Sound production module and electronic device

Abstract

Disclosed in the present invention are a sound production module and an electronic device. The sound production module comprises a sound production unit and a module housing. The sound production unit is provided with a first vibration assembly and a second vibration assembly, the vibration direction of the first vibration assembly being disposed at an included angle to the vibration direction of the second vibration assembly; the module housing has an accommodating space, the sound production unit being disposed within the accommodating space, a rear sound cavity being formed between the sound production unit and the module housing, and the module housing having a sound outlet portion for transmitting sound waves of the first vibration assembly and the second vibration assembly to the outside. The present invention provides a sound production module capable of effectively widening the frequency band, and the sound production module has a good sound production effect.

Description

Sound modules and electronic devices Technical Field

[0001] The present invention relates to the technical field of electroacoustic conversion, and in particular to a sound module and an electronic device using the sound module. Background Art

[0002] Due to their small size, micro speakers are widely used in modern portable, communication, and smart devices, and users' demand for high sound quality is also increasing. Especially for some portable smart devices, users are no longer satisfied with the presence or absence of sound, but are more pursuing good sound quality.

[0003] Currently, the effective frequency band of micro speakers in smart mobile terminals is narrow, the timbre is relatively monotonous, and the sound quality is poor.

[0004] Summary of the Invention

[0005] The main purpose of the present invention is to provide a sound module and an electronic device, aiming to provide a sound module, the sound unit of which includes a first vibration component and a second vibration component arranged at an angle, which can expand the bandwidth of the sound module and improve the sound effect.

[0006] To achieve the above objectives, the present invention provides a sound module, comprising:

[0007] A sound-emitting monomer, wherein the sound-emitting monomer is provided with a first vibration component and a second vibration component, the vibration direction of the first vibration component is arranged at an angle to the vibration direction of the second vibration component, and the size of the sound-emitting monomer along the vibration direction of the first vibration component is smaller than the size of the sound-emitting monomer along the vibration direction of the second vibration component; and

[0008] A module housing, wherein the module housing has a receiving space, the sound-emitting unit is arranged in the receiving space and forms a rear sound cavity between the sound-emitting unit and the module housing;

[0009] The module shell has a supporting wall and a sound-emitting part connected to the supporting wall. The sound-emitting unit is provided with a side of the first vibration component connected to the supporting wall, and the sound-emitting unit is provided with a side of the second vibration component connected to the sound-emitting part. The sound-emitting part transmits the sound waves of the first vibration component and the sound waves of the second vibration component to the outside world.

[0010] In one embodiment, the sound output portion is located on a peripheral side of the module housing, the sound output portion is opposite to and communicates with the second vibration component, and the sound waves of the second vibration component are radiated outward through the sound output portion;

[0011] A first front cavity is formed between the first vibration component and the module shell, the support wall is provided with a first fracture, the first front cavity is connected to the sound output part through the first fracture, and the sound waves of the first vibration component are radiated outward through the first front cavity, the first fracture, and the sound output part.

[0012] In one embodiment, the sound output portion has a first sound output channel, the first break is connected to the first sound output channel, and the sound waves of the first vibration component and the sound waves of the second vibration component are both radiated outward through the first sound output channel.

[0013] In one embodiment, a sound-guiding pipe is provided between the sound-emitting portion and the second vibration component, the sound-guiding pipe is connected to the periphery of the second vibration component and is correspondingly connected to the first sound-emitting channel, and the sound-guiding pipe is provided with a first avoidance channel, and the first avoidance channel is opposite to and connected to the first break.

[0014] In one embodiment, the sound output portion has a second sound output channel and a third sound output channel, the second sound output channel and the third sound output channel are isolated from each other, the second sound output channel is opposite to and connected to the second vibration component, and the sound waves of the second vibration component are radiated outward through the second sound output channel;

[0015] The first break is connected to the third sound outlet channel, and the sound waves of the first vibration component are radiated outward through the first front cavity, the first break, and the third sound outlet channel.

[0016] In one embodiment, the third sound outlet channels include two, and the two third sound outlet channels are respectively arranged on two opposite sides of the second sound outlet channel.

[0017] In one embodiment, a sound-guiding tube is provided between the sound-emitting portion and the second vibration component. The sound-guiding tube is connected to the periphery of the second vibration component and is in communication with the second sound-emitting channel. Sound waves of the second vibration component are radiated outward through the sound-guiding tube and the second sound-emitting channel.

[0018] A second avoidance channel is provided between the sound output part and the sound guiding pipe. The second avoidance channel is opposite to and connected to the first break. The sound waves of the first vibration component are radiated outward through the first front cavity, the first break, the second avoidance channel and the third sound output channel.

[0019] In one embodiment, the module housing includes

[0020] A module lower shell, wherein the module lower shell is provided with the support wall and the sound output portion;

[0021] The module upper shell and the module lower shell are connected and enclosed to form the accommodation space, and the rear sound cavity is formed between the sound unit, the module upper shell and the module lower shell.

[0022] In one embodiment, a step structure is provided on the side of the sound unit facing away from the first vibration component and the second vibration component, a vibration space is formed in the sound unit, and the step structure is provided with an air leakage hole connecting the vibration space and the rear sound cavity; the sound module also includes a breathable isolation piece provided on the step structure, the breathable isolation piece covers the air leakage hole, the rear sound cavity is filled with sound-absorbing particles, and the breathable isolation piece is used to prevent the sound-absorbing particles from entering the vibration space.

[0023] In one embodiment, the first vibration component is used for producing bass sounds, and the second vibration component is used for producing treble sounds.

[0024] In one embodiment, the sound-emitting unit includes:

[0025] A housing, the housing comprising a first housing and a second housing arranged at an angle;

[0026] a magnetic circuit system connected to the first shell and the second shell; and

[0027] A vibration system, the vibration system includes the first vibration component and the second vibration component, the first vibration component is connected to the first shell and is opposite to the magnetic circuit system, the second vibration component is connected to the second shell and is opposite to the magnetic circuit system, and the vibration direction of the first vibration component is set at an angle to the vibration direction of the second vibration component.

[0028] In one embodiment, the magnetic circuit system has a first magnetic gap and a second magnetic gap;

[0029] The first vibration assembly includes a first diaphragm and a first voice coil, the first diaphragm is connected to the first housing, one end of the first voice coil is connected to the first diaphragm, and the other end of the first voice coil is suspended in the first magnetic gap;

[0030] The second vibration component includes a second diaphragm and a second voice coil, the second diaphragm is connected to the second shell, the second voice coil is connected to the second diaphragm, and the second voice coil is arranged in the second magnetic gap.

[0031] In one embodiment, the magnetic circuit system comprises:

[0032] Magnetic yoke;

[0033] a first magnetic circuit portion, the first magnetic circuit portion being opposite to and spaced from the first vibrating assembly, the first magnetic circuit portion comprising a central magnetic circuit portion and a side magnetic circuit portion provided on a side of the magnetic yoke facing the housing, the side magnetic circuit portion being provided outside the central magnetic circuit portion and spaced from the central magnetic circuit portion to form the first magnetic gap; and

[0034] The second magnetic circuit part is arranged on the magnetic yoke, opposite to and separated from the second vibration component, and the second magnetic circuit part is located on the side of the first magnetic circuit part facing away from the first vibration component, and cooperates with the first magnetic circuit part to form the second magnetic gap.

[0035] In one embodiment, the central magnetic circuit portion includes a central magnetic circuit and a first common magnetic circuit that are connected, and the side magnetic circuit portion includes a side magnetic circuit and a second common magnetic circuit, wherein the side magnetic circuit is located outside the central magnetic circuit and is separated to form a first sub-gap, and the second common magnetic circuit is located on a side of the first common magnetic circuit that faces away from the central magnetic circuit and is separated to form a second sub-gap, and the first sub-gap is connected to the second sub-gap to form the first magnetic gap;

[0036] The second magnetic circuit portion includes a first magnet and a second magnet arranged at an interval, the first magnet is opposite to and spaced from the first common magnetic circuit to form a third sub-gap, the second magnet is opposite to and spaced from the second common magnetic circuit to form a fourth sub-gap, the third sub-gap and the fourth sub-gap are connected to form the second magnetic gap.

