Electronic device comprising antenna

Abstract

An electronic device disclosed herein may comprise: a housing; a display; a conductive frame forming a side surface of the housing; a first antenna for performing wireless communication by using at least a portion of the conductive frame; a second antenna disposed adjacent to the first antenna inside the electronic device; and a communication module for transmitting and receiving a wireless signal through the first antenna or the second antenna. The at least a portion of the conductive frame may include a first portion and a second portion disposed in different directions. The second antenna may include a slit. The longitudinal direction of the slit may be a direction oriented between the first portion and the second portion. Other embodiments identified through the specification are also possible.

Description

Electronic device including an antenna

[0001] Embodiments disclosed in this document relate to an electronic device including an antenna.

[0002] Electronic devices (or portable communication devices, wireless communication devices) such as smartphones and tablet PCs can perform wireless communication via antennas. These devices may include multiple antennas that respond to wireless communication signals across various bands. While the size of electronic devices such as smartphones and tablet PCs continues to decrease, the number of antennas required to perform various functions continues to increase. If sufficient isolation is not secured between each antenna, normal antenna operation may be hindered.

[0003] For example, an electronic device may transmit and receive signals in the WIFI 6E (5925-7125 MHz) band by using a portion of a conductive frame (hereinafter, “side frame”) disposed on the side. In addition, the electronic device may transmit and receive signals in the UWB (Ultra Wide-Band) (e.g., 5ch: 6250-6750 MHz, 9ch: 7750-8250 MHz) that use a relatively wide frequency band (e.g., 500 MHz) as a single channel) by using a separate chip antenna. If two antennas are disposed adjacently in a section where the frequency bands overlap, signal interference may occur.

[0004] An electronic device according to one embodiment may include a housing, a display, a conductive frame forming a side surface of the housing, a first antenna for performing wireless communication using at least a portion of the conductive frame, a second antenna disposed adjacent to the first antenna within the electronic device, and a communication module for transmitting and receiving a wireless signal through the first antenna or the second antenna. The at least a portion of the conductive frame may include a first portion and a second portion disposed in different directions. The second antenna may include a slit. A longitudinal direction of the slit may be a direction facing between the first portion and the second portion.

[0005] FIG. 1 is a front perspective view of an electronic device according to one embodiment.

[0006] FIG. 2 is a rear perspective view of an electronic device according to one embodiment.

[0007] Figure 3 is an exploded perspective view of an electronic device according to one embodiment.

[0008] Figure 4 illustrates the arrangement of the first antenna and the second antenna according to one embodiment.

[0009] FIG. 5 illustrates a second antenna in the form of a chip antenna according to one embodiment.

[0010] Figures 6 and 7 illustrate multiple layers of a second antenna according to one embodiment.

[0011] Fig. 8 is a graph showing a comparison of the radiation performance of an antenna according to the arrangement direction of slits according to one embodiment.

[0012] Figure 9 shows a radiation pattern of a second antenna according to one embodiment.

[0013] Figures 10 to 12 show changes in radiation patterns according to changes in the shape of the first radiator of the first antenna.

[0014] FIG. 13 is a graph of the S parameter regarding the influence of the second antenna on the first antenna according to one embodiment.

[0015] FIG. 14 is a block diagram of an electronic device within a network environment according to various embodiments.

[0016] In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0017] Hereinafter, various embodiments of this document will be described with reference to the attached drawings. However, this is not intended to limit the technology described in this document to specific embodiments, and it should be understood that various modifications, equivalents, and / or alternatives of the embodiments of this document are included. In connection with the description of the drawings, similar reference numerals may be used for similar components.

[0018]

[0019] FIG. 1 is a front perspective view of an electronic device according to one embodiment. FIG. 2 is a rear perspective view of an electronic device according to one embodiment. FIG. 3 is an exploded perspective view of an electronic device according to one embodiment.

[0020] Referring to FIGS. 1 and 2 , an electronic device (300) according to an embodiment (e.g., electronic device (1401) of FIG. 14 ) may include a housing (310) that includes a first side (or front side) (310A), a second side (or back side) (310B), and a third side (or side side) (310C) that surrounds a space between the first side (310A) and the second side (310B). In an embodiment, the housing (310) may also refer to a structure that forms a portion of the first side (310A), the second side (310B), and the third side (310C).

[0021] The first side (310A) may be formed by a front plate (302) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (310B) may be formed by a substantially opaque back plate (311). The back plate (311) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The third side (310C) may be formed by a side bezel structure (or side member) (318) that is joined to the front plate (302) and the back plate (311) and includes a metal and / or a polymer. In various embodiments, the back plate (311) and the side bezel structure (318) may be formed integrally and may include the same material (e.g., a metal material such as aluminum).

[0022] The front plate (302) may include two first regions (310D) that extend seamlessly from a portion of the first surface (310A) toward the rear plate (311). The first regions (310D) may be located at both ends of a long edge of the front plate (302).

[0023] The rear plate (311) may include two second regions (310E) that extend seamlessly from a portion of the second surface (310B) toward the front plate (302). The second regions (310E) may include both long edges of the rear plate (311).

[0024] In one embodiment, the front plate (302) (or the back plate (311)) may include only one of the first regions (310D) (or the second regions (310E)). Additionally, in another embodiment, the front plate (302) (or the back plate (311)) may not include some of the first regions (310D) (or the second regions (310E)).

[0025] In one embodiment, the side bezel structure (318) may have a first thickness (or width) in a side direction (e.g., a short side) that does not include the first regions (310D) or the second regions (310E) as viewed from the side of the electronic device (300), and may have a second thickness that is thinner than the first thickness in a side direction (e.g., a long side) that includes the first regions (310D) or the second regions (310E).

[0026] The electronic device (300) may include at least one of a display (301) (e.g., a display module (1460) of FIG. 14), an audio module (not shown) (e.g., an audio module (1470) of FIG. 14), a sensor module (not shown) (e.g., a sensor module (1476) of FIG. 14), a camera module (305, 312, 313) (e.g., a camera module (1480) of FIG. 14), a key input device (317) (e.g., an input module (1450) of FIG. 14), a light-emitting element (not shown), and a connector hole (308) (e.g., a connection terminal (1478) of FIG. 14). In another embodiment, the electronic device (300) may omit at least one of the above components (e.g., a key input device (317) or a light-emitting element (not shown)) or may additionally include other components.

[0027] The display (301) may be visually exposed through a significant portion of the front plate (302). For example, at least a portion of the display (301) may be visually exposed through the front plate (302) including the first area (310D) of the first side (310A) and the third side (310C). The display (301) may be disposed on the back surface of the front plate (302).

