Tiling-type display device

Abstract

A tiling-type display device is disclosed. The tiling-type display device comprises: a substrate; light-emitting elements disposed on the substrate; and modules, each including at least one electrode unit for applying voltage to the light-emitting element, wherein a seam between adjacent modules includes a resin, the difference (ΔRI) between a refractive index of the substrate and a refractive index of the resin in a visible light region is in a range of a -0.01≤ΔRI≤0.01, and the bending elastic modulus of the seam is 35,500 MPa or less.

Description

Tiling display device

[0001] The present invention relates to a tiling type display device.

[0002] Conventionally, a tiling display device has been known, which is a unit module having a display unit equipped with light-emitting elements, etc., and is connected by arranging multiple tiles with a regular pattern. Tiled display devices can provide ultra-large screens by connecting multiple tiles, and can also be used scalably by adjusting the number of tiles. However, problems related to the seams that occur between adjacent modules have been pointed out.

[0003] For example, Patent Document 1 describes a transparent composite composition comprising a transparent resin (a) and a glass filler (b), wherein the transparent resin (a) has an Abbe's number of 45 or more. Patent Document 1 also describes that the difference in refractive index between the transparent resin (a) and the glass filler (b) is preferably 0.01 or less.

[0004] Patent Document 1: Japanese Patent Application Laid-Open No. 2004-231934

[0005] The transparent complex composition described in the above patent document 1 has a refractive index difference of 0.01 or less and an Abbe number of 45 or more, but the refractive index difference may increase depending on the wavelength, resulting in insufficient transparency of the display. Therefore, when viewed from an oblique angle, refraction of transparent light passing through the seam or scattering of external light incident on the seam may be observed, resulting in a problem of inability to secure sufficient seamlessness. Furthermore, "seamlessness" refers to a characteristic in which scattering or reflection of transmitted light in the seam between modules does not cause scattering of external light, making it difficult to view the seam.

[0006] In addition, the transparent complex composition described in patent document 1 is suitable for use on rigid bodies such as substrates or lenses, and since the cured product has the characteristics of being very strong and weak, there was a problem that when used on a butt joint (core) of a substrate of a tiling display device, it was easily damaged due to sagging or deformation during handling.

[0007] The various embodiments of the present disclosure have been made in consideration of the above-described circumstances, and are intended to provide a means for improving seamlessness in the core while improving toughness (toughness) of the core.

[0008] The present inventors have conducted extensive research to solve the above-described problem. As a result, the present inventors have found that the above-described problem is solved by a tiling display device in which modules are tiled, each module having a substrate, a light-emitting element mounted on the substrate, and an electrode portion for applying voltage to the light-emitting element, wherein a seam between adjacent modules contains a resin, and a difference (ΔRI) between the refractive index of the substrate and the refractive index of the resin in the visible light region is in the range of -0.01≤ΔRI≤0.01, and a bending modulus of the seam is 35,500 MPa or less.

[0009] According to various embodiments of the present disclosure, a means is provided for improving seamlessness in the core while simultaneously improving toughness (toughness) of the core.

[0010] FIG. 1 is a drawing of a tiling display device according to at least one embodiment of the present disclosure, wherein (A) is a planar schematic diagram, (B) is a cross-sectional schematic diagram cut along line AA, and (C) is a cross-sectional schematic diagram cut along line BB.

[0011] Hereinafter, various embodiments of the present disclosure will be described in more detail, with appropriate reference to the drawings. The embodiments described herein are not necessarily limited to the described contents, and may be implemented by other alternative configurations or additions to the configuration. All other possible implementation forms, embodiments, and operating techniques that can be devised by those skilled in the art without departing from the gist of the present invention are included within the scope and gist of the present invention, and are also included within the scope of the invention described in the claims and their equivalents.

[0012] In this disclosure, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can each include any one of the items listed together in that phrase, or all possible combinations thereof. For example, "A or B," "at least one of A and B," or "at least one of A or B" can all refer to (1) including at least one A, (2) including at least one B, or (3) including both at least one A and at least one B.

[0013] Terms such as "first," "second," or "first" or "second" may be used simply to distinguish one component from another and do not qualify the components in any other respect (e.g., importance or order).

[0014] When a component (e.g., a first component) is referred to as being “coupled” or “connected” to another component (e.g., a second component), with or without the terms “functionally” or “communicatively,” it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0015] The terms "include" or "have" are intended to specify the presence of a feature, number, step, operation, component, part or combination thereof described in this document, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.

[0016] When a component is said to be “connected,” “coupled,” “supported,” or “in contact with” another component, this includes not only cases where the components are directly connected, coupled, supported, or in contact, but also cases where the components are indirectly connected, coupled, supported, or in contact through a third component.

[0017] When we say that a component is "on" another component, this includes not only cases where the component is in contact with the other component, but also cases where there is another component between the two components.

[0018] The term "and / or" includes any combination of a plurality of related described elements or any one of a plurality of related described elements.

[0019] In some contexts, the phrase "a device configured to" may mean that the device, in conjunction with other devices or components, is "capable of" performing A, B, and C. For example, the phrase "a processor configured (or set) to perform A, B, and C" may refer to a dedicated processor (e.g., an embedded processor) for performing those operations, or a general-purpose processor (e.g., a CPU or application processor) that can perform those operations by executing one or more software programs stored in a memory device.

[0020] In the embodiments, a "module" or "part" performs at least one function or operation and may be implemented as hardware or software, or as a combination of hardware and software. Furthermore, a plurality of "modules" or "parts" may be integrated into at least one module and implemented as at least one processor (not shown), excluding any "module" or "part" that needs to be implemented as specific hardware.

[0021] In addition, unless otherwise specified, measurements of operations and physical properties, etc. are performed under conditions of room temperature (20℃ or higher and 25℃ or lower) / relative humidity of 40% RH or higher and 50% RH or lower.

[0022] According to at least one embodiment of the present disclosure, there is provided a tiling display device having at least a module having a substrate, a light-emitting element mounted on the substrate, and an electrode portion for applying voltage to the light-emitting element, wherein a seam between adjacent modules comprises a resin, and a difference (ΔRI) between a refractive index of the substrate and a refractive index of the resin in a visible light region is in a range of -0.01≤ΔRI≤0.01, and a bending modulus of elasticity of the seam is 35,500 MPa or less. A tiling display device having such a configuration has improved seamlessness in the seam, and at the same time, improved toughness (toughness) of the seam.