[0037] In one embodiment, the second voice coil is a flat voice coil, comprising two long axis sides and two short axis sides connected end to end, each of the short axis sides being arranged between two long axis sides, one of the long axis sides being arranged in the third sub-gap, and the other long axis side being arranged in the fourth sub-gap.

[0038] In one embodiment, the side magnetic circuit portion includes a side magnetic circuit and a second common magnetic circuit, a first sub-gap is formed between the side magnetic circuit and the central magnetic circuit, a second sub-gap is formed between the second common magnetic circuit and the central magnetic circuit, and the first sub-gap is connected to the second sub-gap to form the first magnetic gap;

[0039] The second magnetic circuit portion includes a third magnet, which is opposite to the second common magnetic circuit and forms the second magnetic gap therebetween.

[0040] In one embodiment, the second voice coil is a flat voice coil, comprising two long axis sides and two short axis sides connected end to end, each of the short axis sides being arranged between the two long axis sides, one of the long axis sides being connected to the second diaphragm, and the other long axis side being arranged in the second magnetic gap.

[0041] In one embodiment, the magnetic yoke includes a first section, a second section, and a third section connected in sequence, the first section and the third section are respectively arranged at an angle to the second section and are located on opposite sides of the second section, part of the first magnetic circuit is arranged in the first section, and part of the second magnetic circuit is arranged in the third section.

[0042] The present invention also proposes an electronic device, including a device housing and the above-mentioned sound module, the device housing including a display surface, a back surface opposite to the display surface, and a side surface connecting the display surface and the back surface, and the sound module is arranged in the device housing.

[0043] In one embodiment, the sound module is located at the top of the electronic device, and a first sound hole and a second sound hole are provided on the top of the device shell. The first sound hole and the second sound hole are both connected to the sound emitting part, and the second sound hole and the sound emitting part are arranged opposite to each other. The first sound hole is provided on the display surface or on the connecting area between the display surface and the side surface, and the second sound hole is provided on the side surface.

[0044] In one embodiment, the sound module is arranged at the bottom of the electronic device, the bottom of the device housing has a bottom sound hole, the bottom sound hole is opposite to and connected to the sound emitting part, and the bottom sound hole is arranged on the side.

[0045] The sound module of the technical solution of the present invention arranges the first vibration component and the second vibration component on the sound unit so that the vibration direction of the first vibration component is set at an angle to the vibration direction of the second vibration component, and radiates the sound waves of the first vibration component and the second vibration component to the outside through the sound output part, thereby broadening the frequency band of the sound module and making the sound of the sound module richer and fuller. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0047] FIG1 is a plan view of a sound module according to an embodiment of the present invention;

[0048] FIG2 is a schematic cross-sectional view along line AA in FIG1 ;

[0049] FIG3 is a perspective schematic diagram of a sound module with part of the module housing removed in accordance with an embodiment of the present invention;

[0050] FIG4 is a schematic structural diagram of a lower shell of a sound module according to an embodiment of the present invention;

[0051] FIG5 is an exploded schematic diagram of a sound module according to an embodiment of the present invention;

[0052] FIG6 is a plan view of a sound module according to an embodiment of the present invention;

[0053] FIG7 is a schematic cross-sectional view along line BB in FIG1 ;

[0054] FIG8 is a schematic cross-sectional view taken along line CC in FIG1 ;

[0055] FIG9 is a perspective schematic diagram of a sound module with part of the module housing removed in accordance with an embodiment of the present invention;

[0056] FIG10 is a schematic structural diagram of a lower shell of a sound module according to an embodiment of the present invention;

[0057] FIG11 is an exploded schematic diagram of a sound module according to an embodiment of the present invention;

[0058] FIG12 is a cross-sectional schematic diagram of a sound-emitting unit according to an embodiment of the present invention;

[0059] FIG13 is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present invention;

[0060] FIG14 is a schematic cross-sectional view of an electronic device according to an embodiment of the present invention.

[0061] Description of Figure Numbers:

[0062] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0063] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0064] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0065] At the same time, the meaning of "and / or" or "and / or" appearing in the full text includes three options. Taking "A and / or B" as an example, it includes option A, or option B, or an option in which both A and B are satisfied.

[0066] In addition, in the present invention, descriptions such as "first" and "second" are for descriptive purposes only and should not be understood as indicating or implying their relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between the various embodiments can be combined with each other, but this must be based on the fact that they can be implemented by ordinary technicians in this field. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0067] Due to their small size, micro speakers are widely used in modern portable, communication, and smart devices, and users' demand for high sound quality is also increasing. Especially for some portable smart devices, users are no longer satisfied with the presence or absence of sound, but are more pursuing good sound quality.

[0068] Currently, the effective frequency band of micro speakers in smart mobile terminals is narrow, the timbre is relatively monotonous, and the sound quality is poor.

[0069] Based on the above concepts and problems, the present invention proposes a sound module 100. It is understandable that the sound module 100 is applied to an electronic device 200, which can be a mobile phone, tablet, computer, earphones, watch or TV, etc., which is not limited here.

[0070] Please refer to Figures 1 to 12. In an embodiment of the present invention, the sound module 100 includes a sound unit 1 and a module shell 2, wherein the module shell 2 has a receiving space, and the sound unit 1 is received in the receiving space. The sound unit 1 is provided with a first vibration component 131 and a second vibration component 132. The vibration direction of the first vibration component 131 is arranged at an angle to the vibration direction of the second vibration component 132. The module shell 2 has a support wall 212 and a sound output part 211 connected to the support wall 212. The sound unit 1 is provided with a side of the first vibration component 131 connected to the support wall 212, and the sound unit 1 is provided with a side of the second vibration component 132 connected to the sound output part 211. The sound output part 211 transmits the sound waves of the first vibration component 131 and the sound waves of the second vibration component 132 to the outside world.

[0071] In this embodiment, as shown in Figures 2 and 7 to 8, the sound unit 1 is arranged in the receiving space and forms a rear sound cavity 3 with the module shell 2. The rear sound cavity 3 can be further used to fill sound-absorbing particles, thereby effectively improving the low-frequency performance and acoustic performance of the sound module 100.

[0072] In this embodiment, by arranging the first vibration component 131 and the second vibration component 132 on the sound-emitting unit 1, the vibration direction of the first vibration component 131 and the vibration direction of the second vibration component 132 are set at an angle, and the sound waves of the first vibration component 131 and the second vibration component 132 are radiated to the outside through the sound-emitting part 211, thereby broadening the frequency band of the sound-emitting module 100 and making the sound of the sound-emitting module 100 richer and fuller.

[0073] As shown in Figures 2, 7, and 8, the dimension of the sound-emitting unit 1 along the vibration direction of the first vibration component 131 is smaller than the dimension of the sound-emitting unit 1 along the vibration direction of the second vibration component 132. As a result, the sound-emitting unit 1 has a flat structure, which, when adapted to an application end, facilitates a thin design of the application end and improves the user experience.

[0074] As shown in Figures 1 to 11, the sound-emitting portion 211 is located on the peripheral side of the module shell 2. The sound-emitting portion 211 is opposite to and connected to the second vibration component 132. The sound waves of the second vibration component 132 radiate outward through the sound-emitting portion 211. A first front cavity 1310 is formed between the first vibration component 131 and the module shell 2. The support wall 212 is provided with a first break 2121. The first front cavity 1310 is connected to the sound-emitting portion 211 through the first break 2121. The sound waves of the first vibration component 131 radiate outward through the first front cavity 1310, the first break 2121, and the sound-emitting portion 211. In this way, the sound waves of the first vibration component 131 and the second vibration component 132 are both radiated to the outside world by the sound-emitting portion 211, broadening the frequency band of the sound module 100 and improving its sound effect. Optionally, a dustproof net 26 is further provided on the sound-emitting portion 211 to prevent external dust or impurities from entering the interior of the sound-emitting portion 211 and affecting its sound effect.

