Electronic device comprising speaker

Abstract

The present disclosure relates to an electronic device. The electronic device according to an embodiment of the present disclosure may comprise: a first housing; a second housing; a hinge structure configured such that the first housing and the second housing are connected, and such that the first housing and the second housing are rotated; a flexible display disposed on the first housing and the second housing; a speaker disposed on the first housing; a first sound output path configured to be opened if the first housing and the second housing reach an unfolded state, the first sound output path comprising a first speaker hole configured to be covered at least partially if the first housing and the second housing reach a folded state; and a second sound output path configured to be opened if the first housing and the second housing reach a folded state, the second sound output path comprising a second speaker hole configured to be covered at least partially if the first housing and the second housing reach the unfolded state. The second speaker hole may be disposed in the first housing.

Description

Electronic devices containing speakers

[0001] The present disclosure relates to an electronic device including a speaker, for example, a foldable electronic device including a speaker.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. Recent electronic devices are being developed to enable portability and communication.

[0003] Electronic devices can refer to devices that perform specific functions based on their embedded programs, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and car navigation systems. For example, these electronic devices can output stored information as audio or video.

[0004] As the integration of electronic devices increases and ultra-high-speed, high-capacity wireless communications become more widespread, a single electronic device, such as a mobile terminal, can now incorporate a variety of functions. For example, in addition to communication functions, entertainment functions like gaming, multimedia functions like music and video playback, communication and security functions like mobile banking, and even calendar management and electronic wallet functions are being integrated into a single electronic device. These electronic devices are also becoming smaller and more portable for users.

[0005] An electronic device according to one embodiment of the present disclosure comprises: a first housing, a second housing, a hinge structure configured to connect the first housing and the second housing and rotate the first housing and the second housing, a flexible display disposed in the first housing and the second housing, a speaker disposed in the first housing, a first sound output path configured to open when the first housing and the second housing are in an unfolded state, the first sound output path including a first speaker hole configured to pass sound output from the speaker (500) to the outside of the electronic device (101) when the first housing (310) and the second housing (320) are in the unfolded state and to be at least partially covered when the first housing and the second housing are in the folded state, and a second sound output path configured to open when the first housing and the second housing are in a folded state, the first sound output path being configured to open when the first housing (310) and the second housing (320) are in the folded state, the first sound output path including the first speaker hole configured to pass sound output from the speaker (500) to the outside of the electronic device (101) when the first housing (310) and the second housing (320) are in the unfolded state, and to be at least partially covered when the first housing and the second housing are in the folded state. A second sound output path may include a second speaker hole configured to pass sound output from a speaker (500) to the outside of the electronic device (101) and configured to be at least partially covered when the first housing and the second housing are in the unfolded state, and the second speaker hole may be arranged in the first housing.

[0006] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0007] FIG. 2 is a front view, a side view, and a rear view of an unfolded state of an electronic device according to one embodiment of the present disclosure.

[0008] FIG. 3 is a front view, a side view, and a rear view of a folded state of an electronic device according to an embodiment of the present disclosure.

[0009] FIG. 4 is an exploded perspective view of an electronic device in an unfolded state according to one embodiment of the present disclosure.

[0010] FIG. 5 is a cross-sectional view of an electronic device in a folded state according to one embodiment of the present disclosure.

[0011] Figure 6 is an enlarged view of a portion of Figure 5.

[0012] FIG. 7 is a perspective view showing a diaphragm of a speaker according to one embodiment of the present disclosure.

[0013] FIG. 8 is a perspective view showing a vent portion of a speaker according to one embodiment of the present disclosure.

[0014] FIG. 9 illustrates the propagation paths of sound generated from a speaker in a folded state of an electronic device according to one embodiment of the present disclosure.

[0015] Figure 10 is an enlarged view of a portion of Figure 9, showing the rear cover removed.

[0016] FIG. 11 is a rear view of a portion of a housing according to one embodiment of the present disclosure.

[0017] Fig. 12 is a cross-sectional view of the housing taken along line AA` of Fig. 11.

[0018] FIG. 13 is a cross-sectional view of an electronic device in a folded state according to one embodiment of the present disclosure.

[0019] Figure 14 is an enlarged view of a portion of Figure 13.

[0020] FIG. 15 illustrates the propagation paths of sound generated from a speaker in a folded state of an electronic device according to one embodiment of the present disclosure.

[0021] FIG. 16 shows a call appearance of an electronic device in a folded state according to one embodiment of the present disclosure.

[0022] FIG. 17 is a cross-sectional view of an electronic device in an unfolded state according to one embodiment of the present disclosure.

[0023] Figure 18 is an enlarged view of a portion of Figure 17.

[0024] FIG. 19 shows a call appearance of an electronic device in an unfolded state according to one embodiment of the present disclosure.

[0025] FIG. 20 is a cross-sectional view of an electronic device in a partially folded state according to one embodiment of the present disclosure.

[0026] Figure 21 is an enlarged view of a portion of Figure 20.

[0027] FIG. 22 shows a call appearance of an electronic device in a partially folded state according to one embodiment of the present disclosure.

[0028] FIG. 23 is a perspective view of an electronic device in a folded state according to one embodiment of the present disclosure.

[0029] FIG. 24 is a cross-sectional view of a portion of an electronic device according to one embodiment of the present disclosure.

[0030] FIG. 25 is a rear view of an electronic device in a folded state according to one embodiment of the present disclosure.

[0031] Fig. 26 is a cross-sectional view of a portion of an electronic device taken along line BB` of Fig. 25.

[0032] Fig. 27 is a cross-sectional view of a portion of an electronic device taken along line BB` of Fig. 25.

[0033] Fig. 28 is a cross-sectional view of a portion of an electronic device taken along line BB` of Fig. 25.

[0034] The following description of the accompanying drawings may provide an understanding of various exemplary implementations of the present disclosure, including the claims and their equivalents. While the exemplary embodiments disclosed in the following description include numerous specific details to aid understanding, they are to be considered as one example of various exemplary embodiments. Accordingly, those skilled in the art will appreciate that various modifications and variations of the various implementations described herein may be made without departing from the scope and spirit of the disclosure. Furthermore, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0035] The terms and words used in the following description and claims are not limited to their reference meanings and can be used to clearly and consistently describe one embodiment of the present disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various implementations of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the disclosure and its equivalents.

[0036] Unless the context clearly dictates otherwise, the singular forms of "a," "an," and "the" should be understood to include plural meanings. Thus, for example, "a component surface" could be understood to include one or more of the surfaces of the component.

[0037] Those skilled in the art will recognize that one or more of the embodiments illustrated in FIGS. 1 through 28 may be combined to form new embodiments. Furthermore, portions of the embodiments may be combined accordingly.

[0038] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0039] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0040] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0041] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0042] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0043] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0044] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0045] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0046] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0047] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0048] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0049] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0050] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0051] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0052] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0053] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0054] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0055] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0056] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0057] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0058] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0059] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0060] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0061] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0062] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0063] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0064] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0065] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0066] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0067] FIG. 2 illustrates a front view, a side view, and a rear view of an electronic device (101) in an unfolded state according to one embodiment of the present disclosure. FIG. 3 illustrates a front view, a side view, and a rear view of an electronic device (101) in a folded state according to one embodiment of the present disclosure.

[0068] Referring to FIGS. 2 and 3, an electronic device (101) according to one embodiment includes a first housing (210), a second housing (220), a flexible or foldable display (230) (hereinafter, abbreviated as “the first display (230)”) disposed in the first housing (210) and the second housing (220) (e.g., the display module (160) of FIG. 1), and a hinge cover (260).

[0069] According to one embodiment, a surface on which the first display (230) is disposed may be defined as a front surface of the electronic device (101). The front surface of the electronic device (101) may be formed by a front plate (e.g., a glass plate or a polymer plate including various coating layers) having at least a portion that is substantially transparent. In addition, a surface opposite to the front surface may be defined as a rear surface of the electronic device (101). The rear surface of the electronic device (101) may be formed by a substantially opaque rear plate (hereinafter referred to as a “rear cover”). The rear cover may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. In addition, a surface surrounding a space between the front surface and the rear surface may be defined as a side surface of the electronic device (101). The side surface may be formed by a side bezel structure (or “side member”) that is coupled to the front plate and the rear cover and includes a metal and / or a polymer. In some embodiments, the rear cover and side bezel structures may be formed integrally and include the same material (e.g., a metal material such as aluminum).

[0070] The electronic device (101) may include at least one of a first display (230), an audio module (241, 243, 245), a sensor module (255), a camera module (251, 253), a key input device (211, 212, 213), and a connector hole (214). According to one embodiment, the electronic device (101) may omit at least one of the components (e.g., a key input device (211, 212, 213)) or additionally include another component (e.g., a light-emitting element).

[0071] According to one embodiment of the present disclosure, the first display (230) may be a display in which at least a portion of the display area can be transformed into a flat or curved surface. According to one embodiment, the first display (230) may include a folding area (231c), a first area (231a) disposed on one side (e.g., the upper side of the folding area (231c) illustrated in FIG. 2) with respect to the folding area (231c), and a second area (231b) disposed on the other side (e.g., the lower side of the folding area (231c) illustrated in FIG. 2). However, the division of the areas of the first display (230) illustrated in FIG. 2 is exemplary, and the first display (230) may be divided into a plurality of areas (e.g., four or more or two) depending on the structure or function. For example, in the embodiment illustrated in FIG. 2, the areas of the first display (230) may be divided by the folding area (231c) or the folding axis (A), but in other embodiments, the areas of the first display (230) may be divided by another folding area (231c) or another folding axis (e.g., a folding axis perpendicular to the folding axis (A)).

[0072] According to one embodiment of the present disclosure, a microphone hole (241) may be arranged inside a microphone for acquiring external sound, and in some embodiments, a plurality of microphones may be arranged to detect the direction of the sound.

[0073] According to one embodiment of the present disclosure, the speaker holes (243, 245) may include an external speaker hole (243) and a first speaker hole (245). In some embodiments, the speaker holes (243, 245) and the microphone hole (241) may be implemented as a single hole, or a speaker may be included without the speaker hole (243, 245) (e.g., a piezo speaker). The positions and numbers of the microphone holes (241) and the speaker holes (243, 245) may vary depending on the embodiment.

[0074] According to one embodiment of the present disclosure, the camera module (251, 253) may include a first camera device (251) disposed on a first surface (210a) of a first housing (210) of the electronic device (101), and a second camera device (253) disposed on a second surface (210b). In addition, the electronic device (101) may further include a flash (not shown). The camera devices (251, 253) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (not shown) may include, for example, a light-emitting diode or a xenon lamp.

[0075] According to one embodiment of the present disclosure, the sensor module (255) may generate an electric signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. Although not illustrated in the drawing, the electronic device (101) may additionally or alternatively include another sensor module (e.g., the sensor module (176) of FIG. 1) in addition to the sensor module (255) provided on the second surface (210b) of the first housing (210). The electronic device (101) may include, as a sensor module, at least one of a proximity sensor, a fingerprint sensor, an HRM sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor, for example.

[0076] According to one embodiment of the present disclosure, the key input devices (211, 212, 213) may be disposed on a side of a foldable housing (e.g., hinge cover (260), first housing (210), and / or second housing (220)). In another embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (211, 212, 213), and the key input devices that are not included may be implemented in another form, such as soft keys, on the first display (230). In some embodiments, the key input devices may be configured such that key input is implemented by a sensor module (e.g., gesture sensor).

[0077] According to one embodiment of the present disclosure, the connector hole (214) may be configured to accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data to and from an external electronic device, or, additionally or alternatively, a connector for transmitting and receiving audio signals to and from an external electronic device.

[0078] According to one embodiment of the present disclosure, a foldable housing may be implemented by combining a first housing (210), a second housing (220), a first back cover (240, back cover), a second back cover (250, back cover) and / or a hinge module (e.g., a hinge structure (270) of FIG. 4 described below). The foldable housing of the electronic device (101) is not limited to the shape and combination illustrated in FIG. 2, and may be implemented by combining and / or combining other shapes or parts. For example, in another embodiment, the first housing (210) and the first back cover (240) may be formed integrally, and the second housing (220) and the second back cover (250) may be formed integrally. According to one embodiment of the present disclosure disclosed in this document, the term 'housing' may mean a combination and / or combined configuration of various other parts that are not mentioned. For example, the first area (231a) of the first display (230) may be described as forming one side of the first housing (210), and in another embodiment, the first area (231a) of the first display (230) may be described as being arranged or attached to one side of the first housing (210).

