Heat dissipation device

Abstract

The present application discloses a heat dissipation device, comprising a bearing plate (10), a cooling frame assembly (20), and a heat dissipation assembly (30). The bearing plate has a supporting surface (11); the cooling frame assembly is arranged on the supporting surface; the cooling frame assembly comprises a main frame (21), a first side frame (22), and a second side frame (23); the main frame, the first side frame and the second side frame define a cooling recess (24); the first side frame and the second side frame are telescopically arranged on two ends of the main frame in a first direction, respectively, so that the lengths of the cooling frame assembly and the cooling recess in the first direction are adjustable; and the heat dissipation assembly is arranged on the bearing plate and used for conveying cold air to the cooling recess. The cooling recess is used for concentrating the cold air, so that most of the cold air can fully act on an electronic device so as to perform effective heat dissipation on the electronic device. The first side frame and the second side frame can be telescopically adjusted in the first direction, so as to adjust the lengths of the cooling frame assembly and the cooling recess in the first direction, so that the heat dissipation device can be compatible with electronic devices of different sizes.

Description

heat sink

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on November 16, 2023, with application number 202311527080.1 and invention name “Radiator”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of heat dissipation technology, and in particular to a radiator. Background Art

[0003] With the rapid development of electronic devices, their variety and functions are increasing, making them indispensable tools for people to work, study, and relax. Due to their portability and ease of use, small electronic devices such as laptops and tablets are becoming increasingly popular.

[0004] As electronic devices such as laptops and tablets become increasingly thinner and lighter, and their integration levels become increasingly higher, the heat generated by the internal components of the electronic devices is more concentrated and difficult to dissipate to the outside of the electronic devices, which can easily cause slow operation or even malfunction. Therefore, in order to improve the heat dissipation performance of electronic devices such as laptops and tablets, radiators are generally used to dissipate heat from such electronic devices.

[0005] When current radiators are used to support and dissipate heat for electronic devices, there is a large gap between the electronic devices and the radiator. Most of the cold air blown out by the radiator easily escapes directly from the gap, making it difficult for the radiator to effectively dissipate heat for the electronic devices, resulting in poor heat dissipation effect. Technical issues

[0006] One of the purposes of the embodiments of the present application is to provide a heat sink to solve the technical problem in the prior art that there is a large gap between the electronic device and the heat sink, making it difficult for the heat sink to effectively dissipate heat from the electronic device. Technical Solutions

[0007] The technical solution adopted in the embodiment of this application is:

[0008] A heat sink is provided, comprising:

[0009] A support plate having a support surface;

[0010] A cooling frame assembly is arranged on the supporting surface; the cooling frame assembly includes a main frame, a first frame and a second frame, and the main frame, the first frame and the second frame enclose a cooling trough; the first frame and the second frame are respectively telescopically arranged at both ends of the main frame along a first direction, so that the length of the cooling frame assembly and the cooling trough in the first direction is adjustable; and a heat dissipation assembly is arranged on the support plate, for delivering cold air to the cooling trough. Beneficial effects

[0011] The beneficial effects of the radiator provided by the embodiment of the present application are: by arranging a cooling frame assembly on the support surface, when the electronic device is placed on the support surface, the cooling frame assembly contacts the heat dissipation surface or the circumferential edge of the heat dissipation air inlet of the electronic device, the heat dissipation assembly is used to continuously deliver cold air to the cooling groove, and the cooling groove is used to gather the cold air, so that most of the cold air can fully act on the electronic device, so as to effectively dissipate the heat of the electronic device, which is beneficial to improving the heat dissipation effect; in addition, by making the first frame and the second frame telescopically adjustable along the first direction, so as to adjust the length of the cooling frame assembly and the cooling groove in the first direction, and then adjust the support range of the cooling frame assembly for the electronic device and the cooling range of the cooling groove for the electronic device, it is achieved that electronic devices of different sizes can be supported more stably and dissipated better, that is, it can be compatible with electronic devices of different sizes, which is beneficial to improving the scope of application and practicality of the radiator. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or exemplary technical descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0013] FIG1 is a schematic diagram of a three-dimensional structure of a radiator provided in an embodiment of the present application;

[0014] FIG2 is a second schematic diagram of the three-dimensional structure of the radiator provided in an embodiment of the present application;

[0015] FIG3 is a schematic diagram of an exploded structure of a radiator provided in an embodiment of the present application;

[0016] FIG4 is a bottom view of the main frame according to an embodiment of the present application;

[0017] FIG5 is a schematic diagram of a partial structure of a cooling frame provided in an embodiment of the present application, wherein the main frame is omitted;

[0018] FIG6 is a second schematic diagram of a partial structure of a cooling frame provided in an embodiment of the present application, wherein the main frame is omitted;

[0019] FIG7 is a third schematic diagram of the three-dimensional structure of the radiator provided in an embodiment of the present application;

[0020] FIG8 is a schematic diagram of a vertical cross-sectional structure of a heat dissipation assembly provided in an embodiment of the present application;

[0021] FIG9 is a schematic diagram of an exploded structure of a radiator provided in an embodiment of the present application;

[0022] FIG10 is a bottom view of the cover plate provided in an embodiment of the present application;

[0023] FIG11 is a schematic diagram of the three-dimensional structure of the baffle and the pressing block provided in an embodiment of the present application;

[0024] FIG12 is a diagram showing the assembly state of the baffle, the pressure block and the cover plate provided in an embodiment of the present application;

[0025] FIG13 is a diagram of the expanded state of the radiator provided in an embodiment of the present application;

[0026] FIG14 is a diagram showing a folded state of the radiator provided in an embodiment of the present application.