[0075] As one specific embodiment, the sound output portion 211 has a first sound output channel 2111. The first break 2121 is connected to the first sound output channel 2111. The sound waves of the first vibration component 131 and the sound waves of the second vibration component 132 are both radiated outward through the first sound output channel 2111. It can be understood that the first sound output channel 2111 has a hollow structure. This allows the sound generated by the first vibration component 131 and the second vibration component 132 to be smoothly transmitted through the first sound output channel 2111, thereby improving the sound effect of the sound module 100.

[0076] In this embodiment, the radiation paths of the sound waves of the second vibration component 132 and the first vibration component 131 are connected, and the sound waves of the second vibration component 132 and the sound waves of the first vibration component 131 are mixed and radiated to the outside through the first sound output channel 2111. In this way, the frequency band of the sound module 100 can be further widened and the sound effect can be improved.

[0077] Optionally, a sound-guiding duct 23 is provided between the sound-emitting portion 211 and the second vibration assembly 132. The sound-guiding duct 23 is connected to the periphery of the second vibration assembly 132 and is in communication with the first sound-emitting channel 2111. The sound-guiding duct 23 is provided with a first avoidance channel 231, which is opposite and in communication with the first break 2121. It will be appreciated that the sound-guiding duct 23 has a hollow structure, so that the sound generated by the first vibration assembly 131 and the second vibration assembly 132 can be smoothly transmitted through the sound-guiding duct 23, thereby improving the sound effect of the sound module 100.

[0078] In this embodiment, a sound-guiding tube 23 is provided between the sound-emitting part 211 and the second vibration component 132, that is, a sound-guiding tube 23 is provided between the sound-emitting unit 1 and the module shell 2, so that during the assembly and use of the sound-emitting unit 1, the sound-emitting unit 1 can be adapted to different assembly environments and matched with different module shells 11 by only replacing the sound-guiding tube 23. In this way, the appearance design of the sound-emitting unit 1 can be liberated.

[0079] Optionally, a sealing foam 25 is provided on the surface of the sound-conducting tube 23 away from the second vibration assembly 132. This improves the sealing between the sound-conducting tube 23 and external components, thereby improving the sound quality of the sound module 100. It is understood that the sealing foam 25 is annular and has a first avoidance groove 251 that communicates with the first avoidance channel 231.

[0080] Optionally, the side of the sound-conducting tube 23 away from the second vibration component 132 is an inclined surface, that is, there is an angle between the inclined surface and the mounting surface of the second vibration component 132. This facilitates the assembly of the sound module 100 and external components. While the sound-conducting module 1 is being assembled along the vibration direction of the first vibration component 131, the inclined surface of the sound-conducting tube 23 can also be tightened by force, thereby improving the operability of the sound-conducting module 1 during assembly. Furthermore, the distance between the end of the inclined surface close to the first vibration component 131 and the second vibration component 132 is less than the distance between the end of the inclined surface away from the first vibration component 131 and the second vibration component 132.

[0081] As another specific embodiment, the sound outlet portion 211 has a second sound outlet channel 2112 and a third sound outlet channel 2113. The second sound outlet channel 2112 and the third sound outlet channel 2113 are isolated from each other. The second sound outlet channel 2112 is opposite to and connected to the second vibration component 132. The sound waves of the second vibration component 132 radiate outward through the second sound outlet channel 2112. The first break 2121 and the third sound outlet channel 2113 are connected. The sound waves of the first vibration component 131 radiate outward through the first front cavity 1310, the first break 2121, and the third sound outlet channel 2113. It can be understood that the second sound outlet channel 2112 and the third sound outlet channel 2113 have a hollow structure. In this way, the sound emitted by the second vibration component 132 can be smoothly transmitted through the second sound outlet channel 2112, and the sound emitted by the first vibration component 131 can be smoothly transmitted through the third sound outlet channel 2113, thereby improving the sound effect of the sound module 100.

[0082] In this embodiment, the second sound outlet channel 2112 and the third sound outlet channel 2113 are isolated from each other, that is, the sound waves of the first vibration component 131 and the sound waves of the second vibration component 132 are radiated outward through different radiation paths. In this way, the space between the first vibration component 131 and the second vibration component 132 and the module shell 2 is separated into different radiation paths, which can improve the high-frequency performance of the sound module 100.

[0083] Optionally, the third sound outlet channel 2113 includes two, two third sound outlet channels 2113 respectively arranged on opposite sides of the second sound outlet channel 2112. In this way, the second sound outlet channel 2112 can be directly opposite the second vibration component 132, so that the sound waves of the second vibration component 132 can be directly radiated to the outside world, thereby improving the high-frequency performance of the sound module 100. It can be understood that the first break 2121 and the second sound outlet channel 2112 are isolated from each other, and the first break 2121 is divided into two parts located on both sides of the second sound outlet channel 2112, each of which is connected to a corresponding third sound outlet channel 2113. Optionally, the third sound outlet channel 2113 and the second sound outlet channel 2112 are flared, and the diameter of the side away from the sound unit 1 is larger than the diameter of the side close to the sound unit 1. Of course, in other embodiments, there can also be one third sound outlet channel 2113, which is not limited here.

[0084] Optionally, a sound-guiding pipe 23 is provided between the sound-emitting portion 211 and the second vibration component 132. The sound-guiding pipe 23 is connected to the periphery of the second vibration component 132 and is correspondingly connected to the second sound outlet channel 2112. The sound waves of the second vibration component 132 radiate outward through the sound-guiding pipe 23 and the second sound outlet channel 2112. A second avoidance channel 24 is provided between the sound-emitting portion 211 and the sound-guiding pipe 23. The second avoidance channel 24 is opposite to and connected to the first break 2121. The sound waves of the first vibration component 131 radiate outward through the first front cavity 1310, the first break 2121, the second avoidance channel 24, and the third sound outlet channel 2113. It can be understood that the sound-guiding pipe 23 has a hollow structure, so that the sound emitted by the second vibration component 132 can be smoothly transmitted through the sound-guiding pipe 23, thereby improving the sound effect of the sound module 100. It is understood that the inner wall of the sound outlet portion 211 is connected to the outer wall of the sound guide tube 23, and the second avoidance channel 24 is formed between the sound guide tube 23 and the sound outlet portion 211, specifically between the inner wall of the sound outlet portion 211 and the outer wall of the sound guide tube 23. As shown in Figure 10, the second avoidance channel 24 is formed by the inner wall forming the third sound outlet channel 2113 being recessed in a direction away from the second vibration component 132 relative to the inner wall forming the second sound outlet channel 2112. Of course, in other embodiments, the portion of the outer wall of the sound guide tube 23 corresponding to the third sound outlet channel 2113 can also be recessed in a direction closer to the second vibration component 132 to form a second avoidance channel 24 between the two that is connected to the first break 2121.

[0085] In this embodiment, a sound-guiding tube 23 is provided between the sound-emitting part 211 and the second vibration component 132, that is, a sound-guiding tube 23 is provided between the sound-emitting unit 1 and the module shell 2, so that during the assembly and use of the sound-emitting unit 1, the sound-emitting unit 1 can be adapted to different assembly environments and matched with different module shells 11 by only replacing the sound-guiding tube 23. In this way, the appearance design of the sound-emitting unit 1 can be liberated.

[0086] Optionally, a sealing foam 25 is provided on the surface of the sound-conducting tube 23 away from the second vibration assembly 132. This improves the sealing between the sound-conducting tube 23 and external components, thereby enhancing the sound quality of the sound module 100. It is understood that the sealing foam 25 is annular and has a second avoidance groove 252 that communicates with the third sound outlet channel 2113.

[0087] Optionally, the side of the sound-conducting tube 23 away from the second vibration component 132 is an inclined surface, that is, there is an angle between the inclined surface and the mounting surface of the second vibration component 132. This facilitates the assembly between the sound-emitting unit 1 and the module housing 2. While the sound-emitting unit 1 is being assembled along the vibration direction of the first vibration component 131, the inclined surface of the sound-conducting tube 23 can also be tightened by force, thereby improving the operability of the sound-emitting unit 1 during assembly. Furthermore, the distance between the end of the inclined surface close to the first vibration component 131 and the second vibration component 132 is less than the distance between the end of the inclined surface away from the first vibration component 131 and the second vibration component 132.

