Monitoring system, monitoring method, monitoring device, and detection tape

Abstract

A monitoring system for monitoring the periphery of a substrate processing apparatus installed in a clean room, the monitoring system including a detection tape which is disposed on the upper surface of floor tiles in a part or all of the periphery of the substrate processing apparatus so as to extend across a plurality of the floor tiles, the detection tape including a conductive layer disposed along the longitudinal direction of the tape, the monitoring system further comprising an alarm unit that issues an alarm when an electrically conductive state in the conductive layer is blocked or the voltage of a signal current flowing through the conductive layer falls below a predetermined threshold.

Description

Surveillance system, surveillance method, surveillance device, and detection tape

[0001] The present disclosure relates to a monitoring system, a monitoring method, a monitoring device, and a detection tape.

[0002] Patent Document 1 describes a clean room monitoring device for monitoring the inside of a clean room in which a removable floor surface is arranged on the floor, characterized in that it comprises: a monitoring camera that captures images of the removable floor surface in a passageway through which workers can pass; a monitoring unit that detects the presence or absence of an opening where the removable floor surface has been removed from the image signal obtained by the monitoring camera, and if an opening is present, detects the presence or absence of a worker approaching the opening from the image signal of the monitoring camera, and outputs an alarm signal when the worker is detected; and alarm generation means that receives the alarm signal from the monitoring unit and issues an alarm.

[0003] Japanese Patent No. 6018821

[0004] The technology disclosed herein improves worker safety when floor tiles in a clean room are removed and opened.

[0005] One aspect of the present disclosure is a monitoring system that monitors the surroundings of a substrate processing apparatus installed in a clean room, and includes a detection tape that is placed across multiple floor tiles on the upper surface of some or all of the floor tiles surrounding the substrate processing apparatus, the detection tape having a conductive layer arranged along the longitudinal direction of the tape, and an alarm unit that issues an alarm when electrical conductivity in the conductive layer is interrupted or the voltage of the signal current flowing through the conductive layer falls below a predetermined threshold.

[0006] According to the present disclosure, the safety of workers can be improved when floor tiles in a clean room are removed and the floor surface is opened.

[0007] 10 is a perspective view of a monitoring system to which an embodiment is applied; FIG. 11 is a plan view schematically illustrating a monitoring system to which an embodiment is applied for the purpose of explanation; FIG. 12 is a front cross-sectional view of a detection tape as viewed from the longitudinal direction; FIG. 13 is a front cross-sectional view of a detection tape according to another configuration as viewed from the longitudinal direction; FIG. 14 is a perspective view showing a state in which a rolled detection tape is being unwound and cut; FIG. 15 is an explanatory view showing a procedure for connecting a conductive layer at an end portion of a detection tape, in which (a) is a plan view of the end portion, (b) is a plan view of the end portion after the protective layer has been removed, (c) is an explanatory view showing a state in which a connection tape is attached to the portion from which the protective layer has been removed, and (d) is a plan view showing the state after the connection tape has been attached; FIG. 16 is a perspective view showing a state in which the end portion of the detection tape has been cut; FIG. 17 is a perspective view showing a state in which the protective layer has been pressed from both sides with fingertips from the state of FIG. 7; FIG. 18 is a perspective view showing a state in which the protective layer has been rolled up with fingertips from the state of FIG. 19; FIG. 19 is a perspective view showing a state in which the rolled-up protective layer has been cut with scissors from the state of FIG. 10; 18 is an explanatory diagram showing a state in which a pulse wave is transmitted from a controller to a conductive layer of a detection tape and the controller receives the returned pulse wave. 19 is an explanatory diagram explaining the measurement status of the pulse wave in FIG. 12. 20 is a perspective view of a monitoring system to which an embodiment is applied. 21 is a perspective view showing a state in which a worker is cutting the detection tape in the monitoring system of FIG. 14. 22 is a perspective view showing a state in which a worker has lifted a specific floor tile from the state of FIG. 14 in the monitoring system of FIG. 14. 23 is a perspective view showing a state in which the protective layers at the ends of opposing detection tapes are removed and a connection tape is applied thereon. 24 is an explanatory diagram schematically showing a side cross section in the state of FIG. 21. 25 is an explanatory diagram schematically showing a side cross section showing a state after the connection tape has been applied from the state of FIG. 22. 26 is a perspective view showing a state after the connection tape has been applied. 27 is a diagram showing a state in which the conductive layers at the ends of detection tapes that are arranged in directions that change at a right angle are connected, where (a) is a plan view showing a state in which the protective layers at the ends of two detection tapes have been removed to expose the conductive layers, (b) is a bottom view of a connection tape having an angled conductive layer, and (c) is a side cross section of the connection tape. 22(b) is a plan view showing the state after the connection tape has been attached from the state shown in FIG. 21(a). FIG.

[0008] Conventionally, in semiconductor manufacturing lines for manufacturing semiconductor devices, for example, numerous semiconductor manufacturing devices, such as substrate processing devices, are arranged in clean rooms with a clean atmosphere. In such clean rooms, floor tiles (sometimes called gratings) with numerous lattice-shaped ventilation holes are arranged on the floor. The space below the floor tiles houses pipes, various electrical equipment, pumps, chemical tanks, and the like. For example, when installing, maintaining, or repairing these pipes, various electrical equipment, pumps, and the like, workers must descend into the space below the floor tiles to perform their work. Therefore, the floor tiles are removable.

