Current carrying device and PCB device

Abstract

The present application discloses a current carrying device (10) and a PCB device. The current carrying device (10) is applied to a PCB (100), and comprises: a cable assembly (200), the cable assembly (200) comprising a plurality of cables (210) arranged side by side and insulated from each other, and the cable assembly (200) being arranged above the PCB (100); and two adapter assemblies (300) that are respectively connected to two ends of the cable assembly (200), two ends of the plurality of cables (210) being both connected to the corresponding adapter assemblies (300), and the two adapter assemblies (300) being used for connecting the cables (210) to the PCB (100).

Description

Flow device and PCB device

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Chinese patent application No. 202311434331.1 filed on October 31, 2023, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] The present disclosure relates to the technical field of electronic components, and in particular to a flow-through device and a PCB device. Background Art

[0004] A printed circuit board (PCB), also known as a printed circuit board, is an important electronic component that supports and connects electronic components. Because it is manufactured using electronic printing technology, it is called a "printed" circuit board.

[0005] When a PCB encounters a situation where the power supply current is too large to meet the requirements, the only way to meet the current requirements is to increase the number of PCB layers. However, increasing the number of PCB layers is costly, and some PCBs cannot have an unlimited number of layers due to thickness limitations.

[0006] Summary of the Invention

[0007] The present disclosure provides a flow-through device for a PCB board. The flow-through device includes: a cable assembly, the cable assembly including multiple cables arranged side by side and insulated from each other, and the cable assembly is arranged above the PCB board; two adapter assemblies, the two adapter assemblies are respectively connected to the two ends of the cable assembly, and the two ends of the multiple cables are connected to the corresponding adapter assemblies. The two adapter assemblies are used to connect the cable assembly to the PCB board.

[0008] The present disclosure also provides a PCB device, comprising a PCB board and the above-mentioned flow-through device; wherein the PCB board comprises a laminated structure stacked along a preset direction, the laminated structure having a layout surface facing the preset direction; the laminated structure comprises a power layer, the layout surface being provided with a power copper foil connected to the power layer; the laminated structure further comprises a ground layer stacked on one side of the power layer, the layout surface being provided with a reference ground copper foil connected to the ground layer.

[0009] Other objects and features of the present disclosure will become clear by reading the specification, claims and drawings of this application. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The above and / or additional aspects and advantages of the present disclosure will become apparent and readily understood from the description of the embodiments with reference to the following drawings, in which:

[0011] FIG1 is a schematic structural diagram of a flow-through device according to an embodiment of the related art.

[0012] FIG2 is a schematic structural diagram of a flow-through device according to an embodiment of the present disclosure.

[0013] FIG. 3 is a top view of a flow-through device according to an embodiment of the present disclosure.

[0014] FIG4 is a top view of the connection between the adapter assembly and the cable assembly of the flow device according to an embodiment of the present disclosure.

[0015] FIG5 is an axial view of the connection between the adapter assembly and the cable assembly of the flow device according to an embodiment of the present disclosure.

[0016] FIG6 is a side view of the connection between the adapter assembly and the cable assembly of the flow device according to an embodiment of the present disclosure.

[0017] 7 is a bottom view of the connection between the adapter assembly and the cable assembly of the flow device according to an embodiment of the present disclosure.

[0018] FIG8 is a top view of a PCB board of a flow-through device according to an embodiment of the present disclosure.

[0019] FIG. 9 is a bottom view of an adapter assembly of a flow device according to an embodiment of the present disclosure.

[0020] Description of main component symbols:

[0021] 1. Flow device; 2. Flow strip; 3. PCB board;

[0022] 10. Flow-through device;

[0023] 100, PCB board; 110, layout surface; 120, connection hole; 130, power copper foil; 140, reference ground copper foil;

[0024] 200. Cable assembly; 210. Cable;

[0025] 300, adapter assembly;

[0026] 310. Housing; 311. First opening;

[0027] 320, first connecting structure; 321, protrusion;

[0028] 330. Second connecting structure; 331. Arc-shaped spring;

[0029] 340. Third connecting structure; 341. Connecting member; 342. Arc-shaped spring. DETAILED DESCRIPTION

[0030] The embodiments of the present disclosure are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present disclosure, and are not to be construed as limiting the present disclosure.