[0088] In one embodiment of the present invention, the module housing 2 includes a module upper shell 22 and a module lower shell 21. The module lower shell 21 and the module upper shell 22 are connected and enclose a receiving space. The module lower shell 21 is provided with a support wall 212 and a sound outlet 211. A rear sound cavity 3 is formed between the module lower shell 21, the sound unit 1, the module upper shell 22, and the module lower shell 21. In this embodiment, as shown in Figures 5 and 11, by setting the module housing 2 as a two-part structure of the module lower shell 21 and the module upper shell 22, the installation and fixation of the sound unit 1 is facilitated. The module upper shell 22 and the module lower shell 21 can be fixed by bonding, welding, etc., which is not limited here.

[0089] In one embodiment, as shown in Figures 5, 11 and 12, a vibration space 14 is formed in the sound unit 1, and a step structure is provided on the side of the sound unit 1 facing away from the first vibration component 131 and the second vibration component 132. The step structure is provided with an air vent connecting the vibration space 14 and the rear sound cavity 3; the sound module 100 also includes a breathable isolation member provided in the rear sound cavity 3, which is used to prevent the sound-absorbing particles from entering the vibration space 14 of the sound unit 1 when the rear sound cavity 3 is filled with sound-absorbing particles.

[0090] Optionally, the first step surface of the step structure is provided with an air leak hole, and the breathable isolation piece is arranged in contact with the first step surface and covers the air leak hole; or, the second step surface of the step structure is provided with an air leak hole, and the breathable isolation piece is arranged in contact with the second step surface and covers the air leak hole; or, both the first step surface and the second step surface of the step structure are provided with air leak holes, and the breathable isolation piece is arranged in contact with the first step surface and the second step surface and covers the air leak hole.

[0091] Optionally, the first step surface is provided corresponding to the first vibration component, the second step surface is provided corresponding to the second vibration component, the first step surface is provided with multiple air leakage holes, the second step surface is provided with multiple air leakage holes, the breathable isolation piece includes multiple, each breathable isolation piece covers an air leakage hole setting, which is not limited here.

[0092] In this embodiment, an air vent is provided on the step structure, thereby connecting the vibration space 14 and the rear acoustic cavity 3 via the air vent, thereby balancing the air pressure in the vibration space 14 and the rear acoustic cavity 3. At the same time, a breathable spacer is provided in the rear acoustic cavity 3, so that the breathable spacer can prevent sound-absorbing particles from entering the interior of the sound-emitting unit 1 through the air vent, thereby affecting the acoustic performance of the sound-emitting unit 1.

[0093] It is understandable that the breathable spacer can be arranged in accordance with the step structure of the sound unit 1 and cover the vent hole, thereby increasing the volume of the filling cavity and achieving full filling of the sound module 100. Of course, in other embodiments, the breathable spacer can also be arranged in the rear sound cavity 3 and separate the rear sound cavity 3 from the filling cavity, that is, the breathable spacer cooperates with the module housing 2 to form the filling cavity, and the breathable spacer is spaced apart from the step structure of the sound unit 1, which is not limited here.

[0094] In one embodiment, as shown in Figures 5 and 11 , the module housing 2 is provided with a damping hole communicating with the rear acoustic cavity 3 . The sound module 100 further includes a damping member 5 disposed at the damping hole. As will be appreciated, the provision of the damping hole and the damping member 5 serves to balance the air pressure in the rear acoustic cavity 3 with that in the outside air pressure, while also allowing sound-absorbing particles to be filled into the rear acoustic cavity 3 through the damping hole.

[0095] Optionally, the damping member 5 is a breathable isolation member such as a breathable membrane or film, which is not limited here.

[0096] In one embodiment, as shown in Figures 4 to 5 and Figures 10 to 11, the sound module 100 also includes a flexible circuit board 6, which is used to connect to an external circuit. One end of the flexible circuit board 6 extends into the rear sound cavity 3 and is electrically connected to the sound unit 1. The flexible circuit board 6 has an inner solder pad 61 connected to the sound unit 1 and an outer solder pad 62 connected to the external circuit.

[0097] In this embodiment, a flexible circuit board 6 is provided to connect the external circuit to the sound unit 1, thereby ensuring the normal operation of the sound unit 1. Optionally, the flexible circuit board 6 is made of FPCB.

[0098] In one embodiment, the first vibration component 131 is used for bass sounding, and the second vibration component 132 is used for treble sounding. In this way, the bandwidth of the sound module 100 can be expanded, making the timbre of the sound module 100 fuller and rounder.

[0099] Specifically, the sound module 100 has a crossover frequency F1. When the sound module 100 is used in the electronic device 200, the Fh (front cavity resonant frequency) corresponding to the first vibration component 131 is greater than or equal to 4 kHz and less than or equal to 7 kHz, and F1>Fh. This prevents a sudden phase shift between the sound waves of the first vibration component 131 and the second vibration component 132 at the crossover frequency F1, ensuring that the vibration directions of the first and second vibration components 131, 132 are consistent at the crossover frequency F1, and the sound pressure of the sound module 100 is stable.

[0100] Optionally, F1 is greater than or equal to 6kHz, so that the sound pressure level curve of the sound module 100 formed by the combination of the first vibration component 13131 and the second vibration component 132 is relatively smooth, does not produce a large trough, and the listening experience is natural.

[0101] Furthermore, the crossover frequency F1 is greater than or equal to 6kHz and less than or equal to 10kHz. The crossover frequency F1 can be 6kHz, 6.5kHz, 7kHz, 7.5kHz, 8kHz, 8.5kHz, 9kHz, 9.5kHz, 10kHz, etc. In this way, the sound pressure levels of the first vibration component 13131 and the second vibration component 13232 can be better connected at the crossover frequency, and the sound quality is richer and more natural. The bass of the sound module 100 in this embodiment is deep and powerful, and the treble is clear and rich.

[0102] In the sound module 100 of the present invention, the sound unit 1 includes a housing 11, a magnetic circuit system 12, and a vibration system 13. The housing 11 includes a first shell and a second shell arranged at an angle. The magnetic circuit system 12 is connected to the first shell and the second shell. The vibration system 13 includes a first vibration component 131 and a second vibration component 132. The first vibration component 131 is connected to the first shell and opposite to the magnetic circuit system 12. The second vibration component 132 is connected to the second shell and opposite to the magnetic circuit system 12. The vibration direction of the first vibration component 131 is set at an angle to the vibration direction of the second vibration component 132. Optionally, the vibration direction of the first vibration component 131 is perpendicular to the vibration direction of the second vibration component 132.

[0103] In this embodiment, housing 11 is used to mount, secure, support, and protect components such as vibration system 13 and magnetic circuit system 12. Specifically, housing 11 provides a mounting base for components such as vibration system 13 and magnetic circuit system 12. It is understood that housing 11 may be a mounting shell, housing, or box having a mounting cavity. Specifically, housing 11 defines a receiving space, which is not limited herein.

[0104] Optionally, the first shell and the second shell are integrally formed, thereby improving the structural strength and stability of the housing 11. It is understood that the first shell and the second shell enclose a mounting cavity, which can be a through cavity or a through slot structure. Optionally, the first shell and the second shell are arranged vertically.

[0105] In this embodiment, the first housing has a rectangular structure, having two opposing long sides and two short sides, with the ends of the short sides connected to the two long sides, and the ends of the long sides connected to the two short sides. It will be appreciated that the second housing is connected to either the long side or the short side of the first housing, such that the second housing is perpendicular to the first housing.

[0106] It is understood that the second shell can be optionally a rectangular structure, with the second shell having two opposing long sides and two short sides, with the ends of the short sides respectively connected to the two long sides, and the ends of the long sides respectively connected to the two short sides. In this embodiment, the first shell and the second shell share a long side or a short side. The two long sides and two short sides of the first shell define a first opening, and the two long sides and two short sides of the second shell define a second opening, and the first opening and the second opening are respectively connected to the installation cavity. Optionally, the first opening and the second opening are located on two adjacent surfaces of the shell 11.