[0023] Below, the configuration of an LED display using an LED element as a light-emitting element (20) will be described. However, the tiling display device (100) is not limited to an LED display as a display format, and can also be applied to other types of display devices such as an OLED (Organic Light Emitting Diode) display and a liquid crystal display.

[0024] The configuration of a tiling display device (100) according to at least one embodiment of the present disclosure will be described with appropriate reference to FIG. 1. In the present disclosure, a tile may be an independent display module, and a tiling display device may be a display device that can be used as a single device by connecting a plurality of display modules. A tile may be referred to by various names such as a module, a display, a display module, a display device, etc., and a tiling display device may be referred to by various names such as a modular display device, an integrated display device, etc.

[0025] However, FIG. 1 relates to a tiling display device (100) according to one embodiment of the present invention, and the tiling display device (100) of the present embodiment is not limited to the configuration described by these drawings.

[0026] FIG. 1 illustrates a planar schematic diagram and a cross-sectional schematic diagram of a tiling display device (100) according to at least one embodiment of the present disclosure. In FIG. 1, (A) is a planar schematic diagram of the tiling display device (100), (B) is a cross-sectional schematic diagram taken along line AA of FIG. 1 (A), and (C) is a cross-sectional schematic diagram taken along line BB of FIG. 1.

[0027] According to FIG. 1, one tile, i.e., a module (110), includes a substrate (10), a light-emitting element (20), and an electrode portion (30).

[0028] As shown in (A) to (C) of Fig. 1, a tiling display device (100) includes a substrate (10), a light-emitting element (20) mounted on the substrate surface (surface) of the substrate (10), and at least a module (110) having an electrode portion (30) for applying a voltage required for driving the light-emitting element (20), and is arranged with a regularity such as a matrix shape. Between adjacent modules (110), a core portion (60) that serves as a gap between the substrates (10) is interposed (intervene). The core portion (60) may be described in various ways, such as a connecting portion, a bezel portion, a gap region, a gap, a joint portion, a boundary portion, etc.

[0029] In Fig. 1 (A), a form in which a total of four modules (110) are arranged in a 2x2 configuration is illustrated. In addition, the number of arrangements of modules (110) of a tiled display device (100) is not limited to that in Fig. 1 (A), and any arbitrary arrangement number may be used. In addition, the arrangement direction and arrangement form of the modules (110) may also be varied.

[0030] As shown in Fig. 1(A), the tiling display device (100) has a driving circuit (40) and a flexible substrate (50) connecting the driving circuit (40) and the electrode portion (30). The tiling display device (100) applies a predetermined driving voltage to the electrode portion (30) through the flexible substrate (50) by driving the driving circuit (40). In the tiling display device (100), when a predetermined voltage is applied from the electrode portion (30) to the light-emitting element (20), the light-emitting element (20) emits light and displays predetermined display content.

[0031] The substrate (10) is composed of a material on which a light-emitting element (20) can be mounted, such as alkali-free glass, polyimide, PET (Polyethylene Terephthalate), polyolefin, or silicon. As the alkali-free glass, for example, a glass substrate such as EAGLE XG (registered trademark, Corning Japan Co., Ltd.) can be suitably used. The substrate (10) is not limited to the above-described material, and when mounting the light-emitting element (20), an appropriate material can be arbitrarily selected in consideration of the flatness of the mounting surface of the light-emitting element (20) or the heat resistance when mounting the light-emitting element (20).

[0032] The light-emitting element (20) is composed of surface-mount LED elements of each color of RGB and is mounted on the substrate (10). The light-emitting element (20) constitutes three color elements in each pixel of the substrate (10) and emits light by a voltage applied from the electrode portion (30). For example, the light-emitting element (20) can be implemented as an LED having a size in micrometer units.

[0033] The electrode portion (30) includes various wires or TFTs (Thin Film Transistors) that connect the light-emitting element (20) and the flexible substrate (50). The electrode portion (30) is connected to the driving circuit (40) through the flexible substrate (50) and applies a predetermined driving voltage to the light-emitting element (20) based on the control of the driving circuit (40).

[0034] [seam]

[0035] In a tiling display device (100) according to at least one embodiment of the present disclosure, seamlessness of reflected light and transmitted light in the core (60) can be improved, while achieving seamlessness of the core (60). In addition, the toughness (toughness) of the core (60) can be improved, and damage due to sagging or deformation during handling can be prevented.

[0036] The core (60) between adjacent modules (110) is filled with a resin (61). The refractive index difference (ΔRI) in the visible light region between the substrate (10) and the resin (61) is in the range of -0.01≤ΔRI≤0.01. If the refractive index difference (ΔRI) is outside this range, the seamlessness of the core is reduced. From the viewpoint of improving the seamlessness of reflected light and transmitted light in the core (60) and making seamlessness of the core (60) easier to achieve, the refractive index difference (ΔRI) is more preferably in the range of -0.005≤ΔRI≤0.005. The refractive index difference (ΔRI) can be controlled by appropriately selecting the type of resin (e.g., the type or quantitative ratio of an epoxy compound included in the adhesive composition, etc.).

[0037] The refractive index difference (ΔRI) can be obtained by measuring the refractive indices nd, nf, and nc of the substrate and resin for the wavelengths of the sodium D line (589 nm), hydrogen F line (486.13 nm), and hydrogen C line (656.27 nm) using an Abbe refractometer DR-M2 (manufactured by ATAGO Co., Ltd.) based on a test method compliant with JIS K7142:2014. More specifically, the refractive index difference can be obtained by the method described in the Examples.

[0038] In a tiling display device (100) according to one embodiment of the present disclosure, the bending elastic modulus of the core is 35,500 MPa or less. If the bending elastic modulus exceeds 35,500 MPa, even a small deformation may cause breakage of the core (peeling at the interface between the substrate and the resin, or destruction of the resin, the substrate, etc.).

[0039] The bending modulus of the core is preferably 32,000 MPa or less, more preferably 22,000 MPa or less, and even more preferably 17,000 MPa or less. In addition, the lower limit of the bending modulus of the core is not particularly limited, but is preferably 500 MPa or more, more preferably 1,000 MPa or more, and even more preferably 4,000 MPa or more. For these reasons, the bending modulus of the core is preferably 500 MPa or more and 32,000 MPa or less, more preferably 1,000 MPa or more and 22,000 MPa or less, and even more preferably 4,000 MPa or more and 17,000 MPa or less.

[0040] The bending modulus of the core is, more specifically, a value measured by the method described in the examples. Furthermore, the bending modulus, similar to the refractive index difference (ΔRI), can be controlled by appropriately selecting the type of resin (e.g., the type or quantitative ratio of the epoxy compound included in the adhesive composition).