[0028] The corners of the display (301) may be formed to be substantially identical to the adjacent outer shape of the front plate (302). In another embodiment, in order to expand the area where the display (301) is visually exposed, the gap between the outer edge of the display (301) and the outer edge of the front plate (302) may be formed to be substantially identical.

[0029] The surface (or front plate (302)) of the housing (310) may include a screen display area formed as the display (301) is visually exposed. For example, the screen display area may include a first surface (310A) and first areas (310D) of the side surfaces.

[0030] In one embodiment, the screen display area (310A, 310D) may include a sensing area (not shown) configured to acquire biometric information of the user. Here, the meaning of "the screen display area (310A, 310D) includes the sensing area" may be understood to mean that at least a portion of the sensing area may overlap the screen display area (310A, 310D). For example, the sensing area (not shown) may be an area capable of displaying visual information by the display (301) like other areas of the screen display area (310A, 310D) and additionally capable of acquiring biometric information of the user (e.g., fingerprint).

[0031] The screen display area (310A, 310D) of the display (301) may include an area where the first camera module (305) (e.g., a punch hole camera) is visually exposed. For example, the area where the first camera module (305) is visually exposed may have at least a portion of its edge surrounded by the screen display area (310A, 310D). In various embodiments, the first camera module (305) may include a plurality of camera modules (e.g., the camera module (1480) of FIG. 14).

[0032] In one embodiment, the display (301) may be configured such that at least one of an audio module (not shown), a sensor module (not shown), a camera module (e.g., a first camera module (305)), and a light-emitting element (not shown) is disposed on the back surface of the screen display area (310A, 310D). For example, the electronic device (300) may be configured such that the first camera module (305) (e.g., an under display camera (UDC)) is disposed on the back surface (e.g., a surface facing the -Z-axis direction) of the first surface (310A) (e.g., a front surface) and / or the side surface (310C) (e.g., at least one surface of the first area (310D)) so as to face the first surface (310A) and / or the side surface (310C). For example, the first camera module (305) may be positioned below the display (301) and may not be visually exposed to the screen display area (310A, 310D).

[0033] In one embodiment, when the first camera module (305) is configured as an under-display camera, the display (301) may be formed as a transparent area having a designated transmittance as a part of the display area that displays content in an area facing the first camera module (305). For example, the transparent area may be formed to have a transmittance in a range of about 5% to about 50%. This transparent area may include an area overlapping with an effective area (e.g., a field of view (FOV) area) of the first camera module (305) through which light passes to be imaged by an image sensor (e.g., the image sensor (230) of FIG. 2) to generate an image. For example, the transparent area of ​​the display (301) may include an area having a lower pixel density and / or wiring density than the surrounding area.

[0034] The display (301) may be combined with or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type stylus pen.

[0035] The audio module can acquire or output audio signals through microphone holes (303, 304) and speaker holes (307). The microphone holes (303, 304) may include a first microphone hole (303) formed in a portion of the third surface (310C) and a second microphone hole (304) formed in a portion of the second surface (310B). A microphone (not shown) for acquiring external sound may be placed inside the microphone holes (303, 304). The microphone may include multiple microphones to detect the direction of the sound.

[0036] A second microphone hole (304) formed in a portion of the second surface (310B) may be positioned adjacent to a camera module (305, 312, 313). For example, the second microphone hole (304) may acquire sound when the camera module (305, 312, 313) is running, or may acquire sound when another function is running.

[0037] The speaker hole (307) may include an external speaker hole (307) and a call receiver hole (not shown). The external speaker hole (307) may be formed in a part of the third surface (310C) of the electronic device (300). In another embodiment, the external speaker hole (307) may be implemented as a single hole with the microphone hole (303). Although not shown, the call receiver hole (not shown) may be formed in another part of the third surface (310C). For example, the call receiver hole may be formed in another part of the third surface (310C) (e.g., a part facing the -Y-axis direction) that faces a part of the third surface (310C) where the external speaker hole (307) is formed (e.g., a part facing the -Y-axis direction). According to various embodiments, the receiver hole for the call may not be formed in a part of the third side (310C), but may be formed by a gap between the front plate (302) (or display (301)) and the side bezel structure (318).

[0038] The electronic device (300) may include at least one speaker (not shown) configured to output sound to the outside of the housing (310) through an external speaker hole (307) or a call receiver hole (not shown). According to various embodiments, the speaker may include a piezo speaker in which the speaker hole (307) is omitted.

[0039] A sensor module (not shown) can generate an electrical signal or data value corresponding to an internal operating state of an electronic device (300) or an external environmental state. For example, the sensor module can include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0040] In one embodiment, the camera modules (305, 312, 313) may include a first camera module (305) (e.g., a punch hole camera) exposed to a first side (310A) of the electronic device (300), a second camera module (312) exposed to a second side (310B), and / or a flash (313).

[0041] In one embodiment, the first camera module (305) may be visually exposed through a portion of the screen display area (310A, 310D) of the display (301). For example, the first camera module (305) may be visually exposed to a portion of the screen display area (310A, 310D) through an opening (not shown) formed in a portion of the display (301). In another example, the first camera module (305) (e.g., an under-display camera) may be disposed on the back surface of the display (301) and may not be visually exposed to the screen display area (310A, 310D).

[0042] The second camera module (312) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera module (312) is not necessarily limited to including multiple cameras and may include one camera.

[0043] The first camera module (305) and the second camera module (312) may include one or more lenses, image sensors, and / or image signal processors. The flash (313) may include, for example, a light-emitting diode or a xenon lamp. In another embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (300).

[0044] The key input device (317) may be disposed on the third side (310C) of the housing (310) (e.g., the first areas (310D) and / or the second areas (310E)). In another embodiment, the electronic device (300) may not include some or all of the key input devices (317), and the key input devices (317) that are not included may be implemented in another form, such as a soft key, on the display (301). In another embodiment, the key input device may include a sensor module (not shown) that forms a sensing area (not shown) included in the screen display area (310A, 310D).

[0045] The connector hole (308) can accommodate a connector. The connector hole (308) can be arranged on the third side (310C) of the housing (310). For example, the connector hole (308) can be arranged on the third side (310C) so as to be adjacent to at least a portion of an audio module (e.g., a microphone hole (303) and a speaker hole (307)). In another embodiment, the electronic device (300) can include a first connector hole (308) that can accommodate a connector (e.g., a USB connector) for transmitting / receiving power and / or data with an external electronic device, and / or a second connector hole (not shown) that can accommodate a connector (e.g., an earphone jack) for transmitting / receiving audio signals with an external electronic device.