[0107] It should be noted that when the housing 11 is metal, the magnetic circuit system 12 is fixed to the housing 11 by bonding or welding. In another embodiment, when the housing 11 is plastic injection molded, the side magnetic conductive plates of the magnetic circuit system 12 are first injection molded into the housing 11 as inserts, or the magnetic circuit system 12 is fixed to the housing 11 by bonding, and then the other parts are bonded and fixed, without limitation here.

[0108] In this embodiment, as shown in Figures 2, 7 to 8, and 12, the magnetic circuit system 12 is disposed in the mounting cavity of the housing 11 and is connected to the first shell and the second shell of the housing 11. The vibration system 13 is connected to the first shell and the second shell of the housing 11 and is opposite to the magnetic circuit system 12. It can be understood that the first vibration component 131 of the vibration system 13 is connected to the first shell and covers the first opening, and the second vibration component 132 is connected to the second shell and covers the second opening. In this way, the first shell and the second shell of the housing 11, the first vibration component 131 and the second vibration component 132, and the magnetic circuit system 12 together enclose a vibration space 14.

[0109] It can be understood that the first vibration component 131 is opposite to the magnetic circuit system 12, and the second vibration component 132 is opposite to the magnetic circuit system 12, so that the first vibration component 131 and the second vibration component 132 share the magnetic circuit system 12, that is, the magnetic circuit system 12 provides a magnetic field and driving force for the first vibration component 131 and the second vibration component 132 to drive the first vibration component 131 and the second vibration component 132 to vibrate and make sounds respectively, thereby improving the utilization rate of the magnetic field while reducing the size of the sound-emitting unit 1 and reducing the cost of the sound-emitting unit 1.

[0110] In the present invention, the sound unit 1 of the sound module 100 is configured such that the outer shell 11 is configured as a first shell and a second shell that are set at an angle, so that the first shell and the second shell are an integrally formed structure and enclose a mounting cavity, thereby utilizing the mounting cavity to install and fix the magnetic circuit system 12 while improving the structural strength of the outer shell 11. At the same time, the vibration system 13 is provided with a first vibration component 131 and a second vibration component 132, so that the first vibration component 131 is connected to the first shell and is opposite to the magnetic circuit system 12, and the second vibration component 132 is connected to the second shell and is opposite to the magnetic circuit system 12. In this way, the magnetic circuit system 12 is utilized to simultaneously provide a magnetic field and a driving force for the first vibration component 131 and the second vibration component 132, so as to improve the utilization rate of the magnetic field while reducing the cost. The vibration direction of the first vibration component 131 and the vibration direction of the second vibration component 132 are further configured to be set at an angle, so that the vibration system 13 can form two independent vibration radiation surfaces that are set at an angle, which not only broadens the frequency band of the sound module 100, but also reduces the size of the sound unit 1.

[0111] In one embodiment, the magnetic circuit system 12 has a first magnetic gap 1221 and a second magnetic gap 1231. The first vibrating assembly 131 includes a first diaphragm 1311 and a first voice coil 1312. The first diaphragm 1311 is connected to the first housing. One end of the first voice coil 1312 is connected to the first diaphragm 1311, and the other end is located in the first magnetic gap 1221. The second vibrating assembly 132 includes a second diaphragm 1321 and a second voice coil 1322. The second diaphragm 1321 is connected to the second housing, and the second voice coil 1322 is located in the second magnetic gap 1231. It can be understood that the magnetic circuit system 12 provides the first magnetic gap 1221 and the second magnetic gap 1231. When the first voice coil 1312 is energized, it cuts through the magnetic flux lines in the first magnetic gap 1221, causing vibration, which drives the first diaphragm 1311 to vibrate and produce sound. When the second voice coil 1322 is energized, it cuts through the magnetic flux lines in the second magnetic gap 1231, causing vibration, which drives the second diaphragm 1321 to vibrate and produce sound.

[0112] In one embodiment, the magnetic circuit system 12 includes a magnetic yoke 121, a first magnetic circuit portion 122 and a second magnetic circuit portion 123, wherein the first magnetic circuit portion 122 is arranged on the magnetic yoke 121, and is opposite to and spaced from the first vibration component 131, and the first magnetic circuit portion 122 is provided with a first magnetic gap 1221, and the second magnetic circuit portion 123 is arranged on the magnetic yoke 121, and is opposite to and spaced from the second vibration component 132, and the second magnetic circuit portion 123 is located on the side of the first magnetic circuit portion 122 facing away from the first vibration component 131, and cooperates with the first magnetic circuit portion 122 to form a second magnetic gap 1231.

[0113] In this embodiment, as shown in Figures 2 and 7 to 8, the magnetic yoke 121 of the magnetic circuit system 12 provides an installation and fixing basis for the first magnetic circuit portion 122 and the second magnetic circuit portion 123. The first magnetic circuit portion 122 and the second magnetic circuit portion 123 are arranged on the side of the magnetic yoke 121 facing the outer shell 11, and the magnetic circuit system 12 is connected to the first shell and the second shell of the outer shell 11 through the first magnetic circuit portion 122 and the second magnetic circuit portion 123.

[0114] It is understood that the first magnetic circuit portion 122 and the second magnetic circuit portion 123 can be connected and fixed to the magnetic yoke 121 by bonding. The magnetic yoke 121 can be a structure such as a magnetic plate, which is not limited here. The first magnetic circuit portion 122 and the second magnetic circuit portion 123 can be connected to the first shell and the second shell of the housing 11 by bonding, welding, or other methods, which are not limited here.

[0115] In this embodiment, by providing a first magnetic gap 1221 in the first magnetic circuit portion 122, the first magnetic gap 1221 is utilized to provide an avoidance and vibration space for the first vibration component 131. By providing the second magnetic circuit portion 123 on the side of a portion of the first magnetic circuit portion 122 facing away from the first vibration component 131, and being opposite and spaced from the second vibration component 132, the second magnetic circuit portion 123 cooperates with a portion of the first magnetic circuit portion 122 to form a second magnetic gap 1231. While utilizing the second magnetic gap 1231 to provide an avoidance and vibration space for the second vibration component 132, the first vibration component 131 and the second vibration component 132 share a portion of the first magnetic circuit portion 122, thereby improving the magnetic field utilization of the magnetic circuit system 12 while effectively reducing costs.

[0116] To facilitate the installation and fixation of the first magnetic circuit portion 122 and the second magnetic circuit portion 123, and to position the first magnetic circuit portion 122 and the second magnetic circuit portion 123 opposite the first vibration assembly 131 and the second vibration assembly 132, respectively, in one embodiment, the magnetic yoke 121 includes a first section 1211, a second section 1212, and a third section 1213, which are sequentially connected. The first section 1211 and the third section 1213 are respectively arranged at an angle to the second section 1212 and are located on opposite sides of the second section 1212. Part of the first magnetic circuit portion 122 is arranged in the first section 1211, and the second magnetic circuit portion 123 is arranged in the third section 1213. It can be understood that the first section 1211 and the second section 1212 of the magnetic yoke 121 form a stepped structure on the side facing away from the first shell and the second shell.

[0117] In this embodiment, the first section 1211, the second section 1212, and the third section 1213 of the magnetic yoke 121 are integrally formed. Optionally, the first section 1211, the second section 1212, and the third section 1213 form a Z-shaped structure. This allows the second section 1212 to create a height difference between the first section 1211 and the third section 1213. This facilitates the installation and fixation of the first magnetic circuit portion 122 using the first section 1211 of the magnetic yoke 121, and the installation and fixation of the second magnetic circuit portion 123 using the second section 1212 and the third section 1213 of the magnetic yoke 121. Furthermore, the second magnetic circuit portion 123 is positioned below the portion of the first magnetic circuit portion 122 corresponding to the third section 1213. This improves structural compactness while allowing the second vibration assembly 132 to share a portion of the first magnetic circuit portion 122.