[0041] Suzy

[0042] In a tiling display device according to one embodiment of the present disclosure, the core portion includes a resin. The optical properties of the resin preferably have a haze of 10% or less under a D65 light source, more preferably 5% or less. Furthermore, the haze can be measured using the method described in JIS K7136 (2000).

[0043] Examples of resins include acrylic resins, silicone resins, urethane resins, polyester resins, and combinations thereof. Furthermore, examples of resins include cured products of adhesive compositions containing epoxy compounds. In particular, from the perspective of further enhancing the effects of the embodiments of the present disclosure, the resin may include cured products of adhesive compositions containing epoxy compounds. Below, an adhesive composition containing epoxy compounds will be described.

[0044] Adhesive Composition

[0045] An adhesive composition according to various embodiments of the present disclosure includes an epoxy compound. The term "epoxy compound" refers to a compound containing an epoxy group. Specific examples of the epoxy compound include aliphatic epoxy compounds, alicyclic epoxy compounds, and aromatic epoxy compounds. The epoxy compound may be used singly, or two or more epoxy compounds may be used in combination. Furthermore, the epoxy compound may be a synthetic product or a commercial product. Furthermore, a compound having a functional group that reacts with an epoxy group may be used. Examples of such functional groups include an oxetane group, an episulfide group, an alcoholic hydroxyl group, a phenolic hydroxyl group, a carboxyl group, an acid anhydride group, and an amino group.

[0046] Aliphatic epoxy compounds are chain epoxy compounds that do not contain aromatic groups or alicyclic groups. Specific examples of aliphatic epoxy compounds include polyglycidyl ethers of aliphatic polyhydric alcohols or their alkylene oxide adducts, polyglycidyl esters of aliphatic long-chain polybasic acids, homopolymers synthesized by vinyl polymerization of glycidyl acrylates or glycidyl methacrylates, and copolymers synthesized by vinyl polymerization of glycidyl acrylates or glycidyl methacrylates and other vinyl monomers.Representative compounds include, for example, 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, triglycidyl ether of glycerin, diglycidyl ether of trimethylolpropane, triglycidyl ether of trimethylolpropane, tetraglycidyl ether of sorbitol, hexaglycidyl ether of dipentaerythritol, diglycidyl ether of polyethylene glycol, Examples thereof include glycidyl ethers of polyhydric alcohols such as the diglycidyl ether of polypropyleneglycol, polyglycidyl ethers of polyether polyols obtained by adding one or more alkylene oxides to aliphatic polyhydric alcohols such as propyleneglycol, trimethylolpropane, and glycerin, and diglycidyl esters of aliphatic long-chain dibasic acids.In addition, examples thereof include monoglycidyl ethers of higher aliphatic alcohols, monoglycidyl ethers of polyether alcohols obtained by adding alkylene oxide to phenol, cresol, butylphenol, or these, glycidyl esters of higher fatty acids, epoxidized soybean oil, epoxystearic acid octyl, epoxystearic acid butyl, and epoxide polybutadiene.

[0047] The above aliphatic epoxy compound can be used as a commercial product. Examples of commercial products include, for example, DENACOL (registered trademark, hereinafter the same) EX-121, DENACOL EX-171, DENACOL EX-192, DENACOL EX-211, DENACOL EX-212, DENACOL EX-214L, DENACOL EX-313, DENACOL EX-314, DENACOL EX-321, DENACOL EX-411, DENACOL EX-421, DENACOL EX-512, DENACOL EX-521, DENACOL EX-611, DENACOL EX-612, DENACOL EX-614, DENACOL EX-622, DENACOL EX-810, DENACOL EX-811, DENACOL EX-850, DENACOL EX-851, DENACOL EX-821, DENACOL EX-830, DENACOL EX-832, DENACOL EX-841, DENACOL EX-861, DENACOL EX-911, DENACOL EX-941, DENACOL EX-920, DENACOL EX-931, DENACOL EX-931L (all products of Nagase ChemteX Co., Ltd.), Epolite M-1230, Epolite 40E, Epolite 100E, Epolite 200E, Epolite 400E, Epolite 70P, Epolite 200P, Epolite 400P, Epolite 1500NP, Epolite 1600, Epolite 80MF, Epolite 100MP (all products of KYOEISHA CHEMICAL Co., Ltd.), ADEKA GLYCIROL Examples include ED-503, ADEKA GLYCIROL ED-503G, ADEKA GLYCIROL ED-506, ADEKA GLYCIROL ED-523T, ADEKA RESINE EP-4088S, ADEKA RESINE EP-4080E (all products of ADEKA Co., Ltd.).

[0048] Alicyclic epoxy compounds are epoxy compounds having an alicyclic group. Specifically, examples thereof include polyglycidyl ethers of polyhydric alcohols having at least one alicyclic group, compounds containing cyclohexene oxide or cyclopentene oxide obtained by epoxidizing cyclohexene or cyclopentene ring-containing compounds with an oxidizing agent, and compounds in which an epoxy group is directly bonded to an alicyclic group by a single bond. More specifically, for example, hydrogenated bisphenol A diglycidyl ether, 3, 4-epoxycyclohexyl methyl-3, 4-epoxycyclohexanecarboxylate, 3-4-epoxy-1-methylcyclohexane-3, 4-epoxy-1-methyl hexanecarboxylate, 6-Methyl-3, 4-epoxycyclohexylmethyl-6-Methyl-3, 4-epoxycyclohexanecarboxylate, 3, 4-Epoxy-3-Methylcyclohexyl Methyl-3, 4-Epoxy-3-Methyl cyclohexanecarboxylate, 3, 4-Epoxy-5-Methylcyclohexyl Methyl-3, 4-Epoxy-5-Methyl cyclohexanecarboxylate, 2-(3, 4-Epoxycyclohexyl-5, 5-spiro-3,2-(3, 4-Epoxycyclohexyl-5, 5-spiro-3, 4-Epoxy) cyclohexane-metadioxane, Bis(3, 4-Epoxycyclohexyl methyl) adipate, 3, 4-Epoxy-6-Methyl cyclohexylcarboxylate, Methylenebis(3, 4-epoxycyclohexane), Dicyclopentadiene Diepoxide, Ethylenebis(3, 4-epoxycyclohexanecarboxylate 4-epoxycyclohexanecarboxylate), Epoxyhexahydrophthalic acid Dioctyl, Epoxyhexahydrophthalic acid Di-2-ethylhexyl, 1-Epoxyethyl-3, 4-epoxycyclohexane, 1-2-Epoxy-2-Epoxy ethylcyclohexane, 3, 4-Epoxycyclohexyl methyl Acrylate, 3, 4-Epoxycyclohexyl methyl methacrylate, 2, 2-Bis(hydroxymethyl)-1-butanol-1, Examples include 2-epoxy-4-(2-oxiranyl)cyclohexane (2, 2-Bis(Hydroxymethyl)-1-butanol-1, 2- Epoxy-4-(2-oxiranyl) cyclohexane) adducts, etc.

