200). In this respect, at least a portion of the front plate (202), the frame structure (240), and / or the rear plate (211) that form the exterior of the electronic device (200) may be referred to as the housing (210) of the electronic device (200).

[0097] Figure 3a illustrates a portion of an exemplary electronic device. Figure 3b is an exploded perspective view of a heat spreading member of the exemplary electronic device.

[0098] Referring to FIGS. 3A and 3B, the electronic device (101) may include an electronic component (305) and a heat spreading member (300).

[0099] In one embodiment, the heat spreader (300) may be at least partially disposed on the electronic component (305). It should be understood that when an element is referred to as being "on" another element, this may mean directly on the other element or there may be intervening elements between them. For example, within this document, "B disposed on A" may mean "B disposed over A." For example, within this document, "B disposed on A" may mean "B facing A and spaced apart from A." For example, "the heat spreader (300) disposed on the electronic component (305)" may mean "the heat spreader (300) in contact with the electronic component (305)." For example, “a heat spreading member (300) disposed on an electronic component (305)” may mean “a heat spreading member (300) facing the electronic component (305) and spaced apart from the electronic component (305).”

[0100] For example, the heat diffusion member (300) may overlap at least partially with the electronic component (305) when the heat diffusion member (300) is viewed from above (e.g., when viewed in the +z direction). For example, the heat diffusion member (300) may be disposed over the electronic component (305) in the +z direction. For example, although not shown, the heat diffusion member (300) may be disposed below the electronic component (305) in the +z direction. For example, the heat diffusion member (300) may receive at least a portion of the heat emitted from the electronic component (305) by at least partially facing the electronic component (305).

[0101] For example, the electronic component (305) may be mounted on a printed circuit board (e.g., the first printed circuit board (250), the second printed circuit board (252) of FIG. 2B) of the electronic device (101). One side of the printed circuit board on which the electronic component (305) is disposed may face a heat spreading member (300). For example, the electronic component (305) may be configured to perform a calculation as the electronic device (101) operates, thereby dissipating heat to the surroundings of the electronic component (305). The heat spreading member (300) may be at least partially disposed on the electronic component (305) to disperse the heat dissipated from the electronic component (305). For example, the electronic component (305) may be referred to as, but is not limited to, a processor (e.g., the processor (120) of FIG. 1) of the electronic device (101).

[0102] For example, the electronic device (101) may include a housing (210). An electronic component (305) and a heat diffusion member (300) may be disposed within the housing (210). The housing (210) may include a frame structure (240) for supporting and fastening the heat diffusion member (300) within the housing (210). For example, at least a portion of the frame structure (240) may provide a seating space for accommodating the heat diffusion member (300). For example, at least a portion of the frame structure (240) may be disposed between the electronic component (305) and the heat diffusion member (300). The at least a portion of the frame structure (240) may transfer at least a portion of heat emitted from the electronic component (305) to the heat diffusion member (300). For example, at least a portion of the frame structure (240) (e.g., the support portion (243) of FIG. 2b) may be arranged to support the heat diffusion member (300) so that heat emitted from the electronic component (305) toward the display of the electronic device (101) (e.g., the display (201) of FIG. 2a) is dispersed through the heat diffusion member (300). A structure for dispersing the heat through the heat diffusion member (300) will be described below.

[0103] According to one embodiment, the heat spreading member (300) may include a first region (300a) facing the electronic component (305), a second region (300b) spaced apart from the first region (300a), and a third region (300c) connecting the first region (300a) and the second region (300b). The third region (300c) may include a first flow path (301) for a gaseous fluid, and a second flow path (302) for the liquid fluid.

[0104] For example, the heat diffusion member (300) may include a fluid (not shown) disposed within the heat diffusion member (300) to disperse heat transferred to the heat diffusion member (300). The fluid may be vaporized by heat transferred from the electronic component (305) to the heat diffusion member (300). The fluid may be liquefied as heat is released from the heat diffusion member (300). The fluid may be, for example, water, but is not limited thereto.

[0105] For example, the first region (300a) may be a region that receives heat from the electronic component (305). For example, the first region (300a) may be a region that overlaps the electronic component (305) when viewed from above (e.g., when viewed in the +z direction). The first region (300a) may be a region that is disposed on the electronic component (305). For example, the first region (300a) may be a region that receives at least a portion of the heat emitted from the electronic component (305) through a component (e.g., a frame structure (240)) between the electronic component (305) and the first region (300a). For example, a fluid within the first region (300a) may be vaporized from a liquid state to a gaseous state by the heat transferred from the electronic component (305). The fluid within the first region (300a) can absorb the heat by vaporizing. The first region (300a) may be referred to as an evaporation portion of the heat diffusion member (300) in that it is a region where the fluid vaporizes, but is not limited thereto.

[0106] For example, the second region (300b) may be a region having a lower temperature than the first region (300a). For example, the fluid within the second region (300b) may be liquefied from a gaseous state to a liquid state. By being liquefied, the fluid within the second region (300b) may release heat from the second region (300b). The second region (300b) may be referred to as a condensation portion of the heat diffusion member (300) in that it is a region where the fluid liquefies, but is not limited thereto.

[0107] For example, the third region (300c) may be configured to move a gaseous fluid from the first region (300a) to the third region (300c) through the first flow path (301). The third region (300c) may be configured to move a liquid fluid from the second region (300b) to the first region (300a) through the second flow path (302).

[0108] For example, the third region (300c) may extend from the first region (300a) to the second region (300b). For example, the third region (300c) may be positioned between the first region (300a) and the second region (300b). For example, the third region (300c) may provide a path for fluid to move between the first region (300a) and the second region (300b). For example, the first flow path (301) may be a path for fluid vaporized within the first region (300a) to move to the third region (300b). The fluid in a gaseous state vaporized within the first region (300a) may move to the third region (300b) through the first flow path (301). For example, the second flow path (302) may be a path for the liquefied fluid in the third region (300b) to move to the first region (300a). The liquefied liquid fluid in the third region (300b) may move to the first region (300a) through the second flow path (302). The heat diffusion member (300) may be referred to as a loop heat pipe in that it has a structure in which the fluid in the heat diffusion member (300) moves from the first region (300a) to the second region (300b) or from the second region (300b) to the first region (300a) through a phase change, but is not limited thereto. The heat diffusion member (300) is configured to circulate the fluid within the heat diffusion member (300), thereby dispersing heat transferred from the electronic component (305) to the heat diffusion member (300). The heat diffusion member (300) may require a structure for separating the first flow path (301) for the fluid in a gaseous state and the second flow path (302) for the fluid in a liquid state, for the circulation of the fluid.

[0109] According to one embodiment, the first flow path (301) may be configured such that a fluid substantially vaporized by heat generated from an electronic component (305) diffuses from a first region (300a) of the heat diffusion member (300) through the first flow path (301) to a second region (300b) opposite the first region (300a). The second flow path (302) may be configured such that the fluid substantially liquefied in the second region (300b) diffuses from the second region (300b) through the second flow path (302) to the first region (300a).

[0110] According to one embodiment, the heat spreading member (300) may include a frame (330) including a first plate (310), a second plate (320) coupled with the first plate (310), and a separation structure (335) within the third region (300c) that separates the first flow path (301) and the second flow path (302).

[0111] For example, the frame (330) may form the exterior of the heat diffusion member (300). The frame (330) may include, but is not limited to, a metal having relatively high thermal conductivity. For example, the first plate (310) may be a plate supported by the housing (210) (or the frame structure (240)). For example, the first plate (310) may be a plate that receives heat from the electronic component (305). For example, the second plate (320) may be placed on the first plate (310). The second plate (320) may be fastened to the first plate (310). For example, the second plate (320) may seal the interior space of the heat diffusion member (300) together with the first plate (310). For example, the second plate (320) can form regions (300a, 300b, 300c) of the heat diffusion member (300) together with the first plate (310).

[0112] For example, the separation structure (335) can separate the first flow path (301) from the second flow path (302) within the third region (300c). For example, the separation structure (335) can separate a gaseous fluid moving through the first flow path (301) from a liquid fluid moving through the second flow path (302) within the frame (330). For example, the separation structure (335) can extend in a direction from the first region (300a) toward the second region (300b) (e.g., in the -y direction) and / or in a direction from the second region (300b) toward the first region (300a) (e.g., in the +y direction). For example, the separation structure (335) can be disposed between the first plate (310) and the second plate (320).

[0113] According to one embodiment, the separation structure (335) may protrude at least partially from the first plate (310) or from the second plate (320). For example, when the separation structure (335) protrudes from the first plate (310) toward the second plate (320), the separation structure (335) may support the second plate (320). By supporting the second plate (320), the separation structure (335) may reduce damage to the third region (300c) due to external impact. For example, when the separation structure (335) protrudes from the second plate (320) toward the first plate (310), the separation structure (335) may support the first plate (310). The above separation structure (335) can reduce damage to the third region (300c) due to external impact by supporting the first plate (310). For example, a part of the separation structure (335) (e.g., the first protrusion (610) of FIG. 6c) may protrude from the first plate (310) toward the second plate (320), and the remaining part of the separation structure (335) (e.g., the second protrusion (620) of FIG. 6c) may protrude from the second plate (320) toward the first plate (310). The part of the separation structure (335) and the remaining part of the separation structure (335) may be in contact with each other or may be coupled to each other by an element therebetween (e.g., the adhesive member (650) of FIG. 6c). The formation of the separation structure (335) will be described below with reference to FIG. 6a. The heat diffusion member (300) includes the separation structure (335) to separate the first flow path (301) for the gaseous fluid and the second flow path (302) for the liquid fluid, thereby reinforcing the rigidity of the third region (300c), thereby reducing damage to the third region (300c) due to external impact.

[0114] According to one embodiment, the separation structure (335) can be arranged in an internal space between the first plate (310) and the second plate (320) such that a first flow path (301) and a second flow path (302) are formed along a first side (330a) of the separation structure (335) and a second side (330b) opposite the first side (330a), respectively. For example, the first flow path (301) can be formed at least partially by the first side (330a) of the separation structure (335). A fluid within the first flow path (301) can be brought into contact with the first side (330a) of the separation structure (335). For example, the second flow path (302) can be formed at least partially by the second side (330b) opposite the first side (330a) of the separation structure (335). The fluid within the second euro (302) can come into contact with the second side (330b).

[0115] According to one embodiment, the heat spreading member (300) may include a wick structure (340) for moving a fluid within the frame (330). The wick structure (340) may include a first wick portion (350) attached to a first plate (310) of the frame (330), and a second wick portion (360) within the second flow path (302) at least partially interposed between the first wick portion (350) and the second plate (320) of the frame (330).

