Display module, preparation method therefor, and display apparatus

Abstract

A display module, comprising: a display panel, the display panel comprising a display portion, a bending portion and a binding portion, connected in sequence, the binding portion comprising a first binding sub-portion and a first main body sub-portion connected to each other; a flexible circuit board, comprising a second binding sub-portion and a second main body sub-portion, connected to each other, an orthographic projection of the second binding sub-portion onto the display portion at least partially overlapping with an orthographic projection of the first binding sub-portion onto the display portion, and the second main body sub-portion being provided with a first opening; a chip, located in the first opening and electrically connected to the first main body sub-portion; a bonding layer, bonded between the first main body sub-portion and the second main body sub-portion; a first sealing portion, located in the first opening, the first sealing portion being connected to the bonding layer, the first main body sub-portion and the second main body sub-portion; a second sealing portion, located outside the first opening and connected to the bonding layer, the first binding sub-portion, the first main body sub-portion, the second binding sub-portion and the second main body sub-portion, orthographic projections of the first sealing portion, the bonding layer, the second sealing portion and the first binding sub-portion onto the display portion forming a closed shape.

Description

Display module, manufacturing method thereof, and display device

[0001] This application claims priority to Chinese patent application No. 202311577311.X filed on November 23, 2023, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of display technology, and in particular to a display module, a preparation method thereof, and a display device. Background Art

[0003] Flexible display panels can bend freely, enabling display devices with flexible display panels to achieve a wider range of structural forms, such as folding, bending, and rolling forms. For example, a rolling display device can be unfolded or rolled up by sliding to one side, allowing for flexible adjustment of the product screen size without creases. Display devices with folding or rolling forms are highly favored by users because they can flexibly adjust the size of the display panel (product screen), providing a better user experience.

[0004] Summary of the Invention

[0005] In one aspect, a display module is provided. The display module includes a display panel, a flexible circuit board, a chip, an adhesive layer, a first sealing portion, and a second sealing portion. The display panel includes a display portion, a bending portion, and a binding portion connected in sequence. The display portion has a light-emitting side and a non-light-emitting side disposed opposite each other, and one end of the bending portion connected to the binding portion is bent toward the non-light-emitting side. The binding portion is located on the non-light-emitting side. The binding portion includes a first binding sub-portion and a first main body sub-portion connected thereto. The flexible circuit board includes a second binding sub-portion and a second main body sub-portion connected thereto. The orthographic projection of the second binding sub-portion on the display portion at least partially overlaps with the orthographic projection of the first binding sub-portion on the display portion. The orthographic projection of the second main body sub-portion on the display portion at least partially overlaps with the orthographic projection of the first main body sub-portion on the display portion. The second main body sub-portion has a first opening. The chip is located within the first opening and is electrically connected to the first main body sub-portion. The adhesive layer is bonded between the first and second main body sub-portions and is located on at least one side of the chip. The adhesive layer and the first binding sub-portion are located on different sides of the first opening. The first sealing portion is located within the first opening and is at least partially located on a side of the chip near the first binding sub-section. The first sealing portion is connected to the adhesive layer and the first main body sub-section. The second sealing portion is located outside the first opening and connects the adhesive layer, the first binding sub-section, the first main body sub-section, the second binding sub-section, and the second main body sub-section. The orthographic projection of the first sealing portion, the adhesive layer, the second sealing portion, and the first binding sub-section on the display portion forms a closed shape.

[0006] In some embodiments, a portion of the adhesive layer extends beyond a sidewall of the first opening and into the first opening.

[0007] In some embodiments, the size of the portion of the adhesive layer extending beyond the first opening ranges from 0.3 mm to 0.5 mm.

[0008] In some embodiments, the adhesive layer has a U-shaped cross section surrounding the chip.

[0009] In some embodiments, there are multiple first openings, and the adhesive layers corresponding to the first openings are connected to each other to form an integrated structure.

[0010] In some embodiments, the second main body sub-section further has a second opening; the second sealing portion is located in the second opening and contacts a side wall of the second opening.

[0011] In some embodiments, an orthographic projection of the adhesive layer on the display portion partially overlaps with an orthographic projection of the second sealing portion on the display portion.

[0012] In some embodiments, the first sealing portion is further connected to the chip.

[0013] In some embodiments, a fixing portion is located in the first opening, and the fixing portion connects the chip and the first main body sub-portion.

[0014] In some embodiments, the first sealing portion is connected to the fixing portion, and the orthographic projections of the first sealing portion and the fixing portion on the display portion form a closed figure.

[0015] In some embodiments, there is a gap between the fixing portion and the first opening.

[0016] In some embodiments, the first binding sub-portion extends along a first direction, the first binding sub-portion and the first main body sub-portion are spaced apart along a second direction, and the first direction and the second direction intersect; in the second direction, the minimum distance between the fixing portion and the side wall of the first opening is d1, where 0mm<d1≤0.3mm.

[0017] In some embodiments, the first binding sub-portion extends along a first direction, the first binding sub-portion and the first main body sub-portion are spaced apart along a second direction, and the first direction and the second direction intersect; in the first direction, the minimum distance between the fixing portion and the side wall of the first opening is d2, where 0mm<d2≤0.5mm.

[0018] In some embodiments, the display module further includes: a third sealing portion; the third sealing portion wraps the side of the first binding sub-portion away from the first main body sub-portion.

[0019] On the other hand, a method for preparing a display module is provided. The preparation method includes: providing a display panel, the display panel including a display part, a bending part and a binding part connected in sequence; the display part has a light-emitting side and a non-light-emitting side arranged opposite to each other, and one end of the bending part connected to the binding part is bent to the non-light-emitting side; the binding part is located on the non-light-emitting side; the binding part includes a first binding sub-part and a first main body sub-part connected to each other; an adhesive layer is formed on the first main body sub-part; a chip is bound to the first main body sub-part; a flexible circuit board is bound to the first binding sub-part, and the flexible circuit board includes a second binding sub-part and a second main body sub-part connected to each other; the orthographic projection of the second binding sub-part on the display part at least partially overlaps with the orthographic projection of the first binding sub-part on the display part; the orthographic projection of the second main body sub-part on the display part overlaps with the orthographic projection of the first binding sub-part on the display part The orthographic projections of the first main body sub-section on the display section at least partially overlap; the second main body sub-section has a first opening; the chip is located in the first opening, and the adhesive layer and the first binding sub-section are located on different sides of the first opening; a first sealing portion is formed in the first opening, and at least a portion of the first sealing portion is located on a side of the chip close to the first binding sub-section; the first sealing portion is connected to the adhesive layer and the first main body sub-section; a second sealing portion is formed outside the first opening, and the second sealing portion connects the adhesive layer, the first binding sub-section, the first main body sub-section, the second binding sub-section, and the second main body sub-section; wherein, the first sealing portion, the adhesive layer, the second sealing portion, and the orthographic projection of the first binding sub-section on the display section constitute a closed figure.