[0079] According to one embodiment of the present disclosure, the first housing (210) is connected to a hinge structure (e.g., the hinge structure (270) of FIG. 4 described below) and may include a first side (210a) facing a first direction and a second side (210b) facing a second direction opposite to the first direction. The second housing (220) is connected to a hinge structure (e.g., the hinge structure (270) of FIG. 4 described below) and includes a third side (220a) facing a third direction and a fourth side (220b) facing a fourth direction opposite to the third direction, and may rotate or pivot with respect to the first housing (210) about the hinge structure (or folding axis (A)).

[0080] According to one embodiment of the present disclosure, the first housing (210) and the second housing (220) may be arranged on both sides (or upper / lower sides) with respect to the folding axis (A). The angle or distance at which the first housing (210) and the second housing (220) intersect each other may vary depending on whether the state of the electronic device (101) is an unfolded state, a folded state, or a partially unfolded (or partially folded) intermediate state.

[0081] According to one embodiment of the present disclosure, at least a portion of the first housing (210) and the second housing (220) may be formed of a metallic material or a non-metallic material having a rigidity of a size selected to support the first display (230). At least a portion formed of the metallic material may serve as a ground plane or a radiating conductor of the electronic device (101), and when served as a ground plane, may be electrically connected to a ground line formed on a printed circuit board (e.g., printed circuit boards 216 and 226 of FIG. 4).

[0082] According to one embodiment of the present disclosure, a first rear cover (240) is disposed on one side (e.g., the upper side in FIG. 2) of the folding axis (A) on the rear side of the electronic device (101) and may have, for example, a substantially rectangular periphery, the periphery of which may be wrapped by the first housing (210) (and / or a side bezel structure). Similarly, a second rear cover (250) is disposed on the other side (e.g., the lower side in FIG. 2) of the folding axis (A) on the rear side of the electronic device (101) and may have its periphery wrapped by the second housing (220) (and / or a side bezel structure).

[0083] According to one embodiment of the present disclosure, the first rear cover (240) and the second rear cover (250) may have substantially symmetrical shapes with respect to the folding axis (A). However, the first rear cover (240) and the second rear cover (250) do not necessarily have mutually symmetrical shapes, and in other embodiments, the electronic device (101) may include the first rear cover (240) and the second rear cover (250) of various shapes. In yet another embodiment, the first rear cover (240) may be formed integrally with the first housing (210), and the second rear cover (250) may be formed integrally with the second housing (220).

[0084] According to one embodiment of the present disclosure, the first rear cover (240), the second rear cover (250), the first housing (210), and the second housing (220) may form a space in which various components of the electronic device (101) (e.g., the printed circuit boards (216, 226) or the batteries (215, 225) of FIG. 4) may be placed. According to one embodiment, one or more components may be placed or visually exposed on the rear surface of the electronic device (101). For example, at least a portion of the second display (239) may be visually exposed through the first rear cover (240). In another embodiment, one or more components or sensors may be visually exposed through the first rear cover (240). In various embodiments, the components or sensors may include a proximity sensor, a rear camera, and / or a flash. In addition, although not shown separately in the drawing, one or more components or sensors may be visually exposed through the second rear cover (250).

[0085] According to one embodiment of the present disclosure, the first rear cover (240) may include a notch (244). The notch (244) may be formed at an edge of the first rear cover (240). For example, the notch (244) may be positioned around the perimeter of the second display (239). For example, the notch (244) may extend along an edge of the second display (239). The notch (244) will be described in detail below.

[0086] According to one embodiment of the present disclosure, a front camera device (251) exposed on the front side of the electronic device (101) through one or more openings or a rear camera (253) exposed through the first rear cover (240) may include one or more lenses, an image sensor, and / or an image signal processor. A flash (not shown) may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (101).

[0087] According to one embodiment of the present disclosure, the foldable housing (210, 220, 260) may include a hinge cover (260), a first housing (210), and a second housing (220). The first housing (210) and the second housing (220) may be rotated with respect to the hinge structure (270). When the electronic device (101) is changed from an unfolded state to a folded state, the first housing (210) and the second housing (220) may be rotated with respect to the hinge structure (270) to bring them closer to each other. When the electronic device (101) is changed from a folded state to an unfolded state, a portion of the first housing (210) and a portion of the second housing (220) may be rotated with respect to the hinge cover (260) to move away from each other. According to one embodiment of the present disclosure, the folding direction of the first housing (210) and / or the second housing (220) may include a direction in which the first housing (210) and / or the second housing (220) rotates with respect to the hinge structure (270) when the first housing (210) and / or the second housing (220) transitions from an unfolded state to a folded state. The unfolding direction of the first housing (210) and / or the second housing (220) may include a direction in which the first housing (210) and / or the second housing (220) rotates with respect to the hinge structure (270) when the first housing (210) and / or the second housing (220) transitions from a folded state to an unfolded state.

[0088] According to one embodiment of the present disclosure, the electronic device (101) can be configured to have a folded state of the first display (230) or an unfolded state of the first display (230). For example, the first housing (210) and the second housing (220) can rotate about the folding axis (A) between a folded state in which the first region (231a) and the second region (231b) of the first display (230) face each other, and a state in which the first display (230) is unfolded by a specified angle from the folded state (e.g., the unfolded state of the electronic device (101) illustrated in FIG. 2).

[0089] According to one embodiment of the present disclosure, as the first housing (210) and the second housing (220) rotate about the folding axis (A), the electronic device (101) may include a folded state and an unfolded state. The folded state may be a state in which the first housing (210) and the second housing (220) face each other, and an angle formed by the first housing (210) and the second housing (220) may be less than a predetermined angle (e.g., 10 degrees). The unfolded state may be a state in which the electronic device (101) is fully unfolded or partially unfolded, and an angle formed by the first housing (210) and the second housing (220) may be greater than or equal to the predetermined angle.

[0090] Fig. 2 illustrates an unfolded state of the electronic device (101) in which the first housing (210) and the second housing (220) form an angle of approximately 180°. Fig. 2 and Fig. 3 illustrate a folded state of the electronic device (101) in which the first housing (210) and the second housing (220) are parallel and facing each other. In the folded state, the first region (231a) and the second region (231b) of the first display (230) can be positioned to face each other, and the folding region (231c) can be bent.

[0091] According to one embodiment of the present disclosure, folding of the electronic device (101) can be implemented in two ways: 'in-folding', in which the first region (231a) and the second region (231b) are folded to face each other, and 'out-folding', in which the first region (231a) and the second region (231b) are folded to face opposite directions. For example, in a folded state in the in-folding manner, the first region (231a) and the second region (231b) can be substantially concealed, and in a fully unfolded state, the first region (231a) and the second region (231b) can be arranged to face substantially the same direction. For example, in the folded state in the out-folding manner, the first region (231a) and the second region (231b) may be arranged facing in opposite directions and exposed to the outside, and in the fully unfolded state, the first region (231a) and the second region (231b) may be arranged facing in substantially the same direction.

[0092] According to one embodiment of the present disclosure, the first display (230) may include a display panel (not shown) and a window member (not shown), and at least a portion of which may be formed to be flexible. Although not separately illustrated, it will be readily understood by those skilled in the art that the first display (230) or the display panel includes various layers, such as a light-emitting layer, a substrate(s) encapsulating the light-emitting layer, an electrode or wiring layer, and / or an adhesive layer(s) bonding adjacent different layers. When the first display (230) (e.g., the folding area (231c)) is deformed into a flat shape and a curved shape, a relative displacement may occur between the layers forming the first display (230). The relative displacement due to the deformation of the first display (203) may increase as the point is further from the folding axis (A) and / or as the thickness of the first display (230) increases.

[0093] According to one embodiment of the present disclosure, a window member, for example, a thin film plate, may function as a protective film for protecting a display panel. As a protective film, the thin film plate may be made of a material that protects the display panel from external impact, is scratch-resistant, and reduces wrinkles in the folding area (231c) even during repeated folding and unfolding operations of the housings (210, 220). For example, the material of the thin film plate may include a transparent polyimide film (CPI) or an ultra-thin glass (UTG).

[0094] According to one embodiment of the present disclosure, the electronic device (101) may further include a protective member (206)(s) or a decorative cover (218, 228)(s) disposed on at least a portion of an edge of the first display (230) on the front surface (e.g., the first side (210a) or the third side (220a)). As an example, the protective member (206) and the decorative cover (218, 228) may be connected to each other to surround an edge of the first display (230). The protective member (206) or the decorative cover (218, 228) may prevent at least a portion of an edge of the first display (230) from contacting a mechanical structure (e.g., the first housing (210) or the second housing (220)). The protective member (206) or the decorative cover (218, 228) may be visually exposed to the outside of the electronic device (101).

[0095] According to one embodiment of the present disclosure, the decorative covers (218, 228) and the protective member (206) may be connected to each other. As an example, the decorative covers (218, 228) and the protective member (206) may be formed integrally. The decorative covers (218, 228) may extend along the folding axis (A). The decorative covers (218, 228) may include a first decorative cover (218) disposed between a portion of an edge of a first area (231a) of the first display (230) and an inner wall of the first housing (210). The decorative covers (218, 228) may include a second decorative cover (228) disposed between a portion of an edge of a second area (231b) of the first display (230) and an inner wall of the second housing (220). As an example, the first decorative cover (218) and the second decorative cover (228) can extend substantially parallel along the folding axis (A).

[0096] According to one embodiment of the present disclosure, the first speaker hole (245) may be formed in a decorative cover (218) or a protective member (206) interposed between an edge of the first area (231a) of the first display (230) and an inner wall of the first housing (210). As an example, the first speaker hole (245) may be formed in the first decorative cover (218). Preferably, the first speaker hole (245) may be formed adjacent to an end of the first housing (310) that is furthest from the folding axis (A).

[0097] FIG. 4 is an exploded perspective view of an electronic device (101) according to one embodiment of the present disclosure.

[0098] The description of the first housing (210) and the second housing (220) described with reference to FIGS. 2 and 3 can be equally applied to the first housing (310) and the second housing (320) of the same name, which are illustrated in FIG. 4.

[0099] Referring to FIG. 4, according to one embodiment of the present disclosure, the first display (230) may be exposed through a significant portion of the front surface of the electronic device (101). In some embodiments, the shape of the first display (230) may be formed to be substantially the same as the outer shape of the front surface of the electronic device (101).

[0100] In FIG. 4, 'Y' may mean the longitudinal direction of the electronic device (101) in the second state. In addition, in one embodiment of the present invention, '+Y' may mean the upward direction of the electronic device (101) with respect to the folding axis (A) of the electronic device (101), and '-Y' may mean the downward direction of the electronic device (101) with respect to the folding axis (A) of the electronic device (101).

[0101] According to one embodiment of the present disclosure, a foldable housing of an electronic device (101) includes a first housing (210, 310) and a second housing (220, 320). According to one embodiment, the first housing (210) may include a first surface (210a) and a second surface (210b) facing in an opposite direction to the first surface (210a), and the second housing (220) may include a third surface (220a) and a fourth surface (220b) facing in an opposite direction to the third surface (220a). The electronic device (101) or the foldable housing (210, 220, 260) may additionally or alternatively include a bracket assembly (217, 227). The bracket assembly (217, 227) may include a first bracket assembly (217) disposed in a first housing (210) and a second bracket assembly (227) disposed in a second housing (220). At least a portion of the bracket assembly (217, 227), for example, at least a portion of the first bracket assembly (217) and at least a portion of the second bracket assembly (227), may serve as a plate for supporting the hinge structure (270).

[0102] According to one embodiment of the present disclosure, various electrical components may be arranged on the printed circuit board (216, 226). For example, the printed circuit board (216, 226) may be equipped with a processor (e.g., the processor (120) of FIG. 1), a memory (e.g., the memory (130) of FIG. 1), and / or an interface (e.g., the interface (177) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0103] According to one embodiment of the present disclosure, the printed circuit board (216, 226) may include a first printed circuit board (216) disposed on the side of the first bracket assembly (217) and a second printed circuit board (226) disposed on the side of the second bracket assembly (227). The first printed circuit board (216) and the second printed circuit board (226) may be disposed inside a space formed by the foldable housing (210, 220, 260), the bracket assembly (217, 227), the first rear cover (240) and / or the second rear cover (250). Components for implementing various functions of the electronic device (101) may be separately disposed on the first printed circuit board (216) and the second printed circuit board (226). For example, a processor may be placed on a first printed circuit board (216), and an audio interface may be placed on a second printed circuit board (226).