[0116] For example, the wick structure (340) may include a porous structure for absorbing a liquid fluid within the heat diffusion member (300). For example, the wick structure (340) may be disposed between the first plate (310) and the second plate (320). For example, the first wick portion (350) may be in contact with the first plate (310). The first wick portion (350) may receive at least a portion of the heat emitted from the electronic component (305) through the first plate (310). For example, within the first region (300a), the liquid fluid contained within the first wick portion (350) may be vaporized by the heat transferred from the electronic component (305) to the first region (300a). The fluid in a vaporized gaseous state can be moved to the second region (300b) through the first flow path (301) of the third region (300c). For example, the fluid in a gaseous state within the second region (300b) can be liquefied by releasing heat from the second region (300b). At least a portion of the liquefied liquid fluid can be absorbed within the first wick portion (350).

[0117] For example, the second wick portion (360) can be at least partially disposed within the second flow path (302) for a liquid fluid. A portion of the first wick portion (350) and at least a portion of the second wick portion (360) can be disposed within the second flow path (302). For example, the second wick portion (360) can be at least partially disposed within the second flow path (302) between the first wick portion (350) and the second plate (320). The second wick portion (360) can be attached to the second plate (320). For example, the second wick portion (360) can be attached onto the first wick portion (350). The second wick portion (360), together with the first wick portion (350), can move the liquid fluid within the second flow path (302). The wick structure (340) can provide a path for moving a liquid fluid from the second region (300b) to the first region (300a) by including a second wick section (360) disposed within the second urea (302).

[0118] According to one embodiment, the first wick portion (350) may include a first portion (351) disposed within a first region (300a), a second portion (352) disposed within a second region (300b), and a third portion (353) disposed within a third region (300c) connecting the first portion (351) and the second portion (352). The third portion (353) may include a first support region (353a) disposed within a first flow path (301) for supporting a second plate (320), and a second support region (353b) disposed within a second flow path (302).

[0119] For example, the first portion (351) may be attached to the first plate (310) within the first region (300a). The first portion (351) may be disposed over the electronic component (305). For example, the first portion (351) may receive heat from the electronic component (305) through the first plate (310). A liquid fluid contained within the first portion (351) may be vaporized within the first region (300a) through the heat. For example, the second portion (352) may be spaced apart from the first portion (351). The second portion (352) may absorb the liquefied fluid by releasing heat within the second region (300b).

[0120] For example, the third portion (353) may extend from the first portion (351) to the second portion (352). For example, the third portion (353) may move a liquid fluid from the second portion (300b) to the first portion (300a). For example, the first support portion (353a) may be attached to the first plate (310) within the first flow path (301). The first support portion (353a) may move a liquid fluid contained in the first support portion (353a) toward the first portion (300a). For example, the second support portion (353b) may be separated from the first support portion (353a) by being attached to the first plate (310) within the second flow path (302). The second support area (353b) can move the liquid fluid contained in the second support area (353b) toward the first area (300a). For example, the second support area (353b) can be in contact with the second wick portion (360). The second support area (353b) can be a portion attached to the second wick portion (360) among the third portions (353) in the third area (300c). The first wick portion (350) includes the first support area (353a) disposed within the first flow path (301) and the second support area (353b) disposed within the second flow path (302), thereby improving the performance of the heat diffusion member (300) for dissipating heat.

[0121] According to one embodiment, the first wick portion (350) may include a slit (350a) for passing the separation structure (335). For example, the slit (350a) may be penetrated by the separation structure (335) within the third region (300c). For example, the slit (350a) may be coupled with the separation structure (335) to fasten the first wick portion (350) to the frame (330). For example, the slit (350a) may have a shape corresponding to the shape of the separation structure (335). For example, the slit (350a) may be disposed between the first support region (353a) and the second support region (353b) of the third portion (353). The above slit (350a) can separate the first support area (353a) and the second support area (353b). The first wick portion (350) can provide space for a separation structure (335) by including the slit (350a) and can be fixed to the frame (330).

[0122] In one embodiment, the frame (330) may include a plurality of pillars (370) protruding from the second plate (320) toward the first plate (310). For example, the plurality of pillars (370) may extend from the second plate (320) toward the first plate (310) within the frame (330). For example, the plurality of pillars (370) may be attached to the first wick portion (350) by extending from the second plate (320) toward the first wick portion (350). For example, the air pressure within the heat diffusion member (300) may be lower than the air pressure outside the heat diffusion member (300). Since the air pressure inside the heat diffusion member (300) is lower than the air pressure outside the heat diffusion member (300), the frame (330) of the heat diffusion member (300) may be at least partially dented by an external impact. The second plate (320) may reduce damage to the frame (330) by including a plurality of pillars (370) supported by the first wick portion (350) and / or the first plate (310).

[0123] According to the above-described embodiment, the heat diffusion member (300) of the electronic device (101) is configured to disperse heat emitted from the electronic component (305), thereby reducing damage to other electronic components within the electronic device (101) caused by the heat emitted from the electronic component (305). The heat diffusion member (300) includes a separation structure (335) that separates a first flow path (301) for moving a gaseous fluid and a second flow path (302) for moving the liquid fluid, thereby improving the performance of the heat diffusion member (300) for dissipating the heat and reducing damage to the frame (330) of the heat diffusion member (300) caused by an external impact. The heat diffusion member (300) can move the liquid fluid from the second region (300b) to the first region (300a) through a wick structure (340) disposed within the frame (330). The wick structure (340) can improve the performance of the heat diffusion member (300) by including a second wick portion (360) disposed at least partially within the second flow path (302).

[0124] FIGS. 4A and 4B are cross-sectional views of a heat spreading member of an exemplary electronic device taken along line A-A' of FIG. 3A.

[0125] Referring to FIGS. 4A and 4B , an electronic device (101) may include an electronic component (e.g., the electronic component (305) of FIG. 3A ), and a heat spreading member (300) at least partially disposed on the electronic component (305). The heat spreading member (300) may include a first region facing the electronic component (305) (e.g., the first region (300a) of FIG. 3A ), a second region spaced apart from the first region (300a) (e.g., the second region (300b) of FIG. 3A ), and a third region (300c) connecting the first region (300a) and the second region (300b), the third region including a first flow path (301) for a gaseous fluid, and a second flow path (302) for a liquid fluid. The heat diffusion member (300) may include a frame (330) including a first plate (310), a second plate (320) coupled with the first plate (310), and a separation structure (335) within the third region (300c) separating the first flow path (301) and the second flow path (302), and a wick structure (340) for moving the fluid within the frame (330). The wick structure (340) may include a first wick portion (350) attached to the first plate (310), and a second wick portion (360) within the second flow path (302) at least partially interposed between the first wick portion (350) and the second plate (320). According to one embodiment, the frame (330) may include a plurality of posts (370) protruding from the second plate (320) toward the first plate (310).

[0126] According to one embodiment, the first wick portion (350) may include a first portion (e.g., the first portion (351) of FIG. 3b) disposed within a first region (300a), a second portion (e.g., the second portion (352) of FIG. 3b) disposed within a second region (300b), and a third portion (353) within a third region (300c) connecting the first portion (351) and the second portion (352). The third portion (353) may include a first support region (353a) disposed within the first flow path (301) for supporting the second plate (320), and a second support region (353b) disposed within the second flow path (302).

[0127] Hereinafter, redundant descriptions of the configurations having the same reference numerals as those described above in FIGS. 3a and 3b are omitted.

[0128] In one embodiment, the second wick portion (360) may fill the second passage (302) together with the first wick portion (350). For example, the second wick portion (360) may occupy a space between the first wick portion (350) and the second plate (320) within the second passage (302). For example, the second passage (302) may be filled by the second support area (353b) of the first wick portion (350) and the second wick portion (360) attached to the second support area (353b). For example, the second wick portion (360) may be surrounded by the third support area (353b) of the first wick portion (350) and the second plate (320) within the second passage (302). For example, the second wick portion (350) can be attached to the separation structure (335). For example, the second wick portion (360) can be covered by the second plate (320) within the second flow path (302). The wick structure (340) can move a liquid fluid within the heat spreading member (300) from the second region (300b) to the first region (300a) through the second flow path (302) by including the second wick portion (360) that fills the second flow path (302) together with the first wick portion (350).

[0129] According to one embodiment, the first plate (310) may include a first side wall (311) disposed along an edge of the first plate (310). The second plate (320) may include a second side wall (321) disposed along an edge of the second plate (320) and facing the first side wall (311). The second side wall (321) may be joined to the first side wall (311). For example, the second side wall (321) may be attached onto the second side wall (311). The second side wall (321) may be welded to the first side wall (311), for example. For example, the second side wall (321) may seal a space between the first plate (310) and the second plate (320) together with the first side wall (311). The second side wall (321) can reduce the leakage of fluid within the heat diffusion member (300) by sealing the interior of the heat diffusion member (300) together with the first side wall (311). The second side wall (321) can couple the second plate (320) to the first plate (310) by being coupled with the first side wall (311).

[0130] In one embodiment, the frame (330) may include first posts (410) that protrude from the second plate (320) toward the first plate (310) within the first flow path (301) and thereby contact the first support area (353a). For example, the first posts (410) may extend from the second plate (320) to the first support area (353a). For example, the first posts (410) may be attached to the first support area (353a). The first support area (353a) may be at least partially disposed between the first posts (410) and the second plate (320). For example, the first posts (410) may be in contact with a gaseous fluid within the first flow path (301). The first pillars (410) can support the second plate (320) on which the first pillars (410) are formed. The first pillars (410) can be supported by the first plate (310). The second plate (320) can reduce damage to the first flow path (301) due to external impact by including the first pillars (410) supported by the first wick portion (350) and / or the first plate (310).

[0131] Referring to FIG. 4b, the frame (330) may include second columns (420) that protrude from the second plate (320) to the first plate (310) within the second flow path (302) and thereby come into contact with the second support area (353b). The second wick portion (360) may include a plurality of through holes (430) for allowing the second columns (420) to pass within the second flow path (302). For example, the plurality of columns (370) may include first columns (410) disposed within the first flow path (301) and second columns (420) disposed within the second flow path (302). The first pillars (410) and the second pillars (420) may be attached to the first wick portion (350) by protruding from the second plate (320) toward the first plate (310). For example, the second pillars (420) may extend from the second plate (320) to the second support area (353b). For example, the second pillars (420) may be attached on the second support area (353b). The second support area (353b) may support the second plate (320) through the second pillars (420). For example, the second pillars (420) may be in contact with a liquid fluid within the second flow path (302). The frame (330) can reduce damage to the second filament (302) due to external impact by including the second pillars (420) supported by the second support area (353b) of the first wick portion (350) and / or the first plate (310).