[0020] In some embodiments, the preparation method further includes: forming a third sealing portion on a side of the first binding sub-portion away from the first main body sub-portion.

[0021] In some embodiments, before binding the flexible circuit board to the first binding sub-section, the preparation method further includes: forming a fixing portion around the chip, the fixing portion connecting the chip and the first main body sub-section. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, etc. involved in the embodiments of the present disclosure.

[0023] FIG1 is a structural diagram of a display device according to some embodiments;

[0024] FIG2 is a structural diagram of a display module according to some embodiments;

[0025] FIG3 is a structural diagram of another display module according to some embodiments;

[0026] FIG4 is a cross-sectional structural diagram of the display module shown in FIG3 along the AA' line;

[0027] FIG5 is a cross-sectional structural diagram of the display module shown in FIG3 along the BB' direction;

[0028] FIG6 is a structural diagram of another display module according to some embodiments;

[0029] FIG7 is a cross-sectional structural diagram of the display module shown in FIG6 along the CC' direction;

[0030] FIG8 is a structural diagram of another display module according to some embodiments;

[0031] FIG9 is a structural diagram of another display module according to some embodiments;

[0032] FIG10 is a structural diagram of another display module according to some embodiments;

[0033] FIG11 is a flow chart of a method for manufacturing a display module according to some embodiments;

[0034] 12A to 17 are structural diagrams corresponding to steps in a method for manufacturing a display module according to some embodiments;

[0035] FIG18 is a structural diagram of another display module according to some embodiments. DETAILED DESCRIPTION

[0036] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0037] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0038] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0039] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. The term "connected" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. The term "coupled" indicates, for example, that two or more components are in direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0040] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0041] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0042] It will be understood that when a layer or element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present therebetween.

[0043] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0044] Some embodiments of the present disclosure provide a display device, which can be any display device that displays images, whether in motion (e.g., video) or fixed (e.g., still images), and whether text or images. More specifically, it is expected that the display device of the embodiments described can be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, camcorders, game consoles, watches, clocks, calculators, television monitors, flat-panel displays, computer monitors, automotive displays (e.g., odometer displays, etc.), navigation systems, cockpit controls and / or displays, displays of camera views (e.g., displays of rearview cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., displays of images of a piece of jewelry), etc.

[0045] FIG1 is a structural diagram of a display device according to some embodiments. As shown in FIG1 , the display device 200 includes a display module 100 .

[0046] Exemplarily, the display device 200 further includes a frame, a display driver IC (Integrated Circuit), and other electronic components.

[0047] As shown in FIG2 , some embodiments of the present disclosure provide a display module 100 , which can be applied to the above-mentioned display device 200 . Of course, the display module 100 can also be applied to other display devices, and the present disclosure does not limit this.

[0048] In some embodiments, as shown in FIG. 2 , the display module 100 includes a display panel 1 , a flexible circuit board 2 , and a chip 3 .

[0049] For example, the display panel 1 may be an OLED (Organic Light Emitting Diode) display panel, a QLED (Quantum Dot Light Emitting Diodes) display panel, etc. The embodiments of the present disclosure do not specifically limit this.

[0050] In the present disclosure, the display panel 1 is described as an OLED display panel as an example.

[0051] In some examples, as shown in FIG2 , the display panel 1 includes a display portion 11 , a bending portion 12 , and a binding portion 13 that are sequentially connected.

[0052] Exemplarily, the display unit 11 may include multiple pixel circuits and multiple light-emitting devices. The multiple pixel circuits and the multiple light-emitting devices may be electrically connected, for example, in a one-to-one correspondence. Each pixel circuit may control a corresponding light-emitting device to emit light, and the multiple light-emitting devices cooperate with each other to enable the display unit 11 to display an image.

[0053] As shown in FIG2 , the display unit 11 has a light-emitting side and a non-light-emitting side disposed opposite to each other. The side of the display unit 11 used for displaying images is the light-emitting side of the display unit 11 , and the side facing away from the light-emitting side of the display unit 11 is the non-light-emitting side of the display unit 11 .

[0054] It is understood that the bending process can be used to bend the bending portion 12, with the end of the bending portion 12 connected to the binding portion 13 being bent toward the non-light-exiting side of the display portion 11, thereby bending the binding portion 13 toward the non-light-exiting side of the display portion 11. This can reduce the space occupied by the display module 100 in the first direction, reduce the size of the frame of the display module 100, and facilitate a narrow-frame design.

[0055] In some examples, as shown in Figures 2 and 3 , the binding portion 13 includes a first binding sub-portion A1 and a first main body sub-portion B1 connected thereto. The flexible circuit board 2 includes a second binding sub-portion A2 and a second main body sub-portion B2 connected thereto.

[0056] For example, as shown in FIG3 , in the binding portion 13 , the first binding sub-portion A1 extends along the first direction X, and the first binding sub-portion A1 and the first main body sub-portion B1 are sequentially arranged along the second direction Y. In the flexible circuit board 2 , the second binding sub-portion A2 extends along the first direction X, and the second binding sub-portion A2 and the second main body sub-portion B2 are sequentially arranged along the second direction Y.

[0057] For example, the second direction Y intersects the first direction X. Here, the angle between the first direction X and the second direction Y can be set according to actual needs. For example, the first direction X and the second direction Y are perpendicular, that is, the angle between the first direction X and the second direction Y is 90°.

[0058] The second binding sub-section A2 is bound to the first binding sub-section A1, that is, the flexible circuit board 2 is bound to the display panel 1. Thus, the flexible circuit board 2 can provide digital signals to the display panel 1, so that the display panel 1 can realize the display function.

[0059] For example, when the display unit 11 only has a display function, the flexible circuit board 2 can be used to transmit the display signal required by the display unit 11. When the display unit 11 has both a display function and a touch function, the flexible circuit board 2 can be used to transmit the display signal or the touch signal required by the display unit 11.

[0060] It can be understood that the above display signal or touch signal is transmitted to the display unit 11 through the binding portion 13 and the bending portion 12 in sequence, so that the display unit 11 can work normally.

[0061] In some examples, as shown in FIG3 , the orthographic projection of the second body sub-section B2 on the display portion 11 at least partially overlaps with the orthographic projection of the first body sub-section B1 on the display portion 11. For example, the orthographic projection of the second body sub-section B2 on the display portion 11 is within the range of the orthographic projection of the first body sub-section B1 on the display portion 11.