[0118] Optionally, the first section 1211 and the third section 1213 are parallel to the first housing, or the second section 1212 is parallel to the second housing, making the appearance of the sound module 100 more regular and easier to assemble in an external environment. The second magnetic circuit portion 123 can further be connected to the second section 1212 to increase the connection reliability of the second magnetic circuit.

[0119] In one embodiment, the first magnetic circuit portion 122 includes a central magnetic circuit portion 1222 and a side magnetic circuit portion 1223 . The side magnetic circuit portion 1223 is disposed outside the central magnetic circuit portion 1222 and is spaced apart from the central magnetic circuit portion 1222 to form a first magnetic gap 1221 .

[0120] As shown in Figures 2, 7 to 8, and 12, a portion of the central magnetic circuit portion 1222 and a portion of the side magnetic circuit portion 1223 of the first magnetic circuit portion 122 are mounted and fixed to the first section 1211 of the magnetic yoke 121. The first magnetic circuit portion 122 is connected and fixed to the first shell of the housing 11 via the side magnetic circuit portion 1223. Optionally, the magnetic yoke 121 is bonded to the central magnetic circuit portion 1222 and the side magnetic circuit portion 1223, and the side magnetic circuit portion 1223 is bonded to the first shell of the housing 11.

[0121] It is understood that the central magnetic circuit portion 1222 includes a stacked central magnet and a central magnetic plate, with the central magnet disposed between the central magnetic plate and the magnetic yoke 121. The side magnetic circuit portion 1223 includes stacked side magnets and side magnetic plates, with the side magnets disposed between the side magnetic plates and the magnetic yoke 121. It is understood that the side magnetic plates of the side magnetic circuit portion 1223 may be bonded to the housing 11, or the side magnetic plates and the housing 11 may be integrally formed.

[0122] It is understood that the side magnetic path portion 1223 can be an annular structure, wherein the annular side magnetic path portion 1223 surrounds the central magnetic path portion 1222 and is spaced apart from the central magnetic path portion 1222 to form an annular first magnetic gap 1221. Alternatively, the side magnetic path portion 1223 can be annular, or a polygonal shape such as a quadrilateral, pentagon, or hexagon.

[0123] Of course, it is also possible that the side magnetic circuit parts 1223 include multiple side magnetic circuit parts 1223, which are spaced apart and arranged around the central magnetic circuit part 1222, and are spaced apart from the central magnetic circuit part 1222 to form a first magnetic gap 1221, and two adjacent side magnetic circuit parts 1223 are spaced apart to form a gap connecting the first magnetic gap 1221.

[0124] In one embodiment, the central magnetic circuit portion 1222 and the side magnetic circuit portion 1223 of the first magnetic circuit portion 122 are both magnetized along the vibration direction of the first vibrating assembly 131, with the magnetization directions of the central magnetic circuit portion 1222 and the side magnetic circuit portion 1223 being opposite. It will be appreciated that the central magnet of the central magnetic circuit portion 1222 and the side magnets of the side magnetic circuit portion 1223 are both magnetized along the vibration direction of the first vibrating assembly 131, with the magnetization directions of the central magnet and the side magnets being opposite. It will be appreciated that this configuration can optimize the nonlinear performance of the BL.

[0125] In a specific embodiment, as shown in FIG12 , second magnetic circuit portion 123 is opposed to and spaced apart from a portion of central magnetic circuit portion 1222 and a portion of side magnetic circuit portion 1223 to cooperatively form second magnetic gap 1231. It will be understood that second magnetic circuit portion 123 is opposed to and spaced apart from a portion of central magnetic circuit portion 1222 to form a third sub-gap, and second magnetic circuit portion 123 is opposed to and spaced apart from a portion of side magnetic circuit portion 1223 to form a fourth sub-gap. The third sub-gap and the fourth sub-gap are connected to form second magnetic gap 1231.

[0126] Specifically, the central magnetic circuit portion 1222 includes a connected central magnetic circuit 12221 and a first common magnetic circuit 12222, and the side magnetic circuit portion 1223 includes a side magnetic circuit 12231 and a second common magnetic circuit 12232. The side magnetic circuit 12231 is located on the outside of the central magnetic circuit 12221 and is spaced to form a first sub-gap. The second common magnetic circuit 12232 is located on the side of the first common magnetic circuit 12222 facing away from the central magnetic circuit 12221 and is spaced to form a second sub-gap. The first sub-gap is connected to the second sub-gap to form a first magnetic gap 1221. The second magnetic circuit portion 123 is opposite to and spaced from the first common magnetic circuit 12222 to form a third sub-gap. The second magnetic circuit portion 123 is opposite to and spaced from the second common magnetic circuit 12232 to form a fourth sub-gap. The third sub-gap is connected to the fourth sub-gap to form a second magnetic gap 1231.

[0127] Optionally, the second magnetic circuit portion 123 can be an integral structure or a split structure. As one embodiment, the second magnetic circuit portion 123 includes a first magnet 1232 and a second magnet 1233 spaced apart from each other, wherein the first magnet 1232 is located below the first common magnetic circuit 12222, opposite to and spaced apart from the first common magnetic circuit 12222 to form a third sub-gap, and the second magnet 1233 is located below the second common magnetic circuit 12232, opposite to and spaced apart from the second common magnetic circuit 12232 to form a fourth sub-gap, and the third sub-gap and the fourth sub-gap are connected to form the second magnetic gap 1231.

[0128] Alternatively, the second magnetic circuit portion 123 is an integral structure, the first magnet 1232 is a magnetized region of the second magnetic circuit portion 123 , and the second magnet 1233 is a magnetized region of the second magnetic circuit portion 123 .

[0129] In this embodiment, the central magnetic circuit 12221 and the first common magnetic circuit 12222 of the central magnetic circuit portion 1222 can be an integrally formed structure, or can be separate structures connected together by bonding or other means. It is understandable that the central magnetic circuit 12221 and the first common magnetic circuit 12222 both include a central magnet and a central magnetic conductive plate, and the central magnetic conductive plates of the central magnetic circuit 12221 and the first common magnetic circuit 12222 can be an integral structure, that is, the central magnetic circuit 12221 and the first common magnetic circuit 12222 share a central magnetic conductive plate, which is not limited here.

[0130] It is understood that the side magnetic circuit portion 1223 includes a side magnetic circuit 12231 and a second common magnetic circuit 12232. That is, part of the side magnetic circuit portion 1223 is the second common magnetic circuit 12232, and another part of the side magnetic circuit portion 1223 is the side magnetic circuit 12231. Optionally, the side magnetic circuit 12231 and the second common magnetic circuit 12232 of the side magnetic circuit portion 1223 can be an integrally connected structure or can be separately arranged.

[0131] In this embodiment, the side magnetic circuit portions 1223 include multiple side magnetic circuit portions 1223, each including a side magnetic circuit 12231 and a second common magnetic circuit 12232. Optionally, the side magnetic circuit portions 1223 include four, one being the second common magnetic circuit 12232 and three being the side magnetic circuits 12231. It will be appreciated that the three side magnetic circuits 12231 are spaced apart outside the central magnetic circuit 12221 and are spaced apart from the central magnetic circuit 12221 to form a first sub-gap. The second common magnetic circuit 12232 is located on the side of the first common magnetic circuit 12222 facing away from the central magnetic circuit 12221 and is spaced apart to form a second sub-gap. The first sub-gap and the second sub-gap are connected to form the first magnetic gap 1221.

[0132] It should be noted that both the side magnetic circuit 12231 and the second common magnetic circuit 12232 include stacked side magnets and side magnetic conductive plates, and the side magnets are disposed between the side magnetic conductive plates and the magnetic conductive yoke 121 .

[0133] In order to enable the magnetic circuit system 12 to simultaneously provide a magnetic field and driving force for the first vibration component 131 and the second vibration component 132, the central magnetic circuit portion 1222 and the side magnetic circuit portion 1223 are both magnetized along the vibration direction of the first vibration component 131 and the magnetization directions are opposite, the first magnet 1232 and the second magnet 1233 are both magnetized along the vibration direction of the first vibration component 131 and the magnetization directions are opposite, and the magnetization directions of the first magnet 1232 and the central magnetic circuit portion 1222 are the same.