[0031] In the description of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present disclosure. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present disclosure, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0032] In the description of this disclosure, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections, electrical connections, or mutual communication; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this disclosure based on specific circumstances.

[0033] The disclosure below provides many different embodiments or examples for realizing different structures of the present disclosure. In order to simplify the disclosure of the present disclosure, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present disclosure. In addition, the present disclosure may repeat reference numbers and / or reference letters in different examples, and such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present disclosure provides examples of various specific processes and materials, but those of ordinary skill in the art will appreciate the application of other processes and / or the use of other materials.

[0034] Throughout this specification, reference to terms such as "one embodiment," "certain embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with an embodiment or example is included in at least one embodiment or example of the present disclosure. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0035] When a PCB encounters a situation where the power supply current is too high to meet the current requirement, the only option is to increase the number of PCB layers to meet the current requirement. However, increasing the number of PCB layers is costly, and some PCBs cannot be infinitely increased due to thickness limitations. Therefore, how to meet the current requirement without increasing the number of PCB layers is a pressing issue.

[0036] In order to solve the above technical problems, related technologies have proposed to set surface-mount auxiliary components on the surface of the PCB board to facilitate flow. The surface-mount auxiliary components can be structures such as flow blocks or flow bars.

[0037] Regarding the relative positional relationship between surface-mount auxiliary components such as flow blocks or flow strips and the PCB board, the flow strip is specifically explained below.

[0038] FIG1 is a structural schematic diagram of a flow-through device 1 for a PCB board 3 provided by the related art. Referring to FIG1 , the flow-through device 1 includes a flow-through bar 2, which is attached to the PCB board 3, so the flow-through bar 2 can be called a surface-mounted auxiliary component. During actual use of the flow-through device 1 shown in FIG1 , the flow-through bar 2 is fixedly connected to the surface copper foil of the PCB board 3. As for the fixed connection method between the two, it can be welding or screw connection, and other fixed connection methods can also be used. The flow-through bar 2 can pass through and relieve the flow pressure of the PCB board.

[0039] However, in the flow-through device 1 provided in the related art, the flow-through bar 2 is attached to the surface of the PCB board 3 , which occupies a large amount of surface space of the PCB board 3 and affects the layout of components on the surface of the PCB board 3 .

[0040] The operation of each chip on a PCB is inseparable from the function of the power network. With the increasing competition in the electronics market, the cost control requirements for PCB boards are also gradually increasing. The number of PCB layers is being reduced, and the space for power networks is becoming increasingly tight. As the operating current of chips continues to increase, the current flow through the PCB board has gradually become a major concern in power network design. While meeting the current flow requirements of the PCB board, how to fully utilize the space on and above the PCB surface to minimize power network losses during current transmission is also important.

[0041] To address the aforementioned issues in the related art, the present disclosure provides a current flow device 10 for a PCB 100. The current flow device 10 includes a cable assembly 200 and two adapter assemblies 300. The cable assembly 200 is used to carry current, thereby sharing some of the current on the PCB 100 and alleviating the current flow pressure on the PCB 100. Furthermore, the adapter assemblies 300 located at both ends of the cable assembly 200 connect the cable assembly 200 and the PCB 100, thereby meeting the current flow requirements of the PCB 100 without increasing the number of layers. Furthermore, since adapter assemblies 300 are provided at both ends of the cable assembly 200, the cable assembly 200 can be connected to the PCB board 100 without being attached to the layout surface 110 of the PCB board 100. That is, there is a distance between the cable assembly 200 and the layout surface 110 of the PCB board 100, thereby avoiding the cable assembly 200 affecting the arrangement of components on the layout surface 110 of the PCB board 100. When designing the PCB board 100, the space on the PCB surface and above can be fully utilized to reduce the loss of the power supply network when transmitting current, thereby solving the above-mentioned problems in the related art.