[0132] For example, the plurality of through holes (430) of the second wick portion (360) may be penetrated by the second pillars (420) within the second flow path (302). The plurality of through holes (430) may each have a shape corresponding to the shape of the plurality of pillars (420). For example, the plurality of through holes (430) may be coupled to the second pillars (420). The plurality of through holes (430) may be coupled to the second pillars (420) to secure the second wick portion (360) to the second plate (320). The second wick portion (360), by including the plurality of through holes (430), may provide a space for the second pillars (420) within the second flow path (302) and may couple the second wick portion (360) to the second plate (320).

[0133] Although the second wick portion (360) has been described as including a plurality of through holes (430), it is not limited thereto. Instead of the plurality of through holes (430), the second wick portion (360) may include a plurality of recesses for respectively accommodating the second columns (420), or may include a plurality of through holes (430) and a plurality of recesses for respectively passing through and / or accommodating the second columns (420) of various shapes. By including the plurality of recesses, the second wick portion (360) can provide space for the second columns (420) and reduce damage to the second flow path (302) due to external impact.

[0134] According to the above-described embodiment, the heat diffusion member (300) of the electronic device (101) can improve the performance of the heat diffusion member (300) by including a second wick portion (360) that fills the second flow path (302) together with the first wick portion (350). The heat diffusion member (300) can reduce damage to the first flow path (301) due to external impact by including first posts (410) that protrude from the second plate (320) toward the first plate (310) within the first flow path (301). The heat diffusion member (300) can reduce damage to the second flow path (302) due to external impact by including second posts (420) that protrude from the second plate (320) toward the first plate (310) within the second flow path (302).

[0135] Fig. 4c is a cross-sectional view of a heat spreading member of an exemplary electronic device taken along line A-A' of Fig. 3a. Fig. 4d is a top plan view of a first wick portion of the heat spreading member of Fig. 4c.

[0136] Referring to FIGS. 4c and 4d, the frame (330) may include first posts (410) that protrude from the second plate (320) toward the first plate (310) within the first urea (301) and thereby contact the first support area (353a) of the first wick portion (350). The first support area (353a) may include a plurality of holes (440).

[0137] For example, the plurality of holes (440) may extend in a direction (e.g., -y direction) from the first portion (351) toward the second portion (352) and / or in a direction (e.g., +y direction) from the second portion (352) toward the first portion (351). For example, the plurality of holes (440) may extend along a slit (350a) of the first wick portion (350) for passing the separation structure (335). For example, the second support plate (320) may face the first support plate (310) through the plurality of holes (440) within the first flow path (301). For example, the plurality of holes (440) may be formed in the remaining portion of the first support area (353a) that is not attached to the first pillars (410).

[0138] Although the first support area (353a) of the first wick portion (350) has been described as including a plurality of holes (440), it is not limited thereto. Instead of the plurality of holes (440), the first wick portion (350) may include a plurality of recesses for providing additional space to the first flow path (301), or may include a structure in which a plurality of holes (440) and a plurality of recesses are formed. The first wick portion (350) may provide additional space to the first flow path (301) for a gaseous fluid by including the plurality of holes (440) and / or the plurality of recesses.

[0139] According to the above-described embodiment, the wick structure (340) within the heat diffusion member (300) can provide additional space for a gaseous fluid within the first flow path (301) by including a first wick portion (350) in which a plurality of holes (440) are formed within the first flow path (301). The remaining portion of the first wick portion (350), excluding a portion in which the plurality of holes (440) are formed, is attached to the first pillars (410) within the first flow path (301), thereby reducing damage to the frame (330) due to external impact.

[0140] FIG. 4e is a cross-sectional view of a heat spreading member of an exemplary electronic device taken along line A-A' of FIG. 3a. FIG. 4f is a plan view of a first wick portion of the heat spreading member of FIG. 4d.

[0141] Referring to FIGS. 4e and 4f, the frame (330) may include first posts (410) protruding from the second plate (320) toward the first plate (310) within the first euro (301). The first posts (410) may be in contact with the first plate (310).

[0142] For example, unlike FIGS. 4A to 4D, the first support area (353a) of the first wick portion (350) may be omitted. For example, the third portion (353) of the first wick portion (350) may be disposed within the second passage (302), among the first passage (301) and the second passage (302). For example, the first pillars (410) may extend from the second plate (320) to the first plate (310). The first pillars (410) may be attached to the first plate (310). For example, the first pillars (410) may support the second plate (320) via the first plate (310).

[0143] For example, the liquid-state fluid within the heat diffusion member (300) can move through the third part (353) within the second flow path (302) and the second wick part (360) among the first flow path (301) and the second flow path (302). The liquid-state fluid within the first wick part (350) can move from the second part (352) to the first part (351) through the third part (353) within the second flow path (302). The gas-state fluid within the heat diffusion member (300) can move through the first flow path (301) among the first flow path (301) and the second flow path (302).

[0144] The structures of the first flow path (301) and the second flow path (302) described and illustrated in FIGS. 4A to 4F are exemplary and are not limited thereto. The first flow path (301) and the second flow path (302) of the electronic device (101) may include various structures and combinations of structures, depending on the frame (330) and the wick structure (340) forming the first flow path (301) and the second flow path (302). For example, in one embodiment, the first flow path (301) may include a structure in which a plurality of holes (440) are formed in a first wick portion (350), as shown in FIG. 4C, and the second flow path (302) may include a structure in which a plurality of through-holes (430) for second pillars (420) are formed in a second wick portion (360), as shown in FIG. 4B. For example, in one embodiment, the first flow path (301) may include a structure in which the first wick portion (350) is not arranged and the first columns (410) extend to the first plate (310), as shown in FIG. 4e, and the second flow path (302) may include a structure in which a plurality of through holes (430) for the second columns (420) are formed in the second wick portion (460), as shown in FIG. 4b. However, the present invention is not limited thereto, and the shapes of the first flow path (301) and the second flow path (302) may include a combination of the structures exemplified in FIGS. 4a to 4f.

[0145] According to the above-described embodiment, the first wick portion (350) within the heat diffusion member (300) is arranged within the second path (302) among the first path (301) and the second path (302) within the third region (300c), thereby improving the performance of the heat diffusion member (300). The heat diffusion member (300) includes first pillars (410) that extend from the second plate (320) to the first plate (310) and are attached to the first plate (310), thereby reducing damage to the frame (330) due to external impact.

[0146] Figure 5a is an exploded perspective view of a heat spreading member of an exemplary electronic device.

[0147] Referring to FIG. 5A, an electronic device (e.g., an electronic device (101) of FIG. 1) may include an electronic component (e.g., an electronic component (305) of FIG. 3A), and a heat spreading member (300) at least partially disposed on the electronic component (305). The heat spreading member (300) may include a first region facing the electronic component (305) (e.g., a first region (300a) of FIG. 3A), a second region spaced apart from the first region (300a) (e.g., a second region (300b) of FIG. 3A), and a third region (e.g., a third region (300a) of FIG. 3A) connecting the first region (300a) and the second region (300b), and including a first flow path for a gaseous fluid (e.g., a first flow path (301) of FIG. 3A), and a second flow path for a liquid fluid (e.g., a second flow path (302) of FIG. 3A). The heat spreading member (300) may include a frame (330) including a first plate (310), a second plate (320) coupled with the first plate (310), and a separation structure (335) within the third region (300c) that separates the first flow path (301) and the second flow path (302), and a wick structure (340) for moving the fluid within the frame (330). The wick structure (340) may include a first wick portion (350) attached to the first plate (310), and a second wick portion (360) within the second flow path (302) that is at least partially interposed between the first wick portion (350) and the second plate (320).

[0148] In one embodiment, the separation structure (335) may have a curvature by being at least partially bent. For example, at least some of the regions (300a, 300b, 300c) of the heat diffusion member (300) may be bent. The separation structure (335) within the heat diffusion member (300) may be bent along at least some of the bent heat diffusion member (300).

[0149] For example, the separation structure (335) may include at least one first bending portion (510) having a curvature. The first flow path (301) and / or the second flow path (302) within the third region (300c) of the heat spreading member (300) may have a bent shape due to the at least one first bending portion (510). For example, the second wick portion (360) at least partially disposed within the second flow path (302) may include at least one second bending portion (520) that is bent to correspond to the at least one first bending portion (510) of the separation structure (335). The third portion (353) (or the second support area (353b)) of the first wick portion (350) attached to the second wick portion (360) may be at least partially bent to correspond to the at least one first bending portion (510) and / or the at least one second bending portion (520). However, the present invention is not limited thereto. The heat diffusion member (300) may be required to have a frame (330) having an at least partially bent shape due to structures within the housing (e.g., the housing (210) of FIG. 2A) of the electronic device (101). The separation structure (335) and / or the wick structure (340) within the frame (330) may be configured to be at least partially bent along the at least partially bent frame (330), thereby allowing the heat diffusion member (300) to be placed within the electronic device (101).

[0150] According to the above-described embodiment, the heat spreading member (300) of the electronic device (101) may be configured to be placed within the electronic device (101) by including a separation structure (335) having at least one first bending portion (510) along an at least partially curved frame (330) and / or a second wick portion (360) having at least one second bending portion (520).

[0151] Fig. 5b is a cross-sectional view of a heat diffusion member of an exemplary electronic device taken along line A-A' of Fig. 3a. Fig. 5c is a plan view of a wick structure of the heat diffusion member of Fig. 5b. Fig. 5d is a cross-sectional view of a heat diffusion member of an exemplary electronic device taken along line A-A' of Fig. 3a. Fig. 5e is a plan view of a wick structure of the heat diffusion member of Fig. 5d.

[0152] Referring to FIGS. 5b, 5c, 5d, and 5e, an electronic device (101) may include an electronic component (e.g., the electronic component (305) of FIG. 3a), and a heat spreading member (300) at least partially disposed on the electronic component (305). The heat spreading member (300) may include a first region facing the electronic component (305) (e.g., the first region (300a) of FIG. 3a), a second region spaced apart from the first region (300a) (e.g., the second region (300b) of FIG. 3a), and a third region (300c) connecting the first region (300a) and the second region (300b), the third region including a first flow path (301) for a gaseous fluid, and a second flow path (302) for a liquid fluid. The heat diffusion member (300) may include a frame (330) including a first plate (310), a second plate (320) coupled with the first plate (310), and a separation structure (335) within the third region (300c) separating the first flow path (301) and the second flow path (302), and a wick structure (340) for moving the fluid within the frame (330). The wick structure (340) may include a first wick portion (350) attached to the first plate (310), and a second wick portion (360) within the second flow path (302) at least partially interposed between the first wick portion (350) and the second plate (320). According to one embodiment, the frame (330) may include a plurality of posts (370) protruding from the second plate (320) toward the first plate (310).

