Method and device for synthesizing metal thin film on display

Abstract

The present invention relates to an electroplating device and an electroplating method, in which an anode is moved on one surface of a substrate in a horizontal direction and an object can be electroplated, and especially when an electroplating solution is supplied during an electroplating procedure, the concentration of iron ions in the electroplating solution can be defined and maintained by means of adding inert gas, such that an excellent electroplating quality can be provided. The electroplating device is characterized by comprising a water tank portion provided with an open upper portion and internally provided with an accommodating space; an electroplating portion arranged on the water tank portion and electroplating, on the basis of power supply from a power supply portion, an object arranged inside the water tank portion; an electroplating solution supply portion to supply the electroplating solution to the electroplating portion, receive the electroplating solution flowing in from the water tank portion and enable the electroplating solution to circulate; and a gas supply portion to supply inert gas to the electroplating portion, wherein the electroplating portion sprays the supplied electroplating solution and the inert gas to the object.

Description

Method and device for synthesizing metal thin film for display Technical Field

[0001] The present invention relates to an electroplating device and an electroplating method, and more particularly to an electroplating device and an electroplating method in which an anode is moved horizontally on one side of a substrate and an object is electroplated. In particular, when supplying the electroplating solution during the electroplating process, the concentration of iron ions in the electroplating solution can be maintained by adding an inert gas, thereby achieving excellent electroplating quality. Background Art

[0002] An organic light-emitting diode (OLED) is a thin-film light-emitting diode (LED) made of a film of organic compounds whose light-emitting layer emits light in response to an electric current. Typical OLED displays utilize fluorescent or phosphorescent organic compounds electrically connected to generate light. Images can be displayed by driving N×M organic light-emitting cells.

[0003] This type of organic light-emitting cell consists of an anode (ITO), an organic thin film, and a metal cathode. The organic thin film optimizes the balance of electrons and holes to improve luminous efficiency. It consists of a multilayer structure consisting of an emitting layer (EML), an electron transport layer (ETL), and a hole transport layer (HTL). It may also include an additional electron injection layer (EIL) and a hole injection layer (HIL).

[0004] In order to achieve full color in such an organic electroluminescent device, the red (R), green (G), and blue (B) light-emitting layers need to be patterned separately. A fine metal mask (FMM) is used to pattern the light-emitting layers.

[0005] As a fine metal mask, invar (an alloy of iron and nickel) is used mainly in consideration of thermal expansion and the like.

[0006] The typical production method for Invar (36% Ni-64% Fe) and Super Invar (32% Ni-63% Fe-5% Co) used in fine metal mask production utilizes cold rolling. However, achieving thin sheets with a thickness of 50 μm or less requires multiple rolling steps, resulting in lengthy and complex processes and high manufacturing costs. Furthermore, rolled Invar sheets with a thickness of 50 μm or less produced by cold rolling are limited to a width of 500 mm or less, making them difficult to apply to large-area processes.

[0007] This problem increases the manufacturing cost of OLED display devices that require a thickness of 20 μm or less. The cost increase is caused by the reduced yield in the manufacturing process of large-area OLED display devices, making it difficult to develop display technology.

[0008] Therefore, a method for manufacturing Invar alloy for fine metal mask plates has recently been developed, which uses a master with a mask pattern formed on one surface to produce Invar alloy by electroforming.

[0009] In the Invar alloy electroplating manufacturing method for general fine metal mask templates using this electroforming method, an anode electrode plate and a mother material used as a cathode are arranged opposite to each other in a parallel state in the internal space of the electroplating tank. After the electroplating solution (electrolyte) is supplied to the internal space of the electroplating tank, an anode power supply and a cathode power supply are connected to the anode electrode plate and the mother material respectively, and current is applied to them to form an electroplating layer (Invar alloy) on one side of the mother material.

[0010] Then, the electroplated layer is separated from the masterbatch and subjected to post-processing, and the production of the fine metal mask is finally completed. At this time, the mask pattern formed on one side of the masterbatch before the electroplating process is transferred and remains on the electroplated layer.

[0011] The electroplated layer formed on one side of the mother material is Invar alloy, which varies depending on the purpose, but is usually composed of an iron-nickel alloy (36% Ni-64% Fe). Nickel or an insoluble anode is mainly used as the anode electrode plate, and the plating solution is used to make the iron ions (Fe 2+ ) is formed in a dissolved state.

[0012] At this time, the iron ions dissolved in the electroplating solution continue to adhere to the mother material as the cathode power source to form the electroplating layer and are consumed. Therefore, it is particularly important to correctly maintain the iron ion concentration in the electroplating solution in terms of the quality of the Invar alloy.