[0134] It can be understood that the magnetizing directions of the magnets of the first common magnetic circuit 12222 and the second common magnetic circuit 12232 are opposite, the magnetizing directions of the first magnet 1232 and the magnet of the first common magnetic circuit 12222 are the same, and the magnetizing directions of the second magnet 1233 and the magnet of the second common magnetic circuit 12232 are the same. Such an arrangement can optimize the nonlinear performance of BL.

[0135] In this embodiment, the first voice coil 1312 is an annular voice coil, arranged around the central magnetic circuit portion 1222. The second voice coil 1322 is a flat voice coil, comprising two long-axis sides connected end-to-end and two short-axis sides. Each short-axis side is positioned between the two long-axis sides, with one long-axis side positioned within the third sub-gap and the other long-axis side positioned within the fourth sub-gap. In this manner, both long-axis sides of the second voice coil 1322 cut through the magnetic flux lines within the magnetic gap, driving the second diaphragm 1321 to vibrate and produce sound.

[0136] In another specific embodiment, the second magnetic circuit portion 123 is opposite to a portion of the side magnetic circuit portion 1223, and a second magnetic gap 1231 is formed therebetween. As shown in Figures 2 and 7 to 8, the central magnetic circuit portion 1222 includes a central magnetic circuit 12221, and the side magnetic circuit portion 1223 includes a side magnetic circuit 12231 and a second common magnetic circuit 12232. The side magnetic circuit 12231 is located outside the central magnetic circuit 12221 and is separated to form a first sub-gap. The second common magnetic circuit 12232 is located outside the central magnetic circuit 12221 and is separated to form a second sub-gap. The first sub-gap and the second sub-gap are connected to form the first magnetic gap 1221. The second magnetic circuit portion 123 is opposite to the second common magnetic circuit 12232, and a second magnetic gap 1231 is formed therebetween.

[0137] In this embodiment, side magnetic circuit portion 1223 includes side magnetic circuit 12231 and second common magnetic circuit 12232. That is, part of side magnetic circuit portion 1223 is second common magnetic circuit 12232, and another part of side magnetic circuit portion 1223 is side magnetic circuit 12231. Optionally, side magnetic circuit 12231 and second common magnetic circuit 12232 of side magnetic circuit portion 1223 can be an integrally connected structure or can be separately arranged.

[0138] In this embodiment, the side magnetic circuit portions 1223 include multiple side magnetic circuit portions 1223, each including a side magnetic circuit 12231 and a second common magnetic circuit 12232. Optionally, the side magnetic circuit portions 1223 include four, one second common magnetic circuit 12232 and three side magnetic circuits 12231. It will be appreciated that the three side magnetic circuits 12231 are spaced apart outside the central magnetic circuit 12221 and form a first sub-gap with the central magnetic circuit 12221. The second common magnetic circuit 12232 is spaced apart outside the central magnetic circuit 12221 and form a second sub-gap with the central magnetic circuit 12221. The first sub-gap and the second sub-gap are connected to form the first magnetic gap 1221. Optionally, the thickness of the second common magnetic circuit 12232 is less than or equal to the thickness of the side magnetic circuit 12231.

[0139] It should be noted that the central magnetic circuit 12221 includes a stacked central magnet and a central magnetic plate, and the central magnet is arranged between the central magnetic plate and the magnetic yoke 121. The side magnetic circuit 12231 includes a stacked first side magnet and a first side magnetic plate, and the first side magnet is arranged between the first side magnetic plate and the magnetic yoke 121. The second common magnetic circuit 12232 includes a second common magnetic plate, and the first side magnetic plate and the second common magnetic plate are both arranged opposite to the central magnetic plate.

[0140] Specifically, the second magnetic circuit portion 123 includes a third magnet 1234 , which is opposite to the second common magnetic circuit 12232 and forms a second magnetic gap 1231 therebetween.

[0141] In this embodiment, first voice coil 1312 is an annular voice coil disposed around central magnetic circuit portion 1222. Second voice coil 1322 is a flat voice coil. Second voice coil 1322 includes two long axis sides connected end to end and two short axis sides. Each short axis side is disposed between the two long axis sides. One of the long axis sides is connected to second diaphragm 1321, and the other long axis side is disposed within second magnetic gap 1231. This reduces the distance between second voice coil 1322 and second diaphragm 1321, effectively preventing oscillation of second voice coil 1322 during vibration.

[0142] To ensure air pressure balance in the vibration space 14 within the sound module 100 and thus maintain vibration balance between the first vibration component 131 and the second vibration component 132, in one embodiment, the magnetic yoke 121 is provided with air vents. To prevent impurities or sound-absorbing particles from entering the sound module 100 through the air vents and affecting the performance of the sound module 100, the sound module 100 further includes air-permeable isolation members corresponding to the air vents.

[0143] Optionally, the vent holes are provided at the four corners of the first section 1211 , and the vent holes correspond to the first magnetic gap 1221 and / or the gap formed between the two side magnetic circuit portions 1223 .

[0144] The present invention further provides an electronic device 200, comprising a device housing and the aforementioned sound module 100. The sound module 100 is disposed within the device housing. The specific structure of the sound module 100 is described in the aforementioned embodiment. As will be appreciated, the device housing includes a display surface 210, a back surface 230 opposite the display surface 210, and a side surface 220 connecting the display surface 210 and the back surface 230.

[0145] In one embodiment, as shown in FIG13 , the sound module 100 is disposed on the top of the electronic device 200. The top of the electronic device 200 has a first sound hole 201 and a second sound hole 202. The first sound hole 201 and the second sound hole 202 are both connected to the sound outlet portion 211, and the second sound hole 202 and the sound outlet portion 211 are arranged opposite each other. Optionally, the first sound hole 201 is disposed on the display surface 210 or on the connecting area between the display surface 210 and the side surface 220, and the second sound hole 202 is disposed on the side surface 220. It is understood that the first sound hole 201 and the second sound hole 202 can be a single through hole or a plurality of micro-holes, without limitation.

[0146] In one embodiment, as shown in Figure 14 , the sound module 100 is disposed at the bottom of the electronic device 200. The bottom of the electronic device 200 has a bottom sound hole 203, which is opposite and connected to the sound output portion 211. Optionally, the bottom sound hole 203 is disposed on the side surface 220. It is understood that the bottom sound hole 203 can be a single through hole or a plurality of micro-holes, without limitation.

[0147] In the electronic device 200 of the present application, the sound module 100 may include multiple sound modules 100, which are arranged at both the top and bottom of the electronic device 200. When the electronic device 200 is in the handset mode, the top sound module 100 is in operation, and when the electronic device 200 is in the speaker mode, the bottom sound module 100 is in operation, or the bottom and top sound modules 100 are in operation simultaneously to enhance the speaker effect. This application does not impose any restrictions on this, and in actual applications, the sound module 100 can be flexibly selected according to actual needs.

[0148] Since the electronic device adopts all the technical solutions of all the aforementioned embodiments, it has at least all the beneficial effects brought about by the technical solutions of the aforementioned embodiments, which will not be described one by one here.

[0149] The above descriptions are merely optional embodiments of the present invention and do not limit the patent scope of the present invention. All equivalent structural transformations made based on the contents of the present invention's description and drawings, or direct / indirect applications in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A sound module, characterized in that: The sound module comprises: A sound-emitting monomer, wherein the sound-emitting monomer is provided with a first vibration component and a second vibration component, the vibration direction of the first vibration component is arranged at an angle with the vibration direction of the second vibration component, and the size of the sound-emitting monomer along the vibration direction of the first vibration component is smaller than the size of the sound-emitting monomer along the vibration direction of the second vibration component; and A module housing, wherein the module housing has a receiving space, the sound-emitting unit is arranged in the receiving space and forms a rear sound cavity with the module housing; The module shell has a supporting wall and a sound output part connected to the supporting wall, the sound-emitting unit is provided with a side of the first vibration component connected to the supporting wall, the sound-emitting unit is provided with a side of the second vibration component connected to the sound output part, and the sound output part transmits the sound waves of the first vibration component and the sound waves of the second vibration component to the outside.