[0153] According to one embodiment, unlike FIGS. 3A to 5A, the wick structure (340) may be a structure in which a first wick portion (e.g., the first wick portion (350) of FIG. 3B) and a second wick portion (e.g., the second wick portion (360) of FIG. 3B) are integrally formed. For example, among the wick structures (340), the first wick structure (340) may be a portion having a relatively small thickness for the first columns (410) arranged within the first flow path (301). For example, among the wick structures (340), the second wick portion (350) may be a portion having a relatively thick thickness for filling the second flow path (302).

[0154] According to one embodiment, the wick structure (340) may include a step portion (340a) formed along the separation structure (335). For example, the step portion (340a) may be formed by a difference in thickness between the first wick portion (350) and the second wick portion (360). For example, the height of the step portion (340a) may correspond to the height of each of the first columns (410) arranged in the first flow path (301). The wick structure (340) may be configured to simplify the manufacturing process of the wick structure (340) and to move a fluid within the heat diffusion member (300) by including an integrally formed structure including the step portion (340a).

[0155] Referring to FIGS. 5b and 5c, the wick structure (340) may include a slit (350a) for passing the separation structure (335). The step portion (340a) of the wick structure (340) may be formed along the slit (350a).

[0156] Referring to FIGS. 5d and 5e, the wick structure (340) may omit the slit (350a), unlike FIGS. 5a to 5c. The wick structure (340) may include a separating portion (340b) that functions as a separating structure (335). For example, the separating portion (340b) may be welded to the first plate (310) and the second plate (320). For example, the separating portion (340b) may be a portion of the wick structure (340) where the base material of the unprocessed wick structure (340) is disposed. For example, when the wick structure (340) is a mesh wick, the separating portion (340b) may be a portion where the mesh structure is not formed. The wick structure (340) can separate the first flow path (301) and the second flow path (302) by including a separation portion (340b) that functions as a separation structure (335).

[0157] According to the above-described embodiment, the wick structure (340) of the heat diffusion member (300) can be configured to simplify the manufacturing process of the wick structure (340) and move the fluid within the heat diffusion member (300) by including a structure that includes a step portion (340a) and is formed integrally. The wick structure (340) can separate the first flow path (301) and the second flow path (302) by including a separation portion (340b).

[0158] Figures 6a, 6b, 6c, and 6d illustrate a portion of a heat spreading member of an exemplary electronic device.

[0159] Referring to FIGS. 6A, 6B, 6C, and 6D, an electronic device (101) may include an electronic component (e.g., an electronic component (305) of FIG. 3A), and a heat spreading member (300) at least partially disposed on the electronic component (305). The heat spreading member (300) may include a first region facing the electronic component (305) (e.g., a first region (300a) of FIG. 3A), a second region spaced apart from the first region (300a) (e.g., a second region (300b) of FIG. 3A), and a third region (300c) connecting the first region (300a) and the second region (300b), the third region including a first flow path (301) for a gaseous fluid, and a second flow path (302) for a liquid fluid. The heat diffusion member (300) may include a frame (330) including a first plate (310), a second plate (320) coupled with the first plate (310), and a separation structure (335) within the third region (300c) separating the first flow path (301) and the second flow path (302), and a wick structure (340) for moving the fluid within the frame (330). The wick structure (340) may include a first wick portion (350) attached to the first plate (310), and a second wick portion (360) within the second flow path (302) at least partially interposed between the first wick portion (350) and the second plate (320).

[0160] Referring to FIG. 6a, the separation structure (335) can be brought into contact with the second plate (320) by extending from the first plate (310) toward the second plate (320) within the third region (300c). For example, the separation structure (335) can be formed on the first plate (310). The separation structure (335) can separate the first flow path (301) from the second flow path (302) by protruding from the first plate (310) toward the second plate (320). For example, the separation structure (335) can reduce the second plate (320) from being dented toward the first plate (310) due to an external impact by supporting the second plate (320).

[0161] Referring to FIG. 6b, the separation structure (335) can be brought into contact with the first plate (310) by extending from the second plate (320) toward the first plate (310) within the third region (300c). For example, the separation structure (335) can be formed on the second plate (320). The separation structure (335) can separate the first flow path (301) from the second flow path (302) by protruding from the second plate (320) toward the first plate (310). For example, the separation structure (335) can reduce the first plate (310) from being dented toward the second plate (320) due to an external impact by supporting the first plate (310).

[0162] Referring to FIG. 6c, the separation structure (335) may include a first protrusion (610) extending from the first plate (310) toward the second plate (320) within the third region (300c), a second protrusion (620) extending from the second plate (320) toward the first plate (310) within the third region (300c) to face the first protrusion (610), and an adhesive member (650) connecting the first protrusion (610) and the second protrusion (620). For example, the first protrusion (610) may be positioned at a position corresponding to the second protrusion (620) among the first plate (310). For example, the first protrusion (610) may overlap the second protrusion (620) when viewed from above (e.g., when viewed in the +z direction). For example, the first protrusion (610) can be combined with the second protrusion (620).

[0163] For example, the adhesive member (650) may be interposed between the first protrusion (610) and the second protrusion (620). The adhesive member (650) may attach the first protrusion (610) to the second protrusion (620). For example, the adhesive member (650) may fill a gap between the first protrusion (610) and the second protrusion (620). The adhesive member (650) may be disposed in the gap to separate the first flow path (301) and the second flow path (302). For example, the adhesive member (650) may include, but is not limited to, solder for joining the first protrusion (610) and the second protrusion (620).

[0164] Although the adhesive member (650) is described as being disposed between the first protrusion (610) and the second protrusion (620) of the separation structure (335), it is not limited thereto. For example, referring also to FIG. 6A, the adhesive member (650) may be disposed between the separation structure (335) extending from the first plate (310) toward the second plate (320) and the second plate (320), thereby attaching the separation structure (335) to the second plate (320). For example, referring also to FIG. 6B, the adhesive member (650) may be disposed between the separation structure (335) extending from the second plate (320) toward the first plate (310) and the first plate (310), thereby attaching the separation structure (335) to the first plate (310).

[0165] Referring to FIG. 6d, the separation structure (335) may include a first support portion (335a) protruding from the second plate (320) toward the first wick portion (350), and a second support portion (335b) connected to the first support portion (335a) and at least partially filling the first wick portion (350). For example, unlike as illustrated in FIGS. 6a to 6c, the slit (350a) for passing the separation structure (335) of the first wick portion (350) may be omitted. At least a portion of the first wick portion (350) may be filled with a material forming the separation structure (335). For example, the first support portion (335a) may be a portion that comes into contact with a gaseous fluid moving through the first flow path (301). For example, the first support portion (335a) may be a portion that comes into contact with the second wick portion (360) disposed within the second flow path (302). For example, the second support portion (335b) may be a portion disposed within the first wick portion (350) through the porous structure of the first wick portion (350). For example, the second support portion (335b) may be a portion disposed between the first plate (310) and the first support portion (335a) within the first wick portion (350). For example, the second support portion (335b) may extend from the first support portion (335a) to the first plate (310) through the first wick portion (350), thereby separating the first flow path (301) and the second flow path (302). For example, by attaching the first support portion (335a) to the first plate (310), the separation structure (335) can be fixed to the second plate (320).

[0166] Referring again to FIGS. 6a, 6b, 6c, and 6d, the frame (330) may include at least one recess (630) formed within the separation structure (335).

[0167] For example, when the separation structure (335) of the frame (330) is formed through an etching process, the separation structure (335) may not include at least one recess (630). For example, when the separation structure (335) of the frame (330) is formed through machining, the separation structure (335) may include at least one recess (630) by being formed through press processing of at least a portion of the first plate (310) and / or at least a portion of the second plate (320).

[0168] For example, referring to FIG. 6A, the separation structure (335) may protrude from the first plate (310) toward the second plate (320). The first plate (310) may include a first recess (631) disposed at a position corresponding to the separation structure (335) and recessed toward the second plate (320). For example, referring to FIG. 6B, the separation structure (335) may protrude from the second plate (320) toward the first plate (310). The second plate (320) may include a second recess (632) disposed at a position corresponding to the separation structure (335) and recessed toward the first plate (310).

[0169] For example, referring to FIG. 6C, the separation structure (335) may include a first protrusion (610) protruding from the first plate (310) toward the second plate (320), and a second protrusion (620) protruding from the second plate (320) toward the first plate (310) and facing the first protrusion (610). At least one recess (630) may include a first recess (631) formed in the first protrusion (610) and recessed toward the second plate (320), and a second recess (632) formed in the second protrusion (620) and recessed toward the first plate (310).

[0170] According to one embodiment, the wick structure (340) may include at least one of a mesh wick and a sintering wick. For example, the first wick portion (350) and the second wick portion (360) may be mesh wicks. For example, the first wick portion (350) and the second wick portion (360) may be sintering wicks. For example, one of the first wick portion (350) and the second wick portion (360) may be a mesh wick and the other may be a sintering wick. However, the present invention is not limited thereto. The wick structure (340) may improve the performance of the heat diffusion member (300) by including at least one of a mesh wick and a sintering wick.

[0171] According to the above-described embodiment, the heat diffusion member (300) of the electronic device (101) includes a separation structure (335) within the heat diffusion member (300) that separates the first flow path (301) and the second flow path (302), thereby improving the performance of the heat diffusion member (300) and reducing damage to the third region (300c) in which the separation structure (335) is arranged due to external impact.

[0172] Figures 7a, 7b, and 7c illustrate a portion of a heat spreading member of an exemplary electronic device.

[0173] Referring to FIGS. 7A, 7B, and 7C, an electronic device (101) may include an electronic component (e.g., an electronic component (305) of FIG. 3A), and a heat spreading member (300) at least partially disposed on the electronic component (305). The heat spreading member (300) may include a first region facing the electronic component (305) (e.g., a first region (300a) of FIG. 3A), a second region spaced apart from the first region (300a) (e.g., a second region (300b) of FIG. 3A), and a third region (300c) connecting the first region (300a) and the second region (300b), the third region including a first flow path (301) for a gaseous fluid, and a second flow path (302) for a liquid fluid. The heat diffusion member (300) may include a frame (330) including a first plate (310), a second plate (320) coupled with the first plate (310), and a separation structure (335) within the third region (300c) separating the first flow path (301) and the second flow path (302), and a wick structure (340) for moving the fluid within the frame (330). The wick structure (340) may include a first wick portion (350) attached to the first plate (310), and a second wick portion (360) within the second flow path (302) at least partially interposed between the first wick portion (350) and the second plate (320).

