Diamond array segment manufacturing apparatus and diamond array segment manufacturing method using same

Abstract

The present invention may provide a diamond array segment manufacturing apparatus comprising: a multi-station including multiple stations; a rotary table installed on the upper part of the multi-station and formed to be able to rotate around a vertical axis, the rotary table having a diamond segment mold provided on the outer circumference thereof; a filling unit installed on a corresponding station among the multi-station such that, if the diamond segment mold rotates and is positioned at a setup location, the filling unit fills the diamond segment mold with metal powder and diamond; a compacting unit installed on a corresponding station among the multi-station so as to compact the metal powder that fills the diamond segment mold; a pressing / extracting unit installed on a corresponding station among the multi-station such that the metal powder and diamond that fill the diamond segment mold are molded by the diamond segment mold and then extracted; and an operation control unit for rotating the rotary table such that that the diamond segment mold is positioned at a setup location, the operation control unit controlling operations of the filling unit such that the diamond segment mold is filled with metal powder and diamond, and the operation control unit controlling operations of the compacting unit, the pressing unit, and the extracting unit. According to the above description, reliability and productivity may be improved by improving the quality of the molded diamond array segment.

Description

Diamond array segment manufacturing device and diamond array segment manufacturing method using the same

[0001] The present invention relates to a diamond array segment manufacturing device and a diamond array segment manufacturing method using the same, and more particularly, to a diamond array segment manufacturing device and a diamond array segment manufacturing method using the same, which can improve reliability by improving the quality of the formed array segment, and which can facilitate forming the array segment and minimize the installation area.

[0002]

[0003] In general, a diamond tool is a tool used to cut or polish workpieces such as stone, brick, concrete, and asphalt, and is composed of a shank in the form of a circular plate forming the body, and a diamond segment attached to the outer periphery of the shank to form a cutter portion that acts as a bite for cutting the workpiece.

[0004]

[0005] At this time, the diamond segments are mostly attached to the shank through a welding process such as brazing welding or laser welding, and the diamond segments are manufactured by mixing diamond particles on a metal powder such as nickel or cobalt, molding them, and then sintering them.

[0006]

[0007] However, in the past, when manufacturing such diamond segments, diamond particles were transferred and supplied onto a diamond segment forming device using a vibrating feeder. However, in this case, it was difficult to supply them quantitatively due to segregation of diamond particles and metal powder, and uniform supply was difficult due to them being biased or clumped to one side, which caused differences in the manufacturing quality of the diamond segments. As a result, not only did product reliability decrease, but manufacturing was also cumbersome as it was manufactured through several processes, and there was a problem that productivity was reduced because it took up a lot of installation space of the device.

[0008]

[0009] The present invention aims to provide a diamond array segment manufacturing device and a method for manufacturing a diamond array segment using the same, which can improve the reliability by improving the quality of a diamond segment to be formed by increasing the precision and efficiency of the particle array supply of diamond particles, and which can facilitate the formation of a diamond segment and minimize the installation area.

[0010]

[0011] According to one aspect of the present invention, the present invention comprises: a multi-station including a plurality of stations; a rotary table installed on the upper portion of the multi-station and formed to be rotatable around a vertical axis, the rotary table having a diamond segment mold provided on the outer periphery; a metal powder filling unit installed at a corresponding station in the multi-station and filling metal powder into the diamond segment mold when the diamond segment mold is rotated and positioned at a set position, and a diamond array unit arranging diamonds; a compaction unit installed at a corresponding station in the multi-station and compacting the metal powder filled in the diamond segment mold; a pressurized extraction unit installed at a corresponding station in the multi-station and shaping the filled metal powder and the diamond into a diamond array segment and then extracting the same; A diamond array segment manufacturing device can be provided, characterized in that it includes an operation control unit that rotates the rotary table so that the diamond segment mold is positioned at a set position, operates the filling arrangement unit so that the metal powder and the diamond are filled and arranged in the diamond segment mold, and operates the compaction unit, the pressing unit, and the extraction unit.

[0012]

[0013] Here, the rotary table may further include a cartridge having a plurality of fitting parts formed on the outer periphery and having a plurality of diamond segment molds formed thereon and connected to the fitting parts.

[0014]

[0015] The above filling unit may be configured to include a metal powder filling unit that fills metal powder into the diamond segment mold, and a diamond setting unit that supplies and arranges diamonds into the diamond segment mold.

[0016]

[0017] The above metal powder filling unit may be configured to include a metal powder supply hopper that receives metal powder, and a dividing adapter that is connected to the supply hopper to receive the metal powder and divides and supplies the metal powder to the diamond segment mold so that one side of the array segment in contact with the shank forms a blank area.

[0018]

[0019] The above diamond array setting unit may be configured to include a diamond supply unit that supplies and arranges diamonds into the diamond segment mold, and a removal unit for removing remaining diamonds from the diamond supply unit.

[0020]

[0021] The above diamond supply unit may be configured to include a transport body having a plurality of array grooves formed therein, a moving unit that moves the transport body to supply and arrange diamonds into the diamond segment mold and move it to its original position, and a vacuum suction unit that is coupled to the transport body and fills the array grooves with diamonds by suction.