[0104] According to one embodiment of the present disclosure, a battery (215, 225) for supplying power to an electronic device (101) may be disposed adjacent to a printed circuit board (216, 226). At least a portion of the battery (215, 225) may be disposed, for example, substantially coplanar with the printed circuit board (216, 226). According to one embodiment, a first battery (215) may be disposed adjacent to a first printed circuit board (216), and a second battery (225) may be disposed adjacent to a second printed circuit board (226). The battery (215, 225) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. The battery (215, 225) may be integrally placed inside the foldable housing (210, 220, 260), or may be detachably placed in the foldable housing (210, 220, 260).

[0105] According to one embodiment of the present disclosure, the hinge structure (270) may be configured to provide a folding axis (e.g., the folding axis (A) of FIG. 2) and rotatably connect or couple the foldable housing (210, 220, 260) and / or the bracket assembly (217, 227). The hinge structure (270) may include a first hinge structure (271) disposed on the first printed circuit board (216) side and a second hinge structure (272) disposed on the second printed circuit board (226) side. The hinge structure (270) may be disposed between the first printed circuit board (216) and the second printed circuit board (226). According to one embodiment, the hinge structure (270) may be substantially integrally formed with at least a portion of the first bracket assembly (217) and at least a portion of the second bracket assembly (227).

[0106] According to one embodiment of the present disclosure, a 'housing structure' may refer to a foldable housing (210, 220, 260), and at least one component disposed inside the foldable housing (210, 220, 260) assembled and / or coupled. The housing structure may include a first housing structure and a second housing structure. For example, an assembled configuration including at least one component among a first housing (210), a first bracket assembly (217) disposed inside the first housing (210), a first printed circuit board (216), and a first battery (215) may be referred to as a 'first housing structure'. In another example, an assembled configuration including at least one component among a second housing (220), a second bracket assembly (227) disposed inside the second housing (220), a second printed circuit board (226), and a second battery (225) may be referred to as a 'second housing structure'. However, it should be noted that the 'first housing structure and second housing structure' here are not limited to the addition of the above-described components, and may additionally include or omit various other components.

[0107] According to one embodiment of the present disclosure, the flexible connecting member (280) may be, for example, a flexible printed circuit board (FPCB). The flexible connecting member (280) may connect various electrical components arranged on the first printed circuit board (216) and the second printed circuit board (226). To this end, the flexible connecting member (280) may be arranged to cross the 'first housing structure' and the 'second housing structure'. According to one embodiment, the flexible connecting member (280) may be arranged to cross at least a portion of the hinge structure (270). According to one embodiment, the flexible connecting member (280) may be configured to connect the first printed circuit board (216) and the second printed circuit board (226) across the hinge structure (270), for example, along a direction parallel to the y-axis of FIG. 4. For another example, the flexible connecting member (280) may be extended or arranged through an opening (273, 274) formed in the hinge structure (270). At this time, a part (281) of the flexible connecting member (280) may be arranged to span one side (e.g., the upper side) of the first hinge structure (271), and another part (282) of the flexible connecting member (280) may be arranged to span one side (e.g., the upper side) of the second hinge structure (272). In addition, another part (283) of the flexible connecting member (280) may be arranged on the other side (e.g., the lower side) of the first hinge structure (271) and the second hinge structure (272). A space (hereinafter referred to as a “wiring space”) surrounded by at least a portion of the first hinge structure (271), at least a portion of the second hinge structure (272), and at least a portion of the hinge cover (260) may be formed adjacent to the first hinge structure (271) and the second hinge structure (272). According to one embodiment, at least a portion (283) of the flexible connecting member (280) may be disposed within the wiring space.

[0108] According to one embodiment of the present disclosure, the hinge cover (260) may be configured to accommodate or enclose at least a portion of the hinge structure (270) or the wiring space. In some embodiments, the hinge cover (260) may form a wiring space together with the hinge structure (270) and protect a component (e.g., at least a portion (283) of the flexible connecting member (280)) disposed within the wiring space from external impact. According to one embodiment, the hinge cover (260) may be disposed between the first housing (210) and the second housing (220). In the in-folding type electronic device (101), the hinge cover (260) may be at least partially concealed by the foldable housing (210, 220, 260). For example, in the folded state, the hinge cover (260) may be visually exposed to the external space between the rear surface of the first housing (210) (e.g., the first rear cover (240)) and the rear surface of the second housing (220) (e.g., the second rear cover (250)), and in the unfolded state, it may be substantially accommodated within the interior of the first housing (210) or the second housing (220) and visually concealed.

[0109] According to one embodiment of the present disclosure, an antenna module (219, 229) (e.g., antenna module (197) of FIG. 1) may be disposed between a rear cover (240, 250) and a battery (215, 225). According to one embodiment, the antenna module (219, 229) may include a first antenna module (219) disposed on the side of the first housing (210) and a second antenna module (229) disposed on the side of the second housing (220). The antenna module (219, 229) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna, thereby enabling short-range communication with an external device or wirelessly transmitting and receiving power required for charging. In other embodiments, the antenna structure may be formed by a portion or combination of the side bezel structure and / or the bracket assembly of the foldable housing (210, 220, 260).

[0110] According to one embodiment of the present disclosure, the rear cover (240, 250) may include a first rear cover (240) and a second rear cover (250). The rear cover (240, 250) may be combined with the foldable housing (210, 220, 260) to protect the above-described components (e.g., a printed circuit board (216, 226), a battery (215, 225), a flexible connecting member (280), or an antenna module (219, 229)) disposed within the foldable housing (210, 220, 260). As described above, the rear cover (240, 250) may be formed substantially integrally with the foldable housing (210, 220, 260).

[0111] According to one embodiment of the present disclosure, the protective member (206) and / or the decorative cover (218, 228) can protect at least a portion of an edge of the first display (230). The protective member (206) can be positioned between an edge of a first area (231a, see FIG. 2) of the first display (230) and an inner wall of the first housing (210) and / or between an edge of a second area (231b, see FIG. 2) of the first display (230) and an inner wall of the second housing (220) to prevent the edge of the first display (230) from directly contacting the inner walls of the housings (210, 220).

[0112] Fig. 5 is a cross-sectional view of an electronic device (101) in a folded state according to one embodiment of the present disclosure. Fig. 6 is an enlarged view of a portion of Fig. 5.

[0113] Referring to FIGS. 5 and 6, an electronic device (101) according to one embodiment of the present disclosure includes a speaker (500) (e.g., an audio output module (155) of FIG. 1). The speaker (500) may be placed in a first internal space (210c) of a first housing (310). For example, sound generated from the speaker (500) may be emitted through a first speaker hole (245). For example, sound generated from the speaker (500) may spread to the first internal space (210c) of the first housing (310). A part of the electronic device (101) extending from the speaker (500) to the first speaker hole (245) may be referred to as a duct.

[0114] According to one embodiment of the present disclosure, the first speaker hole (245) may be positioned adjacent to the other side (317) of the first housing (310). Components inside the first housing (310) (e.g., the first battery (215) or the speaker (500)) may be positioned between the one side (313) and the other side (317) of the first housing (310). As an example, the one side (313) and the other side (317) of the first housing (310) may extend substantially parallel along the folding axis (A) direction (e.g., the X direction of FIG. 4). Preferably, the first speaker hole (245) may be formed adjacent to the end of the first housing (310) that is furthest from the folding axis (A) (e.g., the other side (317)).

[0115] According to one embodiment of the present disclosure, the electronic device (101) may include at least one microphone module (R) (e.g., the input module (150) of FIG. 1). For example, the microphone module (R) may be disposed inside the second housing (320). Sound from outside the electronic device (101) may be introduced into the interior of the second housing (320) through the microphone hole (e.g., the microphone hole (243) of FIG. 2) of the second housing (320).

[0116] According to one embodiment of the present disclosure, an electronic device (101) may include a first housing (310) (e.g., the first housing (210) of FIG. 4), a second housing (320) (e.g., the second housing (220) of FIG. 4), a first display (230), and a hinge cover (260).

[0117] According to one embodiment of the present disclosure, a hinge cover (260) may cover at least a portion of a hinge structure (270, see FIG. 4). The hinge cover (260) may be configured to be exposed to the outside of the electronic device (101). The hinge cover (260) may include a central portion (263), and one side (261) and the other side (262) on either side of the central portion (263). The one side (261) of the hinge cover (260) may be referred to as a first extended portion (261) extending from the central portion (263). The other side (262) of the hinge cover (260) may be referred to as a second extended portion (262) extending from the central portion (263).

[0118] According to one embodiment of the present disclosure, one side (261) of the hinge cover (260) may be adjacent to the overlapping portion (311) of the first housing (310). The other side (262) of the hinge cover (260) may be adjacent to the overlapping portion (321) of the second housing (320). The one side (261) of the hinge cover (260) may extend along the overlapping portion (311) of the first housing (310). The other side (262) of the hinge cover (260) may extend along the overlapping portion (321) of the second housing (320). The overlapping portions (311, 321) of the first housing (310) and the second housing (320) and one side (261) and the other side (262) of the hinge cover (260) can extend along the folding axis (A, see FIG. 2).

[0119] According to one embodiment of the present disclosure, the first housing (310) may include a bracket assembly (312, e.g., the first bracket assembly (217) of FIG. 4) on which components of the electronic device (101) are arranged. One surface of the bracket assembly (312) may support the first display (230). The other surface of the bracket assembly (312) opposite to the one surface may support electronic components of the electronic device (101) (e.g., the first battery (215)).

[0120] According to one embodiment of the present disclosure, the first housing (310) may include a side wall (314) that protrudes in one direction (e.g., the z-axis direction of FIG. 4) from the bracket assembly (312). For example, the side wall (314) may protrude from the bracket assembly (312) toward the first display (230) or the second display (239). The side wall (314) may extend along at least a portion of an edge of the bracket assembly (312). The side wall (314) may support a component (e.g., the first battery (215)) inside the electronic device (101).

[0121] According to one embodiment of the present disclosure, the side wall (314) of the first housing (310) may include a side (313) adjacent to the hinge cover (260). The first housing (310) may include an overlapping portion (311) protruding from the side (313) of the side wall (314). The overlapping portion (311) of the first housing (310) may be a side of the first housing (310) that overlaps with the side (261) of the hinge cover (260) when the electronic device (101) is unfolded.

[0122] According to one embodiment of the present disclosure, the overlap portion (311) may be positioned between one side (313) of the side wall (314) of the first housing (310) and one side (261) of the hinge cover (260). For example, the battery (215) may be positioned between the speaker (500) and the overlap portion (311) of the housing (310). For example, the battery (215) may be positioned adjacent to the overlap portion (311).

[0123] According to one embodiment of the present disclosure, the overlapping portion (311) of the first housing (310) may be configured to overlap with the hinge cover (260). When the electronic device (101) is folded or unfolded based on the folding axis (e.g., the folding axis (A) of FIG. 2), the overlapping area (hereinafter, referred to as the overlap area) of the overlapping portion (311) and the hinge cover (260) may change. When the electronic device (101) changes from an unfolded state to a folded state, the overlapping area may decrease, and when the electronic device (101) changes from a folded state to an unfolded state, the overlapping area may increase.

[0124] According to one embodiment of the present disclosure, the overlapping portion (311) may include a facing surface (311e) configured to at least partially face one side (261) of the hinge cover (260). For example, when the foldable housing (260, 310, 320) is unfolded, or when the first housing (310) and the second housing (320) are in an unfolded state, the facing surface (311e) may face one side (261) of the hinge cover (260). For example, when the foldable housing (260, 310, 320) is folded, or when the first housing (310) and the second housing (320) are in a folded state, the facing surface (311e) may not face one side (261) of the hinge cover (260).

[0125] According to one embodiment of the present disclosure, the opposing surface (311e) of the overlapping portion (311) of the first housing (310) may have a shape corresponding to the outer surface of one side (261) of the hinge cover (260). As an example, the outer surface of one side (261) of the hinge cover (260) may be formed convexly, and the opposing surface (311e) of the overlapping portion (311) may be formed concavely correspondingly thereto. A connecting hole (311a) and a second speaker hole (311b) may be arranged on the opposing surface (311e) of the overlapping portion (311) of the first housing (310).