[0027] Among them, the reference numerals in the figures are:

[0028] 10. Support plate; 11. Support surface; 12. Mounting surface; 13. Ventilation port; 14. Dust screen; 15. First pad; 16. Second pad; 17. Limiting slot; 18. Movable slot; 20. Cooling frame assembly; 21. Main frame; 211. Stop bar; 212. Bottom plate; 213. Notch; 214. Positioning slot; 22. First frame; 221. First slide; 222. First ridge; 23. Second frame; 231. Second slide; 232. Second ridge; 24. Cooling slot; 25. Adjusting member; 251. First rack; 252. Second rack; 253. Gear; 30. Heat dissipation assembly; 31. Housing; 311. First air inlet; 312. Cold air outlet; 313. Cold air cavity; 314. Second air inlet; 315. Hot air outlet; 316. 6. Heat dissipation cavity; 317. Avoidance; 318. Bottom shell; 319. Bottom cover; 3181. Limiting frame; 32. Cooling guide; 321. Cooling plate; 322. Cooling pipe; 33. Semiconductor refrigeration element; 34. Heat dissipation element; 35. Air supply fan; 36. Cooling fan; 37. Sealing ring; 38. Circuit board; 39. Data cable; 40. Baffle; 50. Cover; 51. Groove; 60. Press block; 61. Positioning protrusion; 70. Folding frame; 71. Base; 72. Connecting rod; 73. Damping shaft; F1, first direction; F2, second direction. Modes for Carrying Out the Invention

[0029] In order to make the purpose, technical solutions and advantages of this application more clearly understood, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit this application.

[0030] It should be noted that when a component is referred to as being "fixed on" or "disposed on" another component, it may be directly on the other component or indirectly on the other component. When a component is referred to as being "connected to" another component, it may be directly or indirectly connected to the other component. The terms "upper", "lower", "left", "right", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of description and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this application. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances. The terms "first" and "second" are only used for the purpose of convenience of description and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. "Multiple" means two or more, unless otherwise clearly and specifically defined.

[0031] Please refer to Figures 1 to 14 together to describe the heat sink provided in the embodiment of the present application. The heat sink is mainly used to support and dissipate heat for portable electronic devices such as laptops and tablet computers.

[0032] Please refer to Figures 1 to 3 . The radiator includes a support plate 10, a cooling frame assembly 20, and a heat dissipation assembly 30. The support plate 10 has a support surface 11; the cooling frame assembly 20 is disposed on the support surface 11; the cooling frame assembly 20 includes a main frame 21, a first side frame 22, and a second side frame 23, which enclose a cooling trough 24. The first side frame 22 and the second side frame 23 are respectively telescopically disposed at both ends of the main frame 21 along a first direction F1, so that the length of the cooling frame assembly 20 and the cooling trough 24 in the first direction F1 is adjustable. The heat dissipation assembly 30 is disposed on the support plate 10 and is used to supply cold air to the cooling trough 24.

[0033] For ease of understanding, the length of the support plate 10 is defined as a first direction F1, and the width of the support plate 10 is defined as a second direction F2, with the second direction F2 being perpendicular to the first direction F1. In the embodiment of the present application, the first direction F1 is the left-right direction, and the second direction F2 is the front-back direction, as shown in Figures 1 and 2.

[0034] Specifically, the support plate 10 is used to support the electronic device, and the cooling frame assembly 20 is used to contact the peripheral edge of the heat dissipation surface or heat dissipation air inlet of the electronic device. The cooling groove 24 enclosed by the main frame 21, the first frame 22, and the second frame 23 on the support surface 11 is used to collect cold air. The cooling groove 24 covers the heat dissipation surface or heat dissipation air inlet of the electronic device, so that most of the cold air can fully act on the electronic device to effectively dissipate heat and cool the electronic device. The heat dissipation assembly 30 is used to continuously supply cold air into the cooling groove 24, so that the radiator can continuously dissipate heat and cool the electronic device.

[0035] It should be noted that in some embodiments, when the electronic device is placed on the support surface 11, the heat dissipation air inlet of the electronic device is correspondingly arranged with the cooling groove 24, so that the cold air in the cooling groove 24 can enter the interior of the electronic device through the heat dissipation air inlet of the electronic device, dissipate heat from the functional components of the electronic device, such as the central processing unit (CPU), and then be discharged from the heat dissipation air outlet of the electronic device. In other embodiments, when the electronic device is placed on the support surface 11, the heat dissipation surface of the electronic device is correspondingly arranged with the cooling groove 24, and a small gap is provided between the electronic device and the cooling frame assembly 20. During the heat dissipation and cooling process of the electronic device, the heat dissipation assembly 30 continuously supplies cold air into the cooling groove 24, causing the air pressure in the cooling groove 24 to be greater than the external air pressure. Therefore, after the cold air in the cooling groove 24 has fully acted on the heat dissipation surface of the electronic device, it can be discharged from the gap between the electronic device and the cooling frame assembly 20 under the action of the air pressure in the cooling groove 24.