[0042] In order to better explain the embodiments and specific implementation methods of the present disclosure, the following description is made in combination with the accompanying drawings. It should be noted that the structures in the accompanying drawings are only schematic illustrations and do not specifically limit the structures in the present embodiment. Other structures derived therefrom are also within the scope of protection of the present disclosure. Figure 2 is a structural schematic diagram of the flow-through device 10 of the embodiment of the present disclosure. Figure 3 is a top view of the flow-through device 10 of the embodiment of the present disclosure. Referring to Figures 2 and 3, the flow-through device 10 includes a cable assembly 200 and two adapter assemblies 300. The PCB board 100 includes a laminated structure, and the laminated structure is stacked along a preset direction, wherein the preset direction can be the X direction in Figure 2. It should be noted that the preset direction can also be the opposite direction of the X direction.

[0043] It should be noted that the laminated structure can be understood as PCB board 100 comprising multiple layers of circuit boards stacked together. The multilayer circuit board includes at least three conductive layers, two of which are on the outer surface, and the remaining layer is integrated within an insulating plate. Electrical connections between these layers are typically achieved through plated through-holes (PTHs) in the cross-section of the circuit board. Unless otherwise specified, multilayer printed circuit boards, like double-sided boards, are generally plated through-hole boards. Multilayer circuit boards are manufactured by stacking two or more layers of circuits on top of each other, with reliable, pre-defined interconnections.

[0044] In some embodiments, the laminated structure may include a top layer, a power layer, a ground layer and a bottom layer stacked along a preset direction. Of course, the laminated structure may also include other layer structures. The number of layers of the top layer, power layer, ground layer and bottom layer may be 1 layer or 2 layers. The number of layers of the laminated structure and the specific layer structure are not limited here.

[0045] 2 and 3 , the laminated structure has a layout surface 110 facing a preset direction. Components of the PCB board 100 can be arranged on the layout surface 110 , where the layout surface 110 can also be understood as the surface layer of the PCB board 100 .

[0046] Referring to FIG3 , a cable assembly 200 may include a plurality of cables 210 , which are arranged side by side and insulated from each other. The plurality of cables 210 are sequentially arranged side by side along a direction of arrangement, which may be parallel to the layout surface 110 . In other words, the plurality of cables 210 are arranged side by side in a plane parallel to the layout surface 110 . It should be noted that the cable 210 includes a conductor and an insulating layer covering the conductor. The conductor may be made of copper or a copper-tin alloy. The structure of the cable 210 has been disclosed in detail in the relevant art and will not be further described here. The mutually insulated arrangement of the plurality of cables 210 in FIG3 can be understood as meaning that the conductors of each cable 210 are insulated from each other by an insulating layer.

[0047] The cable assembly 200 is arranged above the PCB board 100. Specifically, the cable assembly 200 is arranged above the layout surface 110, see the relative positional relationship between the cable assembly 200 and the layout surface 110 shown in Figure 2. It should be noted that the cable assembly 200 is not attached to the layout surface 110, and it can be understood that the cable assembly 200 is "suspended" above the layout surface 110, so that components can be arranged between the cable assembly 200 and the layout surface 110, thereby avoiding the existence of the cable assembly 200 affecting the arrangement of components on the layout surface 110, so that the PCB board 100 can make full use of the space on the PCB surface and above when designing to reduce the loss of the power supply network when transmitting current.

[0048] Referring to Figures 2 and 3 , two adapter assemblies 300 are respectively connected to the ends of the cable assembly 200. In other words, an adapter assembly 300 is provided at each end of the cable assembly 200. The cable assembly 200 includes multiple cables 210, wherein both ends of the multiple cables 210 are connected to corresponding adapter assemblies 300. The two adapter assemblies 300 can be connected to the PCB board 100. The two adapter assemblies 300 are used to connect the cables 210 to the PCB board 100, so that the cable assembly 200 can pass current.