[0046] The electronic device (300) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on a first surface (310A) of the housing (310). The light-emitting element (not shown) may provide status information of the electronic device (300) in the form of light. In another embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera module (305). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0047] Referring to FIG. 3, an electronic device (300) according to one embodiment may include a front plate (320) (e.g., the front plate (302) of FIG. 1), a display (330) (e.g., the display (301) of FIG. 1), a side member (340) (e.g., the side bezel structure (318) of FIG. 1), a printed circuit board (350), a rear case (360), a battery (370), and a rear plate (380) (e.g., the rear plate (311) of FIG. 2).

[0048] In various embodiments, the electronic device (300) may omit at least some of the above components (e.g., the rear case (360)), or may additionally include other components. Some of the components of the electronic device (300) illustrated in FIG. 3 may be identical or similar to some of the components of the electronic device (300) illustrated in FIGS. 1 and 2, and any redundant descriptions thereof will be omitted below.

[0049] The front plate (320) and the display (330) may be coupled to the side member (340). For example, referring to FIG. 3, the front plate (320) and the display (330) may be positioned below the side member (340). The front plate (320) and the display (330) may be positioned in the +Z-axis direction from the side member (340). For example, the display (330) may be coupled below the side member (340), and the front plate (320) may be coupled below the display (330). The front plate (320) may form a part of the outer surface (or exterior) of the electronic device (300). The display (330) may be positioned between the front plate (320) and the side member (340) so as to be located inside the electronic device (300).

[0050] The side member (340) may be positioned between the display (330) and the back plate (380). For example, the side member (340) may be configured to surround the space between the back plate (380) and the display (330).

[0051] The side member (340) may include a side frame (or frame structure) (341) forming a portion of a side of the electronic device (300) (e.g., the third side (310C) of FIG. 1) and a plate structure (342) extending inward from the side frame (341).

[0052] The plate structure (342) may be disposed inside the side frame (341) so as to be surrounded by the side frame (341). The plate structure (342) may be connected to the side frame (341) or may be formed integrally with the side frame (341). The plate structure (342) may be formed of a metallic material and / or a non-metallic (e.g., polymer) material. In one embodiment, the plate structure (342) may support other components included in the electronic device (300). For example, at least one of a display (330), a printed circuit board (350), a rear case (360), and a battery (370) may be disposed on the plate structure (342). For example, the plate structure (342) may have the display (330) coupled to one side (e.g., a side facing the +Z-axis direction) and the printed circuit board (350) coupled to the opposite side (e.g., a side facing the -Z-axis direction).

[0053] In one embodiment, the side frame (341) may be utilized as an antenna radiator. For example, a portion of the side frame (341) may be utilized to transmit and receive signals in the WIFI 6E (5925-7125 MHz) band. Additional information regarding the utilization of the side frame (341) as an antenna radiator may be provided through FIG. 4.

[0054] The rear case (360) may be positioned between the rear plate (380) and the plate structure (342). The rear case (360) may be coupled to the side member (340) so as to overlap at least a portion of the printed circuit board (350). For example, the rear case (360) may face the plate structure (342) with the printed circuit board (350) interposed therebetween.

[0055] A printed circuit board (350) may be equipped with a processor (e.g., processor (1420) of FIG. 14), memory (e.g., memory (1430) of FIG. 10), and / or an interface (e.g., interface (1477) of FIG. 14). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (300) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0056] A battery (370) (e.g., battery (1489) of FIG. 14) may power at least one component of the electronic device (300). For example, the battery (370) may include a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (370) may be disposed substantially flush with the printed circuit board (350). The battery (370) may be integrally disposed within the electronic device (300), or may be disposed detachably from the electronic device (300).

[0057] The first camera module (305) may be positioned on at least a portion of the side member (340) (e.g., the plate structure (342)) such that the lens may receive external light through a portion of the front plate (320) (e.g., the front surface (310A) of FIG. 1). For example, the lens of the first camera module (305) may be visually exposed through a portion of the front plate (320). The display (330) may be formed with a camera area (337) (e.g., an aperture area or a light-transmitting area) corresponding to the first camera module (305).

[0058] The second camera module (312) may be disposed on the printed circuit board (350) such that the lens can receive external light through the camera area (384) of the rear plate (380) of the electronic device (300) (e.g., the rear surface (310B) of FIG. 2). For example, the lens of the second camera module (312) may be visually exposed to the camera area (384). In one embodiment, the second camera module (312) may be disposed in at least a portion of an internal space formed in a housing of the electronic device (300) (e.g., the housing (310) of FIGS. 1 and 2) and may be electrically connected to the printed circuit board (350) via a connecting member (e.g., a connector).

[0059] The camera area (384) may be formed on a surface of the rear plate (380) (e.g., the rear surface (310B) of FIG. 2). In one embodiment, the camera area (384) may be formed to be at least partially transparent so that external light may be incident on the lens of the second camera module (312). In one embodiment, at least a portion of the camera area (384) may protrude from the surface of the rear plate (380) by a predetermined height. However, the present invention is not limited thereto, and the camera area (384) may also form a substantially flat surface with the surface of the rear plate (380).

[0060]

[0061] Fig. 4 illustrates the arrangement of the first antenna and the second antenna according to one embodiment. Fig. 4 is exemplary and is not limiting.

[0062] Referring to FIG. 4, an electronic device (401) (e.g., the electronic device (300) of FIGS. 1 to 3) may include a first antenna (410) and a second antenna (420) that operate independently of each other.

[0063] The first antenna (410) can transmit and receive wireless communication signals of a designated band by using a part of the side frame (341) (hereinafter, the first radiator) (411). For example, the first antenna (410) can transmit and receive signals of the WIFI 6E (5925~7125MHz) band.

[0064] According to one embodiment, the first antenna (410) and the second antenna (420) may be connected to and operate with different communication modules (or communication circuits) mounted on a printed circuit board (e.g., printed circuit board (350) of FIG. 3) within the electronic device (401). Alternatively, the first antenna (410) and the second antenna (420) may be connected to and operate with one communication module (or communication circuit) mounted on a printed circuit board (e.g., printed circuit board (350) of FIG. 3) within the electronic device (401).