[0174] According to one embodiment, the frame (330) may include another separation structure (710) spaced apart from the separation structure (335). By the separation structure (335) and the other separation structure (710), the first flow path (301) and / or the second flow path (302) may be separated into a plurality of flow paths. The first wick portion (350) may include a slit (350a) for passing through the separation structure (335) and another slit (720) for passing through the other separation structure (710).

[0175] For example, referring to FIG. 7a, the first flow path (301) may include a first set of flow paths (301a, 301b) separated from each other by another separation structure (710) distinct from the separation structure (335). For example, referring to FIG. 7b, the second flow path (302) for moving a liquid-state fluid may be arranged between the first set of flow paths (301a, 301b) for moving the gas-state fluid by the separation structure (335) and the other separation structure (710).

[0176] For example, referring to FIG. 7c, the second flow path (302b) may include a second set of flow paths (302a, 302b) separated from each other by a separation structure (335) and another separation structure (710). The first flow path (301) for moving a gaseous fluid may be arranged between the second set of flow paths (302a, 302b) for moving a liquid fluid by the separation structure (335) and the other separation structure (710). However, the present invention is not limited thereto.

[0177] The frame (330) may include a plurality of separation structures including a separation structure (335) that separates the first flow path (301) and the second flow path (302). By including the plurality of separation structures, the frame (330) can reduce damage to the third region (300c) of the heat diffusion member (300) in which the plurality of separation structures are arranged due to external impact.

[0178] FIGS. 8A, 8B, 8C, 8D, and 8E illustrate portions of exemplary electronic devices.

[0179] Referring to FIGS. 8A, 8B, 8C, 8D, and 8E, the electronic device (101) may include an electronic component (305) and a heat spreading member (300) at least partially disposed on the electronic component (305). The heat spreading member (300) may include a first flow path (301) for a gaseous fluid, and a second flow path (302) for the liquid fluid. The heat spreading member (300) may include a frame (330) including a first plate (e.g., the first plate (310) of FIG. 3b), a second plate (e.g., the second plate (320) of FIG. 3b) coupled to the first plate (310), and a separation structure (335) separating the first flow path (301) and the second flow path (302), and a wick structure (340) for moving the fluid within the frame (330). The wick structure (340) may include a first wick portion (e.g., the first wick portion (350) of FIG. 3b) attached to the first plate (310), and a second wick portion (360) within the second flow path (302) at least partially interposed between the first wick portion (350) and the second plate (320).

[0180] According to one embodiment, the heat spreading member (300) can at least partially overlap the electronic component (305) when the display (e.g., the display (201) of FIG. 2A) is viewed from above (e.g., in the +z direction). For example, a portion of the heat spreading member (300) can overlap the electronic component (305) when the display (201) is viewed from above, and a remaining portion of the heat spreading member (300) can overlap the battery (270) within the electronic device (101). The wick structure (340) within the heat spreading member (300) can be configured to allow fluid vaporized by heat generated from the electronic component (305) to diffuse into the first flow path (301). The above wick structure (340) may be configured to move the liquefied fluid within the first flow path (301) to an area adjacent to the electronic component (305) (e.g., the first area (300a) of FIG. 3A) through the second flow path (302). The wick structure (340) (or the second wick portion (360) of the wick structure (340)) may fill the second flow path (302).

[0181] Referring to FIGS. 8A and 8B, the separation structure (335) can separate the first flow path (301) and the second flow path (302). The gaseous fluid evaporated by the electronic component (305) within the first flow path (301) can diffuse into the first flow path (301). Within the first flow path (301), the fluid adjacent to the first edge part (360a) (periphery part) of the second wick portion (360) spaced apart from the electronic component (305) when viewing the display (201) from above (e.g., when viewing in the +z direction) can be liquefied. The liquefied liquid-state fluid can be moved to a second edge part (360b) opposite to the first edge part (360a) of the second wick portion (360) and adjacent to the electronic component (305) when viewing the display (201) from above, through a wick structure (340) filling the second flow path (302). The liquid-state fluid moved to the second edge part (360b) can be diffused into the first flow path (301) by being vaporized by the electronic component (305).

[0182] Referring to FIGS. 8C, 8D, and 8E, the heat diffusion member (300) may include separation structures (335, 710) that separate the first flow path (301) and the second flow path (302). The wick structure (340) may be configured to allow the fluid vaporized by the electronic component (305) to diffuse into the first flow path (301). The wick structure (340) may be configured to move the fluid liquefied within the first flow path (301) to an area adjacent to the electronic component (305) through the second flow path (302).

[0183] For example, referring to FIG. 8C, the separation structure (335) and another separation structure (710) can separate the first flow path (301) and the second flow path (302). Within the first flow path (301), the fluid adjacent to the first edge part (360a) and the second edge part (360b) of the second wick portion (360) spaced apart from the electronic component (305) when looking at the display (201) from above (e.g., when looking in the +z direction) can be liquefied. The liquefied liquid-state fluid can move to a third edge part (360c) that is spaced from the first edge part (360a) and the second edge part (360b) of the second wick portion (360) and is adjacent to the electronic component (305) when viewing the display (201) from above, through the wick structure (340) that fills the second flow path (302). The liquid-state fluid that has moved to the third edge part (360c) can be vaporized by the electronic component (305) and thus diffuse into the first flow path (301).

[0184] For example, referring to FIG. 8D, the separation structure (335) and another separation structure (710) can separate the first flow path (301) and the second set of flow paths (302a, 302b), respectively. Within the first flow path (301), a fluid adjacent to the first edge part (360a) of the second wick portion (360) spaced apart from the electronic component (305) when viewing the display (201) from above (e.g., when viewing in the +z direction) can be liquefied. The liquefied liquid-state fluid can be moved from the first edge part (360a) of the second wick portion (360) to the second edge part (360b) and the third edge part (360c) adjacent to the electronic component (305) when viewing the display (201) from above, through the wick structure (340) filling the second set of flow paths (302a, 302b). The liquid-state fluid moved to the second edge part (360b) and the third edge part (360c) can be diffused into the first flow path (301) by being vaporized by the electronic component (305).

[0185] For example, referring to FIG. 8E, the second wick portion (360) may include a first part (361) and a second part (362) that are spaced apart from each other. The separation structure (335) and another separation structure (710) may separate the first flow path (301) and the second set of flow paths (302a, 302b), respectively. Within the first flow path (301), a fluid adjacent to a first edge part (360a) of the first part (361) and a second edge part (360b) of the second part (362) that are spaced apart from the electronic component (305) when viewing the display (201) from above (e.g., when viewing in the +z direction) may be liquefied. The liquefied liquid-state fluid can be moved to a third edge part (360c) and a fourth edge part (360d) that are spaced apart from the first edge part (360a) and the second edge part (360b) of the second wick portion (360) and adjacent to the electronic component (305) when viewing the display (201) from above, through a wick structure (340) that fills the second set of flow paths (302a, 302b). The liquid-state fluid moved to the third edge part (360c) and the fourth edge part (360d) can be diffused into the first flow path (301) by being vaporized by the electronic component (305).

[0186] According to the above-described embodiment, the heat diffusion member (300) of the electronic device (101) includes a wick structure (340) arranged in the heat diffusion member (300) in various forms, thereby reducing damage to the electronic device (101) due to heat generated from the electronic component (305).

[0187] Figure 9a illustrates an unfolded state of an exemplary electronic device. Figure 9b illustrates a folded state of an exemplary electronic device. Figure 9c is an exploded view of an exemplary electronic device. Figures 9d and 9e illustrate portions of an exemplary electronic device.

[0188] Referring to FIGS. 9A, 9B, and 9C, an electronic device (101) (e.g., the electronic device (101) of FIG. 1) may include a housing (210) including a first housing (910) and a second housing (920), a flexible display (930) (e.g., the display module (160) of FIG. 1, the display (201) of FIG. 2A), at least one camera (940) (e.g., the camera module (180) of FIG. 1), a hinge structure (950), and / or at least one electronic component (960).

[0189] The first housing (910) and the second housing (920) may form at least a portion of an outer surface of the electronic device (101) that may be gripped by a user. At least a portion of the outer surface of the electronic device (101) defined by the first housing (910) and the second housing (920) may come into contact with a portion of the user's body when the electronic device (101) is used by the user. According to one embodiment, the first housing (910) may include a first side (911), a second side (912) facing the first side (911) and spaced apart from the first side (911), and a third side (913) surrounding at least a portion of the first side (911) and the second side (912). The third side (913) may connect a periphery of the first side (911) and a periphery of the second side (912). The first side (911), the second side (912), and the third side (913) can define an internal space of the first housing (910). According to one embodiment, the first housing (910) can provide the space formed by the first side (911), the second side (912), and the third side (913) as a space for arranging components of the electronic device (101).

[0190] According to one embodiment, the second housing (920) can include a third face (921), a fourth face (922) facing the third face (921) and spaced apart from the third face (921), and a fourth side (923) surrounding at least a portion of the third face (921) and the fourth face (922). The fourth side (923) can connect a periphery of the third face (921) and a periphery of the fourth face (922). The third face (921), the fourth face (922), and the fourth side (923) can define an interior space of the second housing (920). According to one embodiment, the second housing (920) may provide a space formed by a third side (921), a fourth side (922), and a fourth side (923) surrounding at least a portion of the third side (921) and the fourth side (922), as a space for mounting components of the electronic device (101). According to one embodiment, the second housing (920) may be coupled to the first housing (910) so as to be rotatable with respect to the first housing (910).

[0191] According to one embodiment, each of the first housing (910) and the second housing (920) may include a first protective member (914) and a second protective member (924), respectively. The first protective member (914) and the second protective member (924) may be disposed on the first side (911) and the third side (921) along the periphery of the flexible display (930). According to one embodiment, the first protective member (914) and the second protective member (924) may prevent foreign substances (e.g., dust or moisture) from entering through the gap between the flexible display (930) and the first housing (910) and the second housing (920). For example, the first protective member (914) may surround the edge of the first display area (931) of the flexible display (930), and the second protective member (924) may surround the edge of the second display area (932) of the flexible display (930). The first protective member (914) may be formed by being attached to the third side (913) of the first housing (910), or may be formed integrally with the third side (913). The second protective member (924) may be formed by being attached to the fourth side (923) of the second housing (920), or may be formed integrally with the fourth side (923).

