LED light-emitting tube chip stepped-layer packaging structure and preparation process therefor

Abstract

The present invention relates to the technical field of LED light-emitting tube packaging, and in particular to an LED light-emitting tube chip stepped-layer packaging structure and a preparation process therefor. The LED light-emitting tube chip stepped-layer packaging structure comprises a metal support and electrode sheets; the end face of one side of the metal support is provided with at least one mounting position group; the mounting position group comprises a first mounting position, a second mounting position and a third mounting position which are linearly arranged; a red light-emitting chip, a blue light-emitting chip and a green light-emitting chip are respectively provided in the first mounting position, the second mounting position and the third mounting position; the depths of the first mounting position, the second mounting position and the third mounting position are defined as h1, h2 and h3 respectively, and h1>h3>h2; and the electrode sheets are respectively arranged on two sides of the mounting position group and are electrically connected to the metal support. The technical solution of the present invention aims to improve the utilization rate of light energy of the light-emitting tube and increase the light-emitting intensity of the light-emitting tube.

Description

A LED light-emitting tube chip leap-layer packaging structure and its preparation process Technical Field

[0001] The present invention relates to the technical field of LED light-emitting tube packaging, and in particular to a leap-layer packaging structure of an LED light-emitting tube chip and a preparation process thereof. Background Art

[0002] Surface-mount LED light-emitting tubes are widely used as full-color pixel light-emitting tube display devices for LED display screens. When packaging existing surface-mount LED light-emitting tubes, the RGB chip is fixed on the metal electrode plane in the functional area of ​​the LED light-emitting tube cup. The light emitted by the RGB chip relies on the reflection of the plastic cup wall and the electrode plane and the direct light from the RGB chip to form the main light of the light-emitting tube. Since the light emitted by the RGB chip on the electrode plane is hemispherically distributed, only part of the direct light energy and part of the reflected light energy in the hemispherical distribution of light contribute to the light intensity of the light-emitting tube. A considerable part of the hemispherical distribution of light is not collected and used, resulting in waste of chip light energy and low light output efficiency of the light-emitting tube. Summary of the Invention

[0003] The main purpose of the present invention is to provide a leap-layer packaging structure for LED light-emitting tube chips, aiming to improve the utilization rate of light energy of the light-emitting tube and increase the light output intensity of the light-emitting tube.

[0004] To achieve the above-mentioned purpose, the present invention proposes a leap-layer packaging structure for LED light-emitting diode chips, comprising:

[0005] A metal bracket, wherein one end surface of the metal bracket is provided with at least one mounting position group, the mounting position group including a first mounting position, a second mounting position, and a third mounting position arranged linearly, wherein a red light-emitting chip, a blue light-emitting chip, and a green light-emitting chip are respectively provided in the first mounting position, the second mounting position, and the third mounting position, wherein the depths of the first mounting position, the second mounting position, and the third mounting position are defined as h1, h2, and h3, respectively, such that h1>h3>h2;

[0006] Electrode sheets, the electrode sheets are disposed on both sides of the mounting position group and are electrically connected to the metal bracket;

[0007] The metal bracket and the electrode sheet are both inserted into the shell, and a portion of the electrode sheet extends out of the outside of the shell.

[0008] In one embodiment of the present application, the cross-sectional profiles of the first mounting position and the third mounting position are parabolic, and the centers of the light-emitting surfaces of the red light-emitting chip and the green light-emitting chip are respectively located at the foci of the parabolic cross-sectional profiles of the first mounting position and the third mounting position.

[0009] In one embodiment of the present application, the distance between the bottom surface of the third mounting position and the bottom surface of the second mounting position is equal to the thickness of two stacked green light-emitting chips; the distance between the first mounting position and the bottom surface of the third mounting position is equal to the thickness of one green light-emitting chip; and the depth of the second mounting position is equal to the thickness of two stacked blue light-emitting chips.