[0065] The first radiator (411) may form a portion where a first side (short side) (e.g., upper and lower sides) and a second side (long side) (e.g., left and right sides) of the electronic device (401) meet. The first radiator (411) may include a first portion (411a) and a second portion (411b). The first portion may form a portion of the first side (short side) (e.g., upper side) of the electronic device (401). The second portion may form a portion of the second side (long side) (e.g., right side). The first radiator (411) may be rounded in a curved shape in a region where the first portion (411a) and the second portion (411b) meet. The shape of the first radiator (411) is exemplary and is not limited thereto.

[0066] A first gap (or first segment) (G1) and a second gap (or second segment) may be arranged at both ends of the first radiator (411). A non-conductive member (not shown) may be arranged in each of the first gap (G1) and the second gap (G2). The non-conductive member may separate the first radiator (411) from the remainder of the side frame (341).

[0067] The second antenna (420) may include a chip antenna and may transmit and receive wireless communication signals of a designated band. For example, the second antenna (420) may transmit and receive signals of UWB (Ultra Wide-Band) (5ch: 6250~6750MHz, 9ch: 7750~8250MHz) that use a relatively wide frequency band (500MHz) as one channel.

[0068] According to one embodiment, the second antenna (420) may include a slit (or pattern) (580) arranged in a designated direction. Depending on the arrangement of the slit (580), the radiation pattern of the second antenna (420) may vary. The first antenna (410) and the second antenna (420) may be arranged at a close distance from each other. If the first antenna (410) and the second antenna (420) have partially the same frequency band, signal interference may occur. The slit (580) may be arranged in a direction that can reduce signal interference between the first antenna (410) and the second antenna (420). The slit (580) may be arranged to face between the first part (411a) of the first radiator (411) and the second part (411b) of the first radiator (411).

[0069] For example, the slit (580) may not be arranged parallel to the X-axis or the Y-axis, but may form a specified angle. The longitudinal direction of the slit (580) may be a direction facing between the first part (411a) and the second part (411b). The longitudinal direction of the slit (580) may be a direction facing the curved part of the side frame (341). Information regarding the arrangement of the slit (580) and the radiation characteristics of the second antenna (420) may be provided through the drawings below.

[0070]

[0071] Fig. 5 illustrates a second antenna in the form of a chip antenna according to one embodiment. Fig. 5 is exemplary and is not limiting.

[0072] Referring to FIG. 5, the second antenna (420) may include a pattern portion (505) and a feeding portion (510). The second antenna (420) may be implemented as a patch antenna in the form of a chip antenna.

[0073] The pattern unit (505) can operate as a radiator that transmits and receives wireless communication signals in a designated band. The pattern unit (505) can be composed of multiple layers. Additional information regarding the multiple layers constituting the pattern unit (505) can be provided through FIGS. 6 and 7.

[0074] A patch layer (or conductive patch, pattern layer, first layer) (520) may be placed on the top (top in the -Z direction) of the pattern portion (505). The patch layer (520) may transmit and receive wireless communication signals with the outside.

[0075] According to one embodiment, the patch layer (520) may have a square shape, and the length of one side of the patch layer (520) may be determined according to the wavelength of the wireless communication signal transmitted and received by the second antenna (420).

[0076] In general, the resonant length L of the antenna (e.g., the length of one side of the patch layer (520)) can be determined by the following [Mathematical Formula 1] by considering the relative permittivity of the dielectric substrate.

[0077] [Mathematical Formula 1]

[0078]

[0079] Here, "λ" means wavelength, and "ε" means r " means the dielectric constant of the dielectric layer placed below the patch layer (520).

[0080] The wavelength according to frequency can be determined by [Mathematical Formula 2].

[0081] [Equation 2]

[0082]

[0083]

[0084] For example, the wavelength at a frequency of 6.5 GHz can be determined as follows:

[0085]

[0086] The wavelength at other frequencies can be determined as follows:

[0087]

[0088]

[0089]

[0090] If the general PCB material is FR4(ε r = 4.2) when making a 2.4 GHz square patch antenna, the length of one side of the patch layer (520) can be calculated as follows.

[0091]

[0092]

[0093] If the dielectric layer is composed of a material with a high dielectric constant, the size of the patch layer (520) can be reduced. For example, ε r If =40, the size of the patch layer (520) can be calculated as follows.

[0094]

[0095]

[0096]

[0097] As the dielectric constant increases, the size of the patch layer (520) can be reduced, and it can be easy to implement the second antenna (420) as a chip antenna.

[0098] According to one embodiment, the pattern portion (505) may include a first expansion region (or a first group of connecting members) (521) and a second expansion region (or a second group of connecting members) (522). The patch layer (520) is square, and when the first expansion region (521) and the second expansion region (522) are coupled to the patch layer (520), the second antenna (420) may have two different resonant frequencies. When the second antenna (420) is implemented as a square-shaped chip antenna, the first expansion region (521) and the second expansion region (522) may perform a function of expanding the patch layer (520). The first expansion region (521) and the second expansion region (522) may each be configured with a via and a pattern.

[0099] The first expansion region (521) and the second expansion region (522) may be positioned at vertices of the patch layer (520) and may be positioned diagonally from each other. For example, the first expansion region (521) may be positioned at a vertex where the first side and the second side meet, and the second expansion region (522) may be positioned at a vertex where the third side and the fourth side meet.

[0100] According to one embodiment, the patch layer (520) may include a slit (580). In FIG. 5, one slit (580) is included in the patch layer (520), but this is not limiting. For example, there may be multiple slits (580). In this case, the multiple slits may be arranged to be parallel to each other.

[0101] The slit (580) may be arranged such that its length direction is not parallel to each side of the patch layer (520) and forms a specified angle. If the arrangement direction of the slit (580) is changed, the radiation characteristics of the second antenna (420) may change. Additional information regarding the radiation characteristics according to the arrangement of the slit (580) may be provided through the drawings below.

[0102] In one embodiment, the pattern portion (505) may include separate patterns, slots, and air regions for tuning or optimization. For example, the air region may be formed in the patch layer (520) and may be used to adjust the bandwidth.

[0103] According to one embodiment, one end of the feeding part (520) may be introduced into the center of one side of the pattern part (505). The feeding part (520) may be connected to a feeding pad (515) arranged on a different layer from the patch layer (520). The other end of the feeding part (520) may be connected to a feeding point of a printed circuit board (printed circuit board (350) of FIG. 2). The feeding part (520) may supply current to the pattern part (505) in a coupling manner. In the case of the coupling manner, the shape of the patch or slit can be easily changed, and the degree of freedom for adjusting the band characteristics or coupling characteristics can be high. In FIG. 5, the feeding using the coupling manner is illustrated as an example, but is not limited thereto. For example, the feeding manner may be one of coupling, EM coupled, slot coupled, line, and coaxial.