2. The sound module according to claim 1, characterized in that: The sound outlet is located at the peripheral side of the module housing, the sound outlet is opposite to and connected with the second vibration component, and the sound waves of the second vibration component are radiated outward through the sound outlet; A first front cavity is formed between the first vibration component and the module shell, the support wall is provided with a first break, the first front cavity is connected with the sound output part through the first break, and the sound waves of the first vibration component are radiated outward through the first front cavity, the first break, and the sound output part.

3. The sound module according to claim 2, characterized in that: The sound output portion has a first sound output channel, the first break is connected to the first sound output channel, and the sound waves of the first vibration component and the sound waves of the second vibration component are both radiated outward through the first sound output channel.

4. The sound module according to claim 3, characterized in that: A sound-guiding pipe is provided between the sound-emitting part and the second vibration component. The sound-guiding pipe is connected to the periphery of the second vibration component and is correspondingly communicated with the first sound-emitting channel. The sound-guiding pipe is provided with a first avoidance channel, and the first avoidance channel is opposite to and communicated with the first break.

5. The sound module according to claim 2, characterized in that: The sound output part has a second sound output channel and a third sound output channel, the second sound output channel and the third sound output channel are isolated from each other, the second sound output channel is opposite to and connected to the second vibration component, and the sound waves of the second vibration component are radiated outward through the second sound output channel; The first break is connected to the third sound outlet channel, and the sound waves of the first vibration component are radiated outward through the first front cavity, the first break, and the third sound outlet channel.

6. The sound module according to claim 5, characterized in that: The third sound outlet channels include two, and the two third sound outlet channels are respectively arranged on two opposite sides of the second sound outlet channel; And / or, a sound guide pipe is provided between the sound output portion and the second vibration component, the sound guide pipe is connected to the periphery of the second vibration component and is correspondingly connected to the second sound output channel, and the sound waves of the second vibration component are radiated outward through the sound guide pipe and the second sound output channel; A second avoidance channel is provided between the sound outlet and the sound guiding pipe, the second avoidance channel is opposite to and connected with the first break, and the sound waves of the first vibration component are radiated outward through the first front cavity, the first break, the second avoidance channel and the third sound outlet channel.

7. The sound module according to claim 1, characterized in that: The module housing includes A module lower shell, wherein the module lower shell is provided with the support wall and the sound output portion; A module upper shell, wherein the module upper shell and the module lower shell are connected and enclose the accommodation space, and the rear sound cavity is formed between the sound-emitting unit, the module upper shell and the module lower shell; And / or, a step structure is provided on a side of the sound-emitting monomer facing away from the first vibration component and the second vibration component, a vibration space is formed in the sound-emitting monomer, and the step structure is provided with an air leakage hole connecting the vibration space and the rear sound cavity; the sound module further includes a breathable isolation piece provided on the step structure, the breathable isolation piece covers the air leakage hole, the rear sound cavity is filled with sound-absorbing particles, and the breathable isolation piece is used to prevent the sound-absorbing particles from entering the vibration space; And / or, the first vibration component is used for bass sound production, and the second vibration component is used for treble sound production.

8. The sound module according to any one of claims 1 to 7, characterized in that: The sound-emitting monomer comprises: A housing, the housing comprising a first housing and a second housing arranged at an angle; a magnetic circuit system connected to the first shell and the second shell; and A vibration system, the vibration system includes the first vibration component and the second vibration component, the first vibration component is connected to the first shell and is opposite to the magnetic circuit system, the second vibration component is connected to the second shell and is opposite to the magnetic circuit system, and the vibration direction of the first vibration component is set at an angle to the vibration direction of the second vibration component.

9. The sound module according to claim 8, characterized in that: The magnetic circuit system has a first magnetic gap and a second magnetic gap; The first vibration component includes a first diaphragm and a first voice coil, the first diaphragm is connected to the first housing, one end of the first voice coil is connected to the first diaphragm, and the other end of the first voice coil is suspended in the first magnetic gap; The second vibration component includes a second diaphragm and a second voice coil, the second diaphragm is connected to the second shell, the second voice coil is connected to the second diaphragm, and the second voice coil is arranged in the second magnetic gap.

10. The sound module according to claim 9, characterized in that: The magnetic circuit system comprises: Magnetic yoke; a first magnetic circuit portion, the first magnetic circuit portion is opposite to and spaced from the first vibration component, the first magnetic circuit portion comprises a central magnetic circuit portion and a side magnetic circuit portion provided on a side of the magnetic conductive yoke facing the housing, the side magnetic circuit portion is provided outside the central magnetic circuit portion and spaced from the central magnetic circuit portion to form the first magnetic gap; and The second magnetic circuit portion is arranged on the magnetic yoke, opposite to and spaced from the second vibration component, and the second magnetic circuit portion is located on the side of the first magnetic circuit portion facing away from the first vibration component, and cooperates with the first magnetic circuit portion to form the second magnetic gap.

11. The sound module according to claim 10, characterized in that: The central magnetic circuit portion includes a central magnetic circuit and a first common magnetic circuit connected to each other, the side magnetic circuit portion includes a side magnetic circuit and a second common magnetic circuit, the side magnetic circuit is located outside the central magnetic circuit and is spaced to form a first sub-gap, the second common magnetic circuit is located on a side of the first common magnetic circuit that is away from the central magnetic circuit and is spaced to form a second sub-gap, the first sub-gap is connected to the second sub-gap to form the first magnetic gap; The second magnetic circuit portion includes a first magnet and a second magnet arranged at an interval, the first magnet is opposite to and spaced from the first common magnetic circuit to form a third sub-gap, the second magnet is opposite to and spaced from the second common magnetic circuit to form a fourth sub-gap, the third sub-gap and the fourth sub-gap are connected to form the second magnetic gap.

12. The sound module according to claim 11, characterized in that: The second voice coil is a flat voice coil, and the second voice coil includes two long axis sides and two short axis sides connected end to end, each of the short axis sides is arranged between the two long axis sides, one of the long axis sides is arranged in the third sub-gap, and the other long axis side is arranged in the fourth sub-gap.

13. The sound module according to claim 10, characterized in that: The side magnetic circuit portion includes a side magnetic circuit and a second common magnetic circuit, a first sub-gap is formed between the side magnetic circuit and the central magnetic circuit, a second sub-gap is formed between the second common magnetic circuit and the central magnetic circuit, and the first sub-gap is connected to the second sub-gap to form the first magnetic gap; The second magnetic circuit portion includes a third magnet, and the third magnet is opposite to the second common magnetic circuit and forms the second magnetic gap therebetween.

14. The sound module according to claim 13, characterized in that: The second voice coil is a flat voice coil, and the second voice coil includes two long axis sides and two short axis sides connected end to end, each of the short axis sides is arranged between the two long axis sides, one of the long axis sides is connected to the second diaphragm, and the other long axis side is arranged in the second magnetic gap.

15. The sound module according to claim 10, characterized in that: The magnetic yoke includes a first section, a second section and a third section connected in sequence. The first section and the third section are respectively arranged at an angle with the second section and are located on opposite sides of the second section. Part of the first magnetic circuit is arranged in the first section, and part of the second magnetic circuit is arranged in the third section.

16. An electronic device, characterized in that: It comprises a device housing and a sound module as described in any one of claims 1 to 15, wherein the device housing comprises a display surface, a back surface opposite to the display surface, and a side surface connecting the display surface and the back surface, and the sound module is arranged in the device housing.

17. The electronic device according to claim 16, characterized in that: The sound module is located at the top of the electronic device, and a first sound outlet hole and a second sound outlet hole are provided on the top of the device housing, the first sound outlet hole and the second sound outlet hole are both connected to the sound outlet portion, and the second sound outlet hole and the sound outlet portion are arranged opposite to each other, the first sound outlet hole is provided on the display surface or on the connection area between the display surface and the side surface, and the second sound outlet hole is provided on the side surface; And / or, the sound module is arranged at the bottom of the electronic device, the bottom of the device shell has a bottom sound hole, the bottom sound hole is opposite to and connected to the sound emitting part, and the bottom sound hole is arranged on the side.

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