[0010] In one embodiment of the present application, the electrode sheet includes a connected center mounting sheet and an independent electrode sheet. The connected center mounting sheet is formed by extending the second mounting position to two opposite outer sides respectively, and the independent electrode sheets are respectively arranged at intervals on both sides of the two connected center mounting sheets.

[0011] In one embodiment of the present application, an embedding portion is provided at the bottom of the shell, the metal bracket and the electrode sheet are both embedded in the embedding portion, the end face of the metal bracket and the outer wall of the shell are combined to form a cavity, the first mounting position, the second mounting position and the third mounting position are all filled with packaging glue, and the cavity is filled with dispersed glue.

[0012] In one embodiment of the present application, the surface of the encapsulation glue after curing is flush with the end surface of the metal bracket.

[0013] In one embodiment of the present application, the surface of the dispersed color glue after curing is flush with the edge of the shell.

[0014] In order to improve production and processing efficiency and processing accuracy, the present invention also provides a preparation process of an LED light-emitting tube chip leap-layer packaging structure, which is used to prepare the LED light-emitting tube chip leap-layer packaging structure as described above, comprising:

[0015] S10, cutting the metal sheet according to the preset feed values ​​of the metal sheet required for the first installation position, the second installation position, and the third installation position to ensure that there is suitable metal bracket material when the metal sheet is stretched to the first installation position, the second installation position, and the third installation position;

[0016] S20, shallowly punching the cut metal bracket material to form a first mounting position, a second mounting position, and a third mounting position, and micro-punching the connection between the independent electrode sheet and the first mounting position, the second mounting position, and the third mounting position, and simultaneously punching the connection between the independent electrode sheet and the conjoined middle mounting position sheet;

[0017] S30, performing a second deep punching on the first mounting position, the second mounting position, and the third mounting position, so that their depths are close to their respective preset values, and simultaneously tearing the micro-slits between the independent electrode sheet and the first mounting position, the second mounting position, and the third mounting position, so that the independent electrode sheet is separated from the first mounting position, the second mounting position, the third mounting position, and the conjoined middle mounting position sheet;

[0018] S40, shaping and leveling the surface of the metal bracket and the inner wall surfaces of the first mounting position, the second mounting position, and the third mounting position, and simultaneously leveling the electrode sheet;

[0019] S50, filling the first mounting position, the second mounting position and the third mounting position with packaging glue and curing them at high temperature, then filling the cavity with bulk glue and curing them at high temperature, and the surface of the solidified bulk glue is flush with the edge of the shell.

[0020] The technical solution of the present invention adopts the method of providing a linearly arranged first mounting position, a second mounting position, and a third mounting position on the end face of the metal bracket, and respectively arranging a red light-emitting chip, a green light-emitting chip, and a blue light-emitting chip in the three mounting positions. The mounting positions are provided with different depths according to the different thicknesses of the three light-emitting chips. This allows the light energy of the three light-emitting chips to be collected and used. After being reflected by the inner wall surface of the mounting position, it is emitted as parallel light out of the port of the mounting position. Most of the light energy of the hemispherical distribution can be collected and used, thereby improving the chip light energy utilization rate and the light output intensity of the light-emitting tube.

[0021] Furthermore, the first mounting position, the second mounting position and the third mounting position are all filled with packaging glue, and the cavity is filled with diffuse glue. The light emitted by the light-emitting chip is reflected by the inner wall of the mounting position to form parallel light, and then is directly irradiated, refracted, and totally reflected by the packaging glue before being emitted from the surface of the packaging glue cured layer. The diffuse glue and the packaging glue are connected as one, and the heat dissipation glue contains diffuse powder. The light emitted from the packaging glue is directly irradiated, refracted, and totally reflected by the diffuse glue before being emitted from the surface. The direct light presents a distribution curve in the diffuse glue in which the normal light intensity is the largest and the greater the angle of deviation from the normal, the weaker the light intensity gradually becomes, so that the intensity of the light emitted from the surface of the diffuse glue cured layer is the largest. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0023] FIG1 is an exploded view of an embodiment of a leap-layer packaging structure for an LED light-emitting diode chip according to the present invention;