[0104] According to one embodiment, the power supply unit (520) may be fixed to a printed circuit board (e.g., printed circuit board (350) of FIG. 3) via a fixing unit (e.g., via) (511).

[0105]

[0106] Figures 6 and 7 illustrate multiple layers of a second antenna according to one embodiment.

[0107] Referring to FIGS. 6 and 7, the second antenna (420) may include a pattern portion (505) and a feed portion (510). The second antenna (420) may be implemented as a patch antenna in the form of a chip antenna. The pattern portion (505) may include a plurality of layers. The pattern portion (505) may include a patch layer (520), a dielectric layer (525), and a base layer (530).

[0108] The patch layer (520) may be arranged at the top (top in the -Z direction) of the pattern portion (505). The patch layer (520) may transmit and receive wireless communication signals to and from the outside. The patch layer (520) is square and may be coupled to a first expansion region (521) and a second expansion region (522). The first expansion region (521) and the second expansion region (522) may extend the patch layer (520) to allow the second antenna (420) to operate at two resonant frequencies.

[0109] The patch layer (520) may include a slit (580). The slit (580) may be arranged so that its length direction is not parallel to each side of the patch layer (520) and forms a specified angle. If the arrangement direction of the slit (580) is changed, the radiation characteristics of the second antenna (420) may change.

[0110] A dielectric layer (525) may be disposed between the patch layer (520) and the base layer (530). The dielectric layer (525) may have a specified permittivity and may affect the wavelength of a wireless communication signal transmitted and received by the patch layer (520).

[0111] The base layer (530) may be disposed at the lowermost portion (the lowermost portion in the -Z direction) of the pattern portion (505). The base layer (530) may include a power supply pad (or first plate) (515) and a ground area (or second plate) (535). The power supply pad (515) may be connected to the power supply portion (510). The power supply portion (510) may supply current to the patch layer (520) in a coupling manner through the power supply pad (515). The power supply pad (515) may be disposed at the center of one side of the pattern portion (505). The ground area (535) may be connected to a ground point of a printed circuit board (printed circuit board (350) of FIG. 3).

[0112]

[0113] Fig. 8 is a graph showing a comparison of the radiation performance of an antenna according to the arrangement direction of slits according to one embodiment.

[0114] Referring to FIGS. 5 and 8, the second antenna (420) may include a slit (580). The radiation characteristics of the second antenna (420) may vary depending on the arrangement direction of the slit (580).

[0115] The first graph (801) represents the change in the S parameter value according to the arrangement direction of the slit (580). In the first arrangement form (810) in which the slit (580) is arranged parallel to the X-axis, the S parameter value may be -18 dB at 6.5 GHz and -12 dB at 8 GHz. On the other hand, in the second arrangement form (820) in which the slit (580) is not arranged parallel to the X-axis but forms a specified angle (e.g., 45 degrees), the S parameter value may be -27 dB at 6.5 GHz and -20 dB at 8 GHz.

[0116] The second graph (802) shows the change in wireless communication efficiency according to the arrangement direction of the slit (580). In the first arrangement form (810) in which the slit (580) is arranged parallel to the X-axis, the overall efficiency of the antenna may be -2.92 dB at 6.5 GHz and -2.57 dB at 8 GHz. In the second arrangement form (820) in which the slit (580) is not arranged parallel to the X-axis but forms a specified angle (e.g., 45 degrees), the overall efficiency of the antenna may be -3 dB at 6.5 GHz and -2.2 dB at 8 GHz.

[0117] In the first graph (801) and the second graph (802), the S parameter value and the overall efficiency of the antenna may not differ significantly between the first arrangement form (810) and the second arrangement form (820). Accordingly, the second arrangement form (820) in which the slit (580) is not arranged parallel to the X-axis but forms a designated angle (e.g., 45 degrees) may be a form suitable for transmitting and receiving UWB (Ultra Wide-Band) (e.g., 5ch: 6250~6750MHz, 9ch: 7750~8250MHz) signals while reducing interference with the WIFI 6E (5925~7125MHz) band signal of the first antenna (410).

[0118]

[0119] Figure 9 shows a radiation pattern of a second antenna according to one embodiment.

[0120] Referring to FIGS. 4 and 9, the electronic device (401) may include a first antenna (410) and a second antenna (420).

[0121] The first antenna (410) can transmit and receive wireless communication signals of a designated band using the first radiator (411). For example, the first antenna (410) can transmit and receive signals of the WIFI 6E (5925~7125MHz) band. The first radiator (411) can form a portion where the first side (short side) (e.g., the upper side) and the second side (long side) (e.g., the right side) of the electronic device (401) meet.

[0122] The second antenna (420) may be a chip antenna and may transmit and receive wireless communication signals of a designated band. For example, the second antenna (420) may transmit and receive signals of UWB (Ultra Wide-Band) (5ch: 6250~6750MHz, 9ch: 7750~8250MHz) that use a relatively wide frequency band (500MHz) as one channel.

[0123] The second antenna (420) may be positioned adjacent to the first radiator (411) of the first antenna (410). The second antenna (420) may include a slit (580) having a specified angle with the X-axis or the Y-axis. For example, the longitudinal direction of the slit (580) may be in the A direction, which forms an angle of 135 degrees with the X-axis and an angle of 45 degrees with the Y-axis.

[0124] When the second antenna (420) operates, the radiation pattern of the second antenna (420) can be formed in the direction B, which is perpendicular to the direction A. In this case, the second antenna (420) can secure an isolation distance equal to the distance C from the radiator (411) of the first antenna (410).

[0125] According to one embodiment, when the longitudinal direction of the slit (580) is changed, the radiation pattern may also be changed. For example, as the angle between the longitudinal direction of the slit (580) and the X-axis (the angle formed between the longitudinal direction of the slit (580) and the first side (short side) (e.g., the upper side) of the electronic device (401)) increases, the radiation pattern of the second antenna (420) may also be rotated to form a 90-degree angle with respect to the longitudinal direction of the slit (580).

[0126]

[0127] Figures 10 to 12 show changes in radiation patterns according to changes in the shape of the first radiator of the first antenna.

[0128] Referring to FIG. 10, the electronic device (1001) may include a first antenna (1010) and a second antenna (1020).