[0009] In this way, in clean rooms, when floor tiles are removed, workers can descend into the space below the floor tiles to perform their work. However, when floor tiles are removed, openings are created in the floor of the clean room, which are formed by a large number of floor tiles, and there is a risk that workers could fall through these openings into the space below. In particular, workers performing other tasks on the floor tiles may be unaware that openings exist, and so workers have traditionally been warned to be careful.

[0010] The technology described in Patent Document 1 uses a surveillance camera that captures images of the floor tile surface, and based on the image signals obtained by the surveillance camera, detects whether or not there is an opening where a floor tile has been removed, and if there is a worker present, outputs an alarm signal and issues an alarm from an alarm generating means.

[0011] While such technology has improved worker safety, it requires the installation of expensive equipment such as surveillance cameras, and many cameras are required to ensure there are no blind spots, resulting in cost and the time-consuming installation process. Therefore, the present disclosure provides technology that makes it easy to build a surveillance system that can detect the presence or absence of openings where floor tiles have been removed. A surveillance system to which an embodiment is applied will be described below. Note that in this specification and drawings, elements having substantially the same functional configuration will be designated by the same reference numerals, and redundant description will be omitted.

[0012] 1 shows a monitoring system M configured with a detection tape T for the monitoring system according to the embodiment, for monitoring the periphery of a substrate processing apparatus 1. The substrate processing apparatus 1 is installed in a clean room, and floor tiles F are laid out vertically and horizontally on the floor around the substrate processing apparatus 1. The detection tape T has a flat shape like a flat cable.

[0013] To facilitate understanding of such a monitoring system, Figure 2 is a schematic plan view of a simplified monitoring system M. In this example, a detection tape T is placed across floor tiles F2 to F4. Each floor tile F2 to F4 has a square outer shape with sides of 60 cm, for example.

[0014] As shown in Fig. 3, the detection tape T has an insulating base portion 10 having insulating adhesive layers on both sides, and conductive layers 11 and 12 provided on the surface side of the base portion 10 and arranged parallel to each other along the longitudinal direction of the detection tape T. The conductive layers 11 and 12 may be made of, for example, flat copper foil. In this example, the conductive layers 11 and 12 are arranged parallel to each other with an insulating non-adhesive region 13 sandwiched between them. The non-adhesive region 13 can be realized, for example, by attaching an insulating tape, such as a peelable tape made of synthetic resin, to the central region of the base portion 10 in order to align the thickness and height of the conductive layers 11 and 12.

[0015] An insulating protective layer 15 is disposed on top of the conductive layers 11, 12 and the non-adhesive region 13 so as to cover them, and the protective layer 15 is adhered to the base portion 10. However, because the non-adhesive region 13 is located between the conductive layers 11, 12, the underside of the protective layer 15 is not adhered to the non-adhesive region 13, and this portion is removable. In this example, the width TW of the detection tape T is set to, for example, 100 mm or less for ease of handling. Of course, this is not a limitation, and the width TW of the detection tape T can be set arbitrarily between, for example, 30 mm and 100 mm, taking into consideration the thickness and flexibility of the protective layer 15, the width C1 of the conductive layer 11, the width C2 of the conductive layer 12, the width N of the non-adhesive region 13, and the like. Naturally, the width TW of the detection tape T is not limited to this range.

[0016] Furthermore, in this example, the adhesive strength of each portion is set so that the adhesion between the surface side of the base portion 10 and the underside of the protective layer 15 is stronger than the adhesion on the back side of the base portion 10, i.e., the adhesion between the base portion 10 and the surface of the floor tile F. This makes it possible to realize a configuration in which, for example, the base portion 10 of the detection tape T can be peeled off from the surface of the floor tile F, but the protective layer 15 and the base portion 10 do not easily peel off. Therefore, the detection tape T can be easily attached to and peeled off the surface of the floor tile F, and workability is good. On the other hand, the protective layer 15 and the base portion 10 do not easily peel off from the base portion 10, preventing the internal conductive layers 11 and 12 from being easily exposed.

[0017] The adhesive strength between the protective layer 15 and the base portion 10 also depends on the contact area between the underside of the protective layer 15 and the region outside the conductive layers 11 and 12 on the surface of the base portion 10, i.e., the widths DN1 and DN2 shown in FIG. 3 . Therefore, by adjusting the adhesive strength of the surface of the base portion 10, the adhesive strength of the underside of the protective layer 15, and the widths DN1 and DN2 of the region outside the conductive layers 11 and 12 on the surface of the base portion 10, an appropriate adhesive strength can be obtained according to the width TW of the detection tape T. For example, the adhesive widths DN1 and DN2 between the base portion 10 and the protective layer 15 may be narrower than the width C1 of the conductive layer 11 and the width C2 of the conductive layer 12, or narrower than the width N of the non-adhesive region 13. Furthermore, the width C1 of the conductive layer 11 and the width C2 of the conductive layer 12 may be set to be the same as the width N of the non-adhesive region 13. This makes it easier to create a gap in the center of the detection tape T, as will be described later with reference to FIGS. 7 and 8 . Furthermore, the width C1 of the conductive layer 11 and the width C2 of the conductive layer 12 may be set to be equal to or greater than the width N of the non-adhesive region 13. This makes it possible to prevent noise from being carried by the conductive layers 11 and 12 when transmitting and receiving pulse waves, which will be described later.