[0192] According to one embodiment, the third side (913) and the fourth side (923) may include a conductive material, a non-conductive material, or a combination thereof. For example, the fourth side (923) may include at least one conductive member (925) and at least one non-conductive member (926). The at least one conductive member (925) may include a plurality of conductive members that are each spaced apart from each other. The at least one non-conductive member (926) may be disposed between the plurality of conductive members. The plurality of conductive members may be isolated from each other by the at least one non-conductive member (926) disposed between the plurality of conductive members. According to one embodiment, the plurality of conductive members and the plurality of non-conductive members may together form an antenna radiator. The electronic device (101) may be capable of communicating with an external electronic device through the antenna radiator formed by the plurality of conductive members and the plurality of non-conductive members.

[0193] The flexible display (930) may be configured to display visual information. According to one embodiment, the flexible display (930) may be disposed on a first surface (911) of a first housing (910) and a third surface (921) of a second housing (920) across a hinge structure (950). For example, the flexible display (930) may include a first display area (931) disposed on the first surface (911) of the first housing, a second display area (932) disposed on the third surface (921) of the second housing, and a third display area (933) disposed between the first display area (931) and the second display area (932). The first display area (931), the second display area (932), and the third display area (933) may form a front surface of the flexible display (930). According to one embodiment, the flexible display (930) may further include a sub-display panel (935) disposed on the fourth side (922) of the second housing (920). According to one embodiment, the flexible display (930) may include a window exposed toward the outside of the electronic device (101). The window may protect the surface of the flexible display (930) and may include a substantially transparent material to transmit visual information provided by the flexible display (930) to the outside of the electronic device (101). For example, the window may include, but is not limited to, glass (e.g., UTG, ultra-thin glass) and / or a polymer (e.g., PI, polyimide).

[0194] At least one camera (940) may be configured to acquire an image based on receiving light from a subject external to the electronic device (101). According to one embodiment, the at least one camera (940) may include third cameras (941) (e.g., the rear camera (212) of FIG. 2A), a fourth camera (942), and a fifth camera (943). The third cameras (941) may be disposed in the first housing (910). For example, the third cameras (941) may be disposed inside the first housing (910) and at least a portion of the third cameras (941) may be visible through the second side (912) of the first housing (910). The third cameras (941) may be supported by a bracket (not shown) within the first housing (910). The first housing (910) may include at least one opening (941a) that overlaps the third cameras (941) when viewed from above the electronic device (101). The third cameras (941) may acquire images based on receiving light from outside the electronic device (101) through the at least one opening (941a).

[0195] According to one embodiment, the fourth camera (942) may be disposed in the second housing (920). For example, the fourth camera (942) may be disposed inside the second housing (920) and may be visible through the sub-display panel (935). The second housing (920) may include at least one opening (942a) that overlaps the fourth camera (942) when the electronic device (101) is viewed from above. The fourth camera (942) may acquire an image based on receiving light from the outside of the electronic device (101) through the at least one opening (942a).

[0196] In one embodiment, the fifth camera (943) may be disposed in the first housing (910). For example, the fifth camera (943) may be disposed inside the first housing (910) and at least a portion thereof may be visible through the first surface (911) of the first housing (910). In another example, the fifth camera (943) may be disposed inside the first housing (910) and at least a portion thereof may be visible through the first display area (931) of the flexible display (930). The first display area (931) of the flexible display (930) may include at least one opening that overlaps the fifth camera (943) when the flexible display (930) is viewed from above. The fifth camera (943) may acquire an image based on receiving light from the outside of the flexible display (930) through the at least one opening.

[0197] According to one embodiment, the fourth camera (942) and the fifth camera (943) may be positioned below the flexible display (930) (e.g., toward the inside of the first housing (910) or the inside of the second housing (920). For example, the fourth camera (942) and the fifth camera (943) may be under-display cameras (UDCs). When the fourth camera (942) and the fifth camera (943) are under-display cameras, an area of ​​the flexible display (930) corresponding to the positions of the fourth camera (942) and the fifth camera (943), respectively, may not be an inactive area. The inactive area of ​​the flexible display (930) may mean an area of ​​the flexible display (930) that does not include pixels or does not emit light to the outside of the electronic device (101). For another example, the fourth camera (942) and the fifth camera (943) may be punch-hole cameras. When the fourth camera (942) and the fifth camera (943) are punch-hole cameras, an area of ​​the flexible display (930) corresponding to the positions of each of the fourth camera (942) and the fifth camera (943) may be an inactive area.

[0198] According to one embodiment, the hinge structure (950) can rotatably connect the first housing (910) and the second housing (920). The hinge structure (950) can be positioned between the first housing (910) and the second housing (920) of the electronic device (101) so that the electronic device (101) can be bent, curved, or folded. For example, the hinge structure (950) can be positioned between a portion of the third side (913) and a portion of the fourth side (923) that face each other. The hinge structure (950) can change the electronic device (101) into an unfolding state in which the first side (911) of the first housing (910) and the third side (921) of the second housing (920) face the same direction, or into a folding state in which the first side (911) and the third side (921) face each other. When the electronic device (101) is in a folded state, the first housing (910) and the second housing (920) can be folded or overlapped by facing each other.

[0199] According to one embodiment, when the electronic device (101) is in a folded state, the direction in which the first side (911) faces and the direction in which the third side (921) faces may be different from each other. For example, when the electronic device (101) is in a folded state, the direction in which the first side (911) faces and the direction in which the third side (921) faces may be opposite to each other. For another example, when the electronic device (101) is in a folded state, the direction in which the first side (911) faces and the direction in which the third side (921) faces may be inclined with respect to each other. When the direction in which the first side (911) faces is inclined with respect to the direction in which the third side (921) faces, the first housing (910) may be inclined with respect to the second housing (920).

[0200] According to one embodiment, the electronic device (101) may be foldable based on a folding axis (f). The folding axis (f) may refer to a virtual line extending in a direction parallel to the longitudinal direction of the electronic device (101) and passing through the hinge cover (951), but is not limited thereto. For example, the folding axis (f) may be a virtual line extending in a direction perpendicular to the longitudinal direction of the electronic device (101). When the folding axis (f) extends in a direction perpendicular to the longitudinal direction of the electronic device (101), the hinge structure (950) may extend in a direction parallel to the folding axis (f) to connect the first housing (910) and the second housing (920). The first housing (910) and the second housing (920) may be rotatable by the hinge structure (950) extending in a direction perpendicular to the longitudinal direction of the electronic device (101).

[0201] According to one embodiment, the hinge structure (950) may include a hinge cover (951), a first hinge plate (952), a second hinge plate (953), and a hinge module (954). The hinge cover (951) may surround internal components of the hinge structure (950) and form an outer surface of the hinge structure (950). According to one embodiment, the hinge cover (951) surrounding the hinge structure (950) may be at least partially exposed to the outside of the electronic device (101) through a space between the first housing (910) and the second housing (920) when the electronic device (101) is in a folded state. According to one embodiment, when the electronic device (101) is in an unfolded state, the hinge cover (951) may be covered by the first housing (910) and the second housing (920) and may not be exposed to the outside of the electronic device (101).

[0202] According to one embodiment, the first hinge plate (952) and the second hinge plate (953) can be coupled to the first housing (910) and the second housing (920), respectively, thereby rotatably connecting the first housing (910) and the second housing (920). For example, the first hinge plate (952) can be coupled to the first front bracket (915) of the first housing (910), and the second hinge plate (953) can be coupled to the second front bracket (927) of the second housing (920). As the first hinge plate (952) and the second hinge plate (953) are coupled to the first front bracket (915) and the second front bracket (927), respectively, the first housing (910) and the second housing (920) can be rotated according to the rotation of the first hinge plate (952) and the second hinge plate (953).

[0203] The hinge module (954) can rotate the first hinge plate (952) and the second hinge plate (953). For example, the hinge module (954) can rotate the first hinge plate (952) and the second hinge plate (953) about the folding axis (f) by including gears that are interlocked with each other and can rotate. According to one embodiment, the hinge module (954) can be a plurality of pieces. For example, the plurality of hinge modules (954) can be spaced apart from each other at both ends of the first hinge plate (952) and the second hinge plate (953), respectively.

[0204] According to one embodiment, the first housing (910) may include a first front bracket (915) and a rear bracket (916), and the second housing (920) may include a second front bracket (927). The first front bracket (915) and the rear bracket (916) may be disposed inside the first housing (910) and may support components of the electronic device (101). The second front bracket (927) may be disposed inside the second housing (920) and may support components of the electronic device (101). For example, the flexible display (930) may be disposed on one side of the first front bracket (915) and one side of the second front bracket (927). The rear bracket (916) can be placed on the other side of the first front bracket (915) facing one side of the first front bracket (915).

[0205] In one embodiment, a portion of the first front bracket (915) may be surrounded by the third side (913), and a portion of the second front bracket (927) may be surrounded by the fourth side (923). For example, the first front bracket (915) may be formed integrally with the third side (913), and the second front bracket (927) may be formed integrally with the fourth side (923). In another example, the first front bracket (915) may be formed separately from the third side (913), and the second front bracket (927) may be formed separately from the fourth side (923).

[0206] At least one electronic component (960) may implement various functions to be provided to a user. According to one embodiment, at least one electronic component (960) may include a first printed circuit board (250), a second printed circuit board (252), a flexible printed circuit board (253), a battery (270) (e.g., the battery (189) of FIG. 1 ), and / or an antenna (248) (e.g., the antenna module (197) of FIG. 1 ). The first printed circuit board (250) and the second printed circuit board (252) may each form an electrical connection between components within the electronic device (101). For example, components for implementing the overall function of the electronic device (101) (e.g., the processor (120) of FIG. 1 ) may be arranged on the first printed circuit board (250), and electronic components for implementing some functions of the first printed circuit board (250) may be arranged on the second printed circuit board (252). For another example, components for the operation of a sub-display panel (935) placed on the fourth side (922) of a second printed circuit board (252) may be placed.

[0207] In one embodiment, the first printed circuit board (250) may be disposed within the first housing (910). For example, the first printed circuit board (250) may be disposed on one surface of the first front bracket (915). In one embodiment, the second printed circuit board (252) may be disposed within the second housing (920). For example, the second printed circuit board (252) may be spaced apart from the first printed circuit board (250) and disposed on one surface of the second front bracket (927). A flexible printed circuit board (253) may connect the first printed circuit board (250) and the second printed circuit board (252). For example, the flexible printed circuit board (253) may extend from the first printed circuit board (250) to the second printed circuit board (252).

[0208] The battery (270) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (270) may be arranged substantially on the same plane as the first printed circuit board (250) or the second printed circuit board (252).

[0209] The antenna (248) may be configured to receive power or a signal from outside the electronic device (101). According to one embodiment, the antenna (248) may be positioned between the rear bracket (916) and the battery (270). The antenna (248) may include, for example, a near field communication (NFC) antenna, an antenna module, and / or a magnetic secure transmission (MST) antenna. The antenna (248) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging.