[0129] The first antenna (1010) can transmit and receive signals in the WIFI 6E (5925-7125 MHz) band, for example, by using a first radiator (1010a) that is part of a side frame of the electronic device (1001). The first radiator (1010a) of the first antenna (1010) can form a point where a first side (e.g., upper side) and a second side (right side) among the side surfaces of the electronic device (1001) meet.

[0130] A first radiator (1010a) of a first antenna (1010) may include a first portion and a second portion. The first portion may have a first length (LT0), and the second portion may have a second length (LS0).

[0131] The second antenna (1020) may include a chip antenna and may transmit and receive wireless communication signals of a designated band. For example, the second antenna (1020) may transmit and receive signals of UWB (Ultra Wide-Band) (5 channels: 6250 to 6750 MHz, 9 channels: 7750 to 8250 MHz) that use a relatively wide frequency band (500 MHz) as one channel.

[0132] The second antenna (1020) may be positioned adjacent to the first radiator (1010a) of the first antenna (1010). The second antenna (1020) may include a slit (1080) having a specified angle with respect to the X-axis or the Y-axis.

[0133] Referring to FIG. 11, the electronic device (1101) may include a first antenna (1110) and a second antenna (1120).

[0134] The first antenna (1110) can transmit and receive signals in the WIFI 6E (5925-7125 MHz) band, for example, by using a first radiator (1110a) that is part of a side frame of the electronic device (1101). The first radiator (1110a) of the first antenna (1110) can form a point where a first side (e.g., upper side) and a second side (right side) among the side surfaces of the electronic device (1101) meet.

[0135] The first radiator (1110a) of the first antenna (1110) may include a first portion and a second portion. The first portion may have a first length (LT1), and the second portion may have a second length (LS1). Compared to FIG. 10, the first length (LT1) may be longer than the first length (LT0) of FIG. 10, and the second length (LS1) may be shorter than the second length (LS0) of FIG. 10.

[0136] The second antenna (1120) may be a chip antenna and may transmit and receive wireless communication signals of a designated band. For example, the second antenna (1120) may transmit and receive signals of UWB (Ultra Wide-Band) (5 channels: 6250 to 6750 MHz, 9 channels: 7750 to 8250 MHz) that use a relatively wide frequency band (500 MHz) as one channel.

[0137] The second antenna (1120) may be positioned adjacent to the first radiator (1110a) of the first antenna (1110). The second antenna (1120) may include a slit (1180) having a specified angle with respect to the X-axis or the Y-axis.

[0138] Referring to FIG. 12, the electronic device (1201) may include a first antenna (1210) and a second antenna (1220).

[0139] The first antenna (1210) can transmit and receive signals in the WIFI 6E (5925-7125 MHz) band, for example, by using a first radiator (1210a) that is part of a side frame of the electronic device (1201). The first radiator (1210a) of the first antenna (1210) can form a point where a first side (e.g., upper side) and a second side (right side) among the side surfaces of the electronic device (1201) meet.

[0140] The first radiator (1210a) of the first antenna (1210) may include a first portion and a second portion. The first portion may have a first length (LT2), and the second portion may have a second length (LS2). Compared to FIG. 10, the first length (LT2) may be shorter than the first length (LT0) of FIG. 10, and the second length (LS2) may be longer than the second length (LS0) of FIG. 10.

[0141] The second antenna (1220) may be a chip antenna and may transmit and receive wireless communication signals of a designated band. For example, the second antenna (1220) may transmit and receive signals of UWB (Ultra Wide-Band) (5 channels: 6250 to 6750 MHz, 9 channels: 7750 to 8250 MHz) that use a relatively wide frequency band (500 MHz) as one channel.

[0142] The second antenna (1220) may be positioned adjacent to the first radiator (1210a) of the first antenna (1210). The second antenna (1220) may include a slit (1280) having a specified angle with respect to the X-axis or the Y-axis.

[0143]

[0144] FIG. 13 is a graph of the S parameter regarding the influence of the second antenna on the first antenna according to one embodiment.

[0145] Referring to FIGS. 4, 10, 11, 12, and 13, the first graph (1310) may be an S parameter value in an arrangement form (electronic device (401) of FIG. 4, electronic device (1001) of FIG. 10) in which the slit (580) is not arranged parallel to the X-axis or the Y-axis, but forms a designated angle (e.g., 45 degrees). For example, the S parameter value may be -27 dB at 6.5 GHz and -20 dB at 8 GHz.

[0146] The second to fifth graphs (1320 to 1350) illustrate the influence of the first antenna on the second antenna. Port 1 for measuring the S parameter may be the feed of the first antenna, and port 2 may be the feed of the second antenna.

[0147] In the second graph (1320), in a configuration where the slits of the pattern layer are arranged parallel to the X-axis, approximately -40 dB of radiant energy can be transmitted from the first antenna to the second antenna. Accordingly, signal interference can be relatively large.

[0148] In the third graph (1330) (in the case of FIG. 4 and FIG. 10), in a configuration where the slits (580 in FIG. 4 and 1080 in FIG. 10) are not arranged parallel to the X-axis or the Y-axis, but form a designated angle (e.g., 45 degrees), about -64 dB of radiated energy can be transmitted from the first antenna (410, 1010) to the second antenna (420, 1020). Compared to the second graph (1320), there is an attenuation effect of about -24 dB. The WiFi signal of the first antenna (410, 1010) with high antenna signal strength may affect the UWB signal of the second antenna (420, 1020), but due to the attenuation effect, the stability of the UWB signal of the second antenna (420, 1020) can be increased even under conditions of simultaneous radiation of the first antenna (410, 1010) and the second antenna (420, 1020).

[0149] In the fourth graph (1340) (in the case of FIG. 11) and the fifth graph (1350) (in the case of FIG. 12), there is a similar attenuation effect as in the third graph (1330) (in the case of FIG. 4 and FIG. 10), and the length of the first radiator of the first antenna can be changed for tuning or optimization.

[0150] FIG. 14 is a block diagram of an electronic device (1401) within a network environment (1400), according to various embodiments.

[0151] Referring to FIG. 14, in a network environment (1400), an electronic device (1401) may communicate with an electronic device (1402) via a first network (1498) (e.g., a short-range wireless communication network), or may communicate with an electronic device (1404) or a server (1408) via a second network (1499) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (1401) may communicate with the electronic device (1404) via the server (1408). According to one embodiment, the electronic device (1401) may include a processor (1420), a memory (1430), an input module (1450), an audio output module (1455), a display module (1460), an audio module (1470), a sensor module (1476), an interface (1477), a connection terminal (1478), a haptic module (1479), a camera module (1480), a power management module (1488), a battery (1489), a communication module (1490), a subscriber identification module (1496), or an antenna module (1497). In some embodiments, the electronic device (1401) may omit at least one of these components (e.g., the connection terminal (1478)), or may have one or more other components added. In some embodiments, some of these components (e.g., sensor module (1476), camera module (1480), or antenna module (1497)) may be integrated into a single component (e.g., display module (1460)).