[0049] Alicyclic epoxy compounds are available as commercial products. Examples of commercially available products include, for example, UVR-6100, UVR-6105, UVR-6110, UVR-6128, UVR-6200 (all products of Union Carbide Corporation), CELLOXIDE (registered trademark, hereinafter the same) 2021, CELLOXIDE 2021P, CELLOXIDE 2081, CELLOXIDE 2083, CELLOXIDE 2085, CELLOXIDE 2000, CELLOXIDE 3000, CYCLOMER (registered trademark, hereinafter the same) A200, CYCLOMER M100, CYCLOMER M101, EPOLEAD (registered trademark, hereinafter the same) GT-301, EPOLEAD GT-302, EPOLEAD 401, EPOLEAD 403, ETHB, EPOLEAD HD300, EHPE 3150, EHPE Examples include 3150CE (all products of DAICEL Co., Ltd.), ADEKA ARKLS KRM-2110, and ADEKA ARKLS KRM-2199 (all products of ADEKA Co., Ltd.).

[0050] An aromatic epoxy compound is an epoxy compound containing an aromatic group. Examples of the aromatic epoxy compound include mono / polyglycidyl ether compounds of phenols having at least one aromatic ring, such as phenol, cresol, and butylphenol, or alkylene oxide adducts thereof, for example, glycidyl ether compounds of bisphenol A, bisphenol F, or compounds to which an alkylene oxide is further added, or novolac epoxy resins; mono / polyglycidyl ether compounds of aromatic compounds having two or more phenolic hydroxyl groups, such as resorcinol, hydroquinone, and catechol; Examples thereof include glycidyl ether compounds of aromatic compounds having two or more alcoholic hydroxyl groups, such as phenyl dimethanol, phenyl diethanol, or phenyl dibutanol; glycidyl esters of polybasic acid aromatic compounds having two or more carboxylic acids, such as phthalic acid, terephthalic acid, or trimellitic acid; glycidyl esters of benzoic acid; and epoxides of styrene oxide or divinylbenzene.

[0051] Aromatic epoxy compounds can be commercially available. Examples of commercially available products include, for example, DENACOL EX-141, DENACOL EX-146, DENACOL EX-147, DENACOL EX-201, DENACOL EX-203, DENACOL EX-711, DENACOL EX-721, On-Coat (registered trademark, hereinafter the same) EX-1020, On-Coat EX-1030, On-Coat EX-1040, On-Coat EX-1050, On-Coat EX-1051, On-Coat EX-1010, On-Coat EX-1011, On-Coat 1012 (all products of Nagase ChemteX Co., Ltd.); OGSOL (registered trademark, hereinafter the same) PG-100, OGSOL EG-200, OGSOL EG-210, OGSOL EG-250 (above, products of OSAKA GAS CHEMICALS Co., Ltd.); HP4032, HP4032D, HP4700 (above, products of DIC Co., Ltd.); ESN-475V (product of NIPPON STEEL Chemical & Material Co., Ltd.); jER (registered trademark) YX8800 (product of MITSUBISHI CHEMICAL Co., Ltd.); MARPROOF (registered trademark) G-0105SA, MARPROOF G-0130SP (above, products of NOF CORPORATION); EPICLON (registered trademark, hereinafter the same) N-665, EPICLON HP- -7200 (above, products of DIC Co., Ltd.); Examples thereof include EOCN-1020, EOCN-102S, EOCN-103S, EOCN-104S, XD-1000, NC-3000, EPPN-501H, EPPN-501HY, EPPN-502H, NC-7000L (all products of NIPPON KAYAKU Co., Ltd.); ADEKA RESINE (registered trademark, hereinafter the same) EP-4000, ADEKA RESINE EP-4005, ADEKA RESINE EP-4100, ADEKA RESINE EP-4901 (all products of ADEKA Co., Ltd.); etc.

[0052] The epoxy equivalent of the epoxy compound is preferably 80 g / eq. or more, more preferably 95 g / eq. or more, and even more preferably 110 g / eq. or more. When the epoxy compound equivalent is 80 g / eq. or more, the reactivity of the cured product is excellent, and the strength of the cured product obtained by curing the adhesive composition is excellent. In addition, the epoxy equivalent of the epoxy compound is preferably 5,000 g / eq. or less, more preferably 3,000 g / eq. or less, and even more preferably 2,000 g / eq. or less. When the epoxy equivalent of the epoxy compound is 5,000 g / eq. or less, the molecular weight between crosslinking points is large, and therefore the flexibility of the cured product obtained by curing the adhesive composition is excellent. From these viewpoints, the epoxy equivalent of the epoxy compound is preferably, for example, 80 g / eq. or more and 5,000 g / eq. or less, and even more preferably 95 g / eq. It is more preferable that it be 3,000 g / eq or less, and it is even more preferable that it be 110 g / eq or more and 2,000 g / eq or less. In addition, the epoxy equivalent can be measured according to JIS K7236:2001.

[0053] From the viewpoint of further enhancing the effects of the various embodiments of the present disclosure, it is preferable that the epoxy compound include an epoxy compound having an epoxy equivalent of 250 g / eq. or more. By using such an epoxy compound, it is possible to introduce a highly flexible structure, and since the molecular weight between crosslinking points after curing increases, a resin having improved toughness is obtained. In the epoxy compound having an epoxy equivalent of 250 g / eq. or more, the upper limit of the epoxy equivalent is not particularly limited, but is preferably 5,000 g / eq. or less, more preferably 3,000 g / eq. or less, and even more preferably 2,000 g / eq. or less.

[0054] In addition, the content of the epoxy compound having an epoxy equivalent of 250 g / eq. or more in the adhesive composition is preferably 10 mass% or more, more preferably 15 mass% or more, and even more preferably 20 mass% or more, based on the total mass of the adhesive composition. In addition, the content of the epoxy compound having an epoxy equivalent of 250 g / eq. or more in the adhesive composition is preferably 70 mass% or less, more preferably 65 mass% or less, and even more preferably 60 mass% or less, based on the total mass of the adhesive composition. From these viewpoints, the content of the epoxy compound having an epoxy equivalent of 250 g / eq. or more in the adhesive composition is, for example, preferably 10 mass% or more and 70 mass% or less, more preferably 15 mass% or more and 65 mass% or less, and even more preferably 20 mass% or more and 60 mass% or less.