[0036] The first frame 22 and the second frame 23 are respectively telescopically arranged at the two ends of the main frame 21 along the first direction F1, which means that the first frame 22 is telescopically arranged at one end of the main frame 21 along the first direction F1, so that the first frame 22 can be telescopically adjusted relative to the main frame 21 along the first direction F1, and the second frame 23 is telescopically arranged at the other end of the main frame 21 along the first direction F1, so that the second frame 23 can be telescopically adjusted relative to the main frame 21 along the first direction F1, thereby achieving adjustable length of the cooling frame assembly 20 and the cooling groove 24 in the first direction F1. By adjusting the length of the cooling frame assembly 20 in the first direction F1, electronic devices of different sizes can be supported. By adjusting the length of the cooling groove 24 in the first direction F1, the range of the effect of the cold air on the electronic device can be adjusted, thereby being able to adapt to electronic devices of different sizes. In addition, by adjusting the cooling range of the cooling groove 24 on the electronic device, it is convenient to accommodate the different positions of the heat dissipation surfaces or heat dissipation air inlets of electronic devices of different sizes. It is understandable that the support range of the cooling frame assembly 20 for the electronic device and the cooling range of the cooling groove 24 for the electronic device can be adjusted according to electronic devices of different sizes by adjusting the first frame 22 and the second frame 23 to extend and retract along the first direction F1.

[0037] For example, the electronic device is a laptop computer, and the first frame 22 and the second frame 23 are in the retracted state. At this time, the cooling frame assembly 20 can adapt to a 14-inch laptop computer, as shown in Figure 1. The first frame 22 and the second frame 23 are in the open state. At this time, the cooling frame assembly 20 can adapt to a 15-inch to 18-inch laptop computer, as shown in Figure 2.

[0038] Compared with the prior art, the radiator provided by the present application is characterized in that a cooling frame assembly 20 is provided on the support surface 11. When the electronic device is placed on the support surface 11, the cooling frame assembly 20 contacts the circumferential edge of the heat dissipation surface or the heat dissipation air inlet of the electronic device. The heat dissipation assembly 30 is used to continuously supply cold air to the cooling groove 24. The cooling groove 24 is used to converge the cold air so that most of the cold air can fully act on the electronic device to effectively dissipate heat for the electronic device, which is beneficial to improving the heat dissipation effect. In addition, according to electronic devices of different sizes, the first frame 22 and the second frame 23 can be telescopically adjusted along the first direction F1 to adjust the length of the cooling frame assembly 20 and the cooling groove 24 in the first direction F1, thereby adjusting the support range of the cooling frame assembly 20 for the electronic device and the cooling range of the cooling groove 24 for the electronic device, thereby achieving more stable support and better heat dissipation for electronic devices of different sizes, that is, it can be compatible with electronic devices of different sizes, which is beneficial to improving the applicability and practicality of the radiator.

[0039] Optionally, the supporting plate 10 may be, but is not limited to, an aluminum alloy plate.

[0040] In some embodiments of the present application, please refer to Figures 3 and 7. The support plate 10 also has a mounting surface 12, which is arranged opposite to the support surface 11. The support plate 10 is provided with a vent 13 that passes through the support surface 11 and the mounting surface 12. The vent 13 is connected to the cooling groove 24. The heat dissipation component 30 is arranged on the mounting surface 12 and is arranged corresponding to the vent 13, so that the cold air output by the heat dissipation component 30 flows to the cooling groove 24 through the vent 13.

[0041] The above technical solution, by arranging the heat dissipation component 30 on the mounting surface 12, facilitates the cold group component to deliver cold air to the cooling slot 24, and at the same time, makes the overall structure of the radiator more compact, which is conducive to reducing the overall volume of the radiator.

[0042] In some embodiments of the present application, referring to FIG. 3 , the radiator further includes a dustproof net 14 , which covers the vent 13 and has a dustproof filtering effect.

[0043] In some embodiments of the present application, referring to Figures 1 and 3 , the heat sink further includes a first pad 15 and a second pad 16 disposed on the support surface 11. The first pad 15 and the second pad 16 are located on opposite sides of the cooling frame assembly 20 along a second direction F2 perpendicular to the first direction F1. The first pad 15, the second pad 16, and the cooling frame assembly 20 cooperate to support the electronic device, thereby improving the stability of the support provided to the electronic device. Furthermore, the first pad 15 and the second pad 16 provide a good anti-slip effect, effectively preventing the electronic device from shaking.

[0044] In some embodiments, referring to Figures 3 and 4, the main frame 21 is provided with a slot 213, the slot 213 is connected to the vent 13 and the cooling slot 24, and the cross-sectional area of ​​the slot 213 is larger than the cross-sectional area of ​​the vent 13, the dustproof net 14 is confined in the slot 213, and a diffusion space is formed between the dustproof net 14 and the support surface 11. Specifically, the dustproof net 14 is adapted to the size of the slot 213. Since the cross-sectional area of ​​the slot 213 is larger than the area of ​​the vent 13, the cross-sectional area of ​​the diffusion space formed between the dustproof net 14 and the support surface 11 is also larger than the cross-sectional area of ​​the vent 13. Therefore, the cold air output by the heat dissipation component 30 first flows into the diffusion space through the vent 13. After part of the cold air diffuses in the diffusion space, it flows into the cooling groove 24 through the dustproof net 14, so that the cold air output by the heat dissipation component 30 can be quickly and evenly diffused into the cooling groove 24, effectively avoiding the situation where the cold air is too concentrated and the local heat dissipation of the electronic equipment is insufficient, which is beneficial to improving the heat dissipation effect of the electronic equipment.

[0045] Optionally, the main frame 21 , the first side frame 22 and the second side frame 23 may be made of, but not limited to, plastic.

[0046] In some embodiments of the present application, referring to Figures 1 and 2, the first frame 22 and the second frame 23 are both slidably disposed along the first direction F1 between the main frame 21 and the support surface 11. It can be understood that by pushing and pulling the first frame 22 and the second frame 23 along the first direction F1, the length of the first frame 22 and the second frame 23 extending from the main frame 21 in the first direction F1 can be changed, thereby adjusting the length of the cooling frame assembly 20 and the cooling groove 24 in the first direction F1.