[0013] However, the reaction in the insoluble anode (H2O--->1 / 2O2+2H + +2e - ) generated in O2 and Fe 2+ The self-oxidation reaction (Fe 2+ --->Fe3+ +e - ) generated in the Fe 3+ Producing iron oxide (4Fe+3O2--->2Fe 3+ 2O 2- 3) Due to the iron oxide thus generated, Fe-based 3+ The reduction reaction (Fe 3+ +e - --->Fe 2+ ) of Fe 3+ The problem of reduced iron ion reduction.

[0014] As mentioned above, if the Fe salt (Fe 2+ ) concentration is reduced, resulting in an uneven NiFe eutectoid ratio, and there is a problem that the higher the Ni content, the higher the thermal expansion coefficient (CTE).

[0015] Furthermore, iron oxide is an insoluble substance in the electroplating solution. As an impurity in the electroplating solution, it causes protrusions on the surface of the conductor and may reduce the electrodeposition properties of the invar plating layer or induce scars.

[0016] Summary of the Invention

[0017] The present invention has been made to solve the above-mentioned problems, and its object is to provide an electroplating apparatus and an electroplating method that can electroplate an object by moving an anode in a horizontal direction on one surface of a substrate.

[0018] In particular, an object of the present invention is to provide an electroplating apparatus and an electroplating method that can regulate and maintain the concentration of iron ions in the plating solution by injecting an inert gas when the plating solution is supplied in the electroplating process.

[0019] According to the present invention, there is provided a metal thin film synthesis device for use on a display, which is characterized in that it includes: a water tank portion, which is open at the top and has a receiving space inside; a plating portion, which is arranged in the above-mentioned water tank portion and electroplates an object arranged inside the water tank portion according to the power supplied by the power supply portion; a plating liquid supply portion, which supplies plating liquid to the above-mentioned plating portion, receives the plating liquid flowing into the water tank portion, and circulates it; and a gas supply portion, which supplies an inert gas to the above-mentioned plating portion; the plating portion sprays the supplied plating liquid and inert gas onto the object.

[0020] Preferably, it is characterized in that the above-mentioned electroplating part includes: an anode part, which is electrically connected to the anode of the above-mentioned power supply part and releases ions to the object in the water tank part; a cathode part, which is electrically connected to the cathode of the above-mentioned power supply part and supports the object inside the above-mentioned water tank part; and a first supply nozzle and a second supply nozzle, which are respectively arranged on one side and the other side of the above-mentioned anode part, and spray the plating solution and the inert gas toward the object together.

[0021] Preferably, the first supply nozzle and the second supply nozzle are formed so that the direction of the injection hole is inclined toward the lower direction of the anode portion.

[0022] Preferably, it is characterized in that a main supply pipe and a first branch supply pipe and a second branch supply pipe branching from the main supply pipe are provided in the first supply nozzle and the second supply nozzle, and the plating liquid and inert gas supplied by the main supply pipe are selectively supplied to the first supply nozzle and the second supply nozzle through the first branch supply pipe and the second branch supply pipe and are sprayed.

[0023] Preferably, it is characterized in that the above-mentioned inert gas is compressed nitrogen.

[0024] Preferably, it is characterized in that the compressed nitrogen gas is maintained in a supersaturated state in the electroplating solution and is injected at a speed above a specified speed so as to block the inflow of oxygen.

[0025] Preferably, it is characterized in that the compressed nitrogen is based on the plating solution Per minute investment to amount.

[0026] On the other hand, according to another embodiment of the present invention, a method for synthesizing a metal thin film for a display is provided, wherein an object in a water tank portion is electroplated through an electroplating portion located above the water tank portion, and the method is characterized in that the plating solution and an inert gas are sprayed together onto the object through a supply nozzle of the electroplating portion.

[0027] Preferably, it is characterized in that the above-mentioned inert gas is compressed nitrogen.

[0028] Preferably, it is characterized in that the compressed nitrogen gas is maintained in a supersaturated state in the electroplating solution and is injected at a speed above a specified speed so as to block the inflow of oxygen.

[0029] Preferably, it is characterized in that the compressed nitrogen is based on the plating solution Per minute investment to amount.

[0030] According to the present invention, the electroplating device and electroplating method of the embodiments of the present invention have the following effects: the anode can be moved horizontally on one side of the substrate and the object can be electroplated. In particular, when the plating solution is supplied during the electroplating process, the concentration of iron ions in the plating solution can be maintained by adding inert gas, thereby achieving excellent electroplating quality.

