Information output method, information output device, inspection method, inspection device, processing method, and processing system

Abstract

This information output method is for outputting information on a defect in an object W, the method comprising: outputting (i) display information enabling display of inspection result information for the defect and three-dimensional shape information for the object, and (ii) output information in which the inspection result information and the three-dimensional shape information are associated with each other.

Description

Information output method, information output device, inspection method, inspection device, processing method, and processing system

[0001] The present invention relates to the technical fields of, for example, an information output method and information output device capable of outputting information regarding defects in an object, an inspection method and inspection device capable of detecting defects in an object, and a processing method and processing system capable of processing an object.

[0002] An example of an inspection device capable of detecting defects in an object is described in Patent Document 1. One of the technical challenges associated with detecting defects in such an object is how to effectively utilize the results of defect detection.

[0003] Patent No. 5218723

[0004] According to a first aspect, there is provided an information output method for outputting information relating to defects in an object, the information output method outputting (i) display information that enables the display of inspection result information relating to the defects and three-dimensional shape information of the object, and (ii) output information in which the inspection result information and the three-dimensional shape information are associated with each other.

[0005] According to a second aspect, there is provided an information output method for outputting information relating to defects in an object, the information output method outputting display information that enables the display of inspection result information relating to the defects and three-dimensional shape information of the object.

[0006] According to a third aspect, there is provided an information output method for outputting information relating to defects in an object, wherein inspection result information relating to the defects and three-dimensional shape information of the object are mutually associated.

[0007] According to a fourth aspect, there is provided an inspection device that executes the information output method provided by any one of the first to third aspects.

[0008] According to a fifth aspect, there is provided an information output device that outputs information regarding defects in an object, comprising: a storage device that stores program code; and a control device that reads the program code from the storage device and executes it to output (i) display information that enables the display of inspection result information regarding the defects and three-dimensional shape information of the object; and (ii) output information in which the inspection result information and the three-dimensional shape information are associated with each other.

[0009] According to a sixth aspect, there is provided an information output device that outputs information related to defects in an object, the information output device including a storage device that stores program code, and an information output device that outputs display information that can display inspection result information related to the defect and three-dimensional shape information of the object by reading and executing the program code from the storage device.

[0010] According to a seventh aspect, there is provided an information output device that outputs information regarding defects in an object, the information output device including a storage device that stores program code, and an information output device that reads and executes the program code from the storage device to output output information in which inspection result information regarding the defect and three-dimensional shape information of the object are associated with each other.

[0011] According to an eighth aspect, there is provided an inspection method for detecting defects in an object using an apparatus capable of generating three-dimensional shape information of the object based on a first output from a first camera and a second output from a second camera, wherein the inspection method generates inspection result information regarding the defects in the object based on the first output regarding the object.

[0012] According to a ninth aspect, there is provided an inspection apparatus for carrying out the inspection method provided by the eighth aspect.

[0013] According to a tenth aspect, there is provided an inspection device for detecting defects in an object, comprising: a first camera; a second camera arranged at an interval from the first camera; a first memory device for storing a first program code; a second memory device for storing a second program code; a first control device for generating three-dimensional shape information of the object based on a first output from the first camera and a second output from the second camera by reading and executing the first program code from the first memory device; and a second control device for generating inspection result information regarding defects in the object based on the first output by reading and executing the second program code from the second memory device.

[0014] According to an eleventh aspect, there is provided a processing method using an inspection device that detects defects in an object and a processing device that processes the object, the processing method including placing the object inside a housing of the inspection device, detecting defects in the object using the inspection device, transporting the object from the inspection device to the processing device, placing the object inside a housing of the processing device, and processing the object using the processing device.

[0015] According to a twelfth aspect, there is provided a processing method using a processing device that processes an object and an inspection device that detects defects in the object, the processing method including placing the object inside a housing of the processing device, processing the object using the processing device, transporting the object from the processing device to the inspection device, placing the object inside a housing of the inspection device, and detecting defects in the object.

[0016] According to a thirteenth aspect, there is provided a processing system for carrying out the processing method provided by the eleventh or twelfth aspect.

[0017] According to a fourteenth aspect, there is provided a processing system comprising an inspection device that detects defects in an object, a storage device that stores program code, and a processing device that processes the object whose defects have been detected by the inspection device by reading and executing the program code from the storage device.

[0018] According to a fifteenth aspect, there is provided a processing system comprising a processing device that processes an object, a storage device that stores program code, and an inspection device that reads and executes the program code from the storage device to detect defects in the object that has been processed by the processing device.

[0019] The functions and effects of the present invention will become apparent from the following detailed description of the preferred embodiments.

[0020] 1 is a block diagram showing the overall configuration of a machining system of this embodiment. FIG. 2 is a block diagram showing the system configuration of a machining device of this embodiment. FIG. 3 is a cross-sectional view showing the configuration of a machining device of this embodiment. FIG. 4 is a block diagram showing the configuration of a measurement system. FIG. 5 is a block diagram showing the configuration of an imaging system. FIG. 6 is a cross-sectional view showing the configuration of an imaging system. FIG. 7 is a block diagram showing the configuration of a control device. FIG. 8 is a flowchart showing the overall flow of machining operations performed by the machining system. FIG. 9 is a flowchart showing the flow of workpiece inspection operations performed by the measurement system. FIG. 10 conceptually shows a point cloud of a workpiece. FIG. 11 shows a workpiece image in which a crack is reflected. FIG. 12 conceptually shows an example of a superimposed display of point cloud data and defect information. FIG. 13 conceptually shows an example of a superimposed display of point cloud data and defect information. FIG. 14 conceptually shows point cloud data and defect information that are associated with each other. FIG. 15 conceptually shows point cloud data and defect information that are associated with each other. FIG. 16 conceptually shows a workpiece image in which the edge of the workpiece is reflected. FIG. 17 conceptually shows a workpiece image including an image of a series of specific pixels corresponding to a crack and an image of a series of specific pixels that correspond to the edge of the workpiece. FIG. 18(a) is a graph showing the change in size of an image corresponding to a crack, and FIG. 18(b) is a graph showing the change in size of an image corresponding to the edge of the workpiece. FIG. 19 is a cross-sectional view showing the relative positional relationship between the stereo camera and the workpiece. 10 is a conceptual diagram of a workpiece image including a series of specific pixel images corresponding to cracks and a series of specific pixel images corresponding to the edge of the workpiece. FIG. 10 is a cross-sectional view showing an illumination device that illuminates a workpiece with UV illumination light. FIG. 10 is a conceptual diagram of a workpiece image including a series of specific pixel images corresponding to cracks and a series of specific pixel images corresponding to the edge of the workpiece. FIG. 10 is a cross-sectional view showing a stereo camera that images a workpiece. FIG. 10 is a block diagram showing the configuration of a measurement system in a third modified example. FIG. 10(a) and FIG. 10(b) are block diagrams showing the configuration of a control device in the third modified example.

[0021] Hereinafter, embodiments of an information output method, an information output device, an inspection method, an inspection device, a processing method, and a processing system will be described with reference to the drawings. Hereinafter, the embodiments of the information output method, the information output device, the inspection method, the inspection device, the processing method, and the processing system will be described using a processing system SYS that can process a workpiece W, which is an example of an object.

[0022] (1) Configuration of the Machining System SYS First, the configuration of the machining system SYS will be described.

[0023] (1-1) Overall Configuration of Machining System SYS First, the overall configuration of the machining system SYS will be described with reference to Fig. 1. Fig. 1 is a block diagram showing the overall configuration of the machining system SYS.

[0024] As shown in FIG. 1 , the processing system (processing apparatus) SYS includes a processing apparatus 1, a measurement system (inspection apparatus, measuring apparatus) 2, and a transport apparatus 3. In the example shown in FIG. 1 , the processing system SYS includes a single processing apparatus 1. However, the processing system SYS may include multiple processing apparatuses 1. Furthermore, the processing system SYS includes a single measurement system 2. However, the processing system SYS may include multiple measurement systems 2. In addition, the processing system SYS includes a single transport apparatus 3. However, the processing system SYS may not include the transport apparatus 3, or may include multiple transport apparatuses 3.

[0025] When the processing system SYS includes a plurality of processing apparatuses 1, the number of measurement systems 2 may be less than the number of processing apparatuses 1. For example, the processing system SYS may include two or more processing apparatuses 1 and one measurement system 2. Furthermore, when the processing system SYS includes a plurality of measurement systems 2, the number of processing apparatuses 1 may be less than the number of measurement systems 2. For example, the processing system SYS may include one processing apparatus 1 and two or more measurement systems 2.

[0026] In this embodiment, an example will be described in which the processing apparatus 1 is an additive processing apparatus that can form a shaped object on the workpiece W by irradiating the workpiece W with processing light EL (i.e., an energy beam in the form of light) to perform additive processing on the workpiece W. The processing apparatus 1 may form a shaped object that is integrated with or separable from the workpiece W by performing additive processing on the workpiece W. For example, the processing apparatus 1 may form a three-dimensional structure (i.e., a three-dimensional structure that has a size in all three directions, a solid object, in other words, a structure that has a size in the X-axis direction, Y-axis direction, and Z-axis direction) as an example of a shaped object.

[0027] The processing apparatus (additive processing apparatus) 1 may perform additive processing using any additive processing method (i.e., a manufacturing method) capable of manufacturing a shaped object. Examples of additive processing methods include at least one of laser metal deposition (LMD), powder bed fusion (PbF) such as selective laser sintering (SLS), binder jetting, material jetting, stereolithography, and laser metal fusion (LMF). The laser build-up welding method may be referred to as a directed energy deposition method (DED). However, the processing device 1 may process the workpiece W without using the processing light EL.

[0028] The workpiece W, which is the object to be processed, may include an item that has a missing portion and needs to be repaired. In this case, the processing device 1 may perform repair processing to repair (in other words, restore) the item that needs to be repaired by performing additional processing to form a shaped object to fill the missing portion. In other words, the additional processing performed by the processing device 1 may include additional processing to add to the workpiece W a three-dimensional structure that corresponds to the shaped object to fill the missing portion. The additional processing performed by the processing device 1 may be at least a part of the repair process for the workpiece W that has a missing portion.

[0029] An example of an item requiring repair that has a missing portion is at least a portion of a worn turbine. For example, an example of an item requiring repair that has a missing portion is a turbine blade that constitutes a turbine. An example of a turbine is at least one of a power generation turbine and an aircraft engine turbine. In this case, the processing device 1 may repair (in other words, restore) the worn turbine. Another example of an item requiring repair that has a missing portion is a worn propeller-shaped part. Another example of an item requiring repair that has a missing portion is a body part of a vehicle such as an automobile, motorcycle, electric vehicle, or railroad car. Another example of an item requiring repair that has a missing portion is an engine part for an automobile engine, motorcycle engine, or aerospace engine. Another example of an item requiring repair that has a missing portion is a battery part for an electric vehicle. The processing device 1 may repair these items requiring repair.

[0030] The workpiece W may also include an intermediate product manufactured in the process of forming a three-dimensional structure. In this case, the processing device 1 may manufacture a three-dimensional structure from the intermediate product by performing additional processing on the workpiece W, which is an intermediate product of the three-dimensional structure, to complete the three-dimensional structure. As an example, the processing device 1 may manufacture a completed turbine from the intermediate turbine by performing additional processing on the workpiece W, which is an intermediate turbine, to complete the turbine.

[0031] That is, the workpiece W may include a three-dimensional structure, whether finished or unfinished, that is set in the processing device 1. In this case, the processing device 1 may perform additional processing on the workpiece W, which is a three-dimensional structure, to add a new three-dimensional shape and to add a new portion to a finished product or to add a new portion to an unfinished product to create a finished product that includes at least a portion of the workpiece W.

[0032] The measurement system 2 measures the workpiece W. In this embodiment, the measurement system 2 measures the three-dimensional shape of the workpiece W. Once the three-dimensional shape of the workpiece W is determined, the position of the workpiece W in three-dimensional space (for example, the position of the surface of the workpiece W) is determined. Therefore, measuring the three-dimensional shape of the workpiece W may be considered to be substantially equivalent to measuring the position of the workpiece W.

[0033] For this reason, the workpiece W may include a base for forming a three-dimensional structure. In this case, the processing device 1 may manufacture a three-dimensional structure from scratch by performing additive processing to form a three-dimensional structure on the workpiece W. As an example, the processing device 1 may manufacture a turbine from scratch by performing additive processing to form a three-dimensional structure corresponding to a turbine on the workpiece W.

[0034] The measurement system 2 may measure the workpiece W before the processing device 1 actually starts processing the workpiece W. For example, the measurement system 2 may measure the workpiece W that the processing device 1 is scheduled to actually process before the processing device 1 actually starts processing the workpiece W. The measurement system 2 may measure the workpiece W after the processing device 1 has actually finished processing the workpiece W. For example, the measurement system 2 may measure the workpiece W that the processing device 1 has actually processed after the processing device 1 has actually finished processing the workpiece W. The measurement system 2 may measure the workpiece W during at least a portion of the period during which the processing device 1 is actually processing the workpiece W. For example, the measurement system 2 may measure the workpiece W that the processing device 1 is processing during at least a portion of the period during which the processing device 1 is actually processing the workpiece W.

[0035] The measurement system 2 may further generate processing control information. The processing control information is control information used to control the processing device 1 to process the workpiece W. In particular, the processing control information is control information used to control the processing device 1 to process the workpiece W so that the shape of the workpiece W becomes a target shape. For example, the processing control information may include processing path information. The processing path information may indicate a target irradiation position (e.g., the position of a target irradiation area EA described later) to which the processing light EL should be irradiated to process the workpiece W. Specifically, the processing path information may indicate a target movement path (processing path or tool path) that is a path to a target irradiation position (e.g., the movement path of the target irradiation area EA described later) to which the processing light EL should be irradiated to process the workpiece W. In this case, the measurement system 2 may generate a G-code indicating the processing path or tool path as the processing control information. The measurement system 2 may generate a file with an extension "gcode" or "gco" as the processing control information.

[0036] When the measurement system 2 generates the processing control information, the measurement system 2 may measure the three-dimensional shape of the workpiece W in order to generate the processing control information. In this case, the measurement system 2 may measure the workpiece W in order to generate the processing control information before the processing device 1 actually starts processing the workpiece W. The measurement system 2 may generate the processing control information based on three-dimensional shape information related to the measurement results of the three-dimensional shape of the workpiece W.

[0037] The processing control information generated by the measurement system 2 is transmitted from the measurement system 2 to the processing device 1 via a communication network (not shown). The processing device 1 receives (i.e., acquires) the processing control information transmitted from the measurement system 2. The processing device 1, which has received the processing control information, processes the workpiece W based on the received processing control information. Therefore, after the measurement system 2 measures the three-dimensional shape of the workpiece W to generate the processing control information, the workpiece W is transported from the measurement system 2 to the processing device 1. Specifically, the workpiece W is removed from the measurement system 2, and the workpiece W removed from the measurement system 2 is transported to the processing device 1. For example, the workpiece W may be transported from the measurement system 2 to the processing device 1 by the transport device 3. For example, the workpiece W may be transported from the measurement system 2 to the processing device 1 by a user of the processing system SYS. The workpiece W transported to the processing device 1 is placed on the processing device 1 (in other words, placed or attached). As a result, the processing device 1 can process the workpiece W.

[0038] The measurement system 2 may further inspect the workpiece W. Specifically, the measurement system 2 may detect defects in the workpiece W. That is, in the present embodiment, inspecting the workpiece W may include detecting defects in the workpiece W. The measurement system 2 may determine whether or not a defect has occurred in the workpiece W. That is, in the present embodiment, inspecting the workpiece W may include determining whether or not a defect has occurred in the workpiece W.

[0039] An example of a defect in the workpiece W is a crack equivalent to a chip that has occurred in the workpiece W. An example of a defect in the workpiece W is crazing (in other words, crazes) equivalent to fine cracks that have occurred in the workpiece W. An example of a defect in the workpiece W is a scratch that has occurred in the workpiece W. An example of a defect in the workpiece W is a defective shape of the workpiece. An example of a defective shape of the workpiece W is at least one of an unintended distortion of the workpiece W, an unintended bend of the workpiece W, an unintended dent that has occurred in the workpiece W, and an unintended protrusion that has occurred in the workpiece W. An example of a defect in the workpiece W is corrosion of the workpiece W. An example of a defect in the workpiece W is rust that has occurred in the workpiece W. Note that, for convenience of explanation, the following description will be given of an example in which the measurement system 2 detects a crack in the workpiece W as a defect in the workpiece W. However, even when the measurement system 2 detects a defect in the workpiece W other than a crack in the workpiece W, the machining system SYS may perform the operation of detecting a defect in the workpiece W described below.

[0040] 1, the processing system SYS includes a processing device 1 and a measurement system 2, which are separate devices. However, the processing system SYS may include a device in which the processing device 1 and the measurement system 2 are integrated. In other words, the processing device 1 and the measurement system 2 may be integrated.

[0041] The processing system SYS may further include a control server 4. The control server 4 may control the operation of the entire processing system SYS. For example, the control server 4 may control the operation of the processing device 1. For example, the control server 4 may control the operation of the measurement system 2. For example, the control server 4 may control the operation of the transport device 3. However, the processing system SYS does not necessarily have to include the control server 4.

[0042] The control server 4 may function as a cloud server. In this case, the control server 4 may be able to communicate with at least one of the processing apparatus 1, the measurement system 2, and the transport apparatus 3 via a communication network including the Internet. Alternatively, the control server 4 may function as an edge server. In this case, the control server 4 may be able to communicate with at least one of the processing apparatus 1, the measurement system 2, and the transport apparatus 3 via a communication network including an intranet or a local area network.

[0043] The processing system SYS may include a first computer that controls the processing apparatus 1 as part of the processing apparatus 1, in addition to or instead of the control server 4 that controls the processing apparatus 1. That is, the processing apparatus 1 may include the first computer. The first computer may be a laptop computer, a tablet terminal, a mobile terminal such as a smartphone, or any other type of computer. The first computer may function as a control unit 17 (see FIG. 2 ) described later. The processing system SYS may include a second computer that controls the measurement system 2 as part of the measurement system 2, in addition to or instead of the control server 4 that controls the measurement system 2. That is, the measurement system 2 may include the second computer. The second computer may be a laptop computer, a tablet terminal, a mobile terminal such as a smartphone, or any other type of computer. The second computer may function as a control device 22 (see FIG. 4 ) described later. The processing system SYS may include a third computer that controls the transport device 3 as part of the transport device 3, in addition to or instead of the control server 4 that controls the transport device 3. That is, the transport device 3 may include the third computer. The third computer may be a laptop or some other type of computer.

[0044] (1-2) Configuration of Processing Apparatus 1 Next, the configuration of the processing apparatus 1 will be described with reference to Fig. 2 and Fig. 3. Fig. 2 is a block diagram showing the system configuration of the processing apparatus 1. Fig. 3 is a cross-sectional view showing the configuration of the processing apparatus 1.

[0045] In the following description, the positional relationships of the various components constituting the processing apparatus 1 will be described using an XYZ Cartesian coordinate system defined by mutually orthogonal X, Y, and Z axes as the processing coordinate system. For ease of explanation, the X-axis and Y-axis directions are each assumed to be horizontal (i.e., a predetermined direction within a horizontal plane), and the Z-axis direction is assumed to be vertical (i.e., a direction perpendicular to the horizontal plane, essentially an up-down direction). Furthermore, the rotation directions around the X-axis, Y-axis, and Z-axis (in other words, tilt directions) are referred to as the θX direction, θY direction, and θZ direction, respectively. Here, the Z-axis direction may be the direction of gravity. Furthermore, the XY plane may be assumed to be horizontal.

[0046] In the following description, for the sake of convenience, a configuration of the processing device 1 that performs additional processing using a laser build-up welding method will be described as an example of the configuration of the processing device 1.

[0047] The processing device 1, which performs additive processing using the laser build-up welding method, performs additive processing by processing a shaping material M using processing light EL. The shaping material M is a material that can be melted by irradiation with processing light EL of a predetermined intensity or higher. In this embodiment, powder made of a metal material is used as the shaping material M. The shaping material M is not limited to a metal material, and a resin material may also be used. In addition, the shaping material M is a powder or granular material. However, the shaping material M does not have to be a powder or granular material, and a wire-like material or a gaseous material may also be used.

[0048] A processing apparatus 1 that performs additive processing using laser build-up welding sequentially forms multiple structural layers to form a three-dimensional structure in which multiple structural layers are stacked. In this case, the processing apparatus 1 first sets the surface of the workpiece W as a printing surface MS on which the object is actually formed, and forms a first structural layer on the printing surface MS. Thereafter, the processing apparatus 1 sets the surface of the first structural layer as a new printing surface MS, and forms a second structural layer on the new printing surface MS. Thereafter, the processing apparatus 1 repeats the same operations to form a three-dimensional structure in which multiple structural layers are stacked.

[0049] 2 and 3 , the processing apparatus 1 includes a material supply source 11, a processing unit 12, a stage unit 13, a light source 15, a gas supply source 16, and a control unit 17. The processing unit 12 and the stage unit 13 may be housed in a chamber space 183IN inside a housing 18. At least one of the processing unit 12 and the stage unit 13 does not have to be housed in the chamber space 183IN inside the housing 18.

[0050] The material supply source 11 supplies the modeling material M to the processing unit 12. The material supply source 11 supplies a desired amount of modeling material M according to the required amount so that the amount of modeling material M required per unit time for performing additional processing is supplied to the processing unit 12 (material nozzle 1212).

[0051] The processing unit 12 processes the modeling material M supplied from the material supply source 11 to form a model. To form the model, the processing unit 12 includes a processing head 121 and a head drive system 122. The processing head 121 further includes an irradiation optical system 1211 and a material nozzle 1212. In the example shown in FIGS. 2 and 3 , the processing head 121 includes a single irradiation optical system 1211, but the processing head 121 may also include multiple irradiation optical systems 1211. In the example shown in FIGS. 2 and 3 , the processing head 121 includes a single material nozzle 1212, but the processing head 121 may also include multiple material nozzles 1212.