[0047] Specifically, referring to FIG4 , the main frame 21 includes two relatively spaced-apart baffles 211 and a base plate 212 disposed between the two baffles 211. The baffles 211 are fixed to the support surface 11. Optionally, the baffles 211 are fastened to the support plate 10 using screws. The baffles 211 extend along a first direction F1 and protrude from the base plate 212 away from the support surface 11. The baffles 211 are used to support the electronic device. A first slide groove and a second slide groove are formed between the base plate 212 and the support surface 11. The first slide groove allows the first frame 22 to slide through, and the second slide groove allows the second frame 23 to slide through. A slot 213 is provided on the base plate 212 and is located between the first and second slide grooves and is separated from the first and second slide grooves to prevent cold air at the slot 213 from leaking into the first and second slide grooves.

[0048] Please refer to Figures 5 and 6. The first frame 22 includes a first slide 221 slidingly arranged in a first slide groove along a first direction F1 and a first protrusion 222 connecting the first slide 221. The second frame 23 includes a second slide 231 slidingly arranged in a second slide groove and a second protrusion 232 connecting the second slide 231. The first protrusion 222, the second protrusion 232 and the two blocking bars 211 enclose a cooling groove 24.

[0049] Specifically, the first protrusion 222 is provided at an end of the first slide 221 away from the second frame 23 and protrudes from the first slide 221 in a direction away from the support surface 11. The second protrusion 232 is provided at an end of the second slide 231 away from the first frame 22 and protrudes from the second slide 231 in a direction away from the support surface 11. Thus, the first protrusion 222, the second protrusion 232, and the two blocking bars 211 cooperate to enclose the cooling groove 24.

[0050] By adopting the above technical solution, when the first protrusion 222 is pulled along the first direction F1, the first protrusion 222 drives the first slide plate 221 to gradually extend out of the first slide groove along the first direction F1. When the first protrusion 222 is extended to the outside of the supporting plate 10 along the first direction F1, the first slide plate 221 is used to seal the gap between the bottom of the first protrusion 222 and the supporting plate 10, so as to prevent the cold air in the cooling groove 24 from flowing out of the gap between the bottom of the first protrusion 222 and the supporting plate 10; when the second protrusion 232 is pulled in the direction opposite to the first direction F1, the second protrusion 232 drives the second slide plate 231 to extend in the direction opposite to the first direction F1. 1. When the second protrusion 232 extends to the outside of the supporting plate 10 in a direction opposite to the first direction F1, the second slide plate 231 is used to seal the gap between the bottom of the second protrusion 232 and the supporting plate 10, so as to prevent the cold air in the cooling groove 24 from flowing out of the gap between the bottom of the second protrusion 232 and the supporting plate 10. Therefore, by providing the first slide plate 221 and the second slide plate 231, when the length of the cooling frame assembly 20 and the cooling groove 24 is increased, the loss of cold air in the cooling groove 24 can be effectively reduced, so that the cold air in the cooling groove 24 can more effectively act on the electronic equipment.

[0051] In some embodiments of the present application, please continue to refer to Figures 5 and 6. The cooling frame assembly 20 further includes an adjustment member 25, which is disposed between the main frame 21 and the support surface 11 and between the first side frame 22 and the second side frame 23. The adjustment member 25 includes a first rack 251 connected to the first side frame 22, a second rack 252 connected to the second side frame 23, and a gear 253 engaged with the first rack 251 and the second rack 252. The lengths of the first rack 251 and the second rack 252 both extend along the first direction F1, and the gear 253 is disposed between the first rack 251 and the second rack 252.

[0052] Specifically, the first rack 251 is connected to one end of the first slide plate 221 away from the first protruding strip 222 , and the second rack 252 is connected to one end of the second slide plate 231 away from the second protruding strip 232 .

[0053] For example, when the first frame 22 is pulled along the first direction F1, the first frame 22 drives the first rack 251 to move along the first direction F1, the first rack 251 drives the gear 253 to rotate, the gear 253 drives the second rack 252 to move in a direction opposite to the first direction F1, and the second rack 252 drives the second frame 23 to move in a direction opposite to the first direction F1. When the first frame 22 is pushed in a direction opposite to the first direction F1, the first frame 22 drives the first rack 251 to move in a direction opposite to the first direction F1, the first rack 251 drives the gear 253 to rotate, the gear 253 drives the second rack 252 to move in the first direction F1, and the second rack 252 drives the second frame 23 to move in the first direction F1. Of course, the first frame 22 can also be driven to perform corresponding movements by pushing or pulling the second frame 23. It can be understood that with the cooperation of the first rack 251, the gear 253 and the second rack 252, when pushing and pulling the first frame 22 and / or the second frame 23, the first frame 22 and the second frame 23 can be synchronously extended and retracted to adjust the size of the cooling frame assembly 20. The adjustment is convenient, and the extension and retraction lengths of the first frame 22 and the second frame 23 can be kept consistent, so that after adjusting the length of the cooling frame assembly 20 along the first direction F1, the center of gravity of the radiator remains unchanged, effectively ensuring the stability of the radiator supporting the electronic equipment.

[0054] In some embodiments of the present application, a guide channel extending along the first direction F1 is formed between the main frame 21 and the support surface 11. The first rack 251 and the second rack 252 are both slidably disposed in the guide channel along the first direction F1, and the gear 253 is rotatably disposed within the guide channel. The provision of the guide channel guides the movement of the first rack 251 and the second rack 252, effectively improving the stability of the movement of the first rack 251 and the second rack 252, thereby facilitating the stability of the telescopic movement of the first and second side frames 22 and 23 along the first direction F1.