[0062] In some examples, as shown in Figure 3, the orthographic projection of the second binding sub-section A2 on the display portion 11 at least partially overlaps with the orthographic projection of the first binding sub-section A1 on the display portion 11. For example, the orthographic projection of the second binding sub-section A2 on the display portion 11 is within the range of the orthographic projection of the first binding sub-section A1 on the display portion 11.

[0063] In the related art, the second binding sub-section A2 of the flexible circuit board 2 is closer to the bending portion 12 than the second main body sub-section B2. In the first direction X, the second main body sub-section B2 occupies part of the space alone (that is, the second main body sub-section B2 and the first main body sub-section B1 are staggered, and the second main body sub-section B2 and the first main body sub-section B1 respectively occupy part of the space), which causes the flexible circuit board 2 to occupy a larger space in the first direction. In the technical solution disclosed in the present invention, reverse binding is adopted, so that the second main body sub-section B2 is closer to the bending portion 12 than the second binding sub-section A2, and the dimensions occupied by the second main body sub-section B2 and the first main body sub-section B1 in the first direction X partially overlap, thereby reducing the occupied space.

[0064] In this case, in the display module 100, the first binding sub-portion A1 of the binding portion 13 partially overlaps with the second binding sub-portion A2 of the flexible circuit board 2 in the first direction X, and at the same time, the first main body sub-portion B1 of the binding portion 13 partially overlaps with the second main body sub-portion B2 of the flexible circuit board 2 in the first direction X, thereby realizing reverse binding. As a result, the space occupied by the flexible circuit board 2 and the binding portion 13 in the first direction is reduced, the border size of the display module 100 is reduced, and a narrow border design is realized.

[0065] In some examples, as shown in FIG3 , the second main body sub-section B2 has a first opening C1 . The number of the first opening C1 can be one or more. For example, as shown in FIG3 , the number of the first opening C1 is two.

[0066] For example, as shown in Figure 3, chip 3 is located within first opening C1 and is electrically connected to first main body subsection B1. Compared to a case where chip 3 and flexible circuit board 2 are arranged side by side along first direction X, this embodiment, by locating chip 3 within first opening C1 of flexible circuit board 2, eliminates chip 3's footprint in the first direction, further freeing up space within the entire device.

[0067] Exemplarily, the chip 3 can be used to output signals to the display panel 1. For example, the chip 3 can provide the display panel 1 with data signals required for displaying images, and at the same time cooperate with other signals output by the flexible circuit board 2 to enable the display panel 1 to display images.

[0068] Exemplarily, the number of chips 3 is the same as the number of first openings C1, and the chips 3 and first openings C1 are arranged in a one-to-one correspondence, that is, one chip 3 is located in one first opening C1. Optionally, when there is one chip 3, the number of first openings C1 is also one; when there are two chips 3, the number of first openings C1 is also two. Exemplarily, the number of chips 3 is different from the number of first openings C1, and multiple chips 3 can be arranged in one first opening C1. The embodiments of the present disclosure are not limited to this.

[0069] In some examples, as shown in FIG2 to FIG5 , the display module 100 further includes an adhesive layer 4. The adhesive layer 4 is made of a material having a certain viscosity, for example, a PSA (Pressure Sensitive Adhesive).

[0070] 2 to 5 , adhesive layer 4 is bonded between first body subsection B1 and second body subsection B2 and located on at least one side of chip 3. In other words, the bonding between first body subsection B1 and second body subsection B2 via adhesive layer 4 allows the flexible circuit board 2 to be better secured to the binding portion 13.

[0071] Exemplarily, the adhesive layer 4 may be located on one side or multiple sides of the chip 3. For example, as shown in FIG3 , the adhesive layer 4 is located on three sides of the chip 3.

[0072] The adhesive layer 4 and the first binding sub-portion A1 are located on different sides of the first opening C1 .

[0073] For example, in the second direction Y, the first binding sub-portion A1 is located on a side of the first opening C1 close to the second binding sub-portion A2. In this case, the adhesive layer 4 can be located on one side of the first opening C1, for example, the adhesive layer 4 can be located on either side of the first opening C1 on opposite sides in the first direction X. The adhesive layer 4 can also be located on both sides of the first opening C1, for example, the adhesive layer 4 can be located on opposite sides of the first opening C1 on the first direction X.

[0074] For example, as shown in Figures 3 and 6, in order to reduce the difficulty of attaching the adhesive layer 4 and avoid the adhesive layer 4 adhering to the first binding sub-section A1, affecting the binding effect between the first binding sub-section A1 and the second binding sub-section A2, usually, there is a certain safety distance between the adhesive layer 4 and the first binding sub-section A1, that is, there is a gap between the adhesive layer 4 and the first binding sub-section A1 (for example, at position α, position β, position γ shown in Figure 6; at position β shown in Figure 7).

[0075] After the first binding sub-section A1 and the second binding sub-section A2 are bound, and the first main body sub-section B1 and the second main body sub-section B2 are bonded by the adhesive layer 4, since the adhesive layer 4 has a certain thickness, a closed cavity cannot be formed at the above-mentioned gap, and water and oxygen in the air can easily enter through the gap, corroding the binding position of the first binding sub-section A1 and the second binding sub-section A2, affecting the binding effect between the first binding sub-section A1 and the second binding sub-section A2, and further affecting the display effect of the display module 100.

[0076] Based on this, the display module 100 of the present disclosure further includes a first sealing portion 5 and a second sealing portion 6 , as shown in FIG3 .

[0077] 3 , the first sealing portion 5 is located in the first opening C1 and at least partially on the side of the chip 3 close to the first binding sub-portion A1 ; the first sealing portion 5 is connected to the adhesive layer 4 , the first main sub-portion B1 , and the second main sub-portion B2 .

[0078] For example, as shown in Figure 3, with the adhesive layer 4 positioned on three sides of the chip 3, the first sealing portion 5 is positioned within the first opening C1 and on the side of the chip 3 closest to the first binding sub-section A1. In this case, in the second direction Y, the end surface of the gap closest to the first opening C1 is shielded by the adhesive layer 4. This prevents water and oxygen from entering through the end surface of the gap closest to the first opening C1, thereby alleviating corrosion issues at the binding locations of the first and second binding sub-sections A1 and A2 caused by the ingress of water and oxygen.

[0079] Exemplarily, as shown in FIG3 , the second sealing portion 6 is located outside the first opening C1 and connects the adhesive layer 4 , the first binding sub-portion A1 , the first main body sub-portion B1 , the second binding sub-portion A2 , and the second main body sub-portion B2 .

[0080] For example, as shown in FIG3 , the second sealing portion 6 is located at the end of the gap away from the first opening and blocks the end of the gap away from the first opening C1. This prevents water and oxygen from entering through the end of the gap away from the first opening C1, thereby alleviating the corrosion problem caused by water and oxygen at the binding position of the first binding sub-section A1 and the second binding sub-section A2.