[0024] FIG2 is a schematic structural diagram of another embodiment of the LED light-emitting diode chip leap-layer packaging structure of the present invention;

[0025] FIG3 is a cross-sectional view of an embodiment of the mounting position shape of the LED light-emitting diode chip leap-type packaging structure of the present invention;

[0026] FIG4 is a cross-sectional view of another embodiment of the mounting position shape of the LED light-emitting diode chip leap-type packaging structure of the present invention;

[0027] FIG5 is a schematic diagram of the light path of an embodiment of a leap-layer packaging structure for an LED light-emitting diode chip according to the present invention;

[0028] FIG6 is a flow chart of an embodiment of a process for preparing a leap-layer packaging structure for an LED light-emitting diode chip according to the present invention.

[0029] Description of Figure Numbers:

[0030] 10. Metal bracket; 11. First mounting position; 12. Second mounting position; 13. Third mounting position; 14. Red light-emitting chip; 15. Green light-emitting chip; 16. Blue light-emitting chip; 20. Electrode sheet; 21. Integrated center mounting sheet; 22. Independent electrode sheet; 30. Housing; 31. Embedding part; 32. Packaging glue; 33. Dispersed glue.

[0031] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0033] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0034] In the present invention, unless otherwise specified or limited, the terms "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can mean fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will be able to understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0035] In addition, in the present invention, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing throughout the text is to include three parallel solutions. Taking "A and / or B as an example", it includes solution A, or solution B, or solutions that meet both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0036] With reference to Figures 1 to 5, the present invention proposes a leap-layer packaging structure for an LED light-emitting tube chip, including a metal bracket 10, an electrode sheet 20 and a shell 30. One side end face of the metal bracket 10 is provided with at least one mounting position group, and the mounting position group includes a first mounting position 11, a second mounting position 12 and a third mounting position 13 arranged linearly. A red light-emitting chip 14, a blue light-emitting chip 16 and a green light-emitting chip 15 are respectively provided in the first mounting position 11, the second mounting position 12 and the third mounting position 13. The depths of the first mounting position 11, the second mounting position 12 and the third mounting position 13 are defined as h1, h2 and h3 respectively, and h1>h3>h2; the electrode sheet 20 is provided on both sides of the mounting position group and is electrically connected to the metal bracket 10; the metal bracket 10 and the electrode sheet 20 are both inserted into the shell 30, and part of the electrode sheet 20 extends out of the outside of the shell 30.

[0037] When packaging LED light-emitting chips, the light-emitting chips are usually mounted on the surface of the metal bracket 10. However, the red light-emitting chip 14, the green light-emitting chip 15 and the blue light-emitting chip 16 have different thicknesses. Mounting the three different light-emitting chips on the same plane will result in poor consistency of the three different lights, affecting the lighting effect; moreover, the light emitted by the light-emitting chip on the plane of the metal bracket 10 is distributed in a hemispherical shape. The light energy of the direct light and partially reflected light of the light-emitting chip is only a part of the hemispherical light energy. The closer the emitted light is to the metal bracket 10, the less it can be used, resulting in a waste of light energy of the light-emitting chip.

[0038] In view of this, in one embodiment of the present application, at least one mounting position group is provided on one side end face of the metal bracket 10 for fixing the light-emitting chip, and the mounting position group includes a first mounting position 11, a second mounting position 12 and a third mounting position 13 arranged linearly. The above three mounting positions can be stamped into individual pieces, and a red light-emitting chip 14, a blue light-emitting chip 16 and a green light-emitting chip 15 are respectively provided in the first mounting position 11, the second mounting position 12 and the third mounting position 13. Since the thicknesses of the red light-emitting chip 14, the green light-emitting chip 15 and the blue light-emitting chip 16 are different and gradually decrease in the above order, the depth of the first mounting position 11 is greater than the depth of the second mounting position 12 and the depth of the third mounting position 13, so that the center of the light-emitting surface of the three light-emitting chips can be located at the full emission point of the light at the mounting position, thereby collecting the light energy and further improving the utilization rate of the light energy.