[0055] In order to ensure that the gear 253 can only rotate around its own central axis and cannot move in the first direction F1 under the drive of the first rack 251 and / or the second rack 252, a positioning groove 214 is provided on the blocking bar 211. As shown in Figure 4, the positioning groove 214 is connected to the guide channel, and part of the gear 253 is confined in the positioning groove 214. The positioning groove 214 is used to limit the gear 253 to only rotational movement and cannot move along the first direction F1 or in a direction opposite to the first direction F1.

[0056] Optionally, there are two adjusting members 25 , which are arranged opposite to each other along the second direction F2 . Providing two adjusting members 25 is beneficial for improving the stability of the telescopic movement of the first frame 22 and the second frame 23 along the first direction F1 .

[0057] Optionally, a guide channel is formed between the blocking bar 211 and the supporting surface 11 . Since there are two blocking bars 211 , there are also two guide channels. The two adjusting members 25 are respectively disposed in the two guide channels.

[0058] In some embodiments of the present application, please refer to Figures 8 and 9. The heat dissipation assembly 30 includes a shell 31, a cooling member 32, a semiconductor cooling member 33, a heat sink 34, an air supply fan 35 and a heat dissipation fan 36. The shell 31 is provided with relatively independent cold air channels and heat dissipation channels. The cold air channels are connected to the cooling slot 24. At least part of the cooling member 32 and the air supply fan 35 are both arranged in the cold air channels. The heat dissipation fan 36 and the heat sink 34 are both arranged in the heat dissipation channels. The semiconductor cooling member 33 is connected to the cooling member 32 and the heat dissipation member 34.

[0059] Among them, the semiconductor refrigeration component 33 is a semiconductor refrigeration plate. The semiconductor refrigeration component 33 has a cold surface and a hot surface arranged in back to back. The cold surface is in contact with the cooling conductor 32, and the hot surface is in contact with the heat dissipation component 34. The semiconductor refrigeration component 33 can be refrigerated when powered on. The cooling conductor 32 is used to transfer the cold energy of the cold surface and use the cold energy absorbed by the cold surface to cool the air in the cold air channel. The cold air fan is used to blow air to the cooling conductor 32, the heat dissipation component 34 is used to transfer the heat from the hot surface, and the heat dissipation fan 36 is used to blow air to the radiator, that is, the heat dissipation and cooling of the semiconductor refrigeration component 33 are achieved through the cooperation of the heat dissipation fan 36 and the heat dissipation component 34.

[0060] When the heat dissipation assembly 30 is operating, the air supply fan 35 draws ambient air into the cold air duct. This air passes through the cooling element 32, forming cold air below ambient temperature. This air then flows to the cooling tank 24, acting on the electronic equipment to reduce the operating temperature of the electronic equipment, thereby achieving the purpose of heat dissipation and cooling the electronic equipment. Heat from the cooling element 32 is transferred to the heat dissipation element 34 via the semiconductor refrigeration element 33. The heat dissipation fan 36 draws ambient air into the heat dissipation duct. This air passes through the heat dissipation element 34, forming hot air above ambient temperature, before being discharged. Because the cold air duct and the heat dissipation duct are relatively independent, the cold air flow and the hot air flow within the housing 31 are separated, effectively preventing the cold air and hot air from flowing into the housing 31, which is beneficial for improving the heat dissipation and cooling effect on the electronic equipment.

[0061] Specifically, referring to Figures 8 and 9 , the housing 31 is provided with a first air inlet 311, a cold air outlet 312, a cold air cavity 313, a second air inlet 314, a hot air outlet 315, and a heat dissipation cavity 316. The first air inlet 311 and the cold air outlet 312 are located on opposite sides of the housing 31. The first air inlet 311, the cold air cavity 313, and the cold air outlet 312 are sequentially connected to form a cold air channel. The cold air outlet 312 is connected to the cooling tank 24. Specifically, the cold air outlet 312 is connected to the vent 13, i.e., the cold air outlet 312 is connected to the cooling tank 24 via the vent 13 and the notch 213. The second air inlet 314 and the hot air outlet 315 are located on opposite ends of the housing 31. The second air inlet 314, the heat dissipation cavity 316, and the hot air outlet 315 are sequentially connected to form a heat dissipation channel.

[0062] The above technical solution, by arranging the first air inlet 311 and the cold air outlet 312 at opposite sides of the shell 31 respectively, the first air inlet 311 and the cold air outlet 312 form a positive countercurrent, which can enable the air flow to flow quickly from the first air inlet 311 to the cold air outlet 312, and by arranging the second air inlet 314 and the hot air outlet 315 at opposite ends of the shell 31 respectively, the second air inlet 314 and the hot air outlet 315 form a positive countercurrent, which can enable the air flow to flow quickly from the second air inlet 314 to the hot air outlet 315, and the first air inlet 311 and the hot air outlet 315 are respectively located on different sides of the shell 31, which effectively prevents the hot air in the hot cavity 316 from being discharged from the hot air outlet 315 and then entering the cold air cavity 313 from the first air inlet 311.

[0063] Optionally, the cooling element 32 is disposed near the cold air outlet 312 , the heat dissipation fan 36 is disposed near the second air inlet 314 , the heat dissipation element 34 is disposed near the hot air outlet 315 , and the air supply fan 35 is located between the heat dissipation fan 36 and the heat dissipation element 34 .