[0018] 3 has a configuration in which an insulating protective layer 15 is disposed on top of the conductive layers 11, 12 and the non-adhesive region 13 so as to cover them, and the protective layer 15 is directly adhered to the base portion 10. However, this is not limiting, and the detection tape T shown in FIG. 4 can also be proposed. That is, the detection tape T shown in FIG. 4 has a configuration in which a double-sided adhesive layer 14 is provided on the underside of the protective layer 15. Therefore, the protective layer 15 is adhered to the base portion 10 by this double-sided adhesive layer 14. In this case as well, because the non-adhesive region 13 is located between the conductive layers 11, 12, the double-sided adhesive layer 14 on the underside of the protective layer 15 does not adhere to the non-adhesive region 13, and this portion is peelable.

[0019] 4, the adhesive strength of each portion is set so that the adhesion between the surface side of the base portion 10 and the underside of the double-sided adhesive layer 14 is stronger than the adhesion on the back side of the base portion 10, i.e., the adhesion between the base portion 10 and the surface of the floor tile F. As a result, as in the above example, a configuration is achieved in which the base portion 10 of the detection tape T can be peeled off from the surface of the floor tile F, but the protective layer 15 and the base portion 10 do not easily peel off. Therefore, the detection tape T shown in FIG. 4 can also be easily applied to and peeled off the surface of the floor tile F, providing good workability. Furthermore, the protective layer 15 does not easily peel off from the base portion 10, preventing the internal conductive layers 11 and 12 from being easily exposed.

[0020] Of course, in this case as well, the adhesive strength between the protective layer 15 and the base portion 10 depends on the contact area between the underside of the double-sided adhesive layer 14 on the underside of the protective layer 15 and the region outside the conductive layers 11 and 12 on the surface of the base portion 10, i.e., the widths DN1 and DN2 shown in FIG. 4 . Therefore, by adjusting the adhesive strength of the surface of the base portion 10, the adhesive strength of the underside of the double-sided adhesive layer 14, and the widths DN1 and DN2 of the region outside the conductive layers 11 and 12 on the surface of the base portion 10, an appropriate adhesive strength can be obtained according to the width TW of the detection tape T. As in the above case, the adhesive widths DN1 and DN2 between the base portion 10 and the protective layer 15 may be narrower than the width C1 of the conductive layer 11 and the width C2 of the conductive layer 12, or narrower than the width N of the non-adhesive region 13. Furthermore, the width C1 of the conductive layer 11 and the width C2 of the conductive layer 12 may be set to be the same as the width N of the non-adhesive region 13.

[0021] The detection tape T having such a configuration is wound into a roll as shown in FIG. 5 and can be unwound in the direction of the arrow in the figure when in use. It can then be cut to the desired length using, for example, scissors H or a knife. Therefore, for example, as shown in FIG. 2, to place the detection tape T across floor tiles F2 to F4, one end of the tape is attached to the surface of one end of floor tile F2, while unwrapping the required length, and then cutting the detection tape T at the other end of floor tile F4. This provides excellent operability. For example, even when placing the detection tape T across multiple floor tiles F, the work can be carried out simply and quickly. Note that, in order for the detection tape T to be unwound from the roll as shown in FIG. 5, the underside of the base portion 10 must be peelable from the surface of the protective layer 15.

[0022] 5, logo marks L indicating, for example, the company name of the manufacturer or manager of the substrate processing apparatus 1 are displayed at predetermined intervals, for example, about 10 cm to 50 cm, on the surface side of the protective layer of the detection tape T. By displaying the logo marks L indicating the company name of the manufacturer or manager of the substrate processing apparatus 1 on the surface of the detection tape T in this way, when the detection tape T is placed across multiple floor tiles F, anyone entering the clean room will recognize that there is something on the floor tiles F that is somehow related to the substrate processing apparatus 1. This prevents someone from removing a floor tile F without the manager's permission, creating an open state, or leaving that open state unattended.

[0023] The detection tape T having the above configuration is attached and arranged across the surfaces of multiple floor tiles F, as described above. In the example of Fig. 2, it is arranged across floor tiles F2 to F4. A controller 20 electrically connected to the conductive layers 11, 12 is provided on one end of the detection tape T arranged in this manner, and the other end of the detection tape T, i.e., the terminal end, has the ends of the conductive layers 11, 12 electrically connected to each other. The controller 20 is equipped with a transmitter, receiver, measurement unit, and alarm unit, as described below, which are controlled by the control unit.