[0022]

[0023] The above control unit may be configured to include a shock rod that applies a shock to the transport body to shake off and separate residual diamonds attached to the transport body, and a brush that brushes one side of the transport body to remove residual diamonds.

[0024]

[0025] The above-mentioned pressurized extraction unit may be configured to include a pressing unit that pressurizes the filled metal powder and the diamond to form the diamond array segment, and an extraction unit that extracts the formed diamond array segment.

[0026]

[0027] The present invention may further include a mold recognition unit provided on the rotary table to recognize whether the rotary table is located at a corresponding station when the rotary table rotates.

[0028]

[0029] The above mold recognition unit may be configured to include a detection member coupled to a set position of the rotary table, and a detection sensor that detects the detection member.

[0030]

[0031] The present invention includes a plurality of index parts configured on the rotary table to control and fix the rotation of the rotary table, and the index parts may include an index pin configured on the upper portion of the rotary table to vertically move up and down, a hydraulic cylinder that controls the index pin to move up and down, and an index pin insertion hole configured along the rotary table to vertically penetrate between diamond segment molds and into which a downward index pin is vertically inserted.

[0032]

[0033] The above diamond segment mold may be configured to include a pair of guide pin holes configured at a set position on the upper surface and vertically moved in a downward direction, and a pair of guide pins configured at the upper portion of the diamond array segment mold and vertically inserted into the guide pin holes corresponding to the positions of the pair of guide pin holes.

[0034]

[0035] According to another aspect of the present invention, the present invention provides a method for manufacturing a diamond array segment, comprising: (1) filling metal powder into a diamond segment mold when a rotary table is rotated and a diamond segment mold is positioned at a corresponding station; (2) arranging diamonds above the metal powder when the rotary table is rotated and the diamond segment mold is positioned at a corresponding station after the metal powder is filled; (3) pressing and compacting the metal powder and the diamonds at a set pressure when the rotary table is rotated and the diamond segment mold is positioned at a corresponding station after the diamonds are arranged; (5) pressing and compacting the diamond array segments when the rotary table is rotated and the diamond segment mold is positioned at a corresponding station after the metal powder and the diamonds are compacted; (6) A method for manufacturing a diamond array segment can be provided, characterized in that it includes a step of extracting the diamond array segment from the diamond segment mold when the rotary table is rotated after the diamond array segment is formed and the diamond segment mold is positioned at the corresponding station.

[0036]

[0037] Here, after the metal powder and the diamond are compacted after the step (3), a step (4) of forming multiple layers by repeating the steps (2) and (3) so that the metal powder and the diamond form multiple layers may be further included.

[0038]

[0039] The step of arranging the diamonds in the above step (2) may be configured to include a step of (2-1) vacuum-sucking the diamonds with a diamond supply unit, a step of (2-2) removing the remaining diamonds of the diamond supply unit through a removal unit, and a step of (2-3) supplying and arranging the diamonds into the diamond segment mold by transporting the diamond supply unit after removing the remaining diamonds.

[0040]

[0041] The step of removing the remaining diamonds in the above step (2-2) can be performed by applying an impact to the diamond supply unit to shake off and remove the remaining diamonds attached to the diamond supply unit.

[0042]

[0043] The step of removing the remaining diamonds in the above step (2-2) can be performed by sweeping away the remaining diamonds attached to the diamond supply unit by a brush configured to be fixed to the lower portion of the diamond supply unit when the diamond supply unit is transported.

[0044]

[0045] The present invention may further include a preparatory step of cleaning by removing impurities in the diamond segment mold prior to step (1).

[0046]

[0047] Meanwhile, the description of the technology disclosed in this specification is merely an example for structural and functional explanation, and therefore, the scope of the rights of the disclosed technology should not be construed as being limited by the embodiments described in the text. That is, since the embodiments can be modified in various ways and can take various forms, the scope of the rights of the disclosed technology should be understood to include equivalents that can realize the technical idea. Furthermore, the purpose or effect presented in the disclosed technology does not mean that a specific embodiment must include all of them or only such effects, and therefore, the scope of the rights of the disclosed technology should not be construed as being limited thereby.

[0048]

[0049] Furthermore, the meanings of terms described in the present invention should be understood as follows. Terms such as "first," "second," etc. are intended to distinguish one component from another, and the scope of the invention should not be limited by these terms. For example, the first component may be referred to as the second component, and similarly, the second component may be referred to as the first component.

[0050]

[0051] Furthermore, when a component is said to be "connected" to another component, it should be understood that while it may be directly connected to that other component, there may also be other components intervening. Conversely, when a component is said to be "directly connected" to another component, it should be understood that there are no other intervening components. Similarly, other expressions describing relationships between components, such as "between" and "between," or "adjacent to" and "directly adjacent to," should be interpreted in the same way.

[0052]

[0053] Singular expressions should be understood to include plural expressions unless the context clearly indicates otherwise, and terms such as “comprises” or “has” should be understood to specify the presence of a described feature, number, step, operation, component, part, or combination thereof, but not to exclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0054]

[0055] The diamond array segment manufacturing device and the diamond array segment manufacturing method using the same according to the present invention can accurately and uniformly arrange diamond particles inside the metal powder in a compacted state, and can increase the precision and efficiency of the particle array supply of the diamond particles by preventing any disorder in the planting of the diamond particles, thereby improving the reliability due to the improvement in the quality of the formed diamond array segment.