[0031] Furthermore, it has the following effects: it can prevent the formation of iron oxide in the plating solution and the increase of the thermal expansion coefficient, and can recycle the plating solution and electrolyte solution. In order to reduce the plating deviation, the sizes of multiple anodes can be designed to be different if necessary, or the number of channels can be increased to change it. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] FIG1 is a structural diagram of an electroplating apparatus according to an embodiment of the present invention.

[0033] FIG. 2 is a structural diagram of an electroplating unit according to an embodiment of the present invention.

[0034] FIG. 3 is a diagram for explaining a plating process based on movement of a plating unit according to an embodiment of the present invention.

[0035] FIG. 4 is a graph showing the thermal expansion coefficient of Invar according to the Ni content in an example of the present invention.

[0036] FIG. 5 shows the Fe content in the plating solution according to the number of plating times of the plating apparatus according to the amount of inert gas input according to an embodiment of the present invention. 2+ Concentration curve.

[0037] FIG. 6 is a graph showing the Ni eutectoid ratio in the invar according to the number of electroplating times of the electroplating apparatus according to the amount of inert gas supplied in an embodiment of the present invention.

[0038] FIG. 7 is a graph showing the amount of dissolved oxygen in the plating solution according to the amount of inert gas supplied and the number of plating cycles of the plating apparatus according to an embodiment of the present invention.

[0039] Description of Reference Signs

[0040] 100: Plating unit 200: Plating solution supply unit

[0041] 300: Electrolyte supply unit 400: Gas supply unit

[0042] 500: Power supply unit DETAILED DESCRIPTION

[0043] The present invention is susceptible to numerous modifications and embodiments, and specific embodiments are illustrated in detail in the accompanying drawings. However, this does not limit the present invention to specific embodiments. Rather, it should be understood that the present invention encompasses all modifications, equivalents, and alternatives within the spirit and technical scope of the present invention. Similar reference numerals will be used to represent similar structural elements in the accompanying drawings.

[0044] Terms such as "first," "second," "A," and "B" may be used to describe various structural elements, but the structural elements described above shall not be limited to the above terms. The purpose of using the above terms is solely to distinguish one structural element from other structural elements. For example, without departing from the scope of the present invention, a first structural element may be named "second structural element," and similarly, a second structural element may be named "first structural element." And / or this term includes a combination of multiple related recorded items or any one of multiple related recorded items.

[0045] When certain structural elements are "connected" or "connected" to other structural elements, it should be understood that they can be directly connected or connected to the other structural elements, but other structural elements may exist in between. On the contrary, when certain structural elements are "directly connected" or "directly connected" to other structural elements, it should be understood that there are no other structural elements in between. The terms used in this application are only used to illustrate specific embodiments and are not used to limit the present invention. Singular expressions can include plural expressions as long as there is no clear difference in the context. It should be understood that in this application, terms such as "including" or "having" are used to specify the existence of features, numbers, steps, actions, structural elements, parts or combinations of these recorded in the specification, and do not preclude the existence or additional possibilities of one or more other features, numbers, steps, actions, structural elements, parts or combinations of these.

[0046] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms defined in commonly used dictionaries should be interpreted as having the same meaning as in the context of the relevant art and, unless otherwise expressly defined in this application, should not be interpreted as idealizing or overly formalizing.

[0047] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0048] FIG. 1 is a structural diagram of an electroplating apparatus according to an embodiment of the present invention.

[0049] 1 , a metal thin film synthesis device for a display according to an embodiment of the present invention includes a plating section 100 movably provided on a water tank section 600 having a prescribed accommodation space and internally arranging an object I, and receives current from a power supply section 500 to plate the object I. In order to supply the plating solution, electrolyte and inert gas used in the electroplating to the water tank section 600 and the plating section 100, a plating solution supply section 200, an electrolyte supply section 300 and a gas supply section 400 may be integrally provided.

[0050] First, the water tank 600 has a predetermined internal storage space for storing the plating solution. The upper surface of the water tank 600 is open so that the object 1 can be inserted and removed horizontally, and has a height sufficient to accommodate the entire object 1.