[0039] Furthermore, the red light-emitting chip 14, the blue light-emitting chip 16 and the green light-emitting chip 15 are respectively fixed in the first mounting position 11, the second mounting position 12 and the third mounting position 13, so that part of the light from the above three light-emitting chips is reflected multiple times by the inner wall surface of the mounting position to form parallel light rays and then emitted, which can improve the utilization rate of the light energy of the light-emitting chip and thus improve the light output efficiency of the light-emitting tube.

[0040] The shell 30 can be made of engineering plastic, and a plurality of through slots for installing the electrode sheet 20 can be opened on the side wall at the bottom position of the shell 30. After the metal bracket 10 and the electrode sheet 20 are inserted into the shell 30, part of the electrode sheet 20 extends to the outside of the shell 30 through the above-mentioned through slots for subsequent electrical installation operations.

[0041] 3 , further, the cross-sectional profiles of the first mounting position 11 and the third mounting position 13 are parabolic, and the red light-emitting chip 14 and the green light-emitting chip 15 are located at the foci of the parabolic cross-sectional profiles of the first mounting position 11 and the third mounting position 13 , respectively.

[0042] It is understood that the first mounting position 11 and the third mounting position 13 can be in the shape of a parabola with an upward opening, with the surface centers of the red light-emitting chip 14 and the green light-emitting chip 15 located at the foci of the parabola, respectively. Light emitted by the red light-emitting chip 14 and the green light-emitting chip 15 is totally reflected by the inner wall surfaces of the parabola-shaped first mounting position 11 and the third mounting position 13 before exiting the ports of the first mounting position 11 and the third mounting position 13. Preferably, the second mounting position 12 can also be in the shape of a parabola with an upward opening, but due to the limitations of existing processing equipment and technology, it is not currently possible to process the second mounting position into a parabola with a rotational shape. Therefore, the second mounting position 12 can also be in other shapes. In this embodiment, the second mounting position 12 connects the first mounting position 11 and the third mounting position 13 and can be in the shape of an inverted trapezoid or a special shape with a concave bottom wall. Through total reflection from the inner wall surfaces of the mounting positions, most of the light energy emitted by the light-emitting chips can be collected and utilized, significantly improving the utilization rate of the light energy and thereby enhancing the light output efficiency of the light-emitting tube.

[0043] With reference to Figure 4, the first mounting position 11 and the third mounting position 13 can also be inverted trapezoidal cup grooves. The inclination angle of the two side walls of the first mounting position 11 can be the total reflection angle of the light emitted by the red light-emitting chip 14. Similarly, the inclination angle of the two side walls of the third mounting position 13 can be the total reflection angle of the light emitted by the green light-emitting chip 15. The inclination angle of the two side walls of the second mounting position 12 can be the total emission angle of the light emitted by the blue light-emitting chip 16. The light emitted by the red light-emitting chip 14, the green light-emitting chip 15 and the blue light-emitting chip 16 is reflected by the side walls of the first mounting position 11, the second mounting position 12 and the third mounting position 13 respectively to form parallel light emission, thereby collecting most of the light energy of the light-emitting chip and improving the light output efficiency of the light-emitting tube.

[0044] With reference to Figure 4, in one embodiment of the present application, the distance between the bottom surface of the third mounting position 13 and the bottom surface of the second mounting position 12 is equal to the thickness of two stacked green light-emitting chips 15; the distance between the first mounting position 11 and the bottom surface of the third mounting position 13 is equal to the thickness of one green light-emitting chip 15; and the depth of the second mounting position 12 is equal to the thickness of two stacked blue light-emitting chips 16.