[0210] Referring to FIGS. 9d and 9e, the electronic device (101) may include a first housing (910), a second housing (920), a hinge structure (950), an electronic component (305), and a heat spreading member (300) at least partially disposed on the electronic component (305). The heat spreading member (300) may include a first flow path (301) for a gaseous fluid, and a second flow path (302) for the liquid fluid. The heat spreading member (300) may include a frame (330) including a first plate (e.g., the first plate (310) of FIG. 3b), a second plate (e.g., the second plate (320) of FIG. 3b) coupled to the first plate (310), and a separation structure (335) separating the first flow path (301) and the second flow path (302), and a wick structure (340) for moving the fluid within the frame (330). The wick structure (340) may include a first wick portion (e.g., the first wick portion (350) of FIG. 3b) attached to the first plate (310), and a second wick portion (360) within the second flow path (302) at least partially interposed between the first wick portion (350) and the second plate (320).

[0211] According to one embodiment, the first housing (910) can accommodate a heat spreading member (300). The second housing (920) can be rotatably coupled to the first housing (910). A hinge structure (e.g., hinge structure (950) of FIG. 9B) can connect the first housing (910) and the second housing (920).

[0212] For example, the electronic component (305) may be disposed within the first housing (910). The heat spreading member (300) may be disposed within the first housing (910) so as to at least partially overlap the electronic component (305) when the flexible display (e.g., the flexible display (930) of FIG. 9A) is viewed from above.

[0213] For example, the separation structure (335) within the heat diffusion member (300) can separate the first flow path (301) and the second flow path (302). The gaseous fluid evaporated by the electronic component (305) within the first flow path (301) can diffuse into the first flow path (301). Within the first flow path (301), the fluid adjacent to the first edge part (360a) of the second wick portion (360) spaced apart from the electronic component (305) when viewing the flexible display (930) from above (e.g., when viewing in the +z direction) can be liquefied. The liquefied liquid-state fluid can move to a second edge part (360b) opposite to the first edge part (360a) of the second wick portion (360) and adjacent to the electronic component (305) when viewing the flexible display (930) from above, through the wick structure (340) filling the second flow path (302). The liquid-state fluid moved to the second edge part (360b) can diffuse into the first flow path (301) by being vaporized by the electronic component (305). The heat diffusion member (300) can reduce damage to electronic components disposed in the first housing (910) by the heat by dissipating heat generated from the electronic component (305).

[0214] According to one embodiment, the electronic device (101) may include a heat transfer member (980) extending from the first housing (910) to the second housing (920) across the hinge structure (950). The heat spreading member (300) may be configured such that the first flow path (301) is positioned closer to the heat transfer member (980) than the second flow path (302).

[0215] For example, the heat transfer member (980) may at least partially overlap the electronic component (305) when the flexible display (930) is viewed from above (e.g., when viewed in the +z direction). For example, the heat transfer member (980) may be attached on an area (e.g., the first area (300a) of FIG. 3A) where the first flow path (301) is disposed among the first flow path (301) and the second flow path (302) of the heat diffusion member (300). According to one embodiment, the heat diffusion member (300) may be positioned between the electronic component (305) and the heat transfer member (980). The area of ​​the heat diffusion member (300) where the heat transfer member (980) is disposed may be an area disposed on the electronic component (305). For example, the heat transfer member (980) may extend across the hinge structure (950) from an area of ​​the heat diffusion member (300) where the first flow path (301) is disposed, to the second housing (920). Heat transferred from the electronic component (305) to the heat transfer member (980) through the first flow path (301) may be diffused from the first housing (910) to the second housing (920) through the heat transfer member (980). The heat transfer member (980) provides a heat transfer path for transferring heat transferred from the electronic component (305) to the heat diffusion member (300) from the first housing (910) to the second housing (920), thereby reducing damage to the electronic device (101) caused by heat generated from the electronic component (305) and dispersing the heat transferred from the electronic component (305) to the heat diffusion member (300) through the second housing (920).

[0216] According to the above-described embodiment, the electronic device (101) includes a heat transfer member (980) configured to transfer heat generated from an electronic component (305) within a first housing (910) to a second housing (920) rotatably coupled to the first housing (910), thereby reducing damage to the electronic device (101) due to the heat.

[0217] According to the above-described embodiment, an electronic device (e.g., electronic device (101) of FIG. 1) may include an electronic component (e.g., electronic component (305) of FIG. 3A), and a heat spreading member (e.g., heat spreading member (300) of FIG. 3A) at least partially disposed on the electronic component. The heat spreading member may include a first region facing the electronic component (e.g., a first region (300a) of FIG. 3A), a second region spaced apart from the first region (e.g., a second region (300b) of FIG. 3A), and a first flow path connecting the first region and the second region and for a gaseous fluid (e.g., a first flow path (301) of FIG. 3A), a second flow path for the liquid fluid (e.g., a second flow path (302) of FIG. 3A), and a third region including the first flow path and the second flow path (e.g., a third region (300c) of FIG. 3A). The heat spreading member may include a frame (e.g., a frame (330) in FIG. 3b) including a first plate (e.g., a first plate (310) in FIG. 3b), a second plate (e.g., a second plate (320) in FIG. 3b) coupled to the first plate, and a separation structure (e.g., a separation structure (335) in FIG. 3a) in the third region that separates the first flow path and the second flow path. The heat spreading member may include a wick structure (e.g., a wick structure (340) in FIG. 3b) for moving the fluid in the frame. The wick structure may include a first wick portion (e.g., a first wick portion (350) in FIG. 3b) attached to the first plate, and a second wick portion (e.g., a second wick portion (360) in FIG. 3b) in the second flow path that is at least partially interposed between the first wick portion and the second plate. According to the above-mentioned embodiment, the heat spreading member (300) can reduce damage to the electronic device caused by the heat by dissipating the heat emitted from the electronic component (305).The heat diffusion member (300) can enhance the performance of the heat diffusion member by including the separation structure that separates the first flow path and the second flow path. The wick structure can enhance the performance of the heat diffusion member by including the second wick portion that is at least partially positioned within the second flow path. The above-mentioned embodiment can have various effects including the above-mentioned effects.

[0218] In one embodiment, the first wick portion may include a slit (e.g., a slit (350a) of FIG. 3B) for passing the separation structure through. In the aforementioned embodiment, the first wick portion may provide a space for the separation structure by including the slit. The aforementioned embodiment may have various effects, including the aforementioned effects.

[0219] According to one embodiment, the frame may further include first pillars (e.g., first pillars (410) of FIG. 4A) that protrude from the second plate toward the first plate within the first flow path and thereby come into contact with the first plate. According to the above-mentioned embodiment, the frame may reduce damage to the first flow path due to the external impact by including the first pillars. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0220] In one embodiment, the second wick portion can fill the second passage together with the first wick portion. In the above-mentioned embodiment, the second wick portion can improve the performance of the heat diffusion member by filling the second passage together with the first wick portion. The above-mentioned embodiment can have various effects including the above-mentioned effects.

[0221] According to one embodiment, the first wick portion may include a first portion (e.g., the first portion (351) of FIG. 3B) disposed within the first region, a second portion (e.g., the second portion (352) of FIG. 3B) disposed within the second region, and a third portion (e.g., the third portion (353) of FIG. 3B) disposed within the third region, which includes a first supporting region (e.g., the first supporting region (353a) of FIG. 3B) disposed within the first flow path for connecting the first portion and the second portion and supporting the second plate, and a second supporting region (e.g., the second supporting region (353b) of FIG. 3B) disposed within the second flow path. According to the above-mentioned embodiment, the first wick portion may improve the performance of the heat spreading member by including the first supporting region and the second supporting region. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0222] In one embodiment, the frame may further include first posts that protrude from the second plate toward the first plate within the first flow path and thereby come into contact with the first support area. In the above-mentioned embodiment, the frame may reduce damage to the first flow path due to external impact by including the first posts that come into contact with the first support area. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0223] According to one embodiment, the frame may further include second posts (e.g., second posts (420) of FIG. 4B) that protrude from the second plate to the first plate within the second flow path and thereby come into contact with the second support area. The second wick portion may include a plurality of through holes (e.g., a plurality of through holes (430) of FIG. 4B) for passing the second posts within the second flow path. According to the above-mentioned embodiment, the frame may reduce damage to the second flow path due to external impact by including the second posts. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0224] According to one embodiment, the third region may be configured to move the fluid in a gaseous state from the first region to the third region through the first flow path, and to move the fluid in a liquid state from the second region to the first region through the second flow path. According to the above-mentioned embodiment, the third region may improve the performance of the heat diffusion member by being configured to circulate the fluid within the heat diffusion member. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0225] In one embodiment, the separation structure may have a curvature by being at least partially bent. In the aforementioned embodiment, the separation structure may be configured to be at least partially bent so that the heat spreading member is positioned within the electronic device. The aforementioned embodiment may have various effects, including the effects mentioned above.

[0226] In one embodiment, the separation structure can be in contact with the second plate by extending from the first plate toward the second plate within the third region. In the above-mentioned embodiment, the heat diffusion member can improve the performance of the heat diffusion member by including the separation structure and reduce damage to the third region due to external impact. The above-mentioned embodiment can have various effects including the above-mentioned effects.

[0227] In one embodiment, the separation structure can be in contact with the first plate by extending from the second plate toward the first plate within the third region. In the above-mentioned embodiment, the heat diffusion member can improve the performance of the heat diffusion member and reduce damage to the third region due to external impact by including the separation structure. The above-mentioned embodiment can have various effects including the above-mentioned effects.