[0051] The plating solution is an electrolyte that can be used as the material for the electroplating layer that can be used as a mask. As one embodiment, when an Invar sheet, which is an iron-nickel alloy, is manufactured as the electroplating layer, a mixture of a solution containing Ni ions and a solution containing Fe ions can be used as the plating solution. As another embodiment, when a Super Invar sheet, which is an iron-nickel-cobalt alloy, is manufactured as the electroplating layer, a mixture of a solution containing Ni ions, a solution containing Fe ions, and a solution containing Co ions can also be used as the plating solution. Invar sheets and Super Invar sheets can be used as fine metal masks (FMMs) and shadow masks in the manufacture of OLEDs, and play a role in accurately directing the electron beam to the phosphor. In addition, because Invar sheets and Super Invar sheets have very low coefficients of thermal expansion (CTE), there is less concern about the mask pattern shape being deformed due to thermal energy, and therefore they are mainly used in the manufacture of high-definition OLEDs. In addition, the electroplating solution used in the desired electroplating layer can be used without restriction. In this specification, the manufacture of Invar sheet is mainly used as an example for explanation.

[0052] The plating solution supply unit 200 may supply the plating solution to the plating unit 100 .

[0053] The plating solution supply unit 200 is formed to have a storage space within it for storing the plating solution. The plating solution supply unit 200 receives the plating solution from an external plating solution supply unit and stores it. A supply pump (not shown) then supplies the plating solution stored in the storage space to the first and second supply nozzles 160 and 170 of the plating unit 100. Furthermore, the plating solution supply unit 200 is connected to the water tank 600 and receives and stores the plating solution stored in the water tank 600.

[0054] Finally, the plating solution supplied to the first and second supply nozzles 160 and 170 of the plating section 100 by the plating solution supply section 200 is sprayed toward the object 1. The plating solution that flows downward through the object 1 by gravity is stored in the water tank 600 and then recovered to the connected plating solution supply section 200. Thus, the plating solution is circulated as a whole by this structure. As described above, the plating solution supply section 200 circulates the plating solution because, when supplying the plating solution, an inert gas is simultaneously introduced by the gas supply section 400 (described later) to maintain the concentration of iron ions in the plating solution, thereby suppressing the formation of iron oxide in the plating solution.

[0055] At this time, the plating solution supply unit 200 may further include a filter for removing impurities from the plating solution.

[0056] The electrolyte supply unit 300 may supply an electrolyte solution to the plating unit 100 .

[0057] The electrolyte supply unit 300 is formed to have a storage space inside for storing an electrolyte solution. The electrolyte supply unit 300 receives the electrolyte solution from an external electrolyte solution supply unit and stores it. The electrolyte solution stored in the storage space is then supplied to the electroplating unit 100 via a supply pump (not shown). The electrolyte supply unit 300 is also connected to the electroplating unit 100 and receives the electrolyte solution flowing into the electroplating unit 100 for storage.

[0058] Finally, the electrolyte solution supplied to the plating unit 100 through the electrolyte supply unit 300 is recovered again to the connected electrolyte supply unit 300 , thereby circulating the electrolyte solution as a whole through this structure.

[0059] The gas supply unit 400 may supply an inert gas to the plating unit 100 .

[0060] The gas supply unit 400 is formed to have a storage space for storing inert gas. The gas supply unit 400 receives inert gas from an external inert gas supply unit and stores it. The inert gas stored in the storage space is then supplied to the first supply nozzle 160 and the second supply nozzle 170 of the electroplating unit 100 via a supply pump (not shown).

[0061] Finally, the inert gas supplied to the first and second supply nozzles 160 and 170 of the plating section 100 by the gas supply unit 400 is sprayed together with the supplied plating solution into the plating solution in the water tank 600. During this process, the inert gas maintains a supersaturated state of gas in the plating solution, inhibits the influx of oxygen into the plating solution, and maintains the concentration of iron ions in the plating solution, ultimately suppressing the formation of titanium oxide in the plating solution.

[0062] The power supply unit 500 can supply current to the electroplating unit 100. The power supply unit 500 can form a plurality of channels, and the plurality of channels can be formed into four or more channels. Furthermore, the plurality of channels of the power supply unit 500 can independently control the current values. Therefore, the power supply unit 500 can design the anodes to be of different sizes, or can change them by increasing the number of channels, if necessary, to reduce the electroplating deviation of the electroplating unit 100.

[0063] The plating unit 100 may form a plating layer (Invar alloy) on one side of the master material for the fine metal mask.

[0064] The plating section 100 is located within the upper portion of the water tank 600 and is movable horizontally along the water tank 600. Furthermore, the plating section 100 is electrically connected to the power supply 500 to receive current. Furthermore, the plating section 100 is connected to the plating solution supply 200 and the gas supply 400 to receive plating solution and inert gas, and to the electrolyte supply 300 to receive electrolyte solution.

[0065] FIG. 2 is a structural diagram of an electroplating unit according to an embodiment of the present invention.