[0049] The current-carrying device 10 in this embodiment utilizes the multiple cables 210 in the cable assembly 200 to carry current, thereby sharing some of the current on the PCB board 100 and alleviating the current pressure on the PCB board 100. Furthermore, the cable assembly 200 and the PCB board 100 are connected via the adapter assemblies 300 located at both ends of the cable assembly 200, thereby meeting the current-carrying requirements of the PCB board 100 without increasing the number of layers. Furthermore, because the adapter assemblies 300 are provided at both ends of the cable assembly 200, the cable assembly 200 can be connected to the PCB board 100 without being attached to the layout surface 110 of the PCB board 100. In other words, a gap exists between the cable assembly 200 and the layout surface 110 of the PCB board 100, thereby preventing the cable assembly 200 from affecting the arrangement of components on the layout surface 110 of the PCB board 100.

[0050] FIG4 is a top view of the adapter assembly 300 of the flow device 10 connected to the cable assembly 200 according to an embodiment of the present disclosure. FIG5 is an axial view of the adapter assembly 300 of the flow device 10 connected to the cable assembly 200 according to an embodiment of the present disclosure. FIG6 is a side view of the adapter assembly 300 of the flow device 10 connected to the cable assembly 200 according to an embodiment of the present disclosure. Referring to FIG4 to FIG6 , the adapter assembly 300 includes a housing 310 and a first connecting structure 320. The first connecting structure 320 can be connected to the housing 310. For example, the first connecting structure 320 can be conductively connected to the housing 310 or insulatedly connected to the housing 310. The first connecting structure 320 is used to be fixedly connected to the PCB board 100.

[0051] PCB 100 is provided with a connection hole. The opening of the connection hole is located on layout surface 110, and the connection hole extends through at least one layer of the laminate structure. For example, the connection hole may extend through one, two, three, four, or all layers of the laminate structure. In some embodiments, to facilitate the preparation of the connection hole on PCB 100 and ensure its versatility, without requiring adaptive changes based on the length of first connection structure 320, the connection hole may extend through all layers of the laminate structure. That is, the connection hole is configured as a through-hole structure on PCB 100.

[0052] In some embodiments, the first connection structure 320 is disposed in the connection hole to be fixedly connected to the PCB board 100. The fixed connection between the first connection structure 320 and the PCB board 100 can be achieved by welding or other connection structures.

[0053] In some embodiments, referring to FIG. 6 , the first connection structure 320 may include a plurality of protrusions 321 for soldering to the PCB 100. The protrusions 321 are spaced apart, and the spacing between the protrusions 321 can be the same or different. The protrusions 321 extend from the housing 310 toward the PCB 100 to facilitate insertion into the connection holes, where the axis of the connection holes is perpendicular to the layout surface 110.

[0054] The PCB board 100 is provided with multiple connection holes, and the multiple protrusions 321 are the same in number and arranged in one-to-one correspondence with the multiple connection holes, so that each protrusion 321 can be connected to the PCB board 100, thereby improving the reliability of the connection between the adapter assembly 300 and the PCB board 100.

[0055] When the PCB board 100 is fixedly connected to the flow device 10, the protrusion 321 is inserted into the connecting hole and welded to the connecting hole. That is, the first connecting structure 320 is arranged in the connecting hole and welded to the inner wall of the connecting hole to realize the welding connection between the first connecting structure 320 and the PCB board 100.

[0056] In other embodiments, the protrusion 321 is directly connected to the PCB board 100 by welding.

[0057] The flow device 10 of this embodiment realizes the connection between the adapter assembly 300 and the PCB board structure through the mutual cooperation between the first connecting structure 320 and the connecting hole. Since the cable assembly 200 is fixedly connected to the adapter assembly 300, the cable assembly 200 and the adapter assembly 300 can be prevented from shaking on the PCB board 100, thereby improving the reliability of the cable assembly 200 and the adapter assembly 300 on the PCB board 100.