[0024] The process of electrically connecting the end portions of the conductive layers 11 and 12 together in this manner is performed, for example, according to the procedure shown in Figures 6(a) to 6(d). That is, at the end portion of the detection tape T already attached to the surface of the floor tile F shown in Figure 6(a), only the protective layer 15 at the end is cut off, for example, about 3 cm from the end, as shown in Figure 6(b). As mentioned above, the protective layer 15 is adhered to the base portion 10, so removing only the base portion 10 3 cm from the end is usually a time-consuming and troublesome process.

[0025] However, as described above, in the detection tape T of the present disclosure, the non-adhesive region 13 is located between the conductive layers 11 and 12 and is not adhered to the double-sided adhesive layer 14 on the underside of the protective layer 15, allowing the non-adhesive region 13 to be peeled away from the double-sided adhesive layer 14 on the underside of the protective layer 15. Therefore, if, from the flat state shown in FIG. 7 , both sides of the protective layer 15 of the detection tape T are pinched with fingers and pressed inward (in the direction of the arrows in the figure), as shown in FIG. 8 , the center of the detection tape T will rise, creating a gap, as shown in the figure. Then, by inserting a thin object, such as the tip of a screwdriver 18, into this gap and lifting the protective layer 15, the gap will become larger. Next, as shown in FIG. 9 , the end of the protective layer 15 is lifted with, for example, a finger. This maintains the lifted state of the protective layer 15 at the end. Thereafter, as shown in FIG. 10, the end of the turned-up protective layer 15 may be cut off with scissors H or a knife at a point having a length of, for example, about 3 cm.

[0026] By the above procedure, the detection tape T shown in Fig. 6(a) is in a state in which, for example, about 3 cm of the protective layer 15 at the end portion is removed as shown in Fig. 6(b). Thereafter, as shown in Fig. 6(c), a connection tape TE dedicated to the end portion can be attached onto the conductive layers 11 and 12 and the non-adhesive region 13 exposed at the end of the detection tape T.

[0027] As shown in Figure 6(c) (note that Figure 6(c) depicts the connecting tape TE as viewed from the back side), this connecting tape TE has an adhesive layer 21 provided on the underside of an insulating protective layer 15, and a conductive layer 22 provided on the underside of this adhesive layer 21 in an area narrower than the adhesive layer 21. The conductive layer 22 has a width and length that allows electrical continuity between the two conductive layers 11, 12 at the end of the detection tape T. By attaching such connecting tape TE to the exposed conductive layers 11, 12 and non-adhesive area 13 at the end of the detection tape T, the conductive layers 11, 12 are electrically connected at the end. Figure 6(d) shows the connecting tape TE attached to the end of the detection tape T.

[0028] 2, a controller 20 electrically connected to the conductive layers 11, 12 is provided at the starting end of the detection tape T, and a connecting tape TS serving as a start tape is used to connect the conductive layers 11, 12 of the detection tape T to the controller 20, as shown in Fig. 11, for example. Fig. 11 is a perspective view of the connecting tape TS as seen from the back side, in which conductive layers 31, 32 electrically connected to the conductive layers 11, 12 of the detection tape T are provided on the adhesive layer on the lower surface of the insulating protective layer 30. The conductive layers 31, 32, like the conductive layers 11, 12, are made of, for example, copper foil.

[0029] Then, for example, by soldering the lead portions 34, 35 of the cable 33 connected to the controller 20 to the conductive layers 31, 32, it is possible to electrically connect the conductive layers 11, 12 of the detection tape T to the controller 20. For example, insulating protective tape 36 may be attached to the connection points between the lead portions 34, 35 and the conductive layers 31, 32.

[0030] 12, in a monitoring system M configured with the detection tape T having the above-described structure, a pulse wave is transmitted from a transmitter 20a provided in a controller 20 to the conductive layer 11, and the pulse wave reaches a receiver 20b provided in the controller 20 from the terminal end of the detection tape T, via the conductive layer 12. Therefore, in this example, the conductive layer 11 of the detection tape T placed on the floor tile F constitutes the transmission path, and the conductive layer 12 constitutes the reception path.

[0031] The controller 20 is provided with a measuring unit 20c that measures the pulse wave returning from the conductive layer 12 as a receiving path, and a predetermined alarm or alarm signal is issued from an alarm unit 20d based on the measurement results from this measuring unit 20c.

[0032] In this example, the oscillation frequency of the pulse wave is set to 1 kHz, and the period t of the pulse wave is 1000 μS, as shown in FIG. 13 . The voltage value e is set to 3 V, and the current value is set to 0.62 mA. The pulse wave from the receiving path is measured by the measurement unit 20c, and at measurement position Z, as shown in FIG. 13 , the voltage value is measured at a location of 1 / 4 wavelength. If the voltage value at a delay time of 80 μS falls below a predetermined threshold value, for example, 1 / 2 the rated voltage, i.e., 1.5 V, an abnormality is detected and a predetermined alarm or warning signal is issued from the alarm unit 20d. Of course, an alarm or warning signal is also issued if the receiving unit 20b cannot receive the signal itself. The transmitting unit 20a, receiving unit 20b, measuring unit 20c, and alarm unit 20d provided in the controller 20 are controlled by the control unit 20e provided in the controller 20.