[0055] In addition, epoxy compounds having an epoxy equivalent of 250 g / eq. or more may be used singly or in combination of two or more. When two or more epoxy compounds having an epoxy equivalent of 250 g / eq. or more are used, the above content represents their total amount.

[0056] From the viewpoint of further enhancing the effectiveness of various embodiments of the present disclosure, the epoxy compound having an epoxy equivalent of 250 g / eq. or more is preferably an aliphatic chain epoxy compound that does not contain an aromatic group or an alicyclic group. From the same viewpoint, the epoxy compound having an epoxy equivalent of 250 g / eq. or more is more preferably an aliphatic chain ether structure. The epoxy compound having an epoxy equivalent of 250 g / eq. or more is more preferably polypropylene glycol diglycidyl ether.

[0057] The adhesive composition can be cured by ring-opening polymerization of the epoxy group. The energy for polymerization is not particularly limited, but may include heat and active energy rays. That is, the adhesive composition may be thermosetting or active energy ray-curable. When the adhesive composition is cured by heat, the adhesive composition may contain a curing agent, a thermal acid generator, or a thermal base generator. When the adhesive composition is cured by active energy rays, the adhesive composition may contain a photopolymerization initiator, a photoacid generator, or a photobase generator.

[0058] The adhesive composition may be an active energy ray-curable adhesive composition in which an epoxy compound is polymerized and cured by irradiation with active energy rays such as ultraviolet rays, visible light, X-rays, or electron rays. The adhesive composition may also be an ultraviolet-curable adhesive composition in which the epoxy compound is cured by irradiation with ultraviolet rays. When the adhesive composition is ultraviolet-curable, the cumulative amount of ultraviolet light at the time of curing is, for example, 100 mJ / cm. 2 It is also okay if it is more than 1000 mJ / cm 2 It is also okay if it is more than 10000 mJ / cm 2 It may be less than 8000 mJ / cm 2 The ultraviolet rays irradiated to the adhesive composition may be UVA (wavelength 320 nm to 400 nm), UVB (wavelength 280 nm to 320 nm), or UVC (wavelength 200 nm to 280 nm).

[0059] The adhesive composition preferably includes a photoacid generator. This allows the epoxy compound contained in the adhesive composition to be cured by cationic polymerization, forming a cured product of the adhesive composition suitable as a resin. The photoacid generator generates cationic species or Lewis acids upon irradiation with active energy rays, thereby initiating the polymerization reaction of the epoxy compound. Since the photoacid generator acts catalytically with light, it exhibits excellent storage safety and workability even when mixed with the epoxy compound. Examples of the photoacid generator include aromatic diazonium salts; onium salts such as aromatic iodonium salts and aromatic sulfonium salts; and iron-arene coordination compounds.

[0060] As aromatic diazonium salts, for example,

[0061] Benzenediazonium Hexafluoroantimonate,

[0062] Benzenediazonium Hexafluorophosphate,

[0063] Benzenediazonium hexafluoroborate,

[0064] You can hear the back.

[0065] As aromatic iodonium salts, for example,

[0066] Diphenyliodonium Tetrakis(pentafluorophenyl)borate,

[0067] Diphenyliodonium Hexafluorophosphate,

[0068] Diphenyliodonium Hexafluoroantimonate,

[0069] Di(4-nonylphenyl) iodonium hexafluorophosphate,

[0070] You can hear the back.

[0071] As aromatic sulfonium salts, for example,

[0072] Triphenylsulfonium Hexafluorophosphate,

[0073] Triphenylsulfonium Hexafluoroantimonate,

[0074] Triphenylsulfonium Tetrakis(pentafluorophenyl)borate,

[0075] Diphenyl(4-(Phenylthio)-phenyl)sulfonium hexafluorophosphate,

[0076] 4, 4'-Bis(Diphenylsulfonio) Diphenyl Sulfide Bis Hexafluorophosphate

[0077] 4, 4'-Bis〔Di(β-hydroxyethoxy) phenylsulfonio〕diphenyl sulfide bishexafluoroantimonate

[0078] 4, 4'-Bis〔Di(β-hydroxyethoxy) phenylsulfonio〕diphenyl sulfide bis hexafluorophosphate

[0079] 7-〔Di(p-Toluic) sulfonio〕-2-Isopropylthioxanthone Hexafluoroantimonate,

[0080] 7-〔Di(p-Toluic) sulfonio〕-2-Isopropylthioxanthone Tetrakis(pentafluorophenyl)borate

[0081] 4-Phenylcarbonyl-4'-diphenylsulfonio-diphenyl sulfide hexafluorophosphate,

[0082] 4-(p-tert-Butylphenylcarbonyl)-4'-diphenylsulfonio-diphenyl sulfide hexafluoroantimonate,

[0083] 4-(p-tert-Butylphenylcarbonyl)-4'-Di(p-Toluic) sulfonio-Diphenyl Sulfide Tetrakis(pentafluorophenyl)borate

[0084] You can hear the back.

[0085] As iron-arene complexes, for example,

[0086] Xylene-Cyclopentadienyliron(II) Hexafluoroantimonate,

[0087] Cumene-Cyclopentadienyliron(II) Hexafluorophosphate,

[0088] Xylene-Cyclopentadienyliron(II) Tris(trifluoromethanesulfonyl) methanide.

[0089] You can hear the back.

[0090] The photoacid generators can be used singly or in combination of two or more. Among the above, aromatic sulfonium salts are particularly preferred due to their excellent curability and UV absorption properties even in the wavelength range around 300 nm.

[0091] Aromatic sulfonium salts may be either synthetic or commercially available. Examples of commercially available aromatic sulfonium salts include, for example, WPAG-336, WPAG-367, WPAG-370, WPAG-469, WPAG-638 (all products of FUJIFILM Wako Pure Chemical Corporation), CPI (registered trademark, hereinafter the same)-100P, CPI-101A, CPI-200K, CPI-201S (all products of San-Apro Ltd.), ADEKA ARKLS (registered trademark, hereinafter the same) SP-056, ADEKA ARKLS SP-066, ADEKA ARKLS SP-130, ADEKA ARKLS SP-140, ADEKA ARKLS SP-082, ADEKA ARKLS SP-103, ADEKA ARKLS SP-601, ADEKA ARKLS SP-606, ADEKA ARKLS SP-701, ADEKA ARKLS Examples include SP-150, ADEKA ARKLS SP-170 (all products of ADEKA Co., Ltd.).