[0058] Figure 7 is a bottom view of the adapter assembly 300 and cable assembly 200 of the flow device 10 according to an embodiment of the present disclosure. Figure 8 is a top view of the PCB 100 of the flow device 10 according to an embodiment of the present disclosure. Referring to Figures 7 and 8, the housing 310 has a receiving cavity. The adapter assembly 300 also includes a second connecting structure 330 disposed within the receiving cavity. Second connecting structure 330 is used to establish a power connection between the cable 210 and the PCB 100.

[0059] The second connecting structure 330 can be insulated and connected to the inner wall of the housing 310. For example, an insulating material is provided between the second connecting structure 330 and the inner wall of the housing 310. The second connecting structure 330 is connected to the insulating material, and the insulating material is connected to the inner wall of the housing 310, thereby achieving an insulated connection between the second connecting structure 330 and the inner wall of the housing 310. The second connecting structure 330 is conductively connected to a portion of the cable 210 in the cable assembly 200. The cable 210 can be connected to the second connecting structure 330 via the connecting structure.

[0060] The laminated structure includes a power layer. The layout surface 110 is provided with a power copper foil 130 connected to the power layer. The power copper foil 130 can be connected to the power layer through vias.

[0061] The second connection structure 330 and the power copper foil 130 are used to contact each other when the first connection structure 320 is connected to the PCB board 100 , so as to achieve contact connection between the second connection structure 330 and the power copper foil 130 .

[0062] FIG9 is a bottom view of the adapter assembly 300 of the flow-through device 10 according to an embodiment of the present disclosure. Referring to FIG9 , in some embodiments, the housing 310 may be provided with a through hole extending through the thickness of the housing. The through hole may have a first opening 311 formed on the outer wall of the housing 310. The first opening 311 is disposed toward the layout surface 110. At least a portion of the second connection structure 330 may extend out of the accommodating cavity through the first opening 311 to form a contact connection with the power supply copper foil 130. In some embodiments, the top cover of the housing 310 (the portion not provided with the first opening 311 and facing the layout surface 110 of the PCB board 100) may be made of an insulating material.

[0063] In order to reduce the resistance of the adapter assembly 300 during connection, the second connection structure 330 may be made of copper.

[0064] In some embodiments, the second connection structure 330 includes a plurality of arc-shaped springs 331 insulated from one another. Each arc-shaped spring 331 is arc-shaped. The plurality of arc-shaped springs 331 corresponds to the number of cables 210 connected to the second connection structure 330, and are connected one-to-one. In other words, each cable 210 is connected to a separate arc-shaped spring 331. The arc-shaped springs 331 are used to connect each cable 210 to the power supply on the PCB 100, thereby enabling power distribution among the multiple cables 210.

[0065] In order to reduce the resistance of the adapter assembly 300 during connection, the arc-shaped spring 331 may be made of copper.

[0066] 7 and 8 , the adapter assembly 300 may further include a third connection structure 340 , which is also disposed in the accommodating cavity and is used to achieve a return current connection between the cable 210 and the PCB board 100 .

[0067] The third connecting structure 340 can be conductively connected to the inner wall of the housing 310. For example, the third connecting structure 340 can be welded to the inner wall of the housing 310 using a conductive material to achieve a conductive connection between the third connecting structure 340 and the inner wall of the housing 310. The third connecting structure 340 is conductively connected to the remaining cables 210 in the cable assembly 200, and the housing 310 is conductively connected to the first connecting structure 320. In other words, the third connecting structure 340 is conductively connected to the first connecting structure 320 and the remaining cables 210 in the cable assembly 200.

[0068] The laminated structure may further include a ground layer, which is stacked on one side of the power layer. For example, the ground layer is arranged above the power layer along the predetermined direction shown in Figure 1, or is arranged below the power layer along the predetermined direction shown in Figure 1. A reference ground copper foil 140 connected to the ground layer is provided on the layout surface 110. The reference ground copper foil 140 can be connected to the ground layer through vias.