[0052] The irradiation optical system 1211 is an optical system (e.g., a focusing optical system) for emitting the processing light EL. Specifically, the irradiation optical system 1211 is optically connected to the light source 15 that emits the processing light EL via an optical transmission member 151 such as an optical fiber or a light pipe, and is capable of irradiating the processing light EL propagated from the light source 15 via the optical transmission member 151. A stage 131 is disposed below the irradiation optical system 1211. Therefore, when a workpiece W is placed on the stage 131, the irradiation optical system 1211 irradiates the workpiece W with the processing light EL emitted from the irradiation optical system 1211 downward (i.e., toward the -Z side). In other words, the irradiation optical system 1211 irradiates the workpiece W with the processing light EL from above the workpiece W. The irradiation optical system 1211 configured in this manner is capable of irradiating the processing light EL onto a target irradiation area EA that is set on or near the workpiece W as an area to be irradiated (typically, condensed) with the processing light EL. Furthermore, the irradiation optical system 1211 can be switched by the control of the control unit 17 between a state in which the processing light EL is irradiated onto the target irradiation area EA and a state in which the processing light EL is not irradiated onto the target irradiation area EA.

[0053] The material nozzle 1212 supplies (e.g., injects, jets, spouts, or sprays) the modeling material M. The material nozzle 1212 is physically connected to the material supply source 11, which is a supply source of the modeling material M, via the supply pipe 111 and the mixer 112. The material nozzle 1212 supplies the modeling material M supplied from the material supply source 11 via the supply pipe 111 and the mixer 112. The material nozzle 1212 may pressure-feed the modeling material M supplied from the material supply source 11 via the supply pipe 111. That is, the mixer 112 mixes the powder or granular modeling material M supplied from the material supply source 11 with a conveying gas (pressurized gas) supplied from the gas supply source 16. The modeling material M mixed with the conveying gas in the mixer 112 is transported to the material nozzle 1212 through the supply pipe 111 by a flow of inert gas. As a result, the material nozzle 1212 supplies the modeling material M together with the transport gas. Consequently, the material nozzle 1212 is capable of spraying the modeling material M together with the inert gas from the material nozzle 1212. The transport gas is, for example, an inert gas such as nitrogen or argon, and is supplied from the gas supply source 16, which is also a purge gas supply source. While the transport gas and the purge gas are the same gas and supplied from the same gas supply source 16, this is not limiting. The transport gas may be supplied from a gas supply source different from the purge gas, or a gas different from the purge gas may be used, or any gas may be used. The material nozzle 1212 supplies the modeling material M downward (i.e., toward the -Z side) from the material nozzle 1212. A stage 131 is disposed below the material nozzle 1212. When a workpiece W is mounted on the stage 131, the material nozzle 1212 supplies the modeling material M toward the workpiece W or the vicinity of the workpiece W.

[0054] In this embodiment, the material nozzle 1212 supplies the modeling material M to the irradiation position of the processing light EL (i.e., the target irradiation area EA onto which the processing light EL from the irradiation optical system 1211 is irradiated). For this reason, the material nozzle 1212 and the irradiation optical system 1211 are aligned so that a target supply area MA, which is set on or near the workpiece W as the area onto which the material nozzle 1212 supplies the modeling material M, coincides with (or at least partially overlaps with) the target irradiation area EA. In this case, the modeling material M supplied from the material nozzle 1212 is irradiated with the processing light EL emitted by the irradiation optical system 1211. As a result, the modeling material M melts. That is, a molten pool MP containing the molten modeling material M is formed on the workpiece W.

[0055] The material nozzle 1212 may supply the forming material M to the molten pool MP formed by the processing light EL emitted from the irradiation optical system 1211. Alternatively, for example, the processing device 1 may melt the forming material M from the material nozzle 1212 using the irradiation optical system 1211 before the forming material M reaches the workpiece W, and then adhere the molten forming material M to the workpiece W.

[0056] The head drive system 122 moves the machining head 121 under the control of the control unit 17. That is, the head drive system 122 moves the irradiation optical system 1211 and the material nozzle 1212 under the control of the control unit 17. The head drive system 122 moves the machining head 121, for example, along at least one of the X-axis, Y-axis, Z-axis, θX direction, θY direction, and θZ direction. When the head drive system 122 moves the machining head 121, the relative positions of the machining head 121, the stage 131, and the workpiece W placed on the stage 131 change. As a result, the target irradiation area EA and the target supply area MA (and further, the molten pool MP) move relative to the workpiece W.

[0057] The stage unit 13 includes a stage 131 and a stage drive system 132 .

[0058] A workpiece W is placed on the stage (mounting device) 131. The stage 131 is capable of supporting the workpiece W placed on the stage 131. The stage 131 may be capable of holding the workpiece W placed on the stage 131. In this case, the stage 131 may be equipped with at least one of a mechanical chuck, an electrostatic chuck, a vacuum chuck, etc. to hold the workpiece W. Alternatively, the stage 131 may not be capable of holding the workpiece W placed on the stage 131. In this case, the workpiece W may be placed on the stage 131 in a clampless manner. Note that the workpiece W does not have to be placed on the stage 131. For example, the workpiece W may be placed on a mounting surface.

[0059] The workpiece W may be attached to a jig 133, which is a holding member that holds the workpiece W. In this case, the workpiece W may be attached to the jig 133, and the jig 133 to which the workpiece W is attached may be placed on the stage 131. In other words, the jig 133 may hold the workpiece W, and the jig 133 holding the workpiece W may be placed on the stage 131.

[0060] As described above, since the stage unit 13 is disposed in the chamber space 183IN inside the housing 18, the stage 131 provided in the stage unit 13 may also be disposed in the chamber space 183IN inside the housing 18. Furthermore, the workpiece W placed on the stage 131 may also be disposed in the chamber space 183IN inside the housing 18. In this case, the processing apparatus 1 may process the workpiece W disposed in the chamber space 183IN inside the housing 18.

[0061] The stage drive system (displacement device) 132 moves the stage 131 under the control of the control unit 17. The stage drive system 132 moves the stage 131, for example, along at least one of the X-axis, Y-axis, Z-axis, θX direction, θY direction, and θZ direction. When the stage drive system 132 moves the stage 131, the relative positional relationship between the stage 131 and the workpiece W placed on the stage 131 and the machining head 121 changes. As a result, the target irradiation area EA and the target supply area MA (and further, the molten pool MP) move relative to the workpiece W.

[0062] The light source 15 emits, for example, at least one of infrared light, visible light, and ultraviolet light as the processing light EL. However, other types of light may be used as the processing light EL. The processing light EL may include multiple pulsed lights (i.e., multiple pulse beams). The processing light EL may include continuous light (CW: Continuous Wave). The processing light EL may be laser light. In this case, the light source 15 may include a semiconductor laser such as a laser light source (e.g., a laser diode (LD)). The laser light source may be a fiber laser, a CO ２ The light source 15 may include at least one of a laser, a YAG laser, an excimer laser, etc. However, the processing light EL does not have to be laser light. The light source 15 may include any light source (for example, at least one of an LED (Light Emitting Diode), a discharge lamp, etc.).

[0063] The gas supply source 16 is a supply source of purge gas for purging the chamber space 183IN inside the housing 18. The purge gas includes an inert gas. Examples of the inert gas include nitrogen gas and argon gas. The gas supply source 16 is connected to the chamber space 183IN via a supply port 182 formed in a partition member 181 of the housing 18 and a supply pipe 161 connecting the gas supply source 16 and the supply port 182. The gas supply source 16 supplies purge gas to the chamber space 183IN via the supply pipe 161 and the supply port 182. As a result, the chamber space 183IN becomes a space purged with the purge gas. The purge gas supplied to the chamber space 183IN may be exhausted from an exhaust port (not shown) formed in the partition member 181. The gas supply source 16 may be a cylinder containing an inert gas. When the inert gas is nitrogen gas, the gas supply source 16 may be a nitrogen gas generator that generates nitrogen gas using air as a raw material.

[0064] When the material nozzle 1212 supplies the modeling material M together with a purge gas, the gas supply source 16 may supply the purge gas to the mixer 112 to which the modeling material M is supplied from the material supply source 11. Specifically, the gas supply source 16 may be connected to the mixer 112 via a supply pipe 162 connecting the gas supply source 16 and the mixer 112. As a result, the gas supply source 16 supplies the purge gas to the mixer 112 via the supply pipe 162. In this case, the modeling material M from the material supply source 11 may be supplied (specifically, pressure-fed) through the supply pipe 111 toward the material nozzle 1212 by the purge gas supplied from the gas supply source 16 via the supply pipe 162. In other words, the gas supply source 16 may be connected to the material nozzle 1212 via the supply pipe 162, the mixer 112, and the supply pipe 111. In this case, the material nozzle 1212 supplies the modeling material M together with a purge gas for pumping the modeling material M.

[0065] The control unit 17 controls the operation of the processing apparatus 1. For example, the control unit 17 may control the processing unit 12 (for example, at least one of the processing head 121 and the head drive system 122) provided in the processing apparatus 1 so as to process the workpiece W. For example, the control unit 17 may control the stage unit 13 (for example, the stage drive system 132) provided in the processing apparatus 1 so as to process the workpiece W.

[0066] The control unit 17 may include, for example, an arithmetic device (processor) 171 and a storage device (memory) 172 .

[0067] The arithmetic device 171 may include, for example, at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). In addition, the arithmetic device 171 may include not only computers having different architectures such as a single / multi-processor architecture and a sequential (von Neumann) / parallel architecture, but also special circuits including at least one of a field programmable gate array (FPGA), an application specific circuit (ASIC), and a signal processing device. The arithmetic device 171 reads a computer program (computer program code). For example, the arithmetic device 171 may read a computer program stored in the storage device 172. For example, the arithmetic device 171 may read a computer program stored in a computer-readable, non-transitory recording medium using a recording medium reading device (not shown). The arithmetic device 171 may communicate with a device (not shown) located outside the control unit 17 (for example, outside the processing device 1) via a communication device (not shown). The arithmetic device 171 may acquire (i.e., download or read) a computer program from a storage device (not shown) located outside the control unit 17 (e.g., outside the machining device 1) via a communication device (not shown). The arithmetic device 171 executes the loaded computer program. As a result, logical functional blocks for executing operations to be performed by the control unit 17 (e.g., operations for controlling the machining device 1) are realized within the arithmetic device 171. In other words, the arithmetic device 171 can function as a controller for realizing logical functional blocks for executing operations to be performed by the control unit 17. In this case, any device (typically, a computer) that executes a computer program can function as the control unit 17.

[0068] In this way, the control unit 17 functions as a device that controls the operation of the processing device 1 by the arithmetic device 171 executing a computer program (computer program code). This computer program is a computer program that causes the arithmetic device 171 to perform (i.e., execute) the operation that the control unit 17 should perform. In other words, this computer program is a computer program that causes the control unit 17 to function so as to cause the processing device 1 to perform the operation described below.

[0069] The storage device 172 can store desired data. For example, the storage device 172 may temporarily store a computer program including computer program instructions for controlling processing. The computer program instructions provide logic and routines that enable the arithmetic device 171 to execute operations for controlling the machining apparatus 1. Although the computer program is transmitted from the storage device 172 to the arithmetic device 171 via a data bus (not shown), it may also be transmitted via, for example, a computer-readable storage medium, a computer program product, a memory device, or a recording medium such as a CD-ROM or DVD. The storage device 172 may temporarily store data that the arithmetic device 171 temporarily uses when the arithmetic device 171 is executing a computer program (computer program code). The storage device 172 may also store data that the control device 17 stores long-term. The storage device 172 may include at least one of a RAM (Random Access Memory), a ROM (Read Only Memory), a hard disk device, a magneto-optical disk device, an SSD (Solid State Drive), and a disk array device. In other words, the storage device 172 may include a non-transitory recording medium.

[0070] The control unit 17 may control the emission mode of the processing light EL by the irradiation optical system 1211. The emission mode may include, for example, at least one of the intensity of the processing light EL and the emission timing of the processing light EL. When the processing light EL includes multiple pulsed lights, the emission mode may include, for example, at least one of the emission duration of the pulsed light, the emission cycle of the pulsed light, and the ratio between the emission duration of the pulsed light and the emission cycle of the pulsed light (so-called duty ratio). Furthermore, the control unit 17 may control the movement mode of the processing head 121 by the head drive system 122. The control unit 17 may control the movement mode of the stage 131 by the stage drive system 132. The movement mode may include, for example, at least one of the movement amount, movement speed, movement direction, and movement timing (movement time). Furthermore, the control unit 17 may control the supply mode of the modeling material M by the material nozzle 1212. The supply mode may include, for example, at least one of the supply amount (particularly, the supply amount per unit time) and the supply timing (supply time).

[0071] The control unit 17 does not have to be provided inside the processing apparatus 1. For example, the control unit 17 may be provided as a server or the like outside the processing apparatus 1. In this case, the control unit 17 and the processing apparatus 1 may be connected via a wired and / or wireless network (or a data bus and / or a communication line). The wired network may be a network using a serial bus interface, such as at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485, and USB. The wired network may be a network using a parallel bus interface. The wired network may be a network using an Ethernet (registered trademark) interface, such as at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T. The wireless network may be a network using radio waves. An example of a network using radio waves is a network compliant with IEEE 802.1x (e.g., at least one of a wireless LAN and Bluetooth (registered trademark)). A network using infrared rays may be used as the wireless network. A network using optical communication may be used as the wireless network. In this case, the control unit 17 and the processing device 1 may be configured to be able to transmit and receive various information via the network. The control unit 17 may also be able to transmit information such as commands and control parameters to the processing device 1 via the network. The processing device 1 may include a receiving device that receives information such as commands and control parameters from the control unit 17 via the network. The processing device 1 may also include a transmitting device (i.e., an output device that outputs information to the control unit 17) that transmits information such as commands and control parameters to the control unit 17 via the network. Alternatively, a first control device that performs part of the processing performed by the control unit 17 may be provided inside the processing device 1, while a second control device that performs another part of the processing performed by the control unit 17 may be provided outside the processing device 1.

[0072] A computational model that can be constructed by machine learning may be implemented in the control unit 17 by the arithmetic device 171 executing a computer program. An example of a computational model that can be constructed by machine learning is a computational model including a neural network (so-called artificial intelligence (AI)). In this case, learning of the computational model may include learning of parameters of the neural network (e.g., at least one of a weight and a bias). The control unit 17 may control the operation of the processing device 1 using the computational model. In other words, the operation of controlling the operation of the processing device 1 may include the operation of controlling the operation of the processing device 1 using the computational model. The control unit 17 may be implemented with a computational model that has been constructed by offline machine learning using training data. Furthermore, the computational model implemented in the control unit 17 may be updated on the control unit 17 by online machine learning. Alternatively, the control unit 17 may control the operation of the processing device 1 using a computational model implemented in a device external to the control unit 17 (i.e., a device provided outside the processing device 1) in addition to or instead of the computational model implemented in the control unit 17.

[0073] The recording medium for recording the computer program executed by the control unit 17 may be at least one of the following: a CD-ROM, CD-R, CD-RW, a flexible disk, an MO, a DVD-ROM, a DVD-RAM, a DVD-R, a DVD+R, a DVD-RW, a DVD+RW, and an optical disk such as Blu-ray (registered trademark), a magnetic medium such as a magnetic tape, a magneto-optical disk, a semiconductor memory such as a USB memory, and any other medium capable of storing a program. The recording medium may also include a device capable of recording a computer program (for example, a general-purpose device or a dedicated device in which a computer program is implemented in an executable state in at least one of the forms of software and firmware). Furthermore, each process or function included in the computer program may be realized by a logical processing block realized within the control unit 17 (i.e., the computer) as the control unit 17 executes the computer program, or may be realized by hardware such as a predetermined gate array (FPGA (Field Programmable Gate Array), ASIC (Application Specific Integrated Circuit)) included in the control unit 17, or may be realized in a form that combines logical processing blocks and partial hardware modules that realize some elements of the hardware.

[0074] (1-3) Structure of Measurement System 2 Next, with reference to FIG. 4, the configuration of the measurement system 2 that uses light to perform flaw detection testing on at least one of the workpiece W and the molded object will be described. Note that the measurement system 2 of this embodiment will be described using, as an example, a fluorescent flaw detection test that performs flaw detection based on the fluorescence emitted from the flaw detection liquid when the flaw detection liquid is irradiated with ultraviolet (UV) light. However, the measurement system 2 is not limited to fluorescent flaw detection testing, and may also perform a penetrant flaw detection test in which a flaw detection liquid is penetrated into a defect (flaw) to detect the defect. FIG. 4 is a block diagram showing the configuration of the measurement system 2. As shown in FIG. 4, the measurement system 2 includes an imaging system (imaging device) 21 and a control device 22.

[0075] The imaging system 21 is capable of imaging the workpiece W. By imaging the workpiece W, the imaging system 21 generates a workpiece image IMG in which the workpiece W is captured. The imaging system 21 generates workpiece image data IMD that indicates the workpiece image IMG. The imaging system 21 outputs the generated workpiece image data IMD to the control device 22. The control device 22 generates processing control information and detects defects in the workpiece W based on the workpiece image data IMD (i.e., the workpiece image IMG) that is the output of the imaging system 21.

[0076] An example of the configuration of the imaging system 21 is shown in FIG. 5, which is a block diagram showing the configuration of the imaging system 21, and FIG. 6, which is a cross-sectional view showing the configuration of the imaging system 21. As shown in FIGS. 5 and 6, the imaging system 21 includes a stage unit 211, an imaging unit (imaging device) 212, a housing 213, and an imaging drive system 214. However, the imaging system 21 does not necessarily have to include the imaging drive system 214. The stage unit 211 includes a stage 2111 and a stage drive system 2112. However, the stage unit 211 does not necessarily have to include the stage drive system 2112. Furthermore, the imaging unit 212 includes a stereo camera 2121, a projection device 2122, a lighting device 2123, and a filter 2124. Note that the imaging unit 212 may include a single projection device 2122 or multiple projection devices 2122. The imaging unit 212 may include a single lighting device 2123 or multiple lighting devices 2123 .

[0077] The workpiece W is placed on the stage 2111. For this reason, the stage 2111 may be referred to as a mounting device on which the workpiece W is placed. The stage unit 211, which includes the stage 2111 on which the workpiece W is placed, may also be referred to as a mounting device. The stage 2111 is capable of supporting the workpiece W placed on the stage 2111. The stage 2111 may be capable of holding the workpiece W placed on the stage 2111. In this case, the stage 2111 may be equipped with at least one of a mechanical chuck, an electrostatic chuck, a vacuum chuck, etc. to hold the workpiece W. Alternatively, the stage 2111 may not be capable of holding the workpiece W placed on the stage 2111. In this case, the workpiece W may be placed on the stage 2111 in a clampless manner. Note that the workpiece W does not have to be placed on the stage 2111. For example, the workpiece W may be placed on a mounting surface.

[0078] As described above, the workpiece W may be attached to the jig 133, which is a holding member that holds the workpiece W. In this case, the workpiece W may be attached to the jig 133, and the jig 133 to which the workpiece W is attached may be placed on the stage 2111. In other words, the jig 133 may hold the workpiece W, and the jig 133 holding the workpiece W may be placed on the stage 2111.

[0079] A stage drive system (displacement device) 2112 moves the stage 2111. The stage drive system 2112 moves the stage 2111, for example, along at least one of the X-axis, Y-axis, Z-axis, θX direction, θY direction, and θZ direction. When the stage drive system 2112 moves the stage 2111, the relative positional relationship between the stage 2111 and each of the workpieces W placed on the stage 2111 and the imaging unit 212 (that is, at least one of the stereo camera 2121, the projection device 2122, and the lighting device 2123) changes.

[0080] The stereo camera 2121 is an imaging device (camera) capable of capturing images of the workpiece W. In particular, the stereo camera 2121 includes two monocular cameras, cameras 2125 and 2126. The cameras 2125 and 2126 are aligned with each other so that the cameras 2125 and 2126 are disposed at a predetermined distance from each other. The cameras 2125 and 2126 may be disposed so that the relative positional relationship between the cameras 2125 and 2126 is fixed. In particular, even if the positional relationship between the stage 2111 and each of the workpieces W placed on the stage 2111 and the cameras 2125 and 2126 (i.e., the stereo camera 2121) is changed by the stage drive system 2112 described above moving the stage 2111, the relative positional relationship between the cameras 2125 and 2126 does not need to be changed. Conversely, the stage drive system 2112 may be a drive system that can change the positional relationship between each of the stage 2111 and the workpiece W and each of the cameras 2125 and 2126 without changing the relative positional relationship between the cameras 2125 and 2126.

[0081] Each of the cameras 2125 and 2126 is an imaging device capable of capturing an image of the workpiece W. Each of the cameras 2125 and 2126 is an imaging device equipped with an imaging element IS capable of capturing an image of the workpiece W. Examples of the imaging element IS include a CCD (Charge Coupled Device) sensor and a CMOS (Complementary Metal-Oxide-Semiconductor) sensor.

[0082] Each of the cameras 2125 and 2126 may be disposed at a specific location. For example, each of the cameras 2125 and 2126 may be disposed at a specific location where it can image the workpiece W placed on the stage 2111. Each of the cameras 2125 and 2126 may be capable of imaging the workpiece W at a specific angle of view. For example, each of the cameras 2125 and 2126 may be capable of imaging the workpiece W in a state where the angle of view of each of the cameras 2125 and 2126 is aligned with the workpiece W so that the entire workpiece W placed on the stage 2111 fits within the angle of view. For example, each of the cameras 2125 and 2126 may be capable of imaging the workpiece W in a state where the angle of view of each of the cameras 2125 and 2126 is aligned with the workpiece W so that a portion of the workpiece W placed on the stage 2111 fits within the angle of view.

[0083] Each of the cameras 2125 and 2126 generates a workpiece image IMG by capturing an image of the workpiece W. That is, the camera 2125 generates a workpiece image IMG as its output, and the camera 2126 generates a workpiece image IMG as its output. Therefore, the stereo camera 2121 generates two workpiece images IMG generated by the cameras 2125 and 2126, respectively, as its output. The stereo camera 2121 generates workpiece image data IMD indicating the two workpiece images IMG generated by the cameras 2125 and 2126, respectively, as its output. In the following description, the workpiece image IMG generated by the camera 2125 will be referred to as workpiece image IMG #1, and the workpiece image IMG generated by the camera 2126 will be referred to as workpiece image IMG #2, as necessary, to distinguish between the two.

[0084] When the stereo camera 2121 captures an image of the workpiece W attached to the jig 133, the stereo camera 2121 may capture an image of the jig 133 to which the workpiece W is attached, as well as the workpiece W. In other words, the stereo camera 2121 may capture an image of the workpiece W and the jig 133 under conditions in which both the workpiece W and the jig 133 are included in the angle of view of the stereo camera 2121. The advantages of the stereo camera 2121 capturing an image of the workpiece W and the jig 133 will be described in detail later.