[0066] 2 , the electroplating section 100 can be horizontally movably arranged on the upper side of the water tank section 600, and has an anode section 110 electrically connected to the power supply section 500 to release ions. A first supply nozzle 160 and a second supply nozzle 170 are respectively provided on one side and the other side of the anode section 110, which move in conjunction with the anode section 110. A cathode section 120 supporting the object I and electrically connected to the power supply section 500 may be provided inside the water tank section 600.

[0067] Here, the anode portion 110 and the first and second supply nozzles 160 and 170 provided on one side and the other side of the anode portion 110 are linked to move horizontally together with the anode portion 110 according to external horizontal movement control.

[0068] The anode of the anode unit 110 may be electrically connected to the anode of the power supply unit 500. The anode unit 110 may be formed of a plurality of anodes, preferably four or more anodes, which may be controlled individually.

[0069] The anode of the anode unit 100 may be disposed in a housing, the interior of which is connected to the electrolyte supply unit 300 , receiving electrolyte solution from the electrolyte supply unit 300 , retaining the electrolyte solution, and then moving the electrolyte solution back to the electrolyte supply unit 30 for circulation.

[0070] Furthermore, a first supply nozzle 160 and a second supply nozzle 170 provided on both sides of the anode portion 110 spray the plating solution and the inert gas toward the lower object 1. The first supply nozzle 160 and the second supply nozzle 170 can operate together to spray the plating solution and the inert gas, or can operate independently to selectively spray the plating solution and the inert gas.

[0071] In order to spray the plating solution and the inert gas into the first supply nozzle 160 and the second supply nozzle 170 , the first supply nozzle 160 and the second supply nozzle 170 have a main supply pipe 130 and first and second branch supply pipes 140 and 150 branched from the main supply pipe 130 .

[0072] A plating solution inlet 190 and a gas inlet 180 are connected to the upper portion of the main supply pipe 130. The plating solution inlet 190 is connected to the plating solution supply unit 200 to supply the plating solution to the main supply pipe 130. Furthermore, the gas inlet 180 is connected to the gas supply unit 400 to supply an inert gas to the main supply pipe 130. Therefore, the plating solution and the inert gas flow together in the main supply pipe 130.

[0073] In this case, reference numeral 181 denotes a solenoid-type gas valve that controls the supply and amount of the inert gas supplied from the gas supply unit 400 to the main supply pipe 130 .

[0074] The lower portion of the main supply pipe 130 branches into a first branch supply pipe 140 and a second branch supply pipe 150. The plating solution and the inert gas flow together through the first branch supply pipe 140 and the second branch supply pipe 150. The supply and amount of the plating solution and the inert gas flowing through the first branch supply pipe 141 and the second branch supply pipe 151 are controlled by the operation of the first branch supply pipe 141 and the second branch supply pipe 151 provided on the respective pipes.

[0075] The first branch supply pipe 140 is connected to the first supply nozzle 160 to supply the electroplating solution and the inert gas, and the second branch supply pipe 150 is connected to the second supply nozzle 170 to supply the electroplating solution and the inert gas.

[0076] The first supply nozzle 160 is disposed at one side of the anode portion 110 , and the direction of the spray hole of the first supply nozzle 160 may be formed to be inclined toward the lower portion of the anode portion 110 .

[0077] Furthermore, the second supply nozzle 170 is provided at the other side of the anode portion 110 , and the direction of the spray hole of the second supply nozzle 170 may be formed to be inclined toward the lower direction of the anode portion 110 .

[0078] The first supply nozzle 160 and the second supply nozzle 170 can adjust the injection of the plating solution and the inert gas and the injection flow rate thereof according to the first branch pipe 141 and the second branch pipe 151 respectively.

[0079] The main supply pipe 130 , the branch supply pipes 140 , 150 , and the supply nozzles 160 , 170 may be integrally formed.

[0080] The main supply pipe 130, branch supply pipes 140, 150, and supply nozzles 160, 170 of the integrated plating unit 100 can be moved horizontally and vertically by a drive unit (not shown). During horizontal movement, the integrated main supply pipe 130, branch supply pipes 140, 150, and supply nozzles 160, 170, which are connected to the lower side, move toward one side or the other of the object 1 while maintaining a horizontal position as a whole. Furthermore, during vertical movement, the integrated main supply pipe 130, branch supply pipes 140, 150, and supply nozzles 160, 170 move up and down in the vertical direction.

[0081] FIG. 3 is a diagram for explaining a plating process based on movement of a plating unit according to an embodiment of the present invention.