[0126] According to one embodiment of the present disclosure, the overlap portion (311) may include a duct (316). For example, through the duct (316), the second internal space (311d) between the hinge cover (260) and the overlap portion (311) and the first internal space (210c) of the first housing (310) may be spatially connected to each other. Sound generated from the speaker (500) may pass through the first internal space (210c) and the duct (316) to the second internal space (311d). The duct (316) may be a separate component mounted on the overlap portion (311) or may be a part of the overlap portion (311) that is penetrated.

[0127] According to one embodiment of the present disclosure, the overlapping portion (311) may include a connecting hole (311a). The connecting hole (311a) may be formed at one end of the duct (316). The connecting hole (311a) may be positioned on an opposite surface (311e) of the overlapping portion (311). Through the connecting hole (311a), the second internal space (311d) and the first internal space (210c) of the first housing (310) may be spatially connected to each other. For example, the connecting hole (311a) may be formed toward the second internal space (311d) between the hinge cover (260) and the overlapping portion (311).

[0128] According to another embodiment of the present disclosure, a first opening (not shown) instead of a duct (316) may be arranged in the overlap portion (311). As an example, the first opening (not shown) may include a hole formed in a direction penetrating the first rear cover (240) (e.g., the X-axis direction of FIG. 4). According to another embodiment of the present disclosure, sound generated from the speaker (500) may sequentially pass through the first internal space (210c) and the first opening (not shown) arranged in the overlap portion (311) and be transmitted to the second internal space (311d).

[0129] According to one embodiment of the present disclosure, the overlapping portion (311) includes a second speaker hole (311b). Sound generated from the speaker (500) can be transmitted to the outside of the electronic device (101) through the second speaker hole (311b). The second speaker hole (311b) can be located on the opposite surface (311e) of the overlapping portion (311). The second speaker hole (311b) can penetrate the overlapping portion (311).

[0130] Preferably, the second speaker hole (311b) may be formed adjacent to one end of the first housing (310) closest to the folding axis (A). In other words, the second speaker hole (311b) may be formed at the other end of the first housing (310) opposite to the one end where the first speaker hole (245) is located. Preferably, the first speaker hole (245) and the second speaker hole (311b) may be connected to the outside of the electronic device in different directions.

[0131] According to one embodiment of the present disclosure, the second internal space (311d) and the external space of the electronic device (101) may be spatially connected to each other by a second speaker hole (311b). As an example, the second speaker hole (311b) may be formed in a direction toward the first rear cover (240) and may overlap with the notch (244). For example, the second speaker hole (311b) may be spatially connected to the notch (244) of the first rear cover (240).

[0132] According to another embodiment of the present disclosure, a notch (244) may not be formed on the edge of the first rear cover (240), but a second opening (not shown) may be formed. As an example, the second opening (not shown) may be formed on the edge of the first rear cover (240) and may include a slot extending along the edge of the second display (239). According to another embodiment of the present disclosure, sound generated from the speaker (500) may sequentially pass through the second speaker hole (311b) and the second opening (not shown) and be transmitted to the outside of the electronic device (101).

[0133] According to one embodiment of the present disclosure, the opening directions of the second speaker hole (311b) and the connection hole (311a) may be different from each other. For example, the second speaker hole (311b) may be formed in a direction toward the first rear cover (240) and may be formed in a direction substantially perpendicular to the direction toward which the connection hole (311a) is directed.

[0134] According to one embodiment of the present disclosure, the second speaker hole (311b) and the connection hole (311a) may be spaced apart from each other. For example, the connection hole (311a) and the second speaker hole (311b) may be positioned on a single rotational orbit defined based on a folding axis (e.g., the folding axis (A) of FIG. 2). The second speaker hole (311b) may be positioned between the sealer (315) and the connection hole (311a) on the overlapping portion (311).

[0135] According to one embodiment of the present disclosure, a sealer (315) may be placed on an edge (311c) of an overlap portion (311). The sealer (315) may be placed between the edge (311c) of the overlap portion (311) and the hinge cover (260). The sealer (315) may seal a space between the edge (311c) of the overlap portion (311) and an outer surface of the hinge cover (260). The sealer (315) may prevent foreign substances from entering the interior of the electronic device (101).

[0136] According to one embodiment of the present disclosure, an electronic device (101) may include a second housing (320). The second housing (320) may include an overlapping portion (321) configured to overlap with the other side (262) of the hinge cover (260). The overlapping portion (321) may be positioned adjacent to the other side (262) of the hinge cover (260).

[0137] According to one embodiment of the present disclosure, a sealer (325) may be placed on an edge (321c) of an overlapping portion (321). The sealer (325) may be placed between the edge (321c) of the overlapping portion (321) and the hinge cover (260). The sealer (325) may seal a space between the edge (321c) of the overlapping portion (321) and the outer surface of the hinge cover (260). The sealer (325) may prevent foreign substances from entering the interior of the electronic device (101).

[0138] According to one embodiment of the present disclosure, the electronic device (101) may include a damper (400) configured to shield at least a portion of the first speaker hole (245). The damper (400) may shield at least a portion of the first speaker hole (245) when the electronic device (101) is folded. For example, the damper (400) may be disposed in the second decorative cover (228, see FIG. 2). As an example, the damper (400) may be formed integrally with the second decorative cover (228). Sealing of the first speaker hole (245) by the damper (400) may direct sound from the speaker (500) toward the second speaker hole (311b).

[0139] According to one embodiment of the present disclosure, an electronic device (101) may include a damper (400). The damper (400) may be configured to cover a first speaker hole (245) when the electronic device (101) is in a folded state. As an example, the damper (400) and the first speaker hole (245) may be positioned on a single rotational orbit defined with respect to a folding axis (e.g., the folding axis (A) of FIG. 2). Accordingly, the damper (400) and the first speaker hole (245) may overlap each other when the electronic device (101) is folded.

[0140] According to one embodiment of the present disclosure, the damper (400) may have a shape corresponding to the shape of the first speaker hole (245). When the electronic device (101) is in a folded state, the damper (400) may contact the first speaker hole (245) to seal the first speaker hole (245), or may cover the first speaker hole (245) while being adjacent to the first speaker hole (245). The volume of sound radiated through the first speaker hole (245) may be reduced by the damper (400).

[0141] According to one embodiment of the present disclosure, sound generated from the speaker (500) can be radiated to the outside of the electronic device (101) along a predetermined path. The sound transmission path from the speaker (500) to the holes (245, 311b) open to the outside of the electronic device (101) can be referred to as a closed path or an open path.

[0142] According to one embodiment of the present disclosure, a closed path does not only mean a case where a sound transmission path is blocked as the term "closed" implies. For example, a closed path may include a case where at least one of a hole (e.g., a connection hole (311a), a second speaker hole (311b), or a first speaker hole (245)) or a passage (e.g., a duct (316)) included in a sound transmission path is sealed by another configuration and the sound transmission path is blocked, as well as a case where at least one of a hole or passage included in a sound transmission path is blocked by another adjacent one due to an operation of the electronic device (101) (e.g., folding or unfolding), so that most (e.g., 80%) of the sound is not emitted to the outside of the electronic device but is reflected inward.

[0143] According to one embodiment of the present disclosure, an open path may include a case where not all of the holes or passages constituting the sound transmission path are blocked by or overlap with other components, as well as a case where at least one of the holes or passages constituting the sound transmission path is partially blocked by other components, but most (e.g., 80%) of the sound is not reflected.

[0144] According to one embodiment of the present disclosure, when the electronic device (101) is in a folded state, a portion of the sound generated from the speaker (500) may travel to the first speaker hole (245) along the first closed path (C1). When the electronic device (101) is in a folded state, the damper (400) may cover the first speaker hole (245). Most of the sound transmitted to the first speaker hole (245) by the damper (400) may be reflected into the interior of the electronic device (101).

[0145] According to one embodiment of the present disclosure, a portion of the sound generated from the speaker (500) may be radiated to the outside of the electronic device (101) along a second open path (O2). The second open path (O2) may include a surrounding space of the speaker (500), a first internal space (210c) of the first housing (310), a duct (316), a connection hole (311a), and / or a second speaker hole (311b). The second open path (O2) is a path through which the sound generated from the speaker (500) is radiated to the outside of the electronic device (101), and may be referred to as a second sound output path (O2). The second open path (O2) will be described in detail below with reference to FIGS. 9 and 10 .

[0146] According to one embodiment of the present disclosure, the connecting hole (311a) and the notch (244, see FIGS. 2 and 3) may be spaced apart from each other. For example, the notch (244) may be positioned between the edge (311c) of the overlapping portion (311) and the second display (239). As an example, the connecting hole (311a) may be positioned below the second display (239), and the notch (244) may be positioned around the periphery of the second display (239).

[0147] According to one embodiment of the present disclosure, the notch (244) may be positioned at an edge of the first rear cover (240) corresponding to the second speaker hole (311b). As an example, the notch (244) may be formed at an edge of the first rear cover (240) overlapping the second speaker hole (311b).

[0148] Fig. 7 is a perspective view showing a diaphragm (520) of a speaker (500) according to one embodiment of the present disclosure. Fig. 8 is a perspective view showing a vent portion (551, 552) of a speaker (500) according to one embodiment of the present disclosure.

[0149] Referring to FIGS. 7 and 8, a speaker (500) according to one embodiment of the present disclosure may include a frame (510). The frame (510) may include a fastening portion (540). The fastening portion (540) may be coupled to an inner portion (e.g., bracket assembly (312)) of a first housing (310), and the speaker (500) may be stably placed in a first internal space (210c) of the first housing (310).

[0150] According to one embodiment of the present disclosure, the speaker (500) may include a vibration generating unit (530). The vibration generating unit (530) may be located in a space surrounded by a frame (510) (hereinafter, the inside of the frame (510)). As an example, the vibration generating unit (530) may include a magnet (not shown) that forms a magnetic field and a coil (not shown) configured to reciprocate by the magnet.

[0151] According to one embodiment of the present disclosure, a speaker (500) may include a diaphragm (520). The diaphragm (520) may vibrate by a vibration generating unit (530). Sound generated by the vibration of the diaphragm (520) may be radiated to the outside of the diaphragm (520). As an example, sound radiated to the outside of the diaphragm (520) may be transmitted to the first speaker hole (245) along the first open path (O1, see FIG. 17).

[0152] According to one embodiment of the present disclosure, the frame (510) of the speaker (500) may include at least one (e.g., two) vent portions (551, 552). As an example, FIG. 8 illustrates a case where two vent portions (551, 552) are formed. However, unlike as illustrated in FIG. 8, the speaker (500) may include only one vent portion (551 or 552).

[0153] According to one embodiment of the present disclosure, the vent portions (551, 552) may be placed in a vent hole (not shown) formed in the frame (510). The vent portions (551, 552) may cover the vent hole formed in the frame (510). Air may enter and exit through the vent portions (551, 552). The pressure change inside the diaphragm (520) (e.g., inside the frame (510)) due to the vibration of the diaphragm (520) may be reduced by the vent portions (551, 552). As an example, the vent portions (551, 552) may include a breathable mesh. For example, the vent portions (551, 552) may be formed of a material that is impermeable and breathable.

[0154] According to one embodiment of the present disclosure, the diaphragm (520) and the vent portions (551, 552) may be positioned on two opposing surfaces of the speaker (500). The vibration generating unit (530) may be positioned between the two opposing surfaces of the speaker (500). As an example, the diaphragm (520) may be positioned on the front of the speaker (500) to radiate sound toward the front of the speaker (500), and the vent portions (551, 552) may be positioned on the rear of the speaker (500), so that sound generated by the diaphragm (520) may be radiated toward the rear of the speaker (500) through the vent portions (551, 552).

[0155] According to one embodiment of the present disclosure, a portion of the sound generated by the vibration of the diaphragm (520) may be radiated to the outside of the speaker (500) through the vent portions (551, 552). The sound radiated to the outside of the speaker (500) through the vent portions (551, 552) may resonate in the internal space of the electronic device (101) (e.g., the first internal space (210c) and / or the second internal space (311d) of FIGS. 5 and 6). As an example, the sound radiated through the vent portions (551, 552) may be transmitted to the second speaker hole (311b) along the second open path (O2, see FIG. 6).

[0156] According to one embodiment of the present disclosure, the vent portions (551, 552) and the diaphragm (520) may be positioned on one side and the other side of the frame (510). As an example, the vent portions (551, 552) and the diaphragm (520) may be positioned on one side and the other side of the frame (510) opposite each other. The diaphragm (520) may be referred to as the first side (520) of the speaker (500). The vent portions (551, 552) may be referred to as the second side of the speaker (500).