[0085] The projection device 2122 is a projector capable of projecting a predetermined projection pattern onto the workpiece W. In particular, the projection device 2122 projects the predetermined projection pattern onto the workpiece W in order to measure the three-dimensional shape of the workpiece W. In this case, the stereo camera 2121 uses both cameras 2125 and 2126 to capture an image of the workpiece W onto which the projection pattern is projected. In other words, both cameras 2125 and 2126 capture an image of the workpiece W onto which the projection pattern is projected. In this case, as will be described in detail later, the control device 22 generates three-dimensional shape information indicating the three-dimensional shape of the workpiece W based on both two workpiece images IMG#1 and IMG#2, each of which captures the workpiece W onto which the projection pattern is projected. In other words, the projection device 2122 projects the predetermined projection pattern onto the workpiece W when the control device 22 acquires the workpiece images IMG#1 and IMG#2 in order to generate the three-dimensional shape information of the workpiece W.

[0086] The lighting device 2123 is a light that can illuminate the workpiece W with illumination light. In other words, the lighting device 2123 is a light that can irradiate the workpiece W with illumination light. In particular, the lighting device 2123 illuminates the workpiece W with illumination light in order to detect cracks in the workpiece W. Specifically, in order to detect cracks in the workpiece W, a flaw detection agent (penetrant) that penetrates the cracks in the workpiece W is applied to the workpiece W. The flaw detection agent contains a fluorescent substance. After the flaw detection agent is applied to the workpiece W, the flaw detection agent on the surface of the workpiece W is removed (e.g., washed). In this case, the flaw detection agent that has penetrated the cracks is not removed. After the flaw detection agent is removed from the workpiece W, a developer may be applied to the workpiece W, if necessary, to suck out the flaw detection agent that has penetrated the cracks in the workpiece W. Then, the lighting device 2123 illuminates the workpiece W to which the flaw detection agent has been applied (and to which a developer has been applied, if necessary) with illumination light. In this case, the lighting device 2123 illuminates the workpiece W with illumination light that reacts with the flaw detection agent (particularly, the fluorescent substance contained in the flaw detection agent). Specifically, the lighting device 2123 illuminates the workpiece W with illumination light that can excite the flaw detection agent (particularly, the fluorescent substance contained in the flaw detection agent). In this embodiment, an example will be described in which the lighting device 2123 illuminates the workpiece W with illumination light that is ultraviolet light. For this reason, in the following description, the illumination light used by the lighting device 2123 to illuminate the workpiece W will be referred to as UV (UltraViolet) illumination light. As a result, the flaw detection agent (fluorescent substance) that has penetrated the crack absorbs and is excited by the UV illumination light, and the flaw detection agent that has penetrated the crack emits excitation light. In other words, the flaw detection agent illuminated by the UV illumination light is excited, and excitation light is emitted from the flaw detection agent. As a result, the cracks in the workpiece W are highlighted by the excitation light. In other words, fluorescent cracks are highlighted. In this case, the stereo camera 2121 captures an image of the workpiece W illuminated with UV illumination light using at least one of the cameras 2125 and 2126. That is, at least one of the cameras 2125 and 2126 captures an image of the workpiece W illuminated with UV illumination light. In this case, as will be described in detail later, the control device 22 detects cracks in the workpiece W based on at least one of the two workpiece images IMG#1 and IMG#2 in which the workpiece W illuminated with illumination light is captured.In other words, the illumination device 23 illuminates the workpiece W with UV illumination light when the control device 22 acquires at least one of the workpiece images IMG#1 and IMG#2 to detect cracks in the workpiece W.

[0087] The filter 2124 is an optical filter capable of cutting ultraviolet light. The stereo camera 2121 images the workpiece W through the filter 2124. As a result, the stereo camera 2121 can image the workpiece W while reducing the influence of the UV illumination light emitted by the lighting device 2123. Specifically, when the lighting device 2123 is irradiating the workpiece W with UV illumination light, the image sensor IS of the stereo camera 2121 can receive excitation light emitted by the flaw detection agent applied to the workpiece W while reducing the influence of at least one of the reflected light and scattered light of the UV illumination light by the workpiece W.

[0088] The housing 213 is a housing device having an internal space formed therein for housing at least the stage 2111. Therefore, at least the stage 2111 may be disposed inside the housing 213.

[0089] Since the stage 2111 is disposed inside the housing 213, the workpiece W placed on the stage 2111 may also be disposed inside the housing 213. In this case, the measurement system 2 may measure the workpiece W disposed inside the housing 213. The measurement system 2 may inspect the workpiece W disposed inside the housing 213.

[0090] The stereo camera 2121 may be disposed inside the housing 213. In this case, the stereo camera 2121 may capture an image of the workpiece W disposed inside the housing 213 from a position inside the housing 213. Alternatively, the stereo camera 2121 may be disposed outside the housing 213. In this case, the stereo camera 2121 may capture an image of the workpiece W disposed inside the housing 213 from a position outside the housing 213 through an optical window formed in the housing 213.

[0091] The projection device 2122 may be disposed inside the housing 213. In this case, the projection device 2122 may project a projection pattern onto the workpiece W disposed inside the housing 213 from a position inside the housing 213. Alternatively, the projection device 2122 may be disposed outside the housing 213. In this case, the projection device 2122 may project a projection pattern onto the workpiece W disposed inside the housing 213 from a position outside the housing 213 through an optical window formed in the housing 213.

[0092] The illumination device 2123 may be disposed inside the housing 213. In this case, the illumination device 2123 may illuminate the workpiece W disposed inside the housing 213 with illumination light from a position inside the housing 213. Alternatively, the illumination device 2123 may be disposed outside the housing 213. In this case, the illumination device 2123 may illuminate the workpiece W disposed inside the housing 213 with illumination light from a position outside the housing 213 through an optical window formed in the housing 213.

[0093] The imaging drive system 214 is a drive system capable of moving the imaging unit 212. The imaging drive system 214 may move the imaging unit 212, for example, along at least one of the X-axis, Y-axis, Z-axis, θX direction, θY direction, and θZ direction. FIG. 5 shows an example in which the imaging drive system 214 is a drive system capable of moving the imaging unit 212 along the Z-axis. In this case, the imaging drive system 214 may include a Z guide member 2141 extending along the Z-axis direction and a Z slide member 2142 movable along the Z guide 214 and to which the imaging unit 212 is attached. When the imaging drive system 214 moves the imaging unit 212, the relative positional relationship between the stage 2111, the workpiece W placed on the stage 2111, and the imaging unit 212 (i.e., at least one of the stereo camera 2121, the projection device 2122, and the lighting device 2123) changes.

[0094] The control device 22 generates processing control information and detects cracks in the workpiece W. That is, the control device 22 generates processing control information and inspects the workpiece W. An example of the configuration of the control device 22 capable of generating processing control information and inspecting the workpiece W is shown in FIG. 7. As shown in FIG. 7, the control device 22 includes an arithmetic device (processor) 221, a storage device (memory) 222, and a communication device 223. The control device 22 may further include an input device 224 and a display device 225. The arithmetic device 221, the storage device 222, the communication device 223, the input device 224, and the display device 225 may be connected via a data bus 226.

[0095] The arithmetic device 221 may include, for example, at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). In addition, the arithmetic device 221 may include not only computers having different architectures such as a single / multi-processor architecture and a sequential (von Neumann) / parallel architecture, but also special circuits including at least one of a field programmable gate array (FPGA), an application specific circuit (ASIC), and a signal processing device. The arithmetic device 221 reads a computer program (computer program code). For example, the arithmetic device 221 may read a computer program stored in the storage device 222. For example, the arithmetic device 221 may read a computer program stored in a computer-readable, non-transitory storage medium using a storage medium reading device (not shown). The arithmetic device 221 may receive computer program code from a device (not shown) located outside the control device 22 via the communication device 223. The arithmetic device 221 may acquire (i.e., download or read) a computer program stored in a storage device of a device (not shown) located outside the control device 22 via the communication device 223. The arithmetic device 221 executes the loaded computer program. As a result, logical function blocks for executing operations to be performed by the control device 22 (e.g., operations for generating machining control information and inspecting the workpiece W) are realized within the arithmetic device 221. In other words, the arithmetic device 221 can function as a controller for realizing logical function blocks for executing operations to be performed by the control device 22. In this case, any device (typically, a computer) that executes a computer program can function as the control device 22.

[0096] In this way, the control device 22 functions as a device that executes the operations to be performed by the control device 22, by the arithmetic device 221 executing a computer program (computer program code). This computer program is a computer program for causing the arithmetic device 221 to perform (i.e., execute) the operations to be performed by the control device 22. In other words, this computer program is a computer program for causing the control device 22 to function so as to cause the measurement system 2 to perform the operations described below.

[0097] Fig. 7 shows an example of logical functional blocks realized within the arithmetic device 221. As shown in Fig. 7, a control information generation unit 2211 and a work inspection unit 2212 are realized within the arithmetic device 221. Details of the operations of the control information generation unit 2211 and the work inspection unit 2212 will be explained later with reference to Fig. 8 etc., but a brief outline will be given below.

[0098] A computational model that can be constructed by machine learning may be implemented in the computational device 221 by the computational device 221 executing a computer program. An example of a computational model that can be constructed by machine learning is a computational model including a neural network (so-called artificial intelligence (AI)). In this case, learning of the computational model may include learning of parameters of the neural network (e.g., at least one of a weight and a bias). The computational device 221 may generate processing control information using the computational model. The computational device 221 may inspect the workpiece W using the computational model. Note that a computational model that has been constructed by offline machine learning using teacher data may be implemented in the computational device 221. Furthermore, the computational model implemented in the computational device 221 may be updated by online machine learning on the computational device 221. Alternatively, the calculation device 221 may generate processing control information and / or inspect the workpiece W using a calculation model implemented in a device external to the calculation device 221 (i.e., a device provided outside the control device 22) in addition to or instead of the calculation model implemented in the calculation device 221.

[0099] The storage device 222 can store desired data. For example, the storage device 222 may temporarily store a computer program including computer program instructions for controlling processing. The computer program instructions provide logic and routines that enable the processing device 221 to execute the method illustrated in FIG. 8 , which will be described later. Although the computer program is transmitted from the storage device 222 to the processing device 221 via the data bus 226, it may also be transmitted via, for example, a computer-readable storage medium, a computer program product, a memory device, or a recording medium such as a CD-ROM or DVD. The storage device 222 may temporarily store data that the processing device 221 uses temporarily when the processing device 221 is executing the computer program (computer program code). The storage device 222 may also store data that the control device 22 will retain for a long period of time. The storage device 222 may include at least one of a RAM (Random Access Memory), a ROM (Read Only Memory), a hard disk device, a magneto-optical disk device, an SSD (Solid State Drive), and a disk array device. In other words, the storage device 222 may include a non-transitory recording medium.

[0100] The recording medium for recording the computer program executed by the control device 22 may be at least one of the following: a CD-ROM, CD-R, CD-RW, a flexible disk, an MO, a DVD-ROM, a DVD-RAM, a DVD-R, a DVD+R, a DVD-RW, a DVD+RW, and an optical disk such as Blu-ray (registered trademark), a magnetic medium such as a magnetic tape, a magneto-optical disk, a semiconductor memory such as a USB memory, and any other medium capable of storing a program. The recording medium may also include a device capable of recording a computer program (for example, a general-purpose device or a dedicated device in which a computer program is implemented in a state in which it can be executed in at least one of the forms of software and firmware). Furthermore, each process or function included in the computer program may be realized by a logical processing block realized within the control device 22 when the control device 22 (i.e., the computer) executes the computer program, or may be realized by hardware such as a predetermined gate array (FPGA (Field Programmable Gate Array), ASIC (Application Specific Integrated Circuit)) provided in the control device 22, or may be realized in a form that mixes logical processing blocks and partial hardware modules that realize some elements of the hardware.

[0101] The communication device 223 can communicate with the processing device 1 via a communication network (not shown). For example, the communication device 223 may be able to transmit (in other words, output) processing control information generated by the control device 22 to the processing device 1 (or a device different from the processing device 1). For example, the communication device 223 may be able to transmit (in other words, output) inspection defect information regarding the result of inspection of the workpiece W by the control device 22 to the processing device 1 (or a device different from the processing device 1).

[0102] The input device 224 is a device that accepts information input to the control device 22 from outside the control device 22. For example, the input device 224 may include an operation device that can be operated by a user (for example, at least one of a keyboard, a mouse, and a touch panel). In this case, the input device 224 may accept user input. For example, the input device 224 may include a reading device that can read information recorded as data on a recording medium that can be externally attached to the control device 22. For example, the input device 224 may accept information input from a robot external to the control device 22. For example, the input device 224 may accept information input from a computer external to the control device 22.

[0103] The display device 225 can display desired information as an image. That is, the display device 225 can display an image showing information that is to be output.

[0104] (2) Operation of the Machining System SYS Next, the operation performed by the machining system SYS will be described. In this embodiment, the machining system SYS may perform (execute) a machining operation (machining method) for machining the workpiece W mainly using the machining device 1 and the measurement system 2. Therefore, the machining operation performed by the machining system SYS will be described below.

[0105] (2-1) Overall Flow of Machining Operation First, the overall flow of the machining operation executed by the machining system SYS will be described with reference to Fig. 8. Fig. 8 is a flowchart showing the overall flow of the machining operation performed by the machining system SYS.

[0106] 8 , before the processing device 1 starts processing the workpiece W, the measurement system 2 inspects the workpiece W (step S1). That is, the arithmetic device 221 of the measurement system 2 executes a program (program code) read from the storage device 222, and performs (executes) a workpiece inspection operation (inspection method) to inspect the workpiece W (step S1). At this timing, if it is determined as a result of the workpiece inspection operation in step S1 that a crack has occurred in the workpiece W (i.e., a crack has been detected) (step S2: Yes), the control device 22 of the measurement system 2 (particularly, the workpiece inspection unit 2212 of the arithmetic device 221) may output an alert indicating that a crack has occurred in the workpiece W.

[0107] For example, the workpiece inspection unit 2212 may control the display device 225 to display an alert, so that the operator of the machining system SYS can recognize that a crack has occurred in the workpiece W.

[0108] For example, the workpiece inspection unit 2212 may use the communication device 223 to output (transmit) to the processing device 1 an alert indicating that a crack has occurred in the workpiece W. In this case, the processing device 1 that has received the alert does not need to process the workpiece W. In other words, the processing device 1 does not need to perform additional processing to form a three-dimensional structure on the workpiece W. As a result, after the three-dimensional structure has been formed on the workpiece W, there is no possibility that the three-dimensional structure formed on the workpiece W will break due to a crack that has occurred in the workpiece W.

[0109] Alternatively, if it is determined that a crack has occurred in the workpiece W (Step S2: Yes), the processing apparatus 1 may perform processing to remove defective portions, including cracks, from the workpiece W. For example, the processing apparatus 1 may perform removal processing to remove the defective portions by irradiating the defective portions of the workpiece W with processing light EL. In this case, the processing apparatus 1 may acquire information about the inspection results of the workpiece W (i.e., crack detection results) from the measurement system 2, identify the defective portions of the workpiece W based on the acquired information, and perform removal processing to remove the defective portions by irradiating the identified defective portions with processing light EL. The information about the crack detection results may include at least one of information about the position of the detected crack, information about the size of the detected crack, and information about the shape of the detected crack. After the defective portions have been removed, the processing apparatus 1 may perform additional processing on the workpiece W. For example, the processing apparatus 1 may perform additional processing to add a three-dimensional structure to the workpiece W to fill the removed defective portions, thereby substantially manufacturing (in other words, restoring) a workpiece W without cracks. Thereafter, the processing device 1 may perform additional processing to form a three-dimensional structure that was originally to be formed on the workpiece W. Alternatively, for example, the processing device 1 may perform additional processing to form a three-dimensional structure that integrates a three-dimensional structure for filling the removed defective portion with the three-dimensional structure that was originally to be formed on the workpiece W. As a result, after the three-dimensional structure has been formed on the workpiece W, there is no longer a possibility that the three-dimensional structure formed on the workpiece W will break due to cracks that have occurred in the workpiece W.

[0110] On the other hand, if the result of the workpiece inspection operation in step S1 determines that no cracks have occurred in the workpiece W (i.e., no cracks have been detected) (step S2: No), the processing device 1 processes the workpiece W.

[0111] In order to perform the workpiece inspection operation in step S1, the workpiece W is placed inside the housing 213 of the measurement system 2. Specifically, the workpiece W is placed on a stage 2111 placed inside the housing 213 of the measurement system 2. For example, the conveying device 3 may transport the workpiece W to the measurement system 2 and place the transported workpiece W on the stage 2111. Thereafter, the measurement system 2 may inspect the workpiece W placed on the stage 2111.

[0112] As described above, in this embodiment, an example has been described in which the arithmetic device 221 of the measurement system 2 inspects the workpiece W to detect cracks in the workpiece W as defects in the workpiece W. Note that the workpiece inspection operation corresponds to the operation of detecting cracks in the workpiece W.

[0113] As described above, a flaw detection agent may be applied to the workpiece W in order to detect cracks in the workpiece W. In this case, the flaw detection agent may be applied to the workpiece W before the workpiece W is transported to the measurement system 2, and then the workpiece W with the flaw detection agent applied may be transported to the measurement system 2. In other words, the flaw detection agent may be applied to the workpiece W before the workpiece W is placed inside the housing 213 of the measurement system 2, and then the workpiece W with the flaw detection agent applied may be transported inside the housing 213 of the measurement system 2. Specifically, the flaw detection agent may be applied to the workpiece W before the workpiece W is placed on the stage 2111 of the measurement system 2, and then the workpiece W with the flaw detection agent applied may be placed on the stage 2111 of the measurement system 2.

[0114] Alternatively, the workpiece W to which no flaw detection agent has been applied may be transported to the measurement system 2, and then the flaw detection agent may be applied to the workpiece W. In other words, the workpiece W to which no flaw detection agent has been applied may be placed inside the housing 213 of the measurement system 2, and then the flaw detection agent may be applied to the workpiece W. Specifically, the workpiece W to which no flaw detection agent has been applied may be placed on the stage 2111 of the measurement system 2, and then the flaw detection agent may be applied to the workpiece W.

[0115] In cases where a developer is further applied to the workpiece W to which the flaw detection agent has been applied, the developer may be applied to the workpiece W before the workpiece W is transported to the measurement system 2, and then the workpiece W coated with the developer may be transported to the measurement system 2. In other words, the developer may be applied to the workpiece W before the workpiece W is placed inside the housing 213 of the measurement system 2, and then the workpiece W coated with the developer may be transported inside the housing 213 of the measurement system 2. Specifically, the developer may be applied to the workpiece W before the workpiece W is placed on the stage 2111 of the measurement system 2, and then the workpiece W coated with the developer may be placed on the stage 2111 of the measurement system 2.

[0116] Alternatively, a workpiece W that has not been coated with a developer may be transported to the measurement system 2, and then the developer may be applied to the workpiece W. In other words, a workpiece W that has not been coated with a developer may be placed inside the housing 213 of the measurement system 2, and then the developer may be applied to the workpiece W. Specifically, a workpiece W that has not been coated with a developer may be placed on the stage 2111 of the measurement system 2, and then the developer may be applied to the workpiece W.

[0117] As described above, the workpiece W may be attached to the jig 133. In this case, the workpiece W may be attached to the jig 133, and then the workpiece W attached to the jig 133 (in other words, the jig 133 with the workpiece W attached) may be transported to the measurement system 2. In other words, the workpiece W may be attached to the jig 133, and then the workpiece W attached to the jig 133 (in other words, the jig 133 with the workpiece W attached) may be placed inside the housing 213 of the measurement system 2. Specifically, the workpiece W attached to the jig 133 (in other words, the jig 133 with the workpiece W attached) may be placed on the stage 2111 of the measurement system 2. The measurement system 2 may then inspect the workpiece W attached to the jig 133.

[0118] Alternatively, the workpiece W that is not attached to the jig 133 may be transported to the measurement system 2, and then the workpiece W may be attached to the jig 133 inside the measurement system 2. In other words, the workpiece W that is not attached to the jig 133 may be placed inside the housing 213 of the measurement system 2, and then the workpiece W that is placed inside the housing 213 may be attached to the jig 133. Specifically, the workpiece W that is not attached to the jig 133 may be placed on the stage 2111 of the measurement system 2, and then the workpiece W that is placed on the stage 2111 may be attached to the jig 133.

[0119] After the workpiece W is transported to the measurement system 2 (i.e., after the workpiece W is placed on the stage 2111), the measurement system 2 starts the workpiece inspection operation. Here, if the workpiece W is attached to the jig 133 as described above, the measurement system 2 may inspect the workpiece W attached to the jig 133. However, the measurement system 2 may also inspect a workpiece W that is not attached to the jig 133. The detailed flow of the workpiece inspection operation will be described later with reference to FIG. 9.

[0120] The processing device 1 processes the workpiece W based on the result of the workpiece inspection operation in step S1. That is, the processing device 1 uses the detection result of the crack in the workpiece W as input information, executes a program (program code) read from the storage device 172 in the arithmetic device 171, and processes the workpiece W based on the generated generation information.

[0121] At this timing, if it is determined as a result of the work inspection operation in step S1 that a crack has occurred in the work W (i.e., a crack has been detected) (step S2: Yes), the control device 22 of the measurement system 2 (particularly, the work inspection unit 2212 of the calculation device 221) may output an alert indicating that a crack has occurred in the work W.

[0122] In order to process the workpiece W, first, the control device 22 of the measurement system 2 (particularly, the control information generating unit 2211 of the arithmetic device 221) generates processing control information (step S3). Specifically, the control information generating unit 2211 may generate the processing control information based on three-dimensional shape information indicating the three-dimensional shape of the workpiece W.

[0123] The three-dimensional shape information is generated by the workpiece inspection unit 2212 of the calculation device 221. Specifically, as will be described in detail later, in the workpiece inspection operation of step S1, the workpiece inspection unit 2212 generates the three-dimensional shape information based on workpiece image data IMD including two workpiece images IMG#1 and IMG#2 generated by the stereo camera 2121. In this embodiment, an example will be described in which the workpiece inspection unit 2212 generates point cloud data indicating the three-dimensional shape of the workpiece W as a point cloud as three-dimensional shape information. In this case, the point cloud data is data indicating the three-dimensional shape of the workpiece W using a point cloud model, which is a three-dimensional model. In the following description, where necessary, the point cloud model indicated by the point cloud data generated by the workpiece inspection unit 2212 will be referred to as the workpiece model.