[0092] The content (solid content) of the photoacid generator in the adhesive composition is preferably 0.25 parts by mass or more, more preferably 0.5 parts by mass or more, and even more preferably 0.75 parts by mass or more, relative to 100 parts by mass of the epoxy compound. The content (solid content) of the photoacid generator in the adhesive composition is preferably 5.0 parts by mass or less, more preferably 4.0 parts by mass or less, and even more preferably 3.0 parts by mass or less, relative to 100 parts by mass of the epoxy compound. That is, the content (solid content) of the photoacid generator in the adhesive composition is preferably 0.25 parts by mass or more and 5.0 parts by mass or less, more preferably 0.5 parts by mass or more and 4.0 parts by mass or less, and even more preferably 0.75 parts by mass or more and 3.0 parts by mass or less, relative to 100 parts by mass of the epoxy compound. When two or more types of photoacid generators are included in the adhesive composition, the content of the photoacid generators represents the total amount thereof.

[0093] The above adhesive composition may contain other components in addition to the epoxy compound and photoacid generator. Examples of the other components include a photosensitizer, a photosensitizing assistant, a polymerization accelerator, an ion trapping agent, an antioxidant, a light stabilizer, a chain transfer agent, a tackifier, a thermoplastic resin, a filler, a flow regulator, a plasticizer, an antifoaming agent, an antistatic agent, a leveling agent, a pigment, an organic solvent, and the like.

[0094] The method for manufacturing the adhesive composition is not particularly limited, and can be obtained by stirring and mixing each component. The temperature and time during mixing are not particularly restricted. There are also no specific restrictions on the order of mixing, and methods such as mixing each component all at once or mixing each component sequentially are employed.

[0095] Since the resin improves the seamlessness of reflected and transmitted light in the deep portion (60) and promotes seamlessness of the deep portion (60), when tiling an unprocessed substrate such as a wiring, it is preferable to set the resin to have optical characteristics in the range of [(haze of deep portion) - (haze of non-deep portion)] ≤ 1.0. This [(haze of deep portion) - (haze of non-deep portion)] (ΔH) can be measured by the method described in the examples.

[0096] In one embodiment of the present disclosure, a colorable transparent resin colored in a predetermined color may be used as the resin (61) to be filled in the core (60). The colorable transparent resin may be one that is close to the color of the electrode portion (30) from the standpoint of visibility. For example, a pigment or dye may be mixed to provide a color of a color system such as black, brown, or yellow, in accordance with the color of the electrode portion (30).

[0097] When using the cured product of the adhesive composition as a resin, the method of connecting the core is not particularly limited, but for example, the core can be obtained by bringing the cut portions of the cut glass substrates into contact with each other, dropping the adhesive composition on the contacted cut portions (connection portions), and then curing the adhesive composition.

[0098] In a tiling display device (100), a molding layer (70) having a thickness less than half that of the substrate (10) can be formed to cover the light emitting element (20). The molding layer (70) can be composed of a resin such as silicone resin or epoxy resin, and silicone resin can be used from the viewpoint of heat resistance.

[0099] The method for forming a layered member for forming at least a portion of the molding layer (70) is not particularly limited, and may be formed by a known method including, for example, a solution casting method, a melt casting method, a coating method, a sputtering method, a deposition method, an ion plating method, a chemical vapor deposition (CVD) method, etc.

[0100] Although not shown in Fig. 1, the tiling display device may have a protective layer on one or both sides of the substrate from the viewpoint of improving strength such as impact resistance. The protective layer may be formed of glass or an organic resin film. For example, a resin film usable as an optical film can be used as the organic resin film, and examples of the material thereof include polyester (PET) such as polyethylene terephthalate (PET), triacetyl cellulose (TAC), polymethyl methacrylate (PMMA), polycarbonate (PC), and the like. In order to adhere the protective layer to the substrate (10), an adhesive layer may be provided, and the adhesive layer may include a resin selected from the group consisting of acrylic resin, urethane resin, epoxy resin, silicone resin, and combinations thereof.

[0101] Although not shown in Fig. 1, the tiling display device can form a low-reflection portion on at least one of the surface and the surface of the deep portion of the protective layer. The low-reflection portion can have at least one of a structure made of a film formed of a low-reflection material (e.g., a black matrix resin containing a black material), and a structure that has undergone a predetermined surface treatment to provide low reflection (e.g., an AR (Anti Reflection) treatment, an LR (Low Reflection) treatment, an AG (Anti Glare) treatment, or a combination of these treatments).

[0102] The tiling display device of the present disclosure having the above configuration can suppress deterioration of seamlessness due to reflection of external light in the core and refraction / scattering of transmitted light. In addition, since the core (60) can be made seamless, in addition to seamlessness from the front, improvement in seamlessness from an oblique direction can also be expected. Therefore, the tiling display device of the present disclosure can have an appearance similar to a single sheet of glass module, and can be widely and appropriately used in transmissive devices ranging from small displays to large displays. In addition, the tiling display device of the present disclosure has improved toughness in the core, and is less likely to be damaged even when subjected to sagging or deformation during handling.

[0103] While the embodiments of the present disclosure have been described in detail, it is to be understood that they are illustrative and exemplary and not restrictive, and that the scope of the present disclosure should be construed in accordance with the appended claims.

[0104] A tiling display device according to at least one embodiment of the present disclosure may include the following formats and shapes.

[0105] 1. A tiling type display device having at least a module having a substrate, a light-emitting element mounted on the substrate, and an electrode portion for applying voltage to the light-emitting element, wherein a core portion between adjacent modules includes a resin, and a difference (ΔRI) between the refractive index of the substrate and the refractive index of the resin in the visible light region is in the range of -0.01≤ΔRI≤0.01, and a bending modulus of the core portion is 35,500 MPa or less.