[0045] Understandably, due to the varying thicknesses of different light-emitting chips, the depths of the bottom surfaces of the various mounting positions also vary. In this embodiment, the thickness of the red light-emitting chip 14 is equal to the thickness of two green light-emitting chips 15. Therefore, the distance between the bottom surface of the first mounting position 11 and the bottom surface of the third mounting position 13 is equal to the thickness of one green light-emitting chip 15. The thickness of the blue light-emitting chip 16 is equal to one-third the thickness of the green light-emitting chip 15. Therefore, the distance between the third mounting position 13 and the bottom surface of the second mounting position 12 is equal to the thickness of two stacked green light-emitting chips 15. By adjusting the depths of the various mounting positions, the centers of the primary light-emitting surfaces of the three light-emitting chips are positioned at the points of total reflection of light from the first mounting position 11, the second mounting position 12, and the third mounting position 13. This improves the utilization of the three different light sources and enhances the light output efficiency of the light-emitting tube.

[0046] With reference to Figure 2, in one embodiment of the present application, the electrode sheet 20 includes a conjoined center mounting sheet 21 and an independent electrode sheet 22. The conjoined center mounting sheet 21 is formed by extending from the second mounting position 12 to two opposite outer sides, and the independent electrode sheets 22 are respectively arranged on both sides of the two conjoined center mounting sheets 21 at intervals.

[0047] It can be understood that one side of the integrated mounting piece 21 can be an anode pin for inputting forward current, and the other side can be a cathode pin for grounding. The separate piece can be a functional pin, such as for temperature compensation or control to achieve dimming or other functions. It can be set according to needs and is not limited here.

[0048] To sum up, the technical solution of this embodiment is to set a linearly arranged first mounting position 11, a second mounting position 12 and a third mounting position 13 on the end face of the metal bracket 10, and respectively set a red light-emitting chip 14, a green light-emitting chip 15 and a blue light-emitting chip 16 in the three mounting positions, and set mounting positions of different depths according to the different thicknesses of the three light-emitting chips. The light energy of the three light-emitting chips in a hemispherical distribution can be collected and used, and after total reflection by the inner wall surface of the focus mounting position, the light is emitted from the port of the mounting position in the form of parallel light, thereby improving the light output efficiency of the light-emitting tube.

[0049] 1 and 2 , an embedding portion 31 may be provided at the bottom of the shell 30, in which the metal bracket 10 and the electrode sheet 20 are both snapped into place, and a side end face of the embedding portion 31 away from the bottom of the shell 30 and an outer wall of the shell 30 are enclosed to form a cavity, and the first mounting position 11, the second mounting position 12 and the third mounting position 13 are all filled with packaging glue 32, and the cavity is filled with dispersed color glue 33.

[0050] It is understood that the encapsulating glue 32 filled in the first mounting position 11, the second mounting position 12, and the third mounting position 13 is transparent glue. After curing, it not only fixes the light-emitting chip but also allows light to be emitted from the surface of the encapsulating glue 32 after multiple refractions and reflections. The scattered color glue 33 contains scattered color powder. Light is reflected and refracted multiple times within the cured layer of scattered color glue 33 before being emitted from the surface. The emitted parallel light rays in the cured layer of scattered color glue 33 have a light intensity distribution curve with the highest normal light intensity and gradually weakening with increasing deviation from the normal angle. This ensures that the emitted light conforms to the light curve distribution required by the display, thereby enhancing the luminous efficiency of the light-emitting tube.

[0051] In one embodiment of the present application, the surface of the encapsulation glue 32 after curing is flush with the end surface of the metal bracket 10 .