[0157] According to one embodiment of the present disclosure, the speaker (500) may include a pad (553). The pad (553) may be disposed on the frame (510). The pad (553) may be disposed between a peripheral structure of the speaker (500) (e.g., the cap (560) of FIG. 26) and the frame (510). The pad (553) may be disposed to face the diaphragm (520). The pad (553) may reduce displacement of the frame (510) of the speaker (500) due to vibration of the diaphragm (520).

[0158] FIG. 9 illustrates sound propagation paths (C1, O2) generated from a speaker (500) in a folded state of an electronic device (101) according to one embodiment of the present disclosure. FIG. 10 is an enlarged view of part X of FIG. 9, illustrating a state in which the first rear cover (240) is removed.

[0159] Referring to FIG. 9, according to one embodiment of the present disclosure, when the electronic device (101) is folded, sound generated from the speaker (500) may travel along a first closed path (C1) and a second open path (O2). The first closed path (C1) may extend from the speaker (500) toward the first speaker hole (245). The second open path (O2) may extend from the speaker (500) toward the notch (244).

[0160] According to one embodiment of the present disclosure, the second open path (O2) may extend along a bottom surface (e.g., a surface facing the inside of the electronic device (101)) of the first rear cover (240). The second open path (O2) may extend along a bottom surface (e.g., a surface facing the first internal space (210c)) of the second display (239) disposed on the bottom surface of the first rear cover (240).

[0161] Referring to FIGS. 9 and 10, according to one embodiment of the present disclosure, the duct (316) may include a flow portion (3161) and an inlet portion (3162). For example, the second open path (O2) may include an inlet portion (3162) of the duct (316), a flow portion (3161), a connection hole (311a) of an overlap portion (311), and a second speaker hole (311b).

[0162] According to one embodiment of the present disclosure, the flow path portion (3161) may be formed by penetrating the overlap portion (311). The flow path portion (3161) may extend in the width direction (e.g., the Y-axis direction of FIG. 4) of the overlap portion (311). As an example, the flow path portion (3161) may extend straight along the thickness direction of the overlap portion (311).

[0163] According to one embodiment of the present disclosure, the inlet portion (3162) of the duct (316) may be located at one end of the flow path portion (3161). The connecting hole (311a) of the overlapping portion (311) may be located at the other end of the flow path portion (3161). The inlet portion (3162) and the connecting hole (311a) may be spatially connected through the flow path portion (3161).

[0164] According to one embodiment of the present disclosure, the inlet portion (3162) may include a breathable mesh. For example, the inlet portion (3162) may be formed of a material that is impermeable and breathable. The first internal space (210c) of the first housing (310) and the interior of the flow path portion (3161) may be spatially connected to each other through the inlet portion (3162). The inlet portion (3162) may block the movement of foreign substances between the first internal space (210c) of the first housing (310) and the flow path portion (3161).

[0165] According to one embodiment of the present disclosure, there may be a plurality of ducts (316), for example, two. As an example, the plurality of ducts (316) may be a pair. For example, the pair of ducts (316) may be spaced apart from each other in the direction of the folding axis (A) (e.g., the X-axis direction of FIG. 4). For example, the pair of ducts (316) may be located on both sides of the through hole (319).

[0166] According to one embodiment of the present disclosure, the second speaker hole (311b) may be spaced apart from the connecting hole (311a) in a direction in which the overlapping portion (311) protrudes from one side (313) of the side wall (314) (e.g., the -Y-axis direction in FIG. 4). For example, the second speaker hole (311b) may be a long slot. For example, the second speaker hole (311b) may be a slot that extends along the longitudinal direction (e.g., the X-axis direction in FIG. 4) of one side (313) of the side wall (314). The first holes (311a) may be spaced apart from both ends of the second speaker hole (311b) toward the inside of the first housing (310).

[0167] According to one embodiment of the present disclosure, the first housing (310) may include a through hole (319) through which a portion of a flexible connecting member (e.g., a portion (281) of the flexible connecting member (280) of FIG. 4) passes. A portion (281) of the flexible connecting member (280) may pass through the through hole (319) and extend toward the interior of the second housing (320). The through hole (319) may be located between two ducts (316). The through hole (319) may be located between the inlet portions (3162) of the two ducts (316).

[0168] Fig. 11 is a rear view of a portion of a first housing (310) according to one embodiment of the present disclosure. Fig. 12 is a cross-sectional view of the first housing (310) taken along line AA` of Fig. 11.

[0169] Referring to FIGS. 11 to 12, according to one embodiment of the present disclosure, the flow path portion (3161) of the duct (316) may have a bent structure. For example, the flow path portion (3161) may extend in a direction extending from the connection hole (311a) and in a direction extending from the inlet portion (3162) such that they intersect each other. The flow path portion (3161) may extend from the connection hole (311a) along the width direction (e.g., the Y-axis direction in FIG. 4) of the overlap portion (311). The flow path portion (3161) may extend from the inlet portion (3162) along the height direction (e.g., the Z-axis direction in FIG. 4) of the overlap portion (311). As an example, the direction in which the flow path portion (3161) extends from the connection hole (311a) and the direction in which the flow path portion (3161) extends from the inlet portion (3162) may be substantially orthogonal to each other.

[0170] According to one embodiment of the present disclosure, the edge (311c) of the overlap portion (311) may include a recessed portion so that a sealer (315, see FIG. 6) may be placed. The edge (311c) of the overlap portion (311) may be spaced apart from the second speaker hole (311b) toward one side (261) of the hinge cover (260) along the width direction (e.g., the Y-axis direction of FIG. 4) of the overlap portion (311). The edge (311c) of the overlap portion (311) may be at least partially exposed to the outside of the electronic device (101).

[0171] Fig. 13 is a cross-sectional view of an electronic device (5101) in a folded state according to one embodiment of the present disclosure. Fig. 14 is an enlarged view of a portion of Fig. 13. Fig. 15 illustrates sound propagation paths (C1, O4) generated from a speaker (500) in a folded state of an electronic device (5101) according to one embodiment of the present disclosure.

[0172] The description of components (e.g., overlap portion (311), duct (316), flow portion (3161), or inlet portion (3162)) described with reference to FIGS. 1 to 12 can be substantially identically applied to components of the same name (e.g., overlap portion (311`), duct (316`), flow portion (3161`), or inlet portion (3162`)) illustrated in FIGS. 13 to 15, to the extent that they are not arranged with each other.

[0173] Referring to FIGS. 13 and 14 , an electronic device (5101) according to one embodiment of the present disclosure may include a duct (316`). The duct (316`) may be positioned in an overlap portion (311`). A flow path portion (3161`) may pass through the overlap portion (311`). As an example, at least a portion of sound generated from a speaker (500) may be transmitted to a second speaker hole (311b) through the flow path portion (3161`).

[0174] According to one embodiment of the present disclosure, the third internal space (210d) of the electronic device (101) and the interior of the flow path portion (3161`) may be spatially connected to each other through the inlet portion (3162`). As an example, the inlet portion (3162`) may include a breathable mesh. For example, the inlet portion (3162`) may be formed of a material that is impermeable and breathable. The inlet portion (3162`) may block the inflow of foreign substances.

[0175] According to one embodiment of the present disclosure, the third internal space (210d) of the electronic device (5101) may be a space between the first display (230) and the first housing (310). As an example, the third internal space (210d) may be a space between the first area (231a) of the first display (230) and the bracket assembly (312, the first bracket assembly (217) of FIG. 4) of the first housing (310).

[0176] According to one embodiment of the present disclosure, the inlet portion (3162`) of the duct (316`) may be located at one end of the flow path portion (3161`). The connecting hole (311a) of the overlap portion (311`) may be located at the other end of the flow path portion (3161`).

[0177] According to one embodiment of the present disclosure, sound generated from the speaker (500) can be propagated along a first closed path (C1) and an open path (or a fourth open path, O4). As an example, the fourth open path (O4) can include a third internal space (210d), an inlet portion (3162`) of a duct (316`), a flow path portion (3161`), a connection hole (311a) of an overlap portion (311`), a second internal space (311d), and a second speaker hole (311b). As another example, sound generated from the speaker (500) can be radiated to the outside of the electronic device (5101) by sequentially passing through the third internal space (210d), the second internal space (311d), and the second speaker hole (311b) without passing through the duct (316`).

[0178] According to one embodiment of the present disclosure, an electronic device (5101) may include a heat dissipation sheet (610, 620). The heat dissipation sheet (610, 620) may transfer heat accumulated in a high-temperature region (e.g., a region where a printed circuit board (216) of FIG. 4 is disposed) inside the electronic device (5101) to a low-temperature region (e.g., a region where a first battery (215) of FIG. 4 is disposed). For example, the heat dissipation sheet (610, 620) may be a sheet of a thermally conductive metal (e.g., copper, aluminum, etc.).

[0179] According to one embodiment of the present disclosure, the open path (O4) may extend across the heat dissipation sheets (610, 620). The heat dissipation sheet (610) may include a first heat dissipation sheet (610) and a second heat dissipation sheet (620) positioned on both sides of the open path (O4). A portion of the open path (O4) corresponding to the third internal space (210d) may be positioned between the first heat dissipation sheet (610) and the second heat dissipation sheet (620).

[0180] According to one embodiment of the present disclosure, an electronic device (5101) may include an adhesive member (710, 720, 730, 810, 820). The adhesive member (710, 720, 730, 810, 820) may be disposed between the first display (230) and the bracket assembly (312). The first region (231a) of the first display (230) may be attached to the bracket assembly (312) of the first housing (310) by the adhesive member (710, 720, 730, 810, 820). A space (e.g., the third internal space (210d) of the open path (O4)) surrounded by the adhesive member (710, 720, 730, 810, 820) can be made waterproof and dustproof by the adhesive member (710, 720, 730, 810, 820). As an example, the adhesive member (710, 720, 730, 810, 820) can be a double-sided tape (e.g., Poron tape) containing a low-density elastomer.

[0181] According to one embodiment of the present disclosure, the adhesive member (710, 720, 730, 810, 820) may include a first adhesive member (710) that at least partially surrounds components of the electronic device (5101) (e.g., a camera device (251) and / or a speaker (500)).

[0182] According to one embodiment of the present disclosure, the adhesive members (710, 720, 730, 810, 820) may include a second adhesive member (720) and a third adhesive member (730) that partially define an open path (O4). As an example, the second adhesive member (720) and the third adhesive member (730) may define a portion of the open path (O4) between the speaker (500) and the inlet portion (3162') of the duct (316'). According to one embodiment of the present disclosure, the shape of a portion of the open path (O4) defined by the second adhesive member (720) and the third adhesive member (730) may be determined depending on the relative positions of the speaker (500) and the inlet portion (3162') of the duct (316'). As an example, FIG. 15 illustrates a case where the open path (O4) is partially bent.

[0183] FIG. 16 shows a call appearance of an electronic device (101) in a folded state according to one embodiment of the present disclosure.

[0184] Referring to FIGS. 9 and 16, an electronic device (101) according to one embodiment of the present disclosure may include a sound emitting portion (S1, S2) and a sound sensing portion (M). A user may make a call by hearing a voice through the sound emitting portion (S1, S2) and transmitting a voice through the sound sensing portion (M).

[0185] According to one embodiment of the present disclosure, the first sound radiating portion (S1) may be a first speaker hole (245). The second sound radiating portion (S2) may be a second speaker hole (311b) or a notch (344). A portion of the sound generated from the speaker (500) may be transmitted to the first sound radiating portion (S1) along the first closed path (C1). A portion of the sound generated from the speaker (500) may be transmitted to the second sound radiating portion (S2) along the second open path (O2) and may be radiated to the outside of the electronic device (101).

[0186] According to one embodiment of the present disclosure, the sound detection portion (M) may be a microphone hole (243, see FIGS. 2 and 3). Through the sound detection portion (M), sounds from outside the electronic device (101) may be transmitted to a microphone module (R, see FIG. 5) inside the electronic device (101).

[0187] When the electronic device (101) according to one embodiment of the present disclosure is in a folded state, the second sound emitting portion (S2) and the sound sensing portion (M) may be positioned at edges of the electronic device (101) facing each other. FIG. 16 illustrates, as an example, a case where the second sound emitting portion (S2) is positioned close to the user's ear, and the sound sensing portion (M) is positioned close to the user's mouth. Accordingly, the user can make a call while the electronic device (101) is in a folded state.