[0152] The processor (1420) may, for example, execute software (e.g., a program (1440)) to control at least one other component (e.g., a hardware or software component) of the electronic device (1401) connected to the processor (1420) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (1420) may store commands or data received from other components (e.g., a sensor module (1476) or a communication module (1490)) in a volatile memory (1432), process the commands or data stored in the volatile memory (1432), and store result data in a non-volatile memory (1434). According to one embodiment, the processor (1420) may include a main processor (1421) (e.g., a central processing unit or an application processor) or an auxiliary processor (1423) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (1421). For example, when the electronic device (1401) includes the main processor (1421) and the auxiliary processor (1423), the auxiliary processor (1423) may be configured to use less power than the main processor (1421) or to be specialized for a given function. The auxiliary processor (1423) may be implemented separately from the main processor (1421) or as a part thereof.

[0153] The auxiliary processor (1423) may control at least a portion of functions or states associated with at least one component (e.g., the display module (1460), the sensor module (1476), or the communication module (1490)) of the electronic device (1401), for example, on behalf of the main processor (1421) while the main processor (1421) is in an inactive (e.g., sleep) state, or together with the main processor (1421) while the main processor (1421) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (1423) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (1480) or a communication module (1490)). In one embodiment, the auxiliary processor (1423) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (1401) where the artificial intelligence is performed, or can be performed through a separate server (e.g., server (1408)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0154] The memory (1430) can store various data used by at least one component (e.g., the processor (1420) or the sensor module (1476)) of the electronic device (1401). The data can include, for example, software (e.g., the program (1440)) and input data or output data for commands related thereto. The memory (1430) can include volatile memory (1432) or non-volatile memory (1434).

[0155] The program (1440) may be stored as software in memory (1430) and may include, for example, an operating system (1442), middleware (1444), or an application (1446).

[0156] The input module (1450) can receive commands or data to be used in a component of the electronic device (1401) (e.g., a processor (1420)) from an external source (e.g., a user) of the electronic device (1401). The input module (1450) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0157] The audio output module (1455) can output audio signals to the outside of the electronic device (1401). The audio output module (1455) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0158] The display module (1460) can visually provide information to an external party (e.g., a user) of the electronic device (1401). The display module (1460) may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling the device. In one embodiment, the display module (1460) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0159] The audio module (1470) can convert sound into an electrical signal, or vice versa. According to one embodiment, the audio module (1470) can acquire sound through the input module (1450), output sound through the sound output module (1455), or an external electronic device (e.g., electronic device (1402)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (1401).

[0160] The sensor module (1476) can detect the operating status (e.g., power or temperature) of the electronic device (1401) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (1476) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0161] The interface (1477) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (1401) with an external electronic device (e.g., the electronic device (1402)). In one embodiment, the interface (1477) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0162] The connection terminal (1478) may include a connector through which the electronic device (1401) may be physically connected to an external electronic device (e.g., the electronic device (1402)). In one embodiment, the connection terminal (1478) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0163] The haptic module (1479) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (1479) may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0164] The camera module (1480) can capture still images and videos. In one embodiment, the camera module (1480) may include one or more lenses, image sensors, image signal processors, or flashes.

[0165] The power management module (1488) can manage the power supplied to the electronic device (1401). According to one embodiment, the power management module (1488) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0166] A battery (1489) may power at least one component of the electronic device (1401). In one embodiment, the battery (1489) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0167] The communication module (1490) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (1401) and an external electronic device (e.g., electronic device (1402), electronic device (1404), or server (1408)), and the performance of communication through the established communication channel. The communication module (1490) may operate independently from the processor (1420) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (1490) may include a wireless communication module (1492) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (1494) (e.g., a local area network (LAN) communication module, or a power line communication module). Any of these communication modules may communicate with an external electronic device (1404) via a first network (1498) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (1499) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a local area network or a wide area network)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (1492) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (1496) to verify or authenticate the electronic device (1401) within a communication network such as the first network (1498) or the second network (1499).

[0168] The wireless communication module (1492) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimizing terminal power and connecting multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency communications (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (1492) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (1492) may support various technologies for securing performance in high-frequency bands, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (1492) may support various requirements specified in the electronic device (1401), an external electronic device (e.g., the electronic device (1404)), or a network system (e.g., the second network (1499)). According to one embodiment, the wireless communication module (1492) may support a peak data rate (e.g., 20 Gbps or more) for eMBB implementation, a loss coverage (e.g., 164 dB or less) for mMTC implementation, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC implementation.

[0169] The antenna module (1497) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (1497) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (1497) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (1498) or the second network (1499), may be selected from the plurality of antennas by, for example, the communication module (1490). A signal or power may be transmitted or received between the communication module (1490) and the external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (1497).

[0170] According to various embodiments, the antenna module (1497) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0171] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0172] According to one embodiment, commands or data may be transmitted or received between the electronic device (1401) and an external electronic device (1404) via a server (1408) connected to a second network (1499). Each of the external electronic devices (1402 or 1404) may be the same or a different type of device as the electronic device (1401). According to one embodiment, all or part of the operations executed in the electronic device (1401) may be executed in one or more of the external electronic devices (1402, 1404, or 1408). For example, when the electronic device (1401) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (1401) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (1401). The electronic device (1401) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (1401) may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (1404) may include an Internet of Things (IoT) device. The server (1408) may be an intelligent server utilizing machine learning and / or a neural network.According to one embodiment, an external electronic device (1404) or server (1408) may be included within the second network (1499). The electronic device (1401) may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technology.

[0173] An electronic device according to one embodiment may include a housing, a display, a conductive frame forming a side surface of the housing, a first antenna for performing wireless communication using at least a portion of the conductive frame, a second antenna disposed adjacent to the first antenna within the electronic device, and a communication module for transmitting and receiving a wireless signal through the first antenna or the second antenna. The at least a portion of the conductive frame may include a first portion and a second portion disposed in different directions. The second antenna may include a slit. A longitudinal direction of the slit may be a direction facing between the first portion and the second portion.

[0174] According to one embodiment, the second antenna may include a first layer which is a conductive patch including the slit, a second layer to which a feed portion or a ground portion is connected, and a dielectric layer between the first layer and the second layer.