[0052] It can be understood that the surface of the cured packaging glue 32 is flush with the end surface of the metal bracket 10 to avoid the light reflected to the surface of the metal bracket 10 from being refracted multiple times by the packaging glue 32 again, causing light energy attenuation, thereby enhancing light extraction efficiency.

[0053] In one embodiment of the present application, the surface of the dispersed color glue 33 after curing is flush with the edge of the housing 30. It can be understood that the cured dispersed color glue 33 is connected to the encapsulation glue 32, and the three different light-emitting chips emit light from their respective mounting locations. After multiple refractions and reflections, the light is emitted from the surface of the cured layer of dispersed color glue 33, ensuring that the light properties of the light-emitting chips at different levels are the same when they finally exit the surface of the cured layer of dispersed color glue 33.

[0054] 5 , the technical solution of this embodiment adopts the method that the first mounting position 11, the second mounting position 12 and the third mounting position 13 are all filled with encapsulation glue 32, and the cavity is filled with diffused glue 33. The light emitted by the light-emitting chip is reflected by the inner wall of the mounting position to form parallel light, and then is directly irradiated, refracted and reflected by the encapsulation glue 32 before being emitted from the surface of the solidified layer of the encapsulation glue 32. The diffused glue 33 and the encapsulation glue 32 are connected as a whole. The heat dissipation glue contains diffused color powder. The light emitted from the encapsulation glue 32 is directly irradiated, refracted and reflected by the diffused glue 33 before being emitted from the surface. The direct light presents a distribution curve in the diffused glue 33 in which the normal light intensity is the largest and the greater the angle of deviation from the normal, the weaker the light intensity gradually becomes, so that the intensity of the light emitted from the surface of the solidified layer of the diffused glue 33 is the largest.

[0055] 6 , the present invention further provides a process for preparing a leap-layer packaging structure for an LED light-emitting tube chip, which is used to process the above LED light-emitting tube packaging structure, comprising the following steps:

[0056] S10, cutting the metal sheet according to the preset feed values ​​of the metal sheet required for the first installation position, the second installation position, and the third installation position to ensure that there is suitable metal bracket material when the metal sheet is stretched to the first installation position, the second installation position, and the third installation position;

[0057] S20, shallowly punching the cut metal bracket material to form a first mounting position, a second mounting position, and a third mounting position, and micro-punching the connection between the independent electrode sheet and the first mounting position, the second mounting position, and the third mounting position, and simultaneously punching the connection between the independent electrode sheet and the conjoined middle mounting position sheet;

[0058] S30, performing a second deep punching on the first mounting position, the second mounting position, and the third mounting position, so that their depths are close to their respective preset values, and simultaneously tearing the micro-slits between the independent electrode sheet and the first mounting position, the second mounting position, and the third mounting position, so that the independent electrode sheet is separated from the first mounting position, the second mounting position, the third mounting position, and the conjoined middle mounting position sheet;

[0059] S40, shaping and leveling the surface of the metal bracket and the inner wall surfaces of the first mounting position, the second mounting position, and the third mounting position, and simultaneously leveling the electrode sheet;

[0060] S50, filling the first mounting position, the second mounting position, and the third mounting position with packaging glue and curing them at high temperature, filling the cavity with bulk glue and curing it at high temperature, and the surface of the solidified bulk glue is flush with the edge of the shell.

[0061] Optionally, the metal bracket may be made of a thin copper sheet, and the surface of the punched metal bracket may be silver-plated.

[0062] The technical solution of the present invention can improve the processing accuracy and production efficiency of the metal bracket by cutting, shallow punching, deep punching, shaping and leveling, and sealing and curing the metal bracket material.