[0188] Fig. 17 is a cross-sectional view of an electronic device (101) in an unfolded state according to one embodiment of the present disclosure. Fig. 18 is an enlarged view of a portion of Fig. 17.

[0189] Referring to FIGS. 17 and 18, when the electronic device (101) is in an unfolded state, the overlapping portion (311) and one side (261) of the hinge cover (260) may overlap each other. When the electronic device (101) is in an unfolded state, one side (261) of the hinge cover (260) may at least partially cover the connection hole (311a) and the second speaker hole (311b). When the electronic device (101) is in an unfolded state, the opposing surface (311e) of the overlapping portion (311) of the first housing (310) may face the outer surface of one side (261) of the hinge cover (260). When the electronic device (101) is in an unfolded state, the connection hole (311a) and the second speaker hole (311b) can be shielded by one side (261) of the hinge cover (260). Sealing of the second speaker hole (311b) by one side (261) of the hinge cover (260) can cause sound from the speaker (500) to be directed toward the first speaker hole (245).

[0190] According to one embodiment of the present disclosure, when the electronic device (101) is in an unfolded state, a portion of the sound generated from the speaker (500) may be transmitted to the connection hole (311a) along the second closed path (C2). Since the connection hole (311a) and the second speaker hole (311b) are covered by one side (261) of the hinge cover (260), the sound transmitted along the second closed path (C2) may not be emitted to the outside of the electronic device (101) or may be reduced.

[0191] According to one embodiment of the present disclosure, when the electronic device (101) is in an unfolded state, the damper (400, see FIG. 5) can be spaced apart from the first speaker hole (245). A portion of the sound generated from the speaker (500) can be transmitted to the first speaker hole (245) along the first open path (O1) and radiated to the outside of the electronic device (101). The first open path (O1) is a path along which the sound generated from the speaker (500) is radiated to the outside of the electronic device (101), and can be referred to as a first sound output path (O1).

[0192] As a result, a single speaker (500) can be a sound source in both the folded and unfolded states, and there is one open speaker hole configured to output the sound of the speaker to the outside in each state.

[0193] FIG. 19 shows a call appearance of an electronic device (101) in an unfolded state according to one embodiment of the present disclosure.

[0194] Referring to FIGS. 18 and 19, a portion of the sound generated from the speaker (500) may be transmitted to the first sound radiating portion (S) along the first open path (O1) and may be radiated to the outside of the electronic device (101). A portion of the sound generated from the speaker (500) may be transmitted to the connecting hole (311a) along the second closed path (C2), but since the connecting hole (311a) and the second speaker hole (311b) are covered by the hinge cover (260), the sound may not be radiated to the outside of the electronic device (101) or may be reduced.

[0195] When the electronic device (101) according to one embodiment of the present disclosure is in an unfolded state, the first sound emitting portion (S1) and the sound sensing portion (M) can be positioned at two edges of the electronic device (101) that face each other. FIG. 19 illustrates, as an example, a case where the first sound emitting portion (S1) is positioned close to the user's ear area, and the sound sensing portion (M) is positioned close to the user's mouth area.

[0196] FIG. 20 is a cross-sectional view of an electronic device (101) in a partially folded state or partially unfolded state according to one embodiment of the present disclosure. FIG. 21 is an enlarged view of a portion of FIG. 20.

[0197] Referring to FIGS. 20 and 21, when the electronic device (101) is in a partially folded state, the overlapping portion (311) and one side (261) of the hinge cover (260) may partially overlap. For example, when the electronic device (101) is in a partially folded state, one side (261) of the hinge cover (260) may cover the second speaker hole (311b). When the electronic device (101) is in a partially folded state, a part of the opposing surface (311e) of the overlapping portion (311) of the first housing (310) may face a part of the outer surface of one side (261) of the hinge cover (260).

[0198] According to one embodiment of the present disclosure, when the electronic device (101) is in a partially folded state, a portion of the sound generated from the speaker (500) may be transmitted to the second internal space (311d) of the overlapping portion (311) of the first housing (310) along the partially closed path (P). Even if the connection hole (311a) is open and not covered by one side (261) of the hinge cover (260), the second speaker hole (311b) is covered by one side (261) of the hinge cover (260), so that the sound transmitted along the partially closed path (P) may not be emitted to the outside of the electronic device (101) or may be reduced. The partially closed path (P) may be referred to as a third closed path (P).

[0199] According to one embodiment of the present disclosure, when the electronic device (101) is in a partially folded state, the damper (400, see FIG. 5) can be spaced apart from the first speaker hole (245). A portion of the sound generated from the speaker (500) can be transmitted to the first speaker hole (245) along the first open path (O1) and radiated to the outside of the electronic device (101).

[0200] FIG. 22 shows a call appearance of an electronic device (101) in a partially folded state according to one embodiment of the present disclosure.

[0201] Referring to FIGS. 21 and 22, when the electronic device (101) is in a partially folded state, a portion of the sound generated from the speaker (500) may be transmitted to the first sound radiating portion (S) along the first open path (O1) and may be radiated to the outside of the electronic device (101). When the electronic device (101) is in a partially folded state, a portion of the sound generated from the speaker (500) may be transmitted to the second internal space (311d) of the overlapping portion (311) of the first housing (310) along the partially closed path (P). However, since the second speaker hole (311b) is covered by the hinge cover (260), the sound may not be radiated to the outside of the electronic device (101) or may be reduced.

[0202] When the electronic device (101) according to one embodiment of the present disclosure is in a partially folded state, the first sound emitting portion (S1) and the sound sensing portion (M) may be positioned at two edges of the electronic device (101) that face each other. FIG. 22 illustrates, as an example, a case where the first sound emitting portion (S1) is positioned close to the user's ear area, and the sound sensing portion (M) is positioned close to the user's mouth area.

[0203] FIG. 23 is a perspective view of an electronic device (1101) in a folded state according to one embodiment of the present disclosure. The description of components (e.g., electronic device (101) or hinge cover (260)) described with reference to FIGS. 1 to 22 may be equally applied to components of the same name (e.g., electronic device (1101) or hinge cover (1260)) illustrated in FIG. 23, to the extent that they are not arranged with each other.

[0204] Referring to FIG. 23, according to one embodiment of the present disclosure, an electronic device (1101) may include a microphone hole (1264). The microphone hole (1264) may be formed in a hinge cover (1260). The microphone hole (1264) allows sounds from outside the electronic device (1101) to enter the interior of the electronic device (1101) through the microphone hole (1264). The sounds entering the interior of the electronic device (1101) through the microphone hole (1264) may be transmitted to a microphone module (R, see FIG. 5).

[0205] According to one embodiment of the present disclosure, at least one microphone hole (1264) may be formed in the hinge cover (1260). The microphone hole (1264) may be located near the center of the hinge cover (1260). The exterior and interior of the hinge cover (1260) may be spatially connected to each other through the microphone hole (1264).

[0206] Fig. 24 is a cross-sectional view of a portion of an electronic device (1101) according to one embodiment of the present disclosure. The description of components (e.g., flexible connecting member (280), hinge cover (260)) described with reference to Figs. 1 to 22 may be equally applied to components of the same name (e.g., flexible connecting member (1280) and hinge cover (1260)) illustrated in Fig. 24, to the extent that they are not arranged with each other.

[0207] Referring to FIG. 24, a hinge cover (1260) according to one embodiment of the present disclosure may include one side (1261) adjacent to an overlapping portion (311) of a first housing (310). The hinge cover (1260) may include one side (1262) adjacent to an overlapping portion (321) of a second housing (320). The hinge cover (1260) may include a central portion (1263) between one side (1261) and the other side (1262).

[0208] According to one embodiment of the present disclosure, the central portion (1263) may include a microphone hole (1264). An inner surface of the central portion (1263) of the hinge cover (1260) may be recessed toward the exterior of the hinge cover (1260). A microphone module (1284) may be placed in the recessed area of ​​the central portion (1263).

[0209] According to one embodiment of the present disclosure, the microphone module (1284) may be configured to detect sound introduced into the inside of the hinge cover (1260) through the microphone hole (1264). The microphone module (1284) may be disposed on the flexible connecting member (1280).

[0210] According to one embodiment of the present disclosure, the flexible connecting member (1280) may include a first portion (1283) facing a central portion (1263) of the hinge cover (1260). The flexible connecting member (1280) may include a second portion (1281) extending from the first portion (1283) toward the inside of the first housing (310). The flexible connecting member (1280) may include a third portion (1282) extending from the first portion (1283) toward the inside of the second housing (320).

[0211] According to one embodiment of the present disclosure, a microphone module (1284) may be arranged in a first portion (1283) of a flexible connecting member (1280). As an example, the microphone module (1284) may be connected to a processor (e.g., processor (120) of FIG. 1) or a battery (215 or 315, see FIG. 5) via the flexible connecting member (1280). The first portion (1283) of the flexible connecting member (1280) may include a through hole (1283a). External sounds of the electronic device (1101) may sequentially pass through the microphone hole (1264) and the through hole (1283a) and be transmitted to the microphone module (R).

[0212] According to one embodiment of the present disclosure, the through hole (1283a) formed in the flexible connecting member (1280) may be a slot formed long along the longitudinal direction of the signal line included in the flexible connecting member (1280). As an example, the through hole (1283a) may be a slot extended long along the longitudinal direction of the flexible connecting member (1280) (e.g., the Y-axis direction of FIG. 4).

[0213] According to one embodiment of the present disclosure, the first part (1283) of the flexible connecting member (1280) can be coupled to the inner surface of the central part (1263) of the hinge cover (1260) via the coupling member (1285). As an example, the coupling member (1285) can be a double-sided tape, and the first part (1283) of the flexible connecting member (1280) can be adhered to the inner surface of the central part (1263) of the hinge cover (1260) via the coupling member (1285).

[0214] According to one embodiment of the present disclosure, when the electronic device (1101) is in a folded state, the first microphone hole (1264) and the second microphone holes (241, 243) formed in the hinge cover (1260) are spaced apart from each other, so that the sounds detected by the plurality of microphone holes (1264, 241, 243) can be compared to easily remove background noise detected around the electronic device (1101) during recording or calling.

[0215] FIG. 25 is a rear view of an electronic device (2101, 3101, 4101) in a folded state according to one embodiment of the present disclosure. FIG. 26 is a cross-sectional view of a portion of the electronic device (2101) taken along the BB` cutting line of FIG. 25.

[0216] The description of the components described with reference to FIGS. 2 to 23 (e.g., the electronic device (101), the second display (239), the camera device (253), the sensor module (255), the first housing (310), the other side (317) of the first housing (310), the first bracket assembly (312), or the first rear cover (240)) can be substantially identically applied to the components with the same names illustrated in FIG. 26 (e.g., the electronic device (2101), the second display (239), the camera device (253), the sensor module (255), the first housing (2310), the other side (2317) of the first housing (2310), the first bracket assembly (2312), or the rear cover (2240)) to the extent that they are not arranged with each other. Referring to FIGS. 25 and 26, the first housing (2310) of the electronic device (2101) according to one embodiment of the present disclosure includes the first bracket It may include an assembly (2312) and a second side (2317) connected to the first bracket assembly (2312). The speaker (500) may be placed in the first bracket assembly (2312).

[0217] According to one embodiment of the present disclosure, an electronic device (2101) may include a back cover (2240). A notch (2244) may be formed at an edge of the back cover (2240) adjacent to the other side (2317) of the first housing (2310). The notch (2244) may be positioned adjacent to the other side (2317) of the first housing (2310). A first speaker hole (245) may be positioned adjacent to the other side (2317) of the first housing (2310). As an example, the notch (2244) and the first speaker hole (245) may be positioned at two opposite points of the first housing (2310).

[0218] According to one embodiment of the present disclosure, the electronic device (2101) may include a duct structure (2318). The duct structure (2318) may be disposed on the other side (2317) of the first housing (2310). As an example, the duct structure (2318) may be a passage penetrating the other side (2317) of the first housing (2310). One side of the duct structure (2318) may support an edge of the rear cover (2240). As an example, the duct structure (2318) may be adhered to the edge of the rear cover (2240) via an adhesive member.

[0219] According to one embodiment of the present disclosure, the duct structure (2318) may extend from the first decorative cover (218) in a direction toward the notch (2244) of the rear cover (2240) (e.g., the -Z-axis direction of FIG. 4). As an example, the duct structure (2318) may be positioned between the notch (2244) and the first speaker hole (245).