[0081] For example, the materials of the first sealing portion 5 and the second sealing portion 6 may be the same or different.

[0082] When the first sealing portion 5 and the second sealing portion 6 are made of the same material, such as UV (Ultraviolet Ray) adhesive, the first sealing portion 5 and the second sealing portion 6 can be formed simultaneously, simplifying the manufacturing process of the display module 100.

[0083] When the materials of the first sealing portion 5 and the second sealing portion 6 are different, the material of the first sealing portion 5 may be, for example, UV glue, and the material of the second sealing portion 6 may be, for example, epoxy adhesive or modified silicone adhesive.

[0084] Illustratively, the orthographic projections of the first sealing portion 5 , the adhesive layer 4 , the second sealing portion 6 and the first binding sub-portion A1 on the display portion 11 form a closed figure.

[0085] It should be noted that a "closed figure" refers to an image that is in a closed state in its dimension. Specifically in the embodiment of the present disclosure, for example, as shown in FIG3 , the first sealing portion 5 extends along the first direction X. In the first direction X, the left end face of the first sealing portion 5 is connected to the end face of the portion of the adhesive layer 4 located on the left side of the first opening C1 close to the first opening C1; the right end face of the first sealing portion 5 is connected to the end face of the portion of the adhesive layer 4 located on the right side of the first opening C1 close to the first opening C1; the second sealing portion 6 extends along the second direction Y. In the second direction Y, the upper end face of the first sub-portion 61 of the second sealing portion 6 is connected to the upper end face of the first sub-portion 61 of the second sealing portion 6 located on the first opening C1. 1, the lower end surface of the first sub-portion 61 of the second sealing portion 6 is connected to the right end surface of the first binding sub-portion A1, the left end surface of the first binding sub-portion A1 is connected to the lower end surface of the second sub-portion 62 of the second sealing portion 6, and the upper end surface of the second sub-portion 62 of the second sealing portion 6 is connected to the other end surface of the partial adhesive layer 4 located on the left side of the first opening C1, thereby making the orthographic projection of the first sealing portion 5, the adhesive layer 4, the second sealing portion 6 and the first binding sub-portion A1 on the display portion 11 form a closed figure.

[0086] Furthermore, the first main body sub-section B1 and the second main body sub-section B2 are bonded by the adhesive layer 4; the first binding sub-section A1 and the second binding sub-section A2 are bound, thereby, the first sealing section 5, the adhesive layer 4, the second sealing section 6 and the first binding sub-section A1, together with the first main body sub-section B1 and the second main body sub-section B2, can form a closed cavity.

[0087] In this embodiment, a first sealing part 5 and a second sealing part 6 are provided, and the positive projections of the first sealing part 5, the adhesive layer 4, the second sealing part 6 and the first binding sub-part A1 on the display part 11 form a closed figure; the end face of the gap between the adhesive layer 4 and the first binding sub-part A1 can be blocked, so that the first sealing part 5, the adhesive layer 4, the second sealing part 6 and the first binding sub-part A1 form a closed cavity with the first main body sub-part B1 and the second main body sub-part B2, thereby avoiding water and oxygen from entering along the gap between the adhesive layer 4 and the first binding sub-part A1, and effectively preventing the binding positions of the first binding sub-part A1 and the second binding sub-part A2 from being corroded by water and oxygen, thereby improving the binding effect between the first binding sub-part A1 and the second binding sub-part A2, and improving the stability of the display module 100.

[0088] In some examples, there is a gap between the chip 3 and the adhesive layer 4. That is, there is a certain safety distance between the chip 3 and the adhesive layer 4, thereby reducing the difficulty of binding the chip 3.

[0089] For example, as shown in FIG8 , in the first direction X, the distance b between one side surface of the chip 3 and the edge of the adhesive layer 4 near the side surface can range from 1.2 mm to 1.5 mm. For example, in the first direction X, the distance b between one side surface of the chip 3 and the edge of the adhesive layer 4 near the side surface can range from 1.2 mm to 1.25 mm. 1.3 mm, 1.4 mm, 1.5 mm, etc. In the second direction Y, the distance c between one side surface of the chip 3 and the edge of the adhesive layer 4 near the side surface can range from 0.9 mm to 1.2 mm. For example, in the second direction Y, the distance c between one side surface of the chip 3 and the edge of the adhesive layer 4 near the side surface can range from 0.9 mm to 1.2 mm.

[0090] In some embodiments, as shown in FIG. 3 and FIG. 8 , a portion of the adhesive layer 4 extends beyond the sidewall of the first opening C1 and extends into the first opening C1 .

[0091] Exemplarily, when the adhesive layer 4 is located on one side of the chip 3 , at one sidewall of the first opening C1 , a portion of the adhesive layer 4 exceeds the sidewall of the first opening C1 and extends into the first opening C1 .

[0092] As another example, when the adhesive layer 4 is located on multiple sides of the chip 3, a portion of the adhesive layer 4 may extend beyond the sidewall of the first opening C1 and into the first opening C1 at one sidewall of the first opening C1. Alternatively, a portion of the adhesive layer 4 may extend beyond the sidewall of the first opening C1 and into the first opening C1 at multiple sidewalls of the first opening C1. For example, when the adhesive layer 4 is located on three sides of the chip 3, portions of the adhesive layer 4 may extend beyond the sidewall of the first opening C1 and into the first opening C1 at two opposing sidewalls of the first opening C1 in the first direction X, as shown in FIG3 .

[0093] In this embodiment, the first sealing portion 5 can be overlapped on the portion of the adhesive layer 4 that exceeds the first opening C1, thereby increasing the connection area between the first sealing portion 5 and the adhesive layer 4, further ensuring the reliability of the connection between the first sealing portion 5 and the adhesive layer 4, and further improving the airtightness of the closed cavity formed by the first sealing portion 5, the adhesive layer 4, the second sealing portion 6, the first binding sub-portion A1 and the first main body sub-portion B1 and the second main body sub-portion B2, thereby improving the waterproof performance of the binding connection between the flexible circuit board 2 and the display panel 1, and improving the stability of the display module 100.

[0094] In some embodiments, as shown in FIG8 , the dimension a of the portion of the adhesive layer 4 extending beyond the first opening C1 ranges from 0.3 mm to 0.5 mm. For example, the dimension a of the portion of the adhesive layer 4 extending beyond the first opening C1 can be 0.3 mm, 0.35 mm, 0.4 mm, 0.45 mm, 0.5 mm, etc. This is not a limitation of the present disclosure.