[0069] 8 , in some embodiments, the opening of the connection hole is disposed in the reference ground copper foil 140. The third connection structure 340 contacts the reference ground copper foil 140 when the first connection structure 320 is connected to the PCB board 100, thereby achieving contact connection between the third connection structure 340 and the reference ground copper foil 140.

[0070] Similarly, referring to FIG9 , in some embodiments, the shell 310 may be provided with a through hole penetrating the wall thickness thereof, and the through hole forms a first opening 311 on the outer wall surface of the shell 310 , and the first opening 311 is arranged toward the layout surface 110 , and at least a portion of the third connection structure 340 may extend out of the accommodating cavity through the first opening 311 to be in contact connection with the reference ground copper foil 140 .

[0071] In order to reduce the resistance of the adapter assembly 300 during connection, the third connection structure 340 may be made of copper.

[0072] In some embodiments, the third connection structure 340 includes a plurality of arc-shaped springs 342, each insulated from the other. Each arc-shaped spring 342 is connected to the same number of cables 210 connected to the third connection structure 340, and the number of these arc-shaped springs 342 corresponds to the number of cables 210 connected to the third connection structure 340. In other words, each cable 210 is connected to a separate arc-shaped spring 342. The arc-shaped springs 342 are used to connect each cable 210 to the power supply on the PCB 100, thereby enabling power distribution among the multiple cables 210.

[0073] In order to reduce the resistance of the adapter assembly 300 during connection, the arc-shaped spring 342 may be made of copper.

[0074] In some embodiments, the arc-shaped spring piece 331 of the second connection structure 330 and the arc-shaped spring piece 342 of the third connection structure 340 may have the same structure.

[0075] In some embodiments, the third connecting structure 340 includes a set of connecting members 341, each of which includes a plurality of arc-shaped springs 342. The connecting members 341 are disposed on one side of the second connecting structure 330. For example, the connecting members 341 can be disposed on the left side of the second connecting structure 330. Alternatively, the connecting members 341 can be disposed on the right side of the second connecting structure 330.

[0076] In other embodiments, the third connection structure 340 includes multiple groups of connection members 341 , each group of connection members 341 includes multiple arc-shaped springs 342 , and the multiple groups of connection members 341 are respectively disposed on both sides of the second connection structure 330 .

[0077] 7 , in some embodiments, the third connection structure 340 may include two groups of connection members 341, each group of connection members 341 including a plurality of arc-shaped spring pieces 342, and the two groups of connection members 341 are respectively disposed on both sides of the second connection structure 330. Each group of connection members 341 may include six arc-shaped spring pieces 342.

[0078] It should be noted that the number and type of cables 210 in the cable assembly 200 are related to the PCB board 100 and may vary in different embodiments. However, the steps for determining the number and type of cables 210 in the cable assembly 200 are the same across different embodiments. For ease of understanding, the following description will be based on a specific embodiment of the design and manufacture of the flow-through device 10.

[0079] First: simulate PCB board 100.

[0080] According to the design requirements of the PCB board 100, the PCB board 100 is simulated by a simulation device. If the simulation results show that the current through the power plane on the PCB board 100 does not meet the requirements and the power consumption is too high, the PCB board 100 needs to be rectified to ensure that the current through the PCB board 100 meets the requirements.

[0081] In the related art, the above problem is solved by increasing the number of power layers or providing surface-mount auxiliary components. However, increasing the number of power layers will thicken the PCB board 100, which may make it impossible to install the PCB board 100 in the designated space, thereby affecting the use of the PCB board 100; the surface-mount auxiliary components will affect the surface layout of the PCB board 100.

[0082] This embodiment employs a different approach than those employed in related art to address the aforementioned technical issues. It utilizes a cable assembly 200 to carry current, thereby sharing some of the current on the PCB 100 and alleviating the current pressure on the PCB 100. Adapter assemblies 300 located at both ends of the cable assembly 200 connect the cable assembly 200 to the PCB 100, thereby meeting the current requirements without increasing the number of layers on the PCB 100. Furthermore, because the cable 210 is flexible and does not need to be attached to the mounting surface 110 of the PCB 100, it offers considerable flexibility in practical applications.