[0056]

[0057] The diamond array segment manufacturing device and the diamond array segment manufacturing method using the same according to the present invention can effectively form a diamond array segment by using a diamond segment mold equipped on a rotary table that rotates 360 degrees and arranging stations along the rotation path of the diamond segment mold, thereby improving work efficiency and greatly improving productivity.

[0058]

[0059] The diamond array segment manufacturing device and the diamond array segment manufacturing method using the same according to the present invention can easily form the array segment by using a rotating rotary table and a multi-station.

[0060]

[0061] FIG. 1 is a drawing showing a diamond array segment manufacturing device according to an embodiment of the present invention.

[0062] FIG. 2 is a block diagram showing the control flow of an operation control unit in a diamond array segment manufacturing device according to an embodiment of the present invention.

[0063] FIG. 3 is a plan view showing the arrangement of a rotary table and a multi-station in a diamond array segment manufacturing device according to an embodiment of the present invention.

[0064] FIG. 4 is a perspective view showing a diamond segment mold in a diamond array segment manufacturing device according to an embodiment of the present invention.

[0065] FIG. 5 is a schematic drawing of a mold recognition unit in a diamond array segment manufacturing device according to an embodiment of the present invention.

[0066] FIG. 6 and FIG. 7 are schematic drawings showing a metal powder filling unit in a diamond array segment manufacturing device according to an embodiment of the present invention.

[0067] FIG. 8 is a drawing showing an example of an array segment filled by a metal powder filling unit in a diamond array segment manufacturing device according to an embodiment of the present invention.

[0068] FIG. 9 is a drawing schematically showing the operation process of a control unit in a diamond array segment manufacturing device according to an embodiment of the present invention.

[0069] FIG. 10 is a drawing schematically showing a rotation driving method of a filling part in a diamond array segment manufacturing device according to an embodiment of the present invention.

[0070] Fig. 11 is a front view showing the array grooves of the diamond supply unit in the diamond array segment manufacturing device according to an embodiment of the present invention.

[0071] FIG. 12 is a drawing schematically showing the configuration and operation process of a pressurized extraction unit in a diamond array segment manufacturing device according to an embodiment of the present invention.

[0072]

[0073] Multi-station including multiple stations;

[0074] A rotary table installed adjacent to the above multi-station and formed to be rotatable around a vertical axis, and having a diamond segment mold provided on the outer periphery;

[0075] A filling unit that fills metal powder and diamond into the diamond segment mold when the diamond segment mold is installed at the corresponding station in the multi-station and rotates to be positioned at the set position;

[0076] A compaction unit installed at the multi-station and compacting the metal powder filled in the diamond segment mold;

[0077] A pressurized extraction unit installed at the multi-station and filled in the station to form the metal powder and the diamond into a diamond array segment and then extract them;

[0078] A diamond array segment manufacturing device characterized by comprising: an operation control unit that rotates the rotary table so that the diamond segment mold is positioned at a set position, operates the filling unit so that the metal powder and the diamond are filled into the diamond segment mold, and operates the compaction unit and the pressing unit and the extraction unit.

[0079]

[0080] Hereinafter, the present invention will be described in more detail with reference to preferred embodiments thereof.

[0081]

[0082] A diamond array segment manufacturing device according to an embodiment of the present invention is a device for forming an array segment attached to a shank in order to manufacture a circular saw blade, and can supply and form diamonds according to a desired position and arrangement, and by performing each process using a diamond segment mold that rotates 360 degrees, it is easy to form the array segment, minimize the installation area of ​​the manufacturing device, increase the production volume of the array segment, and improve the reliability of the product.

[0083]

[0084] Referring to FIGS. 1 and 2, a diamond array segment manufacturing device according to an embodiment of the present invention may be configured to include a multi-station (100), a rotary table (200), a filling unit (300), a compaction unit (600), a pressurized extraction unit (700), and an operation control unit (800).

[0085]

[0086] First, the multi-station (100) can be formed of multiple stations depending on the process, and each station can perform its own process.

[0087]

[0088] In the present invention, each station is fixed in position so that the rotary table (200) rotates and the diamond segment mold (230) described later is positioned at the corresponding position to perform the corresponding task, and the filling unit (300), compaction unit (600), and pressurized extraction unit (700) described above can be installed.

[0089]

[0090] The above multi-station (100) can have each station arranged in a circular plane corresponding to the rotating rotary table (200).

[0091]

[0092] Referring to FIG. 3, the multi-station (100) is composed of four stations, and each station can be arranged at 90-degree intervals.

[0093]

[0094] Here, each of the above stations is configured as a pressing and extraction station, a diamond array station, a preparation and compaction station, and a metal powder filling station, so that when the diamond segment mold (230) is positioned at the corresponding location, the station can perform the set task. Here, a description of the operation, including the detailed configuration installed at the corresponding station, will be described later.