[0095] The above arrangement not only ensures that the connection area between the first sealing portion 5 and the adhesive layer 4 is large enough and the connection between the first sealing portion 5 and the adhesive layer 4 is effective, but also ensures that the adhesive layer 4 extends beyond the side wall of the first opening C1 and the portion extending into the first opening C1 is not too large, thereby ensuring a certain safety distance between the chip 3 and the adhesive layer 4, thereby reducing the difficulty of binding the chip 3.

[0096] In some embodiments, as shown in FIG. 3 , the adhesive layer 4 has a U-shaped cross section surrounding the chip 3 .

[0097] For example, the number of chips 3 is the same as the number of adhesive layers 4, and the chips 3 and adhesive layers 4 are arranged in a one-to-one correspondence, that is, one adhesive layer 4 surrounds one chip 3. When there is one chip 3, there is also one adhesive layer 4; when there are two chips 3, there are also two adhesive layers 4.

[0098] For example, as shown in FIG3 , the chip 3 is rectangular in shape, and the adhesive layer 4 surrounds three sides of the chip 3. In this case, the first sealing portion 5 can be provided only on one side of the chip 3 close to the first binding sub-portion A1, thereby forming a closed shape together with the adhesive layer 4, the second sealing portion 6, and the orthographic projection of the first binding sub-portion A1 on the display portion 11.

[0099] With the above arrangement, the design size of the first sealing portion 5 can be reduced. When the first sealing portion 5 is formed by colloid infusion, the amount of colloid used can be reduced, thereby reducing production costs and shortening production cycles.

[0100] Furthermore, as shown in FIG3 , along the first direction X, the adhesive layer 4 surrounds the two opposite sides of the chip 3, as well as the side of the chip 3 away from the first binding sub-section A1. Part of the adhesive layer 4 on both opposite sides of the chip 3 along the first direction X extends beyond the sidewalls of the first opening C1 and into the first opening C1. Along the first direction X, both ends of the first sealing portion 5 overlap the adhesive layer 4, thereby improving the reliability of the connection between the first sealing portion 5 and the adhesive layer 4, further improving the airtightness of the closed cavity formed by the first sealing portion 5, the adhesive layer 4, the second sealing portion 6, the first binding sub-section A1, and the first main body sub-section B1 and the second main body sub-section B2, improving the waterproof performance of the binding connection between the flexible circuit board 2 and the display panel 1, and improving the stability of the display module 100.

[0101] In some embodiments, there are multiple first openings C1 , and the adhesive layers 4 corresponding to the first openings C1 are connected to each other to form an integrated structure.

[0102] 3 and 8 , the second main body sub-section B has two first openings C1 , and two adhesive layers 4 corresponding to the two first openings C1 are connected to each other to form an integral structure. For example, the overall shape of the two adhesive layers 4 is "m"-shaped.

[0103] The aforementioned "integrated structure" refers to two connected patterns being arranged on the same layer, and the two patterns being continuous and unseparated. Specifically, in the disclosed embodiment, the multiple adhesive layers 4 corresponding to the first openings C1 are interconnected and unseparated, forming an integrated structure. This simplifies the preparation process of the adhesive layers 4 and allows multiple adhesive layers 4 to be attached at once, simplifying the preparation process of the display module 100.

[0104] In some embodiments, as shown in FIG. 3 and FIG. 8 , the second main body sub-portion B2 further has a second opening C2 ; the second sealing portion 6 is located in the second opening C2 and contacts the sidewall of the second opening C2 .

[0105] For example, as shown in Figures 3 and 8, the second main body sub-part B2 has two second openings C2. In the first direction X, the two second openings C2 are respectively located at the two ends of the second main body sub-part B2. At this time, the display module 100 includes two second sealing parts 6, and one second sealing part 6 is located in one second opening C2.

[0106] With the above-mentioned arrangement, in the first direction X, the second sealing part 6 blocks the end face at the gap between the adhesive layer 4 and the first binding sub-part A1, and forms a closed cavity with the first sealing part 5, the adhesive layer 4, the first binding sub-part A1, the first main body sub-part B1 and the second main body sub-part B2, thereby preventing water and oxygen from entering along the gap between the adhesive layer 4 and the first binding sub-part A1, and effectively preventing the binding positions of the first binding sub-part A1 and the second binding sub-part A2 from being corroded by water and oxygen, thereby improving the binding effect between the first binding sub-part A1 and the second binding sub-part A2, and improving the stability of the display module 100.

[0107] In some embodiments, the orthographic projection of the adhesive layer 4 on the display portion 11 partially overlaps with the orthographic projection of the second sealing portion 6 on the display portion 11 .

[0108] Illustratively, a portion of the adhesive layer 4 extends beyond the sidewall of the second opening C2 and extends into the second opening C2 , and the second sealing portion 6 overlaps with the portion of the adhesive layer 4 extending into the second opening C2 .

[0109] By adopting the above-mentioned setting, the connection area between the second sealing part 6 and the adhesive layer 4 can be increased, thereby ensuring the reliability of the connection between the second sealing part 6 and the adhesive layer 4, further improving the airtightness of the closed cavity formed by the first sealing part 5, the adhesive layer 4, the second sealing part 6, the first binding sub-part A1 and the first main body sub-part B1 and the second main body sub-part B2, improving the waterproof performance of the binding connection between the flexible circuit board 2 and the display panel 1, and improving the stability of the display module 100.

[0110] In some embodiments, as shown in FIG. 3 and FIG. 8 , the first sealing portion 5 is further connected to the chip 3 .

[0111] For example, the first sealing portion 5 is located on a side of the first opening C1 close to the first binding sub-portion A1, filling the gap between the chip 3 and the flexible circuit board 2. Thus, the first sealing portion 5 can also be used to fix the chip 3 to prevent the chip 3 from falling off the display panel 1.

[0112] In some embodiments, as shown in FIG. 8 , the display module 100 further includes a fixing portion 7 located in the first opening C1 , and the fixing portion 7 connects the chip 3 and the first main body sub-portion B1 .

[0113] Exemplarily, the material of the fixing portion 7 may be UV glue, and the fixing portion 7 may be formed by coating.

[0114] For example, as shown in FIG8 , the cross section of the fixing portion 7 is U-shaped and surrounds the chip 3. At this time, the fixing portion 7 is connected to three sides of the chip 3. Of course, the fixing portion 7 can also be connected to one side of the chip 3 or two sides of the chip 3. The embodiments of the present disclosure are not limited to this.

[0115] With the above arrangement, the chip 3 can be fixed by the fixing portion 7 to prevent the chip 3 from falling off the display panel 1 .

[0116] In some embodiments, as shown in FIG8 , the first sealing portion 5 is connected to the fixing portion 7 , and the orthographic projections of the first sealing portion 5 and the fixing portion 7 on the display portion 11 form a closed figure.