[0220] According to one embodiment of the present disclosure, a portion of the sound radiated from the diaphragm (520, see FIG. 7) of the speaker (500) may be transmitted to the first speaker hole (245) along the first closed path (C1), but may not be radiated to the outside of the electronic device (2101), but may be reflected into the inside of the electronic device (2101) by the damper (400).

[0221] According to one embodiment of the present disclosure, the third open path (O3) may include a duct structure (2318). A portion of sound radiated from a diaphragm (520, see FIG. 7) of a speaker (500, see FIGS. 7 and 8) may be transmitted along the third open path (O3) to a notch (2244) and radiated to the outside of the electronic device (2101). The duct structure (2318) may be spatially connected to the outside of the electronic device (2101) through the notch (2244).

[0222] According to one embodiment of the present disclosure, the electronic device (2101) may include a cap (560). The cap (560) may partially surround the speaker (500). The cap (560) may contact a pad (553) of the speaker (500). The pad (553) may be configured to be compressed by the cap (560).

[0223] Fig. 27 is a cross-sectional view of a portion of an electronic device (3101) taken along the line BB` of Fig. 25. The description of components (e.g., the first housing (2310), the rear cover (2240), the notch (2244), the third open path (O3)) described with reference to Fig. 26 can be substantially identically applied to components having the same reference numerals as those depicted in Fig. 27. The electronic device (3101) depicted in Fig. 27 differs from the electronic device (2101) depicted in Fig. 26 in that a speaker module (1500) is arranged instead of a speaker (500).

[0224] The description of the components described with reference to FIGS. 2 to 23 (e.g., the electronic device (101), the second display (239), the first housing (310), the other side (317) of the first housing (310), the first bracket assembly (312), or the first rear cover (240)) can be substantially identically applied to the components of the same name illustrated in FIG. 27 (e.g., the electronic device (3101), the second display (239), the first housing (2310), the other side (2317) of the first housing (2310), the first bracket assembly (2312), or the rear cover (2240)) to the extent that they are not arranged with each other.

[0225] Referring to FIGS. 25 and 27, a first housing (2310) of an electronic device (2101) according to one embodiment of the present disclosure may include a first bracket assembly (2312) and a second side (2317) connected to the first bracket assembly (2312). A speaker module (1500) may be disposed in the first bracket assembly (2312).

[0226] An electronic device (3101) according to one embodiment of the present disclosure may include a speaker module (1500). The speaker module (1500) may be disposed in a first bracket assembly (2312) of a first housing (2310). The speaker module (1500) may include a vibration generating unit (1530) (e.g., the vibration generating unit (530) of FIG. 7) and a vibration plate (1520) (e.g., the vibration plate (520) of FIG. 7). The vibration generating unit (1530) may include a magnet (not shown) that forms a magnetic field and a coil (not shown) configured to reciprocate by the magnet. The vibration generating unit (1530) causes the vibration plate (1520) to vibrate, thereby radiating sound.

[0227] According to one embodiment of the present disclosure, a speaker module (1500) may include a resonance housing (1510). The resonance housing (1510) may form a resonance space (RS). Sound generated by a vibration generating unit (1530) of the speaker module (1500) may resonate in the resonance space (RS).

[0228] According to one embodiment of the present disclosure, a portion of the sound radiated from the diaphragm (1520) of the speaker module (1500) may be transmitted to the first speaker hole (245) along the first closed path (C1), but may not be radiated to the outside of the electronic device (3101) and may be reflected into the inside of the electronic device (3101) by the damper (400).

[0229] According to one embodiment of the present disclosure, the third open path (O3) may include a duct structure (2318). A portion of the sound radiated from the diaphragm (1520) of the speaker module (1500) may be transmitted along the third open path (O3) to the notch (2244) and radiated to the outside of the electronic device (3101). The duct structure (2318) may be spatially connected to the outside of the electronic device (3101) through the notch (2244).

[0230] FIG. 28 is a cross-sectional view of a portion of the electronic device (4101) taken along the BB` cutting line of FIG. 25.

[0231] The description of the components described with reference to FIGS. 2 to 23 (e.g., the electronic device (101), the second display (239), the first housing (310), the other side (317) of the first housing (310), the first bracket assembly (312), or the first rear cover (240)) can be substantially identically applied to the components of the same name illustrated in FIG. 28 (e.g., the electronic device (4101), the second display (239), the first housing (3310), the one side (3317) of the first housing (3310), the first bracket assembly (3312), or the rear cover (2240)) to the extent that they are not arranged with each other.

[0232] Referring to FIGS. 25 and 28, a first housing (3310) of an electronic device (4101) according to one embodiment of the present disclosure may include a first bracket assembly (3312) and a second side (3317) connected to the first bracket assembly (2312). A speaker (500) may be placed in the first bracket assembly (3312).

[0233] According to one embodiment of the present disclosure, an electronic device (4101) may include a rear cover (2240). A notch (2244) may be formed at an edge of the rear cover (2240) adjacent to the other side (3317) of the first housing (3310). The notch (2244) may be positioned adjacent to the other side (3317) of the first housing (3310). A first speaker hole (245) may be positioned adjacent to the other side (3317) of the first housing (3310). As an example, the notch (2244) and the first speaker hole (245) may be positioned at two opposite points of the first housing (3310).

[0234] According to one embodiment of the present disclosure, the electronic device (4101) may include a duct structure (3318). Through the duct structure (3318), sound radiated through the vent portion (551, 552, see FIG. 8) of the speaker (500) may be transmitted to the notch (2244). As an example, the duct structure (3318) may be a part of the other side (3317) of the first housing (3310). As another example, the duct structure (3318) may be formed by the other side (3317) of the first housing (3310) and the cap (3560). According to one embodiment of the present disclosure, sound radiated from the vent portion (551, 552, see FIG. 8) of the speaker (500) and sound radiated from the diaphragm (520, see FIG. 7) of the speaker (500) may not overlap. As an example, a space (e.g., a first closed path (C1)) through which sound radiated from a diaphragm (520) of a speaker (500) is transmitted and a space (e.g., a fifth open path (O5)) through which sound radiated through a vent portion (551, 552) is transmitted can be spatially separated by the other side (3317) of the first housing (3310).

[0235] According to one embodiment of the present disclosure, an electronic device (4101) may include a cap (3560). The cap (3560) may partially surround a speaker (500). The cap (3560) may contact a pad (553) of the speaker (500). The pad (553) may be configured to be compressed by the cap (560).

[0236] According to one embodiment of the present disclosure, the cap (3560) may include a coupling portion (3561) coupled with the first bracket assembly (3312). The coupling portion (3561) of the cap (3560) may be coupled to the first bracket assembly (3312) via a coupling member (W). When the coupling portion (3561) is coupled by the coupling member (W), the cap (3560) may be brought into close contact with the pad (553) of the speaker (500). When the coupling portion (3561) is coupled by the coupling member (W), the spatial connection between the surrounding space of the vent portions (551, 552) and the internal space of the electronic device (4101) (e.g., the first internal space (210c) of FIG. 5) may be blocked. Accordingly, sound radiated through the vent portions (551, 552) may be focused on the duct structure (3318).

[0237] According to one embodiment of the present disclosure, sound radiated through the vent portion (551, 552, see FIG. 8) of the speaker (500) may be transmitted to the notch (2244) along the fifth open path (O5) and radiated to the outside of the electronic device (4101). The fifth open path (O5) may include a duct structure (3318). The duct structure (3318) of the first housing (3310) and the external space of the electronic device (4101) may be spatially connected to each other through the notch (2244).

[0238] According to one embodiment of the present disclosure, a portion of the sound radiated from the diaphragm (520, see FIG. 7) of the speaker (500) may be transmitted to the first speaker hole (245) along the first closed path (C1), but may be reflected into the interior of the electronic device (4101) instead of being radiated to the outside of the electronic device (4101) by the damper (400).

[0239] In the case of foldable electronic devices that fold or unfold along a predetermined axis, the positions of electronic components (e.g., speakers or microphones) within the electronic device vary depending on the degree of folding. Accordingly, extensive research is being conducted to improve the functionality (e.g., sound emission, sound detection, or calling) of these electronic components in states defined by the degree of folding of the electronic device.

[0240] The problem to be solved in the present disclosure is that the sound output from the electronic device may be radiated from different parts of the electronic device when the electronic device is in an unfolded state and a folded state.

[0241] A problem to be solved in the present disclosure may be to enable a call when an electronic device is in a folded state and an unfolded state.

[0242] The problem to be solved in this disclosure is not limited to the problem mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0243] According to various embodiments of the present disclosure, by forming an acoustic passage open to the outside of the electronic device when the electronic device is in a folded state, the volume and sound quality of the electronic device can be improved when the electronic device is in a folded state.

[0244] According to various embodiments of the present disclosure, the sound path that is open when the electronic device is folded is covered when the electronic device is unfolded, thereby minimizing degradation in call quality when the electronic device is unfolded. Furthermore, by selectively opening one speaker hole and blocking another speaker hole depending on the folded / unfolded state of the device, sound is transmitted only through a desired path and blocked from other paths, thereby controlling sound leakage and improving sound quality and directionality.

[0245] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0246] According to one embodiment of the present disclosure, an electronic device (101) includes a foldable housing (310, 320) including a first housing (310) and a second housing (320).

[0247] According to one embodiment of the present disclosure, an electronic device (101) may include a hinge structure (270) that provides a folding axis (A) of a foldable housing (31, 320).

[0248] According to one embodiment of the present disclosure, the hinge structure (270) may be configured such that the first housing (310) and the second housing (320) are coupled to rotate around the folding axis (A).

[0249] According to one embodiment of the present disclosure, an electronic device (101) may include a hinge cover (260; 1260) configured to be partially accommodated within the foldable housing (310, 320).

[0250] According to one embodiment of the present disclosure, an electronic device (101) may include a speaker (500) disposed in a first internal space (210c) of the first housing (310).

[0251] According to one embodiment of the present disclosure, the first housing (310) may include a side wall (314) surrounding at least a portion of the first internal space (210c).

[0252] According to one embodiment of the present disclosure, the side wall (314) may include a first portion (311) configured to overlap with the hinge cover (260; 1260).

[0253] According to one embodiment of the present disclosure, the first housing (310) may include a connecting hole (311a) located in the first portion (311).

[0254] According to one embodiment of the present disclosure, the connecting hole (311a) can connect the first internal space (210c) and the second internal space (311d) of the first part (311).

[0255] According to one embodiment of the present disclosure, the first housing (310) may include a second speaker hole (311b) located in the first portion (311).

[0256] According to one embodiment of the present disclosure, the second speaker hole (311b) can communicate the exterior of the electronic device (101) and the second internal space (311d) of the first part (311).

[0257] According to one embodiment of the present disclosure, when the foldable housing (310, 320) is folded so that the first housing (310) and the second housing (320) face each other, the connection hole (311a) and the second speaker hole (311b) can be opened.

[0258] According to one embodiment of the present disclosure, the connection hole (311a) may be spaced apart from the second speaker hole (311b) along the direction in which the first housing (310) is folded with respect to the folding axis (A).

[0259] According to one embodiment of the present disclosure, when the foldable housing (310, 320) is partially folded so that the first housing (310) is inclined with respect to the second housing (320), the second speaker hole (311b) overlaps with the hinge cover (260; 1260), and the connection hole (311a) can be opened.

[0260] According to one embodiment of the present disclosure, the outer surface of the first part (311) where the connection hole (311a) and the second speaker hole (311b) are located and the outer surface of the hinge cover (260; 1260) accommodated inside the first housing (310) may be adjacent to each other.

[0261] According to one embodiment of the present disclosure, the outer surface of the first portion (311) may be formed to correspond to a part of the outer surface of the hinge cover (260).

[0262] According to one embodiment of the present disclosure, the electronic device (101) may include a first display (230) including a first area (231a) supported by the first housing (310), a second area (231b) supported by the second housing (320), and a folding area (231c) disposed between the first area (231a) and the second area (231b).

[0263] According to one embodiment of the present disclosure, the electronic device (101) may include a second display (239) facing the first display (230) on the first housing (310).

[0264] According to one embodiment of the present disclosure, the second speaker hole (311b) may be located around the second display (239).

[0265] According to one embodiment of the present disclosure, a rear cover (240) covering the second display (239) may be included.

[0266] According to one embodiment of the present disclosure, the rear cover (240) may have an edge supported by a side wall (314) of the first housing (310).