[0124] In this case, the control information generator 2211 may generate processing control information based on the workpiece model and a three-dimensional model (target model) indicating a target shape of the workpiece W after processing. Specifically, the control information generator 2211 generates a three-dimensional model indicating the three-dimensional shape of a three-dimensional structure to be formed by the processing device 1 through additive processing, based on the workpiece model and the target model. For example, the control information generator 2211 may generate a three-dimensional model (differential model) corresponding to the difference between the target model and the workpiece model as a three-dimensional model indicating the three-dimensional shape of the three-dimensional structure to be formed by the processing device 1. Then, the control information generator 2211 may generate processing control information based on the differential model. For example, the control information generator 2211 may perform a slicing process to divide the differential model into multiple layered models at a layering pitch corresponding to the thickness of the structural layers constituting the three-dimensional structure, thereby generating multiple slice data corresponding to each of the multiple structural layers constituting the three-dimensional structure. Thereafter, the control information generating unit 2211 may generate a plurality of pieces of processing control information to be used for forming a plurality of structure layers, respectively, based on the plurality of slice data.

[0125] The control information generating unit 2211 uses the communication device 223 to output (transmit) the generated processing control information to the processing device 1. The processing device 1 processes the workpiece W based on the processing control information generated by the control information generating unit 2211 (step S4).

[0126] However, before the processing device 1 starts processing the workpiece W, the workpiece W is transported from the measurement system 2 to the processing device 1. For example, the transport device 3 may take out the workpiece W from the housing 213 (particularly, the stage 2111) of the measurement system 2. The transport device 3 may transport the workpiece W taken out from the measurement system 2 to the processing device 1. That is, the transport device 3 may place the workpiece W taken out from the measurement system 2 in the chamber space 183IN inside the housing 18 of the processing device 1. Specifically, the transport device 3 may place the workpiece W taken out from the measurement system 2 on the stage 131 of the processing device 1. Thereafter, the processing device 1 may process the workpiece W (step S4).

[0127] As described above, a flaw detection agent may be applied to the workpiece W to detect cracks. As described above, the flaw detection agent applied to the workpiece W is generally removed (cleaned), but some of the flaw detection agent may remain in the cracks. In this case, the flaw detection agent (particularly, the flaw detection agent that has penetrated and remained in the cracks; the same applies hereinafter in this paragraph and the next paragraph) may be removed from the workpiece W before the workpiece W is transported from the measurement system 2 to the processing device 1, and the workpiece W from which the flaw detection agent has been removed may then be transported to the processing device 1. In other words, the flaw detection agent may be removed from the workpiece W before the workpiece W is transported from the measurement system 2 to the processing device 1, and the workpiece W from which the flaw detection agent has been removed may then be placed in the chamber space 183IN inside the housing 18 of the processing device 1. Specifically, the flaw detection agent may be removed from the workpiece W before the workpiece W is transported from the measurement system 2 to the processing device 1, and the workpiece W from which the flaw detection agent has been removed may then be placed on the stage 131 of the processing device 1. Furthermore, when the flaw detection agent is removed from the workpiece W, the flaw detection agent may be removed from the workpiece W before the workpiece W is removed from the measurement system 2, or the flaw detection agent may be removed from the workpiece W after the workpiece W is removed from the measurement system 2.

[0128] Alternatively, the flaw detection agent does not have to be removed from the workpiece W before the workpiece W is transported from the measurement system 2 to the processing device 1, and the workpiece W with the flaw detection agent remaining in the cracks may be transported to the processing device 1. In other words, the workpiece W with the flaw detection agent remaining in the cracks may be placed in the chamber space 183IN inside the housing 18 of the processing device 1. Specifically, the workpiece W with the flaw detection agent remaining in the cracks may be placed on the stage 131 of the processing device 1. Note that the flaw detection agent may be removed from the workpiece W after the workpiece W with the flaw detection agent remaining in the cracks is transported to the processing device 1. In this case, the processing device 1 may process the workpiece W from which the flaw detection agent has been removed. Alternatively, the flaw detection agent may not be removed from the workpiece W after the workpiece W with the flaw detection agent remaining in the cracks is transported to the processing device 1. In this case, the processing device 1 may process the workpiece W with the flaw detection agent remaining.

[0129] When a developer is applied to the workpiece W to detect cracks in the workpiece W, the developer may be removed from the workpiece W before the workpiece W is transported from the measurement system 2 to the processing apparatus 1, and then the workpiece W from which the developer has been removed may be transported to the processing apparatus 1. In other words, the developer may be removed from the workpiece W before the workpiece W is transported from the measurement system 2 to the processing apparatus 1, and then the workpiece W from which the developer has been removed may be placed in the chamber space 183IN inside the housing 18 of the processing apparatus 1. Specifically, the developer may be removed from the workpiece W before the workpiece W is transported from the measurement system 2 to the processing apparatus 1, and then the workpiece W from which the developer has been removed may be placed on the stage 131 of the processing apparatus 1. Note that when the developer is removed from the workpiece W, the developer may be removed from the workpiece W before the workpiece W is removed from the measurement system 2, or the developer may be removed from the workpiece W after the workpiece W is removed from the measurement system 2.

[0130] Alternatively, the developer does not have to be removed from the workpiece W before the workpiece W is transported from the measurement system 2 to the processing apparatus 1, and the workpiece W with the developer still applied thereto may be transported to the processing apparatus 1. That is, the workpiece W with the developer still applied thereto may be placed in the chamber space 183IN inside the housing 18 of the processing apparatus 1. Specifically, the workpiece W with the developer still applied thereto may be placed on the stage 131 of the processing apparatus 1. Note that the developer may be removed from the workpiece W after the workpiece W with the developer still applied thereto is transported to the processing apparatus 1. In this case, the processing apparatus 1 may process the workpiece W from which the developer has been removed. Alternatively, the developer does not have to be removed from the workpiece W after the workpiece W with the developer still applied thereto is transported to the processing apparatus 1. In this case, the processing apparatus 1 may process the workpiece W with the developer still applied thereto.

[0131] As described above, the measurement system 2 may inspect the workpiece W attached to the jig 133. In this case, the workpiece W attached to the jig 133 (in other words, the jig 133 with the workpiece W attached) may be transported from the measurement system 2 to the processing device 1. That is, the workpiece W attached to the jig 133 (in other words, the jig 133 with the workpiece W attached) may be placed in the chamber space 183IN inside the housing 18 of the processing device 1. Specifically, the workpiece W attached to the jig 133 (in other words, the jig 133 with the workpiece W attached) may be placed on the stage 131 of the processing device 1. Thereafter, the processing device 1 may process the workpiece W attached to the jig 133.

[0132] That is, the workpiece W may remain attached to the jig 133 during the period from when the measurement system 2 inspects the workpiece W in step S1 until when the processing device 1 processes the workpiece W in step S4. In this case, the relative positional relationship between the workpiece W and the jig 133 is fixed during the period from when the measurement system 2 inspects the workpiece W until when the processing device 1 processes the workpiece W. Therefore, if information regarding the position of the jig 133 in the processing coordinate system used by the processing device 1 is known to the processing device 1, the processing device 1 can directly use the measurement results of the workpiece W and the jig 133 in the measurement coordinate system used by the measurement system 2 (that is, the measurement results of the three-dimensional shape, essentially the measurement results of the position) to identify the position of the workpiece W in the processing coordinate system. Alternatively, as long as the processing device 1 measures the position of the jig 133 in the processing coordinate system used by the processing device 1, the processing device 1 can directly use the measurement results of the workpiece W and the jig 133 in the measurement coordinate system used by the measurement system 2 (i.e., the measurement results of the three-dimensional shape, essentially the measurement results of the position) to identify the position of the workpiece W in the processing coordinate system. Therefore, after the workpiece W is transported to the processing device 1, the processing device 1 does not need to measure the three-dimensional shape (position) of the workpiece W again. This makes it possible to improve the efficiency of the processing operation. Furthermore, since it is no longer necessary to remove the workpiece W from the jig 133, the throughput of the processing operation is improved.

[0133] After the processing device 1 completes processing of the workpiece W, the measurement system 2 inspects the workpiece W (step S5). That is, the measurement system 2 performs (executes) a workpiece inspection operation (inspection method) to inspect the workpiece W (step S5). The workpiece inspection operation in step S5 may be the same as the workpiece inspection operation in step S1. Specifically, the workpiece inspection operation in step S5 and the workpiece inspection operation in step S1 may be the same except that the workpiece inspection operation in step S5 is performed after the processing device 1 completes processing of the workpiece W, while the workpiece inspection operation in step S1 is performed before the processing device 1 starts processing the workpiece W.

[0134] Before the measurement system 2 starts inspecting the workpiece W, the workpiece W is transported from the processing device 1 to the measurement system 2. For example, the transport device 3 may take out the workpiece W from the housing 18 of the processing device 1 (particularly, from the stage 131 arranged in the chamber space 183IN). The transport device 3 may transport the workpiece W taken out from the processing device 1 to the measurement system 2. In other words, the transport device 3 may place the workpiece W taken out from the processing device 1 inside the housing 213 of the measurement system 2. Specifically, the transport device 3 may place the workpiece W taken out from the processing device 1 on the stage 2111 of the measurement system 2. The measurement system 2 may then inspect the workpiece W.

[0135] When the workpiece inspection operation in step S5 is performed, similarly to when the workpiece inspection operation in step S1 is performed, a flaw detection agent may be applied to the workpiece W before the workpiece W is transported to the measurement system 2, and then the workpiece W with the flaw detection agent applied may be transported to the measurement system 2. Alternatively, a workpiece W without a flaw detection agent may be transported to the measurement system 2, and then the flaw detection agent may be applied to the workpiece W. If a developer is further applied to the workpiece W with the flaw detection agent applied, the developer may be applied to the workpiece W before the workpiece W is transported to the measurement system 2, and then the workpiece W with the developer applied may be transported to the measurement system 2. Alternatively, a workpiece W without a developer applied may be transported to the measurement system 2, and then the developer may be applied to the workpiece W.

[0136] As described above, the processing device 1 may process the workpiece W attached to the jig 133. In this case, the workpiece W attached to the jig 133 (in other words, the jig 133 to which the workpiece W is attached) may be transported from the processing device 1 to the measurement system 2. That is, the workpiece W attached to the jig 133 (in other words, the jig 133 to which the workpiece W is attached) may be placed inside the housing 213 of the measurement system 2. Specifically, the workpiece W attached to the jig 133 (in other words, the jig 133 to which the workpiece W is attached) may be placed on the stage 2111 of the measurement system 2. Thereafter, the measurement system 2 may inspect the workpiece W attached to the jig 133.

[0137] That is, the workpiece W may remain attached to the jig 133 during the period from when the processing device 1 processes the workpiece W in step S4 until when the measurement system 2 inspects the workpiece W in step S1. In this case, the relative positional relationship between the workpiece W and the jig 133 is fixed during the period from when the processing device 1 processes the workpiece W until when the measurement system 2 inspects the workpiece W. Furthermore, since it is no longer necessary to remove the workpiece W from the jig 133, the throughput of the processing operation is improved.

[0138] When the workpiece inspection operation is performed in step S5, a three-dimensional structure is formed on the workpiece W in step S4. As described above, the workpiece W may include a three-dimensional structure previously formed by the processing device 1. Therefore, when the workpiece inspection operation is performed in step S5, the workpiece W inspected by the workpiece inspection operation may include a three-dimensional structure newly formed in step S4, in addition to the existing workpiece W that was used as a base on which the three-dimensional structure was formed in step S4. In other words, the measurement system 2 may inspect the three-dimensional structure newly formed in step S4. Specifically, the measurement system 2 may detect defects (e.g., cracks) in the three-dimensional structure newly formed in step S4. The measurement system 2 may determine whether or not a defect (e.g., crack) has occurred in the three-dimensional structure newly formed in step S4.

[0139] Thereafter, if it is determined as a result of the work inspection operation in step S5 that a crack has occurred in the work W (i.e., a crack has been detected) (step S6: Yes), the control device 22 of the measurement system 2 (particularly, the work inspection unit 2212) may output an alert to notify the operator (user) that a crack has occurred in the work W (step S7).

[0140] If it is determined in step S6 that a crack has occurred in the workpiece W (step S6: Yes), similarly to the case where it is determined in step S2 that a crack has occurred in the workpiece W, the processing device 1 may perform processing to remove a defective portion including the crack from the workpiece W. After the defective portion has been removed, the processing device 1 may perform additional processing to add a three-dimensional structure to the workpiece W to fill the removed defective portion, thereby substantially manufacturing (in other words, restoring) a workpiece W that does not have a crack.

[0141] On the other hand, if the result of the workpiece inspection operation in step S5 determines that no cracks have occurred in the workpiece W (i.e., no cracks have been detected) (step S6: No), the processing system SYS may terminate the processing operation shown in Figure 8.

[0142] 8 shows an example in which the measurement system 2 inspects the workpiece W before the processing device 1 starts processing the workpiece W, and the measurement system 2 inspects the workpiece W after the processing device 1 completes processing the workpiece W. However, while the measurement system 2 inspects the workpiece W before the processing device 1 starts processing the workpiece W, the measurement system 2 does not have to inspect the workpiece W after the processing device 1 completes processing the workpiece W. While the measurement system 2 inspects the workpiece W after the processing device 1 completes processing the workpiece W, the measurement system 2 does not have to inspect the workpiece W before the processing device 1 starts processing the workpiece W.

[0143] (2-2) Flow of Workpiece Inspection Operation Next, with reference to Fig. 9, we will explain the workpiece inspection operation performed by the measurement system 2 in each of steps S1 and S5 in Fig. 8. Fig. 9 is a flowchart showing the flow of the workpiece inspection operation performed by the measurement system 2 in each of steps S1 and S5 in Fig. 8.

[0144] As shown in FIG. 9 , the lighting device 2123 illuminates the workpiece W with UV illumination light (step S111). Note that while the lighting device 2123 is illuminating the workpiece W with UV illumination light, the projection device 2122 does not need to project a projection pattern onto the workpiece W. When the lighting device 2123 illuminates the workpiece W with UV illumination light, as described above, the flaw detection agent that has penetrated into the cracks in the workpiece W emits excitation light. The stereo camera 2121 uses at least one of the cameras 2125 and 2126 to capture an image of the workpiece W illuminated with UV illumination light (step S112). As a result, if a crack has occurred in the workpiece W, at least one of workpiece images IMG#1 and IMG#2 is generated, which capture an image of the excitation light emitted from the flaw detection agent that has penetrated the crack. The workpiece inspection unit 2212 of the control device 22 (arithmetic device 221) detects cracks in the workpiece W based on at least one of the workpiece images IMG#1 and IMG#2 in which cracks illuminated by the excitation light are captured. Therefore, the workpiece image data IMD including at least one of the workpiece images IMG#1 and IMG#2 generated in step S112 is mainly used to detect cracks in the workpiece W. In the following description, for convenience of explanation, an example will be described in which the workpiece image data IMD including the workpiece image IMG#1 is used to detect cracks in the workpiece W. In other words, an example will be described in which the workpiece image data IMD including the workpiece image IMG#1 is generated in step S112 to detect cracks in the workpiece W. In the following description, for convenience of explanation, the workpiece image data IMD generated in step S112 (i.e., the workpiece image data IMD mainly used to detect cracks in the workpiece W) will be referred to as flaw detection image data IMD_Inspect.

[0145] When a developer is applied to suck out the flaw detection agent that has penetrated into the cracks in the workpiece W, the stereo camera 2121 may image the workpiece W after a predetermined time has elapsed since the developer was applied, in order to ensure time for the developer to suck out the flaw detection agent. As a result, compared to when the stereo camera 2121 images the workpiece W before the predetermined time has elapsed since the developer was applied, there is a higher possibility that a workpiece image IMG#1 that shows a crack will be generated under circumstances in which a crack has occurred in the workpiece W. As a result, the crack detection accuracy is higher compared to when the stereo camera 2121 images the workpiece W before the predetermined time has elapsed since the developer was applied.

[0146] The stereo camera 2121 may image the workpiece W multiple times at different times. The stereo camera 2121 may image the workpiece W multiple times from the same position with the same angle of view at different times. In this case, the flaw detection image data IMD_inspect may be flaw detection image data IMD_inspect that indicates multiple workpiece images IMG#1 that are each generated by imaging the workpiece W multiple times from the same position with the same angle of view. The workpiece inspection unit 2212 may detect cracks in the workpiece W based on the flaw detection image data IMD_inspect that indicates multiple workpiece images IMG#1 that are each generated by imaging the workpiece W multiple times from the same position with the same angle of view. For example, even if a crack is not detected based on one workpiece image IMG#1 among the multiple workpiece images IMG#1, if a crack is detected based on another workpiece image IMG#1 different from the one workpiece image IMG#1 among the multiple workpiece images IMG#1, the workpiece inspection unit 2212 may determine that the crack detected based on the other workpiece image IMG#1 has occurred in the workpiece W. As a result, the accuracy of crack detection increases.

[0147] As an example, the stereo camera 2121 may image the workpiece W at a first timing after a first predetermined time has elapsed since the developer was applied. Furthermore, the stereo camera 2121 may image the workpiece W again at a second timing after a second predetermined time longer than the first predetermined time has elapsed since the developer was applied. The position of the stereo camera 2121 that images the workpiece W at the first timing may be the same as the position of the stereo camera 2121 that images the workpiece W at the second timing. The angle of view of the stereo camera 2121 that images the workpiece W at the first timing may be the same as the angle of view of the stereo camera 2121 that images the workpiece W at the second timing. In this case, the flaw detection image data IMD_inspect may be flaw detection image data IMD_inspect that shows a first workpiece image IMG#1-1 generated by imaging the workpiece W at the first timing and a second workpiece image IMG#1-2 generated by imaging the workpiece W at the second timing. The workpiece inspection unit 2212 may detect cracks in the workpiece W based on the flaw detection image data IMD_inspect indicating the workpiece images IMG#1-1 and IMG#1-2. For example, even if no cracks are detected based on the workpiece image IMG#1-1, if a crack is detected based on the workpiece image IMG#1-2, the workpiece inspection unit 2212 may determine that the crack detected based on the workpiece image IMG#1-2 has occurred in the workpiece W. In this case, even if there is variation in the development time due to the developer, the workpiece inspection unit 2212 can accurately detect cracks.

[0148] After the operations from step S111 to step S112 are performed (or before the operations from step S111 to step S112 are performed), the projection device 2122 projects the projection pattern onto the workpiece W (step S113). Note that while the projection device 2122 is projecting the projection pattern onto the workpiece W, the illumination device 2123 does not need to illuminate the workpiece W with UV illumination light. The stereo camera 2121 uses both cameras 2125 and 2126 to capture images of the workpiece W onto which the projection pattern is projected (step S114). As a result, workpiece images IMG#1 and IMG#2 are generated, in which the workpiece W onto which the projection pattern is projected is captured. The workpiece inspection unit 2212 of the control device 22 generates three-dimensional shape information indicating the three-dimensional shape of the workpiece W based on both workpiece images IMG#1 and IMG#2 in which the workpiece W onto which the projection pattern is projected is captured. For this reason, the workpiece image data IMD including both workpiece images IMG#1 and IMG#2 generated in step S114 is primarily used to generate three-dimensional shape information. In the following description, for convenience of explanation, the workpiece image data IMD generated in step S114 (i.e., the workpiece image data IMD primarily used to generate three-dimensional shape information) will be referred to as stereo image data IMD_3D.

[0149] The relative positional relationship between the stereo camera 2121 and the workpiece W when the stereo camera 2121 images the workpiece W in step S114 is the same as the relative positional relationship between the stereo camera 2121 and the workpiece W when the stereo camera 2121 images the workpiece W in step S112. In this case, the workpiece W (specifically, the stage 2111 on which the workpiece W is placed) does not move, and the stereo camera 2121 does not need to move, from the time the stereo camera 2121 images the workpiece W in either step S112 or step S114 until the time the stereo camera 2121 images the workpiece W in the other of step S112 or step S114. Alternatively, the workpiece W (specifically, the stage 2111 on which the workpiece W is placed) and the stereo camera 2121 may move in the same movement direction by the same movement amount from the time the stereo camera 2121 images the workpiece W in either step S112 or step S114 until the time the stereo camera 2121 images the workpiece W in the other of step S112 or step S114. In either case, the relative positional relationship between the workpiece W and the stereo camera 2121 is fixed from the time the stereo camera 2121 images the workpiece W in either step S112 or step S114 until the time the stereo camera 2121 images the workpiece W in the other of step S112 or step S114.

[0150] However, the relative positional relationship between the stereo camera 2121 and the workpiece W when the stereo camera 2121 images the workpiece W in step S112 may change regularly with respect to the relative positional relationship between the stereo camera 2121 and the workpiece W when the stereo camera 2121 images the workpiece W in step S114. Specifically, the relative positional relationship between the stereo camera 2121 and the workpiece W when the stereo camera 2121 images the workpiece W in step S112 may always be shifted by the same amount with respect to the relative positional relationship between the stereo camera 2121 and the workpiece W when the stereo camera 2121 images the workpiece W in step S114.

[0151] Thereafter, the workpiece inspection unit 2212 determines whether or not to end the imaging of the workpiece W by the stereo camera 2121 (step S116). For example, the workpiece inspection unit 2212 may determine to end the imaging of the workpiece W by the stereo camera 2121 when the stereo camera 2121 has imaged the workpiece W over the entire circumference around the Z axis. For example, the workpiece inspection unit 2212 may determine not to end the imaging of the workpiece W by the stereo camera 2121 when the stereo camera 2121 has not imaged the workpiece W over the entire circumference around the Z axis. For example, the workpiece inspection unit 2212 may determine to end the imaging of the workpiece W by the stereo camera 2121 when the number of times the stereo camera 2121 has imaged the workpiece W in each of steps S112 and S114 exceeds a predetermined number (for example, an arbitrary number equal to or greater than once). For example, the work inspection unit 2212 may determine not to terminate imaging of the work W by the stereo camera 2121 if the number of times the stereo camera 2121 images the work W in each of steps S112 and S114 is less than a predetermined number (for example, any number greater than or equal to one or two times).