[0095]

[0096] Meanwhile, the diamond array segment manufacturing device according to an embodiment of the present invention may be provided with a base frame (10) in which the filling unit (300), the compaction unit (600), the pressurized extraction unit (700), and the operation control unit (800) including the multi-station (100) are installed and can support each component, and the base frame (10) may be formed in a box shape as shown in the drawing to support each component from above and have a structure that can be stored therein.

[0097]

[0098] The above rotary table (200) is installed adjacent to the multi-station (100) and is formed to be able to rotate around a vertical axis according to a control signal of the operation control unit (800), and a diamond segment mold (230) may be provided on the outer periphery.

[0099]

[0100] The above rotary table (200) can rotate 360 ​​degrees, so that the diamond segment mold (230) can be positioned at the corresponding station according to the rotation.

[0101]

[0102] The above rotary table (200) can have multiple fitting parts (210) formed on the outer periphery.

[0103]

[0104] Accordingly, the present invention can be configured to include a cartridge (220) coupled to the fitting portion (210) and having a plurality of diamond segment molds (230) formed therein.

[0105]

[0106] Here, the cartridge (220) and the diamond segment mold (230) can be separated from each other and detachably coupled.

[0107]

[0108] In the drawing, the cartridge (220) shows a case where four diamond segment molds (230) are formed for each, but this is only one embodiment and the number of diamond segment molds (230) can be formed in various ways depending on the number of processes and the arrangement of stations.

[0109]

[0110] Referring to Fig. 4, the diamond segment mold (230) has a forming hole (231) formed in a shape corresponding to the array segment shape, so that metal powder and diamonds can be filled and arranged inside. Here, the forming hole (231) can be formed to penetrate in the vertical direction, and an extraction part (720) can be arranged at the bottom, and a press rod of the compaction part (600) can be arranged at the top.

[0111]

[0112] Meanwhile, the upper surface of the diamond segment mold (230) may be configured to include a pair of guide pin holes (232) at a set position, and a guide pin (233) configured at the upper portion to correspond to the positions of the pair of guide pin holes (232) and inserted into the guide pin holes (232).

[0113]

[0114] By adjusting the setting position between the multi-station (100) and the rotary table (200) through the guide pin (233) inserted into the guide pin hole (232), the position of the diamond segment mold (230) of the rotary table (200) is controlled to be accurately positioned at the first station (110) to the fourth station (140) of the multi-station (100), thereby aligning and preventing the positions of the diamond segment mold (230) and the multi-station (100) from being misaligned due to a malfunction of the sensor or an electrical error as the rotary table (200) rotates repeatedly.

[0115]

[0116] Meanwhile, the diamond segment mold (230) needs to accurately recognize which station is located when the rotary table (200) rotates.

[0117]

[0118] To this end, the present invention may be provided with a mold recognition unit (900) provided on the rotary table (200), and the mold recognition unit (900) may be positioned between each fitting unit (210) on the rotary table (200).

[0119]

[0120] Referring to FIG. 5, the mold recognition unit (900) may be configured to include a detection member (910) that is fastened to a set position on the upper surface of the rotary table (200), a detection sensor (920) that detects the detection member (910), and an index unit (930) that corrects an angle according to the rotation of the rotary table (200).

[0121]

[0122] Here, the sensing member (910) may be a sensing member (910) that is fastened to the rotary table (200), and the sensing member (910) may be fastened to protrude from the upper surface of the rotary table (200) by a set height.

[0123]

[0124] At this time, the above detection member (910) may be formed in multiples corresponding to the number and multiple of the stations and may be provided on the rotary table (200) at a set position.

[0125]

[0126] Accordingly, the above detection sensor (920) can detect the detection member (910) having a different height to recognize the mold number, i.e. the position of the corresponding mold, and can be applied as a detection load.

[0127]

[0128] Meanwhile, the detection sensor (920) may be configured to include a lamp (921) that allows the user to visually confirm that the detection member (910) is located at the corresponding position.

[0129]

[0130] The above index part (930) may be configured to include an index pin (index pin, 931) configured on the upper portion of the rotary table (200) and vertically moved up and down, a hydraulic cylinder (932) configured to move the index pin (931) up and down, and an index pin insertion hole (933) configured on the rotary table (200) and vertically formed between diamond array segment molds into which the downward index pin (931) is vertically inserted.

[0131]

[0132] To this end, the index pin (931) is moved downward using a hydraulic cylinder (932) to insert the index pin (931) into the index pin insertion hole (933) to fix the rotary table (200). Accordingly, by configuring each multi-station (100) to perform a process while the rotary table (200) is fixed, it is possible to prevent safety accidents caused by misalignment of the corresponding angles and positions of the multi-station (100) and the diamond segment mold (230) due to software errors or repeated rotation of the rotary table (200).

[0133]

[0134] Meanwhile, the guide pin (233) formed on the upper surface of the diamond segment mold (230) may be configured to be moved downward while the index pin (931) is lowered and inserted into the index pin insertion hole (933) so that the guide pin (233) is inserted into the guide pin hole (232).