[0064] The above technical solution, by placing the cooling element 32 near the cold air outlet 312, allows the cold air cooled by the cooling element 32 to be promptly discharged from the cold air outlet 312, reducing the flow time of the cold air in the cooling channel, effectively preventing the shell 31 from absorbing the cold in the cooling channel, effectively reducing the loss of cold in the cooling channel, and improving the heat dissipation effect. By placing the cooling fan 36 near the second air inlet 314, the cooling fan 36 can easily draw ambient air into the heat dissipation channel. By placing the heat dissipation element 34 near the hot air outlet 315, the heat of the heat dissipation element 34 can be promptly discharged from the hot air outlet 315, reducing the flow time of the hot air in the heat dissipation channel, and effectively preventing the heat in the heat dissipation channel from being transferred to the cooling channel.

[0065] Optionally, the cooling member 32 may be made of, but not limited to, copper. The heat sink 34 may be made of, but not limited to, aluminum alloy. The heat sink 34 includes a plurality of heat sink fins, which are spaced apart to improve the heat dissipation efficiency of the heat sink 34.

[0066] In some embodiments of the present application, please refer to Figure 9, the shell 31 is also provided with a avoidance port 317 connected to the heat dissipation cavity 316, and the cooling member 32 includes a cooling plate 321 and a cooling tube 322 connected to the cooling plate 321. The cooling plate 321 is arranged at the avoidance port 317 and is attached to the semiconductor refrigeration member 33. The cooling tube 322 is arranged at the cold air outlet 312.

[0067] Optionally, the cooling pipe 322 is in a circuitous shape, which effectively increases the cooling area of ​​the cooling pipe 322, thereby effectively improving the cooling efficiency.

[0068] In some embodiments, both ends of the cooling pipe 322 are sealed on the housing 31 by sealing rings 37. Optionally, the sealing ring 37 can be, but is not limited to, a silicone sealing ring 37.

[0069] Specifically, the housing 31 includes a bottom shell 318 and a bottom cover 319. The bottom cover 319 covers the bottom shell 318 to form a storage space. A limit frame 3181 is provided on the bottom cover 319. The limit frame 3181 is located in the middle of the bottom cover 319 facing the bottom shell 318. The limit frame 3181 divides the storage space into a cooling chamber 313 and a heat dissipation chamber 316. The first air inlet 311, the second air inlet 314, and the hot air outlet 315 are all provided on the bottom shell 318, while the avoidance opening 317 and the cold air outlet 312 are provided on the bottom cover 319.

[0070] Optionally, the cooling fan 36 is fastened to the bottom case 318 by screws.

[0071] In some embodiments of the present application, referring to FIG9 , the heat sink further includes a circuit board 38 disposed within the heat dissipation channel. The circuit board 38 is electrically connected to the peltier element 33, the air supply fan 35, and the heat dissipation fan 36. The circuit board 38 is used to control the operation of the peltier element 33, the air supply fan 35, and the heat dissipation fan 36. By placing the circuit board 38 within the accommodating cavity, the operation of the heat dissipation fan 36 simultaneously dissipates heat from the circuit board 38.

[0072] Optionally, the circuit board 38 is disposed in the heat dissipation cavity 316 and close to the second air inlet 314 .

[0073] In some embodiments of the present application, please continue to refer to FIG9 . The heat sink further includes a data cable 39 , which is connected to the circuit board 38 . The data cable 39 is connected to an electronic device or an external power source to power the circuit board 38 , the semiconductor cooling element 33 , the air supply fan 35 , and the cooling fan 36 . The heat sink has a first operating mode and a second operating mode. When the data cable 39 is connected to the electronic device on the support surface 11 , the first operating mode is used, and the circuit board 38 adjusts the operating parameters of the semiconductor cooling element 33 and the air supply fan 35 in real time based on the temperature of the electronic device. When the data cable 39 is disconnected from the electronic device, the second operating mode is used, and the operating parameters of the semiconductor cooling element 33 and the air supply fan 35 are fixed.

[0074] Specifically, the operating parameters of the semiconductor cooler 33 are primarily the cooling capacity of the semiconductor cooler 33, and the operating parameters of the air supply fan 35 are primarily the speed of the air supply fan 35. Thus, when the data cable 39 is electrically connected to the electronic device on the support surface 11, the radiator operates in a first operating mode. The circuit board 38 can obtain the temperature of the electronic device in real time via the data cable 39 and, based on the obtained temperature, adaptively adjust the cooling capacity of the semiconductor cooler 33 and the speed of the air supply fan 35 to maintain the temperature of the electronic device at a preset temperature. When the data cable 39 is disconnected from the electronic device on the support surface 11, the circuit board 38 cannot obtain the temperature of the electronic device, and thus the radiator enters a second operating mode. The cooling capacity of the semiconductor cooler 33 and the speed of the air supply fan 35 are both fixed.

[0075] In some embodiments of the present application, referring to Figures 1 and 2, the radiator further includes a baffle 40, which is connected to a side edge of the support plate 10 along a second direction F2 and is configured to be telescopically adjustable along the second direction F2, wherein the second direction F2 is perpendicular to the first direction F1.

[0076] In the above technical solution, the baffle 40 is connected to one side edge of the supporting plate 10 along the second direction F2. When the supporting plate 10 is in an inclined state, the baffle 40 is located below the supporting plate 10. The baffle 40 is used to resist the electronic equipment to prevent the electronic equipment from slipping when the supporting plate 10 is in an inclined state. In addition, by adjusting the length of the baffle 40 extending from the supporting plate 10 in the second direction F2, the supporting size of the electronic device in the second direction F2 can be adjusted to accommodate electronic devices of different sizes.

[0077] For example, the electronic device is a laptop computer. By adjusting the length of the first frame 22 and the second frame 23 extending from the main frame 21 in the first direction F1 and adjusting the length of the baffle 40 extending from the support plate 10 in the second direction F2, it can be adapted to a 14-inch to 18-inch laptop computer.