[0117] For example, as shown in FIG8 , the first sealing portion 5 is located on a side of the chip 3 close to the first binding sub-portion A1 and extends along the first direction X. At this time, in the first direction X, one end of the fixing portion 7 is connected to the side of the first sealing portion 5 close to the chip 3, and the other end of the fixing portion 7 is connected to the side of the first sealing portion 5 close to the chip 3. In other words, the two ends of the fixing portion 7 are connected by a portion of the first sealing portion 5, and the orthographic projections of the first sealing portion 5 and the fixing portion 7 on the display portion 11 form a closed figure.

[0118] The first sealing part 5 is connected to the first main body sub-part B1 and the chip 3. On the side of the chip 3 close to the first binding sub-part A1, the binding position of the first main body sub-part B1 and the chip 3 is wrapped by the first sealing part 5; the fixing part 7 is connected to the first main body sub-part B1 and the chip 3. On multiple sides of the chip 3 surrounded by the fixing part 7, the binding position of the first main body sub-part B1 and the chip 3 is wrapped by the fixing part 7.

[0119] The above configuration can prevent the chip 3 and the first main body sub-part B1 from being in contact with water and oxygen, thereby improving the waterproof performance of the chip 3 and the first main body sub-part B1 and improving the stability of the display module 100 .

[0120] In some embodiments, as shown in FIG. 8 , there is a gap between the fixing portion 7 and the first opening C1 .

[0121] Exemplarily, there is a gap between each position of the fixing portion 7 and the first opening C1 .

[0122] In the related art, as shown in FIG. 10 , the colloid is filled between the fixing portion 7 and the first opening C1 . In this case, the amount of colloid used is large, the production cost is high, and the production cycle is long.

[0123] The present disclosure adopts the above-mentioned configuration, which can not only prevent the flexible circuit board 2 from interfering with the fixing portion 7 when being attached, but also effectively reduce the amount of colloid used, reduce production costs, and shorten the production cycle.

[0124] In some embodiments, as shown in FIG8 , the minimum distance d1 between the fixing portion 7 and the sidewall of the first opening C1 in the second direction Y is, where 0 mm < d1 ≤ 0.3 mm. For example, the minimum distance d1 between the fixing portion 7 and the sidewall of the first opening C1 in the second direction Y can be 0.05 mm, 0.1 mm, 0.15 mm, 0.2 mm, 0.3 mm, etc., and the embodiments of the present disclosure are not limited thereto.

[0125] This arrangement ensures a safe distance between the chip 3 and the fixing portion 7 disposed around the chip 3 and the first opening C1 in the flexible circuit board 2, thereby reducing the difficulty of attaching the flexible circuit board 2 and preventing the flexible circuit board 2 from colliding with the fixing portion 7 when attaching the flexible circuit board 2.

[0126] Furthermore, in the second direction Y, the minimum distance d1 between the fixing portion 7 and the side wall of the first opening C1 can be in the range of 0.1 mm to 0.2 mm. For example, in the second direction Y, the minimum distance d1 between the fixing portion 7 and the side wall of the first opening C1 can be 0.1 mm, 0.12 mm, 0.14 mm, 0.17 mm, 0.20 mm, etc. The embodiments of the present disclosure are not limited to this. In this way, a safe distance can be ensured between the chip 3 and the fixing portion 7 arranged around the chip 3 and the first opening C1 in the flexible circuit board 2, and the space reserved for the chip 3 and the fixing portion 7 arranged around the chip 3 in the flexible circuit board 2 can be small (that is, the first opening C1 is small), thereby ensuring the performance of the flexible circuit board 2.

[0127] In some embodiments, as shown in FIG8 , the minimum distance d2 between the fixing portion 7 and the sidewall of the first opening C1 in the first direction X is, where 0 mm < d2 ≤ 0.5 mm. For example, the minimum distance d2 between the fixing portion 7 and the sidewall of the first opening C1 in the first direction X can be 0.05 mm, 0.15 mm, 0.25 mm, 0.4 mm, 0.5 mm, etc., and the embodiments of the present disclosure are not limited thereto.

[0128] Furthermore, in the first direction X, the minimum distance d2 between the fixing portion 7 and the side wall of the first opening C1 can be in the range of 0.2 mm to 0.3 mm. For example, in the first direction X, the minimum distance d2 between the fixing portion 7 and the side wall of the first opening C1 can be 0.2 mm, 0.22 mm, 0.24 mm, 0.27 mm, 0.30 mm, etc. The embodiments of the present disclosure are not limited to this. In this way, a safe distance can be ensured between the chip 3 and the fixing portion 7 arranged around the chip 3 and the first opening C1 in the flexible circuit board 2, and the space reserved for the chip 3 and the fixing portion 7 arranged around the chip 3 in the flexible circuit board 2 can be small (that is, the first opening C1 is small), thereby ensuring the performance of the flexible circuit board 2.

[0129] This arrangement ensures a safe distance between the chip 3 and the fixing portion 7 disposed around the chip 3 and the first opening C1 in the flexible circuit board 2, thereby reducing the difficulty of attaching the flexible circuit board 2 and preventing the flexible circuit board 2 from colliding with the fixing portion 7 when attaching the flexible circuit board 2.

[0130] In some embodiments, as shown in FIG9 , the display module 100 further includes a third sealing portion 8 . The third sealing portion 8 wraps around the side of the first binding sub-section A1 away from the first main body sub-section B1. This prevents the side of the first binding sub-section A1 away from the first main body sub-section B1 from coming into contact with water and oxygen, thereby improving the waterproof performance of the side of the first binding sub-section A1 away from the first main body sub-section B1 and enhancing the stability of the display module 100.

[0131] Furthermore, the third sealing portion 8 also wraps the side of the second binding sub-portion A2 away from the second main body sub-portion B2, thereby preventing the side of the second binding sub-portion A2 away from the second main body sub-portion B2 from contacting water and oxygen, thereby improving the waterproof performance of the side of the second binding sub-portion A2 away from the second main body sub-portion B2 and improving the stability of the display module 100.

[0132] In some examples, as shown in FIG. 2 and FIG. 8 , the display module 100 further includes a micro-coating layer 9 .

[0133] Exemplarily, the micro-coating layer 9 is located outside the bent portion 12 of the display panel 1 to protect the bent portion 12 of the display panel 1 .

[0134] Exemplarily, the material of the micro coating layer 9 may be MCL glue.

[0135] The present disclosure also provides a method for preparing a display module 100, which is used to prepare the above-mentioned display module 100. As shown in FIG11 , the method for preparing the display module 100 includes steps S1 to S6.