[0033] As described above, the disclosed monitoring system M measures the voltage value at measurement position Z when the detection tape T is cut. Therefore, even if noise voltage is detected when the detection tape T is cut, the threshold value is set to 1.5V, half the voltage value e, allowing for appropriate monitoring. More specifically, for example, when the total length of the detection tape T deployed in monitoring system M is 60m, the return pulse voltage measured on the receiving path was confirmed to be approximately 2.8V, showing little drop. Therefore, when setting the threshold, starting from approximately 1.5V, which is about the middle of the 3V oscillation voltage, the lower the threshold, the more vulnerable it becomes to noise. Conversely, as the threshold value increases, the more vulnerable it becomes to the drop in return voltage itself. Therefore, by setting the threshold value in this example to 1.5V, the system is both resistant to noise and able to handle voltage drops. Therefore, the effects of noise can be suppressed and the cut in the detection tape T can be detected appropriately. Of course, an abnormality can also be determined when the return voltage itself is not detected. Furthermore, improper use such as when the conductive layers 11 and 12 are exposed or when the connecting portions of the conductive layers 11 and 12 are beginning to peel off can also be detected as abnormalities.

[0034] 12, the conductive layer 11 that constitutes the transmission path and the conductive layer 12 that constitutes the reception path are arranged parallel to each other in the detection tape T, but if, for example, an extremely high-frequency pulse wave flows through the conductive layers 11 and 12, there is a risk that accurate measurement will not be possible due to capacitive coupling. To prevent this, for example, the distance d between the conductive layers 11 and 12 (the width of the non-adhesive region 13) could be increased, but this would increase the width of the detection tape T, which would cause problems in terms of handling and practicality.

[0035] On the other hand, clean rooms are often home to electrical machinery and equipment that use commercial frequency power, such as 50 Hz or 60 Hz, as well as numerous conductive paths and locations through which current of this commercial frequency flows. Floor tiles F are typically made of conductive materials. Therefore, the pulse wave transmitted from transmitter 20a must be set to a frequency high enough to be clearly distinguishable from commercial frequencies without being affected by such commercial frequencies.

[0036] From this perspective, in the example of the present disclosure, the oscillation frequency of the pulse wave is set to 1 kHz. Furthermore, the width of the detection tape T is 40 mm, and the conductive layers 11 and 12 and the distance d between the conductive layers 11 and 12 (the width of the non-adhesive region 13) are each set to 8 mm. Of course, this is not limiting, and a pulse wave having an oscillation frequency that does not propagate across the conductive layers 11 and 12 may be used depending on the distance d between the conductive layers 11 and 12.

[0037] The current value of the pulse wave is set to 0.62 mA for the following reason. That is, as will be described later, when it is necessary to lift and open a floor tile F for work purposes, the detection tape T placed across multiple floor tiles F must be cut with scissors, a cutter, or the like. In this case, there is a risk that current will flow to the worker's body through the scissors or cutter held by the worker. In such a case, if the current value is high (for example, 5 mA or more), there is a risk that the worker's body will be in danger. Therefore, the current value of the pulse wave is set to 1 mA or less, which is generally considered to be safe for the human body.

[0038] 14, in the monitoring system M configured as described above, a detection tape T is placed across the floor tiles F2 to F4, and a logo mark L indicating the company name of the manufacturer or manager of the substrate processing apparatus 1 is displayed on the surface of the detection tape T. Therefore, as described above, it is possible to prevent someone who enters the clean room from arbitrarily removing a floor tile F to create an open state or leaving the open state.

[0039] Incidentally, since one detection tape T is affixed across the floor tiles F2 to F4, when a worker P works on the underside of a floor tile F, for example, in the space below floor tile F3, he must first cut the detection tape T at both ends of floor tile F3 using scissors or a cutter, as shown in Figure 15. Then, he must lift up floor tile F3 as shown in Figure 16.

[0040] As described above, in the monitoring system M, as shown in Figure 12, a pulse wave is transmitted from the transmitter 20a of the controller 20 to the conductive layer 11 in the detection tape T, and the pulse wave returns to the receiver 20b of the controller 20 via the conductive layer 12. The measuring unit 20c of the controller 20 monitors the returning pulse wave, and an alarm is issued when the detection tape T is cut at both ends of the floor tile F3. Therefore, not only the worker P but also other workers in the vicinity can recognize that an opening has occurred in the floor tile F, thereby improving worker safety.

[0041] To construct such a monitoring system M, all that is required is to attach detection tape T across multiple floor tiles F, as already described. Moreover, since the detection tape T is wound in a roll as shown in FIG. 5, it can be easily unwound, and since the backside of the base portion on the lower surface of the detection tape T is adhesive, the unwound detection tape T can simply be attached to the surface of the floor tile F. Then, it is only necessary to cut the detection tape T at the end of the floor tile F to be installed. After that, it is only necessary to attach the connection tape TE designed specifically for end portions, as shown in FIG. 6, to the cut portion. Therefore, the monitoring system M can be constructed easily.

[0042] 15 and 16, once the detection tape T is cut, both the transmission path and the reception path are cut and pulse waves do not flow, so once the required work in the space below the floor tile F is completed, the removed floor tile F3 must be returned to its original position and the transmission path and reception path must be made electrically conductive again. In this case, simply placing the floor tile F3 in its original position will not allow the conductive layers 11, 12 at the cut ends of the cut detection tape T to be properly connected to each other.