[0078] Specifically, referring to Figures 3, 10 and 11, the radiator also includes a cover plate 50 arranged on the supporting plate 10 and a pressure block 60 arranged on the baffle 40. The baffle 40 and / or the pressure block 60 slides with the supporting plate 10 along the second direction F2. A groove 51 is provided on one of the cover plate 50 and the pressure block 60, and a positioning protrusion 61 is provided on the other of the cover plate 50 and the pressure block 60. The positioning protrusion 61 is engaged with the groove 51. There are multiple positioning protrusions 61 and / or grooves 51, and the multiple positioning protrusions 61 and / or multiple grooves 51 are spaced apart along the second direction F2.

[0079] In some embodiments, there are multiple positioning protrusions 61 and one or more grooves 51. In other embodiments, there are multiple grooves 51 and one or more positioning protrusions 61. It is understood that by cooperating and engaging the positioning protrusions 61 with different grooves 51, or by cooperating and engaging different positioning protrusions 61 with grooves 51, or by cooperating and engaging different positioning protrusions 61 with different grooves 51, the baffle 40 can be adjusted to multiple gear positions, thereby enabling the baffle 40 to be adjusted to multiple gear positions.

[0080] It should be noted that the positioning protrusion 61 is an elastic structure. During the sliding process of the baffle 40, when the positioning protrusion 61 is misaligned with the groove 51, the positioning protrusion 61 produces elastic compression deformation. When the positioning protrusion 61 corresponds to the groove 51, the positioning protrusion 61 is snapped into the corresponding groove 51, as shown in Figure 12, to limit the baffle 40.

[0081] The above technical solution adjusts the length of the baffle 40 extending from the support plate 10 in the second direction F2 by pushing and pulling the baffle 40 along the second direction F2. When the baffle 40 is adjusted to a preset position, the positioning protrusions 61 engage with the corresponding grooves 51 to limit the position of the baffle 40. By providing multiple positioning protrusions 61 and / or grooves 51 along the second direction F2, and by spacing the multiple positioning protrusions 61 and / or the multiple grooves 51 along the second direction F2, the baffle 40 can be adjusted and positioned in multiple gears, thereby enabling the baffle 40 to be adjusted in multiple gears.

[0082] Optionally, there are two pressing blocks 60, and the two pressing blocks 60 are arranged at intervals along the first direction F1. A positioning protrusion 61 is provided on each pressing block 60, and two groups of grooves are provided on the baffle 40. The two groups of grooves are arranged at intervals along the first direction F1, and each group of grooves includes at least one groove 51, wherein at least one positioning protrusion 61 on one pressing block 60 is engaged with at least one groove 51 of one group of grooves, and at least one positioning protrusion 61 on the other pressing block 60 is engaged with at least one groove 51 of the other group of grooves. By arranging two pressing blocks 60 to cooperate with the two groups of grooves respectively, it is beneficial to improve the stability of the movement of the baffle 40 along the second direction F2 and the stability of the positioning of the baffle 40.

[0083] Optionally, referring to FIG3 , the support plate 10 is provided with a retaining groove 17 extending through the support surface 11 and a movable groove 18 extending through the mounting surface 12. The movable groove 18 extends along the second direction F2 and is in communication with the retaining groove 17. The baffle 40 is in sliding contact with the mounting surface 12, the cover plate 50 is retained within the retaining groove 17, and the pressure block 60 is movably disposed within the movable groove 18. Specifically, a portion of the pressure block 60 is slidably disposed between the cover plate 50 and the support surface 11, while the other portion of the pressure block 60 is connected to the baffle 40 via the movable groove 18.

[0084] In some embodiments of the present application, referring to FIG. 13 and FIG. 14 , the heat sink further includes a folding frame 70 , which is connected to the supporting plate 10 and is configured to adjust the height and tilt angle of the supporting plate 10 .

[0085] With the above technical solution, when an electronic device is placed on the support plate 10, the overall height and tilt angle of the support plate 10 can be adjusted using the folding frame 70, so that the support plate 10 can support the electronic device at a predetermined height and tilt angle as desired by the user, making it easier for the user to use. Furthermore, when not in use, the folding frame 70 can be folded, saving space and making it easier to store and carry.

[0086] In some embodiments of the present application, the folding frame 70 includes a base 71 and at least two connecting rods 72. The at least two connecting rods 72 are spaced apart along a first direction F1. One end of the connecting rod 72 is rotatably connected to the base 71, and the other end of the connecting rod 72 is rotatably connected to the support plate 10. By rotating the connecting rod 72 relative to the base 71, the connecting rod 72 can be unfolded relative to or folded on the base 71, thereby adjusting the height of the support plate 10. By rotating the support plate 10 relative to the connecting rod 72, the inclination angle of the support plate 10 can be adjusted.

[0087] It should be noted that a preset damping mechanism is provided between one end of the connecting rod 72 and the base 71, and between the other end of the connecting rod 72 and the support plate 10, so that the folding stand 70 can support the support plate 10 with the electronic device placed thereon and maintain it at a preset height and tilt angle. Optionally, the ends of the connecting rod 72 are hinged to the base 71 and the support plate 10, respectively, via a damping axis.

[0088] The above are merely optional embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included within the scope of the claims of the present application.

Claims

1. A radiator, It is characterized in that include: A support plate having a support surface; A cooling frame assembly is arranged on the support surface; the cooling frame assembly comprises a main frame, a first frame and a second frame, and the main frame, the first frame and the second frame enclose a cooling groove; the first frame and the second frame are respectively telescopically arranged at two ends of the main frame along a first direction, so that the length of the cooling frame assembly and the cooling groove in the first direction is adjustable; The heat dissipation component is arranged on the supporting plate and is used for conveying cold air to the cooling tank.