[0136] S1: As shown in Figures 12A and 12B, a display panel 1 is provided. The display panel 1 includes a display portion 11, a bending portion 12, and a binding portion 13, which are connected in sequence. The display portion 11 has a light-emitting side and a non-light-emitting side disposed opposite each other. The end of the bending portion 12 connected to the binding portion 13 is bent toward the non-light-emitting side of the display portion 11. The binding portion 13 includes a first binding sub-portion A1 and a first main body sub-portion B1, which are connected to each other.

[0137] S2: As shown in FIG. 13 , an adhesive layer 4 is formed on the first main body sub-part B1 .

[0138] For example, regarding the structure of the adhesive layer 4 , reference may be made to the description in some of the above embodiments, which will not be repeated here.

[0139] S3: As shown in FIG14 , the chip 3 is bonded to the first main body sub-part B1 .

[0140] For example, regarding the structure of the chip 3, reference may be made to the description in some of the above embodiments, which will not be repeated here.

[0141] S4: As shown in FIG15 , the flexible circuit board 2 is bonded to the first binding sub-section A1. The flexible circuit board 2 includes a second binding sub-section A2 and a second main body sub-section B2 connected thereto. The orthographic projection of the second binding sub-section A2 on the display portion 11 at least partially overlaps with the orthographic projection of the first binding sub-section A1 on the display portion 11; the orthographic projection of the second main body sub-section B2 on the display portion 11 at least partially overlaps with the orthographic projection of the first main body sub-section B1 on the display portion 11; and the second main body sub-section B2 has a first opening C1.

[0142] Exemplarily, the chip 3 is located in the first opening C1 , and the adhesive layer 4 and the first binding sub-portion A1 are located on different sides of the first opening C1 .

[0143] S5: As shown in FIG. 16 , a first sealing portion 5 is formed in the first opening C1 .

[0144] For example, regarding the structure of the first sealing portion 5 , reference may be made to the description in some of the above embodiments, which will not be repeated here.

[0145] Exemplarily, the first sealing portion 5 may be formed by colloid injection.

[0146] S6: As shown in FIG. 17 , a second sealing portion 6 is formed outside the first opening C1 .

[0147] For example, regarding the structure of the second sealing portion 6 , reference may be made to the description in some of the above embodiments, which will not be repeated here.

[0148] For example, the second sealing portion 6 may be formed by colloid injection.

[0149] It should be noted that some steps of the above-mentioned manufacturing method can be performed simultaneously, or can be performed in an order different from that shown in Figure 11. For example, the above-mentioned steps S5 and S6 can be performed in reverse, that is, first forming the second sealing portion 6 outside the first opening C1, and then forming the first sealing portion 5 inside the first opening C1; or the above-mentioned steps S5 and S6 can also be performed simultaneously, that is, forming the second sealing portion 6 outside the first opening C1 and forming the first sealing portion 5 inside the first opening C1 at the same time.

[0150] Illustratively, the orthographic projections of the first sealing portion 5 , the adhesive layer 4 , the second sealing portion 6 and the first binding sub-portion A1 on the display portion 11 form a closed figure.

[0151] The manufacturing method of the display module 100 provided in some embodiments of the present disclosure can be used to manufacture the display module 100 in any of the above-mentioned embodiments. In this manufacturing method, after the flexible circuit board 2 is bonded to the first binding sub-section A1, a first sealing portion 5 is formed within the first opening C1 of the flexible circuit board 2 to block the end surface of the gap between the adhesive layer 4 and the first binding sub-section A1 near the first opening C1; and a second sealing portion 6 is formed outside the first opening C1 to block the end of the gap between the adhesive layer 4 and the first binding sub-section A1 away from the first opening C1. Ultimately, the first sealing portion 5, the adhesive layer 4, the second sealing portion 6, and the first binding sub-section A1 form a closed cavity with the first main body sub-section B1 and the second main body sub-section B2, preventing water and oxygen from entering through the gap between the adhesive layer 4 and the first binding sub-section A1. This can effectively prevent water and oxygen from corroding the bonding position of the first binding sub-section A1 and the second binding sub-section A2, thereby improving the bonding effect between the first binding sub-section A1 and the second binding sub-section A2 and improving the stability of the display module 100.

[0152] In some embodiments, the method for manufacturing the display module 100 further includes: forming a third sealing portion 8 on a side of the first binding sub-portion A1 away from the first main body sub-portion B1 .

[0153] For example, the third sealing portion 8 wraps around the side of the first binding sub-section A1 away from the first main body sub-section B1. This prevents the side of the first binding sub-section A1 away from the first main body sub-section B1 from contact with water and oxygen, improves the waterproof performance of the side of the first binding sub-section A1 away from the first main body sub-section B1, and improves the stability of the display module 100.

[0154] Furthermore, the third sealing portion 8 also wraps the side of the second binding sub-portion A2 away from the second main body sub-portion B2, thereby preventing the side of the second binding sub-portion A2 away from the second main body sub-portion B2 from contacting water and oxygen, thereby improving the waterproof performance of the side of the second binding sub-portion A2 away from the second main body sub-portion B2 and improving the stability of the display module 100.

[0155] In some embodiments, before step S4 , the method for preparing the display module 100 further includes: forming a fixing portion 7 around the chip 3 , wherein the fixing portion 7 connects the chip 3 and the first main body sub-portion B1 .

[0156] Exemplarily, the material of the fixing portion 7 may be UV glue, and the fixing portion 7 may be formed by coating.

[0157] 8 , the fixing portion 7 has a U-shaped cross section, surrounding the chip 3. For example, in the first direction X, two opposite sides of the chip 3 and the side of the chip 3 away from the first binding sub-part A are surrounded by the fixing portion 7.

[0158] In related art, as shown in Figure 18 , a blind hole is formed on one side of the flexible circuit board 2 near the binding portion 13. The chip 3 is positioned within the blind hole, and a side adhesive 05 is applied around the chip 3 to secure it. Therefore, during the fabrication of the display module 100, the flexible circuit board 2 must be attached after the chip 3 is electrically connected to the first main body sub-section B1 and secured.

[0159] At this time, when the side glue 05 is coated around the chip 3, the glue on the side of the chip 3 close to the first binding sub-part A1 is easily splashed onto the first binding sub-part A1. When the second binding sub-part A2 is subsequently bound and connected to the first binding sub-part A1, the second binding sub-part A2 and the first binding sub-part A1 are easily bound abnormally, resulting in abnormal display of the display module 100; moreover, when attaching the flexible circuit board 2, since the side glue 05 has been formed around the chip 3, the safety distance between the side glue 05 and the flexible circuit board 2 is small, and the side glue 05 and the flexible circuit board 2 are easily collided.