[0083] Secondly, the number of cables 210 and the type of cables 210 required for the auxiliary current are calculated and simulated.

[0084] Step 1: Obtain the number of power supply layers specifically included in the stacked structure of the PCB board 100, and then calculate and obtain the maximum current carrying capacity I of the PCB board 100 based on the number of power supply layers on the PCB board 100. pcb .

[0085] Step 2: Obtain the actual operating current I of the chip on the PCB board 100 total , and then calculate the actual working current I of the chip total The maximum flow capacity of the PCB board 100 pcb The difference between ΔI (ΔI=I total -I pcb ), the difference ΔI can be understood as the current value that requires the cable assembly 200 to assist in the flow of current.

[0086] Step 3: Select a suitable type of cable 210 and determine the number of cables 210 in the cable assembly 200 based on the difference ΔI and the temperature rise condition.

[0087] Step 4: Simulate and obtain the DC resistance R of the power layer on the PCB board 100 pcb .

[0088] Step 5: Calculate the total DC resistance R of the cable assembly 200 and the adapter assembly 300 cable .

[0089] Step 6: Calculate the actual current I that the cable assembly 200 can flow through based on the current distribution principle. cable .

[0090] Among them, I pcb / I cable =R cable / R pcb

[0091] Step 7: Compare the actual current I that the cable assembly 200 can flow through cableAnd the current ΔI that needs auxiliary flow, if I cable >ΔI, then the design of the cable assembly 200 (the design of the cable assembly 200 includes at least the number of cables 210 in the cable assembly 200 and the type of cables 210) is appropriate; if cable <ΔI, the auxiliary current capacity of the cable assembly 200 cannot meet the current requirement of the PCB board 100. In this case, it is necessary to increase the number of cables 210 in the cable assembly 200, or reduce the DC resistance R of the cables 210 and the adapter assembly 300. cable To increase the actual flow capacity of the cable 210 cable .

[0092] Step 8: Manufacturing the PCB board 100, which at least includes a laminated structure and vias.

[0093] Step 9: Use a simulation device to verify whether the power consumption of the PCB board 100 in the above-mentioned flow device 10 meets the requirements after the cable assembly 200 passes the flow, and whether the diversion size of the cable assembly 200 is appropriate.

[0094] Step 10: If the simulation verification solution is feasible, the cable assembly 200 and the adapter assembly 300 are manufactured, and the PCB board 100 manufactured in step 8 is assembled with the cable assembly 200 and the adapter assembly 300 to form a flow device 10.

[0095] Comparative Example

[0096] The current at the chip end is set to 500A, and the simulation results show that the total power consumption is 118.8W.

[0097] Example

[0098] The current at the chip end is set to 500A, and the simulation results show that the total power consumption is 97.1W.

[0099] Table 1

[0100] Table 1 shows the simulation results of the comparative example and the embodiment.

[0101] The above simulation results show that by using the cable assembly 200 and adapter assembly 300 described in this proposal, the total voltage drop is reduced by 10.6%, the power consumption on the PCB board 100 can be reduced by 18.3%, and the through-current is reduced by 21.6%, which greatly improves the through-current and power consumption of the PCB board 100.

[0102] The present disclosure also provides a PCB device, comprising a PCB 100 and a current flow device 10. PCB 100 comprises a laminated structure stacked along a predetermined direction, the laminated structure having a layout surface 110 oriented in the predetermined direction. The laminated structure includes a power layer, with a power copper foil 130 connected to the power layer disposed on the layout surface 110. The laminated structure also includes a ground layer stacked on one side of the power layer, with a reference ground copper foil 140 connected to the ground layer disposed on the layout surface 110.

[0103] The PCB board 100 is provided with a connection hole 120 with an opening located on the layout surface 110 and penetrating at least one layer of the laminated structure. The opening of the connection hole 120 is set at the reference ground copper foil 140. The connection hole 120 is used to connect the adapter component 300.