[0152] If it is determined in step S116 that the stereo camera 2121 should not end imaging of the workpiece W (step S116), the workpiece inspection unit 2212 controls the stage drive system 2112 so that the workpiece W rotates a predetermined rotation angle around the Z axis (i.e., the stage 2111 on which the workpiece W is placed rotates a predetermined rotation angle around the Z axis) (step S117). Then, the operations from step S111 to step S114 are performed again. In this case, in each of step S112 and step S114, the stereo camera 2121 may image the workpiece W a number of times determined by the formula "360 degrees / predetermined rotation angle." For example, if the predetermined rotation angle is 10 degrees, the stereo camera 2121 may image the workpiece W 36 times (= 360 degrees / 10 degrees). As a result, the stereo camera 2121 generates the same number of pieces of flaw detection image data IMD_inspect as the number of times the stereo camera 2121 captured images of the workpiece W in step S112. The workpiece inspection unit 2212 acquires the same number of pieces of flaw detection image data IMD_inspect as the number of times the stereo camera 2121 captured images of the workpiece W in step S112. Furthermore, the stereo camera 2121 generates the same number of pieces of stereo image data IMD_3D as the number of times the stereo camera 2121 captured images of the workpiece W in step S114. The workpiece inspection unit 2212 acquires the same number of pieces of stereo image data IMD_3D as the number of times the stereo camera 2121 captured images of the workpiece W in step S114.

[0153] If the imaging system 21 is equipped with an imaging drive system 214 that can move the imaging unit 212, in step S117, the work inspection unit 2212 may move the stereo camera 2121 relative to the workpiece W in addition to or instead of moving the workpiece W relative to the stereo camera 2121. That is, in step S117, the work inspection unit 2212 may change the relative positional relationship between the workpiece W and the stereo camera 2121 by moving at least one of the workpiece W and the stereo camera 2121.

[0154] Thereafter, the workpiece inspection unit 2212 generates three-dimensional shape information indicating the three-dimensional shape of the workpiece W based on the stereo image data IMD_3D (step S121). In this embodiment, as described above, an example will be described in which the workpiece inspection unit 2212 generates point cloud data indicating the three-dimensional shape of the workpiece W using a point cloud model, which is a three-dimensional model, as an example of three-dimensional shape information. However, the workpiece inspection unit 2212 may generate any three-dimensional shape information indicating the three-dimensional shape of the workpiece W.

[0155] To generate the point cloud data, the workpiece inspection unit 2212 may calculate the parallax by associating each portion of the projection pattern reflected in the two workpiece images IMG#1 and IMG#2 included in the stereo image data IMD_3D. The workpiece inspection unit 2212 may generate a point cloud (point cloud model) of the workpiece W by a well-known method based on the principle of triangulation using the calculated parallax.

[0156] Here, the point cloud generated based on one piece of stereo image data IMD_3D may include a point cloud of a portion of the workpiece W, but may not include a point cloud of another portion of the workpiece W. Specifically, the point cloud generated based on one piece of stereo image data IMD_3D may include a point cloud of a first portion of the workpiece W facing toward the stereo camera 2121, but may not include a point cloud of a second portion of the workpiece W facing away from the stereo camera 2121. In other words, the work inspection unit 2212 may be able to generate a point cloud of a portion of the workpiece W based on one piece of stereo image data IMD_3D, but may not be able to generate a point cloud of the entirety (or most of) the workpiece W. Therefore, the work inspection unit 2212 may repeat the operation of generating a point cloud of a portion of the workpiece W based on the stereo image data IMD_3D as many times as the number of pieces of stereo image data IMD_3D generated in step S114, and merge the generated point clouds of the portion of the workpiece W. As a result, the workpiece inspection unit 2212 may generate point cloud data representing the point cloud of the entire workpiece W (or most of the workpiece W), as shown in FIG. 10, which conceptually illustrates the point cloud of the workpiece W.

[0157] 9 , after the operation of step S121 is performed (or before the operation of step S121 is performed), the workpiece inspection unit 2212 detects cracks in the workpiece W based on the flaw detection image data IMD_inspect (step S122). Note that the workpiece inspection unit 2212 may detect cracks in the workpiece W using any crack detection method that detects cracks based on an image generated by capturing an image of an object to which a flaw detection agent has been applied and which has been irradiated with ultraviolet light. For this reason, a detailed description of the operation of detecting cracks in the workpiece W based on the flaw detection image data IMD_inspect will be omitted; an example thereof will be briefly outlined below.

[0158] The workpiece inspection unit 2212 may perform a noise removal process to remove noise from the workpiece image IMG#1 indicated by the flaw detection image data IMD_inspect. For example, the workpiece inspection unit 2212 may perform the noise removal process using any filter (e.g., a Gaussian filter) available for removing image noise. The workpiece inspection unit 2212 may then perform an edge detection process to detect the edge of the workpiece W in the workpiece image IMG#1. In the edge detection process, a specific pixel located at a position corresponding to the edge of the workpiece W is identified from each pixel in the flaw detection image data IMD_inspect, thereby detecting a partial edge of the workpiece W in the workpiece image IMG#1. Here, the edge of the workpiece W may refer to at least one of the boundary lines (ridge lines) between faces of the workpiece W and a corner where three or more faces converge. The specific pixel may refer to a pixel whose pixel value (e.g., brightness value) changes significantly across that pixel. For example, the workpiece inspection unit 2212 may perform edge detection processing, which uses any filter available for detecting specific pixels in an image (e.g., at least one of a Sobel filter and a Laplacian filter) to calculate the luminance gradient of each pixel and perform binarization processing on the luminance gradient to detect specific pixels. That is, the workpiece inspection unit 2212 may perform edge detection processing to detect pixels that satisfy the condition that the luminance gradient of each pixel is equal to or greater than a threshold value as specific pixels. The workpiece inspection unit 2212 may then detect edges from the image of a linear series of specific pixels in the workpiece image IMG#1, based on the workpiece image IMG#1 in which the pixel value of each pixel has been determined to be one of two values ​​indicating whether it corresponds to an edge or not (i.e., each pixel has been determined to be either a specific pixel corresponding to an edge or another pixel not corresponding to an edge) through the binarization processing included in the edge detection processing. For example, the workpiece inspection unit 2212 may detect edges by performing a Hough transform on the workpiece image IMG#1. Thereafter, the workpiece inspection unit 2212 may detect a plurality of adjacent specific pixels or a series of connected specific pixels as one crack. In other words, cracks may be detected based on specific pixels that do not correspond to the edges of the workpiece W.

[0159] FIG. 11 shows an example of a crack detected in the workpiece image IMG#1. As shown in FIG. 11, when a crack occurs in the workpiece W, the flaw detection agent that has penetrated the crack emits excitation light. Therefore, in the workpiece image IMG#1, an image of the excitation light emitted from the flaw detection agent that has entered the crack is captured as an image of the crack. In other words, the brightness value of a pixel in which the crack is captured is different from the brightness values ​​of the pixels surrounding the crack. Therefore, the pixel corresponding to the crack is likely to be detected as the specific pixel described above. Therefore, by performing a series of processes including the edge detection process described above, the workpiece inspection unit 2212 can properly detect cracks.

[0160] The workpiece inspection unit 2212 may calculate characteristics of the detected crack. For example, the workpiece inspection unit 2212 may calculate at least one of the crack's position, crack's size, and crack's shape as the crack's characteristics. For example, the workpiece inspection unit 2212 may calculate at least one of the crack's position (two-dimensional position) in a two-dimensional coordinate plane corresponding to the workpiece image IMG#1, the crack's size (two-dimensional size) in a two-dimensional coordinate plane corresponding to the workpiece image IMG#1, and the crack's shape (two-dimensional shape) in a two-dimensional coordinate plane corresponding to the workpiece image IMG#1 as the crack's characteristics. For example, the workpiece inspection unit 2212 may calculate at least one of the crack's position (three-dimensional position) in a three-dimensional space in which the workpiece W is arranged (e.g., a three-dimensional space corresponding to a point cloud), the crack's size (three-dimensional size) in a two-dimensional coordinate plane in which the workpiece W is arranged corresponding to the workpiece image IMG#1 in the three-dimensional space in which the workpiece W is arranged, and the crack's shape (three-dimensional shape) in the three-dimensional space in which the workpiece W is arranged.

[0161] For example, the workpiece inspection unit 2212 may calculate at least one of the position (two-dimensional position), size (two-dimensional size), and shape (two-dimensional shape) of a crack in the workpiece image IMG#1 based on images of a series of specific pixels in the workpiece image IMG#1. Then, the workpiece inspection unit 2212 may convert the position (two-dimensional position) of the crack in the workpiece image IMG#1 into a three-dimensional position in a three-dimensional space in which the workpiece W is disposed. For example, the flaw detection image data IMD_inspect used to detect cracks and the stereo image data IMD_3D used to detect point cloud data of the workpiece W are generated from the same stereo camera 2121. For this reason, the workpiece inspection unit 2212 may convert the two-dimensional position in the workpiece image IMG#1 into a three-dimensional position in the three-dimensional space in which the workpiece W is arranged, based on the relative positional relationship between the stereo camera 2121 and the workpiece W when the stereo camera 2121 images the workpiece W to generate the flaw detection image data IMD_inspect, and the relative positional relationship between the stereo camera 2121 and the workpiece W when the stereo camera 2121 images the workpiece W to generate the stereo image data IMD_inspect. As a result, the workpiece inspection unit 2212 can convert the two-dimensional position of the crack in the workpiece image IMG#1 into a three-dimensional position of the crack in the three-dimensional space in which the workpiece W is arranged.

[0162] As an example, as described above, if the relative positional relationship between the stereo camera 2121 and the workpiece W when the stereo camera 2121 images the workpiece W to generate the flaw detection image data IMD_inspect is the same as the relative positional relationship between the stereo camera 2121 and the workpiece W when the stereo camera 2121 images the workpiece W to generate the stereo image data IMD_inspect, then the scene (image) reflected in the workpiece image IMG#1 shown by the flaw detection image data IMD_inspect is the same as the scene (image) reflected in the workpiece image IMG#1 shown by the stereo image data IMD_3D. The work inspection unit 2212 may take advantage of the fact that the scene (image) reflected in the work image IMG#1 shown by the flaw detection image data IMD_inspect is the same as the scene (image) reflected in the work image IMG#1 shown by the stereo image data IMD_3D, and convert the two-dimensional position of the crack in the work image IMG#1 into the three-dimensional position of the crack in the three-dimensional space in which the work W is placed.

[0163] As another example, as described above, if the relative positional relationship between the stereo camera 2121 and the workpiece W when the stereo camera 2121 images the workpiece W to generate the flaw detection image data IMD_inspect is always shifted by the same amount when the stereo camera 2121 images the workpiece W to generate the stereo image data IMD_inspect, then the scene (image) reflected in the workpiece image IMG #1 shown by the stereo image data IMD_3D will always be shifted by the same amount from the scene (image) reflected in the workpiece image IMG #1 shown by the flaw detection image data IMD_inspect. The work inspection unit 2212 may convert the two-dimensional position of the crack in the work image IMG #1 into the three-dimensional position of the crack in the three-dimensional space in which the work W is placed, by taking advantage of the fact that the scene (image) reflected in the work image IMG #1 shown by the flaw detection image data IMD_inspect is always shifted by the same amount from the scene (image) reflected in the work image IMG #1 shown by the stereo image data IMD_3D.

[0164] After the three-dimensional position of the crack in three-dimensional space is calculated, the work inspection unit 2212 may calculate at least one of the shape of the crack in three-dimensional space and the size of the crack in three-dimensional space based on the three-dimensional position of the crack.

[0165] 9 , the workpiece inspection unit 2212 controls the display device 225 to display the point cloud data generated in step S121 and defect information related to the cracks (i.e., defects) detected in step S122 (step S123). Specifically, the workpiece inspection unit 2212 may generate display information that enables the point cloud data and defect information to be displayed. The display information may be display control information that controls the display device to display the point cloud data and defect information. The workpiece inspection unit 2212 may then output the generated display information to the display device 225. The display device 225 may display the point cloud data and defect information based on the display information generated by the workpiece inspection unit 2212. Note that the defect information may also be referred to as inspection result information because it is information related to cracks detected by the workpiece inspection operation.

[0166] The workpiece inspection unit 2212 may control the display device 225 to display a point cloud (point cloud model) indicated by the point cloud data. In other words, displaying the point cloud data may include displaying the point cloud (point cloud model) indicated by the point cloud data. Alternatively, the workpiece inspection unit 2212 may generate an arbitrary three-dimensional model that shows the same three-dimensional shape as the three-dimensional shape of the workpiece W indicated by the point cloud data, and control the display device 225 to display the generated three-dimensional model. In other words, displaying the point cloud data may include displaying an arbitrary three-dimensional model that shows the same three-dimensional shape as the three-dimensional shape of the workpiece W indicated by the point cloud data. Examples of the arbitrary three-dimensional model include a wireframe model, a surface model, and a solid model.

[0167] The workpiece inspection unit 2212 may control the display device 225 to display information regarding crack characteristics as defect information. In other words, displaying defect information may include displaying information regarding crack characteristics. As described above, the crack characteristics may include at least one of the crack position, crack size, and crack shape. In this case, the workpiece inspection unit 2212 may control the display device 225 to display information regarding the crack position (position information) as defect information. The workpiece inspection unit 2212 may control the display device 225 to display information regarding the crack size (size information) as defect information. The workpiece inspection unit 2212 may control the display device 225 to display information regarding the crack shape (shape information) as defect information. As an example, the workpiece inspection unit 2212 may control the display device 225 to display at least one of text characters and numeric values ​​indicating crack characteristics, including at least one of the crack position, crack size, and crack shape, as defect information.

[0168] The workpiece inspection unit 2212 may control the display device 225 to display the workpiece image IMG#1 used to detect the crack as defect information. That is, displaying the defect information may include displaying the workpiece image IMG#1 used to detect the crack. In other words, the workpiece inspection unit 2212 may control the display device 225 to display the workpiece image IMG#1 indicated by the flaw inspection image data IMD_inspect as defect information. That is, displaying the defect information may include displaying the workpiece image IMG#1 indicated by the flaw inspection image data IMD_inspect.

[0169] The workpiece inspection unit 2212 may control the display device 225 to display the point cloud data and the defect information on the same screen. In particular, the workpiece inspection unit 2212 may control the display device 225 to display the point cloud data and the defect information superimposed on the same screen. However, as will be described later in a second modified example, the workpiece inspection unit 2212 may also control the display device 225 to display the point cloud data and the defect information on separate screens.

[0170] 12 , which conceptually illustrates an example of a superimposed display of point cloud data and defect information, the workpiece inspection unit 2212 may control the display device 225 to superimpose a workpiece object DO_W, which is a three-dimensional display object corresponding to the point cloud model (i.e., a three-dimensional model) indicated by the point cloud data, and a crack object DO_CR, which is a three-dimensional display object corresponding to a crack. In this case, the workpiece inspection unit 2212 may generate display information including the workpiece object DO_W and the crack object DO_CR. When the workpiece object DO_W and the crack object DO_CR are displayed in this manner, the user of the machining system SYS can intuitively grasp the detected crack.

[0171] The workpiece inspection unit 2212 may generate a workpiece object DO_W based on the point cloud data generated in step S121 of Fig. 9. For example, the workpiece inspection unit 2212 may use, as the workpiece object DO_W, a point cloud model indicated by the point cloud data generated in step S121 of Fig. 9. For example, the workpiece inspection unit 2212 may generate, as the workpiece object DO_W, an arbitrary three-dimensional model indicating the same three-dimensional shape as the three-dimensional shape indicated by the point cloud data generated in step S121 of Fig. 9.

[0172] The workpiece inspection unit 2212 may generate a crack object DO_CR based on the crack detection result in step S122 of Fig. 9. For example, the workpiece inspection unit 2212 may generate, as the crack object DO_CR, a display object that resembles the crack detected in step S122 of Fig. 9.

[0173] The position of a crack object DO_CR corresponding to a crack may correspond to the position of the crack. Specifically, the position on the workpiece object DO_W where the crack object DO_CR corresponding to a crack is displayed may correspond to the position of the crack on the workpiece W. The relative positional relationship between the crack object DO_CR corresponding to a crack and the workpiece object DO_W may be the same as the relative positional relationship between the crack and the workpiece W. As a result, the user can intuitively and relatively easily grasp where the crack is located on the workpiece W.

[0174] The size of a crack object DO_CR corresponding to a crack may correspond to the size of the crack. Specifically, the size of a crack object DO_CR corresponding to a crack relative to a workpiece object DO_W may correspond to the size of the crack relative to the workpiece W. The relationship between the size of a crack object DO_CR corresponding to a crack and the size of the workpiece DO_W may be the same as the relationship between the size of the crack and the size of the workpiece W. The ratio between the size of a crack object DO_CR corresponding to a crack and the size of the workpiece DO_W may be the same as the ratio between the size of the crack and the size of the workpiece W. As a result, the user can intuitively and relatively easily grasp the size of the crack that has occurred.

[0175] The shape of the crack object DO_CR corresponding to a crack may correspond to the shape of the crack. Specifically, the shape of the crack object DO_CR corresponding to a crack may be the same as the shape of the crack. As a result, the user can intuitively and relatively easily grasp the shape of the crack that has occurred.

[0176] The work inspection unit 2212 may generate the deformed work image IMG#1 as a crack object DO_CR by deforming the two-dimensional work image IMG#1 used to detect the crack so that the two-dimensional work image IMG#1 can be attached to the surface of the three-dimensional work object DO_W.

[0177] When the crack object DO_CR is displayed, if an operation (in other words, an input) is performed on the crack object DO_CR, the workpiece inspection unit 2212 may control the display device 225 to display detailed information 2251 about the crack corresponding to the crack object DO_CR, as shown in FIG. 13 . For example, if a user selects the crack object DO_CR (e.g., clicks on the crack object DO_CR), the workpiece inspection unit 2212 may control the display device 225 to display detailed information 2251 about the crack corresponding to the crack object DO_CR. For example, if a user inputs an operation to select the crack object DO_CR (e.g., clicks on the crack object DO_CR), the workpiece inspection unit 2212 may control the display device 225 to display detailed information 2251 about the crack corresponding to the crack object DO_CR. As a result, the workpiece inspection unit 2212 can notify the user of the details of the crack. This allows the user to properly understand the details of the crack.

[0178] The workpiece inspection unit 2212 may control the display device 225 to display the detailed information 2251 immediately after an operation is performed on the crack object DO_CR. In other words, the timing when an operation is performed on the crack object DO_CR and the timing when the detailed information 2251 is displayed may be substantially the same. Alternatively, the workpiece inspection unit 2212 may control the display device 225 to display the detailed information 2251 after a predetermined time has elapsed since an operation is performed on the crack object DO_CR. In other words, the timing when an operation is performed on the crack object DO_CR and the timing when the detailed information 2251 is displayed may differ by at least the predetermined elapsed time.

[0179] On the other hand, when no operation is being performed on the crack object DO_CR, the workpiece inspection unit 2212 may control the display device 225 not to display the detailed information 2251 about the crack corresponding to the crack object DO_CR. In other words, the workpiece inspection unit 2212 may control the display device 225 to selectively display the detailed information 2251 in a pop-up when an operation is being performed on the crack object DO_CR. As a result, by differentiating the timing at which the crack object DO_CR is displayed and the timing at which the detailed information 2251 is displayed on the display screen of the display device 225, the amount of information displayed on the display screen of the display device 225 is not increased more than necessary, thereby simplifying the display screen.

[0180] Alternatively, even when no operation is being performed on the crack object DO_CR, the workpiece inspection unit 2212 may control the display device 225 to display detailed information 2251 about the crack corresponding to the crack object DO_CR. However, the display manner of the detailed information 2251 when no operation is being performed on the crack object DO_CR may be different from the display manner of the detailed information 2251 when an operation is being performed on the crack object DO_CR. For example, the workpiece inspection unit 2212 may control the display device 225 to highlight the detailed information 2251 when an operation is being performed on the crack object DO_CR, but to simply display the detailed information 2251 without highlighting the detailed information 2251 when no operation is being performed on the crack object DO_CR. In this case, the display screen is also simplified.

[0181] The detailed crack information 2251 may include information about crack characteristics (specifically, position, shape, size, etc.). The detailed crack information 2251 may include information about the extent of the crack (specifically, at least one of the crack depth and crack width). The information about the extent of the crack may include information about the likelihood of the crack detected in step S122 of FIG. 9. For example, if a series of specific pixels is detected as a crack in step S122 of FIG. 9 and the reliability of the detection is high, there is a high possibility that the detected crack is actually a crack. In this case, the detailed crack information 2251 may include information indicating a high possibility that the detected crack is actually a crack as information about the likelihood of the crack. On the other hand, for example, if a series of specific pixels is detected as a crack in step S122 of FIG. 9 but the reliability of the detection is low, it cannot necessarily be said that there is a high possibility that the detected crack is actually a crack. In this case, the detailed information 2251 may include information indicating that it is not necessarily highly likely that the detected crack is actually a crack, as information regarding the likelihood of the crack.

[0182] The workpiece inspection unit 2212 may control the display device 225 so that the display mode of the crack object DO_CR differs for each crack. For example, the workpiece inspection unit 2212 may control the display device 225 so that a first crack object DO_CR corresponding to a first crack is displayed in a first display mode, and a second crack object DO_CR corresponding to a second crack different from the first crack is displayed in a second display mode different from the first display mode. The display mode may include a color for displaying the crack object DO_CR. The display mode may include a brightness for displaying the crack object DO_CR. When the display mode of the crack object DO_CR differs for each crack in this way, the user can easily grasp the multiple cracks individually.

[0183] The workpiece inspection unit 2212 may control the display device 225 so that the display mode of the crack object DO_CR changes depending on the likelihood of the crack. For example, the workpiece inspection unit 2212 may control the display device 225 to display a third crack object DO_CR corresponding to a third crack that is likely to be an actual crack in a third display mode, and to display a fourth crack object DO_CR corresponding to a fourth crack that is not necessarily likely to be an actual crack in a fourth display mode different from the third display mode. The display mode may include a color for displaying the crack object DO_CR. The display mode may include a brightness for displaying the crack object DO_CR. When the display mode of the crack object DO_CR changes depending on the likelihood of the crack, the user can intuitively grasp the likelihood that each crack is actually a crack.

[0184] 9 , in parallel with or before or after the operation of step S123, the workpiece inspection unit 2212 may store the point cloud data generated in step S121 and the defect information related to the cracks (i.e., defects) detected in step S122 in the storage device 222, with the point cloud data and the defect information associated with each other (step S124). For example, as shown in FIG. 14 , which conceptually shows the associated point cloud data and defect information, the workpiece inspection unit 2212 may store the point cloud data and the defect information in the storage device 222 as management data 50 including a data field 51 for storing the point cloud data, a data field 52 for storing the defect information, and a data field 53 for storing identification information for uniquely identifying a combination of the point cloud data and the defect information. 14 , the workpiece inspection unit 2212 may store the point cloud data, defect information, and identification information in the storage device 222, with the point cloud data, defect information, and identification information associated with each other. The data field 51 storing the point cloud data may store, in addition to or instead of the point cloud data, stereo image data IMD_3D used to generate the point cloud data. The data field 51 storing the point cloud data may store, in addition to or instead of the point cloud data, two workpiece images IMG#1 and IMG#2 used to generate the point cloud data. Alternatively, the management data 50 may include, in addition to or instead of the data field 51, a data field for storing the stereo image data IMD_3D (two workpiece images IMG#1 and IMG#2) used to generate the point cloud data.