[0135]

[0136] Afterwards, it is possible to adjust the angle and position of the multi-station (100) and the diamond segment mold (230) to correspond to each other so that both the index pin (931) and the guide pin (233) are lowered and inserted into the index pin insertion hole (933) and the guide pin hole (232), respectively, so that the diamond array segment manufacturing device can be prevented from being damaged due to the alignment angle of the multi-station (100) and the diamond segment mold (230) being misaligned due to repeated rotation of the rotary table (200).

[0137]

[0138] The above filling unit (300) is installed at a corresponding station in the multi-station (100) and, when the diamond segment mold (230) rotates and is positioned at a set position, it fills metal powder and diamond into the diamond segment mold (230).

[0139]

[0140] The above filling unit (300) may be configured to include a metal powder filling unit (400) and a diamond array filling unit.

[0141]

[0142] At this time, the filling unit (300) is configured in a linear or radial manner depending on the method of moving to the diamond segment mold (230), and the structure of the metal powder supply unit (410) may be configured differently depending on the method of moving the filling unit (300). In the present invention, it is preferred that the method of moving the filling unit (300) has a linear structure, but as illustrated in FIG. 10, the method of moving the filling unit (300) may be configured in a radial manner.

[0143]

[0144] To this end, the filling unit (300) moving in a straight line moves forward and backward by a moving unit (512) described later, and the filling unit (300) rotating radially can rotate by a preset angle around a rotation axis (310).

[0145]

[0146] Accordingly, the radially rotating filling part (300) is configured as a left and right pair centered on a rotation axis (310), and can rotate by a preset angle by a rotation motor (not shown) configured on the rotation axis (310). At this time, a slide arm (320) capable of adjusting the position of the filling part (300) is configured on the rotation axis (310), so that the filling part (300) can be controlled according to the position of the diamond segment mold (230).

[0147]

[0148] Referring to FIGS. 6 and 7, the metal powder filling unit (400) is configured to supply metal powder to a certain depth into the diamond segment mold (230) and fill the same, and can supply metal powder through the metal powder supply unit (410).

[0149]

[0150] Accordingly, FIG. 6 illustrates a metal powder supply unit (410) when the movement method of the filling unit (300) is configured in a straight line, and FIG. 7 illustrates a metal powder supply unit (410) when the movement method of the filling unit (300) is configured in a radial line.

[0151]

[0152] Meanwhile, the shank and the diamond array segment are integrated by laser welding at their contact surfaces, but in this case, considering the problem that the laser is reflected by the diamond of the diamond array segment and welding is not performed, the present invention can form a blank area without diamond on one side of the diamond array segment that comes into contact with the shank for integration when integrating the shank and the diamond array segment.

[0153]

[0154] Accordingly, the metal powder filling unit (400) can form a blank area when supplying metal powder.

[0155]

[0156] Referring to Fig. 8, four diamond segment molds (230) are formed in a 2×2 array, and when the movement method of the filling part (300) is linear, the forming hole (231) is formed in a square shape as shown in (c) of Fig. 8, and when the movement method of the filling part (300) is radial, the forming hole (231) is formed in a fan shape as shown in (a), (c), and (d) of Fig. 8.

[0157]

[0158] To this end, the metal powder filling unit (400) may be arranged in the order of metal powder supply hopper (411, B) - blank (A) - metal powder supply hopper (411, B) so that a blank area (A) is formed on one side (inner side) of the diamond segment mold (230), and may be formed so that the entire area becomes a blank area (A) as shown in (b) of FIG. 8.

[0159]

[0160] Meanwhile, when the diamond segment mold (230) is formed in a fan shape, the metal powder filling unit (400) can be arranged in the order of blank (A) - metal powder hopper (411, B), blank (A) - metal powder hopper (411, B) so that the blank area (A) is formed on only one side, and the entire diamond segment mold (230) can be formed as the blank area (A).

[0161]

[0162] Here, the metal powder filling unit (400) is equipped with a powder division adapter (412) at the inlet of the metal powder supply hopper (411) that supplies metal powder, so that a blank area can be effectively formed.

[0163]

[0164] Meanwhile, by supplying metal powders having different particles or types into each of the plurality of metal powder hoppers (411), the metal powders filled into the forming hole (231) are configured to be of different types stacked, so that various types of diamond cutting segments can be produced in response to the type of cutting material or industrial site.

[0165]

[0166] Referring to FIG. 9, the diamond setting unit (500) is configured to supply and arrange diamonds into the diamond segment mold (230), and may include a diamond supply unit (510) and a removal unit (520).

[0167]

[0168] The above diamond supply unit (510) is located at the second station (120) for arranging diamonds and can move forward and backward toward the diamond segment mold (230), and after sucking in the diamonds, can supply them in an array into the diamond segment mold (230).

[0169]

[0170] The above diamond supply unit (510) may be configured to include a transfer body (511), a vacuum suction unit (513) connected to the transfer body (511) to suck up diamonds, a moving unit (512) connected to the transfer body (511) to move the transfer body (511) forward and backward, and a removal unit (520) for removing residual diamonds attached to the transfer body (511).

[0171]

[0172] Referring to FIG. 11, the transport body (511) includes a supply member (515) having a plurality of array grooves (516) formed on the lower surface, and can cause diamonds to be sucked into the array grooves (516) by vacuum.