[0104] The connection hole 120 is used to connect the first connection structure 320 to achieve a fixed connection between the adapter assembly 300 and the PCB board 100 .

[0105] It should be noted that the above comparative examples and embodiments are only for illustrating the beneficial effects of this implementation, rather than limiting the embodiments of the present disclosure. The embodiments can be further optimized and will not be described in detail again.

[0106] It is understood that the above embodiments and implementations are merely exemplary embodiments and implementations used to illustrate the principles of the present disclosure, and the present disclosure is not limited thereto. Those skilled in the art may make various modifications and improvements without departing from the spirit and substance of the present disclosure, and such modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. A flow-through device for a PCB board, the flow-through device comprising: A cable assembly, the cable assembly comprising a plurality of cables arranged side by side and insulated from each other, the cable assembly being arranged above the PCB board; Two adapter assemblies, the two adapter assemblies are respectively connected to the two ends of the cable assembly, the two ends of the multiple cables are connected to the corresponding adapter assemblies, and the two adapter assemblies are used to connect the cable assembly to the PCB board.

2. The flow device according to claim 1, wherein: The adapter assembly includes a housing and a first connection structure connected to the housing, wherein the first connection structure is used for fixed connection with the PCB board.

3. The flow device according to claim 2, wherein: The first connection structure includes a plurality of protrusions arranged at intervals, wherein the protrusions extend from the housing toward the PCB board, and the protrusions are used for welding with the PCB board to achieve welding connection between the first connection structure and the PCB board.

4. The flow device according to claim 2 or 3, wherein: The switching component also includes: A second connection structure, the housing has a receiving cavity, the second connection structure is disposed in the receiving cavity, the second connection structure is insulatedly connected to the inner wall of the housing and conductively connected to a portion of the cables in the cable assembly; The second connection structure is in contact with the power copper foil of the PCB board when the first connection structure is connected to the PCB board, and the second connection structure is used to realize the power connection between the cable and the PCB board.

5. The flow device according to claim 4, wherein: The second connection structure includes a plurality of arc-shaped spring pieces that are insulated from each other. The number of the arc-shaped spring pieces is the same as the number of the cables connected to the second connection structure and they are connected one-to-one.

6. The flow device according to claim 4 or 5, wherein: The switching component also includes: a third connection structure, the third connection structure being disposed in the accommodating cavity, the third connection structure being conductively connected to an inner wall of the housing and the remaining cables in the cable assembly, and the housing being conductively connected to the first connection structure; The third connection structure is in contact with the reference ground copper foil of the PCB board when the first connection structure is connected to the PCB board, and the third connection structure is used to achieve a return current connection between the cable and the PCB board.

7. The flow device according to claim 6, wherein: The third connection structure includes a plurality of arc-shaped spring pieces that are insulated from each other. The number of the arc-shaped spring pieces is the same as the number of the cables connected to the third connection structure and they are connected one-to-one.

8. The flow device according to claim 7, wherein: The third connection structure comprises a group of connection members, the connection members comprise a plurality of the arc-shaped spring leaves, and the connection members are arranged on one side of the second connection structure; or The third connection structure includes a plurality of groups of connection members, each group of the connection members includes a plurality of the arc-shaped spring leaves, and the plurality of groups of the connection members are respectively arranged on both sides of the second connection structure.

9. A PCB device, comprising a PCB board and a flow-through device according to any one of claims 1 to 8; in, The PCB board comprises a stacked structure stacked along a preset direction, and the stacked structure has a layout surface facing the preset direction; The laminated structure includes a power layer, and the layout surface is provided with a power copper foil connected to the power layer; The laminated structure further includes a ground layer stacked on one side of the power layer, and the layout surface is provided with a reference ground copper foil connected to the ground layer.

10. The PCB device according to claim 9, wherein: The PCB board is provided with a connection hole whose opening is located on the layout surface and penetrates at least one layer in the laminated structure. The opening of the connection hole is arranged on the reference ground copper foil, and the connection hole is used to connect the adapter component.

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