[0043] In such a case, as shown in Fig. 17, first, the ends of the cut detection tape T are joined together by removing only the protective layer 15 at each end by, for example, about 3 cm, following the method already shown in Figs. 7 to 10, to expose the conductive layers 11 and 12. The dashed dotted line in the figure indicates the butted end faces of the floor tile F.

[0044] Next, the ends of the cut detection tape T are electrically connected using a reconnecting tape TB having the structure shown in Figure 18. This connecting tape TB has an adhesive layer 42 provided on the underside of an insulating protective layer 41, and conductive layers 44, 45 provided parallel to each other on the underside of the adhesive layer 42, with a non-adhesive region 43 sandwiched between them, in an area narrower than the adhesive layer 42. An adjustment layer 46 for adjusting the height is provided between the conductive layers 44, 45 and the adhesive layer 42. The conductive layers 44, 45 are made of, for example, copper foil. The length of the connecting tape TB is longer than the distance Y between the opposing portions of the detection tape T attached to the floor tile F where the protective layer 15 has been removed, and the length of the conductive layers 44, 45 in the extending direction is the same as this distance Y.

[0045] 18 , the conductive layers 11 and 12 at the ends of the detection tape T, which are exposed when the protective layer 15 at the ends is removed, need to be reliably electrically connected to the conductive layers 44 and 45 located on the underside of the connecting tape TB, but the length of the connecting tape TB is longer than the distance Y between the opposing portions from which the protective layer 15 has been removed. Therefore, even if the connecting tape TB is attached to the portion where the conductive layers 12 and 13 are exposed, there is a risk that the conductive layers 11 and 12 of the detection tape T will not be electrically connected to the conductive layers 44 and 45 of the connecting tape TB.

[0046] Therefore, the connecting tape TB has an adjustment layer 46 for adjusting the height between the conductive layers 44, 45 and the adhesive layer 42. As a result, when the connecting tape TB is attached to a portion where the conductive layers 12, 13 are exposed, it is possible to match the height of the protective layer 15 on the top surface of the detection tape T with the combined thickness of the conductive layers 44, 45 and the adjustment layer 46, as shown in Fig. 19, and the conductive layers 11, 12 and the conductive layers 44, 45 of the connecting tape TB are reliably electrically connected.

[0047] 20, when the connecting tape TB is attached to the exposed portions of the conductive layers 11 and 12 of the detection tape T, the end of the protective layer 41 of the connecting tape TB becomes higher than the protective layer 15 on the upper surface of the detection tape T, resulting in a step as shown. However, even if such a step occurs, the detection tape T and the connecting tape TB themselves are flat to begin with, and the connecting tape TB is attached to the protective layer 15 of the detection tape T by the adhesive layer 42 on the lower surface of the protective layer 41, so considering that people usually only walk on the floor tile F, a step of that height does not cause any problems.

[0048] The adjustment layer 46 may also be provided on the connection tape TE dedicated to the termination portion already explained in FIG. 6 and on the angled connection tape TC that changes direction by 90 degrees in a plan view, which will be described later.

[0049] Depending on the installation location of the monitoring system M, it may be necessary to place the detection tape T on the floor tile F with the extension direction of the detection tape T bent at a right angle. Figure 20 illustrates how to handle such a situation. Figure 21(a) illustrates a state in which the protective layer 15 at each end of two detection tapes T1 and T2, which are arranged extending perpendicularly to each other on the floor tile F, has been removed by a predetermined length, e.g., approximately 3 cm, from the end. As illustrated, the conductive layers 11 and 12 at each end of the detection tapes T1 and T2 are exposed. Note that removing the protective layer 15 at each end of the two detection tapes T1 and T2 by a predetermined length from the end can be performed in accordance with the methods shown in Figures 7 to 10 above.

[0050] The connecting tape TC shown in Fig. 21(b) is used to electrically connect the conductive layers 11, 12 at the corners of the detection tape T, which are bent at right angles in this way. Fig. 21(b) is a view of the connecting tape TC from the back side, and Fig. 21(c) is a cross-sectional view of the side of the connecting tape TC.

[0051] As can be seen from these figures, the connecting tape TC has an adhesive layer 42 provided on the underside of an insulating protective layer 41, and two parallel conductive layers 44, 45 provided on the underside of this adhesive layer 42, with a non-adhesive region 43 sandwiched between them and an area narrower than the adhesive layer 42. Copper foil, for example, is used for the conductive layers 44, 45. The conductive layers 44, 45 are provided on an insulating base portion 47 that has adhesive properties on both sides. The conductive layers 44, 45 are angled, changing direction by 90 degrees when viewed from above.

[0052] 22, by attaching the connecting tape TC having such a configuration to the corners of the detection tape T on the floor tile F where the conductive layers 11, 12 are exposed, the conductive layers 44, 45 of the connecting tape TC can be electrically connected to the exposed conductive layers 11, 12 at each end of the detection tapes T1, T2. This provides excellent workability. Since the insulating base portions 47 are located at the corners of the underside of the connecting tape TC, the conductive layers 44, 45 do not come into direct contact with the floor tile F.