[0173]

[0174] Here, the above array groove (516) can be formed in a specific arrangement by design so that diamonds can be supplied according to a specific arrangement.

[0175]

[0176] Here, the diamond supply unit (510) may be configured to include a receiving portion (514) that is open at the top and receives diamonds at the bottom of the transport body (511) so that the diamonds are sucked into the transport body (511).

[0177]

[0178] The above vacuum suction unit (513) is connected to the transfer body (511) and can suck in diamonds to fill the arrangement groove (516) and discharge them so that the diamonds can be arranged in the metal powder filled in the diamond segment mold (230).

[0179]

[0180] The above moving unit (512) has a role of moving the transfer body (511) forward and backward according to the control signal of the operation control unit (800), and can move forward after sucking in the diamond to supply and arrange the diamond to the diamond segment mold (230) and then move backward to return to the original position.

[0181]

[0182] Meanwhile, the above-mentioned receiving portion (514) is manufactured in various sizes, and the sizes of the array grooves (516) are also formed to be different from each other so that multiple diamonds of various sizes can be supplied, thereby improving the lifespan and cutting power of the diamond cutting segment.

[0183]

[0184] The above removal unit (520) serves to remove and collect the remaining diamonds attached to the transfer body (511), and enables the diamond supply unit (510) to arrange the diamonds in a desired amount at an accurate location on the pre-filled metal powder.

[0185]

[0186] The above removal unit (520) may be configured to include a shock rod (521) and a brush (522).

[0187]

[0188] The above shock rod (521) can be configured to apply a light shock to the lower portion of the transport body (511) so that the diamond attached to the transport body (511) falls downward.

[0189]

[0190] The above shock rod (521) is configured as a pair to apply an even shock to the left and right sides of the plane of the transport body (511) and can apply an shock to both sides of the transport body (511).

[0191]

[0192] The above brush (522) can secondarily remove residual diamonds by sweeping the lower surface of the transfer body (511) as the transfer body (511) moves forward toward the diamond segment mold (230).

[0193]

[0194] According to the above, the removal unit (520) can primarily remove the remaining diamonds attached to the transfer body (511) by the impact rod (521), and secondarily remove the remaining diamonds through the brush (522) as the transfer body (511) moves forward toward the diamond segment mold (230).

[0195]

[0196] Meanwhile, when diamonds are arranged in this way on metal powder, it is necessary to maintain the arrangement of diamonds by compacting the metal powder and diamonds so that the arrangement of diamonds is not disturbed.

[0197]

[0198] Accordingly, considering that when metal powder and diamond are simply stacked, the arrangement of the diamonds may become scattered due to the metal powder that is subsequently filled, the metal powder and diamond filled in the diamond segment mold (230) can be pressed at a certain pressure through the compaction unit (600) to maintain the arrangement of the diamonds at a certain level.

[0199]

[0200] The above compaction unit (600) is installed on the upper side of the rotary table (200), and a press rod having a plane shape corresponding to the plane shape of the diamond segment mold (230) is positioned on the upper side of the array segment rod so that the metal powder and the diamond filled in the diamond segment mold (230) can be pressed while moving from the upper side to the lower side.

[0201]

[0202] The above pressurized extraction unit (700) is installed on the upper side of the rotary table (200) and, when metal powder and diamond are filled in multiple layers, serves to shape the filled metal powder and diamond into a diamond array segment and then extract them.

[0203]

[0204] Referring to FIG. 12, the pressurized extraction unit (700) may be configured to include a pressing unit (710), an extraction unit (720), and an extraction operation unit (730).

[0205]

[0206] Here, the pressing unit (710) and the extraction unit (720) pressurize the metal powder and the diamond filled in the diamond segment mold (230) at a set pressure. At this time, the pressing unit (710) and the extraction unit (720) can be formed so that they can form the diamond array segment by applying the same set pressure to each other.

[0207]

[0208] The above pressing unit (710) may be configured to be positioned above the diamond segment mold (230) and pressurize from the top to the bottom.

[0209]

[0210] The above extraction unit (720) pressurizes the filled metal powder and the diamond at the same set pressure as the pressing unit (710), and then extracts the formed diamond array segment.

[0211]

[0212] The above extraction operation unit (730) can operate the extraction unit (720) to extract the formed diamond array segment by limiting the length of movement of the extraction unit (720) in the downward direction by the pressure of the pressing unit (710).

[0213]

[0214] To this end, the extraction operation unit (730) may be configured to include a pressure support plate (731) that moves downwards along with the extraction unit (720) by the pressurization of the pressing unit (710), a fixed stopper (732) that limits the distance by which the pressure support plate (731) moves downwards, a pair of elastic restoring parts (733) that restore the pressure support plate (731) to its initial position when the pressing unit (710) is completed, and an extraction sub-motor (734) that moves the extraction unit (720) upwards to extract the diamond array segment when the pressurization of the pressing unit (710) and the extraction unit (720) is completed and the diamond array segment is formed.

[0215]

[0216] According to the above, when the pressing unit (710) pressurizes the metal powder and the diamond filled in the diamond segment mold (230) at a set pressure, the extraction unit (720) moves vertically downward together with the diamond segment mold (230), and the pressure support plate (731) configured at the bottom of the extraction unit (720) moves downward together.