[0228] According to one embodiment, the separation structure may include a first protrusion extending from the first plate toward the second plate within the third region (e.g., the first protrusion (610) of FIG. 6C), a second protrusion facing the first protrusion by extending from the second plate toward the first plate within the third region (e.g., the second protrusion (620) of FIG. 6C), and an adhesive member connecting the first protrusion and the second protrusion (e.g., the adhesive member (650) of FIG. 6C). According to the above-mentioned embodiment, the heat spreading member may improve the performance of the heat spreading member and reduce damage to the third region due to an external impact by including the separation structure. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0229] According to one embodiment, the separation structure may include a first support portion (e.g., the first support portion (335a) of FIG. 6d) protruding from the second plate toward the first wick portion, and a second support portion (e.g., the second support portion (335b) of FIG. 6d) connected to the first support portion and at least partially filling the first wick portion. According to the above-mentioned embodiment, the heat diffusion member may improve the performance of the heat diffusion member and reduce damage to the third region due to external impact by including the separation structure. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0230] According to one embodiment, the frame may further include at least one recess formed within the separation structure (e.g., at least one recess (630) of FIG. 6A). According to the above-mentioned embodiment, the heat diffusion member may improve the performance of the heat diffusion member and reduce damage to the third region due to external impact by including the separation structure including the at least one recess. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0231] According to one embodiment, the wick structure may include at least one of a mesh wick and a sintering wick. According to the above-mentioned embodiment, the wick structure may improve the performance of the heat diffusion member by including at least one of a mesh wick and a sintering wick. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0232] In one embodiment, an electronic device may include an electronic component and a heat spreader member at least partially disposed on the electronic component. The heat spreader member may include a first region facing the electronic component, a second region spaced from the first region, and a third region connecting the first region and the second region and including a first flow path for a gaseous fluid, a second flow path for the fluid in a liquid state, and the third region including the first flow path and the second flow path. The heat spreader member may include a frame including a separation structure within the third region separating the first flow path and the second flow path, and a wick structure for moving the fluid within the frame. The wick structure may include a first wick portion including a first portion disposed within the first region, a second portion disposed within the second region, and a third portion within the third region connecting the first portion and the second portion, and a second wick portion within the second flow path interposed between the third portion and the frame. According to the above-mentioned embodiment, the heat diffusion member (300) can reduce damage to the electronic device caused by the heat by dissipating the heat emitted from the electronic component (305). The heat diffusion member (300) can improve the performance of the heat diffusion member by including the separation structure that separates the first flow path and the second flow path. The wick structure can improve the performance of the heat diffusion member by including the second wick portion that is at least partially disposed within the second flow path. The above-mentioned embodiment can have various effects including the above-mentioned effects.

[0233] In one embodiment, the second wick portion can fill the second passage together with the first wick portion. In the above-mentioned embodiment, the second wick portion can improve the performance of the heat diffusion member by filling the second passage together with the first wick portion. The above-mentioned embodiment can have various effects including the above-mentioned effects.

[0234] According to one embodiment, the third portion may include a first support area disposed within the first flow path, and a second support area disposed within the second flow path. The frame may further include a first plate to which the first wick portion is attached, a second plate to which the second wick portion is attached and coupled with the first plate, and first posts that protrude from the second plate within the first flow path toward the first plate and thereby come into contact with the first support area. According to the above-mentioned embodiment, the frame may reduce damage to the first flow path due to an external impact by including the first posts that come into contact with the first support area. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0235] According to one embodiment, the frame may further include second posts that protrude from the second plate toward the first plate within the second passage, thereby contacting the second support area. The second wick portion may include a plurality of through holes for passing the second posts within the second passage. According to the above-mentioned embodiment, the frame may reduce damage to the second passage due to external impact by including the second posts. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0236] According to one embodiment, the third region may be configured to move the fluid in a gaseous state from the first region to the third region through the first flow path, and to move the fluid in a liquid state from the second region to the first region through the second flow path. According to the above-mentioned embodiment, the third region may improve the performance of the heat diffusion member by being configured to circulate the fluid within the heat diffusion member. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0237] In one embodiment, an electronic device (e.g., electronic device (101) of FIG. 1) may include a display (e.g., display (201) of FIG. 2A, flexible display (930) of FIG. 9A), an electronic component (e.g., electronic component (305) of FIG. 3A), and a heat spreading member (e.g., heat spreading member (300) of FIG. 3A) disposed to partially overlap the electronic component when viewed from above the display. The heat spreading member may include a first plate facing the electronic component (e.g., a first plate (310) of FIG. 3b), a second plate substantially opposite the first plate (e.g., a second plate (320) of FIG. 3b), a separation structure (e.g., a separation structure (335) of FIG. 3a) disposed in an internal space between the first plate and the second plate such that a first flow path (e.g., a first flow path (301) of FIG. 3a) and a second flow path (e.g., a second flow path (302) of FIG. 3a)) are formed along the first side (e.g., a first side (330a) of FIG. 3a) and the second side (e.g., a second side (330b) of FIG. 3a) opposite the first side, respectively. The heat spreading member may include a wick structure (e.g., a wick structure (340) of FIG. 3b) for moving a fluid along at least one of the first flow path or the second flow path. The wick structure may include a first wick portion (e.g., a first wick portion (350) of FIG. 3b) positioned in the first flow path and the second flow path, and a second wick portion (e.g., a second wick portion (360) of FIG. 3b) positioned above a portion of the first wick portion corresponding to the second flow path.

[0238] According to one embodiment, the first flow path may be configured such that the fluid substantially vaporized by heat generated from the electronic component diffuses from a first region of the heat diffusion member (e.g., the first region (300a) of FIG. 3A) to a second region opposite the first region (e.g., the second region (300b) of FIG. 3A) through the first flow path. The second flow path may be configured such that the fluid substantially liquefied in the second region diffuses from the second region to the first region through the second flow path.

[0239] In one embodiment, the first wick portion may be attached on the first plate. The second wick portion may be attached on the first wick portion.

[0240] According to one embodiment, the separation structure may include a protrusion protruding from at least one of the first plate and the second plate (e.g., the first protrusion (610) and the second protrusion (620) of FIG. 6c).

[0241] In one embodiment, the protrusion may be formed to contact the other of the first plate and the second plate.

[0242] In one embodiment, the protrusion may be welded to the first wick portion.

[0243] According to one embodiment, the first wick portion may include a slit corresponding to the separation structure (e.g., a slit (350a) in FIG. 3b).

[0244] In one embodiment, the heat spreading member may further include first posts (e.g., first posts (410) of FIG. 4A) that contact the first wick portion protruding from the second plate toward the first plate within the first euro.

[0245] According to one embodiment, the first wick portion may include a plurality of holes (e.g., a plurality of holes (440) in FIG. 4c) corresponding to at least a portion of the space between the first pillars.

[0246] In one embodiment, the second plate may include a plurality of recesses formed along the separation structure within the second wick portion. The second wick portion may be configured to fill the recesses.

[0247] According to one embodiment, the wick structure may include a separation portion in which no pores are formed (e.g., separation portion (340b) of FIG. 5d) as at least a portion of the separation structure.

[0248] In one embodiment, the electronic device (101) may include a first housing (e.g., a first housing (910) of FIG. 9a) for accommodating the heat spreading member, a second housing rotatably coupled to the first housing, a hinge structure (e.g., a hinge structure (950) of FIG. 9b) connecting the first housing and the second housing, and a heat transfer member (e.g., a heat transfer member (980) of FIG. 9d) extending from the first housing to the second housing across the hinge structure. The heat spreading member may be configured such that the first flow path is positioned closer to the heat transfer member than the second flow path.

[0249] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0250] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0251] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0252] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0253] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a commodity between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0254] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device (101), display (201); Electronic components (305); and When viewed from above the display (201), a heat spreading member (300) is disposed to partially overlap with the electronic component (305); The above heat diffusion member (300) is A first plate (310) facing the above electronic component (305); A second plate (320) substantially opposite to the first plate (310); A separation structure (335) arranged in the internal space between the first plate (310) and the second plate (320) so that a first flow path (301) and a second flow path (302) are formed along the first side (330a) and the second side (330b) opposite to the first side (330a), respectively; and A wick structure (340) for moving a fluid along at least one of the first flow path (301) or the second flow path (302); The above wick structure (340) is A first wick portion (350) located in the first euro (301) and the second euro (302); and A second wick portion (360) located over a portion corresponding to the second uro (302) among the first wick portions (350); including; Electronic devices (101).

2. In paragraph 1, The above first euro (301) is, The fluid substantially vaporized by the heat generated from the electronic component (305) is configured to diffuse from the first region (300a) of the heat diffusion member (300) to the second region (300b) opposite to the first region (300a) through the first flow path (301), The above second euro (302) is, The fluid, which is substantially liquefied in the second region (300b), is configured to diffuse from the second region (300b) to the first region (300a) through the second flow path (302). Electronic devices (101).

3. In paragraph 1 or 2, The above first wick part (350) is, Attached to the first plate (310) above, The above second wick part (360) is Attached to the above first wick portion (350), Electronic device (101).

4. In any one of paragraphs 1 to 3, The above separation structure (335) is Including a protrusion (610; 620) protruding from at least one of the first plate (310) and the second plate (320). Electronic device (101).

5. In paragraph 4, The above protrusion (610; 620) is formed to contact the other one of the first plate (310) and the second plate (320). Electronic device (101).

6. In paragraph 4, The above protrusion (610; 620) is Welded to the above first wick portion (350), Electronic device (101).

7. In any one of paragraphs 1 to 6, The above first wick part (350) is, Including a slit (350a) corresponding to the above separation structure (335); Electronic device (101).

8. In any one of paragraphs 1 to 7, The above heat diffusion member (300) is Further comprising first pillars (410) protruding from the second plate (320) toward the first plate (310) within the first euro (301) and in contact with the first wick portion (350); Electronic device (101).

9. In paragraph 8, The above first wick part (350) is, A plurality of holes (440) corresponding to at least a portion of the space between the first pillars (410); Electronic device (101).

10. In any one of paragraphs 1 to 9, The above second plate (320) is, A plurality of recesses formed along the separation structure (335) within the second euro (302); The above second wick part (360) is configured to fill the above recesses, Electronic device (101).

11. In any one of paragraphs 1 to 10, The above wick structure (340) is As at least a part of the above separation structure (335), including a separation portion (340b) in which no pores are formed, Electronic device (101).

12. In any one of paragraphs 1 to 11, A first housing (910) accommodating the above heat diffusion member (300); A second housing (920) rotatably coupled to the first housing (910); A hinge structure (950) connecting the first housing (910) and the second housing (920); and Across the hinge structure (950), a heat transfer member (980) extending from the first housing (910) to the second housing (920) is included. The above heat diffusion member (300) is configured so that the first flow path (301) is positioned closer to the heat transfer member (980) than the second flow path (302). Electronic devices (101).

13. In any one of paragraphs 1 to 12, The above second wick part (360) is configured to fill the second euro (302) with the first wick portion (350), Electronic devices (101).

14. In any one of paragraphs 1 to 13, The above heat diffusion member (300) is Further comprising second pillars (420) protruding from the second plate (320) to the first plate (310) within the second euro (302) and thereby coming into contact with the first wick portion (350); The above second wick part (360) is Including a plurality of through holes (430) for passing the second pillars (420) within the second euro (302); Electronic devices (101).

15. In any one of paragraphs 1 to 14, The above heat diffusion member (300) is At least partially bent, The above separation structure (335) is Having a curvature by being at least partially bent along the above heat diffusion member (300), Electronic devices (101).

Images