[0185] The data field 52 in which the defect information is stored may store, in addition to or instead of the defect information, the flaw detection image data IMD_inspect used to generate the defect information. The data field 52 in which the defect information is stored may store, in addition to or instead of the defect information, the workpiece image IMG#1 used to generate the defect information. Alternatively, the management data 50 may include, in addition to or instead of the data field 52, a data field for storing the flaw detection image data IMD_inspect (workpiece image IMG#1) used to generate the defect information.

[0186] An example of the identification information is workpiece identification information for uniquely identifying the workpiece W imaged by the stereo camera 2121 in order to generate point cloud data and defect information, because point cloud data and defect information are generated for each workpiece W. In this case, when the workpiece inspection operation shown in Fig. 9 is performed on multiple workpieces W, the workpiece inspection unit 2212 may store the same number of pieces of management data 50 as the number of workpieces W in the storage device 222, as shown in Fig. 14.

[0187] Another example of identification information is time identification information for identifying the time when the work inspection operation shown in Fig. 9 (specifically, the machining operation shown in Fig. 2, which includes the work inspection operation shown in Fig. 9) was performed. This is because point cloud data and defect information are generated for each work inspection operation shown in Fig. 9. In this case, if the work inspection operation shown in Fig. 9 is performed multiple times on a certain work W, the work inspection unit 2212 may store in the storage device 222 management data 50 in the same number as the number of work inspection operations performed.

[0188] As shown in FIG. 15 showing another example of the management data 50, the management data 50 may include a data field 53 for storing processing history information relating to the history of processing performed on the workpiece W in the past. The processing history information may include information regarding the type of processing performed on the workpiece W in the past. The processing history information may include information regarding a portion of the workpiece W that was processed in the past. The processing history information may include information regarding at least one of the position, shape, and size of a portion of the workpiece W that was processed in the past. The processing history information may include information regarding a three-dimensional structure that was formed by processing performed on the workpiece W in the past. The processing history information may include information regarding at least one of the position, shape, and size of a three-dimensional structure that was formed by processing performed on the workpiece W in the past.

[0189] 9 , the work inspection unit 2212 may output the management data 50 as output information (step S125). For example, the work inspection unit 2212 may output the management data 50 to the outside of the measurement system 2. For example, the work inspection unit 2212 may output the management data 50 to the machining device 1. For example, the work inspection unit 2212 may output the management data 50 to the outside of the machining system SYS. For example, the work inspection unit 2212 may output the management data 50 to a server external to the machining system SYS.

[0190] The management data 50 output by the measurement system 2 may be used by a device different from the measurement system 2. For example, the management data 50 output by the measurement system 2 may be used by the processing device 1 to process the workpiece W. For example, the management data 50 output by the measurement system 2 may be used by an external server to evaluate the workpiece W. In other words, when the measurement system 2 outputs the management data 50, there is an advantage that the management data 50 can be utilized outside the measurement system 2, compared to when the measurement system 2 does not output the management data 50.

[0191] Note that, when the measurement system 2 outputs the management data 50 as output information of the measurement system 2, the measurement system 2 may be referred to as an information output device that outputs output information. A workpiece inspection operation that includes an operation of outputting the management data 50 as output information of the measurement system 2 may be considered to be an operation that includes an information output operation (information output method) that outputs output information.

[0192] (3) Technical Effects As described above, in this embodiment, the measurement system 2 can detect defects (cracks in the above example) in the workpiece W and display defect information related to the detected defects on the display device 225. This allows the user of the machining system SYS to appropriately understand the defects in the workpiece W. In other words, the measurement system 2 can effectively utilize the detection results of the defects in the workpiece W to notify the user of the defects in the workpiece W.

[0193] Furthermore, in this embodiment, the measurement system 2 can superimpose point cloud data indicating the three-dimensional shape of the workpiece W and defect information regarding defects in the workpiece W (cracks in the above example). This allows the user of the processing system SYS to intuitively grasp the defects in the workpiece W. In other words, the user can grasp the defects in the workpiece W relatively easily. For example, the user can grasp relatively easily where a crack has occurred in the workpiece W. For example, the user can grasp relatively easily what size a crack has occurred. The user can grasp relatively easily what shape a crack has occurred.

[0194] Furthermore, in this embodiment, the measurement system 2 can manage point cloud data indicating the three-dimensional shape of the workpiece W and defect information regarding defects (cracks in the above example) in the workpiece W as management data 50 in which the point cloud data and defect information are associated with each other. Therefore, compared to when the point cloud data and defect information are managed without being associated with each other, the measurement system 2 can manage the point cloud data and defect information more efficiently. In particular, compared to when the point cloud data and defect information are managed without being associated with each other, the measurement system 2 can quickly identify combinations of point cloud data and defect information, thereby efficiently extracting data for data utilization. As an example, the combination of point cloud data and defect information indicates a defect that occurred in a workpiece W having a certain three-dimensional shape. Therefore, the management data 50 can be used as data for evaluating the impact of a defect that occurred in a workpiece W during a period after the workpiece W has been processed. In other words, the management data 50 can be used for traceability of the workpiece W.

[0195] Furthermore, in this embodiment, the measurement system 2 can output point cloud data indicating the three-dimensional shape of the workpiece W and defect information regarding defects (cracks in the above example) in the workpiece W as management data 50 in which the point cloud data and the defect information are associated with each other. Therefore, compared to when the point cloud data and the defect information are output without being associated with each other, the measurement system 2 can output the point cloud data and the defect information in a data format that is easy to utilize. In particular, because the measurement system 2 can output the management data 50, the vast amount of management data 50 output from multiple measurement systems 2 can be centrally managed on a server external to the measurement system 2. Furthermore, the vast amount of management data 50 output from multiple measurement systems 2 can be centrally utilized (e.g., analyzed) on a server external to the measurement system 2. Therefore, the scope of data utilization is broader than when a single measurement system 2 utilizes the management data 50 generated by the measurement system 2 itself. As a result, the machining system SYS can more appropriately machine the workpiece W using the results of data utilization. Such an advantage becomes greater as the number of measurement systems 2 included in the processing system SYS increases.

[0196] (4) Modifications Next, modifications of the machining system SYS will be described.

[0197] (4-1) First Modification As described above, in step S8 of FIG. 9 , in order to generate the flaw detection image data IMD_inspect, the stereo camera 2121 images the workpiece W illuminated with UV illumination light by the lighting device 2123. In this case, the stereo camera 2121 images the workpiece W through a filter 2124 that can block ultraviolet light. Therefore, the stereo camera 2121 can image the workpiece W while reducing the effects of at least one of the reflected light and scattered light of the UV illumination light by the workpiece W. However, it is not easy to manufacture an ideal filter 2124 that blocks 100% of ultraviolet light. Therefore, even when the stereo camera 2121 images the workpiece W through the filter 2124, at least one of the reflected light and scattered light of the UV illumination light by the workpiece W may be incident on the image sensor IS of the stereo camera 2121. As a result, as shown in FIG. 16 , the stereo camera 2121 may generate a workpiece image IMG that captures not only cracks (specifically, an image due to excitation light emitted by the flaw detection agent that has penetrated the cracks) but also the edge of the workpiece W itself (specifically, an image due to at least one of reflected light and scattered light of UV illumination light by the workpiece W). In this case, in some cases, the workpiece inspection unit 2212 may mistakenly detect the edge of the workpiece W itself as a crack by performing the crack detection method that includes the edge detection process described above. As a result, the accuracy of crack detection may deteriorate. Note that in the first modified example, for convenience of explanation, the "edge of the workpiece W itself" will be referred to simply as the edge of the workpiece W.

[0198] Therefore, in the first variant, a crack determination operation may be performed to determine whether a series of specific pixels detected as a crack by the crack detection method including the above-mentioned edge detection processing are a crack or an edge of the workpiece W.

[0199] In this embodiment, as an example of a crack determination operation, a crack determination operation is described in which a series of specific pixels detected as a crack by a crack detection method including edge detection processing is used to determine whether the series of specific pixels is a crack or an edge of the workpiece W, using multiple workpiece images IMG#1 each generated by the stereo camera 2121 capturing images of the workpiece W under multiple different imaging conditions.

[0200] (4-1-1) First Crack Determination Operation The first crack determination operation is a crack determination operation for determining whether an image of a series of specific pixels detected as a crack is a crack or an edge of the workpiece W, using a plurality of workpiece images IMG#1 that are each generated by the stereo camera 2121 capturing images of the workpiece W coated with developer from the same position with the same angle of view at a plurality of different capturing times. In other words, in the first crack determination operation, the capturing conditions under which the stereo camera 2121 captures images of the workpiece W include the capturing times at which the stereo camera 2121 captures images of the workpiece W.

[0201] For example, the stereo camera 2121 may generate workpiece image IMG#1-11 as workpiece image IMG#1 by capturing an image of the workpiece W at a first imaging time t#11. Furthermore, the stereo camera 2121 may generate workpiece image IMG#1-12 as workpiece image IMG#1 by capturing an image of the workpiece W at a second imaging time t#12 that is later than the first imaging time t#11. The position of the stereo camera 2121 capturing an image of the workpiece W at the first imaging time t#11 is the same as the position of the stereo camera 2121 capturing an image of the workpiece W at the second imaging time t#12. The angle of view of the stereo camera 2121 capturing an image of the workpiece W at the first imaging time t#11 is the same as the angle of view of the stereo camera 2121 capturing an image of the workpiece W at the second imaging time t#12.

[0202] Thereafter, the workpiece inspection unit 2212 determines, based on the workpiece images IMG#1-11 and IMG#1-12, whether a series of specific pixels detected as a crack by a crack detection method including edge detection processing is a crack or an edge of the workpiece W. Specifically, the workpiece inspection unit 2212 may determine, based on changes in the images (particularly, images of the series of specific pixels detected as a crack by a crack detection method including edge detection processing) captured in each of the workpiece images IMG#1-11 and IMG#1-12, whether a series of specific pixels is a crack or an edge of the workpiece W.

[0203] For example, Figure 17(a) shows an example of a workpiece image IMG#1-11, and Figure 17(b) shows an example of a workpiece image IMG#1-12. Figures 17(a) and 17(b) show workpiece images IMG#1-11 and IMG#1-12, respectively, in which a series of specific pixel images L#11 corresponding to cracks and a series of specific pixel images L#12 corresponding to the edges of the workpiece W are detected. That is, Figures 17(a) and 17(b) show workpiece images IMG#1-11 and IMG#1-12, respectively, in which a series of specific pixel images L#11 and a series of specific pixel images L#12 are captured. The location in workpiece image IMG#1-11 where the series of specific pixel images L#11 are captured may be the same as the location in workpiece image IMG#1-12 where the series of specific pixel images L#11 are captured. The location in the workpiece image IMG#1-11 where the image L#12 of the series of specific pixels is reflected may be the same as the location in the workpiece image IMG#1-12 where the image L#12 of the series of specific pixels is reflected.

[0204] Here, when developer is applied to the workpiece W, there is a possibility that the amount of flaw detection agent that has penetrated into the cracks and is sucked out (seeped out) of the cracks increases over time. Therefore, there is a high possibility that a change in the size of the image L#11 of the series of specific pixels corresponding to the cracks will be observed between the workpiece image IMG#1-11 and the workpiece image IMG#1-12 over time. Specifically, as shown in FIGS. 17(a) and 17(b), the thickness of the image L#11 of the series of specific pixels in the workpiece image IMG#1-12 will be thicker than the thickness of the image L#11 of the series of specific pixels in the workpiece image IMG#1-11.

[0205] On the other hand, since the edge of the workpiece W is an image that appears in the workpiece image IMG#1 regardless of the seepage of the flaw detection agent by the developer, it is highly likely that no change will be observed in the size of the image L#12 of the series of specific pixels that corresponds to the edge of the workpiece W between the workpiece image IMG#1-11 and the workpiece image IMG#1-12. Specifically, as shown in Figures 17(a) and 17(b), the thickness of the image L#11 of the series of specific pixels in the workpiece image IMG#1-11 is the same as the thickness of the image L#11 of the series of specific pixels in the workpiece image IMG#1-12.

[0206] Note that the state in which "no change is observed in the size of the image of a series of specific pixels between workpiece image IMG#1-11 and workpiece image IMG#1-12" referred to here may include a first state in which "the size of the image of a series of specific pixels in workpiece image IMG#1-11 and the size of the image of a series of specific pixels in workpiece image IMG#1-12 are literally exactly the same." Furthermore, the state in which "no change is observed in the size of the image of a series of specific pixels between workpiece image IMG#1-11 and workpiece image IMG#1-12" may, in addition to or instead of the first state, include a second state in which "the size of the image of a series of specific pixels in workpiece image IMG#1-11 and the size of the image of a series of specific pixels in workpiece image IMG#1-12 are not literally exactly the same, but the difference between them is small enough that they can be considered to be the same (for example, the difference between them is smaller than a first allowable upper limit value)."

[0207] Similarly, the state in which "the thickness of the image of a series of specific pixels in workpiece image IMG#1-11 is the same as the thickness of the image of a series of specific pixels in workpiece image IMG#1-12" may include a first state in which "the thickness of the image of a series of specific pixels in workpiece image IMG#1-11 and the thickness of the image of a series of specific pixels in workpiece image IMG#1-12 are literally exactly the same." Furthermore, the state in which "the thickness of the image of a series of specific pixels in workpiece image IMG#1-11 is the same as the thickness of the image of a series of specific pixels in workpiece image IMG#1-12" may, in addition to or instead of the first state, include a second state in which "the thickness of the image of a series of specific pixels in workpiece image IMG#1-11 and the thickness of the image of a series of specific pixels in workpiece image IMG#1-12 are not literally exactly the same, but the difference between them is small enough that they can be considered to be the same (for example, the difference between them is smaller than a second allowable upper limit value)."

[0208] For this reason, the workpiece inspection unit 2212 may determine whether a change in size of the images of the same series of specific pixels is observed between the workpiece image IMG#1-11 and the workpiece image IMG#1-12, thereby determining whether the images of the series of specific pixels are images of the series of specific pixels corresponding to a crack or images of the series of specific pixels corresponding to an edge of the workpiece W. Specifically, if a change in size of the images of the same series of specific pixels is observed between the workpiece image IMG#1-11 and the workpiece image IMG#1-12, the workpiece inspection unit 2212 may determine that the images of the series of specific pixels are images of the series of specific pixels corresponding to a crack. In other words, if a change in size of the images of the same series of specific pixels is observed between the workpiece image IMG#1-11 and the workpiece image IMG#1-12, the workpiece inspection unit 2212 may determine that a crack exists at the position of the images of the series of specific pixels. On the other hand, if no change in the size of the images of the same series of specific pixels is observed between the workpiece image IMG#1-11 and the workpiece image IMG#1-12, the workpiece inspection unit 2212 may determine that the images of the series of specific pixels are images of a series of specific pixels corresponding to the edge of the workpiece W. In other words, if no change in the size of the images of the same series of specific pixels is observed between the workpiece image IMG#1-11 and the workpiece image IMG#1-12, the workpiece inspection unit 2212 may determine that there is no crack at the position of the images of the series of specific pixels. If no change in the size of the images of the same series of specific pixels is observed between the workpiece image IMG#1-11 and the workpiece image IMG#1-12, the workpiece inspection unit 2212 may determine that there is an edge of the workpiece W at the position of the images of the series of specific pixels. As a result, the workpiece inspection unit 2212 is less likely to erroneously detect a series of specific pixels corresponding to the edge of the workpiece W as a crack. As a result, the accuracy of crack detection is improved.

[0209] If the workpiece inspection unit 2212 determines that the image of a series of specific pixels corresponds to the edge of the workpiece W, it may consider that it has substantially detected the edge of the workpiece W. In this case, in step S123 of FIG. 9 , the workpiece inspection unit 2212 may control the display device 225 to display edge information of the workpiece W related to the detected edge of the workpiece W, in addition to the point cloud data and defect information described above. The method for displaying the edge information of the workpiece W may be the same as the method for displaying the defect information. The edge information of the workpiece W may include information regarding the characteristics of the edge of the workpiece W (e.g., at least one of position, size, and shape). Furthermore, in step S124 of FIG. 9 , the workpiece inspection unit 2212 may store the point cloud data, defect information, and edge of the workpiece W in the storage device 222, with the point cloud data, defect information, and edge of the workpiece W associated with each other. Furthermore, in step S125 of FIG. 9 , the workpiece inspection unit 2212 may output, as output information, management data 50 in which the point cloud data, defect information, and edge of the workpiece W are associated with each other. The same applies to the second to fifth crack determination operations described below.

[0210] (4-1-2) Second Crack Determination Operation The second crack determination operation, like the first crack determination operation described above, is a crack determination operation for determining whether a series of specific pixels detected as a crack is a crack or an edge of the workpiece W by using a plurality of workpiece images IMG#1 generated by the stereo camera 2121 capturing images of the workpiece W coated with developer from the same position at the same angle of view at a plurality of different imaging times. Therefore, for the second crack determination operation, as with the first crack determination operation, the workpiece inspection unit 2212 will also describe an operation for determining whether a series of specific pixels detected as a crack by a crack detection method including edge detection processing is a crack or an edge of the workpiece W based on the workpiece images IMG#1-11 and IMG#1-12.

[0211] As already explained in the first crack determination operation, there is a high possibility that a change in the size of the image L#11 of a series of specific pixels corresponding to a crack will be observed between the workpiece image IMG#1-11 and the workpiece image IMG#1-12. In this case, the size of the image L#11 of a series of specific pixels corresponding to a crack is likely to change in accordance with an ideal change trend corresponding to the characteristics of the developer, as shown in FIG. 18(a), which is a graph showing the change in size of the image L#11 of a series of specific pixels corresponding to a crack. Specifically, the size of the image L#11 of a series of specific pixels corresponding to a crack is likely to change in accordance with an ideal change trend corresponding to the development time during which the developer absorbs (exudes) the flaw detection agent. On the other hand, as mentioned above, there is also a possibility that the size of the image L#12 of a series of specific pixels corresponding to the edge of the workpiece W will change between the workpiece image IMG#1-11 and the workpiece image IMG#1-12. However, even if the size of the image L#12 of a series of specific pixels corresponding to the edge of the workpiece W changes, as shown in Figure 18(b), which is a graph showing the change in size of the image L#12 of a series of specific pixels corresponding to the edge of the workpiece W, it is unlikely that the size of the image L#12 of a series of specific pixels corresponding to the edge of the workpiece W will change with an ideal change trend corresponding to the characteristics of the developer. It is unlikely that the size of the image L#12 of a series of specific pixels corresponding to the edge of the workpiece W will change with an change trend different from the ideal change trend corresponding to the characteristics of the developer.

[0212] For this reason, the workpiece inspection unit 2212 may determine whether the size of the images of the same series of specific pixels between the workpiece images IMG#1-11 and IMG#1-12 changes in accordance with an ideal change trend corresponding to the characteristics of the developer, thereby determining whether the images of the series of specific pixels are images of a series of specific pixels corresponding to a crack or images of a series of specific pixels corresponding to an edge of the workpiece W. Specifically, if the size of the images of the same series of specific pixels between the workpiece images IMG#1-11 and IMG#1-12 changes in accordance with an ideal change trend corresponding to the characteristics of the developer, the workpiece inspection unit 2212 may determine that the images of the series of specific pixels are images of a series of specific pixels corresponding to a crack. In other words, if the size of the images of the same series of specific pixels between the workpiece images IMG#1-11 and IMG#1-12 changes in accordance with an ideal change trend corresponding to the characteristics of the developer, the workpiece inspection unit 2212 may determine that a crack exists at the position of the images of the series of specific pixels. On the other hand, if the size of the images of the same series of specific pixels between workpiece image IMG#1-11 and workpiece image IMG#1-12 does not change in accordance with the ideal change trend corresponding to the developer characteristics, the workpiece inspection unit 2212 may determine that the images of the series of specific pixels are images of a series of specific pixels corresponding to the edge of the workpiece W. In other words, if the size of the images of the same series of specific pixels between workpiece image IMG#1-11 and workpiece image IMG#1-12 does not change in accordance with the ideal change trend corresponding to the developer characteristics, the workpiece inspection unit 2212 may determine that there is no crack at the position of the images of the series of specific pixels. If the size of the images of the same series of specific pixels between workpiece image IMG#1-11 and workpiece image IMG#1-12 does not change in accordance with the ideal change trend corresponding to the developer characteristics, the workpiece inspection unit 2212 may determine that there is an edge of the workpiece W at the position of the images of the series of specific pixels. As a result, the workpiece inspection unit 2212 is less likely to erroneously detect a series of specific pixels corresponding to the edge of the workpiece W as a crack. As a result, the accuracy of crack detection is improved.

[0213] In addition to or instead of using multiple workpiece images IMG #1 generated by the stereo camera 2121 capturing images at multiple different capturing times, the workpiece inspection unit 2212 may use a single workpiece image IMG #1 generated by the stereo camera 2121 capturing images of the workpiece W after the lighting device 2123 that had been illuminating the workpiece W with UV illumination light stops emitting UV illumination light to determine whether an image of a series of specific pixels detected as a crack is a crack or an edge of the workpiece W. Specifically, when the lighting device 2123 that had been illuminating the workpiece W with UV illumination light stops emitting UV illumination light, at least one of the reflected light and scattered light of the UV illumination light by the workpiece W no longer enters the stereo camera 2121. As a result, the edge of the workpiece W is unlikely to be captured in the workpiece image IMG #1 generated by the stereo camera 2121 capturing images of the workpiece W after the lighting device 2123 that had been illuminating the workpiece W with UV illumination light stops emitting UV illumination light. On the other hand, even if the lighting device 2123 that had been illuminating the workpiece W with UV illumination light stops emitting UV illumination light, the flaw detection agent that has penetrated the crack may continue to emit excitation light for a certain period of time. As a result, a crack may appear in the workpiece image IMG#1 that is generated by the stereo camera 2121 capturing an image of the workpiece W after the lighting device 2123 that had been illuminating the workpiece W with UV illumination light stops emitting UV illumination light. For this reason, the workpiece inspection unit 2212 can detect, as an image of a series of specific pixels corresponding to a crack, an image of a series of specific pixels detected from the workpiece image IMG#1 that is generated by the stereo camera 2121 capturing an image of the workpiece W after the lighting device 2123 that had been illuminating the workpiece W with UV illumination light stops emitting UV illumination light.