[0267] According to one embodiment of the present disclosure, the rear cover (240) may have a notch (244) formed on an edge corresponding to the second speaker hole (311b).

[0268] According to one embodiment of the present disclosure, the connecting holes (311a) are provided in pairs and can be positioned symmetrically with respect to the center of the notch (244).

[0269] According to one embodiment of the present disclosure, a duct (316) extending from the boundary of the connecting hole (311a) toward the first internal space (210c) may be included.

[0270] According to one embodiment of the present disclosure, the duct (316) can be opened into the first internal space (210c).

[0271] According to one embodiment of the present disclosure, the electronic device (101) may include a sealer (315) disposed at an edge (311c) of the first portion (311).

[0272] According to one embodiment of the present disclosure, the sealer (315) can seal between the edge (311c) of the first portion (311) and the hinge cover (260).

[0273] According to one embodiment of the present disclosure, the second speaker hole (311b) may be spaced apart from the sealer (315) toward the connection hole (311a).

[0274] According to one embodiment of the present disclosure, the second speaker hole (311b) may be located between the sealer (315) and the connecting hole (311a) in the rotational direction of the first housing (310) based on the folding axis (A).

[0275] According to one embodiment of the present disclosure, the electronic device (1101) may include a flexible connecting member (1280) extending from the interior of the first housing (310) to the interior of the second housing (320) through the inner side of the hinge cover (260).

[0276] According to one embodiment of the present disclosure, the electronic device (1101) may include a first microphone module (1284) disposed on the flexible connecting member (1280) and positioned on the inner side of the hinge cover (1260).

[0277] According to one embodiment of the present disclosure, the electronic device (1101) may include a microphone hole (1264) formed in the hinge cover (1260).

[0278] According to one embodiment of the present disclosure, the flexible connecting member (1280) may include a through hole (1283a) located between the microphone hole (1264) and the first microphone module (1284).

[0279] According to one embodiment of the present disclosure, the electronic device (101) may include a second microphone module (R) disposed inside the second housing (320).

[0280] According to one embodiment of the present disclosure, the electronic device (101) may include a microphone hole (243) formed at an edge of the second housing (320) facing the hinge cover (260).

[0281] According to one embodiment of the present disclosure, an electronic device (2101) may include a foldable housing (2310, 320) including a first housing (2310) and a second housing (320).

[0282] According to one embodiment of the present disclosure, the electronic device (2101) may include a hinge structure (270) in which the first housing (2310) and the second housing (320) are coupled to rotate about the folding axis (A).

[0283] According to one embodiment of the present disclosure, the electronic device (2101) may include a speaker (500) disposed inside the first housing (2310).

[0284] According to one embodiment of the present disclosure, the electronic device (2101) may include a rear cover (2240) forming a first side of the electronic device (2101).

[0285] According to one embodiment of the present disclosure, the rear cover (2240) may include a notch (2244) at an edge that connects the exterior of the electronic device (2101) and the interior of the first housing (2310).

[0286] According to one embodiment of the present disclosure, the electronic device (2101) may include a first speaker hole (245) facing the notch (2244) with respect to the first housing (2310).

[0287] According to one embodiment of the present disclosure, the first speaker hole (245) can communicate the internal space of the first housing (2310) with the exterior of the electronic device (2101).

[0288] According to one embodiment of the present disclosure, the electronic device (2101) may include a damper (400) disposed at an edge of the second housing (320).

[0289] According to one embodiment of the present disclosure, the damper (400) may be configured to overlap the first speaker hole (245) when the foldable housing (2310, 320) is folded.

[0290] According to one embodiment of the present disclosure, the damper (400) may be formed to correspond to the shape of the first speaker hole (245).

[0291] According to one embodiment of the present disclosure, an electronic device (2101) may include a first display (230) including a first area (231a) supported by the first housing (2310), a second area (231b) supported by the second housing (320), and a folding area (231c) disposed between the first area (231a) and the second area (231b).

[0292] According to one embodiment of the present disclosure, the electronic device (2101) may include a second display (239) facing the first display (230) on the first housing (2310).

[0293] According to one embodiment of the present disclosure, the notch (2244) may be positioned around the periphery of the second display (239).

[0294] According to one embodiment of the present disclosure, an electronic device (101) may include a foldable housing (260, 310, 320) including a first housing (310), a second housing (320), and a hinge cover (260) disposed between the first housing (310) and the second housing (320).

[0295] According to one embodiment of the present disclosure, when the foldable housing (260, 310, 320) is unfolded, the first side of the first housing (310) and the second side of the second housing (320) can face the same direction.

[0296] According to one embodiment of the present disclosure, the first side and the second side may be set to face each other when the foldable housing (260, 310, 320) is fully folded.

[0297] According to one embodiment of the present disclosure, the electronic device (101) may include a hinge structure (270) at least partially accommodated in the hinge cover (260) and connected to the first housing (310) and the second housing (320).

[0298] According to one embodiment of the present disclosure, the electronic device (101) may include a flexible display (230) accommodated across the first housing (310), the hinge cover (260), and the second housing (320) so as to be viewed from the same direction.

[0299] According to one embodiment of the present disclosure, the electronic device (101) may include a speaker (500) accommodated in the first housing (310).

[0300] According to one embodiment of the present disclosure, the first housing (310) may include a first speaker hole (245) and a second speaker hole (311b) connected to the speaker (500) through a spatial path (O4) so ​​that sound output from the speaker (500) is transmitted (passed) to the outside of the electronic device.

[0301] According to one embodiment of the present disclosure, the first speaker hole (245) may be formed on the first surface adjacent to the first side (317) of the first housing opposite the hinge cover (260) so as to be at least partially shielded when the foldable housing (260, 310, 320) is fully folded.

[0302] According to one embodiment of the present disclosure, the second speaker hole (311b) may be formed on a third surface opposite the first surface adjacent to the second side (311) of the first housing (310) facing the hinge cover (260) so as to be at least partially shielded when the foldable housing (260, 310, 320) is unfolded.

[0303] According to one embodiment of the present disclosure, the electronic device (101) may include a damper (damper, 400) disposed on a third side of the second housing (320) opposite the hinge cover (260) to at least partially shield the first speaker hole (245) between the first speaker hole (245) and the second housing (320) when the foldable housing (260, 310, 320) is completely folded.

[0304] According to one embodiment of the present disclosure, the second speaker hole (311b) may be set to be at least partially shielded by the hinge cover (260) when the foldable housing (260, 310, 320) is unfolded.

[0305] According to one embodiment of the present disclosure, the second speaker hole (311b) may be set so as not to be shielded by the hinge cover (260) when the foldable housing (260, 310, 320) is folded.

[0306] According to one embodiment of the present disclosure, the first housing (310) may include a first duct formed at least partially between the speaker (500) and the flexible display (230) to guide the sound to the first speaker hole (245).

[0307] According to one embodiment of the present disclosure, the first housing (310) may include a second duct (316) formed at least partially between the speaker (500) and the third surface of the first housing to guide the sound to the second speaker hole (311b).

[0308] According to one embodiment of the present disclosure, the first side (520) of the speaker (500) can be spatially connected to the first speaker hole (245).

[0309] According to one embodiment of the present disclosure, the second side (551, 552) of the speaker (500) can be spatially connected to the second speaker hole (311b).

[0310] According to one embodiment of the present disclosure, the first housing (2310) may include a third speaker hole (2318) formed on the third surface and spatially connected to the speaker (500) and the first speaker hole (245).

[0311] According to one embodiment of the present disclosure, an electronic device (1101) may include a microphone module (1284) at least partially accommodated in the hinge cover (1260).

[0312] According to one embodiment of the present disclosure, the hinge cover (1260) may include a microphone hole (1264).

[0313] According to one embodiment of the present disclosure, the microphone module (1284) may be configured to receive sound from outside the electronic device through the microphone hole (1264).

[0314] Although the detailed description of this document has described specific embodiments, it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of this document.

Claims

1. In electronic devices, First housing (310); Second housing (320); A hinge structure (270) configured to connect the first housing (310) and the second housing (320) and rotate the first housing (310) and the second housing (320); A flexible display (230) placed in the first housing (310) and the second housing (320); A speaker (500) placed in the first housing (310); A first sound output path (O1) configured to be opened when the first housing (310) and the second housing (320) are in an unfolded state, and configured to allow sound output from the speaker (500) to pass to the outside of the electronic device (101) when the first housing (310) and the second housing (320) are in the unfolded state, and including a first speaker hole (245) configured to be at least partially covered when the first housing (310) and the second housing (320) are in the folded state; and A second sound output path (O2) configured to be opened when the first housing (310) and the second housing (320) are in the folded state, and configured to allow sound output from the speaker (500) to pass to the outside of the electronic device (101) when the first housing (310) and the second housing (320) are in the folded state, and including a second speaker hole (311b) configured to be at least partially covered when the first housing (310) and the second housing (320) are in the unfolded state, The above second speaker hole (311b) is an electronic device placed in the first housing (310).

2. In paragraph 1, The second speaker hole (311b) is arranged in a part (311) of the first housing (310) adjacent to the hinge structure (270), An electronic device in which the first speaker hole (245) is positioned around a portion (231a) of the flexible display (230) disposed in the first housing (310).

3. In paragraph 1 or 2, An electronic device further comprising a hinge cover including an extension portion (261) configured to cover at least a portion of the hinge structure (270) and at least partially cover the second speaker hole (311b) when the first housing (310) and the second housing (320) are in an unfolded state.

4. In any one of paragraphs 1 to 3, The first housing (310) of the upper part is When the first housing (310) and the second housing (320) are in an unfolded state, they include an opposing surface (311e) configured to face the extended portion (261). The above second speaker hole (311b) is an electronic device arranged on the opposite surface.

5. In any one of paragraphs 1 to 4, The above second sound output path (O2) is: It further includes a connecting hole (311a) located on the opposing surface (311e) and spaced apart from the second speaker hole (311b) toward the foldable display (230). An electronic device in which, when the first housing (310) and the second housing (320) are folded, the connection hole (311a) and the second speaker hole (311b) are opened.

6. In paragraph 1 or paragraph 5, The above connecting hole (311a) is An electronic device spaced apart from the second speaker hole (311b) along the folding direction of the first housing (310).

7. In any one of paragraphs 1 to 6, The above connecting hole (311a) is An electronic device in which the first housing (310) and the second housing (320) are at least partially covered by the extended portion (261) of the hinge cover (260) when the first housing (310) and the second housing (320) are in an unfolded state.

8. In any one of paragraphs 1 to 7, Further comprising a rear cover (240) opposite to a part (231a) of the flexible display (230) and having an edge supported by the first housing (310), The above second speaker hole (311b) is an electronic device located around the rear cover (240).

9. In any one of paragraphs 1 to 8, The above rear cover (240) is an electronic device having a notch (244) formed on the edge corresponding to the second speaker hole (311b).

10. In any one of paragraphs 1 to 9, Further comprising a display (239) covered by the rear cover, An electronic device in which the above connection hole (311a) is located below the display (239), and the above notch (244) is located around the display (239).

11. In any one of paragraphs 1 to 10, The above first housing (310): a side wall (314) defining an internal space (210c); and It includes an overlapping portion (311) that protrudes from the side wall (314) and includes the opposing surface (311e), The above second sound output path (O2) is: An electronic device including a duct (316) positioned at the above-mentioned overlapping portion (311) and having the above-mentioned connecting hole (311a) formed at one end.

12. In any one of paragraphs 1 to 11, It further includes a sealer (315) that is placed on the edge (311c) of the above-mentioned overlapping portion (311) and seals the space between the edge (311c) of the above-mentioned overlapping portion (311) and the hinge cover (260). The second speaker hole (311b) is an electronic device spaced from the sealer (315) toward the connecting hole (311a).

13. In any one of paragraphs 1 to 12, The above second speaker hole (311b) is An electronic device positioned between the sealer (315) and the connecting hole (311a) in the rotational direction of the first housing (310) with respect to the hinge structure (270).

14. In any one of paragraphs 1 to 13, A flexible connecting member (1280) extending from the inside of the first housing (310) to the inside of the second housing (320) through the inside of the hinge cover (260); A first microphone module (1284) disposed on the flexible connecting member (1280) and located on the inner side of the hinge cover (1260); and An electronic device further comprising a first microphone hole (1264) formed in the hinge cover (1260).

15. In any one of paragraphs 1 to 14, The above flexible connecting member (1280) is An electronic device including a through hole (1283a) located between the first microphone hole (1264) and the first microphone module (1284).

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