[0082] 3 , the main supply pipe 130, branch supply pipes 140, 150, and supply nozzles 160, 170 of the electroplating unit 100 formed by the integral type move along one side or the other side of the horizontal direction and can be operated separately. That is, as shown in (a) of FIG3 , if the anode unit 110 moves toward one side (arrow), the first supply nozzle 160 formed by tilting toward the side direction of the anode unit 110 moves sprays the plating solution and the inert gas, and the second supply nozzle 170 may not spray the plating solution and the inert gas. On the contrary, as shown in (b) of FIG3 , if the anode unit 110 moves toward the other side (arrow), the second supply nozzle 170 formed by tilting toward the other side direction of the anode unit 110 moves sprays the plating solution and the inert gas, and the first supply nozzle 160 may not spray the plating solution and the inert gas.

[0083] Conventional electroplating equipment creates plating spots and other defects on the plated layer due to eddy currents generated when the plating solution is sprayed. Furthermore, the severity of the spots in conventional electroplating equipment increases in direct proportion to the flow rate of the plating solution sprayed. Furthermore, conventional electroplating equipment cannot quickly remove hydrogen when the plating solution spray flow rate is reduced to reduce spots on the plated surface, resulting in dents on the plated surface.

[0084] According to the first supply nozzle 160 and the second supply nozzle 170 of the embodiment of the present invention, a first branch valve 141 and a second branch valve 151 are respectively provided on the plating liquid spray nozzle. According to the forward direction of the insoluble anode, the first supply nozzle 160 and the second supply nozzle 170 are selectively operated respectively to eliminate the factors that generate vortexes when spraying the plating liquid. In addition, since the first supply nozzle 160 and the second supply nozzle 170 can be separately adjusted to spray or not and the spray flow rate, the hydrogen generated on the cathode surface can be quickly removed by increasing the spray flow rate according to the moving direction of the anode part 110, thereby preventing the formation of dents on the electroplating surface. In addition, according to the embodiment of the present invention, the first supply nozzle 160 and the second supply nozzle 170 are tilted toward the lower side of the anode part 110, thereby minimizing the formation of dents and spots on the electroplating surface.

[0085] Furthermore, the cathode portion 120 can be electrically connected to the cathode of the power supply portion 500. Such cathode portion 120 can be respectively arranged at the left and right edges in the water trough portion 600. Furthermore, the cathode portion 120 can form a clamp 121 at the end portions on the left and right sides formed in the water trough portion 600. The clamp 121 contacts the object I and can hold the left and right edges of the object I for support. The clamp 121 can fix the object I arranged in the horizontal direction in a manner that does not move. Such clamp 121 is formed by a conductor and can act as a medium so that as the cathode portion 120 is connected to the object I, the current applied to the cathode portion 120 can flow to the object I and the anode portion 110.

[0086] On the other hand, when an Invar sheet, which is an iron-nickel alloy, is manufactured as an electroplated layer, the plating solution serving as the material for the electroplated layer can determine the large / small area of ​​the plated body, the plating thickness deviation between the via or through hole and the ground, and the aspect ratio, depending on the amount of additives added in the plating solution, which ranges from several to several tens of ml.

[0087] Additives can be accelerators (brighteners) such as organic compounds such as SPS, MPSA, DPS, and thiourea; decelerators (suppressors, carriers) such as polymer organic compounds such as PEG, gelatin, and collagen; and levelers such as compounds such as Janus Green B (JGB), PEI, and HEC. Among them, the sulfur compound acting as an accelerator can be easily decomposed by the oxygen generated by the anode portion 110 in the plating chamber.

[0088] Among them, the best qualification requirement for Invar raw materials used in fine metal masks (FMM) is low thermal expansion coefficient (CTE). In order to obtain Invar with low thermal expansion coefficient by electrolytic plating, Ni 2+ 、Fe 2+ The coexistence ratio is particularly important.

[0089] Therefore, the Invar plating solution needs to precipitate the Ni-Fe alloy from the substrate at a ratio of 36% to 38%. In order to maintain a constant precipitation ratio, it is necessary to regulate and manage the Ni salt (Ni 2+ ) and Fe salts (Fe 2+ )concentration.

[0090] However, by the reaction in the insoluble anode (H2O--->1 / 2O2+2H + +2e - ) generated in O2 and Fe 2+ The self-oxidation reaction (Fe 2+ --->Fe 3+ +e - ) generated in the Fe 3+ Can generate iron oxide (4Fe+3O2--->2Fe 3+ 2O 2- 3).