[0214] (4-1-3) Third Crack Determination Operation The third crack determination operation is a crack determination operation for determining whether an image of a series of specific pixels detected as a crack is a crack or an edge of the workpiece W, using a plurality of workpiece images IMG#1 generated by the stereo camera 2121 capturing images of the workpiece W while changing the relative positional relationship between the stereo camera 2121 and the workpiece W. In other words, in the third crack determination operation, the imaging conditions under which the stereo camera 2121 captures images of the workpiece W include the positional relationship between the stereo camera 2121 and the workpiece W (in other words, the relative position of the stereo camera 2121 with respect to the workpiece W).

[0215] For example, as shown in Figure 19(a) which shows the relative positional relationship between the stereo camera 2121 and the workpiece W, the stereo camera 2121 may capture an image of the workpiece W when the relative positional relationship between the stereo camera 2121 and the workpiece W is a first positional relationship, thereby generating workpiece images IMG#1-31 as workpiece images IMG#1. Furthermore, as shown in Figure 19(b) which shows the relative positional relationship between the stereo camera 2121 and the workpiece W, the stereo camera 2121 may capture an image of the workpiece W when the relative positional relationship between the stereo camera 2121 and the workpiece W is a second positional relationship different from the first positional relationship, thereby generating workpiece images IMG#1-32 as workpiece images IMG#1.

[0216] Thereafter, the workpiece inspection unit 2212 determines, based on the workpiece images IMG#1-31 and IMG#1-32, whether the image of a series of specific pixels detected as a crack by a crack detection method including edge detection processing is a crack or an edge of the workpiece W. Specifically, the workpiece inspection unit 2212 may determine, based on changes in the images captured in each of the workpiece images IMG#1-31 and IMG#1-32 (particularly, the image of a series of specific pixels detected as a crack by a crack detection method including edge detection processing), whether the image of a series of specific pixels is a crack or an edge of the workpiece W.

[0217] For example, Figure 20(a) shows an example of a workpiece image IMG#1-31, and Figure 20(b) shows an example of a workpiece image IMG#1-32. Figures 20(a) and 20(b) show workpiece images IMG#1-31 and IMG#1-32, respectively, in which a series of specific pixel images L#31 corresponding to a crack and a series of specific pixel images L#32 corresponding to an edge of the workpiece W are detected. In other words, Figures 20(a) and 20(b) show workpiece images IMG#1-31 and IMG#1-32, respectively, in which a series of specific pixel images L#31 and a series of specific pixel images L#32 are captured.

[0218] When the relative positional relationship between the stereo camera 2121 and the workpiece W changes, the relative positional relationship between the lighting device 2123, which moves together with the stereo camera 2121, and the workpiece W changes. When the relative positional relationship between the lighting device 2123 and the workpiece W changes, the way in which the UV illumination light hits the workpiece W changes. When the way in which the UV illumination light hits the workpiece W changes, the traveling direction of at least one of the reflected light and scattered light of the UV illumination light by the workpiece W changes. When the traveling direction of at least one of the reflected light and scattered light of the UV illumination light by the workpiece W changes, a change is likely to be observed in the way the edge of the workpiece W (image L#32 of a series of specific pixels corresponding to the edge of the workpiece W) appears in the workpiece image IMG#1 when the stereo camera 2121 receives at least one of the reflected light and scattered light of the UV illumination light by the workpiece W. Therefore, it is likely that a change will be observed in the image L#32 of a series of specific pixels corresponding to the edge of the workpiece W between the workpiece images IMG#1-31 and IMG#1-32. For example, there is a high possibility that a change will be observed in the brightness of the image L#32 of a series of specific pixels corresponding to the edge of the workpiece W between the workpiece image IMG#1-31 and the workpiece image IMG#1-32.

[0219] On the other hand, even if the way the UV illumination light hits the workpiece W changes, as long as the UV illumination light is irradiated onto the flaw detection agent that has penetrated the crack, the flaw detection agent will emit excitation light. Therefore, when the stereo camera 2121 receives the excitation light, there is a high possibility that no change will be observed in the way the crack (the image L#31 of a series of specific pixels corresponding to the crack) appears in the workpiece image IMG#1. Therefore, there is a high possibility that no change will be observed in the image L#31 of a series of specific pixels corresponding to the crack between the workpiece image IMG#1-31 and the workpiece image IMG#1-32. For example, there is a high possibility that no change will be observed in the brightness of the image L#31 of a series of specific pixels corresponding to the crack between the workpiece image IMG#1-31 and the workpiece image IMG#1-32.

[0220] Note that the state in which "no change is observed in the image of a series of specific pixels between workpiece image IMG#1-31 and workpiece image IMG#1-32" referred to here may include a first state in which "the image of a series of specific pixels in workpiece image IMG#1-31 and the image of a series of specific pixels in workpiece image IMG#1-32 are literally identical." Furthermore, the state in which "no change is observed in the image of a series of specific pixels between workpiece image IMG#1-31 and workpiece image IMG#1-32" may, in addition to or instead of the first state, include a second state in which "the image of a series of specific pixels in workpiece image IMG#1-31 and the image of a series of specific pixels in workpiece image IMG#1-32 are not literally identical, but the difference between them is small enough that they can be considered to be identical (for example, the difference between them is smaller than a third allowable upper limit value)."

[0221] Furthermore, the state in which "no change is observed in the brightness of the image of a series of specific pixels between workpiece image IMG#1-31 and workpiece image IMG#1-32" referred to here may include a first state in which "the brightness of the image of a series of specific pixels in workpiece image IMG#1-31 and the brightness of the image of a series of specific pixels in workpiece image IMG#1-32 are literally exactly the same." Furthermore, the state in which "no change is observed in the brightness of the image of a series of specific pixels between workpiece image IMG#1-31 and workpiece image IMG#1-32" may, in addition to or instead of the first state, include a second state in which "the brightness of the image of a series of specific pixels in workpiece image IMG#1-31 and the brightness of the image of a series of specific pixels in workpiece image IMG#1-32 are not literally exactly the same, but the difference between them is small enough that they can be considered to be the same (for example, the difference between them is smaller than a fourth allowable upper limit value)."

[0222] For this reason, the workpiece inspection unit 2212 may determine whether a series of specific pixel images correspond to a crack or to an edge of the workpiece W by determining whether a change in brightness is observed in the images of the same series of specific pixels between the workpiece image IMG#1-31 and the workpiece image IMG#1-32. Specifically, if no change in brightness is observed in the images of the same series of specific pixels between the workpiece image IMG#1-31 and the workpiece image IMG#1-32, the workpiece inspection unit 2212 may determine that the images of the series of specific pixels correspond to a crack. In other words, if no change in brightness is observed in the images of the same series of specific pixels between the workpiece image IMG#1-31 and the workpiece image IMG#1-32, the workpiece inspection unit 2212 may determine that a crack exists at the position of the images of the series of specific pixels. On the other hand, if a change in brightness of the same series of specific pixel images is observed between workpiece image IMG#1-31 and workpiece image IMG#1-32, the workpiece inspection unit 2212 may determine that the series of specific pixel images is a series of specific pixel images corresponding to the edge of the workpiece W. In other words, if a change in brightness of the same series of specific pixel images is observed between workpiece image IMG#1-31 and workpiece image IMG#1-32, the workpiece inspection unit 2212 may determine that there is no crack at the position of the series of specific pixel images. If a change in brightness of the same series of specific pixel images is observed between workpiece image IMG#1-31 and workpiece image IMG#1-32, the workpiece inspection unit 2212 may determine that there is an edge of the workpiece W at the position of the series of specific pixel images. As a result, the workpiece inspection unit 2212 is less likely to erroneously detect a series of specific pixel images corresponding to the edge of the workpiece W as a crack. As a result, the accuracy of crack detection is improved.

[0223] (4-1-4) Fourth Crack Determination Operation The fourth crack determination operation is a crack determination operation for determining whether an image of a series of specific pixels detected as a crack is a crack or an edge of the workpiece W, using a plurality of workpiece images IMG#1 generated by the stereo camera 2121 capturing images of the workpiece W while changing the characteristics of the UV illumination light. In other words, in the fourth crack determination operation, the imaging conditions under which the stereo camera 2121 captures images of the workpiece W include the characteristics of the UV illumination light.

[0224] Below, an example will be described in which the fourth crack determination operation is a crack determination operation for determining whether an image of a series of specific pixels detected as a crack is a crack or an edge of the workpiece W, using a plurality of workpiece images IMG#1 generated by the stereo camera 2121 capturing images of the workpiece W while changing the intensity of the UV illumination light. That is, below, an example will be described in which the imaging conditions under which the stereo camera 2121 captures images of the workpiece W include the intensity of the UV illumination light, which is an example of a characteristic of the UV illumination light.

[0225] For example, as shown in FIG. 21(a) which shows an illumination device 2123 illuminating the workpiece W with UV illumination light, the stereo camera 2121 may generate workpiece image IMG#1-41 as workpiece image IMG#1 by capturing an image of the workpiece W when the illumination device 2123 is illuminating the workpiece W with UV illumination light of a first intensity. Furthermore, as shown in FIG. 21(b) which shows an illumination device 2123 illuminating the workpiece W with UV illumination light, the stereo camera 2121 may generate workpiece image IMG#1-42 as workpiece image IMG#1 by capturing an image of the workpiece W when the illumination device 2123 is illuminating the workpiece W with UV illumination light of a second intensity different from the first intensity.

[0226] Thereafter, the workpiece inspection unit 2212 determines, based on the workpiece images IMG#1-41 and IMG#1-42, whether the image of the series of specific pixels detected as a crack by the crack detection method including edge detection processing is a crack or an edge of the workpiece W. Specifically, the workpiece inspection unit 2212 may determine, based on changes in the images captured in each of the workpiece images IMG#1-41 and IMG#1-42 (particularly, the image of the series of specific pixels detected as a crack by the crack detection method including edge detection processing), whether the image of the series of specific pixels is a crack or an edge of the workpiece W.

[0227] For example, Figure 22(a) shows an example of a workpiece image IMG#1-41, and Figure 22(b) shows an example of a workpiece image IMG#1-42. Figures 22(a) and 22(b) show workpiece images IMG#1-41 and IMG#1-42, respectively, in which a series of specific pixel images L#41 corresponding to a crack and a series of specific pixel images L#42 corresponding to an edge of the workpiece W are detected. In other words, Figures 22(a) and 22(b) show workpiece images IMG#1-41 and IMG#1-42, respectively, in which a series of specific pixel images L#41 and a series of specific pixel images L#42 are captured.

[0228] When the intensity of the UV illumination light (or any characteristic of the UV illumination light, the same applies hereinafter) changes, the intensity (or any characteristic, the same applies hereinafter) of at least one of the reflected light and scattered light of the UV illumination light by the workpiece W changes. When the intensity of at least one of the reflected light and scattered light of the UV illumination light by the workpiece W changes, a change is likely to be observed in the appearance of the edge of the workpiece W (image L#32 of a series of specific pixels corresponding to the edge of the workpiece W) that is captured in the workpiece image IMG#1 when the stereo camera 2121 receives at least one of the reflected light and scattered light of the UV illumination light by the workpiece W. Therefore, a change is likely to be observed in the image L#42 of a series of specific pixels corresponding to the edge of the workpiece W between the workpiece images IMG#1-41 and IMG#1-42. For example, a change is likely to be observed in the brightness of the image L#42 of a series of specific pixels corresponding to the edge of the workpiece W between the workpiece images IMG#1-41 and IMG#1-42.

[0229] On the other hand, even if the intensity of the UV illumination light changes, as long as the UV illumination light is irradiated onto the flaw detection agent that has penetrated the crack, the flaw detection agent will emit excitation light. Therefore, when the stereo camera 2121 receives the excitation light, there is a high possibility that no change will be observed in the appearance of the crack (the image L#41 of a series of specific pixels corresponding to the crack) that appears in the workpiece image IMG#1. Therefore, there is a high possibility that no change will be observed in the image L#41 of a series of specific pixels that correspond to the crack between the workpiece image IMG#1-41 and the workpiece image IMG#1-42. For example, there is a high possibility that no change will be observed in the brightness of the image L#41 of a series of specific pixels that correspond to the crack between the workpiece image IMG#1-41 and the workpiece image IMG#1-42.

[0230] Note that the state in which "no change is observed in the image of a series of specific pixels between workpiece image IMG#1-41 and workpiece image IMG#1-42" referred to here may include a state similar to the state in which "no change is observed in the image of a series of specific pixels between workpiece image IMG#1-31 and workpiece image IMG#1-32" described in the third crack determination operation. Also, the state in which "no change is observed in the brightness of the image of a series of specific pixels between workpiece image IMG#1-41 and workpiece image IMG#1-42" referred to here may include a state similar to the state in which "no change is observed in the image of a series of specific pixels between workpiece image IMG#1-31 and workpiece image IMG#1-32" described in the third crack determination operation.

[0231] For this reason, the workpiece inspection unit 2212 may determine whether a series of specific pixel images correspond to a crack or to an edge of the workpiece W by determining whether a change in brightness is observed in the images of the same series of specific pixels between the workpiece image IMG#1-41 and the workpiece image IMG#1-42. Specifically, if no change in brightness is observed in the images of the same series of specific pixels between the workpiece image IMG#1-41 and the workpiece image IMG#1-42, the workpiece inspection unit 2212 may determine that the images of the series of specific pixels correspond to a crack. In other words, if no change in brightness is observed in the images of the same series of specific pixels between the workpiece image IMG#1-41 and the workpiece image IMG#1-42, the workpiece inspection unit 2212 may determine that a crack exists at the position of the images of the series of specific pixels. On the other hand, if a change in brightness of the same series of specific pixel images is observed between workpiece image IMG#1-41 and workpiece image IMG#1-42, the workpiece inspection unit 2212 may determine that the series of specific pixel images is a series of specific pixel images corresponding to the edge of the workpiece W. In other words, if a change in brightness of the same series of specific pixel images is observed between workpiece image IMG#1-41 and workpiece image IMG#1-42, the workpiece inspection unit 2212 may determine that there is no crack at the position of the series of specific pixel images. If a change in brightness of the same series of specific pixel images is observed between workpiece image IMG#1-41 and workpiece image IMG#1-42, the workpiece inspection unit 2212 may determine that there is an edge of the workpiece W at the position of the series of specific pixel images. As a result, the workpiece inspection unit 2212 is less likely to erroneously detect a series of specific pixel images corresponding to the edge of the workpiece W as a crack. As a result, the accuracy of crack detection is improved.

[0232] (4-1-5) Fifth Crack Determination Operation The fifth crack determination operation is a crack determination operation for determining whether a series of specific pixel images detected as a crack are a crack or an edge of the workpiece W using a plurality of workpiece images IMG#1 generated by the stereo camera 2121 capturing images of the workpiece W while switching the UV illumination light on and off. In other words, in the fifth crack determination operation, the imaging conditions under which the stereo camera 2121 captures images of the workpiece W include the on / off of the UV illumination light. Note that the on / off of the UV illumination light may be considered an example of a characteristic of the UV illumination light. In this case, similar to the fourth crack determination operation, the fifth crack determination operation may be considered a crack determination operation for determining whether a series of specific pixel images detected as a crack are a crack or an edge of the workpiece W using a plurality of workpiece images IMG#1 generated by the stereo camera 2121 capturing images of the workpiece W while changing the characteristics of the UV illumination light.

[0233] For example, as shown in FIG. 23( a) showing a stereo camera 2121 capturing an image of a workpiece W, the stereo camera 2121 may capture an image of the workpiece W when the lighting device 2123 is illuminating the workpiece W with UV illumination light, thereby generating workpiece image IMG#1-51 as workpiece image IMG#1. In other words, the stereo camera 2121 may capture an image of the workpiece W when the UV illumination light is on, thereby generating workpiece image IMG#1-51 as workpiece image IMG#1. Furthermore, as shown in FIG. 23( b) showing a stereo camera 2121 capturing an image of the workpiece W when the lighting device 2123 is not illuminating the workpiece W with UV illumination light, the stereo camera 2121 may capture an image of the workpiece W when the lighting device 2123 is not illuminating the workpiece W with UV illumination light, thereby generating workpiece image IMG#1-52 as workpiece image IMG#1. In other words, the stereo camera 2121 may capture an image of the workpiece W when the UV illumination light is off, thereby generating workpiece image IMG#1-52 as workpiece image IMG#1.

[0234] As described above, when the stereo camera 2121 captures an image of the workpiece W to generate the stereo image data IMD_3D, the illumination device 2123 does not need to illuminate the workpiece W with UV illumination light. Therefore, the workpiece image IMG#1 indicated by the stereo image data IMD_3D may be used as the workpiece image IMG#1-52. However, a new workpiece image IMG#1-52 may be generated separately from the workpiece image IMG#1 indicated by the stereo image data IMD_3D. In other words, the stereo camera 2121 may capture an image of the workpiece W to generate the stereo image data IMD_3D, and may also capture an image of the workpiece W to generate the workpiece image IMG#1-52.

[0235] Thereafter, the workpiece inspection unit 2212 determines, based on the workpiece images IMG#1-51 and IMG#1-52, whether a series of specific pixels detected as a crack by a crack detection method including edge detection processing is a crack or an edge of the workpiece W. Specifically, the workpiece inspection unit 2212 may determine, based on changes in the images (particularly, images of the series of specific pixels detected as a crack by a crack detection method including edge detection processing) captured in each of the workpiece images IMG#1-51 and IMG#1-52, whether a series of specific pixels is a crack or an edge of the workpiece W.

[0236] For example, Figure 24(a) shows an example of a workpiece image IMG#1-51, and Figure 24(b) shows an example of a workpiece image IMG#1-52. Figures 24(a) and 24(b) show workpiece images IMG#1-51 and IMG#1-52, respectively, in which a series of specific pixel images L#51 corresponding to a crack and a series of specific pixel images L#52 corresponding to an edge of the workpiece W are detected. In other words, Figures 24(a) and 24(b) show workpiece images IMG#1-51 and IMG#1-52, respectively, in which a series of specific pixel images L#51 and a series of specific pixel images L#52 are captured.

[0237] When the workpiece W is illuminated with UV illumination light, at least one of the reflected light and scattered light of the UV illumination light by the workpiece W and the excitation light emitted by the flaw detection agent illuminated with the UV illumination light are both incident on the stereo camera 2121. For this reason, as shown in FIG. 24( a), there is a high possibility that both the edge of the workpiece W (image L#52 of a series of specific pixels corresponding to the edge of the workpiece W) and the crack (image L#51 of a series of specific pixels corresponding to the crack) are captured in the workpiece image IMG#1-51.

[0238] On the other hand, when the workpiece W is not illuminated with UV illumination light, the excitation light emitted by the flaw detection agent illuminated with UV illumination light does not enter the stereo camera 2121. On the other hand, even when the workpiece W is not illuminated with UV illumination light, there is a high possibility that at least one of the ambient light (e.g., visible light) reflected by the workpiece W and the scattered light is incident on the stereo camera 2121. Note that, at the timing when the stereo camera 2121 captures the workpiece W to generate the workpiece image IMG#1-52, the illumination device 2123 may illuminate the workpiece W with visible illumination light (i.e., illumination light with a different wavelength from the UV illumination light). In this case, there is a high possibility that at least one of the reflected light and scattered light from the workpiece W of the visible illumination light emitted by the illumination device 2123 is incident on the stereo camera 2121. Therefore, as shown in Figure 24 (b), the workpiece image IMG#1-52 is likely to reflect the edge of the workpiece W (image L#52 of a series of specific pixels corresponding to the edge of the workpiece W), but not the crack (image L#51 of a series of specific pixels corresponding to the crack).

[0239] For this reason, the workpiece inspection unit 2212 may determine whether the image of a series of specific pixels reflected in the workpiece image IMG#1-51 is also reflected in the workpiece image IMG#1-52, thereby determining whether the image of a series of specific pixels is an image of a series of specific pixels corresponding to a crack or an image of a series of specific pixels corresponding to an edge of the workpiece W. Specifically, if the image of a series of specific pixels reflected in the workpiece image IMG#1-51 is not also reflected in the workpiece image IMG#1-52, the workpiece inspection unit 2212 may determine that the image of a series of specific pixels is an image of a series of specific pixels corresponding to a crack. In other words, if the image of a series of specific pixels reflected in the workpiece image IMG#1-51 is not also reflected in the workpiece image IMG#1-52, the workpiece inspection unit 2212 may determine that a crack exists at the position of the image of the series of specific pixels. On the other hand, if the image of a series of specific pixels reflected in the workpiece image IMG#1-51 is also reflected in the workpiece image IMG#1-52, the workpiece inspection unit 2212 may determine that the image of the series of specific pixels corresponds to the edge of the workpiece W. In other words, if the image of a series of specific pixels reflected in the workpiece image IMG#1-51 is also reflected in the workpiece image IMG#1-52, the workpiece inspection unit 2212 may determine that there is no crack at the position of the image of the series of specific pixels. If the image of a series of specific pixels reflected in the workpiece image IMG#1-51 is also reflected in the workpiece image IMG#1-52, the workpiece inspection unit 2212 may determine that there is an edge of the workpiece W at the position of the image of the series of specific pixels. As a result, the workpiece inspection unit 2212 is less likely to erroneously detect the image of a series of specific pixels corresponding to the edge of the workpiece W as a crack. As a result, the accuracy of crack detection is improved.

[0240] (4-2) Second Modification In the above description, the workpiece inspection unit 2212 controls the display device 225 to display the point cloud data and the defect information on the same screen. In the second modification, the workpiece inspection unit 2212 may control the display device 225 to display the point cloud data and the defect information on separate screens. In other words, the workpiece inspection unit 2212 may control the display device 225 to display the point cloud data on a first screen and the defect information on a second screen that is different from the first screen.

[0241] As an example, the workpiece inspection unit 2212 may control the display device 225 to display the workpiece image IMG#1 indicated by the flaw detection image data IMD_inspect on the second screen. Furthermore, the workpiece inspection unit 2212 may control the display device 225 so that, when a user performs an operation to select a crack in the workpiece image IMG#1 displayed on the display device 225, a three-dimensional model of the workpiece W with the selected crack superimposed thereon is displayed on the first screen (e.g., the first screen is displayed as a pop-up). The workpiece inspection unit 2212 may control the display device 225 so that, when a user performs an operation to select a crack in the workpiece image IMG#1 displayed on the display device 225, the selected crack is superimposed on the three-dimensional model of the workpiece W already displayed on the first screen. The work inspection unit 2212 may control the display device 225 so that, when a user performs an operation to select a crack within the work image IMG#1 displayed on the display device 225, detailed information 2251 (see Figure 13) regarding the details of the selected crack is popped up on the first screen.