2. The heat sink according to claim 1, Features: The first frame and the second frame are both slidably disposed between the main frame and the supporting surface along the first direction.

3. The heat sink according to claim 2, Features: The main frame includes two baffles arranged relatively at intervals and a bottom plate arranged between the two baffles. A first slide groove and a second slide groove are formed between the bottom plate and the supporting surface. The first slide groove is for the first frame to slide through, and the second slide groove is for the second frame to slide through.

4. The heat sink according to claim 3, Features: The first frame includes a first slide plate slidably set in the first slide groove and a first protrusion connecting the first slide plate, and the second frame includes a second slide plate slidably set in the second slide groove and a second protrusion connecting the second slide plate, and the first protrusion, the second protrusion and the two blocking bars enclose the cooling groove.

5. The heat sink according to claim 1, Features: The cooling frame assembly also includes an adjusting member, which includes a first rack connected to the first frame, a second rack connected to the second frame, and a gear meshed with the first rack and the second rack, and the lengths of the first rack and the second rack both extend along the first direction.

6. The heat sink according to claim 5, Features: A guide channel extending along a first direction is formed between the main frame and the support surface. The first rack and the second rack are both slidably arranged in the guide channel. The gear is rotatably arranged in the guide channel.

7. The heat sink according to claim 5, Features: The number of the adjusting members is two, and the two adjusting members are arranged opposite to each other along a second direction perpendicular to the first direction.

8. The heat sink according to claim 1, Features: The support plate also has a mounting surface disposed opposite to the support surface. The support plate is provided with a vent penetrating the support surface and the mounting surface. The vent is connected to the cooling groove. The heat dissipation component is disposed on the mounting surface and is disposed corresponding to the vent.

9. The heat sink according to claim 8, Features: A dustproof net is also included, and the dustproof net covers the vent.

10. The heat sink according to claim 1, Features: It also includes a first pad and a second pad arranged on the support surface, and the first pad and the second pad are respectively located on opposite sides of the cooling frame assembly along a second direction perpendicular to the first direction.

11. The heat sink according to claim 1, Features: The heat dissipation assembly includes a shell, a cooling member, a semiconductor cooling member, a heat sink, an air supply fan and a heat dissipation fan. The shell is provided with relatively independent cold air channels and heat dissipation channels. The cold air channels are connected to the cooling groove. At least part of the cooling member and the air supply fan are arranged in the cold air channels. The heat dissipation fan and the heat sink are arranged in the heat dissipation channel. The semiconductor cooling member is connected to the cooling member and the heat sink.

12. The heat sink according to claim 11, Features: The shell is provided with a first air inlet, a cold air outlet, a cold air cavity, a second air inlet, a hot air outlet and a heat dissipation cavity. The first air inlet and the cold air outlet are respectively arranged on opposite sides of the shell, and the first air inlet, the cold air cavity and the cold air outlet are connected in sequence to form the cold air channel, and the cold air outlet is connected to the cooling groove; the second air inlet and the hot air outlet are respectively arranged at opposite ends of the shell, and the second air inlet, the heat dissipation cavity and the hot air outlet are connected in sequence to form the heat dissipation channel.

13. The heat sink according to claim 12, Features: The heat dissipation fan is arranged close to the second air inlet, the heat dissipation element is arranged close to the hot air outlet, and the air supply fan is located between the heat dissipation fan and the heat dissipation element.

14. The heat sink according to claim 12, Features: The shell is also provided with an escape port connected to the heat dissipation cavity, the cooling component includes a cooling plate and a cooling tube connected to the cooling plate, the cooling plate is arranged at the escape port and is attached to the semiconductor refrigeration component, and the cooling tube is arranged at the cold air outlet.

15. The heat sink according to claim 11, Features: The radiator further comprises a circuit board, which is arranged in the heat dissipation channel and is electrically connected to the semiconductor refrigeration component, the air supply fan and the heat dissipation fan.

16. The heat sink according to claim 15, Features: It also includes a data line electrically connected to the circuit board. When the data line is connected to the electronic device on the support surface, a first working mode is performed, and the circuit board adjusts the working parameters of the semiconductor refrigeration component and the air supply fan based on the temperature of the electronic device; when the data line is disconnected from the electronic device, a second working mode is performed, and the working parameters of the semiconductor refrigeration component and the air supply fan are fixed values.

17. The heat sink according to claim 1, Features: The heat sink further includes a baffle, which is connected to a side edge of the supporting plate along a second direction perpendicular to the first direction and is configured to be telescopically adjustable along the second direction.

18. The heat sink according to claim 17, Features: It also includes a cover plate arranged on the supporting plate and a pressure block arranged on the baffle plate, the baffle plate and / or the pressure block slidingly cooperate with the supporting plate along the second direction, one of the cover plate and the pressure block is provided with a groove, and the other is provided with a positioning protrusion, the positioning protrusion is engaged with the groove, the number of the positioning protrusion and / or the groove is multiple, and the multiple positioning protrusions and / or the multiple grooves are spaced apart along the second direction.

19. The heat sink according to claim 1, Features: It also includes a folding frame, which is connected to the supporting plate and is configured to adjust the height and tilt angle of the supporting plate.

20. The heat sink according to claim 19, Features: The folding frame includes a base and at least two connecting rods, at least two of the connecting rods are spaced apart along the first direction, one end of the connecting rod is rotatably connected to the base, and the other end of the connecting rod is rotatably connected to the supporting plate.

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