[0160] In the above-mentioned disclosed embodiment, before binding the flexible circuit board 2, a fixing portion 7 is formed around the chip 3; after binding the flexible circuit board 2, after the flexible circuit board 2 is bound to the display panel 1, a first sealing portion 5 is formed on the side of the chip 3 close to the first binding sub-portion A1 of the display panel 1. Therefore, when binding the flexible circuit board 2, the safety distance between the side of the chip 3 close to the first binding sub-portion A1 and the flexible circuit board 2 is larger, which reduces the difficulty of attaching the flexible circuit board 2 and reduces the probability of interference and collision between the side glue around the flexible circuit board 2 and the chip 3; moreover, it can also avoid that when the first sealing portion 5 is formed on the side of the chip 3 close to the first binding sub-portion A1, part of the colloid is splashed to the first binding sub-portion A1, thereby causing the second binding sub-portion A2 of the flexible circuit board 2 to be abnormally bound to the first binding sub-portion A1 when the flexible circuit board 2 is subsequently bound, thereby causing the display module 100 to have abnormal display.

[0161] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in the present disclosure should be included within the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A display module, comprising: The display panel comprises a display portion, a bending portion and a binding portion which are connected in sequence; The display portion has a light-emitting side and a non-light-emitting side disposed opposite to each other, and one end of the bent portion connected to the binding portion is bent to the non-light-emitting side; the binding portion is located on the non-light-emitting side; the binding portion includes a first binding sub-portion and a first main body sub-portion connected to each other; The flexible circuit board comprises a second binding sub-section and a second main body sub-section connected to each other; The orthographic projection of the second binding sub-portion on the display portion at least partially overlaps with the orthographic projection of the first binding sub-portion on the display portion; The orthographic projection of the second main body sub-section on the display portion at least partially overlaps with the orthographic projection of the first main body sub-section on the display portion; The second main body sub-section has a first opening; a chip, located in the first opening and electrically connected to the first main body sub-portion; an adhesive layer, bonded between the first main body sub-section and the second main body sub-section, and located on at least one side of the chip; the adhesive layer and the first binding sub-section are located on different sides of the first opening; A first sealing portion is located in the first opening and at least partially located on a side of the chip close to the first binding sub-portion; the first sealing portion is connected to the adhesive layer, the first main body sub-portion, and the second main body sub-portion; A second sealing portion, located outside the first opening, and connecting the adhesive layer, the first binding sub-portion, the first main body sub-portion, the second binding sub-portion, and the second main body sub-portion; The orthographic projections of the first sealing portion, the adhesive layer, the second sealing portion and the first binding sub-portion on the display portion form a closed figure.

2. The display module according to claim 1, wherein: A portion of the adhesive layer exceeds the side wall of the first opening and extends into the first opening.

3. The display module according to claim 2, wherein: The size range of the portion of the adhesive layer that exceeds the first opening is 0.3 mm to 0.5 mm.

4. The display module according to any one of claims 1 to 3, wherein: The adhesive layer has a U-shaped cross section and surrounds the chip.

5. The display module according to any one of claims 1 to 4, wherein: There are a plurality of first openings, and the adhesive layers corresponding to the first openings are connected to each other to form an integral structure.

6. The display module according to any one of claims 1 to 5, wherein: The second main body sub-part also has a second opening; the second sealing part is located in the second opening and contacts with the side wall of the second opening.

7. The display module according to any one of claims 1 to 6, wherein: An orthographic projection of the adhesive layer on the display portion partially overlaps with an orthographic projection of the second sealing portion on the display portion.

8. The display module according to any one of claims 1 to 7, wherein: The first sealing portion is also connected to the chip. 9 . The display module according to claim 8 , further comprising a fixing portion located in the first opening, wherein the fixing portion connects the chip and the first main body sub-portion.

10. The display module according to claim 9, wherein: The first sealing portion is connected to the fixing portion, and the orthographic projections of the first sealing portion and the fixing portion on the display portion form a closed figure.

11. The display module according to claim 9 or 10, wherein: There is a gap between the fixing portion and the first opening.

12. The display module according to claim 11, wherein: The first binding sub-portion extends along a first direction, the first binding sub-portion and the first main body sub-portion are spaced apart along a second direction, and the first direction and the second direction intersect; In the second direction, a minimum distance between the fixing portion and a side wall of the first opening is d1, wherein 0 mm<d1≤0.3 mm.

13. The display module according to claim 11 or 12, wherein: The first binding sub-portion extends along a first direction, the first binding sub-portion and the first main body sub-portion are spaced apart along a second direction, and the first direction and the second direction intersect; In the first direction, a minimum distance between the fixing portion and a side wall of the first opening is d2, wherein 0 mm < d2 ≤ 0.5 mm.

14. The display module according to any one of claims 1 to 13, further comprising: A third sealing portion; the third sealing portion wraps the first binding sub-portion away from the side of the first main body sub-portion.

15. A method for preparing a display module, comprising: Providing a display panel, the display panel comprising a display portion, a bending portion and a binding portion connected in sequence; The display portion has a light-emitting side and a non-light-emitting side disposed opposite to each other, and one end of the bent portion connected to the binding portion is bent to the non-light-emitting side; the binding portion is located on the non-light-emitting side; the binding portion includes a first binding sub-portion and a first main body sub-portion connected to each other; forming an adhesive layer on the first main body sub-part; Binding a chip to the first main body sub-part; Binding a flexible circuit board on the first binding sub-part, wherein the flexible circuit board includes a second binding sub-part and a second main body sub-part connected to each other; The orthographic projection of the second binding sub-portion on the display portion at least partially overlaps with the orthographic projection of the first binding sub-portion on the display portion; The orthographic projection of the second main body sub-section on the display portion at least partially overlaps with the orthographic projection of the first main body sub-section on the display portion; The second main body sub-portion has a first opening; the chip is located in the first opening, and the adhesive layer and the first binding sub-portion are located on different sides of the first opening; A first sealing portion is formed in the first opening, wherein at least a portion of the first sealing portion is located on a side of the chip close to the first binding sub-portion; the first sealing portion is connected to the adhesive layer and the first main body sub-portion; A second sealing portion is formed outside the first opening, wherein the second sealing portion connects the adhesive layer, the first binding sub-portion, the first main body sub-portion, the second binding sub-portion, and the second main body sub-portion; The orthographic projections of the first sealing portion, the adhesive layer, the second sealing portion and the first binding sub-portion on the display portion form a closed figure.

16. The preparation method according to claim 15, further comprising: forming a third sealing portion on a side of the first binding sub-portion away from the first main body sub-portion.

17. The preparation method according to claim 15 or 16, wherein: Before binding the flexible circuit board on the first binding sub-part, the preparation method further includes: A fixing portion is formed around the chip, and the fixing portion connects the chip and the first body sub-portion.

18. A display device comprising: The display module according to any one of claims 1 to 14.

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