[0217]

[0218] Afterwards, the pressure support plate (731) moves downward and when the movement is stopped by the fixed stopper (732), the movement of the pressure support plate (731) also stops, so that the same pressure as the set pressure of the pressing part (710) is applied to the extraction part (720), so that the metal powder and the diamond can be pressed at the same set pressure from the top and bottom.

[0219]

[0220] When the forming of the diamond array segment is completed by pressing the metal powder and the diamond, the pressing unit (710) moves upward, and the pressure support plate (731) moves to the initial position by a pair of elastic restoring units (733) formed of springs, and then the extraction sub-motor (734) moves the extraction unit (720) upward to extract the diamond array segment.

[0221]

[0222] Meanwhile, the present invention may further include a cleaning unit (not shown) for removing impurities inside the diamond segment mold (230) after the extraction of the diamond array segment is completed as described above.

[0223]

[0224] The above cleaning unit is preferably located at the second station (120), but may be located at another station depending on the usage environment and needs, and various configurations may be applied as long as they can effectively remove impurities within the diamond segment mold (230).

[0225]

[0226] The above operation control unit (800) receives the station position information from the mold recognition unit (900) and rotates the rotary table (200) so that the diamond segment mold (230) is positioned at a set position, controls the operation of each station so that the metal powder and the diamond are filled into the diamond segment mold (230), and controls the operation of the filling unit (300), and controls the operation of the compaction unit (600), the pressing unit (710), the extraction unit (720), and the extraction operation unit (730).

[0227]

[0228] Here, the operation control unit (800) may be configured to include a display device and a control panel (810; see FIG. 1) so that the manager can effectively control the operation of each station of the multi-station (100) and the rotation of the rotary table (200).

[0229]

[0230] Below, a method for manufacturing a diamond array segment using the above-mentioned diamond array segment manufacturing device will be examined.

[0231]

[0232] The method for manufacturing a diamond array segment according to an embodiment of the present invention can first fill metal powder in step (1) after preparing for filling, such as removing residue inside a diamond segment mold (230).

[0233]

[0234] Once the metal powder is filled in this way, diamonds can be filled and arranged in step (2).

[0235]

[0236] When the diamonds are arranged in the metal powder filled in the diamond segment mold (230) in this way, the diamonds can be pressed at a preset pressure in the subsequent step (3), which is the compacting step, so that the diamonds are embedded in the metal powder.

[0237]

[0238] Here, the compacting process is a necessary operation to fill the metal powder while maintaining the diamond arrangement in a constant state, because if the metal powder and diamond are simply stacked, the diamond arrangement may become scattered due to the metal powder that is then filled.

[0239]

[0240] Step (4) thereafter can form multiple layers according to the settings by repeating steps (2) and (3).

[0241]

[0242] In the present invention, unlike the conventional method of forming a single layer of metal powder and diamond and then molding, multiple layers (a total of 8 to 9 layers) can be formed with a metal powder and diamond array, and through this process, a metal powder layer can be formed on both sides of a diamond array segment.

[0243]

[0244] By filling the metal powder and diamond in this way to form a setting layer, (5) the diamond array segment can be pressed and formed.

[0245]

[0246] After (6), the formed diamond array segment is extracted, and the formed diamond array segment can be finished by baking at a set high temperature.

[0247]

[0248] Meanwhile, for each process described above, a method for manufacturing a diamond array segment according to an embodiment of the present invention will be described by taking as an example a case in which the above-described configurations are installed at the corresponding locations for each station in the multi-station (100).

[0249]

[0250] First, the multi-station (100) can be arranged in a circular shape on a plane corresponding to a rotary table (200) in which four stations rotate 360 ​​degrees, and each station can be sequentially positioned as the first station (110) to the fourth station (140).

[0251]

[0252] Here, looking at each station, the first station (110) may be configured with a pressurized extraction unit (700) to enable pressing and extraction, the second station (120) may be configured with a diamond setting unit (500) located adjacent to the clockwise direction of the first station (110) to enable setting of diamonds, the third station (130) may be configured with a compaction unit (600) and a cleaning unit located adjacent to the clockwise direction of the second station (120) to enable preparation and compaction, and the fourth station (140) may be configured with a metal powder filling unit (400) located adjacent to the clockwise direction of the third station (130) and adjacent to the counterclockwise direction of the first station (110) to enable filling of metal powder.

[0253]

[0254] Here, a detailed look at the method for manufacturing diamond array segments according to each station for the diamond segment mold (230) coupled to the rotating rotary table (200) is as follows: first, filling preparation is performed starting from the third station (130), and then, by rotating, metal powder is filled into the diamond segment mold (230) at the fourth station (140), and after rotating, it passes through the first station (110) and the diamonds can be arranged at the second station (120).

[0255]

[0256] When the diamonds are arranged in this way at the second station (120), they are rotated to be compacted at the third station (130), and after passing through the fourth station (140) and the second station (120) by rotation, the second station (120), the third station (130), and the fourth station (140) are repeated to form multiple layers. After the set multiple layers are formed, the diamond array segments can be pressed and extracted at the first station (110) by rotation.