[0091] As described above, oxygen generated in the anode portion 110 during plating promotes the formation of unstable Fe 2+ Oxidation will sharply reduce the Fe content in the plating solution. 2+ Concentration. And, due to the iron oxide generated in this way, the Fe-based 3+ The reduction reaction (Fe 3+ +e - --->Fe 2+ ) of Fe 3+ And, when Fe 2+ Concentration compared to Ni 2+ When the concentration is significantly reduced, the Ni eutectoid ratio of the alloy precipitated in the cathode is relatively high, and ultimately an Invar raw material with a low thermal expansion coefficient cannot be obtained.

[0092] FIG. 4 is a graph showing the thermal expansion coefficient of Invar according to the Ni content in an example of the present invention.

[0093] As shown in Figure 4, due to the Fe salt (Fe 2+) concentration decreases, resulting in an uneven Ni-Fe eutectoid ratio. Consequently, higher Ni content leads to a higher thermal expansion coefficient. Furthermore, iron oxide is insoluble in the plating solution. As an impurity in the plating solution, it can cause protrusions on the surface of the conductor (object I), reducing the electrodeposition properties of the invar plating layer or inducing scarring.

[0094] One prior art technique, in order to suppress the formation of iron oxide from the oxygen generated in the anode portion 110, attempts to provide an ion exchange membrane that blocks the flow of the plating solution and the electrolyte solution by allowing ions discharged from the anode to pass through the anode portion 110. However, while this prior art ion exchange membrane can block the flow of oxygen generated in the anode portion 110, which serves as an insoluble anode, out of the two supply pathways for dissolved oxygen in the plating solution, it does not specifically address the flow of oxygen into the plating solution from air.

[0095] In the present invention, as described above, the first supply nozzle 160 and the second supply nozzle 170 supply the plating solution and the inert gas together, so that two supply paths of dissolved oxygen in the plating solution can be controlled.

[0096] At this time, the inert gas is preferably N2 gas, but it has low reactivity and other inert gases with good chemical stability can also be used. In particular, when the inert gas is N2 gas, compressed nitrogen gas with a pressure of 120 kg / cm 2 Filled with more than 99.99% N2 gas.

[0097] This inert gas sprayed into the plating solution helps to remove hydrogen generated and attached to the surface of the cathode portion 120, maintains nitrogen supersaturation in the plating solution, and ultimately controls the inflow of oxygen generated on the insoluble anode and the inflow of oxygen in the atmosphere, thereby preventing the formation of iron oxide.

[0098] Dissolved oxygen (DO) is molecular oxygen dissolved in water or a solution, typically supplied by oxygen in the air. The amount of dissolved oxygen in water or a solution is affected by temperature and air pressure, with the amount decreasing as the temperature of the solution increases.

[0099] Under the plating solution usage conditions of the electroplating apparatus according to an embodiment of the present invention, there are two possible pathways for the supply of dissolved oxygen into the plating solution: one in which the supply pathway is in contact with the air in the plating solution, and another in which oxygen generated by the insoluble anode reaction flows in. In the present invention, first supply nozzle 160 and second supply nozzle 170 continuously supply an inert gas to the plating solution, thereby preventing additional oxygen from flowing into the plating solution.

[0100] FIG. 5 shows the Fe content in the plating solution according to the number of plating times of the plating apparatus according to the amount of inert gas input according to an embodiment of the present invention.2+ Concentration curve.

[0101] According to the number of plating times (0 to 10 times), the outer shell without inert gas (N2) is sprayed with plating solution per minute. The inert gas (N2) is sprayed into the plating solution at a rate of one minute. Fe in the plating solution of the shell of inert gas (N2) 2+ The concentrations are shown in Table 1 below.

[0102] The supply of inert gas (N2) is based on the invar plating solution. Measured as a benchmark.

[0103] Table 1

[0104] 5, it can be confirmed that the shell does not spray inert gas (N2) into the plating solution. As the number of plating times increases, Fe 2+ The concentration is significantly lower, but the shell that sprays inert gas (N2) into the plating solution (per minute) per minute ), even if the number of plating times increases, it is stipulated to maintain Fe 2+ concentration.

[0105] FIG. 6 is a graph showing the Ni eutectoid ratio in the invar according to the number of electroplating times of the electroplating apparatus according to the amount of inert gas supplied in an embodiment of the present invention.

[0106] According to the number of plating times (0 to 10 times), the outer shell without inert gas (N2) is sprayed with plating solution per minute. The inert gas (N2) is sprayed into the plating solution at a rate of one minute. The Ni content in the invar of the inert gas (N2) shell is shown in Table 2 below.