[0053] In the example described above, in addition to the basic detection tape T that can be wound into a roll, there are provided connection tape TS, which is the start tape used to connect to the controller 20, connection tape TB used when reconnecting, connection tape TE dedicated to the termination, and connection tape TC used when changing direction by 90 degrees in a plan view, so that the installation of the monitoring system is flexible and it is possible to build an appropriate monitoring system depending on the equipment installed in the clean room and its installation conditions.

[0054] In the above example, a pulse wave is sent to the detection tape T, and the voltage value of the pulse wave measured on the receiving path is compared with a preset threshold value, and depending on the presence or absence of the pulse wave, the presence or absence of an opening caused by the removal of the floor tile F is detected. Alternatively, the impedance of the conductive layers 11, 12 may be constantly monitored, and if the impedance changes significantly beyond a set threshold value, it may be determined that the floor tile F has been removed and an opening has occurred.

[0055] More specifically, to detect an abnormality based on a change in impedance, after setting the detection tape T, for example, the variable resistance of the circuit is adjusted to the impedance of the line so that the bridge circuit in the controller 20 is balanced (calibration), and when the conductive layers 11, 12 of the detection tape T become disconnected and the balance of the circuit is disrupted, an abnormality is detected.

[0056] The embodiments disclosed above are illustrative in all respects and are not restrictive, and may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims.

[0057] The following configurations are within the technical scope of the present disclosure. Furthermore, configurations that combine the items described in (1) to (15) below to the extent that they are not inconsistent are also within the technical scope of the present disclosure. (1) A monitoring system for monitoring the periphery of a substrate processing apparatus installed in a clean room, the monitoring system comprising: a detection tape arranged across multiple floor tiles on the upper surfaces of some or all of the floor tiles around the substrate processing apparatus, the detection tape having a conductive layer arranged along the longitudinal direction of the tape; and an alarm unit that issues an alarm when electrical continuity in the conductive layer is interrupted or when the voltage of a signal current flowing through the conductive layer falls below a predetermined threshold. (2) The monitoring system described in (1), in which the conductive layer has a transmission path and a reception path. (3) The monitoring system described in (2), in which the alarm unit is connected to one end of each of the transmission path and the reception path, and the other end of each of the transmission path and the reception path is electrically conductive. (4) The monitoring system according to (3), wherein the other end of each of the transmission path and the reception path is electrically connected via a connecting tape that is angled 90 degrees in plan view. (5) The monitoring system according to (4), comprising a transmitter that transmits a pulse signal to the transmission path, a receiver that receives a pulse signal from the reception path, and a measurement unit that measures the pulse signal from the reception path. (6) The monitoring system according to (5), wherein the alarm is issued when the pulse signal is not received or when the pulse signal from the reception path measured by the measurement unit falls below a predetermined threshold. (7) The monitoring system according to (6), wherein the current value of the pulse signal is 1 mA or less. (8) The monitoring system according to (6) or (7), wherein the pulse signal has a frequency that does not propagate across the transmission path and the reception path. (9) The monitoring system according to (1), wherein the alarm unit issues the alarm based on a change in impedance in the conductive layer.(10) The monitoring system described in any one of (1) to (7) and (9), wherein the detection tape has an insulating base portion having insulating adhesive layers on both sides, a conductive layer provided on the surface side of the base portion and arranged along the longitudinal direction of the detection tape, an insulating non-adhesive region arranged along the longitudinal direction of the detection tape in contact with or in proximity to the conductive layer, and an insulating protective layer covering the conductive layer and the non-adhesive region and adhered to the base portion, and the detection tape is unwound from a rolled state. (11) The detection tape for a monitoring system described in (10), wherein the adhesion between the base portion and the protective layer is achieved by an insulating double-sided adhesive member arranged on the underside of the protective layer. (12) A monitoring method for monitoring the periphery of a substrate processing apparatus installed in a clean room, comprising: placing a detection tape having a conductive layer along its longitudinal direction on the upper surface of some or all of the floor tiles around the substrate processing apparatus so as to straddle multiple floor tiles; and issuing an alarm when electrical continuity in the conductive layer is interrupted or the voltage of a signal current flowing through the conductive layer falls below a predetermined threshold. (13) The monitoring method according to (12), wherein the determination of whether or not electrical continuity in the conductive layer is interrupted is made by the presence or absence of reception of a signal current flowing through the conductive layer or by comparing a measured value of the signal current with a predetermined threshold. (14) The monitoring method according to (13), wherein the signal current is a pulse wave. (15) A monitoring device for monitoring the periphery of a substrate processing apparatus installed in a clean room, comprising: a detection tape arranged across multiple floor tiles on the upper surface of some or all of the floor tiles around the substrate processing apparatus, the detection tape having a conductive layer arranged along the longitudinal direction; and an alarm unit that issues an alarm when the electrical continuity in the conductive layer is interrupted or the voltage of the signal current flowing through the conductive layer falls below a predetermined threshold value.(16) A detection tape for use in the monitoring system of (1), comprising: an insulating base portion having insulating adhesive layers on both sides; a conductive layer provided on the surface side of the base portion and arranged along the longitudinal direction of the detection tape; an insulating non-adhesive region arranged along the longitudinal direction of the detection tape in contact with or close to the conductive layer; and an insulating protective layer covering the conductive layer and the non-adhesive region and adhered to the base portion, wherein the detection tape can be unwound from a rolled state.