[0257]

[0258] Although the present invention has been described above with reference to preferred embodiments thereof, it will be apparent to those skilled in the art that various modifications and changes may be made to the present invention without departing from the spirit and scope of the present invention as set forth in the claims below.

[0259]

[0260] The present invention is not limited to the specific preferred embodiments described above, and anyone with ordinary skill in the art to which the invention pertains can make various modifications without departing from the gist of the present invention claimed in the claims, and as long as it relates to technical ideas forming such modifications, it is within the scope of the claims.

Claims

1. Multi-station including multiple stations; A rotary table installed adjacent to the above multi-station and formed so as to be able to rotate around a vertical axis, and having a diamond segment mold provided on the outer periphery; A filling unit that fills metal powder and diamond into the diamond segment mold when the diamond segment mold is installed at a corresponding station in the multi-station and rotates to be positioned at a set position; A compaction unit installed at the multi-station and compacting the metal powder filled in the diamond segment mold; A pressurized extraction unit installed at the multi-station and filled in the station for shaping the metal powder and the diamond into a diamond array segment and then extracting them; A diamond array segment manufacturing device characterized by comprising: an operation control unit that rotates the rotary table so that the diamond segment mold is positioned at a set position, operates and controls the filling unit so that the metal powder and the diamond are filled into the diamond segment mold, and operates and controls the compaction unit, the pressing unit, and the extraction unit.

2. In paragraph 1, The above rotary table has multiple inserts formed on the outer periphery, A diamond array segment manufacturing device characterized by further including a cartridge coupled to the above fitting and having a plurality of diamond segment molds formed therein.

3. In paragraph 1, The above filling part is, A metal powder filling unit for filling metal powder into the above diamond segment mold, A diamond array segment manufacturing device characterized by including a diamond setting unit that supplies and arranges diamonds into the diamond segment mold.

4. In paragraph 3, The above filling unit further includes a radial device that rotates radially and operates by rotating at a preset angle, The above radial device A rotary shaft configured with a rotary motor to rotate at a preset angle, A diamond array segment manufacturing device characterized by including a slide arm configured on the above rotational axis to adjust the position of a filling portion.

5. In paragraph 1, The above metal powder filling unit is, A metal powder supply hopper for receiving metal powder, A diamond array segment manufacturing device characterized by including a dividing adapter that is connected to the supply hopper to receive the metal powder and divides and supplies the metal powder to the diamond segment mold so that one side of the diamond array segment in contact with the shank forms a blank area.

6. In paragraph 1, The above diamond setting unit is, A diamond supply unit that supplies and arranges diamonds into the above diamond segment mold, A diamond array segment manufacturing device characterized by including a removal unit for removing residual diamonds of the above diamond supply unit.

7. In paragraph 6, The above diamond supply unit, A transport body having multiple array grooves formed therein, A moving unit that moves the above-mentioned transfer body to supply and arrange diamonds into the above-mentioned cutting tip mold and moves it to the original position; A diamond array segment manufacturing device characterized by including a vacuum suction unit coupled to the above-mentioned transfer body to fill the above-mentioned array grooves with diamonds by suction force.

8. In paragraph 7, A diamond array segment manufacturing device characterized in that a plurality of array grooves of the above-mentioned transfer body have different sizes and are alternately arranged to form an alternating arrangement of diamonds.

9. In paragraph 1, The above pressurized extraction unit is, A pressing section that pressurizes the upper part of the filled metal powder and the diamond to form the diamond array segment; An extraction section that pressurizes the lower part of the diamond and the metal powder filled with the same pressure as the pressing section, and extracts the formed diamond array segment; A diamond array segment manufacturing device characterized by including an extraction operating unit that operates the extraction unit to extract the formed diamond array segment while limiting the lower movement distance of the extraction unit.

10. In paragraph 1, It comprises a plurality of index parts configured on the above rotary table to control and fix the rotation of the rotary table, The above index section An index pin configured on the upper part of the rotary table that moves vertically up and down, A hydraulic cylinder that controls the movement of the index pin in the up and down direction, A diamond array segment manufacturing device characterized by comprising an index pin insertion hole formed vertically between diamond segment molds and configured along a rotary table into which a downward-facing index pin is vertically inserted.

11. A method for manufacturing a diamond array segment using a diamond array segment manufacturing device according to any one of claims 1 to 10, (1) A step of filling metal powder into a diamond segment mold when a rotary table rotates and a diamond segment mold is positioned at a corresponding station; (2) A step of arranging diamonds on top of the metal powder when the rotary table rotates after filling the metal powder and the diamond segment mold is positioned at the corresponding station; (3) After the diamonds are arranged, the rotary table rotates so that the diamond segment mold is positioned at the corresponding station, and the metal powder and the diamonds are pressed and compacted at a set pressure; (4) A step of pressing and forming the diamond array segment by positioning the diamond segment mold at the corresponding station by rotating the rotary table after the metal powder and the diamond are compacted; (5) A method for manufacturing a diamond array segment, characterized in that it comprises a step of extracting the diamond array segment from the diamond segment mold when the rotary table is rotated after the diamond array segment is formed and the diamond segment mold is positioned at the corresponding station.

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