[0242] As another example, the workpiece inspection unit 2212 may control the display device 225 to display point cloud data on a first screen intended to be primarily viewed by either the user's right eye or left eye, and to display defect information on a second screen intended to be primarily viewed by the other of the user's right eye or left eye. In this case, the user may internally combine the point cloud data viewed by either the right eye or left eye with the defect information viewed by the other of the right eye or left eye. As a result, even if the point cloud data and the defect information are displayed on different screens, the user can essentially view the superimposed point cloud data and defect information.

[0243] Alternatively, in the case where the point cloud data and the defect information are displayed on the same screen, the workpiece inspection unit 2212 may control the display device 225 to display the point cloud data on the screen during a first period and to display the defect information on the screen during a second period different from the first period. In other words, the workpiece inspection unit 2212 may control the display device 225 to display the point cloud data and the defect information on the same screen in a time-division manner.

[0244] Alternatively, the measurement system 2 may include a projection device capable of projecting the point cloud data and the defect information onto a predetermined screen in addition to or instead of the display device 225. The measurement system 2 may include a projection device capable of projecting the defect information onto the workpiece W in addition to or instead of the display device 225.

[0245] (4-3) Third Modification In the above description, the measurement system 2 uses a single control device 22 to generate point cloud data of the workpiece W based on the stereo image data IMD_3D, and detects defects (e.g., cracks) in the workpiece W based on the flaw detection image data IMD_inspect. In a third modification, the measurement system 2 may use multiple control devices 22 to generate point cloud data of the workpiece W based on the stereo image data IMD_3D, and detect defects (e.g., cracks) in the workpiece W based on the flaw detection image data IMD_inspect.

[0246] 25, which is a block diagram showing the configuration of the measurement system 2 in the third modified example, a first control device 22#1 and a second control device 22#2 may be separately provided. The first control device 22#1 may generate point cloud data of the workpiece W based on the stereo image data IMD_3D. The second control device 22#1 may detect defects (e.g., cracks) in the workpiece W based on the flaw detection image data IMD_inspect.

[0247] The configuration of each of the first control device 22#1 and the second control device 22#2 may be the same as the configuration of the control device 22 shown in Fig. 7. That is, as shown in Fig. 26(a), which is a block diagram showing the configuration of the first control device 22#1, the first control device 22#1 may include a first calculation device (first processor) 221#1, a first storage device (first memory) 222#1, a first communication device 223#1, a first input device 224#1, and a first display device 225#1 as the calculation device (processor) 221, the storage device (memory) 222, the communication device 223, the input device 224, and the display device 225, respectively. As shown in Figure 26(b), which is a block diagram showing the configuration of the second control device 22#2, the second control device 22#2 may be equipped with a second calculation device (second processor) 221#2, a second storage device (second memory) 222#2, a second communication device 223#2, a second input device 224#2 and a second display device 225#2 as the calculation device (processor) 221, the storage device (memory) 222, the communication device 223, the input device 224 and the display device 225, respectively.

[0248] 26(a) and 26(b), the first control device 22#1 includes a control information generator 2211#1, and the second control device 22#2 includes a control information generator 2211#2. However, if the first control device 22#1 includes the control information generator 2211#1, the second control device 22#2 does not need to include the control information generator 2211#2. If the second control device 22#2 includes the control information generator 2211#2, the first control device 22#1 does not need to include the control information generator 2211#1.

[0249] (4-4) Other Modifications In the above description, the measurement system 2 (particularly the imaging system 21) generates the stereo image data IMD_3D and the flaw detection image data IMD_inspect separately at different times. Specifically, as shown in the above-mentioned FIG. 9 , the imaging system 21 generates the flaw detection image data IMD_inspect by imaging the workpiece W in step S112, and generates the stereo image data IMD_3D by imaging the workpiece W in step S114, which is different from step S112. However, the imaging system 21 may generate the stereo image data IMD_3D and the flaw detection image data IMD_inspect at the same time. For example, the imaging system 21 may generate stereo image data IMD_3D showing both the two workpiece images IMG#1 and IMG#2 and stereo image data IMD_3D showing one workpiece image IMG#1 at the same time by generating two workpiece images IMG#1 and IMG#2 using the stereo camera 2121. However, in this case, the stereo camera 2121 may image the workpiece W during at least a part of the period when the projection device 2122 projects a projection pattern onto the workpiece W and the illumination device 2123 illuminates the workpiece W with UV illumination light.

[0250] In the above description, the stereo camera 2121 of the measurement system 2 generates the stereo image data IMD_3D by capturing an image of a workpiece W onto which the projection device 2122 projects a projection pattern. The stereo camera 2121 may also generate the stereo image data IMD_3D by capturing an image of a workpiece W onto which the projection device 2122 does not project a projection pattern. Even in this case, the workpiece inspection unit 2212 may calculate the parallax by matching common portions captured in the two workpiece images IMG#1 and IMG#2 included in the stereo image data IMD_3D. As a result, point cloud data of the workpiece W may be generated even when the stereo camera 2121 captures an image of a workpiece W onto which the projection device 2122 does not project a projection pattern. Note that when the stereo camera 2121 captures an image of a workpiece W onto which the projection device 2122 does not project a projection pattern, the measurement system 2 (particularly, the imaging system 21) does not need to include the projection device 2122.

[0251] In the above description, the measurement system 2 (particularly, the imaging system 21) includes a stereo camera 2121. However, the imaging system 21 may also include, in addition to the stereo camera 2121, a monocular camera capable of capturing an image of the workpiece W to generate a workpiece image IMG (workpiece image data IMD). In this case, the control device 22 may use the workpiece image data IMD generated by the stereo camera 2121 as stereo image data IMD_3D. Furthermore, the control device 22 may use the workpiece image data IMD generated by the monocular camera as flaw detection image data IMD_inspect. Note that the stereo camera 2121 and the monocular camera may be integrated or may be separate imaging devices.

[0252] In the above description, the processing apparatus 1 melts the shaping material M by irradiating the shaping material M with the processing light EL. However, the processing apparatus 1 may melt the shaping material M by irradiating the shaping material M with any energy beam. Examples of the any energy beam include at least one of a charged particle beam and an electromagnetic wave. Examples of the charged particle beam include at least one of an electron beam and an ion beam.

[0253] In the above description, the processing apparatus 1 performs additive processing using a laser build-up welding method. However, the processing apparatus 1 may also perform additive processing using an additive processing method other than laser build-up welding. For example, the processing apparatus 1 may perform additive processing using a powder bed fusion method. When the processing apparatus 1 performs additive processing using a powder bed fusion method, after the workpiece W measured by the measurement system 2 or a holder holding the workpiece W is placed on the stage 131 of the processing apparatus 1, the processing apparatus 1 fills the periphery of the workpiece W with the building material M so that the top surface of the building material M is positioned on the top surface of the workpiece W, and then performs additive processing on the top surface of the workpiece W.

[0254] In the above description, the processing device 1 is an additive processing device capable of performing additive processing on the workpiece W. However, the processing device 1 may also be a processing device capable of performing any processing on the workpiece W. For example, the processing device 1 may be a processing device (removal processing device) capable of performing removal processing to remove a portion of the workpiece W. In this case, the processing device 1 may perform removal processing to remove a portion of the workpiece W by irradiating the workpiece W with processing light EL (or any energy beam). Alternatively, the processing device 1 may perform removal processing to remove a portion of the workpiece W using a cutting tool. For example, the processing device 1 may be a processing device capable of performing remelt processing to reduce the flatness (i.e., reduce the surface roughness or make the surface closer to a flat surface) of the surface of the workpiece W (or a shaped object formed on the workpiece W) processed by additive processing or removal processing.

[0255] At least some of the constituent elements of each of the above-described embodiments can be appropriately combined with at least some of the other constituent elements of each of the above-described embodiments. Some of the constituent elements of each of the above-described embodiments may not be used. Furthermore, to the extent permitted by law, the disclosures of all publications and U.S. patents cited in each of the above-described embodiments are incorporated herein by reference.

[0256] The present invention is not limited to the above-described embodiments, but can be modified as appropriate within the scope of the claims and the gist or idea of ​​the invention as can be read from the entire specification, and information processing methods, processing methods, display methods, display devices, information processing devices, and computer programs that involve such modifications are also included in the technical scope of the present invention.

[0257] SYS Machining system 1 Machining device 2 Measurement system 21 Imaging system 211 Stage unit 2111 Stage 2112 Stage drive system 212 Imaging unit 2121 Stereo camera 2122 Projection device 2123 Lighting device 2124 Filter 213 Housing 22 Control device 221 Arithmetic device 2211 Control information generation unit 2212 Work inspection unit 24 Input device 25 Display device W Work EL Machining light

Claims

1. An information output method for outputting information relating to defects in an object, the information output method outputting: (i) display information capable of displaying inspection result information relating to the defects and three-dimensional shape information of the object; and (ii) output information in which the inspection result information and the three-dimensional shape information are associated with each other.

2. The information output method described in claim 1, wherein the defects include a first defect located at a first position on the object and a second defect located at a second position on the object different from the first position, and the display mode of the first defect and the display mode of the second defect are different.

3. The information output method according to claim 1 or 2, wherein the defect is displayed in a different manner in the inspection result information based on the likelihood of being determined to be a defect.

4. The information output method according to claim 2 or 3, wherein the display mode is a display color of the display indicating the defect.

5. The information output method according to any one of claims 2 to 4, wherein the display mode is the brightness of the display indicating the defect.

6. An information output method according to any one of claims 1 to 5, wherein the display information includes position information of the object of the defect detected as the inspection result information.

7. An information output method according to any one of claims 1 to 6, wherein the three-dimensional shape information is a three-dimensional model of the object, and the display information includes the three-dimensional model and information of a display object displayed on the three-dimensional model corresponding to the defect detected as the inspection result information.

8. The information output method according to claim 7, wherein the display object has a shape corresponding to the defect detected as the inspection result information.

9. The information output method according to claim 7 or 8, wherein a size of the displayed object for the three-dimensional model corresponds to a size of the defect detected as the inspection result information for the object.

10. The information output method according to claim 9, further comprising determining the size of the display object based on the output information.

11. The information output method according to any one of claims 7 to 10, wherein a position of the display object relative to the three-dimensional model corresponds to a position of the defect detected as the inspection result information for the object.

12. The information output method according to claim 11, further comprising determining the position of the display object based on the output information.

13. The information output method according to any one of claims 7 to 12, further comprising the step of outputting detailed information about the defect corresponding to the display object when an operation is performed on the display object.

14. The information output method according to claim 13, wherein the detailed information includes at least one of information regarding the degree of the defect, information regarding the position of the defect, and information regarding the size of the defect.

15. An information output method according to any one of claims 1 to 14, wherein the display information notifies information in the three-dimensional shape information of a selected defect from among the defects.

16. The information output method according to claim 15, further comprising generating information on the three-dimensional shape of the selected defect based on the inspection result information.

17. The information output method according to claim 15 or 16, further comprising popping up a screen displaying the three-dimensional shape information indicating the selected defect, and notifying information in the three-dimensional shape information of the selected defect.

18. The information output method according to any one of claims 1 to 17, wherein the three-dimensional shape information is point cloud data.

19. An information output method for outputting information relating to defects in an object, the information output method comprising the steps of: outputting display information capable of displaying inspection result information relating to the defects and three-dimensional shape information of the object.

20. An information output method for outputting information relating to defects in an object, the information output method comprising the steps of: outputting inspection result information relating to the defects and three-dimensional shape information of the object, the inspection result information being associated with each other.

21. An information output method according to any one of claims 1 to 20, wherein the output information includes a first image captured of the object to which a flaw detection agent has been applied in order to obtain the inspection result information, a second image captured of the object in order to obtain the three-dimensional shape information, and information linking the second image to the first image.

22. An inspection device that executes the information output method according to any one of claims 1 to 21.

23. An information output device that outputs information regarding defects in an object, comprising: a storage device that stores program code; and a control device that outputs (i) display information that enables the display of inspection result information regarding the defects and three-dimensional shape information of the object; and (ii) output information in which the inspection result information and the three-dimensional shape information are associated with each other, by reading and executing the program code from the storage device.

24. The information output device of claim 23, wherein the control device generates the display information in which the display manner of a first defect located at a first position of the object and a second defect located at a second position of the object different from the first position, which are defects contained in the inspection result information, is different.

25. The information output device according to claim 23 or 24, wherein the control device generates the display information in which the display mode of the defect is changed based on the likelihood of determining that the defect exists.

26. The information output device according to claim 24 or 25, wherein the control device generates the display information in which the display color indicating the defect is changed as the display mode.

27. The information output device according to any one of claims 24 to 26, wherein the control device generates the display information in such a manner that the luminance of the display indicating the defect is varied as the display mode.

28. The information output device according to any one of claims 23 to 27, wherein the control device generates the display information including position information of the object of the detected defect.

29. An information output device as described in any one of claims 23 to 28, wherein the control device generates the display information including a three-dimensional model of the object as the three-dimensional shape information, and information of a display object displayed on the three-dimensional model corresponding to the defect detected as the inspection result information.

30. The information output device according to claim 29, wherein the control device generates the display object having a shape corresponding to the detected defect.

31. The information output device according to claim 29 or 30, wherein the control device causes a size of the displayed object for the three-dimensional model to correspond to a size of the defect detected as the inspection result information for the object.

32. The information output device according to claim 31, wherein the control device determines the size of the display object based on the output information.

33. The information output device according to any one of claims 29 to 32, wherein the control device causes a position of the display object with respect to the three-dimensional model to correspond to a position of the defect detected as the inspection result information for the object.

34. The information output device according to claim 33, wherein the control device determines the position of the display object based on the output information.

35. The information output device according to any one of claims 29 to 34, wherein the control device outputs detailed information on the defect corresponding to the display object in response to an input to the display object.

36. The information output device according to claim 35, wherein the control device outputs, as the detailed information, at least one of information regarding the degree of the defect, information regarding the position of the defect, and information regarding the size of the defect.

37. The information output device according to any one of claims 23 to 36, wherein the control device outputs the display information notifying information in the three-dimensional shape information of a selected defect from among the defects.

38. The information output device according to claim 37, wherein the control device generates information on the three-dimensional shape information of the selected defect based on the inspection result information.

39. The information output device according to claim 37 or 38, wherein the control device generates the display information notifying information in the three-dimensional shape information of the selected defect, and pops up a screen displaying the display information.

40. The information output device according to any one of claims 23 to 39, wherein the control device outputs point cloud data as the three-dimensional shape information.

41. An information output device that outputs information related to defects in an object, comprising: a storage device that stores program code; and an information output device that outputs display information that can display inspection result information related to the defects and three-dimensional shape information of the object by reading and executing the program code from the storage device.

42. An information output device that outputs information regarding defects in an object, comprising: a storage device that stores program code; and an information output device that reads and executes the program code from the storage device to output output information in which inspection result information regarding the defects and three-dimensional shape information of the object are associated with each other.

43. An information output device as described in any one of claims 23 to 42, wherein the output information includes a first image captured of the object to which a flaw detection agent has been applied in order to obtain the inspection result information, a second image captured of the object in order to obtain the three-dimensional shape information, and information linking the second image to the first image.

44. An inspection method for detecting defects in an object using an apparatus capable of generating three-dimensional shape information of the object based on a first output from a first camera and a second output from a second camera, the inspection method generating inspection result information regarding the defects in the object based on the first output regarding the object.

45. The inspection method according to claim 44, further comprising the steps of: generating the three-dimensional shape information based on the first output and the second output; and generating display information capable of displaying the inspection result information and the three-dimensional shape information.

46. ​​The inspection method described in claim 45, wherein the positional relationship between the first camera and the object is the same when acquiring the first output for obtaining the inspection result information and when acquiring the first output for generating the three-dimensional shape information.

47. The inspection method described in claim 46, wherein the positional relationship between the first camera and the object when obtaining the first output for generating the three-dimensional shape information is regularly changed relative to the positional relationship between the first camera and the object when obtaining the first output for obtaining the inspection result information.

48. The inspection method according to any one of claims 44 to 47, wherein the three-dimensional shape information is point cloud data.

49. An inspection method as described in any one of claims 44 to 48, wherein the inspection result information is generated based on the first output of the object when a flaw detection agent is applied to the object and then light that reacts to the flaw detection agent is irradiated onto the object.

50. An inspection method according to any one of claims 44 to 48, wherein the three-dimensional shape information is generated based on the first output and the second output of the object in a state where a projection pattern is projected.

51. An inspection apparatus for carrying out the inspection method according to any one of claims 44 to 50.

52. An inspection device for detecting defects in an object, comprising: a first camera; a second camera arranged at an interval from the first camera; a first memory device storing a first program code; a second memory device storing a second program code; a first control device that generates three-dimensional shape information of the object based on a first output from the first camera and a second output from the second camera by reading and executing the first program code from the first memory device; and a second control device that generates inspection result information regarding defects in the object based on the first output by reading and executing the second program code from the second memory device.

53. The inspection device of claim 52, wherein the first control device and the second control device are a single control device.

54. The inspection device according to claim 53, wherein the control device generates display information that enables the inspection result information and the three-dimensional shape information to be displayed.

55. An inspection device as described in any one of claims 52 to 54, further comprising a mounting device on which the object can be placed and which can change the relative positions between the first camera and the object, and between the second camera and the object, without changing the relative positions between the first camera and the second camera.

56. The inspection device according to any one of claims 52 to 55, wherein the three-dimensional shape information is point cloud data.

57. An inspection device as described in any one of claims 52 to 56, further comprising a light capable of irradiating the object to which the flaw detection agent is applied with light that reacts with the flaw detection agent when the first output is acquired to generate the inspection result information.

58. An inspection device according to any one of claims 52 to 57, further comprising a projector capable of projecting a projection pattern onto the object when the first output and the second output are acquired to generate the three-dimensional shape information.

59. A processing method using an inspection device that detects defects in an object and a processing device that processes the object, comprising the steps of: placing the object inside a housing of the inspection device, detecting defects in the object with the inspection device, transporting the object from the inspection device to the processing device, placing the object inside the housing of the processing device, and processing the object with the processing device.

60. The processing method according to claim 59, further comprising the steps of: transporting the object attached to a jig from the inspection device to the processing device; and processing the object attached to the jig with the processing device.

61. A processing method as described in claim 59 or 60, comprising applying a flaw detection agent to the object, placing the object inside a housing of the inspection device, and irradiating the object with light that reacts with the flaw detection agent using the inspection device to detect defects in the object.

62. A processing method as described in claim 61, comprising sequentially applying a flaw detection agent and a developer for developing the flaw detection agent to the object, placing the object inside a housing of the inspection device, and irradiating the object with light that reacts with the flaw detection agent in the inspection device to detect defects in the object.

63. The processing method according to claim 62, further comprising removing the developer from the object removed from the housing of the inspection device, placing the object inside the housing of the processing device, and processing the object with the processing device.

64. The processing method according to claim 62, wherein the object removed from the housing of the inspection device is placed inside the housing of the processing device without removing the developer, and is processed by the processing device.

65. The processing method according to any one of claims 59 to 64, wherein the processing device processes the object in which the defect is not detected by the inspection device.

66. The processing system according to any one of claims 59 to 65, wherein the processing of the processing device is an additive processing.

67. The processing method according to claim 66, wherein after removing a portion of the object in which the defect has been detected by the inspection device, the processing device performs the additional processing on the object.

68. The processing method according to any one of claims 59 to 67, wherein the processing device processes the object based on the detection result of the defect of the object by the inspection device.

69. The processing method according to any one of claims 59 to 68, wherein the detection of defects in the object by the inspection device includes measurement of a three-dimensional shape of the object.

70. A processing method using a processing device that processes an object and an inspection device that detects defects in the object, comprising the steps of: placing the object inside a housing of the processing device, processing the object with the processing device, transporting the object from the processing device to the inspection device, placing the object inside the housing of the inspection device, and detecting defects in the object.

71. The processing method according to claim 70, further comprising the steps of: processing the object attached to a jig with the processing device; transporting the object attached to the jig from the processing device to the inspection device; and detecting defects in the object attached to the jig with the inspection device.

72. A processing method as described in claim 70 or 71, comprising the steps of: applying a flaw detection agent to the object; placing the object inside a housing of the inspection device; and irradiating the object with light that reacts with the flaw detection agent using the inspection device to detect defects in the object.

73. A processing method as described in claim 72, comprising sequentially applying a flaw detection agent and a developer for developing the flaw detection agent to the object, placing the object inside a housing of the inspection device, and irradiating the object with light that reacts with the flaw detection agent in the inspection device to detect defects in the object attached to a jig.

74. A processing system for carrying out the processing method of any one of claims 59 to 73.

75. A processing system comprising: an inspection device that detects defects in an object; a storage device that stores program code; and a processing device that reads and executes the program code from the storage device to process the object about which defects have been detected by the inspection device.

76. A processing system comprising: a processing device that processes an object; a storage device that stores program code; and an inspection device that reads and executes the program code from the storage device to detect defects in the object processed by the processing device.

77. The processing system according to claim 75 or 76, wherein the inspection device is capable of detecting defects in the object attached to a jig, and the processing device is capable of processing the object attached to the jig.

78. The processing system according to any one of claims 75 to 77, wherein the inspection device detects defects in the object placed inside a housing of the inspection device, and the processing device processes the object placed inside a housing of the processing device.

79. A processing system according to any one of claims 75 to 78, wherein the inspection device is equipped with lighting capable of irradiating the object to which the flaw detection agent is applied with light that reacts with the flaw detection agent.

80. A processing system described in any one of claims 75 to 79, wherein the inspection device outputs output information in which defect information regarding the defect of the object, three-dimensional shape information of the object, and object identification information for identifying the object are associated with each other.

81. A processing system according to any one of claims 75 to 80, wherein the inspection device outputs output information in which defect information regarding the defects of the object, three-dimensional shape information of the object, and processing history information regarding the history of processing performed on the object in the past are associated with each other.

82. The processing system according to any one of claims 75 to 81, wherein the processing device is an additional processing device that performs additional processing on the object.

83. The processing system according to any one of claims 75 to 82, wherein the processing device processes the object based on the result of detection of defects in the object by the inspection device.

84. The processing system according to any one of claims 75 to 83, wherein the detection of defects in the object in the inspection device includes measurement of a three-dimensional shape of the object.

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