[0106] 2. The above-mentioned resin is a tiling display device as described in 1., which comprises a cured product of an adhesive composition containing an epoxy compound:

[0107] 3. The tiling display device described in 2 above, wherein the epoxy compound comprises an epoxy compound having an epoxy equivalent of 250 g / eq. or more:

[0108] 4. The tiling display device described in 3 above, wherein the total mass of the adhesive composition includes an epoxy compound having an epoxy equivalent of 250 g / eq. or more, in an amount of 10 mass% or more:

[0109] 5. The epoxy compound having an epoxy equivalent of 250 g / eq. or more is an aliphatic chain epoxy compound that does not contain an aromatic group and an alicyclic group, the tiling type display device described in 3. or 4.:

[0110] 6. The epoxy compound having an epoxy equivalent of 250 g / eq. or more, which has an aliphatic chain ether structure, is a tiling display device according to any one of 3 to 5 above:

[0111] 7. The epoxy compound having an epoxy equivalent of 250 g / eq. or more is a tiling display device according to any one of 3. to 6. above, which is polypropylene glycol diglycidyl ether:

[0112] 8. A tiling display device according to any one of 1 to 7, wherein the difference (ΔRI) between the refractive index of the substrate and the refractive index of the resin in the visible light range is -0.005≤ΔRI≤0.005:

[0113] 9. A tiling display device described in any one of 1. to 8 above, which is a transparent device:

[0114] [Example]

[0115] The effects of various embodiments of the present disclosure will be described in more detail. However, the technical scope of the present invention is not limited to the following embodiments.

[0116] (Preparation of adhesive composition 1)

[0117] 20 g of DENACOL (registered trademark) EX-141 (PHENYL GLYCIDYL ETHER, manufactured by Nagase ChemteX Co., Ltd., epoxy equivalent: 151 g / eq.), 42 g of DENACOL (registered trademark) EX-931 (manufactured by Nagase ChemteX Co., Ltd., epoxy equivalent: 471 g / eq.), and 38 g of EHPE3150CE (manufactured by DAICEL Co., Ltd., epoxy equivalent: 177 g / eq.) were mixed to prepare a uniform solution, and then 2.5 g of CPI-100P (manufactured by San-Apro Ltd.), a photoacid generator, was mixed to prepare an adhesive 1 in a solution state.

[0118] (Preparation of adhesive compositions 2 to 8)

[0119] Adhesive compositions 2 to 8 were prepared in the same manner as above (Preparation of Adhesive 1), except that the compositions were changed to those shown in Table 1 below. In addition, each component shown in Table 1 below is as follows, and '-' in Table 1 below indicates that the component is not included:

[0120] EX-141: DENACOL EX-141 (PHENYL GLYCIDYL ETHER, manufactured by Nagase ChemteX Co., Ltd., epoxy equivalent: 151 g / eq.)

[0121] EX-214L: DENACOL EX-214L (1, 4-Butanediol Diglycidyl Ether, manufactured by Nagase ChemteX Co., Ltd., epoxy equivalent: 115 g / eq.)

[0122] EX-321: DENACOL EX-321 (Trimethylolpropane polyglycidyl ether, manufactured by Nagase ChemteX Co., Ltd., epoxy equivalent: 140 g / eq.)

[0123] EX-931: DENACOL EX-931 (Poly propylene glycol diglycidyl ether, manufactured by Nagase ChemteX Co., Ltd., epoxy equivalent: 471 g / eq.)

[0124] EHPE3150CE: EHPE3150CE (1, 2-Epoxy-4-(2-oxiranyl) cyclohexane adduct of 2, 2-Bis(Hydroxymethyl)-1-butanol, manufactured by DAICEL Co., Ltd., epoxy equivalent: 177 g / eq.)

[0125] CE2021P: CELLOXIDE 2021P (3, 4-Epoxycyclohexyl methyl-3', 4'- epoxycyclohexanecarboxylate, manufactured by DAICEL Co., Ltd., epoxy equivalent: 133 g / eq.)

[0126] CPI-100P: 50% solution of Diphenyl-4-(Phenylthio)-Phenyl sulfonium Hexafluorophosphate in propylene carbonate (product of San-Apro Ltd.).

[0127] [Table 1]

[0128]

[0129] [Production of evaluation samples]

[0130] Using the adhesive compositions 1 to 8 obtained above, two types of samples (evaluation composition A, evaluation composition B) for use in various evaluations were produced through the following processes 1 to 7 or 1 to 8:

[0131] Process 1: As a glass substrate, EAGLE XG (registered trademark, Corning Japan Co., Ltd.) measuring 150 mm × 70 mm × 0.5 mm thick was prepared by cutting it from the center.

[0132] Process 2: On a silicone non-adhesive sheet (product of NEION Film Coatings Corp.), the glass prepared in Process 1 was attached with the cut portions facing each other so that the gap between the cut portions was 100 μm.

[0133] Process 3: The adhesive composition obtained in the examples and comparative examples was dropped onto the butt joint (hereinafter also referred to as the core) and allowed to penetrate into the core.

[0134] Process 4: After confirming that the adhesive composition has penetrated deep into the glass, the adhesive composition is poured in a linear shape on the short side of the glass, a silicone non-adhesive sheet is attached using a hand roller by wedging the adhesive composition, and a uniform adhesive layer is applied on the glass plate.

[0135] Process 5: From the coating surface of the adhesive composition, the adhesive composition was cured by irradiating it with ultraviolet rays using a black light (black light blue fluorescent lamp, manufactured by SANKYO DENKI Co., Ltd.). The accumulated light intensity at this time was 6000 mJ / cm2 (the illuminance meter used was the main body UVPF-A1 and the light-receiving unit PD-365 (both manufactured by IWASAKI ELECTRIC CO., LTD.)).

[0136] Process 6: The sample coated with the adhesive composition was turned over, the silicone non-adhesive sheet was peeled off, the adhesive solution was poured in a linear shape on the short side of the glass, and the silicone non-adhesive sheet (product of NEION Film Coatings Corp.) was attached using a hand roller by wedging the adhesive, and a uniform resin layer was coated on the glass plate.

[0137] Process 7: Under the same conditions as Process 5, the adhesive was cured by irradiating it with ultraviolet rays using a black light from the coated surface. After curing, any portion protruding from the glass was removed with a knife. The cured product (resin) of the resulting adhesive was stored at room temperature (25°C) for at least one day and then subjected to evaluation. This configuration is referred to as Evaluation Configuration A.

[0138] Process 8: A 100 μm thick polyethylene terephthalate (PET) film (TOYOBO CO., LTD. product) with a 100 μm thick adhesive layer (NEION Film Coatings Corp. product) attached in advance was attached to the adhesive-coated surface from which the silicone non-adhesive sheet on the adhesive-coated surface of Process 7 was peeled off. This configuration is referred to as evaluation configuration B.