[0175] In one embodiment, the power supply unit can supply power to the conductive patch by a coupling method.

[0176] In one embodiment, the second layer may include a first plate to which the power supply is connected and a second plate to which the ground is connected. The first plate and the second plate may be spaced apart from each other by a specified interval.

[0177] In one embodiment, the conductive patch can be connected to the connecting members of the first group and the connecting members of the second group.

[0178] In one embodiment, the first layer may be rectangular. The connecting members of the first group may be arranged around the first vertex of the first layer. The connecting members of the second group may be arranged around the second vertex of the first layer.

[0179] According to one embodiment, the first vertex and the second vertex may be arranged diagonally.

[0180] In one embodiment, the second layer may have a square shape. The second plate may be positioned at the center of one side of the second layer.

[0181] In one embodiment, the challenging patch may have a square shape.

[0182] In one embodiment, the slit may be positioned so as to face a vertex of the square shape.

[0183] In one embodiment, the second antenna may be a chip antenna.

[0184] In one embodiment, the first portion and the second portion may have the same length.

[0185] In one embodiment, the slit may be arranged at a 45 degree angle with the first portion or the second portion.

[0186] In one embodiment, the first portion and the second portion may have different lengths.

[0187] In one embodiment, the slit may be positioned to form a smaller angle with the longer portion of the first portion or the second portion.

[0188] In one embodiment, the slit may be positioned so as to face between the first portion and the second portion.

[0189] According to one embodiment, the radiating surface of the second antenna may be arranged to face the rear case of the electronic device.

[0190] In one embodiment, the slit may include a plurality of slits.

[0191] According to one embodiment, the plurality of slits may be arranged parallel to each other.

[0192] According to one embodiment, the first antenna can transmit and receive signals of WIFI communication. The second antenna can transmit and receive signals of UWB (Ultra Wide-Band) communication.

[0193] In electronic devices, interference of wireless communication signals can occur when multiple antennas with overlapping frequency bands operate simultaneously. Within electronic devices with limited mounting space, signal interference can occur when two antennas are placed adjacent to each other in an area where their frequency bands overlap.

[0194] An electronic device according to one embodiment disclosed in this document can increase the isolation of two antennas in a section where frequency bands overlap by changing the arrangement direction of slits of patch antennas.

[0195] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0196] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0197] Various embodiments of the present document may be implemented as software (e.g., program (10)) including one or more instructions stored in a storage medium (e.g., built-in memory (1436) or external memory (138)) readable by a machine (e.g., electronic device (1401)). For example, a processor (e.g., processor (1420)) of the machine (e.g., electronic device (1401)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0198] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a commodity between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0199] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices (300, 401, 1001, 1101, 1201, 1401), Housing (310); display(301, 1460); A conductive frame (341) forming a side surface of the above housing (310); A first antenna (410, 1010, 1110, 1210) that performs wireless communication using at least a part of the above challenging frame (341); A second antenna (420, 1020, 1120, 1220) positioned adjacent to the first antenna (410, 1010, 1110, 1210) within the electronic device; and A communication module (1490) for transmitting and receiving a wireless signal through the first antenna (410, 1010, 1110, 1210) or the second antenna (420, 1020, 1120, 1220) is included; At least a portion of the above challenging frame (341) comprising a first part and a second part arranged in different directions; The above second antenna (420, 1020, 1120, 1220) is Contains slits (580, 1080, 1180, 1280), An electronic device (300, 401, 1001, 1101, 1201, 1401), characterized in that the longitudinal direction of the slit is a direction directed between the first part and the second part.

2. In the first paragraph, the second antenna (420, 1020, 1120, 1220) A first layer (520) which is a challenging patch including the above slits (580, 1080, 1180, 1280); A second layer (530) to which a power supply or grounding part is connected; and An electronic device (300, 401, 1001, 1101, 1201, 1401) comprising a dielectric layer between the first layer (520) and the second layer (530).

3. In the second paragraph, the power supply unit An electronic device (300, 401, 1001, 1101, 1201, 1401) for supplying power to the above-mentioned challenging patch by means of a coupling method.

4. In the second paragraph, the second layer (530) It includes a first plate to which the above power supply part is connected and a second plate to which the above ground part is connected, An electronic device (300, 401, 1001, 1101, 1201, 1401) in which the first plate and the second plate are spaced apart from each other by a specified interval.

5. In the fourth paragraph, the challenging patch An electronic device (300, 401, 1001, 1101, 1201, 1401) connected to the connecting members of the first group and the connecting members of the second group.

6. In the fifth paragraph, the first layer (520) It is square in shape, The connecting members of the first group are arranged around the first vertex of the first layer (520), Electronic devices (300, 401, 1001, 1101, 1201, 1401) in which the connecting members of the second group are arranged centered on the second vertex of the first layer (520).

7. In the fourth paragraph, the second layer (530) It is square in shape, The above second plate An electronic device (300, 401, 1001, 1101, 1201, 1401) positioned at the center of one side of the second layer (530).

8. In the second paragraph, the challenging patch It has a square shape, The above slits (580, 1080, 1180, 1280) Electronic devices (300, 401, 1001, 1101, 1201, 1401) arranged so as to face the corners of the above square shape.

9. In any one of clauses 1 to 8, the second antenna (420, 1020, 1120, 1220) An electronic device that is a chip antenna.

10. In any one of paragraphs 1 to 9, the first part and the second part Electronic devices having the same length (300, 401, 1001, 1101, 1201, 1401).

11. In the 10th paragraph, the slit (580, 1080, 1180, 1280) An electronic device (300, 401, 1001, 1101, 1201, 1401) arranged so as to have a 45 degree angle with the first part or the second part.

12. In any one of paragraphs 1 to 11, the first part and the second part Electronic devices having different lengths (300, 401, 1001, 1101, 1201, 1401).

13. In the 12th paragraph, the slit (580, 1080, 1180, 1280) An electronic device (300, 401, 1001, 1101, 1201, 1401) arranged to form a smaller angle with the longer portion of the first portion or the second portion.

14. In any one of clauses 1 to 13, the slit (580, 1080, 1180, 1280) An electronic device (300, 401, 1001, 1101, 1201, 1401) positioned so as to face between the first and second parts.

15. In any one of clauses 1 to 14, the radiating surface of the second antenna (420, 1020, 1120, 1220) An electronic device (300, 401, 1001, 1101, 1201, 1401) arranged to face the rear case of the electronic device.

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