[0063] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made by using the contents of the present invention description and drawings under the inventive concept of the present invention, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A LED light-emitting tube chip leap-layer packaging structure, characterized in that: include: A metal bracket, wherein at least one mounting position group is arranged on one end surface of the metal bracket, wherein the mounting position group includes a first mounting position, a second mounting position and a third mounting position which are arranged linearly, wherein a red light-emitting chip, a blue light-emitting chip and a green light-emitting chip are arranged in the first mounting position, the second mounting position and the third mounting position, respectively, and the depths of the first mounting position, the second mounting position and the third mounting position are defined as h1, h2 and h3 respectively, and then h1>h3>h2; Electrode sheets, which are disposed on both sides of the mounting position group and are electrically connected to the metal bracket; A shell, wherein the metal bracket and the electrode sheet are both inserted into the shell, and a portion of the electrode sheet extends out of the shell; The cross-sectional profiles of the first mounting position and the third mounting position are parabolic or inverted trapezoidal, and the centers of the light-emitting surfaces of the red light-emitting chip and the green light-emitting chip are respectively located at the foci of the parabolic cross-sectional profiles of the first mounting position and the third mounting position; The first mounting position, the second mounting position and the third mounting position are all filled with packaging glue.

2. The LED light-emitting tube chip leap-layer packaging structure according to claim 1, characterized in that: The distance that the bottom surface of the third mounting position is lower than the bottom surface of the second mounting position is equal to the thickness of two stacked green light-emitting chips; the distance that the first mounting position is lower than the bottom surface of the third mounting position is equal to the thickness of a green light-emitting chip; the depth of the second mounting position is equal to the thickness of two stacked blue light-emitting chips.

3. The LED light-emitting tube chip leap-layer packaging structure according to claim 1, characterized in that: The electrode sheet comprises a conjoined central mounting sheet and an independent electrode sheet. The conjoined central mounting sheet is formed by extending the second mounting position to two opposite outer sides respectively. The independent electrode sheets are respectively arranged at intervals on both sides of the two conjoined central mounting sheets.

4. The LED light-emitting tube chip leap-layer packaging structure according to any one of claims 1, characterized in that: The bottom of the shell is provided with an embedding portion, the metal bracket and the electrode sheet are both embedded in the embedding portion, the end surface of the metal bracket and the outer wall of the shell are surrounded to form a cavity, and the cavity is filled with dispersed color glue.

5. The LED light-emitting tube chip leap-layer packaging structure according to claim 4, characterized in that: The surface of the packaging glue after curing is flush with the end surface of the metal bracket.

6. The LED light-emitting tube chip leap-layer packaging structure according to claim 5, characterized in that: The surface of the dispersed color glue after curing is flush with the edge of the shell.

7. A preparation process for a leap-layer packaging structure of an LED light-emitting tube chip, characterized in that: Used to prepare the LED light-emitting tube chip leap-type packaging structure according to any one of claims 1 to 6, comprising: S10, cutting the metal sheet according to the preset feeding values ​​of the metal sheet required for the first installation position, the second installation position and the third installation position to ensure that there is a suitable metal bracket material when the metal sheet is stretched to the first installation position, the second installation position and the third installation position; S20, shallowly punching the cut metal bracket material to form a first mounting position, a second mounting position and a third mounting position, and micro-punching the connection between the independent electrode sheet and the first mounting position, the second mounting position and the third mounting position, and simultaneously punching the connection between the independent electrode sheet and the joint middle mounting position sheet; S30, performing secondary deep punching on the first mounting position, the second mounting position and the third mounting position, so that their depths are close to their respective preset values, and simultaneously tearing the micro-slits between the independent electrode sheet and the first mounting position, the second mounting position and the third mounting position, so that the independent electrode sheet is separated from the first mounting position, the second mounting position, the third mounting position and the connected middle mounting position sheet; S40, shaping and leveling the surface of the metal bracket and the inner wall surfaces of the first mounting position, the second mounting position, and the third mounting position, and leveling the electrode sheet simultaneously; S50, filling the first mounting position, the second mounting position and the third mounting position with packaging glue and curing at high temperature, and then filling the cavity with dispersed color glue and curing at high temperature, and the surface of the cured dispersed color glue is flush with the edge of the shell.

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