[0139] [Evaluation: Measurement of bending modulus]

[0140] A jig for a three-point bending test was set up on a Texture Analyzer (product of Stable Micro System). The distance between the points was 40 mm. The sample of evaluation configuration A, in which the silicone non-adhesive sheet was peeled off on both sides, was measured for thickness with a film thickness meter, and then installed on the point so that the core was centered. A load was applied at a pushing speed of 5 mm / min, the position where the load started to be applied was set to 0, the position where the sample broke was set to the amount of change in deflection Δs, and the load at the time of breakage was set to the amount of change in bending load ΔF. The bending elastic modulus E (unit: MPa) of the core was calculated using the following equation.

[0141] [Mathematical Formula 1]

[0142]

[0143] [Evaluation: Breakage Resistance Test]

[0144] One short side of the sample of evaluation configuration B, from which the silicone non-adhesive sheet was peeled off, was placed on the experimental table with the PET adhesive side facing upward, and the other short side was placed on the end of a 0.5 mm thick glass placed on the experimental table, so that the sample of evaluation configuration B had a 0.5 mm step on the long side. The sample of evaluation configuration B was pressed with a hand roller from the end placed on the experimental table, and the condition of the core part being broken after pressing was observed. If breakage did not occur, the step was increased by 0.5 mm at a time, and the step was increased until breakage of the core part or breakage of the glass part occurred. The maximum height at which breakage did not occur was taken as the characteristic value of the breakage resistance test.

[0145] [Evaluation: Measurement of optical properties]

[0146] Using a haze meter NDH5000W (product of NIPPON DENSHOKU INDUSTRIES Co., Ltd.), the haze of the core and non-core parts of a sample of evaluation configuration A with the silicone non-adhesive sheet peeled off on both sides was measured, and the difference (haze of the core part - haze of the non-haze part, ΔH) was obtained.

[0147] [Evaluation: Sensory Test of Visibility]

[0148] A sample of Evaluation Configuration A, with the silicone non-adhesive sheet peeled off on both sides, was fixed to a window, and the sensory evaluation was conducted by observing the core from various angles at a distance of 1 m. The sensory evaluation results indicate that the core is practically invisible or vaguely visible.

[0149] [Evaluation: Refractive Index Measurement]

[0150] Two fluororesin plates measuring 20 mm × 30 mm × 1 mm in thickness were prepared, a hole measuring 5 mm × 20 mm was made in the center of one of them, the two sheets were overlapped, and the ends were fixed with clips. Next, the adhesive compositions obtained in the above Examples and Comparative Examples were filled into the holed portion, and under the same conditions as in Step 5, ultraviolet rays were irradiated using a black light to produce a cured product (resin) of the adhesive composition. After storing the cured product (resin) at room temperature (25°C) for more than one day, the refractive index (nf) at a wavelength of 486.13 nm, the refractive index (nd) at a wavelength of 589 nm, and the refractive index (nc) at a wavelength of 656.27 nm were measured at 25°C using an Abbe refractometer (DR-M2: manufactured by ATAGO Co., Ltd.). For the measured refractive index, the difference in refractive index of each wavelength of EAGLE XG (registered trademark, Corning Japan Co., Ltd.) used as a glass substrate (refractive index of resin - refractive index of glass, Δnf, Δnd, Δnc) was calculated, and an evaluation value of the refractive index difference (ΔRI) was further calculated from the obtained refractive index difference.

[0151] The results of the above evaluation are shown in Table 2 below.

[0152] [Table 2]

[0153]

[0154] [result]

[0155] As is clear from Table 2 above, Examples 1 to 6 using adhesives 1 to 6 all have a bending elastic modulus of 35,500 MPa or less in the core, and in a breakage resistance test, no cracking of the resin occurs even at a step difference of 2 mm, showing good properties of being resistant to deformation. In addition, the refractive index difference ΔRI between the resin (cured product of adhesives 1 to 6) and the substrate in the visible light region is in the range of -0.01≤ΔRI≤0.01, and the haze difference (ΔH) between the core and non-core is 1 or less, and in a sensory test of visibility, the core is barely visible or is blurry, indicating that seamlessness of the core is achieved.

[0156] Meanwhile, Comparative Examples 1 and 2 using adhesives 7 and 8 have a bending elastic modulus of the core exceeding 35,500 MPa, and in a breakage resistance test, cracking occurred in the core even at a step of 0.5 mm, showing that the core is remarkably weak against deformation. In addition, Comparative Example 2 has a refractive index difference ΔRI between the resin (cured product of adhesive 8) and the substrate in the visible light range of 0.0170, and in a sensory test of visibility, the core is clearly visible, indicating that seamlessness is not achieved.

[0157] Each of the embodiments described above may be implemented as a standalone embodiment, but may also be implemented in whole or in part in combination with at least one other embodiment.

[0158] Although various embodiments of the present disclosure have been illustrated and described above, the present disclosure is not limited to the specific embodiments described above, and various modifications may be made by a person having ordinary skill in the art to which the present disclosure pertains without departing from the gist of the present disclosure as claimed in the claims, and such modifications should not be individually understood from the technical idea or prospect of the present disclosure.

Claims

1. In a tiling type display device, substrate; A light emitting element disposed on the substrate; and A module including at least one electrode part for applying voltage to the light-emitting element; The seam between the adjacent modules comprises a resin, The difference (ΔRI) between the refractive index of the substrate and the refractive index of the resin in the visible light range is in the range of -0.01≤ΔRI≤ 0.01, A tiling display device having a bending elastic modulus of the above-mentioned core of 35,500 MPa or less.

2. In paragraph 1, The above resin is, A tiling display device comprising a cured product of an adhesive composition containing an epoxy compound.

3. In paragraph 2, The above epoxy compound, A tiling display device comprising an epoxy compound having an epoxy equivalent of 250 g / eq. or more.

4. In paragraph 3, A tiling display device, wherein the content of the epoxy compound having an epoxy equivalent of 250 g / eq. or more is 10 mass% or more with respect to the total mass of the adhesive composition.

5. In paragraph 3, A tiling type display device, wherein the epoxy compound having an epoxy equivalent of 250 g / eq. or more is an aliphatic chain epoxy compound that does not contain an aromatic group and an alicyclic group.

6. In paragraph 3, A tiling display device, wherein the epoxy compound having an epoxy equivalent of 250 g / eq. or more has an aliphatic chain ether structure.

7. In paragraph 3, A tiling display device, wherein the epoxy compound having an epoxy equivalent of 250 g / eq. or more is polypropylene glycol diglycidyl ether.

8. In paragraph 1, A tiling display device, wherein the difference (ΔRI) between the refractive index of the substrate and the refractive index of the resin in the visible light range is -0.005≤ΔRI≤ 0.

005.

9. In paragraph 1, The above-mentioned tiling display device is a transmissive device, a tiling display device.

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