[0107] Table 2

[0108] 6, it can be confirmed that the shell of the electroplating solution without spraying inert gas (N2) increases with the number of electroplating times, and the Ni content gradually increases, but the shell of the electroplating solution with spraying inert gas (N2) (per minute) per minute ), even if the number of electroplating times increases, it is stipulated to maintain the Ni content.

[0109] FIG. 7 is a graph showing the amount of dissolved oxygen in the plating solution according to the amount of inert gas supplied and the number of plating cycles of the plating apparatus according to an embodiment of the present invention.

[0110] According to the number of plating times (0 to 10 times), the outer shell without inert gas (N2) is sprayed with plating solution per minute. The inert gas (N2) is sprayed into the plating solution at a rate of one minute. Dissolved oxygen content in the plating solution of the inert gas (N2) shell As shown in Table 3 below.

[0111] The supply of inert gas (N2) is based on the invar plating solution. The dissolved oxygen content was measured using a METTLER TOLEDO InPro6860i / 12 / 120 / nA sensor at 40°C.

[0112] Table 3

[0113] 7, it can be confirmed that the amount of dissolved oxygen in the plating solution is measured without spraying inert gas (N2) into the housing. Higher, but the shell of the inert gas (N2) sprayed into the plating solution (per minute per minute ), the dissolved oxygen content in the plating solution is measured Very low.

[0114] As described above, the preferred embodiments are disclosed in the drawings and the specification. Although specific terms are used, they are intended to illustrate the present invention only and are not intended to limit or restrict the scope of the present invention as described in the claims. Therefore, those skilled in the art will appreciate that various variations and equivalent embodiments are possible. Therefore, the true scope of protection of the present invention lies in the technical concepts of the appended claims.

Claims

1. A metal film synthesis device for display, It is characterized in that include: The water tank part is open at the top and has a receiving space inside; The electroplating unit is disposed in the water tank and electroplates the object disposed inside the water tank according to the power supply of the power supply unit; a plating solution supplying unit that supplies the plating solution to the plating unit, receives the plating solution flowing from the water tank unit, and circulates the plating solution; and a gas supply unit for supplying an inert gas to the electroplating unit; The plating section sprays supplied plating solution and inert gas toward an object.

2. The metal thin film synthesis device for display according to claim 1, It is characterized in that The electroplating unit comprises: an anode portion, electrically connected to the anode of the power supply portion, and releasing ions toward an object in the water tank portion; a cathode portion electrically connected to a cathode of the power supply portion and supporting an object inside the water tank portion; and The first supply nozzle and the second supply nozzle are respectively provided at one side and the other side of the anode portion, and spray the plating solution and the inert gas together toward the object.

3. The metal thin film synthesis device for display according to claim 2, It is characterized in that The first supply nozzle and the second supply nozzle are formed so that the directions of the injection holes are inclined toward the lower direction of the anode part.

4. The metal thin film synthesis device for display according to claim 3, It is characterized in that A main supply pipe and a first branch supply pipe and a second branch supply pipe branching from the main supply pipe are provided in the first supply nozzle and the second supply nozzle. The plating liquid and inert gas supplied by the main supply pipe are selectively supplied to the first supply nozzle and the second supply nozzle through the first branch supply pipe and the second branch supply pipe to be sprayed.

5. The metal thin film synthesis device for display according to any one of claims 1 to 4, It is characterized in that The inert gas is compressed nitrogen.

6. The metal thin film synthesis device for display according to claim 5, It is characterized in that The compressed nitrogen gas is maintained in a supersaturated state in the plating solution and is injected at a speed above a specified speed so as to block the inflow of oxygen.

7. The metal thin film synthesis device for display according to claim 6, It is characterized in that The compressed nitrogen gas is fed in an amount of 0.1 liter to 1.0 liter per minute based on 100 liters of the plating solution.

8. A method for synthesizing a metal thin film for a display, wherein the object in the water tank is electroplated by an electroplating unit on the upper part of the water tank. It is characterized in that The plating solution and the inert gas are sprayed toward the object through the supply nozzle of the plating section.

9. The method for synthesizing a metal thin film for a display according to claim 8, It is characterized in that The inert gas is compressed nitrogen.

10. The method for synthesizing a metal thin film for a display according to claim 9, It is characterized in that The compressed nitrogen gas is maintained in a supersaturated state in the plating solution and is injected at a speed above a specified speed so as to block the inflow of oxygen.

11. The method for synthesizing a metal thin film for a display according to claim 10, It is characterized in that The compressed nitrogen gas is fed in an amount of 0.1 liter to 1.0 liter per minute based on 100 liters of the plating solution.

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