[0058] REFERENCE SIGNS LIST 1 substrate processing apparatus 10 base portion 11, 12 conductive layer 13 non-adhesive area 14 double-sided adhesive layer 15 protective layer 20 controller F floor tile T detection tape TB, TC, TE, TS connection tape

Claims

1. A monitoring system for monitoring the surroundings of a substrate processing apparatus installed in a clean room, comprising: a detection tape arranged across a number of floor tiles on the upper surface of some or all of the floor tiles surrounding the substrate processing apparatus, the detection tape having a conductive layer arranged along the longitudinal direction of the tape; and an alarm unit that issues an alarm when electrical conductivity in the conductive layer is interrupted or the voltage of the signal current flowing through the conductive layer falls below a predetermined threshold value.

2. The monitoring system of claim 1, wherein said conductive layer has a transmit path and a receive path.

3. A monitoring system as claimed in claim 2, wherein said alarm unit is connected to one end of each of said transmission path and said reception path, and said transmission path and said reception path are electrically connected to the other end of each of said transmission path and said reception path.

4. A surveillance system according to claim 3, wherein the other end of each of the transmission path and the reception path is electrically connected via an angled connection tape that changes direction by 90 degrees in a plan view.

5. The monitoring system according to claim 4, comprising: a transmitting unit that transmits a pulse signal to the transmission path; a receiving unit that receives the pulse signal from the reception path; and a measuring unit that measures the pulse signal from the reception path.

6. A monitoring system as described in claim 5, wherein the alarm is issued when the pulse signal is not received or when the pulse signal from the receiving path measured in the measuring section falls below a predetermined threshold value.

7. The monitoring system according to claim 6, wherein the current value of the pulse signal is 1 mA or less.

8. A monitoring system according to claim 6 or 7, wherein the pulse signal has a frequency that does not propagate across the transmission path and the reception path.

9. The monitoring system according to claim 1, wherein the alarm unit issues an alarm based on a change in impedance in the conductive layer.

10. A monitoring system as described in any one of claims 1 to 7 and 9, wherein the detection tape has an insulating base portion having insulating adhesive layers on both sides, a conductive layer provided on the front side of the base portion and arranged along the longitudinal direction of the detection tape, an insulating non-adhesive region arranged along the longitudinal direction of the detection tape in contact with or close to the conductive layer, and an insulating protective layer covering the conductive layer and the non-adhesive region and adhered to the base portion, and the detection tape is capable of being unwound from a rolled state.

11. The surveillance system according to claim 10, wherein the base portion and the protective layer are adhered to each other by an insulating double-sided adhesive member disposed on the underside of the protective layer.

12. A monitoring method for monitoring the surroundings of a substrate processing apparatus installed in a clean room, comprising: placing a detection tape having a conductive layer along the longitudinal direction of the tape across multiple floor tiles on the upper surface of some or all of the floor tiles surrounding the substrate processing apparatus; and sounding an alarm when electrical continuity in the conductive layer is interrupted or the voltage of the signal current flowing through the conductive layer falls below a predetermined threshold value.

13. The monitoring method according to claim 12, wherein the determination of whether or not the electrical continuity in the conductive layer has been interrupted is made by the presence or absence of reception of a signal current flowing through the conductive layer, or by comparing a measured value of the signal current with a predetermined threshold value.

14. The monitoring method according to claim 13, wherein the signal current is a pulse wave.

15. A monitoring device for monitoring the surroundings of a substrate processing apparatus installed in a clean room, comprising: a detection tape arranged across a plurality of floor tiles on the upper surface of some or all of the floor tiles surrounding the substrate processing apparatus, the detection tape having a conductive layer arranged along the longitudinal direction; and an alarm unit for issuing an alarm when the electrical continuity in the conductive layer is interrupted or the voltage of the signal current flowing through the conductive layer falls below a predetermined threshold value.

16. A detection tape used in a monitoring system for monitoring the periphery of a substrate processing apparatus installed in a clean room, the monitoring system comprising an alarm unit which issues an alarm when the electrical continuity in the conductive layer of the detection tape is interrupted or the voltage of the signal current flowing through the conductive layer falls below a predetermined threshold value, the detection tape being placed across a plurality of floor tiles on the upper surfaces of some or all of the floor tiles surrounding the substrate processing apparatus, the detection tape further comprising: an insulating base portion having an insulating adhesive layer on both sides, the conductive layer being provided on the front side of the base portion and arranged along the longitudinal direction of the detection tape, an insulating non-adhesive region being in contact with or adjacent to the conductive layer and arranged along the longitudinal direction of the detection tape, and an insulating protective layer which covers the conductive layer and the non-adhesive region and is adhered to the base portion, and the detection tape being capable of being unwound from a rolled state.

Images